Component mounting device, component mounting method, and component mounting system

Abstract

To provide a component mounting device, a component mounting method, and a component mounting system that can improve the reliability of component mounting.SOLUTION: A component mount device comprises a mounting head which has a nozzle and an elevation part, a storage part which previously stores an operation pattern of elevation of the nozzle by the elevation part, and a control part which controls the elevation part according to the operation pattern. The operation pattern includes a first lowering pattern of lowering of the nozzle holding a component from a first height to a second height and a second lowering pattern of lowering of the nozzle from the second height to a third height. The control part controls the elevation part by applying height control based upon height variation corresponding to the first lowering pattern when the nozzle moves from the first height toward the second height, and also controls the elevation part by applying speed control based upon a reference speed corresponding to the second lowering pattern when the nozzle moves from the second height toward the third height.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates to a component mounting device, a component mounting method, and a component mounting system. [Background technology]

[0002] 2. Description of the Related Art Conventionally, there has been known a component mounting apparatus that holds a component with a nozzle of a mounting head and mounts the component on a board (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2014-67860 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, when the component held by the nozzle comes into contact with the board, the impact of the contact can damage the component or the board, which can result in component mounting errors. For this reason, there is room for improvement in terms of component mounting reliability.

[0005] Therefore, an object of the present disclosure is to provide a component mounting device, a component mounting method, and a component mounting system that can solve the above-mentioned problems and improve the reliability of component mounting. [Means for solving the problem]

[0006] In order to achieve the above-mentioned object, a component mounting device of the present disclosure is a component mounting device that mounts a component on a substrate, and includes a mounting head having a nozzle that holds a component and a lifting unit that raises and lowers the nozzle, a memory unit that pre-stores operation patterns in which the lifting unit raises and lowers the nozzle, and a control unit that controls the lifting unit based on the operation patterns, the operation patterns including a first descent pattern in which the nozzle that holds the component descends from a first height to a second height that is lower than the first height, and a second descent pattern in which the nozzle descends from the second height to a third height at which the component can be mounted on the substrate, and the control unit controls the lifting unit to apply height control based on a height change corresponding to the first descent pattern when the nozzle moves from the first height toward the second height, and controls the lifting unit to apply speed control based on a reference speed corresponding to the second descent pattern when the nozzle moves from the second height toward the third height.

[0007] In addition, the component mounting method disclosed herein is a component mounting method for mounting a component on a substrate, and includes a first lowering step of controlling a lifting unit that raises and lowers a nozzle holding a component so as to lower the nozzle from a first height to a second height lower than the first height based on a first lowering pattern stored in advance, and a second lowering step of controlling the lifting unit to lower the nozzle from the second height to a third height at which a component can be mounted on the substrate based on a second lowering pattern stored in advance, wherein in the first lowering step, height control based on a height change corresponding to the first lowering pattern is applied, and in the second lowering step, speed control based on a reference speed corresponding to the second lowering pattern is applied.

[0008] In addition, a component mounting system of the present disclosure is a component mounting system that mounts a component on a substrate, and includes a mounting head having a nozzle that holds a component and a lifting unit that raises and lowers the nozzle, a memory unit that pre-stores operation patterns in which the lifting unit raises and lowers the nozzle, and a control unit that controls the lifting unit based on the operation patterns, the operation patterns including a first descent pattern when the nozzle that holds the component descends from a first height to a second height that is lower than the first height, and a second descent pattern when the nozzle descends from the second height to a third height at which the component can be mounted on the substrate, and the control unit controls the lifting unit to apply height control based on a height change corresponding to the first descent pattern when the nozzle moves from the first height to the second height, and controls the lifting unit to apply speed control based on a reference speed corresponding to the second descent pattern when the nozzle moves from the second height to the third height. Effect of the Invention

[0009] According to the present disclosure, it is possible to improve the reliability of component mounting. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic plan view showing a main configuration of a component mounting device / component mounting system according to an embodiment; [Figure 2A] FIG. 1 is a schematic plan view of a mounting head according to an embodiment; [Figure 2B] FIG. 1 is a schematic side view of a mounting head according to an embodiment; [Figure 2C] FIG. 1 is a schematic side view of a mounting head according to an embodiment; [Diagram 3] FIG. 2 is a block diagram showing a control system of the component mounting device according to the embodiment; [Figure 4] 1 is a flowchart showing an example of a component mounting process performed by the component mounting device of the embodiment. [Diagram 5] FIG. 5 is a schematic graph for explaining the component mounting process according to the flowchart of FIG. 4; [Figure 6] An enlarged portion of the graph in Figure 5 [Figure 7] FIG. 13 is an enlarged view of a part of a graph of a component mounting process according to a modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] According to a first aspect of the present disclosure, there is provided a component mounting device for mounting a component on a substrate, the component mounting device comprising: a mounting head having a nozzle for holding a component and a lifting unit for raising and lowering the nozzle; a memory unit for pre-storing an operation pattern in which the lifting unit raises and lowers the nozzle; and a control unit for controlling the lifting unit based on the operation pattern, the operation pattern including a first descent pattern in which the nozzle holding the component descends from a first height to a second height lower than the first height, and a second descent pattern in which the nozzle descends from the second height to a third height at which the component can be mounted on the substrate, the control unit controlling the lifting unit to apply height control based on a height change corresponding to the first descent pattern when the nozzle moves from the first height toward the second height, and controlling the lifting unit to apply speed control based on a reference speed corresponding to the second descent pattern when the nozzle moves from the second height toward the third height.

