Method for manufacturing connection structure, connection structure, film structure, and method for manufacturing film structure

Abstract

To provide a method for manufacturing a connection structure, a connection structure, a film structure, and a method for manufacturing a film structure, which enable mounting of an electronic component having multiple terminal rows on its mounting surface using existing equipment.SOLUTION: A film structure includes a tape-shaped base material 21 and a connecting film formed on the base material 21, and has a unit area of a predetermined length in the longitudinal direction of the base material 21 and a predetermined width in the width direction of the base material 21 in a planar view, and has a non-attached portion in the unit area where a portion of the connecting film has been removed.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present technology relates to a method for manufacturing a connection structure in which electronic components are connected, a connection structure, a film structure, and a method for manufacturing the film structure. [Background technology]

[0002] Conventionally, ACF (Anisotropic Conductive Film), NCF (Non Conductive Film), and the like are known as connection films for connecting various electronic components, and camera modules and the like are mounted using connection films (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2015-130426 A Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, electronic components that have a recess in the center of the mounting surface have become known. For example, in a camera module, the center of a ceramic substrate is hollowed out to accommodate an image sensor, a recess is formed in the center of the mounting surface, and a terminal row is formed on the periphery of the mounting surface. In addition, electronic components that have multiple terminal rows on the mounting surface and electronic components whose mounting surface consists of multiple protrusions and have terminal rows on the protrusions are also considered to be similar to those that have a recess.

[0005] When mounting such electronic components having multiple terminal rows on the mounting surface using a connection film, significant improvements to the mounting equipment are required. For example, when attaching a connection film to each of the multiple terminal rows on the mounting surface, the connection film needs to be attached multiple times. In addition, when mounting an electronic component having a recess in the center of the mounting surface by attaching a connection film to the entire mounting surface, there is a concern that the recess will fill with gas, reducing the reliability of the connection.

[0006] The present technology has been proposed in consideration of the conventional situation, and provides a method for manufacturing a connection structure that can mount an electronic component having multiple terminal rows on its mounting surface using existing equipment, as well as a connection structure, a film structure, and a method for manufacturing the film structure. [Means for solving the problem]

[0007] The film structure according to the present technology comprises a tape-like substrate and a connecting film formed on the substrate, and has a unit area of ​​a predetermined length in the longitudinal direction of the substrate and a predetermined width in the width direction of the substrate in a plan view, and has a non-attached portion in the unit area in a shape in which a portion of the connecting film has been removed.

[0008] The manufacturing method of the film structure according to the present technology includes a processing step of processing a film roll having a tape-like substrate and a connecting film formed on the substrate, and in the processing step, the film roll is slit, half-cut, punched, or punch press processed to form a film structure having a unit area of ​​a predetermined length in the longitudinal direction of the substrate and a predetermined width in the width direction of the substrate in a plan view, and having a non-attached portion in the unit area where a part of the connecting film has been removed.

[0009] The connection structure according to the present technology includes a first electronic component having a plurality of terminal rows, a second electronic component, and a cured film in which the connection film of the above-mentioned film structure is cured between the first electronic component and the second electronic component, connecting the terminals of the first electronic component and the terminals of the second electronic component.

[0010] The manufacturing method of the connection structure according to the present technology includes an attachment step of attaching a connection film from the above-mentioned film structure to a first electronic component or a second electronic component having a plurality of terminal rows, and a connection step of connecting terminals of the first electronic component and terminals of the second electronic component via the connection film. Effect of the Invention

[0011] According to the present technology, it is possible to mount an electronic component having a plurality of terminal rows on a mounting surface using existing mounting equipment. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a plan view showing a mounting surface of a camera module. [Diagram 2] FIG. 2 is a cross-sectional view taken along line II-II shown in FIG. [Diagram 3] FIG. 3 is a plan view showing a unit area of ​​a film structure. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV shown in FIG. [Diagram 5] FIG. 5 is a cross-sectional view showing a bonding step of bonding the connection film to the camera module. [Figure 6] FIG. 6 is a cross-sectional view showing a state in which the substrate has been peeled off from the connection film in the bonding step. [Figure 7] FIG. 7 is a cross-sectional view showing a mounting process for mounting a flexible substrate on a camera module. [Figure 8] FIG. 8 is a cross-sectional view showing a connection process for connecting a terminal of a camera module and a terminal of a flexible substrate via a connection film. [Figure 9] FIG. 9 is a cross-sectional view showing a connection structure on which a camera module is mounted. [Figure 10] FIG. 10 is a cross-sectional view showing a configuration example of a connection structure on which a camera module is mounted. [Figure 11] FIG. 11 is a perspective view showing a film roll. [Figure 12] FIG. 12 is a plan view showing a film structure of the first modified example. [Figure 13] FIG. 13 is a plan view showing a film structure according to the second modification. [Figure 14] FIG. 14 is a plan view showing a film structure of the third modified example. [Figure 15] FIG. 15 is a plan view showing a film structure according to the fourth modification. [Figure 16] FIG. 16 is a plan view showing a mounting surface of another example of the camera module. [Figure 17] FIG. 17 is a plan view showing a first example of a film structure corresponding to the mounting surface shown in FIG. [Figure 18] FIG. 18 is a plan view showing a second example of a film structure corresponding to the mounting surface shown in FIG. [Figure 19] FIG. 19 is a plan view showing a third example of a film structure corresponding to the mounting surface shown in FIG. [Figure 20] FIG. 20 is a plan view showing an example of a mounting surface of a camera module according to another embodiment. [Figure 21] FIG. 21 is a plan view showing an example of a connection film corresponding to the mounting surface of the camera module shown in FIG. [Figure 22] FIG. 22 is a perspective view showing an example of a tape-shaped film structure around which the connecting film shown in FIG. 21 is wound. [Diagram 23] FIG. 23 is a cross-sectional view in the width direction including the non-attached portion of the film structure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings in the following order. 1. Manufacturing method of connection structure 2. Connection structure 3.Film structure 4. Manufacturing method of film structure 5. Variations 6. Working Example

[0014] <1. Method for manufacturing connection structure> The method for manufacturing a connection structure according to the present embodiment includes a bonding step of bonding a connection film having a unit area of ​​a predetermined length in the length direction of the base material and a predetermined width in the width direction of the base material from a film structure including a tape-like base material and a connection film formed on the base material to a first electronic component or a second electronic component having a plurality of terminal rows, and a connection step of connecting the terminals of the first electronic component and the terminals of the second electronic component through the connection film, and the film structure has non-bonded portions to which the connection film is not bonded other than the portions corresponding to the plurality of terminal rows in the unit area. This allows an electronic component having a plurality of terminal rows to be mounted on the mounting surface using existing mounting equipment. In addition, in the bonding step, the connection film can be bonded all at once without bonding the connection film multiple times corresponding to the plurality of terminal rows.

