Hot melt adhesive composition

Abstract

The present invention relates to a hot melt adhesive composition comprising: i) at least one specific semi-crystalline aliphatic copolyamide, ii) at least one filler having a carbon atom content between 60% and 100% relative to the number of atoms constituting the filler, the carbon-based filler having a D90 median average particle size ranging from 1 to 400 micrometers; iii) at least one electrically insulating filler selected from metal oxides and nitrides; Including, the sum of the carbon-based filler content and the electrically insulating filler content is between 30% and 75% by weight, based on the total weight of the composition; The filler has a D90 median average particle size ranging from 1 to 400 micrometers. The present invention relates to a hot melt adhesive composition. The present invention also relates to processes for their preparation and to their uses.

Description

[Technical Field]

[0001] The present invention relates to a hot melt adhesive composition for the encapsulation of electronic devices, a method for the preparation of such a composition, and its use. [Background technology]

[0002] The use of polyamides as hot melt adhesives for encapsulating electronic and mechanical devices, for example, in the automotive or medical fields, is well known. Specifically, plastic materials are commonly used to protect batteries, whether in automobiles or, on a smaller scale, in the shells of mobile phones. More specifically, the encapsulated substrate can be a metal, such as copper, or a polymer, such as the material that makes up printed circuits. This encapsulation must be carried out at low pressure to avoid damaging the molded parts.

[0003] Furthermore, these materials must be electrically insulating to avoid the possibility of short circuits, and, if the battery is an enclosed element, they must also be thermally conductive to allow the heat generated during use to be dissipated.

[0004] At the assembly level, the encapsulation of the components must be carried out at low pressure so as not to damage the parts being molded. Encapsulation is a delicate process: the material that allows the encapsulation of the parts is melted. It is then gently deposited at high temperature on the elements to be encapsulated. The pressure of the molten material at the nozzle outlet is described as low pressure. The term "wetting" is used to define this encapsulation. In fact, if the pressure at the nozzle outlet is too high, the force on the molten material can damage the parts to be encapsulated.

[0005] Several low-pressure injection processes are known for encapsulating parts. A process called "epoxy potting" has the disadvantage of being relatively time-consuming, resulting in low productivity due to its relatively slow reaction time. Chemical vapor deposition processes have their own uses in the field of encapsulation. However, this process is known to be dangerous.

[0006] Therefore, new materials are needed that should meet specific physicochemical properties and allow for easier, faster and more reliable low-pressure encapsulation processes.

[0007] Therefore, there is a real need to provide a polymer that combines all the above mentioned properties, namely thermal conductivity, low viscosity, good mechanical properties and good adhesive properties. Summary of the Invention

[0008] The non-reactive nature of the compositions of the present invention allows for high productivity combined with improved thermal conductivity, adhesive properties and low viscosity, allowing for low pressure encapsulation of fragile objects, part aesthetics, excellent mechanical properties and a melting point below 220°C are also important.

[0009] The present invention provides a hot melt adhesive composition comprising: i) Formula (1) below: X / Y(1) [- units X are semi-crystalline units obtained by polycondensation of units selected from C6 to C18 α,ω-aminocarboxylic acids, C6 to C18 lactams and (Ca diamine)(Cb diacid) units, where a represents the number of carbon atoms of the diamine and b represents the number of carbon atoms of the diacid, a is between 2 and 18 and b is between 4 and 18, and Ca diamine and Cb diacid are saturated or unsaturated, linear or branched, aliphatic or alicyclic, - the Y unit is a unit obtained by polycondensation of (Cd diamine)(Ce diacid) units, where d represents the number of carbon atoms in the diamine and e represents the number of carbon atoms in the diacid, d and e are between 2 and 48, the Cd diamine and the Ce diacid are saturated or unsaturated, linear or branched, aliphatic or alicyclic, and the Cd diamine may be a polyetheramine; Units Y have a Tg of less than 30° C., advantageously less than 20° C., very advantageously less than 0° C., The copolyamide has a melt viscosity of between 0.5 and 300 Pa.s at 200°C, measured according to ASTM standard D3236-88(2009), The copolyamide constitutes the matrix of the composition. at least one semi-crystalline aliphatic copolyamide comprising at least two units corresponding to ii) at least one carbon-based filler, the carbon atom content of which is between 60% and 100% relative to the number of atoms constituting the filler; iii) at least one electrically insulating filler selected from metal oxides and nitrides; Including, the sum of the carbonaceous filler content and the electrically insulating filler content is between 30% and 75% by weight, based on the total weight of the composition; the filler has a D90 median average particle size in the range of 1 to 400 micrometers; The present invention relates to a hot melt adhesive composition.

[0010] The present invention also relates to a process for the preparation of the composition according to the invention.

[0011] The invention then relates to the use of the composition for encapsulating an electronic device. DETAILED DESCRIPTION OF THE INVENTION

[0012] The invention will now be described in more detail, but in a non-limiting manner.

[0013] Within the meaning of the present invention, the term "hot melt" is understood to mean the ability of a composition to melt under the influence of heat.

[0014] In the specification, all percentages are mole % unless otherwise indicated.

[0015] Within the meaning of the present invention, the expression "between... and..." is understood to mean that the boundaries are included in the stated range.

[0016] Copolyamide The copolyamides present in the composition according to the invention are semicrystalline and aliphatic.

[0017] The expression "semicrystalline copolyamide" covers copolyamides that exhibit both a glass transition temperature Tg and a melting temperature Tm, which can be determined according to ISO 11357-2:2013 and 11357-3:2013, respectively.

[0018] The nomenclature used to define polyamides is described in ISO standard 1874-1:1992 "Plastics - Polyamide (PA) molding and extrusion materials - Part 1: Designation," particularly page 3 (Tables 1 and 2), and is well known to those skilled in the art. In the PAL notation, PA denotes polyamide, and L denotes the number of carbon atoms in the amino acid or lactam. Thus, polyamides are obtained by polycondensation of amino acids or lactams containing L carbon atoms. In the PAMN notation, M denotes the number of carbon atoms in the diamine, and N denotes the number of carbon atoms in the diacid.

[0019] The semi-crystalline aliphatic copolyamide comprises at least two units corresponding to formula (1): X / Y(1) [In formula: - units X are semi-crystalline units obtained by polycondensation of units chosen from C6 to C18 α,ω-aminocarboxylic acids, C6 to C18 lactams and (Ca diamine)(Cb diacid) units, where a represents the number of carbon atoms of the diamine and b represents the number of carbon atoms of the diacid, a is between 2 and 18 and b is between 4 and 18, and Ca diamine and Cb diacid are saturated or unsaturated, linear or branched, aliphatic or alicyclic, - the Y unit is a unit obtained by polycondensation of (Cd diamine)(Ce diacid) units, where d represents the number of carbon atoms in the diamine and e represents the number of carbon atoms in the diacid, d and e are between 2 and 48, the Cd diamine and the Ce diacid are saturated or unsaturated, linear or branched, aliphatic or alicyclic, and the Cd diamine may be a polyetheramine; Unit Y has a Tg of less than 30° C., advantageously less than 20° C., and very advantageously less than 0° C. Including, The copolyamide has a melt viscosity of between 0.5 and 300 Pa.s at 200°C, measured according to ASTM standard D3236-88(2009), The copolyamide constitutes the matrix of the composition.

