Lighting module, lighting device, and lamp

Abstract

To provide a lighting device, a light unit, a liquid crystal display device, and a vehicle lamp.SOLUTION: A lighting device disclosed in an embodiment of the invention includes: a substrate; a plurality of light emitting devices disposed on the substrate; a resin layer covering the plurality of light emitting devices on the substrate; and a first reflective member disposed on the resin layer. The resin layer includes a first surface facing the plurality of light emitting devices, and a hole disposed between the first surface and the plurality of light emitting devices. The hole penetrates from a lower surface of the first reflective member in a direction of the substrate, and the hole and the light emitting device may overlap in a light emission direction of the light emitting device.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an illumination module having a plurality of light emitting elements. The present invention relates to an illumination module providing a line-shaped surface light source, and an illumination device, a light unit, a liquid crystal display device, and a vehicle lamp having the illumination module. [Background technology]

[0002] Lighting applications include vehicle lighting as well as display and signboard backlighting. Light-emitting diodes (LEDs) have advantages over existing light sources such as fluorescent lamps and incandescent lamps, such as low power consumption, semi-permanent lifespan, fast response speed, safety, and environmental friendliness. Such light-emitting devices are applied to various display devices and various lighting devices such as interior and exterior lights. Recently, lamps using LEDs as vehicle light sources have been proposed. Compared to incandescent lamps, LEDs have the advantage of low power consumption. However, since the angle of light emitted from LEDs is small, there is a demand for increasing the light-emitting area of ​​LED-based lamps when using LEDs as vehicle lamps. LEDs are small in size, which allows for greater freedom in lamp design, and their semi-permanent lifespan makes them economical. Summary of the Invention [Problem to be solved by the invention]

[0003] An embodiment of the invention provides a lighting module or lighting device that outputs light emitted from a plurality of light-emitting elements in a line shape. An embodiment of the invention provides a lighting module or lighting device having an output surface having a line width in one direction of a plurality of light-emitting elements. An embodiment of the invention provides a lighting module or lighting device having a transparent output surface having a line width around a plurality of light-emitting elements. An embodiment of the invention provides a lighting module or lighting device in which a resin layer having one or more holes is arranged along a plurality of light-emitting elements. An embodiment of the invention provides a lighting module or lighting device having a resin layer in which holes arranged in one or two rows along a plurality of light-emitting elements are arranged. An embodiment of the invention provides a lighting module or lighting device in which reflective members are arranged on the upper and lower surfaces of a resin layer in which a plurality of light-emitting elements are arranged. An embodiment of the invention may provide a lighting module that irradiates side light or surface light in a line shape, and a lighting device, a light unit, a liquid crystal display device, and a vehicle lamp having the same. [Means for solving the problem]

[0004] A lighting device according to an embodiment of the invention includes a substrate, a plurality of light-emitting elements disposed on the substrate, a resin layer disposed on the substrate, and a first reflecting member disposed on the resin layer, the resin layer including a first surface facing the emission surfaces of the plurality of light-emitting elements, and a hole disposed between the first surface and the plurality of light-emitting elements, the hole penetrating the resin layer toward the substrate at a lower surface of the first reflecting member, and the hole and the light-emitting elements may overlap in a light emission direction of the light-emitting elements. According to an embodiment of the invention, the hole may include a plurality of holes facing each of the plurality of light-emitting elements and spaced apart from each other. Each of the plurality of holes may face the emission surfaces of the plurality of light-emitting elements and have an area larger than an area of ​​the emission surfaces. The hole may have a length longer than a length connecting both ends of the plurality of light-emitting elements.

[0005] According to an embodiment of the invention, the holes are arranged closer to the light emitting element than the first surface of the resin layer. The holes may be arranged in two rows between the light emitting element and the first surface of the resin layer, and at least one of the two rows of holes may be arranged in a plurality of rows. An embodiment of the invention includes a second reflecting member between the substrate and the resin layer, and the holes are arranged between the second reflecting member and the second reflecting member. The height of the holes may be in a range of 50% to 100% of the thickness of the resin layer. The holes include a first surface portion facing the emission surface of the light emitting element, a second surface portion and a third surface portion that are gradually narrowed in distance from both ends of the first surface portion toward the first surface of the resin layer, and an interior angle formed by the second surface portion and the third surface portion may be in a range of 60 degrees to 120 degrees. According to an embodiment of the invention, the virtual line connecting the plurality of light emitting elements may include a straight line, a diagonal line, or a curved line, and the virtual line connecting the plurality of holes may be a straight line, a diagonal line, or a curved line. The hole may include a bar shape parallel to the first surface. Effect of the Invention

[0006] According to the embodiments of the invention, the luminous intensity of the light source can be improved, and a line-shaped surface light source can be provided by a plurality of point light sources. In addition, the manufacturing process of the lighting module can be reduced. According to the embodiments of the invention, the light loss can be reduced and the light efficiency can be improved. In addition, since a thin lighting module is provided in the form of a line light, the design freedom can be increased and the light uniformity of the surface light source can be improved. The optical reliability of the lighting module and the lighting device having the same according to the embodiments of the invention can be improved. In addition, the reliability of a vehicle lighting device having the lighting module can be improved. In addition, the present invention is applicable to a light unit, various display devices, lighting devices, or vehicle lamps having a lighting module. [Brief description of the drawings]

[0007] [Figure 1] 1 is a perspective view showing a lighting module according to a first embodiment of the invention; [Diagram 2]FIG. 2 is a plan view of the lighting module of FIG. [Diagram 3] FIG. 3 is a cross-sectional side view of the lighting module of FIG. 2 taken along line A-A. [Figure 4] FIG. 3 is a cross-sectional view of the lighting module of FIG. 2 taken along line B-B. [Diagram 5] FIG. 3 is a front view of the lighting module of FIG. 2. [Figure 6] FIG. 3 is an exploded perspective view of the lighting module of FIG. 2. [Figure 7] FIG. 3 is a partially enlarged view of the lighting module of FIG. 2. [Figure 8] 3 is a modified example of the hole in the lighting module of FIG. 2. [Figure 9] 3 is a modified example of the hole in the lighting module of FIG. 2. [Figure 10] 3 is a modified example of the hole in the lighting module of FIG. 2. [Figure 11] 3 is a modified example of the hole in the lighting module of FIG. 2. [Figure 12] 3 is a modified example of the hole in the lighting module of FIG. 2. [Figure 13] 3 is another example of a hole in the lighting module of FIG. 2. [Figure 14] 11 is an example of a plan view of a lighting module according to a second embodiment of the invention. [Figure 15] 15 is a partial enlarged view for explaining a hole in the lighting module of FIG. 14. FIG. [Figure 16] 15 is a modified example of the hole in the lighting module of FIG. 14. [Figure 17] 15 is a modified example of the hole in the lighting module of FIG. 14. [Figure 18] 15 is a modified example of the hole in the lighting module of FIG. 14. [Figure 19] 15 is a modified example of the hole in the lighting module of FIG. 14. [Figure 20] 2. (A) to (D) are examples in which the exit angle of the hole in the lighting module of FIG. 2 is modified. [Figure 21] 4 is a modified example of the lighting module according to the first or second embodiment of the invention. [Figure 22]13 is an example in which a reflector is disposed behind a lighting module according to an embodiment of the invention. [Diagram 23] 1A to 1C are examples of manufacturing processes for a lighting module according to an embodiment of the invention. [Figure 24] 1 is a diagram showing the luminous intensity of a lighting module according to a first embodiment of the invention. [Diagram 25] 11 is a diagram showing the luminous intensity of a lighting module according to a second embodiment of the invention. [Figure 26] 21 is a graph comparing luminous intensity according to the exit angle of the hole of the lighting module of FIG. 20. [Figure 27] 1 is a front view of a light-emitting element applied to a lighting module according to an embodiment of the present invention; [Figure 28] 28 is an example of a module in which the light emitting element of FIG. 27 is disposed on a circuit board. [Figure 29] 2 is an example of a lamp to which a lighting module according to an embodiment of the invention is applied. [Diagram 30] 1 is a plan view of a vehicle to which a lamp having a lighting device or lighting module according to an embodiment of the invention is applied; [Diagram 31] 31 is a diagram showing a lamp having the lighting module or lighting device of FIG. 30. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, which will enable a person skilled in the art to which the present invention pertains to easily carry out the present invention. However, it should be understood that the embodiment described in this specification and the configurations illustrated in the drawings are merely preferred embodiments of the present invention, and that various equivalents and modifications may exist at the time of filing this application. In the detailed description of the operation principle of the preferred embodiment of the present invention, if a detailed description of a known configuration or function is deemed to hinder the understanding of the embodiment of the present invention, the detailed description will be omitted. Each term described below is a term defined in consideration of the function in the present invention, and the meaning of each term should be interpreted based on the overall content of this specification. Throughout the drawings, parts having similar functions and actions are denoted by the same reference numerals. The lighting device according to the present invention can be applied to various lamp devices requiring illumination, such as vehicle lamps, home lighting devices, and industrial lighting devices. For example, when applied to vehicle lamps, the lighting device of the present invention can be applied to headlamps, side lamps, side mirror lamps, fog lamps, tail lamps, brake lights, daytime running lights, vehicle interior lighting, door scuffs, rear combination lamps, backup lamps, etc. The lighting device of the present invention can be applied to indoor and outdoor advertising devices, display devices, and various electric vehicles, and can be applied to all lighting fields and advertising fields that are currently developed and commercialized or can be realized by future technological development. The following embodiments will be made clear from the accompanying drawings and explanations of the embodiments. In the explanation of the embodiments, when it is described that each layer, region, pattern, or structure is formed "on" or "under" the substrate, each layer, region, pad, or pattern, "on" and "under" include those formed "directly" or "with another layer interposed therebetween". In addition, the reference to the top or bottom of each layer will be described based on the drawings.

