Polishing Pad

JP1797366SActive Publication Date: 2025-04-30FUJIBO HLDG
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
JP2024019974D
Authority / Receiving Office
JP · JP
Patent Type
Designs
Current Assignee / Owner
Filing Date
2024-09-27
Publication Date
2025-04-30
Estimated Expiration
2049-09-27

Smart Images

  • Figure 0001797366000001
    Figure 0001797366000001
  • Figure 0001797366000002
    Figure 0001797366000002
  • Figure 0001797366000003
    Figure 0001797366000003
Patent Text Reader

Abstract

This article is mainly used for polishing electronic devices and electronic components. This article is composed of an abrasive layer and a base layer, and cylindrical convex portions are formed on the surface of the abrasive layer. By arranging the convex portions in a slightly offset pattern rather than concentrically, there is no variation in the convex portions that come into contact with the workpiece, making it possible to polish the entire workpiece uniformly and stably.
Need to check novelty before this filing date? Find Prior Art