Hot melt adhesive composition

Abstract

The present invention relates to a hot melt adhesive composition comprising: i) at least one specific semi-crystalline aliphatic copolyamide containing units Y exhibiting a Tg of less than 30° C.; ii) from 3% to 35% by weight, relative to the total weight of the composition, of at least one thermally conductive filler, the content of which is between 80% and 100% of carbon atoms relative to the number of atoms constituting the filler, the composition comprising less than 20% of components with a density greater than 3. The invention also relates to its preparation process and to its uses.

Description

[Technical field]

[0001] The present invention relates to a hot melt adhesive composition for the encapsulation of electronic devices, a process for the preparation of such a composition, and its use. [Background technology]

[0002] The use of polyamides as hot melt adhesives for sealing electronic and mechanical devices, for example used in the automotive or medical sector, is well known, since plastic materials are generally used to protect batteries, whether in cars or on a smaller scale, such as in the shell of a mobile phone. More specifically, the substrate to be encapsulated can be a metal, such as copper, or a polymer, for example the material that constitutes printed circuits.

[0003] Furthermore, these materials must be electrically insulating to avoid the possibility of short circuits, and, if the battery is an encapsulated element, they must also be thermally conductive to allow the evacuation of heat generated during use.

[0004] At the packaging level, the encapsulation of the parts must be done at low pressure so as not to damage the parts to be molded. Encapsulation is a problematic process: the material that allows the encapsulation of the parts is melted. It is subsequently deposited gently at high temperature on the elements to be encapsulated. The pressure at the nozzle outlet of the molten material is described as low pressure. The term "wetting" is used to define this encapsulation. In fact, if the pressure at the nozzle outlet is high, the forces exerted on the parts to be molded during the deposition of the molten material can damage them. Several low-pressure injection processes are known to encapsulate parts. The process called "epoxy potting" has the disadvantage of being relatively time-consuming, which leads to low productivity due to the relatively slow reaction times. The chemical vapor deposition process is used as such in the field of encapsulation. However, this process is known to be dangerous.

[0005] Therefore, new materials are required that should meet specific physicochemical properties and allow for easier low pressure encapsulation processes.

[0006] It has been found that during the encapsulation process, the material is usually in the melting device in a molten state for a relatively long time. It has been found that the known compositions undergo phase separation. This loss of homogeneity over time results in differences in properties between the encapsulated product produced at the beginning of the run with homogeneous material and the encapsulated product produced at the end of the run with non-homogeneous material. Furthermore, if the filler settles and the molten material becomes too dense, the exit nozzle tends to become clogged. Then, over time, these relatively abrasive fillers damage the production plant.

[0007] There is therefore a real need to provide a hot melt adhesive composition which exhibits good electrical insulating and thermal conductive properties, exhibits stability over time in the molten state, and can be easily used at low pressures. Summary of the Invention

[0008] The present invention relates to a hot melt adhesive composition comprising: (i) Formula (1) below: X / Y(1) [-Unit X is C 6 From C 18 α,ω-Amino carboxylic acids, C 6 From C 18 semi-crystalline units obtained by polycondensation of units selected from lactam and (Ca diamine).(Cb diacid) units, where a represents the number of carbon atoms of the diamine and b represents the number of carbon atoms of the diacid, a being between 2 and 18 and b being between 4 and 18, Ca diamine and Cb diacid being saturated or unsaturated, linear or branched, aliphatic or alicyclic, the Y unit is a unit resulting from polycondensation of (Cd diamine).(Ce diacid) units, d represents the number of carbon atoms of the diamine and e represents the number of carbon atoms of the diacid, d and e are between 2 and 48, the Cd diamine and the Ce diacid are saturated or unsaturated, linear or branched, aliphatic or cycloaliphatic, and the Cd diamine may be a polyetheramine, the unit Y exhibits a Tg of less than 30° C., advantageously less than 20° C. and very advantageously less than 0° C., The copolyamide exhibits a melt viscosity at 200°C, measured according to ASTM standard D3236-88 (2009), between 0.5 and 300 Pa.s; The copolyamide constitutes the matrix of the composition. and at least one semi-crystalline aliphatic copolyamide comprising at least two units corresponding to (ii) from 3% to 35% by weight, relative to the total weight of the composition, of at least one thermally conductive filler, the carbon atom content of which is between 80% and 100% relative to the number of atoms constituting the filler; Including, The composition contains less than 20% of components with a density greater than 3; The present invention relates to a hot melt adhesive composition.

[0009] The present invention also relates to a process for the preparation of the composition according to the invention.

[0010] The invention then relates to the use of the composition for encapsulating an electronic device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] In the following the invention will be explained in more detail and in a non-limiting manner.

[0012] Within the meaning of the present invention, the term "hot melt" is understood to mean the ability of a composition to melt under the influence of heat.

[0013] In the specification, all percentages are mole percent unless otherwise indicated.

[0014] Within the context of the present invention, the expression "between... and..." is understood to mean that the boundaries are included in the stated range.

[0015] Copolyamide The copolyamides present in the composition according to the invention are semicrystalline and aliphatic.

[0016] The expression "semicrystalline copolyamide" covers copolyamides that exhibit both a glass transition temperature Tg and a melting temperature Tm, which can be determined according to ISO 11357-2:2013 and 11357-3:2013, respectively.

[0017] The nomenclature used to define polyamides is described in ISO standard 1874-1:1992 "Plastics-Polyamide (PA) moulding and extrusion materials-Part 1: Designation", especially page 3 (Tables 1 and 2), and is well known to those skilled in the art. In the PAL notation, PA denotes polyamide and L denotes the number of carbon atoms of the amino acid or lactam. Thus, polyamides are obtained by polycondensation of amino acids or lactams containing L carbon atoms. In the PAMN notation, M denotes the number of carbon atoms of the diamine and N denotes the number of carbon atoms of the diacid.

