Photosensitive resin composition, photosensitive resin layer, display device, and method of manufacturing photosensitive resin layer

Abstract

To provide a photosensitive resin composition that is sufficiently curable even at low temperatures, offers superior solvent resistance and coating appearance characteristics, along with superior color characteristics, and demonstrates high reliability and pattern precision, a photosensitive resin layer made using the same, a display device, and a method of manufacturing a photosensitive resin layer.SOLUTION: The present invention provides a photosensitive resin composition including (A) a binder resin, (B) a colorant, (C) a polymerizable monomer, (D) a polymerization initiator and (E) a solvent. The binder resin includes an acrylic binder resin with a specific structure having ethylenically unsaturated double bonds in its side chains.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present disclosure relates to a photosensitive resin composition, a photosensitive resin film, a display device, and a method for producing a photosensitive resin film. [Background technology]

[0002] Recently, there has been growing interest in self-emissive micro OLED display panels that emit light themselves as display panels applied to VR (Virtual Reality), AR (Augmented Reality), and MR (Mixed Reality) devices.

[0003] In the case of micro OLED display panels, whose pixel size is about 10 times smaller than that of general OLED display panels, it is difficult to precisely form red (R) / green (G) / blue (B) emission layers using existing FMM (Fine Metal Mask) technology. In other words, in order to apply existing LCD displays to devices such as VR and AR, the color filter pattern size is too large, making it difficult to increase the resolution.

[0004] Recently, OLEDoS (OLED on Silicon) technology has been introduced to achieve a high resolution of over 4000ppi. This technology uses OLED deposited on a silicon wafer as a backlight and patterns a color filter on it. The color filters used in existing LCD displays are cured through an exposure process in which a pattern of about 100μm is formed on the glass and a post bake process at a high temperature of over 230℃, while the color filters formed on OLEDoS cannot undergo a high-temperature process due to OLED and must be cured at a low temperature. It is also important that they are finely patterned to increase the resolution. Due to the characteristics of VR, AR, and MR devices, which are small in size, fine patterning is essential to achieve the desired resolution.

[0005] However, color filters made from existing materials are cured only at low temperatures (below 100°C), so it is difficult to improve the solvent resistance and coating appearance characteristics, and it is not easy to ensure the color characteristics. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Korean Patent Publication No. 10-2022-0081693 Summary of the Invention [Problem to be solved by the invention]

[0007] One embodiment provides a photosensitive resin composition that cures sufficiently even at low temperatures, has excellent solvent resistance and coating appearance properties, and also has excellent color properties, and has high reliability and patternability.

[0008] Another embodiment provides a photosensitive resin film produced using the above photosensitive resin composition.

[0009] Another embodiment provides a display device including the above photosensitive resin film.

[0010] In addition, another embodiment provides a method for producing the above photosensitive resin film. [Means for solving the problem]

[0011] A photosensitive resin composition according to one embodiment includes (A) a binder resin, (B) a colorant, (C) a polymerizable monomer, (D) a polymerization initiator, and (E) a solvent. The binder resin includes at least one selected from the group consisting of structural units represented by the following Chemical Formulae 1 and 2, and includes at least two selected from the group consisting of structural units represented by the following Chemical Formulae 3 to 5. [Chemical formula 1] [ka] [Chemical formula 2] [ka] [Chemical formula 3] [ka] [Chemical formula 4] [ka] [Chemical formula 5] [ka] In the above Chemical Formulas 1 to 5, R 1 ~R 6 and R 8 each independently represents a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, R 7 and R 9 each independently represents a substituted or unsubstituted arylene group having 6 to 20 carbon atoms, L 1 ~L 6 each independently represents a single bond or a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms.

[0012] The binder resin can contain structural units represented by Chemical Formula 1 and Chemical Formulas 3 to 5.

[0013] In Chemical Formula 1 and Chemical Formula 3 to Chemical Formula 5, R 1 , R 4 , and R 6 are each independently a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, R 2 , R 5 , and R 8 are each independently a hydrogen atom, and L 1 ~L 6may each independently be a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms.

[0014] The binder resin may have a weight average molecular weight of 5000 g / mol to 8000 g / mol.

[0015] The binder resin can have a double bond equivalent weight of 150 g / mol to 500 g / mol.

[0016] The solid content constituting the photosensitive resin composition may be contained in an amount of 12% by weight to 24% by weight based on the total amount of the photosensitive resin composition.

[0017] The polymerizable monomer can include one or more compounds that contain three or more functional groups.

[0018] The polymerizable monomer may be a mixture of two types of compounds, each of which independently contains three or more functional groups.

[0019] The two types of compounds are a first polymerizable monomer having 3 to 5 functional groups and a second polymerizable monomer having 6 or more functional groups, and the first polymerizable monomer may be contained in a smaller amount than the second polymerizable monomer.

[0020] The photosensitive resin composition can contain, relative to the total amount of the photosensitive resin composition, (A) 5 wt % to 20 wt % of a binder resin, (B) 70 wt % to 90 wt % of a colorant, (C) 1 wt % to 10 wt % of a polymerizable monomer, (D) 0.1 wt % to 5 wt % of a polymerization initiator, and the balance (E) a solvent.

[0021] The photosensitive resin composition may further contain an antioxidant.

[0022] The antioxidant may be contained in an amount of 0.01% by weight to 1% by weight based on the total amount of the photosensitive resin composition.

[0023] The photosensitive resin composition may further contain additives such as malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a surfactant, or a combination thereof.

[0024] The photosensitive resin composition may be a composition for a micro OLED display device.

[0025] A photosensitive resin film according to another embodiment is produced using a photosensitive resin composition.

[0026] A display device according to another embodiment includes a photosensitive resin film.

[0027] The display device may include an OLED substrate deposited on a silicon wafer and a color filter layer laminated on the OLED substrate to convert white light generated from the OLED substrate into a plurality of color lights, the color filter layer including a red color filter, a green color filter, and a blue color filter.

[0028] In addition, a method for producing a photosensitive resin film according to another embodiment includes a step of applying a photosensitive resin composition, a step of pre-baking the applied composition at a temperature of 100° C. or less, a step of exposing the pre-baked composition to i-line radiation, and a step of developing the applied composition.