[0020] Advantageously, the polyamide of formula (1) has a ratio of the number of carbon atoms to the number of nitrogen atoms (denoted C / N) greater than or equal to 8.

[0021] Within the meaning of the present invention, the term "semicrystalline units" is understood to mean polyamides having a melting temperature (Tm) in DSC according to standard ISO 11357-3:2013 and an enthalpy of crystallization in the cooling phase in DSC at a rate of 5 K / min, measured according to standard ISO 11357-3 of 2013, of greater than 15 J / g, preferably greater than 30 J / g.

[0022] The units X may result from the polycondensation of one or more C6 to C12 α,ω-aminocarboxylic acids. Preferably, the α,ω-aminocarboxylic acids are selected from 7-aminoheptanoic acid, 11-aminoundecanoic acid and 12-aminododecanoic acid.

[0023] The units X may result from the polycondensation of one or more C6 to C12 lactams. Preferably, the lactams are selected from caprolactam, enantholactam and lauryllactam.

[0024] The units X may result from the polycondensation of (Ca diamine).(Cb diacid) units, where a represents the number of carbon atoms in the diamine and b represents the number of carbon atoms in the diacid, a is between 2 and 18, and b is between 4 and 18. More particularly, b is between 5 and 18.

[0025] The Ca diamine may be selected from linear or branched aliphatic diamines or cycloaliphatic diamines.

[0026] When the Ca diamine is aliphatic and linear and of formula H2N-(CH2)a-NH2, it is preferentially chosen from ethylenediamine (a=2), butanediamine (a=4), pentanediamine (a=5), hexanediamine (a=6), heptanediamine (a=7), octanediamine (a=8), nonanediamine (a=9), decanediamine (a=10), undecanediamine (a=11), dodecanediamine (a=12), tridecanediamine (a=13), tetradecanediamine (a=14), hexadecanediamine (a=16), octadecanediamine (a=18) or octadecanediamine (a=18).

[0027] When the Ca diamine is aliphatic and branched, it may contain one or more methyl or ethyl substituents in the main chain and may be advantageously selected, for example, from 2,2,4-trimethyl-1,6-hexanediamine, 2,4,4-trimethyl-1,6-hexanediamine, 2-methyl-1,5-pentanediamine or 2-methyl-1,8-octanediamine.

[0028] The Ca diamine, when cycloaliphatic, may be selected from piperazine (a=4) and aminoethylpiperazine (a=6), hereinafter designated pip.

[0029] Preferably, the Ca diamine is selected from ethylene diamine, hexamethylene diamine, decanediamine and piperazine.

[0030] The Cb diamine may be selected from linear or branched aliphatic diacids or cycloaliphatic diacids.

[0031] Throughout this specification, the expressions "diacid," "carboxylic diacid," and "dicarboxylic acid" refer to the same product.

[0032] The Cb diacid, when aliphatic, may be selected from adipic acid (b=6), heptanedioic acid (b=7), octanedioic acid (b=8), azelaic acid (b=9), sebacic acid (b=10), undecanedioic acid (b=11), dodecanedioic acid (b=12), brassylic acid (b=13), tetradecanedioic acid (b=14), hexadecanedioic acid (b=16), octadecanedioic acid (b=18) or octadecenedioic acid (b=18).

[0033] When the diacid is alicyclic, it may contain the following carbon skeleton: norbornyl, cyclohexyl, dicyclohexyl, or dicyclohexylpropane.

[0034] Preferably, the units X are selected from caprolactam, enantholactam and lauryllactam, 7-aminoheptanoic acid, 11-aminoundecanoic acid and 12-aminododecanoic acid, PA26, PA29, PA210, PA212, PA214, PA218, PA56, PA59, PA510, PA66, PA69, PA610, PA512, PA612, PA514, PA614, PA618, PApip10, PApip12, PA1010, PA1012, PA1014, PA1018, PA1210, PA1212, PA1214 and PA1218. More particularly, the units X are selected from caprolactam, lauryllactam, 11-aminoundecanoic acid, PA26, PA29, PA210, PA212, PA214, PA218, PA59, PA510, PA69, PA610, PA512 and PA612.

[0035] Preferably, unit X is selected from an amino acid and a lactam or PA26, PA29, PA210, PA212, PA214, PA218, PA59, PA510, PA66, PA69, PA610, PA512 or PA612; more particularly, unit X is selected from an amino acid and a lactam having a number of carbon atoms greater than 6. More particularly, unit X is PA6, PA11, PA12, PA210, PA212, PA69, PA610 or PA612.

[0036] The Y unit is obtained by polycondensation of (Cd diamine).(Ce diacid) units, where d represents the number of carbon atoms in the diamine and e represents the number of carbon atoms in the diacid, and d and e are between 2 and 48, and the Cd diamine and the Ce diacid are saturated or unsaturated, linear or branched aliphatic, and the Cd diamine is selected from aliphatic diamines, alicyclic diamines and polyether amines.

[0037] The Cd diamines may be selected from linear or branched aliphatic or cycloaliphatic diamines, as defined above for the Ca diamines.

[0038] The Cd diamines may also be selected from eicosane diamines (a=20) and docosane diamines (a=22).

[0039] Cd diamines may also result from the amination of polymerized fatty acids, as defined below: Cd diamines are C36 or C44 diamines.

[0040] The Cd diamine may also be selected from bis(3,5-dialkyl-4-aminocyclohexyl)methane, bis(3,5-dialkyl-4-aminocyclohexyl)ethane, bis(3,5-dialkyl-4-aminocyclohexyl)propane, bis(3,5-dialkyl-4-aminocyclohexyl)butane, bis(3-methyl-4-aminocyclohexyl)methane (BMACM or MACM), bis(p-aminocyclohexyl)methane (PACM), and isopropylidenedi(cyclohexylamine) (PACP), isophoronediamine (f=10), piperazine (f=4) (hereinafter referred to as pip), or aminoethylpiperazine. It may also contain the following carbon skeleton: norbornylmethane, cyclohexylmethane, dicyclohexylpropane, di(methylcyclohexyl), or di(methylcyclohexyl)propane. A non-exhaustive list of these alicyclic diamines is given in "Cycloaliphatic Amines" (Encyclopedia of Chemical Technology, Kirk-Othmer, 4th Edition (1992), pp. 386-405).