[0018] The semi-crystalline aliphatic copolyamides contain at least two units corresponding to formula (1): X / Y(1) [In formula: - Unit X is C 6 From C 18 α,ω-Amino carboxylic acids, C 6 From C 18 semi-crystalline units obtained by polycondensation of units selected from lactam and (Ca diamine).(Cb diacid) units, where a represents the number of carbon atoms of the diamine and b represents the number of carbon atoms of the diacid, a being between 2 and 18 and b being between 4 and 18, Ca diamine and Cb diacid being saturated or unsaturated, linear or branched, aliphatic or alicyclic, the Y unit is a unit resulting from polycondensation of (Cd diamine).(Ce diacid) units, d represents the number of carbon atoms of the diamine and e represents the number of carbon atoms of the diacid, d and e are between 2 and 48, the Cd diamine and the Ce diacid are saturated or unsaturated, linear or branched, aliphatic or cycloaliphatic, and the Cd diamine may be a polyetheramine, The unit Y exhibits a Tg of less than 30° C., advantageously less than 20° C., very advantageously less than 0° C. Including, The copolyamide exhibits a melt viscosity at 200°C, measured according to ASTM standard D3236-88 (2009), between 0.5 and 300 Pa.s; The copolyamide constitutes the matrix of the composition.

[0019] Advantageously, the polyamide of formula (1) has a ratio of the number of carbon atoms to the number of nitrogen atoms (denoted C / N) greater than or equal to 8.

[0020] Within the meaning of the present invention, the term "semicrystalline units" is understood to mean a polyamide that exhibits a melting point (Tm) in DSC according to ISO standard 11357-3:2013 and an enthalpy of crystallization in the DSC cooling phase at a rate of 5 K / min, measured according to ISO standard 11357-3 of 2013, of greater than 15 J / g, preferably greater than 30 J / g.

[0021] The unit X is one or more C 6 ~C 12 It may result from the polycondensation of α,ω-amino carboxylic acids, preferably selected from 7-aminoheptanoic acid, 11-aminoundecanoic acid and 12-aminododecanoic acid.

[0022] The unit X is one or more C 6 ~C 12 It may result from the polycondensation of lactams. Preferably, the lactams are selected from caprolactam, enantholactam and lauryllactam.

[0023] The unit X may result from the polycondensation of (Ca diamine).(Cb diacid) units, where a represents the number of carbon atoms in the diamine and b represents the number of carbon atoms in the diacid, a being between 2 and 18, b being between 4 and 18. More particularly, b is between 5 and 18.

[0024] The Ca diamines may be selected from linear or branched aliphatic or cycloaliphatic diamines.

[0025] Ca diamine is aliphatic and linear, and has the formula H 2 N-(CH 2 ) a -NH 2 When the Ca diamine is of the formula (a=2), it is preferentially selected from ethylene diamine (a=2), butane diamine (a=4), pentane diamine (a=5), hexane diamine (a=6), heptane diamine (a=7), octanediamine (a=8), nonane diamine (a=9), decanediamine (a=10), undecane diamine (a=11), dodecane diamine (a=12), tridecane diamine (a=13), tetradecane diamine (a=14), hexadecanediamine (a=16), octadecane diamine (a=18) or octadecane diamine (a=18).

[0026] The Ca diamines, when aliphatic and branched, may contain one or more methyl or ethyl substituents in the main chain and may be advantageously selected, for example, from 2,2,4-trimethyl-1,6-hexanediamine, 2,4,4-trimethyl-1,6-hexanediamine, 2-methyl-1,5-pentanediamine or 2-methyl-1,8-octanediamine.

[0027] The Ca diamine, when it is alicyclic, may be selected from piperazine (a=4) and aminoethylpiperazine (a=6), hereinafter designated pip.

[0028] Preferably, the Ca diamine is selected from ethylene diamine, hexamethylene diamine, decanediamine and piperazine.

[0029] The Cb diamine may be selected from linear or branched aliphatic or cycloaliphatic diacids.

[0030] Throughout this specification the expressions "diacid," "carboxylic diacid," and "dicarboxylic acid" refer to the same product.

[0031] The Cb diacids, when aliphatic, may be selected from adipic acid (b=6), heptanedioic acid (b=7), octanedioic acid (b=8), azelaic acid (b=9), sebacic acid (b=10), undecanedioic acid (b=11), dodecanedioic acid (b=12), brassylic acid (b=13), tetradecanedioic acid (b=14), hexadecanedioic acid (b=16), octadecanedioic acid (b=18) or octadecenedioic acid (b=18).

[0032] When the diacid is alicyclic, it may contain the following carbon skeletons: norbornyl, cyclohexyl, dicyclohexyl, or dicyclohexylpropane.

[0033] Preferably, the units X are selected from caprolactam, enantholactam and lauryllactam, 7-aminoheptanoic acid, 11-aminoundecanoic acid and 12-aminododecanoic acid, PA26, PA29, PA210, PA212, PA214, PA218, PA56, PA59, PA510, PA66, PA69, PA610, PA512, PA612, PA514, PA614, PA618, PApip10, PApip12, PA1010, PA1012, PA1014, PA1018, PA1210, PA1212, PA1214 and PA1218. More particularly, the units X are selected from caprolactam, lauryllactam, 11-aminoundecanoic acid, PA26, PA29, PA210, PA212, PA214, PA218, PA59, PA510, PA69, PA610, PA512 and PA612.

[0034] Preferably, the unit X is selected from amino acids and lactams or PA26, PA29, PA210, PA212, PA214, PA218, PA59, PA510, PA66, PA69, PA610, PA512 or PA612; more particularly, the unit X is selected from amino acids and lactams having a number of carbon atoms greater than 6. More particularly, the unit X is PA6, PA11, PA12, PA210, PA212, PA69, PA610 or PA612.

[0035] The Y unit is obtained by polycondensation of (Cd diamine).(Ce diacid) units, where d represents the number of carbon atoms of the diamine and e represents the number of carbon atoms of the diacid, d and e are between 2 and 48, the Cd diamine and the Ce diacid are saturated or unsaturated, linear or branched aliphatic, and the Cd diamine is selected from aliphatic diamines, cycloaliphatic diamines and polyether amines.

[0036] The Cd diamines may be selected from linear or branched aliphatic or cycloaliphatic diamines as defined above for the Ca diamines.

[0037] The Cd diamine may also be selected from eicosane diamine (d=20) and docosane diamine (d=22).

[0038] Cd diamines may also result from the amination of polymerized fatty acids, as defined below. 36 Or C 44 It is a diamine.

