Electrical device for receiving magnetic field measurement sensor
JP2022084559A5Pending Publication Date: 2026-06-03VALEO SIEMENS EAUTOMOTIVE FRANCE SAS
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- VALEO SIEMENS EAUTOMOTIVE FRANCE SAS
- Filing Date
- 2021-11-25
- Publication Date
- 2026-06-03
AI Technical Summary
Technical Problem
The existing electrical connection between magnetic field measuring sensors and electronic boards in electrical systems is weak due to mechanical constraints, leading to positioning uncertainties and reduced mechanical strength.
Method used
An electrical device with a support and electrical circuit that houses a magnetic field sensor, featuring a receiving portion for sensor attachment and a retaining member, allowing plane-to-plane contact and overmolding to improve mechanical retention and reduce positioning uncertainties.
Benefits of technology
Enhances mechanical strength and accuracy of current measurements by eliminating the need for pins, reducing positioning uncertainties, and improving the compactness and reproducibility of the assembly.
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Abstract
To provide an electrical device for receiving a sensor for magnetic field measurement.SOLUTION: The invention relates to an electrical device comprising: a support comprising a holding member; and an electrical circuit 12 housed at least partially in the support and comprising an array of electrical tracks 122 and a receiving portion 121 designed to receive a magnetic field sensor. The electrical circuit 12 is configured to create an electrical link between the magnetic field sensor, on the one hand, and an electronic board external to the electrical device, on the other hand. The holding member comprises at least one bearing portion forming a stop so as to create a mechanical link between the support and the electronic board. The receiving portion 121 forms an exposed surface configured to create an electrical connection with the magnetic field sensor through plane-to-plane contact between the receiving portion 121 and a face of the magnetic field sensor.SELECTED DRAWING: Figure 4
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