AUXILIARY POWER SUPPLY FOR THE MICROROBOT FACTORY

Abstract

AUXILIARY POWER SUPPLY FOR THE MICROROBOT FACTORY A wireless power supply system (1000) for a microrobot platform is disclosed herein. The system consists of a microrobot platform (100) and one or more wireless charging zones (111), in which the microrobot platform is configured to levitate above one or more wireless charging zones. The microrobot platform further consists of a microrobot (101), a plurality of printed circuit board layers (102) arranged in a stackable structure, a magnetic levitation stack (106A), a wireless power supply stack, and a microcontroller unit (107). The microrobot platform can be wirelessly charged using inductive charging, in which magnetically coupled induction loop coils transfer power from the wireless charging area to the microrobot platform. See Figure 1A for abbreviations.

Description

Title of the invention: AUXILIARY POWER SUPPLY FOR THE MICROROBOT FACTORY SUMMARY

[0001] A wireless power supply system for a microrobot platform, including a microrobot platform and one or more wireless charging zones, is disclosed herein, wherein the microrobot platform can be configured to levitate above one or more wireless charging zones. The microrobot platform may include a microrobot having a plurality of magnets, a plurality of printed circuit board (PCB) layers arranged in a stackable structure, a magnetic levitation stack (MAGLEV), a wireless power supply stack, and a microcontroller unit (MCU). The MAGLEV stack may include a microrobot driver circuit configured to levitate the platform. The wireless power supply stack may include an energy storage device, a first induction loop coil configured to charge the energy storage device, and a wireless power supply driver circuit.The one or more wireless charging zones may include a second induction loop coil, which can be configured to transfer power to the first induction loop coil.

[0002] In some embodiments, the MCU includes a demultiplexer configured to receive direct current and provide power to the MAGLEV stack and the wireless power stack.

[0003] In some embodiments, the demultiplexer alternates between charging the energy storage device for a first period and supplying the MAGLEV stack for a second period.

[0004] In certain embodiments, the microrobot platform of the described system further includes a peripheral stack. In such an embodiment, the demultiplexer is configured to receive a direct current and provide power and processing to the peripheral stack.

[0005] In some embodiments, the first induction loop coil is a PCB coil.

[0006] In some embodiments, the first induction coil is electrically coupled to the energy storage device and fixed to the microrobot platform with an adhesive.

[0007] In certain embodiments, the described system further includes a working surface, which includes a flexible PCB substrate, a motor base located under the flexible PCB substrate, and one or more linear actuators coupled to the base of motor. In this embodiment, one or more linear actuators are configured to adjust the flexible PCB substrate. In some embodiments, the flexible PCB substrate is configured to adjust the pitch, yaw, roll, or a combination thereof of the microrobot platform. The microrobot platform can be configured to levitate above the work surface.

[0008] In some embodiments, one or more wireless charging zones are arranged within the work surface.

[0009] In some embodiments, one or more wireless charging zones are arranged at a distance from the work surface.

[0010] In some embodiments, the energy storage device is a battery.

[0011] In some embodiments, the energy storage device is a supercapacitor.

[0012] In some embodiments, the first induction loop coil and the second induction loop coil are magnetically coupled by a Qi interface standard.

[0013] In another aspect, a method of wirelessly supplying power to a levitating microrobot platform is disclosed here, including the magnetic coupling of a first induction loop coil with a second induction loop coil, the attachment of the first induction loop coil to a microrobot platform so that the first induction loop coil is electrically coupled to an energy storage device, the positioning of the microrobot platform above the second induction loop coil, the generation of a magnetic field between the first induction loop coil and the second induction loop coil so that a magnetic field generates an alternating current in the first induction loop coil, the conversion of the alternating current into direct current, and the charging of the energy storage device.According to this embodiment, the microrobot platform is arranged in a "stackable" structure, and the microrobot platform is configured to levitate above the second induction loop coil.

[0014] In some embodiments, the method further includes receiving direct current at a demultiplexer and supplying power to a MAGLEV stack and a wireless power stack. The demultiplexer can alternate between charging the energy storage device for a first period and powering the MAGLEV stack for a second period.

[0015] In some embodiments, the demultiplexer is configured to receive a direct current and provide power and processing for a stack of devices.

[0016] In some embodiments, the first induction coil is electrically coupled to the energy storage device and fixed to the microrobot platform with an adhesive.

[0017] In some embodiments, the energy storage device is a battery.

[0018] In some embodiments, the energy storage device is a supercapacitor.

[0019] In some embodiments, the first induction loop coil and the second induction loop coil are magnetically coupled by a Qi interface standard.

