Light-emitting unit and display device

Abstract

To provide a light-emitting unit which can manufacture a lens array with high yield even when the lens array is manufactured by resin molding, and a display device including the light-emitting unit.SOLUTION: In a light-emitting unit 400, a lens array 300 has lens parts 320 which are arranged at positions facing each of a plurality of light-emitting elements 100, and plate-like body parts 310 which are arranged at positions facing surfaces 200a of a circuit board 200. The plate-like body parts 310 and the plurality of lens parts 320 are integrally formed with each other. Inner surfaces 310a facing the surfaces 200a of the circuit board 200 of the plate-like body parts 310 are arranged at positions closer to the surfaces 200a of the circuit board 200 than a top part 100a farthest from the surface 200a of the circuit board 200 in a Z-axis direction parallel to a thickness direction of the circuit board 200, of each of the light-emitting elements 100.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a light-emitting unit and a display device. [Background technology]

[0002] As disclosed in Patent Document 1, a light-emitting unit is known that includes a circuit board on which a plurality of light-emitting elements are arranged on a surface, and a lens array that is disposed facing the circuit board.

[0003] The lens array has a lens portion disposed at a position facing each of the plurality of light-emitting elements, and a plate-shaped main body disposed at a position facing the surface of the circuit board. The inner surface of the lens array facing the circuit board and the light-emitting elements is formed flat. A gap is secured between the inner surface of the lens array and the light-emitting elements. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-006855 Summary of the Invention [Problem to be solved by the invention]

[0005] In the above lens array, the plate-like main body is thinner than the lens portions, and there is a large difference in thickness between the plate-like main body and the lens portions.

[0006] For this reason, when manufacturing a lens array by molding resin using a mold, weld lines and other molding defects may occur in the plate-shaped main body or in the connection between the plate-shaped main body and the lens portion, and such molding defects are a factor in reducing the yield of the lens array.

[0007] An object of the present disclosure is to provide a light-emitting unit that enables lens arrays to be manufactured with good yield even when the lens arrays are manufactured by resin molding, and a display device including the light-emitting unit. [Means for solving the problem]

[0008] The light-emitting unit according to the present disclosure comprises: A plurality of light emitting elements each emitting visible light; a circuit board on which a plurality of the light emitting devices are arranged; a lens array including a lens portion disposed at a position facing each of the plurality of light-emitting elements and a plate-shaped main body portion disposed at a position facing the surface of the circuit board, the plate-shaped main body portion and the plurality of lens portions being integrally formed; Equipped with The inner surface of the plate-shaped main body facing the surface of the circuit board is positioned closer to the surface of the circuit board than the top of each of the light-emitting elements that is farthest from the surface of the circuit board in the Z-axis direction parallel to the thickness direction of the circuit board. Effect of the Invention

[0009] According to the above configuration, the inner surface of the plate-shaped main body is located closer to the surface of the circuit board than the top of the light-emitting element, so the plate-shaped main body can be formed thicker than in the past. Therefore, even when the lens array is manufactured by molding resin, molding defects are unlikely to occur in the plate-shaped main body or in the connection between the plate-shaped main body and the lens portion during molding. Therefore, the lens array can be manufactured with a high yield. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a front view of a display screen of a display device according to a first embodiment; [Diagram 2] FIG. 1 is a partial cross-sectional view of a light-emitting unit according to a first embodiment. [Diagram 3] 1 is a cross-sectional view of a light-emitting device according to a first embodiment. [Figure 4]FIG. 11 is a partial cross-sectional view of a light-emitting unit according to a second embodiment. [Diagram 5] FIG. 5 is a partial cross-sectional view of a light-emitting unit according to a second embodiment, taken along a line perpendicular to the cross-section shown in FIG. [Figure 6] 5 is a partial cross-sectional view of a light-emitting unit according to a third embodiment, taken along a line perpendicular to the cross-section shown in FIG. 4. [Figure 7] FIG. 11 is a partial cross-sectional view of a light-emitting unit according to a fourth embodiment. [Figure 8] FIG. 11 is a partial cross-sectional view of a light-emitting unit according to a fifth embodiment. [Figure 9] FIG. 13 is a partial cross-sectional view of a light-emitting unit according to a sixth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment will be described with reference to the drawings, taking as an example a case where a light emitting unit displays an image. In the drawings, the same or corresponding parts are denoted by the same reference numerals.