[0041] The Cd diamine can also be a polyetheramine, i.e., a polyoxyalkylene diamine. Preferably, it is a polyoxyalkylene chain with an amine group at the chain end. The polyoxyalkylene chain preferably contains an oxyethylene (POE), oxypropylene (POP), or oxytetramethylene (POTM) group, either alone or in admixture. When these groups are present in admixture, a mixture of POE and POP, or POTM and POP, is preferred.

[0042] These compounds can be obtained by cyanoacetylation of α,ω-dihydroxylated aliphatic polyoxyalkylenes, known as polyetherdiols. The polyetheramines are preferably selected from commercially available products, in particular those sold by Huntsman under the Jeffamine® and Elastamine® brands (e.g., Jeffamine® D400, D2000, ED 2003 or XTJ 542, Elastamine® RT 1000, RP 405 or RP 2009) or by BASF under the Baxxodur® brand (e.g., Baxxodur® EC 302, EC 301, EC 303 or EC 311).

[0043] Preferably, the number average molecular weight of the polyetheramine is 60 g.mol -1 and 2000 g.mol -1 Between 80g.mol and more specifically -1 and 1500 g.mol -1 between 100 g.mol and even more preferably between 100 g.mol -1 and 500 g.mol -1 It is between.

[0044] Cd diamines may also result from the amination of polymerized fatty acids, as defined below. These diamines are commercially available from Cognis Corporation (BASF) under the brand name Versamine® and from Croda under the trade name Priamine®.

[0045] The Ce diacids may be selected from linear or branched aliphatic or cycloaliphatic diacids, as defined above for the Cb diacids.

[0046] The Ce diacid may also be selected from eicosane diacid (b=20), docosane diacid (b=22) and fatty acid dimers.

[0047] Ce diacids can be derived from polymerized fatty acids. These polymerized fatty acids refer to compounds produced by the coupling reaction of unsaturated fatty acids, resulting in a mixture of products with two acid functional groups (denoted as acid dimers) or three acid functional groups (denoted as acid trimers). This coupling can be a combination or condensation reaction of two moles of unsaturated monocarboxylic acids, where the monoacids can be the same or different. This dimerization reaction can be carried out by catalytic or non-catalytic polymerization methods according to known methods. For example, C36 dimer diacids can be obtained by dimerization of unsaturated C18 monoacids such as oleic acid, linoleic acid, linolenic acid, and mixtures thereof. These mixtures are found, for example, in tall oil. Typically, these mixtures contain primarily dimers, with smaller amounts of monomers, trimers, and oligomers. After separation, the fatty acid dimers are obtained primarily as a mixture of 75% to 98% or more, particularly with the corresponding monomers "1.5-2" and trimers.

[0048] Dimeric diacids can be derived from C14 myristoleic acid, C16 palmitoleic acid, C16 sapienic acid, C18 oleic acid, C18 elaidic acid, C18 transvacenic acid, C18 linoleic acid, C18 linolelaidic acid, C18 α-linolenic acid, C18 γ-linolenic acid, C20 11-eicosenoic acid, C20 eicosapentaenoic acid, C20 dihomo-γ-linolenic acid, C20 arachidonic acid, C22 erucic acid, C22 clupanodonic acid, C22 docosahexaenoic acid, C24 nervonic acid, and mixtures thereof.

[0049] Polymerized fatty acids are commercially available and in particular products sold by Croda under the trade name Pripol® can be used, but also products sold by Cognis under the trade name Empol®, or products sold by Kraton under the trade name Unydime® or products sold by Oleon under the trade name Radiacid® can also be used.

[0050] The fatty acid dimer can then be converted to an amine dimer by converting two of the acid functional groups to an amine functional group, or to an amino acid dimer by converting one of the acid functional groups to an amine functional group.

[0051] Preferably, the diacids used in unit Y are acid dimers, more particularly C36 and C44 dimers are used.

[0052] Preferably, the units Y are selected from PA236, PA536, PA636, PA1036, PA pip36, PA pip44, PA244, PA544, PA644, PA1044, PA POP36, PA POP44, PA POP6, PA POP9, PA POP10, PA POP12 or PA POP14, POP being a polyetheramine with a molar mass between 60 g / mol and 2000 g / mol.

[0053] The units Y of the copolyamide according to the invention preferably have a Tg of less than 30° C., advantageously less than 0° C. The glass transition temperatures mentioned can be determined by differential scanning calorimetry (DSC) in accordance with ISO standard 11357-2:2013, Plastics - Differential Scanning Calorimetry (DSC) Part 2. The heating and cooling rates are 20° C. / min.

[0054] The copolyamide according to the invention comprises from 30 mol % to 99.5 mol % of units X and from 0.5 mol % to 70 mol % of units Y, preferably from 40 mol % to 98 mol % of units X and from 2 mol % to 60 mol % of units Y, and more particularly from 50 mol % to 90 mol % of units X and from 10 mol % to 50 mol % of units Y.

[0055] The mole percentage of units X and Y is measured, for example, by calculating the percentage of moles of the monomer that constitutes unit X relative to the total number of moles of all the monomers that constitute the copolyamide, i.e., X and Y. This is done excluding the chain limiter, and does not count excess diamines or diacids, according to the following formula: TIFF2024537888000001.tif24170 shows the calculation.

[0056] The copolyamides according to the invention have a melt viscosity, measured according to ASTM standard D3236-88(2009), of between 0.5 and 300 Pa.s at 200° C., preferably between 0.5 and 200 Pa.s, more preferably from 1 to 100 Pa.s at 200° C., and even more particularly from 2 to 30 Pa.s at 200° C. More particularly, the melt viscosity is measured at 200° C. using a Brookfield rheometer using an SC 4-27 module according to ASTM standard D3236-88(2009).

[0057] The copolyamides according to the invention preferably have a Tg below 20° C., advantageously below 0° C. The stated glass transition temperatures can be determined by differential scanning calorimetry (DSC) in accordance with ISO standard 11357-2:2013, Plastics - Differential Scanning Calorimetry (DSC) Part 2. The heating and cooling rates are 20° C. / min.

[0058] Preferably, the copolyamide according to the invention comprises at least one unit selected from PA26, PA29, PA210, PA212, PA214, PA218, PA56, PA59, PA510, PA512, PA66, PA69, PA610, PA612, PA6, PA11, PA12, PA1010, PA1012, PA1212, PA pip10, PA pip36, PA pip44, PA POP40036, PA POP40044, PA POP40010, PA POP4006, PA POP200036, PA POP200044, PA POP200010, PA POP20006, PA3636, PA3644, PA4436, PA4444 and mixtures thereof.

