Liquid discharge head
Patent Information
- Application Number
- JP2022048587
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2022-03-24
- Publication Date
- 2025-06-13
- Estimated Expiration
- 2042-03-24
AI Technical Summary
Existing liquid ejection heads face issues with pressure fluctuations propagating through a common flow path affecting the ejection characteristics of multiple nozzles, leading to unintended changes in droplet characteristics and print quality.
A liquid ejection head design featuring a common flow path with partition walls and a damper mechanism arranged to intersect the discharge surface, which suppresses pressure fluctuations by reflecting and absorbing them, thereby reducing crosstalk between nozzles.
The design effectively minimizes the impact of pressure fluctuations on droplet ejection characteristics, enhancing print quality by reducing unintended fluctuations and crosstalk between nozzles.
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Abstract
Description
Technical Field
[0001] The present invention relates to a liquid ejection head.
Background Art
[0002] In a liquid ejection head used in a liquid ejection device that ejects a liquid such as ink, a plurality of nozzles are provided on the ejection surface, and a pressure chamber having an actuator such as a piezoelectric element that applies pressure to the liquid to eject droplets from the nozzles is provided. Pressure fluctuations applied to the liquid in the pressure chamber for droplet ejection can affect the ejection characteristics of subsequent droplets. The ejection characteristics of droplets include ejection speed, droplet volume, and the degree of droplet aggregation. When the ejection characteristics of droplets change, in a printing device using the liquid ejection head, the droplet landing position on the paper surface, the area of the droplet after landing, the number of droplets landing, etc. change, which affects the print quality. On the other hand, a technique including a damper mechanism that absorbs pressure fluctuations of the liquid accompanying droplet ejection is known. In Patent Documents 1 and 2, a damper chamber is arranged at a position facing in a direction intersecting the ejection surface with respect to the liquid flow path, a flexible damper wall is arranged between the damper chamber and the flow path, and a technique for absorbing pressure fluctuations of the liquid in the flow path by the deflection of the damper wall is described.
Prior Art Documents
Patent Documents
[0003]
Patent Document 1
Patent Document 2
Summary of the Invention
Problems to be Solved by the Invention
[0004] A liquid discharge head configuration is known in which a common channel is provided that communicates with multiple pressure chambers, each communicating with a separate nozzle, and extends in the direction of the nozzle arrangement. Liquid is supplied to the common channel from the outside and distributed from the common channel to each pressure chamber. In the technologies of Patent Documents 1 and 2, a damper mechanism is positioned opposite the discharge surface in a direction intersecting the common channel. However, such a damper mechanism cannot sufficiently suppress the propagation of pressure fluctuations within the common channel in the direction of the nozzle arrangement. Due to the pressure fluctuations propagating within the common channel in the direction of the nozzle arrangement, pressure fluctuations occurring in one pressure chamber may affect the discharge characteristics of droplets from nozzles in other pressure chambers that are connected via the common channel.
[0005] In view of the above problems, the present invention aims to suppress the influence of pressure fluctuations associated with droplet discharge on droplet discharge from other nozzles connected via a common channel in a liquid discharge head in which multiple nozzles are connected via a common channel. [Means for solving the problem]
[0006] The present invention relates to a liquid dispensing head that dispenses liquid from a dispensing surface, A plurality of nozzles arranged along the first direction of the discharge surface, Multiple pressure chambers are provided, each of which is in communication with one of the multiple nozzles and is equipped with an actuator that applies pressure to the liquid to discharge the liquid from the nozzle. Multiple individual flow paths communicating with each of the aforementioned multiple pressure chambers, A common channel extending in the first direction that communicates with each of the plurality of individual channels via individual openings, A damper mechanism is positioned opposite the discharge surface in a direction intersecting the common flow path and absorbs pressure fluctuations of the liquid in the common flow path. Equipped with, The common flow path is characterized by having a partition wall that is positioned between adjacent individual openings in the first direction and extends in a direction intersecting the discharge surface.
[0007] The present invention relates to a liquid dispensing head that dispenses liquid from a dispensing surface, A plurality of nozzles arranged along the first direction of the discharge surface, Multiple pressure chambers are provided, each of which is in communication with one of the multiple nozzles and is equipped with an actuator that applies pressure to the liquid to discharge the liquid from the nozzle. Multiple individual flow paths communicating with each of the aforementioned multiple pressure chambers, A common channel extending in the first direction that communicates with each of the plurality of individual channels, A damper mechanism is positioned opposite the discharge surface in a direction intersecting the common flow path and absorbs pressure fluctuations of the liquid in the common flow path. Equipped with, The common channel is characterized by being provided with a partition wall that partially obstructs the flow of liquid along the first direction. [Effects of the Invention]
[0008] According to the present invention, in a liquid discharge head in which multiple nozzles are connected via a common channel, it is possible to suppress the influence of pressure fluctuations associated with droplet discharge on droplet discharge from other nozzles connected via the common channel. [Brief explanation of the drawing]
[0009] [Figure 1] Schematic diagram of an inkjet recording device [Figure 2] Schematic diagram of the liquid dispensing head module [Figure 3] schematic cross-sectional view of liquid discharge substrate [Figure 4] Planar perspective schematic of a liquid discharge substrate [Figure 5] Schematic diagram of a liquid discharge substrate according to Embodiment 1 of the present invention [Figure 6] Schematic diagram of a liquid discharge substrate according to Embodiment 2 of the present invention [Figure 7] Schematic diagram of liquid discharge substrate according to Embodiment 3 of the present invention [Figure 8] Schematic diagram of the liquid discharge substrate according to Embodiment 4 of the present invention
Best Mode for Carrying Out the Invention
[0010] Hereinafter, with reference to the drawings, a liquid ejection head and a liquid ejection device according to an embodiment of the present invention will be described. Hereinafter, an example of applying the present invention to an inkjet recording head and an inkjet recording device that eject ink as an example of a liquid will be described, but the present invention is also applicable to other devices. For example, it can be applied to devices such as printers, copiers, facsimiles having a communication system, word processors having a printer unit, industrial recording devices combined with various processing devices in a complex manner, for example, devices for manufacturing biochips and printing electronic circuits. Also, the configurations of the following examples are merely examples for explanation, and various combinations and modifications are possible within the scope of the present invention.
