Multi-chip module for chip-enabled documents and their corresponding chip-enabled documents.
The integration of lateral cutouts and conductive adhesive films in multichip modules improves connectivity and stability within smart documents, addressing integration challenges of multiple components while maintaining compatibility with existing infrastructure.
Patent Information
- Authority / Receiving Office
- FR · FR
- Patent Type
- Applications
- Current Assignee / Owner
- SMART PACKAGING SOLUTIONS SPS
- Filing Date
- 2024-12-31
- Publication Date
- 2026-07-03
AI Technical Summary
Existing multi-chip modules for smart documents face challenges in efficiently integrating and connecting multiple components, such as microcontrollers and biometric sensors, due to their conventional rectangular parallelepiped shape, which limits steric and electrical connectivity.
Incorporating lateral cutouts in the multichip module design, such as shoulders or chamfered edges, to facilitate electrical connectivity and self-centering within the document body, while using conductive adhesive films for secure attachment without encapsulating resin or glue joints.
Enhances electrical connectivity and mechanical stability of the multichip module within smart documents, maintaining standard dimensions and compatibility with existing card inserters, and reducing assembly complexity.
Smart Images
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Abstract
Description
Title of the invention: Multichip module for chip document and corresponding chip document.
[0001] The present invention relates to the field of multi-chip modules for chip-enabled documents.
[0002] A first object of the invention therefore relates to a multichip module; and a second object of the invention relates to a chip document comprising a multichip module according to the invention.
[0003] For the purposes of the present invention, "smart document" means: an identity document, a passport, a smart card, in particular a bank card; which includes a transport ticket, a subscription card, etc.
[0004] For the sake of brevity, only the case of a bank smart card where the module comprises a microcontroller in the form of a secure element and an interface integrated circuit in the form of a biometric fingerprint sensor will be described here. Those skilled in the art will know how to adapt the present invention to other types of microcontrollers and other interface integrated circuits.
[0005] It is common to refer to what is actually a module as a "chip." The choice of chip type depends on the intended use of the smart card. A chip can, for example, be in the form of a microcontroller or, particularly in the banking sector, a secure element.
[0006] In the field of security, particularly banking, we are seeing an increasing number of applications that implement DCVV (Dynamic Card Verification Value) technology and / or biometric technology, which require specific and complex modules. The term "module" is therefore a generic term.
[0007] It is therefore known that a smart card can comprise two modules: a first module called "payment" which includes a secure element, and a second module, for example a module comprising a biometric sensor, typically a fingerprint reader.
[0008] The link between these two modules poses various problems and we see the emergence of multi-chip modules which include a stack of electronic components allowing to perform, with a single multi-chip module, the same functions as those performed by two separate modules connected to each other.
[0009] The present invention relates to such multi-chip modules.
[0010] For the sake of brevity, the term "multi-chip" may be deliberately omitted from the following description. Similarly, the expression "smart card" may be shortened to "card".
[0011] In a conventional manner, a module comprises a first face and a second face opposite to the first face.
[0012] For simplicity, "first face" and "upper face" are used interchangeably. For example, the upper face is the face of the module that supports terminal blocks, for a "contact" module enabling transactions with physical contact of a reader on the terminal blocks, or which is on the same side as the cardholder's personal information. Similarly, "second face" and "lower face" are used interchangeably to mean the face opposite the upper face.
[0013] Conventionally, a multichip module comprises, confined within a single module: - passive components, - a set of at least one microcontroller, - an interface integrated circuit, - a printed circuit board.
[0014] Generally, the above electronic components are stacked on the printed circuit board.
[0015] The interface integrated circuit includes, for example:
[0016] - a sensor, for example biometric,
[0017] - a display screen, or
[0018] - an application-specific integrated circuit (better known by the English acronym ASIC).
[0019] The module also includes a set of connection pads, for transmitting data or energy to or from the module.
[0020] A multichip module according to the prior art has a rectangular parallelepiped shape, where the connection pads are arranged on the upper face.
[0021] According to the invention, a multichip module comprises a set of at least one lateral cutout. As described later, this lateral cutout allows not only steric configuration effects but also electrical connectivity effects.