[0009] <Lighting module> 1 to 7, a lighting module 200 according to an embodiment of the invention includes a plurality of light emitting elements 100 and emits light emitted from the light emitting elements 100 as a line-shaped surface light. The lighting module 200 has a side surface, an emission surface, or a transparent surface having a line width arranged around the plurality of light emitting elements 100. The lighting module 200 has an emission surface or a transparent surface having a certain width on one side of the plurality of light emitting elements 100. The lighting module 200 may include a first surface S1 facing one side of the light emitting element 100, a second surface S2 opposite to the first surface S1, and third and fourth surfaces S3 and S4 extending in a second direction from both ends of the first surface S1 and the second surface S2. The first and second surfaces S1 and S2 may be opposed to each other. At least a portion of the third and fourth surfaces S3 and S4 may be opposed to each other. As another example, as shown in FIG. 21, the third and fourth surfaces S3 and S4 may not be opposed to each other. The minimum distance between the first and second surfaces S1, S2 may be smaller than the minimum distance between the third and fourth surfaces S3, S4.

[0010] The first surface S1 and the second surface S2 may have a long length in one direction or a first direction X. The one direction or the first direction X may include a straight line or a curved line as shown in FIG. 21. The third surface S3 and the fourth surface S4 may be perpendicular to the first direction X or perpendicular to the first or second surfaces S1 and S2. The first surface S1 may face the light emitting surface 111 of the light emitting element 100 or may be a surface exposed in the second direction from a first end of the third surface S3 and the fourth surface S4. The second surface S2 may face the non-light emitting surface of the plurality of light emitting elements 100 or may be a surface exposed in the second direction from a second end of the third surface S3 and the fourth surface S4. The third surface and the fourth surface S3 and S4 may be side surfaces different from the first surface S1 and the second surface S2.

[0011] In the lighting module 200, a plurality of light emitting elements 100 may be arranged in a first direction or along a region between the first surface S1 and the second surface S2. The plurality of light emitting elements 100 may be arranged in one row. A virtual line connecting the light emitting elements 100 arranged in one row may include a straight line or a curved line having a curvature. As another example, the plurality of light emitting elements may be arranged in two rows, and the light emitting elements in the two rows may be arranged between the first surface S1 and the second surface S2 so as not to overlap in a column direction (e.g., Y direction). The plurality of light emitting elements 100 arranged in the first direction X may face the first surface S1 or the exit surface. Each exit surface 111 of the plurality of light emitting elements 100 may face the first surface S1. Light emitted from the light emitting element 100 is emitted through the first surface S1, and a part of the light is emitted through at least one of the second surface S2, the third surface S3, and the fourth surface S4.

[0012] As shown in FIG. 2 to FIG. 5, the lighting module 200 may have a length X1 in a first direction X longer than a width Y1 in the second direction Y. The length X1 in the first direction is variable depending on the number of the light emitting elements 100 arranged, and may be, for example, 30 mm or more. The width Y1 in the second direction may be 13 mm or more or 16 mm or more. The width Y1 in the second direction Y of the lighting module 200 may provide an area in which the emitted light of the light emitting element 100 is diffused and an area that protects the rear of the light emitting element 100. As shown in FIG. 2, the distance D1 between the light emitting element 100 and the first surface S1 and the distance D5 between the light emitting element 100 and the second surface S2 may be different based on the light emitting element 100. The distance D5 between the light emitting element 100 and the second surface S2 may be 2 mm or more, for example, in the range of 2 mm to 20 mm. If the distance D5 between the light emitting device 100 and the second surface S2 is smaller than the range, the area where moisture can penetrate or a circuit pattern can be formed is small, and if the distance D5 is larger than the range, the size of the lighting module 200 is large. In the lighting module 200, the first surface S1, the second surface S2, the third surface S3, and the fourth surface S4 may be provided as surfaces perpendicular to a third direction Z. The third direction Z may be a direction perpendicular to the first and second directions X and Y. The first surface S1, the second surface S2, the third surface S3, and the fourth surface S4 may have the same thickness or height in the third direction Z. The lighting module 200 includes a substrate 210, a resin layer 220 on the substrate 210, and a first reflecting member 240 on the resin layer 220. The first to fourth surfaces S1, S2, S3, and S4 may be side surfaces of the resin layer 220. The resin layer 220 includes the first surface S1, the second surface S2, the third surface S3, and the fourth surface S4. The resin layer 220 is disposed to surround an element, for example, one or more light emitting elements 100, disposed on the substrate 210. The light emitting elements 100 are arranged in a first direction, with at least three or more light emitting elements 100 disposed within the resin layer 220. The light emitting elements 100 are disposed between the substrate 210 and the first reflecting member 240. The resin layer 220 may be made of a light-transmitting material such as silicone or epoxy.The resin layer 220 may also include a glass material as another material.

[0013] The lighting module 200 may include a second reflective member 230 between the resin layer 220 and the substrate 210. The second reflective member 230 may not be formed, and a reflective member may be attached to the upper surface of the substrate 210 to replace the role of the second reflective member 230. The substrate 210 may include a printed circuit board (PCB), and may include, for example, a resin-based printed circuit board (PCB), a metal core PCB, a flexible PCB, a ceramic PCB, or an FR-4 substrate. The substrate 210 may be a substrate made of a flexible or rigid material. A circuit pattern is disposed on the substrate 210. The circuit pattern of the substrate 210 may include a plurality of pads in an area corresponding to the light emitting element 100. A rear area of ​​the substrate 210 based on the light emitting element 100 is an opposite area to an area from which light is emitted, and a circuit pattern for connecting the light emitting element 100 is disposed thereon. The width of the rear region is variable depending on the number of the light emitting devices 100 or the connection method of the light emitting devices 100. The width of the rear region may be provided as a distance D5 between the light emitting device 100 and the second surface S2 of 2 mm or more. This makes it possible to prevent moisture from penetrating from the rear of the light emitting device 100 and to form a circuit pattern for connecting a plurality of light emitting devices 100.

