Laminate-type electronic component

Abstract

To provide a laminate-type electronic component increased in capacity per unit volume.SOLUTION: A laminate-type electronic component 1000 comprises: a main body 110 including dielectric layers 111 and internal electrodes 121, 122, and having first and second faces opposed to each other in a first direction, third and fourth faces opposed to each other in a second direction, and fifth and sixth faces opposed to each other in a third direction; a first (second) external electrode 131 (132) including a first (second) connection part 131a (132a) disposed on the third (fourth) face, a first (second) band part 131b (132b) extending from the first (second) connection part to part of the first face, and a third (fourth) band part 131c (132c) extending from the first (second) connection part to part of the second face; an insulation layer 151 disposed over the first and second connection parts so as to cover the second face, and the third and fourth band parts; and a first (second) plating layer 141 (142) disposed on the first (second) band part. The insulation layer contains a hafnium (Hf)-containing oxide.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and plays the role of charging or discharging electricity.

[0003] These multilayer ceramic capacitors offer the advantages of being small yet guaranteeing high capacitance and being easy to mount, making them suitable for use as components in various electronic devices. With the miniaturization and increased power output of various electronic devices such as computers and mobile devices, the demand for smaller and higher-capacitance multilayer ceramic capacitors is growing. Furthermore, with the recent increase in industry interest in automotive electronic components, multilayer ceramic capacitors are required to have high reliability characteristics for use in automobiles or infotainment systems.

[0004] To miniaturize and increase the capacitance of multilayer ceramic capacitors, the internal electrodes and dielectric layers must be made thinner and the number of layers increased. This requires minimizing the volume of parts that do not affect capacitance formation and increasing the effective volume fraction necessary to achieve the required capacitance. Furthermore, to mount as many components as possible within a limited substrate area, the mounting space must be minimized.

[0005] Furthermore, as multilayer ceramic capacitors become smaller and their capacitance increases, the margin thickness decreases, making it easier for moisture or plating solutions to penetrate from the outside, which can potentially weaken their reliability. Therefore, there is a need for a method to protect multilayer ceramic capacitors from moisture or plating solution penetration from the outside. [Overview of the project] [Problems that the invention aims to solve]

[0006] One of the several objectives of the present invention is to provide a stacked electronic component with improved capacity per unit volume.

[0007] One of the several objectives of the present invention is to provide a stacked electronic component with improved reliability.

[0008] One of the several objectives of the present invention is to provide a stacked electronic component that can minimize the mounting space.

[0009] However, the objectives of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0010] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately with the dielectric layer in between, a body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, and a third band portion including a first connecting portion arranged on the third surface, a first band portion extending from the first connecting portion to a part of the first surface, and a third band portion extending from the first connecting portion to a part of the second surface. The device includes: 1 an external electrode; 2 an external electrode including a second connecting portion disposed on the fourth surface, a second band portion extending from the second connecting portion to a part of the first surface, and a fourth band portion extending from the second connecting portion to a part of the second surface; 3 an insulating layer disposed on the first and second connecting portions and covering the second surface, third and fourth band portions; 4 a first plating layer disposed on the first band portion; and 5 a second plating layer disposed on the second band portion, wherein the insulating layer may contain an oxide containing hafnium (Hf).

[0011] A stacked electronic component according to one embodiment of the present invention includes a body comprising a dielectric layer and first and second internal electrodes alternately arranged with the dielectric layer in between, the body comprising first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction; a first external electrode comprising a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a part of the first surface; a second external electrode comprising a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a part of the first surface; an insulating layer disposed on the second surface and extending over the first and second connection portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion, wherein the insulating layer may contain an oxide containing hafnium (Hf).

[0012] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately with the dielectric layer in between, a body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, a first external electrode including a first connecting portion on the third surface, a first band portion extending from the first connecting portion to a part of the first surface, and a first corner portion extending from the first connecting portion to the corner connecting the second and third surfaces, a second connecting portion on the fourth surface, a second band portion extending from the second connecting portion to a part of the first surface, and extending from the second connecting portion to the corner connecting the second and fourth surfaces The device includes a second external electrode including a second corner portion, an insulating layer disposed on the first and second connection portions and positioned to cover the second surface, the first and second corner portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion. When the average size in the second direction from the extension of the third surface to the end of the first corner portion is B3, the average size in the second direction from the extension of the fourth surface to the end of the second corner portion is B4, the average size in the second direction of the region separated from the third surface and the second internal electrode is G1, and the average size in the second direction of the region separated from the fourth surface and the first internal electrode is G2, the conditions B3≦G1 and B4≦G2 are satisfied, and the insulating layer may contain an oxide containing hafnium (Hf).

[0013] A stacked electronic component according to one embodiment of the present invention includes a body comprising a dielectric layer and first and second internal electrodes alternately arranged with the dielectric layer in between, the body comprising first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction; a first external electrode comprising a first connecting electrode disposed on the third surface and a first band electrode disposed on the first surface and connected to the first connecting electrode; a second external electrode comprising a second connecting electrode disposed on the fourth surface and a second band electrode disposed on the first surface and connected to the second connecting electrode; a first insulating layer disposed on the first connecting electrode; a second insulating layer disposed on the second connecting electrode; a first plating layer disposed on the first band electrode; and a second plating layer disposed on the second band electrode, wherein the first and second insulating layers may contain an oxide containing hafnium (Hf). [Effects of the Invention]

[0014] One of the various effects of the present invention is that by placing an insulating layer on the connection portion of the external electrode and a plating layer on the band portion of the external electrode, the reliability of the multilayer electronic component is improved while increasing the capacitance per unit volume.

[0015] One of the various effects of this invention is that it minimizes the mounting space for stacked electronic components.

[0016] One of the various effects of the present invention is that the insulating layer contains an oxide containing hafnium (Hf), thereby improving moisture resistance and acid resistance to plating solutions, and suppressing the occurrence and propagation of cracks.

[0017] One of the various effects of the present invention is that, by including an oxide containing hafnium (Hf) in the insulating layer, diffusion occurs in the portion in contact with the glass, thereby suppressing a decrease in the continuity of the insulating layer.

[0018] However, the various and beneficial advantages and effects of the present invention are not limited to the above-described content, and can be more easily understood in the process of describing the specific embodiments of the present invention.

Brief Description of the Drawings

[0019] [Figure 1] Schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. [Figure 2] Schematically shows a perspective view of the main body of the stacked electronic component of FIG. 1. [Figure 3] It is a cross-sectional view taken along the line I-I' of FIG. 1. [Figure 4] It is an exploded perspective view schematically showing the main body of FIG. 2 disassembled. [Figure 5] Schematically shows a perspective view of a substrate on which the stacked electronic component of FIG. 1 is mounted. [Figure 6] Schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. [Figure 7] It is a cross-sectional view taken along the line II-II' of FIG. 6. [Figure 8] Schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. [Figure 9] It is a cross-sectional view taken along the line III-III' of FIG. 8. [Figure 10] Schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. [Figure 11] It is a cross-sectional view taken along the line IV-IV' of FIG. 10. [Figure 12] Schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. [Figure 13] It is a cross-sectional view taken along the line V-V' of FIG. 12. [Figure 14] Schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. [Figure 15] It is a cross-sectional view taken along the line VI-VI' of FIG. 14. [Figure 16] Shows a modified example of FIG. 14. [Figure 17] This diagram schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 18] This is a cross-sectional view along the line VII-VII' in Figure 17. [Figure 19] This diagram schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 20] Figure 19 shows a cross-sectional view along the line XIV-XIV'. [Figure 21] This diagram schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 22] This is a cross-sectional view along the line VIII-VIII' in Figure 21. [Figure 23] This shows a modified version of Figure 21. [Figure 24] This diagram schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 25] This is a cross-sectional view along the line IX-IX' in Figure 24. [Figure 26] This shows a modified version of Figure 24. [Figure 27] This figure schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 28] This is a cross-sectional view along the line X-X' in Figure 27. [Figure 29] This shows a modified version of Figure 27. [Figure 30] This diagram schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 31] This is a cross-sectional view along the line XI-XI' in Figure 30. [Figure 32] This shows a modified version of Figure 30. [Figure 33] This diagram schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 34] This is a cross-sectional view along the line XII-XII' in Figure 33. [Figure 35]This diagram schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 36] Figure 35 is a cross-sectional view along the line XIII-XIII'. [Figure 37] This shows a modified version of Figure 35. [Figure 38] This diagram schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 39] This is a cross-sectional view along the line XV-XV' in Figure 38. [Figure 40] This diagram schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 41] This is a cross-sectional view along the line XVI-XVI' in Figure 40. [Figure 42] This is a magnified view of the K1 region in Figure 40. [Modes for carrying out the invention]

[0020] Embodiments of the present invention will be described below with reference to specific embodiments and accompanying drawings. However, embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to give a more complete explanation of the present invention to a person of ordinary skill. Accordingly, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for a clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0021] Furthermore, in order to clearly illustrate the present invention in the drawings, parts unrelated to the explanation have been omitted, and the size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of explanation; therefore, the present invention is not necessarily limited to what is shown. Components with the same function within the scope of the same concept are described using the same reference numerals. Moreover, throughout the specification, when a part "includes" a component, this does not mean that other components are excluded, but rather that other components may be further included, unless otherwise stated.

[0022] In the drawing, the first direction can be defined as the lamination direction or the thickness T direction, the second direction as the length L direction, and the third direction as the width W direction.

[0023] Figure 1 schematically shows a perspective view of a stacked electronic component according to one embodiment of the present invention, Figure 2 schematically shows a perspective view of the main body of the stacked electronic component in Figure 1, Figure 3 is a cross-sectional view along the line I-I' in Figure 1, Figure 4 is an exploded perspective view schematically showing the main body of Figure 2 disassembled, and Figure 5 schematically shows a perspective view of a substrate on which the stacked electronic component in Figure 1 is mounted.

[0024] A stacked electronic component 1000 according to one embodiment of the present invention will be described below with reference to Figures 1 to 5.

[0025] A stacked electronic component 1000 according to one embodiment of the present invention includes a dielectric layer 111, first and second internal electrodes 121 and 122 arranged alternately with the dielectric layer in between, a body 110 including first and second surfaces 1 and 2 facing in the first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing in the second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing in the third direction, and a first external electrode including a first connection portion 131a arranged on the third surface, a first band portion 131b extending from the first connection portion to a part of the first surface, and a third band portion 131c extending from the first connection portion to a part of the second surface. The electrode includes a pole 131, a second external electrode 132 including a second connecting portion 132a disposed on the fourth surface, a second band portion 132b extending from the second connecting portion to a part of the first surface, and a fourth band portion 132c extending from the second connecting portion to a part of the second surface, an insulating layer 151 disposed on the first and second connecting portions and disposed to cover the second surface, third and fourth band portions 131c and 132c, a first plating layer 141 disposed on the first band portion 131b, and a second plating layer 142 disposed on the second band portion 132b, wherein the insulating layer 151 may contain an oxide containing hafnium (Hf).

[0026] The main body 110 consists of alternating layers of dielectric layers 111 and internal electrodes 121 and 122. There are no particular restrictions on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be a hexahedron or a similar shape. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 is not a perfectly straight hexahedron, but can be substantially hexahedron-shaped.

[0027] The main body 110 may have first and second surfaces 1 and 2 facing each other in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and facing each other in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first and second surfaces 1 and 2 and connected to the third and fourth surfaces 3 and 4 and facing each other in a third direction.

[0028] In one embodiment, the main body 110 includes a first-to-third corner connecting the first and third surfaces, a first-to-fourth corner connecting the first and fourth surfaces, a second-to-third corner connecting the second and third surfaces, and a second-to-fourth corner connecting the second and fourth surfaces. The first-to-third corner and the second-to-third corner have a shape that contracts towards the center of the main body in the first direction as they approach the third surface, and the first-to-fourth corner and the second-to-fourth corner can have a shape that contracts towards the center of the main body in the first direction as they approach the fourth surface.

[0029] Due to the overlap of margin regions on the dielectric layer 111 where internal electrodes 121 and 122 are not placed, a step difference is generated due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface and the third to fifth surfaces and / or the second surface and the third to fifth surfaces may have a form that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, due to the contraction behavior during the sintering process of the main body, the corners connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, and 6 and / or the corners connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, and 6 may have a form that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, in order to prevent chipping defects, the corners connecting each surface of the main body 110 can be rounded by performing a separate process to round the corners connecting the first surface with the third to sixth surfaces and / or the corners connecting the second surface with the third to sixth surfaces.