[0015] Here, the term "unit area" refers to an area having a predetermined length in the longitudinal direction of the base material, e.g., a rectangular area, and the term "non-attached portion" refers to an area in the unit area where the connection film is not attached to the electronic component, e.g., a gap where no connection film exists, a connection film that is not attached due to cutting, etc.

[0016] Examples of the first electronic component include a mounting surface that is made up of multiple protrusions and has a terminal row on the protrusions, a flat mounting surface that has multiple terminal rows, and a mounting surface that has a recess in the center and a terminal row formed on the periphery of the mounting surface. The first electronic component that has a recess in the center of the mounting surface has, for example, a rectangular mounting surface, and the mounting surface has terminal rows on two opposing sides of the periphery of the recess, two adjacent sides (L-shaped), or three sides of the periphery of the recess (U-shaped, U-shaped, C-shaped). The terminal row may be located on the entire periphery. The periphery of the recess and the terminal row may be configured only parallel or vertical, but are not limited to this and are appropriately adjusted depending on the object. Therefore, the shape of the unit area of ​​the connection film is also appropriately adjusted accordingly.

[0017] The outer shape of the mounting surface is not limited to a rectangular shape, and may be, for example, a curved shape, a circular shape, a polygonal shape, or the like. The outer shape of the mounting surface may be configured with sides as described above, or may be a shape with the interior removed (extracted). The shape of the mounting component having the mounting surface may or may not be the same as the mounting surface. This may be either one of the first electronic component and the second electronic component, or both (not shown).

[0018] When the first electronic component has a recess in the center of the mounting surface, the film structure preferably has a non-attached portion extending from the periphery of the unit area toward the center of the unit area, thereby preventing the recess from filling with gas and reducing the reliability of the connection.

[0019] When the unit area of ​​the film structure is rectangular, it is preferable that the non-attached portion is formed from the center of at least one side of the unit area toward the center of the unit area, which allows a first electronic component having a mounting surface with a terminal row formed on three sides (U-shaped) of the periphery of the recess to be mounted.

[0020] In addition, when the unit area of ​​the film structure is rectangular, it is preferable that the non-attached portion is formed in the unit area from the center in the width direction of the base material to the length direction of the base material, whereby a first electronic component having a mounting surface with a terminal row formed on two opposing sides of the periphery of the recess can be mounted.

[0021] In addition, in the unit area of ​​the film structure, the connection film may be processed linearly to form a polygonal shape such as a hexagon, octagon, or dodecagon, a U-shape, or a curved U-shape, C-shape, or a cylindrical attachment part. The attachment part of the connection film may be a shape in which straight lines and curves are mixed. The polygonal shape may be a regular polygon. The corners of these shapes may be chamfered. The attachment part of the connection film may be a shape in which a part is missing. For example, a rectangular corner may be missing, and the attachment part of the connection film may be a cross or a similar shape. For example, when the unit area of ​​the film structure is rectangular, the corners of the rectangular connection film may be chamfered in a straight line to form a non-attached part, and the attachment part may be an octagon. An octagon can be formed by linearly chamfering each corner of a square or rectangular connection film, and a cross can be formed by missing a corner of a square or rectangular connection film. This allows the connection film to be mounted in an octagonal or cross shape. The chamfering and cutting are not limited to straight lines, but may be curved lines, or a mixture of straight lines and curved lines. The octagonal or cross-shaped connection film is an example, and only a portion of the film may be chamfered or cut. The connection film may have a shape in which a portion of the surface is removed (punched out). The shape of the connection film is not limited to straight lines, but may be curved lines or a mixture of straight lines and curved lines. In this case, as a film structure, only the connection film may be removed, or the connection film and the base material may be removed. This makes it possible to prevent the resin from protruding from the mounting surface, particularly at the corners, from reaching the side of the mounting component so as to occupy a large area. In addition, when assembling the component together with other components, unnecessary contact of the resin with the other components is easily avoided, which contributes to preventing contamination. The more precise and small the component, the more preferable the shape is to be chamfered or cut out (punched out).

[0022] In the film structure, at least a part of the attachment part in the unit area is preferably the same shape as the shape of the mounting surface of the first electronic component or the second electronic component. That is, the attachment part of the connection film may be, for example, a rectangular shape, a curved shape, a circular shape, a polygonal shape, or the like, in accordance with the shape of the mounting surface, or may be a U-shape, a U-shape, a C-shape, or the like, in which a part of these shapes is missing. The attachment part of the connection film may also be a hollowed-out shape in which a part of the surface is removed. By matching the shape of the attachment part of the connection film to the outer shape of the mounting surface, it is possible to prevent a part of the connection film from excessively protruding from the mounting surface, which makes it easier to handle the electronic component to be mounted, improves workability, prevents interference with the previous and subsequent processes, and ultimately reduces the overall manufacturing cost. For example, in the process of attaching the connection film to the board (temporary attachment), the outer shapes of the board and the connection film are similar, so that the effect of increasing workability can be expected.

[0023] In addition, the size of the outer periphery of the attachment portion in the unit area of ​​the film structure may be smaller, the same as, or larger than the size of the outer periphery of the mounting surface of the first electronic component or the second electronic component. In consideration of suppressing excessive protrusion of the adhesive film, the lower limit of the size of the outer periphery of the attachment portion with respect to the size of the outer periphery of the mounting surface is preferably 50% or more, more preferably 80% or more. In addition, the upper limit of the size of the outer periphery of the mounting surface is preferably 110% or less, more preferably 105% or less, and more preferably 100% or less, because if it is too small, it is desirable to have a margin for stable attachment when mounting is performed continuously. These require that the connection film be present so as to sufficiently cover the terminals on the mounting surface, and can be appropriately adjusted depending on the width and shape of the mounting surface. In addition, the size of the attachment portion may be adjusted taking into account the effective connection area and the influence of protrusion. It is preferable that the shape of the outer edge of the attachment portion and the mounting surface of the first electronic component or the second electronic component are the same or similar, but even if there are some differences, this does not exclude the scope of the present technology.