[0014] The light emitting devices 100 have bonding parts disposed at the bottom and are electrically connected to pads of the substrate 210. The light emitting devices 100 are connected in series by a circuit pattern of the substrate 210. As another example, the light emitting devices 100 may be connected in parallel by a circuit pattern of the substrate 210, or a group of two or more light emitting devices connected in series may be connected in parallel. The light emitting device 100 may include a package in which an element having a light emitting chip or an LED chip is packaged. The light emitting chip may emit at least one of blue, red, green, and ultraviolet (UV). The light emitting device 100 may emit at least one of white, blue, red, and green. The light emitting device 100 emits light in a lateral direction and has a bottom disposed on the substrate 210. The light emitting device 100 may be a side view type. As another example, the light emitting device 100 may be an LED chip, and one side of the LED chip is open and the other side is provided with a reflective member. The light emitting surface 111 of the light emitting device 100 is disposed on a surface adjacent to the substrate 210, for example, a side surface adjacent to the upper surface of the substrate 210. The light emitting surface 111 is disposed on a side surface between the bottom and upper surface of the light emitting device 100, and emits light in the second direction Y. The light emitting surface 111 of the light emitting device 100 may be a surface adjacent to the second reflecting member 230 and perpendicular to the upper surface of the substrate 210 and the upper surface of the second reflecting member 230. The thickness of the light emitting device 100 may be smaller than the length of the light emitting device 100 in the first direction X. The thickness of the light emitting device 100 may be 3 mm or less, for example, 2 mm or less. The thickness of the light emitting device 100 may be in the range of 1 mm to 2 mm, for example, in the range of 1.2 mm to 1.8 mm. As shown in FIG. 4 and FIG. 5, the peach G1 between the light emitting devices 100 may be 10 mm or more, for example, in the range of 10 mm to 30 mm. In addition, the distance G2 between the outermost light emitting device 100 and the third or fourth side surface S3 or S4 of the resin layer 220 may be smaller than the pitch G1, and may be 10 mm or less.The length (L1 in FIG. 7) of the light emitting device 100 in the first direction X may be larger than the thickness of the light emitting device 100, for example, 1.5 times or more of the thickness of the light emitting device 100. Since the light emitting device 100 has a small thickness and a large length in the first direction X, it can provide a wide light output angle in the first direction X, which is a left-right direction based on the center of the light emitting device 100. Here, the light output angle of the light emitting device 100 in the first direction X may be larger than the light output angle in the third direction Z, which is an up-down direction. The light output angle of the light emitting device 100 in the second direction Y may range from 110 degrees to 160 degrees. Here, as shown in FIG. 3, the thickness Za of the substrate 210 may be smaller than the thickness of the light emitting device 100. The thickness of the light emitting device 100 may be more than twice the thickness Za of the substrate 210, for example, in the range from 2 times to 4 times. Since the thickness Za of the substrate 210 is provided thin, the lighting module 200 may be provided as a flexible plate.

[0015] The resin layer 220 is disposed on the substrate 210. The second reflecting member 230 is disposed between the resin layer 220 and the substrate 210. The resin layer 220 may cover the light emitting device 100, and the first reflecting member 240 may cover the upper surface of the resin layer 220. The resin layer 220 may contact the upper surface and side of the light emitting device 100. The resin layer 220 may contact the upper surface of the second reflecting member 230. A part of the resin layer 220 may contact the substrate 210 through the opening 232 of the second reflecting member 230. The resin layer 220 may contact the emission surface of the light emitting device 100. The first surface S1, the second surface S2, the third surface S3, and the fourth surface S4 of the resin layer 220 are side surfaces between the first and second reflecting members 240 and 230. The first surface S1, the second surface S2, the third surface S3, and the fourth surface S4 may be surfaces around the light emitting device 100 or surfaces corresponding to the side surfaces of the light emitting device 100. The upper surface area of ​​the resin layer 220 may be the same as the upper surface area of ​​the substrate 210, the upper surface area of ​​the second reflecting member 230, or the upper surface area of ​​the first reflecting member 240. The length of the resin layer 220 in the first direction may be the same as the length of the substrate 210, the length of the second reflecting member 230, or the length of the first reflecting member 240. The maximum width Y1 of the resin layer 220 in the second direction may be the same as the maximum width of the substrate 210, the maximum width of the second reflecting member 230, or the maximum width of the first reflecting member 240. The resin layer 220 is disposed between the first and second reflecting members 240, 230. The upper surface of the second reflecting member 230 and the lower surface of the first reflecting member 240 are disposed to face the lower surface of the resin layer 220 at the upper surface. An upper surface of the first reflective member 230 and a lower surface of the second reflective member 230 may have the same area. Thus, the resin layer 220 may diffuse and guide the light emitted from the light emitting device 100 and the light reflected by the first and second reflective members 240 and 230 to a lateral direction. The resin layer 220 is formed to a thickness Zb that is thicker than the thickness of the light emitting device 100. Thus, the resin layer 220 may protect the upper part of the light emitting device 100 and prevent moisture from penetrating.The light emitting device 100 can be protected by disposing the substrate 210 on the lower part and the resin layer 220 on the upper part. Therefore, the distance between the upper surface of the resin layer 220 and the light emitting device 100 is 0.6 mm or less, for example, in the range of 0.5 mm to 0.6 mm. The upper part of the resin layer 220 is disposed with the same thickness as the distance, and can protect the upper part of the light emitting device 100. The thickness Zb of the resin layer 220 is the distance between the first and second reflecting members 240, 230, and the distance (for example, Zb) between the first and second reflecting members 240, 230 may be smaller than the distance between the first surface S1 and the second surface S2. For example, the distance between the first surface S1 and the second surface S2 may include a maximum distance or a minimum distance. The distance or the distance between the second reflecting member 230 and the first reflecting member 240 may be smaller than the distance or the distance between the first surface S1 and the second surface S2 of the resin layer 220. By disposing the distance between the first and second reflecting members 240 and 230 smaller than the width Y1 or the minimum width of the lighting module 200 in the second direction, a line-shaped surface light can be provided, and the luminous intensity can be improved and hot spots can be prevented. In addition, a lighting module that is flexible in the third direction can be provided. The thickness Zb of the resin layer 220 may be equal to or less than twice the thickness of the light emitting element 100, for example, more than 1 time and equal to or less than 2 times. The thickness Zb of the resin layer 220 may be, for example, in the range of 1.5 mm to 1.9 mm or 1.6 mm to 1.8 mm. The thickness Zb of the resin layer 220 may be equal to or less than 0.8 times the thickness Z1 of the lighting module 200, for example, in the range of 0.4 times to 0.8 times the thickness Z1 of the lighting module 200. Since the resin layer 220 is disposed with a difference of 1.2 mm or less from the thickness Z1 of the lighting module 200, a decrease in the light efficiency of the lighting module 200 can be prevented and a flexible characteristic can be enhanced. The resin layer 220 may include a resin material such as silicone, silicone molding compound (SMC), epoxy, or epoxy molding compound (EMC).The resin layer 220 may include a UV (ultra violet) curable resin or a thermosetting resin material, and may selectively include, for example, PC, OPS, PMMA, PVC, etc. The resin layer 220 may include a phosphor. The phosphor may include at least one of a yellow phosphor, a green phosphor, a blue phosphor, and a red phosphor. A light extraction structure such as a concave-convex structure is disposed on the first surface S1 of the resin layer 220, but is not limited thereto. A first region horizontally overlapping the light emitting element 100 on the first surface S1 and a second region horizontally overlapping a region between the light emitting elements are disposed on the same plane. As another example, the second region may be recessed from the first region toward the second surface, or the first region may be protruded from the second region in a convex manner.

