Light-emitting device

Abstract

To provide an air-tight light-emitting device.SOLUTION: A case 40 covering a substrate 10 and a light source 20 has a resin filling part 50. The resin filling part 50 has a first passage hole 51 for passing a coated member 72 and a second passage hole 52 for passing a core wire 71. A second seal material 60 is filled in the resin filling part 50 to block the gaps between the coated member 72 and the first passage hole 51 and between the core wire 71 and the second passage hole 52.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a light emitting device having a light source such as a light emitting element. [Background technology]

[0002] There are various known light-emitting devices that use cases or the like to improve the sealing performance of light-emitting diodes (LEDs) that emit visible light. Patent Document 1 discloses a light-emitting device in which lead wires are arranged between elastic sealants, and a cover case member and a base case member sandwich the sealants, thereby making the device waterproof and dustproof. Patent Document 2 discloses a light-emitting device in which lead wires are connected to the rear surface of a circuit board, and silicone rubber is filled in between the rear surface of the circuit board and inside the housing, making the device waterproof and sealed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2011-124327 A (Fig. 3) [Patent Document 2] International Publication WO2008 / 117334 (Figure 3) Summary of the Invention [Problem to be solved by the invention]

[0004] In the light-emitting device described in Patent Document 1, the elastic sealant sandwiches the lead wires and is sandwiched between the cover case member and the base case member. If the cover case member and the base case member are misaligned during the manufacture of the light-emitting device, the sealant will not be sandwiched properly, causing gaps between the sealant and either the lead wires, the cover case member, or the base case member, which may reduce the airtightness.

[0005] Furthermore, in the light emitting device described in Patent Document 1, the substrate on which the light emitting element is mounted has a structure in which it is held by lead wires connected to the surface of the substrate by solder or the like. Although it is unclear whether the lead wires are covered, when the light emitting element emits ultraviolet light, the covering member arranged on the light emitting element side of the sealing member may fall off due to deterioration caused by ultraviolet light, which may lead to a decrease in the light emitting efficiency of the light emitting element or lighting failure due to the adhesion of the fallen covering member inside the light emitting device.

[0006] In addition, in the light emitting device described in Patent Document 2, silicone rubber is filled from the through hole into which the lead wire is inserted on the side of the housing. When filling with silicone rubber, the lead wire blocks the through hole, so the silicone rubber is likely to adhere to the lead wire, which makes the work difficult. In order to improve the workability, it is possible to increase the diameter of the through hole, but if the silicone rubber overflows from the through hole after being sufficiently filled with silicone rubber, it may adhere to surrounding parts and cause problems.

[0007] Furthermore, the light emitting device described in Patent Document 2 uses a double-sided board in which LEDs are mounted on the front side of the board and lead wires are connected to the back side, resulting in higher material costs than when a single-sided board is used.

[0008] The present invention is devised to solve such problems, and aims to provide a light-emitting device that is hermetically sealed by a case that holds a resin-filled portion that partially covers the substrate and lead wires and is arranged to surround the light-emitting element, while suppressing deterioration of the coating material of the lead wires. [Means for solving the problem]

[0009] The light emitting device of the present invention has a substrate, a light source arranged on the substrate, a case covering the substrate and the light source, a resin filling section arranged in the case and surrounded by a side wall that penetrates from the top surface of the case to the top surface of the substrate, a first through hole arranged in the side wall, a second through hole arranged in the side wall opposite the light source and the first through hole, a conductive core wire connected to the substrate, and an insulating covering member covering the core wire, one side end of the covering member being arranged in the resin filling section.

[0010] Furthermore, in the light emitting device according to the present invention, it is preferable that a second sealant is filled in the resin filling portion, and one side end of the covering member is covered with the second sealant.

[0011] Furthermore, in the light emitting device according to the present invention, it is preferable that the first through hole has a core wire and a covering member disposed therein, and the second through hole has the core wire disposed therein but no covering member disposed therein.