[0012] [Embodiment 1] As shown in FIG. 1, a display device 500 according to this embodiment is configured by combining a plurality of light-emitting units 400 each of which displays an image.

[0013] The plurality of light-emitting units 400 are arranged vertically and horizontally in a matrix shape. As a result, the plurality of light-emitting units 400 as a whole constitute one display screen 510. In other words, each light-emitting unit 400 constitutes a part of the display screen 510.

[0014] To facilitate the following explanation, a right-handed XYZ Cartesian coordinate system is defined for the display device 500, in which the left-right direction when viewing the display screen 510 from the front is the X-axis direction, the up-down direction is the Y-axis direction, and the direction perpendicular to the X-axis and Y-axis directions is the Z-axis direction. The direction from left to right is the positive direction of the X-axis. Note that FIG. 1 is a front view of the display screen 510 as viewed from a line of sight parallel to the Z-axis.

[0015] In this embodiment, the X-axis is parallel to the rows of the matrix formed by the multiple light-emitting units 400. The Y-axis is parallel to the columns of the matrix. The Y-axis typically extends vertically in a site where the display device 500 is installed.

[0016] The following describes the configuration of each light-emitting unit 400. In Fig. 2, which will be referred to below, the above-mentioned XYZ orthogonal coordinate system is added to each light-emitting unit 400 when the light-emitting unit 400 constitutes the display device 500. The same applies to Figs. 3 to 9.

[0017] 2, the light-emitting unit 400 includes a plurality of light-emitting elements 100 each emitting visible light, a circuit board 200 having the plurality of light-emitting elements 100 arranged on a surface 200a thereof, and a lens array 300 disposed facing the surface 200a of the circuit board 200. Each light-emitting element 100 constitutes a pixel on the display screen 510 of FIG.

[0018] 3, each light emitting element 100 has a red LED (Light Emitting Diode) 110R that emits red light, a green LED 110G that emits green light, and a blue LED 110B that emits blue light. Each of the red LED 110R, the green LED 110G, and the blue LED 110B is a radiation source of visible light.

[0019] The light emitting element 100 also has a package member 120 that holds the red LED 110R, the green LED 110G, and the blue LED 110B. The package member 120 has a bottomed recess that has a depth in the thickness direction of the circuit board 200 shown in Fig. 2, i.e., in the Z-axis direction. The red LED 110R, the green LED 110G, and the blue LED 110B are arranged on the bottom surface of the recess.

[0020] The recess is filled with a transparent sealing member 140. The transparent sealing member 140 covers the red LED 110R, the green LED 110G, and the blue LED 110B. The transparent sealing member 140 is made of a resin that transmits visible light.

[0021] The light emitting element 100 also has a lead frame 130 exposed on the back surface of the package member 120 facing the circuit board 200 shown in Fig. 2. The lead frame 130 is electrically and mechanically connected to the circuit board 200 shown in Fig. 2, and supplies power required for light emission to each of the red LED 110R, the green LED 110G, and the blue LED 110B.

[0022] The light emitting element 100 has an emission surface 100a, which is an end surface located on the opposite side to the lead frame 130 in the Z-axis direction. The emission surface 100a according to this embodiment is formed of a transparent sealing member 140. However, the transparent sealing member 140 may be omitted. In that case, the emission surface 100a is defined as a virtual plane perpendicular to the Z-axis, which is defined at the position of the opening of the recess.

[0023] Returning to Fig. 2, the description will continue. The circuit board 200 holding the plurality of light emitting elements 100 described above has a front surface 200a on which the light emitting elements 100 are attached, a back surface 200b opposite to the front surface 200a in the Z-axis direction, and a side surface 200c connecting the front surface 200a and the back surface 200b.

