Liquid crystal device and electronic apparatus

Abstract

To separate a flexible substrate for supplying power to a heating member from another flexible substrate.SOLUTION: A liquid crystal device comprises: an element substrate 30; a terminal 320 provided on the element substrate 30; an FPC substrate 61 electrically connected to the terminal 320; a counter substrate 20 arranged overlapping on the element substrate 30; a heater 230 including connections 231b, 231c provided on the counter substrate 20; FPC substrates 62b, 62c electrically connected to the connections 231b, 231c; and a liquid crystal 50 held between the element substrate 30 and the counter substrate 20. In plan view, the terminal 320 is provided outside one side of a rectangular area where the element substrate 30 and the counter substrate 20 overlap each other. The connections 62b, 62c are provided outside sides other than the side of the rectangular area.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] The present invention relates to a liquid crystal device and an electronic device. [Background technology]

[0002] In a liquid crystal panel, the optical response decreases when the temperature of the liquid crystal is low. For this reason, a liquid crystal panel is known that has a built-in heater and uses heat from the heater to increase the temperature of the liquid crystal, thereby improving the optical response (see, for example, Patent Document 1). Specifically, in the liquid crystal panel described in Patent Document 1, the heater is arranged so as to overlap the driving region in a planar manner. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2007-199339 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the technology described in Patent Document 1, the FPC board that supplies the control signal to the driving area is configured to supply power to the heater. Since a current larger than that of the control signal flows through the heater, there is an issue that noise is easily superimposed on the control signal. In consideration of these circumstances, one aspect of the present disclosure is to provide a technology that suppresses noise superimposition on a control signal in a configuration in which a voltage is applied to a heater to cause a current to flow. [Means for solving the problem]

[0005] In order to solve the above problem, a liquid crystal device according to one embodiment of the present disclosure has a first substrate, a first connection portion provided on the first substrate, a first flexible substrate electrically connected to the first connection portion, a second substrate arranged to overlap the first substrate, a second connection portion provided on the second substrate, a heating member provided on the second substrate, a second flexible substrate electrically connected to the heating member via the second connection portion, and a liquid crystal layer sandwiched between the first substrate and the second substrate, wherein the first connection portion is provided outside one side of a rectangular region overlapping the first substrate and the second substrate in a planar view, and the second connection portion is provided outside the sides other than the one side of the rectangular region. [Brief description of the drawings]

[0006] [Figure 1] FIG. 1 is a diagram showing an optical configuration of a projection type display device to which an electro-optical device according to a first embodiment is applied. [Diagram 2] FIG. 2 is a block diagram showing an electrical configuration of a drive system in a projection display device. [Diagram 3] FIG. 1 is a diagram showing a configuration for controlling a heater in a projection display device. [Figure 4] FIG. 1 is a perspective view showing an electro-optical device. [Diagram 5] FIG. 1 is a cross-sectional view showing a structure of an electro-optical device. [Figure 6] FIG. 2 is a block diagram showing an electrical configuration of the electro-optical device. [Figure 7] FIG. 2 is a diagram illustrating a configuration of a pixel circuit in an electro-optical device. [Figure 8] FIG. 2 is a plan view showing a counter substrate of the electro-optical device. [Figure 9] FIG. 2 is a plan view showing an element substrate of the electro-optical device. [Figure 10] 1A and 1B are diagrams illustrating a connection state between an FPC board and an element board. [Figure 11] 13A and 13B are diagrams showing a first modified example of an FPC board connectable to a counter board. [Figure 12] 13A and 13B are diagrams showing a second modified example of the FPC board connectable to the counter board. [Figure 13] 13 is a diagram showing a connection state between an FPC board and a counter board according to a second modified example. FIG. [Figure 14] FIG. 11 is a perspective view showing an electro-optical device according to a second embodiment. [Figure 15] FIG. 2 is a plan view illustrating a counter substrate in the electro-optical device. [Figure 16] 13 is a plan view showing a modified example of the opposing substrate in the electro-optical device. FIG. [Figure 17] FIG. 11 is a perspective view showing an electro-optical device according to a third embodiment. [Figure 18] FIG. 2 is a plan view showing a dust-proof glass in the electro-optical device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0007] Hereinafter, electro-optical devices according to embodiments will be described with reference to the drawings. In each drawing, the dimensions and scale of each part are appropriately different from the actual ones. In addition, the embodiments described below are preferred specific examples, and therefore various technically preferable limitations are attached, but the scope of the present disclosure is not limited to these forms unless otherwise specified in the following description to the effect that the present disclosure is limited.

[0008] First Embodiment FIG. 1 is a diagram showing an optical configuration of a projection display device 100 to which an electro-optical device according to a first embodiment is applied. As shown in the figure, the projection display device 100 includes electro-optical devices 10R, 10G, and 10B. The projection display device 100 is also provided with a lamp unit 2102 consisting of a white light source such as a halogen lamp. Projection light emitted from the lamp unit 2102 is separated into three primary colors, red (R), green (G), and blue (B), by three mirrors 2106 and two dichroic mirrors 2108. Of these, the R light enters the electro-optical device 10R, the G light enters the electro-optical device 10G, and the B light enters the electro-optical device 10B. Since the optical path of B is longer than the optical paths of R and G, it is necessary to prevent loss in the optical path of B. For this reason, a relay lens system 2121 consisting of an entrance lens 2122, a relay lens 2123, and an exit lens 2124 is provided in the optical path of B.

