Laminated electronic component

Abstract

To provide a laminated electronic component with improved capacity per unit volume.SOLUTION: A laminated electronic component 1000 includes: a main body 110 with first to sixth surfaces; first and second external electrodes 131 and 132 each of which includes a first (second) connection part 131a (132a) arranged on the third (fourth) surface, a first (second) band part 131b (132b) extended from the first (second) connection part to a part of the first (second) surface, and a third (fourth) band part 131c (132c) extended from the first (second) connection part to a part of the second surface; an insulating layer 151 arranged on the first and second connection parts so as to cover the second surface and the third and fourth band parts; a first plating layer 141 arranged on the first band part; and a second plating layer 142 arranged on the second band part. End parts of the first and second plating layers and an end part of the insulating layer are arranged in contact with each other at a contact on the first and second external electrodes. A thickness of the end parts of the insulating layer and the plating layers decreases toward the contact.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and plays the role of charging or discharging electricity.

[0003] Such multilayer ceramic capacitors have the advantages of being small, yet guaranteeing high capacitance, and being easy to mount, making them suitable for use as components in various electronic devices. With the miniaturization and increased power output of various electronic devices such as computers and mobile devices, the demand for smaller and higher-capacitance multilayer ceramic capacitors is increasing.

[0004] Furthermore, in recent years, industry interest in automotive electronic components has been increasing, and multilayer ceramic capacitors are required to have high reliability characteristics for use in automobiles or infotainment systems.

[0005] Therefore, in Patent Document 1, in a multilayer electronic component mounted by solder, in order to suppress the occurrence of cracks in the base body due to tensile stress caused by the thermal contraction of the solder fillet, a glass layer is placed directly on the sintered body layer on each end face side so as to extend in a direction perpendicular to one main surface and side surface of the base body, and a part of the surface of the external electrode is formed, and a plating layer is placed on the surface of the external electrode that is not covered by the glass layer.

[0006] To miniaturize and increase the capacitance of multilayer ceramic capacitors, it is necessary to form the internal electrodes and dielectric layers thinly and increase the number of layers. This requires minimizing the volume of parts that do not affect capacitance formation and increasing the effective volume fraction necessary to achieve the desired capacitance.

[0007] Furthermore, in order to mount as many components as possible within the limited area of ​​the circuit board, it is necessary to minimize the mounting space.

[0008] Furthermore, as multilayer ceramic capacitors become smaller and their capacitance increases, the margin thickness decreases. This makes them more susceptible to external moisture penetration or plating solution penetration, potentially leading to a decrease in reliability. Therefore, there is a need for methods to protect multilayer ceramic capacitors from external moisture penetration or plating solution penetration. [Prior art documents] [Patent Documents]

[0009] [Patent Document 1] Japanese Patent Publication No. 2016-178219 [Overview of the Initiative] [Problems that the invention aims to solve]

[0010] One of the various objectives of the present invention is to provide a stacked electronic component with improved capacity per unit volume.

[0011] One of the various objectives of the present invention is to provide a multilayer electronic component with improved reliability.

[0012] One of the various objectives of the present invention is to provide a stacked electronic component that can minimize the mounting space.

[0013] One of the various objectives of the present invention is to solve the problem that when a glass layer is placed to form part of the surface of an external electrode, and a plating layer is placed on the surface of the external electrode that is not covered by the glass layer, the bonding force at the point where the plating layer and the glass layer are in contact becomes weak.

[0014] However, the objectives of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0015] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately on either side of the dielectric layer, and comprises a body having first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction; a first external electrode including a first connecting portion on the third surface, a first band portion extending from the first connecting portion to a part of the first surface, and a third band portion extending from the first connecting portion to a part of the second surface; and a second connecting portion on the fourth surface, extending from the second connecting portion to the first The device includes a second external electrode including a second band portion extending to a part of the surface and a fourth band portion extending from the second connection portion to a part of the second surface; an insulating layer disposed on the first and second connection portions and disposed to cover the second surface, third and fourth band portions; a first plating layer disposed on the first band portion; and a second plating layer disposed on the second band portion, wherein the ends of the first and second plating layers and the ends of the insulating layer are arranged to be in contact with each other at contacts on the first and second external electrodes, and the thickness of the ends of the first and second plating layers and the ends of the insulating layer can decrease toward the contacts.

[0016] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately on either side of the dielectric layer, and comprises a body having first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction, a first external electrode including a first connecting portion arranged on the third surface and a first band portion extending from the first connecting portion to a part of the first surface, a second connecting portion arranged on the fourth surface, and the second connecting The device includes a second external electrode including a second band portion extending from the connecting portion to a part of the first surface, an insulating layer disposed on the second surface and extending over the first and second connecting portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion, wherein the ends of the first and second plating layers and the ends of the insulating layer are arranged to be in contact with each other at the contacts on the first and second external electrodes, and the thickness of the ends of the first and second plating layers and the ends of the insulating layer can decrease toward the contacts.

[0017] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately on either side of the dielectric layer, comprising: a body having first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction; a first external electrode including a first connecting portion on the third surface, a first band portion extending from the first connecting portion to a part of the first surface, and a first corner portion extending from the first connecting portion to the corner connecting the second and third surfaces; a second external electrode including a second connecting portion on the fourth surface, a second band portion extending from the second connecting portion to a part of the first surface, and a second corner portion extending from the second connecting portion to the corner connecting the second and fourth surfaces; and disposed on the first and second connecting portions. The device includes an insulating layer arranged to cover the second surface, the first and second corner portions, a first plating layer arranged on the first band portion, and a second plating layer arranged on the second band portion, wherein when the average size in the second direction from the extension line of the third surface to the end of the first corner portion is B3, the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion is B4, the average size in the second direction of the region separated from the third surface and the second internal electrode is G1, and the average size in the second direction of the region separated from the fourth surface and the first internal electrode is G2, the conditions B3≦G1 and B4≦G2 are satisfied, the ends of the first and second plating layers and the ends of the insulating layer are arranged to be in contact with each other at the contacts on the first and second external electrodes, and the thickness of the ends of the first and second plating layers and the ends of the insulating layer can decrease toward the contacts.

[0018] A multilayer electronic component according to an embodiment of the present invention includes a dielectric layer, and first and second internal electrodes alternately arranged sandwiching the dielectric layer, having first and second surfaces facing in a first direction, third and fourth surfaces connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing in a third direction; a main body; a first connection electrode disposed on the third surface; a first external electrode including a first band electrode disposed on the first surface and connected to the first connection electrode; a second connection electrode disposed on the fourth surface; a second external electrode including a second band electrode disposed on the first surface and connected to the second connection electrode; a first insulating layer disposed on the first connection electrode; a second insulating layer disposed on the second connection electrode; a first plating layer disposed on the first band electrode; and a second plating layer disposed on the second band electrode. The ends of the first and second plating layers and the ends of the first and second insulating layers are arranged to contact each other at contacts on the first and second external electrodes, and the ends of the first and second plating layers and the ends of the first and second insulating layers can decrease in thickness toward the contacts.

Advantages of the Invention

[0019] One of the various advantages of the present invention is that by disposing an insulating layer on the connection portion of the external electrode and a plating layer on the band portion of the external electrode, the capacitance per unit volume of the multilayer electronic component is improved and the reliability is improved.

[0020] One of the various advantages of the present invention is that the mounting space of the multilayer electronic component is minimized.

[0021] One of the various advantages of the present invention is that the bonding strength of the multilayer electronic component is improved by minimizing the contact area between the insulating layer and the plating layer, and the fixing strength during mounting on the substrate is improved.

[0022] However, the various and beneficial advantages and effects of the present invention are not limited to the above content and can be more easily understood in the process of describing specific embodiments of the present invention.

Brief Description of the Drawings

[0023] [Figure 1] This is a schematic perspective view of a stacked electronic component according to an embodiment of the present invention. [Figure 2] This is a schematic perspective view of the main body of the stacked electronic component of FIG. 1. [Figure 3] This is a cross-sectional view taken along line I-I' of FIG. 1. [Figure 4] This is an enlarged view of the P1 region of FIG. 3. [Figure 5] This is an enlarged view of the P1' region of FIG. 4. [Figure 6] This is an exploded perspective view schematically showing the main body of FIG. 2 disassembled. [Figure 7] This is a schematic perspective view of a substrate on which the stacked electronic component of FIG. 1 is mounted. [Figure 8] This is a schematic perspective view of a stacked electronic component according to an embodiment of the present invention. [Figure 9] This is a cross-sectional view taken along line II-II' of FIG. 8. [Figure 10] This is an enlarged view of the P2 region of FIG. 9. [Figure 11] This is a schematic perspective view of a stacked electronic component according to an embodiment of the present invention. [Figure 12] This is a cross-sectional view taken along line III-III' of FIG. 11. [Figure 13] This is a schematic perspective view of a stacked electronic component according to an embodiment of the present invention. [Figure 14] This is a cross-sectional view taken along line IV-IV' of FIG. 13. [Figure 15] This is an enlarged view of the P3 region of FIG. 14. [Figure 16] This is a schematic perspective view of a stacked electronic component according to an embodiment of the present invention. [Figure 17] This is a cross-sectional view taken along line V-V' of FIG. 16. [Figure 18] This is a schematic perspective view of a stacked electronic component according to an embodiment of the present invention. [Figure 19]This is a cross-sectional view along line VI-VI' in Figure 18. [Figure 20] This shows a modified version of Figure 18. [Figure 21] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 22] This is a cross-sectional view along line VII-VII' in Figure 21. [Figure 23] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 24] This is a cross-sectional view along line VIII-VIII' in Figure 23. [Figure 25] This shows a modified version of Figure 23. [Figure 26] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 27] This is a cross-sectional view along the line IX-IX' in Figure 26. [Figure 28] This shows a modified version of Figure 26. [Figure 29] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 30] This is a cross-sectional view along line X-X' in Figure 29. [Figure 31] This shows a modified version of Figure 29. [Figure 32] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 33] This is a cross-sectional view along line XI-XI' in Figure 32. [Figure 34] This shows a modified version of Figure 32. [Figure 35] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 36] This is a cross-sectional view along line XII-XII' in Figure 35. [Figure 37] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 38]This is a cross-sectional view along line XIII-XIII' in Figure 37. [Figure 39] This shows a modified version of Figure 37. [Figure 40] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 41] This is a cross-sectional view along line XIV-XIV' in Figure 39. [Figure 42] This is a magnified view of the K1 region in Figure 41. [Figure 43] This is a cross-sectional view of a stacked electronic component according to yet another embodiment of the present invention. [Figure 44] This is another variation of Figure 18. [Figure 45] This is yet another variation of Figure 18. [Modes for carrying out the invention]

[0024] Preferred embodiments of the present invention will be described below with reference to the attached drawings. However, embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to give a more complete explanation of the present invention to a person with average skill in the art. Accordingly, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for a clearer explanation.

[0025] In order to clearly explain the present invention, parts unrelated to the explanation are omitted in the drawings, thicknesses are enlarged to clearly represent various layers and regions, and components with the same function within the scope of the same concept are described using the same reference numerals. Furthermore, throughout the specification, when a component is "included," unless otherwise stated, it does not mean that other components are excluded, but rather that other components may be included.

[0026] In drawings, the first direction can be defined as the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0027] Figure 1 is a schematic perspective view of a multilayer electronic component according to one embodiment of the present invention. Figure 2 is a schematic perspective view of the main body of the multilayer electronic component in Figure 1. Figure 3 is a cross-sectional view along line I-I' in Figure 1. Figure 4 is an enlarged view of region P1 in Figure 3. Figure 5 is an enlarged view of region P1' in Figure 4. Figure 6 is an exploded perspective view of the main body in Figure 2, shown in disassembled form. Figure 7 is a schematic perspective view of a substrate on which the multilayer electronic component in Figure 1 is mounted.

[0028] A stacked electronic component 1000 according to one embodiment of the present invention will be described below with reference to Figures 1 to 7.

[0029] A stacked electronic component 1000 according to one embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately on either side of the dielectric layer, and comprises a body 110 having first and second surfaces 1 and 2 facing each other in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing each other in a third direction; a first external electrode 131 including a first connecting portion 131a arranged on the third surface, a first band portion 131b extending from the first connecting portion to a part of the first surface, and a third band portion 131c extending from the first connecting portion to a part of the second surface; and a second connecting portion 132a arranged on the fourth surface, extending from the second connecting portion to the first The device includes a second external electrode 132 including a second band portion 132b extending to a part of the surface and a fourth band portion 132c extending from the second connection portion to a part of the second surface; an insulating layer 151 disposed on the first and second connection portions and disposed to cover the second surface, third and fourth band portions 131c and 132c; a first plating layer 141 disposed on the first band portion 131b; and a second plating layer 142 disposed on the second band portion 132b, wherein the ends S1 of the first and second plating layers 141 and 142 and the end of the insulating layer 151 are arranged to be in contact with each other at the contacts on the first and second external electrodes 131 and 132, and the thickness of the ends of the insulating layer and plating layer can be reduced toward the contacts.

[0030] The main body 110 has dielectric layers 111 and internal electrodes 121 and 122 stacked alternately.

[0031] The specific shape of the main body 110 is not particularly limited, but as shown in the figure, the main body 110 may have a hexahedral shape or a similar shape. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 may not have a perfectly straight hexahedral shape, but may have a substantially hexahedral shape.

[0032] The main body 110 may have first and second surfaces 1 and 2 facing each other in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and facing each other in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first and second surfaces 1 and 2 and connected to the third and fourth surfaces 3 and 4 and facing each other in a third direction.

[0033] In one embodiment, the main body 110 includes a first-to-third corner connecting the first and third surfaces, a first-to-fourth corner connecting the first and fourth surfaces, a second-to-third corner connecting the second and third surfaces, and a second-to-fourth corner connecting the second and fourth surfaces, wherein the first-to-third corner and the second-to-third corner are contracted towards the center of the main body in the first direction as they approach the third surface, and the first-to-fourth corner and the second-to-fourth corner are contracted towards the center of the main body in the first direction as they approach the fourth surface.

