Adhesive tape material for semiconductor device manufacturing

Abstract

This product is an adhesive tape material used in the semiconductor device manufacturing process for dicing semiconductor wafers and die bonding semiconductor chips obtained by dicing. To use it, the PET separator is peeled off, the wafer ring is attached to the adhesive layer, and the semiconductor wafer is attached to the adhesive layer. The adhesive layer of this product has a straight line on both sides when viewed from the front. This allows for closer spacing between adhesive layers. This product can be used with both circular and rectangular semiconductor wafers.

Images