Substrate processing system

Abstract

To provide a substrate processing system capable of freely changing configurations of a batch processing device and a sheet processing device.SOLUTION: A substrate processing system 1 comprises a batch processing device 3, a sheet processing device 7, and an interface device 5 which connects the batch processing device 3 with the sheet processing device 7. The batch processing device 3 extends in a rear direction X. The sheet processing device 7 is disposed while being opposed to the batch processing device 3 so as to be arranged side by side in a width direction Y which is orthogonal with the rear direction X. The interface device 5 is adjacent to one end side of each of the batch processing device 3 and the sheet processing device 7 and disposed so as to extend in the width direction Y. A batch substrate conveyance region R3 of the batch processing device 3 is disposed adjacently to a transferring block 19 and a processing block 21 at the side where the sheet processing device 7 is disposed. The interface device 5 includes an attitude conversion region R5 and a relay region T6. The attitude conversion region R5 is disposed at an opposite side of the processing block 21 via the transferring block 19.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a substrate processing system for processing substrates. Examples of the substrate include semiconductor substrates, substrates for FPDs (Flat Panel Displays), glass substrates for photomasks, substrates for optical disks, substrates for magnetic disks, ceramic substrates, and substrates for solar cells. Examples of the FPD include liquid crystal display devices and organic EL (electroluminescence) display devices. [Background technology]

[0002] In a conventional substrate processing system, a carry-in device, a second interface device, a batch processing device, a first interface device, a single wafer processing device, and an unloading device are arranged in this order in a U-shape (see, for example, Patent Document 1).

[0003] Here, the direction in which the loading device, the second interface device, and the batch processing device are lined up is called the front-rear direction. Also, the horizontal direction perpendicular to the front-rear direction is called the width direction. At this time, in the above-mentioned substrate processing system, the loading device, the second interface device, and the batch processing device are lined up in a row in this order at the rear. The unloading device and the single wafer processing device are lined up in a row in this order at the rear. Then, the first interface device extends to the right from the batch processing device to the single wafer processing device. That is, the single wafer processing device is provided to the right of the batch processing device. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-064652 Summary of the Invention [Problem to be solved by the invention]

[0005] Conventional substrate processing systems have the following problems. For example, as in the above-mentioned substrate processing system, a first interface device (interface device) is provided behind the batch processing device and behind the single wafer processing device. In this case, if the batch processing device becomes longer in the front-rear direction at the request of the user, for example, it becomes necessary to change the transport path of the first interface device or the single wafer processing device. This change may be troublesome, which may limit changes to the configuration of the batch processing device and the single wafer processing device.

[0006] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate processing system that allows the configuration of a batch processing device and a single wafer processing device to be freely changed. [Means for solving the problem]

[0007] In order to achieve the above object, the present invention has the following configuration. That is, the substrate processing system according to the present invention is a substrate processing system including a batch processing device for processing a plurality of substrates collectively, a single substrate processing device for processing the plurality of substrates one by one, and an interface device for connecting the batch processing device and the single substrate processing device, wherein the batch processing device extends in a first horizontal direction, the single substrate processing device is arranged facing the batch processing device so as to be aligned in a second horizontal direction perpendicular to the first horizontal direction, the interface device is arranged adjacent to one end of each of the batch processing device and the single substrate processing device and extends in the second horizontal direction, and the batch processing device includes a first carrier mounting shelf on which carriers for storing the plurality of substrates in a horizontal position at a predetermined interval are mounted, a transfer block adjacent to the first carrier mounting shelf, a batch processing block adjacent to the transfer block and extending in the first horizontal direction, and a batch substrate transport area arranged adjacent to the transfer block and the batch processing block on the side where the single substrate processing device is disposed, the one end side extending to the interface device and the other end side extending in the first horizontal direction. the batch substrate transport area extending from the carrier to the first carrier mounting shelf, the transfer block including a substrate handling mechanism and a first position change mechanism, the substrate handling mechanism taking out the substrates in a horizontal position from the carrier placed on the first carrier mounting shelf, the first position change mechanism including a first position change unit that changes the substrates received from the substrate handling mechanism from a horizontal position to a vertical position, and a vertical holding unit that holds the substrates changed to a vertical position by the first position change unit, the batch processing block including a substrate handling mechanism and a first position change unit that changes the substrates in the first horizontal position from a horizontal position to a vertical position, the batch processing tanks are arranged in a row, each of the batch processing tanks storing a processing liquid for immersing the plurality of substrates; the batch substrate transport area includes a first batch transport mechanism that transports the plurality of substrates in a vertical position between the plurality of batch processing tanks, the vertical holding unit, and the interface device; the interface device includes a posture change area that is arranged on the opposite side of the batch processing block with the transfer block interposed therebetween, and a relay area that is adjacent to the posture change area and extends in the second horizontal direction;The posture change area includes a second posture change mechanism that changes the posture of the plurality of substrates processed in the batch processing device from a vertical posture to a horizontal posture, the relay area includes an intermediate substrate transport mechanism that transports the plurality of substrates that have been converted to the horizontal posture by the second posture change mechanism to the single substrate processing device, the single substrate processing device includes a second carrier mounting shelf on which the carrier is placed, and a single substrate processing block adjacent to the second carrier mounting shelf, the single substrate processing block includes a plurality of single substrate processing chambers that perform a predetermined processing on the plurality of substrates processed in the batch processing device one by one, and a horizontal substrate transport robot that receives the substrate transported by the intermediate substrate transport mechanism and transports the received substrate to one of the plurality of single substrate processing chambers, and the horizontal substrate transport robot stores the substrate that has been processed in one of the plurality of single substrate processing chambers in the carrier placed on the second carrier mounting shelf.

[0008] According to the substrate processing system of the present invention, the posture changing area of ​​the interface device is provided on the opposite side of the processing block having the batch processing tank via the transfer block of the batch processing device. For example, the length of the batch processing device may change in the first horizontal direction in which the batch processing device extends due to an increase or decrease in the number of batch processing tanks of the batch processing device. Even in this case, there is no need to change the configuration of at least the transfer block of the batch processing device and the interface device. Therefore, the configuration of the batch processing device and the single wafer processing device can be freely changed.

[0009] In addition, since the posture changing area is provided on the opposite side of the processing block across the transfer block, it is possible to prevent the relay area of ​​the interface device from intersecting with the batch substrate transport area in a plan view. This prevents the configuration from becoming complicated. Furthermore, the single wafer processing device is provided on the opposite side of the transfer block across the batch substrate transport area. This makes it possible to reduce the size of the interface device blocking one side of the transfer block in a plan view. Furthermore, it is possible to ensure a wide maintenance area on the opposite side of the batch substrate transport area across the batch processing tank.

[0010] In addition, in the above-mentioned substrate processing system, it is preferable that the second position change mechanism includes a second position change unit that changes the multiple substrates from a vertical position to a horizontal position, and a waiting tank that is provided between the transfer block and the second position change unit and stores immersion liquid in which the multiple substrates are immersed in the vertical position.

[0011] The attitude changing mechanism can hold a plurality of substrates in a vertical attitude while immersing the plurality of substrates in the immersion liquid stored in the standby tank.

[0012] Furthermore, in the above-mentioned substrate processing system, it is preferable that the second attitude change mechanism further includes a second batch transport mechanism, the second batch transport mechanism including a guide rail provided on the opposite side of the batch substrate transport area via the waiting tank, the second batch transport mechanism transporting the plurality of substrates in a vertical attitude from the waiting tank to the second attitude change unit along the guide rail, and the first batch transport mechanism transporting the plurality of substrates in a vertical attitude between the plurality of batch processing tanks, the vertical holding unit and the waiting tank.

[0013] The guide rail is disposed so that the waiting tank is disposed between the guide rail and the batch substrate transport area, and therefore, it is possible to prevent the second batch transport mechanism that transports substrates along the guide rail from interfering with the transport of substrates from the underwater posture changing unit to the relay substrate transport mechanism by crossing between the posture changing unit and the relay substrate transport mechanism.

[0014] Furthermore, in the above-mentioned substrate processing system, it is preferable that the second batch transport mechanism includes a pair of chucks in which multiple pairs of holding grooves and multiple pairs of passing grooves are arranged alternately, and when a group of substrates to be processed in which the multiple substrates and other multiple substrates are arranged alternately is immersed in the immersion liquid in the waiting tank, the second batch transport mechanism uses the pair of chucks to remove the multiple substrates from the group of substrates to be processed and transport the removed multiple substrates to the posture conversion section.

[0015] The second batch transport mechanism can remove multiple substrates (first substrate group) from a processing substrate group in which multiple substrates (first substrate group) and other multiple substrates (second substrate group) are alternately arranged. The removed multiple substrates (first substrate group) are converted to a horizontal posture by the posture conversion unit. Meanwhile, the other multiple substrates (second substrate group) can be made to wait while immersed in the immersion liquid in the waiting tank. This can prevent the other multiple substrates (second substrate group) from drying out while waiting.

[0016] In addition, the above-mentioned substrate processing system preferably further includes a stocker device adjacent to the batch processing device and the interface device, the stocker device including a load port for loading and unloading the carrier, and a carrier transport robot for transporting the carrier at least between the load port and the first carrier mounting shelf. The carrier transport robot can transport the carrier at least between the load port and the first carrier mounting shelf. Even if the length of the single wafer processing device in the first horizontal direction changes, there is no need to change the configuration of the stocker device.

[0017] In the above-mentioned substrate processing system, an example of the relay substrate transport mechanism is provided with a belt conveyor. In the above-mentioned substrate processing system, an example of the relay substrate transport mechanism is provided with a movable relay hand that holds one substrate. In the above-mentioned substrate processing system, an example of the substrate handling mechanism is preferably provided with a plurality of hands that respectively hold the plurality of substrates, and the plurality of hands are movable as a unit. Effect of the Invention

[0018] According to the substrate processing system of the present invention, the configurations of the batch processing apparatus and the single wafer processing apparatus can be freely changed. [Brief description of the drawings]

[0019] [Figure 1] 1 is a plan view showing a schematic configuration of a substrate processing system according to a first embodiment. [Diagram 2] 1(a) to 1(c) are side views illustrating the substrate handling mechanism and the first position changing mechanism. [Diagram 3] FIG. 2 is a plan view showing the configuration of the interface device and its surroundings. [Figure 4] 13(a) to 13(h) are diagrams illustrating four holding modes of a pair of chucks of the second batch transfer mechanism. [Diagram 5] 13(a) to 13(c) are diagrams illustrating a second attitude change mechanism. [Figure 6] 13(a) to 13(c) are diagrams illustrating a second attitude change mechanism. [Figure 7] 6A and 6B are diagrams for explaining a second attitude change mechanism. [Figure 8] FIG. [Figure 9] 4 is a flowchart illustrating an operation of the substrate processing system. [Figure 10] 1A and 1B are plan views for explaining the effect of the substrate processing system. [Figure 11] 1A and 1B are plan views for explaining the effect of the substrate processing system. [Figure 12] FIG. 11 is a plan view showing a schematic configuration of a substrate processing system according to a second embodiment. [Figure 13] FIG. 13 is a plan view showing a configuration of an interface device and its periphery according to a modified example. [Figure 14] FIG. 13 is a plan view showing the configuration of an interface device according to another modified example and its surroundings. [Figure 15] 13A and 13B are diagrams for explaining rotation of the substrate about a vertical axis by the pusher mechanism of the underwater attitude changing unit. Example 1

[0020] A first embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a plan view showing a schematic configuration of a substrate processing system according to the first embodiment.