[0034] Due to the overlap of margin regions on the dielectric layer 111 where internal electrodes 121 and 122 are not placed, a step difference is created due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface with the third to fifth surfaces and / or the corners connecting the second surface with the third to fifth surfaces may have a shape that is contracted toward the center of the body 110 in the first direction when the first or second surface is used as a reference. Alternatively, due to the contraction behavior during the sintering process of the body, the corners connecting the first surface 1 with the third to sixth surfaces 3, 4, 5, and 6 and / or the corners connecting the second surface 2 with the third to sixth surfaces 3, 4, 5, and 6 may have a shape that is contracted toward the center of the body 110 in the first direction when the first or second surface is used as a reference. Alternatively, to prevent chipping defects, the corners connecting each face of the main body 110 can be rounded by performing a separate process, thereby allowing the corners connecting the first face with the third to sixth faces and / or the corners connecting the second face with the third to sixth faces to have a rounded shape.

[0035] The above-mentioned corners may include the 1st-3rd corner connecting the 1st and 3rd faces, the 1st-4th corner connecting the 1st and 4th faces, the 2nd-3rd corner connecting the 2nd and 3rd faces, and the 2nd-4th corner connecting the 2nd and 4th faces. Additionally, the corners may include the 1st-5th corner connecting the 1st and 5th faces, the 1st-6th corner connecting the 1st and 6th faces, the 2nd-5th corner connecting the 2nd and 5th faces, and the 2nd-6th corner connecting the 2nd and 6th faces. The 1st to 6th faces of the main body 110 are almost flat, and any non-flat areas can be considered corners. Hereinafter, the extension of each face may mean a line extended from the flat portion of each face.

[0036] In this case, the regions of the external electrodes 131 and 132 located on the corners of the main body 110 can be designated as corner portions, the regions located on the third and fourth surfaces of the main body 110 can be designated as connecting portions, and the regions located on the first and second surfaces of the main body can be designated as band portions.

[0037] On the other hand, in order to suppress the step caused by the internal electrodes 121 and 122, if the internal electrodes are cut after lamination so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115, the portions connecting the first surface with the fifth and sixth surfaces and the portions connecting the second surface with the fifth and sixth surfaces may not have a contracted form.

[0038] The multiple dielectric layers 111 that make up the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0039] According to one embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, or the like can be used. The barium titanate-based material can include BaTiO3-based ceramic powder. Examples of the ceramic powder include BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1) in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc.

[0040] In addition, for the raw material for forming the dielectric layer 111, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to powders such as barium titanate (BaTiO3) according to the purpose of the present invention.

[0041] On the other hand, the average thickness td of the dielectric layer 111 does not need to be particularly limited.

[0042] However, generally, when the dielectric layer is formed thinly with a thickness less than 0.6 μm, especially when the thickness of the dielectric layer is 0.35 μm or less, the reliability may decrease.

[0043] According to one embodiment of the present invention, by disposing an insulating layer on the connection portion of the external electrode and disposing a plating layer on the band portion of the external electrode, moisture penetration from the outside, penetration of the plating solution, etc. can be prevented, and the reliability can be improved. Therefore, even when the average thickness of the dielectric layer 111 is 0.35 μm or less, excellent reliability can be ensured.

[0044] Therefore, when the average thickness of the dielectric layer 111 is 0.35 μm or less, the reliability improvement effect according to the present invention can become more pronounced.

[0045] The average thickness td of the dielectric layer 111 may refer to the average thickness of the dielectric layer 111 disposed between the first internal electrode 121 and the second internal electrode 122.

[0046] The average thickness of the dielectric layer 111 can be measured by image scanning the cross-section of the main body 110 in the length and thickness direction (LT) with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the thickness of one dielectric layer in the scanned image can be measured at 30 equally spaced points in the length direction, and the average value can be calculated. These 30 equally spaced points can be specified by the capacitance forming section Ac. Furthermore, by extending this average value measurement to 10 dielectric layers, the average thickness of the dielectric layers can be further generalized.

[0047] The main body 110 may include a capacitance forming portion Ac which is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 which are arranged to face each other with a dielectric layer 111 in between, and cover portions 112 and 113 which are formed on the upper and lower parts of the capacitance forming portion Ac in a first direction.

[0048] Furthermore, the capacitance-forming portion Ac is a part that contributes to the capacitance formation of the capacitor, and can be formed by repeatedly stacking multiple first and second internal electrodes 121 and 122 with a dielectric layer 111 in between.

[0049] The cover portions 112 and 113 may include an upper cover portion 112 positioned above the volume forming portion Ac in the first direction, and a lower cover portion 113 positioned below the volume forming portion Ac in the first direction.

[0050] The upper cover portion 112 and the lower cover portion 113 described above can be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, respectively, and can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0051] The upper cover portion 112 and the lower cover portion 113 described above do not include internal electrodes and may contain the same material as the dielectric layer 111.

[0052] In other words, the upper cover portion 112 and the lower cover portion 113 can include ceramic materials, for example, barium titanate (BaTiO3) based ceramic materials.

[0053] On the other hand, the average thickness of the cover portions 112 and 113 is not particularly limited. However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the average thickness tc of the cover portions 112 and 113 can be 15 μm or less. Furthermore, according to one embodiment of the present invention, by arranging the insulating layer on the connection portion of the external electrode and the plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of the plating solution, thereby improving reliability. Therefore, even when the average thickness tc of the cover portions 112 and 113 is 15 μm or less, excellent reliability can be ensured.

[0054] The average thickness tc of the cover portions 112 and 113 represents the size in the first direction and can be the average value of the sizes of the cover portions 112 and 113 in the first direction measured at five equally spaced points on the upper or lower part of the volume forming portion Ac.

[0055] Furthermore, margin portions 114 and 115 can be arranged on the side surface of the volume-forming portion Ac.

[0056] The margin portions 114 and 115 may include a first margin portion 114 located on the fifth surface 5 of the main body 110 and a second margin portion 115 located on the sixth surface 6. That is, the margin portions 114 and 115 can be located on both end surfaces in the width direction of the ceramic main body 110.

[0057] As shown in Figure 3, the margin portions 114 and 115 may refer to the regions between the interface between both ends of the first and second internal electrodes 121 and 122 and the body 110 in a cross-section obtained by cutting the main body 110 in the width-thickness (WT) direction.

[0058] The margins 114 and 115 essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0059] The margin portions 114 and 115 can be formed by applying a conductive paste to the ceramic green sheet, excluding the areas where the margin portions should be formed, to form internal electrodes.

[0060] Furthermore, in order to suppress the step caused by the internal electrodes 121 and 122, after lamination the internal electrodes are cut so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers may be laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115.

[0061] On the other hand, the width of the margin portions 114 and 115 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the average width of the margin portions 114 and 115 can be 15 μm or less. Furthermore, according to one embodiment of the present invention, by arranging the insulating layer on the connection portion of the external electrode and the plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of the plating solution, thereby improving reliability. Therefore, even when the average width of the margin portions 114 and 115 is 15 μm or less, excellent reliability can be ensured.

[0062] The average width of the margin portions 114 and 115 refers to the average size of the margin portions 114 and 115 in the third direction, and can be the average value of the sizes of the margin portions 114 and 115 in the third direction measured at five equally spaced points on the side surface of the volume forming portion Ac.

[0063] The internal electrodes 121 and 122 are arranged alternately with the dielectric layer 111.

[0064] The internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are arranged alternately so as to face each other across the dielectric layer 111 that constitutes the main body 110, and can be exposed on the third and fourth surfaces 3 and 4 of the main body 110, respectively.

[0065] Referring to Figure 3, the first internal electrode 121 can be exposed via the third surface 3, separated from the fourth surface 4, and the second internal electrode 122 can be exposed via the fourth surface 4, separated from the third surface 3. The first external electrode 131 can be placed on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 132 can be placed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0066] In other words, the first internal electrode 121 is not connected to the second external electrode 132, but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131, but is connected to the second external electrode 132. Therefore, the first internal electrode 121 can be formed at a certain distance from the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance from the third surface 3.

[0067] At this time, the first and second internal electrodes 121 and 122 can be electrically isolated from each other by the dielectric layer 111 placed between them.

[0068] The main body 110 can be formed by alternately stacking ceramic green sheets printed with the first internal electrode 121 and ceramic green sheets printed with the second internal electrode 122, and then firing them.

[0069] The materials used to form the internal electrodes 121 and 122 are not particularly limited, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 may include one or more of the following: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0070] Furthermore, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of the following on a ceramic green sheet: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. While screen printing or gravure printing can be used as the printing method for the conductive paste for internal electrodes, the present invention is not limited to these methods.

[0071] On the other hand, the average thickness te of the internal electrodes 121 and 122 does not need to be particularly limited.

[0072] However, generally speaking, when the internal electrode is formed to a thickness of less than 0.6 μm, especially when the thickness of the internal electrode is 0.35 μm or less, reliability may be reduced.

[0073] According to one embodiment of the present invention, by placing an insulating layer on the connection portion of the external electrode and a plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of the plating solution, thereby improving reliability. Therefore, even when the average thickness of the internal electrodes 121 and 122 is 0.35 μm or less, excellent reliability can be ensured.

[0074] Therefore, when the average thickness of the internal electrodes 121 and 122 is 0.35 μm or less, the effects of the present invention can become more pronounced, and miniaturization and increased capacitance of the stacked electronic component can be achieved more easily.

[0075] The average thickness te of the internal electrodes 121 and 122 mentioned above may represent the average thickness of the internal electrodes 121 and 122.

[0076] The average thickness of the internal electrodes 121 and 122 can be measured by image scanning the cross-section of the main body 110 in the length and thickness direction (LT) using a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the thickness of one internal electrode in the scanned image can be measured at 30 equally spaced points in the length direction, and the average value can be calculated. These 30 equally spaced points can be specified in the capacitance forming section Ac. Furthermore, by extending this average value measurement to 10 internal electrodes, the average thickness of the internal electrodes can be further generalized.

[0077] External electrodes 131 and 132 can be arranged on the third surface 3 and fourth surface 4 of the main body 110. The external electrodes 131 and 132 may include first and second external electrodes 131 and 132, respectively, which are arranged on the third and fourth surfaces 3 and 4 of the main body 110 and connected to first and second internal electrodes 121 and 122, respectively.

[0078] The external electrodes 131 and 132 may include a first external electrode 131 having a first connecting portion 131a located on the third surface and a first band portion 131b extending from the first connecting portion to a part of the first surface, and a second external electrode 132 having a second connecting portion 132a located on the fourth surface and a second band portion 132b extending from the second connecting portion to a part of the first surface. The first connecting portion 131a may be connected to the first internal electrode 121 on the third surface, and the second connecting portion 132a may be connected to the second internal electrode 122 on the fourth surface.

[0079] Furthermore, the first external electrode 131 may include a third band portion 131c extending from the first connection portion 131a to a part of the second surface, and the second external electrode 132 may include a fourth band portion 132c extending from the second connection portion 132a to a part of the second surface. In addition, the first external electrode 131 may include a first side band portion extending from the first connection portion 131a to a part of the fifth and sixth surfaces, and the second external electrode 132 may include a second side band portion extending from the second connection portion 132a to a part of the fifth and sixth surfaces.

[0080] However, the third band section, the fourth band section, the first side band section, and the second side band section are not necessarily essential components in this invention. The first and second external electrodes 131 and 132 do not need to be placed on the second surface, nor do they need to be placed on the fifth and sixth surfaces. By not placing the first and second external electrodes 131 and 132 on the second surface, the first and second external electrodes 131 and 132 can be placed below the extension line of the second surface of the main body. Also, the first and second connecting sections 131a and 132a can be placed away from the fifth and sixth surfaces, and the first and second connecting sections 131a and 132a can be placed away from the second surface. Also, the first and second band sections 131b and 132b can be placed away from the fifth and sixth surfaces. Furthermore, referring to Figures 44 and 45, various embodiments of the stacked electronic component 1005', 1005'' (modified versions of the stacked electronic component 1005 in Figure 18) are shown, where the first or second connecting portion 131a-5', 132a-5' can be separated from the fifth and sixth surfaces, and the first or second connecting portion 131a-5', 132a-5' can be separated from the second surface. In addition, the first or second band portion (131b or 132b) can also be separated from the fifth and sixth surfaces.

[0081] On the other hand, when the first and second external electrodes 131 and 132 include the third and fourth band portions 131c and 132c, it is indicated that an insulating layer is placed on the third and fourth band portions 131c and 132c, but it is not limited to this, and a plating layer can be placed on the third and fourth band portions 131c and 132c to improve ease of mounting. Also, the first and second external electrodes 131 and 132 can include the third and fourth band portions 131c and 132c but not the side band portions, in which case the first and second connecting portions 131a and 132a and the first to fourth band portions 131b, 132b, 131c, and 132c can be separated from the fifth and sixth surfaces.

[0082] In this embodiment, a structure is described in which the stacked electronic component 1000 has two external electrodes 131 and 132. However, the number and shape of the external electrodes 131 and 132 can be modified according to the shape of the internal electrodes 121 and 122 or other purposes.

[0083] On the other hand, the external electrodes 131 and 132 can be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc. Furthermore, they can have a multilayer structure.

[0084] The external electrodes 131 and 132 may be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin.

[0085] Furthermore, the external electrodes 131 and 132 may be formed in a configuration in which a fired electrode and a resin-based electrode are formed sequentially on the main body. Alternatively, the external electrodes 131 and 132 may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0086] The conductive metal included in the external electrodes 131 and 132 can be any material with excellent electrical conductivity, but is not particularly limited. For example, the conductive metal can be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. Preferably, the external electrodes 131 and 132 can include one or more of Ni and Ni alloys, which can further improve connectivity with the internal electrodes 121 and 122 containing Ni.

[0087] The insulating layer 151 can be placed on the first and second connection portions 131a and 132a.