[0020] The purpose of this summary is to present a selection of concepts in a simplified form, which are described in greater detail below in the detailed description. This summary is not intended to identify key features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter. Description of the drawings

[0021] [Fig 1A-1D] Figures 1A-1D are examples of wireless power supply systems for a microrobot platform, in accordance with the present technology;

[0022] [Fig 2A-2D] Figures 2A to 2D are examples of microrobots, in accordance with the present technology;

[0023] [Fig.3] The [Fig.3] is a signal processing scheme, in accordance with the present technology;

[0024] [Fig.4] Fig.4 is a timing diagram, in accordance with the present technology; and

[0025] [Fig. 5] The [Fig. 5] is a method of using a system to provide a wireless power supply to a levitating microrobot platform, in accordance with the present technology.

[0026] [Fig 6A-6D] Figures 6A to 6D are examples of work surfaces, in accordance with the present technology.

[0027] The preceding aspects and many related advantages of the present invention will be more readily appreciated as they are better understood with reference to the following detailed description, when taken in conjunction with the accompanying drawings. Detailed description

[0028] Systems, devices, and methods for wirelessly powering a microrobot platform are disclosed herein, including a microrobot platform and one or more wireless charging zones. In some embodiments, the microrobot platform includes a microrobot, a plurality of printed circuit board (PCB) layers arranged in a stackable structure, and a magnetic levitation stack. (MAGLEV), a wireless power stack and a peripheral stack, where the wireless power stack is configured to store and supply power to each of the stacks. In some embodiments, one or more wireless charging zones are configured to supply power to the wireless power stack of the microrobot platform. In some embodiments, the microrobot platform is configured to levitate above a work surface composed of a flexible PCB substrate, in which one or more wireless charging zones are arranged within the work surface.

[0029] Figures IA and IB are examples of wireless power supply systems for a microrobot platform, according to the present technology. In some embodiments, the system 1000 includes a microrobot platform 100 and a work surface 105. In some embodiments, the work surface 105 includes one or more wireless charging zones 111 and one or more non-charging zones 112. During operation, the microrobot platform 100 levitates above the work surface 105.

[0030] Figure 1A shows the example of a system 1000 including the microrobot platform 100 and one or more wireless charging zones 111. In some embodiments, as described herein, the microrobot platform further includes a microrobot 101 having a plurality of magnets, as shown in detail in Figures 2A and 2D. In some embodiments, the microrobot platform 100 further includes a plurality of PCB layers 102 arranged in a stackable structure. As used herein, a stackable structure refers to embodiments in which the plurality of PCB layers 102 are physically stacked one on top of the other such that each PCB layer 102 is physically coupled to each adjacent layer.It should be understood that the location of one individual PCB layer 102 relative to another as shown is provided solely by way of example or illustration and should not be interpreted as preferred or advantageous over other embodiments. Within this "stack" structure, there are several different printed circuit board layers divided into subgroups based on their function, including a wireless power stack 104A, 104B, 104C...104N; and a magnetic levitation (MAGLEV) stack 106A, 106B, 106C...106N. In some embodiments, there is also a stack of 108A, 108B, 108C...108N peripherals, in which additional PCB layers 102 with physically and electrically coupled microrobot structures (not shown) can be added to the microrobot platform 100 to provide additional functionality to the microrobot platform 100.In some embodiments, . Power and processing for each PCB layer are provided at least in part by a microcontroller unit (MCU) 107.

[0031] In some embodiments, the wireless power stack 104A, 104B, 104C...104N comprises an energy storage device 103, a first induction loop coil 109, and a wireless power driver circuit. In some embodiments, the first induction loop coil 109 is physically coupled to the microrobot platform 100 so that it forms part of the same stackable structure. In some embodiments, the components of the wireless power stack 104A, 104B, 104C...104N are arranged on PCB layers 102 and electrically coupled to each other so that the first induction loop coil 109 is configured to charge the energy storage device 103. The wireless power module 104A, 104B, 104C...104N and its included components are electrically coupled to the MCU 107 via the wireless power driver circuit.In some embodiments, the first induction loop coil 109 is a PCB coil, where the first induction loop coil 109 is created directly in the PCB layer 102, forming the required coils from the copper traces of the PCB layer 102. As will be discussed here, in some embodiments, the first induction loop coil is magnetically coupled to a second induction loop coil 110, so that the second induction loop coil is configured to transfer power to the first induction loop coil, and from there to the energy storage device 103. In some embodiments, the energy storage device 103 is a battery; while in other embodiments, the energy storage device 103 may be a supercapacitor.

[0032] In some embodiments, power and processing for each PCB layer are provided at least in part by a microcontroller unit (MCU) 107. In some embodiments, the MCU 107 includes a demultiplexer, which can be configured to provide power and processing from the MCU 107 to each of the PCB layers 102. In some embodiments, the demultiplexer alternates the PCB layers to which the MCU provides power and processing. In some embodiments, this allows the wireless power stack 104A, 104B, 104C...104N to deliver power throughout the microrobot platform 100 while it is operational (e.g., moving or levitating). For example, when the microrobot platform 100 is levitating above a wireless charging zone 111, the MCU 107 can deliver power simultaneously to the MAGLEV stack 106A, 106B, 106C...106N and the stacking of peripherals 108A, 108B, 108C...108N while also charging the energy storage device 103. .