[0012] According to a second aspect of the present disclosure, there is provided a component mounting device as described in the first aspect, further comprising a height acquisition unit that acquires a height of the nozzle, and in the height control, the control unit feedback-controls the nozzle height acquired by the height acquisition unit based on the height change corresponding to the first descent pattern.

[0013] According to a third aspect of the present disclosure, there is provided a component mounting device as described in the first or second aspect, further comprising a speed acquisition unit that acquires the lifting and lowering speed of the nozzle, and in the speed control, the control unit feedback-controls the lifting and lowering speed acquired by the speed acquisition unit based on the reference speed corresponding to the second descent pattern.

[0014] According to a fourth aspect of the present disclosure, there is provided a component mounting device as described in the third aspect, wherein the operation pattern includes data on height change of the nozzle over time, and when the nozzle moves from the second height to the third height, if the lifting and lowering speed acquired by the speed acquisition unit becomes slower than the reference speed, the time at which the nozzle reaches the third height becomes slower than the time at which the nozzle reaches the third height in the operation pattern.

[0015] According to a fifth aspect of the present disclosure, there is provided a component mounting device as described in the third or fourth aspect, wherein the control unit determines the time at which to start raising the nozzle after reaching the third height based on the operation pattern, regardless of a change in the lifting and lowering speed from the second height to the third height.

[0016] According to a sixth aspect of the present disclosure, there is provided a component mounting device as described in the third or fourth aspect, wherein the control unit varies the time at which the nozzle starts to rise after reaching the third height in accordance with a change in the lifting and lowering speed from the second height to the third height.

[0017] According to a seventh aspect of the present disclosure, there is provided a component mounting device as described in any one of the first to sixth aspects, wherein the reference speed corresponding to the second descent pattern is slower than the nozzle ascent and descent speed corresponding to the first descent pattern.

[0018] According to an eighth aspect of the present disclosure, there is provided a component mounting device as described in any one of the first to seventh aspects, further comprising a contact detection unit that detects whether a component held by the nozzle has contacted the board, the memory unit further having thrust limit data that limits the thrust of the lifting unit corresponding to a pressing load on the board, and the control unit controls the lifting unit to apply thrust limit control that limits the thrust of the lifting unit based on the thrust limit data in response to the contact detection unit detecting contact when the nozzle moves from the second height toward the third height.

[0019] According to a ninth aspect of the present disclosure, there is provided the component mounting device described in the eighth aspect, wherein the control unit controls the lifting unit so as not to apply the thrust limit control until the contact detection unit detects contact when the nozzle moves from the second height toward the third height.

[0020] According to a tenth aspect of the present disclosure, there is provided a component mounting method for mounting a component on a substrate, the component mounting method including: a first lowering step of controlling a lifting unit that raises and lowers a nozzle holding a component so as to lower the nozzle from a first height to a second height lower than the first height based on a pre-stored first lowering pattern; and a second lowering step of controlling the lifting unit to lower the nozzle from the second height to a third height at which a component can be mounted on the substrate based on a pre-stored second lowering pattern, wherein the first lowering step applies height control based on a height change corresponding to the first lowering pattern, and the second lowering step applies speed control based on a reference speed corresponding to the second lowering pattern.

[0021] According to an eleventh aspect of the present disclosure, there is provided a component mounting system for mounting a component on a substrate, the component mounting system comprising: a mounting head having a nozzle for holding a component and a lifting unit for raising and lowering the nozzle; a memory unit for pre-storing an operation pattern in which the lifting unit raises and lowers the nozzle; and a control unit for controlling the lifting unit based on the operation pattern, the operation pattern including a first descent pattern in which the nozzle holding the component descends from a first height to a second height lower than the first height, and a second descent pattern in which the nozzle descends from the second height to a third height at which the component can be mounted on the substrate, the control unit controlling the lifting unit to apply height control based on a height change corresponding to the first descent pattern when the nozzle moves from the first height to the second height, and controlling the lifting unit to apply speed control based on a reference speed corresponding to the second descent pattern when the nozzle moves from the second height to the third height.

[0022] (Embodiment) Hereinafter, exemplary embodiments of the component mounting device, component mounting method, and component mounting system according to the present disclosure will be described with reference to the accompanying drawings. The present disclosure is not limited to the specific configurations of the following embodiments, and configurations based on similar technical ideas are included in the present disclosure. The configurations, shapes, etc. described below are examples for explanation purposes, and can be appropriately changed depending on the specifications of the component mounting device, component mounting method, and component mounting system.

[0023] In the following, corresponding elements in each drawing are given the same reference numerals, and duplicated explanations are omitted. In the following, two axes that are orthogonal to each other in a horizontal plane are defined as the X-axis in the substrate transport direction (the left-right direction in FIG. 1) and the Y-axis that is orthogonal to the substrate transport direction (the up-down direction in FIG. 1), and the height direction that is orthogonal to the horizontal plane is defined as the Z-axis (the up-down direction in FIG. 2B).

[0024] First, the configuration of a component mounting device 1 will be described with reference to FIG.