[0030] The above-mentioned corners may include the 1st-3rd corner connecting the 1st and 3rd faces, the 1st-4th corner connecting the 1st and 4th faces, the 2nd-3rd corner connecting the 2nd and 3rd faces, and the 2nd-4th corner connecting the 2nd and 4th faces. Furthermore, the corners may include the 1st-5th corner connecting the 1st and 5th faces, the 1st-6th corner connecting the 1st and 6th faces, the 2nd-5th corner connecting the 2nd and 5th faces, and the 2nd-6th corner connecting the 2nd and 6th faces. The 1st to 6th faces of the main body 110 can generally be flat surfaces, and non-flat areas can be designated as corners. Hereinafter, the extension of each face may refer to a line extended from the flat portion of each face.

[0031] In this case, the regions of the external electrodes 131 and 132 located on the corners of the main body 110 can be designated as corner portions, the regions located on the third and fourth surfaces of the main body 110 can be designated as connecting portions, and the regions located on the first and second surfaces of the main body can be designated as band portions.

[0032] On the other hand, in order to suppress the step difference caused by the internal electrodes 121 and 122, if the internal electrodes after lamination are cut so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115, then the portions connecting the first surface with the fifth and sixth surfaces and the portions connecting the second surface with the fifth and sixth surfaces do not need to have a contracted form.

[0033] The multiple dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0034] According to an embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, or the like can be used. The barium titanate-based material can include BaTiO3-based ceramic powder. Examples of the ceramic powder include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc.

[0035] In addition, various ceramic additives, organic solvents, binders, dispersants, etc., can be added to the powder such as barium titanate (BaTiO3) as the raw material for forming the dielectric layer 111 according to the object of the present invention.

[0036] On the other hand, the average thickness td of the dielectric layer 111 does not need to be particularly limited. However, generally, when the dielectric layer is formed thinly with a thickness of less than 0.6 μm, especially when the thickness of the dielectric layer is 0.35 μm or less, there is a risk of a decrease in reliability. According to an embodiment of the present invention, by disposing the insulating layer on the connection portion of the external electrode and disposing the plating layer on the band portion of the external electrode, it is possible to prevent moisture penetration from the outside, penetration of the plating solution, etc., and improve the reliability. Therefore, even when the average thickness of the dielectric layer 111 is 0.35 μm or less, excellent reliability can be ensured.

[0037] Therefore, the reliability improvement effect according to the present invention can be more pronounced when the average thickness of the dielectric layer 111 is 0.35 μm or less. The average thickness td of the dielectric layer 111 can mean the average thickness of the dielectric layer 111 disposed between the first and second internal electrodes 121 and 122.

[0038] The average thickness of the dielectric layer 111 can be measured by scanning an image of the cross-section of the main body 110 in the length and thickness direction (LT) with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, in the scanned image, the thickness of a single dielectric layer can be measured at 30 equally spaced points in the length direction, and the average value can be calculated. These 30 equally spaced points can be specified in the capacitance forming section Ac. Furthermore, by extending this average value measurement to 10 dielectric layers and measuring the average values, the average thickness of the dielectric layer can be further generalized.

[0039] The main body 110 may include a capacitance forming section Ac which is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 which are arranged facing each other with a dielectric layer 111 in between to form a capacitance, and cover sections 112 and 113 which are formed on the upper and lower parts of the capacitance forming section Ac in the first direction. Furthermore, the capacitance forming section Ac is the part that contributes to the capacitance formation of the capacitor and can be formed by repeatedly stacking a plurality of first and second internal electrodes 121 and 122 with a dielectric layer 111 in between.

[0040] The cover portions 112 and 113 may include an upper cover portion 112 positioned above the volume-forming portion Ac in the first direction and a lower cover portion 113 positioned below the volume-forming portion Ac in the first direction.

[0041] The upper cover portion 112 and the lower cover portion 113 described above can be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, respectively, and can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0042] The upper cover portion 112 and the lower cover portion 113 do not contain internal electrodes and may contain the same material as the dielectric layer 111. That is, the upper cover portion 112 and the lower cover portion 113 may contain ceramic materials, for example, barium titanate (BaTiO3) based ceramic materials.

[0043] On the other hand, the average thickness of the cover portions 112 and 113 is not particularly limited. However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the average thickness tc of the cover portions 112 and 113 may be 15 μm or less. Furthermore, according to one embodiment of the present invention, by arranging the insulating layer on the connection portion of the external electrode and the plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of the plating solution, thereby improving reliability. Therefore, even when the average thickness tc of the cover portions 112 and 113 is 15 μm or less, excellent reliability can be ensured.

[0044] The average thickness tc of the cover portions 112 and 113 can represent the size in the first direction, and can be the average value of the sizes of the cover portions 112 and 113 in the first direction measured at five equally spaced points on the upper or lower part of the volume forming portion Ac.

[0045] Furthermore, margin portions 114 and 115 can be arranged on the side surfaces of the volume-forming portion Ac. The margin portions 114 and 115 may include a first margin portion 114 arranged on the fifth surface 5 of the main body 110 and a second margin portion 115 arranged on the sixth surface 6. That is, the margin portions 114 and 115 can be arranged on both end surfaces in the width direction of the main body 110.

[0046] As shown in Figure 3, the margin portions 114 and 115 can refer to the areas between the interface between both ends of the first and second internal electrodes 121 and 122 and the body 110 in a cross-section obtained by cutting the main body 110 in the width-thickness (WT) direction. The margin portions 114 and 115 can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0047] The margin portions 114 and 115 may be formed by applying conductive paste to the ceramic green sheet, except for the areas where the margin portions are formed, to form internal electrodes. In addition, in order to suppress the step caused by the internal electrodes 121 and 122, the laminated internal electrodes may be cut so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers may be laminated in the third direction (width direction) on both sides of the capacitance forming portion Ac to form the margin portions 114 and 115.

[0048] On the other hand, the width of the margin portions 114 and 115 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average width of the margin portions 114 and 115 may be 15 μm or less. Furthermore, according to one embodiment of the present invention, by arranging the insulating layer on the connection portion of the external electrode and the plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of the plating solution, thereby improving reliability. For this reason, even when the average width of the margin portions 114 and 115 is 15 μm or less, excellent reliability can be ensured.

[0049] The average width of the margin portions 114 and 115 can represent the average size of the margin portions 114 and 115 in the third direction, and can be the average value of the sizes of the margin portions 114 and 115 in the third direction measured at five equally spaced points on the side surface of the volume forming portion Ac.

[0050] The internal electrodes 121 and 122 are stacked alternately with the dielectric layer 111. The internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are arranged alternately facing each other with the dielectric layer 111 constituting the main body 110 in between, and can be exposed on the third and fourth surfaces 3 and 4 of the main body 110, respectively.

[0051] Referring to Figure 3, the first internal electrode 121 can be separated from the fourth surface 4 and exposed via the third surface 3, and the second internal electrode 122 can be separated from the third surface 3 and exposed via the fourth surface 4. The first external electrode 131 can be placed on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 132 can be placed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0052] In other words, the first internal electrode 121 is not connected to the second external electrode 132, but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131, but is connected to the second external electrode 132. Therefore, the first internal electrode 121 can be formed at a certain distance apart on the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance apart on the third surface 3.

[0053] In this case, the first and second internal electrodes 121 and 122 can be electrically isolated from each other by a dielectric layer 111 placed in between. The main body 110 can be formed by alternately stacking ceramic green sheets printed with the first internal electrode 121 and ceramic green sheets printed with the second internal electrode 122, and then firing them.

[0054] The materials used to form the internal electrodes 121 and 122 are not particularly limited, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 may include one or more of the following: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0055] Furthermore, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of the following on a ceramic green sheet: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. While screen printing or gravure printing can be used as the printing method for the conductive paste for internal electrodes, the present invention is not limited to these methods.

[0056] On the other hand, the average thickness te of the internal electrodes 121 and 122 does not need to be particularly limited. However, when the internal electrodes are formed thinly with a thickness of less than 0.6 μm, reliability may decrease, especially when the thickness of the internal electrodes is 0.35 μm or less.

[0057] According to one embodiment of the present invention, by arranging an insulating layer on the connection portion of the external electrode and a plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of plating solution, thereby improving reliability. Therefore, even when the average thickness of the internal electrodes 121 and 122 is 0.35 μm or less, excellent reliability can be ensured. Accordingly, when the average thickness of the internal electrodes 121 and 122 is 0.35 μm or less, the effects of the present invention become more pronounced, and miniaturization and high capacity of the stacked electronic component can be achieved more easily.

[0058] The average thickness te of the internal electrodes 121 and 122 can be said to represent the average thickness of the internal electrodes 121 and 122. The average thickness of the internal electrodes 121 and 122 can be measured by scanning an image of the cross-section of the main body 110 in the length and thickness direction (LT) with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, in the scanned image, the thickness of one internal electrode can be measured at 30 equally spaced points in the length direction, and the average value can be calculated. The 30 equally spaced points can be specified in the capacitance forming section Ac. Furthermore, by extending this average value measurement to 10 internal electrodes and measuring the average value, the average thickness of the internal electrodes can be further generalized.

[0059] External electrodes 131 and 132 can be arranged on the third surface 3 and fourth surface 4 of the main body 110. The external electrodes 131 and 132 may include first and second external electrodes 131 and 132, respectively, which are arranged on the third and fourth surfaces 3 and 4 of the main body 110 and connected to first and second internal electrodes 121 and 122, respectively.

[0060] The external electrodes 131 and 132 may include a first external electrode 131 which includes a first connecting portion 131a located on the third surface and a first band portion 131b extending from the first connecting portion to a part of the first surface, and a second external electrode 132 which includes a second connecting portion 132a located on the fourth surface and a second band portion 132b extending from the second connecting portion to a part of the first surface. The first connecting portion 131a can be connected to the first internal electrode 121 on the third surface, and the second connecting portion 132a can be connected to the second internal electrode 122 on the fourth surface.

[0061] Furthermore, the first external electrode 131 may include a third band portion 131c extending from the first connection portion 131a to a part of the second surface, and the second external electrode 132 may include a fourth band portion 132c extending from the second connection portion 132a to a part of the second surface. In addition, the first external electrode 131 may include a first side band portion extending from the first connection portion 131a to a part of the fifth and sixth surfaces, and the second external electrode 132 may include a second side band portion extending from the second connection portion 132a to a part of the fifth and sixth surfaces.

[0062] However, the third band portion, the fourth band portion, the first side band portion, and the second side band portion are not essential components of the present invention. The first and second external electrodes 131 and 132 do not have to be placed on the second surface, nor do they have to be placed on the fifth and sixth surfaces. By not placing the first and second external electrodes 131 and 132 on the second surface, the first and second external electrodes 131 and 132 can be placed below the extension line of the second surface of the main body. In addition, the first and second connecting portions 131a and 132a can be placed at a distance from the fifth and sixth surfaces, and the first and second connecting portions 131a and 132a can be placed at a distance from the second surface. In addition, the first and second band portions 131b and 132b can also be placed at a distance from the fifth and sixth surfaces.

[0063] On the other hand, when the first and second external electrodes 131 and 132 include the third and fourth band portions 131c and 132c, the diagram shows that an insulating layer is placed on the third and fourth band portions 131c and 132c, but the diagram is not limited to this, and a plating layer may be placed on the third and fourth band portions 131c and 132c to improve ease of mounting. Also, the first and second external electrodes 131 and 132 may include the third and fourth band portions 131c and 132c but not the side band portions, in which case the first and second connecting portions 131a and 132a and the first to fourth band portions 131a, 132b, 131c, and 132c may be separated from the fifth and sixth surfaces.

[0064] In this embodiment, a structure is described in which the stacked electronic component 1000 has two external electrodes 131 and 132. However, the number and shape of the external electrodes 131 and 132 can be changed according to the form of the internal electrodes 121 and 122 or other purposes.

[0065] On the other hand, the external electrodes 131 and 132 may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined by considering electrical properties, structural stability, etc. Furthermore, they may have a multilayer structure.

[0066] The external electrodes 131 and 132 may be firing electrodes containing a conductive metal and glass, or resin-based electrodes containing a conductive metal and resin. In one embodiment, the external electrodes 131 and 132 may contain glass. The insulating layer 151 of the present invention contains an oxide containing hafnium (Hf), and the oxide containing hafnium (Hf) can suppress the occurrence of diffusion in the portion in contact with the glass, thereby preventing a decrease in the continuity of the insulating layer. Therefore, when the external electrodes 131 and 132 contain glass, the effects of the present invention can be made more pronounced.

[0067] The external electrodes 131 and 132 may be formed in a manner in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Alternatively, the external electrodes 131 and 132 may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0068] While materials with excellent electrical conductivity can be used as the conductive metal in the external electrodes 131 and 132, they are not particularly limited. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. Preferably, the external electrodes 131 and 132 may contain one or more of Ni and Ni alloys. This can further improve the connectivity with the internal electrodes 121 and 122 which contain Ni.