[0011] (Description of the entire head) FIG. 1 is a schematic configuration diagram of an inkjet recording device 101 according to an embodiment. The inkjet recording device 101 is a one-pass type recording device that records an image on a recording medium 111 by a single conveyance of the recording medium 111 by a conveyance unit 110 using a liquid ejection head module 1. Hereinafter, the width direction of the recording medium 111 is defined as the X direction, the conveyance direction of the recording medium 111 (indicated by arrow A) is defined as the Y direction, and the direction intersecting the X direction and the Y direction is defined as the Z direction. The X direction and the Y direction are directions along the ejection surface on which nozzles, which will be described later, of the liquid ejection head module 1 are formed. The X direction (first direction) is the arrangement direction of the nozzles, and the Y direction (second direction) is the arrangement direction of the nozzle rows. The Y direction (second direction) is a direction along the ejection surface and intersects the X direction (first direction). Typically, the X direction and the Y direction are along a horizontal plane and perpendicular to each other, and the Z direction is parallel to the vertical direction. 。
[0012] The liquid ejection head module 1 is composed of individual modules that eject cyan, magenta, yellow, and black inks. When distinguishing the liquid ejection head modules of each color, they are distinguished by attaching the symbols C, M, Y, and K. The four-color liquid ejection head modules are arranged along the conveyance direction (Y direction) of the recording medium 111. In addition, each color liquid ejection head module has sub-modules arranged along the width direction (X direction) of the recording medium 111. When distinguishing the sub-modules, they are distinguished by attaching the symbols a and b. In FIG. 1, the liquid ejection head module 1 is arranged vertically above the recording medium 111 and ejects ink vertically downward (Z direction). Note that the configuration of the liquid ejection head module 1 shown in FIG. 1 is an example, and the present invention is also applicable to other forms of liquid ejection head modules.
[0013] (Explanation of the configuration of the liquid ejection head) FIG. 2 is a schematic view of the liquid ejection head module 1. FIG. 2(a) is a perspective view of the liquid ejection head module 1 seen from the ejection surface side. FIG. 2(b) is a view showing the ejection surface of the liquid ejection substrate 2. FIG. 2(c) is a view showing the surface of the liquid ejection substrate 2 opposite to the ejection surface.
[0014] The liquid ejection head module 1 has a head body 4 and a plurality of liquid ejection substrates 2 arranged on the head body 4. The liquid ejection head module 1 has a plurality of nozzles 3 arranged in the X direction (first direction) along the ejection surface 30 of the liquid ejection substrate 2.
[0015] The liquid ejection substrate 2 has a nozzle substrate 201, and a plurality of nozzles 3 are arranged along the longitudinal direction (X direction) of the nozzle substrate 201, forming a nozzle row. A plurality of nozzle rows are arranged along the short direction (Y direction) of the nozzle substrate 201. The liquid ejection substrate 2 has a flow channel forming substrate 204, and ink is supplied to the liquid ejection substrate 2 from an external ink tank through supply external openings 20 formed in the flow channel forming substrate 204. The supplied ink flows through the flow channels inside the liquid ejection substrate 2, is ejected from the nozzles 3, and drops onto the recording medium 111. Ink is supplied to the plurality of supply external openings 20 from an ink tank (not shown) via a common supply port (not shown) provided in the head body 4.
[0016] The head body 4 is equipped with an electrical circuit board (not shown) for supplying power and signals to drive actuators such as piezoelectric elements that eject ink from the nozzle 3. The electrical circuit board is connected by wiring (not shown) to terminals 10 of the vibration substrate 202 on which the actuator of the liquid ejection substrate 2 is provided. Note that the configuration of the liquid ejection head module 1 shown in Figure 2 is just one example, and the present invention is applicable to other forms of liquid ejection head modules.
[0017] (Explanation of the liquid discharge substrate configuration) Figure 3 is a schematic cross-sectional view of the liquid discharge substrate 2. Figure 3(a) shows the BB cross-section in Figure 2(b), and Figure 3(b) is an enlarged view of a part of Figure 3(a).
[0018] The liquid discharge substrate 2 is constructed by joining together four substrates: a nozzle substrate 201, a vibration substrate 202, a liquid supply substrate 203, and a flow path forming substrate 204. A damper member 300 is interposed between the liquid supply substrate 203 and the flow path forming substrate 204. The flow path forming substrate 204 is provided with a recess extending in the X direction (first direction), and the damper member 300 and the recess form a damper chamber, which is a space extending in the X direction (first direction). This space is a space in which gas (typically air) exists. This space and the damper member 300 constitute a damper mechanism 301 that absorbs pressure fluctuations of the liquid.
[0019] Multiple pressure chambers 11 are formed in multiple nozzles 3, each communicating with a multiple pressure chamber 11, and each of the multiple pressure chambers 11 is an actuator that applies pressure to the liquid to discharge the liquid from the nozzle 3. A piezoelectric element 18 is provided. The piezoelectric element 18 is mounted on a deformable wall surface made of a vibrating substrate 202, and the piezoelectric element 18 deforms the vibrating substrate 202, thereby applying pressure to the liquid in the pressure chamber 11 and causing droplets to be discharged from the nozzle 3.
[0020] Multiple individual channels are formed, each communicating with a multiple pressure chamber 11, and a common channel extending in the X direction (first direction) is formed, communicating with each of the multiple individual channels via individual openings. In the example of Figure 3(b), the individual channels include an individual supply channel 12a for supplying liquid to the pressure chamber 11 and an individual discharge channel 12b for discharging liquid from the pressure chamber 11. The common channel is formed in the liquid supply substrate 203. In the example of Figure 3(b), the common channel includes a common supply channel 13a communicating with the multiple individual supply channels 12a via individual supply openings 120a, and a common discharge channel 13b communicating with the multiple individual discharge channels 12b via individual discharge openings 120b.
[0021] The damper member 300 is positioned opposite the common flow path in a direction (Z direction) that intersects the discharge surface 30, and absorbs pressure fluctuations of the liquid in the common flow path. In the example shown in Figure 3(b), the wall surface of the common supply flow path 13a facing the individual supply flow path 12a is made of the damper member 300, and therefore the damper mechanism 301 is positioned opposite the individual supply flow path 12a. Similarly, the wall surface of the common discharge flow path 13b facing the individual discharge flow path 12b is made of the damper member 300, and therefore the damper mechanism 301 is positioned opposite the individual discharge flow path 12b. The damper member 300 may also be positioned opposite at least one of the common supply flow path 13a and the common discharge flow path 13b in a direction (Z direction) that intersects the discharge surface 30.
[0022] Each of the multiple common supply channels 13a communicates with each of the multiple supply connection channels 15a formed in the channel-forming substrate 204. Each of the multiple supply connection channels 15a has multiple supply external openings 20a, and liquid is supplied from the outside through the supply external openings 20a. Each of the multiple common discharge channels 13b communicates with multiple discharge connection channels 15b formed in the channel-forming substrate 204. Each of the multiple discharge connection channels 15b has multiple discharge external openings 20b, and liquid is discharged to the outside through the discharge external openings 20b.
[0023] The nozzle substrate 201, vibration substrate 202, liquid supply substrate 203, and flow path forming substrate 204 are each formed from a silicon substrate or the like. The configuration and number of substrates forming the liquid discharge substrate 2 are not limited to this example. The damper member 300 is formed from an elastic material, and resin materials such as polyimide or polyamide can be used.
