Polishing and grinding device

JP1790565SActive Publication Date: 2025-02-04HANGZHOU ZHONGGUI ELECTRONICS TECH CO LTD
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Patent Information

Application Number
JP2024501202D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Priority Date
2024-01-24
Filing Date
2024-05-23
Publication Date
2025-02-04
Estimated Expiration
2049-05-23

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Abstract

This design is used for polishing and grinding wafer substrates. The bottom surface of the exterior of the design product used is not easily visible, or a portion of it is not visible, and is omitted from the drawing.
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