[0012] Furthermore, in the light emitting device of the present invention, it is preferable that the first through hole and the second through hole are arranged in a straight line when viewed in a plane, the first through hole is positioned so as to be spaced away from the upper surface of the substrate, the second through hole is positioned so as to be in contact with the upper surface of the substrate, and the covering member and the core wire are supported from the lower wall of the first through hole and the upper wall of the second through hole and are held in an inclined shape between the first through hole and the second through hole.

[0013] Furthermore, in the light emitting device according to the present invention, the light source preferably emits ultraviolet light.

[0014] Furthermore, the light emitting device according to the present invention preferably further comprises an optical element for controlling the light emitted from the light source, and the optical element is preferably disposed on the upper surface of the case. Effect of the Invention

[0015] The light-emitting device of the present invention can be a hermetically sealed light-emitting device having a substrate, a light source, a case, a resin-filled portion, two or more passage holes, a core wire, and a covering member, with one side end of the covering member being disposed within the resin-filled portion. [Brief description of the drawings]

[0016] [Figure 1] 1 is a perspective view of a light emitting device according to a first embodiment. [Diagram 2] FIG. 2 is an exploded perspective view of the light emitting device shown in FIG. [Diagram 3] 2 is a perspective view of the light emitting device shown in FIG. 1 with optical elements removed. [Figure 4] 2 is a bottom view of the case of the light emitting device shown in FIG. [Diagram 5] FIG. 13 is a bottom view of a case of a light emitting device according to a modified example. [Figure 6] FIG. 4 is a cross-sectional view taken along the line AA shown in FIG. [Figure 7] 4 is a flowchart showing a method for manufacturing the light emitting device according to the first embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Hereinafter, a light emitting device according to the present invention will be described with reference to the drawings. However, it should be noted that the technical scope of the present invention is not limited to the embodiments, but extends to the inventions described in the claims and their equivalents.

[0018] (Configuration and Function of the Light Emitting Device According to the First Embodiment) Fig. 1 is a perspective view of the light emitting device according to the first embodiment, Fig. 2 is an exploded perspective view of the light emitting device shown in Fig. 1, Fig. 3 is a perspective view of the light emitting device shown in Fig. 1 with optical elements removed, Fig. 4 is a bottom view of a case of the light emitting device shown in Fig. 1, Fig. 5 is a bottom view of a case of a light emitting device according to a modified example, and Fig. 6 is a cross-sectional view taken along line AA shown in Fig. 3.

[0019] 2 and 6, the light emitting device of this embodiment includes a substrate 10, a first wiring pattern 11, a second wiring pattern 12, a first electrode 13, a second electrode 14, a light source 20, a first sealant 30, a case 40, a second sealant 60, a lead wire 70, and an optical element 80. The light emitting device 1 emits light in response to a voltage being applied between the first electrode 13 and the second electrode 14 via the lead wire 70.

[0020] As shown in FIG. 2, the substrate 10 is a single-sided wiring board having a rectangular planar shape and made of a material having high thermal conductivity, such as a metal such as copper or aluminum, or a ceramic such as aluminum nitride or alumina. When high heat dissipation is not required, the substrate 10 may be a printed circuit board made of an insulating resin such as glass epoxy, BT resin, or polyimide. A first wiring pattern 11, a second wiring pattern 12, a first electrode 13, and a second electrode 14 are arranged on the front surface of the substrate 10. A material having high thermal conductivity is exposed on the rear surface of the substrate 10, and by directly connecting the material to a heat dissipation means such as a heat sink, high heat dissipation can be obtained, and the heat generated by the light source 20 can be efficiently dissipated.

[0021] The first wiring pattern 11, the second wiring pattern 12, the first electrode 13, and the second electrode 14 have a rectangular planar shape, are formed of a conductive material such as copper, and are arranged spaced apart from each other on the surface of the substrate 10. The surfaces of the first wiring pattern 11, the second wiring pattern 12, the first electrode 13, and the second electrode 14 may be protected by gold plating or the like. The first wiring pattern 11 and the first electrode 13 are connected by wiring (not shown), and the second wiring pattern 12 and the second electrode 14 are connected by wiring (not shown).