[0033] In some embodiments, the operation of the microrobot platform 100 is controlled or modified by a user with a processor 113. For example, the durations for which power is applied by the MCU 107 to the various layers of the PCB 102 and their associated components can be modified by the processor 113. In some embodiments, the processor is a computer or similar device. In other embodiments, the processor is a smartphone or similar device.

[0034] In some embodiments, the MCU 107 further includes a transceiver configured to wirelessly receive instructions from a processor 113 and transmit diagnostic information relating to the operation of the wireless power stack 104A, 104B, 104C...104N; and the MAGLEV stack 106A, 106B, 106C...106N. In some embodiments, the transceiver is further configured to receive instructions from a processor 113 relating to the operation and functions of the device stack 108A, 108B, 108C...108N and transmit information collected by one or more peripheral devices that include the device stack 108A, 108B, 108C...108N. For example, as described here, the transceiver can receive instructions for the operation of a gripper, or the transceiver can transmit images collected by a camera.In such embodiments, the MCU 107 is configured to process and deliver instructions received from the processor 113, as well as information relating to the operation of the wireless power stack 104A, 104B, 104C...104N; the MAGLEV stack 106A, 106B, 106C...106N; and the peripheral stack 108A, 108B, 108C...108N. In some embodiments, these collected instructions and information are delivered via a wired connection.

[0035] In some embodiments, the MAGLEV stack 106A, 106B, 106C...106N includes a microrobot driver circuit configured to levitate the microrobot platform 100. This circuit can be electrically coupled to the MCU 107, through which it can receive power from the wireless power stack 104A, 104B, 104C...104N. In such embodiments, the MAGLEV stack 106A, 106B, 106C...106N can remain operational—thus maintaining the levitation state 100 of the microrobot platform—while other PCB layers 102 also receive sufficient power to operate. In some embodiments, the microrobot platform 100 levitates above a work surface 105 of height E.

[0036] In certain embodiments, the system further includes a work surface 105 comprising a flexible PCB substrate, a motor base located under the PCB substrate, and one or more linear actuators coupled to the motor base. Examples of motor bases and linear actuators are shown in Figures 6A to 6D. In some embodiments, the flexible PCB substrate is configured to bend and / or curve in response to one or more linear actuators (which can be referred to here as "adjusting" the PCB substrate). In some embodiments, the motor base is located beneath the flexible PCB substrate. The motor base is coupled to one or more linear actuators and is configured to drive and direct them to move up and down to adjust the PCB substrate. During operation, a microrobot platform can levitate above the flexible PCB substrate. In some embodiments, the flexible PCB substrate is adjusted before the microrobot moves over it.In other embodiments, the flexible PCB substrate can be adjusted dynamically, i.e., while one or more microrobots are in motion. In some embodiments, the flexible PCB substrate is configured to adjust the pitch, yaw, roll, or any combination thereof of the microrobot platform 100.

[0037] In some embodiments, the work surface 105 comprises one or more wireless charging zones 111 and one or more non-charging zones 112. In some embodiments, the one or more wireless charging zones comprise a second induction loop coil 110, magnetically coupled to the first induction loop coil 109 of the microrobot platform 100. In some embodiments, the second induction loop coil 110 is disposed within the work surface 105 and configured to transfer power to the first induction loop coil 109 via wireless induction charging. In some embodiments, the one or more non-charging zones comprise a flexible PCB substrate, as described in [Fig. 2B].

[0038] Figure 1B is an example of a system 1000 comprising a microrobot platform 100 and one or more wireless charging zones 111. In some embodiments, the first induction coil 109 is attached to the microrobot platform 100 with an adhesive layer 114. In such an embodiment, the first induction loop coil is not physically coupled to a PCB layer 102; however, it remains electrically coupled to the energy storage device 103 and the MCU 107 as described above. Examples of adhesives may have an epoxy, acrylic, or silicone base.

[0039] Figures IC and 1D are examples of wireless power supply systems for a microrobot platform according to the present technology.

[0040] Figure 1C illustrates an example of a system 1000 comprising a microrobot platform 100 levitating above a work surface 105, where the platform The microrobot is positioned above a wireless charging zone 111. In some embodiments, a work surface 105 comprises one or more wireless charging zones 111 and one or more non-charging zones 112. In some embodiments, the one or more wireless charging zones 111 consist of a second induction loop coil 110, magnetically coupled to the first induction loop coil 109 of the microrobot platform 100. In some embodiments, this magnetic coupling is achieved using a Qi interface standard. In some embodiments, the second induction loop coil 110 is positioned within the work surface 105.