[0021] For convenience, in this specification, the direction in which the transfer block 19 (described later) and the processing block 21 (described later) in the batch processing apparatus 3 are aligned is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, for example, the direction from the processing block 21 toward the transfer block 19 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the "width direction Y" is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." In each figure, for reference, front, back, right, left, top, and bottom are indicated as appropriate.

[0022] <1. Overall composition> Please refer to Fig. 1. The substrate processing system 1 processes a substrate W. The substrate processing system 1 performs, for example, chemical processing, cleaning processing, drying processing, and the like on the substrate W.

[0023] The substrate processing system 1 includes a stocker device 2, a batch processing device 3, an interface device 5, and a single wafer processing device 7. In other words, the substrate processing system 1 is a hybrid system including the batch processing device 3 and the single wafer processing device 7. The batch processing device 3 processes a plurality of substrates W (e.g., 25 or 50 substrates) all at once. The single wafer processing device 7 processes the substrates W one by one. The interface device 5 connects the batch processing device 3 and the single wafer processing device 7.

[0024] The stocker device 2, the batch processing device 3, the interface device 5 and the single wafer processing device 7 are arranged in a C-shape or a U-shape. A more specific description will be given. The batch processing device 3 extends in the rear direction X. The single wafer processing device 7 is disposed facing the batch processing device 3 so as to be arranged in the width direction Y perpendicular to the rear direction X. The interface device 5 is adjacent to one end side of each of the batch processing device 3 and the single wafer processing device 7. The interface device 5 is disposed so as to extend in the width direction Y.

[0025] The rear direction X corresponds to a first horizontal direction in the present invention, and the width direction Y corresponds to a second horizontal direction in the present invention.

[0026] <2. Stocker equipment> The stocker device 2 houses at least one carrier C. The stocker device 2 is adjacent to the batch processing device 3, the interface device 5, and the single wafer processing device 7. The carrier C stores a plurality of substrates W (e.g., 25 substrates) in a horizontal position with a predetermined interval (e.g., 10 mm) between them. In the carrier C, the substrates W are aligned in the vertical direction Z or in the thickness direction of each substrate W. For example, a FOUP (Front Opening Unify Pod) is used as the carrier C, but is not limited to this.

[0027] The stocker apparatus 2 includes a plurality of (e.g., two) load ports 9, a main body region R1, and an extension region R2. The two load ports 9 are adjacent to the front X of the main body region R1. The two load ports 9 are arranged in the width direction Y. Each of the two load ports 9 is for loading and unloading a carrier C. The main body region R1 and the extension region R2 are formed in an L-shape in a plan view. The main body region R1 is formed to extend in the width direction Y. The extension region R2 is connected to the rear X of the right end portion of the main body region R1.

[0028] The stocker apparatus 2 includes a storage shelf 15 and a carrier transport robot 16. The storage shelf 15 is disposed in the main body region R1. The storage shelf 15 is a shelf for storing the carriers C. The carriers C are placed on the storage shelf 15.

[0029] The carrier transport robot 16 transports the carrier C between the two load ports 9, the two shelves 18, 89, and the storage shelf 15. The carrier transport robot 16 is equipped with a gripping unit 17 that grips a protrusion provided on the upper surface of the carrier C, for example. The gripping unit 17 is movable in the horizontal direction (front-rear direction X and width direction Y) and the vertical direction Z by the carrier transport robot 16. The carrier transport robot 16 is driven by one or more electric motors. Note that the carrier transport robot 16 may be a movable support unit that supports the lower surface of the carrier C.

[0030] <3. Batch processing equipment> An overview of the batch processing device 3 will be described. The batch processing device 3 takes out a plurality of substrates W (e.g., 25 substrates) from a carrier C transported to a shelf 18. The batch processing device 3 converts the plurality of substrates W taken out (e.g., 25 substrates) from a horizontal position to a vertical position using a first position conversion mechanism 23 (described later). The batch processing device 3 performs a predetermined batch processing on the plurality of substrates W (e.g., 25 or 50 substrates) that have been converted to a vertical position. The batch processing device 3 transports the plurality of substrates W (e.g., 25 or 50 substrates) that have been subjected to the batch processing to an interface device 5.

[0031] Next, the batch processing device 3 will be described in detail. The batch processing device 3 includes a shelf 18, a transfer block 19, a processing block 21, and a batch substrate transport region R3. The shelf 18 is disposed in the extension region R2. A carrier C is placed on the shelf 18. The transfer block 19 is adjacent to the rear X of the shelf 18. The processing block 21 is adjacent to the rear X of the transfer block 19. The processing block 21 extends toward the rear X.

[0032] The batch substrate transport area R3 is disposed adjacent to the transfer block 19 and the processing block 21 on the side where the single wafer processing device 7 is disposed. One end of the batch substrate transport area R3 extends to the interface device 5. The other end of the batch substrate transport area R3 extends to the rear X. In other words, the batch substrate transport area R3 is adjacent to the left Y of the transfer block 19, the processing block 21 and the attitude changing area R5 (described later). The batch substrate transport area R3 may also be adjacent to the rear X of the relay area R6 (described later).

[0033] <3-1. Transfer block> The transfer block 19 includes a substrate handling mechanism (robot) HTR and a first position changing mechanism 23. The substrate handling mechanism HTR is provided at the rear X of the shelf 18. The substrate handling mechanism HTR takes out a plurality of (e.g., 25) substrates W in a horizontal position from a carrier C placed on the shelf 18, and transports the taken-out substrates W to the first position changing mechanism 23.

[0034] Please refer to Figures 2(a) to 2(c). The substrate handling mechanism HTR has a plurality of hands 25 (e.g., 25). Each hand 25 holds one substrate W. For convenience of illustration, in Figures 2(a) to 2(c), the substrate handling mechanism HTR is shown to have three hands 25. Furthermore, a pair of horizontal holding parts 31B and a pair of vertical holding parts 31C, which will be described later, hold three substrates W. Furthermore, a pusher 33A, which will be described later, supports six substrates W.

[0035] The substrate handling mechanism HTR further includes a hand support section 26, an advancing / retreating section 27, and a lifting / rotating section 29. The hand support section 26 supports the plurality of hands 25. This allows the plurality of hands 25 to move as a unit. The advancing / retreating section 27 moves the plurality of hands 25 forward and backward via the hand support section 26. The lifting / rotating section 29 rotates the advancing / retreating section 27 around a vertical axis AX1 to change the orientation of the hand 25. The lifting / rotating section 29 is fixed to the floor surface and does not move in the horizontal direction (front-rear direction X and width direction Y). The advancing / retreating section 27 and the lifting / rotating section 29 each include an electric motor. The substrate handling mechanism HTR may also include a movable hand (not shown) for transporting only one substrate W, in addition to the hand 25.

[0036] The first position change mechanism 23 includes a position change unit 31 and a pusher mechanism 33. The substrate handling mechanism HTR, the position change unit 31, and the pusher mechanism 33 are arranged in this order on the left side Y. In other words, the substrate handling mechanism HTR, the position change unit 31, and the pusher mechanism 33 (including the pusher 33A) are arranged along the width direction Y perpendicular to the rear direction X from the transfer block 19 toward the processing block 21.

[0037] The attitude conversion unit 31 converts a plurality of substrates W (e.g., 25 substrates) received from the substrate handling mechanism HTR from a horizontal attitude to a vertical attitude. As shown in FIG. 2(a), the attitude conversion unit 31 includes a support table 31A, a pair of horizontal holding units 31B, a pair of vertical holding units 31C, and a rotation drive unit 31D. The pair of horizontal holding units 31B and the pair of vertical holding units 31C are provided on the support table 31A. When the substrates W are in a horizontal attitude, the pair of horizontal holding units 31B support the substrates W from below while contacting the lower surface of each substrate W. When the substrates W are in a vertical attitude, the pair of vertical holding units 31C hold the substrates W. The rotation drive unit 31D rotates the support table 31A around a horizontal axis AX2.

[0038] As shown in FIG. 2(c), the pusher mechanism 33 includes a pusher 33A, a lifting and rotating unit 33B, a horizontal moving unit 33C, and a rail 33D. The pusher 33A holds the lower portion of each of the multiple (e.g., 25 or 50) substrates W that have been converted to a vertical position by the position changing unit 31. In other words, the pusher 33A holds the multiple substrates W received from the substrate handling mechanism HTR via the position changing unit 31 in a vertical position. The lifting and rotating unit 33B lifts and lowers the pusher 33A in the vertical direction Z. The lifting and rotating unit 33B also rotates the pusher 33A around a vertical axis AX3. This allows the device surface of the substrate W, indicated by the arrow AR1, to be oriented in any direction.

[0039] The horizontal moving unit 33C horizontally moves the pusher 33A and the lifting and rotating unit 33B along the rail 33D. The rail 33D extends in the width direction Y. Each of the rotary drive unit 31D, the lifting and rotating unit 33B, and the horizontal moving unit 33C includes an electric motor.

[0040] The shelf 18 corresponds to the first carrier mounting shelf of the present invention. The attitude changing unit 31 corresponds to the first attitude changing unit of the present invention. The pusher 33A corresponds to the vertical holding unit of the present invention. The plurality of substrates of the present invention may be a part of, for example, 25 or 50 substrates W.

[0041] Here, the operation of the first position change mechanism 23 will be described. For example, each of the four batch processing tanks BT1 to BT4 in the processing block 21, which will be described later, processes 50 substrates W corresponding to two carriers C at a time. For this reason, the 50 substrates W (W1, W2) are held by the pusher 33A while the position of each of the 50 substrates W is changed 25 at a time. The 25 substrates W1 are called the first substrate group. The 25 substrates W2 are called the second substrate group. The 50 substrates W (W1, W2) are called the processing substrate group. When the substrates W1 and W2 are not particularly distinguished from each other, the substrates W1 and W2 are described as substrates W.