[0016] The second reflective member 230 may reflect light emitted from the light emitting device 100. The second reflective member 230 is formed on the upper surface of the substrate 210. The second reflective member 230 may be formed on the upper layer of the substrate 210 or may be formed on a separate layer. The second reflective member 230 is attached to the upper surface of the substrate 210 with an adhesive. The resin layer 220 is attached to the upper surface of the second reflective member 230. The second reflective member 230 has a plurality of openings 232 in an area corresponding to the lower surface of the light emitting device 100, and the light emitting device 100 is connected to the substrate 210 through the openings 232. A portion of the resin layer 220 may contact the substrate 210 through the openings 232. The openings 232 may be an area where the light emitting device 100 is bonded to the substrate 210. The second reflective member 230 may be formed in a single layer or a multi-layer structure. The second reflective member 230 may include a material that reflects light, for example, a metal or a non-metal material. If the second reflective member 230 is a metal, it may include a metal layer such as stainless steel, aluminum (Al), or silver (Ag), and if the second reflective member 230 is a non-metal material, it may include a white resin material or a plastic material. The second reflective member 230 may include a white resin material or a polyester (PET) material. The second reflective member 230 may include at least one of a low reflection film, a high reflection film, a diffuse reflection film, or a regular reflection film. The second reflective member 230 may be provided as a regular reflection film for reflecting incident light to the first surface S1, for example.

[0017] One end of the second reflecting member 230 is disposed on the same plane as the first surface S1. The other end of the second reflecting member 230 is disposed on the same plane as the second surface S2. As another example, one end and the other end of the second reflecting member 230 are spaced apart from the first surface S1 and the second surface S2 and contact the resin layer 220. That is, the outside of the second reflecting member 230 is covered with the resin layer 220 to prevent moisture from penetrating. The thickness Zc of the second reflecting member 230 may be smaller than the thickness Za of the substrate 210. The thickness Zc of the second reflecting member 230 is disposed to be 0.5 times or more the thickness Za of the substrate 210, so that the transmission loss of the incident light can be reduced. The thickness Zc of the second reflecting member 230 may be in the range of 0.2 mm to 0.4 mm. If the thickness Zc is smaller than the range, a light transmission loss occurs, and if the thickness Zc is thicker than the range, the thickness Z1 of the lighting module 200 increases.

[0018] The first reflective member 240 is disposed on the resin layer 220. The first reflective member 240 is bonded to the upper surface of the resin layer 220. The first reflective member 240 is disposed on the entire upper surface of the resin layer 220 to reduce light loss. The first reflective member 240 may be made of the same material as the second reflective member 230. The first reflective member 240 may have a material with a higher light reflectivity or a greater thickness than the material of the second reflective member 230 in order to reflect light and reduce light transmission loss. The first reflective member 240 may have the same or a greater thickness than the second reflective member 230. For example, the first and second reflective members 240 and 230 may be provided with the same material and the same thickness. The first reflective member 230 may be spaced apart from an edge of the substrate 210, and a portion of the resin layer 220 may contact an upper surface of the edge side of the substrate 210. When the resin layer 220 contacts the edge of the substrate 210, it can suppress the penetration of moisture. The thickness Zd of the first reflecting member 240 may be smaller than the thickness Za of the substrate 210. The thickness Zd of the first reflecting member 240 is disposed to be 0.5 times or more the thickness Za of the substrate 210, so that the transmission loss of the incident light can be reduced. The thickness Zd of the first reflecting member 240 may be in the range of 0.2 mm to 0.4 mm, and if it is smaller than this range, the light transmission loss occurs, and if it is thicker than this range, the thickness Z1 of the lighting module 200 increases. The first reflecting member 240 may be formed in a single layer or a multi-layer structure. The first reflecting member 240 may include a material that reflects light, for example, a metal or a non-metallic material. If the first reflecting member 240 is a metal, it may include a metal layer such as stainless steel, aluminum (Al), or silver (Ag), and if it is a non-metallic material, it may include a white resin material or a plastic material. The first reflecting member 240 may include a white resin material or a polyester (PET) material. The first reflecting member 240 may include at least one of a low reflection film, a high reflection film, a diffuse reflection film, and a regular reflection film. The first reflecting member 240 may be provided as a regular reflection film so that the incident light travels in the direction of the first surface S1.

[0019] The outgoing surface of the resin layer 220 is treated to have a haze surface to diffuse light. The haze surface is treated to have a rougher surface than the inner surface of the resin layer 220 to diffuse the outgoing light.

[0020] The lighting module 200 according to the embodiment of the invention may provide a flexible line-shaped surface light source by providing a thickness Z1 in the third direction in a line shape. The thickness Z1 of the lighting module 200 may be 3 mm or less. That is, the lighting module 200 may be provided as a line-shaped surface light source of 3 mm or less. As another example, the lighting module 200 may be disposed to be greater than 3 mm and less than 6 mm. In this case, the thickness of the lighting module 200 increases, but the thickness of the resin layer 220 is provided to be thicker to increase the line width and increase the light distribution area. Referring to FIG. 3, when the thickness of each component of the lighting module 200 is Za, the thickness of the resin layer 220 is Zb, the thickness of the second reflecting member 230 is Zc, and the thickness of the first reflecting member 240 is Zd, there may be a relationship of Zb>Za>Zd≧Zc. The distance between the lower surface of the substrate 210 and the upper surface of the first reflecting member 240 is the thickness Z1 of the lighting module 200. The thickness Zb may have a ratio of 0.4 to 0.8 of Z1, the thickness Za may have a ratio of 0.14 to 0.18 of Z1, and the thickness Zd or Zc may have a ratio of 0.08 to 0.12 of Z1. The Zb may have a ratio of 3.5 to 4 of Za. The Zb may have a ratio of 5.8 to 6.4 of Zc or Zd. The thickness Zb of the resin layer 220 is arranged to be thicker than the thickness Za of the substrate 210, so that the light emitting device 100 can be protected, the light can be diffused and guided, and the flexibility characteristics can be enhanced. In addition, a line-shaped emission surface having the thickness Zb or height of the resin layer 220 is provided, so that a line emission surface can be provided.

[0021] 2 and 7, in the first embodiment of the invention, the resin layer 220 includes a hole R0 therein. The hole R0 may penetrate the resin layer 220 from the upper surface of the resin layer 220 toward the substrate 210, or may be recessed through the resin layer 220. The hole R0 may be arranged in one or more. The hole R0 is arranged between each light emitting element 100 and the first surface S1. At least a portion of the hole R0 may overlap with the light emitting surface 111 of the light emitting element 100 in the horizontal direction. The hole R0 may diffuse the light emitted from the light emitting element 100. The material filled in the hole R0 may have a refractive index different from that of the resin layer 220. The material filled in the hole R0 may have a refractive index lower than that of the material of the resin layer 220. The hole R0 may be filled with a gas, for example, air, oxygen, nitrogen, hydrogen, argon, or carbon dioxide. The hole R0 may be in a vacuum state. As another example, the hole R0 may be filled with a material having a higher refractive index than the resin layer 220. The material having a higher refractive index may include metal oxide or metal nitride. The hole R0 and each light emitting device 100 may overlap in a direction from the first surface S1 toward the light emitting device 100. The area of ​​each hole R0 may be larger than the area of ​​each light emitting device 100's output surface. That is, a hole R0 having an area larger than the front area of ​​each light emitting device 100 may be provided in front of each light emitting device 100. The maximum length B1 of the hole R0 in the first direction X may be larger than the length L1 of each light emitting device 100 in the first direction. The maximum length B1 of the hole R0 in the first direction may be larger than the length of the output surface 111 of each light emitting device 100 in the first direction. As a result, the hole R0 can cover the output side area of ​​the light emitting device 100 in the first direction and can diffuse the incident light with a predetermined directivity angle distribution. The length B1 may be 1 mm or more larger than the length L1 of the light emitting device 100, or may be 115% or more larger than the length L1. A maximum width B2 of the hole R0 in the second direction may be equal to or larger than the width L2 of the light emitting device 100.The maximum width B2 of the hole R0 in the second direction may be 1 mm or more, for example, in the range of 1 mm to 4 mm. If the maximum width B2 of the hole R0 in the second direction is smaller than the range, it is difficult to process, and if it is larger than the range, the improvement rate of the light uniformity is small. The hole R0 is disposed in an area of ​​5% or more, for example, 5% to 60%, of the distance D1 between the light emitting element 100 and the first surface S1.