[0039] The Cd diamine may also be selected from bis(3,5-dialkyl-4-aminocyclohexyl)methane, bis(3,5-dialkyl-4-aminocyclohexyl)ethane, bis(3,5-dialkyl-4-aminocyclohexyl)propane, bis(3,5-dialkyl-4-aminocyclohexyl)butane, bis(3-methyl-4-aminocyclohexyl)methane (BMACM or MACM), bis(p-aminocyclohexyl)methane (PACM) and isopropylidenedi(cyclohexylamine) (PACP), isophoronediamine (f=10), piperazine (f=4) (hereinafter referred to as pip), or aminoethylpiperazine. It may also include the following carbon skeletons: norbornylmethane, cyclohexylmethane, dicyclohexylpropane, di(methylcyclohexyl) or di(methylcyclohexyl)propane. A non-exhaustive list of these alicyclic diamines is provided in "Cycloaliphatic Amines," Encyclopedia of Chemical Technology, Kirk-Othmer, 4th Edition (1992), pp. 386-405.

[0040] The Cd diamines can also be polyetheramines, i.e. polyoxyalkylene diamines. Preferably, they are polyoxyalkylene chains with amine groups at the chain ends. The polyoxyalkylene chains preferably contain oxyethylene (POE), oxypropylene (POP) or oxytetramethylene (POTM) groups, either alone or in mixtures. When these groups are included in mixtures, mixtures of POE and POP, or POTM and POP, are preferred.

[0041] These compounds can be obtained by cyanoacetylation of α,ω-dihydroxylated aliphatic polyoxyalkylenes, called polyetherdiols. The polyetheramines are preferably selected from the commercial products, in particular those sold under the Jeffamine® and Elastamine® brands by Huntsman (e.g. Jeffamine® D400, D2000, ED 2003 or XTJ 542, Elastamine® RT 1000, RP 405 or RP 2009) or under the Baxxodur® brand by BASF (e.g. Baxxodur® EC 302, EC 301, EC 303 or EC 311).

[0042] Preferably, the number average molecular weight of the polyetheramine is 60 g.mol -1 and 2000 g.mol -1 Between 80g.mol and 80g.mol -1 and 1500 g.mol -1 and even more preferably between 100 g.mol -1 and 500 g.mol -1 It is between.

[0043] Cd diamines may also result from the amination of polymerized fatty acids, as defined below. These diamines are commercially available from Cognis Corporation (BASF) under the brand name "Versamine" and from Croda under the brand name Priamine®.

[0044] The Ce diacids may be selected from linear or branched aliphatic or cycloaliphatic diacids, as defined above for the Cb diacids.

[0045] The Ce diacid may also be selected from eicosane diacid (e=20), docosane diacid (e=22) and fatty acid dimers.

[0046] Ce diacids can be derived from polymerized fatty acids. These polymerized fatty acids represent compounds produced from the coupling reaction of unsaturated fatty acids, resulting in a mixture of products with two acid functional groups (denoted as acid dimers) or three acid functional groups (denoted as acid trimers). This coupling can be a combination or condensation reaction of two moles of unsaturated monocarboxylic acids, the monoacids being the same or different. This dimerization reaction can be carried out by catalytic or non-catalytic polymerization methods according to known methods. For example, C 36 Dimer diacids are unsaturated C carboxylic acids such as oleic acid, linoleic acid, linolenic acid and mixtures thereof. 18 They can be obtained by dimerization of monoacids. These mixtures are present, for example, in tall oil. Usually, these mixtures contain mainly dimers and, in smaller amounts, monomers, trimers and oligomers. After separation, the fatty acid dimers are obtained mainly as a mixture with 75% to more than 98%, in particular with the corresponding monomers "1 and 1 / 2 mers" and trimers.

[0047] The dimer diacids can be derived from C14 myristoleic acid, C16 palmitoleic acid, C16 sapienic acid, C18 oleic acid, C18 elaidic acid, C18 transvacenic acid, C18 linoleic acid, C18 linoleyl acid, C18 alpha-linolenic acid, C18 gamma-linolenic acid, C20 11-eicosenoic acid, C20 eicosapentaenoic acid, C20 dihomo-gamma-linolenic acid, C20 arachidonic acid, C22 erucic acid, C22 clupanodonic acid, C22 docosahexaenoic acid, C24 nervonic acid and mixtures thereof.

[0048] Polymerized fatty acids are commercially available and in particular the products sold by Croda under the brand name Pripol® can be used, but also the products sold by Cognis under the brand name Empol®, or the products sold by Kraton under the brand name Unydime® or the products sold by Oleon under the brand name Radiacid®.

[0049] The fatty acid dimer can then be converted to an amine dimer by converting two of the acid functional groups to an amine functional group, or to an amino acid dimer by converting one of the acid functional groups to an amine functional group.

[0050] Preferably, the diacid used in the unit Y is an acid dimer, more particularly C 36 and C 44 A dimer is used.

[0051] Preferably, the units Y are selected from PA236, PA536, PA636, PA1036, PA pip36, PA pip44, PA244, PA544, PA644, PA1044, PA POP36, PA POP44, PA POP6, PA POP9, PA POP10, PA POP12 or PA POP14, POP being polyetheramines having a molar mass between 60 g / mol and 2000 g / mol.

[0052] The units Y of the copolyamide according to the invention preferably have a Tg of less than 30° C., advantageously less than 0° C. The glass transition temperatures mentioned can be determined by differential scanning calorimetry (DSC) according to ISO standard 11357-2:2013, Plastics-Differential Scanning Calorimetry (DSC) Part 2. The heating and cooling rates are 20° C. / min.

[0053] The copolyamide according to the invention comprises from 30 mol% to 99.5 mol% of units X and from 0.5 mol% to 70 mol% of units Y, preferably from 40 mol% to 98 mol% of units X and from 2 mol% to 60 mol% of units Y, and more particularly from 50 mol% to 90 mol% of units X and from 10 mol% to 50 mol% of units Y.

[0054] The molar percentage of units X and Y is measured, for example, by calculating the percentage of the number of moles of the monomer that constitutes unit X relative to the sum of the number of moles of all the monomers that constitute the copolyamide, i.e., X and Y. This is done excluding the chain limiter, and does not count the excess diamine or diacid, according to the following formula: TIFF2024536476000001.tif15170 shows the calculation.

[0055] The copolyamide according to the invention has a melt viscosity, measured according to ASTM standard D3236-88 (2009), between 0.5 and 300 Pa.s at 200° C., preferably between 0.5 and 200 Pa.s, more preferably from 1 to 100 Pa.s at 200° C., and more particularly from 2 to 30 Pa.s at 200° C. More particularly, the melt viscosity is measured at 200° C. using a Brookfield rheometer using an SC 4-27 module according to ASTM standard D3236-88 (2009).