[0042] See FIG. 2(a). The attitude changing unit 31 receives 25 substrates W1 from the substrate handling mechanism HTR. At this time, the 25 substrates W1 are in a horizontal attitude and aligned at full pitch (e.g., 10 mm intervals). The full pitch is also called normal pitch. The device surface of each substrate W1 faces upward. The device surface of the substrate W is the surface on which electronic circuits are formed and is called the "front surface." The back surface of the substrate W refers to the surface on which electronic circuits are not formed. The surface opposite to the device surface is the back surface.

[0043] See Fig. 2(b). The rotary drive unit 31D of the attitude changing unit 31 rotates the pair of horizontal holding units 31B, etc. by 90 degrees around the horizontal axis AX2 to change the 25 substrates W1 from a horizontal position to a vertical position. Then, the pusher mechanism 33 raises the pusher 33A to receive the 25 substrates W1 from the attitude changing unit 31. Then, the pusher mechanism 33 rotates the pusher 33A by 180 degrees around the vertical axis AX3. This changes the orientation of the 25 substrates W1 from the left Y to the right Y.

[0044] Then, the posture conversion unit 31 receives the 25 substrates W2 from the substrate handling mechanism HTR and converts the 25 substrates W2 from a horizontal posture to a vertical posture. Then, the pusher mechanism 33 raises the pusher 33A holding the 25 substrates W1. As a result, the pusher 33A receives another 25 substrates W2.

[0045] Refer to FIG. 2(c). The pusher 33A holds 50 substrates W (W1, W2). 25 substrates W1 and 25 substrates W2 are arranged alternately. The 50 substrates W are aligned at a half pitch (e.g., 5 mm intervals). The half pitch is half the interval of the full pitch. Thereafter, the pusher mechanism 33 moves the pusher 33A holding the 50 substrates W along the rail 33D to a substrate transfer position PP below a pair of chucks 37, 38 (described later) of the batch transport mechanism WTR1 (described later).

[0046] <3-2. Processing block (batch processing block)> The processing block 21 includes a batch processing area R4. The batch processing area R4 is adjacent to the rear X of the transfer block 19. The batch processing area R4 includes a plurality of (e.g., four) batch processing tanks BT1 to BT4. The four batch processing tanks BT1 to BT4 are arranged in a row in the rear direction X or in the front-rear direction X along which the batch processing device 3 extends. Each of the four batch processing tanks BT1 to BT4 collectively immerses and processes a plurality of substrates W (e.g., 25 or 50 substrates). Each of the four batch processing tanks BT1 to BT4 stores a processing liquid (e.g., a chemical liquid or pure water) in which the plurality of substrates W are immersed.

[0047] The four batch processing tanks BT1 to BT4 are, for example, composed of two chemical processing tanks BT1, BT3 and two water rinsing processing tanks BT2, BT4. The chemical processing tank BT1 and the water rinsing processing tank BT2 form one set, and the chemical processing tank BT3 and the water rinsing processing tank BT4 form another set. The combination of the chemical processing tanks and the water rinsing processing tanks is not limited to this example. The number of batch processing tanks is not limited to four, and may be one or more than two.

[0048] The two chemical processing tanks BT1, BT3 each perform an etching process using a chemical liquid. For example, phosphoric acid is used as the chemical liquid. The chemical processing tanks BT1, BT3 each store a chemical liquid supplied from a chemical liquid jetting pipe (not shown). The two water rinsing processing tanks BT2, BT4 each perform a pure water cleaning process in which the chemical liquid adhering to multiple substrates W is washed away with pure water. For example, deionized water (DIW) is used as the pure water. The water rinsing processing tanks BT2, BT4 each store pure water supplied from a pure water jetting pipe (not shown).

[0049] Four lifters LF1 to LF4 are provided in each of the four batch processing tanks BT1 to BT4. For example, the lifter LF1 holds the substrates W in a vertical position aligned at a predetermined half pitch (for example, 5 mm intervals). The lifter LF1 raises and lowers a plurality of substrates W between a processing position inside the batch processing tank BT1 and a transfer position above the batch processing tank BT1. The other three lifters LF2 to LF4 are configured in the same manner as the lifter LF1. Note that an area R20 shown in FIG. 1 is, for example, an area for preparing the chemical liquid to be supplied to the chemical processing tanks BT1, BT3 (for example, an area for adjusting the temperature and concentration of the chemical liquid to be supplied).

[0050] <3-3. Batch substrate transport area> The batch substrate transport area R3 is disposed on the opposite side of the substrate handling mechanism HTR via the first attitude changing mechanism 23 (including the pusher 33A). One end of the batch substrate transport area R3 extends to an attitude changing area R5 (described later) of the interface device 5. The other end of the batch substrate transport area R3 extends backward X. In other words, the batch substrate transport area R3 extends in the front-rear direction X.

[0051] The batch substrate transfer region R3 includes a batch transfer mechanism (robot) WTR1. The batch transfer mechanism WTR1 transfers a plurality of substrates W in a vertical position among the four batch processing tanks BT1 to BT4, the first position changing mechanism 23 (including a pusher 33A), and the interface device 5 (a standby tank 45 described later).

[0052] The four batch processing tanks BT1 to BT4, the substrate transfer position PP, the standby tank 45 (described later), and the submersible posture change unit 43 (described later) are aligned in a row in the front-rear direction X. Therefore, the batch transport mechanism WTR1 transports a plurality of substrates W in a vertical posture backward X or parallel to the front-rear direction X.

[0053] The batch transport mechanism WTR1 includes a pair of chucks 37, 38 and a guide rail 39. The pair of chucks 37, 38 includes, for example, 50 pairs of holding grooves for holding 50 substrates W. That is, each of the two chucks 37, 38 includes 50 holding grooves. The two chucks 37, 38 each extend parallel to the width direction Y (FIG. 1) in a plan view. The batch transport mechanism WTR1 opens and closes the two chucks 37, 38. The guide rail 39 extends in the front-rear direction X. The batch transport mechanism WTR1 moves the pair of chucks 37, 38 along the guide rail 39. The batch transport mechanism WTR1 is driven by an electric motor.

[0054] <4. Interface device> An overview of the interface device 5 will be described. The interface device 5 receives a plurality of substrates W that have been subjected to a predetermined batch process in either of the two water-rinsing processing tanks BT2, BT4 from the batch transport mechanism WTR1. The interface device 5 converts the received substrates W from a vertical position to a horizontal position. The interface device 5 transports the substrates W converted to the horizontal position to the single substrate processing device 7.

[0055] Next, the interface device 5 will be described in detail with reference to Figs. 1 and 3. The interface device 5 includes a posture changing area R5 and a relay area R6 arranged in the width direction Y. The posture changing area R5 is arranged on the opposite side of the processing block 21 across the transfer block 19. That is, the posture changing area R5 is adjacent to the front X of the transfer block 19. The posture changing area R5 is adjacent to the left Y of the extension area R2 of the stocker device 2, and is also adjacent to the rear X of the main body area R1. The posture changing area R5 is arranged on the left Y of the shelf 18.

[0056] <4-1. Second attitude transformation mechanism> The attitude changing region R5 includes a second attitude changing mechanism 41. The second attitude changing mechanism 41 changes the attitude of a plurality of substrates W processed in the batch processing device 3 from a vertical attitude to a horizontal attitude. The second attitude changing mechanism 41 includes an underwater attitude changing unit 43, a standby tank 45, and a second batch transport mechanism WTR2. The underwater attitude changing unit 43 corresponds to the second attitude changing unit of the present invention.

[0057] The standby tank 45 is provided in front X of the substrate transfer position PP. The standby tank 45 is also provided between the transfer block 19 and the underwater posture change unit 43. The standby tank 45 is provided with a lifter LF7. The lifter LF7 is configured similarly to the lifter LF1. The standby tank 45 stores an immersion liquid in which multiple substrates W are immersed in a vertical posture. Pure water is used as the immersion liquid. The pure water (e.g., DIW) is supplied from a pure water jetting pipe not shown.

[0058] The second batch transport mechanism WTR2 transports a plurality of substrates W (e.g., 25 substrates) in a vertical position from the standby tank 45 to the submersible position change unit 43 along a guide rail 51. The second batch transport mechanism WTR2 includes a pair of chucks 47, 48, a support pillar 49 (see FIG. 5(b)), and a guide rail 51. The support pillar 49 supports the pair of chucks 47, 48 at its upper end. The support pillar 49 rotates the first chuck 47 about a horizontal axis AX4 and rotates the second chuck 48 about a horizontal axis AX5 (see FIG. 4(a)). The horizontal axes AX4, AX5 each extend in the width direction Y.

[0059] The pair of chucks 47, 48 and the support pillar 49 are movable along a guide rail 51 extending in the front-rear direction X. The guide rail 51 is provided at a height position closer to the floor surface of the attitude changing area R5 than the ceiling surface. The guide rail 51 is provided directly or indirectly on the floor surface of the attitude changing area R5. The second batch transport mechanism WTR2 is driven by, for example, an electric motor.

[0060] The guide rail 51 is provided on the opposite side of the batch substrate transport region R3 across the standby tank 45. That is, the guide rail 51 is provided to the right Y of the submersible position changing unit 43 and the standby tank 45. This makes it possible to prevent the second batch transport mechanism WTR2, which transports the substrate W along the guide rail 51, from interfering with the substrate transport from the submersible position changing unit 43 to the intermediate substrate transport mechanism 81 (described later) by crossing between the submersible position changing unit 43 and the intermediate substrate transport mechanism 81.

[0061] Next, a description will be given of the pair of chucks 47, 48. For example, a group of substrates to be processed (e.g., 50 substrates W1, W2) in which a plurality of substrates W1 (e.g., 25 substrates) and another plurality of substrates W2 (e.g., 25 substrates) are alternately arranged is assumed to be immersed in the immersion liquid in the standby tank 45. In this case, the second batch transport mechanism WTR2 uses the pair of chucks 47, 48 to take out a plurality of substrates W1 (W2) (e.g., 25 substrates) from the group of substrates to be processed in the standby tank 45, and transports the taken out plurality of substrates W1 (W2) (e.g., 25 substrates) to the underwater attitude changing unit 43.

[0062] The pair of chucks 47, 48 has a plurality of (for example, four) holding modes. Figs. 4(a) to 4(h) are diagrams for explaining the four holding modes. Figs. 4(a), 4(c), 4(e), and 4(g) are side views showing the pair of chucks 47, 48 as seen in the direction of arrow AR2 shown in Fig. 3. Figs. 4(b), 4(d), 4(f), and 4(h) are cross-sectional views of the pair of chucks 47, 48. For convenience of illustration, six substrates W1 and W2 will be described in Figs. 4(a) to 4(h).

