Display panel and preparation method therefor, and display device

Abstract

Provided are a display panel and a preparation method therefor, and a display device. The display panel comprises: a base substrate (1); and a plurality of light-emitting devices (2) located on one si

Description

Display panel and manufacturing method thereof, and display device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] As one of the OLED technologies, the basic structure of the Organic Light Emitting Diode (OLED) microdisplay is: first electrode + light-emitting layer + second electrode. The first electrode provides holes and the second electrode provides electrons. The holes and electrons combine in the light-emitting layer to form excitons, and the excitons excite the light-emitting layer to emit light. For top-emitting OLED displays, a reflective sublayer is required for the first electrode. The reflective sublayer usually includes an aluminum layer. In the traditional first electrode structure, after the pattern of the first electrode is made, the side of the reflective sublayer is exposed, which can easily cause the aluminum layer on the side to migrate, bulge, and corrode and lose, affecting the injection efficiency of the first electrode and the OLED luminous efficiency, resulting in increased power consumption. Even large particles can directly cause a short circuit between the second electrode and the first electrode, resulting in a high incidence of point and line defects.

[0003] Summary of the Invention

[0004] An embodiment of the present disclosure provides a display panel, the display panel comprising:

[0005] substrate;

[0006] A plurality of light-emitting devices are located on one side of a substrate; each of the plurality of light-emitting devices includes: a first electrode; the first electrode includes: a reflecting portion, and a covering portion located on the side of the reflecting portion facing away from the substrate; the covering portion covers the front and side surfaces of the reflecting portion facing away from the substrate; the covering portion includes: a first structural layer, a second structural layer located between the first structural layer and the reflecting portion; the second structural layer is used to prevent the reflecting portion from contacting the first structural layer.

[0007] In some embodiments, the reflective portion includes: a third structure layer, a reflective sublayer, and a fourth structure layer stacked on one side of the base substrate; the thickness of the first reflective sublayer is greater than the thickness of the third structure layer and the thickness of the fourth structure layer.

[0008] In some embodiments, the reflective portion further includes a first covering layer located on the fourth structure layer away from the reflective sublayer, and the orthographic projection of the fourth structure layer on the base substrate covers the orthographic projection of the first covering layer on the base substrate.

[0009] In some embodiments, the display panel further includes: a planarization layer located between the base substrate and the light-emitting device; the first electrode is located on a side of the planarization layer away from the base substrate, and the covering portion includes a first planar region in contact with the planarization layer.

[0010] In some embodiments, the planarization layer includes a first region; an orthographic projection of the first region on the base substrate is located between orthographic projections of adjacent reflective portions on the base substrate;

[0011] The first region includes: a first surface facing away from the substrate and parallel to the plane where the substrate is located, and a first side surface; the remaining region of the planarization layer outside the first region includes a second surface facing away from the substrate and parallel to the plane where the substrate is located; the first side surface connects the first surface and the second surface;

[0012] The distance between the first surface and the base substrate is smaller than the distance between the second surface and the base substrate;

[0013] The orthographic projection of the first flat area on the substrate is located within the orthographic projection of the first region on the substrate.

[0014] In some embodiments, the distance between the first surface and the second surface is greater than the thickness of the first flat region of the covering portion.

[0015] In some embodiments, a distance between the first surface and the second surface is less than a thickness of the reflective portion.

[0016] In some embodiments, the angle between the first side surface and the first surface is greater than 90°.

[0017] In some embodiments, the display panel further includes a plurality of partition structures; the partition structures overlap in a region between an orthographic projection of the base substrate and an orthographic projection of an adjacent first electrode on the base substrate.

[0018] In some embodiments, the partition structure includes a first partition groove structure; the first partition groove structure is located in the first area;

[0019] The orthographic projection of the first partition groove structure on the base substrate is located between the orthographic projections of adjacent first electrodes on the base substrate.

[0020] In some embodiments, in a direction perpendicular to the substrate, a depth of the first partition trench structure is greater than a distance between the first surface and the second surface.

[0021] In some embodiments, the display panel further includes a pixel definition layer; the pixel definition layer includes opening areas corresponding one to one with the light-emitting devices, and the orthographic projection of the opening areas on the substrate falls within the orthographic projection of the first electrode on the substrate; the pixel definition layer covers an edge of the first electrode;

[0022] The maximum thickness of the pixel definition layer is smaller than the maximum thickness of the first electrode.

[0023] In some embodiments, the partition structure includes a second partition slot structure;

[0024] The display panel further includes a pixel definition layer; the pixel definition layer includes a second partition groove structure; the orthographic projection of the second partition groove structure on the base substrate is located between the orthographic projections of adjacent first electrodes on the base substrate;

[0025] The pixel definition layer further includes opening areas corresponding to the light-emitting devices one by one, and the orthographic projection of the opening areas on the base substrate falls within the orthographic projection of the first electrode on the base substrate.

[0026] In some embodiments, a maximum thickness of the pixel definition layer is greater than a maximum thickness of the first electrode.

[0027] In some embodiments, the pixel definition layer includes: a first pixel definition sublayer, a second pixel definition sublayer, and a third pixel definition sublayer stacked in a direction perpendicular to the substrate;

[0028] The maximum thickness of the first pixel definition sublayer is greater than the maximum thickness of the second pixel definition sublayer, and the maximum thickness of the second pixel definition sublayer is greater than the maximum thickness of the third pixel definition sublayer;

[0029] The maximum thickness of the first pixel definition sublayer is greater than the maximum thickness of the first electrode;

[0030] The depth of the second partition groove structure is greater than the total thickness of the third pixel definition sublayer and the second pixel definition sublayer and is less than the maximum thickness of the pixel definition layer;

[0031] The third pixel definition sublayer includes a first opening area, and the second pixel definition sublayer includes a second opening area; an orthographic projection of the first opening area on the base substrate falls within an orthographic projection of the second opening area on the base substrate.

[0032] In some embodiments, an orthographic projection of the first structure layer on the base substrate covers an orthographic projection of the second structure layer on the base substrate.

[0033] In some embodiments, the first structure layer includes: a first sublayer covering the reflective portion, and a second sublayer located on a side of the first sublayer away from the reflective portion; the thickness of the second sublayer is greater than that of the first sublayer.

[0034] In some embodiments, the angle between the side surface of the reflective portion and the plane where the base substrate is located is greater than 0° and less than or equal to 70°.