[0022] Thus, according to a first of its objects, the invention relates to a multi-chip module (100) for a chip-enabled document (200), comprising a first face and a second face opposite to the first face, and comprising: - passive components (110), - an assembly of at least one microcontroller (160), - an interface integrated circuit (120), - a printed circuit board (130),
[0023] confined within a single module (100),
[0024] the multichip module (100) further comprising a set of connection pads (140), for transmitting data or energy from or to the multichip module (100).
[0025] It is essentially characterized in that the multichip module (100) comprises a set of at least one side cutout (150).
[0026] It can be foreseen that at least one lateral cutout (150) has a shoulder shape (150).
[0027] It can be foreseen that at least one shoulder (150) supports a set of at least one connecting stud (140), in particular in the form of a micro-pillar (141).
[0028] It can be foreseen that at least one lateral cutout (150) has a chamfered or fillet shape.
[0029] It can be foreseen that at least one of the first face and the second face supports a set of at least one connection stud (140).
[0030] It can be foreseen that the module (100) includes at least one reversed chip.
[0031] According to another of its objects, the invention relates to a chip document (200) comprising an assembly of at least one multichip module (100) according to the invention, and comprising an assembly of at least one corresponding cavity (230), in the form of a through or non-through hole, the shape of which locally matches that of the multichip module (100), the multichip module (100) being contact or non-contact.
[0032] A conductive adhesive film (300) can also be provided, disposed around the periphery of the multi-chip module (100), and at least partially in galvanic contact with at least one connection pad (140).
[0033] It can be foreseen that the multichip module (100) includes at least one antenna and the chip document (200) includes at least one antenna (210), the antenna (210) of the multichip module (100) being arranged with regard to the antenna of the chip document (200), so that the multichip module (100) and the chip document (200) can be in inductive coupling with each other through said antennas.
[0034] It can be foreseen that the smart document (200) is one of: - an identity document, - a passport, - a smart card, in particular a bank card.
[0035] Other features and advantages of the present invention will become more apparent from the following description given by way of illustrative and non-limiting example and made with reference to the accompanying figures.
[0036] The figures are not to scale, some details may have been omitted, others amplified, to facilitate understanding.
[0037] [Fig-1] illustrates a cross-section of a multi-chip module according to the prior art,
[0038] [Fig.2A] to [Fig.2I] illustrate in cross-section several embodiments of a multi-chip module according to the invention,
[0039] [Fig.3A] to [Fig.3J] illustrate in cross-section several embodiments of a lateral cutout of a multi-chip module according to the invention,
[0040] [Fig.4A] illustrates in top view a smart card comprising an embodiment of a multi-chip module according to the invention,
[0041] [Fig.4B] illustrates a cross-section of the smart card of [Fig.4A],
[0042] [Fig. 5A] illustrates a cross-section of an embodiment of a module multichip according to the invention
[0043] [Fig.5B] illustrates a cross-section of the smart card of [Fig.5A],
[0044] [Fig. 6A] illustrates in top view a smart card comprising a mode of realization of a multi-chip module according to the invention,
[0045] [Fig.6B] illustrates a cross-section of the smart card of [Fig.6A].
[0046] Figure 1 illustrates a multi-chip module according to the prior art. The module features a rectangular parallelepiped shape with an upper face 101 and a lower face 102, and includes a set of connection pads 140 arranged on the upper face 101 for transmitting data or energy from or to the module 100.
[0047] The lower face 102 of a multichip module according to the prior art generally supports a sensor 120, for example biometric.
[0048] In a smart card 200, the card body 220 is machined to insert the module 100. The machining includes one or two cavities, where the second cavity is machined into the first cavity, so that the second cavity is narrower and deeper than the first cavity.
[0049] According to the invention, the multichip module 100 comprises a set of at least one lateral cutout 150.
[0050] The lateral cut 150 is implemented for example by means of a shaped cutter.
[0051] Different embodiments of lateral cutting 150 are illustrated in figures 2A to 2H.
[0052] For brevity, only the case where the interface integrated circuit 120 is a biometric sensor 120 is described.