[0022] The minimum distance D2 between the first surface S1 of the resin layer 220 and the hole R0 may be smaller than the minimum distance D1 between the light emitting element 100 and the first surface S1 of the resin layer 220. The minimum distance D2 between the first surface S1 of the resin layer 220 and the hole R0 may be equal to or larger than the minimum distance D3 between the hole R0 and the light emitting element 100. That is, the hole R0 is disposed closer to the light emitting element 100 than the first surface S1 of the resin layer 220. The minimum distance D1 between the light emitting element 100 and the first surface S1 of the resin layer 220 may be 4 mm or more, for example, in the range of 4 mm to 10 mm or in the range of 4 mm to 20 mm. By disposing the minimum distance D2 in the range of 10% to 60% of the distance D1, the incident light can be refracted and diffused by the hole R0. The minimum distance D3 between the hole R0 and the light emitting element 100 may be 2 mm or more, for example, in the range of 2 mm to 4 mm. If the minimum distance D3 is smaller than the range, it affects the directivity angle distribution of light of the light emitting device 100, and the light extraction efficiency is reduced. The minimum distance D3 may be a minimum distance considering an error between a fixing pin (291 in FIG. 23) inserted when mounting the light emitting device 100 and forming the hole R0. The distance G4 between the light emitting devices 100 may be 5 mm or more, for example, between 5 mm and 18 mm. If the distance G4 is too narrow, the number of the light emitting devices 100 increases, and if the distance G4 is too large, dark areas occur between the light emitting devices 100. The distance G4 is variable according to the directivity angle distribution of the light emitting device 100. The hole R0 may be arranged one-to-one with the light emitting device 100, and hot spots on the central region of the light emitting device 100 can be reduced. If a plurality of holes R0 are arranged, the interval G3 between the holes R0 may be smaller than the interval G4 between the light emitting devices 100. The interval G3 may be 100% or more of the interval G4, for example, in the range of 100% to 200%. If the interval G3 is smaller than the interval G4, the difference in luminous intensity between the area passing through the hole R0 and its surroundings becomes large. Here, adjacent holes R0 are interconnected.

[0023] As shown in FIG. 3, the height of the hole R0 may be the same as the thickness Zb of the resin layer 220, or may be in the range of 50% to 100% or 80% to 100% of the thickness Zb of the resin layer 220. The lower surface of the first reflecting member 240 is disposed on the upper surface of the hole R0. The upper surface of the second reflecting member 230, the upper surface of the substrate 210, or a part of the resin layer 220 is disposed on the lower surface of the hole R0. The hole R0 is formed by disposing a fixing pin in the resin layer 220 and removing the fixing pin after the resin layer 220 is hardened. Here, in the process of forming the hole R0, if the fixing pin is disposed first and then the resin layer 220 is dispensed and hardened, resin may not be disposed at the bottom of the fixing pin. As another example, if the fixing pin is inserted before the resin layer 220 is dispensed and hardened, a part of the resin may be present at the bottom of the fixing pin. Thus, the height of the hole R0 may be the same as the thickness Zb of the resin layer 220, or may be in the range of 50% to 100% or 80% to 100% of the thickness Zb of the resin layer 200. The top view shape of the hole R0 may include a polygonal shape or a shape having a curved surface. The polygonal shape may be a triangle, a rectangle, or a shape with pentagons or more. The hole R0 may include a first surface portion Ra facing the light emitting element 100, and a second surface portion Rb and a third surface portion Rc facing the first surface S1. The first surface portion Ra may be a region where the light is incident. The second surface portion Rb and the third surface portion Rc may be surfaces that emit the light traveling through the first surface portion Ra or another surface portion. The first surface portion Ra may have the height of the hole R0 and may have a maximum length in the first direction X of the hole R0. The second surface portion Rb and the third surface portion Rc are arranged to be inclined from both ends of the first surface portion Ra. The distance between the second surface Rb and the third surface Rc may be greatest at the first surface Ra and smallest at a point closest to the first surface S1. The second surface Rb and the third surface Rc may provide a vertex at a point where they intersect with each other. The interior angle C1 of the vertex Rp may be less than 120 degrees, for example, in the range of 60 degrees to 120 degrees.That is, the interior angle C1 of the vertex Rp is the angle between the second face Rb and the third face Rc or the interior angle of the emission area, and may be 60 degrees or more or in the range of 60 degrees to 120 degrees. Here, FIG. 20 (A) is a case where the interior angle C1 of the emission area of ​​the hole R0 is 60 degrees, (B) is 90 degrees, (C) is 120 degrees, and (D) is 150 degrees. Here, when the interior angle C1 of the emission area of ​​the hole R0 is changed, the position and length of the first face Ra are fixed and measured. A luminous intensity graph according to the interior angle of the hole R0 is provided as shown in FIG. 26. As shown in Table 1, when the interior angle C1 is 60 degrees to 120 degrees, the uniformity of light is 84% ​​or more, and when it is 150 degrees, it is about 80%.

[0024] [Table 1]

[0025] Therefore, the uniformity of the light emitted through the second and third surface portions Rb and Rc of the hole R0 can be improved by selecting the inner angle C1 of the emission region of the hole R0 from the range of 60 degrees to 120 degrees. In the first embodiment, the resin layer 220 includes a plurality of holes R0 adjacent to the first surface S1 and arranged along the first surface S1, and each of the plurality of holes R0 is disposed between each of the light emitting elements 100 and the first surface S1. As a result, the light emitted through the light emitting element 100 is diffused by the holes R0, so that the uniformity of the light emitted through the first surface S1 is improved. Also, hot spots are eliminated. Also, it is not necessary to form a convex lens to improve the light uniformity on the first surface S1. Also, the distance between the first surface S1 and the light emitting element 100 is reduced, so that the width of the module can be prevented from increasing. FIGS. 8 to 12 show examples of modified holes in the lighting module according to the first embodiment. For convenience of explanation, the modified hole will be described by selectively including the configuration of the first embodiment. Referring to FIG. 8, the hole R0 includes a first surface portion Ra, a second surface portion Rb, and a third surface portion Rc, and may include a fourth surface portion Rd facing the first surface portion Ra. The fourth surface portion Rd may be connected between the second surface portion Rb and the third surface portion Rc, and may have a length B3 that is smaller than the length B1 of the first surface portion Ra. The fourth surface portion Rd may have a shape in which the apex of FIG. 7 is removed. The fourth surface portion Rd may transmit light incident through the first surface portion Ra to a minimum extent. The first surface S1 facing the fourth surface portion Rd may have a convex pattern, but is not limited thereto. Referring to FIG. 9, the hole R0 includes a first surface portion Ra, a second surface portion Rb, and a third surface portion Rc, and the second surface portion Rb and the third surface portion Rc may include a concave-convex pattern Rr1. The uneven pattern Rr1 is provided in a triangular prism shape and can diffuse incident light. The uneven pattern Rr1 diffuses the incident light through various paths, and the uniformity of the light is further improved. Referring to FIG 10, the fourth surface Rd of the hole R0 may include a number of uneven patterns Rr2.The fourth surface Rd has a number of concave-convex patterns Rr2, so that hot spots caused by light emitted through the fourth surface Rd of the hole R0 are suppressed. Referring to FIG. 11, the hole R0 includes a first surface Ra, second and third surfaces Rb and Rc, and includes a recessed portion Re recessed toward the light emitting element in an area between the second surface Rb and the third surface Rc, and the recessed portion Re may face the light emitting element 100. A first vertex Rp1 is connected between the recessed portion Re and the second surface Rb, and a second vertex Rp2 is connected between the recessed portion Re and the third surface Rc. A depth B5 of the recessed portion Re may be 10% or more of the width B2 of the hole R0, for example, in a range of 10% to 50%. A low point of the recessed portion Re is disposed to be adjacent to the first surface Ra rather than the first and second vertices Rp1 and Rp2. The center of the recessed portion Re is disposed in the same region as the center of the light emitting device 100. The recessed portion Re can adjust the degree of diffusion of the incident light according to the depth B5, thereby suppressing a hot spot at the center of the light emitting device 100. Referring to FIG. 12, the hole R01 can include a first surface portion Ra1 that bulges toward the first surface S1 of the resin layer 220, and a curved second surface portion Rb1 that faces the first surface portion Ra1. The distance between the first surface portion Ra1 and the second surface portion Rb1 may be constant or may become wider toward the center of the hole R01. The outer surface Rk1 between the first surface portion Ra1 and the second surface portion Rb1 may be a horizontal surface or an inclined surface. The first surface portion Ra1 can refract the incident light, and the second surface portion Rb2 can refract the refracted light again. The hole RO1 can diffuse the incident light by the first surface portion Ra1 and the second surface portion Rb1.