[0022] As shown in FIG. 2, the light source 20 is an LED die having a rectangular planar shape, and emits ultraviolet light, visible light, and infrared light. In one example, the ultraviolet light has a wavelength of 280 nm or less. Although not shown, the light source 20 has an anode terminal and a cathode terminal on the back surface. The anode terminal is mounted on the first wiring pattern 11, and the cathode terminal is mounted on the second wiring pattern 12, respectively, by a conductive adhesive material or solder. When the light source 20 has an anode terminal on the front surface and a cathode terminal on the back surface, the anode terminal of the light source 20 may be electrically connected to the first wiring pattern 11 by a conductive material such as a gold wire. The light source 20 is also referred to as a light-emitting element. In addition, the light-emitting element may be mounted on an insulating material such as aluminum nitride, for example.

[0023] 2, the first sealant 30 is a thin-film adhesive material made of a resin such as epoxy or silicone. The first sealant 30 has a rectangular opening near the center so as not to cover the first wiring pattern 11, the second wiring pattern 12, the first electrode 13, and the second electrode 14. The outer periphery of the first sealant 30 is disposed so as to match the outer periphery of the surface of the substrate 10, and the substrate 10 and the case 40 are tightly attached and fixed together.

[0024] As shown in Fig. 3 and Fig. 4, the case 40 has an upper wall 41, a first side wall 42, a second side wall 43, an emission port 44, and an injection port 45. The case 40 is made of a black resin material having a downwardly concave shape composed of the upper wall 41 on the upper surface and the first side wall 42 on the outer surface. The case 40 has a light-shielding property and suppresses scattering of light emitted from the light source 20 toward any direction other than the emission port 44. The case 40 is arranged so that the outer periphery of the case 40 coincides with that of the substrate 10 and the first sealant 30, and is bonded to the substrate 10 via the first sealant 30.

[0025] The upper wall 41 has a rectangular planar shape, and is disposed on the upper surface of the case 40 so as to face the substrate 10. The upper wall 41 has an emission port 44 in the shape of a circular opening in the center, through which light emitted from the light source 20 exits. The upper wall 41 also has two injection ports 45 near the corners of the rectangular planar shape, and a second sealant 60, which will be described later, is injected through the injection ports 45. The emission port 44 and the injection port 45 may be disposed in positions other than those described in the embodiment, so long as they are disposed in positions that do not interfere with each other. Furthermore, the outlet 44 and the inlet 45 may have an opening shape such as a circle or a polygon.

[0026] The first side wall 42 has a rectangular side shape extending vertically downward around the periphery of the upper wall 41, and is disposed to separate the substrate 10 from the upper wall 41 at a position that does not interfere with the emission port 44 and the injection port 45. The first side wall 42 has a shape that surrounds the light source 20 on all four sides, and blocks the emitted light that travels to the side of the light source 20. The planar shape of the lower end of the first side wall 42 is formed to match the planar shape of the first sealant 30, and is adhered to the first sealant 30.

[0027] The first side wall 42 has a first side wall 42a, a first side wall 42b, a first side wall 42c, and a first side wall 42d. The first side wall 42a is disposed below the outer periphery of the upper wall 41 where the two injection ports 45 are adjacent to each other, and has a first through hole 51. The first side wall 42b and the first side wall 42c are wall surfaces perpendicular to the first side wall 42a, and are disposed at positions opposite each other. The first side wall 42d is a wall surface facing the first side wall 42a.

[0028] The second side wall 43 is integrated with the lower surface of the upper wall 41 and has a rectangular side shape extending vertically downward around the outer periphery of the injection port 45. The second side wall 43 is located inside the first side walls 42a to 42d. The position of the lower end of the second side wall 43 coincides with the position of the lower end of the first side wall 42. The second side wall 43 has a second side wall 43a1, a second side wall 43a3, a second side wall 43b1, and a second side wall 43c1.