[0056] The copolyamides according to the invention preferably have a Tg of less than 20° C., advantageously less than 0° C. The glass transition temperatures mentioned can be determined by differential scanning calorimetry (DSC) according to ISO standard 11357-2:2013, Plastics-Differential Scanning Calorimetry (DSC) Part 2. The heating and cooling rates are 20° C. / min.

[0057] Preferably, the copolyamide according to the invention comprises at least one unit selected from PA26, PA29, PA210, PA212, PA214, PA218, PA56, PA59, PA510, PA512, PA66, PA69, PA610, PA612, PA6, PA11, PA12, PA1010, PA1012, PA1212, PA pip10, PA pip36, PA pip44, PA POP40036, PA POP40044, PA POP40010, PA POP4006, PA POP200036, PA POP200044, PA POP200010, PA POP20006, PA3636, PA3644, PA4436, PA4444 and mixtures thereof.

[0058] Preferably, the copolyamides according to the invention have the following structures: PA26 / pip36, PA210 / pip36, PA212 / pip36, PA214 / pip36, PA218 / pip36, PA59 / pip36, PA510 / pip36, PA512 / pip36, PA610 / pip36, PA612 / pip36, PA6 / pip36, PA1010 / pip36, PA1012 / pip36, PA1212 / pip36, PA26 / pip44, PA210 / pip44, PA212 / pip44, PA214 / pip44, PA218 / pip p44, PA59 / pip44, PA510 / pip44, PA512 / pip44, PA610 / pip44, PA612 / pip44, PA6 / pip44, PA1010 / pip44, PA1012 / pip44, PA1212 / pip44, PA26 / POP4003 6, PA210 / POP40036, PA212 / POP40036, PA214 / POP40036, PA218 / POP40036, PA59 / POP40036, PA510 / POP40036, PA512 / POP40036, PA610 / POP40036, PA61 2 / POP40036, PA6 / POP40036, PA1010 / POP40036, PA1012 / POP40036, PA1212 / POP40036, PA26 / POP40010, PA210 / POP40010, PA212 / POP40010, PA214 / PO P40010, PA218 / POP40010, PA59 / POP40010, PA510 / POP40010, PA512 / POP40010, PA610 / POP40010, PA612 / POP40010, PA6 / POP40010, PA1010 / POP40010 , PA1012 / POP40010, PA1212 / POP40010, PA26 / POP4006, PA210 / POP4006, PA212 / POP4006, PA214 / POP4006, PA218 / POP4006, PA59 / POP4006, PA510 / POP 4006, PA512 / POP4006, PA610 / POP4006, PA612 / POP4006, PA6 / POP4006, PA1010 / POP4006, PA1012 / POP4006, PA1212 / POP4006, PA26 / 3636, PA210 / 3636,PA212 / 3636, PA214 / 3636, PA218 / 3636, PA59 / 3636, PA510 / 3636, PA512 / 3636, PA610 / 3636, PA612 / 3636, PA6 / 3636, PA11 / 3636, PA12 / 3636 and PA11 / 3636 / pip36, PA1010 / 3636, PA1012 / 3636, PA1212 / 3636, PA26 / POP200036, PA210 / POP200036, PA212 / POP200036, PA214 / POP200036, PA218 / POP200036, PA59 / POP200036, PA510 / POP200036, PA512 / POP200036, PA610 / POP200036, PA612 / POP200036, PA6 / POP200036, PA1010 / POP200036, PA1012 / POP2000 36, PA1212 / POP200036, PA26 / pip36 / POP40036, PA210 / pip36 / POP40036, PA212 / pip36 / POP40036, PA214 / pip36 / POP40036, PA218 / pip36 / POP40036, PA59 / pip36 / POP40036, PA510 / pip36 / POP40036, PA512 / pip36 / POP40036, PA610 / pip36 / POP40036, PA612 / pip36 / POP40036, PA6 / pip36 / POP40036, P A1010 / pip36 / POP40036, PA1012 / pip36 / POP40036, PA1212 / pip36 / POP40036, PA26 / pip36 / POP200036, PA210 / pip36 / POP200036, PA212 / pip36 / POP2 00036, PA214 / pip36 / POP200036, PA218 / pip36 / POP200036, PA59 / pip36 / POP200036, PA510 / pip36 / POP200036, PA512 / pip36 / POP200036, PA610 / pip 36 / POP200036, PA612 / pip36 / POP200036, PA6 / pip36 / POP200036, PA1010 / pip36 / POP200036, PA1012 / pip36 / POP200036, PA1212 / pip36 / POP200036,PA26 / pip36 / POP4006, PA210 / pip36 / POP4006, PA212 / pip36 / POP4006, PA214 / pip36 / POP4006 , PA218 / pip36 / POP4006, PA59 / pip36 / POP4006, PA510 / pip36 / POP4006, PA512 / pip36 / POP4006 , PA610 / pip36 / POP4006, PA612 / pip36 / POP4006, PA6 / pip36 / POP4006, PA1010 / pip36 / POP4006 , PA1012 / pip36 / POP4006, PA1212 / pip36 / POP4006, PA26 / pip36 / POP20006, PA210 / pip36 / POP2 0006, PA212 / pip36 / POP20006, PA214 / pip36 / POP20006, PA218 / pip36 / POP20006, PA59 / pip36 / POP20006, PA510 / pip36 / POP20006, PA512 / pip36 / POP20006, PA610 / pip36 / POP20006, PA612 / pip36 / POP20006, PA6 / pip36 / POP20006, PA1010 / pip36 / POP20006, PA1012 / pip36 / POP20006 or PA1212 / pip36 / POP20006; POP20006 is selected from polyetheramines of the polyoxypropylene formula having a molar mass of 2000 g / mol and C, 6 It is meant to be a unit resulting from condensation with a diacid.

[0059] Particularly preferably, the copolyamide according to the invention comprises units X chosen from diamine.diacid units and units Y comprising piperazine as Cd diamine and a diacid containing more than 6 carbon atoms as Ce diacid.

[0060] According to another preferred embodiment, the Ce diacid is 44 Or C 44 It is an acid dimer.

[0061] According to yet another embodiment, the copolyamide according to the invention comprises units X of the type (Ca diamine).(Cb diacid) containing an average number of carbon atoms per nitrogen atom greater than or equal to 6, and units Y comprising piperazine as Cd diamine and a diacid containing more than 6 carbon atoms as Ce diacid.