[0024] In addition, the film structure preferably has a non-attached portion in the center in the unit area. This corresponds to the connection film having an attachment portion in the shape of the letter U, the letter C, or the like described above. The non-attached portion may have a hollowed-out shape in which a part of the surface is removed. That is, in the unit area of ​​the film structure, the attachment portion has an outer peripheral edge and an inner peripheral edge. The attachment portion of the connection film is required to have a sufficient effective connection area between the outer peripheral edge and the inner peripheral edge. This prevents unnecessary and excessive protrusion of the connection film and prevents gas from filling up when an electronic component having a recess is mounted on the mounting surface. The non-attached portion may be a slit or a hole. Furthermore, the shapes such as the letter U, the letter C, and the letter C do not necessarily need to be connected. In this way, since the film structure may be composed of sides, all the sides forming the outer shape may be connected and may have a hollowed-out shape. The film structure may be formed by providing attachment portions on the substrate at intervals corresponding to the sides constituting these shapes. In the process of temporarily attaching the connecting film and the process of connecting, if they are performed all at once, workability will be improved, and if they are performed side by side, the amount of equipment modification required will be reduced, and introduction costs can be reduced. In addition, since the connecting film (attachment part) on such sides is placed on the base material, only one film roll will be pulled out, and it is expected that relatively little modification of the existing manufacturing equipment will be required. The same effect can be expected even if all the sides that form the outer shape are connected and have a hollowed-out shape. Appropriate selection can be made depending on conditions such as constraints on equipment modifications for temporary attachment and pressure bonding of the connecting film.

[0025] The first electronic component and the second electronic component are not particularly limited and can be appropriately selected depending on the purpose. Examples of the first electronic component include a ceramic substrate, a rigid substrate, a flexible substrate (FPC: Flexible Printed Circuits), a glass substrate, a plastic substrate, a resin multilayer substrate, an IC (Integrated Circuit) module, an IC chip, etc. Examples of the second electronic component include a ceramic substrate, a rigid substrate, a flexible substrate (FPC: Flexible Printed Circuits), a glass substrate, a plastic substrate, a resin multilayer substrate, etc.

[0026] In functional modules such as camera modules, ceramic substrates are sometimes used because of their excellent electrical and thermal insulation properties. Ceramic substrates are also used for miniaturization (for example, 1 cm 2 It has the advantages of excellent dimensional stability at low temperatures (see below).

[0027] The connecting film is not particularly limited, and examples thereof include a film-shaped anisotropic conductive film (ACF: Anisotropic Conductive Film) and a film-shaped adhesive film (NCF: Non Conductive Film). The curing type of the connecting film is not particularly limited, and examples thereof include a heat curing type, a light curing type, and a light and heat combined curing type. The connecting film may be a hot melt type using a thermoplastic resin. The connecting film according to the present technology is provided on a substrate (substrate film) and is separable from the release film. This is different from a connecting film that uses an adhesive or a curing resin integrally with the substrate (used without being separated). Therefore, a high level of processing technology is required for the connecting film.

[0028] This technology can be used in the manufacturing methods of any electronic device that uses electrical connections, such as semiconductor devices (including driver ICs, as well as optical elements, thermoelectric conversion elements, photoelectric conversion elements, and other devices that use semiconductors), display devices (monitors, televisions, head mounted displays, etc.), mobile devices (tablet devices, smartphones, wearable devices, etc.), game consoles, audio equipment, imaging devices (using image sensors such as camera modules), electrical mounting for vehicles (mobile devices), medical equipment, sensor devices (touch sensors, fingerprint authentication, iris authentication, etc.), and home appliances.

[0029] Hereinafter, a specific example of a method for manufacturing a connection structure for mounting a camera module will be described as an example. The method for manufacturing the connection structure shown as an example includes a bonding step of bonding a connection film to the camera module, a mounting step of mounting a flexible substrate on the camera module, and a connecting step of connecting a terminal of the camera module to a terminal of the flexible substrate via the connection film.

[0030] [Camera module] Fig. 1 is a plan view showing the mounting surface of the camera module, and Fig. 2 is a cross-sectional view taken along line II-II shown in Fig. 1. As shown in Figs. 1 and 2, the camera module 10 includes a ceramic substrate 11 having a recess (cavity) on its rectangular mounting surface, a first terminal row 12 and a second terminal row 13 formed on two opposing sides of the periphery of the recess on the rectangular mounting surface, and an image sensor 14 accommodated in the recess. In addition, the camera module 10 has a mounting surface of a predetermined width 12W on which the first terminal row 12 is formed and a mounting surface of a predetermined width 13W on which the second terminal row 13 is formed in the cross section taken along line II-II.

[0031] [Film structure] FIG. 3 is a plan view showing a unit area of ​​the film structure, and FIG. 4 is a cross-sectional view taken along the line IV-IV shown in FIG. 3. As shown in FIGS. 3 and 4, the film structure 20 includes a tape-shaped base material 21 and connection films 22 and 23 formed on the base material 21, and has a rectangular unit area having a predetermined length 21L in the length direction of the base material 21 and a predetermined width 21W in the width direction of the base material 21 in a plan view. The film structure 20 has a gap 24, which is a non-attached portion, extending from the center of the width direction of the base material 21 to the length direction of the base material 21 in the unit area. The gap 24 can be formed, for example, by punching an adhesive film from the center of the width direction of the base material 21 to the length direction of the base material 21. That is, in the film structure 20, the non-attached portions are formed in the unit area from the center of the width direction of the base material to the length direction of the base material, and a connecting film 22 of a predetermined width 22W and a connecting film 23 of a predetermined width 23W are formed at a distance in the length direction of the base material 21 corresponding to the first terminal row 12 and the second terminal row 13 of the ceramic substrate 11.

[0032] The width 22W of the connecting film 22 and the width 23W of the connecting film 23 may be narrower, the same as, or wider than the width 12W of the mounting surface of the first terminal row 12 and the width 13W of the mounting surface of the second terminal row 13, respectively.

[0033] When the width of the connection film is narrower than the width of the mounting surface of the terminal row, it is possible to suppress excessive overflow of the resin of the connection film from the film connection body. Therefore, it is possible to prevent the resin that overflows excessively from contacting the camera module or other mounted components, and it is possible to improve the workability of assembly. In addition, it is effective when it is preferable to avoid contamination of the mounted components. When the width of the connection film is wider than the width of the mounting surface of the terminal row, it is possible to ensure a sufficient amount of resin for the connection part, so that it is possible to improve the peel strength (connection strength) of the connection object. It is effective when it is desired to ensure sufficient connection strength for the connection structure. When the width of the connection film is the same as the width of the mounting surface of the terminal row, it is possible to combine the above two advantages. The width of the connection film and the width of the mounting surface of the terminal row may be appropriately adjusted according to the specifications required for the mounting part.

[0034] From the viewpoint of the conductive property and adhesive property of the connection structure, the lower limit of the width 22W of the connection film 22 and the width 23W of the connection film 23 are preferably 80% or more, more preferably 100% or more, and even more preferably 120% or more of the width 12W of the mounting surface of the first terminal row 12 and the width 13W of the mounting surface of the second terminal row 13, respectively. From the viewpoint of shape processing, if the width is too narrow, the difficulty increases, so as an example, the width is 0.3 mm or more, preferably 0.4 mm or more, and even more preferably 0.5 mm or more. Moreover, the upper limit of the width 22W of the connection film 22 and the width 23W of the connection film 23 are preferably 280% or less, more preferably 240% or less of the width 12W of the mounting surface of the first terminal row 12 and the width 13W of the mounting surface of the second terminal row 13, respectively.

