Coil electronic component
By setting the insulating layer and external electrodes in the inductor device, the manufacturing problems of thin inductor devices are solved, efficient utilization of magnetic materials and thinner equipment are achieved, and the performance and reliability of inductor devices are improved.
Patent Information
- Application Number
- JP2024117209
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-07-27
- Filing Date
- 2024-07-22
- Publication Date
- 2025-02-06
AI Technical Summary
The prior art is difficult to manufacture thin inductors without increasing the volume of magnetic material, which affects the lightness of electronic equipment and the freedom of component layout.
An inductor device including magnetic material and coil is designed. By providing an insulating layer and external electrode on the surface and inside of the magnetic material, the connection and protection of the coil are ensured, while a multi-layer insulating layer structure is adopted to prevent electrode expansion and reduce material waste.
The manufacturing of thin inductor devices is realized, the functionality of magnetic materials and the thinning of equipment is maintained, while improving the performance and reliability of inductor devices.
Smart Images
Figure 2025018992000001_ABST
Abstract
Description
[Technical field]
[0001] The present disclosure relates to coil electronics. [Background technology]
[0002] Recently, as the functions of mobile devices become more diverse and power consumption increases, coil electronic components with low loss and excellent efficiency are being adopted around power semiconductors (PMIC, power management integrated circuit) to extend battery life in mobile devices. Meanwhile, there is a growing demand for thin power inductors to slim down products and increase the freedom of component placement. Summary of the Invention [Problem to be solved by the invention]
[0003] One aspect of the embodiment seeks to provide a coil electronic component that is thin without volume loss of a magnetic material.
[0004] However, the problem to be solved by the present embodiment is not limited to the above problem, and can be variously expanded within the scope of the technical ideas included in the present embodiment. [Means for solving the problem]
[0005] A coil electronic component according to one embodiment may include a magnetic body having a first surface and a second surface facing in a first direction, a third surface and a fourth surface facing in a second direction connecting the first surface and the second surface, and a fifth surface and a sixth surface facing in the third direction connecting the first surface and the second surface; a coil at least a portion of which is embedded in the magnetic body; a first external electrode extending from the sixth surface of the magnetic body to a portion of the first surface and connected to the coil; a second external electrode extending from the sixth surface of the magnetic body to a portion of the second surface and connected to the coil; a first insulating layer covering the first external electrode on the first surface of the magnetic body; and a second insulating layer covering the second external electrode on the second surface of the magnetic body.
[0006] The coil electronic component may further include a third insulating layer surrounding the third, fourth and fifth surface edges of the first external electrode on the first surface of the magnetic body, and a fourth insulating layer surrounding the third, fourth and fifth surface edges of the second external electrode on the second surface of the magnetic body.
[0007] Additionally, the first insulating layer can cover at least a portion of the third insulating layer, and the second insulating layer can cover at least a portion of the fourth insulating layer.
[0008] Further, the first external electrode may include a first electrode pad arranged on the sixth surface of the magnetic body and a first connecting portion arranged on the first surface of the magnetic body, and the second external electrode may include a second electrode pad arranged on the sixth surface of the magnetic body and a second connecting portion arranged on the second surface of the magnetic body.
[0009] In addition, the first electrode pad and the first connecting portion may be an integral structure, and the second electrode pad and the second connecting portion may be an integral structure.
[0010] Moreover, the first connecting portion may be spaced apart from the fifth surface of the magnetic body, and the second connecting portion may be spaced apart from the fifth surface of the magnetic body.
[0011] Moreover, the first connecting portion may be spaced apart from the third surface and the fourth surface of the magnetic body, and the second connecting portion may be spaced apart from the third surface and the fourth surface of the magnetic body.
[0012] The coil may also be a wire-wound coil.
[0013] The coil electronic component may further include a support substrate disposed inside the magnetic body and including a first support surface and a second support surface facing each other, and the coil may include a first coil pattern disposed on the first support surface of the support substrate, a second coil pattern disposed on the second support surface of the support substrate, and a via connecting the first coil pattern and the second coil pattern.
[0014] Also, the magnetic body may be a laminate in which a plurality of sheets are stacked, and the coil may include a plurality of coil patterns disposed on each of the plurality of sheets and connected to each other.
[0015] Also, the coil electronic component may further include a fifth insulating layer disposed on the sixth surface of the magnetic body between the first external electrode and the second external electrode.