[0025] The component mounting device 1 has a function of performing a component mounting operation of mounting components, such as dies and IC chips, supplied from a component supply unit 4 onto a substrate P. The component mounting device 1 constitutes a component mounting system that mounts components onto the substrate P.

[0026] A substrate transport mechanism 3 is disposed along the X-axis at the center of the base 2. The substrate transport mechanism 3 transports the substrate P transported from upstream to the mounting operation position, positions it, and holds it. The substrate transport mechanism 3 also transports the substrate P downstream after component mounting operation is completed.

[0027] Component supply units 4 are arranged on both sides (front and back directions along the Y axis) of the board transport mechanism 3. Each component supply unit 4 has multiple tape feeders 5 mounted along the X axis. The tape feeders 5 pitch-feed a component tape, on which pockets for storing components are formed, in a direction (tape feed direction) from the outside of the component supply unit 4 toward the board transport mechanism 3, to supply components to a component supply position from which the components are picked up by the mounting head 8.

[0028] In FIG. 1, a Y-axis table 6 equipped with a linear drive mechanism is arranged along the Y-axis at both ends of the upper surface of the base 2 in the X-axis. A beam 7 similarly equipped with a linear drive mechanism is connected to the Y-axis table 6 so as to be freely movable along the Y-axis. The beam 7 is arranged along the X-axis. A mounting head 8 is mounted on the beam 7 via a plate 7a so as to be freely movable along the X-axis. The mounting head 8 is detachable from the plate 7a. The mounting head 8 is equipped with a plurality of component mounting units 9 (FIGS. 2A and 2B). A nozzle 10 for suctioning and holding a component is mounted on the lower end of each of the component mounting units 9. Each component mounting unit 9 is equipped with an elevation motor 30 (elevation unit) for raising and lowering the nozzle 10 along the Z-axis.

[0029] 1, the Y-axis table 6 and the beam 7 constitute a head moving mechanism 28 that moves the mounting head 8 along the X-axis and the Y-axis. The head moving mechanism 28 and the mounting head 8 perform a mounting turn in which a nozzle 10 of the component mounting unit 9 sucks and picks up a component from the tape feeder 5 arranged in the component supply unit 4, and mounts the component at a mounting position on the board P positioned by the board transport mechanism 3. In this way, each of the multiple component mounting units 9 has a nozzle 10 as a component holder that holds the component, and mounts the component on the board P.

[0030] 1, a component recognition camera 50 is disposed between the component supply unit 4 and the board transport mechanism 3. When the mounting head 8 which has picked up a component from the component supply unit 4 moves above the component recognition camera 50, the component recognition camera 50 captures an image of the component held by the mounting head 8 to recognize the holding posture of the component.

[0031] A head camera 52 is attached to the plate 7a to which the mounting head 8 is attached. The head camera 52 moves integrally with the mounting head 8. As the mounting head 8 moves, the head camera 52 moves above the board P positioned by the board transport mechanism 3, and captures an image of a board mark (not shown) provided on the board P to recognize the position of the board P. When the mounting head 8 mounts components on the board P, the mounting position is corrected taking into account the recognition results of the components by the component recognition camera 50 and the recognition results of the board position by the head camera 52.

[0032] Next, the configuration of the mounting head 8 will be described with reference to Figures 2A, 2B, and 2C. The mounting head 8, which is detachable from the plate 7a, is provided with a plurality of component mounting sections 9A-9H. In this example, the mounting head 8 is provided with four component mounting sections 9 aligned along the X-axis in two rows along the Y-axis. The mounting head 8 is provided with four component mounting sections 9A-9D in the first row, and eight component mounting sections 9E-9H in the second row. Hereinafter, the component mounting sections 9A-9H may be collectively referred to as component mounting sections 9.

[0033] 2B, each of the component mounting units 9A to 9H includes a lift motor 30 and a shaft 11 extending downward along the Z axis. The shaft 11 passes vertically through the block 20 and protrudes below the block 20. A nozzle holder 12 is disposed at the lower end of the shaft 11 protruding below the block 20. A nozzle 10 is detachably attached to the nozzle holder 12.

[0034] The block 20 moves up and down along a vertically extending groove 13a formed in a guide member 13 arranged below the component mounting units 9A to 9H. By driving the lift motor 30, each of the component mounting units 9A to 9H raises and lowers the nozzle 10 mounted on the lower end in a lift direction Z1. The lift direction Z1 is parallel to the Z axis. In this manner, the lift motor 30, the shaft 11, and the nozzle holder 12 constitute a lift means 14 that raises and lowers the nozzle 10. Information on the height position / lift distance of the nozzle 10 is output by an encoder of the lift motor 30.

[0035] The mounting head 8 also includes a nozzle rotation mechanism (not shown) that rotates the shaft 11 around the Z axis to rotate the nozzle 10. An example of the shaft 11 in this embodiment is a ball spline.

[0036] In the above configuration, in order to reduce the resistance when the block 20 moves up and down along the groove 13a of the guide member 13, a lubricant (grease) is applied to the point where the block 20 contacts the groove 13a. When the mounting head 8 is continuously used, the sliding resistance when the block 20 moves up and down may increase due to reasons such as the lubricant being depleted. When the sliding resistance increases, the lifting speed of the nozzle 10 decreases if the current value supplied to the lifting motor 30 is kept the same.