[0035] Moreover, the lower limit of the width 24W of the gap 24 is 5% or more, preferably 10% or more, more preferably 20% or more, with respect to the width 21W of the base material 21, and the upper limit of the width 24W of the gap 24 is 80% or less, preferably 75% or less, more preferably 60% or less, with respect to the width 21W of the base material 21. If the width 24W of the gap 24 is too small, there is a concern that the recess will be sealed by the resin flow, and if the width 24W of the gap 24 is too large, there is a concern that the width of the connection film will be narrowed, so that the connection film will peel off from the base material, and in some cases, the adhesive strength of the connection body will not be satisfactory. As a specific example, the width 24W of the gap 24 is preferably 1.0 mm or more, and more preferably 1.2 mm or more. This makes it possible to prevent the recess from being filled with gas and reducing reliability, and to obtain high adhesive strength. In addition, the amount of connection film used is reduced, which is preferable from the viewpoint of environmental characteristics. Using the removed gap portion not only improves environmental characteristics, but also reduces material costs, improving economic efficiency. In addition, for example, the removed void portion can be stored for verification purposes.

[0036] [Attachment process] Fig. 5 is a cross-sectional view showing a bonding step of bonding a connection film to a camera module, and Fig. 6 is a cross-sectional view showing a state in which the substrate is peeled off from the connection film in the bonding step. As shown in Figs. 5 and 6, in the bonding step, the connection films 22, 23 of the unit areas of the film structure 20 are transferred to the camera module 10. For example, a bonding device is used to press the substrate side of the film structure, and the connection films 22, 23 of the unit areas are bonded together to the mounting surface of the camera module 10 on the stage. The film structure to which the connection films 22, 23 have been transferred is wound up as only the substrate.

[0037] [Mounting process] Fig. 7 is a cross-sectional view showing a mounting process for mounting a flexible substrate on a camera module. As shown in Fig. 7, the flexible substrate 30 has a first terminal row 32 and a second terminal row 33 on a base material 31, corresponding to the first terminal row 12 and the second terminal row 13 of the camera module 10. In the mounting process, the first terminal row 32 and the second terminal row 33 of the flexible substrate 30 are aligned with the first terminal row 12 and the second terminal row 13 of the camera module 10, and the flexible substrate 30 is mounted on the camera module 10.

[0038] [Connection process] Fig. 8 is a cross-sectional view showing a connection step of connecting the terminals of the camera module and the terminals of the flexible substrate via a connection film. As shown in Fig. 8, in the connection step, for example, a pressure bonding tool 42 is used to press the first terminal row 12 of the camera module 10 and the first terminal row 32 of the flexible substrate 31 via a cushioning material 41, and a pressure bonding tool 43 is used to press the second terminal row 13 of the camera module 10 and the second terminal row 33 of the flexible substrate 30. In addition, the connection film is cured by heating, irradiating light, or the like, depending on the curing type of the connection film.

[0039] Fig. 9 is a cross-sectional view showing a connection structure in which a camera module is mounted. As shown in Fig. 9, the connection structure in which a camera module 10 is mounted is configured such that a first terminal row 12 of the camera module 10 and a first terminal row 32 of a flexible substrate 30 are connected by a cured film 22A formed by curing a connection film 22. Also, a second terminal row 13 of the camera module 10 and a second terminal row 33 of a flexible substrate 30 are connected by a cured film 23A formed by curing a connection film 23. In the case of a hot-melt type connection film, the cured film 23 is a cured film connected by a hot-melt type connection film.

[0040] According to this method of manufacturing a connection structure, the film structure has a non-attached portion extending from the periphery of the unit area to the center of the unit area when viewed in a plane, so that an electronic component having a recess in the center of the mounting surface can be mounted using existing equipment, and the recess can be prevented from filling with gas, which would otherwise reduce reliability.

[0041] <2. Connection structure> The connection structure according to the present embodiment includes a first electronic component having a recess in the center of a mounting surface, a second electronic component, and a cured film formed by curing a connection film having a non-attached portion from a peripheral portion of a unit area having a predetermined length and a predetermined width in a plan view to the center of the unit area between the first electronic component and the second electronic component, and a terminal of the first electronic component and a terminal of the second electronic component are connected to each other. This makes it possible to prevent the recess from being filled with gas, which would otherwise reduce reliability.

[0042] As described above, the first electronic component and the second electronic component are not particularly limited and can be appropriately selected depending on the purpose. In addition, the connection film and the curing type of the connection film are also not particularly limited and can be appropriately selected depending on the purpose.

[0043] Hereinafter, a connection structure on which a camera module is mounted will be described as a specific example. FIG. 10 is a cross-sectional view showing a configuration example of a connection structure on which a camera module is mounted. The same components as those shown in FIGS. 1 to 9 are given the same reference numerals, and the description will be omitted. As shown in FIG. 10, the connection structure includes a camera module 10 having a first terminal row 12 and a second terminal row 13, a flexible substrate 30 having a first terminal row 32 and a second terminal row 33, a cured film 22A obtained by curing the connection film 22 between the first terminal row 12 and the first terminal row 32, and a cured film 23A obtained by curing the connection film 23 between the second terminal row 13 and the second terminal row 33. The connection structure also includes a protective glass 15 fixed on the ceramic substrate 11, and a lens 16 disposed on the image sensor 14 and installed in the housing. In addition, a camera module driving IC 17 may be mounted on the flexible substrate 30 in addition to the camera module mounting portion.

[0044] According to the connection structure having such a configuration, it is difficult to optically shorten the distance T2 between the image sensor 14 and the lens 16, but the distance T1 between the lens 16 and the flexible substrate 30 can be shortened, and the connection structure can be made thinner. In addition, in the rectangular mounting surface of the connection structure, two opposing sides of the periphery of the recess of the ceramic substrate 11 are fixed with the hardened film 22A and the hardened film 23A, and a part of the other two sides is not fixed. Therefore, it is possible to prevent the recess of the ceramic substrate 11 from being blocked by the base material 31 of the flexible substrate 30, and the flexible substrate 30 from expanding due to the influence of the gas.

[0045] <3. Film structure> The film structure according to the present embodiment includes a tape-shaped substrate and a connection film formed on the substrate, and has a unit area of ​​a predetermined length in the longitudinal direction of the substrate in a plan view, and has a non-attached area from the periphery of the unit area to the center of the unit area. The film structure can be in the form of a film roll wound around a core.

