Reinforcement structure for printed circuit board

Abstract

To provide a reinforcement structure for a printed circuit board capable of reducing inconveniences caused by vibrations, etc.SOLUTION: A reinforcement structure A1 or a printed circuit board includes a printed board 1 having both ends in a first direction x perpendicular to a thickness direction z fixed to a support 9, a plurality of electronic components 2 mounted on the printed board 1, and a reinforcing body 3 mounted on the printed board 1. The reinforcing body 3 has a predetermined length in the thickness direction z and in a second direction y perpendicular to the thickness direction z and the first direction x, and extends in the first direction x. The reinforcing body 3 is disposed on both sides of the center of the printed board 1 in the first direction x, straddling it.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a reinforcement structure for a printed circuit board. [Background technology]

[0002] A plurality of electronic components are mounted on a printed circuit board incorporated in various electronic devices. In order to prevent warping or the like of the printed circuit board, a configuration has been proposed in which a reinforcing tool is attached to the printed circuit board (see, for example, Patent Document 1). The reinforcing tool described in this document is fixed to the surface of the printed circuit board and extends along the longitudinal direction of the printed circuit board. The reinforcing tool is formed by bending a metal plate, and appropriate notches are provided in the part other than the part fixed to the printed circuit board. This makes it possible to reinforce the printed circuit board while avoiding interference with the electronic components and wiring patterns mounted on the surface of the printed circuit board.

[0003] On the other hand, equipment incorporating printed circuit boards can be significantly affected by vibration. For example, power supplies for welding (welding power supplies) are repeatedly transported by truck to welding sites. The vibrations during transportation can cause bending of the printed circuit boards incorporated in the welding power supplies, which can lead to problems such as broken wires in mounted components and poor bonding of solder joints. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 8-37348 Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure has been devised under these circumstances, and an object of the present disclosure is to provide a reinforcement structure for a printed circuit board that is capable of reducing inconveniences caused by vibrations and the like. [Means for solving the problem]

[0006] In order to solve the above problems, the present disclosure employs the following technical solutions.

[0007] The reinforcement structure for a printed circuit board provided by the present disclosure comprises a printed circuit board having both ends in a first direction perpendicular to the thickness direction fixed to a support, a plurality of electronic components mounted on the printed circuit board, and a reinforcement body mounted on the printed circuit board, wherein the reinforcement body has a predetermined length in the thickness direction and in a second direction perpendicular to the thickness direction and the first direction, extends in the first direction, and is arranged on both sides of the center of the printed circuit board in the first direction, straddling it.

[0008] In a preferred embodiment, the reinforcement body is arranged on one side of the thickness direction of the printed circuit board, and the multiple electronic components include one or more first components arranged on the opposite side of the reinforcement body in the thickness direction of the printed circuit board and multiple second components arranged on the same side as the reinforcement body, and each of the one or more first components has a weight greater than each of the multiple second components.

[0009] In a preferred embodiment, the one or more first components are located at the center of the printed circuit board in the first direction when viewed in the thickness direction, and the reinforcing body is mounted at a position overlapping at least one of the one or more first components when viewed in the thickness direction.

[0010] In a preferred embodiment, the electronic device further comprises a plurality of heat sinks arranged on both sides of the one or more first components in the first direction.

[0011] In a preferred embodiment, the device further comprises a spacer interposed between the printed circuit board and the reinforcing member in the thickness direction, and the reinforcing member is disposed spaced apart from the printed circuit board in the thickness direction.

[0012] In a preferred embodiment, the device further includes one or more semiconductor devices each attached to the outside of one of the plurality of heat sinks in the first direction, and each of the one or more semiconductor devices has a resin part and a lead including a portion protruding from the resin part to one side in the thickness direction, and the lead is soldered to the printed circuit board.

[0013] In a preferred embodiment, the reinforcing body includes a support member and a plurality of other electronic components supported by the support member. Effect of the Invention

[0014] According to the reinforcement structure for a printed circuit board of the present disclosure, the printed circuit board can be prevented from warping in the intermediate portion between both end fixing parts in the first direction, thereby reducing problems such as breakage of mounted components (multiple electronic components) due to vibration during transportation.