[0069] The insulating layer 151 can be placed on the first and second connection portions 131a and 132a. Since the first and second connection portions 131a and 132a are connected to the internal electrodes 121 and 122, they can become pathways for the penetration of the plating solution during the plating process or for moisture penetration during actual use. In the present invention, since the insulating layer 151 is placed on the connection portions 131a and 132a, it is possible to prevent the penetration of moisture from the outside or the penetration of the plating solution.

[0070] The insulating layer 151 can be positioned in contact with the first and second plating layers 141 and 142. In this case, the insulating layer 151 may be in contact with the first and second plating layers 141 and 142 in a manner that partially covers their edges, or the first and second plating layers 141 and 142 may be in contact with the insulating layer 151 in a manner that partially covers their edges.

[0071] The insulating layer 151 can be placed on the first and second connection portions 131a and 132a and positioned to cover the second surface and the third and fourth band portions 131c and 132c. In this case, the insulating layer 151 can be positioned to cover the area of ​​the second surface where the third and fourth band portions 131c and 132c are not located, and the third and fourth band portions 131c and 132c themselves. This allows the insulating layer 151 to cover the area where the ends of the third and fourth band portions 131c and 132c are in contact with the main body 110, thereby blocking the path of moisture penetration and further improving moisture resistance reliability.

[0072] The insulating layer 151 is positioned on the second surface and can extend over the first and second connection portions 131a and 132a. Furthermore, if the external electrodes 131 and 132 are not positioned on the second surface, the insulating layer can be positioned to completely cover the second surface. On the other hand, the insulating layer 151 does not necessarily have to be positioned on the second surface; it may not be positioned on part or all of the second surface, and the insulating layer may be separated into two parts and positioned on the first and second connection portions 131a and 132a, respectively. If the insulating layer is not positioned on the entire second surface, it can be positioned below the extension line of the second surface. Also, even if the insulating layer is not positioned on the second surface, it can extend over the first and second connection portions 131a and 132a to form a single insulating layer on the fifth and sixth surfaces.

[0073] Furthermore, the insulating layer 151 can be positioned to cover the first and second side band portions, and parts of the fifth and sixth surfaces. In this case, parts of the fifth and sixth surfaces not covered by the insulating layer 151 can be exposed to the outside.

[0074] Furthermore, the insulating layer 151 may be arranged to cover the first and second side band portions, the fifth surface, and the sixth surface entirely. In this case, the fifth and sixth surfaces are not exposed to the outside, thus improving moisture resistance reliability. The connection portions 131a and 132a are also not directly exposed to the outside, thus improving the reliability of the laminated electronic component 1000. More specifically, the insulating layer can cover the first and second side band portions entirely, and cover all areas of the fifth and sixth surfaces except for the areas where the first and second side band portions are formed.

[0075] The insulating layer 151 can prevent the formation of plating layers 141 and 142 on the external electrodes 131 and 132 on which the insulating layer 151 is placed, and can improve sealing properties to minimize the penetration of moisture, plating solution, etc. from the outside.

[0076] The insulating layer 151 may contain an oxide containing hafnium (Hf). Conventionally, glass-based materials were generally used for the insulating layer, but due to the characteristics of the glass series, significant aggregation occurs during sintering, making it difficult to form a uniform film. Furthermore, the heat required during the sintering process can generate stress within the main body, potentially causing cracks or delamination. In addition, when using an insulating layer containing a glass series material, a method is used in which the insulating layer containing the glass series material is fired after the external electrodes. However, during the firing process of the insulating layer, there is a risk that the metallic material of the external electrodes may diffuse into the internal electrodes, causing radial cracks. Moreover, since the glass series generally has hard properties, there is a risk of it breaking even with small impacts.

[0077] This invention aims to solve the problems associated with glass-based insulating layers by applying an oxide containing hafnium (Hf) instead of glass-based materials to the insulating layer. The hafnium (Hf) oxide not only possesses insulating properties but also has a very low water permeability, ensuring sufficient moisture resistance and acid resistance to plating solutions even at thin thicknesses. Furthermore, the hafnium (Hf) oxide suppresses diffusion at the point of contact with the glass, preventing a decrease in the continuity of the insulating layer. Therefore, by applying an oxide containing hafnium (Hf) instead of glass-based materials to the insulating layer, moisture resistance and acid resistance to plating solutions can be further improved, the continuity of the insulating layer can be prevented, and cracks due to thermal shrinkage and radial cracks due to metal diffusion can be suppressed.

[0078] On the other hand, the method for forming the insulating layer 151 is not particularly limited. For example, after forming external electrodes 131 and 132 on the main body 100, an insulating layer 151 containing an oxide containing hafnium (Hf) can be formed using atomic layer deposition (ALD). Atomic layer deposition is a semiconductor process in which thin films or protective films are deposited on the surface of a substrate. Unlike conventional deposition techniques that chemically apply thin films, it is a technique that grows thin films by stacking atomic layers one by one. Atomic layer deposition has the advantages of excellent step-covarage, easy adjustment of thin film thickness, and the ability to form uniform thin films. Therefore, the insulating layer 151 may be formed by atomic layer deposition, thereby enabling the formation of a thin and uniform insulating layer 151.

[0079] Furthermore, the type of hafnium (Hf) oxide contained in the insulating layer 151 is not particularly limited, but may be, for example, HfO2.

[0080] In one embodiment, the insulating layer 151 may have a ratio of 0.95 or more moles of hafnium (Hf) atoms to the total number of moles of the remaining elements excluding oxygen atoms. That is, the insulating layer 151 can consist of an oxide that substantially contains hafnium (Hf), excluding elements detected as impurities. In this case, the oxide containing hafnium (Hf) may be HfO2. This further enhances the effect of suppressing cracks due to thermal shrinkage, radiative cracks due to metal diffusion, and improving moisture resistance reliability.

[0081] In this case, the composition of the insulating layer 151 may be calculated from images observed using SEM-EDS (Scanning Electron Microscope-Energy Dispersive X-ray Spectroscopy). Specifically, after polishing the multilayer electronic component to the center in the width direction (third direction) to expose the cross-sections in the length direction and thickness direction (LT cross-section), the number of moles of each element contained in the insulating layer can be measured using EDS in the central region of the region obtained by dividing the insulating layer into five equal parts in the thickness direction, and the number of moles of hafnium (Hf) atoms relative to the total number of moles of the remaining elements excluding oxygen atoms can be calculated.

[0082] In one embodiment, the average thickness t2 of the insulating layer 151 may be 15 nm or more and 1000 nm or less. When the average thickness t2 of the insulating layer 151 is 15 nm or more, the moisture permeability of the insulating layer is 0 mg / m 2 It can be [day], which improves moisture resistance reliability.

[0083] If the average thickness of the insulating layer 151 is less than 15 nm, there is a risk that the effect of suppressing cracks due to thermal shrinkage, radial cracks due to metal diffusion, etc., and the effect of improving moisture resistance reliability may not be sufficiently ensured, and the moisture permeability of the insulating layer may be 0 mg / [m 2 This may exceed [day]. In contrast, if the average thickness of the insulating layer 151 exceeds 1000 nm, there is a risk of cracks occurring in the insulating layer, the formation time of the insulating layer may become excessively long, and the overall size of the multilayer electronic component may increase, potentially reducing the capacitance per unit volume.

[0084] The average thickness t2 of the insulating layer 151 may be the average of the thicknesses measured at five equally spaced points on the first and second connection portions 131a and 132a. More specifically, it may be the average of the thickness values ​​of the insulating layer measured at the center point in the first direction of the first and second connection portions 131a and 132a, two points separated by 5 μm in the first direction from the center point in the first direction, and two points separated by 10 μm in the first direction.

[0085] In one embodiment, a cover layer disposed on the insulating layer 151 and containing an aluminum (Al) oxide may be further included. A more detailed description will follow.

[0086] In one embodiment, the insulating layer 151 is arranged in direct contact with the first and second external electrodes 131 and 132, and the first and second external electrodes 131 and 132 may include conductive metal and glass. As a result, the plating layers 141 and 142 do not need to be placed in the area of ​​the outer surface of the first and second external electrodes 131 and 132 where the insulating layer 151 is placed, thereby effectively suppressing corrosion of the external electrodes by the plating solution.

[0087] In this case, the first plating layer 141 can be positioned to cover the end of the insulating layer 151 that is placed on the first external electrode 131, and the second plating layer 142 can be positioned to cover the end of the insulating layer 151 that is placed on the second external electrode 132. By forming the insulating layer 151 first before forming the plating layers 141 and 142 on the external electrodes 131 and 132, the penetration of the plating solution during the plating layer formation process can be suppressed more reliably. By forming the insulating layer before the plating layer, the plating layers 141 and 142 can have a configuration that covers the end of the insulating layer 151.

[0088] In one embodiment, the insulating layer 151 is arranged in direct contact with the first and second external electrodes 131 and 132, and the first and second external electrodes 131 and 132 may include conductive metal and resin. As a result, the plating layers 141 and 142 do not need to be placed in the area of ​​the outer surface of the first and second external electrodes 131 and 132 where the insulating layer 151 is placed, thereby effectively suppressing corrosion of the external electrodes by the plating solution.

[0089] In this case, the first plating layer 141 can be positioned to cover the end of the insulating layer 151 that is placed on the first external electrode 131, and the second plating layer 142 can be positioned to cover the end of the insulating layer 151 that is placed on the second external electrode 132. By forming the insulating layer 151 first before forming the plating layers 141 and 142 on the external electrodes 131 and 132, the penetration of the plating solution during the plating layer formation process can be suppressed more reliably. By forming the insulating layer before the plating layer, the plating layers 141 and 142 can have a configuration that covers the end of the insulating layer 151.

[0090] The first and second plating layers 141 and 142 can be placed on the first and second band portions 131b and 132b, respectively. The plating layers 141 and 142 can improve mounting characteristics, and by placing the plating layers 141 and 142 on the band portions 131b and 132b, the mounting space can be minimized, and the penetration of the plating solution into the internal electrodes can be minimized, thereby improving reliability. One end of the first and second plating layers 141 and 142 can be in contact with the first surface, and the other end can be in contact with the insulating layer 151.

[0091] The types of plating layers 141 and 142 are not particularly limited and may include one or more of Cu, Ni, Sn, Ag, Au, Pd, and their alloys, and may be formed in multiple layers. To give a more specific example of plating layers 141 and 142, plating layers 141 and 142 may be Ni plating layers or Sn plating layers, and may be in a form in which Ni plating layers and Sn plating layers are formed sequentially on the first and second band portions 131b and 132b.

[0092] In one embodiment, the first and second plating layers 141 and 142 can be arranged to extend and partially cover the first and second connecting portions 131a and 132a, respectively. When H1 is the average size in the first direction from the first internal electrodes 121 and 122 to the internal electrode closest to the first surface 1, and H2 is the average size in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 141 and 142 arranged on the first and second connecting portions 131a and 132a, it is possible to satisfy H1 > H2. This suppresses the penetration of the plating solution into the internal electrodes during the plating process and improves reliability.

[0093] H1 and H2 may be the average of values ​​measured in cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction. H1 may be the average of values ​​measured at the point where the internal electrode closest to the first surface 1 is connected to the external electrode in each cross-section, and H2 may be the average of values ​​measured with reference to the edge of the plating layer in contact with the external electrode, and the extension line of the first surface that serves as the reference when measuring H1 and H2 may be the same.

[0094] In one embodiment, the first plating layer 141 can be positioned to cover the end of the insulating layer 151 that is located on the first external electrode 131, and the second plating layer 142 can be positioned to cover the end of the insulating layer 151 that is located on the second external electrode 132. This strengthens the bonding force between the insulating layer 151 and the plating layers 141 and 142, thereby improving the reliability of the multilayer electronic component 1000.

[0095] In one embodiment, the insulating layer 151 can be positioned to cover the edge of the first plating layer 141 that is located on the first external electrode 131, and the insulating layer 151 can be positioned to cover the edge of the second plating layer 142 that is located on the second external electrode 132. This strengthens the bonding force between the insulating layer 151 and the plating layers 141 and 142, thereby improving the reliability of the multilayer electronic component 1000.

[0096] In one embodiment, when the average size of the main body 110 in the second direction is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, the conditions 0.2 ≤ B1 / L ≤ 0.4 and 0.2 ≤ B2 / L ≤ 0.4 can be satisfied.

[0097] If B1 / L and B2 / L are less than 0.2, it may be difficult to ensure sufficient adhesion strength. On the other hand, if B2 / L exceeds 0.4, there is a risk of leakage current occurring between the first band portion 131b and the second band portion 132b under high voltage current, and there is a risk that the first band portion 131b and the second band portion 132b may be electrically connected due to plating seepage or the like during the plating process. B1, B2, and L may be the average of values ​​measured in cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction.