[0024] Figure 4 is a plan view showing a part of the liquid discharge substrate 2. The liquid discharge substrate 2 has a plurality of nozzles 3 and a plurality of pressure chambers 11 connected to each of the plurality of nozzles 3. The plurality of nozzles 3 are arranged along the X direction (first direction) to form a nozzle row, and a plurality of such nozzle rows are formed along the Y direction (second direction). At both ends of the longitudinal direction (Y direction) of each pressure chamber 11, there is a separate supply opening 120a that communicates with a separate supply channel 12a and a separate discharge opening 120b that communicates with a separate discharge channel 12b. In relation to the discharge surface (XY plane), the damper mechanism 301 is positioned to encompass the position of the separate supply opening 120a. Furthermore, in relation to the discharge surface (XY plane), the damper mechanism 301 and the supply connection channel 15a and discharge connection channel 15b do not overlap on the XY plane. Note that the positional relationship between the damper mechanism 301, the supply connection channel 15a, and the discharge connection channel 15b is not limited to the example in Figure 4.
[0025] The configuration of the liquid ejection substrate 2 shown in Figures 3 and 4 is an example of a liquid ejection substrate to which the present invention can be applied, and the configuration of a liquid ejection substrate to which the present invention can be applied is not limited to this example. For example, in the liquid ejection substrate 2 shown in Figures 3 and 4, liquid is supplied to the liquid ejection substrate 2 from an external ink tank. The ink passes through the pressure chamber 11, some of which is discharged from the nozzle 3, and the rest circulates back to the external ink tank. However, the present invention is also applicable to liquid ejection substrates 2 that do not have such a circulation channel. Examples 1 and 2 below are examples of applying the present invention to a liquid ejection substrate 2 that does not have a circulation channel, while Examples 3 and 4 are examples of applying the present invention to a liquid ejection substrate 2 that does have a circulation channel.
[0026] Furthermore, in the liquid discharge substrate 2 shown in Figures 3 and 4, the common flow channels 13a, 13b and damper mechanism 301 and the nozzle 3 are arranged on opposite sides of the pressure chamber 11 in the direction intersecting the discharge surface (Z direction). However, the present invention is also applicable to a liquid discharge substrate 2 in which the common flow channels, damper mechanism and nozzle are arranged on the same side of the pressure chamber in the direction intersecting the discharge surface (Z direction). Examples 1, 3, and 4 below are examples in which the present invention is applied to a liquid discharge substrate 2 in which the common flow channels, damper mechanism and nozzle are arranged on opposite sides of the pressure chamber in the direction intersecting the discharge surface (Z direction). Example 2 is an example in which the present invention is applied to a liquid discharge substrate 2 in which the common flow channels, damper mechanism and nozzle are arranged on the same side of the pressure chamber in the direction intersecting the discharge surface (Z direction).
[0027] (Example 1) The liquid discharge substrate of Embodiment 1 of the present invention will be described using Figure 5. Figure 5(a) is a plan view showing a part of the liquid discharge substrate 2 of Embodiment 1. Figure 5(b) is a cross-sectional view along line AA in Figure 5(a).
[0028] On the liquid discharge substrate 2, multiple nozzles 3 are arranged in the X direction (first direction) to form one nozzle row, and multiple nozzle rows are arranged in the Y direction (second direction). Figure 5(a) shows a portion of the two nozzle rows.
[0029] Multiple pressure chambers 11 are arranged along the X direction on the liquid ejection substrate 2. The side of the pressure chamber 11 along the X direction is the short side, and the side along the Y direction is the long side. A nozzle 3 is formed at one end in the direction of the long side (Y direction), and the other end communicates with an individual flow path 12. Each of the multiple pressure chambers 11 communicates with a common flow path 13 via an individual flow path 12. Multiple individual flow paths 12 that communicate with each of the multiple pressure chambers 11 that constitute the two rows of nozzles shown in Figure 5(a) all communicate with the same common flow path 13. The common flow path 13 communicates with a connecting flow path 15, and the connecting flow path 15 communicates with an external ink tank via an external opening 20.
[0030] The common flow path 13 communicates with the individual flow paths 12 via individual openings 120, and the damper mechanism 301 is positioned to face the individual openings 120 in a direction intersecting the discharge surface (Z direction).
[0031] In the common flow path 13, partition walls 16 are formed between adjacent individual openings 120 in the X direction (the arrangement direction of the nozzles 3, the first direction) and extend in a direction intersecting the discharge surface (Z direction). In Embodiment 1, partition walls 16 are not positioned between all adjacent individual openings 120.
[0032] The partition wall 16 extends while bending in the Y direction (second direction), and its wall surface intersects in the X direction (first direction). This causes pressure fluctuations propagating in the X direction within the common flow path 13 to be reflected by the partition wall 16, suppressing the propagation of pressure fluctuations throughout the entire region of the common flow path 13 extending in the X direction.
[0033] One end of the partition wall 16 in the Y direction is in contact with one side wall of the common channel 13 along the X direction (first direction), and the other end is away from the other side wall of the common channel 13 along the X direction (first direction). In terms of positional relationship along the discharge surface (XY plane), the partition wall 16 and the connecting channel 15 do not overlap. As a result, the partition wall 16 does not excessively limit the rate of flow of liquid in the common channel 13. This can be prevented from happening.
[0034] In the Y direction (second direction) intersecting the X direction (first direction) along the discharge surface, the length W2 of the partition wall 16 is longer than the length W1 of the individual openings 120 (W2 > W1). This makes it possible to more reliably suppress the propagation of pressure fluctuations between adjacent individual openings 120.
[0035] In Figure 5(b), the liquid discharge substrate 2 is formed by a laminated structure consisting of a nozzle substrate 201, a vibrating substrate 202, a liquid supply substrate 203, and a flow path forming substrate 204. Each substrate may be composed of a single layer, or it may be composed of multiple layers or a laminated structure of multiple substrates.
[0036] The nozzle substrate 201 has a nozzle 3 and a pressure chamber 11 formed on it.
[0037] A recess 24 is formed in the vibrating substrate 202, and the vibrating substrate 202 is fixed to the nozzle substrate 201 via the diaphragm 17. A piezoelectric element 18, which is an actuator that deforms the diaphragm 17, is provided in the space formed by the diaphragm 17 and the diaphragm 202. Individual channels 12 are formed in the vibrating substrate 202, and through holes 121 are formed in the diaphragm 17 at positions corresponding to the individual channels 12, thereby connecting the pressure chamber 11 and the individual channels 12.
[0038] A common channel 13 and a partition wall 16 are formed in the liquid supply substrate 203, and the individual channels 12 and the common channel 13 are connected when the liquid supply substrate 203 is fixed to the vibrating substrate 202.