[0046] FIG. 11 is a perspective view showing a film winding body. As shown in FIG. 11, the film winding body is formed by winding a film structure including a tape-shaped base material 21 and connection films 22 and 23 formed on the base material 21 around a winding core 25. The winding core 25 has an axial hole into which a rotating shaft for rotating the reel is inserted, and connects one end of the film structure in the longitudinal direction to wind the film structure. The length of the film structure wound around the film winding body is not particularly limited, but the lower limit of the length is 5 m or more, 10 m or more, or 50 m or more, and the upper limit of the length is 5000 m or less, 3000 m or less, or 1000 m or less can be suitably used.

[0047] The substrate 21 is a support film formed into a tape shape and supporting the connection films 22 and 24. Examples of the substrate 21 include PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), and PTFE (Polytetrafluoroethylene). In addition, the substrate 21 may be one in which at least the surface on the connection films 22 and 23 side is subjected to a release treatment using, for example, a silicone resin.

[0048] The thickness of the substrate is not particularly limited. The lower limit of the substrate thickness is preferably 10 μm or more in terms of separation, more preferably 25 μm or more, and even more preferably 38 μm or more. The upper limit of the substrate thickness is preferably 200 μm or less, more preferably 100 μm or less, and even more preferably 75 μm or less, because if the substrate is too thick, there is a concern that excessive pressure will be applied to the connection film. It may be 50 μm or less. In addition, since the present technology assumes that the substrate and the connection film are separable, it is not preferable for the unit area to be too small, as this will cause unnecessary separation. In addition, it is also not preferable for the void portion to be too large for the same reason.

[0049] The width of the substrate is not particularly limited. The lower limit of the width of the substrate is preferably 1 mm or more in terms of winding, more preferably 2 mm or more, and even more preferably 4 mm or more. The upper limit of the width of the substrate may be 250 mm or less, preferably 120 mm or less, more preferably 60 mm or less, and even more preferably 10 mm or less, because if the width is too large, it may be difficult to carry or handle. The width of the substrate may be appropriately adjusted based on the size of the unit area and the void. From the viewpoint of productivity, it is preferable that a part of the connection film contacts the end of the width of the substrate film.

[0050] As described above, the connection film and the curing type of the connection film are not particularly limited and can be appropriately selected according to the purpose. As described above, the curing type may be replaced with a hot melt type.

[0051] Hereinafter, an anisotropic conductive film containing conductive particles in an insulating binder will be described as an example. The lower limit of the thickness of the anisotropic conductive film may be, for example, the same as the conductive particle diameter, and preferably 1.3 times or more the conductive particle diameter or 10 μm or more. The upper limit of the thickness of the anisotropic conductive film may be, for example, 40 μm or less or 2 times or less the conductive particle diameter. The anisotropic conductive film may be laminated with an adhesive layer or a pressure-sensitive adhesive layer that does not contain conductive particles, and the number of layers and the lamination surface can be appropriately selected according to the target or purpose. The insulating resin of the adhesive layer or the pressure-sensitive adhesive layer can be the same as that of the anisotropic conductive film. The conductive particles may be dispersed or arranged in the resin. When the conductive particles are dispersed in the resin, they may be individually separated without contact. The anisotropic conductive film preferably contains conductive particles so that the number of conductive particles captured per terminal is preferably 5 or more, more preferably 10 or more.

[0052] The conductive particles may be appropriately selected from those used in known anisotropic conductive films. For example, metal particles such as nickel, copper, silver, gold, and palladium, and metal-coated resin particles in which the surface of resin particles such as polyamide and polybenzoguanamine is coated with a metal such as nickel, may be mentioned. The surface may be insulated to the extent that the conductive performance is not impaired. The surface may also have protrusions.

[0053] The particle diameter of the conductive particles is not particularly limited, but the lower limit of the particle diameter is preferably 2 μm or more, and the upper limit of the particle diameter is preferably 50 μm or less, more preferably 20 μm or less, from the viewpoint of the capture efficiency of the conductive particles in the connection structure. The particle diameter of the conductive particles can be a value measured by an image type particle size distribution meter (for example, FPIA-3000: manufactured by Malvern Instruments). The number is preferably 1000 or more, preferably 2000 or more.

[0054] The insulating binder (insulating resin) may be a known insulating binder. Examples of the curing type include a heat curing type, a photocuring type, and a photothermal combined curing type. Examples of the curing type include a photoradical polymerization type resin composition containing a (meth)acrylate compound and a photoradical polymerization initiator, a thermal radical polymerization type resin composition containing a (meth)acrylate compound and a thermal radical polymerization initiator, a thermal cationic polymerization type resin composition containing an epoxy compound and a thermal cationic polymerization initiator, and a thermal anionic polymerization type resin composition containing an epoxy compound and a thermal anionic polymerization initiator. Also, a known adhesive composition may be used. In the case of a hot melt type, the composition of JP 2014-060025 A may be used.

[0055] Hereinafter, as a specific example, a thermal radical polymerization type insulating binder containing a film-forming resin, an elastomer, a (meth)acrylic monomer, a polymerization initiator, and a silane coupling agent will be described. Note that the (meth)acrylic monomer includes both an acrylic monomer and a methacrylic monomer.

[0056] The film-forming resin is not particularly limited, and examples thereof include phenoxy resin, unsaturated polyester resin, saturated polyester resin, urethane resin, butadiene resin, polyimide resin, polyamide resin, and polyolefin resin. The film-forming resin may be used alone or in combination of two or more. Among these, it is particularly preferable to use phenoxy resin from the viewpoints of film-forming property, processability, and connection reliability. The phenoxy resin is a resin synthesized from bisphenol A and epichlorohydrin, and may be appropriately synthesized or may be a commercially available product. The content of the film-forming resin is not particularly limited, and is preferably, for example, 10% by mass to 60% by mass.

[0057] The elastomer is not particularly limited, and examples thereof include polyurethane resin (polyurethane-based elastomer), acrylic rubber, silicone rubber, and butadiene rubber.

[0058] The (meth)acrylic monomer is not particularly limited, and may be, for example, a monofunctional (meth)acrylic monomer or a polyfunctional (meth)acrylic monomer having two or more functional groups. From the viewpoint of stress relaxation of the polymer, it is preferable that 80 mass % or more of the (meth)acrylic monomers in the insulating binder are monofunctional (meth)acrylic monomers.

[0059] From the viewpoint of adhesion, the monofunctional (meth)acrylic monomer preferably has a carboxylic acid. The molecular weight of the monofunctional (meth)acrylic monomer having a carboxylic acid is preferably 100 to 500, and more preferably 200 to 350. The content of the monofunctional (meth)acrylic monomer having a carboxylic acid in the insulating binder is preferably 3% by mass to 20% by mass, and more preferably 5% by mass to 10% by mass.