[0098] Referring to Figure 5, which shows a mounting substrate 1100 on which a multilayer electronic component 1000 is mounted, the plating layers 141 and 142 of the multilayer electronic component 1000 can be joined to electrode pads 181 and 182 placed on the substrate 180 by solder 191 and 192.

[0099] On the other hand, when the internal electrodes 121 and 122 are stacked in a first direction, the stacked electronic component 1000 can be horizontally mounted on the substrate 180 so that the internal electrodes 121 and 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting; when the internal electrodes 121 and 122 are stacked in a third direction, the stacked electronic component can be vertically mounted on the substrate so that the internal electrodes 121 and 122 are perpendicular to the mounting surface.

[0100] The size of the stacked electronic component 1000 is not particularly limited. However, in order to achieve miniaturization and high capacitance simultaneously, the thickness of the dielectric layer and internal electrodes must be reduced and the number of layers increased. Therefore, in stacked electronic components 1000 having a size of 1005 (length × width, 1.0 mm × 0.5 mm) or less, the reliability and capacitance improvement effects per unit volume according to the present invention can be more pronounced.

[0101] Therefore, considering manufacturing tolerances, external electrode size, etc., the reliability improvement effect according to the present invention can be more pronounced when the length of the stacked electronic component 1000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the stacked electronic component 1000 can mean the maximum size of the stacked electronic component 1000 in the second direction, and the width of the stacked electronic component 1000 can mean the maximum size of the stacked electronic component 1000 in the third direction.

[0102] (Examples) Table 1 below evaluates the moisture resistance reliability and crack occurrence based on the average thickness of the insulating layer containing hafnium (Hf) oxide. Specifically, for each test number, insulating layers with varying average thicknesses were formed on a PI (Polyimide) film using atomic layer deposition, and then the moisture transmittance was measured at 100% relative humidity and 41.8°C. The moisture transmittance was measured using Mocon's "AQUATRAN 1(G)".

[0103] Furthermore, the presence or absence of cracks was observed visually using an optical microscope, and "O" was used to indicate the presence of cracks, while "×" was used to indicate the absence of cracks. The above evaluation of moisture resistance reliability was performed by forming an insulating layer on the PI film, but the effects that can be confirmed from the evaluation of moisture resistance reliability can be similarly understood in the case of multilayer electronic components 1000, 2000, and 3000 using various embodiments.

[0104] [Table 1]

[0105] Test number 1 shows that the average thickness of the insulating layer is less than 15 nm, confirming insufficient effectiveness in suppressing moisture permeation. Test numbers 2 to 7 show that the average thickness of the insulating layer is 15 nm or more, and the moisture permeability is 0 mg / m². 2 It was confirmed that the test was conducted on a day, and the effect of suppressing moisture permeation was confirmed to be significant. However, in test number 7, the average thickness of the insulating layer exceeded 1000 nm, and cracks occurred in the insulating layer. Therefore, by setting the average thickness t2 of the insulating layer of the multilayer electronic component according to one embodiment to 15 nm or more and 1000 nm or less, it is possible to block moisture permeation and ensure excellent moisture resistance reliability while preventing cracks.

[0106] Figure 6 schematically shows a perspective view of a multilayer electronic component 1001 according to one embodiment of the present invention, and Figure 7 is a cross-sectional view along the line II-II' in Figure 6. Referring to Figures 6 and 7, in the multilayer electronic component 1001 according to one embodiment of the present invention, the first and second plating layers 141-1 and 142-1 can be positioned below the extension line E1 of the first surface. This makes it possible to minimize the height of the solder during mounting and to minimize the mounting space. In addition, the insulating layer 151-1 can be extended below the extension line of the first surface and positioned in contact with the first and second plating layers 141-1 and 142-1.

[0107] Figure 8 schematically shows a perspective view of a multilayer electronic component 1002 according to one embodiment of the present invention, and Figure 9 is a cross-sectional view along the line III-III' in Figure 8. Referring to Figures 8 and 9, the multilayer electronic component 1002 according to one embodiment of the present invention may further include an additional insulating layer 161 disposed on the first surface 1 and positioned between the first band portion 131b and the second band portion 132b. This makes it possible to prevent leakage currents that may occur between the first band portion 131b and the second band portion 132b under high voltage current.

[0108] The type of the additional insulating layer 161 does not need to be particularly limited. For example, similar to the insulating layer 151, the additional insulating layer 161 can include an oxide containing hafnium (Hf). However, it is not necessary to limit the additional insulating layer 161 and the insulating layer 151 to the same material, and they may be formed of different materials. For example, it may include one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., and may include glass.

[0109] FIG. 10 schematically shows a perspective view of a stacked electronic component 1003 according to an embodiment of the present invention, and FIG. 11 is a cross-sectional view taken along line IV-IV' of FIG. 10. Referring to FIGS. 10 and 11, in the stacked electronic component 1003 according to an embodiment, when the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-3 and 142-3 disposed on the first and second connection portions 131a and 132a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased to improve the fixing strength.

[0110] More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0111] H1, H2, and T may be values obtained by averaging the values measured in the cross-sectional (L-T cross-section) obtained by cutting the main body 110 at five points having equal intervals in the third direction in the first and second directions. H1 may be a value obtained by averaging the values measured at the points where the internal electrodes closest to the first surface 1 in each cross-section are connected to the external electrodes. H2 may be a value obtained by averaging the values measured based on the ends of the plating layers in contact with the external electrodes in each cross-section. The extension lines of the first surface serving as the reference during the measurement of H1 and H2 may be the same. Also, T may be a value obtained by averaging the maximum sizes of the main body 110 in the first direction in each cross-section.

[0112] FIG. 12 schematically shows a perspective view of a stacked electronic component 1004 according to an embodiment of the present invention, and FIG. 13 is a cross-sectional view taken along line V-V' of FIG. 12. Referring to FIGS. 12 and 13, in the stacked electronic component 1004 according to an embodiment of the present invention, the average length B1 of the first band portion 131b-4 may be longer than the average length B3 of the third band portion 131c-4, and the average length of the second band portion 132b-4 may be longer than the average length B4 of the fourth band portion 132c-4. Thereby, the area in contact with solder during mounting can be increased to improve the fixing strength.

[0113] More specifically, when the average size in the second direction from the extension line of the third surface 3 to the end of the first band portion 131b-4 is B1, the average size in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 132b-4 is B2, the average size in the second direction from the extension line of the third surface 3 to the end of the third band portion 131c-4 is B3, and the average size in the second direction from the extension line of the fourth surface 4 to the end of the fourth band portion 132c-4 is B4, B3 < B1 and B4 < B2 can be satisfied.

[0114] In this case, when L is the average size of the main body 110 in the second direction, the conditions 0.2 ≤ B1 / L ≤ 0.4 and 0.2 ≤ B2 / L ≤ 0.4 can be satisfied. B1, B2, B3, B4, and L may be the average values ​​obtained by measuring the cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction.

[0115] Furthermore, the first external electrode 131-4 may include a first side band portion extending from the first connection portion 131a-4 to a part of the fifth and sixth surfaces, and the second external electrode 132-4 may include a second side band portion extending from the second connection portion 132a-4 to a part of the fifth and sixth surfaces. In this case, the size of the first and second side band portions in the second direction may gradually increase as they approach the first surface. That is, the first and second side band portions may be arranged in a tapered or trapezoidal shape.

[0116] Furthermore, when B3 is the average size in the second direction from the extension of the third surface to the end of the third band portion 141c-4, B4 is the average size in the second direction from the extension of the fourth surface to the end of the fourth band portion 142c-4, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then B3 ≤ G1 and B4 ≤ G2 can be satisfied. This makes it possible to minimize the volume occupied by the external electrodes and increase the capacity per unit volume of the stacked electronic component 1004.

[0117] The above G1 and G2 can be defined as follows: In a cross-section obtained by cutting the main body in the first and second directions at the center of the third direction, G1 is the average value of the size in the second direction at the distance to the third surface, measured for any five second internal electrodes located in the center of the first direction, and G2 is the average value of the size in the second direction of the region at the distance to the fourth surface, measured for any five first internal electrodes located in the center of the first direction.

[0118] Furthermore, the method can be further generalized by determining G1 and G2 from cross-sections (LT cross-sections) obtained by cutting the main body 110 at five equally spaced points in the third direction in the first and second directions, and then averaging these values ​​to obtain G1 and G2.

[0119] However, the present invention is not intended to be limited to B3≦G1 and B4≦G2, and a case satisfying B3≧G1 and B4≧G2 can also be included in one embodiment of the present invention. Therefore, in one embodiment, when B3 is the average size in the second direction from the extension line of the third surface to the end of the third band portion, B4 is the average size in the second direction from the extension line of the fourth surface to the end of the fourth band portion, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode, then B3≧G1 and B4≧G2 can be satisfied.

[0120] In one embodiment, when B1 is the average size in the second direction from the extension line of the third surface E3 to the end of the first band portion, and B2 is the average size in the second direction from the extension line of the fourth surface to the end of the second band portion, B1≧G1 and B2≧G2 can be satisfied. This makes it possible to improve the bonding strength of the multilayer electronic component 1004 to the substrate 180.

[0121] Figure 14 schematically shows a perspective view of a stacked electronic component 1005 according to one embodiment of the present invention, and Figure 15 is a cross-sectional view along the line VI-VI' in Figure 14. Referring to Figures 14 and 15, the first and second external electrodes 131-5 and 132-5 of the stacked electronic component 1005 according to one embodiment of the present invention are not arranged on the second surface, but are arranged on the third, fourth, and first surfaces, and can have an L-shape. That is, the first and second external electrodes 131-5 and 132-5 can be arranged below the extension of the second surface.

[0122] The first external electrode 131-5 may include a first connection portion 131a-5 located on the third surface 3 and a first band portion 131b-5 extending from the first connection portion 131a-5 to a part of the first surface 1. The second external electrode 132-5 may include a second connection portion 132a-5 located on the fourth surface 4 and a second band portion 132b-5 extending from the second connection portion 132a-5 to a part of the first surface 1. The external electrodes 131-5 and 132-5 may not be located on the second surface 2, and the insulating layer 151-5 may be arranged to cover the entire second surface 2. This minimizes the volume occupied by the external electrodes 131-5 and 132-5, thereby improving the capacitance per unit volume of the multilayer electronic component 1005. However, the insulating layer 151-5 is not limited to covering the entire second surface 2. The insulating layer may not cover part or all of the second surface 2, but may be separated and cover the first and second connection portions 131a-5 and 132a-5, respectively.

[0123] Furthermore, the insulating layer 151-5 can be positioned to cover parts of the fifth and sixth surfaces to further improve reliability. In this case, the parts of the fifth and sixth surfaces not covered by the insulating layer 151-5 can be exposed to the outside. Moreover, the insulating layer 151-5 can be positioned to cover the entire fifth and sixth surfaces, in which case the fifth and sixth surfaces are not exposed to the outside, thereby further improving moisture resistance reliability.

[0124] A first plating layer 141-5 is placed on the first band portion 131b-5, and a second plating layer 142-5 is placed on the second band portion 132b-5. The first and second plating layers 141-5 and 142-5 can be extended to a portion of the first and second connecting portions 132a-5 and 132b-5. In this case, the external electrodes 131-5 and 132-5 do not necessarily have to be placed on the fifth and sixth surfaces 5 and 6. That is, the external electrodes 131-5 and 132-5 can be placed only on the third, fourth, and first surfaces.

[0125] From the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122, the average size in the first direction is H1. When the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-5 and 142-5 disposed on the first and second connection portions 131a-5 and 132a-5 is H2, H1 < H2 can be satisfied. Thereby, the area contacting the solder during mounting can be increased to improve the fixing strength, and the increase in the equivalent series resistance (ESR) due to the increase in the area where the external electrodes 131-5 and 132-5 contact the plating layers 141-5 and 142-5 can be suppressed.

[0126] More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0127] Also, the first and second plating layers 141-5 and 142-5 can be arranged to cover a part of the insulating layer 151-1 on the third and fourth surfaces. That is, the plating layers 141-5 and 142-5 can be arranged to cover the ends of the insulating layer 151-5 on the third and fourth surfaces. Thereby, the bonding strength between the insulating layer 151-5 and the plating layers 141-5 and 142-5 can be strengthened to improve the reliability of the multilayer electronic component 1005.

[0128] Also, the insulating layer 151-5 can be arranged to cover a part of the first and second plating layers 141-5 and 142-5 on the third and fourth surfaces. That is, the insulating layer 151-5 can be arranged to cover the ends of the plating layers 141-5 and 142-5 on the third and fourth surfaces. Thereby, the bonding strength between the insulating layer 151-5 and the plating layers 141-5 and 142-5 can be strengthened to improve the reliability of the multilayer electronic component 1005.

