Laminate type electronic component

Abstract

To provide a laminate type electronic component which alleviates stress of a solder fillet, prevents intrusion of moisture from outside, and has a small size and high capacity.SOLUTION: A laminate type electronic component includes: a body that is a generally hexahedron; an external electrode which extends to a part of a main surface from an end face and has a connection part 131a; an insulation film 151 arranged so as to extend to a part of the end face from one main surface; and a plating layer 141 arranged on the main surface of the external electrode. In a region P1 where the plating layer and the insulation layer are brought into contact with each other, the thickness of the insulation layer is gradually smaller toward a terminal. The end of the plating layer includes a first region S1 arranged so as to extend between the insulation layer and the external electrode, and a second region S2 arranged so as to extend and cover the insulation layer.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-layered ceramic capacitors (MLCCs), a type of multilayer electronic component, are chip-type capacitors that are mounted on printed circuit boards of various electronic products, such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and serve to charge and discharge electricity.

[0003] Such multilayer ceramic capacitors have advantages of being small in size, high in capacitance, and easy to mount, and can be used as components of various electronic devices.

[0004] In recent years, with the miniaturization and multi-functionalization of electronic products, there has been an increasing demand for higher integration and higher capacity of multilayer ceramic capacitors, and the space between multilayer ceramic capacitors has been minimized.

[0005] Furthermore, as multilayer ceramic capacitors are used in automobiles and infotainment systems, there is an increasing demand for high reliability, high strength characteristics, and miniaturization.

[0006] Therefore, in Patent Document 1, in order to prevent cracks from occurring in the element body due to tensile stress caused by thermal contraction of the solder fillet in a multilayer electronic component mounted by solder, a glass layer is provided directly on the sintered body layer on each end face side so as to extend in a direction perpendicular to one main surface and side face of the element body, and forms part of the surface of the external electrode, and a plating layer is provided on the surface of the external electrode that is not covered by the glass layer.

[0007] Meanwhile, in order to miniaturize and increase the capacitance of a multilayer ceramic capacitor, the number of layers must be increased by forming the internal electrodes and dielectric layers thin, and the volume of parts that do not affect the formation of capacitance must be minimized to increase the effective volume fraction required to realize capacitance.

[0008] Furthermore, in order to mount the maximum number of components within a limited area of ​​a board, it is necessary to minimize the mounting space.

[0009] Furthermore, as multilayer ceramic capacitors become smaller and have higher capacitance, the thickness of their margins becomes thinner, which makes it easier for moisture or plating solution to penetrate from the outside, which can result in reduced reliability. Therefore, a solution is needed to protect multilayer ceramic capacitors from the penetration of moisture or plating solution from the outside. [Prior art documents] [Patent documents]

[0010] [Patent Document 1] Korean Patent Publication No. 2016-178219 Summary of the Invention [Problem to be solved by the invention]

[0011] One of the many objects of the present invention is to protect laminated electronic components from stresses due to thermal contraction of solder fillets.

[0012] One of the various objects of the present invention is to reduce the size and increase the capacity of multilayer electronic components.

[0013] One of the various objects of the present invention is to reduce packaging volume.

[0014] One of the various objects of the present invention is to protect a laminated electronic component from the penetration of external moisture and plating solutions.

[0015] However, the object of the present invention is not limited to the above-mentioned contents, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0016] A multilayer electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer sandwiched therebetween, the main body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces facing each other in the third direction; a first external electrode including a first connecting portion disposed on the third surface and a first band portion extending from the first connecting portion to a portion of the first surface; a second connecting portion disposed on the fourth surface and a second band portion extending from the second connecting portion to a portion of the first surface; the second surface includes a second external electrode including a band portion; an insulating layer disposed on the second surface and extending to a portion on the first and second connection portions; and a plating layer disposed on the first and second band portions, the plating layer extending to a portion on the first and second connection portions and contacting the insulating layer, the insulating layer having a thickness that gradually decreases toward an end in a region where the plating layer and the insulating layer contact each other, and an end of the plating layer including a first region extending between the insulating layer and the first and second connection portions and a second region extending to cover the insulating layer.

[0017] A multilayer electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes alternately arranged with the dielectric layer sandwiched therebetween, the main body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces facing each other in the third direction; a first external electrode including a first connecting portion arranged on the third surface and a first band portion extending from the first connecting portion to a portion of the first surface; a second connecting portion arranged on the fourth surface and a second band portion extending from the second connecting portion to a portion of the first surface; the second external electrode including a second band portion disposed on the second surface and the first and second connection portions, an insulating layer disposed on the second surface and the first and second connection portions and extending to a portion on the first and second band portions, and a plating layer disposed on the first and second band portions and in contact with the insulating layer, wherein in a region where the insulating layer and the plating layer are in contact with each other, the insulating layer has a thickness that gradually decreases toward an end, and an end of the plating layer may include a third region disposed extending between the insulating layer and the first and second band portions and a fourth region disposed extending to cover the insulating layer.

[0018] A multilayer electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately with the dielectric layer sandwiched therebetween, the main body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces facing each other in the third direction; a first external electrode including a first connecting portion arranged on the third surface, a first band portion extending from the first connecting portion to a portion of the first surface, and a third band portion extending from the first connecting portion to a portion of the second surface; a second connecting portion arranged on the fourth surface, a second band portion extending from the second connecting portion to a portion of the first surface, and an upper The external electrode includes a second external electrode including a fourth band portion extending from the second connection portion to a portion of the second surface, an insulating layer disposed on the first and second connection portions and arranged so as to cover the second surface and the third and fourth band portions, and a plating layer disposed on the first and second band portions, wherein the plating layer extends to a portion on the first and second connection portions and contacts the insulating layer, and in the region where the plating layer and the insulating layer contact, the insulating layer has a thickness that gradually decreases toward the end, and an end of the plating layer includes a first region extending between the insulating layer and the first and second connection portions and a second region extending so as to cover the insulating layer.

[0019] A multilayer electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately with the dielectric layer sandwiched therebetween, the main body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces facing each other in the third direction; a first external electrode including a first connecting portion arranged on the third surface, a first band portion extending from the first connecting portion to a part of the first surface, and a first corner portion extending from the first connecting portion to a corner connecting the second surface and the third surface; a second external electrode including a second connecting portion arranged on the fourth surface, a second band portion extending from the second connecting portion to a part of the first surface, and a second corner portion extending from the second connecting portion to a corner connecting the second surface and the fourth surface; and a second external electrode arranged on the first and second connecting portions, and and a plating layer disposed on the first and second band portions, wherein when an average distance in the second direction from an extension of the third surface to an end of the first corner portion is B3, an average distance in the second direction from an extension of the fourth surface to an end of the second corner portion is B4, an average size in the second direction of a region where the third surface and the second internal electrode are separated is G1, and an average size in the second direction of a region where the fourth surface and the first internal electrode are separated is G2, B3≦G1 and B4≦G2 are satisfied, the plating layer extends to a part on the first and second connection portions and contacts the insulating layer, and in the region where the plating layer and the insulating layer contact, the thickness of the insulating layer gradually decreases toward the end, and end portions of the plating layer include a first region extended and disposed between the insulating layer and the first and second connection portions and a second region extended and disposed so as to cover the insulating layer.

[0020] A multilayer electronic component according to one embodiment of the present invention includes a main body including a dielectric layer and first and second internal electrodes arranged alternately with the dielectric layer sandwiched therebetween, the main body including first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in the third direction; a first external electrode including a first connecting electrode arranged on the third surface and a first band electrode arranged on the first surface and connected to the first connecting electrode; and a second external electrode including a second connecting electrode arranged on the fourth surface and a second band electrode arranged on the first surface and connected to the second connecting electrode. , a first insulating layer disposed on the first connecting electrode, a second insulating layer disposed on the second connecting electrode, a first plating layer disposed on the first band electrode, and a second plating layer disposed on the second band electrode, an end of the first plating layer includes a 1-1 region extending between the first insulating layer and the first connecting electrode and a 1-2 region extending to cover the first insulating layer, and an end of the second plating layer includes a 2-1 region extending between the second insulating layer and the second connecting electrode and a 2-2 region extending to cover the second insulating layer. [Effects of the Invention]

[0021] One of the various effects of the present invention is that it suppresses the occurrence of cracks due to stress caused by thermal contraction of the solder fillet.

[0022] One of the many advantages of the present invention is that it increases the effective volume fraction required to achieve capacity.

[0023] One of the various objects of the present invention is to minimize packaging space for stacked electronic components.

[0024] One of the various objects of the present invention is to prevent the penetration of moisture and plating solution from the outside into a laminated electronic component.

[0025] However, the various advantageous and beneficial effects of the present invention are not limited to the above-mentioned contents, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief explanation of the drawings]

[0026] [Figure 1] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 2] 2 is a schematic perspective view of a main body of the multilayer electronic component of FIG. 1. [Figure 3] FIG. 2 is a cross-sectional view taken along II' in FIG. [Figure 4] FIG. 4 is an enlarged view of a P1 region in FIG. 3. [Figure 5] FIG. 3 is an exploded perspective view schematically showing the main body of FIG. 2 in an exploded state. [Figure 6] 2 is a schematic perspective view of a substrate on which the multilayer electronic component of FIG. 1 is mounted. [Figure 7] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 8] FIG. 8 is a cross-sectional view taken along line II-II' in FIG. [Figure 9] FIG. 9 is an enlarged view of the P2 region in FIG. 8. [Figure 10] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 11] FIG. 11 is a cross-sectional view taken along the line III-III' in FIG. [Figure 12] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 13] FIG. 13 is a cross-sectional view taken along line IV-IV′ of FIG. [Figure 14] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 15] FIG. 15 is a cross-sectional view taken along the line VV′ of FIG. [Figure 16]1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 17] FIG. 17 is a cross-sectional view taken along line VI-VI' of FIG. [Figure 18] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 19] FIG. 19 is a cross-sectional view taken along line VII-VII′ of FIG. 18. [Figure 20] FIG. 20 is an enlarged view of the P3 region in FIG. 19. [Figure 21] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 22] FIG. 23 is a cross-sectional view taken along line VIII-VIII' in FIG. [Figure 23] This shows a modification of FIG. [Figure 24] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 25] FIG. 25 is a cross-sectional view taken along line IX-IX' of FIG. 24. [Figure 26] This shows a modification of FIG. [Figure 27] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 28] FIG. 28 is a cross-sectional view taken along the line XX′ of FIG. 27. [Figure 29] This shows a modification of FIG. [Figure 30] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 31] 31 is a cross-sectional view taken along line XI-XI' of FIG. 30. [Figure 32] This shows a modification of FIG. [Figure 33] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 34] FIG. 34 is a cross-sectional view taken along line XII-XII′ of FIG. 33. [Figure 35]1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 36] FIG. 36 is a cross-sectional view taken along line XIII-XIII' of FIG. 35. [Figure 37] This shows a modification of FIG. [Figure 38] This shows a modification of FIG. [Figure 39] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Figure 40] 39A is a cross-sectional view taken along line XIV-XIV' of FIG. 39. [Figure 41] FIG. 41 is an enlarged view of the K1 region in FIG. 40. DETAILED DESCRIPTION OF THE INVENTION

[0027] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0028] In order to clearly explain the present invention in the drawings, parts that are not relevant to the explanation have been omitted, and the size and thickness of each component shown in the drawings have been arbitrarily shown for the convenience of explanation, so the present invention is not necessarily limited to those shown. Components that have the same function within the same concept will be described using the same reference numerals. Furthermore, throughout the specification, when a part "comprises" a certain component, this does not mean that it excludes other components, but that it may further include other components, unless otherwise specified to the contrary.

[0029] In the drawings, the first direction can be defined as the stacking direction or thickness T direction, the second direction can be defined as the length L direction, and the third direction can be defined as the width W direction.

[0030] FIG. 1 is a schematic perspective view of a multilayer electronic component according to one embodiment of the present invention, FIG. 2 is a schematic perspective view of the main body of the multilayer electronic component of FIG. 1, FIG. 3 is a cross-sectional view taken along line II' of FIG. 1, FIG. 4 is an enlarged view of the P1 region of FIG. 3, FIG. 5 is a schematic exploded perspective view of the main body of FIG. 2, and FIG. 6 is a schematic perspective view of a substrate on which the multilayer electronic component of FIG. 1 is mounted.

[0031] A multilayer electronic component 1000 according to one embodiment of the present invention will now be described with reference to FIGS.

[0032] A multilayer electronic component 1000 according to one embodiment of the present invention may include a body 110 including a dielectric layer 111 and first and second internal electrodes 121, 122 arranged alternately on either side of the dielectric layer 111, and including first and second surfaces 1, 2 facing each other in a first direction, third and fourth surfaces 3, 4 connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces 5, 6 connected to the first to fourth surfaces and facing each other in the third direction.

[0033] 2 and 3, the body 110 is formed by alternately stacking dielectric layers 111 and internal electrodes 121 and 122.

[0034] Although there is no particular limitation on the specific shape of the body 110, the body 110 may be hexahedral or a similar shape as shown in the figure. Due to shrinkage of the ceramic powder contained in the body 110 during the firing process, the body 110 may have a substantially hexahedral shape, although not a hexahedral shape with perfectly straight lines.

[0035] The main body 110 may have first and second surfaces 1 and 2 facing each other in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and facing each other in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first and second surfaces 1 and 2 and connected to the third and fourth surfaces 3 and 4 and facing each other in the third direction.

[0036] In one embodiment, the main body 110 includes a 1-3 corner connecting the first surface and the third surface, a 1-4 corner connecting the first surface and the fourth surface, a 2-3 corner connecting the second surface and the third surface, and a 2-4 corner connecting the second surface and the fourth surface, and the 1-3 corner and the 2-3 corner may have a shape that is contracted toward the center of the main body in the first direction as they approach the third surface, and the 1-4 corner and the 2-4 corner may have a shape that is contracted toward the center of the main body in the first direction as they approach the fourth surface.

