Vapor deposition apparatus for manufacturing display device and method for vapor deposition using the same

Abstract

To prevent a vapor deposition pattern from bleeding and spreading (shadow phenomenon) such that a vapor deposition material penetrates between a substrate for a display device and a metal mask in forming the vapor deposition pattern on the substrate by performing vapor deposition while overlapping the mask on the substrate.SOLUTION: A vapor deposition apparatus for manufacturing a display device includes: a chamber; a vapor depositor disposed inside the chamber to jet a vapor deposition material; a heat image camera for measuring temperature of a subject; a lens including a first surface and a second surface opposite to the first surface and disposed while being adjacent to the heat image camera; and a heat image camera module connected to the lens and including a thermocouple for measuring temperature of the lens.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a deposition apparatus for manufacturing a display device and a deposition method using the same, and more particularly to a vacuum deposition apparatus for manufacturing a display device, which maintains a vacuum state inside a chamber, and a vacuum deposition method using the same. [Background technology]

[0002] When manufacturing a display device, a horizontal upward deposition method is widely used in which a substrate and a patterned metal mask are horizontally arranged in a chamber, and then a deposition material is sprayed toward the mask to deposit the deposition material on the substrate.

[0003] The horizontal upward deposition method is a method in which the substrate and the mask are horizontally arranged on the bottom surface of the chamber, aligned and assembled (bonded) to each other, and an organic material is deposited on the substrate in a horizontal state.

[0004] On the other hand, if the substrate and the mask are attached in a misaligned state, the deposition material may seep between the substrate and the mask, causing a shadow phenomenon in which the deposition pattern smears and spreads. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] International Publication No. 2010 / 087356 [Patent Document 2] U.S. Pat. No. 8,724,976 [Patent Document 3] Korean Patent Publication No. 10-2020-0079815 Summary of the Invention [Problem to be solved by the invention]

[0006] SUMMARY OF THE PRESENT EMBODIMENT An object of the present invention is to provide a deposition apparatus for manufacturing a display device, which has improved process reliability.

[0007] Another object of the present invention is to provide a deposition method using the deposition apparatus for manufacturing a display device.

[0008] However, the object of the present invention is not limited to the above-mentioned object, and can be expanded in various ways without departing from the spirit and scope of the present invention. [Means for solving the problem]

[0009] In order to achieve the object of the present invention, a deposition apparatus for manufacturing a display device according to one embodiment of the present invention includes: (1) a chamber; an evaporator disposed in the chamber and configured to inject an evaporation material; (2) a thermal imaging camera for measuring a temperature of an object; (3) a lens including a first surface and a second surface opposite to the first surface and disposed adjacent to the thermal imaging camera; and (4) a thermal imaging camera module connected to the lens and having a thermocouple for measuring a temperature of the lens.

[0010] The apparatus may further include a substrate facing the evaporator in the chamber and onto which the deposition material is deposited, a mask disposed between the substrate and the evaporator, and an electrostatic chuck disposed below the substrate for supporting and fixing the substrate.

[0011] The object may be at least one of the substrate, the mask, and the electrostatic chuck.

[0012] The thermal imaging camera module may further include a cooling line in contact with the thermal imaging camera for regulating the temperature of the thermal imaging camera and the temperature of the lens.

[0013] The cooling lines may be wrapped around a surface of the thermal imaging camera.

[0014] The thermal imaging camera module may further include a protective tape comprising a transparent material and attached to the second surface of the lens.

[0015] The thermal imaging camera module may further include a body portion housing the thermal imaging camera and the thermocouple, and a leg portion coupled to the body portion.

[0016] The legs may include bellows.

[0017] The body portion includes a first opening through which the lens can be coupled to the body portion.

[0018] The thermal imaging camera module may further include a shutter coupled to the body portion for opening and closing the second face of the lens.

[0019] The main body portion includes a second opening, and the thermal imaging camera module may further include (1) a shutter drive unit that controls the open or closed state of the shutter, and (2) a shutter connection unit that connects the shutter drive unit and the shutter and is coupled to the main body portion via the second opening.

[0020] The thermal imaging camera module may further include (1) a motor cable positioned within the main body and supplying power to the shutter drive unit, and (2) a camera cable positioned within the main body and supplying power to the thermal imaging camera.

[0021] An internal space of the thermal imaging camera module sealed by the body, the lens, the shutter connector, and the legs may be in an atmospheric state.

[0022] The thermal imaging camera module may further include an angle adjustment portion disposed at the boundary between the main body portion and the leg portion for adjusting the direction in which the thermal imaging camera captures images.

[0023] In order to achieve another object of the present invention, a deposition method using a deposition apparatus for manufacturing a display device according to one embodiment of the present invention includes the steps of providing a chamber including an evaporator, a base material, an electrostatic chuck disposed on the base material, and a thermal imaging camera module including a thermal imaging camera and a shutter, opening the shutter so that the thermal imaging camera is exposed, measuring a temperature of the electrostatic chuck using the thermal imaging camera, closing the shutter so that the thermal imaging camera is not exposed, and spraying a deposition material from the evaporator.

[0024] The method may further include the steps of measuring a temperature of the electrostatic chuck and adjusting the temperature of the electrostatic chuck to a first target temperature during the step of closing the shutter.

[0025] The first target temperature may be 60° C. or less.

[0026] The method may further include adjusting the temperature of the electrostatic chuck to a first target temperature, positioning a mask in the chamber using a mask transporter during the closing of the shutter, measuring the temperature of the mask using the thermal imaging camera, and adjusting the temperature of the mask to a second target temperature.