[0041] In certain embodiments, the microrobot platform 100—and by extension the first induction loop coil 109—is positioned above a wireless charging area 111 consisting of a second induction loop coil 110. In such an embodiment, the second induction loop coil 110 can be configured to transfer power to the first induction loop coil 109 via a wireless induction load. In such an embodiment, an alternating current is made to pass through the second induction loop coil 110, creating a magnetic field 116 that fluctuates according to the amplitude of the alternating current. This fluctuating magnetic field 116, in turn, creates an alternating current in the first induction loop coil 109.The alternating current created is then converted into direct current using a rectifier, after which it can be directed to the different PCBs 102 according to the configuration of the microrobot platform 100 and the programming of the MCU 107. In some embodiments, the positioning of the microrobot platform 100 above a wireless charging area 111 allows for quasi-simultaneous charging, in which the MCU 107 can be programmed to alternate the PCBs 102 receiving the direct current generated within the wireless power supply stack 104A, 104B, 104C...104N. For example, the MCU 107 can direct power to the energy storage device 103 for a first time, then to the MAGLEV stack 106A, 106B, 106C...106N for a second time, then to the peripheral stack 108A, 108B, 108C...108N for a third time, etc.In such embodiments, the various PCBs 102 all receive the required power from the wireless power supply area 111 rather than from the energy storage device 103. This allows the different PCBs 102 to perform their different operations while also charging the energy storage device 103. In some embodiments, several PCBs 102 draw power from the energy storage device 103 while the resulting DC current is directed by the MCU 107 to another PCB 102. For example, the MCU 107 can direct the resulting DC current to an image sensor in the stack. of devices 108A, 108B, 108C...108N to take and process an image, while the MAGLEV stack 106A, 106B, 106C...106N can draw power from the energy storage device 103 to maintain its levitating state.

[0042] Figure 1D illustrates an example of a system comprising a microrobot platform 100 levitating above a work surface 105, where the microrobot platform is disposed above a non-loading zone 112. In some embodiments, a wireless charging zone 111 is disposed at a distance D from the work surface. In the illustrated example, the work surface 105 consists solely of one or more non-loading zones 112. As such, the microrobot 100 can perform operations when positioned above the work surface 105; However, it must do so without benefiting from a near-simultaneous charge because there are no wireless charging zones 111 arranged over the entire work surface 105. Instead, the micro-robot 100 must return to the wireless charging zone 111 to recharge periodically.

[0043] Figures 2A to 2D are examples of microrobots, in accordance with the present technology.

[0044] Figure 2A is an example of a microrobot 200 including four magnets 205A, 205B, 205C... 205N. In some embodiments, the four magnets (also referred to herein as a plurality of magnets) 205A, 205B, 205C... 205N are arranged in a lattice with alternating magnetization. For example, in Figure 2A, magnets 205A (top) and 205C (bottom) may have a first magnetization, and magnets 205B (left) and 205N (right) may have a second magnetization, opposite to the first. In some embodiments, the plurality of magnets 205A, 205B, 205C... 205N are arranged in a checkerboard pattern. In some embodiments, the plurality of magnets 205A, 205B, 205C... 205N are composed of any material, such as nickel, iron, samarium, or similar materials. In some embodiments, the plurality of magnets 205A, 205B, 205C... 205N are composed of neodymium (NdFeB).In one embodiment, the plurality of magnets comprises one or more magnetic materials. Non-limiting examples of magnetic materials include ferromagnetic elements (e.g., cobalt, gadolinium, iron, or the like), rare-earth elements, ferromagnetic metals, ferromagnetic transition metals, materials exhibiting magnetic hysteresis, or the like, or combinations thereof. Other non-limiting examples of magnetic materials include nickel, iron, samarium, or the like, or combinations thereof.

[0045] Figure 2B shows an example of a microrobot 200 positioned on a work surface 105, which includes a flexible printed circuit board (PCB) substrate. In some embodiments, the checkerboard configuration of a plurality of magnets (such as the plurality of magnets 205A, 205B, 205C... 205N) together with a graphite layer of the substrate 105 confines the microrobot 200 to a specific location in (x, y, z). A magnetic potential well can be generated to locate the microrobot 200. In some embodiments, a magnetic force is generated by four PCB current tracks located within the PCB substrate of the work surface 105. Pairs of these four tracks are typically driven in quadrature, behaving very similarly to a linear stepper motor. While driving the currents in quadrature controls the relative phase between the current pairs and consequently the in-plane position of the microrobot 200, modulating the absolute amplitude of the tracks increases or decreases the out-of-plane force between the board and the robot, resulting in movement along the Z-axis of approximately 40 to 70 pm. Figure [Fig. 2B] shows a levitating substrate system.In such embodiments, the graphite layer of the substrate 105 can be thick, such as 0.5 mm thick. In such embodiments, the microrobot 200 can levitate away from the substrate 105 by a height E.