[0039] A connecting channel 15 and a damper mechanism 301 extending along a first direction (X direction) are formed on the channel forming substrate 204, and the channel forming substrate 204 is fixed to the liquid supply substrate 203 via an adhesive layer 19. The adhesive layer 19 is not formed in the region corresponding to the common channel 13, the liquid in the common channel 13 is in contact with the damper member 300, and the common channel 13 and the connecting channel 15 are in communication. The damper member 300 is a flexible member that deforms by bending in response to pressure fluctuations of the liquid in the common channel 13. The damper mechanism 301 that absorbs pressure fluctuations of the liquid in the common channel 13 is formed by a space 22 as a damper chamber and a damper member 300 provided such that one surface is in contact with the liquid in the common channel 13 and the other surface is in contact with the gas in the space 22. The common channel 13 and the damper mechanism 301 are formed by fixing a liquid supply substrate 203, which serves as a common channel substrate and constitutes the side walls and partition walls 16 of the common channel 13, and a channel forming substrate 204, which serves as a damper substrate and includes the damper mechanism 301, via an adhesive layer 19. In the connection region between the common channel 13 and the connecting channel 15, a filter 21 may be formed by providing through holes or slits in the damper member 300. The adhesive layer 19 is not formed between the portion of the liquid supply substrate 203 that constitutes the partition walls 16 and the channel forming substrate 204 that serves as a damper substrate, thereby preventing the partition walls 16 from contacting the damper member 300. This prevents the presence of the partition walls 16 from hindering the bending deformation and vibration of the damper member 300.
[0040] In the liquid discharge substrate 2 of Example 1, when a voltage is applied to the piezoelectric element 18 via electrical wiring (not shown), the diaphragm 17 deforms, causing pressure fluctuations in the liquid within the pressure chamber 11. By applying a voltage to the piezoelectric element 18 in accordance with the resonant frequency of the pressure chamber 11 containing the liquid 14, and displacing the diaphragm 17 in a combination of directions that expand and contract the space within the pressure chamber 11, droplets of liquid 14 are discharged from the nozzle 3. Therefore, liquid 14 can be discharged from the nozzle 3 in accordance with the drive signal input to the piezoelectric element 18. The liquid 14 is supplied to the pressure chamber 11 from a liquid tank (not shown) via an external opening 20, a connecting channel 15, a common channel 13, and individual channels 12.
[0041] The displacement of the diaphragm 17 due to the application of voltage to the piezoelectric element 18 and the discharge of liquid 14 from the nozzle 3 cause pressure fluctuations in the liquid 14 within the pressure chamber 11. These pressure fluctuations propagate to other pressure chambers 11 that are connected via individual flow paths 12 and common flow paths 13. Pressure fluctuations occur. If liquid 14 is dispensed under these conditions, unintended changes may occur in the characteristics of the dispensed liquid droplets, such as the velocity, volume, and how the droplets clump together.
[0042] In this regard, in the liquid discharge substrate 2 of Embodiment 1, a damper mechanism 301 is positioned opposite the individual openings 120 in the common flow path 13 and the discharge surface in a direction intersecting the Z direction, so that pressure fluctuations propagated in the common flow path 13 can be reduced by the damper mechanism 301. Furthermore, a partition wall 16 is provided between some adjacent individual openings 120. Therefore, pressure fluctuations propagating in the X direction (first direction, longitudinal direction of the common flow path 13) within the space of the common flow path 13 are blocked at the position of the partition wall 16, suppressing the propagation of pressure fluctuations over long distances within the common flow path 13. Since the partition wall 16 and the damper member 300 are not in contact, the presence of the partition wall 16 can be suppressed from affecting the pressure fluctuation reduction effect of the damper member 300. In this way, the synergistic effect of the partition wall 16 that blocks pressure fluctuations propagating within the common flow path 13 and the damper mechanism 301 that absorbs pressure fluctuations can suppress the effect of pressure fluctuations generated in one pressure chamber 11 on other pressure chambers 11. Therefore, crosstalk between the pressure chambers 11 communicating via the common flow path 13 can be reduced, and unintended fluctuations in the characteristics of the liquid droplets 14 ejected from the nozzle 3 can be suppressed. This makes it possible to suppress a decrease in print quality on the recording medium 111 by the recording device 101 having the liquid ejection head module 1.
[0043] In Example 1, the damper mechanism 301 was exemplified as consisting of a damper member 300 and a space 22 provided in the flow path forming substrate 204. However, the configuration is not limited to this as long as it reduces pressure fluctuations through the deformation of the damper member 300.
[0044] (Example 2) The liquid discharge substrate of Embodiment 2 of the present invention will be described with reference to Figure 6. In the following description, the differences from Embodiment 1 will be mainly explained, and components similar to those in Embodiment 1 will be given the same reference numerals as in Embodiment 1, and detailed explanations will be omitted.
[0045] Figure 6(a) is a plan view showing a part of the liquid discharge substrate 2 of Example 2. Figure 6(b) is a cross-sectional view along line AA in Figure 6(a). Figure 6(a), like Figure 5(a), shows a part of the two rows of nozzles N1 and N2.
[0046] Individual flow paths 12, which communicate with the pressure chamber 11 in which the nozzles 3 of adjacent nozzle rows N1 and N2 are formed, communicate with the same common flow path 13. An external opening 20 is formed at the X-direction end of the common flow path 13 and is connected to a liquid tank (not shown).
[0047] The common flow path 13 communicates with the individual flow paths 12 via individual openings 120, and the damper mechanism 301 is positioned to face the individual openings 120 in a direction intersecting the discharge surface (Z direction).
[0048] The row of individual openings 120 corresponding to nozzle 3 in the first nozzle row N1 is designated as the first individual opening row R1, and the row of individual openings 120 corresponding to nozzle 3 in the second nozzle row N2 is designated as the second individual opening row R2.
[0049] The partition wall 16 includes a partition wall 161 positioned between adjacent individual openings 120 of the first individual opening row R1 in the X direction (the arrangement direction of the nozzles 3, the first direction), and a partition wall 162 positioned between adjacent individual openings 120 of the second individual opening row R2 in the X direction. Partition wall 161 extends to a position in the Y direction where it does not overlap with the individual openings 120 of the second individual opening row R2, and partition wall 162 extends to a position in the Y direction where it does not overlap with the individual openings 120 of the first individual opening row R1. Partially overlapping in the Y direction, partition walls 161 and 162 are nested in a positional relationship along the discharge surface (XY plane), and are arranged in a comb-like shape overall.
[0050] The partition walls 161 and 162 extend in the Y direction (second direction), and their wall surfaces intersect in the X direction (first direction). This causes pressure fluctuations propagating in the X direction within the common flow path 13 to be reflected by the partition walls 161 and 162, suppressing the propagation of pressure fluctuations throughout the entire region of the common flow path 13 that extends in the X direction.