[0037] A marginal region where the internal electrodes 121, 122 are not disposed overlaps the dielectric layer 111, resulting in a step due to the thickness of the internal electrodes 121, 122, and the corners connecting the first surface and the third to fifth surfaces and / or the corners connecting the second surface and the third to fifth surfaces may have a shape that shrinks toward the center in the first direction of the main body 110 when viewed from the first surface or the second surface. Alternatively, due to shrinkage behavior during the sintering process of the main body, the corners connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, 6 and / or the corners connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, 6 may have a shape that shrinks toward the center in the first direction of the main body 110 when viewed from the first surface or the second surface. Alternatively, in order to prevent chipping defects, the corners connecting each surface of the main body 110 may be rounded through a separate process, so that the corners connecting the first surface and the third to sixth surfaces and / or the corners connecting the second surface and the third to sixth surfaces may have a rounded shape.

[0038] The corners may include a 1-3 corner connecting the first and third surfaces, a 1-4 corner connecting the first and fourth surfaces, a 2-3 corner connecting the second and third surfaces, and a 2-4 corner connecting the second and fourth surfaces. The corners may also include a 1-5 corner connecting the first and fifth surfaces, a 1-6 corner connecting the first and sixth surfaces, a 2-5 corner connecting the second and fifth surfaces, and a 2-6 corner connecting the second and sixth surfaces. The first to sixth surfaces of the main body 110 may be generally flat surfaces, and non-flat areas may be defined as corners. Hereinafter, the extension line of each surface may refer to a line extended from the flat portion of each surface.

[0039] In this case, the areas of the external electrodes 131, 132 arranged on the corners of the main body 110 can be called corner portions, the areas arranged on the third and fourth surfaces of the main body 110 can be called connection portions, and the areas arranged on the first and second surfaces of the main body can be called band portions.

[0040] On the other hand, in order to suppress steps caused by the internal electrodes 121, 122, if the laminated internal electrodes are cut so as to be exposed on the fifth and sixth surfaces 5, 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated in the third direction (width direction) on both side surfaces of the capacitance forming portion Ac to form margin portions 114, 115, the portions connecting the first surface to the fifth and sixth surfaces and the portions connecting the second surface to the fifth and sixth surfaces do not need to have a contracted shape.

[0041] The plurality of dielectric layers 111 forming the body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 may be so integrated that they are difficult to identify without the use of a scanning electron microscope (SEM).

[0042] According to an embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, or the like can be used. The barium titanate-based material can include BaTiO3-based ceramic powder. Examples of the ceramic powder include BaTiO3, (Ba1- x Ca x )TiO3 (0 < x < 1) in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x [[ID=第十二条]])(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc.

[0043] In addition, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to the raw material for forming the dielectric layer 111, such as powder of barium titanate (BaTiO3), according to the purpose of the present invention.

[0044] On the other hand, the average thickness td of the dielectric layer 111 does not need to be particularly limited.

[0045] However, generally, when the dielectric layer is formed thin with a thickness of less than 0.6 μm, especially when the thickness of the dielectric layer is 0.35 μm or less, there is a risk of reduced reliability.

[0046] According to an embodiment of the present invention, by disposing an insulating layer on the connection portion of the external electrode and disposing a plating layer on the band portion of the external electrode, it is possible to prevent moisture penetration from the outside, penetration of the plating solution, etc., and improve reliability. Therefore, even when the average thickness of the dielectric layer 111 is 0.35 μm or less, excellent reliability can be ensured.

[0047] Therefore, when the average thickness of the dielectric layer 111 is 0.35 μm or less, the effect of improving reliability according to the present invention can be more significant.

[0048] The average thickness td of the dielectric layer 111 may refer to the average thickness of the dielectric layer 111 disposed between the first and second internal electrodes 121 and 122.

[0049] The average thickness of the dielectric layer 111 can be measured by scanning an image of a cross section of the body 110 in the length and thickness direction LT using a scanning electron microscope (SEM) with a magnification of 10,000. More specifically, the thickness of any dielectric layer in the scanned image can be measured at 30 equally spaced points in the length direction to calculate an average value. The 30 equally spaced points can be designated as the capacitance forming portion Ac. Furthermore, by extending this average measurement to 10 dielectric layers, the average thickness of the dielectric layer can be further generalized.

[0050] The main body 110 may include a capacitance forming portion Ac that is arranged inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 that are arranged opposite each other across a dielectric layer 111 to form a capacitance, and cover portions 112 and 113 that are formed at the top and bottom of the capacitance forming portion Ac in a first direction.

[0051] The capacitance forming portion Ac is a portion that contributes to forming the capacitance of the capacitor, and may be formed by repeatedly laminating a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 sandwiched therebetween.

[0052] The cover parts 112 and 113 may include an upper cover part 112 disposed on an upper part of the capacitance forming part Ac in the first direction and a lower cover part 113 disposed on a lower part of the capacitance forming part Ac in the first direction.

[0053] The upper cover part 112 and the lower cover part 113 may be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the capacitance forming part Ac in the thickness direction, respectively, and may basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0054] The upper cover part 112 and the lower cover part 113 do not include an internal electrode and may include the same material as the dielectric layer 111 .

[0055] That is, the upper cover part 112 and the lower cover part 113 may include a ceramic material, for example, a barium titanate (BaTiO3) based ceramic material.

[0056] Meanwhile, the average thickness of the covers 112, 113 does not need to be particularly limited. However, to more easily achieve miniaturization and high capacity of the multilayer electronic component, the average thickness tc of the covers 112, 113 may be 15 μm or less. Furthermore, according to one embodiment of the present invention, by arranging an insulating layer on the connection portion of the external electrode and a plating layer on the band portion of the external electrode, it is possible to prevent penetration of moisture and plating solution from the outside and improve reliability, so that excellent reliability can be ensured even if the average thickness tc of the covers 112, 113 is 15 μm or less.

[0057] The average thickness tc of the cover parts 112, 113 may mean the size in the first direction, and may be the average value of the size in the first direction of the cover parts 112, 113 measured at five equally spaced points on the top or bottom of the capacitance forming part Ac.

[0058] Moreover, margin portions 114 and 115 can be arranged on the side surfaces of the capacitance forming portion Ac.

[0059] The margin portions 114, 115 may include a first margin portion 114 disposed on the fifth surface 5 of the body 110 and a second margin portion 115 disposed on the sixth surface 6. That is, the margin portions 114, 115 may be disposed on both end surfaces of the ceramic body 110 in the width direction.

[0060] The margin portions 114 and 115 may refer to the regions between both ends of the first and second internal electrodes 121 and 122 and the boundary surface of the body 110 in a cross-section of the body 110 cut along the width-thickness WT direction, as shown in FIG. 3.

[0061] The margin portions 114 and 115 basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0062] The margin portions 114 and 115 can be formed by applying a conductive paste to the ceramic green sheets except for the areas where the margin portions are to be formed, to form internal electrodes.

[0063] In addition, in order to suppress steps caused by the internal electrodes 121, 122, the laminated internal electrodes can be cut so as to be exposed on the fifth and sixth surfaces 5, 6 of the main body, and then a single dielectric layer or two or more dielectric layers can be laminated in the third direction (width direction) on both side surfaces of the capacitance forming portion Ac to form margin portions 114, 115.

[0064] Meanwhile, the width of the margin portions 114, 115 does not need to be particularly limited. However, to more easily achieve miniaturization and high capacity of the multilayer electronic component, the average width of the margin portions 114, 115 may be 15 μm or less. Furthermore, according to one embodiment of the present invention, by arranging an insulating layer on the connection portion of the external electrode and a plating layer on the band portion of the external electrode, it is possible to prevent penetration of moisture and plating solution from the outside and improve reliability, so that excellent reliability can be ensured even if the average width of the margin portions 114, 115 is 15 μm or less.

[0065] The average width of the margin portions 114, 115 may mean the average size of the margin portions 114, 115 in the third direction, and may be the average value of the size of the margin portions 114, 115 in the third direction measured at five equally spaced points on the side of the capacitance forming portion Ac.

[0066] The internal electrodes 121 and 122 are stacked alternately with the dielectric layers 111 .

[0067] The internal electrodes 121, 122 may include first and second internal electrodes 121, 122. The first and second internal electrodes 121, 122 are alternately arranged to face each other across the dielectric layer 111 constituting the body 110, and may be exposed to the third and fourth surfaces 3, 4 of the body 110, respectively.

[0068] 3, the first internal electrode 121 may be spaced apart from the fourth surface 4 and exposed to the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and exposed to the fourth surface 4. A first external electrode 131 may be disposed on the third surface 3 of the main body and connected to the first internal electrode 121, and a second external electrode 132 may be disposed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0069] That is, the first internal electrode 121 is not connected to the second external electrode 132 but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131 but is connected to the second external electrode 132. Therefore, the first internal electrodes 121 can be formed at a predetermined distance apart on the fourth surface 4, and the second internal electrodes 122 can be formed at a predetermined distance apart on the third surface 3.

[0070] At this time, the first and second internal electrodes 121 and 122 may be electrically isolated from each other by the dielectric layer 111 disposed therebetween.

[0071] The body 110 may be formed by alternately stacking ceramic green sheets on which the first internal electrodes 121 are printed and ceramic green sheets on which the second internal electrodes 122 are printed, and then firing the stacked sheets.

[0072] There are no particular limitations on the material forming the internal electrodes 121 and 122, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can contain one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0073] The internal electrodes 121 and 122 may be formed by printing a conductive paste for internal electrodes containing at least one of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof onto a ceramic green sheet. The conductive paste for internal electrodes may be printed by screen printing or gravure printing, but the present invention is not limited thereto.

[0074] On the other hand, the average thickness te of the internal electrodes 121, 122 does not need to be particularly limited.

[0075] However, in general, when the internal electrodes are formed thinly, with a thickness of less than 0.6 μm, there is a risk of reliability decreasing, especially when the thickness of the internal electrodes is 0.35 μm or less.

[0076] According to one embodiment of the present invention, an insulating layer is placed on the connection portion of the external electrode and a plating layer is placed on the band portion of the external electrode, thereby preventing the penetration of moisture and plating solution from the outside and improving reliability, and therefore excellent reliability can be ensured even if the average thickness of the internal electrodes 121, 122 is 0.35 μm or less.

[0077] Therefore, when the thickness of the internal electrodes 121, 122 is 0.35 μm or less on average, the effect of the present invention becomes more pronounced, and the ceramic electronic component can be more easily miniaturized and have a higher capacity.

[0078] The average thickness te of the internal electrodes 121 and 122 may refer to the average thickness of the internal electrodes 121 and 122.

[0079] The average thickness of the internal electrodes 121, 122 can be measured by scanning an image of a cross section of the body 110 in the length and thickness direction LT using a scanning electron microscope (SEM) with a magnification of 10,000. More specifically, the thickness of any internal electrode in the scanned image can be measured at 30 equally spaced points in the length direction to calculate an average value. The 30 equally spaced points can be designated as the capacitance forming portion Ac. Furthermore, by extending this average measurement to 10 internal electrodes, the average thickness of the internal electrodes can be further generalized.

[0080] The external electrodes 131 and 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110. The external electrodes 131 and 132 may include first and second external electrodes 131 and 132 disposed on the third and fourth surfaces 3 and 4 of the body 110, respectively, and connected to the first and second internal electrodes 121 and 122, respectively.

[0081] The external electrodes 131 and 132 may include a first external electrode 131 including a first connection portion 131a disposed on the third surface and a first band portion 131b extending from the first connection portion to a portion of the first surface, and a second external electrode 132 including a second connection portion 132a disposed on the fourth surface and a second band portion 132b extending from the second connection portion to a portion of the first surface. The first connection portion 131a may be connected to the first internal electrode 121 on the third surface, and the second connection portion 132a may be connected to the second internal electrode 122 on the fourth surface.

[0082] The first external electrode 131 may include a third band portion 131c extending from the first connection portion 131a to a portion of the second surface, and the second external electrode 132 may include a fourth band portion 132c extending from the second connection portion 132a to a portion of the second surface. The first external electrode 131 may include a first side band portion extending from the first connection portion 131a to a portion of the fifth and sixth surfaces, and the second external electrode 132 may include a second side band portion extending from the second connection portion 132a to a portion of the fifth and sixth surfaces.

[0083] However, the third band portion, the fourth band portion, the first side band portion, and the second side band portion may not be essential components of the present invention. The first and second external electrodes 131 and 132 may not be arranged on the second surface, nor on the fifth and sixth surfaces. Since the first and second external electrodes 131 and 132 are not arranged on the second surface, the first and second external electrodes 131 and 132 may be arranged below an extension of the second surface of the main body. Furthermore, the first and second connecting portions 131a and 132a may be arranged spaced apart from the fifth and sixth surfaces, and the first and second connecting portions 131a and 132a may be arranged spaced apart from the second surface. Furthermore, the first and second band portions 131b and 132b may be arranged spaced apart from the fifth and sixth surfaces.

[0084] Meanwhile, when the first and second external electrodes 131, 132 include the third and fourth band portions 131c, 132c, an insulating layer is illustrated disposed on the third and fourth band portions 131c, 132c, but this is not limited thereto, and a plating layer may be disposed on the third and fourth band portions 131c, 132c to improve ease of mounting. Furthermore, the first and second external electrodes 131, 132 may include the third and fourth band portions 131c, 132c but may not include side band portions, in which case the first and second connection portions 131a, 132a and the first to fourth band portions 131a, 132b, 131c, 132c may be spaced apart from the fifth and sixth surfaces.

[0085] In this embodiment, the ceramic electronic component 100 has a structure including two external electrodes 131 and 132, but the number and shape of the external electrodes 131 and 132 may vary depending on the configuration of the internal electrodes 121 and 122 and other purposes.

[0086] Meanwhile, the external electrodes 131 and 132 may be formed using any material that has electrical conductivity, such as a metal, and the specific material may be determined in consideration of electrical properties, structural stability, etc., and may further have a multi-layer structure.

[0087] The external electrodes 131 and 132 may be firing electrodes containing a conductive metal and glass, or resin-based electrodes containing a conductive metal and resin.