[0046] Figures 2C and 2D show various arrangements for the microrobots 200. It should be understood that any number of magnets can be included in the plurality of magnets 205A, 205B, 205C... 205N. In some embodiments, the plurality of magnets 205A, 205B, 205C... 205N are arranged in an alternating orientation, with the magnetization alternating between adjacent magnets.

[0047] In some embodiments, the microrobot(s) 200 is / are controlled by the local track pattern and currents. That is, the control of the microrobot is based on a region or zone, rather than on something that moves with the microrobot (as is the case for conventional motorized robots). Zone control has both advantages and disadvantages for controlling multiple agents. The disadvantage of zone control is that two microrobots in close proximity may not be controlled independently unless they are in different, independent zones. The advantage of zone control is that a large number of microrobots can be controlled to perform the same movement in parallel using only a few control channels.The control zone approach generally reduces the number of control channels required, since microrobots do not need to route additional control channels to regions that only require, for example, a single degree of freedom for transport.

[0048] In certain embodiments, the substrate or other lithographically patterned microcircuits allow for the relatively easy fabrication of large, complex control systems using conventional batch manufacturing. In certain embodiments, the dimensions of the systems disclosed herein can reach up to 30 cm x 30 cm. cm, or even more. In some embodiments, the microrobot(s) can pass between 105 distinct substrates if they are close to each other.

[0049] In some embodiments, as described herein, the microrobots can be configured to "cooperate" with each other by performing different steps of a joint process, for example, a process for applying eyelashes to a single eye or to a single user with two eyes (not shown). In some embodiments, multiple microrobots can operate together more directly.

[0050] Figure 3 is a signal processing diagram for quasi-simultaneous wireless charging in a microrobot platform, according to the present technology. It should be understood that the components identified in this signal processing diagram 3000 are analogous to the components identified in the system 1000 mentioned in Figures IA to 1D. In some embodiments, a microrobot platform positioned above a wireless charging area can be configured for quasi-simultaneous wireless charging as described in Figure 1D. In some embodiments, the processes of the various PCBs 304, 306, 308 of a microrobot are controlled by their respective driver control circuits 317, 319. In some embodiments, a microrobot driver control circuit controls both the processes of the magnetic levitation stack (MAGLEV) 306 and the processes of the peripheral stack 308, if necessary.Examples of MAGLEV processes 306 might include levitating the microrobot platform. Examples of peripheral processes 308 might be determined by the peripheral devices used in the peripheral stack, which could include grasping an eyelash or acquiring and processing an image (as discussed above). In some embodiments, the wireless power driver circuit 319 controls the processes of the wireless power stack 304. Examples of power processes 304 might include charging the energy storage device.

[0051] In some embodiments, the microcontroller unit (MCU) 307 includes a demultiplexer 315 that can be configured to provide power and processing from the MCU 307 to each of the PCB layers and their associated driver control circuits 317, 319. In some embodiments, the demultiplexer alternates the PCB layers to which the MCU provides power and processing. In such embodiments, this allows the wireless power stack to deliver power through the microrobot platform while it is operational (e.g., moving or levitating). For example, when the microrobot platform is levitating above a wireless charging area, the MCU 307 can deliver power to both the MAGLEV stack 306 and the peripheral stack. 308 while also charging the energy storage device 304. In some embodiments, a processor 313 can be configured to send instructions to a microrobot MCU 307 which can adjust the operation of the demultiplexer 315. For example, the processor 313 can adjust the durations for which power is applied to a given control circuit 317, 319.

[0052] Figure 4 is a timing diagram for quasi-simultaneous wireless charging according to the present technology. It should be understood that the components identified in this timing diagram are analogous to the components identified in the system shown in Figures 1A to 1D. In some embodiments, a microrobot platform positioned above a wireless charging area can be configured for quasi-simultaneous wireless charging as described in Figure 1D. In some embodiments, a microrobot platform whose operations are controlled by a microcontroller unit (MCU) uses a demultiplexer to receive direct current and supply power to the various PCBs that comprise the microrobot platform, including the wireless power stack, the MAGLEV stack, and the peripheral stack, depending on the operational requirements.For example, the MCU can direct power to the energy storage device for a first duration, then to the MAGLEV stack for a second duration, then to the peripheral stack for a third duration, and so on. An example of this process is illustrated in the 400 timing diagram, which assigns matched processes (e.g., power processes, MAGLEV processes, etc.) to the time intervals T2...Tn. The duration required for a given time interval Tj, T2...Tn can vary considerably depending on the process. For example, charging the energy storage device might require a first duration, while powering a peripheral device such as a light source might require a shorter second duration. Conversely, powering a peripheral device such as an image sensor might require power for a longer third duration.In some embodiments, the duration of these time intervals is programmed in the MCU and adjusted as needed by a processor.