[0009] In the embodiment, the electro-optical device 10R is a liquid crystal panel having a plurality of pixel circuits. Each of the plurality of pixel circuits includes a liquid crystal element. The liquid crystal element of the electro-optical device 10R is driven based on a data signal corresponding to R as described later, and has a transmittance according to the effective value of the voltage of the data signal. Therefore, in the electro-optical device 10R, the transmittance of the liquid crystal element is individually controlled to generate an R transmission image. Similarly, in the electro-optical device 10G, a G transmission image is generated based on a data signal corresponding to G, and in the electro-optical device 10B, a B transmission image is generated based on a data signal corresponding to B.

[0010] The transmitted images of each color generated by the electro-optical devices 10R, 10G, and 10B are incident on the dichroic prism 2112 from three directions. In the dichroic prism 2112, the R and B light are refracted at 90 degrees, while the G light travels straight. Therefore, the dichroic prism 2112 combines the images of each color. The combined image by the dichroic prism 2112 is incident on the projection lens 2114. The projection lens 2114 enlarges and projects the combined image produced by the dichroic prism 2112 onto a screen Scr.

[0011] The transmission images by the electro-optical devices 10R and 10B are emitted after being reflected by the dichroic prism 2112, whereas the transmission image by the electro-optical device 10G travels straight and is emitted. Therefore, the transmission images by the electro-optical devices 10R and 10B are in a left-right inverted relationship with the transmission image by the electro-optical device 10G.

[0012] 2 is a block diagram showing a configuration for controlling display, which is one of the electrical configurations of the projection display device 100. As shown in the figure, the projection display device 100 includes the above-mentioned electro-optical devices 10R, 10G, and 10B, and a display control circuit 15.

[0013] Video data Vid-in is supplied from a host device (not shown) or other higher-level device in synchronization with a synchronization signal Sync to the display control circuit 15. The video data Vid-in specifies the gradation level of pixels in an image to be displayed, for example, by 8 bits for each of RGB.

[0014] In the projection display device 100, a color image projected on the screen Scr is expressed by synthesizing the transmitted images of the electro-optical devices 10R, 10G, and 10B as described above. Therefore, a pixel, which is the smallest unit of a color image, can be divided into a red subpixel of the electro-optical device 10R, a green subpixel of the electro-optical device 10G, and a blue subpixel of the electro-optical device 10B. However, when it is not necessary to specify the color of the subpixels in the electro-optical devices 10R, 10G, and 10B, or when only brightness is an issue, there is no need to refer to them as subpixels. Therefore, in this description, the display unit in the electro-optical devices 10R, 10G, and 10B will be simply referred to as a pixel.

[0015] The synchronization signal Sync includes a vertical synchronization signal that instructs the start of vertical scanning of the video data Vid-in, a horizontal synchronization signal that instructs the start of horizontal scanning, and a clock signal that indicates the timing of one video pixel in the video data Vid-in.

[0016] The display control circuit 15 separates the video data Vid-in from the higher-level device into R, G, and B components, converts them into analog voltage data signals, and supplies them to the electro-optical devices 10R, 10G, and 10B. Specifically, the display control circuit 15 converts the R component of the video data Vid-in into analog and supplies it to the electro-optical device 10R via the FPC (Flexible Printed Circuits) board 61 as a data signal Vid-R. Similarly, the display control circuit 15 converts the G component of the video data Vid-in into analog and supplies it to the electro-optical device 10G via the FPC board 61 as a data signal Vid-G, and converts the B component into analog and supplies it to the electro-optical device 10B via the FPC board 61 as a data signal Vid-B. The display control circuit 15 supplies the data signals Vid_R, Vid_G, and Vid_B via the FPC board 61 in synchronization with a control signal Ctr for controlling the driving of the electro-optical devices 10R, 10G, and 10B in that order.

[0017] Next, the electro-optical devices 10R, 10G, and 10B will be described. The electro-optical devices 10R, 10G, and 10B have a common structure and differ only in the color, i.e., wavelength, of the light incident thereon. Therefore, the electro-optical devices 10R, 10G, and 10B will be generally described with the reference numeral 10, without specifying the color.

[0018] 3 is a block diagram showing a configuration for controlling heating of the electro-optical device 10. The electro-optical device 10 is provided with a heater 230 and a temperature sensor 17. The heater 230 is an example of a heating member. The temperature control circuit 16 applies a voltage to the heater 230 via the FPC boards 62a and 62b. The temperature sensor 17 detects the temperature of the electro-optical device 10 and outputs information Temp indicating the temperature as a detected value. The information Temp is supplied to the temperature control circuit 16 via an FPC board, for example, an FPC board 61, which is separate from the FPC boards 62a and 62b.

[0019] The temperature control circuit 16 controls the voltage applied to the heater 230 so that the temperature indicated by the information Temp becomes the target temperature. Specifically, if the temperature indicated by the information Temp is lower than the target temperature, the temperature control circuit 16 increases the voltage applied to the heater 230. The target temperature is a temperature suitable for use of the electro-optical device 10, and is set in advance in the temperature control circuit 16. Fluctuations in the voltage applied to the heater 230 can be a source of noise. For this reason, the temperature control circuit 16 controls the voltage applied to the heater 230 to a constant voltage, and switches the constant voltage stepwise, for example, every minute, according to the temperature indicated by the information Temp.