[0035] An embodiment of the present disclosure provides a method for manufacturing a display panel, comprising:

[0036] providing a substrate;

[0037] forming a pattern of a plurality of reflective portions on one side of the base substrate;

[0038] A pattern of multiple covering parts is formed on the side of the reflecting part facing away from the base substrate; wherein the covering part covers the front and side surfaces of the reflecting part facing away from the base substrate, and the covering part includes: a first structural layer, and a second structural layer located between the first structural layer and the reflecting part; the second structural layer is used to prevent the reflecting part from contacting the first structural layer.

[0039] An embodiment of the present disclosure provides a display device, which includes the display panel provided by the embodiment of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0041] FIG1 is a schematic structural diagram of a display panel provided by an embodiment of the present disclosure;

[0042] FIG2 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0043] FIG3 is a graph showing a reflectivity test result of a display panel provided by an embodiment of the present disclosure;

[0044] FIG4 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0045] FIG5 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0046] FIG6 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0047] FIG7 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0048] FIG8 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0049] FIG9 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0050] FIG10 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0051] FIG11 is a schematic structural diagram of another display panel provided by an embodiment of the present disclosure;

[0052] FIG12 is a schematic flow chart of a method for manufacturing a display panel according to an embodiment of the present disclosure;

[0053] FIG13 is a schematic flow chart of another method for manufacturing a display panel provided in an embodiment of the present disclosure;

[0054] FIG14 is a schematic flow chart of another method for manufacturing a display panel provided in an embodiment of the present disclosure;

[0055] FIG15 is a schematic flow chart of another method for manufacturing a display panel provided in an embodiment of the present disclosure;

[0056] FIG16 is a schematic diagram of a structure formed by an over-etching process on a reflective portion in a method for manufacturing a display panel provided by an embodiment of the present disclosure. DETAILED DESCRIPTION

[0057] In order to make the purpose, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. And in the absence of conflict, the embodiments in the present disclosure and the features in the embodiments can be combined with each other. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0058] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by persons of ordinary skill in the field to which this disclosure belongs. The words "first", "second" and similar terms used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Words such as "include" or "comprise" mean that the elements or objects preceding the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0059] It should be noted that the sizes and shapes of the figures in the accompanying drawings do not reflect the actual scale and are only for the purpose of illustrating the present disclosure. The same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions.

[0060] In the related art, for top-emitting OLED displays, the first electrode includes a reflective sublayer and a hole transport sublayer located on the reflective sublayer. The reflective sublayer usually includes an aluminum layer. The traditional first electrode manufacturing process usually adopts a one-time etching process, that is, after depositing the various film layers of the first electrode, a one-time etching process is performed to form the pattern of the first electrode. After the first electrode pattern is formed, the side of the reflective sublayer is exposed, which can easily cause defects such as migration bulging, corrosion loss, etc. of the aluminum layer on the side. One solution to avoid causing migration bulging or corrosion loss of the aluminum layer is to use a hole transport sublayer to cover the side of the aluminum layer. However, the hole transport sublayer is usually indium tin oxide, which is in direct contact with the aluminum layer on the side, causing oxygen diffusion to form an aluminum oxide insulating layer at the interface between the two, which significantly affects the ohmic characteristics and causes a serious decline in the performance of the OLED device.

[0061] An embodiment of the present disclosure provides a display panel, as shown in FIG1 , comprising:

[0062] Base substrate 1;

[0063] A plurality of light-emitting devices 2 are located on one side of a substrate 1; the light-emitting devices 2 include: a first electrode 201; as shown in FIG1 , the first electrode 201 includes: a reflecting portion 2011, and a covering portion 2012 located on the side of the reflecting portion 2011 facing away from the substrate 1; the covering portion 2012 covers the front side a and the side side e of the reflecting portion 2011 facing away from the substrate 1; the covering portion 2012 includes: a first structure layer 20121, and a second structure layer 20122 located between the first structure layer 20121 and the reflecting portion 2011; the second structure layer 20122 is used to prevent the reflecting portion 2011 from contacting the first structure layer 20121.

[0064] In the display panel provided by the embodiment of the present disclosure, the first electrode includes a covering portion that covers the side of the reflective portion, thereby preventing migration bulges or corrosion defects from occurring on the side of the reflective portion, improving the flatness of the front and side surfaces of the first electrode, improving the injection efficiency of the first electrode, and improving the luminous efficiency of the light-emitting device, thereby reducing the power consumption of the display panel. In addition, since the covering portion includes a second structural layer located between the first structural layer and the reflective portion, it can prevent the reflective portion from contacting the first structural layer. Typically, the first structural layer is a metal oxide, and the reflective portion includes a metal material. When the two contact, an oxide insulating layer is formed. The second structural layer prevents the reflective portion from contacting the first structural layer, thereby preventing the reflective portion and the first structural layer from forming an oxide insulating layer, thereby preventing the ohmic characteristics of the first electrode from being affected and preventing the performance of the light-emitting device from being affected.

[0065] In some embodiments, as shown in FIG2 , the light emitting device 2 further includes: a light emitting functional layer 202 located on a side of the first electrode 201 away from the substrate 1 , and a second electrode 203 located on a side of the light emitting functional layer away from the first electrode 201 .

[0066] In a specific implementation, the second electrode includes a transparent electrode.

[0067] In a specific implementation, the first electrode is, for example, an anode of a light-emitting device, and the second electrode is, for example, a cathode of the light-emitting device.

[0068] It should be noted that in the display panel provided by the embodiments of the present disclosure, the first electrode of the light-emitting device includes not only a first structural layer providing holes but also a reflective portion, and the second electrode is a transparent electrode, i.e., the light-emitting device is a top-emitting light-emitting device. Light emitted by the light-emitting functional layer reaches the reflective portion, is reflected, and then exits from the second electrode.

[0069] In some embodiments, as shown in FIG. 1 , the reflective portion 2011 includes: a third structural layer 20111 , a reflective sublayer 20112 , and a fourth structural layer 20113 that are stacked.

[0070] It should be noted that, in specific implementations, the third and fourth structural layers are provided to protect the reflective sublayer. In particular, the fourth structural layer, because the covering portion needs to cover the side of the reflective portion, requires first forming the reflective portion pattern, followed by forming the covering layer pattern. Typically, an etching process is used to form the reflective portion pattern, and since etching processes require the use of an etchant, providing the fourth structural layer on the side of the reflective sublayer facing away from the base substrate prevents damage to the front surface of the reflective sublayer facing away from the base substrate from contact with the etchant.

[0071] In some embodiments, as shown in FIG1 , the shape of the cross section of the reflective portion 2011 perpendicular to the base substrate 1 is an isosceles trapezoid.

[0072] That is, in the display panel provided by the embodiment of the present disclosure, the side surface of the reflective portion of the first electrode is an inclined surface with an angle greater than 0 with the plane where the base substrate is located, so that the covering portion covers the side surface of the reflective portion to protect the side surface of the reflective portion and avoid migration bulging or corrosion loss on the side surface of the reflective portion.