[0016] The fifth insulating layer can also be disposed on the third surface, the fourth surface and the fifth surface of the magnetic body. Effect of the Invention
[0017] According to the embodiment, it is possible to provide a coil electronic component that is thin without causing volume loss of the magnetic body. [Brief description of the drawings]
[0018] [Figure 1] FIG. 1 is a perspective view showing a coil electronics component according to an embodiment; [Diagram 2] 2 is a schematic cross-sectional view taken along line II-II' in FIG. 1. [Diagram 3] FIG. 2 is a side view illustrating the coil electronic component of FIG. [Figure 4a] 2A to 2C are diagrams illustrating some steps of forming external electrodes on the coil electronic component of FIG. 1; [Figure 4b] 2A to 2C are diagrams illustrating some steps of forming external electrodes on the coil electronic component of FIG. 1; [Figure 4c] 2A to 2C are diagrams illustrating some steps of forming external electrodes on the coil electronic component of FIG. 1; [Figure 4d] 2A to 2C are diagrams illustrating some steps of forming external electrodes on the coil electronic component of FIG. 1; [Figure 4e] 2A to 2C are diagrams illustrating some steps of forming external electrodes on the coil electronic component of FIG. 1; [Figure 4f] 2A to 2C are diagrams illustrating some steps of forming external electrodes on the coil electronic component of FIG. 1; [Diagram 5] FIG. 11 is a cross-sectional view illustrating a coil electronic component according to a comparative example. [Figure 6] FIG. 13 is a perspective view showing a coil electronic component according to another embodiment. [Figure 7] 7 is a schematic cross-sectional view taken along line VII-VII' in FIG. 6. [Figure 8] FIG. 13 is a partial cross-sectional view showing a coil electronic component according to another embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0019] Hereinafter, the embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily carry out the present invention. In order to clearly explain the present invention in the drawings, parts that are not necessary for the explanation are omitted, and the same or similar components are given the same reference numerals throughout the specification. In addition, in the accompanying drawings, some components are exaggerated, omitted, or shown in a schematic manner, and the size of each component does not entirely reflect the actual size.
[0020] The attached drawings are merely intended to facilitate understanding of the embodiments disclosed in this specification, and the attached drawings do not limit the technical ideas disclosed in this specification, and it should be understood that the attached drawings include all modifications, equivalents, or alternatives included in the idea and technical scope of the present invention.
[0021] Terms including ordinal numbers such as first, second, etc. may be used to describe various components, but the components are not limited by the terms. The terms are used only to distinguish one component from another.
[0022] Furthermore, when a part such as a layer, film, region, or plate is said to be "on" or "above" another part, this includes not only the case where it is directly on top of the other part, but also the case where there is another part in between. Conversely, when a part is said to be "directly on" another part, it means that there is no other part in between. Furthermore, being "on" or "above" a reference part means being located above or below the reference part, and does not necessarily mean being located "on" or "above" the direction opposite to gravity.
[0023] Throughout the specification, the terms "comprise" or "have" are intended to specify the presence of any feature, numeral, step, operation, component, part, or combination thereof described in the specification, but should be understood as not precluding the presence or additional possibility of one or more other features, numerals, steps, operations, components, parts, or combinations thereof. Thus, when a part is said to "comprise" a certain element, this means that it can further include other elements, but not to the exclusion of other elements, unless specifically stated to the contrary.
[0024] Also, throughout the specification, a reference to "in a plane" means a view of the part as viewed from above, and a reference to "in cross section" means a view of the part as viewed from the side through a vertical cut.
[0025] In addition, throughout the specification, when the term "connected" is used, this does not only mean that two or more components are directly connected, but also that two or more components are indirectly connected through other components, or that they are not only physically connected, but also electrically connected, or that they are referred to by different names depending on their position or function but are still one body.
[0026] FIG. 1 is a perspective view showing a coil electronic component according to one embodiment, FIG. 2 is a schematic cross-sectional view taken along line II-II' in FIG. 1, and FIG. 3 is a side view showing the coil electronic component of FIG. 1.
[0027] 1, 2 and 3, a coil electronic component 1000 according to one embodiment includes a main body 100, a coil 200, a supporting substrate 300, a first external electrode 500, a second external electrode 600, a first insulating layer 710, a second insulating layer 720, a third insulating layer 730, a fourth insulating layer 740 and a fifth insulating layer 750.
[0028] The body 100 may be formed in a roughly rectangular hexahedron shape, but the present embodiment is not limited thereto. The body 100 may have a substantially rectangular hexahedron shape, but not a perfect rectangular hexahedron shape, due to shrinkage of the magnetic powder during sintering. For example, the body 100 may have a roughly rectangular hexahedron shape, but the corners and vertices may be rounded.
[0029] In this embodiment, for ease of explanation, the two surfaces facing each other in the longitudinal direction (L-axis direction) are defined as the first surface S1 and the second surface S2, the two surfaces facing each other in the width direction (W-axis direction) are defined as the third surface S3 and the fourth surface S4, and the two surfaces facing each other in the thickness direction (T-axis direction) are defined as the fifth surface S5 and the sixth surface S6.
[0030] The length of the coil electronic component 1000 may refer to the maximum value of the lengths of a plurality of line segments parallel to the length direction (L axis direction) by connecting two outermost boundary lines facing each other in the length direction (L axis direction) of the coil electronic component 1000 shown in the cross-section photograph of the coil electronic component 1000 in the width direction (W axis direction) center of the coil electronic component 1000 based on an optical microscope or SEM (Scanning Electron Microscope) photograph. Alternatively, the length of the coil electronic component 1000 may refer to the minimum value of the lengths of a plurality of line segments parallel to the length direction (L axis direction) by connecting two outermost boundary lines facing each other in the length direction (L axis direction) of the coil electronic component 1000 shown in the cross-section photograph. Alternatively, the length of the coil electronic component 1000 may refer to the arithmetic average value of the lengths of at least two line segments parallel to the length direction (L axis direction) by connecting two outermost boundary lines facing each other in the length direction (L axis direction) of the coil electronic component 1000 shown in the cross-section photograph.