[0059] Preferably, the copolyamides according to the invention have the following structures: PA26 / pip36, PA210 / pip36, PA212 / pip36, PA214 / pip36, PA218 / pip36, PA59 / pip36, PA510 / pip36, PA512 / pip36, PA610 / pip36, PA612 / pip36, PA6 / pip36, PA1010 / pip36, PA1012 / pip36, PA1212 / pip36, PA26 / pip44, PA210 / pip44, PA212 / pip44, PA214 / pip44, PA218 / pip p44, PA59 / pip44, PA510 / pip44, PA512 / pip44, PA610 / pip44, PA612 / pip44, PA6 / pip44, PA1010 / pip44, PA1012 / pip44, PA1212 / pip44, PA26 / POP4003 6, PA210 / POP40036, PA212 / POP40036, PA214 / POP40036, PA218 / POP40036, PA59 / POP40036, PA510 / POP40036, PA512 / POP40036, PA610 / POP40036, PA61 2 / POP40036, PA6 / POP40036, PA1010 / POP40036, PA1012 / POP40036, PA1212 / POP40036, PA26 / POP40010, PA210 / POP40010, PA212 / POP40010, PA214 / PO P40010, PA218 / POP40010, PA59 / POP40010, PA510 / POP40010, PA512 / POP40010, PA610 / POP40010, PA612 / POP40010, PA6 / POP40010, PA1010 / POP40010 , PA1012 / POP40010, PA1212 / POP40010, PA26 / POP4006, PA210 / POP4006, PA212 / POP4006, PA214 / POP4006, PA218 / POP4006, PA59 / POP4006, PA510 / POP 4006, PA512 / POP4006, PA610 / POP4006, PA612 / POP4006, PA6 / POP4006, PA1010 / POP4006, PA1012 / POP4006, PA1212 / POP4006, PA26 / 3636, PA210 / 3636,PA212 / 3636、PA214 / 3636、PA218 / 3636、PA59 / 3636、PA510 / 3636、PA512 / 3636、PA610 / 3636、PA612 / 3636、PA6 / 3636、PA1010 / 3636、PA1012 / 3636、PA1212 / 3636、PA26 / 3636、PA210 / 3636、PA212 / 3636、PA214 / 3636、PA218 / 3636、PA59 / 3636、PA510 / 3636、PA512 / 3636、PA610 / 3636、PA612 / 3636、PA6 / 3636、PA1010 / 3636、PA1012 / 3636、PA1212 / 3636、PA26 / POP200036、PA210 / POP200036、PA212 / POP200036、PA214 / POP200036、PA218 / POP200036、PA59 / POP200036、PA510 / POP200036、PA512 / POP200036、PA610 / POP200036、PA612 / POP200036、PA6 / POP200036、PA1010 / POP200036、PA1012 / POP200036、PA1212 / POP200036、PA26 / pip36 / POP40036、PA210 / pip36 / POP40036、PA212 / pip36 / POP40036、PA214 / pip36 / POP40036、PA218 / pip36 / POP40036、PA59 / pip36 / POP40036、PA510 / pip36 / POP40036、PA512 / pip36 / POP40036、PA610 / pip36 / POP40036、PA612 / pip36 / POP40036、PA6 / pip36 / POP40036、PA1010 / pip36 / POP40036、PA1012 / pip36 / POP40036、PA1212 / pip36 / POP40036、PA26 / pip36 / POP200036、PA210 / pip36 / POP200036、PA212 / pip36 / POP200036、PA214 / pip36 / POP200036、PA218 / pip36 / POP200036、PA59 / pip36 / POP200036、PA510 / pip36 / POP200036、PA512 / pip36 / POP200036、PA610 / pip36 / POP200036、PA612 / pip36 / POP200036, PA6 / pip36 / POP200036, PA1010 / pip36 / POP200036, PA1012 / pip36 / POP200036, PA1212 / pip36 / POP200036, PA26 / pip36 / POP4006, PA210 / pip36 / POP4006, PA212 / pip36 / POP4006, PA214 / pip36 / POP4006 , PA218 / pip36 / POP4006, PA59 / pip36 / POP4006, PA510 / pip36 / POP4006, PA512 / pip36 / POP4006, PA610 / pip36 / PO P4006, PA612 / pip36 / POP4006, PA6 / pip36 / POP4006, PA1010 / pip36 / POP4006, PA1012 / pip36 / POP4006, PA1212 / pi p36 / POP4006, PA26 / pip36 / POP20006, PA210 / pip36 / POP20006, PA212 / pip36 / POP20006, PA214 / pip36 / POP20006 , PA218 / pip36 / POP20006, PA59 / pip36 / POP20006, PA510 / pip36 / POP20006, PA512 / pip36 / POP20006, PA610 / pip36 / POP20006, PA612 / pip36 / POP20006, PA6 / pip36 / POP20006, PA1010 / pip36 / POP20006, PA1012 / pip36 / POP20006, PA1212 / pip36 / POP20006; POP20006 refers to a unit resulting from the condensation of a polyetheramine of the polyoxypropylene type having a molar mass of 2000 g with a C6 diacid.

[0060] Particularly preferably, the copolyamide according to the invention comprises units X chosen from diamine.diacid units and units Y comprising piperazine as Cd diamine and a diacid containing more than 6 carbon atoms as Ce diacid.

[0061] According to another preferred embodiment, the Ce diacid is a C36 or C44 acid dimer.

[0062] According to yet another embodiment, the copolyamide according to the invention comprises units X of the type (Ca diamine).(Cb diacid) containing an average number of carbon atoms per nitrogen atom greater than or equal to 6, and units Y comprising piperazine as Cd diamine and a diacid containing more than 6 carbon atoms as Ce diacid.

[0063] Preferably, the copolyamide according to the invention comprises, as Ce diacid, an acid dimer, or as Cd diamine, a polyetheramine.

[0064] According to a preferred embodiment, the copolyamides according to the invention are selected from the group consisting of PA26 / pip36, PA210 / pip36, PA59 / pip36, PA510 / pip36, PA512 / pip36, PA610 / pip36, PA210 / POP40036, PA59 / POP40036, PA510 / POP40036, PA610 / POP40036, PA210 / POP40010, PA59 / POP4009, PA510 / POP40010, PA26 / POP4006, PA210 / POP4006, PA610 / POP4006, PA26 / pip36 / POP40036, PA210 / pip36 / POP40036, PA510 / pip36 / POP40036, PA610 / pip36 / POP40036, PA6 / pip36 / POP40036, PA210 / pip36 / POP200036, PA59 / pip36 / POP200036, PA510 / pip36 / POP200036, PA512 / pip36 / POP200036, PA610 / pip36 / POP200036, PA210 / pip36 / POP20006, PA610 / pip36 / POP20006

[0065] According to one embodiment of the invention, the copolyamide consists of two units X and Y as defined above.