[0088] Since the first and second connection parts 131a and 132a are connected to the internal electrodes 121 and 122, they could potentially become pathways for the penetration of plating solution during the plating process or for the penetration of moisture during actual use. In the present invention, since an insulating layer 151 is placed on the connection parts 131a and 132a, it is possible to prevent the penetration of moisture or plating solution from the outside.

[0089] The insulating layer 151 can be positioned in contact with the first and second plating layers 141 and 142. In this case, the insulating layer 151 may be in contact with the first and second plating layers 141 and 142 in a manner that covers a portion of their edges, or the first and second plating layers 141 and 142 may be in contact with the insulating layer 151 in a manner that covers a portion of its edges.

[0090] The insulating layer 151 can be placed on the first and second connection portions 131a and 132a and positioned to cover the second surface and the third and fourth band portions 131c and 132c. In this case, the insulating layer 151 can be positioned to cover the area on the second surface where the third and fourth band portions 131c and 132c are not located, and the third and fourth band portions 131c and 132c themselves. This allows the insulating layer 151 to cover the area where the ends of the third and fourth band portions 131c and 132c are in contact with the main body 110, thereby blocking the moisture penetration path and further improving moisture resistance reliability.

[0091] The insulating layer 151 is positioned on the second surface and can extend over the first and second connection portions 131a and 132a. Furthermore, if the external electrodes 131 and 132 are not positioned on the second surface, the insulating layer can be positioned to cover the entire second surface. On the other hand, the insulating layer 151 does not necessarily have to be positioned on the second surface. The insulating layer does not have to be positioned on part or all of the second surface; it may be separated into two parts, each positioned on the first and second connection portions 131a and 132a. If the insulating layer is not positioned on the entire second surface, it can be positioned below the extension of the second surface. Also, even if the insulating layer is not positioned on the second surface, it can extend from the first and second connection portions 131a and 132a to the fifth and sixth surfaces, forming a single insulating layer.

[0092] Furthermore, the insulating layer 151 can be positioned to cover the first and second side band portions, and parts of the fifth and sixth surfaces. In this case, parts of the fifth and sixth surfaces not covered by the insulating layer 151 can be exposed to the outside.

[0093] Furthermore, the insulating layer 151 can be arranged to cover the first and second side band portions, the fifth surface, and the sixth surface entirely. In this case, the fifth and sixth surfaces are not exposed to the outside, thus improving moisture resistance reliability. Also, the connection portions 131a and 132a are not directly exposed to the outside, thus improving the reliability of the laminated electronic component 1000. More specifically, the insulating layer can cover the first and second side band portions entirely, and the fifth and sixth surfaces can cover all areas except those where the first and second side band portions are formed.

[0094] The insulating layer 151 can prevent the formation of plating layers 141 and 142 on the external electrodes 131 and 132 on which the insulating layer 151 is placed, thereby improving sealing properties and minimizing the penetration of moisture, plating solutions, etc., from the outside.

[0095] The insulating layer 151 may include, but is not limited to, a glass material with excellent resistance to plating solutions, such as a glass material containing Si, and can be composed of a material having sufficient strength to protect the laminated electronic component 1000 from tensile stress due to thermal shrinkage. Furthermore, the insulating layer 151 may contain a single component or multiple components, and more preferably, one or more additives selected from TiO2, BaTiO3, Al2O3, SiO2, BaO, etc., may be included to improve the bonding strength with the main body 110 or external electrodes 131, 132.

[0096] The method for forming the insulating layer 151 varies depending on the components and purpose. For example, it can be formed by first forming a coating film with an insulating paste using a squeegee, then placing external electrodes 131 and 132 on the main body 110, sequentially immersing each end face, and then drying at a temperature of 150°C. It can also be formed by sol-gel processing, chemical vapor deposition (CVD), atomic layer deposition (ALD), etc., but is not limited to these, and may be formed by other methods that can form a thin and uniform insulating layer.

[0097] The first and second plating layers 141 and 142 can be placed on the first and second band portions 131b and 132b, respectively. The plating layers 141 and 142 can play a role in improving mounting characteristics. By placing the plating layers 141 and 142 on the band portions 131b and 132b, the mounting space can be minimized, and the penetration of the plating solution into the internal electrodes can be minimized, thereby improving reliability. One end of the first and second plating layers 141 and 142 can be in contact with the first surface, and the other end can be in contact with the insulating layer 151.

[0098] The types of plating layers 141 and 142 are not particularly limited and can be plating layers containing one or more of Cu, Ni, Sn, Ag, Au, Pd, and their alloys, and can be formed in multiple layers.

[0099] As a more specific example of the plating layers 141 and 142, the plating layers 141 and 142 can be Ni plating layers or Sn plating layers, and can be configured such that the Ni plating layer and the Sn plating layer are formed sequentially on the first and second band portions 131b and 132b.

[0100] Patent Document 1 introduces a glass layer that is directly provided on one main surface of the base body and extends in a direction perpendicular to the side surface, directly on the sintered body layer on each end face side, to suppress cracks in the laminated electronic component due to thermal shrinkage of the solder fillet, and a metal layer that is provided to cover the sintered body layer other than the part covered by the glass layer for mounting by solder fillet, and to constitute another part of the surface of the external electrode.

[0101] The glass layer described in Patent Document 1 is made of a glass material having a Si content of 20 mol% to 65 mol%, which is a glass material with excellent resistance to plating solutions. On the other hand, Patent Document 1 discloses that if the Si mole fraction is less than 20 mol%, the resistance to plating solutions is insufficient, and if it exceeds 65 mol%, the glass softening point becomes higher, the wettability to the sintered body layer decreases, and the glass layer becomes more prone to peeling.

[0102] Generally, glass layers formed from Si-containing glass materials, regardless of their Si content, are composed of insulating materials, resulting in a problem of weak adhesion to plating layers and external electrodes made of metal components. Therefore, residual stress generated during the manufacturing process and external impacts may cause delamination in multilayer electronic components, potentially reducing the overall resistance of the multilayer electronic component to external impacts.

[0103] In particular, the structure disclosed in Patent Document 1 has a structure in which the glass layer and the metal layer are simply connected with the same thickness or substantially the same thickness, which may cause further problems as described above, and this may lead to a decrease in bonding strength when the multilayer electronic component is mounted on the substrate by soldering.

[0104] Therefore, the present invention aims to improve the overall bonding strength of the multilayer electronic component and enhance the bonding strength by minimizing the area in which the insulating layer and the plating layer come into contact.

[0105] In one embodiment, the ends S1 of the first and second plating layers 141 and 142 and the end of the insulating layer 151 are arranged to be in contact with each other at the contacts on the first and second external electrodes 131 and 132, and the ends S1 of the first and second plating layers 141 and 142 and the end S2 of the insulating layer 151 can decrease in thickness toward the contacts.

[0106] As a result, even when the average thickness t1 of the first and second plating layers 141 and 142 and the average thickness t2 of the insulating layer 151 are substantially the same, the area in contact between the first and second plating layers 141 and 142 and the insulating layer 151 can be minimized, thereby improving the overall bonding strength of the multilayer electronic component 1000.

[0107] Specifically, the first and second plating layers 141 and 142 are arranged on the first and second external electrodes and include an end S1 which is in contact with the insulating layer 151, and the insulating layer 151 may include an end S2 which is arranged on the first and second external electrodes and is in contact with the first and second plating layers 141 and 142.

[0108] The ends S1 and S2 can be in contact with each other, and the end S1 of the plating layer can cover a portion of the end S2 of the insulating layer, or the end S2 of the insulating layer can cover a portion of the end S1 of the plating layer. As a result, the ends S1 of the plating layer and S2 of the insulating layer can have a configuration in which their thickness gradually decreases toward the point where they are in contact with each other.

[0109] In this invention, the description is based on a configuration in which the end S1 of the plating layer covers a portion of the end S2 of the insulating layer. However, the invention is not limited to this configuration, and can be similarly understood when the end S2 of the insulating layer covers a portion of the end S1 of the plating layer.

[0110] In one embodiment, the ends S1 of the first and second plating layers and the end S2 of the insulating layer are in contact with each other, forming a recessed groove R toward the main body 110.

[0111] When the contact area between the ends S1 of the first and second plating layers and the end S2 of the insulating layer is large, the bonding strength may decrease due to the difference in the components of the plating layers 141 and 142 and the insulating layer 151. Specifically, the plating layers 141 and 142 can contain one or more of the following: Cu, Ni, Sn, Ag, Au, Pd, and their alloys, and therefore contain conductive materials, while the insulating layer 151 contains insulating materials such as glass material containing Si, resulting in a problem of weak bonding strength between them. Consequently, the larger the contact area between the first and second plating layers 141 and 142 and the insulating layer 151, the higher the possibility of delamination occurring, which may lead to a decrease in the adhesion strength of the multilayer electronic component 1000. According to one embodiment of the present invention, by having the ends S1 of the first and second plating layers and the end S2 of the insulating layer come into contact with each other to form a recessed groove R, the area in contact between the first and second plating layers 141, 142 and the insulating layer 151 can be minimized, thereby reducing the possibility of delamination and improving the bonding strength of the multilayer electronic component 1000.

[0112] In one embodiment, when the average thickness of the insulating layer is t2 and the average size in the second direction from point P, which is located on the outermost side of the contact in the second direction, to the first and second external electrodes is t3, the condition 1 / 20 ≤ t3 / t2 ≤ 1 / 5 can be satisfied.

[0113] The ends S1 of the first and second plating layers 141 and 142 and the ends of the insulating layer 151 can be in contact at contacts on the first and second external electrodes 131 and 132. These contacts may refer to contacts on the length-thickness cross section (LT cross section) of the multilayer electronic component 1000. However, these contacts do not refer to any single specific point, but can be a tangent line consisting of multiple contacts, and in the case of the entire multilayer electronic component rather than a cross section, the first and second plating layers 141 and 142 can be surfaces in contact with the insulating layer 151.

[0114] From this perspective, when viewed from a cross-section in the length-thickness direction (LT cross-section), the area in contact between the end S1 of the first and second plating layers and the end S2 of the insulating layer can differ depending on the position of point P, which is located on the outermost side in the second direction among the multiple contact points.

[0115] At this time, if the average thickness of the insulating layer is t2 and the average size in the second direction from point P, which is located on the outermost side of the contact in the second direction, to the first and second external electrodes is t3, then if t3 / t2 exceeds 1 / 55, the contact area between the first and second plating layers 141 and 142 and the insulating layer 151 increases, which may reduce the adhesion strength of the laminated electronic component 1000.

[0116] On the other hand, there is no particular lower limit to the t3 / t2 ratio. However, it is preferable that it be 1 / 20 or more in order to prevent moisture penetration from the outside.

[0117] Therefore, according to one embodiment of the present invention, by satisfying 1 / 20 ≤ t3 / t2 ≤ 1 / 5, the bonding strength of the stacked electronic component 1000 can be improved and its resistance to moisture penetration from the outside can be improved.

[0118] The average size t3 in the second direction from point P, the outermost point in the second direction among the contacts, to the first and second external electrodes can be the average of the values ​​measured in the cross-section (LT cross-section) cut in the first and second directions at five points that are equally spaced in the third direction. Specifically, it can be the average of the values ​​measured in the second direction from the outermost point in the second direction among the contacts where the insulating layer and the plating layer are in contact on the first and second external electrodes, to the surfaces of the first and second external electrodes.

[0119] There are various methods for forming the ends S1 of the first and second plating layers 141 and 142 and the end S2 of the insulating layer 151 so that their thickness decreases towards the contact point, or for forming grooves. For example, when forming the insulating layer by a dipping method, the shape of the plastic carrier plate or rubber jig that fixes the top of the multilayer electronic component can be manufactured to have a shape corresponding to the shape of the ends of the insulating layer and the ends of the plating layer. Furthermore, a method can be used to minimize the contact surface (t3 / t2) between the plating layer and the insulating layer by applying a water-repellent substance to the insulating layer.

[0120] In one embodiment, the ends S1 of the first and second plating layers 141 and 142 and the end S2 of the insulating layer 151 can be arranged to be in contact with each other below the extension line of the first surface. In this case, the formation of solder fillets on the third and fourth surfaces of the multilayer electronic components mounted on the substrate can be prevented or minimized, thereby reducing the rate of short circuits caused by solder between multilayer electronic components. This makes it possible to minimize the spacing between mounted multilayer electronic components and improve the mounting density of multilayer electronic components on the substrate.

[0121] In one embodiment, the insulating layer 151 can be arranged extending from the first and second connection portions 131a, 132a to a portion of the first and second band portions 131b, 132b, at which point the ends S1 of the first and second plating layers and the end S2 of the insulating layer can be arranged to be in contact with each other at the contact points on the first and second band portions 131b, 132b. This prevents solder fillets from forming on the connection portions when the multilayer electronic components are mounted on the substrate, and further reduces the rate of short circuits caused by solder between multilayer electronic components. Therefore, the spacing between mounted multilayer electronic components can be further minimized, and the mounting density of multilayer electronic components on the substrate can be significantly improved.

[0122] In one embodiment, the first and second plating layers 141 and 142 can be arranged to extend and cover a portion of the first and second connecting portions 131a and 132a, respectively. When H1 is the average size in the first direction from the first internal electrodes 121 and 122 to the internal electrode closest to the first surface 1, and H2 is the average size in the first direction from the extension of the first surface 1 to the ends of the first and second plating layers 141 and 142 arranged on the first and second connecting portions 131a and 132a, it is possible to satisfy H1 > H2. This suppresses the penetration of the plating solution into the internal electrodes during the plating process, thereby improving reliability.

[0123] H1 and H2 can be the average of values ​​measured in cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction. H1 can be the average of values ​​measured at the point in each cross-section where the internal electrode closest to the first surface 1 is connected to the external electrode, and H2 can be the average of values ​​measured with reference to the edge of the plating layer in contact with the external electrode. The extension line of the first surface used as a reference when measuring H1 and H2 can be the same.