[0015] Other features and advantages of the present disclosure will become more apparent from the following detailed description taken in conjunction with the accompanying drawings. [Brief description of the drawings]

[0016] [Figure 1] 1 is a perspective view showing an example of a reinforcement structure for a printed circuit board according to the present disclosure; [Diagram 2] 2 is a front view of the reinforcement structure of the printed circuit board shown in FIG. [Diagram 3] 2 is a bottom view of the reinforcement structure of the printed circuit board shown in FIG. 1. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. [Diagram 5] 2 is a cross-sectional view taken along line VV in FIG. 1. [Figure 6] FIG. 3 is a cross-sectional view taken along line VI-VI in FIG. [Figure 7] 11 is a perspective view showing a modified example of a reinforcement structure for a printed circuit board according to the present disclosure. FIG. [Figure 8] 8 is a front view of the reinforcement structure of the printed circuit board shown in FIG. 7. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Hereinafter, preferred embodiments of the present disclosure will be described in detail with reference to the drawings.

[0018] The terms "first," "second," and the like in this disclosure are used merely as labels and are not necessarily intended to dictate any ordering of their objects.

[0019] 1 to 6 show an example of a reinforcement structure for a printed circuit board according to the present disclosure. The reinforcement structure A1 for a printed circuit board according to the present embodiment includes a printed circuit board 1, a plurality of electronic components 2, a reinforcing body 3, a spacer 4, a plurality of heat sinks 51 and 52, a plurality of semiconductor devices 6, and a chassis 9, and is incorporated in, for example, a welding power supply. The welding power supply converts AC power, which is input power, into DC power and outputs it. The plurality of electronic components 2 and the plurality of semiconductor devices 6 play a role in power conversion in the welding power supply. The plurality of electronic components 2 include passive components such as an electrolytic capacitor, a choke coil, a transformer, and a reactor. The plurality of semiconductor devices 6 include transistors (for example, MOSFETs) having a switching function.

[0020] In Figs. 1 to 6, the thickness direction of the present disclosure is defined as "thickness direction z". The direction perpendicular to the thickness direction z (the vertical direction in Fig. 3, the horizontal direction in Fig. 4) corresponds to the first direction of the present disclosure and is called "first direction x". The direction perpendicular to both the thickness direction z and the first direction x (the horizontal direction in Figs. 2 and 3) corresponds to the second direction of the present disclosure and is called "second direction y". In Fig. 4, the right side in the figure is called "x1 side of the first direction x", and the left side in the figure is called "x2 side of the first direction x". In Figs. 2 and 3, the right side in the figure is called "y1 side of the second direction y", and the left side in the figure is called "y2 side of the second direction y". In Figs. 1, 2, and 4 to 6, the upper side in the figure corresponds to "one side of the thickness direction" of the present disclosure and is called "z1 side of the thickness direction z", and the lower side in the figure is called "z2 side of the thickness direction z".

[0021] The printed circuit board 1 has a wiring pattern formed on an insulating substrate, and directly or indirectly supports a plurality of electronic components 2, a reinforcing member 3, and a plurality of heat sinks 51, 52. The printed circuit board 1 has a front surface 11 facing the z1 side of the thickness direction z and a back surface 12 facing the z2 side of the thickness direction z, and is rectangular when viewed in the thickness direction z. In this embodiment, the printed circuit board 1 has an elongated rectangular shape with the second direction y as the longitudinal direction and the first direction x as the short side direction.

[0022] The printed circuit board 1 has both ends in the first direction x (ends on the x1 side and x2 side in the first direction x) fixed to the chassis 9. The chassis 9 is formed, for example, by appropriately punching and bending a metal plate, and supports and fixes the printed circuit board 1. In this embodiment, the printed circuit board 1 is fixed to the chassis 9 by a plurality of fasteners 91 made of screw members or the like. In the illustrated example, the printed circuit board 1 is fixed to the chassis 9 at both ends in the first direction x by a plurality of fasteners 91 (four at a time) spaced apart in the second direction y. The chassis 9 is fixed to a housing (not shown) of the welding power supply. As a result, both ends in the first direction x of the printed circuit board 1 are fixed to the housing via the chassis 9. The chassis 9 and the housing correspond to an example of a "support" in the present disclosure.