[0053] On [Fig.2A], the lateral cutout 150 is a straight shoulder 150 in the upper face 101. The sensor 120 is arranged on the lower face 102. The upper face 101 can support terminal blocks (not shown) or another interface integrated circuit 120 (not shown).
[0054] In contrast, on [Fig.2A], the lateral cutout 150 supports, in the right shoulder 150, a set of connection pads 140, which are galvanic contacts which enable the electrical connection between module 100 and the rest of board 200, as described later with reference to figures 4A, 5A and 6A.
[0055] The [Fig.2B] is a variant of the embodiment of the [Fig.2A], in which the upper face 101 further supports a set of at least one connection stud 140.
[0056] The [Fig.2C] is a variant of the embodiment of the [Fig.2B], in which the interface integrated circuit 120 is supported by the upper face 101, and the lower face 102 supports a set of at least one connection pad 140.
[0057] In figures 2A, 2B, and 2C, the lateral cutout 150 is a right shoulder 150 so that the module 100 has an inverted T shape, and the thickness of the shoulder 150 corresponds to that of a conductive adhesive film 300, described later.
[0058] On [Fig.2D] and [Fig.2E], the lateral cutout 150 is made in the lower face 102, in this case in the form of a straight shoulder 150, so that the module 100 has a T-shape.
[0059] The teachings of figures 2A to 2E are combinable, that is to say that a lateral cut 150 can be provided in the upper face 101 and a lateral cut 150 in the lower face 102, as illustrated in figures 2F, 2G, and 2H, which all represent a double right shoulder 150.
[0060] In figures 2F, 2G, and 2H, the lateral cutout 150 supports, in the upper right shoulder 150, a set of connection pads 140; and the interface integrated circuit 120 is arranged on the lower face 102 of the module 100.
[0061] On [Fig.2F], module 100 is contactless: the upper face 101 of module 100 is free of connection pads 140.
[0062] On [Fig.2G], module 100 is contact-based: the upper face 101 of module 100 further includes connection pads 140.
[0063] On [Fig.2H], the module 100 is contact-based: the upper face 101 of the module 100 further includes connection pads 140, and the lower face 102 of the module 100 also includes connection pads 140.
[0064] The [Fig.21] is a variant of the [Fig.2H], in which the module 100 has a shoulder 150, the upper face 101 of the shoulder 150 and the lower face 102 of the shoulder 150 each include connection pads 140, which allows electrical connections to be made by means of a conductive adhesive film 300 on the upper face 101 and on the lower face 102 of the module 100.
[0065] The shape of the lateral cutout 150 in the lower face 102 makes it easier to position the module 100 in the body 220 of the card 200, by self-centering of the latter, as illustrated for example on [Fig.3A], which also includes a set of connection pads 140 on the upper face 101.
[0066] Other forms of lateral cutout 150 in the lower face 102 of the module 100 are illustrated in figures 3B to 3F.
[0067] On [Fig.3B], the module 100 is free of connection studs 140 and the cavity 230 of the body 220 of the card 200 has, as in [Fig.3A], a known T-shaped cross-section, but here the lateral cut 150 is such that the cross-section of the module 100 has a chamfered edge.
[0068] On [Fig.3C], which further includes a set of connection pads 140 on the upper face 101, the shape of the cutout in the module 100 has a shoulder 150 and a chamfered edge in the lower face 102. It is advantageous in this case to machine the cavity 230 of the body 220 of the card 200 so that the shape of the lateral cutout 150 locally follows the shape of the cavity 230.
[0069] In a variant of the invention illustrated in [Fig.3B], in [Fig.3D] the module 100 comprises a set of connection studs 140 on its upper face 101.
[0070] On [Fig.3D] and 3E the shape of the lateral cutout 150 is a cut-off edge.
[0071] On [Fig.3F], the shape of the lateral cutout 150 is rounded, in the shape of a fillet.
[0072] The lateral space between the module 100 and the cavity 230 of the body 220 of card 200 can can be more or less wide. For example, [Fig.3D] and [Fig.3E] illustrate the same module 100, but the shape of the cavity 230 in [Fig.3E] follows the shape of the module 100. This lateral space acts as a void, limiting mechanical stress during the bending of the card 200. It can be filled with air or a flexible material such as an adhesive, a flexible plastic, silicone, etc.