[0026] FIG. 13 shows a modified example of the hole. The hole R02 may include a first hole portion R21 having a long length in one direction and a first hole portion R22 protruding from the first hole portion R21 toward the first surface S1 of the resin layer 220. The first hole portion R21 may include a first surface portion Ra2 facing the plurality of light emitting elements 100, and a second surface portion Rb2 opposite to the first surface portion Ra2 may be an emission surface. The second hole portion R22 includes an emission surface portion Rc having inclined third and fourth surface portions Rc1 and Rc2, and the third and fourth surface portions Rc1 and Rc2 may overlap with each of the light emitting elements 100 in the horizontal direction. The third and fourth surface portions Rc1 and Rc2 form a vertex in a region adjacent to the first surface S1, and the interior angle of the vertex may be 120 degrees or less, for example, in the range of 60 to 120 degrees. The second hole portion Rr2 can guide the incident light and diffuse it in a lateral direction.

[0027] 14 to 19 are examples of plan views showing holes of a lighting module according to Example 2. The configuration of the lighting module can be selectively applied to the configuration of Example 1, and only changed parts will be described.

[0028] 14 and 15, the resin layer 220 includes a plurality of holes R1 therein, each of which corresponds to the light emitting device 100. The plurality of holes R1 are disposed between the light emitting device 100 and a first surface S1 of the resin layer 220. The holes R1 may have a bar shape or a rectangular shape that is long in one direction. A length B1 of the holes R1 in the first direction is longer than a length L1 of the light emitting device 100 in the first direction. The holes R1 may be spaced apart from each other.

[0029] The length B1 of the hole R1 in the first direction may be 1 mm or more longer than the length L1 of the light emitting device 100 in the first direction. The width B2 of the hole R1 in the second direction may be 1 mm or more, for example, in the range of 1 mm to 3 mm. The distance D3 between the hole R1 and the light emitting device 100 may be closer than the distance D2 between the hole R1 and the first surface S1. The hole R1 may include a first surface R11 facing the light emitting device 100 and a second surface R12 facing the first surface S1. An outer surface Rs1 is disposed at both ends between the first and second surfaces R11 and R12, and the outer surface Rs1 extends perpendicularly to at least one or both of the first surface R11 and the second surface R12. As a result, the light incident on the hole R1 is diffused, and the diffused light is output as a line surface light.

[0030] As shown in FIG. 16, the holes R2 are arranged with a length that covers the plurality of light emitting devices 100. The holes R2 may have a bar shape or a rectangular shape. The length of the holes R2 in the first direction may be 80% or more of the maximum length of the resin layer 220 in the first direction. The length of the holes R2 in the first direction may be greater than the length of the outermost ends of the plurality of light emitting devices 100 connected together. Thus, the holes R2 are arranged between each of the light emitting devices 100 and the first surface S1, and are arranged to correspond to the regions between the light emitting devices 100. Thus, the holes R2 cover the emission side and the outer region of the light emitting device 100, and thus diffuse the incident light to prevent hot spots on the first surface S1. The holes R2 may be provided in a sine wave shape or may include a convex portion bulging toward the light emitting device 100 and / or a concave portion bulging toward the first surface S1. Such a bar-shaped hole R2 may reduce the linearity of the incident light.

[0031] As shown in FIG. 17, the resin layer 220 may include a first hole R1 adjacent to the light emitting device 100 and a second hole R2 adjacent to a first surface S1 of the resin layer 220, and at least one of the first hole R1 and the second hole R2 may be single or multiple. The multiple holes R1 and R2 may be arranged in at least two rows between the light emitting device 100 and the first surface S1 of the resin layer 220. The multiple first holes R1 may be arranged in a first direction and face each of the multiple light emitting devices 100. The first holes R1 are disposed between the light emitting device 100 and each of the second holes R2. The single second hole R2 is disposed in the first direction and is disposed between the first hole R1 and the first surface S1 of the resin layer 220. The length of the longer hole among the first and second holes R1 and R2 may be two or five times or more longer than the length of the shorter hole. The hole R2 having a longer length among the first and second holes R1 and R2 may be spaced apart from the third and fourth side surfaces S3 and S4. The distance D6 between the first and second holes R1 and R2 may be at least 1 mm and may be equal to or smaller than the distance D3 between the first hole R1 and the light emitting device 100. At least a portion of the first and second holes R1 and R2 are interconnected, which may be variable depending on the shape of a fixing pin. The length of the first hole R1 in the first direction X is the same or shorter than the length of the second hole R3. Conversely, the positions of the first hole R1 and the second hole R2 may be mutually interchangeable. The first and second holes R1 and R2 are arranged in a double structure and overlap the light emitting device 100 in the horizontal direction, thereby reducing hot spots in the center of the light emitting device.

[0032] As shown in FIG. 18, the resin layer 220 may include a first hole R1 adjacent to the light emitting device 100 and a second hole R3 adjacent to a first surface S1 of the resin layer 220. The first hole R1 and the second hole R3 may be a plurality of holes. The first holes R1 are arranged in a first direction X and face each light emitting device 100. The first hole R1 is disposed between the light emitting device 100 and each of the second holes R3. The second holes R3 are arranged in a first direction X and disposed between the first hole R1 and the first surface S1 of the resin layer 220. The lengths B11 and B1 of the first and second holes R1 and R3 in the first direction may be the same, or the length B11 of the second hole R3 may be shorter than the length B1 of the first hole R1. Alternatively, the positions of the first hole R1 and the second hole R3 may be mutually interchanged. The first and second holes R1 and R3 are arranged in a double structure and overlap the light emitting device 100 in the horizontal direction, thereby reducing hot spots in the center of the light emitting device.

[0033] As shown in FIG. 19, the holes R2a, R2b have a long length in the first direction, and the holes R2a, R2b may overlap in the second direction and include a region that does not overlap in the first direction. The holes R2a, R2b are arranged in parallel. The first hole R2a of the holes R2a, R2b adjacent to the light emitting element 100 may be parallel to a straight line connecting the light emitting element 100. The second hole R2b of the holes R2a, R2b adjacent to the first surface S1 may be parallel to the first surface S1. Each of the holes R2a, R2b may be spaced apart from the third and fourth side surfaces S3, S4. The holes R2a, R2b are arranged to be closer to the third and fourth side surfaces S3, S4 than the outermost light emitting element 100. This allows the light incident from the entire light emitting element 100 to be diffused.