[0037] Next, the configuration of a control system of component mounting device 1 will be described with reference to Fig. 3. Component mounting device 1 includes a board transport mechanism 3, a component supply unit 4, a mounting head 8, a head moving mechanism 28, a component recognition camera 50, and a head camera 52. Mounting head 8 includes a plurality of component mounting units 9, each of which has an elevation motor 30.

[0038] The control unit 26 is configured to control the component mounting device 1. The control unit 26 includes a general-purpose processor such as a CPU, MPU, FPGA, DSP, or ASIC that executes a program to realize a predetermined function. The control unit 26 executes a program stored in a memory (storage unit) to realize the function.

[0039] The control unit 26 controls the board conveying mechanism 3, component supply unit 4, mounting head 8, head moving mechanism 28, component recognition camera 50, head camera 52, etc. based on information stored in the memory or information acquired by other components.

[0040] In FIG. 3, the control unit 26 includes a memory unit 32, an on-board control unit 34, a data acquisition unit 36, and a contact detection unit 38.

[0041] The memory unit 32 is a storage device, and stores on-board data 40, acquired data 42, operation pattern data 44, reference speed data 46, thrust limit data 48, and the like.

[0042] In the mounting data 40, various information such as the types of components to be mounted on the board P, the coordinates of the component mounting positions on the board P, etc. are stored in advance for each board type of mounting board.

[0043] Data acquired by the data acquisition unit 36, which will be described later, is sequentially stored in the acquired data 42. The acquired data 42 includes information on the height position / lifting speed of the nozzle 10 outputted from the encoder of the lifting motor 30, for example.

[0044] The operation pattern data 44 stores in advance data relating to a pattern for raising and lowering the nozzle 10 by the lift motor 30. The operation pattern data 44 of this embodiment includes information on the change in height of the nozzle 10 over time, and includes at least a first lowering pattern 44A and a second lowering pattern 44B. The lifting and lowering speed of the nozzle 10 corresponding to the second lowering pattern 44B (a reference speed to be described later) is set to be slower than the lifting and lowering speed of the nozzle 10 corresponding to the first lowering pattern 44A. Details will be described later.

[0045] The reference speed data 46 stores in advance a reference speed when the lift motor 30 lifts and lowers the nozzle 10 based on the second lowering pattern 44B. The control unit 26 feedback-controls the lift speed of the nozzle 10 based on the reference speed included in the reference speed data 46.

[0046] The thrust limit data 48 prestores an upper limit value related to the thrust of the lift motor 30. The thrust limit data 48 in this embodiment is a current supply value to the lift motor 30 corresponding to the thrust of the lift motor 30. By using the thrust limit data 48 to set an upper limit of the current supply value to the lift motor 30, it is possible to limit the pushing force when the component held by the nozzle 10 comes into contact with and pushes into the substrate P.

[0047] Based on data such as the mounting data 40, the mounting control unit 34 raises and lowers the nozzle 10 of the mounting head 8 to pick up the component supplied by the tape feeder 5, and then raises and lowers the nozzle 10 toward the mounting position on the substrate P to perform a mounting turn to mount the component.

[0048] The data acquisition unit 36 ​​acquires various data related to the component mounting device 1. The acquired data is stored in the storage unit 32 as acquired data 42. The data acquisition unit 36 ​​in this embodiment acquires, for example, information on the height position / lifting speed of the nozzle 10 outputted from the encoder of the lifting motor 30 while the mounting turn is being performed, and information on the load rate (torque rate) of the lifting motor 30. That is, the data acquisition unit 36 ​​functions as a "height acquisition unit" that acquires the height of the nozzle 10, a "speed acquisition unit" that acquires the lifting speed of the nozzle 10, and a "load rate acquisition unit" that acquires the load rate of the lifting motor 30.

[0049] The contact detection unit 38 detects that the component held by the nozzle 10 has come into contact with the substrate P, based on the load factor (acquired data 42) of the lift motor 30 acquired by the data acquisition unit 36 ​​during the execution of the mounting turn. Specifically, the contact between the component and the substrate P is detected in response to an increase in the load factor of the lift motor 30.

[0050] Fig. 4 shows a flow of a component mounting process in which components held by the nozzle 10 of the mounting head 8 are mounted onto the substrate P using the component mounting device 1 having the above configuration. Each process in the flowchart shown in Fig. 4 is executed by the control unit 26. Fig. 5 is a schematic graph for explaining the component mounting process according to the flowchart in Fig. 4. In Fig. 5, the horizontal axis indicates time, and the vertical axis indicates the height of the nozzle 10.

[0051] 4, the control unit 26 aligns the nozzle 10 with respect to the substrate P (S11). Specifically, the mounting control unit 34 positions the nozzle 10 holding the component D (FIG. 5) to be mounted on the substrate P in the XY directions in accordance with the mounting order of the mounting data 40. At this time, the height of the nozzle 10 and the component D is a first height H1.

[0052] The control unit 26 starts lowering the nozzle 10 (S12). Specifically, the on-board control unit 34 controls the lift motor 30 to lower the nozzle 10 based on the first lowering pattern 44A of the operation pattern data 44 stored in the memory unit 32.

[0053] The first lowering pattern 44A includes height data of the nozzle 10 over time from the first height H1 to the second height H2, and the mounting control unit 34 lowers the nozzle 10 and the component D from the first height H1 to the second height H2. This executes the first lowering process.