[0027] The method may further include adjusting the temperature of the mask to a second target temperature, positioning a substrate in the chamber between the mask and the electrostatic chuck while closing the shutter, measuring the temperature of the substrate using the thermal imaging camera, and adjusting the temperature of the substrate to a third target temperature.

[0028] The method may further include adjusting the temperature of the substrate to a third target temperature, contacting the mask onto the substrate during the closing of the shutter, measuring the temperature of the mask and the temperature of the substrate using the thermal imaging camera, and adjusting the temperature of the mask to a fourth target temperature and adjusting the temperature of the substrate to a fifth target temperature. Effect of the Invention

[0029] The deposition apparatus for manufacturing a display device according to the present invention includes a thermal imaging camera module including a thermal imaging camera, and thus can measure the temperature of the object. More specifically, the deposition apparatus can directly measure the temperature of the object without inferring the temperature of the object through the temperature of a coolant disposed around the object.

[0030] In addition, before completing a deposition process for manufacturing a display device, the deposition apparatus can predict problems that may occur during the deposition process by directly measuring the temperature of the object using a thermal imaging camera. If the temperature of the object is different from a target temperature, the deposition apparatus can adjust the temperature of the object to the target temperature to prevent the problem from occurring.

[0031] Therefore, by measuring and adjusting the temperature of the electrostatic chuck so that the temperature of the electrostatic chuck does not become excessively high, it is possible to prevent the electrostatic chuck from receiving a thermal shock.

[0032] In addition, the substrate and the mask can be aligned and bonded in an optimal state by measuring and controlling the temperatures of the substrate and the mask so that the temperatures of the substrate and the mask do not become excessively high. Thus, a shadow phenomenon can be prevented. In addition, a deposition pattern can be formed so that the properties of the deposition pattern deposited on the substrate, such as thickness, refractive index, molecular arrangement, and roughness, are the same as the target properties. Thus, defects such as color abnormality and increased current consumption of the display device manufactured by the deposition process can be prevented. Thus, the yield of the display device manufactured by the deposition process can be improved.

[0033] However, the effects of the present invention are not limited to the effects described above, and can be expanded in various ways without departing from the spirit and scope of the present invention. [Brief description of the drawings]

[0034] [Figure 1] FIG. 1 is a cross-sectional view showing a deposition apparatus for manufacturing a display device according to an embodiment of the present invention. [Diagram 2] FIG. 2 is an enlarged cross-sectional view showing a portion A in FIG. [Diagram 3] FIG. 3 is an enlarged cross-sectional view showing the thermal imaging camera module in FIG. [Figure 4] FIG. 4 is a cross-sectional view showing the thermal imaging camera module in FIG. [Diagram 5] FIG. 5 is a cross-sectional view showing a deposition method using the deposition apparatus for manufacturing a display device according to an embodiment of the present invention. [Figure 6] FIG. 6 is a cross-sectional view showing a deposition method using the deposition apparatus for manufacturing a display device according to an embodiment of the present invention. [Figure 7] FIG. 7 is a cross-sectional view illustrating a deposition method using the deposition apparatus for manufacturing a display device according to an embodiment of the present invention. [Figure 8] FIG. 8 is a cross-sectional view showing a deposition method using the deposition apparatus for manufacturing a display device according to an embodiment of the present invention. [Figure 9]FIG. 9 is a cross-sectional view illustrating a deposition method using the deposition apparatus for manufacturing a display device according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0035] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The same reference numerals are used to refer to the same elements in the drawings, and duplicated descriptions of the same elements will be omitted.

[0036] FIG. 1 is a cross-sectional view showing a deposition apparatus 1000 for manufacturing a display device according to an embodiment of the present invention.

[0037] As shown in FIG. 1, a deposition apparatus 1000 for manufacturing a display device includes a chamber 100 , a deposition device 200 , a substrate 300 , a mask 400 , a thermal imaging camera module 500 , an electrostatic chuck 600 , and a base material 700 .

[0038] The deposition apparatus 1000 for manufacturing a display device may include, but is not limited to, a chemical vapor deposition (CVD) apparatus. For example, the deposition apparatus 1000 for manufacturing a display device may include a plasma enhanced chemical vapor deposition (PECVD) apparatus. The deposition apparatus 1000 for manufacturing a display device forms components included in a display device. For example, the deposition apparatus 1000 for manufacturing a display device forms a silicon-based insulating layer, a silicon-based semiconductor layer, etc. included in the display device.

[0039] The chamber 100 provides a space for performing a deposition process for manufacturing a display device. The chamber 100 is connected to an exhaust device. The inside of the chamber 100 is maintained in a vacuum state by the exhaust device. The chamber 100 may be made of, but is not limited to, stainless steel.

[0040] The deposition device 200 contains a deposition material (DM). The deposition device 200 is a shower head type including at least one nozzle (NZ) for spraying the deposition material (DM). The deposition device 200 is disposed on one side of the chamber 100. The deposition device 200 sprays the deposition material (DM) stored therein through the nozzle (NZ). The deposition material (DM) sprayed through the nozzle (NZ) is sprayed in a high temperature environment. Therefore, the temperature of other components in the chamber 100 increases in order to perform the deposition process.

[0041] The base material 700 is disposed on the other side within the chamber 100. The base material 700 supports the electrostatic chuck 600, the substrate 300, and the mask 400, which are disposed on the base material 700.

[0042] The electrostatic chuck 600 is disposed on a base material 700. The electrostatic chuck 600 supports the substrate 300. The electrostatic chuck 600 fixes (or chucks) the substrate 300. The electrostatic chuck 600 uses an electrostatic force to fix the substrate 300.