[0034] As shown in FIG. 21, the lighting module 201 may be provided in a curved shape based on a horizontal straight line X0. When this is applied to a vehicle lamp, it may be combined into a curved lamp shape extending to the rear (or front) and sides of the vehicle. The lighting module 201 may have an angle C2 between the straight line X0 and a virtual straight line X2 connecting both ends of the first surface S1 in a range of 10 degrees to 60 degrees, and a virtual straight line X3 extended in a tangential direction from the first surface S1 disposed at one end of the lighting module 201 in a range of 5 degrees to 30 degrees. The virtual line connecting adjacent light emitting elements 100 in the lighting module 201 may include a straight line, a diagonal line, or a curved line. The virtual line connecting the plurality of holes R0 may include a straight line, a diagonal line, or a curved line. Here, a part of the line connecting the light emitting elements 100 is disposed to be adjacent to the first surface direction more than the virtual straight line connecting one end to the other end of the first surface S1 of the lighting module 201.

[0035] 22, the lighting module has a third reflecting member 245 disposed behind the resin layer or on the second side surface S2. The third reflecting member 245 may be made of a metal or non-metal material among the materials of the reflecting members disclosed above. The third reflecting member 245 extends from a side surface of the substrate 210 to a side surface of the first reflecting member 240, or is disposed on a side surface of the resin layer 220 at the side height of the resin layer 220. The third reflecting member 245 can re-reflect the light reflected by the hole R0 or the first surface S1.

[0036] 23(A) to 23(C) are diagrams showing a manufacturing process of a lighting module according to an embodiment. As shown in FIG. 23(A), the fixing pin 291 may penetrate through the resin layer 220 and contact the second reflective member 230 or the substrate 210. At this time, the fixing pin 291 is disposed before the resin layer 220 is formed, and is separated as shown in (B) after the resin layer 220 is dispensed and hardened. As another example, the fixing pin 291 may be positioned after the resin layer 220 is dispensed, and the fixing pin may be separated as shown in (B) when the resin layer 220 is hardened. As shown in FIG. 23(C), when a hole R0 is formed in the area where the fixing pin is removed, a first reflective member 240 is formed on the resin layer 220. The first reflective member 240 is disposed on the resin layer 220 and the hole R0. At least one hole R0 is disposed between the light emitting element 100 and the first surface S1.

[0037] FIG. 24 is a graph showing the luminous intensity distribution of the lighting module according to the first embodiment of the invention, and FIG. 25 is a graph showing the luminous intensity distribution of the lighting module according to the second embodiment. As shown in FIG. 24, the luminous intensity distribution by the triangular hole can provide a light uniformity of 80% or more, for example, 85% or more. As shown in FIG. 25, the luminous intensity distribution by the line-shaped or bar-shaped hole has a light uniformity of 50% or more. FIG. 26 is a diagram showing the luminous intensity distribution of each lighting module (A) to (D) of FIG. 20 when the interior angle C1 is 60 degrees, 90 degrees, 120 degrees, and 150 degrees. It can be seen that the range of the interior angle from 60 degrees to 120 degrees has a uniform distribution of about 85%, and when it is 150 degrees, it has a uniform distribution of about 80%.

[0038] FIG. 27 is an example of a module in which a light emitting device is disposed on a circuit board in a lighting module according to an embodiment of the invention, and FIG. 28 is a view of the module seen from the other side of FIG. 27. Referring to FIGS. 27 and 28, the light emitting device 100 includes a body 10 having a cavity 20, a plurality of lead frames 30, 40 in the cavity 20, and one or more light emitting chips 71 disposed on at least one of the plurality of lead frames 30, 40. Such a light emitting device 100 is an example of the light emitting device disclosed in the above embodiment, and may be embodied as a side-emitting package. The light emitting device 100 may have a length (or a length of a long side) in a first direction X that is three times or more, for example, four times or more, than a width in a second direction Y. The length in the second direction Y may be 2.5 mm or more, for example, in a range of 2.7 mm to 6 mm or in a range of 2.5 mm to 3.2 mm. The light emitting device 100 may have a long length in the first direction X, thereby reducing the number of the light emitting devices 100 in the first direction X. The light emitting device 100 may be provided with a relatively thin thickness, and thus the thickness of a lighting device having the light emitting device 100 may be reduced. The thickness of the light emitting device 100 may be 2 mm or less, for example, 1.5 mm or less, or in a range of 0.6 mm to 1 mm. The body 10 includes a cavity 20, and the length in the first direction X may be three times or more than the thickness of the body 10, and thus the directivity angle of light in the first direction X may be widened. At least one or more lead frames 30, 40 are disposed on the body 10. At least one or more lead frames 30, 40 are disposed on the bottom of the cavity 20. For example, a first lead frame 30 and a second lead frame 40 are coupled to the body 10. The body 10 may be made of an insulating material. The body 10 may be made of a reflective material. The body 10 may be made of a material having a reflectance higher than a transmittance with respect to a wavelength emitted from the light emitting chip, for example, a material having a reflectance of 70% or more. The body 10 can be defined as a non-transparent material or a reflective material if the reflectance is 70% or more.The body 10 may be made of a resin material such as a resin-based insulating material, for example, polyphthalamide (PPA). The body 10 may be made of a thermosetting resin or a highly heat-resistant and light-resistant material including a silicone-based, epoxy-based, or plastic material. The body 10 may include a resin material to which a reflective material, for example, a metal oxide, is added, and the metal oxide may include at least one of TiO2, SiO2, and Al2O3. Such a body 10 may effectively reflect incident light. As another example, the body 10 may be made of a translucent resin material or a resin material having a phosphor that converts the wavelength of incident light. The first side portion 15 of the body 10 may be a surface on which the cavity 20 is disposed, or may be a surface from which light is emitted. The second side portion of the body 10 may be an opposite side or a second side of the first side portion 15.

[0039] The first lead frame 30 includes a first lead portion 31 disposed at the bottom of the cavity 20, a first bonding portion 32 disposed at a first outer region of the third side portion 11 of the body 10, and a first heat dissipation portion 33 disposed on the third side portion 13 of the body 10. The first bonding portion 32 is bent from the first lead portion 31 within the body 10 to protrude to the third side portion 11, and the first heat dissipation portion 33 is bent from the first bonding portion 32. The first outer region of the third side portion 11 may be a region adjacent to the third side portion 13 of the body 10. The second lead frame 40 includes a second lead portion 41 disposed at the bottom of the cavity 20, a second bonding portion 42 disposed at a second outer region of the third side portion 11 of the body 10, and a second heat dissipation portion 43 disposed at a fourth side portion 14 of the body 10. The second bonding portion 42 is bent from the second lead portion 41 within the body 10, and the second heat dissipation portion 43 is bent from the second bonding portion 42. The second outer region of the third side portion 11 may be a region adjacent to the fourth side portion 14 of the body 10. A gap 17 between the first and second lead portions 31, 41 may be made of the material of the body 10 and may be flush with or protrude from the bottom of the cavity 20, but is not limited thereto. As another example, two or more lead frames may be disposed within the body 10, for example, three lead frames may be disposed, one of which may be a heat dissipation frame or a frame of positive polarity, and the other two may be mutually different negative polarities.

[0040] Here, the light emitting chip 71 is disposed on the first lead portion 31 of the first lead frame 30, for example, and connected to the first and second lead portions 31 and 41 by wires 72 and 73, or connected to the first lead portion 31 by an adhesive and connected to the second lead portion 41 by a wire. Such a light emitting chip 71 may be a horizontal chip, a vertical chip, or a chip having a via structure. The light emitting chip 71 may be mounted by a flip chip method. The light emitting chip 71 may selectively emit light within a wavelength range from ultraviolet to visible light. The light emitting chip 71 may emit light, for example, at an ultraviolet or blue peak wavelength. The light emitting chip 71 may include at least one of a II-VI compound and a III-V compound. The light emitting chip 71 may be made of a compound selected from the group consisting of, for example, GaN, AlGaN, InGaN, AlInGaN, GaP, AlN, GaAs, AlGaAs, InP, and mixtures thereof. A plurality of the light emitting chips 71 may be connected in series or in parallel. The light emitting chip 71 disposed in the cavity 20 of the light emitting device 100 according to the embodiment may be one or more. The light emitting chip 71 may be selected from, for example, a red LED chip, a blue LED chip, a green LED chip, and a yellow green LED chip.