[0020] Fig. 4 is a perspective view showing the appearance of the electro-optical device 10, and Fig. 5 is a cross-sectional view taken along line Hh in Fig. 4. Note that line Hh is a virtual line cutting the electro-optical device 10 along the X-axis so as to include the area where the counter substrate 20 and the element substrate 30 overlap. As shown in Figure 5, in the electro-optical device 10, an opposing substrate 20 having a common electrode 22 and an element substrate 30 having a pixel electrode 32 are bonded together by a sealing material 40 so that their electrode forming surfaces face each other while maintaining a certain gap, and liquid crystal 50 is filled into this gap. The element substrate 30 is an example of a first substrate, the counter substrate 20 is an example of a second substrate, and the liquid crystal 50 is an example of an electro-optical layer.

[0021] 4, in this embodiment, the opposing substrate 20 and the element substrate 30 have the same length along the X-axis, but are attached to each other with a misalignment along the Y-axis. Therefore, the opposing substrate 20 has a protruding portion 210 protruding from the element substrate 30, and the element substrate 30 has a protruding portion 310 protruding from the opposing substrate 20.

[0022] The Y-axis refers to an axis that has no fixed orientation in the direction in which the data lines extend in the electro-optical device 10, and is aligned along the long side of a display area described below. The X-axis refers to an axis that intersects with the Y-axis in a plan view, and has no fixed orientation in the direction in which the scanning lines extend in the electro-optical device 10. The X-axis corresponds to a short side of the display area. In this description, a plan view refers to viewing the substrate in a direction perpendicular to the substrate surface, i.e., in the thickness direction of the substrate, and a cross-sectional view refers to viewing the substrate by cutting the substrate in a direction perpendicular to the substrate surface.

[0023] The counter substrate 20 and the element substrate 30 are each made of a light-transmitting and insulating base material such as glass or quartz. As described below, a plurality of terminals are provided on the protruding portion 310, and each of the terminals is connected to one end of a plurality of wirings provided on an FPC (Flexible Printed Circuits) substrate 61. The FPC substrate 61 is an example of a first flexible substrate. The other ends of the multiple terminals provided on the FPC board 61 are connected to the display control circuit 15 and the temperature control circuit 16. As a result, the above-mentioned data signal and control signal are supplied from the display control circuit 15 to the electro-optical device 10, and information indicating temperature, Temp, is supplied from the electro-optical device 10 to the temperature control circuit 16.

[0024] The protruding portion 210 is provided with two terminals connected to the heater 230, and one end of the wiring provided on the FPC boards 62a, 62b is connected to each of them. The other ends of the wiring provided on the FPC boards 62a, 62b are connected to the temperature control circuit 16. As a result, a voltage controlled by the temperature control circuit 16 is applied to the heater 230 via the FPC boards 62a, 62b. The FPC boards 62a and 62b are an example of a second flexible board.

[0025] Each of the FPC boards 62a and 62b is configured to be bent by 90 degrees twice. The reason for this is that the temperature control circuit 16 is provided on the same side as the display control circuit 15 with respect to the electro-optical device 10. In the electro-optical device 10 , light from the lamp unit 2102 enters the counter substrate 20 and exits from the element substrate 30 .

[0026] For convenience, a description will now be given of the electrical configuration of the electro-optical device 10. FIG. On the element substrate 30 of the electro-optical device 10, a scanning line driving circuit 360 and a data line driving circuit 370 are provided on the periphery of the display area 5.

[0027] In detail, a plurality of scanning lines 36 are provided extending along the X-axis on the element substrate 30. A plurality of data lines 37 are provided extending along the Y-axis and electrically insulated from the scanning lines 36. Pixel circuits 38 are provided in a matrix shape corresponding to the intersections of the scanning lines 36 and the data lines 37.

[0028] If the number of scanning lines 36 is m and the number of data lines 37 is n, pixel circuits 38 are arranged in a matrix of m rows and n columns. Both m and n are integers of 2 or more. In order to distinguish the rows of the matrix in the scanning lines 36 and pixel circuits 38, they may be referred to as 1, 2, 3, ..., (m-1), m rows from the top in the figure. Similarly, in order to distinguish the columns of the matrix in the data lines 37 and pixel circuits 38, they may be referred to as 1, 2, 3, ..., (n-1), n ​​columns from the left in the figure.

[0029] The scanning line driving circuit 360 selects the scanning lines 36 one by one in the order of, for example, the 1st, 2nd, 3rd, ..., mth rows in accordance with a control signal Ctr from the display control circuit 15, and sets the scanning signal to the selected scanning line 36 to H level. Note that the scanning line driving circuit 360 sets the scanning signals to the scanning lines 36 other than the selected scanning line 36 to L level. The data line driving circuit 370 latches the data signal supplied from the display control circuit 15 for one row, and outputs it via the data line 37 to the pixel circuit 38 located on that scanning line 36 during the period when the scanning signal to that scanning line 36 is at H level.

[0030] A plurality of terminals 320 are provided along the X-axis on the protruding portion 310. The plurality of terminals 320 are terminals for supplying a control signal Ctr to the scanning line driving circuit 360, terminals for supplying data signals and the like to the data line driving circuit 370, and further terminals for supplying information Temp from the temperature sensor 17 to the temperature control circuit 16. The plurality of terminals 320 are an example of a first connection portion.

[0031] Fig. 7 is a diagram showing an equivalent circuit of a pixel circuit 38. Note that Fig. 7 shows an equivalent circuit for a total of four pixel circuits 38, two vertically and two horizontally, corresponding to the intersections of two adjacent scanning lines 36 and two adjacent data lines 37. The pixel circuits 38 have the same circuit configuration.