[0124] In one embodiment, the first plating layer 141 can be positioned to cover the end of the insulating layer 151 that is located on the first external electrode 131, and the second plating layer 142 can be positioned to cover the end of the insulating layer 151 that is located on the second external electrode 132. This strengthens the bonding force between the insulating layer 151 and the plating layers 141 and 142, thereby improving the reliability of the multilayer electronic component 1000.

[0125] In one embodiment, the insulating layer 151 can be positioned to cover the end of the first plating layer 141 that is located on the first external electrode 131, and the insulating layer 151 can be positioned to cover the end of the second plating layer 142 that is located on the second external electrode 132. This strengthens the bonding force between the insulating layer 151 and the plating layers 141 and 142, thereby improving the reliability of the multilayer electronic component 1000.

[0126] In one embodiment, when the average size of the main body 110 in the second direction is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, the conditions 0.2 ≤ B1 / L ≤ 0.4 and 0.2 ≤ B2 / L ≤ 0.4 can be satisfied.

[0127] If B1 / L and B2 / L are less than 0.2, it may be difficult to ensure sufficient adhesion strength. On the other hand, if B2 / L exceeds 0.4, there is a risk of leakage current occurring between the first band portion 131b and the second band portion 132b under high voltage current, and there is a risk that the first band portion 131b and the second band portion 132b may become electrically connected due to plating bleeding during the plating process.

[0128] B1, B2, and L can be the average of values ​​measured at cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction.

[0129] Referring to Figure 7, which shows a mounting substrate 1100 on which a multilayer electronic component 1000 is mounted, the plating layers 141 and 142 of the multilayer electronic component 1000 can be joined to electrode pads 181 and 182 placed on the substrate 180 by solder 171 and 172.

[0130] On the other hand, when the internal electrodes 121 and 122 are stacked in a first direction, the stacked electronic component 1000 can be horizontally mounted on the substrate 180 such that the internal electrodes 121 and 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting, and when the internal electrodes 121 and 122 are stacked in a third direction, the stacked electronic component can be vertically mounted on the substrate such that the internal electrodes 121 and 122 are perpendicular to the mounting surface.

[0131] There is no particular limit to the size of the 1000 multilayer electronic component.

[0132] However, in order to achieve both miniaturization and high capacitance, it is necessary to reduce the thickness of the dielectric layer and internal electrodes and increase the number of layers. Therefore, in a stacked electronic component 1000 having a size of 1005 (length x width, 1.0 mm x 0.5 mm) or less, the reliability and capacitance improvement effect per unit volume according to the present invention can be made more pronounced.

[0133] Therefore, considering manufacturing tolerances, the size of external electrodes, etc., the reliability improvement effect according to the present invention can be more pronounced when the length of the stacked electronic component 1000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the stacked electronic component 1000 refers to the maximum size of the stacked electronic component 1000 in the second direction, and the width of the stacked electronic component 1000 refers to the maximum size of the stacked electronic component 1000 in the third direction.

[0134] Figure 8 is a schematic perspective view of a stacked electronic component 1001 according to one embodiment of the present invention. Figure 9 is a cross-sectional view along line II-II' in Figure 8.

[0135] Referring to Figures 8 and 9, in the stacked electronic component 1001 according to one embodiment of the present invention, the first and second plating layers 141-1 and 142-1 can be positioned below the extension line E1 of the first surface. This makes it possible to minimize the height of the solder during mounting and to minimize the mounting space.

[0136] Furthermore, the insulating layer 151-1 can extend to below the extension line E1 of the first surface and be arranged in contact with the first and second plating layers 141-1 and 142-1.

[0137] Figure 10 is an enlarged view of region P2 in Figure 9.

[0138] Referring to Figure 10, the first and second plating layers 141-1 and 142-1 can be positioned below the extension line E1 of the first surface, or the insulating layer 151-1 can be positioned so as to extend below the extension line E1 of the first surface and be in contact with the first and second plating layers 141-1 and 142-1. Therefore, the groove R can also be positioned below the extension line E1 of the first surface. This makes it possible to improve the bonding strength between the insulating layer 151-1 and the first and second plating layers 141-1 and 142-1 while minimizing the mounting space, thereby improving the adhesion strength during mounting.

[0139] Furthermore, since the groove R is positioned below the extension line E1 of the first surface, even if moisture penetrates through the groove R, it can be prevented from reaching the volume-forming section Ac, thereby improving moisture resistance reliability.

[0140] Figure 11 is a schematic perspective view of a stacked electronic component 1002 according to one embodiment of the present invention. Figure 12 is a cross-sectional view along line III-III' in Figure 11.

[0141] Referring to Figures 11 and 12, the stacked electronic component 1002 according to one embodiment of the present invention may further include an additional insulating layer 161 disposed on the first surface 1 and positioned between the first band portion 131b and the second band portion 132b. This makes it possible to prevent leakage current and the like that which may occur between the first band portion 131b and the second band portion 132b under high voltage current.

[0142] The type of additional insulating layer 161 is not particularly limited. For example, the additional insulating layer 161 may include a glass material containing Si, similar to the insulating layer 151. However, the additional insulating layer 161 and the insulating layer 151 are not limited to the same material and may be formed from different materials. For example, one or more materials selected from epoxy resin, acrylic resin, ethyl cellulose, etc. may be included. In addition, the additional insulating layer 161 may contain one or more additives selected from TiO2, BaTiO3, SiO2, Al2O3, BaO, etc., in addition to polymer resin. This can improve the bonding strength with the main body or external electrodes.

[0143] FIG. 13 schematically shows a perspective view of a stacked electronic component 1003 according to an embodiment of the present invention. FIG. 14 is a cross-sectional view taken along line IV-IV' of FIG. 13.

[0144] Referring to FIGS. 13 and 14, in a stacked electronic component 1003 according to an embodiment, when the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-3 and 142-3 disposed on the first and second connection portions 131a and 132a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved.

[0145] More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0146] H1, H2, and T can be values obtained by averaging the values measured in a cross-sectional view (L-T cross-sectional view) obtained by cutting the main body 110 at five points having equal intervals in the third direction in the first and second directions. H1 is a value obtained by averaging the values measured at the points where the internal electrode closest to the first surface 1 is connected to the external electrode in each cross-sectional view, and H2 can be a value obtained by averaging the values measured based on the ends of the plating layers in contact with the external electrode in each cross-sectional view. The extension line of the first surface used as a reference when measuring H1 and H2 can be the same. Also, T can be a value obtained by measuring the maximum size in the first direction of the main body 110 in each cross-sectional view and then averaging.

[0147] FIG. 15 is an enlarged view of the P3 region of FIG. 14.

[0148] Referring to FIG. 15, the ends of the first and second plating layers 141-3 and 142-3 and the end of the insulating layer 151-3 are arranged to contact each other at the contacts on the first and second external electrodes 131 and 132, and the ends of the first and second plating layers 141-3 and 142-3 and the end of the insulating layer 151-3 can have a thickness decreasing toward the contacts. Thereby, the adhesion strength during mounting of the multilayer electronic component can be improved. Also, since H1 < H2 is satisfied, the area contacting the solder during mounting can be increased, and the adhesion strength can be further improved.

[0149] Further, in a more preferable case where H1 < H2 < T / 2 is satisfied, the effect of improving the moisture resistance reliability by the insulating layer can be maintained, and the problem that the moisture resistance reliability may decrease due to the formation of the groove portion R can be solved.

[0150] FIG. 16 schematically shows a perspective view of a multilayer electronic component 1004 according to an embodiment of the present invention. FIG. 17 is a cross-sectional view taken along V-V' of FIG. 16.

[0151] Referring to FIGS. 16 and 17, in the multilayer electronic component 1004 according to an embodiment of the present invention, the average length B1 of the first band portion 131b-4 can be longer than the average length B3 of the third band portion 131c-4, and the average length of the second band portion 132b-4 can be longer than the average length B4 of the fourth band portion 132c-4. Thereby, the area contacting the solder during mounting can be increased, and the adhesion strength can be improved.

[0152] More specifically, when the average size in the second direction from the extension line of the third surface 3 to the end of the first band portion 131b-4 is B1, the average size in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 132b-4 is B2, the average size in the second direction from the extension line of the third surface 3 to the end of the third band portion 131c-4 is B3, and the average size in the second direction from the extension line of the fourth surface 4 to the end of the fourth band portion 132c-4 is B4, B3 < B1 and B4 < B2 can be satisfied.

[0153] In this case, when the average size of the main body 110 in the second direction is L, the conditions 0.2 ≤ B1 / L ≤ 0.4 and 0.2 ≤ B2 / L ≤ 0.4 can be satisfied.

[0154] B1, B2, B3, B4, and L can be the average of values ​​measured at cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction.

[0155] Furthermore, the first external electrode 131-4 may include a first side band portion extending from the first connecting portion 131a-4 to a part of the fifth and sixth surfaces, and the second external electrode 132-4 may include a second side band portion extending from the second connecting portion 132a-4 to a part of the fifth and sixth surfaces. In this case, the size of the first and second side band portions in the second direction may gradually increase as they approach the first surface. That is, the first and second side band portions may be arranged in a tapered or trapezoidal shape.

[0156] Furthermore, when B3 is the average size in the second direction from the extension line of the third surface to the end of the third band portion 131c-4, B4 is the average size in the second direction from the extension line of the fourth surface to the end of the fourth band portion 132c-4, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then B3 ≤ G1 and B4 ≤ G2 can be satisfied. This minimizes the volume occupied by the external electrodes and increases the capacity per unit volume of the stacked electronic component 1004.

[0157] The above G1 and G2 can be defined as follows: G1 is the average size in the second direction, separated to the third plane, measured for any five second internal electrodes located in the center of the first direction, and G2 is the average size in the second direction, separated to the fourth plane, measured for any five first internal electrodes located in the center of the first direction.

[0158] Furthermore, the method can be further generalized by determining G1 and G2 from cross-sections (LT cross-sections) obtained by cutting the main body 110 at five equally spaced points in the third direction in the first and second directions, and then averaging these values ​​to obtain G1 and G2.

[0159] However, there is no intention to limit the present invention to B3≦G1 and B4≦G2, and the case where B3≧G1 and B4≧G2 are satisfied can also be included in one embodiment of the present invention. Therefore, in one embodiment, when B3 is the average size in the second direction from the extension line of the third surface to the end of the third band portion, B4 is the average size in the second direction from the extension line of the fourth surface to the end of the fourth band portion, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode, B3≧G1 and B4≧G2 can be satisfied.

[0160] In one embodiment, when the average size in the second direction from the extension line E3 of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, it is possible to satisfy B1≧G1 and B2≧G2. This makes it possible to improve the bonding strength of the multilayer electronic component 1004 to the substrate 180.

[0161] Figure 18 is a schematic perspective view of a stacked electronic component 1005 according to one embodiment of the present invention. Figure 19 is a cross-sectional view along line VI-VI' in Figure 18.

[0162] Referring to Figures 18 and 19, the first and second external electrodes 131-5 and 132-5 of the stacked electronic component 1005 according to one embodiment of the present invention are not arranged on the second surface, but on the third, fourth, and first surfaces, and can have an L-shape. That is, the first and second external electrodes 131-5 and 132-5 can be arranged below the extension of the second surface.

[0163] The first external electrode 131-5 includes a first connection portion 131a-5 located on the third surface 3 and a first band portion 131b-5 extending from the first connection portion 131a-5 to a part of the first surface 1, and the second external electrode 132-5 may include a second connection portion 132a-5 located on the fourth surface 4 and a second band portion 132b-5 extending from the second connection portion 132a-5 to a part of the first surface 1. Since the external electrodes 131-5 and 132-5 are not located on the second surface 2, the insulating layer 151-5 can be arranged to cover the entire second surface 2. This minimizes the volume occupied by the external electrodes 131-5 and 132-5, thereby improving the capacitance per unit volume of the multilayer electronic component 1005. However, the insulating layer 151-5 is not limited to covering the entire second surface 2. The insulating layer may not cover part or all of the second surface 2, but may be separated and cover the first and second connection portions 131a-5 and 132a-5, respectively.

[0164] Furthermore, reliability can be further improved by arranging the insulating layer 151-5 to cover a portion of the fifth and sixth surfaces. In this case, the portions of the fifth and sixth surfaces not covered by the insulating layer 151-5 can be exposed to the outside.

[0165] Furthermore, the insulating layer 151-5 can be positioned to cover the entire fifth and sixth surfaces. In this case, since the fifth and sixth surfaces are not exposed to the outside, moisture resistance reliability can be further improved.

[0166] A first plating layer 141-5 is placed on the first band portion 131b-5, and a second plating layer 142-5 is placed on the second band portion 132b-5. The first and second plating layers 141-5 and 142-5 can extend to a portion of the first and second connecting portions 131a-5 and 132a-5.

[0167] In this case, the external electrodes 131-5 and 132-5 do not necessarily have to be placed on the fifth and sixth surfaces 5 and 6. That is, the external electrodes 131-5 and 132-5 can be placed only on the third, fourth, and first surfaces.

[0168] From the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122, the average size in the first direction is H1. When the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-5 and 142-5 disposed on the first and second connection portions 131a-5 and 132a-5 is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, the fixing strength can be improved, the area where the external electrodes 131-5 and 132-5 contact the plating layers 141-5 and 142-5 can be increased, and an increase in ESR (Equivalent Series Resistance) can be suppressed.

[0169] More preferably, when the average size of the main body 110 in the first direction is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because if H2 is T / 2 or more, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0170] Also, the first and second plating layers 141-5 and 142-5 can be arranged to cover a part of the insulating layer 151-1 on the third and fourth surfaces. That is, the plating layers 141-5 and 142-5 can be arranged to cover the ends of the insulating layer 151-5 on the third and fourth surfaces. Thereby, the bonding strength between the insulating layer 151-5 and the plating layers 141-5 and 142-5 can be strengthened, and the reliability of the stacked electronic component 1005 can be improved.

[0171] Also, the insulating layer 151-5 can be arranged to cover a part of the first and second plating layers 141-5 and 142-5 on the third and fourth surfaces. That is, the insulating layer 151-5 can be arranged to cover the ends of the plating layers 141-5 and 142-5 on the third and fourth surfaces. Thereby, the bonding strength between the insulating layer 151-5 and the plating layers 141-5 and 142-5 can be strengthened, and the reliability of the stacked electronic component 1005 can be improved.

