Thermally conductive composition based on (meth)acrylate compounds

FR3167953A1Pending Publication Date: 2026-05-01BOSTIK SA(FR)
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Patent Information

Authority / Receiving Office
FR · FR
Patent Type
Applications
Current Assignee / Owner
BOSTIK SA(FR)
Filing Date
2024-10-28
Publication Date
2026-05-01
Patent Text Reader

Abstract

Composition based on (meth)acrylate compounds. The present invention relates to a two-component crosslinkable composition comprising: - a component A comprising: an oxidant; at least one (meth)acrylate monomer; - a component B comprising: a reducing agent; said composition comprising at least one thermally conductive filler in component A and / or B; said composition having, after crosslinking, a density at 23°C ranging from 1.6 to 2.2; said composition having, after crosslinking, a density at 23°C / thermal conductivity ratio ranging from 0.80 to 1.30; said composition being free of compounds comprising a peroxide group. Figure: None
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Citation Information

Patent Citations

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