[0051] The partitions 161 and 162 are separated from the wall surface of the common channel 13 along the X direction. This prevents the partitions 161 and 162 from becoming an excessive rate-limiting factor in the liquid flow within the common channel 13.
[0052] In the Y direction (second direction), the lengths of the partition walls 161 and 162 are longer than the lengths of the individual openings 120. This makes it possible to more reliably suppress the propagation of pressure fluctuations between adjacent individual openings 120.
[0053] In Figure 6(b), the liquid discharge substrate 2 is formed by a laminated structure consisting of a nozzle substrate 201, a flow path forming substrate 204, a liquid supply substrate 203, and a vibrating substrate 202. Each substrate may consist of a single layer, or it may consist of multiple layers or a laminated structure of multiple substrates.
[0054] The nozzle substrate 201 has a nozzle 3 and a space 22 formed therein.
[0055] A common channel 13 and a partition wall 16 are formed on the channel forming substrate 204, and the channel forming substrate 204 is fixed to the nozzle substrate 201 via an adhesive layer 19. The adhesive layer 19 is not formed in the region corresponding to the common channel 13, and the liquid in the common channel 13 is in contact with the damper member 300. The damper member 300 is a flexible member that deforms by bending in accordance with pressure fluctuations of the liquid in the common channel 13. The space 22 and the damper member 300, which is provided so that one surface is in contact with the liquid in the common channel 13 and the other surface is in contact with the gas in the space 22, constitute a damper mechanism 301 that absorbs pressure fluctuations of the liquid in the common channel 13. The common channel 13 and the damper mechanism 301 are formed by fixing the channel forming substrate 204, which is a common channel substrate that constitutes the side walls and partition wall 16 of the common channel 13, and the nozzle substrate 201, which is a damper substrate including the damper mechanism 301, via an adhesive layer 19.
[0056] Individual channels 12 and a pressure chamber 11 are formed in the liquid supply substrate 203, and the individual channels 12, common channel 13, and pressure chamber 11 are connected when the liquid supply substrate 203 is fixed to the channel forming substrate 204.
[0057] A recess 24 is formed in the vibrating substrate 202, and the vibrating substrate 202 is fixed to the liquid supply substrate 203 via the diaphragm 17. A piezoelectric element 18, which is an actuator that deforms the diaphragm 17, is provided in the space formed by the diaphragm 17 and the recess 24.
[0058] Furthermore, through-channels 23 connecting the nozzle 3 and the pressure chamber 11 are formed in the nozzle substrate 201, the channel forming substrate 204, and the liquid supply substrate 203.
[0059] In Example 2, the liquid 14 is discharged from a liquid tank (not shown) through an external opening 20, a common channel 13, individual channels 12, a pressure chamber 11, and a through channel 23 via a nozzle 3. The liquid 14 supplied to the common channel 13 is supplied to the pressure chamber 11 through the space between the comb-shaped partition walls 161 and 162.
[0060] In Embodiment 2, since partition walls 16 are arranged between adjacent individual openings 120 in the X direction, the propagation of pressure fluctuations to adjacent pressure chambers 11 in the X direction, which has a large impact on the propagation of pressure fluctuations, can be suppressed. Furthermore, partition walls 16 are arranged in a comb-like pattern in the center of the common flow path 13 in the Y direction, and partition walls 16 are not provided near both ends of the common flow path in the Y direction, resulting in an open space. Therefore, pressure fluctuations propagate near both ends of the common flow path in the Y direction. Consequently, the propagation of pressure fluctuations to adjacent pressure chambers 11 in the Y direction can also be suppressed.
[0061] Furthermore, in Example 2, since no adhesive layer 19 is formed between the partition wall 16 and the damper member 300, and the partition wall 16 and the damper member 300 are in non-contact, the presence of the partition wall 16 can suppress its influence on the pressure fluctuation reduction effect of the damper member 300. The synergistic effect of the partition wall 16, which blocks pressure fluctuations propagating within the common flow path 13, and the damper mechanism 301, which absorbs pressure fluctuations, can suppress pressure fluctuations occurring in one pressure chamber 11 from affecting other pressure chambers 11. Therefore, crosstalk between pressure chambers 11 communicating via the common flow path 13 can be reduced, and unintended fluctuations in the characteristics of droplets of liquid 14 ejected from the nozzle 3 can be suppressed. As a result, a decrease in print quality on the recording medium 111 by the recording device 101 having the liquid ejection head module 1 can be suppressed.
[0062] In Example 2, the damper mechanism 301 was exemplified as consisting of a damper member 300 and a space 22 provided in the nozzle substrate 201. However, the configuration is not limited to this as long as the structure reduces pressure fluctuations by the deformation of the damper member 300. For example, an opening may be provided on the surface of the nozzle substrate 201 facing the damper member 300 via the space 22, or a nozzle-shaped opening may be provided on the wall surface between the space 22 and the common flow path 13 without providing a damper member 300, thereby forming a meniscus of liquid 14.
[0063] (Example 3) The liquid discharge substrate of Embodiment 3 of the present invention will be described with reference to Figure 7. In the following description, the differences from Embodiment 1 will be mainly explained, and components similar to those in Embodiment 1 will be given the same reference numerals as in Embodiment 1, and detailed explanations will be omitted.
[0064] Figure 7(a) is a plan view showing a part of the liquid discharge substrate 2 of Example 3. Figure 7(b) is a cross-sectional view along line AA in Figure 7(a). Figure 7 shows a part of the four nozzle rows N1, N2, N3, and N4.
[0065] A nozzle 3 is formed near the center of each pressure chamber 11 in the Y direction (longitudinal direction of the pressure chamber 11), and communicates with individual supply channels 12a and individual discharge channels 12b near both ends in the Y direction. The pressure chamber 11 communicates with a common supply channel 13a and a supply connection channel 15a via the individual supply channel 12a, and the supply connection channel 15a communicates with an external ink tank via the supply external opening 20a. The pressure chamber 11 is connected with a common discharge channel 13b and a discharge connection channel 15b via the individual discharge channel 12b, and the discharge connection channel 15b communicates with an external ink tank via the discharge external opening 20b.
[0066] The common supply channel 13a communicates with the individual supply channel 12a via the individual supply opening 120a, and the damper mechanism 301 is positioned to face the individual supply opening 120a in the direction intersecting the discharge surface (Z direction). The common discharge channel 13b communicates with the individual discharge channel 12b via the individual discharge opening 120b, and the damper mechanism 301 is positioned to face the individual discharge opening 120b in the direction intersecting the discharge surface (Z direction).