[0043] The substrate 300 is disposed on the electrostatic chuck 600. That is, the electrostatic chuck 600 is disposed below the substrate 300. Thus, the substrate 300 faces the deposition device 200 in the chamber 100. The substrate 300 is fixed by the electrostatic chuck 600. The substrate 300 includes a glass substrate. However, the type of the substrate 300 is not limited thereto. For example, the substrate 300 may include a quartz substrate, a plastic substrate, and the like. The deposition material (DM) sprayed by the deposition device 200 is deposited on the substrate 300. Thus, various deposition patterns are formed on the substrate 300 by depositing the deposition material on the substrate 300. The display device includes the substrate 300 having the deposition patterns. For example, the substrate 300 is a display panel included in the display device.

[0044] The mask 400 is placed on the substrate 300, i.e., the mask 400 is placed between the substrate 300 and the deposition tool 200. The mask 400 includes a patterned metal. In other words, the mask 400 is a single component that includes a predefined opening, i.e., the mask 400 shown in side view is not isolated but is representative of said opening.

[0045] When the deposition device 200 sprays the deposition material (DM) toward the substrate 300, the deposition material (DM) is deposited in a pattern on the substrate 300. In other words, the deposition material (DM) is deposited on the substrate 300 only through the openings of the mask 400. Therefore, it is important that the mask 400 is attached (cemented) on the substrate 300 such that the openings of the mask 400 are aligned with the positions on the substrate 300 where the deposition material (DM) is to be deposited.

[0046] The deposition process may be performed at a high temperature, and the temperature within the chamber 100 may be different from the temperatures of the components within the chamber 100. In other words, the temperature of the substrate 300, the temperature of the mask 400, the temperature of the electrostatic chuck 600, etc. may be different from each other.

[0047] The material contained in the substrate 300 may be different from the material contained in the mask 400. In other words, the thermal expansion coefficient of the substrate 300 may be different from the thermal expansion coefficient of the mask 400. Therefore, when the deposition process is performed at a high temperature, the substrate 300 and the mask 400 may be bonded in a misaligned state. In this case, the deposition material (DM) may seep between the substrate 300 and the mask 400. This may cause a shadow phenomenon in which the deposition pattern bleeds and spreads.

[0048] In addition, the temperature of the substrate 300 and the temperature of the mask 400 affect the properties of the deposition pattern, such as the thickness, refractive index, molecular arrangement, and roughness of the deposition pattern. If the properties of the deposition pattern are different from those of the target, the display device manufactured by the deposition process will have defects such as color abnormality and increased current consumption. Therefore, the yield of the display device manufactured by the deposition process will decrease.

[0049] Furthermore, if the temperature of the electrostatic chuck 600 is excessively high, the electrostatic chuck 600 may be subjected to a thermal shock due to thermal expansion and contraction, and the electrostatic chuck 600 may lose its electrostatic adhesion (chucking) due to this thermal shock.

[0050] Therefore, it is necessary to know the temperature of the substrate 300, the temperature of the mask 400, and the temperature of the electrostatic chuck 600.

[0051] A thermal imaging camera module 500 may be disposed within the chamber 100 to ascertain the temperatures of the substrate 300, the mask 400, and the electrostatic chuck 600. The thermal imaging camera module 500 analyzes temperature images of components disposed within the chamber 100 to measure the temperatures of the components. In one embodiment, the thermal imaging camera module 500 may directly measure the temperatures of the substrate 300, the mask 400, and the electrostatic chuck 600. The thermal imaging camera module 500 may also measure the temperatures of each component by implementing an algorithm that separates temperature images of components that are in contact with each other.

[0052] Although the thermal imaging camera modules 500 are shown disposed one on each of the left and right sides, the number and location of the thermal imaging camera modules 500 are not so limited.

[0053] The thermal imaging camera module 500 will be described in detail in FIGS.

[0054] FIG. 2 is an enlarged cross-sectional view showing a portion A in FIG.

[0055] 2, the base material 700 includes an aluminum substrate. The base material 700 may be formed as a bulk type. For example, the base material 700 may be formed by die casting. However, the material and type of the base material 700 are not limited thereto. The material of the base material 700 may vary depending on the material of the electrostatic chuck 600.

[0056] The workpiece 700 includes at least one cooling line (CL). The temperature of the workpiece 700 is reduced by the cooling agent flowing through the cooling line (CL). Thus, when the deposition process is performed at a high temperature, the temperature of the workpiece 700 can be adjusted by the cooling agent flowing through the cooling line (CL). The cooling agent flowing through the cooling line (CL) can also adjust the temperature of components in contact with the workpiece 700. For example, the cooling agent flowing through the cooling line (CL) can adjust the temperature of the electrostatic chuck 600 disposed on the workpiece 700, the temperature of the substrate 300 disposed on the electrostatic chuck 600, and the temperature of the mask 400 disposed on the substrate 300.

[0057] The electrostatic chuck 600 can be disposed on a base material 700. The electrostatic chuck 600 can fix (or chuck) a substrate 300 such as a glass substrate by forming an electric field using a positive electrode (e.g., a first electrode (CE1)) and a negative electrode (e.g., a second electrode (CE2)) electrode layer (CE).

[0058] The electrostatic chuck 600 includes an insulating layer (IL) including a first insulating layer (IL1) and a second insulating layer (IL2), an electrode layer (CE) including a first electrode (CE1) and a second electrode (CE2), a dam portion (DAM), and an embossment (EB).