[0129] Figure 16 shows a modified example of Figure 14. Referring to Figure 16, in a modified example 1006 of the stacked electronic component 1005 according to one embodiment of the present invention, a first additional electrode layer 134 can be placed between the first connection portion 131a-6 and the third surface, and a second additional electrode layer 135 can be placed between the second connection portion 132a-6 and the fourth surface. The first additional electrode layer 134 can be placed within a range that does not deviate from the third surface, and the second additional electrode layer 135 can be placed within a range that does not deviate from the fourth surface. The first and second additional electrode layers 134 and 135 can improve the electrical connectivity between the internal electrodes 121 and 122 and the external electrodes 131-6 and 132-6, have excellent coupling strength with the external electrodes 131-6 and 132-6, and can play a role in further improving the mechanical coupling strength of the external electrodes 131-6 and 132-6.

[0130] The first and second external electrodes 131-6 and 132-6 may have an L-shape in which the first and second external electrodes are not arranged on the second surface. The first external electrode 131-6 may include a first connecting portion 131a-6 arranged on the first additional electrode layer 134 and a first band portion 131b-6 extending from the first connecting portion 131a-6 to a part of the first surface 1, and the second external electrode 132-6 may include a second connecting portion 132a-6 arranged on the second additional electrode layer 135 and a second band portion 132b-6 extending from the second connecting portion 132a-6 to a part of the first surface 1.

[0131] On the other hand, the first and second additional electrode layers 131-6 and 132-6 may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined considering electrical properties, structural stability, etc. Furthermore, the first and second additional electrode layers 131-6 and 132-6 may be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin. In addition, the first and second additional electrode layers 131-6 and 132-6 may be formed by transferring a sheet containing conductive metal onto the main body.

[0132] While materials with excellent electrical conductivity can be used as the conductive metal in the first and second additional electrode layers 131-6 and 132-6, they are not particularly limited. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. Preferably, the first and second additional electrode layers 131-6 and 132-6 may contain one or more of Ni and Ni alloys. This can further improve connectivity with the internal electrodes 121 and 122 containing Ni.

[0133] Figure 17 schematically shows a perspective view of a multilayer electronic component 1007 according to one embodiment of the present invention, and Figure 18 is a cross-sectional view along the line VII-VII' in Figure 17. Referring to Figures 17 and 18, the average thickness t1 of the first and second plating layers 141-6 and 142-6 of the multilayer electronic component 1007 according to one embodiment of the present invention may be thinner than the average thickness t2 of the insulating layer 151-6.

[0134] The insulating layer 151-6 plays a role in preventing the penetration of moisture or plating solution from the outside, but its connectivity with the plating layers 141-6 and 142-6 is weak, which can cause delamination of the plating layers 141-6 and 142-6. If the plating layers are delaminated, the adhesion strength to the substrate 180 may decrease. Here, delamination of the plating layers 141-6 and 142-6 can mean that the plating layers are partially peeled off or physically separated from the external electrodes 131-5 and 132-5. Due to the weak connectivity between the plating layers and the insulating layer, the gap at the interface between the insulating layer and the plating layer may widen, increasing the possibility of foreign matter penetration, making it more vulnerable to external impacts, etc., and thus increasing the likelihood of delamination.

[0135] According to one embodiment of the present invention, the average thickness t1 of the plating layer can be made thinner than the average thickness t2 of the insulating layer, thereby reducing the contact area between the plating layer and the insulating layer. This suppresses the occurrence of delamination and improves the adhesion strength of the multilayer electronic component 1000 to the substrate 180.

[0136] The average thickness t1 of the first and second plating layers 141-6 and 142-6 may be the average of the thicknesses measured at five equally spaced points on the first and second connection portions 131a-5 and 132a-5 or the first and second band portions 131b-5 and 132b-5, and the average thickness t2 of the insulating layer 151-6 may be the average of the thicknesses measured at five equally spaced points on the first and second connection portions 131a-5 and 132a-5.

[0137] Figure 19 schematically shows a perspective view of a multilayer electronic component 1008 according to one embodiment of the present invention, and Figure 20 is a cross-sectional view along the line XIV-XIV' in Figure 18. Referring to Figures 19 and 20, a cover layer 171 containing an aluminum (Al) oxide can be placed on the insulating layer 151-7 of the multilayer electronic component 1008 according to one embodiment.

[0138] Aluminum (Al) oxides can undergo diffusion at the point of contact with glass. When forming an insulating layer with an aluminum (Al) oxide on an external electrode containing glass, diffusion can reduce the continuity of the insulating layer. In particular, when multilayer electronic components are used in high-temperature environments, diffusion is more likely to occur, and if an insulating layer is formed with an aluminum (Al) oxide, the reliability of moisture resistance in high-temperature environments may not be guaranteed.

[0139] According to one embodiment of the present invention, since the cover layer 171 containing an oxide containing aluminum (Al) is placed on an insulating layer 151-7 containing an oxide containing hafnium (Hf), it is possible to prevent a decrease in the continuity of the cover layer 171 even when the external electrodes 131 and 132 contain glass, and excellent moisture resistance reliability can be ensured even in high-temperature environments. Furthermore, even if a crack occurs in the cover layer 171, the insulating layer 151-7 can prevent the crack from propagating into the first and second external electrodes 131 and 132 and the main body 110, thereby suppressing the occurrence of cracks.

[0140] In one embodiment, the hafnium (Hf) oxide contained in the insulating layer 151-7 may be HfO2, and the aluminum (Al) oxide contained in the cover layer 171 may be Al2O3.

[0141] In one embodiment, the insulating layer 151-7 may have a molar ratio of hafnium (Hf) atoms to the total number of moles of the remaining elements excluding oxygen atoms of 0.95 or more, and the cover layer 171 may have a molar ratio of aluminum (Al) atoms to the total number of moles of the remaining elements excluding oxygen atoms of 0.95 or more. That is, excluding elements detected as impurities, the insulating layer 151-7 can be substantially composed of an oxide containing hafnium (Hf), and the cover layer 171 can be substantially composed of aluminum (Al). This further improves the effect of suppressing cracks due to thermal shrinkage, radiative cracks due to metal diffusion, and the effect of improving moisture resistance reliability. In this case, the components of the cover layer 171 can be analyzed by the same method as the method for analyzing the components of the insulating layer described above.

[0142] Figure 21 schematically shows a perspective view of a stacked electronic component 2000 according to one embodiment of the present invention, and Figure 22 is a cross-sectional view along the line VIII-VIII' in Figure 21. Hereinafter, the stacked electronic component 2000 according to one embodiment of the present invention will be described in detail with reference to Figures 21 and 22. However, any content that overlaps with the above description may be omitted to avoid redundant explanation.

[0143] A stacked electronic component 2000 according to one embodiment of the present invention includes a dielectric layer 111, first and second internal electrodes 121 and 122 arranged alternately with the dielectric layer in between, a body 110 including first and second surfaces 1 and 2 facing in the first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing in the second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing in the third direction, and a first connecting electrode 231a arranged on the third surface and a first band electrode 231b arranged on the first surface and connected to the first connecting electrode The device includes an external electrode 231, a second external electrode 232 including a second connecting electrode 232a disposed on the fourth surface and a second band electrode 232b disposed on the first surface and connected to the second connecting electrode, a first insulating layer 251 disposed on the first connecting electrode, a second insulating layer 252 disposed on the second connecting electrode, a first plating layer 241 disposed on the first band electrode, and a second plating layer 242 disposed on the second band electrode, wherein the first and second insulating layers 251 and 252 may contain an oxide containing hafnium (Hf).

[0144] The first connecting electrode 231a can be positioned on the third surface 3 and connected to the first internal electrode 121, and the second connecting electrode 231b can be positioned on the fourth surface 4 and connected to the second internal electrode 122. In addition, a first insulating layer 251 can be positioned on the first connecting electrode 231a', and a second insulating layer 252 can be positioned on the second connecting electrode 232a.

[0145] Conventionally, when forming external electrodes, a paste containing conductive metal was used, and the exposed surface of the main body's internal electrodes was dipped into the paste. However, external electrodes formed by this dipping method sometimes had excessively thick external electrodes in the center in the thickness direction. Furthermore, even without this problem of thickness imbalance of external electrodes by the dipping method, since the internal electrodes are exposed on the third and fourth surfaces of the main body, the external electrodes placed on the third and fourth surfaces were formed to have a thickness of at least a certain level in order to suppress the penetration of moisture and plating solution through the external electrodes.

[0146] In contrast, in the present invention, since insulating layers 251 and 252 are arranged on the connecting electrodes 231a and 232a, sufficient reliability can be ensured even if the thickness of the connecting electrodes 231a and 232a on the third and fourth surfaces where the internal electrodes are exposed is reduced.

[0147] The first and second connecting electrodes 231a and 232a may be configured to correspond to the third and fourth surfaces, respectively, and the surfaces of the first and second connecting electrodes 231a and 232a facing the main body 110 may have the same area as the third and fourth surfaces of the main body 110, respectively. The first and second connecting electrodes 231a and 232a can be positioned within a range that does not deviate from the third and fourth surfaces 3 and 4, respectively. The connecting electrodes 231a and 232a can be positioned so as not to extend to the first, second, fifth and sixth surfaces 1, 2, 5 and 6 of the main body 110. Specifically, in one embodiment, the first and second connecting electrodes 231a and 232a can be positioned at a distance from the fifth and sixth surfaces. This minimizes the volume occupied by the external electrodes while ensuring sufficient connectivity between the internal electrodes 121 and 122 and the external electrodes 231 and 232, thereby increasing the capacity per unit volume of the stacked electronic component 2000.

[0148] From this perspective, the first and second connecting electrodes 231a and 232a can be arranged at a distance from the second surface 2. That is, by not arranging the external electrodes 231 and 232 on the second surface, the volume occupied by the external electrodes 231 and 232 can be further minimized, and the capacity per unit volume of the stacked electronic component 2000 can be further increased.

[0149] However, the connecting electrodes 231a and 232a may include corner portions that extend to the corners of the main body 110 and are positioned on the corners. That is, in one embodiment, the first connecting electrode includes a corner portion that extends and is positioned on the first-third and second-third corners, and the second connecting electrode may include a corner portion that extends and is positioned on the first-fourth and second-fourth corners.

[0150] Furthermore, the connecting electrodes 231a and 232a can have a more uniform and thinner thickness compared to external electrodes formed by the conventional dipping method. The method for forming the connecting electrodes 231a and 232a is not particularly limited, but for example, they can be formed by transferring sheets containing conductive metal, organic substances such as binders, etc., to the third and fourth surfaces, but are not limited to this, and can also be formed by plating conductive metal onto the third and fourth surfaces. In other words, the connecting electrodes 231a and 232a may be a fired layer formed by firing conductive metal, or a plated layer.

[0151] The thickness of the connecting electrodes 231a and 232a is not particularly limited, but may be, for example, 2 to 7 μm. Here, the thickness of the connecting electrodes 231a and 232a can mean the maximum thickness, and can also mean the size of the connecting electrodes 231a and 232a in the second direction.

[0152] In one embodiment, the first and second connecting electrodes 231a and 232a may contain the same metal and glass as the metal contained in the internal electrodes 121 and 122. By including the same metal as the metal contained in the internal electrodes 121 and 122, the electrical connectivity with the internal electrodes 121 and 122 can be improved, and by including glass in the first and second connecting electrodes 231a and 232a, the bonding strength with the main body 110 and / or insulating layers 251 and 252 can be improved. In this case, the same metal as the metal contained in the internal electrodes 121 and 122 may be Ni.

[0153] The first and second insulating layers 251 and 252 are arranged on the first and second connecting electrodes 231a and 232a, respectively, and can serve to prevent the formation of a plating layer on the first and second connecting electrodes 231a and 232a. In addition, the first and second insulating layers 251 and 252 can improve sealing properties and minimize the penetration of moisture, plating solutions, etc. from the outside. The first and second insulating layers 251 and 252 can contain an oxide containing hafnium (Hf). This can further improve moisture resistance reliability and suppress cracks due to thermal shrinkage and radiation cracks due to metal diffusion.

[0154] The first and second band electrodes 231b and 232b can be positioned on the first surface 1 of the main body 110. The first and second band electrodes 231b and 232b can be electrically connected to the first and second internal electrodes 121 and 122, respectively, by contacting the first and second connecting electrodes 231a and 232a.

[0155] Conventional dipping methods for forming external electrodes result in thicker electrodes on the third and fourth surfaces, and they extend to the first, second, fifth, and sixth surfaces, making it difficult to secure a high effective volume ratio. In contrast, according to one embodiment of the present invention, by arranging the first and second connecting electrodes 231a and 232a on the surface where the internal electrodes are exposed, and the first and second band electrodes 231b and 232b on the surface that will be mounted on the substrate, a high effective volume ratio can be secured.