[0073] In some embodiments, as shown in FIG1 , an angle c between the side surface of the reflective portion 2011 and the plane where the base substrate 1 is located is greater than 0° and less than or equal to 70°.

[0074] In the display panel provided by the embodiment of the present disclosure, the angle between the side surface of the reflective portion of the first electrode and the plane on which the base substrate is located is greater than 0° and less than or equal to 70°, that is, the angle is small, which is conducive to the continuous film formation of the covering portion on the side surface of the reflective portion to protect the side surface of the reflective portion and avoid migration bulging or corrosion loss on the side surface of the reflective portion.

[0075] In some embodiments, an orthographic projection of the first structure layer on the base substrate covers an orthographic projection of the second structure layer on the base substrate.

[0076] In some embodiments, as shown in FIG. 1 , the orthographic projection of the first structure layer 20121 on the base substrate 1 coincides with the orthographic projection of the second structure layer 20122 on the base substrate 1 .

[0077] In a specific implementation, after forming the pattern of the reflective sublayer, the second structural layer and the first structural layer can be sequentially formed. The first and second structural layers are then patterned to form a covering portion pattern in which the orthographic projection of the first structural layer on the substrate coincides with the orthographic projection of the second structural layer on the substrate. In other words, the patterns of the first and second structural layers are formed in a single patterning process. This prevents contact between the reflective portion and the first structural layer, forming the oxide insulating layer while avoiding additional steps in the first electrode fabrication process, thus saving costs.

[0078] In some embodiments, the second structural layer includes a refractory material.

[0079] In the display panel provided by the embodiment of the present disclosure, the second structural layer includes a refractory material, so that the second structural layer is not likely to react with the reflective portion to form an insulating layer when in contact with the reflective portion, thereby enabling the second structural layer to block the reflective portion from contacting the first structural layer to form an oxide insulating layer.

[0080] In some embodiments, the refractory material is, for example, a material having a melting point greater than 1650°C.

[0081] In some embodiments, the third structural layer and the fourth structural layer also include refractory materials with a melting point greater than 1650°C.

[0082] In the display panel provided by the embodiments of the present disclosure, the third and fourth structural layers also comprise a refractory metal material having a melting point greater than 1650°C. Thus, the third and fourth structural layers can protect the reflective sublayer from damage. In particular, the fourth structural layer comprising a refractory metal material having a melting point greater than 1650°C can prevent damage to the reflective sublayer from frontal contact with the etching solution.

[0083] In some embodiments, when the second structural layer, the third structural layer, and the fourth structural layer all include refractory metal materials, for example, the second structural layer, the third structural layer, and the fourth structural layer include one of the following materials or a combination thereof: titanium (Ti), tungsten (W), molybdenum (Mo), cobalt (Co), chromium (Cr), platinum (Pt), titanium nitride (TiN), and titanium tungsten (TiW).

[0084] In some embodiments, the material of the reflective sublayer 20112 includes aluminum (Al).

[0085] In some embodiments, the first structural layer is a transparent film layer, so that the light emitted by the light-emitting functional layer can reach the reflective sublayer and be reflected.

[0086] In some embodiments, the material of the first structure layer includes indium tin oxide (ITO).

[0087] In a specific implementation, the third structural layer, the reflective sublayer, and the fourth structural layer of the stacked arrangement included in the reflective part are, for example, Ti / Al / Ti or Ti / Al / TiN; the second structural layer and the first structural layer included in the covering part are, for example, Ti / ITO or TiN / ITO; the reflective part + the covering part included in the first electrode are, for example, Ti / Al / Ti+Ti / ITO, Ti / Al / TiN+Ti / ITO, Ti / Al / TiN+TiN / ITO or Ti / Al / Ti+TiN / ITO.

[0088] It should be noted that the display panel provided by the embodiment of the present disclosure has poor light transmittance of the second and fourth structural layers. In order to avoid affecting the light transmittance of the surface of the light-emitting device facing away from the substrate, it is necessary to set a second and fourth structural layers with relatively thin thickness.

[0089] In some embodiments, the thickness of the first structural layer is greater than the thickness of the second structural layer.

[0090] In some embodiments, the thickness of the second structure layer is greater than or equal to 10 angstroms and less than or equal to 15 angstroms.

[0091] In some embodiments, the thickness of the first reflective sub-layer is greater than the thickness of the third structure layer and the thickness of the fourth structure layer.

[0092] In some embodiments, the thickness of the third structural layer is greater than 50 angstroms.

[0093] In some embodiments, the thickness of the fourth structure layer is greater than or equal to 10 angstroms and less than or equal to 15 angstroms.

[0094] In some embodiments, the thickness of the reflective sublayer is greater than or equal to 700 angstroms, thereby ensuring the reflectivity of the reflective sublayer.

[0095] In some embodiments, the thickness of the first structure layer is greater than or equal to 120 angstroms and less than or equal to 100 angstroms, thereby ensuring the flatness of the front and side surfaces of the first electrode facing away from the substrate while ensuring the transmittance of the first structure layer.

[0096] In a specific implementation, taking the first electrode structure comprising a reflective portion and a covering portion composed of Ti / Al / TiN+TiN / ITO as an example, the thicknesses of the various film layers are as follows: Ti: 100 angstroms, Al: 730 angstroms, TiN: 10 angstroms, TiN: 10 angstroms, and ITO: 150 angstroms. The reflectivity test results of the aforementioned first electrode structure are shown in FIG3 . The reflectivity of this first electrode structure for light with a wavelength of 460 nanometers is 84%, meeting the reflectivity requirements.

[0097] In some embodiments, as shown in FIG. 4 , the first structure layer 20121 includes: a first sublayer 201211 covering the reflective portion, and a second sublayer 201212 located on a side of the first sublayer 201211 facing away from the reflective portion.

[0098] It should be noted that in order to avoid affecting the light transmittance of the surface of the light-emitting device facing away from the substrate, the thickness of the second structural layer cannot be too thick. Therefore, the thickness uniformity of the thinner second structural layer is poor, which will accordingly affect the thickness uniformity of the single-layer first structural layer formed on the second structural layer.

[0099] In the display panel provided by the embodiments of the present disclosure, the first structural layer includes a first sublayer and a second sublayer, that is, the first sublayer is formed first, followed by the second sublayer. Because the material of the first structural layer allows for a relatively thick film layer while maintaining light transmittance, a relatively thick first sublayer can be formed to flatten the front and side surfaces of the second structural layer. Subsequently, the second sublayer is formed on the side of the film layer with higher flatness, thereby improving the flatness of the first electrode surface.