[0024] The plurality of light-emitting elements 100 are arranged on the surface 200a of the circuit board 200. Specifically, the plurality of light-emitting elements 100 are distributed in a matrix on the surface 200a of the circuit board 200. The row direction of the matrix is ​​parallel to the X-axis direction, and the column direction is parallel to the Y-axis direction.

[0025] An electrode pad (not shown) is formed on the front surface 200a of the circuit board 200 for each light emitting element 100. The lead frame 130 of the light emitting element 100, shown in FIG. 3, is electrically and mechanically connected to the electrode pad.

[0026] On the other hand, a control circuit 210 and metal wiring (not shown) are provided on a rear surface 200b of the circuit board 200. The control circuit 210 is formed of an integrated circuit element.

[0027] The metal wiring and control circuit 210 on the rear surface 200b and the electrode pads on the front surface 200a are electrically connected through metal plating formed in via holes extending in the Z-axis direction.

[0028] In this manner, the control circuit 210 electrically connected to the light emitting element 100 controls the intensity ratio between the three primary color light components emitted by the red LED 110R, the green LED 110G, and the blue LED 110B shown in Fig. 3. This realizes the display of an image on the display screen 510 shown in Fig. 1.

[0029] Next, a description will be given of the lens array 300. The lens array 300 has lens portions 320 that are arranged at positions facing each of the multiple light emitting elements 100.

[0030] Since the multiple light emitting elements 100 are distributed in a matrix pattern within the XY plane, the multiple lens portions 320 are also distributed in a matrix pattern within the XY plane. Each lens portion 320 plays a role in adjusting the directivity of visible light emitted by the light emitting element 100 facing it.

[0031] The lens array 300 also has a plate-shaped main body 310 disposed at a position facing the front surface 200a of the circuit board 200. The plate-shaped main body 310 serves to hold a plurality of lens units 320.

[0032] The plate-shaped main body 310 and the lens portions 320 are transparent to visible light. The plate-shaped main body 310 and the lens portions 320 are integrally formed. Specifically, the plate-shaped main body 310 and the lens portions 320 are integrally formed by injection molding a resin having a higher refractive index than air using a mold. Examples of the resin include acrylic resin and polycarbonate.

[0033] The lens portion 320 has an inner surface 320a facing the emission surface 100a of the light emitting element 100, and an outer surface 320b opposite to the inner surface 320a in the thickness direction of the lens portion 320.

[0034] Outer surface 320b of lens portion 320 has a shape that protrudes in the positive Z-axis direction more than plate-shaped main body portion 310. Here, the positive Z-axis direction refers to the direction from circuit board 200 toward lens portion 320 in the Z-axis direction. In other words, outer surface 320b of lens portion 320 forms a convex lens that protrudes in the positive Z-axis direction.

[0035] Meanwhile, an inner surface 320a of the lens portion 320 defines an accommodating recess 340 recessed in the positive direction of the Z axis so as to cover the light emitting element 100. A gap is provided between the inner surface 320a of the lens portion 320 and the radiation surface 100a of the light emitting element 100.

[0036] The plate-shaped main body 310 has an inner surface 310a that faces the surface 200a of the circuit board 200. A gap is secured between the inner surface 310a of the plate-shaped main body 310 and the surface 200a of the circuit board 200.

[0037] Furthermore, the plate-shaped main body 310 has an outer surface 310b opposite to the inner surface 310a in the thickness direction of the plate-shaped main body 310. The inner surface 310a and the outer surface 310b of the plate-shaped main body 310 are formed flat and parallel to the XY plane.

[0038] Furthermore, the plate-shaped main body 310 has an inner wall surface 310c that faces the side surface of the light-emitting element 100. The inner wall surface 310c connects the inner surface 320a of the lens portion 320 and the inner surface 310a of the plate-shaped main body 310.

[0039] The above-mentioned accommodating recess 340 is defined by an inner wall surface 310c of the plate-shaped main body portion 310 and an inner surface 320a of the lens portion 320. A gap is secured between the light-emitting element disposed in the accommodating recess 340 and the inner wall surface 310c and the inner surface 320a defining the accommodating recess 340.

[0040] As described above, in this embodiment, the lens array 300 has, for each light emitting element 100, the accommodating recess 340 that covers the light emitting element 100.