[0066] According to another preferred embodiment, the copolyamide comprises more than two units X and Y as defined above. Preferably, the copolyamide comprised in the composition according to the invention comprises at least three different units. For example, the copolyamide according to the invention may comprise two units X and one unit Y, one unit X and two units Y, or two units X and two units Y. Preferably, the copolyamide comprised in the composition according to the invention is a terpolyamide or a tetrapolyamide.

[0067] Preferably, the copolyamide according to the invention comprises fatty acid dimers, advantageously in a content of from 1 mol% to 35 mol%, preferably from 2 mol% to 30 mol%, and preferentially from 7 mol% to 25 mol% of fatty acid dimers relative to the total number of moles of the copolyamide.

[0068] Preferably, the copolyamide according to the invention comprises a polyetherdiamine content of between 0.5 and 25 mol%, preferably between 1 and 22 mol%, and preferentially between 1.5 and 14 mol%, relative to the total number of moles of the copolyamide.

[0069] The piperazine content in the copolyamide is preferably less than 40 mol %, advantageously less than 30 mol %, very advantageously less than 20 mol %, relative to the total number of moles of copolyamide.

[0070] Chain limiting agent The copolyamides of the present invention are synthesized conventionally, optionally in the presence of a chain limiter or chain terminator.

[0071] Suitable chain terminators for reacting with the terminal amine functionality can be monocarboxylic acids, anhydrides such as phthalic anhydride, monohalogenated acids, monoesters or monoisocyanates.

[0072] Preferably, monocarboxylic acids are used. These may be selected from aliphatic monocarboxylic acids such as acetic acid, propionic acid, lactic acid, valeric acid, caproic acid, capric acid, lauric acid, tridecylic acid, myristic acid, palmitic acid, stearic acid, pivalic acid, and isobutyric acid; alicyclic acids such as cyclohexanecarboxylic acid; aromatic monocarboxylic acids such as benzoic acid, toluic acid, α-naphthalenecarboxylic acid, β-naphthalenecarboxylic acid, methylnaphthalenecarboxylic acid, and phenylacetic acid; and mixtures thereof. Preferred compounds are fatty acids, in particular acetic acid, propionic acid, lactic acid, valeric acid, caproic acid, capric acid, lauric acid, tridecylic acid, myristic acid, palmitic acid, and stearic acid.

[0073] Suitable chain terminators for reaction with the terminal acid functionality include monoamines, monoalcohols, and monoisocyanates.

[0074] Preferably, monoamines are used, which may be selected from aliphatic monoamines such as methylamine, ethylamine, propylamine, butylamine, hexylamine, octylamine, decylamine, laurylamine, stearylamine, dimethylamine, diethylamine, dipropylamine and dibutylamine; alicyclic amines such as cyclohexylamine and dicyclohexylamine; aromatic monoamines such as aniline, toluidine, diphenylamine and naphthylamine; and mixtures thereof.

[0075] Preferred compounds are butylamine, hexylamine, octylamine, decylamine, laurylamine, stearylamine, cyclohexylamine, and aniline.

[0076] The chain limiter may be a dicarboxylic acid introduced in excess relative to the diamine stoichiometry, or a diamine introduced in excess relative to the diacid stoichiometry.

[0077] According to a preferred embodiment, the copolyamide present in the composition according to the invention is a wholly or partly recycled copolyamide. When the polyamide is recycled, it comprises functional groups resulting from an oxidation reaction selected from imide, alcohol or carboxylic acid functional groups, preferably imide or alcohol functional groups, in a molar ratio relative to amide functional groups that is greater than the molar ratio in the same unrecycled polyamide.

[0078] According to one embodiment, said molar ratio of functional groups resulting from the oxidation reaction, i.e. the sum of the number of moles of imide, acid and alcohol functional groups relative to the number of moles of amide functional groups of the copolyamide, is between 1 / 10000 and 1 / 20.

[0079] This ratio can be measured by calculating the concentration by proton NMR. Copolyamide samples are prepared by dissolving the copolyamide in dichloromethane-d2 with the addition of HFIP (hexafluoroisopropanol).

[0080] In a first alternative, said molar ratio of imide functions is between 1 / 1000 and 1 / 20, in particular between 1 / 500 and 1 / 20, and in particular between 1 / 200 and 1 / 50.

[0081] In a second alternative, said molar ratio of carboxylic acid functions is between 1 / 5000 and 1 / 20, in particular between 1 / 3000 and 1 / 50, and very advantageously between 1 / 500 and 1 / 25.

[0082] In a third alternative, said molar ratio of alcohol functions is between 1 / 1000 and 1 / 20, advantageously between 1 / 1000 and 1 / 25, and very advantageously between 1 / 200 and 1 / 50.

[0083] Preferably, the copolyamide present in the composition has a melting temperature preferably between 10 and 220°C, advantageously between 120 and 200°C, very advantageously between 130 and 180°C.

[0084] The water content of the copolyamide after exposure to 23°C and 50% relative humidity (measurement carried out at equilibrium) is preferably between 0.1 and 1.2% by weight, advantageously 0.15 to 0.7% by weight, relative to the total weight of the copolyamide.

[0085] The copolyamide described above constitutes the matrix of the composition according to the invention.

[0086] Carbon-based fillers The composition according to the invention comprises at least one filler, the carbon atom content of which is between 60% and 100% relative to the number of atoms constituting the filler. Preferably, the filler contains 80% to 100% of carbon atoms, more particularly 94% to 99.99% of carbon atoms relative to the number of atoms constituting the filler.

[0087] The filler may be selected from natural graphite, synthetic graphite, expanded graphite, graphene, carbon black, and carbon fiber. Preferably, the filler is selected from natural graphite, synthetic graphite, and expanded graphite.

[0088] The graphite used in the compositions according to the invention can be synthetic or naturally occurring. There are three types of naturally occurring graphite available commercially: flake graphite, amorphous graphite, and crystalline graphite.

[0089] Flaky graphite, as the name suggests, exhibits a flake-like morphology. Amorphous graphite, as the name suggests, is not amorphous but is actually crystalline. Amorphous graphite is available in average sizes ranging from approximately 5 micrometers to approximately 10 centimeters. Crystalline graphite typically exhibits a vein-like appearance on its exterior, hence the name. Crystalline graphite is commercially available in flake form from Asbury Graphite and Carbon Inc. Carbons.

