Semiconductor device inspection images

Abstract

The image of the present design is used to inspect a semiconductor device to be analyzed, and is an image for inspecting each block area when multiple block areas consisting of multiple chips are formed on a semiconductor device. In this image, as shown in the "Image Diagram", each block area is automatically set to an approximately rectangular shape. Then, by selecting a specific operation unit, the image moves to "Image Diagram 1 of the Changed State", and an approximately rectangular selection part is displayed so as to cover each block area. The approximately rectangular selection part can also be deselected, so that only the block areas to be analyzed can be selected. "Image Diagram 1 of the Changed State" is in a state where all the approximately rectangular parts are selected, and "Image Diagram 2 of the Changed State" is in a state where only the approximately rectangular parts at the four corners where there are no chips are deselected and excluded from the analysis target.

Images