[0031] The thickness of the coil electronic component 1000 may refer to the maximum value of the lengths of a plurality of line segments parallel to the thickness direction (T axis direction) by connecting two outermost boundary lines facing each other in the thickness direction (T axis direction) of the coil electronic component 1000 shown in the cross-section photograph of the coil electronic component 1000 in the width direction (W axis direction) center of the coil electronic component 1000 based on an optical microscope or SEM (Scanning Electron Microscope) photograph. Alternatively, the thickness of the coil electronic component 1000 may refer to the minimum value of the lengths of a plurality of line segments parallel to the thickness direction (T axis direction) by connecting two outermost boundary lines facing each other in the thickness direction (T axis direction) of the coil electronic component 1000 shown in the cross-section photograph. Alternatively, the thickness of the coil electronic component 1000 may refer to the arithmetic average value of the lengths of at least two line segments parallel to the thickness direction (T axis direction) by connecting two outermost boundary lines facing each other in the thickness direction (T axis direction) of the coil electronic component 1000 shown in the cross-section photograph.
[0032] The width of the coil electronic component 1000 may refer to the maximum value of the lengths of a plurality of line segments parallel to the width direction (W axis direction) by connecting two outermost boundary lines facing each other in the width direction (W axis direction) of the coil electronic component 1000 shown in the cross-section photograph of the length direction (L axis direction)-width direction (W axis direction) at the center of the thickness direction (T axis direction) of the coil electronic component 1000 based on an optical microscope or SEM (Scanning Electron Microscope) photograph. Alternatively, the width of the coil electronic component 1000 may refer to the minimum value of the lengths of a plurality of line segments parallel to the width direction (W axis direction) by connecting two outermost boundary lines facing each other in the width direction (W axis direction) of the coil electronic component 1000 shown in the cross-section photograph. Alternatively, the width of the coil electronic component 1000 may refer to the arithmetic average value of the lengths of at least two line segments parallel to the width direction (W axis direction) by connecting two outermost boundary lines facing each other in the width direction (W axis direction) of the coil electronic component 1000 shown in the cross-section photograph.
[0033] Meanwhile, the length, width and thickness of the coil electronic component 1000 may be measured by a micrometer measurement method. The micrometer measurement method may be performed by setting a zero point with a micrometer that has been subjected to Gage R&R (Repeatability and Reproducibility), inserting the coil electronic component 1000 according to the present embodiment between the tips of the micrometer, and rotating the measurement lever of the micrometer. Meanwhile, when the length of the coil electronic component 1000 is measured by the micrometer measurement method, the length of the coil electronic component 1000 may mean a value measured once or may mean an arithmetic average of values measured multiple times. This may be similarly applied to the measurement of the width and thickness of the coil electronic component 1000.
[0034] The body 100 forms the exterior of the coil electronic component 1000, and is a space in which a magnetic path is formed, which is a path through which magnetic flux induced in the coil 200 passes when a current is applied to the coil 200 through the first external electrode 500 and the second external electrode 600.
[0035] The body 100 encapsulates the coil 200 and the support substrate 300 and contains a magnetic material. The body 100 contains magnetic particles, and an insulating material may be interposed between the magnetic particles.
[0036] The magnetic material may include a first metal magnetic powder, a second metal magnetic powder having a larger particle size than the first metal magnetic powder, and a third metal magnetic powder having a larger particle size than the second metal magnetic powder. The average particle size (D 50 ) may be 0.1 μm or more and 0.2 μm or less, and the average particle size (D 50 ) may be 1 μm or more and 2 μm or less, and the average particle size (D 50 ) may be 25 μm or more and 30 μm or less.
[0037] The magnetic particles may be ferrite particles or metallic magnetic particles that exhibit magnetic properties.
[0038] The ferrite particles may be, for example, at least one of spinel-type ferrites such as Mg-Zn, Mn-Zn, Mn-Mg, Cu-Zn, Mg-Mn-Sr, and Ni-Zn-based ferrites; hexagonal-type ferrites such as Ba-Zn, Ba-Mg, Ba-Ni, Ba-Co, and Ba-Ni-Co-based ferrites; garnet-type ferrites such as Y-based ferrites; and Li-based ferrites.
[0039] The metal magnetic particles may be composed of two or more kinds of powders with different compositions, and may include one or more selected from the group consisting of iron (Fe), silicon (Si), chromium (Cr), cobalt (Co), molybdenum (Mo), aluminum (Al), niobium (Nb), copper (Cu) and nickel (Ni). For example, the metal magnetic particles may be at least one of pure iron, Fe-Si alloys, Fe-Si-Al alloys, Fe-Ni alloys, Fe-Ni-Mo alloys, Fe-Ni-Mo-Cu alloys, Fe-Co alloys, Fe-Ni-Co alloys, Fe-Cr alloys, Fe-Cr-Si alloys, Fe-Si-Cu-Nb alloys, Fe-Ni-Cr alloys, and Fe-Cr-Al alloys. Here, the different compositions of the metal magnetic particles may also mean different contents.