[0023] The electronic components 2 are mounted on the front surface 11 side (z1 side in the thickness direction z) or the back surface 12 side (z2 side in the thickness direction z) of the printed circuit board 1. In this embodiment, the electronic components 2 include electronic components 20 arranged on the z1 side of the thickness direction z (the same side as the reinforcing body 3 described later in the thickness direction z) of the printed circuit board 1, and electronic components 21 and 22 arranged on the z2 side of the thickness direction z of the printed circuit board 1 (the opposite side to the reinforcing body 3 in the thickness direction z). In the illustrated example, one electronic component 21 and three electronic components 22 are arranged on the z2 side of the thickness direction z of the printed circuit board 1. As shown in FIGS. 3 to 5, the electronic components 21 and 22 are located at the center of the printed circuit board 1 in the first direction x as viewed in the thickness direction z, and are arranged at intervals along the second direction y. The electronic component 21 is, for example, a choke coil, and the electronic component 22 is, for example, an electrolytic capacitor. Each of the electronic components 21 and 22 is heavier than each of the electronic components 20. The multiple electronic components 21 and 22 correspond to an example of a "first component" in the present disclosure, and the multiple electronic components 20 correspond to an example of a "second component" in the present disclosure.

[0024] 1, 2, 4, and 5, the reinforcing body 3 is mounted on the printed circuit board 1. In this embodiment, the reinforcing body 3 is disposed on the z1 side in the thickness direction z with respect to the printed circuit board 1. The reinforcing body 3 includes supporting substrates 31 and 32, and a plurality of electronic components 33.

[0025] The support substrates 31 and 32 are made of an insulating material and have wiring patterns formed thereon. The support substrate 31 is disposed parallel to the printed circuit board 1 and has an elongated rectangular shape with the first direction x as its longitudinal direction and the second direction y as its lateral direction. The support substrate 32 stands perpendicular to the support substrate 31 and has an elongated rectangular shape with the first direction x as its longitudinal direction and the thickness direction z as its lateral direction.

[0026] The electronic components 33 are supported by either one of the support boards 31 and 32. The electronic components 33 are disposed in an intersection space on the z1 side of the thickness direction z of the support board 31, overlapping the support board 31 as viewed in the thickness direction z, and on the y2 side of the second direction y of the support board 32, overlapping the support board 32 as viewed in the second direction y. The gaps between the electronic components 33 are appropriately filled with, for example, a filler 34. In Figs. 1, 2, and 5, the outline of the filler 34 is shown by an imaginary line (two-dot chain line). With this configuration, the support boards 31 and 32, the electronic components 33, and the filler 34 constituting the reinforcing body 3 are integrated with each other. The reinforcing body 3 has a predetermined length in each of the thickness direction z and the second direction y as a whole, and extends in the first direction x. The reinforcing body 3 is disposed on both sides of the center of the printed circuit board 1 in the first direction x, straddling the center as viewed in the thickness direction z. Further, the reinforcing body 3 is mounted at a position overlapping at least one of the electronic components 21, 22 as viewed in the thickness direction z. In the illustrated example, the reinforcing body 3 is mounted at a position overlapping the entire electronic component 22 located on the y1 side of the second direction y and a part of the electronic component 22 adjacent to the electronic component 22 as viewed in the thickness direction z. The length of the reinforcing body 3 in the thickness direction z and the length in the second direction y are, for example, 5 to 50 times the thickness (dimension in the thickness direction z) of the printed circuit board 1, and preferably 10 to 25 times the thickness of the printed circuit board 1. In this embodiment, the reinforcing body 3 constitutes a switching power supply of the welding power supply.

[0027] As shown in Figures 1, 2, 5, etc., the reinforcing body 3 is disposed at a distance from the printed circuit board 1 on the z1 side in the thickness direction z. The spacer 4 is interposed between the printed circuit board 1 and the reinforcing body 3 in the thickness direction z. In this embodiment, the spacer 4 is a metal spacer including a screw member, and the four corners of the support board 31 are fixed by the four spacers 4. Note that the configuration of the spacer 4 is not limited to the example shown in the figures, and may be, for example, an annular shape surrounding the peripheral portion of the reinforcing body 3 as viewed in the thickness direction z.

[0028] As shown in Figs. 2 to 5, the heat sinks 51, 52 are arranged on the z2 side in the thickness direction z with respect to the printed circuit board 1. The heat sinks 51, 52 are arranged on both sides of the first direction x (the x1 side and the x2 side of the first direction x) with the electronic components 21, 22 sandwiched between them. In the illustrated example, three heat sinks 51 are arranged on the x1 side of the first direction x, and one heat sink 52 is arranged on the x2 side of the first direction x. The three heat sinks 51 are lined up in the second direction y.