[0088] The external electrodes 131 and 132 may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body, or by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0089] The conductive metal contained in the external electrodes 131, 132 may be any material with excellent electrical conductivity, and is not particularly limited. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and alloys thereof. Preferably, the external electrodes 131, 132 may contain one or more of Ni and Ni alloys, thereby further improving connectivity with the internal electrodes 121, 122 containing Ni.

[0090] An insulating layer 151 may be disposed on the first and second connection portions 131a and 132a.

[0091] The first and second connection portions 131a and 132a are portions connected to the internal electrodes 121 and 122, and therefore may become paths for the penetration of plating solution during the plating process or moisture in actual use. In the present invention, an insulating layer 151 is disposed on the connection portions 131a and 132a, thereby preventing the penetration of moisture or plating solution from the outside.

[0092] The insulating layer 151 may be disposed to be in contact with the first and second plating layers 141 and 142. In this case, the insulating layer 151 may be in contact with the first and second plating layers 141 and 142 in a manner that partially covers the ends of the insulating layer 151, or the first and second plating layers 141 and 142 may be in contact with the insulating layer 151 in a manner that partially covers the ends of the insulating layer 151.

[0093] The insulating layer 151 may be disposed on the first and second connecting portions 131a and 132a and may be disposed to cover the second surface and the third and fourth band portions 131c and 132c. In this case, the insulating layer 151 may be disposed to cover the regions of the second surface where the third and fourth band portions 131c and 132c are not disposed and the third and fourth band portions 131c and 132c. As a result, the insulating layer 151 covers the regions where the ends of the third and fourth band portions 131c and 132c contact the main body 110, blocking a path for moisture penetration and further improving moisture resistance reliability.

[0094] The insulating layer 151 may be disposed on the second surface and extended to the first and second connection portions 131a and 132a. If the external electrodes 131 and 132 are not disposed on the second surface, the insulating layer may be disposed to cover the entire second surface. Meanwhile, the insulating layer 151 does not necessarily have to be disposed on the second surface. The insulating layer may be disposed on part or all of the second surface. Alternatively, the insulating layer may be divided into two parts, each disposed on the first and second connection portions 131a and 132a. If the insulating layer is not disposed on the entire second surface, it may be disposed below an extension of the second surface. If the insulating layer is not disposed on the second surface, it may extend to the fifth and sixth surfaces on the first and second connection portions 131a and 132a to form a single insulating layer.

[0095] Furthermore, the insulating layer 151 may be disposed to cover the first and second side band portions and parts of the fifth and sixth surfaces. In this case, parts of the fifth and sixth surfaces that are not covered by the insulating layer 151 may be exposed to the outside.

[0096] Furthermore, insulating layer 151 may be arranged to cover all of the first and second side band portions and the fifth and sixth surfaces, in which case moisture resistance reliability can be improved because the fifth and sixth surfaces are not exposed to the outside, and connection portions 131a, 132a are not directly exposed to the outside either, improving the reliability of multilayer electronic component 1000. More specifically, the insulating layer may cover all of the first and second side band portions and cover all of the areas of the fifth and sixth surfaces except for the areas where the first and second side band portions are formed.

[0097] The insulating layer 151 can prevent the formation of plating layers 141 and 142 on the external electrodes 131 and 132 on which the insulating layer 151 is disposed, and can also improve sealing properties to minimize penetration of moisture, plating solution, etc. from the outside.

[0098] The laminated electronic component 1000 according to one embodiment of the present invention may include an insulating layer 151 disposed on the second surface 2 and extending to a portion of the first and second connection portions 131a, 132a.

[0099] The insulating layer 151 is preferably disposed on the second surface 2 and extends to the first connecting portion 131a, the second connecting portion 132a, a portion of the fifth surface 5, and a portion of the sixth surface 6, so as to be in contact with the plating layers 141 and 142. Therefore, the insulating layer 151 simultaneously surrounds a portion of the first and second external electrodes 131 and 132 and a portion of the body 110, thereby protecting the multilayer electronic component 1000 from plating solution, moisture, and external impact.

[0100] In addition, since the first and second external electrodes 131, 132 and the main body 110 do not surround the entire surface but only a portion thereof, plating layers 141, 142 can be formed on the first and second external electrodes 131, 132, and the structure can be mounted on the substrate 180.

[0101] That is, the multilayer electronic component 1000 according to an embodiment of the present invention may include plating layers 141 and 142 disposed on the first and second band portions 131b and 132b.

[0102] The insulating layer 151 may include, but is not limited to, a glass material having excellent resistance to plating solutions, such as a glass material containing Si, and may be made of a material having a strength sufficient to protect the multilayer electronic component 1000 from tensile stress caused by thermal contraction. The insulating layer 151 may include a single component or multiple components, and more preferably, may include one or more additives selected from TiO2, BaTiO3, Al2O3, SiO2, BaO, etc. to improve bonding strength with the main body 100 or the external electrodes 131, 132.

[0103] The method for forming the insulating layer 151 may vary depending on the ingredients and purpose. For example, the insulating layer 151 may be formed by applying an insulating paste using a squeegee to form a film, then disposing the external electrodes 131 and 132 on the body 110, immersing each cross section in turn, and drying at a temperature of 150°C. Alternatively, the insulating layer 151 may be formed by a sol-gel process, a chemical vapor deposition (CVD), an atomic layer deposition (ALD), or the like, but is not limited thereto, and may be formed by any other method capable of forming a thin and uniform insulating layer.

[0104] In one embodiment, the insulating layer 151 is disposed so as to be in direct contact with the first and second external electrodes 131, 132, and the first and second external electrodes 131, 132 may include a conductive metal and glass. As a result, the plating layers 141, 142 may not be disposed in the areas of the outer surfaces of the first and second external electrodes 131, 132 where the insulating layer 151 is disposed, thereby effectively preventing corrosion of the external electrodes by a plating solution.

[0105] In this case, the first plating layer 141 can be disposed so as to cover the end of the insulating layer 151 disposed on the first external electrode 131, and the second plating layer 142 can be disposed so as to cover the end of the insulating layer 151 disposed on the second external electrode 132. By forming the insulating layer 151 before forming the plating layers 141, 142 on the external electrodes 131, 132, it is possible to more reliably suppress penetration of the plating solution during the plating layer formation process. By forming the insulating layer before the plating layer, it is possible for the plating layers 141, 142 to have a shape that covers the end of the insulating layer 151.

[0106] In one embodiment, the insulating layer 151 is disposed so as to be in direct contact with the first and second external electrodes 131, 132, and the first and second external electrodes 131, 132 may contain a conductive metal and a resin. As a result, the plating layers 141, 142 may not be disposed in the areas of the outer surfaces of the first and second external electrodes 131, 132 where the insulating layer 151 is disposed, thereby effectively preventing corrosion of the external electrodes by the plating solution.

[0107] In this case, the first plating layer 141 can be arranged to cover the end of the insulating layer 151 that is arranged on the first external electrode 131, and the second plating layer 142 can be arranged to cover the end of the insulating layer 151 that is arranged on the second external electrode 132. By forming the insulating layer 151 before forming the plating layers 141, 142 on the external electrodes 131, 132, it is possible to more reliably suppress the penetration of the plating solution during the plating layer formation process.

[0108] The first and second plating layers 141 and 142 may be disposed on the first and second band portions 131b and 132b, respectively. The plating layers 141 and 142 may serve to improve mounting characteristics, and by disposing the plating layers 141 and 142 on the band portions 131b and 132b, mounting space may be minimized and reliability may be improved by minimizing penetration of a plating solution into the internal electrodes. One end of the first and second plating layers 141 and 142 may contact the first surface, and the other end may contact the insulating layer 151.

[0109] The type of plating layers 141 and 142 is not particularly limited, and may be a plating layer containing one or more of Cu, Ni, Sn, Ag, Au, Pd, and alloys thereof, and may be made up of a plurality of layers.

[0110] To give a more specific example of the plating layers 141 and 142, the plating layers 141 and 142 may be Ni plating layers or Sn plating layers, and may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the first and second band portions 131b and 132b.

[0111] There is no particular limitation on the method for forming the plating layers 141 and 142. However, in order to improve adhesion, the plating layers 141 and 142 may be formed after forming the insulating layer 151. The plating layers 141 and 142 may be formed by any one of a wet plating method, an electroplating method, and an electroless plating method, but are not limited thereto and may be formed by any other method as long as it can form a highly pure and uniform plating layer.

[0112] In one embodiment, the plating layers 141 and 142 may be disposed to extend to a portion of the first and second connection portions 131a and 132a. That is, the plating layers 141 and 142 may be disposed on the first and second band portions 131b and 132b and may extend to a portion of the first and second connection portions 131a and 132a to contact the insulating layer 151.

[0113] In Patent Document 1, in order to prevent cracks from occurring in the multilayer electronic component due to thermal contraction of the solder fillet, a glass layer is provided directly on one main surface of the element body, and is provided directly on the sintered body layer on each cross-sectional side so as to extend in a direction perpendicular to the side surface, constituting a part of the surface of the external electrode, and a metal layer is provided so as to cover the sintered body layer other than the part covered by the glass layer for mounting by the solder fillet, constituting another part of the surface of the external electrode.

[0114] The glass layer of Patent Document 1 is made of a glass material with excellent resistance to plating solutions, and has a Si content of 20 mol % to 65 mol %. On the other hand, Patent Document 1 discloses that if the Si molar fraction is less than 20 mol %, the resistance to plating solutions is insufficient, and if it exceeds 65 mol %, the glass softening point increases, the wettability to the sintered body layer decreases, and the glass layer becomes more likely to peel off.

[0115] Generally, glass layers made of glass materials containing Si are made of insulating materials regardless of the Si content, and have the problem of weak adhesion to metal plating layers and external electrodes. As a result, residual stress generated during the manufacturing process or external impacts can cause delamination in multilayer electronic components, potentially reducing the overall resistance of the multilayer electronic component to external impacts.

[0116] In particular, the structure disclosed in Patent Document 1 has a structure in which a glass layer and a metal layer are simply connected with the same or substantially the same thickness, which may further cause the above-mentioned problems, and this may lead to a decrease in bonding strength when mounting a multilayer electronic component to a substrate by soldering.

[0117] In the following, the correlation between the plating layers 141, 142, the insulating layer 151, and the first and second connecting portions 131a, 132a in the laminated electronic component 1000 according to one embodiment of the present invention will be explained using the first connecting portion 131a as a reference, and a description of the case where the second connecting portion 132a is used as a reference will be omitted because it overlaps with the case where the first connecting portion 131a is used as a reference.

[0118] 4, the insulating layer 151 according to an embodiment of the present invention may be disposed so that its thickness gradually decreases toward its end. Preferably, the insulating layer 151 may be disposed so that the distance between both ends in the length direction gradually decreases toward its end. As a result, a gap may be disposed between the insulating layer 151 and the first connecting portion 131a.

[0119] The plating layer 141 may include an end portion that contacts the insulating layer 151 and may be divided into two regions.

[0120] An end of the plating layer 141 may include a first region S1 disposed extending between the insulating layer 151 and the first connecting portion 131a, and may include a second region S2 disposed extending to cover the insulating layer 151. The first region S1 may be a region of the end of the plating layer disposed extending between the insulating layer 151 and the first connecting portion 131a. Therefore, the first region S1 and the second region S2 may be disposed connected to each other.

[0121] The first region S1 is a region where the plating layer 151 comes into direct contact with the first connection portion 131a, and therefore can have a significant effect on improving the adhesive strength.

[0122] The second region S2 may be an end region of the plating layer that is disposed to extend to cover the insulating layer 151. That is, the second region S2 may play a role in physically connecting the insulating layer 151 and the plating layer 141.

[0123] By including the first region S1 at the end of the plating layer 151, the area of ​​contact between the plating layer 151 and the first connection portion 131a can be increased, thereby improving the adhesive strength between the plating layer 151 and the first connection portion 131a.

[0124] In addition, by including the second region S2 at the end of the plating layer, an anchoring effect can be generated between the insulating layer 151 and the insulating layer 141, thereby improving the physical bonding force. More preferably, by disposing the insulating layer 151 between the first region S1 and the second region S2, the anchoring effect can be further improved.

[0125] In the multilayer electronic component 1000 according to one embodiment of the present invention, the thickness of the insulating layer 151 gradually decreases toward its end in the region where the plating layers 141, 142 and the insulating layer 151 contact each other, and the ends of the plating layers 141, 142 include a first region extending between the insulating layer 151 and the first and second connecting portions 131a, 132a and a second region extending to cover the insulating layer 151. This improves the physical bonding strength of the plating layers 141, the insulating layer 151, and the first connecting portion 131a even though the insulating layer is made of a material having an insulating component, thereby improving the overall strength of the multilayer electronic component 1000. This improves the resistance of the multilayer electronic component 1000 to external impacts and prevents a decrease in bonding strength when the multilayer electronic component 1000 is mounted on a board by soldering.

[0126] In one embodiment, when the maximum length of the first region S1 in the first direction is a1 and the maximum length of the second region S2 in the first direction is a2, a1 > a2 can be satisfied. If a2 is greater than a1, the contact area of ​​the plating layer 141 with the insulating layer 151 is greater than the contact area of ​​the plating layer 141 with the first connecting portion 131a, which may result in insufficient adhesion between the plating layer 141, the insulating layer 151, and the first connecting portion 131a. In one embodiment, satisfying a1 > a2 increases the length or area of ​​contact between the plating layer 141 and the first connecting portion 131a, thereby minimizing the contact area between the plating layer 141 and the insulating layer 151 and further improving the physical bonding strength. This further improves the overall strength of the multilayer electronic component 1000.

[0127] Meanwhile, a1 is the maximum length of the first region S1 in the first direction and may refer to the distance from the end of the insulating layer 151 to the point where the gap between the insulating layer 151 and the connecting portions 131a and 132a begins. Also, a2 is the maximum length of the second region S2 in the first direction and may refer to the distance from the end of the insulating layer to the end of the second region covering the end of the insulating layer 151.