[0029] Of the two injection ports 45 in the upper wall 41, one injection port 45 is disposed at one end of the first side wall 42a and has a second side wall 43a1 facing the first side wall 42a and a second side wall 43b1 facing the first side wall 42b. Below the outer periphery of one injection port 45 is a space surrounded continuously on all four sides by the first side wall 42a, the first side wall 42b, the second side wall 43a1, and the second side wall 43b1. The second side wall 43a1 has a second through hole 52.

[0030] 5, one of the injection ports 45 may further include a second side wall 43a2 disposed between the first side wall 42a and the second side wall 43a1 so as to face each other, and a second side wall 43b2 disposed between the first side wall 42b and the second side wall 43b1 so as to face each other, and may be a space continuously surrounded on all four sides by the second side wall 43a1, the second side wall 43b1, the second side wall 43a2, and the second side wall 43b2 without using the first side wall 42a and the first side wall 42b. In this case, the second side wall 43a2 has a third through hole 53.

[0031] On the other hand, of the two injection ports 45 in the upper wall 41, the other injection port 45 is disposed at the other end of the first side wall 42a and has a second side wall 43a3 facing the first side wall 42a and a second side wall 43c1 facing the first side wall 42c. The lower part of the outer periphery of the other injection port 45 is a space surrounded on all four sides by the first side wall 42a, the first side wall 42c, the second side wall 43a3, and the second side wall 43c1. The second side wall 43a3 has a second through hole 52.

[0032] 5, the other injection port 45 may further include a second side wall 43a4 disposed between the first side wall 42a and the second side wall 43a3 so as to face each other, and a second side wall 43c2 disposed between the first side wall 42c and the second side wall 43c1 so as to face each other, and may be a space continuously surrounded on all four sides by the second side wall 43a3, the second side wall 43c1, the second side wall 43a4, and the second side wall 43c2 without using the first side wall 42a and the first side wall 42c. In this case, the second side wall 43a4 has a third through hole 53.

[0033] 6, the second sealant 60 is an adhesive material made of a resin such as liquid or gel epoxy or silicone. The second sealant 60 is injected from the injection port 45, flows along the inner wall surface of the first side wall 42 or the second side wall 43 below the injection port 45 toward the substrate 10, and comes into contact with the substrate 10, thereby fixing the substrate 10 and the case 40 together.

[0034] 2 and 6, the lead wire 70 is a linear member formed by extending a cylinder into a long and thin shape, and includes a core wire 71 made of a conductive metal material, and a coating member 72 made of an insulating resin that covers the periphery of the core wire 71. One end of the core wire 71 is connected to each of the first electrode 13 and the second electrode 14 with a conductive material such as solder, and the other end of the core wire 71 is connected to an external power source (not shown) or the like. The lead wire 70 passes through the second through hole 52 and the first through hole 51 from inside the case 40, and is then drawn out to the outside of the case 40.

[0035] 2, the optical element 80 is made of glass such as quartz glass having a rectangular planar shape or a resin having translucency. The optical element 80 is disposed above the emission port 44 of the case 40, and emits the light emitted from the light source 20 to the outside of the light emitting device 1. The optical element 80 may be an optical element that exerts an optical effect on the ultraviolet light from the light source 20, such as a lens, a diffusion plate, or an optical filter. Moreover, only a part of the optical element 80 may be made of glass or resin having translucency, and the other part may be made of a material that does not have translucency.

[0036] As shown in FIG. 3, FIG. 4, and FIG. 6, the light emitting device 1 has a resin filling section 50. The resin filling section 50 has an injection port 45 disposed at the top, and a first side wall 42a, a first side wall 42b, a second side wall 43a1 facing the first side wall 42a, and a second side wall 43b1 facing the first side wall 42b disposed at the sides. In FIG. 6, the first side wall 42a and the second side wall 43a1 are illustrated as cross-sectional views. Note that it is preferable that the planar shape of a square shape formed by the first side wall 42a, the first side wall 42b, the second side wall 43a1, and the second side wall 43b1 is the same as or larger than the injection port 45, so that the second sealant 60 can be easily injected.