[0062] Preferably, the copolyamide according to the invention comprises as Ce diacid an acid dimer or as Cd diamine a polyetheramine.

[0063] According to a preferred embodiment, the copolyamides according to the invention are selected from the group consisting of PA26 / pip36, PA210 / pip36, PA59 / pip36, PA510 / pip36, PA512 / pip36, PA610 / pip36, PA210 / POP40036, PA59 / POP40036, PA510 / POP40036, PA610 / POP40036, PA210 / POP40010, PA59 / POP4009, PA510 / POP40010, PA26 / POP4006, PA210 / POP4006, PA610 / POP4006, PA26 / pip36 / POP40036, PA210 / pip36 / P OP40036, PA510 / pip36 / POP40036, PA610 / pip36 / POP40036, PA6 / pip36 / POP40036, PA210 / pip36 / POP200036, PA59 / pip36 / POP200036, PA510 / pip36 / POP200036, PA512 / pip36 / POP200036, PA610 / pip36 / POP200036, PA210 / pip36 / POP20006, PA610 / pip36 / POP20006, PA6 / 3636, PA11 / 3636, PA12 / 3636 and PA11 / 3636 / pip36.

[0064] According to one embodiment of the invention, the copolyamide consists of two units X and Y as defined above.

[0065] According to another preferred embodiment, the copolyamide comprises more than two units X and Y as defined above. Preferably, the copolyamide comprised in the composition according to the invention comprises at least three different units. For example, the copolyamide according to the invention may comprise two units X and one unit Y, one unit X and two units Y, or two units X and two units Y. Preferably, the copolyamide comprised in the composition according to the invention is a terpolyamide or a tetrapolyamide.

[0066] Preferably, the copolyamide according to the invention comprises fatty acid dimers, advantageously in a content of from 1 mol% to 35 mol%, preferably from 2 mol% to 30 mol% and preferentially from 7 mol% to 25 mol% relative to the total number of moles of the copolyamide.

[0067] Preferably, the copolyamide according to the invention comprises a polyetherdiamine content of between 0.5 and 25 mol%, preferably between 1 and 22 mol%, and preferentially between 1.5 and 14 mol%, relative to the total number of moles of the copolyamide.

[0068] The piperazine content in the copolyamide is preferably less than 40 mol %, advantageously less than 30 mol % and very advantageously less than 20 mol %, relative to the total number of moles of the copolyamide.

[0069] Chain Limiter The copolyamides of the invention are conventionally synthesized, optionally in the presence of a chain limiter or chain terminator.

[0070] Suitable chain terminators for reacting with the terminal amine functionality can be monocarboxylic acids, anhydrides such as phthalic anhydride, monohalogenated acids, monoesters or monoisocyanates.

[0071] Preferably, monocarboxylic acids are used. These may be selected from aliphatic monocarboxylic acids, such as acetic acid, propionic acid, lactic acid, valeric acid, caproic acid, capric acid, lauric acid, tridecylic acid, myristic acid, palmitic acid, stearic acid, pivalic acid and isobutyric acid; alicyclic acids, such as cyclohexanecarboxylic acid; aromatic monocarboxylic acids, such as benzoic acid, toluic acid, α-naphthalenecarboxylic acid, β-naphthalenecarboxylic acid, methylnaphthalenecarboxylic acid, phenylacetic acid; and mixtures thereof. Preferred compounds are fatty acids, in particular acetic acid, propionic acid, lactic acid, valeric acid, caproic acid, capric acid, lauric acid, tridecylic acid, myristic acid, palmitic acid and stearic acid.

[0072] Chain terminators suitable for reaction with the terminal acid functionality include monoamines, monoalcohols and monoisocyanates.

[0073] Preferably, monoamines are used, which may be selected from aliphatic monoamines such as methylamine, ethylamine, propylamine, butylamine, hexylamine, octylamine, decylamine, laurylamine, stearylamine, dimethylamine, diethylamine, dipropylamine and dibutylamine; alicyclic amines such as cyclohexylamine and dicyclohexylamine; aromatic monoamines such as aniline, toluidine, diphenylamine, naphthylamine; and mixtures thereof.

[0074] Preferred compounds are butylamine, hexylamine, octylamine, decylamine, laurylamine, stearylamine, cyclohexylamine, and aniline.

[0075] The chain limiter may be a dicarboxylic acid introduced in excess relative to the diamine stoichiometry, or it may be a diamine introduced in excess relative to the diacid stoichiometry.

[0076] According to a preferred embodiment, the copolyamide present in the composition according to the invention is a totally or partially recycled copolyamide. When the polyamide is a recycled polyamide, it comprises functional groups resulting from an oxidation reaction selected from imide, alcohol or carboxylic acid functional groups, preferably imide or alcohol functional groups, in a molar ratio relative to amide functional groups that is greater than the molar ratio in the same non-recycled polyamide.

[0077] According to one embodiment, said molar ratio of functional groups resulting from the oxidation reaction, i.e. the sum of the number of moles of imide, acid and alcohol functional groups relative to the number of moles of amide functional groups of the copolyamide, is between 1 / 10000 and 1 / 20.

[0078] This ratio can be measured by calculating the concentration with proton NMR. The copolyamide sample was heated to d with HFIP (hexafluoroisopropanol). 2 - It is prepared by dissolving in dichloromethane.

[0079] In a first alternative, said molar ratio of imide functions is between 1 / 1000 and 1 / 20, in particular between 1 / 500 and 1 / 20, and in particular between 1 / 200 and 1 / 50.

[0080] In a second alternative, said molar ratio of carboxylic acid functions is between 1 / 5000 and 1 / 20, in particular between 1 / 3000 and 1 / 50 and very advantageously between 1 / 500 and 1 / 25.

[0081] In a third alternative, said molar ratio of alcohol functions is between 1 / 1000 and 1 / 20, advantageously between 1 / 1000 and 1 / 25 and very advantageously between 1 / 200 and 1 / 50.

[0082] Preferably, the copolyamide present in the composition has a melting point of between 10 and 220°C, advantageously between 120 and 200°C and very advantageously between 130 and 180°C.

[0083] The water content of the copolyamide after exposure to 23° C. and 50% relative humidity (measurement carried out at equilibrium) is preferably between 0.1 and 1.2% by weight, advantageously 0.15 to 0.7% by weight, relative to the total weight of the copolyamide.

[0084] The copolyamide described above constitutes the matrix of the composition according to the invention.