[0128] The above a1 and a2 may be average values ​​measured at 10 first-direction-second-direction cross sections cut at equal intervals in the third direction.

[0129] There may be various methods for making the end of the plating layer include the first region S1 and the second region S2. For example, when the insulating layer 151 is formed by a dipping method, the first region S1 and the second region S2 may be formed by controlling the shape of a plastic carrier plate or a rubber zig that fixes the upper part of the multilayer electronic component.

[0130] Specifically, after the ends of the plastic carrier or rubber zig are formed to have shapes corresponding to the first region S1 and the second region S2, the multilayer electronic component is fixed and immersed in the insulating paste. In this case, the insulating layer is formed in the areas not occupied by the plastic carrier or rubber zig, so the insulating layer does not need to be formed in the areas corresponding to the first region S1 and the second region S2.

[0131] After immersing the multilayer electronic component in the insulating paste, it is dried at a temperature of approximately 150°C. After separating the multilayer electronic component from the plastic carrier and rubber zig, a plating layer is formed on the areas where no insulating layer is to be formed, as described below.

[0132] At this time, the plating solution penetrates into the area where the ends of the plastic carrier and rubber zig were located, so that the ends of the plating layer can form a first area S1 and a second area S2.

[0133] In this case, the thickness of the plating layer can be adjusted by changing the amount of plating solution and plating conditions, and the maximum length a1 in the first direction of the first region and the maximum length a2 in the first direction of the second region can be adjusted by adjusting the shape of the end of the plastic carrier and rubber zig.

[0134] Meanwhile, the order in which the insulating layer 151 and the plating layer 141 are formed does not need to be particularly limited, but after the insulating layer 151 is formed, the plating layer 151 is formed on the connection portions 131a, 132a or band portions 131b, 132b of the external electrodes 131, 132 where the insulating layer 151 is not disposed, thereby minimizing the occurrence of gaps between the plating layers 141, 142 and the insulating layer 151.

[0135] The size of the multilayer electronic component 1000 does not need to be particularly limited.

[0136] However, in order to simultaneously achieve miniaturization and high capacitance, the thickness of the dielectric layers and internal electrodes must be reduced and the number of layers must be increased. Therefore, the effects of improving reliability and capacitance per unit volume according to the present invention can be more pronounced in multilayer electronic components 1000 having a size of 1005 (length x width, 1.0 mm x 0.5 mm) or less.

[0137] Therefore, taking into consideration manufacturing errors, the size of the external electrodes, etc., the reliability improvement effect according to the present invention may be more pronounced when the length of the ceramic electronic component 100 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the multilayer electronic component 1000 may refer to the size of the multilayer electronic component 1000 in the second direction, and the width of the multilayer electronic component 1000 may refer to the size of the multilayer electronic component 1000 in the third direction. Referring to FIG. 6 which illustrates a mounting substrate 1100 on which the multilayer electronic component 1000 is mounted, plating layers 141 and 142 of the multilayer electronic component 1000 may be joined to electrode pads 181 and 182 arranged on a substrate 180 by solders 191 and 192.

[0138] A multilayer electronic component 1001 according to another embodiment of the present invention will be described below, but content that overlaps with the electronic component 1000 according to one embodiment of the present invention will be omitted.

[0139] FIG. 7 is a schematic perspective view of a multilayer electronic component 1001 according to one embodiment of the present invention, FIG. 8 is a cross-sectional view taken along line II-II' in FIG. 7, and FIG. 9 is an enlarged view of region P2 in FIG. 8.

[0140] 7 to 9 , a multilayer electronic component 1001 according to another embodiment of the present invention may include an insulating layer 151-1 disposed on the second surface 2 and the first and second connection portions 131a and 132a and extending to a portion of the first and second band portions 131b and 132b, and plating layers 141-1 and 142-1 disposed on the first and second band portions 131b and 132b and in contact with the insulating layer 151-1. Furthermore, in the region where the insulating layer and the plating layer contact each other, the insulating layer gradually becomes thinner toward its end, and the end of the plating layer may include a third region extending between the insulating layer and the first and second band portions and a fourth region extending to cover the insulating layer. This minimizes the height of the solder during mounting, thereby minimizing the mounting space.

[0141] 9, the insulating layer 151-1 of the multilayer electronic component 1001 according to another embodiment of the present invention may be disposed so that its thickness gradually decreases from the top of the first and second band portions 131b and 132b toward the ends. The insulating layer 151-1 may preferably be disposed so that the distance between both ends in the length direction gradually decreases toward the ends. As a result, gaps may be formed between the insulating layer 151-1 and the first and second band portions 131a.

[0142] In the following, the first band portion 131b will be used as a reference, and a description of the case where the second band portion 132b is used as a reference will be omitted since it is similar to the case where the first band portion 131b is used as a reference.

[0143] The plating layer 141-1 may include an end portion that contacts the insulating layer 151-1 and may be divided into two regions.

[0144] The end of the plating layer 141-1 may include a third region S3 extending between the insulating layer 151-1 and the first band portion 131b, and may include a fourth region S4 extending to cover the insulating layer 151-1. The third region S3 may be a region at the end of the plating layer extending between the insulating layer 151-1 and the first band portion 131b. Therefore, the third region S3 and the fourth region S4 may be connected to each other.

[0145] The third region S3 is a region where the plating layer 151-1 comes into direct contact with the first band portion 131b, and therefore can have a significant effect on improving the adhesive strength.

[0146] The fourth region S4 may be an end region of the plating layer that extends to cover the insulating layer 151-1, i.e., the fourth region S4 may serve to physically connect the insulating layer 151-1 and the plating layer 141-1.

[0147] By including the third region S3 at the end of the plating layer 151-1, the contact area between the plating layer 151-1 and the first band portion 131b can be increased, thereby improving the adhesive strength between the plating layer 151-1 and the first band portion 131b.

[0148] In addition, by including the fourth region S2 at the end of the plating layer, an anchoring effect is generated between the insulating layer 151-1 and the insulating layer 141-1, thereby improving the physical bonding force. More preferably, by disposing the insulating layer 151-1 between the third region S3 and the fourth region S4, the anchoring effect can be further improved.

[0149] According to a multilayer electronic component 1001 according to another embodiment of the present invention, in the region where the plating layers 141-1, 142-1 and the insulating layer 151-1 contact each other, the thickness of the insulating layer 151-1 gradually decreases toward the end, and the ends of the plating layers 141, 142 include a first region extending between the insulating layer 151 and the first and second band portions 131b, 132b and a second region extending to cover the insulating layer 151. This improves the physical bonding strength of the plating layer 141, the insulating layer 151, and the connecting portions 131b, 132b, thereby improving the strength of the entire multilayer electronic component 1001.

[0150] In one embodiment, when the maximum length of the third region S3 in the second direction is a3 and the maximum length of the fourth region S4 in the second direction is a4, a3>a4 may be satisfied. If a4 is greater than a3, the contact area of ​​the plating layer 141-1 with the insulating layer 15-1 is greater than the contact area of ​​the plating layer 141-1 with the first band portion 131b, which may result in insufficient adhesion between the plating layer 141-1, the insulating layer 151-1, and the first connecting portion 131b. In one embodiment, satisfying a3>a4 increases the length or area of ​​contact between the plating layer 141-1 and the first connecting portion 131b, thereby minimizing the contact area between the plating layer 141-1 and the insulating layer 151-1 and further improving physical bonding strength. This further improves the overall strength of the multilayer electronic component 1001.

[0151] Meanwhile, a3 is the maximum length of the third region S3 in the second direction and may refer to the distance from the end of the insulating layer 151-1 to the point where the gap between the insulating layer 151-1 and the band portions 131b and 132b begins, and a4 is the maximum length of the fourth region S4 in the second direction and may refer to the distance from the end of the insulating layer 151-1 to the end of the fourth region covering the end of the insulating layer 151-1.

[0152] The above a3 and a4 may be average values ​​measured at 10 first-direction-second-direction cross sections cut at equal intervals in the third direction.

[0153] In one embodiment, when the size of the main body 110 in the second direction is L, the average distance in the second direction from the extension of the third surface to the end of the first band portion is B1, and the average distance in the second direction from the extension of the fourth surface to the end of the second band portion is B2, the following relationships can be satisfied: 0.2≦B1 / L≦0.4 and 0.2≦B2 / L≦0.4.

[0154] If B1 / L and B2 / L are less than 0.2, it may be difficult to ensure sufficient bonding strength. On the other hand, if B2 / L is more than 0.4, leakage current may occur between the first band portion 131b and the second band portion 132b under high voltage, and the first band portion 131b and the second band portion 132b may be electrically connected due to plating bleeding during the plating process.

[0155] On the other hand, when the internal electrodes 121, 122 are stacked in the first direction, the multilayer electronic component 1000 can be horizontally mounted on the substrate 180 so that the internal electrodes 121, 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting, and when the internal electrodes 121, 122 are stacked in the third direction, the multilayer electronic component can be vertically mounted on the substrate so that the internal electrodes 121, 122 are perpendicular to the mounting surface.

[0156] Hereinafter, a multilayer electronic component according to another embodiment of the present invention will be described, but content that overlaps with the multilayer electronic component according to the embodiment 1000 of the present invention or another embodiment will be omitted.

[0157] FIG. 10 is a schematic perspective view of a multilayer electronic component 1002 according to one embodiment of the present invention, and FIG. 11 is a cross-sectional view taken along line III-III' in FIG.

[0158] 10 and 11, a multilayer electronic component 1002 according to an embodiment of the present invention may further include an additional insulating layer 161 disposed on the first surface 1 and between the first band portion 131b and the second band portion 132b, thereby preventing leakage current that may occur between the first band portion 131b and the second band portion 132b under high voltage.

[0159] The type of the additional insulating layer 161 does not need to be particularly limited. For example, it can contain the same components as the insulating layer 151. On the other hand, the additional insulating layer 161 and the insulating layer 151 do not need to be formed of the same material and can be formed of different materials. For example, the additional insulating layer 161 can contain one or more thermosetting resins selected from epoxy resins, acrylic resins, etc. Further, the additional insulating layer 161 can contain, as additives, one or more selected from TiO2, BaTiO3, Al2O3, SiO2, BaO, etc. in addition to the polymer resin. Thereby, the bonding strength with the main body or the external electrode can be improved.

[0160] FIG. 12 schematically shows a perspective view of a multilayer electronic component 1003 according to an embodiment of the present invention, and FIG. 13 is a cross-sectional view taken along the line IV-IV' of FIG. 12.

[0161] Referring to FIGS. 12 and 13, in the multilayer electronic component 1003 according to an embodiment, when the average distance in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average distance in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-3 and 142-3 disposed on the first and second connection portions 131a and 132a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased to improve the fixing strength.

[0162] More preferably, when the average size of the main body 110 in the first direction is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is T / 2 or more, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0163] H1, H2, and T can be the values obtained by averaging the values measured in the cross-section (L-T cross-section) obtained by cutting the main body 110 at five equally spaced points in the third direction in the first and second directions. H1 can be the value obtained by averaging the values measured at the points where the internal electrode closest to the first surface 1 is connected to the external electrode in each cross-section, H2 can be the value obtained by averaging the values measured with reference to the end of the plating layer in contact with the external electrode in each cross-section, and the extension line of the first surface used as a reference during the measurement of H1 and H2 can be the same. Also, T can be the value obtained by measuring and averaging the maximum size of the main body 110 in the first direction in each cross-section.

[0164] FIG. 14 schematically shows a perspective view of a multilayer electronic component 1004 according to an embodiment of the present invention, and FIG. 15 is a cross-sectional view taken along V-V' of FIG. 14.

[0165] Referring to FIGS. 14 and 15, in the multilayer electronic component 1004 according to an embodiment of the present invention, the average distance B1 of the first band portion 131b-4 can be longer than the average distance B3 of the third band portion 131c-4, and the average length of the second band portion 132b-4 can be longer than the average distance B4 of the fourth band portion 132c-4. Thereby, the area in contact with solder during mounting can be increased to improve the fixing strength.

[0166] More specifically, when the average distance in the second direction from the extension line of the third surface 3 to the end of the first band portion 131b-4 is B1, the average distance in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 132b-4 is B2, the average distance in the second direction from the extension line of the third surface 3 to the end of the third band portion 131c-4 is B3, and the average distance in the second direction from the extension line of the fourth surface 4 to the end of the fourth band portion 132c-4 is B4, B3 < B1 and B4 < B2 can be satisfied.

[0167] At this time, when the average size of the main body 110 in the second direction is L, 0.2 ≦ B1 / L ≦ 0.4 and 0.2 ≦ B2 / L ≦ 0.4 can be satisfied.

[0168] B1, B2, B3, B4, and L may be average values ​​measured on a cross section (LT cross section) of the main body 110 cut in the first and second directions at five points equally spaced in the third direction.

[0169] The first external electrode 131-4 may include a first side band portion extending from the first connection portion 131a-4 to portions of the fifth and sixth surfaces, and the second external electrode 132-4 may include a second side band portion extending from the second connection portion 132a-4 to portions of the fifth and sixth surfaces. The sizes of the first and second side band portions in the second direction may gradually increase toward the first surface. That is, the first and second side band portions may be arranged in a tapered or trapezoidal shape.

[0170] Furthermore, when the average distance in the second direction from an extension of the third surface to an end of the third band portion 131c-4 is B3, the average distance in the second direction from an extension of the fourth surface to an end of the fourth band portion 132c-4 is B4, the average size in the second direction of the region where the third surface and the second internal electrode 122 are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode 121 are separated is G2, it is possible to satisfy B3≦G1 and B4≦G2. This makes it possible to minimize the volume occupied by the external electrodes and increase the capacitance per unit volume of the multilayer electronic component 1004.

[0171] The above G1 and G2 can be defined as the average value of the size in the second direction measured up to the third plane for any five second internal electrodes located at the center in the first direction in a cross section of the body cut in the first and second directions at the center in the third direction, and G1 can be defined as the average value of the size in the second direction of the area measured up to the fourth plane for any five first internal electrodes located at the center in the first direction.