[0054] In the first lowering step, the control unit 26 of this embodiment executes "height control" that feedback controls the height of the nozzle 10 acquired by the data acquisition unit 36 ​​based on the change in height of the first lowering pattern 44A.

[0055] By controlling the height of the nozzle 10, even if the sliding resistance of the nozzle 10 is large and the descent speed temporarily slows down, the height position of the nozzle 10 is adjusted to match the height change of the first descent pattern 44A. Therefore, the time it takes for the nozzle 10 to move from the first height H1 to the second height H2 is kept constant.

[0056] The second height H2 is preset to a height at which the component D held by the nozzle 10 does not come into contact with the substrate P. Therefore, in the height control in the first lowering step, collision with the substrate P is prevented even if the lowering speed of the nozzle 10 increases immediately after the lowering speed of the nozzle 10 temporarily slows down.

[0057] The control unit 26 determines whether the nozzle 10 has reached the second height H2 (S13). Specifically, when the height of the nozzle 10 acquired by the data acquisition unit 36 ​​is equal to or less than the second height H2 included in the first descending pattern 44A, the control unit 26 determines that the nozzle 10 has reached the second height H2 (YES in S13). When the height of the nozzle 10 acquired by the data acquisition unit 36 ​​is higher than the second height H2, the control unit 26 determines that the nozzle 10 has not reached the second height H2 (NO in S13), and executes step S13 again.

[0058] When it is determined that the nozzle 10 has reached the second height H2 (YES in S13), the control unit 26 starts lowering the nozzle 10 (S14). Specifically, the on-board control unit 34 controls the lift motor 30 to lower the nozzle 10 based on the second descent pattern 44B and the reference speed data 46 of the operation pattern data 44 stored in the memory unit 32.

[0059] The second lowering pattern 44B includes height data of the nozzle 10 over time from the second height H2 to the third height H3, and the mounting control unit 34 lowers the nozzle 10 and the component D from the second height H2 to the third height H3. This executes the second lowering process.

[0060] In the present embodiment, the control unit 26 executes “speed control” in the second lowering step, which feedback controls the lifting and lowering speed of the nozzle 10 acquired by the data acquisition unit 36 ​​based on the reference speed included in the reference speed data 46.

[0061] According to the speed control of the nozzle 10, when the sliding resistance of the nozzle 10 is large and the descent speed temporarily slows down, the lifting and lowering speed of the nozzle 10 is controlled to return to the reference speed each time, thereby limiting the descent speed when the nozzle 10 descends from the second height H2 to the third height H3.

[0062] As shown in FIG. 5, the descent speed (reference speed) of the nozzle 10 in the second descending step corresponding to the second descending pattern 44B is set to a speed slower than the descent speed of the nozzle 10 in the first descending step corresponding to the first descending pattern 44A.

[0063] The control unit 26 determines whether the component D held by the nozzle 10 has come into contact with the board P (S15). Specifically, when the load factor of the lift motor 30 acquired by the data acquisition unit 36 ​​is equal to or greater than a predetermined threshold value, the control unit 26 determines that the component D has come into contact with the board P (YES in S15). When the load factor of the lift motor 30 acquired by the data acquisition unit 36 ​​is less than the threshold value, the control unit 26 determines that the component D has not come into contact with the board P (NO in S15), and executes step S15 again.

[0064] When it is determined that the component D has come into contact with the substrate P (YES in S15), the control unit 26 applies thrust limit control (S16). Specifically, while continuing to lower the nozzle 10, an upper limit is set for the current supply value to the lift motor 30 using the thrust limit data 48 stored in the memory unit 32. This limits the thrust of the lift motor 30 while executing a push-in process to push the component D that has come into contact with the substrate P downward. It is possible to push the component D into the substrate P with a predetermined push-in load while suppressing damage to the component D and the substrate P, thereby improving the accuracy of component mounting.

[0065] 5, in the pushing step, for example, thrust limit control is applied while sending a command to lower the nozzle 10 to a height lower than the third height H3 (shown by a dashed line). As a result, the nozzle 10 pushes the component D and the board P at a predetermined pushing load or less corresponding to the thrust limit data 48 while maintaining the height of the nozzle 10 in contact with the board P at the third height H3.

[0066] In this embodiment, the control unit 26 does not apply thrust limit control to the first and second descent steps. As a result, even if the sliding resistance increases while the nozzle 10 is descending from the first height H1 to the third height H3, the thrust of the lift motor 30 is not limited, so that the height control in the first descent step and the speed control in the second descent step can be executed with high accuracy.

[0067] The control unit 26 judges whether the pushing of the component D has been completed (S17). Specifically, the control unit 26 judges whether the timing for completing the pushing of the component D, that is, the timing for starting to raise the nozzle 10, has been reached based on the operation pattern data 44. If it is judged that the pushing of the component D has not been completed (NO in S17), step S17 is executed again.

[0068] When it is determined that the pushing of the component D is completed (YES in S17), the control unit 26 starts to raise the nozzle 10 (S18). Specifically, the mounting control unit 34 controls the lift motor 30 to raise the nozzle 10 based on the operation pattern data 44 stored in the memory unit 32.

[0069] After completing mounting of one component D, the mounting head 8 performs steps S11 to S18 again on a component D held by another nozzle 10, or picks up the next component D from the tape feeder 5. By repeating these operations, a component mounting process (mounting turn) can be performed in which each component is sequentially mounted on the mounting position on the board P.