[0032] The pixel circuit 38 includes a transistor 382, ​​a liquid crystal element 384, and a storage capacitor 386. The transistor 382 is, for example, an n-channel thin film transistor. In the pixel circuit 38, a gate electrode of the transistor 382 is electrically connected to the scanning line 36. In addition, a source region of the transistor 382 is electrically connected to the data line 37, and a drain region of the transistor 382 is electrically connected to the pixel electrode 32 and one end of the storage capacitor 386.

[0033] In transistor 382, ​​when the direction of current flow is reversed, the source region and the drain region are swapped. In this description, the region electrically connected to data line 37 is referred to as the source region, and the region electrically connected to pixel electrode 32 is referred to as the drain region. In addition, in this description, "electrically connected" or simply "connected" means a direct or indirect connection or coupling between two or more elements, and includes, for example, a case in which different wirings are connected via contact holes even if two or more elements are not directly connected to each other on an element substrate.

[0034] A common electrode 22 is provided for all pixels so as to face the pixel electrode 32. A constant voltage LCcom is applied to the common electrode 22 over time. As described above, liquid crystal 50 is sandwiched between the pixel electrode 32 and the common electrode 22. Therefore, for each pixel circuit 38, a liquid crystal element 384 is formed in which liquid crystal 50 is sandwiched between the pixel electrode 32 and the common electrode 22. In addition, a storage capacitor 386 is provided electrically in parallel with the liquid crystal element 384. One end of the storage capacitor 386 is electrically connected to the pixel electrode 32, and the other end is electrically connected to a capacitance line 39. A constant voltage over time, for example, a voltage LCcom that is the same as the voltage applied to the common electrode 22, is applied to the capacitance line 39.

[0035] When the scanning signal of a scanning line 36 becomes H level, the transistor 382 of the pixel circuit 38 provided corresponding to that scanning line 36 is turned on. When the transistor 382 is turned on, the data line 37 and the pixel electrode 32 are electrically connected, so that the data signal supplied to the data line 37 reaches the pixel electrode 32 and one end of the storage capacitor 386 via the transistor 382 in the on state. When the scanning line 36 becomes L level, the transistor 382 is turned off, but the voltage of the data signal that has reached the pixel electrode 32 is held by the liquid crystal element 384 and the storage capacitor 386.

[0036] As is well known, in the liquid crystal element 384, the orientation of the liquid crystal molecules changes in response to the electric field generated by the pixel electrode 32 and the common electrode 22. Therefore, the liquid crystal element 384 has a transmittance that corresponds to the effective value of the applied voltage. If the liquid crystal element 384 is in a normally black mode, the transmittance increases as the voltage applied to the liquid crystal element 384 increases.

[0037] The operation of supplying data signals to the pixel electrodes 32 of the liquid crystal elements 384 is executed in the order of the 1st, 2nd, 3rd, ..., mth rows in one vertical scanning period. As a result, a voltage corresponding to the data signal is held in each of the liquid crystal elements 384 of the pixel circuits 38 arranged in m rows and n columns, each liquid crystal element 384 has a target transmittance, and a transmitted image of the corresponding color is generated by the liquid crystal elements 384 arranged in m rows and n columns. In this way, the generation of a transmission image is executed for each of RGB, and a color image obtained by combining RGB is projected onto the screen Scr.

[0038] In the electro-optical device 10, the region where a transmission image is generated is a region where the pixel electrodes 32 arranged in a matrix form and the common electrode 22 overlap in a planar view. Therefore, the display region 5 is a region where the pixel electrodes 32 arranged in a matrix form and the common electrode 22 overlap in a planar view.

[0039] The projection display device 100 may be used not only indoors but also outdoors. The optical response of the liquid crystal element 384, specifically, the change characteristic of the transmittance with respect to the change in voltage applied to the liquid crystal element 384, decreases as the temperature decreases. For this reason, in this embodiment, in order to prevent the optical response from decreasing even when the outside temperature decreases, a heater 230 is provided to heat the liquid crystal element 384, particularly the liquid crystal 50.

[0040] If the liquid crystal 50 in the display area 5 is heated non-uniformly by the heater 230, the optical response will be biased in the display area 5, and the display quality of moving images in particular will be degraded. Therefore, in this embodiment, the heater 230 is configured to be provided on the counter substrate 20 at a position that is on the outer periphery of the display area 5 in a plan view and overlaps with the frame (partition).

[0041] 8 and 9 are plan views of the electro-optical device 10, with Fig. 8 being a plan view mainly showing the counter substrate 20 and Fig. 9 being a plan view showing the element substrate 30. Note that, for the sake of explanation, Fig. 8 is a view of the electro-optical device 10 with the counter substrate 20 separated from the element substrate 30 and viewed from the direction in which light from the lamp unit 2102 is incident. In this way, the fact that the element substrate 30 is separated from the electro-optical device 10 and the counter substrate 20 on which the heater 230 is provided is viewed from the direction in which light is incident is the same as in Figs. 10, 11, 15, and 16 described below. For the sake of explanation, FIG. 9 is a diagram of the element substrate 30 of the electro-optical device 10, viewed from the light incidence direction with the opposing substrate 20 separated.

[0042] The sealant 40 is provided in a frame shape along the inner periphery of a rectangular region where the counter substrate 20 and the element substrate 30 overlap in a plan view. 8 and 9, the four corners of a rectangular area where the counter substrate 20 and the element substrate 30 overlap in a plan view are A, B, C, and D, respectively. In other words, the outline of the rectangular area is formed by four sides AB, BC, CD, and DA. In the counter substrate 20, the protruding portion 210 is provided outside the side DA as shown by the solid line in Fig. 8 (dashed line in Fig. 9), and in the element substrate 30, the protruding portion 210 is provided outside the side BC as shown by the dashed line in Fig. 8 (dashed line in Fig. 9).