[0172] FIG. 20 shows a modified example 1006 of FIG. 18.

[0173] Referring to Figure 20, a modified example 1006 of the stacked electronic component 1005 according to one embodiment of the present invention may have a first additional electrode layer 134 placed between the first connection portion 131a-6 and the third surface, and a second additional electrode layer 135 placed between the second connection portion 132a-6 and the fourth surface. The first additional electrode layer 134 may be placed within a range that does not deviate from the third surface, and the second additional electrode layer 135 may be placed within a range that does not deviate from the fourth surface. The first and second additional electrode layers 134 and 135 can improve the electrical connectivity between the internal electrodes 121 and 122 and the external electrodes 131-6 and 132-6, and can play a role in improving the mechanical coupling force of the external electrodes 131-6 and 132-6 by providing excellent coupling force with the external electrodes 131-6 and 132-6.

[0174] The first and second external electrodes 131-6 and 132-6 may have an L-shape in which the first and second external electrodes are not positioned on the second surface.

[0175] The first external electrode 131-6 may include a first connecting portion 131a-6 disposed on the first additional electrode layer 134 and a first band portion 131b-6 extending from the first connecting portion 131a-6 to a part of the first surface 1, and the second external electrode 132-6 may include a second connecting portion 132a-6 disposed on the second additional electrode layer 135 and a second band portion 132b-6 extending from the second connecting portion 132a-6 to a part of the first surface 1.

[0176] On the other hand, the first and second additional electrode layers 134 and 135 may be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc. Furthermore, the first and second additional electrode layers 134 and 135 may be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin. In addition, the first and second additional electrode layers 134 and 135 may be formed by transferring a sheet containing conductive metal onto the main body.

[0177] The conductive metals included in the first and second additional electrode layers 134 and 135 can be materials with excellent electrical conductivity, but are not particularly limited. For example, the conductive metals can be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. Preferably, the first and second additional electrode layers 134 and 135 can contain one or more of Ni and Ni alloys, thereby further improving connectivity with the internal electrodes 121 and 122 containing Ni.

[0178] Figure 21 is a schematic perspective view of a stacked electronic component 1007 according to one embodiment of the present invention. Figure 22 is a cross-sectional view along line VII-VII' in Figure 21.

[0179] Referring to Figures 21 and 22, the average thickness t1 of the first and second plating layers 141-6 and 142-6 of the multilayer electronic component 1007 according to one embodiment of the present invention can be thinner than the average thickness t2 of the insulating layer 151-6.

[0180] The insulating layer 151-6 plays a role in preventing the penetration of moisture or plating solution from the outside, but its weak connectivity with the plating layers 141-6 and 142-6 may cause delamination of the plating layers 141-6 and 142-6. If delamination of the plating layers occurs, the adhesion strength to the substrate 180 may decrease. Here, delamination of the plating layers 141-6 and 142-6 may mean that a part of the plating layer comes off or is physically separated from the external electrodes 131-5 and 132-5. Due to the weak connectivity between the plating layer and the insulating layer, gaps may form at the interface between the insulating layer and the plating layer, increasing the possibility of foreign matter entering, making it more vulnerable to external impacts and increasing the likelihood of delamination.

[0181] According to one embodiment of the present invention, by making the average thickness t1 of the plating layer thinner than the average thickness t2 of the insulating layer, the contact area between the plating layer and the insulating layer can be reduced, thereby suppressing the occurrence of delamination and improving the adhesion strength of the multilayer electronic component 1007 to the substrate 180.

[0182] The average thickness t1 of the first and second plating layers 141-6 and 142-6 is the average of the thicknesses measured at five equally spaced points on the first and second connection portions 131a-5 and 132a-5 or the first and second band portions 131b-5 and 132b-5, and the average thickness t2 of the insulating layer 151-6 is the average of the thicknesses measured at five equally spaced points on the first and second connection portions 131a-5 and 132a-5.

[0183] Figure 23 is a schematic perspective view of a stacked electronic component 2000 according to one embodiment of the present invention. Figure 24 is a cross-sectional view along line VIII-VIII' in Figure 23.

[0184] Hereinafter, with reference to Figures 23 and 24, a stacked electronic component 2000 according to one embodiment of the present invention will be described in detail. However, any content that overlaps with the above description may be omitted to avoid redundant explanation.

[0185] A stacked electronic component 2000 according to one embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately on either side of the dielectric layer, and comprises a body 110 having first and second surfaces 1 and 2 facing in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing in a third direction, a first external electrode 231 including a first connecting electrode 231a arranged on the third surface and a first band electrode 231b arranged on the first surface and connected to the first connecting electrode, a second connecting electrode 232a arranged on the fourth surface, and the first The device includes a second external electrode 232, which is arranged on one surface and includes a second band electrode 232b connected to the second connecting electrode; a first insulating layer 251 arranged on the first connecting electrode; a second insulating layer 252 arranged on the second connecting electrode; a first plating layer 241 arranged on the first band electrode; and a second plating layer 242 arranged on the second band electrode, wherein the ends of the first and second plating layers and the ends of the first and second insulating layers are arranged to be in contact with each other at the contacts on the first and second external electrodes, and the thickness of the ends of the first and second plating layers and the ends of the first and second insulating layers can decrease toward the contacts.

[0186] The first connecting electrode 231a can be positioned on the third surface 3 and connected to the first internal electrode 121, and the second connecting electrode 232a can be positioned on the fourth surface 4 and connected to the second internal electrode 122. In addition, a first insulating layer 251 can be positioned on the first connecting electrode 231a, and a second insulating layer 252 can be positioned on the second connecting electrode 232a.

[0187] Conventionally, when forming external electrodes, a paste containing a conductive metal was used, and the surface where the internal electrodes of the main body were exposed was mainly dipped into the paste. However, external electrodes formed by the dipping method sometimes had excessively thick thickness in the center in the thickness direction. Furthermore, even without the problem of thickness variation of external electrodes due to the dipping method, since the internal electrodes are exposed on the third and fourth surfaces of the main body, the thickness of the external electrodes placed on the third and fourth surfaces was formed to be above a certain level in order to suppress the penetration of moisture and plating solution through the external electrodes.

[0188] In contrast, in the present invention, since insulating layers 251 and 252 are arranged on the connecting electrodes 231a and 232a, sufficient reliability can be ensured even if the thickness of the connecting electrodes 231a and 232a on the third and fourth surfaces where the internal electrodes are exposed is reduced.

[0189] The first and second connecting electrodes 231a and 232a can be configured to correspond to the third and fourth surfaces, respectively, and the surfaces extending from the first and second connecting electrodes 231a and 232a toward the main body 110 can have the same area as the third and fourth surfaces of the main body 110, respectively. The first and second connecting electrodes 231a and 232a can be positioned within a range that does not deviate from the third and fourth surfaces 3 and 4, respectively. The connecting electrodes 231a and 232a can be positioned so as not to extend to the first, second, fifth, and sixth surfaces 1, 2, 5, and 6 of the main body 110. Specifically, in one embodiment, the first and second connecting electrodes 231a and 232a can be positioned away from the fifth and sixth surfaces. This ensures sufficient connectivity between the internal electrodes 121 and 122 and the external electrodes 231 and 232, minimizes the volume occupied by the external electrodes, and increases the capacity per unit volume of the stacked electronic component 2000.

[0190] From this perspective, the first and second connecting electrodes 231a and 232a can be arranged at a distance from the second surface 2. That is, by not arranging the external electrodes 231 and 232 on the second surface, the volume occupied by the external electrodes 231 and 232 can be further minimized, and the capacity per unit volume of the stacked electronic component 2000 can be further increased.

[0191] However, the connecting electrodes 231a and 232a may include corner portions that extend to and are positioned on the corners of the main body 110. That is, in one embodiment, the first connecting electrode includes a corner portion (not shown) that extends and is positioned on the first-third and second-third corners, and the second connecting electrode may include a corner portion (not shown) that extends and is positioned on the first-fourth and second-fourth corners.

[0192] Furthermore, the connecting electrodes 231a and 232a can have a more uniform and thinner thickness compared to external electrodes formed by the conventional dipping method.

[0193] The method for forming the connecting electrodes 231a and 232a is not particularly limited. For example, they can be formed by transferring sheets containing a conductive metal, an organic substance such as a binder, to the third and fourth surfaces, but are not limited to this, and can also be formed by plating a conductive metal onto the third and fourth surfaces. That is, the connecting electrodes 231a and 232a may be a fired layer formed by firing a conductive metal, or they may be a plated layer.

[0194] The thickness of the connecting electrodes 231a and 232a is not particularly limited, but can be, for example, 2 to 7 μm. Here, the thickness of the connecting electrodes 231a and 232a refers to the maximum thickness and may refer to the size of the connecting electrodes 231a and 232a in the second direction.

[0195] In one embodiment, the first and second connecting electrodes 231a and 232a may contain the same metal and glass as the metal contained in the internal electrodes 121 and 122. By containing the same metal as the metal contained in the internal electrodes 121 and 122, the electrical connectivity with the internal electrodes 121 and 122 can be improved, and by containing glass, the bonding strength with the main body 110 and / or insulating layers 251 and 252 can be improved. In this case, the same metal as the metal contained in the internal electrodes 121 and 122 may be Ni.

[0196] The first and second insulating layers 251 and 252 are positioned on the first and second connecting electrodes 231a and 232a, respectively, and can serve to prevent the formation of a plating layer on the first and second connecting electrodes 231a and 232a. In addition, the first and second insulating layers 251 and 252 can improve sealing properties and minimize the penetration of moisture, plating solution, etc., from the outside.

[0197] The first and second insulating layers 251 and 252 may include, but are not limited to, glass materials with excellent resistance to plating solutions, such as glass materials containing Si, and may be composed of a material having sufficient strength to protect the laminated electronic component 2000 from tensile stress due to thermal shrinkage. Furthermore, the insulating layer 151 may contain a single component or multiple components, and more preferably, may contain one or more additives selected from TiO2, BaTiO3, Al2O3, SiO2, BaO, etc., to improve the bonding strength with the main body 110 or external electrodes 131 and 132.

[0198] The first and second band electrodes 231b and 232b can be positioned on the first surface 1 of the main body 110. The first and second band electrodes 231b and 232b can be electrically connected to the first and second internal electrodes 121 and 122, respectively, by contacting the first and second connecting electrodes 231a and 232a.

[0199] External electrodes formed by conventional dipping methods are formed thickly on the third and fourth surfaces and extend partially to the first, second, fifth, and sixth surfaces, which presents a problem in that it is difficult to secure a high effective volume ratio.

[0200] In contrast, according to one embodiment of the present invention, by arranging the first and second connecting electrodes 231a and 232a on the surface where the internal electrodes are exposed, and the first and second band electrodes 231b and 232b on the surface that is mounted on the substrate, a high effective volume ratio can be secured.

[0201] On the other hand, when the internal electrodes 121 and 122 are stacked in a first direction, the stacked electronic component 2000 can be horizontally mounted on the substrate so that the internal electrodes 121 and 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting; when the internal electrodes 121 and 122 are stacked in a third direction, the stacked electronic component can be vertically mounted on the substrate so that the internal electrodes 121 and 122 are perpendicular to the mounting surface.

[0202] The first and second band electrodes 231b and 232b may be formed using any electrically conductive material such as a metal, and the specific material can be determined by considering electrical properties, structural stability, etc. For example, the first and second band electrodes 231b and 232b can be firing electrodes containing conductive metal and glass, and can be formed by applying a paste containing conductive metal and glass to the first surface of the main body, but are not limited to this, and can be a plated layer in which conductive metal is plated onto the first surface of the main body.

[0203] The conductive metals included in the first and second band electrodes 231b and 232b can be materials with excellent electrical conductivity and are not particularly limited. For example, the conductive metals can be one or more of nickel (Ni), copper (Cu), and alloys thereof, and may include the same metals as those included in the internal electrodes 121 and 122.

[0204] In one embodiment, the ends of the first and second plating layers 241, 242 and the ends of the first and second insulating layers 251, 252 are arranged to be in contact with each other at the contacts on the first and second external electrodes 231, 232, and the thickness of the ends of the first and second insulating layers and the first and second plating layers can decrease toward the contacts.

[0205] As a result, even when the average thickness of the first and second plating layers 241, 242 and the average thickness of the first and second insulating layers 251, 252 are substantially the same, the area in contact between the first and second plating layers 241, 242 and the first and second insulating layers 251, 252 can be minimized, thereby improving the overall bonding strength of the multilayer electronic component 2000.

[0206] In one embodiment, the ends of the first and second plating layers 241, 242 and the ends of the first and second insulating layers 251, 252 can come into contact with each other, forming a recessed groove toward the main body 110. This minimizes the contact area between the first and second plating layers 241, 242 and the first and second insulating layers 251, 252, thereby reducing the possibility of delamination and improving the adhesion strength of the multilayer electronic component 2000.

[0207] In one embodiment, when the average thickness of the insulating layer is t2 and the average size in the second direction from the outermost point of the contact in the second direction to the first and second external electrodes is t3, the condition 1 / 20 ≤ t3 / t2 ≤ 1 / 5 can be satisfied. This improves the adhesion strength of the laminated electronic component 2000 and improves its resistance to moisture penetration from the outside.

[0208] In one embodiment, the edges of the first and second plating layers 241, 242 and the edges of the first and second insulating layers 251, 252 can be arranged to be in contact with each other below the extension line of the first surface. In this case, the formation of solder fillets on the third and fourth surfaces of the multilayer electronic components mounted on the substrate can be prevented or minimized, and the rate of short circuits caused by solder between multilayer electronic components can be reduced. This makes it possible to minimize the spacing between mounted multilayer electronic components and improve the mounting density of multilayer electronic components on the substrate.