[0029] Further specific details of aspects of the present invention are included in the following detailed description. Effect of the Invention

[0030] The photosensitive resin composition according to one embodiment can be cured at a low temperature of 100°C or less, can secure high resolution by realizing fine patterns, and has excellent spectral characteristics and can secure a wide color range. In particular, when pre-baked at 100°C or less, it has excellent solvent resistance and residue characteristics even with only temperature and photo-curing (i-line exposure), and is suitable for application to micro OLED display devices because it has excellent coating appearance characteristics. [Brief description of the drawings]

[0031] [Figure 1] 2 is an optical microscope photograph of a photosensitive resin film obtained by curing the photosensitive resin composition of Example 1 at a low temperature. [Diagram 2] 1 is an optical microscope photograph of a photosensitive resin film obtained by curing the photosensitive resin composition of Comparative Example 1 at a low temperature. [Diagram 3] 1 is an optical microscope photograph of a photosensitive resin film obtained by curing the photosensitive resin composition of Comparative Example 2 at a low temperature. [Figure 4] 2 is an optical microscope photograph of a photosensitive resin film obtained by curing the photosensitive resin composition of Example 1 at a low temperature. [Diagram 5] 1 is an optical microscope photograph of a photosensitive resin film obtained by curing the photosensitive resin composition of Comparative Example 1 at a low temperature. [Figure 6] 1 is an optical microscope photograph of a photosensitive resin film obtained by curing the photosensitive resin composition of Comparative Example 2 at a low temperature. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0032] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail, but are presented by way of example only and are not intended to limit the invention, which is defined solely by the claims that follow.

[0033] Unless otherwise specified in this specification, an "alkyl group" means an alkyl group having 1 to 20 carbon atoms, an "alkenyl group" means an alkenyl group having 2 to 20 carbon atoms, a "cycloalkenyl group" means a cycloalkenyl group having 3 to 20 carbon atoms, a "heterocycloalkenyl group" means a heterocycloalkenyl group having 3 to 20 carbon atoms, an "aryl group" means an aryl group having 6 to 20 carbon atoms, an "arylalkyl group" means an arylalkyl group having 6 to 20 carbon atoms, an "alkylene group" means an alkylene group having 1 to 20 carbon atoms, an "arylene group" means an arylene group having 6 to 20 carbon atoms, an "alkylarylene group" means an alkylarylene group having 6 to 20 carbon atoms, a "heteroarylene group" means a heteroarylene group having 3 to 20 carbon atoms, and an "alkoxysilane group" means an alkoxysilane group having 1 to 20 carbon atoms.

[0034] Unless otherwise specified in this specification, "substituted" means that at least one hydrogen atom has been replaced with a halogen atom (F, Cl, Br, I), a hydroxy group, an alkoxy group having 1 to 20 carbon atoms, a nitro group, a cyano group, an amine group, an imino group, an azide group, an amidino group, a hydrazino group, a hydrazono group, a carbonyl group, a carbamoyl group, a thiol group, an ester group, an ether group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid group or a salt thereof, an alkyl group having 1 to 20 carbon atoms, a carbon atom, a carboxylic acid group ... It means that the alkyl group is substituted with an alkenyl group having 2 to 20 carbon atoms, an alkynyl group having 2 to 20 carbon atoms, an aryl group having 6 to 20 carbon atoms, a cycloalkyl group having 3 to 20 carbon atoms, a cycloalkenyl group having 3 to 20 carbon atoms, a cycloalkynyl group having 3 to 20 carbon atoms, a heterocycloalkyl group having 2 to 20 carbon atoms, a heterocycloalkenyl group having 2 to 20 carbon atoms, a heterocycloalkynyl group having 2 to 20 carbon atoms, a heteroaryl group having 3 to 20 carbon atoms, or a combination thereof.

[0035] In addition, unless otherwise specified in this specification, "hetero" means that at least one heteroatom selected from the group consisting of N, O, S, and P is included in the chemical formula.

[0036] In addition, unless otherwise specified in this specification, "(meth)acrylate" means that both "acrylate" and "methacrylate" are possible, and "(meth)acrylic acid" means that both "acrylic acid" and "methacrylic acid" are possible.

[0037] Unless otherwise defined herein, "combination" means a mixture or copolymerization, and "copolymerization" means block copolymerization or random copolymerization, and "copolymer" means block copolymerization or random copolymerization.

[0038] In the chemical formulas herein, unless otherwise defined, when a chemical bond is not drawn at a position where a chemical bond should be drawn, it means that a hydrogen atom is bonded to that position.

[0039] Unless otherwise defined herein, "*" means a moiety attached to the same or different atom or chemical formula.

[0040] A photosensitive resin composition according to one embodiment includes (A) a binder resin, (B) a colorant, (C) a polymerizable monomer, (D) a polymerization initiator, and (E) a solvent. The binder resin includes at least one selected from the group consisting of structural units represented by the following Chemical Formulae 1 and 2, and includes at least two selected from the group consisting of structural units represented by the following Chemical Formulae 3 to 5. [Chemical formula 1] [ka] [Chemical formula 2] [ka] [Chemical formula 3] [ka] [Chemical formula 4] [ka] [Chemical formula 5] [ka] In the above Chemical Formulas 1 to 5, R 1 ~R 6 and R 8 each independently represents a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, R 7 and R 9 each independently represents a substituted or unsubstituted arylene group having 6 to 20 carbon atoms, L 1 ~L 6 each independently represents a single bond or a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms.

[0041] Liquid crystal display devices, which are one type of display device, have advantages of being lightweight, thin, inexpensive, low-power-consumption, and excellent connectivity with integrated circuits, and are being used in a wide range of applications, such as notebook computers, monitors, and TV images. Such liquid crystal display devices have color filters in which unit pixels, each of which is a collection of sub-pixels of red (R), green (G), and blue (B), which correspond to the three primary colors of light, are repeatedly formed. When the sub-pixels are arranged adjacent to each other and color signals are applied to each sub-pixel to control the brightness, a specific color is displayed in the unit pixel by the synthesis of the three primary colors. Color filters are manufactured as red (R), green (G), and blue (B) dyes or pigments, and these dye materials play a role in changing the white light of the backlight unit to the corresponding color. The more the dye material's spectrum has a narrow absorption band with no unnecessary wavelengths other than the required absorption wavelength, the better. In addition, the color resist must have excellent heat resistance, light resistance, and chemical resistance so that it does not fade or change color under ultraviolet light, acid, or base conditions to which it is exposed during the etching process. Color filters using photosensitive resin compositions can be produced by coating three or more colors onto a transparent substrate mainly by dyeing, electrodeposition, printing, pigment dispersion, or the like.

[0042] In addition to LCD processes, photosensitive resin compositions can be used in next-generation displays based on dye and pigment technology. Existing LCD processes are designed for durability in high-temperature processes, but next-generation displays require low-temperature processes to minimize thermal deformation loss due to the material properties of the thin film, and since materials for organic light-emitting diodes (OLEDs) can only be processed at low temperatures, there is an increasing demand for low-temperature curing resin compositions. However, there is a problem that they are not cured sufficiently at low temperatures, resulting in weak heat resistance and chemical resistance. If excessive curing materials are used to improve this, uneven surface properties and weak residues will occur during thin film formation.