[0043] The light-shielding film 241 is provided in a frame shape inside the sealing material 40 in a plan view. The light-shielding film 241 is a frame that defines the outer periphery of the display area 5 and has light-shielding properties. The scanning line driving circuits 360 are provided so as to be hidden in two regions along the Y axis in the frame-shaped light-shielding film 241. In addition, the data line driving circuit 370 is provided so as to be hidden in the region along the side BA of the two regions along the X axis in the light-shielding film 241.

[0044] By hiding the scanning line driving circuit 360 and the data line driving circuit 370 behind the light-shielding film 241, light incident from the opposing substrate 20 toward the element substrate 30 is prevented from penetrating into the transistors that constitute the scanning line driving circuit 360 and the data line driving circuit 370. This prevents malfunction of the scanning line driving circuit 360 and the data line driving circuit 370 due to optical leakage.

[0045] Furthermore, when an ultraviolet-curable resin is used as the sealant 40, the light-shielding film 241 is provided so as not to overlap with the sealant 40 in a planar view. This is to prevent the curing of the sealant 40 from being hindered by the light-shielding film 241 when the opposing substrate 20 and the element substrate 30 are bonded together after the sealant 40 is applied and ultraviolet light is irradiated in a direction from the opposing substrate 20 to the element substrate 30 in order to cure the sealant 40.

[0046] As shown in FIG. 8, the heater 230 is integrated with a frame portion 231a that is located between the display area 5 and the sealing material 40 in a planar view and overlaps with a light-shielding film 241, and connection portions 231b and 231c for applying a voltage to the frame portion 231a. In detail, the frame portion 231a is provided with a slit S1, and is electrically divided into one end and the other end. One end is extended to the overhang portion 210 to become the connection portion 231b, and the other end is extended to the overhang portion 210 to become the connection portion 231c. In other words, the portion of the heater 230 excluding the connection portions 231b and 231c constitutes the frame portion 231a. The frame portion 231a is provided so as to overlap the light-shielding film 241 in a plan view and to have a width narrower than that of the light-shielding film 241. The width of the frame 231a or the light-shielding film 241 refers to the dimension in a direction perpendicular to the extending direction of the frame 231a or the light-shielding film 241 in a plan view. The connection portions 231b and 231c are an example of a second connection portion.

[0047] The heater 230 is a wiring film formed by patterning a conductive layer of, for example, aluminum (Al), titanium nitride (TiN), or tungsten silicide (WSi), and electrically has one end and the other end, generating heat when a current flows from one end to the other. In this description, the term "layer" refers to a conductive layer or wiring layer that is not patterned, and the term "film" refers to a conductive layer or wiring layer that is patterned.

[0048] As shown in FIG. 9, a plurality of terminals 320 are provided on the protruding portion 310 of the element substrate 30 along the X-axis. Fig. 10 is a plan view showing a connection state between the multiple terminals 320 in the protruding portion 310 and the FPC board 61. As shown in Fig. 10, the multiple terminals 320 are electrically connected, for example, one-to-one to the multiple wirings 610 provided on the FPC board 61. For this electrical connection, an anisotropic adhesive or an isotropic conductive film is used. The multiple wirings 610 on the FPC board 61 also serve as connection terminals to the multiple terminals 320, each having a width W1, and arranged at equal intervals from each other.

[0049] According to the first embodiment, the light-shielding film 241 that shields the scanning line driving circuit 360 and the data line driving circuit 370 from light is provided in a frame shape outside the display area 5 in a plan view and inside the sealing material 40. Therefore, even if an ultraviolet-curable resin is used as the sealing material 40, the light-shielding film 241 does not overlap with the sealing material 40 in a plan view, and therefore the light-shielding film 241 does not prevent the sealing material 40 from being cured by irradiation with ultraviolet rays. Therefore, it is possible to suppress the occurrence of defects in bonding between the counter substrate 20 and the element substrate 30. A frame portion 231a of the heater 230 overlaps with the light-shielding film 241 in a plan view, and has a shape narrower than the width of the light-shielding film 241. Heat generated by the frame portion 231a is generated almost evenly outside the display area 5, so that uneven heat generation is unlikely to occur in the display area 5. Furthermore, according to the first embodiment, the FPC board 61 that supplies the control signal and the FPC boards 62a, 62b that apply voltage to the heater 230 to supply power are separated, so that the effect of noise generated when switching the constant voltage on the control signal can be suppressed.

[0050] There is no need to separate the FPC boards 62a, 62b into two for applying a voltage to the heater 230. Next, a first modified example and a second modified example in which the FPC boards 62a, 62b are combined into one will be described.

[0051] 11 is a diagram showing an FPC board 62c according to a first modified example by a dashed line. The FPC board 62c has at least two wires. One end of the FPC board 62c is bifurcated, and one of the bifurcations includes one wire that is electrically connected to the connection portion 231b. The other end of the bifurcations includes another wire that is electrically connected to the connection portion 231c. At the other end of the FPC board 62c, the two wires are electrically connected to the temperature control circuit 16, and the temperature control circuit 16 applies to the heater 230 a voltage according to the temperature indicated by the information Temp.

[0052] Fig. 12 is a diagram showing an FPC board 62d according to a second modified example by a dashed line, and Fig. 13 is a plan view showing wiring included in the FPC board 62d. As shown in Fig. 13, the FPC board 62d has, for example, eight wirings 620. The eight wirings 620 also serve as connection terminals to the connection parts 231b, 231c and the temperature control circuit 16, each having a width W2, and arranged at equal intervals from one another. The eight wires 620, except for the connection parts 231b and 231c and the part connected to the temperature control circuit 16, are covered with a coverlay.