[0053] In the illustrated example, a first time interval T1 is dedicated to power processes. Examples of power processes 304 might include charging the energy storage device. In addition, a second time interval T2 is dedicated to MAGLEV processes (e.g., levitation of the microrobot platform) and a third time interval T3 is dedicated to peripheral processes (e.g., grasping an eyelash). These time intervals continue as determined by the MCU programming up to an interval The time interval Tn, which in this example of a timing diagram is dedicated to MAGLEV processes, is also present. In some embodiments, there is a final time interval designated as an inactive state, which may correspond to times when the microrobot platform is not operating. In the illustrated example, power in this state is directed to wireless feeding processes.

[0054] Figure 5 is a method of using a system to provide wireless power to a levitating microrobot platform, according to the present technology. It should be understood that the components identified in this method 500 are analogous to the components identified in the system 1000 shown in Figures IA to 1D.

[0055] In the processing block 502, a first induction loop coil is magnetically coupled to a second induction loop coil. In certain embodiments, the magnetic coupling of these induction loop coils makes it possible to generate a magnetic field between them when an alternating current passes through the second induction loop coil.

[0056] In processing block 504, the first induction loop coil is attached to a microrobot platform, which is configured to levitate above a work surface. In some embodiments, the first induction loop coil is a PCB coil, in which the first induction loop coil is created directly within the PCB layer, forming the required coils from the copper traces of the PCB layer. In some embodiments, the first induction loop coil is attached to the microrobot platform with an adhesive.

[0057] In the processing block 506, the microrobot platform to which the first induction loop coil is attached is positioned above the second induction loop coil. In some embodiments, the second induction loop coil is located in a wireless charging zone. In some embodiments, the wireless charging zone is located within the work surface, while in other embodiments, the wireless charging zone is located at a distance from the work surface.

[0058] In processing block 508, a magnetic field is generated between the first induction loop coil and the second induction loop coil. This is accomplished by passing an alternating current through the second induction loop coil.

[0059] In the processing block 510, an alternating current is generated in the first induction loop coil. The magnetic field fluctuates according to the amplitude of the alternating current, which in turn generates an alternating current in the first induction loop coil.

[0060] At the processing block 512, the generated alternating current is then converted into direct current. In some embodiments, this is accomplished using a rectifier electrically coupled to the first induction loop coil.

[0061] In the processing block 514, the newly converted direct current is then directed to a microcontroller unit that includes a demultiplexer. In some embodiments, the demultiplexer is configured to receive direct current and supply power to the various PCBs that comprise the different stacks of the microrobot platform.

[0062] At processing blocks 516A through C, direct current is directed to the various PCBs that comprise the microrobot platform, depending on the platform configuration and the MCU programming. At processing block 516A, power is directed to a wireless power stack to charge an energy storage device. At processing block 516B, power is directed to a MAGLEV stack for a specified duration. Finally, at processing block 516C, power is directed to a PCB peripheral stack (if present) for a specified duration. In some embodiments, the demultiplexer receives the generated direct current and directs it to these various stacks for durations determined by the MCU.For example, the MCU can direct power to the energy storage device for a first duration, then to the MAGLEV stack for a second duration, followed by the peripheral stack for a third duration, and so on. In some embodiments, this...

[0063] It should be understood that process 500 is to be interpreted as purely representative. In some embodiments, the processing blocks of this process may be carried out simultaneously, sequentially, in a different order, or even omitted, without departing from the scope of this disclosure.

[0064] Figures 6A to 6D are examples of work surfaces, in accordance with the present technology.

[0065] As shown in [Fig. 6A], the work surface 600 may include a flexible printed circuit board (PCB) substrate 605. The system may further include a motor base 610 and one or more linear actuators 615A, 615B, 615C... 615N (also referred to herein as a plurality of linear actuators). In some embodiments, the flexible PCB substrate 105 is configured to bend and / or curve in response to one or more linear actuators 615A, 615B, 615C... 615N, which may herein be referred to as "adjustment" of the PCB substrate 605.

[0066] In some embodiments, the motor base 610 is disposed under the flexible PCB substrate 605. The motor base 610 is coupled to one or more linear actuators 615A, 615B, 615C... 615N and is configured to drive and steer one or more linear actuators 615A, 615B, 615C... 615N so that they move up and down in order to adjust the PCB substrate 605.

[0067] Figure 6B is a top-down perspective of the work surface 600. The flexible PCB substrate 605 can be arranged above a plurality of linear actuators 615A, 615B, 615C... 615N. The flexible PCB substrate 605 is shown as dashed lines in Figure 6B to better illustrate the position of the plurality of linear actuators 615A, 615B, 615C... 615N.