[0043] Therefore, the present inventors have made numerous trials and errors over several years to develop a photosensitive resin composition that has a high degree of curing at low temperatures and has excellent solvent resistance and uniform coating properties, and have finally completed the present invention. Specifically, one embodiment relates to a photosensitive resin composition for forming a color filter that can be cured at low temperatures and has excellent chemical resistance, more specifically, a photosensitive resin composition that has high reliability and patternability with only pre-baking at 100°C and photo-curing (exposure to i-rays (365 nm)).

[0044] Meanwhile, conventional color photoresists are negative-type photosensitive liquid materials that are realized in red, green, and blue color patterns, and technological developments have been made in the direction of gradually changing the composition of the liquid material. For example, there have been efforts to improve color purity by changing the type and content of pigment dispersion liquid, which is a coloring material that realizes color patterns, to improve patterning by changing the composition of binder resins and photopolymerization initiators, or to improve coating properties and color uniformity by using other additives such as leveling agents.

[0045] However, one embodiment relates to a photosensitive resin composition that, unlike conventional color photoresists, is adapted for color filter processing used in micro OLED display devices.

[0046] Micro OLED means a WOLED (White OLED) deposited on a silicon wafer. Inventors also call it OLEDoS (Organic Light Emitting Diode on Silicon). And, micro OLED display device means a display device to which micro OLED is applied.

[0047] As the Metaverse market grows rapidly with the advent of the 4th Industrial Revolution, there is a growing need to develop display devices that improve the realism and visibility of AR, VR, and MR devices and minimize the induction of dizziness. For this purpose, there are various candidate technologies such as LCoS (Liquid Crystal on Silicon), LEDoS (Light Emitting Diode on Silicon), and OLEDoS (Organic Light Emitting Diode on Silicon). Among these, OLEDoS technology is being rapidly developed in various places due to its advantages of high contrast ratio, fast response speed, and being self-luminous, which allows the volume and weight of devices to be reduced with a relatively simple optical system.

[0048] In the case of OLEDoS, there are many difficulties in development because high-resolution microdisplays need to be realized, so pixels of several μm units, which are very small compared to existing displays, must be formed, and color filters must be formed through a low-temperature process to avoid damaging the lower OLED.

[0049] Under such circumstances, the inventors have limited the type of binder resin to realize low-temperature curing and fine patterns, and further controlled the molecular weight of the binder resin and the content of the solids constituting the photosensitive resin composition to complete a photosensitive resin composition that can be cured at a low temperature of 100°C or less, has excellent solvent resistance, generates almost no residue, and can produce a uniform exterior coating. Due to such characteristics, the photosensitive resin composition according to one embodiment can be applied to display devices for next-generation displays such as VR (Virtual Reality), AR (Augmented Reality), and MR (Mixed Reality), for example, micro OLED display devices.

[0050] Each component will be specifically described below.

[0051] (A) Binder resin The binder resin may be an acrylic binder resin.

[0052] For example, the acrylic binder resin may be an epoxy group-free acrylic binder resin that does not contain an epoxy group.

[0053] The acrylic binder resin contains at least one selected from the group consisting of structural units represented by Chemical Formula 1 and Chemical Formula 2, and contains at least two selected from the group consisting of structural units represented by Chemical Formula 3 to Chemical Formula 5. Since the acrylic binder resin has such a structure, the photosensitive resin composition according to one embodiment has excellent solvent resistance and coating appearance properties compared to conventional photosensitive resin compositions.

[0054] For example, the binder resin may contain structural units represented by Chemical Formula 1 and Chemical Formulas 3 to 5. In this case, R 1 , R 4 and R 6 are each independently a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, R 2 , R 5 and R 8 are each independently a hydrogen atom, and L 1 ~L 6 may each independently be a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms. In this case, the photosensitive resin composition according to one embodiment can have even higher reliability and patternability even with low-temperature curing and i-line exposure alone.

[0055] When the binder resin contains a cardo-based binder resin, an epoxy-based binder resin, a silsesquioxane-based binder resin, and / or an epoxy acrylic-based binder resin, curing does not proceed well at a low temperature of 100°C or less, making it difficult to improve reliability and patternability, and the residue characteristics and coating uniformity may also decrease.

[0056] That is, the photosensitive resin composition according to one embodiment has excellent residue characteristics and coating uniformity even when exposed to i-line at a low temperature of 100° C. or less, and further has improved color characteristics, because the structure of the binder resin, specifically the acrylic binder resin, is controlled as described above.

[0057] Furthermore, when the weight average molecular weight and double bond equivalent of the acrylic binder resin having the above-mentioned structure is further controlled, the effects of improving the residue characteristics, coating uniformity, and color characteristics are more excellent.

[0058] For example, the binder resin can have a weight average molecular weight of 5000 g / mol to 8000 g / mol.

[0059] For example, the binder resin can have a double bond equivalent weight of 150 g / mol to 500 g / mol.

[0060] When the weight average molecular weight and / or double bond equivalent of the acrylic binder resin is controlled as described above, the above-mentioned improving effect can be further increased even at a low temperature of 100° C. or less and by only i-line exposure.

[0061] Meanwhile, the photosensitive resin composition according to an embodiment can also enhance the above-mentioned effects when the content of the solid content constituting the composition is controlled. Specifically, the solid content constituting the photosensitive resin composition may be contained in an amount of 12 wt% to 24 wt% based on the total amount of the photosensitive resin composition.

[0062] In the case of conventional photosensitive resin compositions for color filters, the solid content is generally more than the above range, but the photosensitive resin composition according to one embodiment is applied to a micro OLED display device including a WOLED deposited on a glass substrate or a silicon wafer, not polyimide, as a light source, so low-temperature curing is essential, and therefore, when the solid content is controlled as described above, it is more advantageous in improving patternability. Specifically, when the solid content satisfies 12% by weight to 24% by weight based on the total amount of the photosensitive resin composition, sufficient polymerization occurs with a photopolymerization initiator described below during exposure in a low-temperature pattern formation process, and a pattern having excellent heat resistance, light resistance, and chemical resistance can be formed even in a low-temperature process of 100°C or less. Existing color filters for liquid crystal displays (LCDs) form patterns of about 100 μm using resists, but the patterns are too large for use in micro OLED display devices. Therefore, the present inventors have realized fine patterns and made it possible to cure at low temperatures by controlling the solid content constituting the photosensitive resin composition as described above in addition to the type of binder resin, weight average molecular weight, and double bond equivalent.

[0063] The binder resin may be contained in an amount of 5% by weight to 20% by weight, for example, 5% by weight to 15% by weight, for example, 7% by weight to 12% by weight, based on the total amount of the photosensitive resin composition. When the binder resin is contained within the above range, excellent sensitivity, developability, resolution, and linearity of the pattern can be obtained.

[0064] (B) Coloring agent The photosensitive resin composition according to an embodiment includes a colorant, and the colorant may be a green pigment, a blue pigment, a red pigment, a purple pigment, a yellow pigment, or the like.