[0053] The eight wires 620 are classified into a group 621 to which either positive or negative voltage is applied to the heater 230, a group 622 to which the other of positive and negative voltages is applied, and a group 623 that is not connected to the heater 230. Of the eight wires 620, the three wires located at the left end belong to group 621, the three wires located at the right end belong to group 622, and the two wires located between the three wires 620 belonging to group 621 and the three wires 620 belonging to group 622 belong to group 623.

[0054] The wirings 620 of the FPC board 62d are connected to satisfy the following relationship: three wirings 620 belonging to group 621 are connected to connection portion 231b, and three wirings 620 belonging to group 622 are connected to connection portion 231c. The two wirings 620 belonging to group 623 are not connected to either connection portion 231b or 231c between connection portions 231b and 231c. In this example, the number of wirings 620 on the FPC board 62d is set to "8" as an example, but is not limited to this.

[0055] The width W2 of the wiring 620 on the FPC board 62d is wider than the width W1 of the wiring 610 on the FPC board 61. The reason for this is that the voltage to be applied to the heater 230 is applied to the wiring 620, and therefore a larger current flows through the wiring 620 than through the wiring 610 that supplies various control signals and the like to the electro-optical device 10.

[0056] According to the second modification, the FPC board 62d can be a general-purpose product in which wires having the same width are arranged at equal intervals, rather than a dedicated product, and therefore the cost can be kept low.

[0057] In the first embodiment including the first and second modified examples, the multiple terminals 320 were provided on the protruding portion 210 outside one side of the rectangular area where the opposing substrate 20 and the element substrate 30 overlap in a planar view, and the connection portions 231b and 231c for applying a voltage to the heater 230 were provided on the protruding portion 310 on a side other than the one side of the rectangular area, outside the side opposite to the one side. The connection portion for applying a voltage to the heater 230 is not limited to this. Next, a second embodiment will be described in which the connection portion for applying a voltage to the heater 230 is provided on a side other than the side facing the one side of the rectangular region, specifically, on the outer side of the two sides intersecting with the one side of the rectangular region.

[0058] FIG. 14 is a perspective view showing the appearance of an electro-optical device 10 according to the second embodiment, and FIG. 15 is a plan view mainly showing the counter substrate 20 of the electro-optical device 10. As shown in FIG.

[0059] 4 in that the element substrate 30 is provided with a protruding portion 310, the length of the X-axis of the counter substrate 20 is longer than the length of the X-axis of the element substrate 30. In the second embodiment, as shown in FIG. 14, the counter substrate 20 and the element substrate 30 are aligned at their rear edges and bonded together, but the counter substrate 20 protrudes outward from the element substrate 30 to the outside of the side AB and to the outside of the side CD. Of these, the portion of the counter substrate 20 protruding outward from the element substrate 30 to the outside of the side AB is referred to as a protruding portion 210a, and the portion protruding outward from the side CD is referred to as a protruding portion 210b.

[0060] A connection portion 231b for applying a voltage to the heater 230 is provided on the extension portion 210a, and a connection portion 231c for applying a voltage to the heater 230 is provided on the extension portion 210b. One end of a wire provided on the FPC board 62e is connected to the connection portion 231b, and one end of a wire provided on the FPC board 62f is connected to the connection portion 231c. The other end of the wiring provided on FPC board 62e and the other end of the wiring provided on FPC board 62f are connected to temperature control circuit 16, and temperature control circuit 16 applies a voltage to heater 230 according to the temperature indicated by information Temp.

[0061] In the second embodiment, the sealant 40 is provided in a frame shape inside the periphery of a rectangular region where the counter substrate 20 and the element substrate 30 overlap in a plan view, as in the first embodiment. The light-shielding film 241 is also provided in a frame shape inside the sealant 40 and outside the display region 5, as shown in FIG.

[0062] The heater 230 has a shape as shown in Fig. 15 in plan view. In detail, the heater 230 includes a frame portion 231a and connection portions 231b and 231c. However, unlike the first embodiment, the frame portion 231a is a rectangular frame having no gap of the slit S1. The connection portion 231b is connected to the frame portion 231a via the midpoint of the side AB in a plan view, and the connection portion 231c is connected to the frame portion 231a via the midpoint of the side CD in a plan view.

[0063] According to the second embodiment, similarly to the first embodiment, the frame portion 231a of the heater 230 overlaps the frame-shaped light-shielding film 241 in a plan view, and is provided with a width narrower than that of the light-shielding film 241. Therefore, even if an ultraviolet-curable resin is used as the sealant 40, the light-shielding film 241 does not prevent the sealant 40 from being cured, and heat is generated evenly outside the display area 5 by the frame portion 231a, so that uneven heat generation in the display area 5 can be suppressed. Furthermore, according to the second embodiment, the FPC board 61 that supplies the control signal and the FPC boards 62e, 62f that apply voltage to the heater 230 to supply power are separated, so that the effect of noise generated when switching the constant voltage on the control signal can be suppressed.

[0064] Furthermore, in the second embodiment, the path length of the current flowing from one of the connecting portions 231b or 231c to the other is half that of the first embodiment, making it easier for the current to flow. Therefore, if the voltage applied to the connecting portions 231b and 231c is the same as that of the first embodiment, and if the material of the heater 230 is the same (if the resistivity is the same), the film thickness of the heater 230 in the second embodiment can be reduced to half that of the first embodiment, and the same amount of heat can be obtained as in the first embodiment.