[0040] The metal magnetic particles may be amorphous or crystalline. For example, the metal magnetic particles may be Fe-Si-B-Cr based amorphous alloys, but the present embodiment is not limited thereto. The metal magnetic particles may have an average particle size of about 0.1 μm to 30 μm, but is not limited thereto. In this specification, the average particle size is defined as D 90 Or D 50 Particle size distribution can mean a particle size distribution expressed as: D Particle size distribution is an index showing the size (particle diameter) of particles contained in the particle group being measured and in what proportion, and is well known to ordinary engineers. 50 (Particle size corresponding to 50% cumulative volume of particle size distribution) indicates the average particle size.
[0041] The metal magnetic particles may be two or more different types of metal magnetic particles, where different types of metal magnetic particles means that the metal magnetic particles are distinguished from one another in at least one of the average particle size, composition, component ratio, crystallinity, and shape.
[0042] The insulating material may include, but is not limited to, epoxy, polyimide, liquid crystal polymer, and the like, either alone or in combination.
[0043] There is no particular limitation on the method for forming the body 100. For example, the body 100 can be formed by disposing sheets of a magnetic material on the upper and lower parts of the coil 200, and then compressing and curing the sheets.
[0044] The support substrate 300 is disposed inside the main body 100 and supports the coil 200 .
[0045] The support substrate 300 may be made of an insulating material including a thermosetting insulating resin such as an epoxy resin, a thermoplastic insulating resin such as a polyimide, or a photosensitive insulating resin, or may be made of an insulating material obtained by impregnating such an insulating resin with a reinforcing material such as glass fiber or an inorganic filler. For example, the support substrate 300 may be made of an insulating material such as a prepreg, an Ajinomoto Build-up Film (ABF), an FR-4, a Bismaleimide Triazine (BT) film, or a Photo Imagable Dielectric (PID) film, but the present embodiment is not limited thereto.
[0046] As the inorganic filler, at least one selected from the group consisting of silica (SiO2), alumina (Al2O3), silicon carbide (SiC), barium sulfate (BaSO4), talc (Talc), mud, mica powder, aluminum hydroxide (Al(OH)3), magnesium hydroxide (Mg(OH)2), calcium carbonate (CaCO3), magnesium carbonate (MgCO3), magnesium oxide (MgO), boron nitride (BN), aluminum borate (AlBO3), barium titanate (BaTiO3), and calcium zirconate (CaZrO3) can be used.
[0047] There is a through hole 310 at the center of the support substrate 300. The through hole 310 is filled with the magnetic material constituting the main body 100 to form a core, thereby improving the performance of the coil electronic component.
[0048] The coil 200 is disposed inside the body 100 to exhibit the characteristics of the coil electronic component 1000. For example, when the coil electronic component 1000 of the present embodiment is used as a power inductor, when a current is applied to the coil 200, the coil 200 can store energy in the form of a magnetic field to maintain an output voltage, thereby stabilizing the power supply of an electronic device.
[0049] The coil 200 may be disposed on a first supporting surface 320 and a second supporting surface 330 facing each other of a supporting substrate 300. The coil 200 includes a first coil pattern 210 and a second coil pattern 220, and the first coil pattern 210 and the second coil pattern 220 may be electrically connected to each other through a via 230.
[0050] The first coil pattern 210 is disposed on a first supporting surface 320 of the supporting substrate 300 and includes a first lead-out portion 213. The first lead-out portion 213 is exposed from a first surface S1 of the body 100 and is electrically connected to a first external electrode 500.
[0051] The second coil pattern 220 is disposed on a second supporting surface 330 of the supporting substrate 300 and includes a second lead-out portion 223. The second lead-out portion 223 is exposed from a second surface S2 of the body 100 and is electrically connected to a second external electrode 600.
[0052] Meanwhile, when the first coil pattern 210, the first lead-out portion 213, and the vias 230 are formed on the first support surface 320 side of the support substrate 300 by plating, the first coil pattern 210, the first lead-out portion 213, and the vias 230 may each include a seed layer such as an electroless plating layer and an electrolytic plating layer. Here, the electrolytic plating layer may have a single-layer structure or a multi-layer structure. The multi-layer electrolytic plating layer may be formed in a conformal film structure in which one electrolytic plating layer covers another electrolytic plating layer, or may be formed in a shape in which one electrolytic plating layer is laminated only on one surface of one electrolytic plating layer. The seed layer of the first coil pattern 210, the seed layer of the first lead-out portion 213, and the seed layer of the vias 230 may be integrally formed so that no boundary is formed between them, but the present embodiment is not limited thereto. The electrolytic plating layer of the first coil pattern 210, the electrolytic plating layer of the first lead-out portion 213, and the electrolytic plating layer of the via 230 may be integrally formed with no boundaries between them, but this embodiment is not limited to this. The above description can be similarly applied to the second coil pattern 220, the second lead-out portion 223, and the via 230.
[0053] Each of the coil 200 and the vias 230 may be formed from a conductive material such as copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti), or alloys thereof, but the present embodiment is not limited thereto.
[0054] An insulating film IF may be provided between the coil 200 and the body 100. The insulating film IF may be formed along the surfaces of the support substrate 300 and the coil 200. The insulating film IF is not present in the portion where the support substrate 300 and the coil 200 are connected to the external electrodes 500 and 600. The insulating film IF is for insulating the coil 200 from the body 100 and may include a known insulating material such as Parylene. The insulating material included in the insulating film IF may be any material and is not particularly limited. For example, the insulating film IF may be a polyurethane resin, a polyester resin, an epoxy resin, or a polyamideimide resin. The insulating film IF may be formed by a method such as vapor deposition, but is not limited thereto. For example, the insulating film IF may be formed by laminating insulating films on both sides of the support substrate 300.