[0060] The polymerization initiator is not particularly limited as long as it can cure the (meth)acrylic monomer at a predetermined temperature during thermocompression bonding, and examples thereof include organic peroxides. Examples of organic peroxides include lauroyl peroxide, butyl peroxide, benzyl peroxide, dilauroyl peroxide, dibutyl peroxide, peroxydicarbonate, and benzoyl peroxide. These may be used alone or in combination of two or more. The content of the polymerization initiator in the insulating binder is not particularly limited, and is preferably, for example, 0.5% by mass to 15% by mass.

[0061] The silane coupling agent is not particularly limited, and examples thereof include epoxy-based silane coupling agents, acrylic-based silane coupling agents, thiol-based silane coupling agents, amine-based silane coupling agents, etc. The content of the silane coupling agent in the insulating binder is not particularly limited, and is preferably, for example, 0.1% by mass to 5.0% by mass.

[0062] <4. Method for producing film structure> The method for manufacturing the film structure includes a processing step of processing a film roll having a tape-like substrate and a connection film formed on the substrate, and in the processing step, a film structure is formed having a unit area of ​​a predetermined length in the length direction of the substrate and a predetermined width in the width direction of the substrate in a plan view, and a non-attached area from the periphery of the unit area to the center of the unit area. In the processing step, the film roll is slit, half-cut, punched, punched, or punched to form a connection film of a desired shape in the unit area. Also, only the connection film on the substrate film may be processed and removed. Furthermore, a step of providing a cover film on the connection film surface may be provided. Therefore, the above processing may be performed on the substrate and the connection film using the cover film as a support (substitute for the substrate). As described above, the substrate and the connection film are peeled off (separated) from the substrate when used, and therefore the processing technique is highly difficult. The material of the cover film may be the same as the substrate 21 described above. It is preferable that the thickness is thinner than the substrate 21.

[0063] For example, the film structure shown in FIG. 3 and FIG. 4 can be obtained by performing full cutting in the processing step so as to have a unit area of ​​a predetermined width in a plan view, and half cutting so as to have a non-attached portion from the periphery of the unit area to the center of the unit area. Specifically, the film raw roll can be obtained by full cutting at the width 21W of the unit area and half cutting at the width 24W that becomes the gap 24, and punching the connection film of the width 24W. Since the film structure is punched with the connection film, the resin of the connection film can move to the gap that is the non-attached portion, so that protrusion and blocking that occur when the film is reeled can be suppressed, and there is an advantage that the degree of freedom in the compounding design as the connection film is increased. In addition, if the film is wound after processing, the connection film and the processed portion may come into contact with each other, leaving traces of the processing on the connection film, which may be undesirable in appearance. In order to prevent this, a cover film may be provided.

[0064] The depth of the half cut is preferably 1% or more and 95% or less of the thickness of the substrate. When the half cut is deep, the resin of the protruding connection film enters the half cut portion when the film is reeled, so that protrusion and blocking can be suppressed. In addition, when the half cut is shallow, the connection film may not be penetrated, so the depth of the half cut is preferably 5% or more of the thickness of the substrate. This is also due to the thickness of the substrate, but in order to perform stable half cuts, it is more preferable that the depth is 10% or more. When the adhesive film has high viscosity, it is preferable to make it larger than 50% in order to obtain a reliable cut product, more preferably 55% or more, and even more preferably 60% or more. In addition, if the depth of the half cut is too deep, there is a risk that the substrate will be penetrated by minor vibrations or the like when the half cuts are performed continuously, so the depth of the half cut is preferably 90% or less of the thickness of the substrate, more preferably 80% or less, even more preferably 50% or less, and in some cases, it is preferable that the depth is 25% or less. This may be appropriately selected depending on the thickness of the substrate and the length of the film. Furthermore, such half-cutting makes it easier to remove the connection film from the base material, which is expected to improve the manufacturing productivity of the connection structure.

[0065] The processed film structure may be in a state where the connection film provided on one side is half-cut, or a part of the connection film may be removed so that the connection film is individually present on the substrate. From the viewpoint of manufacturing, it is preferable that the connection film is supported on the substrate, but the substrate may be removed by using a cover film as a support. The selection may be made taking into account the overall workability and economy from the manufacturing process of the film structure to the connection process in which it is used. Such a wide range of choices increases convenience.

[0066] <5. Modifications> 12 to 15 are plan views showing film structures of Modifications 1 to 4, respectively. As shown in Fig. 12, the film structure of Modification 1 has gaps 241, which are non-attached portions, formed in a unit region from the centers of two longitudinal sides of the base material to the entire width of the base material, and is compatible with an electronic component having a recess in the center of a rectangular mounting surface and terminal rows on two opposing peripheral sides of the recess.

[0067] Moreover, as shown in FIG. 13, the film structure of variant example 2 has a gap 242, which is a non-attached portion, formed in a unit area from the center of one side of the substrate in the longitudinal direction to a part of the substrate in the width direction, and has a recess in the center of the rectangular mounting surface and is capable of accommodating an electronic component having terminal rows on three sides around the recess.

[0068] Moreover, as shown in FIG. 14, the film structure of variant example 3 has gaps 243, 244, which are non-attached portions, formed in a unit area from the centers of two longitudinal sides of the substrate to a portion of the width of the substrate, and has a recess in the center of the rectangular mounting surface and is capable of accommodating an electronic component having terminal rows on two opposing sides around the periphery of the recess.

[0069] Such film structures of Modifications 1 to 3 can be formed, for example, by punching.

[0070] 15, the film structure of Modification 4 has gap 245, which is a non-attached portion, formed in a unit area from the center of one side of the substrate in the longitudinal direction to a part of the substrate in the width direction, and has a recess in the center of the rectangular mounting surface, and is capable of accommodating an electronic component having terminal rows on three sides around the recess. The film structure of Modification 4 is simple, for example, by punch press processing, in which neither substrate nor connection film is present in the non-attached portion, and the connection film can be half-cut to the length 21L of the unit area by an existing attachment device.

[0071] Fig. 16 is a plan view showing the mounting surface of a camera module. As shown in Fig. 16, a camera module 50 includes a ceramic substrate 51 having a recess (cavity) on a rectangular mounting surface, a first terminal row 52 and a second terminal row 53 formed on two opposing sides of the periphery of the recess on the rectangular mounting surface, a third terminal row 54 formed on one of two sides not in contact with the two sides on which the first terminal row 52 and the second terminal row 53 are formed, and an image sensor 55 accommodated in the recess. The mounting surface of this camera module 50 is rectangular, has a recess in the center, and has terminal rows on three sides (U-shaped) of the periphery of the recess.