[0037] The first side wall 42a has a first through hole 51. When viewed from above the upper surface of the case 40, the first through hole 51 is disposed at a position adjacent to and facing the injection port 45, and is a hole that penetrates the first side wall 42a laterally and is disposed away from the substrate 10 and the upper wall 41 when viewed in cross section as shown in Fig. 6. The first through hole 51 leads the lead wire 70 from the inside to the outside of the light emitting device 1 and holds it horizontally in a straight line.

[0038] The second side wall 43a1 has a second through hole 52 arranged on a straight line connecting the first electrode 13 and the first through hole 51 when viewed from the top surface of the case 40. The second through hole 52 is a hole that penetrates laterally through the second side wall 43a1 arranged below the injection port 45 so as to contact the substrate 10. The second through hole 52 draws out the core wire 71 of the lead wire 70 from inside the light emitting device 1 in the horizontal direction. When the second side wall 43a2 is arranged in addition to the second side wall 43a1 below the injection port 45, the third through hole 53 is arranged in the second side wall 43a2 so as to face the first through hole 51, and the lead wire 70 is held by the three through holes.

[0039] The first through hole 51 may be provided with a shape called an introduction, such as a taper, on the side facing the second through hole 52. Also, the first through hole 51 may be shaped so that the diameter on the second through hole 52 side is larger than the outside of the case 40 over the entire length of the first through hole 51. This makes it easier to insert the lead wire 70, improving workability.

[0040] The second through hole 52 may be provided with a shape called an induction such as a taper on the side facing the first electrode 13. Also, the second through hole 52 may be shaped so that the diameter on the first electrode 13 side is larger than the first through hole 51 side over the entire length of the second through hole 52. This makes it easier for the upper wall of the second through hole 52 to press the core wire 71 toward the substrate 10.

[0041] The second seal material 60 is injected from the injection port 45 and flows toward the substrate 10 along the inner walls of the first side wall 42a, the first side wall 42b, the second side wall 43a1, and the second side wall 43b1 of the four wall surfaces that constitute the resin filling portion 50. The second seal material 60 flows toward the substrate 10 along the leads. The second sealant 60 covers the area between the first through hole 51 and the second through hole 52 of the wire 70, and also seals the gap between the first through hole 51 and the second through hole 52. When the second sealant 60 moves toward the substrate 10, a gap of about the thickness of the first sealant 30 is provided between the substrate 10 and the second side wall 43a1 and the second side wall 43b1, so that there is little risk of air pockets such as air bubbles remaining in the resin filling portion 50. The second sealant 60 is disposed between the substrate 10 and the second side wall 43a1 and the second side wall 43b1, and can increase the area in contact with the substrate 10, so that the second sealant 60 can be more firmly attached to the substrate 10. Furthermore, after contacting the substrate 10, the second sealant 60 is cured by a method such as heating, so that the substrate 10 and the case 40 are fixed, and the light emitting device 1 is hermetically sealed. The second sealant 60 may be bonded to the optical element 80 to prevent it from falling off.

[0042] FIG. 7 is a flowchart showing a method for manufacturing the light emitting device 1.

[0043] First, in a substrate preparation step, a substrate 10 is prepared having a first wiring pattern 11, a second wiring pattern 12, a first electrode 13, and a second electrode 14 arranged on its surface (S101). Next, in a light source arrangement step, a light source 20 is electrically connected to the first wiring pattern 11 and the second wiring pattern 12 (S102). Next, in a lead wire connection step, a lead wire 70 is electrically connected to the first electrode 13 and the second electrode 14 (S103). Next, in a first sealant placement step, a first sealant 30 is placed on the surface of the substrate 10 (S104).

[0044] Next, in a case preparation step, the case 40 having the emission port 44, the injection port 45, the first through hole 51, the second through hole 52, etc. is prepared by resin molding using a mold (S105). Next, in a lead wire insertion step, the lead wire 70 is inserted into the first through hole 51 and the second through hole 52, and is drawn out from the first through hole 51 to the outside (S106).