[0063] 4(a) and 4(b) are diagrams showing the first holding mode. In the first holding mode, the pair of chucks 47, 48 are provided with a pair of passing grooves 59, 60. In the first holding mode, the pair of chucks 47, 48 cannot hold any of the 50 substrates W1, W2 held by the lifter LF7. That is, the 50 substrates W1, W2 pass between the chucks 47, 48 (passing grooves 59, 60).

[0064] 4(c) and 4(d) are diagrams showing the second holding mode. In the second holding mode, the pair of chucks 47, 48 has multiple pairs (e.g., 25 pairs) of holding grooves 53A, 54A and multiple pairs (e.g., 25 pairs) of passing grooves 55A, 56A. The 25 pairs of holding grooves 53A, 54A and the 25 pairs of passing grooves 55A, 56A are arranged alternately. The first chuck 47 has 25 holding grooves 53A and 25 passing grooves 55A arranged alternately. The second chuck 48 has 25 holding grooves 54A and 25 passing grooves 56A arranged alternately. The pair of chucks 47, 48 in the second holding mode holds 25 substrates W1 out of the 50 substrates W1, W2.

[0065] 4(e) and 4(f) are diagrams showing a third holding mode. In the third holding mode, the pair of chucks 47, 48 are provided with, for example, 50 pairs of holding grooves 63, 64. The pair of chucks 47, 48 can hold 50 substrates W1, W2 using the 50 pairs of holding grooves 63, 64.

[0066] 4(g) and 4(h) are diagrams showing a fourth holding mode. In the fourth holding mode, the pair of chucks 47, 48 has multiple pairs (e.g., 25 pairs) of holding grooves 53B, 54B and multiple pairs (e.g., 25 pairs) of passing grooves 55B, 56B. The 25 pairs of holding grooves 53B, 54B and the 25 pairs of passing grooves 55B, 56B are alternately arranged. The pair of chucks 47, 48 in the fourth holding mode holds 25 substrates W2 out of the 50 substrates W1, W2.

[0067] As shown in Figures 4(b) and 4(f), for example, in the first chuck 47, a holding groove 63 for the third holding mode is provided on a surface opposite to the passing groove 59 for the first holding mode across the horizontal axis AX4. As shown in Figures 4(d) and 4(h), for example, in the first chuck 47, a holding groove 53B and a passing groove 55B for the fourth holding mode are provided on a surface opposite to the holding groove 53A and the passing groove 55A for the second holding mode across the horizontal axis AX4.

[0068] For example, with the first holding mode shown in FIG. 4(a) as a reference, the first chuck 47 is rotated 90 degrees clockwise around the horizontal axis AX4, and the second chuck 48 is rotated 90 degrees counterclockwise around the horizontal axis AX5. This places the chucks 47, 48 in the second holding mode shown in FIG. 4(c). Furthermore, with the first holding mode as a reference, the first chuck 47 is rotated 180 degrees clockwise around the horizontal axis AX4, and the second chuck 48 is rotated 180 degrees counterclockwise around the horizontal axis AX5. This places the chucks 47, 48 in the third holding mode shown in FIG. 4(e).

[0069] Similarly, with the first holding mode as a reference, the first chuck 47 is rotated 270 degrees clockwise and the second chuck 48 is rotated 270 degrees counterclockwise, whereby the chucks 47, 48 are placed in a fourth holding mode shown in FIG.

[0070] Next, the underwater posture conversion unit 43 will be described. The underwater posture conversion unit 43 converts a plurality of substrates W from a vertical posture to a horizontal posture. As shown in Figures 3 and 5(a), the underwater posture conversion unit 43 is provided at the front X of the standby tank 45. The underwater posture conversion unit 43 includes an in-tank carrier 67, a lifter LF8, a posture conversion tank 69, a rotation mechanism 71, a pusher mechanism 73, and a horizontal push-out mechanism 75 (see Figure 7(b)).

[0071] The intra-tank carrier 67 can store multiple (e.g., 25 or 50) substrates W. The intra-tank carrier 67 has an entrance / exit 67A and a back opening 67B. The entrance / exit 67A is an opening for allowing the substrate W to enter and exit. The back opening 67B faces the entrance / exit 67A. Furthermore, the back opening 67B is formed with a width smaller than the diameter of the substrate W in the radial direction of the stored substrate W. Therefore, multiple substrates W cannot pass through the back opening 67B.

[0072] The lifter LF8 has two carrier support parts 77 that support the in-tank carrier 67. The lifter LF8 raises and lowers the two carrier support parts 77. The posture change tank 69 accommodates the in-tank carrier 67, the two carrier support parts 77 of the lifter LF8, and a pusher 73A (described later). The posture change tank 69 stores pure water (e.g., DIW) supplied from a pure water jet pipe (not shown). This allows the in-tank carrier 67 to be immersed in the pure water in the posture change tank 69.

[0073] The rotation mechanism 71 includes two opposing shafts 71A. Each of the two shafts 71A penetrates the posture change tank 69. The rotation mechanism 71 holds the intra-tank carrier 67 by sandwiching the intra-tank carrier 67 between the two shafts 71A. Furthermore, the rotation mechanism 71 can rotate the intra-tank carrier 67 held by the two shafts 71A about a horizontal axis AX6 of the shaft 71A. The horizontal axis AX6 extends in the front-rear direction X.

[0074] The pusher mechanism 73 includes a pusher 73A that holds the lower portions of a plurality of (e.g., 25) substrates W in a vertical position. The pusher mechanism 73 can raise and lower the pusher 73A and rotate it about a vertical axis AX7 (see FIG. 5(b)). The horizontal push-out mechanism 75 includes a push-out member 75A that pushes out one substrate W in a horizontal position (see FIG. 7(b)). When the entrance / exit 67A of the intra-tank carrier 67 faces the leftward Y, the push-out member 75A is moved to the leftward Y while passing through the rear opening 67B and the entrance / exit 67A. The lifter LF8, the rotation mechanism 71, the pusher mechanism 73, and the horizontal push-out mechanism 75 are each driven by at least one of an electric motor and an air cylinder.

[0075] <4-2. Operation of the second attitude transformation mechanism> Here, the operation of the second position change mechanism 41 will be described. See Fig. 5(a). 50 substrates W held in a vertical position by a lifter LF7 are immersed in the pure water in the standby tank 45. The 50 substrates W are composed of 25 substrates W1 and 25 substrates W2 arranged alternately, as shown in Fig. 2(c).

[0076] The second batch transfer mechanism WTR2 moves to above the standby tank 45. The second batch transfer mechanism WTR2 sets the pair of chucks 47, 48 to the first holding mode (see FIGS. 4(a) and 4(b)). Thereafter, the lifter LF7 passes the 50 substrates W between the chucks 47, 48, while raising the 50 substrates W to a position higher than the pair of chucks 47, 48.

[0077] The second batch transport mechanism WTR2 then sets the pair of chucks 47, 48 to the second holding mode (see Figures 4(c) and 4(d)). The lifter LF7 then lowers the 50 substrates W. As a result, the second batch transport mechanism WTR2 receives 25 substrates W1 out of the 50 substrates W from the lifter LF7. As a result, 25 substrates W2 are left on the lifter LF7. The lifter LF7 immerses the 25 substrates W2 in pure water in the standby tank 45. The second batch transport mechanism WTR2 then transports the 25 substrates W1 above the posture changing tank 69 and the pusher 73A.

[0078] Refer to Fig. 5(b). The two carrier support parts 77 of the lifter LF8 support the in-tank carrier 67 with the inlet / outlet 67A facing upward. The pusher mechanism 73 raises the pusher 73A while passing the pusher 73A between the two carrier support parts 77, through the rear opening 67B and the inlet / outlet 67A. As a result, the pusher 73A receives the 25 substrates W1 from the pair of chucks 47, 48, indicated by the dashed lines, by holding the lower parts of the 25 substrates W1 held by the pair of chucks 47, 48.

[0079] Thereafter, the second batch transport mechanism WTR2 sets the pair of chucks 47, 48 to the first holding mode (see FIGS. 4(a) and 4(b)). Thereafter, the pusher mechanism 73 lowers the pusher 73A while passing the 25 substrates W1 held by the pusher 73A between the chucks 47, 48. The pusher 73A is lowered to a position where it does not interfere with the pair of chucks 47, 48. Thereafter, the second batch transport mechanism WTR2 moves from above the pusher 73A.

[0080] After that, the pusher mechanism 73 rotates the 25 substrates W1 around the vertical axis AX7 so that the device surfaces face upward when the 25 substrates W1 are converted to a horizontal posture. This adjusts the orientation of the 25 substrates W1. This adjustment is performed, for example, at a position higher than the surface of the pure water in the posture conversion tank 69.

[0081] See Fig. 5(c). The lifter LF8 raises the two carrier support parts 77 supporting the intra-tank carrier 67 with the entrance / exit 67A facing upward from position P1 to position P2. As a result, the 25 substrates W1 held by the pushers 73A are stored in the intra-tank carrier 67. Note that position P2 is, for example, a position higher than the water surface of the pure water in the attitude changing tank 69.

[0082] 6(a). Then, the pusher mechanism 73 lowers the pusher 73A to the bottom surface of the intra-tank carrier 67. In addition, the lifter LF8 lowers the two carrier support parts 77 from position P2 to position P1. As a result, the 25 substrates W1 stored in the intra-tank carrier 67 are immersed in the pure water in the attitude changing tank 69.

[0083] See FIG. 6(b). Then, the rotation mechanism 71 holds the intra-tank carrier 67 with the two shafts 71A. See FIG. 6(c). Then, the lifter LF8 lowers the two carrier support parts 77 from position P1 to position P3. As a result, the intra-tank carrier 67 is held only by the two shafts 71A. Note that position P3 is a position near the bottom surface of the intra-tank carrier 67. Then, the rotation mechanism 71 rotates the intra-tank carrier 67 by 90 degrees around the horizontal axis AX6. As a result, the 25 substrates W1 in the intra-tank carrier 67 are converted from a vertical position to a horizontal position. At this time, the device surface of each substrate W1 faces upward.

[0084] See Fig. 7(a). Then, the lifter LF8 raises the two carrier support parts 77 from position P3 to position P4. As a result, the two carrier support parts 77 come into contact with the lower surface of the intra-tank carrier 67. Then, the rotation mechanism 71 separates the two shafts 71A from the intra-tank carrier 67. As a result, the intra-tank carrier 67 is held only by the two carrier support parts 77.

[0085] See Fig. 7(b). Thereafter, the lifter LF8 raises the two carrier support parts 77 so that the single substrate W1 is removed from the pure water in the posture conversion tank 69. Thereafter, the horizontal push-out mechanism 75 pushes the single substrate W1 taken out of the pure water by the push-out member 75A to the left Y. The pushed-out substrate W1 is transported to an intermediate substrate transport mechanism 81 (described later) in the intermediate region R6.