[0065] The red pigment may be, for example, CI Red Pigment 254, CI Red Pigment 255, CI Red Pigment 264, CI Red Pigment 270, CI Red Pigment 272, CI Red Pigment 177, CI Red Pigment 89, etc., which may be used alone or in combination of two or more kinds, but is not limited thereto.

[0066] The purple pigment may be, in the Color Index, CI Violet Pigment 23 (V.23), CI Violet Pigment 29, Dioxazine Violet, Fast Violet B, Methyl Violet Lake, Indanthrene Brilliant Violet, etc., which may be used alone or in combination of two or more kinds, but is not necessarily limited thereto.

[0067] The green pigment may be, but is not limited to, CI Green Pigment 7, CI Green Pigment 36, CI Green Pigment 58, CI Green Pigment 59, etc., which may be used alone or in combination of two or more kinds, in the Color Index.

[0068] The blue pigment may be a copper phthalocyanine pigment such as CI Blue Pigment 15:6, CI Blue Pigment 15, CI Blue Pigment 15:1, CI Blue Pigment 15:2, CI Blue Pigment 15:3, CI Blue Pigment 15:4, CI Blue Pigment 15:5, CI Blue Pigment 15:6, CI Blue Pigment 16, etc., which may be used alone or in combination of two or more kinds, but is not limited thereto.

[0069] The yellow pigment may be, in the Color Index, an isoindoline pigment such as CI Yellow Pigment 185, CI Yellow Pigment 139, etc., a quinophthalone pigment such as CI Yellow Pigment 138, etc., or a nickel complex pigment such as CI Yellow Pigment 150, etc., which may be used alone or in combination of two or more kinds, but is not necessarily limited thereto.

[0070] The pigments may be used alone or in combination of two or more.

[0071] The pigment may be pretreated with a water-soluble inorganic salt and a wetting agent before use. When the pigment is pretreated before use, the average particle size of the pigment can be reduced.

[0072] The pretreatment can be carried out by kneading the pigment with a water-soluble inorganic salt and a wetting agent, and filtering and washing the pigment obtained from the kneading step.

[0073] The kneading can be carried out at a temperature of 40° C. to 100° C., and the filtration and washing can be carried out by washing the inorganic salt with water or the like, and then filtering.

[0074] Examples of water-soluble inorganic salts include, but are not limited to, sodium chloride, potassium chloride, etc. The wetting agent acts as a medium for uniformly mixing the pigment and the water-soluble inorganic salt to easily grind the pigment, and examples thereof include alkylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, diethylene glycol monomethyl ether, etc.; alcohols such as ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, glycerin polyethylene glycol, etc., and these can be used alone or in combination of two or more.

[0075] The pigment that has undergone the kneading step may have an average particle size of 5 nm to 200 nm, for example, 5 nm to 150 nm. If the average particle size of the pigment is within the above range, the pigment has excellent stability in the pigment mill base (pigment dispersion liquid), and there is no risk of a decrease in pixel resolution.

[0076] The pigment may be used in the form of a pigment dispersion, for example as a millbase, together with a dispersant and a solvent.

[0077] The dispersant helps the pigment to be uniformly dispersed in the dispersion liquid, and nonionic, anionic or cationic dispersants can be used. Specifically, polyalkylene glycol or its ester, polyoxyalkylene, polyhydric alcohol ester alkylene oxide adduct, alcohol alkylene oxide adduct, sulfonic acid ester, sulfonate, carboxylate, carboxylate, alkylamide alkylene oxide adduct, alkylamine, etc. can be used, and these can be used alone or in combination of two or more kinds.

[0078] Examples of commercially available dispersants include DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001, etc. from BYK; EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450, etc. from EFKA Chemical; Solsperse 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse 17000, Solsperse 20000, Solsperse 24000GR, Solsperse 27000, or Solsperse 28000, or Ajinomoto's PB711 or PB821.

[0079] The dispersant may be contained in an amount of 0.1% by weight to 15% by weight based on the total amount of the photosensitive resin composition. When the dispersant is contained within the above range, the composition has excellent dispersibility, and thus the photosensitive resin film has excellent stability, developability, and patternability during production.

[0080] The pigment dispersion may further contain, in addition to the pigment, dispersant, and (dispersion) solvent, a dispersion assistant, a dispersion resin, etc. The solid pigment may be contained in an amount of 5% by weight to 20% by weight, for example 8% by weight to 15% by weight, based on the total amount of the pigment dispersion.

[0081] As the (dispersion) solvent for the pigment dispersion, ethylene glycol acetate, ethyl cellosolve, propylene glycol methyl ether acetate, ethyl lactate, polyethylene glycol, cyclohexanone, propylene glycol methyl ether, or the like can be used, and among these, propylene glycol methyl ether acetate is preferably used.

[0082] The dispersing resin can be an acrylic resin containing a carboxyl group, which can not only improve the stability of the pigment dispersion liquid, but also improve the patterning of the pixels.

[0083] The colorant may further include a dye in addition to the pigment, and in this case, the photosensitive resin composition according to an embodiment may be a hybrid composition. In addition, the dye is not particularly limited, but may include a metal complex dye.

[0084] Metal complex dyes can be compounds having maximum absorbance in the wavelength range of 200nm to 650nm, and in order to match the color coordinates to the combination of dyes, metal complex dyes of all colors that are soluble in organic solvents can be used as long as they are compounds having absorbance in that range.

[0085] Specifically, the metal complex dye may be a green dye having a maximum absorbance in the wavelength region of 530 nm to 680 nm, a yellow dye having a maximum absorbance in the wavelength region of 200 nm to 400 nm, an orange dye having a maximum absorbance in the wavelength region of 300 nm to 500 nm, a red dye having a maximum absorbance in the wavelength region of 500 nm to 650 nm, or a combination thereof.

[0086] The metal complex dye may be a direct dye, an acid dye, a basic dye, an acid mordant dye, a sulfur dye, a reduction dye, an azoic dye, a disperse dye, a reactive dye, an oxidation dye, an oil-soluble dye, an azo dye, an anthraquinone dye, an indigoid dye, a carbonium ion dye, a phthalocyanine dye, a nitro dye, a quinoline dye, a cyanine dye, a polymethine dye, or a combination thereof.

[0087] The metal complex dye may contain at least one metal ion selected from the group consisting of Mg, Ni, Cu, Co, Zn, Cr, Pt, Pd, and Fe.