[0172] Furthermore, G1 and G2 can be obtained by cutting the main body 110 in the first and second directions at five points equally spaced in the third direction (LT cross section), and the average values ​​can be further generalized as G1 and G2.

[0173] However, it is not intended to limit the present invention to B3≦G1 and B4≦G2, and a case where B3≧G1 and B4≧G2 are satisfied can also be included as an embodiment of the present invention. Thus, in one embodiment, when the average distance in the second direction from an extension of the third surface to an end of the third band portion is B3, the average distance in the second direction from an extension of the fourth surface to an end of the fourth band portion is B4, the average size in the second direction of the region where the third surface and the second internal electrode are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode are separated is G2, it is possible to satisfy B3≧G1 and B4≧G2.

[0174] In one embodiment, when the average distance in the second direction from an extension of the third surface E3 to the end of the first band portion is B1 and the average distance in the second direction from an extension of the fourth surface E3 to the end of the second band portion is B2, B1 ≧ G1 and B2 ≧ G2 can be satisfied, thereby improving the adhesive strength of the multilayer electronic component 1004 to the substrate 180.

[0175] FIG. 16 is a schematic perspective view of a multilayer electronic component 1005 according to one embodiment of the present invention, and FIG. 17 is a cross-sectional view taken along line VI-VI' in FIG.

[0176] 16 and 17, the first and second external electrodes 131-5 and 132-5 of a multilayer electronic component 1005 according to an embodiment of the present invention may be arranged on the third, fourth, and first surfaces, rather than on the second surface, and may have an L-shape. That is, the first and second external electrodes 131-5 and 132-5 may be arranged below an extension of the second surface.

[0177] The first external electrode 131-5 may include a first connecting portion 131a-5 disposed on the third surface 3 and a first band portion 131b-5 extending from the first connecting portion 131a-5 to a portion of the first surface 1, and the second external electrode 132-5 may include a second connecting portion 132a-5 disposed on the fourth surface 4 and a second band portion 132b-5 extending from the second connecting portion 132a-5 to a portion of the first surface 1. The external electrodes 131-5 and 132-5 may not be disposed on the second surface 2, and the insulating layer 151-5 may be disposed to cover the entire second surface 2. This minimizes the volume occupied by the external electrodes 131-5 and 132-5, thereby further improving the capacitance per unit volume of the laminated electronic component 1005. However, the insulating layer 151-5 does not need to be limited to covering the entire second surface 2, and may have a form in which the insulating layer does not cover part or all of the second surface 2, but is separated and covers the first and second connection portions 131a-5, 132a-5 respectively.

[0178] Furthermore, the reliability can be further improved by disposing the insulating layer 151-5 so as to cover a portion of the fifth and sixth surfaces, and the portions of the fifth and sixth surfaces that are not covered by the insulating layer 151-5 can be exposed to the outside.

[0179] Furthermore, the insulating layer 151-5 can be arranged to cover the entire fifth and sixth surfaces, in which case the fifth and sixth surfaces are not exposed to the outside, further improving moisture resistance reliability.

[0180] A first plating layer 141-5 is disposed on the first band portion 131b-5, and a second plating layer 142-5 is disposed on the second band portion 132b-5, and the first and second plating layers 141-5, 142-5 may be disposed extending to a portion of the first and second connection portions 132a-5, 132b-5.

[0181] In this case, the external electrodes 131-5 and 132-5 do not have to be disposed on the fifth and sixth surfaces 5 and 6. That is, the external electrodes 131-5 and 132-5 may be disposed only on the third, fourth and first surfaces.

[0182] The average distance in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average distance in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-5 and 142-5 disposed on the first and second connection portions 131a-5 and 132a-5 is H2. When this is the case, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased to improve the fixing strength, and by increasing the area where the external electrodes 131-5 and 132-5 contact the plating layers 141-5 and 142-5, an increase in the ESR (Equivalent Series Resistance) can be suppressed.

[0183] More preferably, when the average size of the main body 110 in the first direction is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because if H2 is T / 2 or more, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0184] Also, the first and second plating layers 141-5 and 142-5 can be arranged so as to cover a part of the insulating layer 151-1 on the third and fourth surfaces. That is, the plating layers 141-5 and 142-5 can be arranged so as to cover the ends of the insulating layer 151-5 on the third and fourth surfaces. Thereby, the bonding strength between the insulating layer 151-5 and the plating layers 141-5 and 142-5 can be strengthened to improve the reliability of the multilayer electronic component 1005.

[0185] Also, the insulating layer 151-5 can be arranged so as to cover a part of the first and second plating layers 141-5 and 142-5 on the third and fourth surfaces. That is, the insulating layer 151-5 can be arranged so as to cover the ends of the plating layers 141-5 and 142-5 on the third and fourth surfaces. Thereby, the bonding strength between the insulating layer 151-5 and the plating layers 141-5 and 142-5 can be strengthened to improve the reliability of the multilayer electronic component 1005.

[0186] FIG. 18 is a schematic perspective view of a multilayer electronic component 1006 according to one embodiment of the present invention, and FIG. 19 is a cross-sectional view taken along line VII-VII′ in FIG.

[0187] 18 and 19, the average thickness t1 of the first and second plating layers 141-6 and 142-6 of the multilayer electronic component 1006 according to an embodiment of the present invention may be thinner than the average thickness t2 of the insulating layer 151-6.

[0188] By making the thickness t1 of the first and second plating layers 141-6, 142-6 thinner than the thickness t2 of the insulating layer 151-6, the contact area between the first and second plating layers 141-6, 142-6 and the insulating layer 151-6 can be minimized, thereby ensuring excellent overall bonding strength of the laminated electronic component 1006.

[0189] The thickness t1 of the first and second plating layers 141-6, 142-6 may be an average value of thicknesses measured at 10 equally spaced points along the first direction on the first and second connection portions 131a-5, 132a-5 or the first and second band portions 131b-5, 132b-5, and the thickness t2 of the insulating layer 151-6 may be an average value of thicknesses measured at 10 equally spaced points along the first direction on the first and second connection portions 131a-5, 132a-5.

[0190] FIG. 20 is an enlarged view of the P3 region in FIG.

[0191] Referring to FIG. 20, the plating layers 141-6 and 142-6 of the laminated electronic component 1006 extend to a portion of the first and second connection portions 131a-5 and 132a-5 to contact the plating layers 141-6 and 152-6. In the region where the plating layers 141-6 and 142-6 contact the insulating layer 151-6, the thickness of the insulating layer 151-6 gradually decreases toward the end, and the ends of the plating layers 141-6 and 142-6 include a first region S1' extending between the insulating layer 151-6 and the first and second connection portions 131a-5 and 132a-5 and a second region S2' extending to cover the insulating layer 151-6.

[0192] Therefore, not only is the area of ​​direct contact between the plating layers 141-6, 142-6 and the insulating layer 151-6 minimized, but the area of ​​contact between the plating layers 141-6, 142-6 and the connecting portions 131a-5, 132a-5 is maximized, thereby further improving the overall bonding strength of the laminated electronic component 1006.

[0193] In one embodiment, when the maximum length in the first direction of the first region S1' is a1' and the maximum length in the first direction of the second region S2' is a2', a1' > a2' can be satisfied. If a2' is greater than a1', the contact area of ​​the plating layer 141-6 with the insulating layer 151-6 is greater than the contact area of ​​the plating layer 141-6 with the connecting portions 131a-5 and 132a-5, which may result in insufficient adhesion between the plating layer 141-6, the insulating layer 151-6, and the connecting portions 131a-5 and 132a-5. In one embodiment, satisfying a1' > a2' increases the length or area of ​​contact between the plating layer 141-6 and the connecting portions 131a-5 and 132-5, thereby minimizing the contact area between the plating layer 141-6 and the insulating layer 151-6 and further improving physical bonding strength. This further improves the overall strength of the multilayer electronic component 1006.

[0194] FIG. 21 is a schematic perspective view of a multilayer electronic component according to one embodiment of the present invention, and FIG. 22 is a cross-sectional view taken along line VIII-VIII' in FIG.

[0195] 21 and 22 , a multilayer electronic component 2000 according to an embodiment of the present invention includes a dielectric layer 111, first and second internal electrodes 121 and 122 alternately disposed with the dielectric layer sandwiched therebetween, a main body 110 including first and second surfaces 1 and 2 facing each other in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 facing each other in the second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces 1 and 2 facing each other in the third direction, a first external electrode 231 including a first linking electrode 231 a disposed on the third surface and a first band electrode 231 b disposed on the first surface and connected to the first linking electrode, a second external electrode 232 including a second linking electrode 232 a disposed on the fourth surface and a second band electrode 232 b disposed on the first surface and connected to the second linking electrode, a first insulating layer 251 disposed on the first linking electrode, and a second insulating layer 252 disposed on the second linking electrode. The first and second plating layers 241 and 242 include a second insulating layer 252 disposed on the electrode, a first plating layer 241 disposed on the first band electrode, and a second plating layer 242 disposed on the second band electrode, wherein the first plating layer 241 extends to a portion on the first connecting electrode 231a and contacts the first insulating layer 251, and the second plating layer 242 extends to a portion on the second connecting electrode 232a and contacts the second insulating layer 152. In the region where the first and second plating layers 241 and 242 contact the first and second insulating layers 251 and 252, the insulating layers 251 and 252 have gradually reduced thicknesses toward the ends, and the ends of the plating layers 241 and 242 include a first region extending between the insulating layers 251 and 252 and the first and second connecting electrodes 231a and 232a and a second region extending to cover the insulating layers 251 and 252.

[0196] The first linking electrode 231a may be disposed on the third surface 3 and connected to the first internal electrode 121, and the second linking electrode 231b may be disposed on the fourth surface 4 and connected to the second internal electrode 122. In addition, a first insulating layer 251 may be disposed on the first linking electrode 231a', and a second insulating layer 252 may be disposed on the second linking electrode 232a.

[0197] Conventionally, external electrodes have been formed by dipping the exposed surface of the body's internal electrodes into a paste containing a conductive metal. However, external electrodes formed using the dipping method can be very thick at the center of the thickness. Furthermore, since the internal electrodes are exposed on the third and fourth surfaces of the body, the external electrodes on the third and fourth surfaces are formed to a certain thickness to prevent moisture and plating solution from penetrating through the external electrodes.

[0198] In contrast, in the present invention, insulating layers 251 and 252 are placed on the connecting electrodes 231a and 232a, so that sufficient reliability can be ensured even if the thickness of the connecting electrodes 231a and 232a on the third and fourth surfaces where the internal electrodes are exposed is made thin.

[0199] The first and second connecting electrodes 231a and 232a may correspond to the third and fourth surfaces, respectively, and surfaces of the first and second connecting electrodes 231a and 232a facing the body 110 may have the same areas as the third and fourth surfaces of the body 110, respectively. The first and second connecting electrodes 231a and 232a may be arranged so as not to deviate from the third and fourth surfaces 3 and 4, respectively. The connecting electrodes 231a and 232a may be arranged so as not to extend to the first, second, fifth, and sixth surfaces 1, 2, 5, and 6 of the body 110. Specifically, in one embodiment, the first and second connecting electrodes 231a and 232a may be arranged spaced apart from the fifth and sixth surfaces. This minimizes the volume occupied by the external electrodes while ensuring sufficient connectivity between the internal electrodes 121 and 122 and the external electrodes 231 and 232, thereby increasing the capacitance per unit volume of the multilayer electronic component 2000.

[0200] From this perspective, the first and second connecting electrodes 231a and 232a may be disposed apart from the second surface 2. That is, since the external electrodes 231 and 232 are not disposed on the second surface 2, the volume occupied by the external electrodes 231 and 232 can be further minimized, and the capacitance per unit volume of the multilayer electronic component 2000 can be further increased.

[0201] However, the connecting electrodes 231a and 232a may include corner portions extending to and disposed on the corners of the body 110. That is, in one embodiment, the first connecting electrode may include corner portions (not shown) extending to and disposed on the first-third corner and the second-third corner, and the second connecting electrode may include corner portions (not shown) extending to and disposed on the first-fourth corner and the second-fourth corner.

[0202] The thickness of the connecting electrodes 231a and 232a is not particularly limited, but may be, for example, 2 to 7 μm. Here, the thickness of the connecting electrodes 231a and 232a may refer to the maximum thickness or the size of the connecting electrodes 231a and 232a in the second direction.

[0203] In one embodiment, the first and second connecting electrodes 231a and 232a may include the same metal and glass as the metal included in the internal electrodes 121 and 122. When the first and second connecting electrodes 231a and 232a include the same metal as the metal included in the internal electrodes 121 and 122, electrical connectivity with the internal electrodes 121 and 122 may be improved, and when the first and second connecting electrodes 231a and 232a include glass, bonding strength with the body 110 and / or the insulating layers 251 and 252 may be improved. In this case, the same metal as the metal included in the internal electrodes 121 and 122 may be Ni.

[0204] The first and second insulating layers 251 and 252 are disposed on the first and second connecting electrodes 231 a and 232 a, respectively, and serve to prevent a plating layer from being formed on the first and second connecting electrodes 231 a and 232 a. In addition, the first and second insulating layers 251 and 252 improve sealing properties and minimize penetration of moisture, plating solution, etc. from the outside.

[0205] The first and second insulating layers 251 and 252 may contain a silicone resin, which can further improve the moisture resistance reliability and suppress cracks due to thermal contraction and radial cracks due to metal diffusion.

[0206] The first and second insulating layers 251 and 252 are disposed on the first and second connecting electrodes 231 a and 232 a, respectively, and serve to prevent a plating layer from being formed on the first and second connecting electrodes 231 a and 232 a. In addition, the first and second insulating layers 251 and 252 improve sealing properties to minimize penetration of moisture, plating solution, etc. from the outside.