[0067] In Embodiment 3, the liquid 14 supplied from a liquid tank (not shown) circulates back into the liquid tank via a supply external opening 20a, a supply connection channel 15a, a pressure chamber 11, a discharge connection channel 15b, and a discharge external opening 20b. This circulation of the liquid 14 is achieved, for example, by providing a predetermined differential pressure between the supply connection channel 15a and the discharge connection channel 15b. By circulating the liquid 14, it is possible to suppress the increase in viscosity of the liquid 14 near the nozzle 3 due to evaporation from the nozzle 3. In the configuration of Embodiment 3, since the structures of the supply system and the discharge system are symmetrical, the circulation direction of the liquid 14 can also be reversed.
[0068] Individual supply channels 12a that communicate with the pressure chambers 11 in which the nozzles 3 of adjacent nozzle rows N1 and N2 are formed, communicate with the same common supply channel 13a. Individual discharge channels 12b that communicate with the pressure chambers 11 in which the nozzles 3 of adjacent nozzle rows N2 and N3 are formed, communicate with the same common discharge channel 13b. The same applies to adjacent nozzle rows N3 and N4.
[0069] The common supply channel 13a communicates with the individual supply channel 12a via the individual supply opening 120a, and the damper mechanism 301 is positioned to face the individual supply opening 120a in the direction intersecting the discharge surface (Z direction).
[0070] The common discharge channel 13b communicates with the individual discharge channel 12b via the individual discharge opening 120b, and the damper mechanism 301 is positioned to face the individual discharge opening 120 in a direction intersecting the discharge surface (Z direction).
[0071] In Example 3, the common channels 13a, 13b and damper mechanism 301, and the nozzle 3 are located on the opposite side of the pressure chamber 11 in the direction intersecting the discharge surface (Z direction). That is, the common channels 13a, 13b and damper mechanism 301 are provided on the liquid supply substrate 203, which is on the opposite side of the nozzle substrate 201 to the vibrating substrate 202. Compared to the configuration of Example 2 (Figure 6), in which the common channels 13 and damper mechanism 301 are provided on the same side of the nozzle substrate 201 to the vibrating substrate 202, the channel connecting the nozzle 3 and the pressure chamber 11 (through channel 23 in Example 2) is shortened. Therefore, it is possible to guide the circulating flow of liquid 14 to the nozzle 3 more efficiently. Thus, the viscosity increase of liquid 14 in the nozzle 3 can be suppressed more effectively.
[0072] In the common supply channel 13a, a partition wall 16 is formed between adjacent individual supply openings 120a in the X direction (the direction in which the nozzles 3 are arranged, the first direction) and extends in the direction intersecting the discharge surface (the Z direction). Partition wall 16N1, which is positioned between the individual supply openings 120a corresponding to nozzle row N1, and partition wall 16N2, which is positioned between the individual supply openings 120a corresponding to nozzle row N2 located in close proximity to the said individual supply opening 120a, are integrally formed.
[0073] Similarly, the common discharge channel 13b has a partition wall 16 that is positioned between adjacent individual discharge openings 120b in the X direction (the direction in which the nozzles 3 are arranged, the first direction) and extends in a direction intersecting the discharge surface (the Z direction).
[0074] The partition wall 16 extends while bending in the Y direction (second direction), and its wall surface intersects in the X direction (first direction). This causes pressure fluctuations propagating in the X direction within the common supply channel 13a and common discharge channel 13b to be reflected by the partition wall 16, suppressing the propagation of pressure fluctuations throughout the entire area of the common supply channel 13a and common discharge channel 13b that extends in the X direction.
[0075] One end of the partition wall 16 in the Y direction is in contact with one side wall of the common supply channel 13a along the X direction (first direction), and the other end is away from the other side wall of the common supply channel 13a along the X direction (first direction). In terms of positional relationship along the discharge surface (XY plane), the partition wall 16 and the supply connection channel 15a do not overlap.
[0076] One end of the partition wall 16 in the Y direction is in contact with one side wall of the common discharge channel 13b along the X direction (first direction), and the other end is away from the other side wall of the common discharge channel 13b along the X direction (first direction). In terms of positional relationship along the discharge surface (XY plane), the partition wall 16 and the discharge connection channel 15b do not overlap.
[0077] This creates a partition for the liquid flow in the common supply channel 13a and the common discharge channel 13b. This can prevent 16 from becoming an excessive rate-limiting factor.
[0078] In Figure 7(b), the liquid discharge substrate 2 is formed by a laminated structure consisting of a nozzle substrate 201, a vibrating substrate 202, a liquid supply substrate 203, and a flow path forming substrate 204. Each substrate may be composed of a single layer, or it may be composed of multiple layers or a laminated structure of multiple substrates.
[0079] In Example 3, pressure fluctuations generated in the pressure chamber 11 from which the liquid 14 is discharged propagate to the common supply channel 13a via the individual supply channel 12a, and to the common discharge channel 13b via the individual discharge channel 12b. However, the partition wall 16 blocks the propagation of pressure fluctuations in the X direction (first direction, direction of arrangement of nozzles 3) within the common supply channel 13a and the common discharge channel 13b. Therefore, the propagation of pressure fluctuations over long distances within the common supply channel 13a and the common discharge channel 13b is suppressed. Furthermore, since the pressure fluctuations are absorbed by the damper mechanism 301, the influence of the propagation of pressure fluctuations in the Y direction (second direction, direction of arrangement of nozzle rows N1, N2, etc.) is also reduced. As in the other examples, since the partition wall 16 and the damper member 300 are not in contact, the presence of the partition wall 16 can suppress its influence on the pressure fluctuation reduction effect of the damper member 300. In this way, the synergistic effect of the partition wall 16 that blocks pressure fluctuations propagating within the common flow path 13 and the damper mechanism 301 that absorbs pressure fluctuations makes it possible to suppress the influence of pressure fluctuations occurring in one pressure chamber 11 on other pressure chambers 11. Therefore, crosstalk between pressure chambers 11 communicating via the common flow path 13 can be reduced, and unintended fluctuations in the characteristics of liquid droplets 14 ejected from the nozzle 3 can be suppressed. As a result, a decrease in print quality on the recording medium 111 by the recording device 101 having the liquid ejection head module 1 can be suppressed.
[0080] Furthermore, by controlling the timing of liquid 14 discharge between adjacent nozzle rows to be staggered, it is possible to further reduce the effects of crosstalk between adjacent nozzle rows.
[0081] (Example 4) The liquid discharge substrate of Embodiment 4 of the present invention will be described with reference to Figure 8. In the following description, the differences from Embodiment 1 will be mainly explained, and components similar to those in Embodiment 1 will be given the same reference numerals as in Embodiment 1, and detailed explanations will be omitted.
[0082] Figure 8(a) is a plan view showing a part of the liquid discharge substrate 2 of Example 4. Figure 8(b) is a cross-sectional view along line AA in Figure 8(a). Figure 8 shows a part of the four nozzle rows N1, N2, N3, and N4.