[0100] In some embodiments, the thickness of the second sub-layer is greater than the thickness of the first sub-layer.

[0101] In some embodiments, the thickness of the first structural layer is less than or equal to 200 angstroms;

[0102] The thickness of the first sublayer is greater than 50 angstroms;

[0103] The second sub-layer has a thickness of less than 150 angstroms.

[0104] In some embodiments, as shown in FIG. 5 , the reflective portion 2011 further includes a first covering layer 20114 located on the fourth structure layer 20113 away from the reflective sub-layer 20112 .

[0105] In some embodiments, the material of the first capping layer includes indium tin oxide.

[0106] It should be noted that in order to avoid affecting the light transmittance of the surface of the light-emitting device facing away from the substrate, the thickness of the fourth structural layer cannot be too thick. Therefore, the thickness uniformity of the thinner fourth structural layer is poor, and accordingly, it will also affect the thickness uniformity of the covering part formed on the fourth structural layer.

[0107] The display panel provided by the embodiment of the present disclosure has a reflective portion including a first covering layer covering the fourth structural layer. Since the material of the first covering layer can be used to produce a thicker film layer while ensuring light transmittance, a thicker first covering layer can be produced to flatten the fourth structural layer.

[0108] In some embodiments, the thickness of the first capping layer is greater than 50 angstroms.

[0109] It should be noted that in related art, to ensure film flatness, when the fourth structural layer is made of TiN, the TiN thickness typically needs to be approximately 18 angstroms, and when the fourth structural layer is made of Ti, the Ti thickness typically needs to be approximately 30 angstroms, which affects light transmittance. In the display panel provided by the disclosed embodiments, the first cover layer is provided to flatten the fourth structural layer, allowing the thickness of the fourth structural layer to be reduced to 10 angstroms or even less. This improves light transmittance on the side of the reflective sublayer facing away from the base substrate while ensuring the surface flatness of the reflective portion.

[0110] In a specific implementation, as shown in Figure 5, the cross-section of the reflecting portion 2011 is an isosceles trapezoid, the first covering layer 20114 covers the surface of the fourth structural layer 20113 facing away from the base substrate 1, and the orthographic projection of the fourth structural layer 20113 on the base substrate 1 covers the orthographic projection of the first covering layer 20114 on the base substrate 1.

[0111] It should be noted that FIG5 is an example of providing a first structural layer on the covering portion. Of course, in specific implementation, the first structural layer in FIG5 can also be formed twice, that is, the first structural layer includes a first sub-layer and a second sub-layer.

[0112] In a specific implementation, the display panel provided by the embodiment of the present disclosure may be a micro organic light emitting diode (Micro OLED) display panel.

[0113] In a specific implementation, the base substrate of the Micro OLED display panel is, for example, a silicon-based base substrate. As shown in FIG2 , the display panel further includes: a planarization layer 3 located between the base substrate 1 and the light-emitting device 2; and a drive circuit layer 7 located between the base substrate 1 and the planarization layer 3. The planarization layer is made of, for example, silicon oxide; the drive circuit layer is, for example, an integrated circuit, including pixel drive circuits electrically connected to the light-emitting devices in a one-to-one correspondence; the pixel drive circuits may include, for example, complementary metal oxide semiconductor transistors.

[0114] In a specific implementation, the drive circuit layer of the Micro OLED display panel uses an integrated circuit including complementary metal oxide semiconductor transistors. The pixel drive circuit is small in size, thereby improving the resolution of the display panel; the resolution of the Micro OLED display panel can be achieved to be greater than 3000 pixels per inch (PPI). In other words, the display panel provided by the embodiments of the present disclosure is a high-resolution display panel.

[0115] In some embodiments, as shown in FIG2 , the first electrode 201 is located on a side of the planarization layer 3 away from the substrate 1 ;

[0116] As shown in FIG. 1 , the covering portion 2012 includes a first planar region d covering the planarization layer 3 .

[0117] In some embodiments, as shown in FIG2 , the display panel further includes a pixel definition layer 4 ; the pixel definition layer 4 includes opening regions 401 corresponding one-to-one with the light-emitting devices 2 . The orthographic projection of the opening regions 401 on the substrate 1 falls within the orthographic projection of the first electrode 201 on the substrate 1 . In other words, the opening regions 401 correspond to the light-emitting regions of the light-emitting devices 2 .

[0118] In some embodiments, as shown in FIG. 2 , the display panel further includes: an encapsulation layer 6 located on a side of the light-emitting device 2 facing away from the base substrate 1 .

[0119] In a specific implementation, the encapsulation layer includes, for example, a stacked arrangement of an inorganic encapsulation layer / an organic encapsulation layer / an inorganic encapsulation layer.

[0120] In a specific implementation, the display panel includes a plurality of sub-pixels, and each sub-pixel includes a light-emitting device.

[0121] In some embodiments, as shown in FIG6 , the light emitting device 2 is a white light emitting device; the display panel further includes: a color filter 8 located on the side of the light emitting device 2 away from the substrate, and a light shielding layer 9 located between adjacent color filters 8 .

[0122] It should be noted that due to the high resolution of the Micro OLED display panel, and the traditional fine metal mask (FMM) can only achieve a resolution of about 800PPI at most, it is difficult to use FMM to evaporate the organic light-emitting layer in a side-by-side monochrome device (SBS) manner. Therefore, when the light-emitting device is a white light-emitting device, a full-surface evaporation process can be used to achieve high-resolution display. The display panel also includes a color filter, so that the light emitted by the white light-emitting device can emit light consistent with the sub-pixel color after passing through the color filter to achieve full-color display.

[0123] In a specific implementation, as shown in FIG6 , the plurality of sub-pixels include, for example, a plurality of blue sub-pixels B, a plurality of red sub-pixels R, and a plurality of green sub-pixels G. Accordingly, the color filter 8 includes a blue color filter corresponding to the blue sub-pixels B, a red color filter corresponding to the red sub-pixels R, and a green color filter corresponding to the green sub-pixels G.

[0124] In a specific implementation, the light-emitting functional layer includes at least one light-emitting unit, and the light-emitting unit includes an organic light-emitting layer.

[0125] 6 , the light-emitting functional layer 202 of the light-emitting device 2 includes only one light-emitting unit, that is, the light-emitting device uses a single organic light-emitting layer structure to emit white light, and the organic light-emitting layer uses, for example, a combination of multiple different light-emitting materials to emit white light.