[0085] Thermally conductive filler The composition according to the invention comprises from 3% to 35% by weight of at least one thermally conductive filler, the carbon atom content of which is between 80% and 100% by number of atoms constituting the filler. Preferably, the filler comprises from 94% to 99.99% of carbon atoms.

[0086] The carbon-based filler may be selected from natural graphite, synthetic graphite, expanded graphite, graphene, carbon black, and carbon fibers. Preferably, the filler is selected from natural graphite, synthetic graphite, and expanded graphite.

[0087] The graphite used in the composition according to the invention can be synthetic or naturally occurring. There are three types of naturally occurring graphite available commercially: flake graphite, amorphous graphite, and crystalline graphite.

[0088] Flake graphite, as the name suggests, exhibits a flake-like morphology. Amorphous graphite, as the name suggests, is not amorphous but is actually crystalline. Amorphous graphite is available in average sizes from about 5 micrometers to about 10 centimeters. Crystalline graphite usually exhibits a vein-like appearance on its outer surface, hence the name. Crystalline graphite is commercially available in flake form from Asbury Graphite and Carbon Inc Carbons.

[0089] Synthetic graphite can be produced from coke and / or pitch derived from petroleum or coal. Synthetic graphite is purer than natural graphite, but less crystalline. One type of synthetic graphite is electrolytic graphite, which is produced from petroleum coke and coal tar pitch calcined in an electric furnace. Another type of synthetic graphite is produced by heating calcined petroleum pitch at 2800 °C. Synthetic graphite tends to have a lower density, higher porosity, and higher electrical resistance than natural graphite.

[0090] Preferably, the thermally conductive filler has a median average particle size D50 in the range of 0.5 to 500 micrometers. Within this range, filler particles having a D50 size of 1 to 200 μm, preferably 20 to 150 μm, may be advantageously used.

[0091] Preferably, the thermally conductive fillers have a median average particle size D90 in the range of from 1 to 400 micrometers, advantageously from 2 to 200 μm, very advantageously from 5 to 150 μm.

[0092] The D50 and D90 values ​​may be estimated according to ISO standard 13320-1:1999.

[0093] In one embodiment, the thermally conductive filler, and therefore the composition, does not contain particles having a diameter greater than 500 μm, and advantageously does not contain particles having a diameter greater than 400 μm.

[0094] When the carbon-based filler is not composed of 100% carbon, the impurities are preferably selected from the following chemicals: SiO 2 , Fe 2 O 3 , Al 2 O 3 , CaO, MgO, K 2 O, Na 2 O, TiO 2 , MnO or P 2 O 5 .

[0095] According to one embodiment, the BET specific surface area, measured according to ISO 9277:2010, is 2 / g and 300m 2 / g, very advantageously 1.5m 2 / g and 200m 2 / g.

[0096] Preferably, these fillers have an average shape factor greater than 3, advantageously greater than 7 and very advantageously greater than 15.

[0097] Scanning electron microscopy allows the observation and visual assessment of the morphology of compounds. Morphometry based on video recording and image analysis makes it possible to access quantifiable parameters characteristic of the particle morphology. Various commercially available devices exist: by way of example, mention may be made of the Morphologi G2 instrument from Malvern, the Camsizer instrument from Retsch and the Alpaga 500 Nano instrument from Occhio, which are described on the Internet pages www.malvern.com, www.retsch-technology.com and also www.occhio.be.

[0098] Using an Alpaga 500 Nano instrument, 10,000 particles are acquired for each sample tested, and elongation and blunting parameters are calculated for each particle.

[0099] The mathematical tools used for its calculation are developed in the doctoral thesis of E. Pirard (University of Liège, 1993, 253 pages) entitled "Morphometrie euclidienne des figures planes. Applications a l'analysse des materiaux granulaires" [Euclidean morphology of plane figures. Applications in the analysis of granular materials]. The document entitled "The descriptive and quantitative representation of particle shape and morphology" is published as ISO / DIS 9276-6.

[0100] Preferably, the thermally conductive filler has a density of less than 3 kg / l, advantageously less than 2.5 kg / l, very advantageously less than 2.3 kg / l. The density is measured according to ISO standard 787-10:1993.

[0101] Preferably, when the thermally conductive filler is expanded graphite, it is present in the composition according to the invention in a content between 5% and 17% by weight relative to the total weight of the composition. Preferably, the expanded graphite is the only thermally conductive filler of the composition.

[0102] Preferably, the thermally conductive filler, when not expanded graphite, is present in the composition according to the invention in a content between 5% and 35% by weight relative to the total weight of the composition. Preferably, the thermally conductive filler, when not expanded graphite, is present in the composition in a content between 10% and 29.90%, preferentially between 15% and 25%.

[0103] Additives The composition according to the invention may comprise at least one additive.

[0104] The additives may be selected from catalysts, antioxidants, heat stabilizers, UV stabilizers, light stabilizers, lubricants, flame retardants, nucleating agents, chain extenders, and dyes.

[0105] Advantageously, the composition as defined above further comprises additives chosen from antioxidants, UV stabilizers, heat stabilizers, plasticizers, nucleating agents, tackifiers, impact modifiers, flame retardants, antistatic agents, reinforcing agents, lubricants, organic and inorganic fillers, optical brighteners, release agents, pigments, dyes, catalysts and mixtures thereof.

[0106] The composition may contain between 0 and 10% by weight of the additive, preferably between 0.1 and 5% by weight of the additive, relative to the total weight of the composition.

[0107] The composition contains less than 20%, very advantageously less than 10%, preferably less than 5%, of components having a density greater than 3.

[0108] Within the meaning of the present invention, the term "ingredients" is understood to mean any product, whatever its chemical nature, present in the composition according to the invention. In other words, less than 20% of fillers and additives that may be present in the composition must have a density greater than 3.

[0109] According to a particular embodiment of the invention, the composition comprises a copolyamide as defined above as matrix, from 3% to 35% by weight, relative to the total weight of the composition, of at least one thermally conductive filler whose carbon atom content is between 80% and 100%, and from 0% to 10% by weight of additives, relative to the total weight of the composition, the composition comprising less than 20% of components with a density (measured according to ISO 787-10:1993) greater than 3.

[0110] The melt viscosity of the composition is preferably between 0.5 and 400 Pa.s, advantageously between 2 and 200 Pa.s, and very advantageously between 3 and 100 Pa.s. The melt viscosity is measured at 210° C. using a Brookfield rheometer using an SC 4-27 module according to ASTM standard D3236-88 (2009).