[0041] This realizes a configuration in which the inner surface 310a of the plate-shaped main body 310 is disposed at a position closer to the surface 200a of the circuit board 200 than the radiation surface 100a of each light-emitting element 100. In other words, the distance in the Z-axis direction between the inner surface 310a of the plate-shaped main body 310 and the surface 200a of the circuit board 200 is smaller than the distance between the radiation surface 100a of the light-emitting element 100 and the surface 200a of the circuit board 200, i.e., the total height of the light-emitting element 100 in the Z-axis direction.

[0042] The emission surface 100a of the light-emitting element 100 is an example of the top portion of the light-emitting element 100 that is farthest from the surface 200a of the circuit board 200 in the Z-axis direction.

[0043] Conventionally, the entire inner surface of the lens array facing the circuit board 200 and the light emitting element 100 is formed flat and parallel to the XY plane. For this reason, conventionally, the entire inner surface of the lens array needs to be disposed in a position in the positive direction of the Z axis from the radiation surface 100a of the light emitting element 100.

[0044] In contrast to this, in this embodiment, the inner surface 310a of the plate-shaped main body 310 is disposed at a position closer to the surface 200a of the circuit board 200 than the radiation surface 100a of the light-emitting element 100. Therefore, according to this embodiment, the plate-shaped main body 310 can be formed thicker than in the past.

[0045] Therefore, even when the lens array 300 is manufactured as a single unit by injection molding of resin, the resin can be smoothly spread during molding to the plate-shaped main body 310 or to the portion that will become the connection portion 330 between the plate-shaped main body 310 and the lens portion 320. Therefore, molding defects are unlikely to occur, and the lens array 300 can be manufactured with a good yield.

[0046] Furthermore, in this embodiment, in each lens portion 320, the area where the convex outer surface 320b is projected onto the surface 200a of the circuit board 200 (hereinafter referred to as the outer surface projection area) includes the area where the concave inner surface 320a is projected onto the surface 200a of the circuit board 200 (hereinafter referred to as the inner surface projection area), and the outer surface projection area is wider than the inner surface projection area.

[0047] As a result, connection portion 330 is less likely to become narrower than when the outer surface projection area and the inner surface projection area are the same. By adopting a configuration in which the outer surface projection area is wider than the inner surface projection area, it is possible to allow resin to pass smoothly through the portion that will become connection portion 330. In other words, a configuration in which the outer surface projection area is wider than the inner surface projection area also contributes to suppressing molding defects in connection portion 330.

[0048] Moreover, according to this embodiment, the lens array 300 covers each of the light-emitting elements 100 with each of the light-emitting elements 100 disposed in the accommodating recess 340. As a result, each of the light-emitting elements 100 is surrounded not only by the inner surface 320a of the lens portion 320 but also by the inner wall surface 310c of the plate-shaped main body portion 310.

[0049] Therefore, even if the light emitted by the light emitting element 100 has a component that travels at a right angle or a nearly right angle to the optical axis of the light emitting element 100 (hereinafter referred to as an in-plane component), at least a part of the in-plane component can be directed toward the lens portion 320 after being reflected by the inner wall surface 310c. This contributes to an increase in the amount of light emitted from each lens portion 320.

[0050] Here, the optical axis of the light-emitting element 100 refers to an imaginary line parallel to the normal of the circuit board 200 at the location where the light-emitting element 100 is provided, i.e., parallel to the Z-axis, and refers to an imaginary line passing through the center of the radiation surface 100a of the light-emitting element 100 when viewed from a line of sight parallel to the Z-axis direction.

[0051] [Embodiment 2] In the configuration of the above-mentioned first embodiment, a component for increasing the strength may be added to the lens array 300. A specific example thereof will be described below.

[0052] 4, the lens array 300 has a sidewall 350 facing the side surface 200c of the circuit board 200. The sidewall 350 extends from the plate-shaped main body 310 in the negative Z-axis direction. Here, the negative Z-axis direction refers to the direction opposite to the positive Z-axis direction in the Z-axis direction. The sidewall 350 is formed integrally with the plate-shaped main body 310.