[0088] Metal complex dyes include CI Solvent Green 1, 3, 4, 5, 7, 28, 29, 32, 33, 34, 35, and other CI Solvent dyes; CI Acid Green 1, 3, 5, 6, 7, 8, 9, 11, 13, 14, 15, 16, 22, 25, 27, 28, 41, 50, 50:1, 58, 63, 65, 80, 104, 105, 106, 109, and other CI Acid Greens. CI Direct Dyes, such as CI Direct Green 25, 27, 31, 32, 34, 37, 63, 65, 66, 67, 68, 69, 72, 77, 79, 82; CI Basic Dyes, such as CI Basic Green 1; CI Mordent Green 1, 3, 4, 5, 10, 13, 15, 19, 21, 23, 26, 29, 31, 33, 34, 35, 41 , CI Mordent dyes such as CI Pigment Green 7, 36, 58, green pigments such as CI Pigment Green 7, 36, 58, solvent yellow 19, solvent yellow 21, solvent yellow 25, solvent yellow 79, solvent yellow 82, solvent yellow 88, solvent orange 45, solvent orange 54, solvent orange 62, solvent orange 99, solvent red 8, solvent red 32, solvent red 109, solvent red 112, solvent red 119, solvent red 124, solvent red 160, solvent red 132, and solvent red 218. A complex of at least one selected from the group consisting of solvent red 8, solvent red 32, solvent red 109, solvent red 112, solvent red 119, solvent red 124, solvent red 160, solvent red 132, and solvent red 218 and a metal ion can be used.

[0089] The dye containing a metal complex may have a solubility of 5 or more in the solvent used in the photosensitive resin composition according to an embodiment, i.e., the solvent described below, specifically, may be 5 to 10. The solubility can be obtained by the amount (g) of the dye dissolved in 100 g of the solvent. When the solubility of the dye containing a metal complex is within the above-mentioned range, compatibility with other components constituting the photosensitive resin composition according to an embodiment and coloring power can be ensured, and precipitation of the dye can be prevented.

[0090] The solvent may be, for example, propylene glycol monomethyl ether acetate (PGMEA), ethyl lactate (EL), ethylene glycol ethyl acetate (EGA), cyclohexanone, 3-methoxy-1-butanol, or a combination thereof.

[0091] The dye containing a metal complex may be contained in an amount of 0.01% by weight to 1% by weight, for example, 0.01% by weight to 0.5% by weight, based on the total amount of the photosensitive resin composition. When the dye containing a metal complex is used in the above range, high brightness and contrast ratio can be achieved with desired color coordinates.

[0092] When the dye and the pigment are mixed and used, they can be mixed at a weight ratio of 0.1:99.9 to 99.9:0.1, specifically, at a weight ratio of 1:9 to 9:1. When mixed within the above weight ratio range, the chemical resistance and maximum absorption wavelength can be controlled within appropriate ranges, and high brightness and contrast ratio can be achieved at the desired color coordinates.

[0093] The colorant may be included in an amount of 70% by weight to 90% by weight, for example, 70% by weight to 85% by weight, for example, 75% by weight to 80% by weight, based on the total amount of the photosensitive resin composition. When the colorant is included in such a very high amount as described above, it may be easy to ensure high color reproduction and viewing angle characteristics by providing excellent coloring effect and developability in a micro OLED display device.

[0094] (C) Polymerizable monomer The polymerizable monomer in the photosensitive resin composition according to an embodiment may include one or more compounds having three or more functional groups, where the functional groups may be, but are not limited to, (meth)acrylate groups, epoxy groups, etc.

[0095] The photosensitive resin composition according to an embodiment has been developed for use in a micro OLED display device, and a low-temperature curing process is essential. In the case of a low-temperature curing patterning process, the contribution of thermal curing is reduced and the influence of photocuring is increased. Therefore, increasing the photocuring efficiency is advantageous for ensuring excellent patterning under low-temperature curing, and according to an embodiment, the photocuring efficiency can be increased by using a compound having at least three functional groups in the monomer as a polymerizable monomer. Specifically, the photocuring efficiency is greatly affected by the weight-average molecular weight and the number of functional groups of the polymerizable monomer, and the smaller the weight-average molecular weight of the polymerizable monomer and the larger the number of functional groups in the polymerizable monomer, the higher the photocuring efficiency. For example, a compound having at least three functional groups in the monomer has a small weight-average molecular weight and a large number of functional groups, and is therefore advantageous for increasing the photocuring efficiency.

[0096] For example, the polymerizable monomer may be a mixture of two kinds of compounds, each of which independently contains three or more functional groups. For example, the polymerizable monomer may be a mixture of a first polymerizable monomer containing three to five functional groups and a second polymerizable monomer containing six or more functional groups. When the polymerizable monomer has the above-mentioned mixed composition, it may be easy to form a low-temperature cured pattern by maximizing the photocuring efficiency while maintaining the above-mentioned color characteristics.

[0097] For example, the first polymerizable monomer may be included in a smaller amount than the second polymerizable monomer. When the two compounds are mixed in the above weight ratio, the low temperature curing patternability is most excellent.

[0098] For example, a polymerizable compound containing three or four functional groups can be represented by the following Chemical Formula 1, but is not limited thereto. [Chemical formula 1] [ka] In the above chemical formula 1, L a ~L d each independently represents a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms, a substituted or unsubstituted oxyalkylene group having 1 to 20 carbon atoms, or a combination thereof, R a ~R d are each independently a hydrogen atom, a hydroxyl group, an epoxy group, or a substituted or unsubstituted (meth)acrylate group, provided that R 1 ~R 4 At least three of the groups are necessarily epoxy groups or substituted or unsubstituted (meth)acrylate groups.

[0099] For example, a compound containing 5 to 6 functional groups may be, but is not necessarily limited to, pentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, or a combination thereof.

[0100] The polymerizable monomer can also be used after being treated with an acid anhydride in order to impart better developability.

[0101] The polymerizable monomer may be included in an amount of 1% by weight to 10% by weight, for example, 1% by weight to 5% by weight, based on the total amount of the photosensitive resin composition. When the polymerizable monomer is included within the above range, curing upon exposure occurs sufficiently in the low-temperature pattern formation process, providing excellent reliability, and the pattern has excellent heat resistance, light resistance, and chemical resistance, as well as excellent resolution and adhesion.

[0102] (D) Polymerization initiator The photosensitive resin composition according to an embodiment includes a polymerization initiator. At this time, the polymerization initiator is controlled to 0.1% by weight to 5% by weight, for example, 1% by weight to 3% by weight, based on the total amount of the photosensitive resin composition. When the content of the polymerization initiator is controlled in this manner, an optimal pattern can be formed in a low-temperature curing process together with the composition of the polymerizable monomer, binder resin, and colorant described above. When a polymerization initiator that is out of the above content range is used together with the composition of the polymerizable monomer, binder resin, and colorant described above, the patternability during the low-temperature curing process may be significantly reduced, which may be undesirable.

[0103] The polymerization initiator may be an acetophenone-based compound, a benzophenone-based compound, a thioxanthone-based compound, a benzoin-based compound, a triazine-based compound, an oxime-based compound, or a combination thereof.

[0104] Examples of acetophenone compounds include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloroacetophenone, pt-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, and 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one.

[0105] Examples of benzophenone-based compounds include benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, and 3,3'-dimethyl-2-methoxybenzophenone.