[0045] Next, in an assembly process, the first sealant 30 and the case 40 are joined (S107). Next, in a second sealant injection process, the second sealant 60 is injected from the injection port 45 and cured by a method such as heating to fix the substrate 10, the case 40, and the lead wires 70 (S108). Next, in an optical element arrangement process, the optical element 80 is arranged so as to cover the emission port 44 of the case 40 (S109), and the light emitting device 1 is manufactured.

[0046] (Functions and Effects of the Light Emitting Device According to the First Embodiment) In the light emitting device 1, the injection port 45 is located on the top surface of the case 40, so that it is easier to inject the second sealant 60 compared to when the injection port 45 is located on the side of the case 40. Moreover, since the lead wire 70 is not inserted into the injection port 45, it is easier to inject the second sealant 60 compared to when the lead wire 70 is present in the injection port 45.

[0047] Furthermore, in the light emitting device 1, the first passage hole 51 can have the smallest inner diameter through which the lead wire 70 passes. Since the gap between the inner diameter of the first passage hole 51 and the outer diameter of the lead wire 70 is small, the second sealant 60 requires sealing in a small area and is easy to seal, so that the light emitting device 1 can be easily hermetically sealed. Furthermore, the risk of the second sealant 60 leaking out of the case 40 from the first passage hole 51 can be reduced.

[0048] Furthermore, in the light emitting device 1, the second through hole 52 can have a minimum inner diameter through which the core wire 71 of the lead wire 70 passes. The lead wire 70 is held in the first through hole 51 and the second through hole 52. Even if pressure is applied to the side of the lead wire 70 from the second sealant 60 when the second sealant 60 is injected, the lead wire 70 is supported by the first through hole 51 and the second through hole 52 and does not bend. This suppresses the force that pulls the lead wire 70 from the first electrode 13 in the direction of the second through hole 52, which is generated by bending of the lead wire 70, and reduces the risk of the lead wire 70 peeling off from the first electrode 13.

[0049] In the light emitting device 1, the second sealant 60 is injected into the first sidewall 42 and the second sidewall 43 constituting the resin filling portion 50, or into a space surrounded on all sides by the second sidewall 43. The second sidewall 43 surrounds the sides of the second sealant 60 and has a shape that prevents the second sealant 60 from heading toward the inside of the light emitting device 1, thereby reducing the risk of the second sealant 60 adhering to the light source 20, etc.

[0050] Moreover, in the light emitting device 1, the second side wall 43 is in contact with and covers the side of the second sealant 60, is disposed between the light source 20 and the second sealant 60, and blocks light from the light source 20 directed toward the second sealant 60. When the light source 20 emits ultraviolet light, the second side wall 43 blocks the ultraviolet light from the light source 20, and therefore, deterioration of the second sealant 60 due to the ultraviolet light can be suppressed.

[0051] In the light emitting device 1, the second sealant 60 injected into the resin filling portion 50 is cured by heating or other methods, and holds the substrate 10, the case 40, and the lead wire 70 together. In addition to the first sealant 30, the second sealant 60 functions as a second bonding material that prevents the substrate 10 from falling off the case 40. Even if a force is applied to the lead wire 70 that pulls it toward the outside of the light emitting device 1, the second sealant 60 fixes the substrate 10, the case 40, and the lead wire 70 together, thereby reducing the risk that the lead wire 70 will peel off from the first electrode 13.

[0052] Furthermore, in the light emitting device 1, the lead wire 70 has the core wire 71 and a covering member 72 covering the periphery of the core wire 71 disposed in the first passing hole 51, and only the core wire 71 disposed in the second passing hole 52. That is, the diameter of the second passing hole 52 can be made smaller than the diameter of the first passing hole 51. Since the covering member 72 is disposed on the opposite side of the light source 20 of the second side wall 43 so as not to pass through the second passing hole 52, for example, when the light source 20 emits ultraviolet light, the light is blocked by the second side wall 43, and therefore there is little risk of the covering member 72 deteriorating.