[0090] Synthetic graphite can be produced from coke and / or pitch derived from petroleum or coal. Synthetic graphite is purer than natural graphite, but less crystalline. One type of synthetic graphite is electrolytic graphite, which is produced from petroleum coke and coal tar pitch calcined in an electric furnace. Another type of synthetic graphite is produced by heating calcined petroleum pitch at 2800°C. Synthetic graphite tends to have lower density, higher porosity, and higher electrical resistance than natural graphite.

[0091] Preferably, the "carbon-based" filler has a D50 median average particle size in the range of 0.5 to 500 micrometers. Within this range, filler particles having a D50 size of 1 to 200 μm, preferably 20 to 150 μm, can be advantageously used.

[0092] Preferably, the carbon-based filler has a D90 average particle size ranging from 1 to 400 micrometers, advantageously from 2 to 200 μm, and very advantageously from 5 to 150 μm.

[0093] The D50 and D90 values ​​can be estimated according to ISO standard 13320-1:1999.

[0094] In one embodiment, the carbon-based filler, and therefore the composition, does not contain particles with a diameter greater than 500 μm, advantageously does not contain particles with a diameter greater than 400 μm.

[0095] When the carbon-based filler is not composed of 100% carbon, the impurities are preferably selected from the following species: SiO2, Fe2O3, Al2O3, CaO, MgO, K2O, Na2O, TiO2, MnO and P2O5.

[0096] According to one embodiment, the BET specific surface area of ​​the carbon-based filler, measured according to ISO 9277:2010, is 2 / g and 300m 2 / g, very advantageously 1.5m 2 / g and 200m 2 / g.

[0097] Preferably, these fillers have an average shape factor greater than 3, advantageously greater than 7 and very advantageously greater than 15.

[0098] Scanning electron microscopy allows the observation and visual assessment of the morphology of compounds. Morphometry based on video recording and image analysis makes it possible to access quantifiable parameters characteristic of the particle morphology. Various commercially available devices exist: by way of example, mention may be made of the Morphologi G2 instrument from Malvern, the Camsizer instrument from Retsch, and the Alpaga 500 Nano instrument from Occhio, which are described on the internet pages www.malvern.com, www.retsch-technology.com and also www.occhio.be.

[0099] Using an Alpaga 500 Nano instrument, 10,000 particles are acquired for each sample tested, and elongation and roundness parameters are calculated for each particle.

[0100] The mathematical tools used for the calculation are developed in E. Pirard's doctoral thesis (1993, University of Liège, 253 pages) entitled "Morphometrie euclidienne des figures planes. Applications a l'analysse des materiaux granulaires [Euclidean morphology of plane figures. Applications in the analysis of granular materials]." The document, entitled "The descriptive and quantitative representation of particle shape and morphology," is published as ISO / DIS 9276-6.

[0101] Preferably, the carbon-based filler has a density of less than 3 kg / L, advantageously less than 2.5 kg / L, very advantageously less than 2.3 kg / L. The density is measured according to ISO standard 787-10:1993.

[0102] Preferably, when the carbon-based filler is an expanded graphite, it is present in the composition according to the invention in a content of 5% and 17% by weight relative to the total weight of the composition. When the carbon-based filler is not an expanded graphite, it is present in the composition according to the invention in a content of 5% and 35% by weight relative to the total weight of the composition. More preferentially, when the carbon-based filler is not an expanded graphite, it is present in the composition according to the invention in a content of 10% and 29.90% by weight, and even more preferentially 10% and 25% by weight, relative to the total weight of the composition.

[0103] Electrically insulating filler The composition according to the invention comprises at least one electrically insulating filler selected from metal oxides and nitrides.

[0104] Preferably, the electrically insulating filler is selected from boron nitride, aluminum nitride, aluminum oxide, magnesium oxide, zinc oxide, aluminosilicates, zirconium oxide, or mixtures thereof. Preferably, the electrically insulating filler is selected from metal oxides, more particularly from aluminum oxide, zinc oxide, and aluminosilicates.

[0105] Advantageously, the composition according to the invention comprises from 17 to 60% by weight, very advantageously from 25 to 55% by weight, very advantageously from 25 to 50% by weight, and even more advantageously from 30 to 50% by weight of electrically insulating filler relative to the weight of the composition according to the invention, and even more advantageously, the composition according to the invention comprises from 40 to 50% by weight of electrically insulating filler relative to the weight of the composition according to the invention.

[0106] In the composition according to the invention, the sum of the contents of carbonaceous filler and electrically insulating filler is between 30% and 75% by weight, preferably between 40% and 65% by weight, relative to the total weight of the composition.

[0107] The filler has a D90 median average particle size ranging from 1 to 400 micrometers.

[0108] In one embodiment, the BET specific surface area of ​​the electrically insulating filler, measured according to ISO standard 9277:2010, is less than 0.1 m 2 / g and 80m 2 / g, advantageously 0.5m 2 / g and 50m 2 / g, very advantageously 0.6m 2 / g and 30m 2 / g.

[0109] It is desirable to use fillers having a D50 median average particle size of about 0.5 to about 200 micrometers. Within this range, electrically insulating fillers having a D50 of 1 to 100 μm, preferably 1.5 to 50 μm, can be advantageously used.

[0110] It is also desirable to use fillers that are largely free of very large particles, and therefore the D90 of the filler should be between 1 and 100 μm, advantageously between 2 and 70 μm.

[0111] In a preferred embodiment, the filler is coated with a size to improve compatibility with the polyamide, which reacts favorably with the polyamide of the present invention. The size may be selected, for example, from aminosilanes, epoxysilanes, or polyurethanes.

[0112] additives The composition according to the invention may comprise at least one additive.

[0113] The additives may be selected from catalysts, antioxidants, heat stabilizers, UV stabilizers, light stabilizers, lubricants, flame retardants, nucleating agents, chain extenders, and dyes.

[0114] Advantageously, the composition as defined above further comprises additives chosen from antioxidants, UV stabilizers, heat stabilizers, plasticizers, nucleating agents, tackifiers, impact modifiers, flame retardants, antistatic agents, reinforcing agents, lubricants, organic and inorganic fillers, optical brighteners, release agents, pigments, dyes, catalysts and mixtures thereof.

[0115] The composition may contain between 0 and 10% by weight of additives, preferably between 0.1 and 5% by weight of additives, relative to the total weight of the composition.

[0116] According to a particular embodiment of the invention, the composition comprises a copolyamide as defined above as matrix, at least one carbon-based filler whose carbon atom content is between 60% and 100% and at least one electrically insulating filler chosen from metal oxides and nitrides, the sum of the carbon-based filler content and the electrically insulating filler content being between 30% and 75% by weight relative to the total weight of the composition, said fillers having a D90 median average particle size ranging from 1 to 400 micrometers.