[0083] In contrast to Example 3, in Example 4, the damper mechanism 301 is not located in the common supply channel 13a, but only in the common discharge channel 13b. The size of the damper mechanism 301 in the Y direction (direction of nozzle row arrangement) is larger than in Example 3. Therefore, a larger amplitude of the damper member 300 can be obtained. The common discharge channel 13b communicates with the individual discharge channel 12b via the individual discharge opening 120b, and the damper mechanism 301 is positioned to face the individual discharge opening 120b in the direction intersecting the discharge surface (Z direction).
[0084] The flow resistance of the individual supply channel 12a and the individual discharge channel 12b are designed to be equal, and a pressure difference is created such that the pressure in the discharge connection channel 15b is lower than that in the supply connection channel 15a. This creates a circulating flow of liquid 14 from the supply connection channel 15a to the discharge connection channel 15b via the individual supply channel 12a, the pressure chamber 11, and the individual discharge channel 12b. In this case, pressure fluctuations caused by discharge are more easily propagated to the individual discharge channel 12b, which has a relatively lower pressure, than to the individual supply channel 12a, which has a relatively higher pressure. Therefore, in a configuration where the damper mechanism 301 is provided in either the common supply channel 13a or the common discharge channel 13b, placing it in the common discharge channel 13b yields a greater effect in suppressing crosstalk. When a damper mechanism 301 is placed in the outlet channel 13b, the flow resistance of the individual discharge channel 12b may be designed to be smaller than that of the individual supply channel 12a, so that pressure fluctuations due to discharge are more easily propagated towards the common discharge channel 13b.
[0085] The common supply channel 13a has multiple supply external openings 20a arranged along the X direction for supplying liquid from the outside. The common discharge channel 13b has multiple discharge external openings 20b arranged along the X direction for discharging liquid to the outside.
[0086] In Embodiment 4, a partition wall is provided in the common flow path where the damper mechanism 301 is located. In Embodiment 4, since the damper mechanism 301 is located in the common discharge flow path 13b, a partition wall 16 is provided in the common discharge flow path 13b. Specifically, a partition wall 16 is formed in the common discharge flow path 13b, positioned between adjacent individual discharge openings 120b in the X direction (the direction in which the nozzles 3 are arranged, the first direction), and extending in the direction intersecting the discharge surface (the Z direction). In Embodiment 4, as in Embodiment 1, a partition wall 16 is not located between all adjacent individual discharge openings 120b; rather, a partition wall 16 is formed at the position of the external discharge opening 20b in the X direction, and at the position between the external discharge openings 20b in the X direction. Therefore, the distance between multiple partition walls 16 in the X direction (first direction) is narrower than the distance between multiple external discharge openings 20b in the X direction.
[0087] The damper mechanism 301 may also be configured to be placed only in the common supply channel 13a. In that case, a partition wall 16 may be provided in the common supply channel 13a, and the partition wall 16 may be formed at the position of the supply external opening 20a in the X direction and at the position between the supply external openings 20a in the X direction. In this case, the distance between the multiple partition walls 16 in the X direction (first direction) is narrower than the distance between the multiple supply external openings 20a in the X direction. Also, in Embodiment 1, if the connection channel 15 has multiple external openings 20 along the X direction (first direction), the positional relationship between the external openings 20 and the partition wall 16 in the X direction may be the same as in Embodiment 4. That is, the distance between the multiple partition walls 16 in the X direction (first direction) may be narrower than the distance between the multiple external openings 20 in the X direction. Also, the position of the partition wall 16 in the X direction may be at the position of the external openings 20 and at the position between the external openings 20 in the X direction.
[0088] The partition wall 16 extends while bending in the Y direction (second direction), and its wall surface intersects in the X direction (first direction). As a result, at the location where the partition wall 16 is provided, the space of the common discharge channel 13b is partially partitioned in the X direction. Pressure fluctuations propagating in the X direction within the common discharge channel 13b are reflected by the partition wall 16, suppressing the propagation of pressure fluctuations throughout the entire area of the common channel 13 extending in the X direction. As in Embodiment 1, no adhesive layer 19 is formed on the part of the partition wall 16, so that the vibration absorption performance of the damper member 300 is not hindered by the partition wall 16.
[0089] One end of the partition wall 16 in the Y direction is in contact with one side wall of the common discharge channel 13b along the X direction (first direction), while the other end is away from the other side wall of the common discharge channel 13b along the X direction (first direction). In terms of positional relationship along the discharge surface (XY plane), the partition wall 16 and the discharge connection channel 15b do not overlap. This prevents the partition wall 16 from becoming an excessive rate-limiting factor for the liquid flow in the common discharge channel 13b.
[0090] In Example 4, similar to Example 1, a common supply channel 13a, a common discharge channel 13b, and a partition wall 16 are formed on the liquid supply substrate 203. A supply connection channel 15a, a discharge connection channel 15b, and a damper mechanism 301 extending along the first direction (X direction) are formed on the channel forming substrate 204. The channel forming substrate 204 is fixed to the liquid supply substrate 203 via an adhesive layer 19. The adhesive layer 19 is not formed in the regions corresponding to the common supply channel 13a and the common discharge channel 13b, and the liquid in the common discharge channel 13b is in contact with the damper member 300. The common channels 13a, 13b, and the damper mechanism 301 serve as a common channel substrate constituting the side walls and partition wall 16 of the common channel. The common flow channel substrate is formed by fixing a liquid supply substrate 203 and a flow channel forming substrate 204, which includes a damper mechanism 301, via an adhesive layer 19. The adhesive layer 19 is not formed between the portion of the liquid supply substrate 203 that constitutes the partition wall 16 and the flow channel forming substrate 204, so that the partition wall 16 does not come into contact with the damper member 300. Furthermore, the adhesive layer 19 is not formed between the portion of the liquid supply substrate 203 that forms the side wall 130 separating the common supply channel 13a and the common discharge channel 13b and the flow channel forming substrate 204, so that the common supply channel 13a and the common discharge channel 13b are in communication.
[0091] The advantage of not forming the adhesive layer 19 in the portion of the side wall 130 separating the common supply channel 13a and the common discharge channel 13b is that the width of the damper mechanism 301 in the Y direction can be secured. In other words, in order to form the adhesive layer 19 in a portion with a small width in the Y direction, such as the side wall 130 separating the common supply channel 13a and the common discharge channel 13b, the width of the side wall 130 in the Y direction needs to be made larger than a certain size, depending on the precision of the formation of the adhesive layer 19. If the width of the side wall 130 in the Y direction is to be secured, the width of the damper mechanism 301 in the Y direction must be reduced accordingly, which reduces the vibration absorption performance of the damper mechanism 301. By not forming the adhesive layer 19 in the portion of the side wall 130, the width of the damper mechanism 301 in the Y direction can be secured, and the vibration absorption performance can be secured.