[0086] Thereafter, 25 substrates W1 are transported from the intra-tank carrier 67, and then the remaining 25 substrates W2 immersed in the pure water in the standby tank 45 are converted to a horizontal posture. When receiving the 25 substrates W2 from the lifter LF7, the second batch transport mechanism WTR2 sets the pair of chucks 47, 48 to the fourth holding mode (see FIGS. 4(g) and 4(h)). Otherwise, the posture conversion of the 25 substrates W2 is performed in the same manner as the posture conversion of the 25 substrates W1 (see FIGS. 5(a) to 7(b)).

[0087] <4-3. Intermediate board transport mechanism> Refer to Figures 1 and 3. The relay area R6 is adjacent to or connected to the left side Y of the attitude changing area R5. The relay area R6 extends in the width direction Y. That is, the relay area R6 extends to the left side Y from the attitude changing area R5. The relay area R6 is equipped with an relay board transport mechanism 81. The relay board transport mechanism 81 transports multiple boards W that have been converted to a horizontal attitude by the second attitude changing mechanism 41 to the single-wafer processing device 7. The relay board transport mechanism 81 is equipped with a belt conveyor 83. The relay area R6 is isolated from the atmosphere outside the substrate processing system 1 by a housing 82.

[0088] The belt conveyor 83 includes two pulleys 84, two belts 85, and a pin lifting unit 87 (see FIG. 3). The two belts 85 are stretched around the two pulleys 84. The pin lifting unit 87 is provided at the tip of the belt conveyor 83. The pin lifting unit 87 has three lift pins (not shown) and lifts up one substrate W on the two belts 85 using the three lift pins. At least one of the two pulleys 84 and the pin lifting unit 87 are each driven by an electric motor.

[0089] <5. Single wafer processing equipment> 1, the single-wafer processing device 7 performs a predetermined single-wafer processing on the multiple substrates W received from the interface device 5, one by one, and transports the multiple substrates W that have undergone the single-wafer processing to a carrier C placed on a shelf 89.

[0090] The single wafer processing device 7 is provided on the opposite side of the transfer block 19 and the processing block 21 across the batch substrate transport area R3 of the batch processing device 3. In other words, the single wafer processing device 7 is provided on the left side Y of the batch processing device 3. A maintenance area R7 is provided between the batch processing device 3 and the single wafer processing device 7.

[0091] The single wafer processing apparatus 7 includes a shelf 89 on which the carriers C are placed, and a single wafer processing block 90. ​​The single wafer processing block 90 is adjacent to the rear X of the shelf 89. The single wafer processing block 90 includes a plurality of single wafer processing chambers SW1, SW2 (described later) which perform predetermined processing one by one on the plurality of substrates W processed in the batch processing apparatus 3. The shelf 89 is disposed in the main body region R1. The shelf 89 corresponds to the second carrier placement shelf of the present invention.

[0092] The single substrate processing block 90 includes a transfer area R8, a single substrate transport area R9, and two single substrate processing areas R10, R11. The transfer area R8 is adjacent to the leading end of the relay area R6 and the shelf 89. The single substrate transport area R9 extends rearward X from the transfer area R8. The first single substrate processing area R10 is adjacent to the left Y of the single substrate transport area R9. The second single substrate processing area R11 is adjacent to the right of the single substrate transport area R9. Each of the two single substrate processing areas R10, R11 extends in the front-rear direction X.

[0093] The first single substrate processing area R10 includes a front tower TW1, a rear tower TW2, and a substrate transport robot CR1, which are arranged in this order along the single substrate transport area R9.

[0094] The front tower TW1 is provided in front X of the substrate transport robot CR1. The rear tower TW2 is provided in rear X of the substrate transport robot CR1. The front tower TW1 includes one first single wafer processing chamber SW1 and two second single wafer processing chambers SW2 stacked in the vertical direction Z as shown in FIG. 8. The rear tower TW2 includes three second single wafer processing chambers SW2 stacked in the vertical direction Z. That is, the first single wafer processing region R10 includes a total of six single wafer processing chambers SW1, SW2. Each single wafer processing chamber SW1, SW2 is provided along the single wafer transfer region R9 and performs a predetermined process on one substrate W.

[0095] The substrate transport robot CR1 includes a hand 91, an advancing / retreating unit 92, and a lifting / rotating unit 93. The hand 91 holds one substrate W in a horizontal position. The advancing / retreating unit 92 moves the hand 91 forward and backward. The lifting / rotating unit 93 raises and lowers the hand 91 and the advancing / retreating unit 92. The lifting / rotating unit 93 also rotates the hand 91 and the advancing / retreating unit 92 around a vertical axis AX8 to change the orientation of the hand 91. The substrate transport robot CR1 transports one substrate W in a horizontal position between the three single wafer processing chambers SW1, SW2 of the front tower TW1 and the three second single wafer processing chambers SW2 of the rear tower TW2.

[0096] The second single substrate processing region R11 includes a front tower TW1, a rear tower TW2, and a substrate transport robot CR2, similar to the first single substrate processing region R10. That is, the second single substrate processing region R11 includes six single substrate processing chambers SW1, SW2. The substrate transport robot CR2 is configured similarly to the substrate transport robot CR1. The types and numbers of the single substrate processing chambers included in the front tower TW1 and the rear tower TW2 are set appropriately.

[0097] The first single wafer processing chamber SW1 includes, for example, a holding and rotating unit 94 and a nozzle 95. The holding and rotating unit 94 includes a spin chuck that holds one substrate W in a horizontal position, and an electric motor that rotates the spin chuck around a vertical axis passing through the center of the substrate W. The nozzle 95 supplies a processing liquid onto the substrate W held by the holding and rotating unit 94. For example, pure water (e.g., DIW) and IPA (isopropyl alcohol) are used as the processing liquid. The first single wafer processing chamber SW1 performs a cleaning process on the substrate W with pure water, and then forms a liquid film of IPA on the upper surface of the substrate W.

[0098] Each of the second single wafer processing chambers SW2 performs drying processing using, for example, a supercritical fluid. For example, carbon dioxide is used as the fluid. When the fluid is carbon dioxide, the supercritical state is obtained when the critical temperature is 31° C. and the critical pressure is 7.38 MPa. By performing drying processing using a supercritical fluid, it is possible to make it difficult for pattern collapse to occur on the substrate W.

[0099] The second single-wafer processing chamber SW2 includes a chamber body (container) 96, a support tray 97, and a lid. The chamber body 96 includes a processing space provided therein, an opening for inserting the substrate W into the processing space, a supply port, and an exhaust port. The substrate W is accommodated in the processing space while being supported by the support tray 97. The lid closes the opening of the chamber body 96. For example, each second single-wafer processing chamber SW2 brings a fluid into a supercritical state and supplies the supercritical fluid to the processing space in the chamber body 96 from the supply port. A drying process is performed on one substrate W by the supercritical fluid supplied to the processing space.

[0100] The single substrate transport region R9 includes a substrate transport robot CR3. The substrate transport robot CR3 transports one substrate W in a horizontal position between the intermediate substrate transport mechanism 81, the twelve single substrate processing chambers SW1 and SW2, and the carrier C placed on the shelf 89. The substrate transport robot CR3 also receives the substrate W transported by the intermediate substrate transport mechanism 81, and transports the received substrate W to a first single substrate processing chamber SW1 of the plurality (e.g., twelve) single substrate processing chambers SW1 and SW2. The substrate transport robot CR3 stores the substrate W that has been processed in a second single substrate processing chamber SW2 of the plurality (e.g., twelve) single substrate processing chambers SW1 and SW2 in the carrier C placed on the shelf 89.

[0101] The substrate transport robot CR3 includes a hand 91, a forward / backward moving part 92, and a lifting / rotating part 93, similar to the substrate transport robot CR1. The substrate transport robot CR3 further includes a guide rail 101 extending in the front-rear direction X. One end of the guide rail 101 extends to the transfer area R8. The lifting / rotating part 93 and the like of the substrate transport robot CR3 can move along the guide rail 101. The substrate transport robot CR3 preferably includes two hands 91. In this case, the first hand 91 is used to transport a wet substrate W, and the second hand 91 is used to transport a substrate W dried in the second single-wafer processing chamber SW2. Each of the substrate transport robots CR1 to CR3 corresponds to a horizontal substrate transport robot of the present invention.

[0102] <6. Control unit> The substrate processing system 1 includes a control unit 110 (see FIG. 1) and a storage unit (not shown). The control unit 110 controls each component of the substrate processing system 1. The control unit 110 includes one or more processors, such as a central processing unit (CPU). The storage unit includes at least one of a read-only memory (ROM), a random-access memory (RAM), and a hard disk, for example. The storage unit stores computer programs required to control each component of the substrate processing system 1.

[0103] <7. Operation of the Substrate Processing System> Next, the operation of the substrate processing system 1 will be described with reference to the flow chart of Fig. 9. With reference to Fig. 1, an external transfer robot (not shown) transfers two carriers C to the load port 9.

[0104] [Step S01] Removing the substrate from the carrier The carrier transport robot 16 of the stocker apparatus 2 transports the first carrier C storing 25 unprocessed substrates W1 from the load port 9 to the shelf 18. Thereafter, the substrate handling mechanism HTR of the batch processing apparatus 3 takes out the 25 substrates W1 (first substrate group) from the first carrier C transported to the shelf 18, and transports the 25 substrates W1 to the attitude conversion unit 31.

[0105] Thereafter, the carrier transport robot 16 transports the first carrier C (empty carrier) from which the 25 substrates W1 have been removed, from the shelf 18 to the shelf 89. Thereafter, the carrier transport robot 16 transports the second carrier C storing the 25 unprocessed substrates W2 from the load port 9 to the shelf 18. Thereafter, the substrate handling mechanism HTR removes the 25 substrates W2 (second substrate group) from the second carrier C transported to the shelf 18, and transports the 25 substrates W2 to the attitude conversion unit 31.

[0106] Thereafter, the carrier transport robot 16 transports the second carrier C (empty carrier) from which the 25 substrates W2 have been removed, from the shelf 18 to the storage shelf 15. The second carrier C is stored in the storage shelf 15 until it can be transported to the shelf 89.

[0107] [Step S02] Transformation to vertical posture 2(a) to 2(c), the posture conversion unit 31 converts the 25 substrates W1 and the 25 substrates W2 individually from a horizontal posture to a vertical posture. The pusher 33A of the pusher mechanism 33 holds the 50 substrates W (substrates W1, W2) in which the 25 substrates W1 and the 25 substrates W2 are alternately arranged, in a vertical posture. The pusher mechanism 33 then transports the 50 substrates W to the substrate transfer position PP.

[0108] [Step S03] Chemical treatment The batch transport mechanism WTR1 receives 50 substrates W in a vertical position from the pusher mechanism 33 at the substrate transfer position PP, and transports the 50 substrates W to one of the two lifters LF1, LF3 of the two chemical liquid processing baths BT1, BT3.