[0070] FIG. 6 is a graph (a graph enlarging a part of FIG. 5) showing details of the speed control in the second lowering step executed by the control unit 26 in this embodiment, in which the horizontal axis indicates time and the vertical axis indicates the height of the nozzle 10.

[0071] 6, while the nozzle 10 is moving from the second height H2 to the third height H3 in the second lowering step, the sliding resistance of the nozzle 10 increases, causing a temporary decrease in the lowering speed of the nozzle 10. The control unit 26 detects this speed decrease based on information on the ascent and descent speed of the nozzle 10 acquired by the data acquisition unit 36, and performs feedback control to return the ascent and descent speed of the nozzle 10 to the reference speed included in the reference speed data 46.

[0072] The time it takes for the nozzle 10 to reach the third height H3 is slower than the original arrival time included in the operation pattern data 44 by the amount that the speed of the nozzle 10 has decreased.

[0073] In this embodiment, the control unit 26 sets the timing for lifting the nozzle 10, i.e., the timing for transitioning from the pushing step to the lifting step, to a predetermined timing included in the operation pattern data 44, regardless of the speed change of the nozzle 10 in the second descending step. By keeping the timing for lifting the nozzle 10 constant, even if the time it takes to reach the third height H3 is delayed due to a decrease in the speed of the nozzle 10 in the second descending step, it is possible to prevent the time required to mount one component D from becoming longer and improve the efficiency of component mounting.

[0074] As described above, in the component mounting process for mounting the component D on the substrate P, the component mounting device 1 of this embodiment applies "height control" in the first lowering process from the first height H1 to the second height H2 and applies "speed control" in the second lowering process from the second height H2 to the third height H3 in relation to the lift control of the nozzle 10. That is, when moving from the first lowering process to the second lowering process, the height control is switched to the speed control.

[0075] By applying height control to the first descending step, the time required for the nozzle 10 to move from the first height H1 to the second height H2 can be made close to constant regardless of the actual change in speed of the nozzle 10. By applying speed control to the second descending step, the speed of the nozzle 10 is limited so as not to exceed a predetermined reference speed even when the speed of the nozzle 10 is increased after the speed of the nozzle 10 is temporarily slowed down due to an increase in sliding resistance or the like. This makes it possible to prevent the impact when the component D held by the nozzle 10 comes into contact with the substrate P from becoming excessively large, thereby suppressing damage to the component D and the substrate P and improving the reliability of component mounting.

[0076] (Action and effect) As described above, the component mounting device 1 of this embodiment is a component mounting device that mounts a component D on a substrate P, and includes a mounting head 8 having a nozzle 10 that holds the component D and a lifting motor 30 (lifting unit) that raises and lowers the nozzle 10, a storage unit 32 that pre-stores operation pattern data 44 for the lifting motor 30 to raise and lower the nozzle 10, and a control unit 26 that controls the lifting motor 30 based on the operation pattern data 44. The operation pattern data 44 includes a first height H1 of the nozzle 10 that holds the component D when the nozzle 10 lowers from the first height H1 to the second height H2 that is lower than the first height H1. The control unit 26 controls the lift motor 30 to apply height control based on a height change corresponding to the first descent pattern 44A when the nozzle 10 moves from the first height H1 to the second height H2, and controls the lift motor 30 to apply speed control based on reference speed data 46 corresponding to the second descent pattern 44B when the nozzle 10 moves from the second height H2 to the third height H3.

[0077] According to such a configuration, by applying height control from the first height H1 to the second height H2 and applying speed control from the second height H2 to the third height H3, it is possible to keep the movement time from the first height H1 to the second height H2 close to a constant, while mitigating the impact when the nozzle 10 reaches the third height H3 and the component D comes into contact with the substrate P. This makes it possible to suppress damage to the component D and the substrate P during component mounting, and improve the reliability of component mounting.

[0078] Furthermore, the component mounting device 1 of the embodiment includes a data acquisition unit 36 ​​(height acquisition unit) that acquires the height of the nozzle 10, and in the height control, the control unit 26 feedback-controls the height of the nozzle 10 acquired by the data acquisition unit 36 ​​based on the height change corresponding to the first lowering pattern 44A. With this configuration, it is possible to execute feedback control based on the height change of the predetermined operation pattern data 44.

[0079] Furthermore, the component mounting device 1 of the embodiment includes a data acquisition unit 36 ​​(speed acquisition unit) that acquires the lifting and lowering speed of the nozzle 10, and in the speed control, the control unit 26 feedback-controls the lifting and lowering speed of the nozzle 10 acquired by the data acquisition unit 36 ​​based on a reference speed corresponding to the second lowering pattern 44B. With this configuration, it is possible to execute feedback control based on the reference speed of the predetermined operation pattern data 44.

[0080] Furthermore, in the component mounting device 1 of the embodiment, the operation pattern data 44 includes data on the change in height of the nozzle 10 over time, and when the nozzle 10 moves from the second height H2 toward the third height H3, if the lifting speed acquired by the data acquiring unit 36 ​​(speed acquiring unit) becomes slower than the reference speed, the time at which the nozzle 10 reaches the third height H3 will be slower than the time at which the nozzle 10 reaches the third height H3 in the operation pattern data 44. With this configuration, although the time at which the nozzle 10 reaches the third height H3 will be slower, the speed at which the nozzle 10 collides with the substrate P can be limited, thereby suppressing damage to the components and the substrate P.