[0053] The circuit board 200 is formed in a quadrangle when viewed from a line of sight parallel to the Z axis, and has four side surfaces 200c. Each of the four side surfaces 200c faces a side wall portion 350. In other words, the lens array 300 also has four side walls 350 corresponding to the circuit board 200 having four side surfaces 200c.

[0054] The side wall portion 350 itself is also shown in Fig. 2. As shown in Fig. 4, the lens array 300 according to this embodiment further has a plurality of protrusions 360 protruding from each of the side wall portions 350.

[0055] Each of the protrusions 360 protrudes inward from an inner surface 350a of the side wall portion 350 that faces the side surface 200c of the circuit board 200. Here, "inward" refers to a direction approaching the circuit board 200 from the side wall portion 350 with respect to an in-plane direction parallel to the front surface 200a of the circuit board 200.

[0056] Each of the protrusions 360 extends in the Z-axis direction. An end of each of the protrusions 360 in the positive direction of the Z-axis is connected to the plate-shaped main body 310. In other words, each of the protrusions 360 is connected not only to the side wall 350 but also to the plate-shaped main body 310.

[0057] As a result, each of the protrusions 360 functions as a rib that reinforces the lens array 300. Each of the protrusions 360 is formed integrally with the side wall portion 350 and the plate-shaped main body portion 310.

[0058] Fig. 5 is a partial cross-sectional view of the lens array 300 as viewed in the Z-axis direction. Fig. 5 shows a cross-section taken along line VV in Fig. 4. Note that Fig. 4 shows a cross-section taken along line IV-IV in Fig. 5.

[0059] 5, in the side wall portion 350 extending in the Y-axis direction, a plurality of protruding portions 360 each protruding in the X-axis direction are lined up in the Y-axis direction. In the side wall portion 350 extending in the X-axis direction, a plurality of protruding portions 360 each protruding in the Y-axis direction are lined up in the X-axis direction.

[0060] Further, a cutout portion 220 into which the protrusion 360 fits is formed for each protrusion 360 on the edge of the circuit board 200. During manufacture, the lens array 300 is brought closer to the circuit board 200 in the negative Z-axis direction under the condition that each protrusion 360 fits into the cutout portion 220, whereby the lens array 300 is placed over the circuit board 200.

[0061] Hereinafter, among the plurality of light-emitting elements 100 arranged in a matrix on the circuit board 200, the plurality of light-emitting elements 100 arranged at positions facing the side wall portion 350 will be referred to as the "outermost peripheral light-emitting elements 100_O." In other words, the light-emitting elements 100 constituting the outermost rows and columns in the matrix are the outermost peripheral light-emitting elements 100_O. Note that in FIG. 5, the outermost peripheral light-emitting elements 100_O are illustrated with shading for ease of understanding.

[0062] In this embodiment, all of the outermost light emitting elements 100_O also face the protrusions 360.

[0063] Specifically, each of the outermost light emitting elements 100_O aligned in the X-axis direction faces the protruding portion 360 in the X-axis direction. Each of the outermost light emitting elements 100_O aligned in the Y-axis direction faces the protruding portion 360 in the Y-axis direction. In other words, the light emitting unit 400 according to this embodiment has a configuration in which the outermost light emitting elements 100_O and the protruding portions 360 are alternately aligned in the X-axis direction and the Y-axis direction.

[0064] In addition, the outermost light-emitting elements 100_O located at the four corners of the circuit board 200 face the protrusions 360 protruding in the X-axis direction in the Y-axis direction, and also face the protrusions 360 protruding in the Y-axis direction in the X-axis direction.

[0065] As described above, according to this embodiment, the protrusions 360 are provided on the lens array 300. Therefore, the strength of the lens array 300 can be increased compared to a case where the protrusions 360 are not provided.

[0066] Further, the circuit board 200 is formed with cutouts 220 into which the respective protrusions 360 fit. Therefore, even though the respective protrusions 360 protrude inward from the side wall 350, an increase in the occupation area of ​​the lens array 300 covering the circuit board 200 in an in-plane direction parallel to the front surface 200a of the circuit board 200 (hereinafter referred to as in-plane size) is suppressed.