[0209] In one embodiment, the first and second insulating layers 251 and 252 can be arranged extending from the first and second connecting electrodes 231a and 232a to a portion of the first and second band electrodes 231b and 232b, at which point the ends of the first and second plating layers and the ends of the first and second insulating layers can be arranged to be in contact with each other at the contact points on the first and second band electrodes 231b and 232b. This prevents solder fillets from forming on the connection points when the multilayer electronic components are mounted on the substrate, and further reduces the rate of short circuits caused by solder between multilayer electronic components. Therefore, the spacing between mounted multilayer electronic components can be further minimized, and the mounting density of multilayer electronic components on the substrate can be significantly improved.

[0210] On the other hand, in order to ensure sealing characteristics and high strength, in one embodiment, the first external electrode 231 may further include a third band electrode (not shown) arranged on the second surface 2 and connected to the first connecting electrode 231a, and the second external electrode 232 may further include a fourth band electrode (not shown) arranged on the second surface 2 and connected to the second connecting electrode 232a.

[0211] In one embodiment, when B1 is the distance from the extension line E3 of the third surface to the end of the first band electrode 231b, B2 is the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b, B3 is the distance from the extension line of the third surface to the end of the third band electrode (not shown), B4 is the distance from the extension line of the fourth surface to the end of the fourth band electrode (not shown), G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, the following conditions can be met: B1≧G1, B3≦G1, B2≧G2, and B4≦G2. This minimizes the volume occupied by the external electrodes, increases the capacity per unit volume of the stacked electronic component 2000, and increases the area in contact with the solder during mounting, thereby improving the bonding strength.

[0212] However, there is no intention to limit the present invention to B1≧G1, B3≦G1, B2≧G2, and B4≦G2; rather, cases satisfying B1≧G1, B3≧G1, B2≧G2, and B4≧G2 can also be included in one embodiment of the present invention. Therefore, in one embodiment, when B1 is the distance from the extension line E3 of the third surface to the end of the first band electrode 231b, B2 is the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b, B3 is the distance from the extension line of the third surface to the end of the third band electrode (not shown), B4 is the distance from the extension line of the fourth surface to the end of the fourth band electrode (not shown), G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then B1≧G1, B3≧G1, B2≧G2, and B4≧G2 can be satisfied.

[0213] The first and second plating layers 241 and 242 can be placed on the first and second band electrodes 231b and 232b. The first and second plating layers 241 and 242 play a role in improving the mounting characteristics. The types of the first and second plating layers 241 and 242 are not particularly limited and can be plating layers containing one or more of Ni, Sn, Pd, and their alloys, and can be formed in multiple layers.

[0214] As a more specific example of the first and second plating layers 241 and 242, the first and second plating layers 241 and 242 can be Ni plating layers or Sn plating layers, and the Ni plating layer and the Sn plating layer can be formed sequentially on the first and second band electrodes 231b and 232b.

[0215] In one embodiment, the first and second plating layers 241 and 242 can be arranged to extend and cover a portion of the first and second connecting electrodes 231a and 232a, respectively.

[0216] When H1 is the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122, and H2 is the average size in the first direction from the extension of the first surface 1 to the edges of the first and second plating layers 241 and 242 placed on the first and second connecting electrodes 231a and 232a, it is possible to satisfy H1 > H2. This suppresses the penetration of the plating solution into the internal electrodes during the plating process and improves reliability.

[0217] In one embodiment, the first and second insulating layers 251 and 252 are arranged to be in direct contact with the first and second connecting electrodes 231a and 232a, respectively, and the first and second connecting electrodes 231a and 232a may include conductive metal and glass. As a result, the plating layers 241 and 242 are not arranged in the regions on the outer surfaces of the first and second connecting electrodes 231a and 232a where the insulating layers 251 and 252 are arranged, thereby effectively suppressing erosion of the external electrodes by the plating solution.

[0218] In one embodiment, the first and second insulating layers 251 and 252 are arranged in direct contact with the first and second connecting electrodes 231a and 232a, respectively, and the first and second connecting electrodes 231a and 232a may include conductive metal and resin. As a result, the plating layers 241 and 242 are not arranged in the regions on the outer surface of the first and second connecting electrodes 231a and 232a where the insulating layers 251 and 252 are arranged, thereby effectively suppressing erosion of the external electrodes by the plating solution.

[0219] In one embodiment, the first plating layer 241 can be positioned to cover the end of the first insulating layer 251 that is located on the first external electrode 231, and the second plating layer 242 can be positioned to cover the end of the second insulating layer 252 that is located on the second external electrode 232. This strengthens the bonding force between the insulating layers 251, 252 and the plating layers 241, 242, thereby improving the reliability of the multilayer electronic component 2000. Furthermore, by forming the first and second insulating layers 251, 252 before forming the plating layers 241, 242 on the external electrodes 231, 232, the penetration of the plating solution during the plating layer formation process can be more effectively suppressed. By forming the insulating layers before the plating layers, the plating layers 241, 242 can have a configuration that covers the ends of the insulating layers 251, 252.

[0220] In one embodiment, the first insulating layer 251 can be positioned to cover the edge of the first plating layer 241 that is located on the first external electrode 231, and the second insulating layer 252 can be positioned to cover the edge of the second plating layer 242 that is located on the second external electrode 232. This strengthens the bonding force between the insulating layers 251, 252 and the plating layers 241, 242, thereby improving the reliability of the multilayer electronic component 2000.

[0221] Figure 25 shows a modified version 2001 of Figure 23.

[0222] Referring to Figure 25, in a modified example 2001 of the stacked electronic component 2000 according to one embodiment of the present invention, the first and second insulating layers 251-1 and 252-1 can be connected to each other as a single insulating layer 253-1 by extending to the fifth and sixth surfaces 5 and 6. At this time, the connected first and second insulating layers 253-1 can be arranged to cover a portion of the fifth and sixth surfaces.

[0223] Figure 26 is a schematic perspective view of a stacked electronic component 2002 according to one embodiment of the present invention. Figure 27 is a cross-sectional view along line IX-IX' in Figure 26.

[0224] Referring to Figures 26 and 27, in the stacked electronic component 2002 according to one embodiment of the present invention, the first and second plating layers 241-2 and 242-2 can be positioned below the extension line of the first surface. This makes it possible to minimize the height of the solder during mounting and to minimize the mounting space.

[0225] Furthermore, the first and second insulating layers 251-2 and 252-2 can be arranged to extend below the extension line of the first surface and in contact with the first and second plating layers 241-2 and 242-2.

[0226] Figure 28 shows a modified version 2003 of Figure 26.

[0227] Referring to Figure 28, in a modified example 2003 of the stacked electronic component 2002 according to one embodiment of the present invention, the first and second insulating layers 251-3 and 252-3 can be connected to each other as a single insulating layer 253-3 by extending to the fifth and sixth surfaces 5 and 6. In this case, the connected first and second insulating layers 253-3 can be arranged to cover the entire fifth and sixth surfaces.

[0228] Figure 29 is a schematic perspective view of a stacked electronic component 2004 according to one embodiment of the present invention. Figure 30 is a cross-sectional view taken along line X-X' in Figure 29.

[0229] Referring to Figures 29 and 30, the stacked electronic component 2004 according to one embodiment of the present invention may further include an additional insulating layer 261 disposed on the first surface 1 and positioned between the first band electrode 231b and the second band electrode 232b. This makes it possible to prevent leakage current and the like that which may occur between the first band electrode 231b and the second band electrode 232b under high voltage current.

[0230] The type of additional insulating layer 261 is not particularly limited. For example, the additional insulating layer 261 may include a glass material containing Si, similar to the insulating layer 251. However, the additional insulating layer 261 and the insulating layers 251-2 and 252-2 do not need to be made of the same material and may be formed from different materials. For example, one or more materials selected from epoxy resin, acrylic resin, ethyl cellulose, etc. may be included. In addition, the additional insulating layer 261 may contain one or more additives selected from TiO2, BaTiO3, SiO2, Al2O3, BaO, etc., in addition to polymer resin. This can improve the bonding strength with the main body or external electrodes.

[0231] Figure 31 shows a modified version 2005 of Figure 29.

[0232] Referring to Figure 31, a modified example 2005 of the stacked electronic component 2004 according to one embodiment of the present invention is such that the first and second insulating layers 251-5 and 252-5 extend to the fifth and sixth surfaces 5 and 6 and are connected to each other, thereby being connected as a single insulating layer 253-5.

[0233] Figure 32 is a schematic perspective view of a stacked electronic component 2006 according to one embodiment of the present invention. Figure 33 is a cross-sectional view along line XI-XI' in Figure 32.

[0234] Referring to FIGS. 32 and 33, a stacked electronic component 2006 according to an embodiment includes a first insulating layer 251-6 disposed on a first connection electrode 231a and a second insulating layer 252-6 disposed on a second connection electrode 232a. When the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 241-6 and 242-6 disposed on the first and second connection electrodes 231a and 232a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, and the adhesion strength can be improved.

[0235] More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0236] FIG. 34 shows a modification 2007 of FIG. 32.

[0237] Referring to FIG. 34, in a modification 2007 of a stacked electronic component 2006 according to an embodiment of the present invention, the first and second insulating layers 251-7 and 252-7 extend to the fifth and sixth surfaces 5 and 6 and are connected to each other, so that they can be connected as one insulating layer 253-7.

[0238] FIG. 35 schematically shows a perspective view of a stacked electronic component 2008 according to an embodiment of the present invention. FIG. 36 is a cross-sectional view taken along XII-XII' of FIG. 35.

[0239] Referring to Figures 35 and 36, in one embodiment of the present invention, the stacked electronic component 2008 can be connected as a single insulating layer 253-8 by having the first and second insulating layers 251-8 and 252-8 extend to the second, fifth, and sixth surfaces 2, 5, and 6 and connect to each other. As shown in Figure 36, the insulating layer 253-8 can be configured to cover the entire second surface, and to cover only a portion of the fifth and sixth surfaces.

[0240] Figure 37 is a schematic perspective view of a stacked electronic component 2009 according to one embodiment of the present invention. Figure 38 is a cross-sectional view along line XIII-XIII' in Figure 37.

[0241] Referring to Figures 37 and 38, the average thickness t1 of the first and second plating layers 241-9, 242-9 of the stacked electronic component 2009 according to one embodiment of the present invention can be thinner than the average thickness t2 of the first and second insulating layers 251-9, 252-9.

[0242] According to one embodiment of the present invention, by making the average thickness t1 of the first and second plating layers 241-9 and 242-9 thinner than the average thickness t2 of the first and second insulating layers 251-9 and 252-9, the contact area between the plating layer and the insulating layer can be reduced, thereby suppressing the occurrence of delamination and improving the adhesion strength of the multilayer electronic component 2009 to the substrate 180.

[0243] The average thickness t1 of the first and second plating layers 241-9 and 242-9 is the average of the thicknesses measured at five equally spaced points on the first and second connecting electrodes 231a and 232a or the first and second band electrodes 231b and 232b, and the average thickness t2 of the insulating layers 251-9 and 252-9 is the average of the thicknesses measured at five equally spaced points on the first and second connecting electrodes 231a and 232a.

[0244] Figure 39 shows a modified version of Figure 37, 2010.

[0245] Referring to Figure 39, a modified example 2010 of the stacked electronic component 2009 according to one embodiment of the present invention is such that the first and second insulating layers 251-10 and 252-10 extend to the fifth and sixth surfaces 5 and 6 and are connected to each other, thereby being connected as a single insulating layer 253-10.

[0246] Figure 40 is a schematic perspective view of a stacked electronic component 3000 according to one embodiment of the present invention. Figure 41 is a cross-sectional view along the line XIV-XIV' in Figure 39. Figure 42 is an enlarged view of region K1 in Figure 41.

[0247] Referring to Figures 40 to 42, a stacked electronic component 3000 according to one embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately on either side of the dielectric layer, a body 110 having first and second faces facing in a first direction, third and fourth faces connected to the first and second faces and facing in a second direction, and fifth and sixth faces connected to the first to fourth faces and facing in a third direction, a first connecting portion 331a arranged on the third face of the body, a first band portion 331b extending from the first connecting portion to a part of the first face, and a first corner portion 33 extending from the first connecting portion to the corner connecting the second and third faces of the body. The device includes a first external electrode 331 including 1c, a second external electrode 332 including a second connecting portion 332a disposed on the fourth surface of the main body, a second band portion 332b extending from the second connecting portion to a part of the first surface, and a second corner portion 332c extending from the second connecting portion to a corner connecting the second and fourth surfaces of the main body, an insulating layer 351 disposed on the first and second connecting portions 331a, 332a and disposed to cover the second surface, the first and second corner portions, a first plating layer 341 disposed on the first band portion, and a second plating layer 342 disposed on the second band portion, wherein the first and second insulating layers may contain a silicone-based resin.

[0248] In one embodiment, when B3 is the average size in the second direction from the extension line of the third surface to the end of the first corner portion 331c, B4 is the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion 332c, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode, then B3 ≤ G1 and B4 ≤ G2 can be satisfied. This minimizes the volume occupied by the external electrodes 331 and 332 and increases the capacity per unit volume of the stacked electronic component 3000.

[0249] At this time, when B1 is the average size in the second direction from the extension line of the third surface to the end of the first band portion 331b, and B2 is the average size in the second direction from the extension line of the fourth surface to the end of the second band portion 332b, it is possible to satisfy B1≧G1 and B3≧G2. This increases the area in contact with the solder during mounting and improves the bonding strength.

[0250] A stacked electronic component 3000 according to one embodiment may include a body 110 having first and second faces facing in a first direction, third and fourth faces connected to the first and second faces facing in a second direction, and fifth and sixth faces connected to the first to fourth faces facing in a third direction. The body 110 of the stacked electronic component 3000 may have the same configuration as the body 110 of the stacked electronic component 1000, except that the end of the first or second face of the body is contracted, as described later.

[0251] External electrodes 331 and 332 can be arranged on the third surface 3 and fourth surface 4 of the main body 110. The external electrodes 331 and 332 may include first and second external electrodes 331 and 332, respectively, which are arranged on the third and fourth surfaces 3 and 4 of the main body 110 and connected to first and second internal electrodes 121 and 122, respectively.