[0072] FIG. 17 is a plan view showing a first example of a film structure corresponding to the mounting surface shown in FIG. 16. In the film structure shown in FIG. 17, the peripheral shape of the attachment portion in the unit regions 21L and 21W is octagonal. As a result, in mounting an electronic component having a rectangular mounting surface, excessive overflow of the resin after pressing can be suppressed compared to when the peripheral shape of the attachment portion is rectangular, and the side surface of the electronic component can be prevented from being contaminated. In addition, the amount of connection film used can be reduced by chamfering the corners of the rectangular attachment portion with straight lines to form an octagonal attachment portion. In addition, a non-attached portion may be provided in the center of the octagonal attachment portion. This can prevent the recess of the camera module 50 from being sealed.

[0073] FIG. 18 is a plan view showing a second example of a film structure corresponding to the mounting surface shown in FIG. 16. In the film structure shown in FIG. 18, a gap 246, which is a non-attached portion, is formed from the center of one side in the length direction of the base material to a part in the width direction of the base material in the octagonal attachment portion of the film structure shown in FIG. 17. This makes it possible to prevent the recess of the camera module 50 from being sealed when mounting an electronic component having the mounting surface shown in FIG. 16, and to reduce the amount of connection film used. In addition, since the outer shape of the mounting surface and the outer shape of the film structure match in the necessary parts, it is possible to suppress excessive overflow of unnecessary resin after bonding of the connection film.

[0074] Fig. 19 is a plan view showing a third example of a film structure corresponding to the mounting surface shown in Fig. 16. In the film structure shown in Fig. 19, the peripheral shape of the attachment portion in unit areas 21L and 21W is U-shaped corresponding to the mounting surface shown in Fig. 16. This is a case where the corners of the rectangular attachment portion are curved, and a gap 247, which is a non-attachment portion, is formed from the center of one side in the length direction of the base material to a part in the width direction of the base material, and the corners are curved and chamfered to form a U-shaped attachment portion. By having a curved shape in the attachment portion in this way, sharp parts are reduced, and it is possible to prevent the connection film from turning over due to unnecessary contact.

[0075] The film structures shown as the first to third examples can be obtained, for example, by preparing a master equipped with a blade for cutting the base film (e.g., polyethylene terephthalate) as the substrate and a half-cut blade for cutting the connection film into various shapes and entering about half the thickness of the substrate, and then using this master to punch out the film roll and remove the non-attached parts. The master may also have joints. In this case, there may be some parts in the longitudinal direction of the film structure where the intervals between the attached parts of the connection film differ, but this is advantageous in terms of production management, such as counting.

[0076] A method for manufacturing a connection structure according to another embodiment includes a step of attaching a connection film having a unit area of ​​a predetermined length in the length direction of the base material and a predetermined width in the width direction of the base material from a film structure including a tape-like base material, a connection film formed on the base material, and a cover film attached to the connection film to a substrate component having an element and a plurality of electrodes formed around the element, or an electronic component having electrodes corresponding to the electrodes of the substrate component, and a step of connecting the electrodes of the substrate component and the electrodes of the electronic component through the connection film, and the film structure has a non-attached portion made of the cover film at a location corresponding to the element in the unit area. By making the non-attached portion made of the cover film, when the film structure is wound around a winding core to form a wound body, it is possible to prevent the adhesive film from coming into contact with the substrate processed in the resin, and the shape of the substrate being reflected, thereby deteriorating the appearance. In addition, it is also possible to suppress excessive overflow of the resin into the gap.

[0077] The cover film may be made of, like the substrate, PET, OPP, PMP, PTFE, etc. The thickness of the cover film is preferably thinner than that of the substrate, and is preferably 8 to 38 μm, and more preferably 12 to 25 μm.

[0078] In addition, in the attaching step, it is preferable to align the connection film before attaching it to the board component or electronic component, which can reliably prevent the adhesive film from adhering to the element.

[0079] In addition, the connection structure according to another embodiment includes a substrate part including an element and a plurality of electrodes formed around the element, an electronic component including electrodes corresponding to the electrodes of the substrate part, and a cured film formed by curing a connection film in which the element portion is a void in a unit area having a predetermined length and a predetermined width between the substrate part and the electronic component, and the electrodes of the substrate part and the electrodes of the electronic component are connected. By using a connection film in which the element portion is a void, it is possible to prevent the adhesive film from adhering to the element and the function of the element from being deteriorated. In addition, since the connection film can be temporarily attached to the substrate while avoiding the element, the work efficiency during the connection process is improved. Since such elements are often relatively expensive, it can be said that processing the connection film structure in advance is economical from a comprehensive viewpoint.

[0080] The substrate parts and electronic parts are not particularly limited and can be appropriately selected according to the purpose. Examples of the substrate parts include ceramic substrates, rigid substrates, flexible substrates (FPC: Flexible Printed Circuits), glass substrates, plastic substrates, resin multilayer substrates, IC (Integrated Circuit) modules, IC chips, etc. Examples of the electronic parts include ceramic substrates, rigid substrates, flexible substrates (FPC: Flexible Printed Circuits), glass substrates, plastic substrates, resin multilayer substrates, etc.

[0081] In addition, the substrate component may be, for example, one having a semiconductor element in the center of the mounting surface and an electrode formed on the periphery of the mounting surface. For example, in the case of a substrate component having a semiconductor element in the center of a rectangular mounting surface, there is one having electrodes on two opposing sides of the mounting surface, two adjacent sides (L-shaped), three sides of the periphery of the mounting surface (U-shaped, U-shaped, C-shaped), or four sides or all sides (in the case of a shape with pentagons or more). The connection film and the substrate may be perforated and hollowed out (the middle of the surface may be hollowed out). In addition, the outer shape of the mounting surface may be not only rectangular, but also, for example, a curved shape, a circular shape, a polygonal shape, etc. In particular, a camera module in which an image sensor is mounted in the center of a ceramic substrate is suitable as the substrate component from the viewpoint of excellent electrical insulation and thermal insulation.

[0082] Fig. 20 is a plan view showing an example of a mounting surface of a camera module according to another embodiment. As shown in Fig. 20, a camera module 60 includes a ceramic substrate 61, first electrodes 62A, 62B, 62C formed on two opposing sides of the periphery of an image sensor 65, second electrodes 63A, 63B, 63C, a third electrode 64 formed on one of two sides not in contact with the two sides on which the first electrodes 62A, 62B, 62C and the second electrodes 63A, 63B, 63C are formed, and an image sensor 65 mounted in the center of the ceramic substrate 61. That is, the camera module 60 has first to third electrodes on three sides (U-shaped) of the periphery of the rectangular image sensor 65. The mounting surface is not limited to that shown in Fig. 20, and the image sensor may have electrodes on all four sides of the periphery.