[0106] Examples of thioxanthone compounds include thioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, and 2-chlorothioxanthone.

[0107] Examples of the benzoin compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzyl dimethyl ketal.

[0108] Examples of triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphth-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-4-bis(trichloromethyl)-6-piperonyl-s-triazine, 2-4-bis(trichloromethyl)-6-(4-methoxystyryl)-s-triazine, and the like.

[0109] Examples of oxime compounds that can be used include O-acyloxime compounds, 2-(O-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(O-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone, and O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one. Specific examples of O-acyloxime compounds include, but are not limited to, 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 1-(4-phenylsulfanylphenyl)-butan-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octan-1-one oxime-O-acetate, and 1-(4-phenylsulfanylphenyl)-butan-1-one oxime-O-acetate.

[0110] In addition to the above-mentioned compounds, the photopolymerization initiator can also be used together with, for example, carbazole compounds, diketone compounds, sulfonium borate compounds, diazo compounds, imidazole compounds, biimidazole compounds, and the like.

[0111] (E) Solvent As the solvent, a substance that is compatible with but does not react with the pigment dispersion liquid containing the colorant, the binder resin, the polymerizable monomer, and the polymerization initiator can be used.

[0112] Examples of the solvent include alcohols such as methanol and ethanol, ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methyl phenyl ether, and tetrahydrofuran, glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, and ethylene glycol dimethyl ether, cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate, carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, and diethylene glycol diethyl ether, propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate, aromatic hydrocarbons such as toluene and xylene, methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl- Ketones such as n-propyl ketone, methyl n-butyl ketone, methyl n-amyl ketone, 2-heptanone, etc.; saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, isobutyl acetate, etc.; lactic acid esters such as methyl lactate, ethyl lactate, etc.; oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, etc.; alkoxyacetic acid alkyl esters such as methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, etc.; 3-oxypropionic acid methyl 3-oxypropionic acid alkyl esters such as ethyl 3-oxypropionate, 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate, 2-oxypropionic acid alkyl esters such as methyl 2-oxypropionate, ethyl 2-oxypropionate, and propyl 2-oxypropionate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, and ethyl 2-ethoxypropionate,2-alkoxypropionic acid alkyl esters such as methyl 2-ethoxypropionate; 2-oxy-2-methylpropionic acid esters such as methyl 2-oxy-2-methylpropionate and ethyl 2-oxy-2-methylpropionate; monooxymonocarboxylic acid alkyl esters of 2-alkoxy-2-methylpropionic acid alkyl esters such as methyl 2-methoxy-2-methylpropionate and ethyl 2-ethoxy-2-methylpropionate; esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyethyl acetate, and methyl 2-hydroxy-3-methylbutanoate; Ketone acid esters such as ethyl pyruvate, and high boiling point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethylsulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate.

[0113] Of these, in consideration of compatibility and reactivity, glycol ethers such as ethylene glycol monoethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, etc.; ethylene glycol alkyl ether acetates such as ethyl cellosolve acetate, etc.; esters such as ethyl 2-hydroxypropionate, etc.; carbitols such as diethylene glycol monomethyl ether, and propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate, propylene glycol propyl ether acetate, etc. can be preferably used.

[0114] The solvent may be contained in an amount of, for example, 0.1% by weight to 20% by weight, for example, 1% by weight to 20% by weight, for example, 3% by weight to 18% by weight relative to the total amount of the photosensitive resin composition. When the solvent is contained within the above range, the photosensitive resin composition has an appropriate viscosity, and thus the processability during production of the photosensitive resin film is excellent.

[0115] (F) Other additives Meanwhile, the photosensitive resin composition may further contain additives such as malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a surfactant, an antioxidant, or a combination thereof.

[0116] The silane coupling agent may have a reactive substituent such as a vinyl group, a carboxyl group, a methacryloxy group, an isocyanate group or an epoxy group in order to improve adhesion to a substrate.

[0117] Examples of silane coupling agents include trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatepropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and the like. These can be used alone or in combination of two or more kinds.

[0118] The silane coupling agent may be contained in an amount of 0.01 to 10 parts by weight relative to 100 parts by weight of the photosensitive resin composition. When the silane coupling agent is contained within the above range, the composition has excellent adhesion, storage stability, and the like.

[0119] In addition, the photosensitive resin composition may further contain a surfactant, such as a fluorine-based surfactant and / or a silicone-based surfactant, to improve coating properties and prevent defects, if necessary.

[0120] Examples of fluorine-based surfactants that can be used include those commercially available under the names BM-1000 and BM-1100 from BM Chemie, Megafac (registered trademark) F 142D, F 172, F 173, F 183, F 554, and F 556 from Dainippon Ink and Chemicals, Inc., Fluorad FC-135, FC-170C, FC-430, and FC-431 from Sumitomo 3M Limited, Surflon (registered trademark) S-112, S-113, S-131, S-141, and S-145 from Asahi Glass Co., Ltd., and SH-28PA, -190, -193, SZ-6032, and SF-8428 from Toray Silicone Co., Ltd.

[0121] As the silicone surfactant, those commercially available from BYK Chem under the names BYK-307, BYK-333, BYK-361N, BYK-051, BYK-052, BYK-053, BYK-067A, BYK-077, BYK-301, BYK-322, BYK-325, etc. can be used.

[0122] The surfactant can be used in an amount of 0.001 to 5 parts by weight based on 100 parts by weight of the photosensitive resin composition. When the surfactant is within the above range, coating uniformity is ensured, no unevenness occurs, and the wetting of the IZO substrate or glass substrate is excellent.

[0123] The antioxidant may include, but is not limited to, a hydroquinone-based compound, a catechol-based compound, or a combination thereof. When the photosensitive resin composition according to an embodiment further includes a hydroquinone-based compound, a catechol-based compound, or a combination thereof, room temperature crosslinking can be prevented during exposure after coating the photosensitive resin composition.

[0124] For example, the hydroquinone-based compound, the catechol-based compound, or a combination thereof can include, but is not necessarily limited to, hydroquinone, methylhydroquinone, methoxyhydroquinone, t-butylhydroquinone, 2,5-di-t-butylhydroquinone, 2,5-bis(1,1-dimethylbutyl)hydroquinone, 2,5-bis(1,1,3,3-tetramethylbutyl)hydroquinone, catechol, t-butylcatechol, 4-methoxyphenol, pyrogallol, 2,6-di-t-butyl-4-methylphenol, 2-naphthol, Tris(N-hydroxy-N-nitrosophenylaminato-O,O')aluminium, or a combination thereof.