[0059] The first insulating layer (IL1) is disposed on the base material 700. The first insulating layer (IL1) serves to insulate between the electrode layer (CE) and the base material 700. The first insulating layer (IL1) is made of yttrium oxide (Y 2 O 3 ), but is not limited to:

[0060] The electrode layer (CE) is disposed on the first insulating layer (IL1). The electrode layer (CE) includes, but is not limited to, tungsten (W). The electrode layer (CE) includes positive and negative electrodes that are alternately arranged. For example, the first electrode (CE1) is a positive electrode, and the second electrode (CE2) is a negative electrode. As a result, the substrate 300 disposed on the electrode layer (CE) may have opposite charges induced to form an electric field. For example, a portion of the substrate 300 disposed on the first electrode (CE1) having a positive electrode may have a negative charge, and a portion of the substrate 300 disposed on the second electrode (CE2) having a negative electrode may have a positive charge. As a result, the electrostatic chuck 600 may fix the substrate 300 by electrostatic force.

[0061] The second insulating layer (IL2) is disposed on the electrode layer (CE). That is, the second insulating layer (IL2) is disposed between the electrode layer (CE) and the substrate 300. The second insulating layer (IL2) serves to insulate between the electrode layer (CE) and the substrate 300. The second insulating layer (IL2) is made of aluminum oxide (Al 2 O 3 ), but is not limited to:

[0062] The dam portion (DAM) is disposed on the second insulating layer (IL2) at the outermost portion thereof so as to extend in the circumferential direction. The dam portion (DAM) has a predetermined thickness and width. The dam portion (DAM) serves to support the substrate 300.

[0063] The emboss (EB) is disposed inside the dam portion (DAM) on the second insulating layer (IL2). The thickness of the emboss (EB) is the same as the thickness of the dam portion (DAM). Thus, the emboss (EB) and the dam portion (DAM) support the substrate 300. Also, a plurality of emboss (EB) may be provided. Thus, a cooling flow path is formed between the plurality of emboss (EB). The coolant flowing along the cooling flow path can efficiently adjust the temperature of the electrostatic chuck 600, the temperature of the substrate 300, and the temperature of the mask 400.

[0064] The substrate 300 is placed on the dam portion (DAM) and the embossing portion (EB). The mask 400 is placed on the substrate 300.

[0065] In other words, when the electrostatic chuck 600, the substrate 300, and the mask 400 need to be cooled, the cooling agent flowing along the cooling lines (CL) and / or the cooling agent supplied to the cooling channels between the embossments (EB) is used.

[0066] However, the temperature of the cooling agent and / or the temperature of the coolant is different from the temperature of the electrostatic chuck 600, the temperature of the substrate 300, and the temperature of the mask 400. In other words, the temperature of the cooling agent and / or the temperature of the coolant is simply used to infer the temperature of the electrostatic chuck 600, the temperature of the substrate 300, and the temperature of the mask 400.

[0067] 1 and 2, the cooling agent and / or the coolant can change the temperature of the electrostatic chuck 600, the temperature of the substrate 300, and the temperature of the mask 400. The thermal imaging camera module 500 monitors the temperature changes of the electrostatic chuck 600, the temperature changes of the substrate 300, and the temperature changes of the mask 400. In other words, the thermal imaging camera module 500 can directly measure the temperature of the electrostatic chuck 600, the temperature of the substrate 300, and the temperature of the mask 400, rather than measuring the temperature of the cooling agent and / or the coolant.

[0068] FIG. 3 is an enlarged cross-sectional view showing the thermal imaging camera module 500 in FIG.

[0069] 1 and 3, the thermal imaging camera module 500 includes a thermal imaging camera 510 for measuring the temperature of an object, a lens 530 including a first surface (S1) and a second surface (S2) opposite to the first surface (S1) and disposed adjacent to the thermal imaging camera 510, and a thermocouple 550 coupled to the lens 530 for measuring the temperature of the lens 530. The thermal imaging camera module 500 is coupled to an analysis device disposed outside the chamber 100.

[0070] The thermal imaging camera 510 senses infrared rays and the like to measure the temperature of the object. In addition, the thermal imaging camera 510 can measure the surface temperature of each object by performing an algorithm to separate temperature images of objects in contact with each other. More specifically, the thermal imaging camera 510 photographs the object, obtains a temperature image of the object, and transmits the temperature image to the analysis device. The analysis device can analyze the temperature image to determine the temperature of the object.

[0071] The lens 530 has a first surface (S1) and a second surface (S2) opposite to the first surface (S1). The first surface (S1) of the lens 530 is disposed in front of the thermal imaging camera 510. More specifically, the first surface (S1) of the lens 530 is attached to the thermal imaging camera 510. The lens 530 is attached to the thermal imaging camera 510 and can adjust the focus of the thermal imaging camera 510 to be at the position of the subject. The subject is at least one of the substrate 300, the mask 400, and the electrostatic chuck 600, but is not limited thereto.

[0072] The thermocouple 550 is a combination of different types of metal wires that generate a thermoelectric effect. The thermoelectric effect is an effect in which an electromotive force is generated by a temperature difference on the metal wires. Thus, the thermocouple 550 can measure the temperature difference on the metal wires. If the temperature of the lens 530 is excessively high, the temperature image acquired by the thermal imaging camera 510 through the lens 530 may be distorted. Therefore, the thermocouple 550 is connected to the lens 530 to continuously measure the temperature of the lens 530.

[0073] The thermal imaging camera module 500 will now be described in detail with reference to FIG.

[0074] FIG. 4 is a cross-sectional view showing the thermal imaging camera module 500 in FIG.

[0075] As shown in Figures 1, 3, and 4, the thermal imaging camera module 500 further includes a main body portion 591, legs 593, a protective tape 531, a shutter 520, a shutter driving portion 521, a shutter connection portion 523, camera cables 541, 542, 543, a motor cable 544, a cooling line 570, and an angle adjustment portion 560.