[0068] In certain embodiments, the plurality of linear actuators 615A, 615B, 615C... 615N are arranged in a network. Each linear actuator of the plurality of linear actuators 615A, 615B, 615C... 615N can move independently, which allows for numerous adjustments to the flexible PCB substrate 605.

[0069] Fig. 6C shows a working surface where the plurality of linear actuators 615A, 615B, 615C... 615N have adjusted the flexible PCB substrate 605. In operation, each linear actuator of the plurality of linear actuators 615A, 615B, 615C... 615N moves independently to fold, bend and otherwise manipulate the flexible PCB substrate 605.

[0070] In operation, as shown in [Fig. 6D], one or more microrobots 200A, 200B can levitate (as shown in [Fig. 2B]) above the flexible PCB substrate 605. In some embodiments, the flexible PCB substrate 605 is adjusted before the one or more microrobots 200A, 200B move over it. In other embodiments, the flexible PCB substrate 605 can be adjusted dynamically, i.e., while the one or more microrobots 200A, 200B are in motion. Although the one or more microrobots 200A, 200B are illustrated as squares for simplicity, it should be understood that the one or more microrobots can be any of the microrobots or microrobot platforms shown and described herein.In some embodiments, the flexible PCB substrate 605 is configured to adjust a pitch, yaw, roll, or one of their combinations of one or more 200A, 200B microrobots.

[0071] Although illustrative embodiments have been shown and described, it will be appreciated that various changes can be made to them without departing from the spirit and scope of the invention.

[0072] This application may refer to quantities and numbers. Unless otherwise specified, such quantities and numbers shall not be considered restrictive, but representative of the possible quantities or numbers associated with this application. Similarly, in this respect, this application may use the term "plurality" to refer to a quantity or number. In this respect, the term "plurality" is understood to mean any number greater than one, for example, two. three, four, five, etc. The terms "about," "approximately," "close," etc., mean plus or minus 5% of the stated value. For the purposes of this disclosure, the expression "at least one of A, B, and C," for example, means (A), (B), (C), (A and B), (A and C), (B and C), or (A, B, and C), including all other possible permutations when more than three items are listed.

[0073] The embodiments disclosed herein may use circuitry to implement the technologies and methodologies described herein, functionally connect two or more components, generate information, determine operating conditions, control an apparatus, device, or process, and / or the like. Any type of circuitry may be used. In one embodiment, the circuitry includes, among other things, one or more computing devices such as a processor (e.g., a microprocessor), a central processing unit (CPU), a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or the like, or any combination thereof, and may include elements or electronics of separate digital or analog circuits, or combinations thereof.

[0074] An embodiment includes one or more data stores that, for example, store instructions or data. Non-limiting examples of one or more data stores include volatile memory (e.g., random access memory (RAM), dynamic random access memory (DRAM), or the like), non-volatile memory (e.g., read-only memory (ROM), electrically erasable read-only memory (EEPROM), compact disc read-only memory (CD-ROM), or the like), persistent memory, or the like. Other non-limiting examples of one or more data stores include erasable and programmable read-only memory (EPROM), flash memory, or the like. The one or more data stores may be connected, for example, to one or more computing devices by one or more instructions, data, or power buses.

[0075] In one embodiment, the circuitry includes a computer-readable media player or a memory slot configured to accept a signal-carrying medium (for example, computer-readable memory storage, computer-readable recording storage, or the like). In one embodiment, a program intended to cause a system to perform any of the disclosed processes may be stored, for example, on a computer-readable recording medium (CRMM), a signal-carrying medium, or the like. Non-limiting examples of signal-carrying media include recordable media such as any form of flash memory, magnetic tape, floppy disk, hard drive, compact disc (CD), digital video disc (DVD), Blu-ray disc, digital tape, computer memory, or the like, as well as a type transmission such as a digital and / or analog communication medium (e.g., a fiber optic cable, a waveguide, a wired communication link, a wireless communication link (e.g., transmitter, receiver, transceiver, transmission logic, reception logic, etc.). Other non-limiting examples of signal-carrying media include, but are not limited to, DVD-ROM, DVD-RAM, DVD+RW, DVD-RW, DVD-R, DVD+R, CD-ROM, Super Audio CD, CD-R, CD+R, CD+RW, CD-RW, video compact discs, super video discs, flash memory, magnetic tape, magneto-optical disc, MINIDISC, non-volatile memory card, EEPROM, optical disc, optical storage, RAM, ROM, system memory, web server, or similar.