[0125] The hydroquinone-based compound, the catechol-based compound, or a combination thereof can be used in the form of a dispersion, and the antioxidant in the form of a dispersion may be contained in an amount of 0.001% by weight to 3% by weight, for example, 0.01% by weight to 1% by weight, based on the total amount of the photosensitive resin composition. When the antioxidant is contained within the above range, it is possible to solve the problems caused by aging at room temperature and prevent the sensitivity reduction and surface peeling phenomenon at the same time.

[0126] In addition, the photosensitive resin composition may contain a certain amount of other additives such as a stabilizer within a range that does not impair the physical properties.

[0127] The photosensitive resin composition according to an embodiment may be a positive type or a negative type, but is preferably a negative type in order to more completely remove residues in areas where a pattern is exposed after exposure and development of a composition having light-blocking properties.

[0128] Another embodiment provides a photosensitive resin film produced by low-temperature curing, exposing, and developing the above-mentioned photosensitive resin composition. Compared with the conventional LCD process, the difference is that no post-curing (post-baking) process is required.

[0129] The method for producing the photosensitive resin film is as follows.

[0130] (1) Coating and film formation stage (low temperature curing) The photosensitive resin composition is applied to a substrate such as a glass substrate or an ITO substrate that has been subjected to a predetermined pretreatment in a desired thickness using a method such as spin or slit coating, roll coating, screen printing, or applicator, and then heated to 100°C or less, for example 85°C, for 1 to 10 minutes to remove the solvent, forming a photosensitive resin film. Through this step, it is possible to improve image quality unevenness.

[0131] (2) Exposure stage To form the required pattern on the obtained photosensitive resin film, the film is irradiated with i-line actinic radiation through a mask. The light source used for irradiation can be a low pressure mercury lamp, a high pressure mercury lamp, an ultra-high pressure mercury lamp, a metal halide lamp, an argon gas laser, or the like. In some cases, X-rays, electron beams, or the like can also be used.

[0132] The exposure dose varies depending on the type and amount of each component of the composition, and the thickness of the dried film. When using a high-pressure mercury lamp, the exposure dose is 500 mJ / cm 2 (based on a 365 nm sensor) or less. However, in some cases the exposure may be as low as 500 mJ / cm 2 (365nm sensor) may be exceeded. Through this stage, pixel size can be fine-tuned to achieve high resolution.

[0133] (3) Development stage As for the development method, after the exposure step, an alkaline aqueous solution is used as a developer to dissolve and remove unnecessary parts, leaving only the exposed parts to form a pattern. Through this step, a profile can be formed to achieve high resolution, and color uniformity can be secured to improve clarity.

[0134] Another embodiment provides a display device including the photosensitive resin film.

[0135] The display device may be a micro-organic light emitting diode (OLED) display device.

[0136] The micro organic light emitting device (OLED) display device includes an OLED substrate deposited on a silicon wafer, and a color filter layer laminated on the OLED substrate to convert white light generated from the OLED substrate into a plurality of color lights, and the color filter layer may include a red color filter, a green color filter, and a blue color filter.

[0137] For example, a micro organic light emitting device (OLED) display device may include an OLED substrate deposited on a silicon wafer, an inorganic layer laminated on the OLED substrate, a protective adhesive layer laminated on the inorganic layer, and a color filter layer laminated on the protective adhesive layer to convert white light generated from the OLED substrate into a plurality of color lights, the color filter layer including a red color filter, a green color filter, and a blue color filter.

[0138] For example, the photosensitive resin composition according to an embodiment may be a green photosensitive resin composition, and the green color filter in the micro OLED display device may be a low-temperature cured film of the green photosensitive resin composition.

[0139] Conventionally, an OLED substrate in which an OLED is deposited on a glass substrate or a polyimide substrate has been used, but in the micro OLED display device according to an embodiment, an OLED is deposited on a silicon wafer, which is more advantageous in realizing a micro display. Such micro displays are attracting attention as next-generation displays, and the micro displays are expected to be applied to devices such as MR. In fact, Apple, Meta, LG Display, etc. have all entered or are planning to enter the next-generation MR device market. For example, the micro OLED display device may further include a micro lens array. The micro lens array may be disposed on a protective adhesive layer and may surround a color filter layer.

[0140] The micro OLED display device with the above structure can be driven on a pixel-by-pixel basis by depositing WOLED on a highly integrated silicon wafer, and is advantageous in ensuring high color reproduction and high resolution since it is easy to control the transmission wavelength through the color filter layer patterned with a resolution of 3μm or less.

[0141] For example, the thickness of the protective adhesive layer may be 1 μm or less, in which case the above-mentioned effects can be further increased.

[0142] For example, the thickness of the color filter layer may be 1.1 μm to 1.6 μm.

[0143] If the thickness of the color filter layer is controlled as described above, it is more advantageous in realizing a micro OLED display device.

[0144] For example, the thickness of the inorganic layer may be 2 μm or less. Even in the case of WOLED, light does not always diffuse only in the direction perpendicular to the OLED substrate, so that red, green, and blue color mixing inevitably occurs, and thus, in the past, an inorganic layer was deposited on the OLED substrate to prevent such color mixing. However, since color mixing cannot be completely prevented even by depositing an inorganic layer, in one embodiment, the inorganic layer is thinned, for example, the thickness of the inorganic layer is controlled to 2 μm or less, thereby preventing the phenomenon of minute light leakage.

[0145] In conclusion, since the photosensitive resin composition according to one embodiment can produce a cured film by only low-temperature (100°C) curing during pre-baking and i-line photocuring as described above, there is a significant difference in achievable resolution compared to conventional display devices.

[0146] Hereinafter, preferred embodiments of the present invention will be described, however, the following embodiment is merely one preferred embodiment of the present invention and the present invention is not limited to the following embodiment. EXAMPLES

[0147] (Photosensitive resin composition production) (Examples 1 to 10, Comparative Examples 1 and 2) A polymerization initiator was dissolved in a solvent according to the composition shown in Tables 1 and 2 below, and then stirred at room temperature for 2 hours. A binder resin and a polymerizable monomer were added thereto, and then stirred at room temperature for 1 hour. Other additives and colorants were added thereto, and then stirred at room temperature for 1 hour, and the entire solution was then stirred for 2 hours. The solution was filtered three times to remove impurities, and a photosensitive resin composition was produced.