[0065] 16 is a plan view showing the counter substrate 20 of the electro-optical device 10 according to a modified example of the second embodiment. In this modified example, a plurality of openings Slt are provided at two portions where the heater 230 intersects with the sealant 40 in a plan view. When an ultraviolet-curable resin is used as the sealing material 40, if an opening Slt is provided at the portion where the heater 230 intersects with the sealing material 40, ultraviolet light can penetrate into the sealing material 40 through the opening Slt, thereby accelerating the curing of the sealing material 40.

[0066] In the first and second embodiments, the heater 230 is provided on the counter substrate 20, but it may be provided on a substrate separate from the counter substrate 20 and the element substrate 30. Therefore, a third embodiment in which the heater is provided on a separate substrate will be described.

[0067] FIG. 17 is a perspective view showing an electro-optical device 10 according to the third embodiment, and FIG. 18 is a plan view showing the dust-proof glass 70, in particular the shape of the heater. As shown in FIG. 17, in the third embodiment, a dust-proof glass 70 is attached to the counter substrate 20. As shown in FIG. If dust, dirt, or the like adheres to the incident surface of the counter substrate 20, the adhesion is enlarged and projected onto the screen Scr because it is close to the focal point, resulting in a deterioration in display quality. To prevent this, a dustproof glass 70 is attached to the counter substrate 20. Even if dust, dirt, or the like adheres to the dustproof glass 70, the adhesion is farther away from the focal point by the thickness of the glass. Therefore, the adhesion is blurred and enlarged and projected onto the screen Scr, thereby preventing a deterioration in display quality.

[0068] In the third embodiment, the opposing substrate 20, the element substrate 30, and the dust-proof glass 70 have the same length of sides along the X-axis. The length of the side of the opposing substrate 20 along the Y-axis is shorter than the length of the side of the element substrate 30 along the Y-axis. The opposing substrate 20, the element substrate 30, and the dust-proof glass 70 are aligned at the rear side in FIG. 4. The element substrate 30 is provided with a protruding portion 310 that protrudes from the opposing substrate 20. In the third embodiment, the opposing substrate 20 is not provided with a protruding portion 210.

[0069] The length of the side of the counter substrate 20 along the Y axis is shorter than the length of the side of the dust-proof glass 70 along the Y axis. Since the counter substrate 20 and the dust-proof glass 70 are aligned on the front side in FIG. 4, the dust-proof glass 70 protrudes from the counter substrate 20. This protruding portion is referred to as a protruding portion 710.

[0070] On the light incident surface of the dustproof glass 70, which is the protrusion 710 in a plan view, i.e., on the same side as the protrusion 310, two terminals connected to the heater are provided, and one end of the wiring in the FPC board 62g and one end of the wiring in the FPC board 62h are electrically connected, respectively. As the dust-proof glass 70, similar to the counter substrate 20 and the element substrate 30, a base material having optical transparency and insulating properties, such as glass or quartz, is used.

[0071] In the third embodiment, the heater 730 provided on the dust-proof glass 70 is a conductive film in which a frame portion 731a and connection portions 731b and 731c are patterned integrally as shown in Fig. 18. The heater 730 and the heater 230 preferably have a light-shielding property. The frame portion 731a is provided along the inside of the periphery of a rectangular region where the counter substrate 20 and the element substrate 30 overlap in a plan view, and is provided so as to open in the display region 5. A slit S2 is provided in the frame portion 731a, and the frame portion 731a is electrically divided into one end and the other end. One end is extended to the protruding portion 710 to become a connection portion 731b, and the other end is extended to the protruding portion 710 to become a connection portion 231c. In other words, the portion of the heater 730 excluding the connection portions 731b and 731c is the frame portion 731a.

[0072] According to the third embodiment, the FPC board 61 that supplies the control signal and the FPC boards 62g and 62h that apply voltage to the heater 230 to supply power are separated, so that the effect of noise generated when switching the constant voltage on the control signal can be suppressed. Furthermore, according to the third embodiment, the heater 730 is provided not on the counter substrate 20 on which the common electrode 22 is provided, but on the dustproof glass 70 separate from the counter substrate 20. Therefore, the distance between the heater 730 and the common electrode 22 is longer by the thickness of the counter substrate 20 compared to a configuration in which the heater 230 is provided on the counter substrate 20. Therefore, even if the voltage applied to the heater 730 is switched, the fluctuation in the voltage is unlikely to propagate to the common electrode 22 via the parasitic capacitance, and adverse effects on the display can be suppressed.

[0073] In the third embodiment, the dust-proof glass 70 is attached to the counter substrate 20, but the dust-proof glass 70 may be attached to the element substrate 300.

[0074] <Additional Notes> From the above-mentioned exemplary embodiments, the following aspects can be understood, for example.

[0075] A liquid crystal device according to one aspect (Aspect 1) includes a first substrate on which a first connection portion is arranged, a first flexible substrate electrically connected to the first connection portion, a second substrate arranged to overlap the first substrate and on which a second connection portion and a heating member are arranged, a second flexible substrate electrically connected to the heating member via the second connection portion, and a liquid crystal layer arranged between the first substrate and the second substrate, wherein the first connection portion is provided along one side of the first substrate in a region not overlapping with the second substrate in a plan view, and the second connection portion is provided along one side of the second substrate in a region not overlapping with the first substrate in a plan view. According to this aspect, the second flexible substrate electrically connected to the heating member is separated from the first flexible substrate, and therefore the influence on the signal supplied to the first flexible substrate can be suppressed.