[0126] Alternatively, in some embodiments, as shown in FIG. 7 , the light-emitting functional layer 202 includes a plurality of light-emitting units 202 - 1 and a charge generation layer 202 - 2 located between the light-emitting units 202 - 1 ; the plurality of light-emitting units 202 - 1 are stacked between the first electrode 201 and the second electrode 203 .

[0127] It should be noted that when the light-emitting device includes only one light-emitting unit, a single organic light-emitting layer is used to realize white light. The brightness of the light-emitting device is usually not high. If a display panel including the light-emitting device is used to achieve high-brightness display, the power consumption of the display panel needs to be increased, which affects the life of the display panel.

[0128] The display panel provided by the embodiment of the present disclosure has a light-emitting device including a plurality of light-emitting units, each of which includes an organic light-emitting layer, so that the light emitted by the light-emitting device is the effect of the superposition of multiple light-emitting units, which can improve the brightness of the light-emitting device, thereby reducing the power consumption of the display panel and increasing the service life of the display panel.

[0129] It should be noted that FIG7 is an example of a light emitting device 2 including two stacked light emitting units 202-1. In some embodiments, as shown in FIG7 , the light emitting device 2 includes: a first light emitting unit 202-1-1, and a second light emitting unit 202-1-2 located on a side of the first light emitting unit 202-1-1 facing away from the substrate 1;

[0130] The first light emitting unit 202-1-1 includes: a red organic light emitting layer r' and a green organic light emitting layer g' located on a side of the red organic light emitting layer r' facing away from the base substrate 1;

[0131] The second light-emitting unit 202-1-2 includes a blue organic light-emitting layer b'.

[0132] In a specific implementation, the charge generation layer is used to generate electrons and holes, thereby providing electrons to the first light-emitting unit and providing holes to the second light-emitting unit.

[0133] In some embodiments, as shown in Figure 7, the first light-emitting unit 202-1-1 also includes: a hole injection layer 2021 located between the red organic light-emitting layer r' and the first electrode 201, a hole transport layer 2022 located between the red organic light-emitting layer r' and the hole injection layer 2021, and an electron transport layer 2023 located between the green organic light-emitting layer g' and the charge generation layer 202-2; the second light-emitting unit 202-1-2 also includes: a hole injection layer 2021 located between the blue organic light-emitting layer b' and the charge generation layer 202-2, two hole transport layers 2022 located between the blue organic light-emitting layer b' and the hole injection layer 2021, an electron transport layer 2023 located between the blue organic light-emitting layer b' and the second electrode 203, a hole blocking layer 2024 located between the blue organic light-emitting layer b' and the electron transport layer 2023, and an electron injection layer 2025 located between the electron transport layer 2023 and the second electrode 203.

[0134] In a specific implementation, the hole injection layer, the hole transport layer, the electron transport layer, the hole blocking layer, the electron injection layer and the charge generation layer can all be prepared using a full-surface evaporation process.

[0135] In some embodiments, the hole injection layer, hole transport layer, electron transport layer, hole blocking layer, electron injection layer and charge generation layer corresponding to different sub-pixels can be connected as a whole, that is, the hole injection layer, hole transport layer, electron transport layer, hole blocking layer, electron injection layer and charge generation layer are common layers.

[0136] Alternatively, in some embodiments, as shown in FIG. 9 to FIG. 11 , the display panel further includes a plurality of partition structures 10 ; the partition structures 10 overlap in the area between the orthographic projections of the base substrate 1 and the orthographic projections of the adjacent first electrodes 201 on the base substrate 1 .

[0137] In a specific implementation, the partition structure is located in the region between the light-emitting areas of the sub-pixels, so as to disconnect the charge generation layer formed by full-surface vapor deposition at the partition structure.

[0138] It should be noted that the charge generation layer has a high lateral conductivity. If the charge generation layer is continuous between adjacent sub-pixels, it can easily lead to color cross-talk between sub-pixels. The display panel provided in the embodiments of the present disclosure is provided with a partition structure that disconnects the charge generation layer formed by vapor deposition across the entire surface at the partition structure to avoid color cross-talk between sub-pixels.

[0139] In a specific implementation, the partition structure may be, for example, a tall fence (TF), a dig on wafer (DOW), an undercut, or the like.

[0140] In some embodiments, as shown in FIG. 8 , FIG. 9 , FIG. 10 , and FIG. 11 , the planarization layer 3 includes a first region 302 ; an orthographic projection of the first region 302 on the base substrate 1 is located between orthographic projections of adjacent first electrodes 201 on the base substrate 1 .

[0141] In some embodiments, as shown in FIG8 , the first region 302 includes: a first surface j parallel to the plane where the substrate 1 is located, and a first side surface f; the remaining region of the planarization layer 3 outside the first region 302 includes a second surface i facing away from the substrate 1 and parallel to the plane where the substrate 1 is located; the first side surface f connects the first surface j and the second surface i;

[0142] The distance between the first surface j and the base substrate 1 is smaller than the distance between the second surface i and the base substrate 1 .

[0143] It should be noted that during the formation of the reflective sublayer, an etching process is required for the fourth structural layer, the reflective sublayer, and the third structural layer. To avoid etching residues in the fourth structural layer, the reflective sublayer, and the third structural layer, an overetching process is required. That is, while the fourth structural layer, the reflective sublayer, and the third structural layer are being etched, a portion of the planarization layer is removed simultaneously. In other words, the planarization layer has a first region where the portion of the planarization layer is removed by the overetching process. Subsequently, a partitioning groove structure is formed in the first region to serve as a partitioning structure.

[0144] In some embodiments, as shown in FIG. 8 , the distance between the first surface j and the second surface i is greater than the thickness of the first flat region d of the covering portion 2012 .

[0145] In some embodiments, as shown in FIG. 8 , the distance between the first surface j and the second surface i is less than the thickness of the reflective portion 2011 .

[0146] In some embodiments, as shown in FIG. 8 , the angle between the first side surface f and the first surface j is greater than 90°.

[0147] In a specific implementation, the angle between the first side surface and the first surface may be equal to the angle between the side surface of the reflective portion and the first surface.

[0148] In a specific implementation, h1 is greater than or equal to 200 angstroms and less than or equal to 300 angstroms.

[0149] In some embodiments, as shown in FIG8 , the orthographic projection of the first flat area on the substrate 1 is located within the orthographic projection of the first region 302 on the substrate 1. That is, the covering portion extends to the area of ​​the planarization layer removed by the over-etching process, i.e., the first region, thereby improving the covering effect of the covering portion.

[0150] In some embodiments, the partition structure is a DOW-formed partition trench structure. As shown in FIG9 , the partition structure 10 includes a first partition trench structure 1001 . The first partition trench structure 1001 is located in the first region 302 . The orthographic projection of the first partition trench structure 1001 on the substrate 1 is located between the orthographic projections of adjacent first electrodes 201 on the substrate 1 . That is, the first partition trench structure 1001 is formed in the first region 302 of the planarization layer 3 .