[0073] On [Fig.3G], the shape of the side cutout 150 is a right shoulder 150 in the upper face 101 of the module 100, the thickness of which corresponds to that of a conductive adhesive film 300, allowing the upper face 101 to be flush with that of the conductive adhesive, and thus not increasing the thickness of the chip card 200 at the location of the module 100.
[0074] The cavity 230 into which the module 100 is inserted can be a non-through hole ([Fig.3G]) or a through hole ([Fig.3H]).
[0075] The lateral cutout 150 according to the invention allows sealing at the edge of sensor 120, as illustrated in particular in [Fig.3H], where a conductive adhesive film 300 covers the upper face 101 of the module 100, flush with the upper face (not referenced) of the body 220 of card 200.
[0076] In [Fig.31], as in [Fig.3G], the module 100 includes a shoulder 150 and connection pads 140 with a conductive adhesive film 300 in the upper face 101. In [Fig.31], the cavity 230 is a through hole so that the module 100 also includes connection pads 140 on the lower face 102, which can be in contact for example with a conductive adhesive film 300.
[0077] In [Fig. 3J], module 100 is identical to that of [Fig. 31], but cavity 230 is different; it has an H-shape, which requires insertion in two steps. Unlike [Fig. 31], in [Fig. 3J], the width of cavity 230 at the lower face 102 of module 100 is greater than the width of the lower face 102 of module 100. This is therefore in contact with a conductive adhesive film 300 that is wider than module 100, which increases the mechanical reliability of the assembly, at the expense of the ease of insertion of module 100.
[0078] Fig. 4A illustrates a 200 smart card, top view, with inductive coupling between the 200 card and the 100 module.
[0079] The [Fig.4B] is a cross-section of map 200 of the [Fig.4A].
[0080] Module 100 comprises a stack of a biometric sensor 120 and a secure element 160 on a printed circuit board 130, as well as a set of at least one passive component 110.
[0081] The cavity 230 of the body 220 of card 200, is a non-opening recess in this case in the shape of a T, which follows the shape of the module 100 whose lateral cut 150 is also in the shape of a T.
[0082] The module 100 comprises a set of connecting pads 140 in this case in the form of a micro-pillar 141, which is a conductive area for example a tin ball, or a micro-pillar 141 in copper or in tin-silver alloy, known for example at https: / / theses.hal.science / tel-02952209 / .
[0083] Machining the shoulder 150 reveals a micro-pillar 141 which is previously mounted on the printed circuit 130.
[0084] A micro-pillar 141 can also be made by copper growth, by gold wire or by soldering a pad to the metal of the printed circuit 130, which is then uncovered or even machined by milling said printed circuit 130.
[0085] Fig. 5A illustrates a 200 smart card, top view, with contact.
[0086] Fig. 5B is a cross-section of map 200 of Fig. 5A.
[0087] In [Fig.5B], the module 100 also includes a set of at least one passive component 110. The visible part of the sensor 120 is intimately bordered by the card 200 at the shoulder 150, which helps to limit fouling.
[0088] The connection between the module 100 and the conductive adhesive film 300 can be made by micro-pillars 141.
[0089] Figure 6A illustrates a contact chip, top view, with actual dimensions in mm. In this case, the connection pads 140 are ISO C1-C6 connectors.
[0090] Fig. 6B is a cross-section of map 200 of Fig. 6A, more detailed than Fig. 3J.
[0091] In this embodiment, the cavity 230 has an H-shaped form, which requires insertion in two operations.
[0092] The conductive adhesive film 300 illustrated in several figures is a flexible film, single-sided or double-sided, i.e. metallized on at least one of its two sides, and if necessary perforated to allow access to the module 100, in particular to the sensor 120. Typically, the conductive adhesive film 300 is connected to ground and to the antenna 210 of the board 200.
[0093] When the conductive adhesive film 300 is double-sided, it may include a set of vias for electrically connecting its two sides.
[0094] Conductive adhesive film 300 is known to those skilled in the art.