[0076] In a liquid crystal device according to a second specific aspect of the first aspect, the second connection portion is disposed outside a side of the rectangular region that faces the one side. In a liquid crystal device according to a third specific aspect of the first aspect, the second connection portions are disposed outside two sides of the rectangular region that intersect with the one side. In the liquid crystal device according to a fourth specific aspect of the first aspect, the second flexible substrate has wiring for applying a voltage to the heating member.

[0077] A liquid crystal device according to a fifth specific example of the fourth example includes a temperature sensor, and a constant voltage corresponding to a detection value of the temperature sensor is applied to the wiring of the second flexible substrate. According to the fifth example, heating of the electro-optical device can be controlled according to the detection value of the temperature sensor.

[0078] In a liquid crystal device according to a specific aspect 6 of aspect 1, the first flexible substrate has a plurality of terminals electrically connected to the first connection portion, the second flexible substrate has a plurality of terminals electrically connected to the second connection portion, and the width of the terminals arranged on the second flexible substrate is wider than the width of the terminals arranged on the first flexible substrate. According to aspect 6, the current flowing through the terminals arranged on the second flexible substrate can be made larger than the current flowing through the terminals arranged on the first flexible substrate.

[0079] In a liquid crystal device according to a seventh specific example of the sixth example, the terminals arranged on the second flexible substrate include a first terminal for supplying a first potential to the heating member, a second terminal for supplying a second potential to the heating member, and a third terminal arranged between the first terminal and the second terminal and not electrically connected to the heating member. According to the seventh example, the second flexible substrate can be a general-purpose product having wiring of the same width arranged at equal intervals.

[0080] In addition, a liquid crystal device according to another aspect 8 has a first substrate on which a first connection portion is arranged, a first flexible substrate electrically connected to the first connection portion, a second substrate arranged overlapping the first substrate, a liquid crystal layer arranged between the first substrate and the second substrate, a third substrate bonded to either the first substrate or the second substrate and on which a second connection portion and a heating member are arranged, and a second flexible substrate electrically connected to the heating member via the second connection portion, wherein the first connection portion is also provided along one side of the first substrate in a region not overlapping with the second substrate in a planar view, and the second connection portion is provided along one side of the first substrate in a region not overlapping with the second substrate in a planar view. According to aspect 8, similar to aspect 1, the second flexible substrate electrically connected to the heating member is separated from the first flexible substrate, thereby reducing the effect on the signal supplied to the first flexible substrate.

[0081] An electronic device according to a ninth aspect includes the electro-optical device according to any one of the first to eighth aspects. [Explanation of symbols]

[0082] 10...electro-optical device, 15...display control circuit, 20...counter substrate, 22...common electrode, 30...element substrate, 32...pixel electrode, 40...sealing material, 50...liquid crystal, 61, 62a, 62b, 62c, 62d, 62e, 62f, 62g, 62h...FPC substrate, 230, 730...heater, 231a, 731...frame portion, 231b, 231c, 231g, 231h, 231e, 231f, 731b, 731c...connection portion, 241...light-shielding film.

Claims

1. a first substrate on which a first connection portion is arranged; a first flexible substrate electrically connected to the first connection portion; a second substrate disposed on the first substrate and having a second connection portion and a heating member disposed thereon; and, a second flexible substrate electrically connected to the heating member via the second connection portion; a liquid crystal layer disposed between the first substrate and the second substrate; and The first connection portion is formed on the first substrate in a region that does not overlap with the second substrate in a plan view. Located along one side, The second connection portion is formed on the second substrate in a region that does not overlap with the first substrate in a plan view. Located along one side Liquid crystal device.

2. The second connection portion is disposed outside the display area. The liquid crystal device according to claim 1 .

3. The second connection portions are arranged outside the display area along two opposing sides of the second substrate. Each will be placed The liquid crystal device according to claim 1 .

4. The second flexible substrate is Wiring for applying a voltage to the heating element The liquid crystal device according to claim 1 .

5. A temperature sensor is provided. A constant voltage corresponding to the detected value of the temperature sensor is applied to the wiring of the second flexible substrate. is applied The liquid crystal device according to claim 4 .

6. The first flexible substrate has: a plurality of terminals electrically connected to the first connection portion are arranged; The second flexible substrate has: a plurality of terminals electrically connected to the second connection portion are arranged; The width of the terminals arranged on the second flexible substrate is wider than the width of the terminal to be The liquid crystal device according to claim 1 .

7. The plurality of terminals arranged on the second flexible substrate include: a first terminal for supplying a first potential to the heating element; a second terminal for supplying a second potential to the heating element; a heat generating element disposed between the first terminal and the second terminal and electrically disconnected from the heating element; A third terminal; Contains The liquid crystal device according to claim 6 .

8. a first substrate on which a first connection portion is arranged; a first flexible substrate electrically connected to the first connection portion; a second substrate disposed so as to overlap the first substrate; a liquid crystal layer disposed between the first substrate and the second substrate; a second connection portion and a heating portion bonded to either the first substrate or the second substrate; a third substrate on which the material is disposed; a second flexible substrate electrically connected to the heating member via the second connection portion; and The first connection portion is formed on the first substrate in a region that does not overlap with the second substrate in a plan view. Located along one side, The second connection portion is formed on the first substrate in a region that does not overlap with the second substrate in a plan view. Located along one side Liquid crystal device.

9. 9. An electronic device comprising the liquid crystal device according to claim 1.

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