[0156] On the other hand, when the internal electrodes 121 and 122 are stacked in a first direction, the stacked electronic component 2000 can be horizontally mounted on the substrate so that the internal electrodes 121 and 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting; when the internal electrodes 121 and 122 are stacked in a third direction, the stacked electronic component can be vertically mounted on the substrate so that the internal electrodes 121 and 122 are perpendicular to the mounting surface.

[0157] The first and second band electrodes 231b and 232b may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined considering electrical properties, structural stability, etc. For example, the first and second band electrodes 231b and 232b may be firing electrodes containing conductive metal and glass, and may be formed by applying a paste containing conductive metal and glass to the first surface of the main body, but are not limited to this, and may also be a plated layer in which conductive metal is plated onto the first surface of the main body.

[0158] While materials with excellent electrical conductivity can be used as the conductive metal in the first and second band electrodes 231b and 232b, they are not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and their alloys, and may also include the same metal as the metal contained in the internal electrodes 121 and 122.

[0159] On the other hand, in one embodiment, the first external electrode 231 further includes a third band electrode (not shown) disposed on the second surface 2 and connected to the first connecting electrode 231a, and the second external electrode 232 may further include a fourth band electrode (not shown) disposed on the second surface 2 and connected to the second connecting electrode 232a.

[0160] In one embodiment, when B1 is the distance from the extension line E3 of the third surface to the end of the first band electrode 231b, B2 is the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b, B3 is the distance from the extension line of the third surface to the end of the third band electrode (not shown), B4 is the distance from the extension line of the fourth surface to the end of the fourth band electrode (not shown), G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then B1≧G1, B3≦G1, B2≧G2, and B4≦G2 can be satisfied. This minimizes the volume occupied by the external electrodes, increases the capacity per unit volume of the stacked electronic component 2000, and increases the contact area with solder during mounting, thereby improving the bonding strength.

[0161] However, there is no intention to limit the present invention to B1≧G1, B3≦G1, B2≧G2, and B4≦G2, and a case satisfying B1≧G1, B3≧G1, B2≧G2, and B4≧G2 can also be included in one embodiment of the present invention. Therefore, in one embodiment, when B1 is the distance from the extension line E3 of the third surface to the end of the first band electrode 231b, B2 is the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b, B3 is the distance from the extension line of the third surface to the end of the third band electrode (not shown), B4 is the distance from the extension line of the fourth surface to the end of the fourth band electrode (not shown), G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then B1≧G1, B3≧G1, B2≧G2, and B4≧G2 can be satisfied. This allows either the first or second surface to be used as the mounting surface, improving ease of implementation.

[0162] The first and second plating layers 241 and 242 can be placed on the first and second band electrodes 231b and 232b. The first and second plating layers 241 and 242 play a role in improving mounting characteristics. The types of the first and second plating layers 241 and 242 are not particularly limited and may be plating layers containing one or more of Ni, Sn, Pd and their alloys, and may be formed in multiple layers.

[0163] To give a more specific example of the first and second plating layers 241 and 242, the first and second plating layers 241 and 242 may be Ni plating layers or Sn plating layers, and the Ni plating layer and the Sn plating layer may be formed sequentially on the first and second band electrodes 231b and 232b.

[0164] In one embodiment, the first and second plating layers 241 and 242 can be arranged to extend and partially cover the first and second connecting electrodes 231a and 232a, respectively. When H1 is the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122, and H2 is the average size in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 241 and 242 arranged on the first and second connecting electrodes 231a and 232a, it is possible to satisfy H1 > H2. This makes it possible to suppress the penetration of the plating solution into the internal electrodes during the plating process and improve reliability.

[0165] In one embodiment, the first and second insulating layers 251 and 252 are arranged to be in direct contact with the first and second connecting electrodes 231a and 232a, respectively, and the first and second connecting electrodes 231a and 232a may include conductive metal and glass. As a result, the plating layers 241 and 242 do not need to be placed in the areas of the outer surface of the first and second connecting electrodes 231a and 232a where the insulating layers 251 and 252 are located, thereby effectively suppressing corrosion of the external electrodes by the plating solution.

[0166] In one embodiment, the first and second insulating layers 251 and 252 are arranged to be in direct contact with the first and second connecting electrodes 231a and 232a, respectively, and the first and second connecting electrodes 231a and 232a may include conductive metal and resin. As a result, the plating layers 241 and 242 do not need to be placed in the areas of the outer surface of the first and second connecting electrodes 231a and 232a where the insulating layers 251 and 252 are located, thereby effectively suppressing corrosion of the external electrodes by the plating solution.

[0167] In one embodiment, the first plating layer 241 can be positioned to cover the end of the first insulating layer 251 that is located on the first external electrode 231, and the second plating layer 242 can be positioned to cover the end of the second insulating layer 252 that is located on the second external electrode 232. This strengthens the bonding force between the insulating layers 251, 252 and the plating layers 241, 242, thereby improving the reliability of the multilayer electronic component 3000. Furthermore, by forming the first and second insulating layers 251, 252 before forming the plating layers 241, 242 on the external electrodes 231, 232, the penetration of the plating solution during the plating layer formation process can be more reliably suppressed. By forming the insulating layers before the plating layers, the plating layers 241, 242 can have a configuration that covers the ends of the insulating layers 251, 252.

[0168] In one embodiment, the first insulating layer 251 can be positioned to cover the end of the first plating layer 241 that is located on the first external electrode 231, and the second insulating layer 252 can be positioned to cover the end of the second plating layer 242 that is located on the second external electrode 232. This strengthens the bonding force between the insulating layer 251 and the plating layers 241 and 242, thereby improving the reliability of the multilayer electronic component 3000.

[0169] Figure 23 shows a modified example of Figure 21. Referring to Figure 23, in a modified example 2001 of the stacked electronic component 2000 according to one embodiment of the present invention, the first and second insulating layers 251-1 and 252-1 can be extended to the fifth and sixth surfaces 5 and 6 and connected to each other, thereby being connected as a single insulating layer 253-1. In this case, the connected first and second insulating layers 253-1 may be arranged to cover a portion of the fifth and sixth surfaces.

[0170] Figure 24 schematically shows a perspective view of a multilayer electronic component 2002 according to one embodiment of the present invention, and Figure 25 is a cross-sectional view along the line IX-IX' in Figure 24. Referring to Figures 24 and 25, in the multilayer electronic component 2002 according to one embodiment of the present invention, the first and second plating layers 241-2 and 242-2 can be positioned below the extension line of the first surface. This makes it possible to minimize the height of the solder during mounting and minimize the mounting space. In addition, the first and second insulating layers 251-2 and 252-2 can be extended below the extension line of the first surface and positioned in contact with the first and second plating layers 241-2 and 242-2.

[0171] Figure 26 shows a modified example of Figure 24. Referring to Figure 26, in a modified example 2003 of the stacked electronic component 2002 according to one embodiment of the present invention, the first and second insulating layers 251-3 and 252-3 can be extended to the fifth and sixth surfaces 5 and 6 and connected to each other, thereby being connected as a single insulating layer 253-3. In this case, the connected first and second insulating layers 253-3 can be arranged to cover the entirety of the fifth and sixth surfaces.

[0172] Figure 27 schematically shows a perspective view of a stacked electronic component 2004 according to one embodiment of the present invention, and Figure 28 is a cross-sectional view along the line X-X' in Figure 27. Referring to Figures 27 and 28, the stacked electronic component 2004 according to one embodiment of the present invention may further include an additional insulating layer 261 disposed on the first surface 1 and positioned between the first band electrode 231b and the second band electrode 232b. This makes it possible to prevent leakage currents and the like that may occur between the first band electrode 231b and the second band electrode 232b under high voltage current.

[0173] The type of additional insulating layer 261 is not particularly limited. For example, the additional insulating layer 261 may contain an oxide containing hafnium (Hf), similar to the first and second insulating layers 251-2 and 252-2. However, the additional insulating layer 261 and the first and second insulating layers 251-2 and 252-2 are not limited to the same material and may be formed from different materials. For example, it may contain one or more materials selected from epoxy resin, acrylic resin, ethyl cellulose, etc., and may also contain glass.

[0174] Figure 29 shows a modified example of Figure 27. Referring to Figure 29, in a modified example 2005 of the stacked electronic component 2004 according to one embodiment of the present invention, the first and second insulating layers 251-5 and 252-5 are extended to the fifth and sixth surfaces 5 and 6 and connected to each other, so that they can be connected as a single insulating layer 253-5.

[0175] FIG. 30 schematically shows a perspective view of a stacked electronic component 2006 according to an embodiment of the present invention, and FIG. 31 is a cross-sectional view taken along line XI-XI' of FIG. 30. Referring to FIGS. 30 and 31, a stacked electronic component 2006 according to an embodiment includes a first insulating layer 251-6 disposed on the first connection electrode 231a and a second insulating layer 252-6 disposed on the second connection electrode 232a. When the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 241-6 and 242-6 disposed on the first and second connection electrodes 231a and 232a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved.

[0176] More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0177] FIG. 32 shows a modified example of FIG. 30. Referring to FIG. 32, in a modified example 2007 of the stacked electronic component 2006 according to an embodiment of the present invention, the first and second insulating layers 251-7 and 252-7 extend to the fifth and sixth surfaces 5 and 6 and are connected to each other, so that they can be connected as one insulating layer 253-7.

[0178] Figure 33 schematically shows a perspective view of a stacked electronic component 2008 according to one embodiment of the present invention, and Figure 34 is a cross-sectional view along the line XII-XII' in Figure 33. Referring to Figures 33 and 34, the stacked electronic component 2008 according to one embodiment of the present invention can be connected as a single insulating layer 253-8 by extending the first and second insulating layers 251-8 and 252-8 to the second, fifth, and sixth surfaces 2, 5, and 6 and connecting them to each other. As shown in Figure 35, the insulating layer 253-8 may cover the entire second surface, or it may cover only a portion of the fifth and sixth surfaces.

[0179] Figure 35 schematically shows a perspective view of a multilayer electronic component 2009 according to one embodiment of the present invention, and Figure 36 is a cross-sectional view along the line XIII-XIII' in Figure 35. Referring to Figures 37 and 40, the average thickness t1 of the first and second plating layers 241-9, 242-9 of the multilayer electronic component 2009 according to one embodiment of the present invention may be thinner than the average thickness t2 of the first and second insulating layers 251-9, 252-9.

[0180] According to one embodiment of the present invention, the average thickness t1 of the first and second plating layers 241-9 and 242-9 can be made thinner than the average thickness t2 of the first and second insulating layers 251-9 and 252-9, thereby reducing the contact area between the plating layer and the insulating layer. This suppresses the occurrence of delamination and improves the adhesion strength of the multilayer electronic component 2009 to the substrate 180.

[0181] The average thickness t1 of the first and second plating layers 241-9 and 242-9 may be the average of the thicknesses measured at five equally spaced points on the first and second connecting electrodes 231a and 232a or the first and second band electrodes 231b and 232b, and the average thickness t2 of the insulating layers 251-9 and 252-9 may be the average of the thicknesses measured at five equally spaced points on the first and second connecting electrodes 231a and 232a.

[0182] Figure 37 shows a modified example of Figure 35. Referring to Figure 37, in a modified example 2010 of the stacked electronic component 2009 according to one embodiment of the present invention, the first and second insulating layers 251-10 and 252-10 are extended to the fifth and sixth surfaces 5 and 6 and connected to each other, so that they can be connected as a single insulating layer 253-10.

[0183] Figure 38 schematically shows a perspective view of a stacked electronic component 2011 according to one embodiment of the present invention, and Figure 39 is a cross-sectional view along the line XV-XV' in Figure 38. Referring to Figures 38 and 39, first and second cover layers 271 and 272 containing insulating material can be arranged on the first and second insulating layers 251-11 and 252-11 of the stacked electronic component 2011 according to one embodiment.

[0184] Since the first and second cover layers 271 and 272, which contain an aluminum (Al) oxide, are arranged on the first and second insulating layers 251-11 and 252-11, which contain a hafnium (Hf) oxide, even when the first and second external electrodes 231 and 232 contain glass, it is possible to prevent a decrease in the continuity of the first and second cover layers 271 and 272, and to ensure excellent moisture resistance reliability even in high-temperature environments. Furthermore, even if cracks occur in the first and second cover layers 271 and 272, the first and second insulating layers 251-11 and 252-11 can prevent the cracks from propagating into the first and second external electrodes 231 and 232 and the main body 110, thereby suppressing the occurrence of cracks.

[0185] In one embodiment, the hafnium (Hf) oxide contained in the first and second insulating layers 251-11 and 252-11 may be HfO2, and the aluminum (Al) oxide contained in the first and second cover layers 271 and 272 may be Al2O3.