[0207] The insulating layers 251, 252 may include, but are not limited to, a glass material having excellent resistance to plating solutions, such as a glass material containing Si, and may be made of a material having a strength sufficient to protect the multilayer electronic component 2000 from tensile stress caused by thermal contraction. The insulating layers 251, 252 may include a single component or multiple components, and more preferably, may include one or more additives selected from TiO2, BaTiO3, Al2O3, SiO2, BaO, etc. to improve bonding strength with the main body 100 or the external electrodes 131, 132.

[0208] The method for forming the insulating layers 251 and 252 is not particularly limited, and may be, for example, a sol-gel process, a chemical vapor deposition (CVD), an atomic layer deposition (ALD), etc. However, the method is not limited thereto, and other methods capable of forming a thin and uniform insulating layer may also be used.

[0209] The thickness of the insulating layers 251 and 252 is not particularly limited, but may be, for example, 3 to 15 μm. Here, the thickness of the insulating layers 251 and 252 may refer to the maximum thickness or the size of the insulating layers 251 and 252 in the second direction.

[0210] The first and second band electrodes 231b and 232b may be disposed on the first surface 1 of the body 110. The first and second band electrodes 231b and 232b may be in contact with the first and second connecting electrodes 231a and 232a, respectively, and thereby be electrically connected to the first and second internal electrodes 121 and 122, respectively.

[0211] External electrodes formed by the conventional dipping method are thick on the third and fourth sides and extend partially to the first, second, fifth, and sixth sides, making it difficult to ensure a high effective volume ratio.

[0212] In contrast, according to one embodiment of the present invention, the first and second connecting electrodes 231a, 232a are arranged on the surface where the internal electrodes are exposed, and the first and second band electrodes 231b, 232b are arranged on the surface that is mounted on the substrate, thereby ensuring a high effective volume ratio.

[0213] On the other hand, when the internal electrodes 121, 122 are stacked in the first direction, the multilayer electronic component 2000 can be horizontally mounted on a substrate so that the internal electrodes 121, 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting, and when the internal electrodes 121, 122 are stacked in the third direction, the multilayer electronic component can be vertically mounted on a substrate so that the internal electrodes 121, 122 are perpendicular to the mounting surface.

[0214] The first and second band electrodes 231b and 232b may be formed using any material that has electrical conductivity, such as metal, and the specific material may be determined in consideration of electrical properties, structural stability, etc. For example, the first and second band electrodes 231 and 232b may be fired electrodes including conductive metal and glass, and may be formed by applying a paste including conductive metal and glass to the first surface of the main body, but are not limited thereto, and may be a plating layer formed by plating a conductive metal on the first surface of the main body.

[0215] The conductive metal contained in the first and second band electrodes 231b and 232b may be a material with excellent electrical conductivity and is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof, and may include the same metal as the metal contained in the internal electrodes 121 and 122.

[0216] Meanwhile, in order to ensure sealing properties and high strength, in one embodiment, the first external electrode 231 may further include a third band electrode (not shown) disposed on the second surface 2 and connected to the first connecting electrode 231a, and the second external electrode 232 may further include a fourth band electrode (not shown) disposed on the second surface 2 and connected to the second connecting electrode 232a.

[0217] In one embodiment, when the distance from the extension line E3 of the third surface to the end of the first band electrode 231b is B1, the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b is B2, the distance from the extension line E4 of the third surface to the end of the third band electrode (not shown) is B3, the distance from the extension line E4 of the fourth surface to the end of the fourth band electrode (not shown) is B4, the average size in the second direction of the region where the third surface and the second internal electrode 122 are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode 121 are separated is G2, the relationships B1 ≧ G1, B3 ≦ G1, B2 ≧ G2, and B4 ≦ G2 can be satisfied. This minimizes the volume occupied by the external electrodes to increase the capacitance per unit volume of the multilayer electronic component 2000, and increases the area in contact with solder during mounting to improve bonding strength.

[0218] However, it is not intended to limit the present invention to B1≧G1, B3≦G1, B2≧G2, and B4≦G2, and cases where B1≧G1, B3≧G1, B2≧G2, and B4≧G2 are satisfied can also be included as one embodiment of the present invention. Therefore, in one embodiment, when the distance from the extension line E3 of the third surface to the end of the first band electrode 231b is B1, the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b is B2, the distance from the extension line E4 of the third surface to the end of the third band electrode (not shown) is B3, the distance from the extension line of the fourth surface to the end of the fourth band electrode (not shown) is B4, the average size in the second direction of the area where the third surface and the second internal electrode 122 are separated is G1, and the average size in the second direction of the area where the fourth surface and the first internal electrode 121 are separated is G2, the relationships B1≧G1, B3≧G1, B2≧G2, and B4≧G2 can be satisfied.

[0219] The first and second plating layers 241 and 242 may be disposed on the first and second band electrodes 231b and 232b. The first and second plating layers 241 and 242 serve to improve mounting characteristics. The type of the first and second plating layers 241 and 242 is not particularly limited, and may be a plating layer containing one or more of Ni, Sn, Pd, and alloys thereof, and may be composed of multiple layers.

[0220] To give a more specific example of the first and second plating layers 241, 242, the first and second plating layers 241, 242 may be Ni plating layers or Sn plating layers, and may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the first and second band electrodes 231b, 232b.

[0221] In one embodiment, an end of the first plating layer 241 may include a 1-1 region extending between the first insulating layer 251 and the first connecting electrode 231a and a 1-2 region extending to cover the first insulating layer 251, and an end of the second plating layer 242 may include a 2-1 region extending between the second insulating layer 252 and the second connecting electrode 232a and a 2-2 region extending to cover the second insulating layer 252. Thus, even if the first and second insulating layers 251 and 252 are made of a material having an insulating component, the physical bonding strength of the plating layers 241 and 242, the insulating layers 251 and 252, and the connecting electrodes 231a and 232a may be improved, thereby improving the overall strength of the multilayer electronic component 2000 and resistance to external impact, and preventing a decrease in bonding strength when mounted on a substrate.

[0222] In one embodiment, when the maximum length in the first direction of the 1-1 region and the 2-1 region is a1 and the maximum length in the first direction of the 2-1 region and the 2-2 region is a2, a1 > a2 may be satisfied. If a2 is greater than a1, the contact area of ​​the plating layers 241 and 242 with the insulating layers 251 and 252 may be greater than the contact area of ​​the plating layers with the connecting electrodes, resulting in insufficient adhesive strength. In one embodiment, satisfying a1 > a2 increases the length or area of ​​contact between the plating layers and the connecting electrodes, thereby minimizing the contact area between the plating layers and the insulating layers and further improving physical bonding strength. This further improves the overall strength of the multilayer electronic component 2000.

[0223] In one embodiment, the first and second plating layers 241 and 242 may be disposed to extend to partially cover the first and second connecting electrodes 231a and 232a, respectively.

[0224] When the average distance in the first direction from the first surface 1 to the internal electrode of the first and second internal electrodes 121, 122 that is arranged closest to the first surface 1 is H1, and the average distance in the first direction from an extension of the first surface 1 to the ends of the first and second plating layers 241, 242 arranged on the first and second connecting electrodes 231a, 232a is H2, it is possible to satisfy H1>H2. This makes it possible to suppress penetration of the plating solution into the internal electrodes during the plating process, thereby improving reliability.

[0225] In one embodiment, the first plating layer 241 may be disposed to cover the end of the first insulating layer 251 located on the first external electrode 231, and the second plating layer 242 may be disposed to cover the end of the second insulating layer 252 located on the second external electrode 232. This may strengthen the bonding strength between the insulating layers 251, 252 and the plating layers 241, 242, thereby improving the reliability of the multilayer electronic component 2000. Furthermore, by forming the first and second insulating layers 251, 252 before forming the plating layers 241, 242 on the external electrodes 231, 232, permeation of the plating solution during the plating layer formation process may be more reliably suppressed. By forming the insulating layers before the plating layers, the plating layers 241, 242 may cover the end of the insulating layers 251, 252.

[0226] In one embodiment, the first insulating layer 251 may be arranged to cover the end of the first plating layer 241 that is located on the first external electrode 231, and the second insulating layer 252 may be arranged to cover the end of the second plating layer 342 that is located on the second external electrode 332. This may strengthen the bonding strength between the insulating layer 351 and the plating layers 341 and 342, thereby improving the reliability of the multilayer electronic component 2000.

[0227] Fig. 23 illustrates a modified example 2001 of Fig. 21. Referring to Fig. 23, in the modified example 2001 of the multilayer electronic component 2000 according to an embodiment of the present invention, the first and second insulating layers 251-1 and 252-1 may be connected to each other by extending to the fifth and sixth surfaces 5 and 6, respectively, to form a single insulating layer 253-1. In this case, the connected first and second insulating layers 253-1 may be disposed to cover portions of the fifth and sixth surfaces.

[0228] FIG. 24 is a schematic perspective view of a multilayer electronic component 2002 according to one embodiment of the present invention, and FIG. 25 is a cross-sectional view taken along line IX-IX' in FIG.

[0229] 24 and 25, in a multilayer electronic component 2002 according to an embodiment of the present invention, first and second plating layers 241-2 and 242-2 may be disposed below an extension of the first surface, thereby minimizing the height of the solder during mounting and minimizing the mounting space.

[0230] In addition, the first and second insulating layers 251-2 and 252-2 may be arranged to extend to an extension line of the first surface or below and contact the first and second plating layers 241-2 and 242-2.

[0231] Here, the first and second insulating layers 251-2 and 252-2 may be arranged to contact the first and second plating layers 241-2 and 242-2 by extending below the extension line of the first surface, but this does not mean that the first and second insulating layers are arranged to contact the first and second plating layers on the band electrodes 231b and 132b. The detailed positions may be adjusted to minimize the solder height and the mounting space during mounting. In this case, the connected first and second insulating layers 253-3 may be arranged to cover the entire fifth and sixth surfaces.

[0232] Fig. 26 illustrates a modification of Fig. 24. Referring to Fig. 26, in a modification 2003 of the multilayer electronic component 2002 according to an embodiment of the present invention, the first and second insulating layers 251-3 and 252-3 extend to the fifth and sixth surfaces 5 and 6 and are connected to each other, so that they can be connected as a single insulating layer 253-3.

[0233] FIG. 27 is a schematic perspective view of a multilayer electronic component 2004 according to one embodiment of the present invention, and FIG. 28 is a cross-sectional view taken along line XX' of FIG.

[0234] 27 and 28, a multilayer electronic component 2004 according to an embodiment of the present invention may further include an additional insulating layer 261 disposed on the first surface 1 and between the first band electrode 231b and the second band electrode 232b, thereby preventing leakage current that may occur between the first band electrode 231b and the second band electrode 232b under high voltage.

[0235] The type of additional insulating layer 261 is not particularly limited. For example, it may contain the same components as insulating layers 251-2 and 252-2. Meanwhile, additional insulating layer 261 and insulating layers 251-2 and 252-2 do not need to be made of the same material, but may be made of different materials. For example, additional insulating layer 261 may contain one or more thermosetting resins selected from epoxy resin, acrylic resin, etc. Furthermore, additional insulating layer 261 may contain one or more additives selected from TiO2, BaTiO3, Al2O3, SiO2, BaO, etc. in addition to polymer resin. This may improve the bonding strength with the main body or external electrodes.

[0236] Fig. 29 illustrates a modification of Fig. 27. Referring to Fig. 29, in a modification 2005 of the multilayer electronic component 2004 according to an embodiment of the present invention, the first and second insulating layers 251-5 and 252-5 extend to the fifth and sixth surfaces 5 and 6 and are connected to each other, so that they can be connected as a single insulating layer 253-5.

[0237] FIG. 30 is a schematic perspective view of a multilayer electronic component 2006 according to one embodiment of the present invention, and FIG. 31 is a cross-sectional view taken along line XI-XI' in FIG.

[0238] Referring to FIGS. 30 and 31, a stacked electronic component 2006 according to an embodiment includes a first insulating layer 251-6 disposed on a first connection electrode 231a and a second insulating layer 252-6 disposed on a second connection electrode 232a. When the average distance in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average distance in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 241-6 and 242-6 disposed on the first and second connection electrodes 231a and 232a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved.

[0239] More preferably, when the average size of the main body 110 in the first direction is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is T / 2 or more, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0240] FIG. 32 illustrates a modified example of FIG. 30. Referring to FIG. 32, a modified example 2007 of the stacked electronic component 2006 according to an embodiment of the present invention can be connected as one insulating layer 253-7 by extending the first and second insulating layers 251-7 and 252-7 to the fifth and sixth surfaces 5 and 6 and connecting them to each other.

[0241] FIG. 33 schematically shows a perspective view of a stacked electronic component 2008 according to an embodiment of the present invention, and FIG. 34 is a cross-sectional view taken along XII-XII' of FIG. 33.

[0242] Referring to FIGS. 33 and 34, a stacked electronic component 2008 according to an embodiment of the present invention can be connected as one insulating layer 253-8 by extending the first and second insulating layers 251-8 and 252-8 to the second, fifth, and sixth surfaces 2, 5, and 6 and connecting them to each other. As shown in FIG. 30, the insulating layer 253-8 may cover the entire second surface, or the fifth and sixth surfaces may cover only a part thereof.

[0243] FIG. 35 is a schematic perspective view of a multilayer electronic component 2009 according to one embodiment of the present invention, and FIG. 36 is a cross-sectional view taken along line XIII-XIII' in FIG.

[0244] Referring to Figures 35 and 36, the average thickness t1 of the first and second plating layers 241-9, 242-9 of the multilayer electronic component 2009 according to one embodiment of the present invention may be thinner than the average thickness t2 of the first and second insulating layers 251-9, 252-9.

[0245] According to one embodiment of the present invention, the average thickness t1 of the first and second plating layers 241-9, 242-9 can be made thinner than the average thickness t2 of the first and second insulating layers 251-9, 252-9 to reduce the area of ​​contact between the plating layer and the insulating layer, thereby suppressing the occurrence of delamination and improving the adhesion strength of the multilayer electronic component 2009 to the substrate 180.