[0117] Preferably, the composition has a melting point below 220° C., advantageously below 200° C., and very advantageously below 180° C. This low melting point is preferred so as not to damage the part being overmolded.

[0118] The composition advantageously has an elongation at break (ISO 527 tensile test at 23° C.) of more than 10%, advantageously more than 30%. The tensile modulus at 23° C., measured on a 1A test specimen (ISO 527), is preferably between 100 and 5000 MPa, advantageously between 200 and 4000 MPa, very advantageously between 200 and 800 MPa.

[0119] Preferably, the composition has a dielectric constant (Dk) measured at 1 GHz between 2 and 6, advantageously between 2.5 and 4, and a dielectric loss tangent (tanδ) between 0.001 and 0.1, advantageously between 0.005 and 0.05. The dielectric constant and the dielectric loss tangent are measured on a 100*100*2 mm plate at a frequency of 1 GHz according to ASTM standard D150. This low dielectric constant makes it possible to avoid interference with enclosed electronic or electrical equipment.

[0120] The melt viscosity of the composition is advantageously between 0.5 and 400 Pa.s, very advantageously between 2 and 200 Pa.s, preferably between 3 and 100 Pa.s. The melt viscosity is measured at 210°C using a Brookfield rheometer using an SC 4-27 module according to ASTM standard D3236-88 (2009).

[0121] The composition according to the invention preferably has a surface resistivity measured according to IEC standard 62631-3-2 (2015) of greater than 10 Ω.m, preferably greater than 10 Ω.m. In other words, the composition is electrically insulating.

[0122] The composition according to the invention preferably has a thermal conductivity measured according to ASTM standard D5930-17 of between 0.9 and 4 W / mK, advantageously between 1 and 3 W / mK.

[0123] The present invention also relates to an encapsulation method using the composition according to the present invention.

[0124] The compositions according to the invention are used to manufacture molded articles by low-pressure injection molding. This injection molding cycle may comprise the following different steps: a) After the parts to be bonded are inserted, the mold is closed; b) injecting the molten composition according to the invention into a mold to a pressure between 0.5 bar and 50 bar, optionally applying a holding pressure; c) cooling and solidifying the molding composition; d) Opening the mold; e) Removing the injection molded part from the mold.

[0125] Low pressure injection molding processes generally operate in the range of 2 to 40 bar and at temperatures between 160°C and 250°C.

[0126] The composition according to the invention can therefore be injected at low pressure, ie at a pressure of less than 100 bar, preferably less than 50 bar.

[0127] use According to yet another aspect, the present invention relates to the use of the composition according to the invention as defined above for the encapsulation of electronic devices, also called overmoldings or moldings, preferably located under the engine hood of a motor vehicle or in medical equipment.

[0128] The present invention also relates to the use of the composition according to the invention as defined above for the manufacture of a hot melt adhesive in the form of a web, film, granules, filaments, grid or powder.

[0129] The present invention is illustrated by the following figures and examples, which are in no way limiting. [Example]

[0130] 1. Preparation and Measurement of Composition The compositions were obtained by melt-mixing the components listed in Tables 1 and 2 below.

[0131] All of the above compositions were produced using an 18 mm ZSK twin-screw extruder (Coperion). The barrel temperature was set at 210°C, the screw speed was 280 rpm, and the flow rate was 8 kg / h. The compositions were then dried under vacuum at 80°C to a moisture content of less than 0.04%.

[0132] 1A specimens (according to ISO standard 527) and 5 mm plates were produced by injection molding using a Battenfeld BA800 CDC press with an unpolished mold, using the following injection parameters: - Barrel temperature: 120℃. - Nozzle temperature: 150℃. - Mold temperature: 15℃. - Cycle time: 60 seconds. was applied. TIFF2024537888000002.tif80170

[0133] In Table 1 above: 1Polyamide A represents a hot melt adhesive composition composed of 31 mol% C10 diacid, 19% Pripol 1013, 25 mol% piperazine, 6.6 mol% Jeffamine® D 2000, and 18.4 mol% ethylenediamine. Polyamide A has a melting point below 180°C and a melt viscosity of 22 Pa.s at 200°C measured according to ASTM standard D3236-88(2009).

[0134] The Tg of the polyamide is −22° C. as measured by DSC.

[0135] The formula for Polyamide A is 210 / pip10 / pip36 / POP36, where pip is piperazine and POP is Jeffamine® D 2000. The nomenclature used to define polyamides is described in ISO standard 1874-1:1992 "Plastics - Polyamide (PA) molding and extrusion materials - Part 1: Designation", particularly page 3 (Tables 1 and 2).

[0136] 2 Polyamide B represents a PA6 having a melting point of 220° C. and a melt viscosity of 325 Pa.s at 280° C. measured according to ASTM standard D3236-88 (2009).

[0137] 3 Graphite 1 represents graphite with the trade name Timrex® KS 15-600SP sold by Imerys. This grade is characterized by a D90 by TDS of greater than 500 μm.

[0138] 4 Graphite 2 represents graphite with the trade name Timrex® M100 sold by Imerys. This grade is characterized by a D90 of less than 400 μm.

[0139] 5Zinc oxide represents the product with the trade name Silatherm® 1438-800 AST sold by Quarzwerk GmbH.

[0140] 6 The aluminosilicate represents the product with the trade name Silatherm® 1466-100 sold by Quarzwerk GmbH.

[0141] 5 Expanded graphite refers to graphite with the trade name Timrex® C Therm HD max sold by Imerys. TIFF2024537888000003.tif74170

[0142] In Table 2 above: 1 Polyamide A represents a hot melt adhesive composition composed of 31 mol% C10 diacid, 19% Pripol 1013, 25 mol% piperazine, 6.6 mol% Jeffamine® D 2000, and 18.4 mol% ethylenediamine. Polyamide A has a melting point below 180°C and a melt viscosity of 22 Pa.s at 200°C measured according to ASTM standard D3236-88(2009).

[0143] The Tg of the polyamide is −22° C. as measured by DSC.

[0144] The formula for Polyamide A is 210 / pip10 / pip36 / POP36, where pip is piperazine and POP is Jeffamine® D 2000. The nomenclature used to define polyamides is described in ISO standard 1874-1:1992, "Plastics - Polyamide (PA) molding and extrusion materials - Part 1: Designation," particularly page 3 (Tables 1 and 2).

[0145] 2Graphite 2 represents graphite with the trade name Timrex® M100 sold by Imerys. This grade is characterized by a D90 of less than 400 μm.

[0146] 3 Expanded graphite refers to graphite with the trade name Timrex® C Therm HD max sold by Imerys.

[0147] 4 Zinc oxide represents the product with the trade name Silatherm® 1438-800 AST sold by Quarzwerk GmbH.