[0055] The first external electrode 500 and the second external electrode 600 are provided outside the body 100 and connected to the coil 200. That is, the first external electrode 500 and the second external electrode 600 are connected to the first lead-out portion 213 and the second lead-out portion 223 of the coil 200, respectively.
[0056] The first external electrode 500 extends from the sixth surface S 6 of the body 100 to a portion of the first surface S 1 and is connected to the first lead-out portion 213 of the coil 200 .
[0057] For example, the first external electrode 500 may include a first electrode pad 510 and a first connection portion 520 .
[0058] The first electrode pad 510 is disposed on the sixth surface S6 of the body 100, and the first connecting part 520 extends from the first electrode pad 510 to the first surface S1 of the body 100. The first lead-out part 213 of the coil 200 is exposed to the first surface S1 of the body 100 and connected to the first connecting part 520. Thus, the coil 200 is electrically connected to the first external electrode 500.
[0059] The first electrode pad 510 and the first connecting part 520 may be an integral structure. For example, the first electrode pad 510 and the first connecting part 520 may be formed by plating.
[0060] The second external electrode 600 extends from the sixth surface S 6 of the body 100 to a portion of the second surface S 2 and is connected to the second lead-out portion 223 of the coil 200 .
[0061] For example, the second external electrode 600 may include a second electrode pad 610 and a second connection portion 620 .
[0062] The second electrode pad 610 is disposed on the sixth surface S6 of the body 100, and the second connecting part 620 extends from the second electrode pad 610 to the second surface S2 of the body 100. The second lead-out part 223 of the coil 200 is exposed to the second surface S2 of the body 100 and connected to the second connecting part 620. Thus, the coil 200 is electrically connected to the second external electrode 600.
[0063] The second electrode pad 610 and the second connecting portion 620 may be an integral structure. For example, the second electrode pad 610 and the second connecting portion 620 may be formed by plating.
[0064] The first external electrode 500 may include a first metal layer 501 , a second metal layer 502 , and a third metal layer 503 .
[0065] The first metal layer 501 is a plating layer in contact with the first lead-out portion 213 of the coil 200 and the outer surfaces of the body 100, i.e., the first surface S1 and the sixth surface S6, and may include copper (Cu). The first metal layer 501 may form the first electrode pad 510 and the first connecting portion 520 of the first external electrode 500.
[0066] The second metal layer 502 is a plating layer covering the first metal layer 501 and may include nickel (Ni). The second metal layer 502 may be formed on the first electrode pad 510 and may not be formed on the first connector 520.
[0067] The third metal layer 503 is a plating layer covering the second metal layer 502 and may include tin (Sn). The third metal layer 503 may be formed on the first electrode pad 510 and may not be formed on the first connector 520.
[0068] However, this embodiment is not limited to such a three-layer structure, and a two-layer structure in which only one plating layer is added on the first metal layer 501 is also possible.
[0069] The second external electrode 600 may include a first metal layer 601 , a second metal layer 602 , and a third metal layer 603 .
[0070] The first metal layer 601 is a plating layer in contact with the second lead-out portion 223 of the coil 200 and the outer surfaces of the body 100, i.e., the second surface S2 and the sixth surface S6, and may include copper (Cu). The first metal layer 601 may form the second electrode pad 610 and the second connecting portion 620 of the second external electrode 600.
[0071] The second metal layer 602 is a plating layer covering the first metal layer 601 and may include nickel (Ni). The second metal layer 602 may be formed on the second electrode pad 610 and may not be formed on the second connector 620.
[0072] The third metal layer 603 is a plating layer covering the second metal layer 602 and may include tin (Sn). The third metal layer 603 may be formed on the second electrode pad 610 and may not be formed on the second connector 620.
[0073] However, this embodiment is not limited to such a three-layer structure, and a two-layer structure in which only one plating layer is added on the first metal layer 601 is also possible.
[0074] Thus, the first external electrode 500 and the second external electrode 600 may include nickel (Ni), copper (Cu), palladium (Pd), gold (Au) or an alloy thereof, and may include a plurality of plating layers. For example, the first external electrode 500 and the second external electrode 600 may be formed in a combination of nickel (Ni), copper (Cu), nickel / copper (Ni / Cu), palladium / nickel (Pd / Ni), palladium / nickel / copper (Pd / Ni / Cu), and copper / nickel / copper (Cu / Ni / Cu).
[0075] In some cases, the outermost layer may be made of tin (Sn). Since a tin-plated layer has a relatively low melting point, it is possible to improve the ease of mounting the first external electrode 500 and the second external electrode 600 on a board.
[0076] In general, the tin plating layer can be bonded to the electrode pad on the substrate through a solder containing a tin (Sn)-copper (Cu)-silver (Ag) alloy paste. That is, the tin plating layer can be bonded to the solder by melting them together during a heat treatment (reflow) process.
[0077] The first insulating layer 710 covers the first external electrode 500 on the first surface S1 of the body 100. The second insulating layer 720 covers the second external electrode 600 on the second surface S2 of the body 100.