[0246] The average thickness t1 of the first and second plating layers 241-9, 242-9 may be an average value of thicknesses measured at five equally spaced points on the first and second connecting electrodes 231a, 232a or the first and second band electrodes 231b, 232b, and the average thickness t2 of the insulating layers 251-9, 252-9 may be an average value of thicknesses measured at five equally spaced points on the first and second connecting electrodes 231a, 232a.

[0247] Fig. 37 illustrates a modification of Fig. 35. Referring to Fig. 37, in a modification 2010 of the multilayer electronic component 2009 according to an embodiment of the present invention, the first and second insulating layers 251-10 and 252-10 extend to the fifth and sixth surfaces 5 and 6 and are connected to each other, so that they can be connected as a single insulating layer 253-10.

[0248] Fig. 38 shows a modification of Fig. 17. Referring to Fig. 38, in a modification 1007 of a multilayer electronic component 1005 according to one embodiment of the present invention, the first and second external electrodes 131-7 and 132-7 may have an L-shape in which the first and second external electrodes are not arranged on the second surface.

[0249] The first external electrode 131-7 may include a first connecting portion 131a-7 disposed on the third surface 3 and a first band portion 131b-7 extending from the first connecting portion 131a-7 to a portion of the first surface 1, and the second external electrode 132-7 may include a second connecting portion 132a-7 disposed on the fourth surface 4 and a second band portion 132b-7 extending from the second connecting portion 132a-7 to a portion of the first surface 1. The external electrodes 131-7 and 132-7 may not be disposed on the second surface 2, and the insulating layer 151-7 may cover the entire second surface 2. In this case, the external electrodes 131-7 and 132-7 may not be disposed on the fifth and sixth surfaces 5 and 6. That is, the external electrodes 131-7 and 132-7 may be disposed only on the third, fourth, and first surfaces.

[0250] A first additional electrode layer 134 may be disposed between the first connection portion 131a-7 and the third surface, and a second additional electrode layer 135 may be disposed between the second connection portion 132a-7 and the fourth surface. The first connection portion 131a-7 may be disposed within a range not deviating from the third surface, and the second connection portion 132a-7 may be disposed within a range not deviating from the fourth surface.

[0251] FIG. 39 is a schematic perspective view of a multilayer electronic component 3000 according to one embodiment of the present invention, FIG. 40 is a cross-sectional view taken along line XIV-XIV' in FIG. 39, and FIG. 41 is an enlarged view of region K1 in FIG. 40.

[0252] 39 to 41, a multilayer electronic component 3000 according to one embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121, 122 alternately disposed with the dielectric layer sandwiched therebetween, and includes a main body 110 including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in the third direction; a first connecting portion 331a disposed on the third surface of the main body; a first band portion 331b extending from the first connecting portion to a part of the first surface; and a first corner portion 331c extending from the first connecting portion to a corner connecting the second surface and the third surface of the main body. a second connecting portion 332a disposed on the fourth surface of the main body, a second band portion 332b extending from the second connecting portion to a part of the first surface, and a second corner portion 332c extending from the second connecting portion to a corner connecting the second surface and the fourth surface of the main body; an insulating layer 351 disposed on the first and second connecting portions 331a, 332a and arranged to cover the second surface and the first and second corner portions; a first plating layer 341 disposed on the first band portion; and a second plating layer 342 disposed on the second band portion, wherein the first and second insulating layers may contain a silicone resin.

[0253] In one embodiment, when the average distance in the second direction from an extension of the third surface to an end of the first corner portion 331c is B3, the average distance in the second direction from an extension of the fourth surface to an end of the second corner portion 332c is B4, the average size in the second direction of the region where the third surface and the second internal electrode are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode are separated is G2, B31 and B42 can be satisfied. This minimizes the volume occupied by the external electrodes 331 and 332, thereby increasing the capacitance per unit volume of the multilayer electronic component 3000.

[0254] In this case, when the average distance in the second direction from an extension of the third surface to the end of the first band portion 331b is B1 and the average distance in the second direction from an extension of the fourth surface to the end of the second band portion 332b is B2, B1 ≧ G1 and B3 ≧ G2 can be satisfied, thereby increasing the area in contact with the solder during mounting and improving the bonding strength.

[0255] A multilayer electronic component 3000 according to one embodiment may include a body 110 including a dielectric layer 111 and first and second internal electrodes 121, 122 alternately arranged with the dielectric layer sandwiched therebetween, and including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in the third direction. The body 110 of the multilayer electronic component 3000 may have the same configuration as the body 110 of the multilayer electronic component 1000, except that, as will be described later, an end portion of the first or second surface of the body has a contracted shape.

[0256] The external electrodes 331 and 332 may be disposed on the third surface 3 and the fourth surface 4 of the body 110. The external electrodes 331 and 332 may include first and second external electrodes 331 and 332 disposed on the third and fourth surfaces 3 and 4 of the body 110, respectively, and connected to the first and second internal electrodes 121 and 122, respectively.

[0257] The external electrodes 331 and 332 may include a first external electrode 331 including a first connecting portion 331a disposed on the third surface, a first band portion 331b extending from the first connecting portion to a portion of the first surface, and a first corner portion 331c extending from the first connecting portion to a corner connecting the second surface and the third surface, and a second external electrode 132 including a second connecting portion 332a disposed on the fourth surface, a second band portion 332b extending from the second connecting portion to a portion of the first surface, and a second corner portion 332c extending from the second connecting portion to a corner connecting the second surface and the fourth surface. The first connecting portion 331a may be connected to the first internal electrode 121 at the third surface, and the second connecting portion 332a may be connected to the second internal electrode 122 at the fourth surface.

[0258] In an embodiment, the first and second connection portions 331a and 332a may be spaced apart from the fifth and sixth surfaces, thereby minimizing the specific gravity of the external electrodes 331 and 332, thereby further miniaturizing the multilayer electronic component 3000.

[0259] A marginal region where the internal electrodes 121, 122 are not disposed overlaps the dielectric layer 111, causing a step due to the thickness of the internal electrodes 121, 122, and the corners connecting the first surface and the third to fifth surfaces and / or the corners connecting the second surface and the third to fifth surfaces may have a shape that shrinks toward the center in the first direction of the main body 110 when viewed from the first surface or the second surface. Alternatively, due to shrinkage behavior during the sintering process of the main body, the corners connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, 6 and / or the corners connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, 6 may have a shape that shrinks toward the center in the first direction of the main body 110 when viewed from the first surface or the second surface. Alternatively, in order to prevent chipping defects, the corners connecting each surface of the main body 110 may be rounded through a separate process, so that the corners connecting the first surface and the third to sixth surfaces and / or the corners connecting the second surface and the third to sixth surfaces may have a rounded shape.

[0260] The corners may include a 1-3 corner c1-3 connecting the first and third faces, a 1-4 corner c1-4 connecting the first and fourth faces, a 2-3 corner c2-3 connecting the second and third faces, and a 2-4 corner c2-4 connecting the second and fourth faces. In addition, the corners may include a 1-5 corner connecting the first and fifth faces, a 1-6 corner connecting the first and sixth faces, a 2-5 corner connecting the second and fifth faces, and a 2-6 corner connecting the second and sixth faces. However, in order to suppress steps caused by the internal electrodes 121, 122, if the laminated internal electrodes are cut so as to be exposed on the fifth and sixth surfaces 5, 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated in the third direction (width direction) on both side surfaces of the capacitance forming portion Ac to form margin portions 114, 115, the portions connecting the first surface to the fifth and sixth surfaces and the portions connecting the second surface to the fifth and sixth surfaces do not need to have a contracted shape.

[0261] Meanwhile, the first to sixth surfaces of the main body 110 may be generally flat surfaces, and the non-flat areas may be corners. Also, the areas of the external electrodes 131 and 132 that are arranged on the corners may be corner portions.

[0262] From this perspective, the first and second corner portions 331c, 332c may be disposed below an extension line E2 of the second surface, and may be disposed spaced apart from the second surface. That is, because the external electrodes 331, 332 are not disposed on the second surface, the volume occupied by the external electrodes 331, 332 can be further minimized, thereby further increasing the capacitance per unit volume of the multilayer electronic component 3000. In addition, the first corner portion 331c may be disposed on a portion of the 2-3 corner C2-3 connecting the third surface and the second surface, and the second corner portion 332c may be disposed on a portion of the 2-4 corner C2-4 connecting the fourth surface and the second surface.

[0263] The extension E2 of the second surface can be defined as follows:

[0264] In a length-thickness cross section (LT cross section) of the laminated electronic component 3000 taken at the center in the width direction, seven straight lines P0, P1, P2, P3, P4, P5, P6, and P7 are drawn in the thickness direction at equal intervals in the length direction from the third surface to the fourth surface, and the line passing through the point where P2 intersects with the second surface and the point where P4 intersects with the second surface can be defined as an extension line E2 of the second surface.

[0265] Meanwhile, the external electrodes 331 and 332 may be formed using any material having electrical conductivity, such as a metal, and the specific material may be determined in consideration of electrical properties, structural stability, etc., and may further have a multi-layer structure.

[0266] The external electrodes 331 and 332 may be firing electrodes containing a conductive metal and glass, or resin-based electrodes containing a conductive metal and resin.

[0267] The external electrodes 331 and 332 may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body, or by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0268] The conductive metal contained in the external electrodes 331, 332 may be any material with excellent electrical conductivity, and is not particularly limited. For example, the conductive metal may be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and alloys thereof. Preferably, the external electrodes 331, 332 may contain one or more of Ni and Ni alloys, thereby further improving connectivity with the internal electrodes 121, 122 containing Ni.

[0269] An insulating layer 351 may be disposed on the first and second connection portions 331a and 332a.

[0270] The first and second connection portions 331a, 332a are portions connected to the internal electrodes 121, 122, and therefore may become paths for the penetration of plating solution during the plating process or moisture in actual use. In the present invention, an insulating layer 351 is disposed on the connection portions 331a, 332a, thereby preventing the penetration of moisture or plating solution from the outside.

[0271] The insulating layer 351 may be disposed to be in contact with the first and second plating layers 341 and 342. In this case, the insulating layer 351 may be in contact with the first and second plating layers 341 and 342 in a manner that partially covers the ends of the insulating layer 351, or the first and second plating layers 341 and 342 may be in contact with the insulating layer 351 in a manner that partially covers the ends of the insulating layer 351.

[0272] The insulating layer 353 may be disposed on the first and second connection portions 331a and 332a and may be disposed to cover the second surface and the first and second corner portions 331c and 332c. In addition, the insulating layer 353 covers the areas where the ends of the first and second corner portions 331c and 332c contact the main body 110, thereby blocking a moisture penetration path and further improving moisture resistance reliability.

[0273] The insulating layer 351 may be disposed on the second surface and extend to the first and second connection portions 331a and 332a. If the external electrodes 331 and 332 are not disposed on the second surface, the insulating layer may be disposed to cover the entire second surface. Meanwhile, the insulating layer 351 does not necessarily have to be disposed on the second surface. The insulating layer may be disposed on part or all of the second surface. Alternatively, the insulating layer may be divided into two parts, each disposed on the first and second connection portions 331a and 332a. Even in this case, the insulating layer may be disposed to cover the entire first and second corner portions 331c and 332c. If the insulating layer is not disposed on the entire second surface, it may be disposed below an extension of the second surface. If the insulating layer is not disposed on the second surface, it may extend to the fifth and sixth surfaces on the first and second connection portions 331a and 332a to form a single insulating layer.

[0274] In one embodiment, the insulating layer 351 is disposed to cover a portion of the fifth and sixth surfaces to improve reliability, and the portions of the fifth and sixth surfaces that are not covered by the insulating layer may be exposed to the outside.

[0275] Furthermore, the insulating layer 351 can be arranged to cover the entire fifth and sixth surfaces, in which case the fifth and sixth surfaces are not exposed to the outside, further improving the moisture resistance reliability.

[0276] The insulating layer 351 may serve to prevent plating layers 341, 342 from being formed on the external electrodes 331, 332 on which the insulating layer 351 is disposed, and may serve to improve sealing properties and minimize penetration of moisture, plating solution, etc. from the outside. The components, composition, average thickness, and effects of the insulating layer 351 are similar to those of the insulating layers 151, 251, 252, 253 of the multilayer electronic components 1000, 2000 or various embodiments thereof, and therefore, description thereof will be omitted.

[0277] The first and second plating layers 341 and 342 may be disposed on the first and second band portions 331b and 332b, respectively. The plating layers 341 and 342 may serve to improve mounting characteristics, and by disposing the plating layers 341 and 342 on the band portions 331b and 332b, mounting space may be minimized and reliability may be improved by minimizing penetration of a plating solution into the internal electrodes. One end of the first and second plating layers 341 and 342 may contact the first surface, and the other end may contact the insulating layer 351.

[0278] The type of plating layers 341 and 342 is not particularly limited, and may be a plating layer containing one or more of Cu, Ni, Sn, Ag, Au, Pd, and alloys thereof, and may be made up of a plurality of layers.

[0279] To give a more specific example of the plating layers 341 and 342, the plating layers 341 and 342 may be Ni plating layers or Sn plating layers, and may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the first and second band portions 331b and 332b.

[0280] In one embodiment, the first plating layer 341 may be disposed to cover the end of the insulating layer 351 located on the first external electrode 331, and the second plating layer 342 may be disposed to cover the end of the insulating layer 351 located on the second external electrode 332. This may strengthen the bonding strength between the insulating layer 351 and the plating layers 341 and 342, thereby improving the reliability of the multilayer electronic component 3000. Furthermore, by forming the insulating layer 351 before forming the plating layers 341 and 342 on the external electrodes 331 and 332, it is possible to more reliably suppress penetration of the plating solution during the plating layer formation process. By forming the insulating layer before the plating layer, the plating layers 341 and 342 may have a configuration in which the plating layers 341 and 342 cover the end of the insulating layer 351.

[0281] In one embodiment, the insulating layer 351 may be arranged to cover an end of the first plating layer 341 that is arranged on the first external electrode 331, and the insulating layer 351 may be arranged to cover an end of the second plating layer 342 that is arranged on the second external electrode 332. This may strengthen the bonding strength between the insulating layer 351 and the plating layers 341 and 342, thereby improving the reliability of the multilayer electronic component 3000.