[0111] Thus, preferably, the composition according to the invention has a surface resistivity measured according to IEC standard 62631-3-2 (2015) of greater than 10 Ω.m, preferably greater than 10 Ω.m. In other words, the composition is electrically insulating.

[0112] The composition according to the invention preferably has an elongation at break (ISO 527 tensile test at 23° C.) of greater than 10%, advantageously greater than 30%.

[0113] The composition preferably has a tensile modulus at 23° C., measured on a 1A test specimen (ISO 527), of between 100 and 5000 MPa, advantageously between 200 and 4000 MPa and very advantageously between 200 and 800 MPa.

[0114] Preferably, the composition has a dielectric constant (Dk) measured at 1 GHz between 2 and 6, advantageously between 2.5 and 4, and a dielectric loss tangent (tan δ) between 0.001 and 0.1, advantageously between 0.005 and 0.05.

[0115] The dielectric constant and dissipation factor are measured on a 100*100*2mm sheet at a frequency of 1GHz according to ASTM standard D150.

[0116] The composition according to the invention has a thermal conductivity, measured according to ASTM standard D5930-17, between 0.9 and 4 W / mK, advantageously between 1 W / mK and 3 W / mK.

[0117] The present invention also relates to an encapsulation method using the composition according to the invention.

[0118] The compositions according to the invention are used for the manufacture of moulded articles by low pressure injection moulding. This injection moulding cycle may comprise the following different steps: a) After the parts to be bonded are inserted, the mold is closed; b) injecting the molten composition according to the invention into a mold to a pressure between 0.5 and 50 bar, optionally applying a holding pressure; c) cooling and solidifying the molding composition; d) Open the mould; e) Removing the injection molded part from the mold.

[0119] Low pressure injection moulding processes generally operate in the range of 2 to 40 bar, with temperatures between 160°C and 250°C.

[0120] Thus, the composition according to the invention can be injected at low pressure, ie at a pressure of less than 100 bar, preferably less than 50 bar.

[0121] use According to yet another aspect, the present invention relates to the use of the composition according to the invention as defined above for the encapsulation of electronic devices, also called overmolding or molding, preferably located under the engine hood of a motor vehicle or in medical equipment.

[0122] The present invention also relates to the use of the composition according to the invention as defined above for the manufacture of a hot melt adhesive in the form of a web, a film, a granule, a filament, a grid or a powder.

[0123] The melt viscosity of the composition is between 0.5 and 400 Pa.s, advantageously between 2 and 200 Pa.s, and very advantageously between 3 and 100 Pa.s. The melt viscosity is measured on powder at 210°C using a Brookfield rheometer using the SC 4-27 module according to ASTM standard D3236-88 (2009).

[0124] The present invention is illustrated by the following figures and examples which are in no way limiting. EXAMPLES

[0125] 1. Preparation and Measurement of Composition The components shown in Tables 1 and 2 below were melt-mixed to obtain compositions.

[0126] All the above compositions were produced using an 18 mm ZSK twin screw extruder (Coperion). The barrel temperature was set at 210° C., the screw speed was 280 rpm, and the flow rate was 8 kg / h. The compositions were then dried under vacuum at 80° C. to a moisture content of less than 0.04%.

[0127] 1A specimens (according to ISO standard 527) and 5 mm plaques were produced by injection molding using a Battenfeld® BA800 CDC press using an unpolished mold. The following parameters were used during injection: - Barrel temperature: 120℃. - Nozzle temperature: 150℃. - Mold temperature: 15℃. - Cycle time: 60 seconds. was applied. Table 1: TIFF2024536476000002.tif68170

[0128] In Table 1 above: 1 Polyamide is 31mol% C 10 represents a hot melt adhesive polyamide composed of a diacid, 19% Pripol® 1013, 25 mol % piperazine, 6.6 mol % Jeffamine® D-2000, and 18.4 mol % ethylenediamine.

[0129] The Tg of the polyamide is −22° C. as measured by DSC and the viscosity is 9 Pa.s at 200° C. as measured according to ASTM standard D3236-88 (2009).

[0130] The formula for Polyamide A is 210 / pip10 / pip36 / POP36, where pip is piperazine and POP is Jeffamine® D-2000. The nomenclature used to define polyamides is described in ISO standard 1874-1:1992 "Plastics - Polyamide (PA) moulding and extrusion materials - Part 1: Designation", particularly page 3 (Tables 1 and 2).

[0131] 2 Expandable graphite refers to graphite sold by Imerys having the brand name Timrex® C Therm HD max and having a density of less than 2.5.

[0132] 3 Expandable graphite refers to graphite sold by Imerys having the brand name Timrex® M100 and having a density of less than 2.5. Table 2: TIFF2024536476000003.tif104170

[0133] In Table 2 above: 1 Polyamide A is 31 mol% C 10 represents a hot melt adhesive polyamide composed of a diacid, 19% Pripol® 1013, 25 mol % piperazine, 6.6 mol % Jeffamine® D-2000, and 18.4 mol % ethylenediamine.

[0134] 6 Polyamide B represents a PA6 having a melting point of 220° C. and a melt viscosity of 325 Pa.s at 280° C., measured according to ASTM standard D3236-88 (2009).

[0135] 3 The graphite has the brand name Timrex® M100, sold by Imerys, and represents a graphite having a density of less than 2.5.

[0136] 2 Expandable graphite is sold by Imerys under the name C Therm® HD max, having a density of less than 2.5.

[0137] 4 The aluminium oxide is sold under the name Martoxid®™ 4250 by Martinswerk, which has a density of greater than 3.

[0138] 5 The boron nitride is sold by Henze under the name 19-E-01-HF-02, having a density of 2.3.

[0139] In these examples, the thermal and electrical properties of these compositions were measured according to the following methods: The homogeneity of these molten compositions was also evaluated.

[0140] Thermal Conductivity Thermal conductivity was measured at 23° C. on 100*100*5 mm plaques using a Neotim® FP2C instrument equipped with a hot wire according to ASTM standard D5930-17.

[0141] resistivity Measurements according to standard IEC 62631-3-2 (2015) were carried out with a Sefelec® M1500P equipped with an 8009 cell under the following conditions: - Potential difference: 40V - Charging time before scanning: 60 seconds - Plaque thickness: 100*100*5mm It was carried out in.