[0081] Furthermore, in the component mounting device 1 of the embodiment, regardless of the change in the lifting speed from the second height H2 to the third height H3, the control unit 26 determines the time at which the nozzle 10 starts to lift after reaching the third height H3 based on the operation pattern data 44. With this configuration, the time required to mount one component can be divided into a fixed period of time.

[0082] Furthermore, in the component mounting device 1 of the embodiment, the reference speed corresponding to the second lowering pattern 44B is slower than the lifting and lowering speed of the nozzle 10 corresponding to the first lowering pattern 44A. With this configuration, the reference speed can be slowed down to reduce the impact when the nozzle 10 collides with the substrate P.

[0083] Moreover, the component mounting device 1 of the embodiment includes a contact detection unit 38 that detects whether the component D held by the nozzle 10 has contacted the substrate P, the storage unit 32 further has thrust limit data 48 that limits the thrust of the lift motor 30 corresponding to the pressing load on the substrate P, and the control unit 26 controls the lift motor 30 to apply thrust limit control that limits the thrust of the lift motor 30 (lift unit) based on the thrust limit data 48 in response to the contact detection unit 38 detecting contact when the nozzle 10 moves from the second height H2 to the third height H3. According to this configuration, by applying thrust limit control in response to the detection of contact, it is possible to apply a desired pressing load to the substrate P while suppressing damage to the substrate P and the component D, and it is possible to improve the reliability of component mounting.

[0084] Furthermore, in the component mounting device 1 of the embodiment, the control unit 26 controls the lift motor 30 so as not to apply thrust limit control when the nozzle 10 moves from the second height H2 to the third height H3 until the contact detection unit 38 detects contact. With this configuration, the thrust of the lift motor 30 is not limited until contact is detected, which makes it easier to return to the reference speed even in cases where sliding resistance increases, and prevents excessive delays from occurring.

[0085] As described above, the component mounting method of this embodiment is a component mounting method for mounting a component D on a substrate P, and includes a first lowering step of controlling a lift motor 30 (lifting unit) for raising and lowering the nozzle 10 so as to lower the nozzle 10 holding the component D from a first height H1 to a second height H2 lower than the first height H1 based on a pre-stored first lowering pattern 44A, and a second lowering step of controlling a lift motor 30 so as to lower the nozzle 10 from the second height H2 to a third height H3 at which the component D can be mounted on the substrate P based on a pre-stored second lowering pattern 44B, in which height control based on a height change corresponding to the first lowering pattern 44A is applied in the first lowering step, and speed control based on reference speed data 46 corresponding to the second lowering pattern 44B is applied in the second lowering step.

[0086] According to such a method, damage to the component D and the substrate P during component mounting can be suppressed, and the reliability of component mounting can be improved.

[0087] Furthermore, the component mounting system of the embodiment is a component mounting device that mounts a component D on a substrate P, and includes a mounting head 8 having a nozzle 10 that holds the component D and a lifting motor 30 (lifting unit) that lifts and lowers the nozzle 10, a storage unit 32 that pre-stores operation pattern data 44 for the lifting motor 30 to lift and lower the nozzle 10, and a control unit 26 that controls the lifting motor 30 based on the operation pattern data 44. The operation pattern data 44 includes a first descent data when the nozzle 10 that holds the component D is lowered from a first height H1 to a second height H2 that is lower than the first height H1. The control unit 26 controls the lift motor 30 to apply height control based on a height change corresponding to the first descent pattern 44A when the nozzle 10 moves from the first height H1 to the second height H2, and controls the lift motor 30 to apply speed control based on reference speed data 46 corresponding to the second descent pattern 44B when the nozzle 10 moves from the second height H2 to the third height H3.

[0088] According to such a configuration, damage to the component D and the substrate P during component mounting can be suppressed, and the reliability of component mounting can be improved.

[0089] Although the present disclosure has been described above with reference to the above-mentioned embodiment, the present disclosure is not limited to the above-mentioned embodiment. For example, in the present embodiment, as shown in FIG. 6, the timing for lifting the nozzle 10 is determined based on the operation pattern data 44 regardless of the speed change of the nozzle 10 in the second lowering process, but the present disclosure is not limited to such a case. For example, the timing for lifting the nozzle 10 may be changed based on the speed change of the nozzle 10 in the second lowering process. An example of the control of the modified example is shown in FIG. 7.

[0090] 7, the time it takes for the nozzle 10 to reach the third height H3 is delayed in response to a temporary decrease in the descending speed of the nozzle 10 while moving from the second height H2 to the third height H3. In this modified example, the control unit 26 delays the timing of lifting the nozzle 10, i.e., the timing of transition from the pushing step to the lifting step, in response to the delay in the time it takes to reach the third height H3. With this type of control, although the timing of lifting the nozzle 10 is delayed, it is possible to ensure that the pushing step lasts for a predetermined period of time or more, thereby improving the accuracy of component mounting.

[0091] In the component mounting device 1 according to the modified example, the control unit 26 varies the time at which the nozzle 10 starts to rise after reaching the third height H3 in accordance with the change in the lifting and lowering speed of the nozzle 10 from the second height H2 to the third height H3. With this configuration, it is possible to execute control that improves the reliability of component mounting, such as ensuring the time to press the component D against the board P.