[0109] For example, the batch transfer mechanism WTR1 transports 50 substrates W in a vertical position to the lifter LF1 of the chemical liquid treatment tank BT1. The lifter LF1 receives the 50 substrates W at a position above the chemical liquid treatment tank BT1. The lifter LF1 immerses the 50 substrates W in the chemical liquid (e.g., phosphoric acid) in the chemical liquid treatment tank BT1. This performs an etching process (batch process). After the etching process, the lifter LF1 lifts the 50 substrates W out of the phosphoric acid in the chemical liquid treatment tank BT1. Note that when the 50 substrates W are transported to the lifter LF3 of another chemical liquid treatment tank BT3, the same process as in the chemical liquid treatment tank BT1 is performed.

[0110] [Step S04] Pure water cleaning process The batch transfer mechanism WTR1 receives, for example, 50 substrates W in a vertical position from the lifter LF1, and transports the 50 substrates W to the lifter LF2 in the water-rinsing processing tank BT2. The lifter LF2 receives the 50 substrates W at a position above the water-rinsing processing tank BT2. The lifter LF2 immerses the 50 substrates W in the pure water in the water-rinsing processing tank BT2. In this way, the cleaning process (batch process) is performed.

[0111] When the batch transport mechanism WTR1 receives 50 vertically oriented substrates W from the lifter LF3, the batch transport mechanism WTR1 transports the 50 substrates W to the lifter LF4 of the water-rinsing processing tank BT4. The lifter LF4 immerses the 50 substrates W in the pure water in the water-rinsing processing tank BT4.

[0112] [Step S05] Changing posture to horizontal posture and transporting the substrate The batch transfer mechanism WTR1 receives 50 substrates W that have been cleaned with pure water from one of the two lifters LF2, LF4. When transporting the 50 substrates W, for example, the lifter LF2 lifts the 50 substrates W from the pure water in the water-cleaning processing tank BT2. The batch transfer mechanism WTR1 transports the received 50 substrates W beyond the substrate transfer position PP of the first position changing mechanism 23 to the lifter LF7 in the standby tank 45 of the interface device 5. The lifter LF7 receives the 50 substrates W at a position above the standby tank 45.

[0113] As shown in Figs. 5(a) to 7(b), the underwater position conversion unit 43 converts the 25 substrates W1 and the 25 substrates W2 individually from a vertical position to a horizontal position. The underwater position conversion unit 43 transports the 25 substrates W1 (25 substrates W2) converted to the horizontal position one by one to the belt conveyor 83 of the relay substrate transport mechanism 81. The belt conveyor 83 transports one substrate W in the horizontal position to the left Y to a position above the pin lifting unit 87. Thereafter, the pin lifting unit 87 raises one substrate W on the two belts 85 by three pins (not shown).

[0114] [Step S06] First single wafer processing The substrate transport robot CR3 uses the first hand 91 to receive one wet substrate W lifted by the three pins of the pin lifting section 87. Then, the substrate transport robot CR3 transports the substrate W received by the first hand 91 to one of the two first single-wafer processing chambers SW1 of the two front towers TW1.

[0115] Each of the first single-wafer processing chambers SW1 holds and rotates the substrate W with its device surface facing upward in a horizontal position by the holding and rotating unit 94, and also supplies pure water to the device surface from the nozzle 95. Thereafter, each of the first single-wafer processing chambers SW1 supplies IPA from the nozzle 95 to the device surface (upper surface) of the substrate W to replace the pure water on the substrate W with the IPA.

[0116] [Step S07] Second single wafer processing It is assumed that the substrate W has been processed in the first single-wafer processing chamber SW1 in the first single-wafer substrate processing region R10. In this case, the substrate transport robot CR1 transports the substrate W, whose gas has been replaced with IPA, from the first single-wafer processing chamber SW1 in the first single-wafer substrate processing region R10 to any one of the five second single-wafer processing chambers SW2 in the first single-wafer substrate processing region R10. Similarly, it is assumed that the substrate W has been processed in the first single-wafer processing chamber SW1 in the second single-wafer substrate processing region R11. In this case, the second substrate transport robot CR2 transports the substrate W, whose gas has been replaced with IPA, from the first single-wafer processing chamber SW1 in the second single-wafer substrate processing region R11 to any one of the five second single-wafer processing chambers SW2 in the second single-wafer substrate processing region R11.

[0117] Each of the second single-wafer processing chambers SW2 uses carbon dioxide in a supercritical state (supercritical fluid) to perform a drying process on one of the substrates W. The drying process using the supercritical fluid suppresses pattern collapse on the pattern surface (device surface) of the substrate W.

[0118] [Step S08] Storing substrates in carriers The substrate transport robot CR3 receives one substrate W1 from the second single-wafer processing chamber SW2 where the drying process has been performed, using the second hand 91 of the two hands 91. Then, the substrate transport robot CR3 transports the substrate W1 received by the second hand 91 to the first carrier C placed on the shelf 89.

[0119] When the 25 substrates W1 are stored in the first carrier C, the carrier transport robot 16 transports the first carrier C from the shelf 89 to one of the two load ports 9. In addition, the carrier transport robot 16 transports the second carrier C (empty carrier) from the storage shelf 15 to the shelf 89 to which the first carrier C has been transported.

[0120] Similarly, the substrate transport robot CR3 uses the second hand 91 to receive one substrate W2 from the second single-wafer processing chamber SW2 where drying processing has been performed. Then, the substrate transport robot CR3 transports the substrate W2 received by the second hand 91 to the second carrier C placed on the shelf 89. When 25 substrates W2 are stored in the second carrier C, the carrier transport robot 16 transports the second carrier C from the shelf 89 to one of the two load ports 9. An external transport mechanism (not shown) transports the two carriers C in turn from the load port 9 to their next destinations.

[0121] According to this embodiment, the attitude changing area R5 of the interface device 5 is provided on the opposite side to the processing block 21 having four batch processing tanks BT1 to BT4 via the transfer block 19 of the batch processing device 3. For example, it is assumed that the length of the batch processing device 3 may change at the rear X to which the batch processing device 3 extends due to an increase or decrease in the number of batch processing tanks in the batch processing device 3. Even in this case, there is no need to change the configuration of at least the transfer block 19 and the interface device 5 (attitude changing area R5 and relay area R6) of the batch processing device 3. Therefore, the configuration of the batch processing device 3 and the single wafer processing device 7 can be freely changed.

[0122] The explanation of this effect will be supplemented. Fig. 10(a) is a plan view showing the substrate processing system 1 in which the interface device 5 is connected at the rear X of the batch processing device 3 and the rear X of the single substrate processing device 7. In this case, for example, as shown in Fig. 10(b), the batch processing device 3 (processing block 21) shown in Fig. 10(a) is lengthened toward the rear X. With this change, for example, as shown in Fig. 10(b), it becomes necessary to lengthen the single substrate transport region R9 in the front-rear direction X.

[0123] In contrast, Fig. 11(a) is a plan view showing the substrate processing system 1 according to the first embodiment. In this case, for example, as shown in Fig. 11(b), the batch processing device 3 (processing block 21) shown in Fig. 11(a) is lengthened toward the rear X. Even with such a change, for example, it is not necessary to change the configurations of the transfer block 19 and the interface device 5 (attitude change area R5 and relay area R6). Similarly, it is not necessary to change the configurations of the transfer area R8 and the stocker device 2, and the positions of the two shelves 18, 89. Note that "no change is necessary" does not restrict the possibility of change.

[0124] Therefore, even if the batch processing device 3 is lengthened in the rear X direction, the stocker device 2, the transfer block 19, the interface device 5, etc. can be used in their original state. This is the same even if the single wafer processing device 7 is lengthened in the rear X direction. Therefore, the configurations of the batch processing device 3 and the single wafer processing device 7 can be freely changed (for example, changed to expand or contract in the front-rear direction X).

[0125] In addition, since the posture changing area R5 is provided on the opposite side of the processing block 21 across the transfer block 19, it is possible to prevent the relay area R6 of the interface device 5 from intersecting with the batch substrate transport area R3 in a plan view. This prevents the configuration from becoming complicated. Furthermore, the single wafer processing device 7 is provided on the opposite side of the transfer block 19 across the batch substrate transport area R3. This makes it possible to reduce the size of the interface device 5 blocking one side (front X) of the transfer block 19 in a plan view. Furthermore, it is possible to ensure a wide maintenance area on the opposite side of the batch substrate transport area R3 across, for example, the batch processing tank BT4.

[0126] The second position changing mechanism 41 also includes a submersible position changing unit 43 that changes the multiple substrates W from a vertical position to a horizontal position, and a standby tank 45 that is provided between the transfer block 19 and the submersible position changing unit 43 and stores immersion liquid in which the multiple substrates W are immersed in the vertical position. The second position changing mechanism 41 can hold the multiple substrates W in a standby state while immersing the multiple substrates W in the vertical position in the immersion liquid stored in the standby tank 45.

[0127] The second batch transport mechanism WTR2 also includes a pair of chucks 47, 48 in which, for example, pairs of holding grooves 53A, 54A and pairs of passing grooves 55A, 56A are alternately arranged. When a processing substrate group in which a plurality of substrates W1 and other substrates W2 are alternately arranged is immersed in the immersion liquid in the standby tank 45, the second batch transport mechanism WTR2 uses the pair of chucks 47, 48 to take out, for example, a plurality of substrates W1 from the processing substrate group and transport the taken out substrates W1 to the underwater attitude changing unit 43.

[0128] The second batch transport mechanism WTR2 can take out a plurality of substrates W1 (first substrate group) from a processing substrate group in which a plurality of substrates W1 (first substrate group) and another plurality of substrates W2 (second substrate group) are alternately arranged. The taken out plurality of substrates W1 (first substrate group) are converted to a horizontal posture by the underwater posture conversion unit 43. Meanwhile, the other plurality of substrates W2 (second substrate group) can be made to wait while being immersed in the immersion liquid in the waiting tank 45. This can prevent the other plurality of substrates W2 (second substrate group) from drying out during waiting. Also, by taking out the plurality of substrates W1 (first substrate group), it is possible to widen the pitch (the distance between two adjacent substrates W1 (W2)) of the plurality of substrates W1 (first substrate group) and the other plurality of substrates W2 (second substrate group). Example 2

[0129] Second Embodiment Next, a second embodiment of the present invention will be described with reference to the drawings. Note that descriptions overlapping with those of the first embodiment will be omitted. Fig. 12 is a plan view showing a schematic configuration of a substrate processing system 1 according to the second embodiment.