[0095] Thus, in general, it can be foreseen that module 100 according to the invention is configured as follows: • at least one of the upper face 101 and the lower face 102 supports an interface integrated circuit 120, said face supporting the interface integrated circuit 120 being able to further support a set of at least one connection pad 140; • The face opposite that supporting the interface integrated circuit 120 can support a set of at least one connection pad 140, the terminal blocks (in particular ISO terminal blocks Cl, C2, C3 etc) being considered as a particular type of connection pad 140; • The module 100 includes a lateral cutout 150 allowing the module 100 to be exempt from the encapsulating resin and whose shape allows, on the upper face 101 of the lateral cutout 150, to support a set of at least one connection pad 140; and / or allows, by the very shape of the lower face 102 of the lateral cutout 150, a self-centering of the module 100 in the cavity 230 of the body 220 of the card 200.
[0096] To secure the module 100 in the cavity 230, an adhesive (not referenced in the figures) can be used, for example a silver adhesive, an anisotropic adhesive (ACF / ACP) or an insulating adhesive.
[0097] The dimensions of the module 100 according to the invention remain within current usage standards, compatible with security elements present on a 200 smart card.
[0098] Current card inserters are designed to machine specific regions of 200 smart cards. The invention can be implemented with current card inserters; there is no need to change the inserter.
[0099] Furthermore, unlike prior art solutions which require a glue joint around the periphery of a module 100 passing between the conductive adhesive film 300 and the substrate, or card body, the invention makes it possible to do without the glue joint, as well as encapsulation resin because the module 100 is glued to the back of the substrate.
[0100] Nomenclature
[0101] 100 Multichip Module
[0102] 101 first face / top face
[0103] 102 second face / bottom face
[0104] 110 passive component
[0105] 120 interface integrated circuit
[0106] 130 printed circuit
[0107] 140 module connection point
[0108] 141 micro-pillar
[0109] 150 side cut
[0110] 160 microcontroller (secure element)
[0111] 200 chip-enabled document
[0112] 210 chip document antenna
[0113] 220 chip document body
[0114] 230 chip document cavity
[0115] 300 conductive adhesive film
Claims
Demands
1. Multichip module (100) for chip document (200), comprising a first face and a second face opposite the first face, and comprising: - passive components (110), - a set of at least one microcontroller (160), - an interface integrated circuit (120), - a printed circuit board (130), confined in a single module (100), the multichip module (100) further comprising a set of connection pads (140), for transmitting data or energy from or to the multichip module (100), characterized in that the multichip module (100) comprises a set of at least one side cutout (150).
2. Multichip module (100) according to claim 1, wherein at least one side cutout (150) has a shoulder shape (150).
3. Multichip module (100) according to claim 2, wherein at least one shoulder (150) supports a set of at least one connection pad (140), in particular in the form of a micro-pillar (141).
4. Multichip module (100) according to any one of the preceding claims, wherein at least one side cutout (150) has a chamfered or fillet shape.
5. Multichip module (100) according to any one of the preceding claims, wherein at least one of the first face and the second face supports a set of at least one connection pad (140).
6. Multichip module (100) according to any one of the preceding claims, comprising at least one reversed chip.
7. Chip document (200) comprising an assembly of at least one multichip module (100) according to any one of the preceding claims, and comprising an assembly of at least one corresponding cavity (230) in the form of a through or non-through hole, the shape of which locally matches that of the multichip module (100), the multichip module (100) being contact or non-contact.
8. Chip-based document (200) comprising a module (100) according to any one of the preceding claims and comprising a conductive adhesive film (300), disposed around the periphery of the multi-chip module (100), and at least partially in galvanic contact with at least one connection pad (140).
9. A chip document (200) comprising a module (100) according to claim 8, wherein the multichip module (100) comprises at least one antenna and the chip document (200) comprises at least one antenna (210), the antenna (210) of the multichip module (100) being disposed with respect to the antenna of the chip document (200), so that the multichip module (100) and the chip document (200) can be inductively coupled to each other by means of said antennas.
10. Smart document (200) comprising a module (100) according to any one of claims 8 or 9, wherein the smart document (200) is one of: - an identity document, - a passport, - a smart card, in particular a bank card.