Polishing Pad

JP1797340SActive Publication Date: 2025-04-30FUJIBO HLDG
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Patent Information

Application Number
JP2024022561D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2024-10-30
Publication Date
2025-04-30
Estimated Expiration
2049-10-30

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Abstract

This product is a polishing pad mainly used for polishing electronic devices and electronic components. This product is composed of a base layer and a polishing layer bonded together. In order to prevent the surface of the polished object from becoming wavy after polishing the object with the polishing pad, the centers of the concentric grooves formed in each layer of the polishing layer and base layer are slightly shifted from the center of each layer, eliminating an escape route for the polishing pressure. This suppresses the repulsion of the polishing layer and prevents the surface of the polished object from becoming wavy.
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