[0092] If the adhesive layer 19 is not formed on the side wall 130, a connecting passage 131 equal to the thickness of the adhesive layer 19 will be formed between the common supply passage 13a and the common discharge passage 13b on the side wall 130. Since the flow resistance of this connecting passage 131 is sufficiently large, a sufficient circulation flow velocity of the liquid 14 can be obtained even in the presence of the connecting passage 131 by providing a predetermined differential pressure between the supply connection passage 15a and the discharge connection passage 15b. Therefore, the thickening of the liquid 14 due to volatilization of the liquid 14 can be suppressed in the nozzle 3.
[0093] In addition, in the side wall 132, which is the widest side wall in the Y direction among the side walls separating the common supply channel 13a and the common discharge channel 13b, an adhesive layer 19 may be formed, as in the other embodiments.
[0094] In Example 4, the damper member 300 is divided into multiple parts 301a, 301b, and 301c in the X direction. This is because the width (size in the Y direction) of the damper mechanism 301 is sufficiently large, and a sufficient vibration absorption effect can be obtained even when divided in the X direction. By dividing the damper member 300 in the longitudinal direction (X direction) of the space of the common discharge channel 13b, it is possible to suppress excessive vibration of the damper member 300 that is long in the X direction. This makes it possible to reduce crosstalk propagating in the longitudinal direction (X direction) of the space of the common discharge channel 13b.
[0095] With the above configuration, pressure fluctuations in the pressure chamber 11 generated by the discharge of liquid 14 driven by the piezoelectric element 18 can be suppressed by the synergistic effect of the damper mechanism 301 and the partition wall 16 in the common discharge channel 13b. Therefore, the propagation of pressure fluctuations to the connected pressure chambers 11 is suppressed, and fluctuations in the discharge characteristics of the liquid discharged from each nozzle 3 can be reduced, thereby reducing color unevenness in the printed image on the recording medium. [Explanation of symbols]
[0096] 1: Liquid discharge head module, 3: Nozzle, 11: Pressure chamber, 12: Individual flow path, 120: Individual opening, 13: Common flow path, 16: Partition wall, 18: Piezoelectric element, 30: Discharge surface, 301: Damper mechanism
Claims
1. A liquid ejection head that ejects liquid from an ejection surface, comprising: a plurality of nozzles arranged along a first direction of the ejection surface; a plurality of pressure chambers provided in communication with each of the plurality of nozzles and having an actuator for applying pressure to the liquid to eject the liquid from the nozzles; a plurality of individual flow paths in communication with each of the plurality of pressure chambers; a common flow path extending in the first direction and in communication with each of the plurality of individual flow paths via an individual opening; a damper mechanism disposed at a position in contact with the common flow path and facing the individual opening for absorbing pressure fluctuations of the liquid in the common flow path; and a partition wall is provided in the common flow path, the partition wall being disposed between the individual openings adjacent to each other in the first direction and extending in a direction intersecting the ejection surface. The liquid ejection head is characterized by this.
2. The liquid ejection head according to claim 1, wherein a plurality of the partition walls are arranged along the first direction.
3. The liquid ejection head according to claim 1 or 2, wherein the partition wall does not contact the damper mechanism.
4. The liquid ejection head according to any one of claims 1 to 3, wherein in a second direction along the ejection surface and intersecting the first direction, the length of the partition wall is longer than the length of the individual opening.
5. The liquid ejection head according to any one of claims 1 to 4, wherein in a direction intersecting the ejection surface, the common flow path, the damper mechanism, and the nozzles are arranged on the side opposite to the pressure chamber.
6. The liquid ejection head according to any one of claims 1 to 4, wherein in a direction intersecting the ejection surface, the common flow path, the damper mechanism, and the nozzles are arranged on the same side as the pressure chamber.
7. The common flow path and the damper mechanism are formed by fixing a common flow path substrate constituting the side wall of the common flow path and the partition wall and a damper substrate including the damper mechanism via an adhesive layer, and the adhesive layer is not provided between a portion of the common flow path substrate that constitutes the partition wall and the damper substrate. The liquid ejection head according to any one of claims 1 to 6 is characterized by this.
8. The liquid ejection head according to any one of claims 1 to 7, wherein the partition wall is disposed away from a side wall of the common flow path along the first direction.
9. The damper mechanism has a damper chamber extending along the first direction, and a flexible member provided such that one surface contacts the liquid in the common flow path and the other surface contacts the gas in the damper chamber. The liquid ejection head according to any one of claims 1 to 8.
10. The common flow path is provided with a plurality of external openings arranged along the first direction and communicating with the outside. The interval in the first direction between the plurality of partition walls arranged along the first direction is narrower than the interval in the first direction between the plurality of external openings. The liquid ejection head according to any one of claims 1 to 9.
11. The individual flow path has an individual supply flow path for supplying liquid to the pressure chamber and an individual discharge flow path for discharging liquid from the pressure chamber. The common flow path has a common supply flow path communicating with the plurality of individual supply flow paths through individual supply openings and a common discharge flow path communicating with the plurality of individual discharge flow paths through individual discharge openings. The damper mechanism is disposed opposite to at least one of the common supply flow path and the common discharge flow path in a direction intersecting the ejection surface. The partition wall is provided at least in the common flow path facing the damper mechanism. The liquid ejection head according to any one of claims 1 to 10.
12. The common supply flow path, the common discharge flow path, and the damper mechanism are formed by fixing a common flow path substrate constituting side walls of the common supply flow path and the common discharge flow path and the partition wall and a damper substrate including the damper mechanism via an adhesive layer. No adhesive layer is provided between a portion of the common flow path substrate that constitutes a side wall separating the common supply flow path and the common discharge flow path and the damper mechanism. The liquid ejection head according to claim 11.
13. The common supply flow path is provided with a plurality of supply external openings arranged along the first direction and supplied with liquid from the outside. The common discharge flow path is provided with a plurality of discharge external openings arranged along the first direction and discharging liquid to the outside. The interval in the first direction between the plurality of partition walls arranged along the first direction is narrower than the interval in the first direction between the plurality of supply external openings or narrower than the interval in the first direction between the plurality of discharge external openings. The liquid ejection head according to claim 11 or 12.
14. A liquid ejection head that ejects liquid from an ejection surface, A plurality of nozzles arranged along the first direction of the ejection surface, A plurality of pressure chambers provided with actuators that communicate with each of the plurality of nozzles and apply pressure to the liquid to discharge the liquid from the nozzles; A plurality of individual flow paths that communicate with each of the plurality of pressure chambers; A common flow path extending in the first direction that communicates with each of the plurality of individual flow paths via individual openings; A damper mechanism that is disposed at a position in contact with the common flow path and opposite to the individual opening to absorb pressure fluctuations of the liquid in the common flow path; Comprising; The common flow path is provided with a partition wall that partially blocks the flow of the liquid along the first direction, and the liquid discharge head is characterized by this.