Substrate layer of polishing pad

Abstract

This product is a base layer of a polishing pad mainly used for polishing electronic devices and electronic components. As shown in the reference diagram showing the usage state, a polishing layer of the same size is attached to the front side of this product to form a polishing pad. In order to prevent the surface of the polished object from becoming wavy after polishing the object with the polishing pad, the center of the concentric groove formed in this product (base layer) is slightly shifted from the center of the concentric groove formed in the polishing layer, eliminating an escape route for the polishing pressure. This suppresses the repulsion of the polishing layer and prevents the surface of the polished object from becoming wavy.

Images