[0067] Specifically, in this embodiment, the amount of inward protrusion of each protrusion 360 is equal to or less than the notch depth, which is the dimension of the notch 220 into which the protrusion 360 fits, in the protruding direction of the protrusion 360. Therefore, even though the lens array 300 is provided with the protrusions 360, the in-plane size of the lens array 300 does not need to be increased.

[0068] [Embodiment 3] A modification of the configuration shown in FIG. 5 will be described below as a third embodiment.

[0069] As shown in FIG. 6, in this embodiment, the entirety of each of the multiple cutout portions 220 is positioned outward, closer to the side wall portion 350 in an in-plane direction parallel to the surface 200a of the circuit board 200, than the multiple outermost light-emitting elements 100_O.

[0070] According to this embodiment, none of the outermost light emitting elements 100_O faces the protruding portion 360. That is, in the configuration shown in FIG. 5, among all the light emitting elements 100, only the outermost light emitting elements 100_O faces the protruding portion 360, but in this embodiment, none of the light emitting elements 100 faces the protruding portion 360.

[0071] Therefore, compared to the configuration shown in Figure 5, the uniformity of the amount of light emitted by the light-emitting unit 400 in an in-plane direction parallel to the surface 200a of the circuit board 200 (hereinafter simply referred to as the in-plane direction) is improved, and the uniformity of the image quality of the image displayed by the light-emitting unit 400 in the in-plane direction is improved.

[0072] Furthermore, according to this embodiment, the positions of the pairs of the notches 220 and the protrusions 360 that fit into the notches 220 are not restricted by the position of the outermost light emitting element 100_O. Therefore, as an example, the arrangement pitch of the pairs in the X-axis direction can be made different from the arrangement pitch of the outermost light emitting elements 100_O in the X-axis direction. The same applies to the Y-axis direction.

[0073] [Embodiment 4] 2 and 4 show an example of a configuration in which the light emitting element 100 is directly mounted on the surface 200a of the circuit board 200. The light emitting element 100 may be indirectly mounted on the surface 200a of the circuit board 200 via a base member. A specific example of this will be described below.

[0074] 7, the circuit board 200 according to this embodiment has a protruding portion 230 protruding from the surface 200a for each light emitting element 100. Each light emitting element 100 is placed on the protruding portion 230.

[0075] It should be noted that the raised portion 230 according to this embodiment is formed integrally with the main body portion of the circuit board 200 that defines the surface 200a.

[0076] The mounting surface of the raised portion 230 on which the light emitting element 100 is attached is formed flat and parallel to the XY plane. The side surface of the raised portion 230 connecting the mounting surface to the surface 200a may have any of a tapered shape that widens toward the surface 200a, a reverse tapered shape that narrows toward the surface 200a, and a right-angled shape that is perpendicular to the surface 200a.

[0077] According to this embodiment, the raised portion 230 brings the light emitting element 100 closer to the lens portion 320. Therefore, compared to a case where the raised portion 230 does not exist, the thickness of the plate-shaped main body portion 310 can be increased without increasing the distance in the Z-axis direction between the emission surface 100a of the light emitting element 100 and the inner surface 320a of the lens portion 320.

[0078] Since the thickness of the plate-shaped main body 310 can be made thicker than in the first embodiment, the probability of molding defects occurring in the plate-shaped main body 310 can be further reduced when the lens array 300 is manufactured by molding resin. Since the emission surface 100a of the light-emitting element 100 can be brought close to the inner surface 320a of the lens portion 320, almost all of the light emitted by the light-emitting element 100 can be made incident on the lens portion 320.

[0079] [Embodiment 5] A modification of the above-mentioned fourth embodiment will be described below as a fifth embodiment.

[0080] 8, the raised portion 240 according to this embodiment is formed by a member separate from the main body portion that defines the surface 200a of the circuit board 200. The circuit board 200 is obtained by attaching the raised portion 240 to the surface 200a of the main body portion. The other configurations and effects are the same as those of the fourth embodiment.

[0081] [Embodiment 6] In the configurations according to the above-described embodiments 1 to 5, the plate-shaped main body 310 of the lens array 300 may incorporate a component for increasing its strength. Specific examples thereof will be described below.