[0282] In one embodiment, the first and second plating layers 341 and 342 can be arranged to extend so as to cover a part of the first and second connection portions 331a and 332a, respectively. When the average distance in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average distance in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 141 and 142 arranged on the first and second connection portions 131a and 132a is H2, H1 > H2 can be satisfied. Thereby, it is possible to suppress the penetration of the plating solution into the internal electrode during the plating process and improve the reliability.

[0283] In one embodiment, when the average distance in the first direction from the first surface to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average distance in the first direction from the extension line of the first surface 1 to the ends of the plating layers 341 and 342 arranged on the first and second connection portions 331a and 332a is H2, H1 < H2 can be satisfied. Thereby, it is possible to increase the area in contact with solder during mounting and improve the adhesion strength. More preferably, when the average size of the main body 110 in the first direction is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0284] In one embodiment, the first and second plating layers 341 and 342 can be arranged below the extension line of the first surface. Thereby, it is possible to minimize the height of the solder during mounting and minimize the mounting space. Further, the insulating layer 351 can be arranged to extend below the extension line of the first surface and contact the first and second plating layers 341 and 342.

[0285] In one embodiment, when the average size of the main body in the second direction is L, the average distance in the second direction from the extension of the third surface to the end of the first band portion is B1, and the average distance in the second direction from the extension of the fourth surface to the end of the second band portion is B2, the relationships 0.2≦B1 / L≦0.4 and 0.2≦B2 / L≦0.4 can be satisfied.

[0286] If B1 / L and B2 / L are less than 0.2, it may be difficult to ensure sufficient bonding strength. On the other hand, if B2 / L is more than 0.4, leakage current may occur between the first band portion 331b and the second band portion 332b under high voltage, and the first band portion 331b and the second band portion 332b may be electrically connected due to plating bleeding during the plating process.

[0287] In one embodiment, the semiconductor device may further include an additional insulating layer disposed on the first surface between the first band portion 331b and the second band portion 332b, thereby preventing leakage current that may occur between the first band electrode 331b and the second band electrode 332b under high voltage.

[0288] The type of the additional insulating layer is not particularly limited. For example, it may contain the same components as the insulating layer 351. Meanwhile, the additional insulating layer and the insulating layer 351 do not need to be made of the same material, but may be made of different materials. For example, the additional insulating layer may contain one or more thermosetting resins selected from epoxy resin, acrylic resin, etc. Furthermore, the additional insulating layer may contain one or more additives selected from TiO2, BaTiO3, Al2O3, SiO2, BaO, etc. in addition to the polymer resin. This may improve the bonding strength with the main body or the external electrode.

[0289] In one embodiment, when the average distance in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average distance in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, B3 < B1 and B4 < B2 can be satisfied. The average distance B1 of the first band portion 331b can be longer than the average distance B3 of the first corner portion 331c, and the average length of the second band portion 332b can be longer than the average length B4 of the second corner portion 332c. Thereby, the area in contact with solder during mounting can be increased to improve the fixing strength.

[0290] More specifically, when the average distance in the second direction from the extension line of the third surface 3 to the end of the first band portion 331b is B1, the average distance in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 332b is B2, the average distance in the second direction from the extension line of the third surface 3 to the end of the first corner portion 331c is B3, and the average distance in the second direction from the extension line of the fourth surface 4 to the end of the second corner portion 332c is B4, B3 < B1 and B4 < B2 can be satisfied.

[0291] In one embodiment, the average thicknesses of the first and second plating layers 341 and 342 can be thinner than the average thickness of the insulating layer 351.

[0292] Although the insulating layer 351 serves to prevent moisture penetration from the outside or penetration of the plating solution, since the connectivity with the plating layers 341 and 342 is weak, it may cause delamination of the layers. When the plating layer is delaminated, the fixing strength with the substrate may decrease. Here, delamination of the plating layer can mean that the plating layer is partially peeled off or physically separated from the external electrodes 331 and 332. Since the connectivity between the plating layer and the insulating layer is weak, there is a high possibility that the gap at the interface between the insulating layer and the plating layer will widen or foreign matter will penetrate, and it may become vulnerable to external shocks and the possibility of delamination increases.

[0293] According to one embodiment of the present invention, the average thickness of the plating layer can be made thinner than the average thickness of the insulating layer, thereby reducing the area of ​​contact between the plating layer and the insulating layer, thereby suppressing the occurrence of delamination and improving the bonding strength with the multilayer electronic component 3000.

[0294] The size of the multilayer electronic component 3000 does not need to be particularly limited.

[0295] However, in order to simultaneously achieve miniaturization and high capacitance, the thickness of the dielectric layers and internal electrodes must be reduced and the number of layers must be increased. Therefore, the effects of improving reliability and capacitance per unit volume according to the present invention can be more pronounced in multilayer electronic components 3000 having a size of 1005 (length x width, 1.0 mm x 0.5 mm) or less.

[0296] Therefore, taking into consideration manufacturing errors, the size of the external electrodes, etc., the reliability improvement effect according to the present invention may be more pronounced when the length of the multilayer electronic component 3000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the multilayer electronic component 3000 may refer to the maximum size of the multilayer electronic component 3000 in the second direction, and the width of the multilayer electronic component 3000 may refer to the maximum size of the multilayer electronic component 3000 in the third direction.

[0297] The present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the scope of the appended claims. Therefore, various substitutions, modifications, and changes may be made by a person skilled in the art without departing from the technical spirit of the present invention as set forth in the claims, and these also fall within the scope of the present invention.

[0298] It should be noted that the expression "one embodiment" used in the present invention does not mean the same embodiment, but is provided to emphasize and describe each unique feature that is different from the others. However, the above-described one embodiment does not exclude being realized in combination with features of another embodiment. For example, even if a feature described in one embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment unless there is a description that contradicts or contradicts the feature in the other embodiment.

[0299] The terms used in the present invention are merely used to describe one embodiment and are not intended to limit the present invention. In this case, a singular expression includes a plural expression unless a clearly different expression is used in the context. [Explanation of symbols]

[0300] 1000, 2000, 3000: Multilayer electronic components 1100: Mounting board 110:Main body 111: Dielectric layer 112, 113: Cover part 114, 115: Margin 121, 122: Internal electrode 131, 231, 331: 1st external electrode 132, 232, 332: 2nd external electrode 134, 135: Additional electrode layer 141, 142, 241, 242, 341, 342: plating layer 151, 251, 252, 253, 351: Insulating layers 161, 261: Additional insulating layer 180: Circuit board 181, 182: Electrode pads 191, 192: Handa

Claims

1. a main body including a dielectric layer and first internal electrodes and second internal electrodes alternately disposed with the dielectric layer sandwiched therebetween, the main body including a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in the third direction; a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a portion of the first surface; a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a portion of the first surface; an insulating layer disposed on the second surface and extending to a portion of the first and second connection portions; a plating layer disposed on the first band portion and the second band portion, the plating layer is in contact with the insulating layer on the first and second external electrodes; the end of the plating layer includes a region disposed between the insulating layer and the first and second external electrodes, and a region disposed so as to cover at least a portion of the insulating layer. Multilayer electronic components.

2. A laminated electronic component as described in claim 1, wherein the thickness of the insulating layer in the region in contact with the insulating layer gradually decreases toward the end.

3. A laminated electronic component as described in claim 1, wherein the plating layer contacts the insulating layer on the first and second connection portions.

4. A region of an end of the plating layer that is disposed between the insulating layer and the first and second connection portions is defined as a first region, and a region of an end of the plating layer that is disposed so as to cover at least a part of the insulating layer is defined as a second region, When the maximum length of the first region in the first direction is a1 and the maximum length of the second region in the first direction is a2, The multilayer electronic component according to claim 3 , wherein a1>a2 is satisfied.

5. A laminated electronic component as described in claim 1, wherein the plating layer contacts the insulating layer on the first and second band portions.

6. The region of the end of the plating layer that is arranged between the insulating layer and the first and second band portions is defined as a third region, and the region of the end of the plating layer that is arranged so as to cover a part of the insulating layer is defined as a fourth region, When the maximum length of the third region in the second direction is a3 and the maximum length of the fourth region in the second direction is a4, The multilayer electronic component according to claim 5 , wherein a3>a4 is satisfied.

7. H1 is an average size in a first direction from the first surface to the internal electrode arranged closest to the first surface among the first internal electrode and the second internal electrode; When the average size in a first direction from an extension line of the first surface to an end of the plating layer disposed on the first connection portion and the second connection portion is H2, The multilayer electronic component according to claim 1 , wherein H1≧H2 is satisfied.

8. When the average size of the body in the first direction is T, The multilayer electronic component according to claim 7, wherein H2<T / 2 is satisfied.

9. A laminated electronic component as described in claim 1, wherein the first connection portion and the second connection portion are positioned at a distance from the second surface.

10. The average size of the body in the second direction is L; The average size in the second direction from the extension line of the third surface to the end of the first band portion is B1; When the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, 2. The multilayer electronic component according to claim 1, wherein 0.2≦B1 / L≦0.4 and 0.2≦B2 / L≦0.4 are satisfied.

11. The maximum size in the second direction of the laminated electronic component is 1.1 mm or less, 2. The multilayer electronic component according to claim 1, wherein the maximum dimension of the multilayer electronic component in the third direction is 0.55 mm or less.

12. A laminated electronic component as described in claim 1, wherein the average thickness of the dielectric layer is 0.35 μm or less.

13. A laminated electronic component as described in claim 1, wherein the average thickness of the first internal electrode and the second internal electrode is 0.35 μm or less.

14. The main body includes a capacitance forming portion including first internal electrodes and second internal electrodes alternately arranged on either side of the dielectric layer, and a cover portion arranged on both end faces of the capacitance forming portion in a first direction; The multilayer electronic component according to claim 1 , wherein the average size of the cover portion in the first direction is 15 μm or less.

15. The first external electrode includes a third band portion extending from the first connection portion to a part of the second surface, The multilayer electronic component according to claim 1 , wherein the second external electrode includes a fourth band portion extending from the second connection portion to a portion of the second surface.

16. The first external electrode includes a first side band portion extending from the first connection portion to a portion of the fifth and sixth surfaces, The multilayer electronic component according to claim 1 , wherein the second external electrode includes a second side band portion extending from the second connection portion to a portion of the fifth and sixth surfaces.

17. The laminated electronic component according to claim 1 , further comprising an additional insulating layer disposed on the first surface and between the first band portion and the second band portion.

18. A laminated electronic component as described in Claim 16, wherein the size of the first and second side band portions in the second direction increases as they approach the first surface.

19. A laminated electronic component as described in Claim 16, wherein the insulating layer is arranged to cover the first side band portion, the second side band portion, the fifth surface, and a portion of the sixth surface.

20. the main body includes a first-third corner connecting the first surface and the third surface, a first-fourth corner connecting the first surface and the fourth surface, a second-third corner connecting the second surface and the third surface, and a second-fourth corner connecting the second surface and the fourth surface; the first-third corner and the second-third corner have a shape that contracts toward the center of the first direction of the main body as they approach the third surface, the first-fourth corner and the second-fourth corner have a shape that contracts toward the center of the first direction of the main body as they approach the fourth surface, the first external electrode includes a first corner portion extending from the first connection portion onto the first-third corner and the second-third corner, 2. The multilayer electronic component according to claim 1, wherein the second external electrode includes a second corner portion extending from the second connection portion onto the first-fourth corner and the second-fourth corner.

21. The average size in the second direction from the extension line of the third surface to the end of the first corner portion is B3, The average size in the second direction from the extension line of the fourth surface to the end of the second corner portion is B4, The average size in the second direction of the region where the third surface and the second internal electrode are separated is G1. When the average size in the second direction of the region where the fourth surface and the first internal electrode are separated is G2, The multilayer electronic component according to claim 20, wherein B3≦G1 and B4≦G2 are satisfied.

22. The average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, The average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, The average size in the second direction of the region where the third surface and the second internal electrode are separated is G1. When the average size in the second direction of the region where the fourth surface and the first internal electrode are separated is G2, The multilayer electronic component according to claim 1 , wherein B1≧G1 and B2≧G2 are satisfied.

23. 2. The multilayer electronic component according to claim 1, wherein an average thickness of the plating layer is thinner than an average thickness of the insulating layer.

24. The multilayer electronic component according to claim 1 , wherein the first connecting portion and the second connecting portion are disposed apart from the fifth surface and the sixth surface.

25. The multilayer electronic component according to claim 1 , wherein the insulating layer is disposed so as to cover a portion of the fifth surface and a portion of the sixth surface.

26. The multilayer electronic component according to claim 1 , wherein the insulating layer is disposed so as to cover the entire fifth surface and the entire sixth surface.

27. ​​The first external electrode includes a first connecting electrode disposed on the third surface and a first band electrode disposed on the first surface and connected to the first connecting electrode; The multilayer electronic component according to claim 1 , wherein the second external electrodes include a second connecting electrode disposed on the fourth surface and a second band electrode disposed on the first surface and connected to the second connecting electrode.

28. The multilayer electronic component according to claim 27 , wherein the first connecting electrode and the second connecting electrode are disposed apart from the fifth surface and the sixth surface.

29. The multilayer electronic component according to claim 27 , wherein the first connecting electrode and the second connecting electrode are disposed apart from the second surface.

30. The multilayer electronic component of claim 27 , wherein the first connecting electrode and the second connecting electrode contain the same metal as a metal contained in the internal electrode.

31. A laminated electronic component as described in Claim 27, wherein the first connecting electrode and the second connecting electrode are fired electrodes comprising a conductive metal and glass.

32. A laminated electronic component as described in claim 27, wherein the first band electrode and the second band electrode are fired electrodes comprising a conductive metal and glass.

33. 28. The multilayer electronic component according to claim 27, wherein the first band electrode and the second band electrode are plated layers.

34. The multilayer electronic component according to claim 27 , wherein the first connecting electrode and the second connecting electrode are plated layers.

Images