[0076] The body portion 591 houses the thermal imaging camera 510 and the thermocouple 550. The body portion 591 includes a first opening (AA1) and a second opening (AA2). The lens 530 is coupled to the body portion 591 by fitting into the first opening (AA1).

[0077] Leg portion 593 is connected to main body portion 591. Leg portion 593 includes a bellows. The bellows is an accordion-like elastic element.

[0078] The protective tape 531 (protective film) includes a transparent material. For example, the protective tape 531 includes polyimide. The protective tape 531 is disposed on the second surface (S2) of the lens 530. More specifically, the protective tape 531 is attached to the second surface (S2) of the lens 530. Thus, the protective tape 531 prevents the lens 530 from being exposed to the deposition material (DM). The protective tape 531 is a tape or film-like material, and can be attached and detached (peeled off and reattached). Therefore, if the protective tape 531 is damaged, the protective tape 531 can be replaced.

[0079] The shutter 520 is coupled to the body 591. The shutter 520 is disposed outside the body 591. The shutter 520 opens and closes the second surface (S2) of the lens 530. In other words, when the shutter 520 opens the second surface (S2) of the lens 530, the thermal imaging camera 510 can measure the temperature of the object through the lens 530. When the shutter 520 closes the second surface (S2) of the lens 530, the thermal imaging camera 510 cannot measure the temperature of the object through the lens 530. However, when the shutter 520 closes the second surface (S2) of the lens 530, the shutter 520 can minimize the attachment of foreign matter such as a deposition material (DM) to the lens 530 and the protective tape 531.

[0080] The shutter driving unit 521 can be disposed inside the main body unit 591. The shutter driving unit 521 controls the shutter 520 to be in an open state or a closed state.

[0081] The shutter connecting part 523 connects the shutter driving part 521 and the shutter 520. The shutter connecting part 523 is coupled to the main body part 591 by fitting into the second opening (AA2) of the main body part 591. In other words, the shutter connecting part 523 can separate the positions of the shutter 520 and the shutter driving part 521 from each other so that the shutter 520 is disposed outside the main body part 591 and the shutter driving part 521 is disposed inside the main body part 591. More specifically, when the shutter driving part 521 drives the shutter 520, the space inside the main body part 591 can be sealed so that the inside of the main body part 591 is not exposed to the outside of the main body part 591.

[0082] The inside of the chamber 100 is in a vacuum state. The internal space of the thermal imaging camera module 500 sealed by the main body 591, the lens 530 coupled to the first opening (AA1) of the main body 591, the shutter connector 523 coupled to the second opening (AA2) of the main body 591, and the leg 593 coupled to the main body 591 may be in an atmospheric state. In other words, the sealed internal space of the thermal imaging camera module 500 can protect components such as the thermal imaging camera 510 and the thermocouple 550 arranged in the chamber 100 from the vacuum state.

[0083] The camera cables 541, 542, 543 and the motor cable 544 are disposed within the main body 591. The camera cables 541, 542, 543 supply power to the thermal imaging camera 510. The motor cable 544 supplies power to the shutter drive unit 521. The camera cables 541, 542, 543 and the motor cable 544 are connected to a power supply line 545 that is disposed within the main body 591 and extends into the leg 593.

[0084] The cooling line 570 contacts the thermal imaging camera 510. The cooling line 570 adjusts the temperature of the thermal imaging camera 510 by a cooling material flowing through the cooling line 570. The cooling line 570 can also adjust the temperature of the lens 530 attached to the thermal imaging camera 510. In other words, if the temperature of the thermal imaging camera 510 and the temperature of the lens 530 are excessively high, the temperature image acquired by the thermal imaging camera 510 may include distortion, so the cooling line 570 can reduce the temperature of the thermal imaging camera 510 and the temperature of the lens 530.

[0085] The cooling line 570 includes a first cooling line 571 through which the cooling material enters the cooling line 570, and a second cooling line 573 through which the cooling material exits the cooling line 570. The first and second cooling lines 571 and 573 are connected to each other. The cooling line 570 is wound around the surface of the thermal imaging camera 510. In other words, the cooling line 570 contacts the surface of the thermal imaging camera 510 by rotating and winding in a spiral shape, thereby maximizing the contact area between the cooling line 570 and the thermal imaging camera 510. That is, the cooling line 570 can efficiently reduce the temperature of the thermal imaging camera 510 and the temperature of the lens 530.

[0086] The angle adjustment unit 560 is disposed at the boundary between the main body 591 and the leg 593. The angle adjustment unit 560 can adjust the direction in which the thermal imaging camera 510 takes an image. That is, the angle adjustment unit 560 adjusts the direction in which the second surface (S2) of the lens 530 attached to the thermal imaging camera 510 faces. In other words, the angle adjustment unit 560 can adjust the direction in which the thermal imaging camera 510 takes an image so that the thermal imaging camera 510 faces the position of the object whose temperature is to be measured.

[0087] 5 to 9 are cross-sectional views illustrating a deposition method using a deposition apparatus for manufacturing a display device according to an embodiment of the present invention.

[0088] As shown in Figures 1, 4 and 5, a deposition method using a deposition apparatus for manufacturing a display device includes the steps of providing a chamber 100 including an evaporator 200, a base material 700, and an electrostatic chuck 600 placed on the base material, and a thermal imaging camera module 500 including a thermal imaging camera 510 and a shutter 520, opening the shutter 520 so that the thermal imaging camera 510 is exposed, measuring the temperature of the electrostatic chuck 600 using the thermal imaging camera 510, and closing the shutter 520 so that the thermal imaging camera 510 is not exposed.