[0186] In one embodiment, the first and second insulating layers 251-11 and 252-11 may have a molar ratio of hafnium (Hf) atoms to the total number of moles of the remaining elements excluding oxygen atoms of 0.95 or more, and the first and second cover layers 271 and 272 may have a molar ratio of aluminum (Al) atoms to the total number of moles of the remaining elements excluding oxygen atoms of 0.95 or more. That is, excluding elements detected as impurities, the first and second insulating layers 251-11 and 252-11 can be substantially composed of an oxide containing hafnium (Hf), and the first and second cover layers 271 and 272 can be substantially composed of aluminum (Al). This further improves the effect of suppressing cracks due to thermal shrinkage, radiative cracks due to metal diffusion, and the effect of improving moisture resistance reliability. In this case, the components of the first and second cover layers 271 and 272 can be analyzed by the same method as the method for analyzing the components of the insulating layer described above.

[0187] Figure 40 schematically shows a perspective view of a stacked electronic component 3000 according to one embodiment of the present invention, and Figure 41 is a cross-sectional view along the line XVI-XVI' in Figure 40. Figure 42 is an enlarged view of region K1 in Figure 40.

[0188] Referring to Figures 40 to 42, a stacked electronic component 3000 according to one embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately with the dielectric layer in between, and comprises a body 110 including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, and a first connecting portion 331a disposed on the third surface of the body, a first band portion 331b extending from the first connecting portion to a part of the first surface, and a first corner portion 331c extending from the first connecting portion to the corner connecting the second and third surfaces of the body. The device includes a first external electrode 331, a second external electrode 332 including a second connecting portion 332a disposed on the fourth surface of the main body, a second band portion 332b extending from the second connecting portion to a part of the first surface, and a second corner portion 332c extending from the second connecting portion to a corner connecting the second and fourth surfaces of the main body, an insulating layer 351 disposed on the first and second connecting portions 331a, 332a and disposed to cover the second surface, the first and second corner portions, a first plating layer 341 disposed on the first band portion, and a second plating layer 342 disposed on the second band portion, wherein the first and second insulating layers may contain an oxide containing hafnium (Hf).

[0189] In one embodiment, when B3 is the average size in the second direction from the extension line of the third surface to the end of the first corner portion 331c, B4 is the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion 332c, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode, then B3 ≤ G1 and B4 ≤ G2 can be satisfied. This minimizes the volume occupied by the external electrodes 331 and 332 and increases the capacity per unit volume of the stacked electronic component 3000.

[0190] In this case, if B1 is the average size in the second direction from the extension line of the third surface to the end of the first band portion 331b, and B2 is the average size in the second direction from the extension line of the fourth surface to the end of the second band portion 332b, then B1≧G1 and B3≧G2 can be satisfied. This increases the area in contact with the solder during mounting, thereby improving the bonding strength.

[0191] A stacked electronic component 3000 according to one embodiment may include a body 110 that includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately with the dielectric layer in between, and has first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction. The body 110 of the stacked electronic component 3000 may have the same configuration as the body 110 of the stacked electronic component 1000, except that the end of the first or second surface of the body is contracted, as will be described later.

[0192] External electrodes 331 and 332 can be arranged on the third surface 3 and fourth surface 4 of the main body 110. The external electrodes 331 and 332 may include first and second external electrodes 331 and 332, respectively, which are arranged on the third and fourth surfaces 3 and 4 of the main body 110 and connected to first and second internal electrodes 121 and 122, respectively.

[0193] The external electrodes 331 and 332 may include a first external electrode 331 which includes a first connecting portion 331a located on the third surface, a first band portion 331b extending from the first connecting portion to a part of the first surface, and a first corner portion 331c extending from the first connecting portion to the corner connecting the second and third surfaces; and a second external electrode 132 which includes a second connecting portion 332a located on the fourth surface, a second band portion 332b extending from the second connecting portion to a part of the first surface, and a second corner portion 332c extending from the second connecting portion to the corner connecting the second and fourth surfaces. The first connecting portion 331a can be connected to the first internal electrode 121 on the third surface, and the second connecting portion 332a can be connected to the second internal electrode 122 on the fourth surface.

[0194] In one embodiment, the first and second connecting portions 331a and 332a can be arranged at a distance from the fifth and sixth surfaces. This minimizes the specific gravity occupied by the external electrodes 331 and 332, thereby further miniaturizing the stacked electronic component 3000.

[0195] Due to the overlap of margin regions on the dielectric layer 111 where internal electrodes 121 and 122 are not placed, a step difference is generated due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface and the third to fifth surfaces and / or the second surface and the third to fifth surfaces may have a form that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, due to the contraction behavior during the sintering process of the main body, the corners connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, and 6 and / or the corners connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, and 6 may have a form that is contracted toward the center in the first direction of the main body 110 when viewed with reference to the first or second surface. Alternatively, in order to prevent chipping defects, the corners connecting each surface of the main body 110 can be rounded by performing a separate process to round the corners connecting the first surface with the third to sixth surfaces and / or the corners connecting the second surface with the third to sixth surfaces.

[0196] The above corners may include the 1st-3rd corner c1-3 connecting the 1st and 3rd faces, the 1st-4th corner c1-4 connecting the 1st and 4th faces, the 2nd-3rd corner c2-3 connecting the 2nd and 3rd faces, and the 2nd-4th corner c2-4 connecting the 2nd and 4th faces. Additionally, the corners may include the 1st-5th corner connecting the 1st and 5th faces, the 1st-6th corner connecting the 1st and 6th faces, the 2nd-5th corner connecting the 2nd and 5th faces, and the 2nd-6th corner connecting the 2nd and 6th faces. However, in order to suppress the step caused by the internal electrodes 121 and 122, if the internal electrodes after lamination are cut so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115, the portions connecting the first surface with the fifth and sixth surfaces and the portions connecting the second surface with the fifth and sixth surfaces may not have a contracted form.

[0197] On the other hand, the first to sixth surfaces of the main body 110 can generally be flat, and non-flat areas can be designated as corners. In addition, the areas of the external electrodes 131 and 132 that are located on the corners can be designated as corner sections.

[0198] From this perspective, the first and second corner portions 331c and 332c can be positioned below the extension line E2 of the second surface, and the first and second corner portions 331c and 332c can be positioned at a distance from the second surface. That is, by not positioning the external electrodes 331 and 332 on the second surface, the volume occupied by the external electrodes 331 and 332 can be further minimized, and the capacity per unit volume of the stacked electronic component 3000 can be further increased. In addition, the first corner portion 331c can be positioned on a part of the second-third corner C2-3 connecting the third surface and the second surface, and the second corner portion 332c can be positioned on a part of the second-fourth corner C2-4 connecting the fourth surface and the second surface.

[0199] The extension line E2 of the second surface can be defined as follows: In the length-thickness cross section (LT cross section) obtained by cutting the stacked electronic component 3000 in the center in the width direction, seven straight lines P0, P1, P2, P3, P4, P5, P6, and P7 are drawn in the thickness direction with equal intervals in the length direction from the third surface to the fourth surface. The extension line E2 of the second surface can be defined as the line passing through the point where P2 intersects the second surface and the point where P4 intersects the second surface.

[0200] On the other hand, the external electrodes 331 and 332 may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined by considering electrical properties, structural stability, etc. Furthermore, they may have a multilayer structure.

[0201] The external electrodes 331 and 332 may be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin.

[0202] Furthermore, the external electrodes 331 and 332 may be formed in a manner in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Also, the external electrodes 331 and 332 may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0203] The conductive metal included in the external electrodes 331 and 332 can be any material with excellent electrical conductivity, but is not particularly limited. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. Preferably, the external electrodes 331 and 332 may include one or more of Ni and Ni alloys, thereby further improving connectivity with the internal electrodes 121 and 122 which contain Ni.

[0204] The insulating layer 351 can be placed on the first and second connection portions 331a and 332a. Since the first and second connection portions 331a and 332a are connected to the internal electrodes 121 and 122, they can serve as pathways for the penetration of the plating solution during the plating process or for moisture penetration during actual use. In this invention, since the insulating layer 351 is placed on the connection portions 331a and 332a, it is possible to prevent the penetration of moisture from the outside or the penetration of the plating solution.

[0205] The insulating layer 351 can be positioned in contact with the first and second plating layers 341 and 342. In this case, the insulating layer 351 may be in contact with the first and second plating layers 341 and 342 in a manner that partially covers their edges, or the first and second plating layers 341 and 342 may be in contact with the insulating layer 351 in a manner that partially covers their edges.

[0206] The insulating layer 353 can be placed on the first and second connection portions 331a and 332a and positioned to cover the second surface and the first and second corner portions 331c and 332c. Furthermore, by having the insulating layer 351 cover the area where the ends of the first and second corner portions 331c and 332c and the main body 110 are in contact, thereby blocking the path of moisture penetration, the moisture resistance reliability can be further improved.

[0207] The insulating layer 351 can be positioned on the second surface and extended to the first and second connection portions 331a and 332a. Furthermore, if the external electrodes 331 and 332 are not positioned on the second surface, the insulating layer can be positioned to cover the entire second surface. On the other hand, the insulating layer 351 does not necessarily have to be positioned on the second surface; it may not be positioned on part or all of the second surface, and the insulating layer may be separated into two parts, each positioned on the first and second connection portions 331a and 332a. However, even in this case, the insulating layer can be positioned to cover the entire first and second corner portions 331c and 332c. If the insulating layer is not positioned on the entire second surface, it can be positioned below the extension line of the second surface. Also, even if the insulating layer is not positioned on the second surface, it can extend over the first and second connection portions 331a and 332a to form a single insulating layer on the fifth and sixth surfaces.

[0208] In one embodiment, the insulating layer 351 can be arranged to cover a portion of the fifth and sixth surfaces to improve reliability. In this case, the portion of the fifth and sixth surfaces not covered by the insulating layer can be exposed to the outside.

[0209] Furthermore, the insulating layer 351 can be positioned to cover the entire fifth and sixth surfaces, in which case the fifth and sixth surfaces are not exposed to the outside, thereby further improving moisture resistance reliability.

[0210] The insulating layer 351 can prevent the formation of plating layers 341 and 342 on the external electrodes 331 and 332 on which the insulating layer 351 is placed, thereby improving sealing properties and minimizing the penetration of moisture, plating solutions, etc., from the outside. The components, composition, average thickness, and effects of the insulating layer 351 are the same as those of the insulating layers 151, 251, 252, and 253 included in the multilayer electronic components 1000 and 2000, or various embodiments thereof, so a detailed explanation of these is omitted.

[0211] The first and second plating layers 341 and 342 can be placed on the first and second band portions 331b and 332b, respectively. The plating layers 341 and 342 can improve mounting characteristics, and by placing the plating layers 341 and 342 on the band portions 331b and 332b, the mounting space can be minimized, and the penetration of the plating solution into the internal electrodes can be minimized, thereby improving reliability. One end of the first and second plating layers 341 and 342 can be in contact with the first surface, and the other end can be in contact with the insulating layer 351.

[0212] The types of plating layers 341 and 342 are not particularly limited and may include one or more of Cu, Ni, Sn, Ag, Au, Pd, and their alloys, and may be formed in multiple layers. To give a more specific example of plating layers 341 and 342, plating layers 341 and 342 may be Ni plating layers or Sn plating layers, and may be formed in a form in which Ni plating layers and Sn plating layers are sequentially formed on the first and second band portions 331b and 332b.

[0213] In one embodiment, the first plating layer 341 can be positioned to cover the end of the insulating layer 351 that is placed on the first external electrode 331, and the second plating layer 342 can be positioned to cover the end of the insulating layer 351 that is placed on the second external electrode 332. This strengthens the bonding force between the insulating layer 351 and the plating layers 341 and 342, thereby improving the reliability of the multilayer electronic component 3000. Furthermore, by forming the insulating layer 351 before forming the plating layers 341 and 342 on the external electrodes 331 and 332, the penetration of the plating solution during the plating layer formation process can be more reliably suppressed. By forming the insulating layer before the plating layer, the plating layers 341 and 342 can have a configuration that covers the end of the insulating layer 351.

[0214] In one embodiment, the insulating layer 351 can be positioned to cover the end of the first plating layer 341 that is located on the first external electrode 331, and the insulating layer 351 can be positioned to cover the end of the second plating layer 342 that is located on the second external electrode 332. This strengthens the bonding force between the insulating layer 351 and the plating layers 341 and 342, thereby improving the reliability of the multilayer electronic component 3000.