[0092] Although the present disclosure has been fully described in connection with the preferred embodiments with reference to the accompanying drawings, various modifications and alterations will be apparent to those skilled in the art. Such modifications and alterations should be understood to be included within the scope of the present disclosure as defined by the appended claims, unless they deviate from the scope of the present disclosure. In addition, changes in the combination and order of elements in each embodiment may be made without departing from the scope and spirit of the present disclosure. [Industrial Applicability]

[0093] The present disclosure is applicable to any component mounting device, component mounting method, and component mounting system head that holds a component with a nozzle of a mounting head and mounts it on a board. [Explanation of symbols]

[0094] 1. Parts mounting equipment / parts mounting system 8 Mounting Head 9 Parts mounting area 10 Nozzles 26 Control Unit 30 Lifting motor (lifting section) 32 Storage section 44 Motion pattern data 44A First Downward Pattern 44B Second descending pattern 46 Reference Speed ​​Data D parts P board H1 First height H2 Second height H3 3rd height

Claims

1. A component mounting device for mounting components on a substrate, comprising: a mounting head having a nozzle for holding a component and a lifting unit for lifting and lowering the nozzle; a storage unit that stores in advance an operation pattern in which the lift unit lifts and lowers the nozzle; a control unit that controls the lift unit based on the operation pattern, the operation pattern includes a first descending pattern when the nozzle holding a component descends from a first height to a second height lower than the first height, and a second descending pattern when the nozzle descends from the second height to a third height at which the component can be mounted on the board, The control unit is a component mounting device that controls the lifting unit to apply height control based on a height change corresponding to the first descent pattern when the nozzle moves from the first height to the second height, and controls the lifting unit to apply speed control based on a reference speed corresponding to the second descent pattern when the nozzle moves from the second height to the third height.

2. A height acquisition unit that acquires the height of the nozzle, The control unit is 2 . The component mounting device according to claim 1 , wherein in the height control, the nozzle height acquired by the height acquisition unit is feedback-controlled based on the height change corresponding to the first lowering pattern.

3. A speed acquisition unit that acquires a lifting and lowering speed of the nozzle, The control unit is 2. The component mounting device according to claim 1, wherein in the speed control, the lifting speed acquired by the speed acquisition unit is feedback-controlled based on the reference speed corresponding to the second lowering pattern.

4. The operation pattern includes data on a change in height of the nozzle over time, 4. The component mounting device of claim 3, wherein when the nozzle moves from the second height to the third height, when the lifting speed acquired by the speed acquisition unit becomes slower than the reference speed, the time at which the nozzle reaches the third height becomes slower than the time at which the nozzle reaches the third height in the operation pattern.

5. 4. The component mounting device according to claim 3, wherein the control unit determines a time to start raising the nozzle after reaching the third height based on the operation pattern, regardless of a change in the lifting speed from the second height to the third height.

6. 4. The component mounting device according to claim 3, wherein the control unit varies a time at which the nozzle starts to rise after reaching the third height in accordance with a change in the lifting speed from the second height to the third height.

7. 2. The component mounting device according to claim 1, wherein the reference speed corresponding to the second lowering pattern is slower than a lifting and lowering speed of the nozzle corresponding to the first lowering pattern.

8. a contact detection unit that detects whether or not a component held by the nozzle has come into contact with the substrate; the storage unit further has thrust limit data for limiting a thrust of the lift unit corresponding to a pressing load applied to the substrate, The control unit is 2. The component mounting device according to claim 1, further comprising: a controller configured to control the lifting unit to apply thrust limit control that limits the thrust of the lifting unit based on the thrust limit data in response to the contact detection unit detecting contact when the nozzle moves from the second height to the third height.

9. The control unit is 9. The component mounting device according to claim 8, wherein when the nozzle moves from the second height to the third height, the lifting unit is controlled so as not to apply the thrust limit control until the contact detection unit detects contact.

10. A component mounting method for mounting a component on a substrate, comprising the steps of: a first lowering step of controlling a lifting unit that lifts and lowers a nozzle holding a component so as to lower the nozzle from a first height to a second height lower than the first height based on a first lowering pattern stored in advance; a second lowering step of controlling the lifting unit so as to lower the nozzle from the second height to a third height at which components can be mounted on the board, based on a second lowering pattern stored in advance; A component mounting method, wherein in the first lowering process, height control based on a height change corresponding to the first lowering pattern is applied, and in the second lowering process, speed control based on a reference speed corresponding to the second lowering pattern is applied.

11. A component mounting system for mounting components on a substrate, comprising: a mounting head having a nozzle for holding a component and a lifting unit for lifting and lowering the nozzle; a storage unit that stores in advance an operation pattern in which the lift unit lifts and lowers the nozzle; a control unit that controls the lift unit based on the operation pattern, the operation pattern includes a first descending pattern when the nozzle holding a component descends from a first height to a second height lower than the first height, and a second descending pattern when the nozzle descends from the second height to a third height at which the component can be mounted on the board, The control unit is a component mounting system that controls the lifting unit to apply height control based on a height change corresponding to the first descent pattern when the nozzle moves from the first height to the second height, and controls the lifting unit to apply speed control based on a reference speed corresponding to the second descent pattern when the nozzle moves from the second height to the third height.

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