[0151] In a specific implementation, a first isolation groove structure is formed in the planarization layer, and a groove structure is also formed in the subsequently formed pixel definition layer at the isolation groove structure. In this way, the charge generation layer formed by the entire surface vapor deposition is disconnected in the area corresponding to the first isolation groove structure.

[0152] In some embodiments, as shown in FIG. 9 , in a direction perpendicular to the substrate, a depth h3 of the first partition trench structure 1001 is greater than a distance h1 between the first surface and the second surface.

[0153] In a specific implementation, the depth h3 of the first partition trench structure is, for example, greater than or equal to 600 angstroms and less than or equal to 1200 angstroms.

[0154] In a specific implementation, as shown in FIG9 , the width of the first region 302 is, for example, 1 micron to 1.2 microns; the width h2 of the first partition groove structure 1001 is, for example, greater than or equal to 0.45 microns and less than or equal to 0.55 microns; the distance h5 between the first partition groove structure 1001 and the edge of the first surface is, for example, 0.15 microns, and the distance h4 between the first partition groove structure 1001 and the edge of the second surface is, for example, 0.3 microns.

[0155] In some embodiments, as shown in FIG. 9 , the pixel definition layer 4 covers the edge of the first electrode 201 .

[0156] In some embodiments, a maximum thickness of the pixel definition layer is less than a maximum thickness of the first electrode.

[0157] In a specific implementation, the thickness of the pixel definition layer is smaller than the thickness of the first electrode. For example, the ratio of the thickness of the pixel definition layer to the thickness of the first electrode is greater than or equal to 1 / 3 and less than or equal to 1 / 2.

[0158] In some embodiments, as shown in FIG. 9 , the orthographic projection of the first partition trench structure 1001 on the base substrate 1 is located within the orthographic projection of the first region 302 on the base substrate 1 .

[0159] In some embodiments, as shown in FIG9 , the first partitioning trench structure 1001 has a rectangular shape in a cross section perpendicular to the base substrate 1 , that is, the side surface of the first partitioning trench structure 1001 is perpendicular to its bottom surface.

[0160] Of course, in specific implementations, as shown in FIG10 , the first partitioning trench structure 1001 may have a non-rectangular shape in a cross section perpendicular to the base substrate 1. For example, in FIG10 , the inverted trapezoidal shape of the first partitioning trench structure 1001 in a cross section perpendicular to the base substrate 1 gradually decreases in the direction away from the base substrate 1. That is, in FIG10 , the width h2 of the first partitioning trench structure 1001 at the point farthest from the base substrate 1 is smaller than the width h9 of the first partitioning trench structure 1001 at the point closest to the base substrate 1. The inverted trapezoidal shape of the first partitioning trench structure in a cross section perpendicular to the base substrate further facilitates disconnection of the charge generation layer at the first partitioning trench structure.

[0161] Alternatively, in some embodiments, the partition structure is a partition groove structure formed by undercut; as shown in Figure 11, the partition structure 10 includes a second partition groove structure 1002; the pixel definition layer 4 includes the second partition groove structure 1002; the orthographic projection of the second partition groove structure 1002 on the base substrate 1 is located between the orthographic projections of adjacent first electrodes 201 on the base substrate 1.

[0162] In some embodiments, as shown in FIG. 11 , the maximum thickness of the pixel definition layer 4 is greater than the maximum thickness of the first electrode 201 .

[0163] In some embodiments, as shown in FIG11 , the pixel definition layer 4 includes: a first pixel definition sublayer 402 , a second pixel definition sublayer 403 , and a third pixel definition sublayer 404 stacked in a direction perpendicular to the base substrate 1 ;

[0164] The maximum thickness of the first pixel definition sublayer 402 is greater than the maximum thickness of the second pixel definition sublayer 403 , and the maximum thickness of the second pixel definition sublayer 403 is greater than the maximum thickness of the third pixel definition sublayer 404 ;

[0165] The maximum thickness of the first pixel definition sublayer 402 is greater than the maximum thickness of the first electrode 201;

[0166] The depth h3 of the second partition trench structure 1002 is greater than the total thickness of the third pixel definition sublayer 404 and the second pixel definition sublayer 403 and less than the maximum thickness of the pixel definition layer 4 .

[0167] That is, the second partition groove structure penetrates the third pixel definition sublayer and the second pixel definition sublayer, but does not penetrate the first pixel definition sublayer. In the area of ​​the second partition groove structure, only a part of the first pixel definition sublayer is removed in the direction perpendicular to the substrate.

[0168] In some embodiments, as shown in FIG11 , the third pixel definition sublayer 404 includes a first opening region 4041, and the second pixel definition sublayer 403 includes a second opening region 4031. The width h6 of the first opening region 4041 is smaller than the width h7 of the second opening region 4031. That is, the orthographic projection of the first opening region 4041 on the substrate 1 falls within the orthographic projection of the second opening region 4031 on the substrate 1. This facilitates isolation of the charge generation layer.

[0169] In a specific implementation, for example, the width h6 of the first opening area 4041 is smaller than the width h8 between adjacent first electrodes 201, and the orthographic projection of the first opening area 4041 on the base substrate 1 falls within the area between the orthographic projections of adjacent first electrodes 201 on the base substrate 1; the width h7 of the second opening area 4031 is greater than the width h8 between adjacent first electrodes 201.

[0170] In a specific implementation, h8 is, for example, greater than or equal to 0.78 microns and less than or equal to 0.88 microns, h6 is, for example, greater than or equal to 0.43 microns and less than or equal to 0.53 microns, h7-h6 are, for example, greater than or equal to 0.08 microns and less than or equal to 0.12 microns, and h3 is, for example, greater than or equal to 800 angstroms and less than or equal to 1000 angstroms. In FIG12 , the width h9 between adjacent openings 401 is greater than or equal to 1.7 microns and less than or equal to 1.8 microns.

[0171] In a specific implementation, the materials of the first pixel definition sublayer and the third pixel definition sublayer include silicon oxide, and the material of the second pixel definition sublayer includes silicon nitride.

[0172] Based on the same inventive concept, an embodiment of the present disclosure provides a method for manufacturing a display panel, as shown in FIG12 , comprising:

[0173] S101, providing a substrate;

[0174] S102, forming a pattern of multiple reflective portions on one side of the base substrate;

[0175] S103. Form a pattern of multiple covering parts on the side of the reflecting part facing away from the base substrate; wherein the covering parts cover the front and side surfaces of the reflecting part facing away from the base substrate, and the covering parts include: a first structural layer, and a second structural layer located between the first structural layer and the reflecting part; the second structural layer is used to block the reflecting part from contacting the first structural layer.