[0053] Furthermore, in the light emitting device 1, one side end of the covering member 72 can be disposed within a range visible from the injection port 45. For example, when one side end of the covering member 72 is disposed in the second passing hole 52, the inner diameter of the second passing hole 52 is smaller than the outer diameter of the covering member 72, so that the second side wall 43 is pushed upward and the upper wall 41 of the case 40 is deformed, and there is a risk that the optical element 80 will be tilted when the optical element 80 is disposed. Since the position of one side end of the covering member 72 can be determined while being visually confirmed, the risk that the one side end of the covering member 72 will be pressed into the second passing hole 52 can be reduced.

[0054] Furthermore, in the light emitting device 1, the lead wire 70 is inclined between the first through hole 51 and the second through hole 52. Furthermore, the core wire 71 contacts the upper side of the inner wall of the second through hole 52, and the covering member 72 contacts the lower side of the inner wall of the first through hole 51. For example, when the lead wire 70 is pulled toward the outside of the case 40, the pulling force applied to the lead wire 70 can be dispersed to the case 40 via the respective contact points, and the core wire 71 can be prevented from peeling off from each of the first electrode 13 and the second electrode 14.

[0055] Furthermore, in the light emitting device 1, the first electrode 13 and the second electrode 14 may be disposed on a line connecting the light source 20 and the second passage hole 52. Furthermore, the conductive material such as solder may contain or cover a surface of a material that reflects light from the light source 20. The conductive material such as solder can block light directed toward the second passage hole 52 of the light source 20, and can suppress irradiation of light to the second sealant 60 in the second passage hole 52.

[0056] In the light emitting device 1, the diameter of the second through hole 52 is smaller than the outer diameter of the covering member 72. The second through hole 52 may be a path for the second sealant 60 to enter the case 40. However, since the covering member 72 covers the gap between the inner diameter of the second through hole 52 and the outer diameter of the core wire 71, the second sealant 60 may not enter the case 40. This makes it possible to suppress the amount of the second sealant 60 that protrudes into the case 40. The second sealant 60 that protrudes into the case 40 spreads along the core wire 71 due to surface tension and the like, and comes into contact with the first electrode 13 and the second electrode 14, and further with a conductive material such as solder. However, since the amount of the second sealant 60 is small, it can be stopped, and adhesion to the light source 20 can be suppressed. [Explanation of symbols]

[0057] 1 Light emitting device 10 Substrate 20 light source 30 First sealing material 40 cases 44 Exit port 45 Inlet 50 Resin filling section 60 Second sealing material 70 Lead Wire 71 Core Wire 72 Covering material 80 Optical Elements

Claims

1. A substrate; A light source disposed on the substrate; a case that covers the substrate and the light source; a resin filling portion disposed in the case and surrounded by a side wall extending from an upper surface of the case to an upper surface of the substrate; A first through hole disposed in the side wall; a second passage hole disposed in the side wall facing the light source and the first passage hole; A conductive core wire connected to the substrate; and an insulating covering member covering the core wire. One side end of the covering member is disposed in the resin filling portion. A light emitting device characterized by:

2. A second sealant is filled in the resin filling portion, One side end of the covering member is covered with the second sealing material.

2. The light emitting device according to claim 1 .

3. The first through hole has the core wire and the covering member disposed therein, The second through hole has the core wire disposed therein and the covering member not disposed therein.

2. The light emitting device according to claim 1 .

4. The first through hole and the second through hole are aligned in a straight line in a plan view, the first passage hole is disposed so as to be spaced apart from an upper surface of the substrate; the second passage hole is disposed in contact with an upper surface of the substrate, the covering member and the core wire are supported by a lower wall of the first through hole and an upper wall of the second through hole, and are held in an inclined shape between the first through hole and the second through hole.

2. The light emitting device according to claim 1 .

5. The light source emits ultraviolet light.

2. The light emitting device according to claim 1 .

6. Further comprising an optical element for controlling the light emitted from the light source, The optical element is disposed on the upper surface of the case.

2. The light emitting device according to claim 1 .

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