[0089] If the temperature of the electrostatic chuck 600 is excessively higher than the first target temperature, the electrostatic chuck 600 may be subjected to thermal shock due to thermal expansion and contraction, which may result in undesired release of electrostatic adhesion. Therefore, the deposition method using the deposition apparatus for manufacturing a display device includes a step of measuring the temperature of the electrostatic chuck 600 using the thermal imaging camera 510, so that the temperature of the electrostatic chuck 600 can be confirmed and problems occurring during the deposition process can be predicted in advance.

[0090] The method may further include a step of adjusting the temperature of the electrostatic chuck 600 to the first target temperature between the step of measuring the temperature of the electrostatic chuck 600 and the step of closing the shutter 520. The first target temperature is 60° C. or less. This can prevent problems from occurring during the deposition process.

[0091] Referring also to FIG. 2, the step of adjusting the temperature of the electrostatic chuck 600 to the first target temperature may adjust the temperature of the electrostatic chuck 600 using a cooling line (CL) included in a base material 700 supporting the electrostatic chuck 600.

[0092] In addition, the deposition method using the deposition apparatus for manufacturing a display device includes a step of opening the shutter 520 and a step of closing the shutter 520, thereby minimizing adhesion of foreign matter such as deposition material (DM) to the lens 530 and the protective tape 531. In other words, damage to the lens 530 and the protective tape 531 can be reduced, and durability can be improved.

[0093] As shown in FIG. 6, between the step of adjusting the temperature of the electrostatic chuck 600 to the first target temperature and the step of closing the shutter 520, the method further includes the steps of positioning a mask 400 in the chamber 100 using a mask transport unit 450, measuring the temperature of the mask 400 using a thermal imaging camera 510, and adjusting the temperature of the mask 400 to a second target temperature.

[0094] If the temperature of the mask 400 is excessively higher than the second target temperature, the mask 400 may not be aligned at a predetermined position on the substrate 300. In addition, when a deposition material (DM) is sprayed onto the substrate 300 to form a deposition pattern, the properties of the deposition pattern may differ from the target properties. Therefore, the deposition method using the deposition apparatus for manufacturing a display device includes a step of measuring the temperature of the mask 400 using the thermal imaging camera 510, so that the temperature of the mask 400 can be confirmed and problems during the deposition process can be predicted in advance.

[0095] The deposition method using the deposition apparatus for manufacturing a display device can prevent problems from occurring during the deposition process by including a step of adjusting the temperature of the mask 400 to the second target temperature. The step of adjusting the temperature of the mask 400 to the second target temperature is performed by a mask coolant included in the mask transport unit 450.

[0096] In addition, the deposition method using the deposition apparatus for manufacturing a display device may include a step of opening a shutter 520 before the step of measuring the temperature of the mask 400, and may further include a step of closing the shutter 520 after the step of measuring the temperature of the mask 400.

[0097] By including the step of opening the shutter 520 and the step of closing the shutter 520, it is possible to minimize the attachment of foreign matter such as a deposition material (DM) to the lens 530 and the protective tape 531. In other words, it is possible to include a step of opening the shutter 520 before the step of using the thermal imaging camera 510, and a step of closing the shutter 520 after the step of using the thermal imaging camera 510. That is, it is possible to minimize the time during which the shutter 520 is open, thereby minimizing the attachment of foreign matter such as a deposition material (DM) to the lens 530 and the protective tape 531.

[0098] As shown in FIG. 7, between the steps of adjusting the temperature of the mask 400 to the second target temperature and closing the shutter 520, the method may further include the steps of positioning a substrate 300 between the mask 400 and an electrostatic chuck 600 in the chamber 100, measuring the temperature of the substrate 300 using a thermal imaging camera 510, and adjusting the temperature of the substrate 300 to a third target temperature.

[0099] If the temperature of the substrate 300 is excessively higher than the third target temperature, the mask 400 may not be aligned at a predetermined position on the substrate 300. In addition, when a deposition material (DM) is sprayed onto the substrate 300 to form a deposition pattern, the properties of the deposition pattern may differ from the targeted properties. Therefore, the deposition method using the deposition apparatus for manufacturing a display device includes a step of measuring the temperature of the substrate 300 using the thermal imaging camera 510, so that the temperature of the substrate 300 can be confirmed and problems occurring during the deposition process can be predicted in advance.

[0100] The deposition method using the deposition apparatus for manufacturing a display device can prevent problems that may occur during the deposition process by including a step of adjusting the temperature of the substrate 300 to the third target temperature. The step of adjusting the temperature of the substrate 300 to the third target temperature is performed by the coolant flowing through the cooling flow path between the cooling line (CL) and the emboss (EB) included in the base material 700.

[0101] In addition, the deposition method using the deposition apparatus for manufacturing a display device may include a step of opening a shutter 520 before the step of measuring the temperature of the substrate 300, and may further include a step of closing the shutter 520 after the step of measuring the temperature of the substrate 300.

[0102] By including the step of opening the shutter 520 and the step of closing the shutter 520, it is possible to minimize the attachment of foreign matter such as a deposition material (DM) to the lens 530 and the protective tape 531. In other words, it is possible to include a step of opening the shutter 520 before the step of using the thermal imaging camera 510, and a step of closing the shutter 520 after the step of using the thermal imaging camera 510. In other words, by minimizing the time during which the shutter 520 is open, it is possible to minimize the attachment of foreign matter such as a deposition material (DM) to the lens 530 and the protective tape 531.

[0103] As shown in FIG. 8, between the step of adjusting the temperature of the substrate 300 to the third target temperature and the step of closing the shutter 520, the method may further include the steps of contacting a mask 400 onto the substrate 300, measuring the temperatures of the mask 400 and the substrate 300 using a thermal imaging camera 510, and adjusting the temperature of the mask 400 to a fourth target temperature and adjusting the temperature of the substrate 300 to a fifth target temperature.