[0176] In the method for manufacturing a display panel provided by the embodiments of the present disclosure, when fabricating the first electrode, a pattern of the reflective portion is first formed, followed by a covering portion that covers the front and side surfaces of the reflective portion. This prevents migration bulging or corrosion defects on the side surfaces of the reflective portion, improves the flatness of the front surface of the first electrode, improves the injection efficiency of the first electrode, and improves the luminous efficiency of the light-emitting device, thereby reducing the power consumption of the display panel. Furthermore, because the covering portion includes a second structural layer located between the first structural layer and the reflective portion, it prevents the reflective portion from contacting the first structural layer to form an oxide insulating layer, thereby preventing any impact on the ohmic characteristics of the first electrode and the performance of the light-emitting device.

[0177] In some embodiments, as shown in FIG13 , step S102 forms a pattern of multiple reflective portions on one side of the substrate; specifically, the step includes:

[0178] S1021, forming a third structure layer 20111, a reflective sublayer 20112, and a fourth structure layer 20113 in sequence on one side of the base substrate 1;

[0179] S1022 , performing an etching process on the fourth structure layer 20113 , the reflective sublayer 20112 , and the third structure layer 20111 to form patterns of a plurality of reflective portions 2011 .

[0180] In some embodiments, as shown in FIG14 , after sequentially forming the third structure layer 20111 , the reflective sublayer 20112 , and the fourth structure layer 20113 on one side of the base substrate 1 , the method further includes:

[0181] A first covering layer 20114 is formed on a side of the fourth structure layer 20113 facing away from the reflective sublayer 20112;

[0182] The etching process for forming the pattern of the plurality of reflective portions 2011 by etching the fourth structure layer 20113, the reflective sublayer 20112, and the third structure layer 20111 specifically includes:

[0183] The first covering layer 20114 , the fourth structure layer 20113 , the reflective sublayer 20112 , and the third structure layer 20111 are etched to form patterns of a plurality of reflective portions 2011 .

[0184] In some embodiments, as shown in FIG13 , step S103 forms a pattern of multiple covering portions on the side of the reflective portion facing away from the base substrate, specifically comprising:

[0185] S1031, forming a second structure layer 20122 on a side of the reflective portion 2011 facing away from the base substrate 1, and forming a first structure layer 20121 on a side of the second structure layer 20122 facing away from the base substrate;

[0186] S1032 , performing a patterning process on the first structure layer 20121 and the second structure layer 20122 to form patterns of a plurality of covering portions 2012 .

[0187] In some embodiments, as shown in FIG13 , a single ITO layer is formed on the side of the second structure layer 20122 facing away from the substrate as the first structure layer 20121 .

[0188] Alternatively, in some embodiments, as shown in FIG. 15 , step S1031 forms a first structural layer on a side of the second structural layer facing away from the substrate, specifically comprising:

[0189] S10311, forming a first sub-layer 201211 on the side of the second structural layer 20122 facing away from the base substrate 1;

[0190] S10312. Form a second sub-layer 201212 on the side of the first sub-layer away from the second structural layer 20122.

[0191] In some embodiments, before forming a pattern of multiple reflective portions on one side of the substrate, the method further includes:

[0192] forming a planarization layer;

[0193] The fourth structure layer, the reflective sublayer, and the third structure layer are etched to form patterns of multiple reflective portions, specifically including:

[0194] An over-etching process is performed on the fourth structure layer, the reflective sub-layer, and the third structure layer to form patterns of a plurality of reflective portions, and a portion of the planarization layer is removed.

[0195] Specifically, the fourth structural layer, the reflective sublayer, and the third structural layer are etched while a portion of the planarization layer is removed. This over-etching process forms the reflective portion pattern. This prevents residues in the fourth structural layer, the reflective sublayer, and the third structural layer, thereby improving the patterning yield of the reflective portion in the first electrode.

[0196] In a specific implementation, an over-etching process is performed on the fourth structural layer, the reflective sub-layer, and the third structural layer to form a pattern of multiple reflective portions, and a portion of the planarization layer is removed. The structure is shown in FIG16 , where the area of ​​the planarization layer 3 removed is the first area 302. In a specific implementation, the over-etching depth is, for example, greater than or equal to 200 angstroms and less than or equal to 300 angstroms, that is, the distance h1 between the surface of the first area 302 parallel to the substrate and the surface of the remaining areas parallel to the substrate is greater than or equal to 200 angstroms and less than or equal to 300 angstroms.

[0197] In a specific implementation, when the reflective portion further includes a first covering layer, an over-etching process is performed on the first covering layer, the fourth structure layer, the reflective sub-layer, and the third structure layer.

[0198] In some embodiments, after forming a pattern of a plurality of covering portions on the side of the reflective portion facing away from the base substrate in step S103, the method further includes:

[0199] forming a first partition trench structure in the planarization layer and in a region between the first electrodes; specifically, the first partition trench structure is located in the first region;

[0200] The step of sequentially forming a pixel definition layer, a light-emitting functional layer, a second electrode, an encapsulation layer, and a color filter on the side of the pattern of the covering portion facing away from the base substrate.

[0201] Alternatively, in some embodiments, after forming a pattern of a plurality of covering portions on the side of the reflective portion facing away from the base substrate in step S103, the step further includes:

[0202] A pixel definition layer pattern is formed on a side of the pattern of the covering portion facing away from the base substrate; the pixel definition layer includes a second partition groove structure;

[0203] A light-emitting functional layer, a second electrode, a packaging layer and a color film are sequentially formed on the side of the pixel definition layer away from the base substrate.

[0204] The specific structures of the pixel definition layer, light-emitting functional layer, encapsulation layer, and color film are described in the display panel embodiment section and will not be repeated here.

[0205] An embodiment of the present disclosure provides a display device, which includes the display panel provided by the embodiment of the present disclosure.

[0206] The display device provided in the embodiments of the present disclosure is any product or component with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigation system. Other essential components of the display device are well understood by those skilled in the art and are not described here in detail, nor should they be construed as limitations of the present disclosure. The implementation of the display device can be referenced to the above-described display panel embodiments, and any repetitive details will not be repeated.