[0078] The third insulating layer 730 surrounds the third surface S3, the fourth surface S4, and the fifth surface S5 of the first external electrode 500 on the first surface S1 of the body 100. For example, the third insulating layer 730 contacts the first connecting portion 520 and covers the first surface S1 of the body 100 in three regions between the first connecting portion 520 and the third surface S3, the fourth surface S4, and the fifth surface S5 of the body 100.
[0079] Since the first insulating layer 710 covers the first external electrode 500 on the first surface S1 of the main body 100, the first insulating layer 710 can cover the first connecting portion 520. The first insulating layer 710 can also cover the third insulating layer 730 surrounding the edge of the first connecting portion 520. That is, the first insulating layer 710 can cover the first connecting portion 520 and the third insulating layer 730.
[0080] The fourth insulating layer 740 surrounds the third surface S3, the fourth surface S4, and the fifth surface S5 of the second external electrode 600 on the second surface S2 of the body 100. For example, the fourth insulating layer 740 contacts the second connecting portion 620 and covers the second surface S2 of the body 100 in three regions between the second connecting portion 620 and the third surface S3, the fourth surface S4, and the fifth surface S5 of the body 100.
[0081] Since the second insulating layer 720 covers the second external electrode 600 on the second surface S2 of the main body 100, the second insulating layer 720 can cover the second connecting portion 620. The second insulating layer 720 can also cover the third insulating layer 730 surrounding the edge of the second connecting portion 620. That is, the second insulating layer 720 can cover the second connecting portion 620 and the third insulating layer 730.
[0082] The fifth insulating layer 750 may be disposed in an area of the sixth surface S6 of the main body 100 where the first external electrode 500 and the second external electrode 600 are not disposed. That is, the fifth insulating layer 750 may be disposed in an area on the sixth surface S6 of the main body 100 excluding the first electrode pad 510 and the second electrode pad 610. The fifth insulating layer 750 may also be disposed on at least a part of the third surface S3, the fourth surface S4, and the fifth surface S5 of the main body 100. The fifth insulating layer 750 may prevent an electrical short between other electronic components and the external electrodes 500, 600.
[0083] Although the first insulating layer 710, the second insulating layer 720, the third insulating layer 730, the fourth insulating layer 740, and the fifth insulating layer 750 have been described above, these insulating layers do not have to be formed in this order. Furthermore, these insulating layers may be formed from the same material or different materials.
[0084] Figures 4a, 4b, 4c, 4d, 4e, and 4f are diagrams illustrating some steps of forming external electrodes on the coil electronic component of Figure 1. Since the first external electrode 500 and the second external electrode 600 have corresponding structures and materials, the following description will focus on the first external electrode 500.
[0085] 4a, a portion of the fifth insulating layer 750 on the sixth surface S6 of the body 100 is removed to form a first pad region 910 and a second pad region 920. A method for removing the fifth insulating layer 750 may include, but is not limited to, a grinding process.
[0086] The first pad region 910 and the second pad region 920 are spaced apart from each other in the length direction (L-axis direction). That is, the fifth insulating layer 750 remains between the first pad region 910 and the second pad region 920. The first electrode pad 510 will be disposed in the first pad region 910, and the second electrode pad 610 will be disposed in the second pad region 920.
[0087] The fifth insulating layer 750 is also removed from the first surface S1 of the body 100 on which the first connecting part 520 is disposed and the second surface S2 of the body 100 on which the second connecting part 620 is disposed.
[0088] Referring to FIG. 4b, a third insulating layer 730 is formed on the first surface S1 of the body 100 where the first connecting part 520 is arranged, and a fourth insulating layer 740 is formed on the second surface S2 of the body 100 where the second connecting part 620 is arranged.
[0089] 4c, a part of the third insulating layer 730 is removed from the first surface S1 of the main body 100 to expose the first lead-out portion 213 of the coil 200, and a part of the fourth insulating layer 740 is removed from the second surface S2 to expose the second lead-out portion 223 of the coil 200. In this case, the third insulating layer 730 is etched from the first surface S1 of the main body 100 using a laser to form the first recess 930, and the fourth insulating layer 740 is etched from the second surface S2 to form the second recess 940. However, the method of removing the third insulating layer is not limited thereto. The first recess 930 may be a shape in which a part of the third insulating layer 730 is recessed to expose the first surface S1 of the main body 100, and the second recess 940 may be a shape in which a part of the fourth insulating layer 740 is recessed to expose the second surface S2 of the main body 100. In other words, the first recess 930 may be a region surrounded by the third insulating layer 730 like a wall, and the second recess 940 may be a region surrounded by the fourth insulating layer 740 like a wall. That is, with respect to the length direction (L-axis direction), the third insulating layer 730 protrudes from the first recess 930, and the fourth insulating layer 740 protrudes from the second recess 940. However, the sixth surface S6 side of the first recess 930 may have an open shape, and the sixth surface S6 side of the second recess 940 may have an open shape.
[0090] Referring to FIG. 4d, plating is performed on the first pad area 910 and the first recess 930 to form a first metal layer 501 covering the first pad area 910 and the first recess 930, and plating is performed on the second pad area 920 and the second recess 940 to form a first metal layer 601 covering the second pad area 920 and the second recess 940.