[0082] As shown in FIG. 9, a plate-shaped main body 310 of a lens array 300 according to this embodiment has a structure in which a reinforcing member 312 for supplementing the strength of a reinforced member 311 is embedded in the reinforced member 311 .

[0083] The reinforced member 311 is formed integrally with the lens portion 320 using the same resin as that forming the lens portion 320 .

[0084] The reinforcing member 312 is made of stainless steel or other metals. However, the material of the reinforcing member 312 is not limited to metal as long as it is stronger than the reinforced member 311, and may be resin.

[0085] When the lens array 300 is injection molded, the reinforcing member 312 is placed in advance at a location of the mold where the reinforced member 311 is to be formed. By injecting resin into the mold in this state, a structure in which the reinforcing member 312 is embedded in the reinforced member 311 can be formed.

[0086] According to this embodiment, since the plate-shaped main body 310 has a structure in which the reinforcing member 312 is embedded in the reinforced member 311, it is possible to realize a lens array 300 having excellent strength.

[0087] The above describes the first to sixth embodiments. Two or more of the configurations selected from the first to sixth embodiments may be combined. The following modifications are also possible.

[0088] In the above-mentioned embodiments 1-6, the light-emitting unit 400 has been described as an example for displaying an image. The light-emitting unit 400 may also function as an illumination unit. A planar illumination light can be formed by arranging a plurality of light-emitting elements, each of which serves as a point light source, in a two-dimensional manner on a circuit board. The color temperature, illuminance, and other physical quantities of the illumination light may be variably controlled by the control circuit 210.

[0089] 3 illustrates a light-emitting element 100 having three types of LEDs. This light-emitting element 100 can also be used when the light-emitting unit 400 functions as an illumination unit. In either case, when the light-emitting unit 400 displays an image or when the light-emitting unit 400 functions as an illumination unit, the light-emitting element 100 may have only one type of LED, or may use, in addition to an LED, an LD (Laser Diode), an organic EL (Electro-Luminescence), or the like, as a radiation source of visible light constituting the light-emitting element 100.

[0090] The pair of cutout portion 220 and protrusion portion 360 fitted into the cutout portion 220 shown in Figures 5 and 6 may be configured on all four side surfaces 200c of the rectangular circuit board 200, or may be configured on only three, two, or one of the side surfaces 200c.

[0091] In the configuration shown in Figure 5, all of the multiple outermost light-emitting elements 100_O may face the protrusion 360, or only some of the multiple outermost light-emitting elements 100_O may face the protrusion 360.

[0092] 2 illustrates a convex lens portion 320 in which outer surface 320b is raised in the positive direction of the Z axis from outer surface 310b of plate-shaped main body portion 310. Outer surface 320b of lens portion 320 may have a flat shape located in the same plane as outer surface 310b of plate-shaped main body portion 310, or may have a concave shape recessed in the negative direction of the Z axis from outer surface 310b of plate-shaped main body portion 310.

[0093] Various aspects of the present disclosure are described below.