[0148] [Table 1]

[0149] (A) Binder resin (A-1) Acrylic binder resin containing a structural unit represented by chemical formula A (Showa Denko) (8000 g / mol) [Chemical formula A] [ka] (A-2) Acrylic binder resin containing a structural unit represented by chemical formula A (Showa Denko) (5000 g / mol) (A-3) Acrylic binder resin containing a structural unit represented by chemical formula B (Showa Denko) (5000 g / mol) [Chemical formula B] [ka] (A-4) Acrylic binder resin containing a structural unit represented by chemical formula A (Showa Denko) (4000 g / mol) (A-5) Acrylic binder resin containing a structural unit represented by chemical formula A (Showa Denko) (9000 g / mol) (A-6) Epoxy binder resin (EHPE3150, Daicel Chemical Industries, Ltd.) (A-7) Silsesquioxane-based binder resin (EHPE3150, Daicel Chemical Industries, Ltd.) (B) Coloring agent Pigment dispersion (Sanyo, BA6136) (C) Polymerizable monomer (C-1) Dipentaerythritol hexa(meth)acrylate (DPHA, Nippon Kayaku Co., Ltd.) (C-2) pentaerythritol triacrylate (PE-3A, Kyoeisha) (D) Polymerization initiator Oxime initiator (SPI-03, Sanyosha) (E) Solvent Propylene glycol monomethyl ether acetate (PGMEA, Daicel) (F) Other Additives (F-1) Leveling agent (F-554, DIC) (F-2) Silane coupling agent (KBM503, ShinEtsu) (F-3) Antioxidant (2-Methylhydroquinone, JHChem)

[0150] (evaluation) Using K-spin8 (SEMES) (Track) equipment, the photosensitive compositions according to Examples 1 to 10, Comparative Example 1 and Comparative Example 2 were coated on 8-inch silicon wafers at a rpm that could reach a certain thickness (1.5 μm) for each sample. Then, the wafer was baked at 100°C for 3 minutes in the hot plate of the Track equipment, and the exposure dose was adjusted using Nikon's i-line stepper (exposure conditions = Dose: 800 ms / Focus: -0.3) to expose the pattern. After measuring the thickness using KLA_Tenscor in the exposure process, development was performed to reveal the pattern. EHD-100S solution (TMAH) was used as the developer. The 96 μm recessed pattern of the patterned substrate after development was completed was confirmed using Hitachi's CD-SEM to confirm the sensitivity of the pattern and the residue around the pattern, and the large area coating uniformity was confirmed using an Olympus optical microscope. Coating uniformity was checked with the naked eye, and excellent results were marked with an O, poor results with a △, and extremely poor results that were deemed difficult to commercialize with an X.

[0151] In addition, the substrate on which the pattern was formed was immersed in BASF's TMAH (2.38%) developer (5 min) to confirm the additional color change. The color was measured using a fine pattern colorimeter (LCF).

[0152] The evaluation results are shown in Table 2 below and in FIGS.

[0153] [Table 2]

[0154] From Table 2 and FIGS. 1 to 6, it can be seen that the photosensitive resin composition according to an embodiment can realize a fine pattern even though it is cured at a low temperature, and has excellent residue properties, coating uniformity, and color properties, and is suitable for use in a micro OLED display device.

[0155] The present invention is not limited to the embodiments, and can be manufactured in various different forms, and a person having ordinary skill in the art to which the present invention pertains can understand that the present invention can be embodied in other specific forms without changing the technical idea or essential features of the present invention. Therefore, it should be understood that the above-described embodiments are illustrative in all respects and are not limiting.

Claims

1. (A) a binder resin; (B) a colorant; and (C) a polymerizable monomer; (D) a polymerization initiator; (E) a solvent; and Including, The binder resin includes at least one selected from the group consisting of structural units represented by the following Chemical Formula 1 and Chemical Formula 2, and includes at least two selected from the group consisting of structural units represented by the following Chemical Formulas 3 to 5. A photosensitive resin composition. [Chemical formula 1] 【Chemistry 1】 [Chemical formula 2] 【Chemistry 2】 [Chemical formula 3] 【Chemistry 3】 [Chemical formula 4] 【Chemistry 4】 [Chemical formula 5] 【Chemistry 5】 (In the above Chemical Formulas 1 to 5, R １ ~R ６ and R ８ each independently represents a hydrogen atom or a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, R ７ and R ９ each independently represents a substituted or unsubstituted arylene group having 6 to 20 carbon atoms, L １ ~L ６ are each independently a single bond or a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms.

2. The photosensitive resin composition according to claim 1, wherein the binder resin comprises structural units represented by Chemical Formula 1 and Chemical Formulas 3 to 5.

3. In the above Chemical Formula 1 and Chemical Formula 3 to Chemical Formula 5, R １ , R ４ , and R ６ each independently represents a substituted or unsubstituted alkyl group having 1 to 20 carbon atoms, R ２ , R ５ , and R ８ are each independently a hydrogen atom, L １ ~L ６ and each independently represents a substituted or unsubstituted alkylene group having 1 to 20 carbon atoms.

4. The photosensitive resin composition according to claim 1, wherein the binder resin has a weight average molecular weight of 5000 g / mol to 8000 g / mol.

5. The photosensitive resin composition according to claim 1, wherein the binder resin has a double bond equivalent of 150 g / mol to 500 g / mol.

6. 2. The photosensitive resin composition according to claim 1, wherein the solid content constituting the photosensitive resin composition is contained in an amount of 12% by weight to 24% by weight based on the total amount of the photosensitive resin composition.

7. The photosensitive resin composition according to claim 1 , wherein the polymerizable monomer comprises one or more compounds containing three or more functional groups.

8. The polymerizable monomer is a mixture of two compounds, 8. The photosensitive resin composition according to claim 7, wherein the two types of compounds each independently contain three or more functional groups.

9. 9. The photosensitive resin composition according to claim 8, wherein the two types of compounds are a first polymerizable monomer having 3 to 5 functional groups and a second polymerizable monomer having 6 or more functional groups, and the first polymerizable monomer is contained in a smaller amount than the second polymerizable monomer.

10. The photosensitive resin composition contains, relative to the total amount of the photosensitive resin composition, 5% by weight to 20% by weight of the (A) binder resin; 70% by weight to 90% by weight of the (B) colorant; 1% by weight to 10% by weight of the polymerizable monomer (C); 0.1% by weight to 5% by weight of the (D) polymerization initiator; the remaining amount of the (E) solvent; The photosensitive resin composition according to claim 1 ,

11. The photosensitive resin composition according to claim 1 , further comprising an antioxidant.

12. The photosensitive resin composition according to claim 11, wherein the antioxidant is contained in an amount of 0.01% by weight to 1% by weight based on the total amount of the photosensitive resin composition.

13. The photosensitive resin composition according to claim 1, further comprising an additive selected from the group consisting of malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a surfactant, and combinations thereof.

14. A photosensitive resin film produced by using the photosensitive resin composition according to claim 1.

15. A display device comprising the photosensitive resin film according to claim 14.

16. The display device includes an OLED substrate deposited on a silicon wafer, and a color filter layer laminated on the OLED substrate to convert white light generated from the OLED substrate into a plurality of color lights; 16. The display device of claim 15, wherein the color filter layer comprises a red color filter, a green color filter, and a blue color filter.

17. Applying the photosensitive resin composition according to claim 1; After the coating, pre-baking at a temperature of 100° C. or less; After the pre-baking, exposing the substrate to an i-line light; a developing step; A method for producing a photosensitive resin film comprising the steps of:

Images