[0091] Except for the sixth surface S6 side of the main body 100, the first recess 930 is surrounded by the third insulating layer 730. In particular, since the third insulating layer 730 is also disposed between the fifth surface S5 of the main body 100 and the first recess 930, the plating can be prevented from spreading to the fifth surface S5. That is, since the fifth insulating layer 750 protrudes from the first recess 930 based on the length direction (L-axis direction), the fifth insulating layer 750 can function as a wall that blocks plating growth toward the fifth surface S5 of the main body 100. As a result, except for the sixth surface S6 side of the main body 100, the first metal layer 501 is surrounded by the fifth insulating layer 750.
[0092] 4e, a first insulating layer 710 is formed to cover the first metal layer 501. The first insulating layer 710 may cover both the first metal layer 501 and the third insulating layer 730. The first metal layer 501 in the first pad region 910 and the first metal layer 601 in the second pad region 920 are not covered by the third insulating layer 730.
[0093] 4f, additional plating is performed to cover the first metal layer 501 in the first pad region 910 and the first metal layer 601 in the second pad region 920. As a result, the second metal layers 502, 602 and the third metal layers 503, 603 described above can be formed.
[0094] FIG. 5 is a cross-sectional view that illustrates a schematic diagram of a coil electronic component according to a comparative example.
[0095] 5, the coil electronic component according to the comparative example includes a slit 110' formed by partially removing a side edge of a fifth surface S5' of a first surface S1' of a body 100', and an insulating layer 700' disposed in the slit 110'. In this case, since the insulating layer 700' formed in the slit 110' does not protrude from the first surface S1' of the body 100', the effect of suppressing the spread of the plating P toward the fifth surface S5' may not be large. In this case, since a part of the body 100' is removed to form the slit 110', the volume of the body 100' is reduced accordingly. Ultimately, this may have an adverse effect on the characteristics of the coil electronic component.
[0096] On the other hand, according to this embodiment, the third insulating layer 730 functions as a wall, thereby effectively preventing the plating from spreading to the fifth surface S5 of the main body 100, and it is not necessary to remove the main body 100 to prevent the plating from spreading, thereby improving the characteristics of the coil electronic component.
[0097] FIG. 6 is a perspective view showing a coil electronic component according to another embodiment, and FIG. 7 is a schematic cross-sectional view taken along line VII-VII' in FIG.
[0098] 6 and 7, the coil electronic component 2000 includes a main body 1100, a coil 1200, a first external electrode 500, a second external electrode 600, a first insulating layer 710, a second insulating layer 720, a third insulating layer 730, a fourth insulating layer 740, and a fifth insulating layer 750.
[0099] The coil 1200 may include at least one turn of conductive wire. For example, the coil 1200 may be a metal (e.g., copper (Cu) or silver (Ag)) wire whose surface is coated with an insulating material and wound in a spiral shape. That is, the coil 1200 may be a wire-wound coil. The coil 1200 is not limited to a single wire, and may be a twisted wire or a wire consisting of two or more wires.
[0100] Coil 1200 may be, but is not limited to, a circular coil. For example, coil 1200 may be any of a variety of known coils, such as a rectangular coil.
[0101] The cross section of the individual wires of the coil 1200 may have various known shapes such as a square, a circle, an oval, a triangle, and the like.
[0102] The coil 1200 may be configured with multiple layers. The coil 1200 may include a first coil 1210 and a second coil 1220. The first coil 1210 may be connected to the second coil 1220 and disposed on the upper side of the second coil 1220, i.e., on the fifth surface S5 side of the body 1100, to form a layer.
[0103] The number of turns of the first coil 1210 and the second coil 1220 may be the same or different.
[0104] The coil 1200 may be formed in a planar spiral shape and may have a plurality of turns. For example, the first coil 1210 may have an innermost turn coil C1, at least one middle turn coil C2, and an outermost turn coil C3, which are arranged in sequence from a midpoint in the length direction (L-axis direction) of the body 1100 toward the first surface S1. The second coil 1220 may also have an innermost turn coil C1', at least one middle turn coil C2', and an outermost turn coil C3', which are arranged in sequence from a midpoint in the length direction (L-axis direction) of the body 1100 toward the second surface S2.
[0105] An insulating film IF may be provided along the surface of each of the multiple turns of the coil 1200. The insulating film IF is for protecting and insulating the multiple turns of the first coil 1210 and the second coil 1220, and may include a known insulating material such as Parylene. Any insulating material may be used for the insulating film IF, and there is no particular limitation. For example, the insulating film IF may be a polyurethane resin, a polyester resin, an epoxy resin, or a polyamide-imide resin. The insulating film IF may be formed by a method such as vapor phase deposition, but is not limited thereto.
[0106] The coil 1200 can include a winding portion 1230 , a first lead portion 1213 and a second lead portion 1223 .
[0107] The winding portion 1230 is a portion in which the metal wire makes at least one turn.
[0108] The first lead portion 1213 extends from one end of the winding portion 1230 and is exposed to a first surface S1 of the body 1100. The first lead portion 1213 is connected to the first external electrode 500. The second lead portion 1223 extends from the other end of the winding portion 1230 and is exposed to a second surface S2 of the body 1100. The second lead portion 1223 is connected to the second external electrode 600.