[0029] The housing (not shown) is provided with an air intake and an exhaust port. The air intake is disposed on the y1 side of the heat sinks 51 and 52 in the second direction y, and the exhaust port is disposed on the y2 side of the heat sinks 51 and 52 in the second direction y. A fan is provided near the air intake. When the welding power supply is in operation, the fan is driven to draw in outside air from the air intake and exhaust air from inside the housing from the exhaust port. This causes an air flow from the y1 side of the second direction y to the y2 side of the second direction y in the housing. The air flow passes by the heat sinks 51 and 52 and the electronic components 21 and 22, thereby cooling the heat sinks 51 and 52 and the electronic components 21 and 22.

[0030] As shown in FIGS. 2 to 4 and 6, the semiconductor devices 6 are attached to the outer side of one of the heat sinks 51, 52 in the first direction x. In this embodiment, a plurality of semiconductor devices 6 are attached to each of the x1 side of the heat sink 51 in the first direction x and the x2 side of the heat sink 52 in the first direction x. The semiconductor device 6 has a lead 61 and a resin part 62. The resin part 62 covers a part of the lead 61. The lead 61 includes a pin-shaped terminal part protruding from the resin part 62 to the z1 side in the thickness direction z. The pin-shaped terminal part (a part of the lead 61) is inserted into a through hole formed in the printed circuit board 1 and is joined to the printed circuit board 1 by solder (not shown). Each semiconductor device 6 is fixed to the heat sink 51 (52) by a screw member.

[0031] Next, the operation of this embodiment will be described.

[0032] A welding power supply incorporating the reinforcement structure A1 for a printed circuit board according to the present embodiment is subjected to vibration during transportation by truck. The printed circuit board 1 has both ends in a first direction x fixed to a chassis 9 (support), and a plurality of electronic components 2 and a reinforcement body 3 are mounted on the printed circuit board 1. The reinforcement body 3 has a predetermined length in each of the thickness direction z and the second direction y, and extends in the first direction x. The reinforcement body 3 is disposed on both sides of the center of the printed circuit board 1 in the first direction x as seen in the thickness direction z. With this configuration, the printed circuit board 1 can be prevented from bending in the intermediate portion between the fixing parts at both ends in the first direction x. This can reduce inconveniences such as breakage of mounted components (a plurality of electronic components 2) due to vibration during transportation.

[0033] The reinforcing body 3 is disposed on the z1 side in the thickness direction z with respect to the printed circuit board 1. The multiple electronic components 21, 22 (first components) which are relatively heavy are disposed on the z2 side in the thickness direction z with respect to the printed circuit board 1. According to this configuration, by disposing the heavy objects (the multiple electronic components 21, 22) and the reinforcing body 3 on opposite sides of the printed circuit board 1, it is possible to increase the mounting efficiency of the printed circuit board 1 and suppress flexural deformation of the printed circuit board 1 caused by vibration.

[0034] The multiple electronic components 21, 22 (first components) are located at the center of the printed circuit board 1 in the first direction x and are arranged along the second direction y as viewed in the thickness direction z. At least one of the electronic components 21, 22 and the reinforcing body 3 overlap each other as viewed in the thickness direction z. By arranging the electronic components 21, 22 and the reinforcing body 3 so as to intersect as viewed in the thickness direction z in this manner, it is possible to further increase the mounting efficiency of the printed circuit board 1 and further suppress flexural deformation of the printed circuit board 1.

[0035] In this embodiment, a plurality of heat sinks 51, 52 are provided. These heat sinks 51, 52 are arranged on both sides of the first direction x (x1 side and x2 side of the first direction x) with the plurality of electronic components 21, 22 sandwiched therebetween. According to the configuration including the heat sinks 51, 52 in this manner, cooling of the mounted components (the plurality of electronic components 2) of the printed circuit board 1 is promoted. In addition, the plurality of heat sinks 51, 52 are arranged to sandwich the heavy electronic components 21, 22 from both sides in the first direction x. This is preferable for promoting cooling of the plurality of electronic components 21, 22.

