Polishing Pad

JP1797327SActive Publication Date: 2025-04-30FUJIBO HLDG
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Patent Information

Application Number
JP2024019971D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2024-09-27
Publication Date
2025-04-30
Estimated Expiration
2049-09-27

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Abstract

This article is mainly used for polishing electronic devices and electronic components. This article consists of an abrasive layer and a base layer, and linear grooves and cylindrical convex portions are formed on the surface of the abrasive layer. By slightly shifting the arrangement pattern of the convex portions rather than concentrically, there is no variation in the convex portions that come into contact with the workpiece, making it possible to polish the entire workpiece uniformly and stably.
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