[0109] The remaining components other than those described above are the same as those of the coil electronic component shown in FIG. 1, so a duplicated description thereof will be omitted.
[0110] FIG. 8 is a partial cross-sectional view that illustrates a coil electronic component according to another embodiment.
[0111] 8, the coil electronic component 3000 includes a body 2100, a coil 2200, a first external electrode 500, a second external electrode 600, a first insulating layer 710, a second insulating layer 720, a third insulating layer 730, a fourth insulating layer 740, and a fifth insulating layer 750.
[0112] The main body 2100 may be a laminate in which a plurality of sheets including a magnetic material are laminated in a thickness direction (T-axis direction). The coil 2200 may include a plurality of coil patterns 2210 arranged on each sheet and connected to each other.
[0113] The coil 2200 has a first lead-out portion 2213 at one end and a second lead-out portion 2223 at the other end. The first lead-out portion 2213 is exposed from a first surface S1 of the body 2100 and is connected to a first external electrode 500. The second lead-out portion 2223 is exposed from a second surface S2 of the body 2100 and is connected to a second external electrode 600.
[0114] The remaining components other than those described above are the same as those of the coil electronic component shown in FIG. 1, so a duplicated description thereof will be omitted.
[0115] Although the embodiment of the present invention has been described above, the present invention is not limited thereto, and can be embodied in various modified forms within the scope of the claims, the description of the invention, and the accompanying drawings, which of course also fall within the scope of the present invention. [Explanation of symbols]
[0116] 1000, 2000, 3000: Coil electronic parts 100, 1100, 2100: Main unit 200, 1200, 2200: Coil 210: First coil pattern 220: Second coil pattern 230:Beer 213, 1213, 2213: 1st drawer 223, 1223, 2223: 2nd drawer 300: Support substrate 500: 1st external electrode 501, 601: First metal layer 502, 602: Second metal layer 503, 603: Third metal layer 510: First electrode pad 520: 1st connection part 600: 2nd external electrode 610: Second electrode pad 620:Second connection part 710: First insulating layer 720: Second insulating layer 730: 3rd insulating layer 740: 4th insulating layer 750: 5th insulating layer 910: First pad area 920: Second pad area 930: First recess 940: Second recess 1210: First coil 1220: Second coil 1230: Winding section 2210: Coil pattern IF: Insulating film
Claims
1. a magnetic body having a first surface and a second surface facing a first direction, a third surface and a fourth surface facing a second direction and connecting the first surface and the second surface, and a fifth surface and a sixth surface facing the third direction and connecting the first surface and the second surface; a coil at least a portion of which is embedded in the magnetic material; a first external electrode extending from the sixth surface of the magnetic body to a portion of the first surface and connected to the coil; a second external electrode extending from the sixth surface of the magnetic body to a portion of the second surface and connected to the coil; a first insulating layer covering the first external electrode on the first surface of the magnetic body; and a second insulating layer covering the second external electrode on the second surface of the magnetic body; Including, coil electronic components.
2. a third insulating layer surrounding side edges of the third surface, the fourth surface, and the fifth surface of the first external electrode on the first surface of the magnetic body; and a fourth insulating layer surrounding side edges of the third surface, the fourth surface, and the fifth surface of the second external electrode on the second surface of the magnetic body; The coil electronics of claim 1 further comprising:
3. the first insulating layer covers at least a portion of the third insulating layer; The coil electronics of claim 2 , wherein the second insulating layer covers at least a portion of the fourth insulating layer.
4. the first external electrode includes a first electrode pad disposed on the sixth surface of the magnetic body and a first connection part disposed on the first surface of the magnetic body; The coil electronic component according to claim 1 , wherein the second external electrode includes a second electrode pad disposed on the sixth surface of the magnetic body and a second connecting portion disposed on the second surface of the magnetic body.
5. the first electrode pad and the first connecting portion are an integral structure, The coil electronic component according to claim 4 , wherein the second electrode pad and the second connecting portion are an integral structure.
6. the first connection portion is spaced apart from the fifth surface of the magnetic body; The coil electronic component according to claim 4 , wherein the second connecting portion is spaced apart from the fifth surface of the magnetic body.
7. the first connecting portion is spaced apart from the third surface and the fourth surface of the magnetic body, The coil electronic component according to claim 6 , wherein the second connecting portion is spaced apart from the third surface and the fourth surface of the magnetic body.
8. The coil electronic component according to claim 1 , wherein the coil is a wire-wound coil.
9. a support substrate disposed within the magnetic body and including a first support surface and a second support surface facing each other; 2. The coil electronic component according to claim 1, wherein the coil includes a first coil pattern disposed on the first support surface of the support substrate, a second coil pattern disposed on the second support surface of the support substrate, and a via connecting the first coil pattern and the second coil pattern.
10. the magnetic body is a laminate in which a plurality of sheets are laminated, The coil electronic component of claim 1 , wherein the coil comprises a plurality of coil patterns disposed on each of the plurality of sheets and connected to each other.
11. The coil electronic component according to claim 1 , further comprising a fifth insulating layer disposed on the sixth surface of the magnetic body between the first external electrode and the second external electrode.
12. The coil electronics component according to claim 11 , wherein the fifth insulating layer is also disposed on the third surface, the fourth surface and the fifth surface of the magnetic body.