[0036] In this embodiment, a spacer 4 is provided between the printed circuit board 1 and the reinforcing body 3 in the thickness direction z. The reinforcing body 3 is disposed at a distance from the printed circuit board 1 in the thickness direction z via the spacer 4. With this configuration, it is possible to form a wiring pattern and mount the electronic component 2 at a position on the surface 11 of the printed circuit board 1 that overlaps with the reinforcing body 3 as viewed in the thickness direction z. This makes it possible to improve the mounting efficiency of the printed circuit board 1. In addition, the structure in which the printed circuit board 1, the spacer 4, and the reinforcing body 3 are integrally connected increases the rigidity of these connected portions. This is preferable in terms of suppressing bending of the printed circuit board 1.

[0037] 7 and 8 show modified examples of the reinforcement structure for a printed circuit board according to the present disclosure. In these figures, elements that are the same as or similar to those in the above embodiment are given the same reference numerals as those in the above embodiment, and redundant explanations are omitted. In the reinforcement structure A2 for a printed circuit board shown in Figs. 7 and 8, the configuration of the reinforcing body 3 is different from that of the reinforcement structure A1 for a printed circuit board according to the above embodiment.

[0038] In this modification, the reinforcing body 3 is composed of a substantially rectangular parallelepiped case 35 and a plurality of electronic components (not shown) housed inside the case 35. The case 35 is fixed to the front surface 11 (the z1 side in the thickness direction z) of the printed circuit board 1 by an appropriate means such as screws.

[0039] The welding power supply incorporating the reinforcement structure A2 of the printed circuit board of this modification is subjected to vibration during transportation by truck. The printed circuit board 1 has both ends in the first direction x fixed to a chassis 9 (support), and the printed circuit board 1 is equipped with a plurality of electronic components 2 and a reinforcing body 3. The reinforcing body 3 has a predetermined length in each of the thickness direction z and the second direction y, and extends in the first direction x. The reinforcing body 3 is arranged on both sides of the center of the printed circuit board 1 in the first direction x as viewed in the thickness direction z. With this configuration, the printed circuit board 1 can suppress the occurrence of bending in the intermediate portion between the fixing parts of both ends in the first direction x. This can reduce inconveniences such as breakage of the mounted components (the plurality of electronic components 2) due to vibration during transportation. In addition, the reinforcement structure A2 of the printed circuit board has the same action and effect as the reinforcement structure A1 of the printed circuit board of the above embodiment within the same range of configuration as the reinforcement structure A1 of the printed circuit board of the above embodiment.

[0040] The reinforcement structure for a printed circuit board according to the present disclosure is not limited to the above-described embodiment. The specific configuration of each part of the reinforcement structure for a printed circuit board according to the present disclosure can be freely designed in various ways. [Explanation of symbols]

[0041] A1, A2: reinforcement structure for printed circuit board, 1: printed circuit board, 2: electronic component, 20: electronic component (second component), 21, 22: electronic component (first component), 3: reinforcement body, 4: spacer, 51, 52: heat sink, 9: chassis (support), x: first direction, y: second direction, z: thickness direction

Claims

1. a printed circuit board having both ends fixed to a support in a first direction perpendicular to the thickness direction; A plurality of electronic components mounted on the printed circuit board; a reinforcing member mounted on the printed circuit board; A reinforcement structure for a printed circuit board, wherein the reinforcement body has a predetermined length in the thickness direction and in a second direction perpendicular to the thickness direction and the first direction, extends in the first direction, and is arranged on both sides of the center of the printed circuit board in the first direction, straddling it.

2. the reinforcing member is disposed on one side of the printed circuit board in the thickness direction, the plurality of electronic components include one or more first components arranged on an opposite side of the printed circuit board to the reinforcement body in the thickness direction, and a plurality of second components arranged on the same side as the reinforcement body, The reinforcement structure for a printed circuit board according to claim 1 , wherein each of the one or more first components is heavier than each of the plurality of second components.

3. the one or more first components are located at a center of the printed circuit board in the first direction when viewed in the thickness direction, The reinforcement structure for a printed circuit board according to claim 2 , wherein the reinforcing member is mounted at a position overlapping at least one of the one or more first components when viewed in the thickness direction.

4. The reinforcement structure for a printed circuit board according to claim 3 , further comprising a plurality of heat sinks arranged on both sides of the one or more first components in the first direction.

5. a spacer interposed between the printed circuit board and the reinforcing body in the thickness direction; 5. The reinforcement structure for a printed circuit board according to claim 1, wherein the reinforcing member is disposed spaced apart from the printed circuit board in the thickness direction.

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