[0148] 5 The aluminosilicate represents the product with the trade name Silatherm® 1466-100 sold by Quarzwerk GmbH.

[0149] In these examples, various physicochemical properties were tested: Thermal conductivity and elongation at break were measured on plates and on prepared test specimens (dumbbells) according to the following methods.

[0150] thermal conductivity Thermal conductivity was measured at 23°C on a 100*100*5 mm plate using a Neotim FP2C device equipped with a hot wire according to ASTM standard D5930-17.

[0151] Elongation at break: Tensile tests were performed at 23 °C with 1 BA dumbbells (Annex A of ISO Standard 527-2:2012) according to ISO Standard 527-2:2012.

[0152] The appearance of the plate surface was also evaluated.

[0153] Surface appearance: The surface appearance is assessed by touch and visual inspection. The characteristic "smooth" is given to samples whose surfaces are smooth, soft to the touch, and visually flat. The characteristic "granular" is given to samples whose surfaces are granular, rough to the touch, and visually bumpy.

[0154] The ability of the compositions to be used at low pressures was also evaluated: to be able to be used at low pressures without damaging the injection molded part, the composition must have a melt temperature below 220°C and a melt viscosity at 200°C between 0.5 Pa.s and 300 Pa.s, as measured according to ASTM standard D3236-88(2009).

[0155] 2. Conclusion Compositions 1, 3 and 5-8 have all the expected properties, in contrast to composition 2, which is inferior in terms of elongation at break, and composition 4, which cannot be used in the overmolding process due to its viscosity and too high melting point.

Claims

1. 1. A hot melt adhesive composition comprising: i) Formula (1): X / Y (1) [In the formula: - units X are semi-crystalline units obtained by polycondensation of units chosen from C6 to C18 α,ω-aminocarboxylic acids, C6 to C18 lactams and (Ca diamine) (Cb diacid) units, a represents the number of carbon atoms of the diamine and b represents the number of carbon atoms of the diacid, a is between 2 and 18 and b is between 4 and 18, and Ca diamine and Cb diacid are saturated or unsaturated, linear or branched, aliphatic or alicyclic, the Y unit is a unit obtained by polycondensation of (Cd diamine)-(Ce diacid) units, where d represents the number of carbon atoms in the diamine and e represents the number of carbon atoms in the diacid, d and e are between 2 and 48, the Cd diamine and the Ce diacid are saturated or unsaturated, linear or branched, aliphatic or alicyclic, and the Cd diamine may be a polyetheramine; Units Y have a Tg of less than 30° C., preferably less than 20° C., very preferably less than 0° C., The copolyamide has a melt viscosity at 200°C, measured according to ASTM standard D3236-88 (2009), between 0.5 and 300 Pa s; The copolyamide constitutes the matrix of the composition. at least one semi-crystalline aliphatic copolyamide comprising at least two units corresponding to ii) at least one filler, the carbon atom content of which is between 60% and 100% relative to the number of atoms constituting the filler; iii) at least one electrically insulating filler selected from metal oxides and nitrides; Including, the sum of the carbonaceous filler content and the electrically insulating filler content is between 30% and 75% by weight, based on the total weight of the composition; the filler has a D90 median average particle size in the range of 1 to 400 micrometers; Hot melt adhesive compositions.

2. 10. The composition of claim 1, wherein the carbon-based filler has a D50 median average particle size ranging from 0.5 to 500 micrometers.

3. The carbon-based filler has a 1 m ２ / g and 300m ２ / g, and very advantageously 1.5 m ２ / g and 200m ２ 2. The composition of claim 1, characterized in that it has a BET specific surface area of ​​between 1000 and 10000 / g.

4. The electrically insulating filler has a thickness of 0.1 m measured according to ISO 9277:2010 ２ / g and 80m ２ / g, and very advantageously 0.5 m ２ / g and 50m ２ 2. The composition of claim 1, characterized in that it has a BET specific surface area of ​​between 1000 and 10000 / g.

5. 2. The composition according to claim 1, characterized in that it has a melt viscosity of between 0.5 and 400 Pa.s, preferably between 2 and 200 Pa.s, very preferably between 3 and 100 Pa.s.

6. 10 measured according to IEC standard 62631-3-2 (2015) １０ 10. The composition of claim 1, characterized in that it has a surface resistivity of greater than Ω.m.

7. 2. The composition according to claim 1, characterized in that it has a melting point of less than 220°C, preferably less than 200°C, very preferably less than 180°C.

8. Copolyamide is PA26, PA29, PA210, PA212, PA214, PA218, PA56, PA59, PA510, PA5 12, PA66, PA69, PA610, PA612, PA6, PA11, PA12, PA1010, PA1012, PA1212, PA pip10, PA pip36, PA pip44, PA POP40036, PA POP40044, PA POP40010, PA POP4006, PA POP200036, PA POP200044, PA POP200010, PA 2. The composition according to claim 1, characterized in that it comprises at least one of units selected from POP20006, PA3636, PA3644, PA4436, PA4444 and mixtures thereof.

9. 2. The composition of claim 1, wherein the copolyamide comprises a polyetheramine as the Cd diamine or an acid dimer as the Ce diacid.

10. 2. The composition according to claim 1, characterized in that the copolyamide is a terpolyamide or a tetrapolyamide.

11. 10. The composition of claim 1, characterized in that it comprises additives selected from antioxidants, UV stabilizers, heat stabilizers, plasticizers, nucleating agents, tackifiers, impact modifiers, flame retardants, antistatic agents, reinforcing agents, lubricants, organic and inorganic fillers, optical brighteners, mold release agents, pigments, dyes, catalysts and mixtures thereof.

12. 2. The composition according to claim 1, characterized in that it can be injected at a pressure of less than 100 bar, preferably less than 50 bar.

13. - when the carbon-based filler is expanded graphite, it is present in the composition at a content between 5% and 17% by weight relative to the total weight of the composition; - when the carbon-based filler is not expanded graphite, it is present in the composition in a content between 5% and 35% by weight, preferably between 10% and 29.90% by weight, and even more preferably between 10% and 25% by weight, relative to the total weight of the composition; The composition of claim 1 , characterized in that

14. 2. The composition according to claim 1, characterized in that the electrically insulating filler is selected from metal oxides, more particularly aluminum oxide, zinc oxide and aluminosilicates.

15. 2. A composition according to claim 1, characterized in that it comprises from 17% to 60% by weight, preferably from 25% to 55% by weight, more preferentially from 25% to 50% by weight and even more advantageously from 30% to 50% by weight of electrically insulating filler relative to the weight of the composition.

16. 10. Use of the composition according to claim 1 for the encapsulation of electronic devices, preferably located under the engine hood of a motor vehicle or in medical equipment.