[0104] The fourth target temperature may be the same as the second target temperature, and the fifth target temperature may be the same as the third target temperature. The fourth target temperature is the optimum temperature of the mask 400 for performing the deposition process of spraying the deposition material (DM). The fifth target temperature is the optimum temperature of the substrate 300 for performing the deposition process of spraying the deposition material (DM). The fourth and fifth target temperatures may be temperatures set to be different depending on the type of deposition material (DM), the type of mask 400, the type of substrate 300, the properties of the targeted deposition pattern, etc.

[0105] When the mask 400 and the substrate 300 come into contact with each other, the temperature of the mask 400 deviates from the second target temperature, and the temperature of the substrate 300 deviates from the third target temperature. Therefore, the deposition method using the deposition apparatus for manufacturing a display device includes a step of measuring the temperatures of the mask 400 and the substrate 300 using the thermal imaging camera 510, and a step of adjusting the temperature of the mask 400 to a fourth target temperature and adjusting the temperature of the substrate 300 to a fifth target temperature, so that the deposition process can be performed at an optimal mask 400 temperature and an optimal substrate 300 temperature.

[0106] In addition, the deposition method using the deposition apparatus for manufacturing a display device may include a step of opening a shutter 520 before the step of measuring the temperature of the mask 400 and the temperature of the substrate 300, and may further include a step of closing the shutter 520 after the step of measuring the temperature of the mask 400 and the temperature of the substrate 300.

[0107] By including the step of opening the shutter 520 and the step of closing the shutter 520, it is possible to minimize the attachment of foreign matter such as a deposition material (DM) to the lens 530 and the protective tape 531. In other words, it is possible to include a step of opening the shutter 520 before the step of using the thermal imaging camera 510, and a step of closing the shutter 520 after the step of using the thermal imaging camera 510. That is, it is possible to minimize the time during which the shutter 520 is open, thereby minimizing the attachment of foreign matter such as a deposition material (DM) to the lens 530 and the protective tape 531.

[0108] 9, the deposition method using the deposition apparatus for manufacturing a display device further includes a step of spraying a deposition material (DM) from a deposition device 200. Thus, the deposition process can form the deposition pattern on the substrate 300 under optimal conditions.

[0109] Although the present invention has been described with reference to illustrative embodiments, it will be understood by those having ordinary skill in the art that various modifications and variations of the present invention may be made without departing from the spirit and scope of the present invention as set forth in the following claims.

[0110] According to one preferred embodiment, the following is true:

[0111] The background and issues of this case are as follows (i) to (ix).

[0112] (i) In manufacturing display panels for organic light-emitting displays (OLEDs) and liquid crystal displays (LCDs), deposition masks (metal sheets with openings at specified locations) are used to form common electrode layers and electrode patterns made of metals or conductive metal oxides, and patterns of layers constituting organic light-emitting elements. That is, deposition is performed by vacuum deposition, sputtering, or the like, with the deposition mask positioned and attached to the substrate for the display panel.

[0113] (ii) The deposition is performed in a reduced pressure chamber (vacuum chamber), and in many cases, the deposition mask and the display panel substrate are heated as the deposition material is sprayed from the deposition source onto the substrate in the process of being manufactured.

[0114] (iii) However, the deposition mask made of metal or the like and the display panel substrate made of glass or resin or the like have different thermal expansion coefficients and thermal conductivities, which may cause a difference in the degree of expansion. This may cause misalignment or gaps in the vicinity of each opening between the deposition mask and the display panel substrate. In such cases, defects or failures may occur, such as the deposition pattern bleeding out of a predetermined area.

[0115] (iv) In order to prevent such defects and malfunctions, it is desirable to form the base plate ("base material") on which the display panel substrate is placed, and the electrostatic chuck (600) provided between this base plate ("base material 700") and the display panel substrate (300) from a material with high thermal conductivity, such as aluminum, and to perform forced cooling by circulating a coolant.

[0116] (v) This forced cooling can be achieved by circulating a liquid or gaseous coolant through coolant flow passages ("cooling lines (CL)") provided inside the base plate ("base material 700") or through grooves (cooling flow passages between the embossments (EB)) provided on the chuck surface of the electrostatic chuck (600).

[0117] (vi) In order to perform appropriate cooling, it is necessary to grasp the temperature at each position of the deposition mask and the substrate for the display panel in real time. However, the prior art has not made any concrete proposal for an apparatus suitable for this purpose.

[0118] (vii) Patent Document 1 proposes measuring the temperature in real time at one location in the chamber, on the premise that the temperature in the chamber is essentially constant. In particular, it shows that the measuring end of a thermocouple is attached to a temperature measurement substrate, and that the temperature measurement substrate is equipped with a cooling line for initialization.

[0119] (viii) On the other hand, Patent Document 2 discloses that an IR camera 150 is installed at the top center of a process chamber 101 for manufacturing semiconductors so as to penetrate the ceiling wall, and the temperature profile over the entire surface 156A of a substrate 156 is captured through a reflector plate 135.

[0120] (ix) Furthermore, Patent Document 3 proposes grasping the amount of thermal expansion by checking the positions of markers on the substrate and the holder on which the substrate is placed through multiple openings in the ceiling wall of the deposition chamber.

[0121] Therefore, according to a preferred embodiment, the following A1 to A3, A1 to A4, or A1 to A5 can be adopted. Also, at least one of A6 to A10 can be adopted.

[0122] A1. Inside the deposition chamber 100, a thermal imaging camera module 500 comprising a thermal imaging camera 510 and a lens 530 is installed.