[0130] In the first embodiment, the stocker apparatus 2 transports the carrier C to the shelf 18 adjacent to the batch processing apparatus 3, and receives the carrier C from the shelf 89 adjacent to the single wafer processing apparatus 7. In this regard, the stocker apparatus 2 does not necessarily have to receive the carrier C from the shelf 89. In other words, the stocker apparatus 2 does not necessarily have to have access to the shelf 89.

[0131] In addition, in the first embodiment, the single wafer processing apparatus 7 includes a first single wafer processing chamber SW1 and a second single wafer processing chamber SW2. In this regard, in the second embodiment, the single wafer processing apparatus 7 may include a first single wafer processing chamber SW1 without including a second single wafer processing chamber SW2.

[0132] In addition, in the first embodiment, the single substrate transport region R9 is provided with a substrate transport robot CR3 that can transport the substrate W in the forward and backward directions X along the guide rails 101. In this regard, in the second embodiment, the single substrate transport region R9 may be provided with a shuttle mechanism 112 and a substrate transport robot CR4.

[0133] Please refer to Fig. 12. The main body area R1 of the stocker apparatus 2 is not adjacent to the single-wafer processing apparatus 7. In the second embodiment, the single-wafer processing block 90 of the single-wafer processing apparatus 7 includes an indexer area 113. The single-wafer processing apparatus 7 also includes a plurality of shelves 114 (for example, two shelves 114). The number of shelves 114 may be one. Each shelf 114 corresponds to the second carrier mounting shelf of the present invention.

[0134] The indexer region 113 is adjacent to the front X of the transfer region R8. In addition, two shelves 114 are adjacent to the front X of the indexer region 113. In a certain section, a transport path RT (see FIG. 12) of an external transport mechanism (e.g., OHT: Overhead Hoist Transport) (not shown) is formed to extend linearly in the width direction Y. A plurality of load ports 9 and a plurality of shelves 114 are arranged to overlap this transport path RT in a plan view.

[0135] When the substrate handling mechanism HTR of the batch processing device 3 removes 25 substrates W from the carrier C placed on the shelf 18, the carrier transport robot 16 transports the empty carrier C from the shelf 18 to the load port 9. The external transport mechanism transports the empty carrier C from the load port 9 to the shelf 114 along the transport path RT.

[0136] The indexer region 113 includes a substrate transport robot CR5. The substrate transport robot CR5 includes a hand 115, an articulated arm 117, and a lifting platform 119. The hand 115 holds one substrate W and is movable. The articulated arm 117 is, for example, a SCARA type robot arm. A base end of the articulated arm 117 is attached to the lifting platform 119 so as to be rotatable about a vertical axis. A hand 115 is attached to a tip end of the articulated arm 117. The articulated arm 117 and the lifting platform 119 are each driven by an electric motor. The substrate transport robot CR5 transports the substrate W from a substrate placement part PS1 (described later) to a carrier C placed on a shelf 114.

[0137] The single substrate transport region R9 includes a shuttle mechanism 112. The shuttle mechanism 112 is provided between the two substrate transport robots CR4 and CR5. The shuttle mechanism 112 includes a substrate placement part PS1, a guide rail 121, and an electric motor (not shown).

[0138] The substrate mounting part PS1 is configured to mount a plurality of substrates W thereon. To this end, the substrate mounting part PS1 includes a plurality of mounting plates (not shown) arranged in the vertical direction Z. The substrate mounting part PS1 may be configured to mount only one substrate W thereon. The guide rails 121 extend in the front-rear direction X. One end of the guide rails 121 extends to the transfer region R8. The substrate mounting part PS1 is movable along the guide rails 121.

[0139] The shuttle mechanism 112 uses an electric motor to move the substrate placement part PS1 between an intermediate position P11, a processing side position P12, and a storage side position P13. The intermediate position P11 is a position where a substrate transport robot CR6, which will be described later, can access the substrate placement part PS1. The processing side position P12 is a position where a substrate transport robot CR4 can access the substrate placement part PS1. The storage side position P13 is a position where a substrate transport robot CR5 can access the substrate placement part PS1.

[0140] The first single substrate processing region R10 does not include the substrate transport robot CR1 shown in Fig. 1, but includes a front tower TW1 and a rear tower TW2. Each of the front tower TW1 and the rear tower TW2 does not include a second single substrate processing chamber SW2, but includes three first single substrate processing chambers SW1 stacked in the vertical direction Z.

[0141] The second single substrate processing area R11 does not include the substrate transport robot CR2 shown in Fig. 1, but includes a front tower TW1 and a rear tower TW2. Each of the front tower TW1 and the rear tower TW2 does not include a second single substrate processing chamber SW2, but includes three first single substrate processing chambers SW1 stacked in the vertical direction Z. Each of the twelve first single substrate processing chambers SW1 in the two single substrate processing areas R10, R11 processes one substrate W with, for example, pure water and IPA, and then performs spin drying.

[0142] The second single substrate processing region R11 also includes a substrate transport robot CR6 provided between the relay region R6 and the front tower TW1. The substrate transport robot CR6 is configured similarly to the substrate transport robot CR1. The substrate transport robot CR6 includes, for example, a movable hand 91. The substrate transport robot CR6 transports one substrate W from the belt conveyor 83 to the substrate placement part PS1.

[0143] The substrate transport robot CR4 is disposed surrounded by two front towers TW1 and two rear towers TW2. Like the substrate transport robot CR1, the substrate transport robot CR4 includes, for example, two hands 91, a forward / backward moving part 92, and a lifting / rotating part 93. The substrate transport robot CR4 transports one substrate W between the twelve first single-wafer processing chambers SW1 and the substrate placement part PS1.

[0144] The operation of the single substrate processing apparatus 7 of this embodiment will be briefly described. The belt conveyor 83 of the relay substrate transport mechanism 81 transports one substrate W in a horizontal position to a position above the pin lifting unit 87. The pin lifting unit 87 then lifts up the substrate W. The lifted substrate W is in a horizontal position, and its device surface is wet. The substrate transport robot CR6 in the second single substrate processing region R11 receives the substrate W lifted by the pin lifting unit 87. The substrate transport robot CR6 then transports the received substrate W to the substrate placement unit PS1 that has been moved to the intermediate position P11.

[0145] Thereafter, the shuttle mechanism 112 moves the substrate platform PS1 from the intermediate position P11 to the processing side position P12. The substrate transport robot CR4 in the single substrate transport region R9 takes out one horizontally oriented substrate W from the substrate platform PS1 using the first hand 91. The substrate transport robot CR4 then transports the taken out substrate W to any one of the twelve first single substrate processing chambers SW1.

[0146] Each of the first single-wafer processing chambers SW1 processes one substrate W in a horizontal position with pure water and IPA, and then performs spin drying to dry the substrate W. Thereafter, the substrate transport robot CR4 uses the second hand 91 to receive the dried substrate W from the first single-wafer processing chamber SW1 where the single-wafer processing has been performed, and transports the received substrate W to the substrate mounting part PS1.

[0147] Thereafter, the shuttle mechanism 112 moves the substrate platform PS1 from the processing side position P12 to the storage side position P13. The substrate transport robot CR5 in the indexer region 113 transports one dried substrate W from the substrate platform PS1 to a carrier C placed on a shelf 114. When, for example, 25 substrates W are stored in the carrier C, an external transport mechanism (not shown) transports the carrier C storing the processed substrates W from the shelf 114 to the next destination along the transport path RT.

[0148] According to this embodiment, even if the stocker apparatus 2 shown in FIG. 10 is different from the stocker apparatus 2 shown in FIG. 1, the substrate processing system 1 of this embodiment has the same effects as those of the first embodiment.

[0149] 12, the shuttle mechanism 112 and the three substrate transport robots CR4, CR5, and CR6 transport one substrate W between the belt conveyor 83 (relay substrate transport mechanism 81), the twelve first single-wafer processing chambers SW1, and the carrier C placed on the shelf 114. In this regard, at least one substrate transport robot (for example, the substrate transport robot CR3 shown in FIG. 1) may transport one substrate W between the belt conveyor 83, the twelve first single-wafer processing chambers SW1, and the carrier C placed on the shelf 114. The shuttle mechanism 112 and the three substrate transport robots CR4, CR5, and CR6 each correspond to a horizontal substrate transport robot of the present invention. Also, a part of the configuration of the second embodiment may be applied to the substrate processing system 1 of the first embodiment.

[0150] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0151] (1) In each of the above-described embodiments, the relay substrate transport mechanism 81 includes the belt conveyor 83. In this regard, the relay substrate transport mechanism 81 may include a substrate transport robot 131 and a substrate placement unit PS2 shown in Fig. 13. The substrate transport robot 131 includes a relay hand 133, an advance / retract unit 135, a rotation unit 137, and a horizontal movement unit 139.

[0152] The relay hand 133 holds one substrate W in a horizontal position and is movable. The advancing / retreating unit 135 moves the relay hand 133 forward and backward. The rotating unit 137 rotates the relay hand 133 about a vertical axis AX9 set in the rotating unit 137. The horizontal moving unit 139 moves the relay hand 133, the advancing / retreating unit 135, and the rotating unit 137 along the width direction Y. The advancing / retreating unit 135, the rotating unit 137, and the horizontal moving unit 139 are each driven by an electric motor. The substrate placement unit PS2 can place one or more substrates W thereon.

[0153] The substrate platform PS2 is provided between the substrate transport robot 131 and the transfer region R8. That is, the substrate platform PS2 is provided to the left Y of the substrate transport robot 131. In this modified example, the horizontal push-out mechanism 75 shown in FIG. 7(b) does not necessarily have to be provided.

[0154] The operation of this modified example will be described. The submersible posture conversion unit 43 converts, for example, 25 substrates W1 (first substrate group) from a vertical posture to a horizontal posture. After that, the substrate transport robot 131 inserts the relay hand 133 into the inside of the intra-tank carrier 67, which is partially raised from the pure water in the posture conversion tank 69, and uses the relay hand 133 to take out one substrate W1 from the intra-tank carrier 67 of the submersible posture conversion unit 43.

[0155] Thereafter, the rotation unit 137 rotates the relay hand 133 about the vertical axis AX9 to change the orientation of the relay hand 133 from the in-tank carrier 67 (underwater attitude conversion unit 43) to the substrate placement unit PS2. The substrate transport robot 131 transports the removed substrate W1 to the substrate placement unit PS2 by causing the relay hand 133, which is directed toward the substrate placement unit PS2, to enter the substrate placement unit PS2. Thereafter, the substrate transport robot CR3 removes the substrate W from the substrate placement unit PS2 and transports it to one of the two first single-wafer processing chambers SW1 of the two front towers TW1.