[0094] (Appendix 1) A plurality of light emitting elements each emitting visible light; a circuit board on which a plurality of the light emitting devices are arranged; a lens array including a lens portion disposed at a position facing each of the plurality of light-emitting elements and a plate-shaped main body portion disposed at a position facing the surface of the circuit board, the plate-shaped main body portion and the plurality of lens portions being integrally formed; Equipped with The inner surface of the plate-shaped main body facing the surface of the circuit board is disposed at a position closer to the surface of the circuit board than the top of each of the light-emitting elements that is farthest from the surface of the circuit board in a Z-axis direction parallel to the thickness direction of the circuit board. Light emitting unit. (Appendix 2) the circuit board has a back surface opposite to the front surface in the Z-axis direction, and a side surface connecting the back surface and the front surface, the lens array further includes a side wall portion facing the side surface of the circuit board, and a plurality of protrusions protruding from an inner surface of the side wall portion facing the side surface of the circuit board, The circuit board is provided with a cutout portion for each of the protrusions, into which the protrusions fit. 2. The light-emitting unit according to claim 1. (Appendix 3) Each of the plurality of cutout portions is disposed outwardly, in its entirety, closer to the side wall portion in an in-plane direction parallel to the surface of the circuit board than a plurality of outermost peripheral light-emitting elements, which are disposed at positions facing the side wall portion, among the plurality of light-emitting elements. Attachment 2, a light-emitting unit. (Appendix 4) At least one of a plurality of outermost peripheral light emitting elements arranged at a position facing the side wall portion among the plurality of light emitting elements also faces the protrusion portion. Attachment 2, a light-emitting unit. (Appendix 5) the circuit board has a protruding portion protruding from the surface for each of the light emitting elements, Each of the light emitting elements rests on the raised portion. 5. The light-emitting unit according to any one of claims 1 to 4. (Appendix 6) The plate-shaped main body portion is A structure in which a reinforcing member that supplements the strength of a reinforced member is embedded in the reinforced member; The light-emitting unit according to any one of claims 1 to 5, (Appendix 7) A light-emitting device comprising a plurality of light-emitting units according to any one of claims 1 to 6; A display screen for displaying an image is formed by a plurality of the light emitting units. Display device. [Explanation of symbols]

[0095] 100 Light emitting element, 100_O Outermost periphery light emitting element (light emitting element), 100a Radiation surface (top), 110R Red LED, 110G Green LED, 110B Blue LED, 120 Package member, 130 Lead frame, 140 Transparent sealing member, 200 Circuit board, 200a Surface, 200b Back side, 200c Side, 210 Control circuit, 220 Notch, 230, 240 Raised portion, 300 Lens array, 310 Plate-shaped main body, 310a Inner surface, 310b Outer surface, 310c Inner wall surface, 311 Reinforced member, 312 Reinforcing member, 320 Lens portion, 320a Inner surface, 320b Outer surface, 330 Connection portion, 340 Storage recess, 350 Side wall, 350a Inner surface, 360 Protrusion, 400 light emitting unit, 500 display device, 510 display screen.

Claims

1. A plurality of light emitting elements each emitting visible light; a circuit board on which a plurality of the light emitting devices are arranged; a lens array including a lens portion disposed at a position facing each of the plurality of light-emitting elements and a plate-shaped main body portion disposed at a position facing the surface of the circuit board, the plate-shaped main body portion and the plurality of lens portions being integrally formed; Equipped with The inner surface of the plate-shaped main body facing the surface of the circuit board is disposed at a position closer to the surface of the circuit board than the top of each of the light-emitting elements that is farthest from the surface of the circuit board in a Z-axis direction parallel to the thickness direction of the circuit board. Light emitting unit.

2. the circuit board has a back surface opposite to the front surface in the Z-axis direction, and a side surface connecting the back surface and the front surface, the lens array further includes a side wall portion facing the side surface of the circuit board, and a plurality of protrusions protruding from an inner surface of the side wall portion facing the side surface of the circuit board, The circuit board is provided with a cutout portion for each of the protrusions, into which the protrusions fit. The light-emitting unit according to claim 1 .

3. Each of the plurality of cutout portions is disposed outwardly, in an in-plane direction parallel to the surface of the circuit board, closer to the side wall portion than a plurality of outermost peripheral light-emitting elements, which are disposed at positions facing the side wall portion, among the plurality of light-emitting elements. The light-emitting unit according to claim 2 .

4. At least one of a plurality of outermost peripheral light emitting elements arranged at a position facing the side wall portion among the plurality of light emitting elements also faces the protrusion portion. The light-emitting unit according to claim 2 .

5. the circuit board has a protruding portion protruding from the surface for each of the light emitting elements, Each of the light emitting elements rests on the raised portion. The light-emitting unit according to claim 1 .

6. The plate-shaped main body portion is A structure in which a reinforcing member that supplements the strength of a reinforced member is embedded in the reinforced member; The light-emitting unit according to claim 1 , wherein

7. A light-emitting device comprising a plurality of light-emitting units according to any one of claims 1 to 4, A display screen for displaying an image is formed by a plurality of the light emitting units. Display device.

Images