[0142] Homogeneity and Sedimentation Granules of the composition are placed in a test tube that is immersed for 30 minutes in a silicone oil bath at 15° C. above the Tm of the copolyamide. At the end of the 30 minutes, the tube is placed in ambient air until the composition solidifies. The tube is then broken to recover the composition.

[0143] If settling is severe, an accumulation of filler at the bottom of the tube will be observed.

[0144] If this is not the case, the sample is cut in two (the top and bottom of the tube are separated) in order to estimate the density at 23 °C according to ISO 1182-1 of the top and bottom of the sample. If the difference in density is more than 0.3, the settling is considered to be too great.

[0145] 2. Conclusion The results show that the composition according to the invention makes it possible to encapsulate components at low pressure using a melting device. The composition according to the invention shows good thermal conductivity and is electrically insulating while at the same time making it possible to avoid overheating of electronic items, thereby avoiding short circuits.

[0146] Compositions 9 and 10 cannot be used in the overmolding process due to their very high viscosity and melting point.

Claims

1. 1. A hot melt adhesive composition comprising: (i) the following formula (1): X / Y (1) [In the formula, - The unit X is C ６ From C １８ α,ω-aminocarboxylic acids, C ６ From C １８ a semi-crystalline unit obtained by polycondensation of a lactam and a unit selected from (Ca diamine) and (Cb diacid) units, wherein a represents the number of carbon atoms in the diamine and b represents the number of carbon atoms in the diacid, a is between 2 and 18, and b is between 4 and 18, and the Ca diamine and the Cb diacid are saturated or unsaturated, linear or branched, aliphatic or alicyclic; the Y unit is a unit obtained by polycondensation of (Cd diamine)-(Ce diacid) units, where d represents the number of carbon atoms in the diamine and e represents the number of carbon atoms in the diacid, d and e are between 2 and 48, the Cd diamine and the Ce diacid are saturated or unsaturated, linear or branched, aliphatic or alicyclic, and the Cd diamine may be a polyetheramine; the units Y exhibit a Tg of less than 30° C., advantageously less than 20° C., very advantageously less than 0° C., The copolyamide exhibits a melt viscosity at 200°C, measured according to ASTM standard D3236-88 (2009), between 0.5 and 300 Pa s; The copolyamide constitutes the matrix of the composition. at least one semi-crystalline aliphatic copolyamide comprising at least two units corresponding to (ii) from 3% to 35% by weight, relative to the total weight of the composition, of at least one thermally conductive filler, the carbon atom content of which is between 80% and 100% relative to the number of atoms constituting the filler; Including, the composition contains less than 20% of components with a density greater than 3; Hot melt adhesive compositions.

2. 10. The composition of claim 1, wherein the thermally conductive filler is selected from natural graphite, synthetic graphite, expanded graphite, graphene, carbon black, and carbon fiber.

3. 10. The composition of claim 1, wherein the thermally conductive filler exhibits a median average particle size D50 in the range of 0.5 to 500 micrometers.

4. 10. The composition of claim 1, wherein the thermally conductive filler exhibits a median average particle size D90 in the range of 1 to 400 micrometers.

5. The composition of claim 1 , wherein the thermally conductive filler exhibits an average shape factor of greater than 3.

6. 2. The composition according to claim 1, characterized in that it contains less than 10%, preferably less than 5%, of components with a density greater than 3.

7. 2. The composition of claim 1, wherein the copolyamide comprises crystalline units X selected from caprolactam, enantholactam and lauryllactam, 7-aminoheptanoic acid, 11-aminoundecanoic acid and 12-aminododecanoic acid, PA26, PA29, PA210, PA212, PA214, PA218, PA56, PA59, PA510, PA66, PA69, PA610, PA512, PA612, PA514, PA614, PA618, PApip10, PApip12, PA1010, PA1012, PA1014, PA1018, PA1210, PA1212, PA1214 and PA1218.

8. 2. The composition according to claim 1, characterized in that the copolyamide comprises units Y selected from PA236, PA536, PA636, PA1036, PApip36, PApip44, PA244, PA544, PA644, PA1044, PA POP36, PA POP44, PA POP6, PA POP9, PA POP10, PA POP12 or PA POP14, wherein POP is a polyetheramine having a molar mass between 60 g / mol and 2000 g / mol.

9. Copolyamides include PA26, PA29, PA210, PA212, PA214, PA218, PA56, PA59, PA510, PA512, PA66, PA69, PA610, PA612, PA6, PA11, PA12, PA1010, PA1012, PA1212, PApip10, PApip36, PApip44, PA POP40036, PA POP40044, PA POP40010, PA POP4006, PA POP200036, PA POP200044, PA POP200010, PA 2. The composition according to claim 1, characterized in that it comprises at least one of units selected from POP20006, PA3636, PA3644, PA4436, PA4444 and mixtures thereof.

10. 2. The composition according to claim 1, characterized in that the copolyamide is selected from PA6 / 3636, PA11 / 3636, PA12 / 3636 and PA11 / 3636 / pip36.

11. 2. A composition according to claim 1, characterized in that it exhibits a melt viscosity at 200°C ranging from 0.5 to 400 Pa.s, preferably from 2 to 200 Pa.s, and more particularly from 3 to 100 Pa.s at 210°C.

12. 2. The composition according to claim 1, characterized in that it comprises, as the only thermally conductive filler of the composition, expanded graphite in a content of between 5% and 17% by weight relative to the total weight of the composition.

13. Measured according to IEC standard 62631-3-2 (2015) １０ More than 10 Ω.m, preferably 10 １１ 2. The composition of claim 1, characterized in that it exhibits a surface resistivity of greater than Ω.m.

14. 2. The composition according to claim 1, characterized in that it exhibits a thermal conductivity, measured according to ASTM standard D5930-17, of between 0.9 and 4 W / m.K, advantageously between 1 and 3 W / m.K.

15. 10. The composition of claim 1, characterized in that it comprises additives selected from antioxidants, UV stabilizers, heat stabilizers, plasticizers, nucleating agents, tackifiers, impact modifiers, flame retardants, antistatic agents, reinforcing agents, lubricants, organic and inorganic fillers, optical brighteners, mold release agents, pigments, dyes, catalysts and mixtures thereof.

16. 2. The composition according to claim 1, characterized in that it can be injected at a pressure of less than 100 bar, preferably less than 50 bar.

17. 10. Use of the composition according to claim 1 for the encapsulation of electronic devices, preferably located under the engine hood of a motor vehicle or in medical equipment.