[0123] A2 A cooling line 570 is wound around the thermal imaging camera 510 to prevent the temperature of the thermal imaging camera 510 and the lens 530 from rising excessively.

[0124] A3. Equip the lens 530 with a temperature sensor such as a thermocouple 550 for sensing the temperature of the lens 530 in real time.

[0125] The A4 thermal imaging camera module 500 is provided with a shutter 520 that can be opened and closed to prevent deposition material from adhering to the lens 530 when temperature detection is not being performed.

[0126] A replaceable transparent protective film (protective tape 531) is attached to the A5 lens 530. In this way, by replacing the protective film (protective tape 531) each time a predetermined amount or more of deposition material adheres, adverse effects of the deposition material during photography can be eliminated.

[0127] A6 The main body 591 of the thermal imaging camera module 500 is sealed while maintaining the inside at atmospheric pressure or a pressure higher than that in the vacuum chamber. This prevents the deposition material from entering the inside of the main body 591.

[0128] The A7 thermal imaging camera module 500 includes an angle adjustment unit 560 at the base of the main body 591 for adjusting the shooting angle.

[0129] A8 The tip of a leg 593 made of a bellows is connected to the base of the main body 591. Since the leg 593 is made of a bellows, the position of the thermal imaging camera module 500 can be appropriately adjusted.

[0130] A9 The shutter 520 is driven by a motor (shutter drive unit 521) inside the main body 591 so as to rotate around a shutter connector 523 fitted into a circular opening provided in the main body 591 of the thermal imaging camera module 500.

[0131] A10 A plurality of thermal imaging camera modules 500 are provided at the left and right ends of the deposition chamber 100 at positions not overlapping with the substrate 300. [Industrial Applicability]

[0132] The present invention is applicable to a deposition process using a substrate and a mask. More specifically, the present invention is applicable to a deposition process in a manufacturing process of a display device. For example, the present invention is applicable to a deposition process for manufacturing a display device such as a high-resolution smartphone, a mobile phone, a smart pad, a smart watch, a tablet PC, a navigation system for a vehicle, a television, a computer monitor, or a notebook computer. [Explanation of symbols]

[0133] 1000: Vapor deposition equipment for display device manufacturing 100: Chamber 200: Evaporator 300: Substrate 400: Mask 500: Thermal imaging camera module 600: Electrostatic chuck DM: Deposition material NZ: Nozzle 510: Thermal imaging camera 530: Lens S1: First side S2: Second Side 550: Thermocouple 531: Protective tape 520: Shutter 521: Shutter drive unit 523: Shutter connection part 541, 542, 543: Camera cables 544: Motor cable 560: Angle adjustment section 570: Cooling line 700: Base material 591: Main body 593: Legs AA1: First aperture AA2: Second opening

Claims

1. A chamber; a vaporizer disposed in the chamber and configured to inject a vapor deposition material; A thermal imaging camera that measures the temperature of the subject; a lens disposed adjacent to the thermal imaging camera, the lens including a first surface and a second surface opposite the first surface; a thermal imaging camera module having a thermocouple connected to the lens for measuring a temperature of the lens.

2. a substrate facing the deposition device in the chamber and onto which the deposition material is deposited; a mask disposed between the substrate and the deposition chamber; 2. The deposition apparatus according to claim 1, further comprising an electrostatic chuck disposed below the substrate for supporting and fixing the substrate.

3. 2. The deposition apparatus according to claim 1, wherein the thermal imaging camera module further comprises a cooling line in contact with the thermal imaging camera to adjust a temperature of the thermal imaging camera and a temperature of the lens.

4. 2 . The deposition apparatus according to claim 1 , wherein the thermal imaging camera module further includes a body that houses the thermal imaging camera and the thermocouple, and a leg that is connected to the body.

5. 5. The deposition apparatus for manufacturing a display device according to claim 4, wherein the thermal imaging camera module further includes an angle adjustment unit disposed at the boundary between the main body and the leg unit and adapted to adjust the direction in which the thermal imaging camera captures images.

6. providing a chamber including an evaporator, a workpiece, and an electrostatic chuck disposed on the workpiece, and a thermal imaging camera module including a thermal imaging camera and a shutter; opening the shutter to expose the thermal imaging camera; measuring a temperature of the electrostatic chuck using the thermal imaging camera; closing the shutter so that the thermal imaging camera is not exposed; and injecting a deposition material from the evaporator.

7. 7. The deposition method using the deposition apparatus for manufacturing a display device according to claim 6, further comprising a step of adjusting the temperature of the electrostatic chuck to a first target temperature between the step of measuring the temperature of the electrostatic chuck and the step of closing the shutter.

8. Furthermore, between the step of adjusting the temperature of the electrostatic chuck to a first target temperature and the step of closing the shutter, positioning a mask within the chamber using a mask transporter; measuring the temperature of the mask using the thermal imaging camera; 8. The deposition method according to claim 7, further comprising the step of: adjusting the temperature of the mask to a second target temperature.

9. Furthermore, between the step of adjusting the temperature of the mask to a second target temperature and the step of closing the shutter, positioning a substrate between the mask and the electrostatic chuck in the chamber; measuring a temperature of the substrate using the thermal imaging camera; 9. The deposition method according to claim 8, further comprising the step of: adjusting the temperature of the substrate to a third target temperature.

10. Furthermore, between the step of adjusting the temperature of the substrate to a third target temperature and the step of closing the shutter, placing the mask on the substrate; measuring a temperature of the mask and a temperature of the substrate using the thermal imaging camera; 10. The deposition method according to claim 9, further comprising the steps of: adjusting a temperature of the mask to a fourth target temperature; and adjusting a temperature of the substrate to a fifth target temperature.

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