[0041] Looking at the inner surface of the cavity 20, the inner surface arranged around the cavity 20 may be inclined with respect to a horizontal straight line of the upper surface of the lead frame 30, 40. The inner surface of the cavity 20 may have a stepped region that is stepped vertically from the first side portion 15 of the body 10. The stepped region is arranged to form a step between the first side portion 15 of the body 10 and the inner surface. The stepped region may control the directional characteristics of the light emitted through the cavity 20. A molding member 81 is arranged in the cavity 20 of the body 11, and the molding member 81 may be formed in a single layer or multiple layers including a translucent resin such as silicone or epoxy. The molding member 81 or the light emitting chip 71 may include a phosphor for changing the wavelength of the emitted light, and the phosphor excites a part of the light emitted from the light emitting chip 71 to emit it as light of a different wavelength. The phosphor may be formed by selecting from quantum dot, YAG, TAG, silicate, nitride, and oxy-nitride-based materials. The phosphor may include at least one of red phosphor, yellow phosphor, and green phosphor, but is not limited thereto. The surface of the molding member 81 may have a flat shape, a concave shape, a convex shape, etc., but is not limited thereto. As another example, a light-transmitting film having a phosphor is disposed on the cavity 20, but is not limited thereto. A lens is further formed on the upper part of the body 10, and the lens may include a concave and / or convex lens structure, and the light distribution of the light emitted from the light emitting device 100 may be adjusted.

[0042] Semiconductor elements such as a light receiving element and a protection element are mounted on the body 10 or any one of the lead frames. The protection element can be implemented as a thyristor, a Zener diode, or a TVS (Transient voltage suppression), and the Zener diode protects the light emitting chip from ESD (electro static discharge).

[0043] 28, at least one or a plurality of light emitting devices 100 are disposed on a support member 210, and a protective layer and / or a reflective member 260 is disposed around the lower portion of the light emitting device 100. The light emitting device 100 is an example of the light emitting device disclosed in the embodiment, and emits light in the direction of the central axis Y0, and is applicable to the lighting device disclosed above. The first and second lead portions 33 and 43 of the light emitting device 100 are bonded to the electrode patterns 213 and 215 of the substrate 210 by conductive adhesive members 217 and 219, which are solder or conductive tape.

[0044] The lighting module according to the embodiment of the invention can be applied to a lamp as shown in FIG. 29. The lamp can be applied to a head lamp, a side mirror lamp, a fog lamp, a tail lamp, a brake light, a daytime running light, a vehicle interior light, a door scarf, a rear combination lamp, or a backup lamp, as examples of vehicle lamps. Referring to FIG. 29, the lamp is formed by combining the lighting module 200 disclosed above with the inside of a housing 503 having an inner lens 502. The thickness of the lighting module 200 is such that it can be inserted into the inner width of the housing 503. The width Z3 of the emission part 515 of the inner lens 502 may be equal to or less than twice the thickness of the lighting module 200, thereby preventing a decrease in luminous intensity. The inner lens 502 can be spaced apart from the first surface of the lighting module 200 by a predetermined distance, for example, 10 mm or more. An outer lens 501 is disposed on the emission side of the inner lens 502. The lamp having such a lighting module 200 is only one example, and may be applied to other lamps having a flexible structure, for example, a curved surface or a curved structure when viewed from the side.

[0045] FIG. 30 is a plan view of a vehicle to which a vehicle lamp to which an illumination module according to the embodiment is applied is applied, and FIG. 31 is a view showing a vehicle lamp having an illumination module or illumination device disclosed in the embodiment. Referring to FIG. 30 and FIG. 31, in a vehicle 900, a tail lamp 800 may include a first lamp unit 812, a second lamp unit 814, a third lamp unit 816, and a housing 810. Here, the first lamp unit 812 may be a light source for functioning as a turn signal lamp, the second lamp unit 814 may be a light source for functioning as a width light, and the third lamp unit 816 may be a light source for functioning as a brake light, but is not limited thereto. At least one or all of the first to third lamp units 812, 814, and 816 may include the illumination device or module disclosed in the embodiment. The housing 810 may accommodate the first to third lamp units 812, 814, and 816 and may be made of a light-transmitting material. At this time, the housing 810 may have a bend according to the design of the vehicle body, and the first to third lamp units 812, 814, and 816 may realize a surface light source having a curved surface according to the shape of the housing 810. When the lamp unit is applied to a tail light, a brake light, or a turn signal lamp of a vehicle, such a vehicle lamp may be applied to a turn signal lamp of the vehicle.

Claims

1. A substrate; A plurality of light emitting elements disposed on the substrate; a resin layer disposed on the substrate; a first reflecting member disposed on the resin layer; the resin layer includes a first surface facing the emission surfaces of the light-emitting elements, and holes disposed between the first surface and the light-emitting elements; the hole penetrates the resin layer with the lower surface of the first reflecting member facing the substrate; The hole and the light-emitting element overlap in a light emission direction of the light-emitting element, the hole is disposed between an upper surface of the substrate and a lower surface of the first reflecting member; The hole includes a plurality of holes spaced apart from each other and facing the plurality of light emitting elements, a light emitting element configured to receive light from the light emitting elements and having a light emitting surface, the light emitting surface being disposed adjacent to the light emitting surface;

2. The lighting device according to claim 1 , wherein the virtual line connecting the plurality of holes is a straight line, a diagonal line or a curved line.

3. A substrate; A plurality of light emitting elements disposed on the substrate; a resin layer disposed on the substrate; a first reflecting member disposed on the resin layer; the resin layer includes a first surface facing the emission surfaces of the light-emitting elements, and holes disposed between the first surface and the light-emitting elements; the hole penetrates the resin layer with the lower surface of the first reflecting member facing the substrate; The hole and the light-emitting element overlap in a light emission direction of the light-emitting element, the hole is disposed between an upper surface of the substrate and a lower surface of the first reflecting member; The hole has a length longer than a length connecting both ends of the plurality of light emitting elements.

4. The illumination device according to claim 3 , wherein the hole comprises a bar shape parallel to the first surface.

5. The lighting device according to claim 1 , wherein the hole is disposed closer to the light emitting element than the first surface of the resin layer.

6. The lighting device according to claim 1 , wherein the holes are arranged in two rows between the light emitting element and the first surface of the resin layer, and a plurality of holes are arranged in any one of the two rows.

7. a second reflecting member disposed between the substrate and the resin layer; The lighting device according to claim 1 , wherein the hole is disposed between a lower surface of the first reflecting member and an upper surface of the second reflecting member.

8. The lighting device according to claim 1 , wherein the height of the hole is in the range of 50% to 100% of the thickness of the resin layer.

9. Each of the holes includes a first surface portion facing an emission surface of the light emitting element, and a second surface portion and a third surface portion that are spaced apart from both ends of the first surface portion toward the first surface of the resin layer at gradually narrowing distances, 3. The lighting device according to claim 1, wherein an interior angle formed between the second surface portion and the third surface portion is in a range of 60 degrees to 120 degrees.

10. The lighting device according to claim 1 , wherein the virtual line connecting the plurality of light-emitting elements includes a straight line, a diagonal line, or a curved line.

11. The lighting device according to claim 1 , wherein a first region that horizontally overlaps the light-emitting element on the first surface and a second region that horizontally overlaps a region between the light-emitting elements are arranged on the same plane.

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