[0252] The external electrodes 331 and 332 may include a first external electrode 331 which includes a first connecting portion 331a located on the third surface, a first band portion 331b extending from the first connecting portion to a part of the first surface, and a first corner portion 331c extending from the first connecting portion to the corner connecting the second and third surfaces, and a second external electrode 332 which includes a second connecting portion 332a located on the fourth surface, a second band portion 332b extending from the second connecting portion to a part of the first surface, and a second corner portion 332c extending from the second connecting portion to the corner connecting the second and fourth surfaces. The first connecting portion 331a may be connected to the first internal electrode 121 on the third surface, and the second connecting portion 332a may be connected to the second internal electrode 122 on the fourth surface.

[0253] In one embodiment, the first and second connecting portions 331a and 332a can be arranged at a distance from the fifth and sixth surfaces. This minimizes the proportion occupied by the external electrodes 331 and 332, allowing the stacked electronic component 3000 to be further miniaturized.

[0254] Due to the overlap of margin regions on the dielectric layer 111 where internal electrodes 121 and 122 are not placed, a step difference is created due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface with the third to fifth surfaces and / or the corners connecting the second surface with the third to fifth surfaces may have a shape that is contracted toward the center of the body 110 in the first direction when the first or second surface is used as a reference. Alternatively, due to the contraction behavior during the sintering process of the body, the corners connecting the first surface 1 with the third to sixth surfaces 3, 4, 5, and 6 and / or the corners connecting the second surface 2 with the third to sixth surfaces 3, 4, 5, and 6 may have a shape that is contracted toward the center of the body 110 in the first direction when the first or second surface is used as a reference. Alternatively, to prevent chipping defects, the corners connecting each face of the main body 110 can be rounded by performing a separate process, thereby allowing the corners connecting the first face with the third to sixth faces and / or the corners connecting the second face with the third to sixth faces to have a rounded shape.

[0255] The above-mentioned corners may include the 1st-3rd corner C1-3 connecting the 1st and 3rd faces, the 1st-4th corner C1-4 connecting the 1st and 4th faces, the 2nd-3rd corner C2-3 connecting the 2nd and 3rd faces, and the 2nd-4th corner C2-4 connecting the 2nd and 4th faces. Additionally, the corners may include the 1st-5th corner connecting the 1st and 5th faces, the 1st-6th corner connecting the 1st and 6th faces, the 2nd-5th corner connecting the 2nd and 5th faces, and the 2nd-6th corner connecting the 2nd and 6th faces. However, in order to suppress the step caused by the internal electrodes 121 and 122, if the internal electrodes are cut after lamination so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115, the portions connecting the first surface with the fifth and sixth surfaces and the portions connecting the second surface with the fifth and sixth surfaces may not have a contracted form.

[0256] On the other hand, the first to sixth surfaces of the main body 110 are almost flat, and the non-flat areas can be considered as corners. In addition, the areas of the external electrodes 331 and 332 that are located on the corners can be considered as corner sections.

[0257] From this perspective, the first and second corner portions 331c and 332c can be positioned below the extension line E2 of the second surface, and the first and second corner portions 331c and 332c can be positioned away from the second surface. That is, since the external electrodes 331 and 332 are not positioned on the second surface, the volume occupied by the external electrodes 331 and 332 can be further minimized, and the capacity per unit volume of the stacked electronic component 3000 can be further increased. In addition, the first corner portion 331c can be positioned on a part of the second-third corner C2-3 connecting the third surface and the second surface, and the second corner portion 332c can be positioned on a part of the second-fourth corner C2-4 connecting the fourth surface and the second surface.

[0258] The extension line E2 of the second face can be defined as follows:

[0259] In the length-thickness direction cross-section (L-T cross-section) obtained by cutting the stacked electronic component 3000 at the center in the width direction, seven straight lines P0, P1, P2, P3, P4, P5, P6, P7 in the thickness direction with equal intervals in the length direction from the third surface to the fourth surface are drawn, and a straight line passing through the point where P2 meets the second surface and the point where P4 meets the second surface can be defined as the extension line E2 of the second surface.

[0260] On the other hand, the external electrodes 331 and 332 may be formed of any material as long as it has electrical conductivity such as metal, and a specific material can be determined in consideration of electrical characteristics, structural stability, etc. Furthermore, it can have a multilayer structure.

[0261] The external electrodes 331 and 332 may be fired electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin.

[0262] Also, the external electrodes 331 and 332 can be in a form where a fired electrode and a resin-based electrode are formed in sequence on the main body. Also, the external electrodes 331 and 332 may be formed by a method of transferring a sheet containing a conductive metal onto the main body, or may be formed by a method of transferring a sheet containing a conductive metal onto the fired electrode.

[0263] As the conductive metal contained in the external electrodes 331 and 332, a material with excellent electrical conductivity can be used, but it is not particularly limited. For example, the conductive metal can be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and alloys thereof. Preferably, the external electrodes 331 and 332 can contain one or more of Ni and Ni alloys, whereby the connectivity with the internal electrodes 121 and 122 containing Ni can be further improved.

[0264] The insulating layer 351 can be disposed on the first and second connection portions 331a and 332a.

[0265] Since the first and second connection parts 331a and 332a are connected to the internal electrodes 121 and 122, they could potentially become pathways for the penetration of plating solution during the plating process or for the penetration of moisture during actual use. In the present invention, since an insulating layer 351 is placed on the connection parts 331a and 332a, it is possible to prevent the penetration of moisture or plating solution from the outside.

[0266] The insulating layer 351 can be positioned in contact with the first and second plating layers 341 and 342. In this case, the insulating layer 351 may be in contact with the first and second plating layers 341 and 342 in a manner that covers a portion of their edges, or the first and second plating layers 341 and 342 may be in contact with the insulating layer 351 in a manner that covers a portion of its edges.

[0267] The insulating layer 351 can be placed on the first and second connection portions 331a and 332a, and can be positioned to cover the second surface and the first and second corner portions 331c and 332c. Furthermore, by covering the area where the ends of the first and second corner portions 331c and 332c and the main body 110 are in contact with each other, the insulating layer 351 blocks the moisture penetration path, thereby further improving moisture resistance reliability.

[0268] The insulating layer 351 is positioned on the second surface and can extend over the first and second connection portions 331a and 332a. Furthermore, if the external electrodes 331 and 332 are not positioned on the second surface, the insulating layer can be positioned to cover the entire second surface. On the other hand, the insulating layer 351 does not necessarily have to be positioned on the second surface. The insulating layer may not be positioned on part or all of the second surface, and may be separated into two parts, each positioned on the first and second connection portions 331a and 332a. However, even in this case, the insulating layer can be positioned to cover the entire first and second corner portions 331c and 332c. If the insulating layer is not positioned on the entire second surface, it can be positioned below the extension of the second surface. Also, even if the insulating layer is not positioned on the second surface, it can extend from the first and second connection portions 331a and 332a to the fifth and sixth surfaces, forming a single insulating layer.

[0269] In one embodiment, the insulating layer 351 is arranged to cover a portion of the fifth and sixth surfaces, thereby improving reliability. In this case, the portions of the fifth and sixth surfaces not covered by the insulating layer can be exposed to the outside.

[0270] Furthermore, the insulating layer 351 can be positioned to cover the entire fifth and sixth surfaces, in which case the fifth and sixth surfaces are not exposed to the outside, thus further improving moisture resistance reliability.

[0271] The insulating layer 351 can prevent the formation of plating layers 341 and 342 on the external electrodes 331 and 332 on which the insulating layer 351 is placed, thereby improving sealing properties and minimizing the penetration of moisture, plating solutions, etc., from the outside. The components, composition, average thickness, and effects of the insulating layer 351 are the same as those of the insulating layers 151, 251, 252, and 253 included in the multilayer electronic components 1000, 2000 or various embodiments thereof, so a detailed explanation of these is omitted.

[0272] The first and second plating layers 341 and 342 can be placed on the first and second band portions 331b and 332b, respectively. The plating layers 341 and 342 can improve mounting characteristics, and by placing the plating layers 341 and 342 on the band portions 331b and 332b, the mounting space can be minimized, and the penetration of the plating solution into the internal electrodes can be minimized, thereby improving reliability. One end of the first and second plating layers 341 and 342 can be in contact with the first surface, and the other end can be in contact with the insulating layer 351.

[0273] The types of plating layers 341 and 342 are not particularly limited and can be plating layers containing one or more of Cu, Ni, Sn, Ag, Au, Pd, and their alloys, and can be formed in multiple layers.

[0274] As a more specific example of the plating layers 341 and 342, the plating layers 341 and 342 can be Ni plating layers or Sn plating layers, and can be in a configuration in which the Ni plating layer and the Sn plating layer are formed sequentially on the first and second band portions 331b and 332b.

[0275] In one embodiment, the insulating layer 351 is arranged in direct contact with the first and second external electrodes 331 and 332, and the first and second external electrodes 331 and 332 may include conductive metal and glass. As a result, the plating layers 341 and 342 are not placed in the areas on the outer surfaces of the first and second external electrodes 331 and 332 where the insulating layer 351 is arranged, thereby effectively suppressing erosion of the external electrodes by the plating solution.

[0276] In one embodiment, the insulating layer 351 is arranged in direct contact with the first and second external electrodes 331 and 332, and the first and second external electrodes 331 and 332 may include conductive metal and resin. As a result, the plating layers 341 and 342 are not placed in the areas on the outer surfaces of the first and second external electrodes 331 and 332 where the insulating layer 351 is arranged, thereby effectively suppressing erosion of the external electrodes by the plating solution.

[0277] In one embodiment, the first plating layer 341 can be positioned to cover the end of the insulating layer 351 that is placed on the first external electrode 331, and the second plating layer 342 can be positioned to cover the end of the insulating layer 351 that is placed on the second external electrode 332. This strengthens the bonding force between the insulating layer 351 and the plating layers 341 and 342, improving the reliability of the multilayer electronic component 3000. Furthermore, by forming the insulating layer 351 before forming the plating layers 341 and 342 on the external electrodes 331 and 332, the penetration of the plating solution during the plating layer formation process can be more effectively suppressed. By forming the insulating layer before the plating layer, the plating layers 341 and 342 can have a configuration that covers the end of the insulating layer 351.

[0278] In one embodiment, the insulating layer 351 is disposed to cover an end portion disposed on the first external electrode 331 of the first plating layer 341, and the insulating layer 351 can be disposed to cover an end portion disposed on the second external electrode 332 of the second plating layer 342. Thereby, the bonding strength between the insulating layer 351 and the plating layers 341 and 342 can be enhanced, and the reliability of the stacked electronic component 3000 can be improved.

[0279] In one embodiment, the end portions of the first and second plating layers 341 and 342 and the end portion of the insulating layer 351 are arranged to contact each other at contacts on the first and second external electrodes 331 and 332, and the end portions of the insulating layer and the plating layers can decrease in thickness toward the contacts.

[0280] Thereby, even when the average thicknesses of the first and second plating layers 341 and 342 and the average thickness of the insulating layer 351 are substantially the same, the area where the first and second plating layers 341 and 342 and the insulating layer 151 contact can be minimized, and the overall bonding strength of the stacked electronic component 3000 can be improved.

[0281] In one embodiment, the end portions of the first and second plating layers 341 and 342 and the end portion of the insulating layer 351 contact each other and can form a groove portion recessed toward the main body 110. Thereby, the area where the first and second plating layers 341 and 342 and the insulating layer 351 contact can be minimized, the possibility of delamination can be reduced, and the fixing strength of the stacked electronic component 3000 can be improved.

[0282] In one embodiment, when the average thickness of the insulating layer is t2 and the average size in the second direction from a point located on the outermost side in the second direction of the contacts to the first and second external electrodes is t3, 1 / 20 ≦ t3 / t2 ≦ 1 / 5 can be satisfied. Thereby, the fixing strength of the stacked electronic component 3000 can be improved, and the resistance to external moisture penetration can be improved.

[0283] In one embodiment, the ends of the first and second plating layers 341 and 342 and the end of the insulating layer 351 can be arranged to be in contact with each other below the extension line of the first surface. In this case, the formation of solder fillets on the third and fourth surfaces of the multilayer electronic components mounted on the substrate can be prevented or minimized, and the rate of short circuits caused by solder between multilayer electronic components can be reduced. This makes it possible to minimize the spacing between mounted multilayer electronic components and improve the mounting density of multilayer electronic components on the substrate.

[0284] In one embodiment, the insulating layer 151 can be arranged extending from the first and second connection portions 331a, 332a to a portion of the first and second band portions 331b, 332b, at which point the ends of the first and second plating layers and the ends of the insulating layer can be arranged to be in contact with each other at the contact points on the first and second band portions 331b, 332b. This prevents solder fillets from forming on the connection portions when the multilayer electronic components are mounted on the substrate, and further reduces the rate of short circuits caused by solder between multilayer electronic components. Therefore, the spacing between mounted multilayer electronic components can be further minimized, and the mounting density of multilayer electronic components on the substrate can be significantly improved.

[0285] In one embodiment, the first and second plating layers 341 and 342 can be arranged to extend so as to cover a portion of the first and second connecting portions 331a and 332a, respectively. When H1 is the average size in the first direction from the first and second internal electrodes 121 and 122 to the internal electrode closest to the first surface 1, and H2 is the average size in the first direction from the extension of the first surface 1 to the ends of the first and second plating layers 341 and 342 arranged on the first and second connecting portions 331a and 332a, it is possible to satisfy H1 > H2. This suppresses the penetration of the plating solution into the internal electrodes during the plating process, thereby improving reliability.

[0286] In one embodiment, when the average size in the first direction from the first surface to the internal electrode closest to the first surface among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface to the ends of the plating layers 341 and 342 disposed on the first and second connection portions 331a and 332a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased, and the adhesion strength can be improved. More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because if H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0287] In one embodiment, the first and second plating layers 341 and 342 can be disposed below the extension line of the first surface. Thereby, the height of the solder during mounting can be minimized, and the mounting space can be minimized. Also, the insulating layer 351 can be disposed to extend below the extension line of the first surface and contact the first and second plating layers 341 and 342.