[0156] (2) In each of the above-described embodiments, the second attitude changing mechanism 41 includes the underwater attitude changing unit 43, the standby tank 45, and the second batch transport mechanism WTR2. In this regard, the second attitude changing mechanism 41 may include an articulated robot (attitude changing unit) and the standby tank 45. In this case, the articulated robot includes a movable hand that holds one substrate W. The articulated robot uses the hand to take out one substrate W in a vertical attitude from the lifter LF7 of the standby tank 45, and converts the taken-out substrate W to a horizontal attitude. Thereafter, the articulated robot may transport the one substrate W in the horizontal attitude to the relay substrate transport mechanism 81. The articulated robot may include a plurality of hands.

[0157] (3) In each of the embodiments described above, the second position changing mechanism 41 includes the standby tank 45, but it does not have to include the standby tank 45 (see FIG. 14). In this case, the batch transport mechanism WTR1 directly transports the 25 substrates W processed in the batch processing device 3 to the submersible position changing unit 43. The pusher 73A of the submersible position changing unit 43 receives the 25 substrates W aligned in the width direction Y from the batch transport mechanism WTR1 in a vertical position, as shown in FIG. 15(a).

[0158] The pusher mechanism 73 of the underwater position changing unit 43 rotates the pusher 73A holding the 25 substrates W by 90 degrees around the vertical axis AX7. As a result, the pusher mechanism 73 aligns the 25 substrates W in the front-rear direction X, as shown in Fig. 15(b). Thereafter, the underwater position changing unit 43 rotates the 25 substrates W around the horizontal axis AX6 extending in the width direction Y, thereby putting the 25 substrates W into a horizontal position.

[0159] 14, 15(a) and 15(b), for example, the substrate transport robot 131 of the relay substrate transport mechanism 81 receives one substrate W from the underwater attitude conversion unit 43 using the relay hand 133, and transports the single substrate W to the substrate placement part PS2 on the interface device 5 side. Note that the relay substrate transport mechanism 81 may be a belt conveyor 83.

[0160] (4) In each of the above-described embodiments, the attitude changing unit included in the second attitude changing mechanism 41 may be configured as follows. That is, the attitude changing unit includes a substrate accommodation unit (e.g., in-tank carrier 67) that accommodates multiple substrates. This substrate accommodation unit is rotatable about a horizontal axis AX6 that is parallel to the device surfaces of the multiple substrates W. The horizontal axis AX6 extends in the rear X, front-rear X, or width Y direction.

[0161] (5) In each of the embodiments and modifications described above, the transfer block 19 includes the substrate handling mechanism HTR, the attitude changing unit 31, and the pusher 33A. In this regard, the transfer block 19 may include the substrate handling mechanism HTR and the pusher 33A without including the attitude changing unit 31. In other words, the substrate handling mechanism HTR may include the attitude changing unit 31 (the function of the attitude changing unit 31).

[0162] In this case, the substrate handling mechanism HTR is composed of an articulated robot. The articulated robot takes out a plurality of substrates W (e.g., five substrates W) from a carrier and converts the substrates W from a horizontal position to a vertical position. The articulated robot then arranges the substrates W in the vertical position on the pusher 33A.

[0163] (6) In the above-mentioned first embodiment and each of the modified examples, the two single substrate processing regions R10, R11 each include six single substrate processing chambers SW1, SW2. In this regard, the two single substrate processing regions R10, R11 may each include six first single substrate processing chambers SW1 without including the second single substrate processing chamber SW2. In this case, each of the six first single substrate processing chambers SW1 may process one substrate W with pure water and IPA, and then perform spin drying. In addition, in the case of this modified example, the two substrate transport robots CR1, CR2 may not be provided.

[0164] (7) In the above-described first embodiment and each of the modified examples, the substrate transport robot CR3 transports one substrate W in a horizontal position between the intermediate substrate transport mechanism 81, the twelve single substrate processing chambers SW1, SW2, and the carrier C placed on the shelf 89. This substrate transport may be shared by a plurality of substrate transport robots. One substrate W may be transferred directly between two substrate transport robots. Also, one substrate W may be transferred via a substrate placement unit.

[0165] (8) In each of the above-described embodiments and modifications, at least one of the six substrate transport robots CR1 to CR6 may have a hand 91 that is moved by an articulated arm.

[0166] (9) In each of the above-described embodiments and modifications, for example, the batch processing tank BT1 collectively immerses and processes 50 substrates W, which are arranged alternately with 25 substrates W1 and 25 substrates W2. The 50 substrates W (W1, W2) are arranged at a half pitch (e.g., 5 mm). In this regard, the batch processing tank BT1 may collectively immerse and process 25 substrates W arranged at a full pitch (e.g., 10 mm).

[0167] (10) In each of the above-described embodiments and modified examples, for example, the batch processing tank BT1 immerses 50 substrates W, which are a processing substrate group, in a batch process. In these 50 substrates W (W1, W2), when the device surfaces of the 25 substrates W1 in the first substrate group face to the right Y, the device surfaces of the 25 substrates W2 in the second substrate group may face to the left Y. In addition, when the device surfaces of the 25 substrates W1 in the first substrate group face to the right Y, the device surfaces of the 25 substrates W2 in the second substrate group may face to the right Y. [Explanation of symbols]

[0168] 1 ... Substrate processing system 2 … Stocker device 3 … Batch processing equipment 5 … Interface device 7 … Single wafer processing equipment 9 … Loading port 16 ... Carrier transport robot 18,89,114 … Shelf 19 ... Transfer block 21 … Processing block HTR: Substrate handling mechanism 23 ... First attitude transformation mechanism 25 … Hand 33A ... Pusher BT1~BT4 … Batch processing tank WTR1 … Batch transfer mechanism 41 ... Second attitude transformation mechanism 43 … Underwater attitude change section 45 … Standby tank WTR2: Second batch transfer mechanism 51 ... Guide rail 53A,54A,53B,54B … Retaining groove 55A,56A,55B,56B … Passing groove 81 ... Interconnect board transport mechanism 83 ... Conveyor belt 90 … Single wafer processing block CR1~CR6 ... Substrate transport robot 110 ... Control section 112 ... Shuttle mechanism 131 ... Substrate transport robot R3: Batch substrate transport area R5 … Posture transformation region R6 … Relay area

Claims

1. A substrate processing system including a batch processing device that processes a plurality of substrates collectively, a single substrate processing device that processes the plurality of substrates one by one, and an interface device that connects the batch processing device and the single substrate processing device, The batch processing device extends in a first horizontal direction; the single wafer processing device is arranged opposite the batch processing device so as to be aligned in a second horizontal direction perpendicular to the first horizontal direction; the interface device is disposed adjacent to one end side of each of the batch processing device and the single wafer processing device and extending in the second horizontal direction; The batch processing device includes: a first carrier mounting shelf on which a carrier for storing the plurality of substrates in a horizontal position at predetermined intervals is mounted; a transfer block adjacent to the first carrier placement shelf; a batch processing block extending in the first horizontal direction adjacent to the loading block; a batch substrate transport area disposed adjacent to the transfer block and the batch processing block on the side where the single substrate processing device is disposed, the batch substrate transport area having one end extending to the interface device and the other end extending in the first horizontal direction; the transfer block includes a substrate handling mechanism and a first attitude changing mechanism, the substrate handling mechanism removes the plurality of substrates in a horizontal position from the carrier placed on the first carrier mounting shelf; the first position changing mechanism includes a first position changing unit that changes the position of the substrates received from the substrate handling mechanism from a horizontal position to a vertical position; a vertical holding unit that holds the plurality of substrates that have been converted to a vertical position by the first position conversion unit, the batch processing block includes a plurality of batch processing tanks arranged in the first horizontal direction, the plurality of batch processing tanks each storing a processing liquid for immersing the plurality of substrates; the batch substrate transport area includes a first batch transport mechanism that transports the plurality of substrates in a vertical position between the plurality of batch processing tanks, the vertical holding unit, and the interface device; the interface device includes a posture change area disposed on the opposite side of the batch processing block with the transfer block interposed therebetween, and a relay area adjacent to the posture change area and extending in the second horizontal direction; the posture changing region includes a second posture changing mechanism that changes the posture of the plurality of substrates processed by the batch processing device from a vertical posture to a horizontal posture, the relay area includes an intermediate substrate transport mechanism that transports the plurality of substrates, which have been converted to a horizontal position by the second position conversion mechanism, to the single substrate processing apparatus; The single wafer processing apparatus includes: a second carrier placement shelf on which the carrier is placed; a single wafer processing block adjacent to the second carrier placement shelf, The single wafer processing block includes: a plurality of single wafer processing chambers for performing a predetermined process on each of the plurality of substrates processed by the batch processing device; a horizontal substrate transport robot that receives the substrate transported by the relay substrate transport mechanism and transports the received substrate to one of the plurality of single substrate processing chambers, A substrate processing system characterized in that the horizontal substrate transport robot stores a substrate that has been processed in one of the plurality of single substrate processing chambers in the carrier placed on the second carrier mounting shelf.

2. 2. The substrate processing system according to claim 1, The second attitude change mechanism includes: a second position change unit that changes the position of the plurality of substrates from a vertical position to a horizontal position; A substrate processing system comprising: a waiting tank provided between the transfer block and the second position change unit, the waiting tank storing an immersion liquid in which the plurality of substrates are immersed in a vertical position.

3. 3. The substrate processing system according to claim 2, The second attitude changing mechanism further includes a second batch transfer mechanism, the second batch transfer mechanism includes a guide rail provided on an opposite side of the batch substrate transfer area across the waiting tank; the second batch transfer mechanism transfers the plurality of substrates in a vertical position from the standby tank to the second position change unit along the guide rail; a first batch transfer mechanism for transferring the substrates in a vertical position between the batch processing tanks, the vertical holding unit, and the standby tank;

4. 4. The substrate processing system according to claim 3, the second batch transfer mechanism includes a pair of chucks in which a plurality of pairs of holding grooves and a plurality of pairs of passing grooves are alternately arranged; a second batch transport mechanism that uses the pair of chucks to remove the substrates from the group of substrates to be processed, and transports the removed substrates to the posture conversion unit, when a group of substrates to be processed, in which the substrates are arranged alternately with other substrates, is immersed in the immersion liquid in the waiting tank.

5. 5. The substrate processing system according to claim 1, a stocker device adjacent to the batch processing device and the interface device; The stocker apparatus includes a load port for loading and unloading the carrier; a carrier transport robot that transports the carrier at least between the load port and the first carrier mounting shelf.

6. 5. The substrate processing system according to claim 1, The substrate processing system according to claim 1, wherein the intermediate substrate transport mechanism includes a belt conveyor.

7. 5. The substrate processing system according to claim 1, The substrate processing system according to claim 1, wherein the relay substrate transport mechanism includes a movable relay hand that holds one substrate.

8. 5. The substrate processing system according to claim 1, The substrate handling mechanism comprises a plurality of hands each for holding a corresponding one of the substrates, the plurality of hands being movable as a unit.

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