[0215] In one embodiment, the first and second plating layers 341 and 342 can be arranged to extend so as to partially cover the first and second connection portions 331a and 332a, respectively. Among the first and second internal electrodes 121 and 122, when the average size in the first direction to the internal electrode disposed closest to the first surface 1 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 141 and 142 disposed on the first and second connection portions 131a and 132a is H2, H1 > H2 can be satisfied. Thereby, it is possible to suppress the penetration of the plating solution into the internal electrode during the plating process and improve the reliability.

[0216] In one embodiment, among the first and second internal electrodes 121 and 122 from the first surface, when the average size in the first direction to the internal electrode disposed closest to the first surface is H1, and the average size in the first direction from the extension line of the first surface to the ends of the plating layers 341 and 342 disposed on the first and second connection portions 331a and 332a is H2, H1 < H2 can be satisfied. Thereby, it is possible to increase the area in contact with the solder during mounting and improve the fixing strength. More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0217] In one embodiment, the first and second plating layers 341 and 342 can be disposed below the extension line of the first surface. Thereby, it is possible to minimize the height of the solder during mounting and minimize the mounting space. Further, the insulating layer 351 can be arranged to extend below the extension line of the first surface and contact the first and second plating layers 341 and 342.

[0218] In one embodiment, when the average size of the main body in the second direction is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, the conditions 0.2 ≤ B1 / L ≤ 0.4 and 0.2 ≤ B2 / L ≤ 0.4 can be satisfied.

[0219] If B1 / L and B2 / L are less than 0.2, it may be difficult to ensure sufficient adhesion strength. On the other hand, if B2 / L exceeds 0.4, there is a risk of leakage current occurring between the first band portion 331b and the second band portion 332b under high voltage current, and there is a risk that the first band portion 331b and the second band portion 332b may become electrically connected due to plating bleeding or the like during the plating process.

[0220] In one embodiment, an additional insulating layer may be further included, which is disposed on the first surface and between the first band portion 331b and the second band portion 332b. This makes it possible to prevent leakage currents and the like that may occur between the first band electrode 331b and the second band electrode 332b under high voltage current.

[0221] The type of additional insulating layer is not particularly limited. For example, the additional insulating layer may contain an oxide containing hafnium (Hf), similar to the insulating layer 351. However, the additional insulating layer and the insulating layer 351 are not limited to the same material and may be formed from different materials. For example, they may contain one or more materials selected from epoxy resin, acrylic resin, ethyl cellulose, etc., and may also contain glass.

[0222] In one embodiment, when the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, B3 < B1 and B4 < B2 can be satisfied. The average length B1 of the first band portion 331b may be longer than the average length B3 of the first corner portion 331c, and the average length of the second band portion may be longer than the average length B4 of the second corner portion 332. Thereby, the area in contact with solder during mounting can be increased to improve the fixing strength.

[0223] More specifically, when the average size in the second direction from the extension line of the third surface 3 to the end of the first band portion 331b is B1, the average size in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 332b is B2, the average size in the second direction from the extension line of the third surface 3 to the end of the first corner portion 33l c is B3, and the average size in the second direction from the extension line of the fourth surface 4 to the end of the second corner portion 332c is B4, B3 < B1 and B4 < B2 can be satisfied.

[0224] In one embodiment, the average thicknesses of the first and second plating layers 341 and 342 may be thinner than the average thickness of the insulating layer 351. The insulating layer 351 serves to prevent moisture penetration from the outside or penetration of the plating solution, but has weak connectivity with the plating layers 341 and 342 and may cause delamination of the plating layers. When the plating layer is delaminated, the adhesion strength to the substrate may decrease. Here, delamination of the plating layer can mean that the plating layer is partially peeled off or physically separated from the external electrodes 331 and 332. Since the connectivity between the plating layer and the insulating layer is weak, the gap at the interface between the insulating layer and the plating layer is likely to widen or foreign substances are likely to penetrate, making it vulnerable to external shocks and the like and increasing the likelihood of delamination.

[0225] According to one embodiment of the present invention, by making the average thickness of the plating layer thinner than the average thickness of the insulating layer, the contact area between the plating layer and the insulating layer can be reduced, thereby suppressing the occurrence of delamination and improving the adhesion strength with the multilayer electronic component 3000.

[0226] There is no particular limit to the size of the multilayer electronic component 3000. However, in order to achieve both miniaturization and high capacitance simultaneously, the thickness of the dielectric layer and internal electrodes must be reduced and the number of layers increased. Therefore, the improvements in reliability and capacitance per unit volume according to the present invention can be more pronounced in multilayer electronic components 3000 having a size of 1005 (length × width, 1.0 mm × 0.5 mm) or less.

[0227] Therefore, considering manufacturing tolerances, external electrode size, etc., the reliability improvement effect according to the present invention can be more pronounced when the length of the stacked electronic component 3000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the stacked electronic component 3000 can mean the maximum size of the stacked electronic component 3000 in the second direction, and the width of the stacked electronic component 3000 can mean the maximum size of the stacked electronic component 3000 in the third direction.

[0228] As described above, embodiments of the present invention have been explained in detail, but the present invention is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims provided. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0229] It should be noted that the expression "one embodiment" used in this invention does not mean that each embodiment is identical to the others, but is provided to emphasize and describe the unique and distinct characteristics of each embodiment. However, the above-presented embodiment does not preclude its realization in combination with the characteristics of other embodiments. For example, even if a matter described in a particular embodiment is not described in another embodiment, it can be understood as a description relating to the other embodiment, as long as there is no description in the other embodiment that contradicts or contradicts that matter.

[0230] The terms used in this invention are used solely to describe one embodiment and are not intended to limit the invention. In this context, singular expressions include plural expressions unless the context clearly indicates otherwise. [Explanation of Symbols]

[0231] 1000, 2000, 3000: Multilayer electronic components 1100: Mounted circuit board 110: Main unit 111: Dielectric layer 112, 113: Cover section 114, 115: Margin section 121, 122: Internal electrode 131, 231, 331: 1st external electrode 132, 232, 332: 2nd external electrode 134, 135: Additional electrode layer 141, 142, 241, 242, 341, 342: Plating layer 151, 251, 252, 253, 351: Insulating layer 171, 271, 272: Cover layer 161, 261: Additional insulating layer 180: Circuit board 181, 182: Electrode pads 191, 192: Handa

Claims

1. a main body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer sandwiched therebetween, the main body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in the third direction; a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a portion of the first surface; a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a portion of the first surface; an insulating layer including a first insulating layer disposed on the first connection portion and a second insulating layer disposed on the second connection portion; a plating layer including a first plating layer disposed on the first band portion and a second plating layer disposed on the second band portion, The insulating layer includes an oxide containing hafnium (Hf).

2. The oxide containing hafnium (Hf) is HfO ２ 2. The multilayer electronic component according to claim 1, wherein

3. 2. The multilayer electronic component according to claim 1, wherein the number of moles of hafnium (Hf) element relative to the total number of moles of remaining elements excluding oxygen among the elements constituting said insulating layer is 0.95 or more.

4. 2. The multilayer electronic component according to claim 1, wherein the insulating layer has an average thickness of 15 nm or more and 1000 nm or less.

5. 2. The multilayer electronic component according to claim 1, wherein the first and second external electrodes include glass.

6. The laminated electronic component according to claim 1 , further comprising a cover layer disposed on the insulating layer and including an oxide containing aluminum (Al).

7. The oxide containing aluminum (Al) is Al ２ O ３ 7. The multilayer electronic component according to claim 6, wherein:

8. 7. The multilayer electronic component according to claim 6, wherein the number of moles of aluminum (Al) element relative to the total number of moles of remaining elements excluding oxygen among the elements constituting said cover layer is 0.95 or more.

9. 2. The multilayer electronic component according to claim 1, wherein H1 is an average size in a first direction from the first surface to an internal electrode of the first and second internal electrodes that is arranged closest to the first surface, and H2 is an average size in the first direction from an extension of the first surface to ends of plating layers arranged on the first and second connection portions, and H1 > H2 is satisfied.

10. 2. The multilayer electronic component according to claim 1, wherein H1 is an average size in a first direction from the first surface to an internal electrode of the first and second internal electrodes that is arranged closest to the first surface, and H2 is an average size in the first direction from an extension of the first surface to ends of plating layers arranged on the first and second connection portions, and H1 < H2 is satisfied.

11. When the average size of the body in the first direction is T, The multilayer electronic component according to claim 10, wherein H2<T / 2 is satisfied.

12. The multilayer electronic component according to claim 1 , wherein the first and second plating layers are disposed at or below an extension of the first surface.

13. When the average size in the second direction of the main body is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, 2. The multilayer electronic component according to claim 1, wherein 0.2≦B1 / L≦0.4 and 0.2≦B2 / L≦0.4 are satisfied.

14. 2. The laminated electronic component according to claim 1, further comprising an additional insulating layer disposed on the first surface and between the first band portion and the second band portion.

15. 2. The multilayer electronic component according to claim 1, wherein the dielectric layers have an average thickness of 0.35 [mu]m or less.

16. 2. The multilayer electronic component according to claim 1, wherein the average thickness of each of the first and second internal electrodes is 0.35 [mu]m or less.

17. a capacitance forming portion including first and second internal electrodes alternately arranged with the dielectric layer interposed therebetween, and cover portions arranged on both end faces of the capacitance forming portion in a first direction; The multilayer electronic component according to claim 1 , wherein the average size of the cover portion in the first direction is 15 μm or less.

18. 2. The multilayer electronic component according to claim 1, wherein the average thickness of the first and second plating layers is thinner than the average thickness of the insulating layer.

19. 2. The multilayer electronic component according to claim 1, wherein the first plating layer is disposed so as to cover an end of the first insulating layer that is closer to the first surface, and the second plating layer is disposed so as to cover an end of the second insulating layer that is closer to the first surface.

20. 2. The multilayer electronic component according to claim 1, wherein the first insulating layer is disposed so as to cover an end of the first plating layer that is disposed on the first external electrode, and the second insulating layer is disposed so as to cover an end of the second plating layer that is disposed on the second external electrode.

21. the first external electrode includes a first side band portion extending from the first connection portion to a portion of the fifth and sixth surfaces; the second external electrode includes a second side band portion extending from the second connection portion to a portion of the fifth and sixth surfaces, The multilayer electronic component according to claim 1 , wherein the sizes of the first and second side band portions in the second direction increase toward the first surface.

22. The multilayer electronic component according to claim 1 , wherein the first and second external electrodes are disposed apart from the fifth and sixth surfaces.

23. The multilayer electronic component according to claim 1 , wherein the first and second external electrodes are disposed apart from the second surface.

24. The multilayer electronic component according to claim 1 , wherein the first and second insulating layers extend to the second surface and are connected to each other.

25. The multilayer electronic component according to claim 1 , wherein the first and second insulating layers extend to the fifth and sixth surfaces and are connected to each other.

26. The multilayer electronic component according to claim 1 , wherein the insulating layer is not disposed on the second, fifth, or sixth surfaces.

27. the first external electrode includes a third band portion extending from the first connection portion to a portion of the second surface; The multilayer electronic component according to claim 1 , wherein the second external electrode includes a fourth band portion extending from the second connection portion to a portion of the second surface.

28. the main body includes a first-third corner connecting the first surface and the third surface, a first-fourth corner connecting the first surface and the fourth surface, a second-third corner connecting the second surface and the third surface, and a second-fourth corner connecting the second surface and the fourth surface; the first-third corner and the second-third corner are shaped to be contracted toward the center of the first direction of the body as they approach the third surface, and the first-fourth corner and the second-fourth corner are shaped to be contracted toward the center of the first direction of the body as they approach the fourth surface, 2. The multilayer electronic component according to claim 1, wherein the first external electrode includes a first corner portion extending from the first connection portion onto the first-third corner and the second-third corner, and the second external electrode includes a second corner portion extending from the second connection portion onto the first-fourth corner and the second-fourth corner.

29. When the average size in the second direction from an extension line of the third surface to an end of the first corner portion is B3, the average size in the second direction from an extension line of the fourth surface to an end of the second corner portion is B4, the average size in the second direction of a region where the third surface and the second internal electrode are separated is G1, and the average size in the second direction of a region where the fourth surface and the first internal electrode are separated is G2, 29. The multilayer electronic component according to claim 28, wherein B3≦G1 and B4≦G2 are satisfied.

30. the first external electrode includes a first connecting electrode disposed on the third surface and a first band electrode disposed on the first surface and connected to the first connecting electrode; 2 . The multilayer electronic component according to claim 1 , wherein the second external electrodes include a second connecting electrode disposed on the fourth surface and a second band electrode disposed on the first surface and connected to the second connecting electrode.

31. the first external electrode further includes a third band electrode disposed on the second surface and connected to the first connecting electrode; The multilayer electronic component according to claim 30 , wherein the second external electrode further comprises a fourth band electrode disposed on the second surface and connected to the second connecting electrode.

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