[0288] In one embodiment, when the average size in the second direction of the main body is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, 0.2 ≦ B1 / L ≦ 0.4 and 0.2 ≦ B2 / L ≦ 0.4 can be satisfied.

[0289] If B1 / L and B2 / L are less than 0.2, it may be difficult to ensure sufficient adhesion strength. On the other hand, if B2 / L exceeds 0.4, there may be a risk of leakage current occurring between the first band portion 331b and the second band portion 332b under high voltage current, and there may be a risk that the first band portion 331b and the second band portion 332b are electrically connected due to plating bleeding or the like during the plating process.

[0290] In one embodiment, an additional insulating layer may be further included, which is disposed on the first surface and between the first band portion 331b and the second band portion 332b. Thereby, leakage current and the like that may occur between the first band portion 331b and the second band portion 332b under high voltage current can be prevented.

[0291] The type of the additional insulating layer does not need to be particularly limited. For example, the additional insulating layer can include a glass material containing Si, similar to the insulating layer 351. However, it is not necessary to limit the additional insulating layer and the insulating layer 351 to the same material, and they may be formed of different materials. For example, it can include one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc. Further, the additional insulating layer 351 can include one or more selected from TiO2, BaTiO3, SiO2, Al2O3, BaO, etc. as additives in addition to the polymer resin. Thereby, the bonding strength with the main body or the external electrode can be improved.

[0292] In one embodiment, when the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, B3 < B1 and B4 < B2 can be satisfied. The average length B1 of the first band portion 331b can be longer than the average length B3 of the first corner portion 331c, and the average length of the second band portion can be longer than the average length B4 of the second corner portion 332c. Thereby, the area in contact with solder during mounting can be increased, and the fixing strength can be improved.

[0293] More specifically, when the average size in the second direction from the extension line of the third surface 3 to the end of the first band portion 331b is B1, the average size in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 332b is B2, the average size in the second direction from the extension line of the third surface 3 to the end of the first corner portion 331c is B3, and the average size in the second direction from the extension line of the fourth surface 4 to the end of the second corner portion 332c is B4, B3 < B1 and B4 < B2 can be satisfied.

[0294] In one embodiment, the average thickness of the first and second plating layers 341 and 342 can be thinner than the average thickness of the insulating layer 351.

[0295] The insulating layer 351 plays a role in preventing the penetration of moisture or plating solution from the outside, but its weak connectivity with the plating layers 341 and 342 may cause delamination of the plating layers. If delamination of the plating layers occurs, the adhesion strength to the substrate may decrease. Here, delamination of the plating layers may mean that a part of the plating layer comes off or is physically separated from the external electrodes 331 and 332. Due to the weak connectivity between the plating layers and the insulating layer, gaps may form at the interface between the insulating layer and the plating layer, increasing the possibility of foreign matter entering, making it more vulnerable to external impacts and increasing the likelihood of delamination.

[0296] Referring to Figure 43, in yet another embodiment of the multilayer electronic component 1000', the insulating layer 151-2 can extend from the first or second connection portion (131a or 132a) to a portion of the first or second band portion (131b or 132b). In this case, the end S1 of the first or second plating layer (141-2 or 142-2) and the end S2 of the insulating layer 151-2 can contact each other at the contact point of the first or second band portion (131b or 132b). This prevents the formation of solder fillets at the connection portion when the multilayer electronic component is mounted on the substrate, further reducing the rate of solder short circuits between the multilayer electronic components. Therefore, the spacing between multilayer electronic components on the substrate can be further minimized, and the mounting density of multilayer electronic components mounted on the substrate can be significantly improved.

[0297] According to one embodiment of the present invention, by making the average thickness of the plating layer thinner than the average thickness of the insulating layer, the contact area between the plating layer and the insulating layer can be reduced, thereby suppressing the occurrence of delamination and improving the adhesion strength of the multilayer electronic component 3000 to the substrate.

[0298] There is no particular limit to the size of the 3000 multilayer electronic component.

[0299] However, in order to achieve both miniaturization and high capacitance, it is necessary to reduce the thickness of the dielectric layer and internal electrodes and increase the number of layers. Therefore, in a stacked electronic component 3000 having a size of 1005 (length x width, 1.0 mm x 0.5 mm) or less, the reliability and capacitance improvement effect per unit volume according to the present invention can be more pronounced.

[0300] Therefore, considering manufacturing tolerances, the size of external electrodes, etc., the reliability improvement effect according to the present invention can be more pronounced when the length of the stacked electronic component 3000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the stacked electronic component 3000 refers to the maximum size of the stacked electronic component 3000 in the second direction, and the width of the stacked electronic component 3000 refers to the maximum size of the stacked electronic component 3000 in the third direction.

[0301] Although embodiments of the present invention have been described in detail above, the present invention is not limited by the embodiments described above and the accompanying drawings, but is limited by the claims attached. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by a person with ordinary skill in the art, and these also fall within the scope of the present invention.

[0302] On the other hand, the expression "one embodiment" used in the present invention does not mean that each embodiment is identical to the others, but is provided to emphasize and explain the unique and distinct features of each embodiment. However, the above-presented embodiment does not exclude cases where it is implemented in combination with the features of other embodiments. For example, even if a matter described in a particular embodiment is not described in another embodiment, it can be interpreted as a description related to the other embodiment, as long as the other embodiment does not describe that matter in the opposite way or in a way that contradicts it.

[0303] Furthermore, the terms used in this invention are explained for illustrative purposes only and are not intended to limit the invention. In this context, singular expressions include plurals unless they clearly have a different meaning in context. [Explanation of symbols]

[0304] 1000, 2000, 3000 Stacked Electronic Components 1100 Mounting board 110 Main Unit 111 Dielectric layer 112, 113 Cover section 114, 115 Margin section 121, 122 Internal electrode 131, 231, 331 1st external electrode 132, 232, 332 2nd external electrode 134, 135 Additional electrode layer 141, 142, 241, 242, 341, 342 Plating layer 151, 251, 252, 253, 351 Insulating layer 161, 261 Additional insulating layer 180 circuit boards 171, 172 Handa

Claims

1. A body including a dielectric layer and first and second internal electrodes arranged alternately on either side of the dielectric layer, the body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces facing each other in the second direction, and fifth and sixth surfaces connected to the first to fourth surfaces facing each other in the third direction; a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a portion of the first surface; a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a portion of the first surface; a first insulating layer disposed on the first connection portion; a second insulating layer disposed on the second connection portion; a first plating layer disposed on the first band portion; a second plating layer disposed on the second band portion, an end of the first insulating layer and an end of the first plating layer contact each other at a first contact point on the first external electrode, and an end of the second insulating layer and an end of the second plating layer contact each other at a second contact point on the second external electrode; When the average thickness of the first insulating layer and the second insulating layer is t2, and the average value of the size in the second direction from the outermost point of the first contact to the first external electrode and the size in the second direction from the outermost point of the second contact to the second external electrode is t3, A multilayer electronic component that satisfies t3 / t2≦1 / 5.

2. A laminated electronic component as described in claim 1, wherein the end of the first insulating layer and the end of the first plating layer decrease in thickness toward the first contact point, and the end of the second insulating layer and the end of the second plating layer decrease in thickness toward the second contact point.

3. A laminated electronic component as described in claim 1, wherein an end of the first insulating layer and an end of the first plating layer abut each other to form a groove portion recessed toward the main body, and an end of the second insulating layer and an end of the second plating layer abut each other to form a groove portion recessed toward the main body.

4. A laminated electronic component as described in claim 1, which satisfies 1 / 20≦t3 / t2.

5. A laminated electronic component as described in claim 1, wherein the first contact and the second contact are positioned below an extension line of the first surface.

6. A laminated electronic component as described in claim 1, wherein the first contact is arranged on the first band portion and the second contact is arranged on the second band portion.

7. A laminated electronic component as described in claim 1, wherein an end of the first plating layer is arranged to cover a portion of an end of the first insulating layer, and an end of the second plating layer is arranged to cover a portion of an end of the second insulating layer.

8. A laminated electronic component as described in claim 1, wherein an end of the first insulating layer is arranged to cover a portion of an end of the first plating layer, and an end of the second insulating layer is arranged to cover a portion of an end of the second plating layer.

9. 2. The multilayer electronic component according to claim 1, wherein when an average size in a first direction from the first surface to one of the first and second internal electrodes that is arranged closest to the first surface is defined as H1, and an average size in the first direction from an extension of the first surface to an end of a plating layer arranged on the first and second connection portions is defined as H2, H1 > H2 is satisfied.

10. 2. The multilayer electronic component according to claim 1, wherein when an average size in a first direction from the first surface to one of the first and second internal electrodes that is arranged closest to the first surface is defined as H1, and an average size in the first direction from an extension of the first surface to an end of a plating layer arranged on the first and second connection portions is defined as H2, H1 < H2 is satisfied.

11. When the average size of the body in the first direction is T, The multilayer electronic component according to claim 10, wherein H2<T / 2 is satisfied.

12. A laminated electronic component as described in claim 1, wherein the first and second plating layers are positioned below an extension line of the first surface.

13. When the average size in the second direction of the main body is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, 2. The multilayer electronic component according to claim 1, wherein 2≦B1 / L≦0.4 and 0.2≦B2 / L≦0.4 are satisfied.

14. 2. The laminated electronic component according to claim 1, further comprising an additional insulating layer disposed on the first surface and between the first band portion and the second band portion.

15. 2. The multilayer electronic component according to claim 1, wherein the dielectric layers have an average thickness of 0.35 [mu]m or less.

16. 2. The multilayer electronic component according to claim 1, wherein the average thickness of the first and second internal electrodes is 0.35 [mu]m or less.

17. The main body includes a capacitance forming portion including first and second internal electrodes arranged alternately with the dielectric layer sandwiched therebetween, and a cover portion arranged on both end faces of the capacitance forming portion in a first direction; The multilayer electronic component according to claim 1 , wherein the average size of the cover portion in the first direction is 15 μm or less.

18. A laminated electronic component as described in claim 1, wherein the average thickness of the first and second plating layers is thinner than the average thickness of the areas of the first and second insulating layers that are arranged on the first and second connection portions.

19. The first external electrode includes a first side band portion extending from the first connection portion to a portion of the fifth and sixth surfaces; the second external electrode includes a second side band portion extending from the second connection portion to a portion of the fifth and sixth surfaces; The multilayer electronic component according to claim 1 , wherein the sizes of the first and second side band portions in the second direction increase toward the first surface.

20. A laminated electronic component as described in claim 1, wherein the first and second external electrodes are positioned away from the fifth and sixth surfaces.

21. A laminated electronic component as described in claim 1, wherein the first and second external electrodes are positioned at a distance from the second surface.

22. A laminated electronic component as described in claim 1, wherein the first and second insulating layers extend to the second surface and are connected to each other.

23. A laminated electronic component as described in claim 1, wherein the first and second insulating layers extend to the fifth and sixth surfaces and are connected to each other.

24. A laminated electronic component as described in claim 1, wherein the first and second insulating layers are not arranged on the second, fifth and sixth surfaces.

25. A laminated electronic component as described in claim 1, wherein the first external electrode includes a third band portion extending from the first connection portion to a portion of the second surface, and the second external electrode includes a fourth band portion extending from the second connection portion to a portion of the second surface.

26. The main body includes a first-third corner connecting the first surface and the third surface, a first-fourth corner connecting the first surface and the fourth surface, a second-third corner connecting the second surface and the third surface, and a second-fourth corner connecting the second surface and the fourth surface, the first-third corner and the second-third corner have a shape contracted toward the center of the first direction of the body as they approach the third surface, and the first-fourth corner and the second-fourth corner have a shape contracted toward the center of the first direction of the body as they approach the fourth surface, 2. The multilayer electronic component according to claim 1, wherein the first external electrode includes a first corner portion extending from the first connection portion onto the first-third corner and the second-third corner, and the second external electrode includes a second corner portion extending from the second connection portion onto the first-fourth corner and the second-fourth corner.

27. ​​When the average size in the second direction from the extension line of the third surface to the end of the first corner portion is B3, the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion is B4, the average size in the second direction of the region where the third surface and the second internal electrode are separated is G1, and the average size in the second direction of the region where the fourth surface and the first internal electrode are separated is G2, 27. The multilayer electronic component according to claim 26, wherein B3≦G1 and B4≦G2 are satisfied.

28. The first external electrode includes a first connecting electrode disposed on the third surface, and a first band electrode disposed on the first surface and connected to the first connecting electrode; 2 . The multilayer electronic component according to claim 1 , wherein the second external electrodes include a second connecting electrode disposed on the fourth surface, and a second band electrode disposed on the first surface and connected to the second connecting electrode.

29. A laminated electronic component as described in Claim 28, wherein the first and second connecting electrodes are positioned away from the fifth and sixth surfaces.

30. A laminated electronic component as described in Claim 28, wherein the first and second connecting electrodes are positioned at a distance from the second surface.

31. A laminated electronic component as described in Claim 28, wherein the first external electrode further includes a third band electrode arranged on the second surface and connected to the first connecting electrode, and the second external electrode further includes a fourth band electrode arranged on the second surface and connected to the second connecting electrode.

32. The multilayer electronic component of claim 28 , wherein the first connecting electrode and the second connecting electrode contain the same metal as a metal contained in the internal electrode.

33. A laminated electronic component as described in Claim 28, wherein the first band electrode and the second band electrode are fired electrodes comprising a conductive metal and glass.

34. A laminated electronic component as described in Claim 28, wherein the first connecting electrode and the second connecting electrode are fired electrodes comprising a conductive metal and glass.

35. 29. The multilayer electronic component according to claim 28, wherein the first band electrode and the second band electrode are plated layers.

36. 30. The multilayer electronic component according to claim 28, wherein the first connecting electrode and the second connecting electrode are plated layers.

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