[0076] The detailed description presented above in relation to the accompanying drawings, where similar numbers refer to similar elements, is intended to be a description of various embodiments of this disclosure and is not intended to represent the only embodiments. Each embodiment described in this disclosure is offered solely by way of example or illustration and should not be construed as being preferred or advantageous over other embodiments. The illustrative examples provided herein are not intended to be exhaustive or to limit the disclosure to the specific forms disclosed. Similarly, all the steps described herein may be interchangeable with other steps, or combinations of steps, to achieve the same or substantially similar result.In general, the embodiments disclosed here are not limiting, and the inventors contemplate that other embodiments within the scope of this disclosure may include structures and features from more than one specific embodiment shown in the figures and described in the patent memorandum.

[0077] In the preceding description, specific details are presented to allow for a thorough understanding of examples of embodiments of this disclosure. However, it will be apparent to those skilled in the art that the embodiments described herein can be implemented without incorporating all the specific details. In some cases, well-known process steps have not been described in detail so as not to unnecessarily obscure various aspects of this disclosure. Furthermore, it should be noted that the embodiments of this disclosure may employ any combination of features described herein.

[0078] This application may include references to directions, such as "vertical," "horizontal," "front," "back," "left," "right," "up," and "down," etc. These references, and other similar references in this application, are intended to help describe and understand the particular embodiment (such as when the (implementation is positioned for use) and are not intended to limit this disclosure to those directions or locations.

[0079] This application may also refer to quantities and numbers. Unless otherwise specified, these quantities and numbers are not to be considered restrictive, but rather as examples of the possible quantities or numbers associated with this application. Similarly, in this respect, this application may use the term "plurality" to refer to a quantity or number. In this context, the term "plurality" is understood to mean any number greater than one, for example, two, three, four, five, etc. The terms "about," "approximately," etc., mean within 5% of the stated value. The term "based on" means "based at least partially on."

[0080] The principles, representative embodiments, and modes of operation of this disclosure have been described in the preceding description. However, aspects of this disclosure that are intended to be protected should not be interpreted as being limited to the particular embodiments disclosed. Furthermore, the embodiments described herein should be considered illustrative rather than restrictive. It should be understood that variations and changes may be made by other means, and equivalents may be used, without departing from the spirit of this disclosure. Accordingly, it is expressly intended that all such variations, changes, and equivalents fall within the spirit and scope of this disclosure as claimed.

Claims

Demands

1. A wireless power supply system (1000) for a microrobot platform, the system comprising a microrobot platform (100) and one or more wireless charging zones (111), the microrobot platform comprising: - a microrobot (101) having a plurality of magnets; - a plurality of printed circuit board layers (102) arranged in a stackable structure; - a magnetic levitation stack (106A, 106B, 106C, 306), comprising a microrobot driver circuit configured to levitate the microrobot platform; - a wireless power supply stack (104A, 104B, 104C), comprising: * an energy storage device (103, 304); * a first induction loop coil (109) configured to charge the energy storage device; and * a wireless power supply driver circuit; and - a microcontroller unit (107, 307);the wireless charging zone(s) comprising a second induction loop coil magnetically coupled to the first induction loop coil (110), wherein the second induction loop coil is configured to transfer power to the first induction loop coil; wherein the microrobot platform is configured to levitate above one or more wireless charging zones.

2. System according to claim 1, wherein the microcontroller unit (307) includes a demultiplexer (315); and wherein the demultiplexer is configured to receive direct current and provide power to the magnetic levitation stack (306) and the wireless power stack.

3. System according to claim 2, wherein the demultiplexer (315) alternates between charging the energy storage device (304) for a first time and powering the magnetic levitation stack (306) for a second time.

4. System according to claim 2, further comprising: a device stack (308), in which the demultiplexer (315) is configured to receive direct current and supply power to the device stack.

5. System according to claim 1, wherein the first induction loop coil (109) is a printed circuit board coil.

6. System according to claim 1, wherein the first induction loop coil (109) is electrically coupled to the energy storage device (103) and fixed to the microrobot platform with an adhesive.

7. System according to claim 1, further comprising a work surface (105), said work surface comprising: - a flexible printed circuit board substrate; - a motor base located under the flexible printed circuit board substrate; and - one or more linear actuators coupled to the motor base, wherein the one or more linear actuators are configured to adjust the flexible printed circuit board substrate; wherein the flexible printed circuit board substrate is configured to adjust a pitch, yaw, roll, or any combination thereof of the microrobot platform; and wherein the microrobot platform (100) is configured to levitate above the work surface.

8. System according to claim 7, wherein one or more wireless charging zones (111) are arranged within the work surface (105); or wherein one or more wireless charging zones are arranged at a distance from the work surface.

9. System according to claim 1, wherein the energy storage device (103) is a supercapacitor.

10. System according to claim 1, wherein the first induction loop coil (109) and the second induction loop coil (110) are magnetically coupled by a Qi interface standard.

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