[0207] In summary, the display panel, manufacturing method thereof, and display device provided by the embodiments of the present disclosure include a first electrode including a covering portion that covers the side surfaces of the reflective portion. This prevents migration bulging or corrosion defects from occurring on the side surfaces of the reflective portion, improves the flatness of the front and side surfaces of the first electrode, improves the injection efficiency of the first electrode, and improves the luminous efficiency of the light-emitting device, thereby reducing the power consumption of the display panel. Furthermore, because the covering portion includes a second structural layer located between the first structural layer and the reflective portion, it prevents the reflective portion from contacting the first structural layer to form an oxide insulating layer, thereby preventing any impact on the ohmic characteristics of the first electrode and the performance of the light-emitting device.

[0208] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0209] Obviously, those skilled in the art may make various changes and modifications to the embodiments of the present invention without departing from the spirit and scope of the embodiments of the present invention. Thus, if such changes and modifications of the embodiments of the present invention fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. A display panel, wherein: The display panel includes: substrate; A plurality of light-emitting devices are located on one side of the substrate; the light-emitting devices include: a first electrode; the first electrode includes: a reflecting portion, and a covering portion located on the side of the reflecting portion facing away from the substrate; the covering portion covers the front and side surfaces of the reflecting portion facing away from the substrate; the covering portion includes: a first structural layer, and a second structural layer located between the first structural layer and the reflecting portion; the second structural layer is used to prevent the reflecting portion from contacting the first structural layer.

2. The display panel according to claim 1, wherein The reflective portion includes: a third structure layer, a reflective sublayer, and a fourth structure layer stacked on one side of the base substrate; the thickness of the reflective sublayer is greater than the thickness of the third structure layer and the thickness of the fourth structure layer.

3. The display panel according to claim 2, wherein: The reflective portion further includes a first covering layer located on the fourth structure layer away from the reflective sub-layer, and an orthographic projection of the fourth structure layer on the base substrate covers an orthographic projection of the first covering layer on the base substrate.

4. The display panel according to any one of claims 1 to 3, wherein: The display panel further includes: a planarization layer located between the base substrate and the light emitting device; the first electrode is located on a side of the planarization layer away from the base substrate; and the covering portion includes a first planar region in contact with the planarization layer.

5. The display panel according to claim 4, wherein: The planarization layer includes a first region; an orthographic projection of the first region on the base substrate is located between orthographic projections of adjacent reflective portions on the base substrate; The first region includes: a first surface facing away from the substrate and parallel to the plane where the substrate is located, and a first side surface; the remaining region of the planarization layer outside the first region includes a second surface facing away from the substrate and parallel to the plane where the substrate is located; the first side surface connects the first surface and the second surface; The distance between the first surface and the base substrate is smaller than the distance between the second surface and the base substrate; The orthographic projection of the first flat area on the base substrate is located within the orthographic projection of the first region on the base substrate. The display panel according to claim 5 , wherein: The distance between the first surface and the second surface is greater than the thickness of the first flat area.

7. The display panel according to claim 5 or 6, wherein: A distance between the first surface and the second surface is smaller than a thickness of the reflective portion.

8. The display panel according to claim 5 or 6, wherein: An angle between the first side surface and the first surface is greater than 90°.

9. The display panel according to any one of claims 4 to 8, wherein: The display panel further includes a plurality of partition structures; the partition structures overlap in a region between an orthographic projection of the base substrate and an orthographic projection of an adjacent first electrode on the base substrate.

10. The display panel according to claim 9, wherein: The partition structure includes a first partition groove structure; the first partition groove structure is located in the first area; The orthographic projection of the first partition groove structure on the base substrate is located between the orthographic projections of adjacent first electrodes on the base substrate.

11. The display panel according to claim 10, wherein: In a direction perpendicular to the substrate, the depth of the first partition groove structure is greater than the distance between the first surface and the second surface.

12. The display panel according to claim 10 or 11, wherein: The display panel further includes a pixel definition layer; the pixel definition layer includes opening areas corresponding to the light-emitting devices one by one, and the orthographic projection of the opening areas on the base substrate falls within the orthographic projection of the first electrode on the base substrate; The pixel definition layer covers the edge of the first electrode; The maximum thickness of the pixel definition layer is smaller than the maximum thickness of the first electrode.

13. The display panel according to claim 9, wherein: The partition structure includes a second partition groove structure; The display panel further includes a pixel definition layer; the pixel definition layer includes a second partition groove structure; the orthographic projection of the second partition groove structure on the base substrate is located between the orthographic projections of adjacent first electrodes on the base substrate; The pixel definition layer further includes opening areas corresponding to the light-emitting devices one by one, and the orthographic projection of the opening areas on the base substrate falls within the orthographic projection of the first electrode on the base substrate.

14. The display panel according to claim 13, wherein: The maximum thickness of the pixel definition layer is greater than the maximum thickness of the first electrode.

15. The display panel according to claim 13, wherein: The pixel definition layer comprises: a first pixel definition sublayer, a second pixel definition sublayer, and a third pixel definition sublayer stacked in a direction perpendicular to the substrate; The maximum thickness of the first pixel definition sublayer is greater than the maximum thickness of the second pixel definition sublayer, and the maximum thickness of the second pixel definition sublayer is greater than the maximum thickness of the third pixel definition sublayer; The maximum thickness of the first pixel definition sublayer is greater than the maximum thickness of the first electrode; The depth of the second partition groove structure is greater than the total thickness of the third pixel definition sublayer and the second pixel definition sublayer and is less than the maximum thickness of the pixel definition layer; The third pixel definition sublayer includes a first opening area, and the second pixel definition sublayer includes a second opening area; the orthographic projection of the first opening area on the base substrate falls within the orthographic projection of the second opening area on the base substrate.

16. The display panel according to any one of claims 1 to 15, wherein: The orthographic projection of the first structure layer on the base substrate covers the orthographic projection of the second structure layer on the base substrate.

17. The display panel according to any one of claims 1 to 16, wherein: The first structural layer includes: a first sublayer covering the reflective portion, and a second sublayer located on a side of the first sublayer away from the reflective portion; the thickness of the second sublayer is greater than that of the first sublayer.

18. The display panel according to any one of claims 1 to 17, wherein: An angle between a side surface of the reflective portion and a plane where the base substrate is located is greater than 0° and less than or equal to 70°.

19. A method for preparing a display panel, wherein: The method comprises: providing a substrate; forming a pattern of a plurality of reflective portions on one side of the base substrate; A pattern of multiple covering parts is formed on the side of the reflecting part facing away from the base substrate; wherein the covering part covers the front and side surfaces of the reflecting part facing away from the base substrate, and the covering part includes: a first structural layer, and a second structural layer located between the first structural layer and the reflecting part; the second structural layer is used to prevent the reflecting part from contacting the first structural layer.

20. A display device, wherein: The display device includes the display panel according to any one of claims 1 to 18.

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