[0083] Fig. 21 is a plan view showing an example of a connecting film corresponding to the mounting surface of the camera module shown in Fig. 20. The connecting film 70 has an attachment portion 71 consisting of the four sides of the periphery of the image sensor 65, and a non-attachment portion 72 which is a gap portion where the portion corresponding to the image sensor 65 is cut out. Because the image sensor 65 portion is a gap portion, it is possible to prevent the connecting film 40 from adhering to the image sensor 65.

[0084] FIG. 22 is a perspective view showing an example of a tape-like film structure around which the connection film shown in FIG. 21 is wound, and FIG. 23 is a cross-sectional view in the width direction including the non-attached portion of the film structure. The film structure 80 includes a tape-like base material 81, a connection film 82 formed on the base material 81, and a cover film 83 attached to the connection film 82, and has a rectangular unit area having a predetermined length L in the length direction of the base material 81 and a predetermined width W in the width direction of the base material 81, and has a rectangular non-attached portion 84 made of the cover film 83 at the center of the unit area. By attaching the cover film 83, even if the resin of the connection film gets into the non-attached portion 84, the film structure can be easily pulled out from the wound body in which the film structure is wound. In addition, by attaching the cover film 83, the appearance of the connection film can be maintained.

[0085] In the film structure shown in FIG. 22, a hollow portion is formed by punching out the base material 81 and the connection film 82 for each rectangular unit area of ​​a predetermined length L and a predetermined width W. The cover film 83 in FIG. 22 is not perforated, and the base material 81 and the connection film 82 are perforated by punching. In this case, the connection film 82 may be half-cut or removed at every predetermined length L in accordance with the part to be used. If the cover film is used as a support, the base material 81 and the connection film 82 may be half-cut or removed at every predetermined length L in accordance with the part to be used. Also, the shape of FIG. 21 may be processed in advance and attached to the cover film.

[0086] The base material 81 and the cover film 83 are formed into a tape shape, and are supporting films that support the connection film 82. As in the above-described embodiment, the base material 81 and the cover film 83 may be, for example, PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), PTFE (Polytetrafluoroethylene), etc. In addition, the base material 81 and the cover film 83 may preferably be ones in which at least the surface on the connection film 82 side is subjected to a release treatment with, for example, a silicone resin.

[0087] As in the above-described embodiment, the connection film 81 is not particularly limited, and examples thereof include a film-shaped anisotropic conductive film (ACF: Anisotropic Conductive Film) and a film-shaped adhesive film (NCF: Non Conductive Film). The curing type of the connection film 81 is also not particularly limited, and examples thereof include a heat curing type, a photocuring type, and a photo-thermal combined curing type. The connection film 81 may also be a hot melt type using a thermoplastic resin.

[0088] The wound body is formed by winding the film structure around a core so that the cover film 83 is on the outside or inside. Such a film structure includes a processing step of processing a raw film having a tape-like base material and a connection film formed on the base material, and a bonding step of bonding a cover film to the processed raw film, and in the processing step, the base material and the connection film in the center of a unit area having a predetermined length in the longitudinal direction of the base material and a predetermined width in the lateral direction of the base material can be punched out. In addition, if necessary, the raw film can be fully cut to the predetermined width of the unit area, and these can be joined together and wound around a core.

[0089] In the processing step, the predetermined length and the predetermined width when punching out the base material and the connection film in the center of the unit area are, for example, 0.3 mm or more, preferably 0.4 mm or more, and more preferably 0.5 mm or more. If the size for punching out the base material and the connection film is small, the resin of the connection film may overflow into the punched part, and a non-attached part may not be formed.

[0090] In addition, in this technology, an adhesive film is attached to the corresponding locations of the terminal row and the electrodes, but conductive particles may be provided only to the corresponding locations of the terminal row and the electrodes. Examples of technologies for providing conductive particles only to the corresponding locations of the terminal row and the electrodes include JP 2016-119306 A and JP 2016-131152 A.

[0091] For example, a resin mold is formed in which recesses are arranged in a lattice pattern at positions corresponding to the terminal rows and electrodes, conductive particles are filled into the recesses of the resin mold, and the conductive particles are transferred from the resin mold to an insulating resin film, thereby obtaining a connection film in which conductive particles are arranged only at positions corresponding to the terminal rows and electrodes. The conductive particles in the connection film are preferably arranged so that the number of conductive particles captured by one terminal or electrode is, for example, 5 or more, and more preferably so that the number of conductive particles captured by one terminal or electrode is 10 or more. The arrangement of conductive particles can also be used as an alignment mark for the connection film. EXAMPLES

[0092] <6. Examples> EXAMPLES Examples of the present technology will be described below. In the examples, a connection structure was produced using an anisotropic conductive film, and the conductive characteristics were evaluated.

[0093] [Preparation of anisotropic conductive film] 5 parts by mass of resin core conductive particles (Ni (undercoat) / Au (surface) plating, resin core) with an average particle size of 20 μm and 95 parts by mass of insulating binder consisting of the following components were put into a planetary mixing device (product name: Awatori Rentaro, manufactured by THINKY Co., Ltd.) and stirred for 1 minute to prepare an anisotropic conductive adhesive composition. The anisotropic conductive adhesive composition was then applied onto a PET film with a thickness of 50 μm and dried in an oven at 80 ° C. for 5 minutes to form an adhesive layer consisting of the anisotropic conductive adhesive composition on the PET film, thereby preparing an anisotropic conductive film with a width of 6.0 mm and a thickness of 25 μm. The ratio of the conductive particles to the insulating binder was adjusted so that 5 or more particles were captured after connection.

[0094] The insulating binder was a mixed solution of ethyl acetate and toluene containing 47 parts by mass of phenoxy resin (product name: YP-50, manufactured by Shinnikka Epoxy Manufacturing Co., Ltd.), 3 parts by mass of monofunctional monomer (product name: M-5300, manufactured by Toagosei Co., Ltd.), 25 parts by mass of urethane resin (product name: UR-1400, manufactured by Toyobo Co., Ltd.), 15 parts by mass of rubber component (product name: SG80H, manufactured by Nagase ChemteX Corporation), 2 parts by mass of silane coupling agent (product name: A-187, manufactured by Momentive Performance Materials Japan), and 3 parts by mass of organic peroxide (product name: Niper BW, manufactured by NOF Corporation) so that the solid content was 50% by mass.

[0095] [Fabrication of connection structure] A camera module evaluation board (ceramic board, width 6.0 mm, width of the mounting surface of the terminal row 1.0 mm, 200 μm pitch, line:space=1:1, terminal thickness 10 μm, Ni (base) / Au (surface) plating, cavity structure, terminal rows on two opposing sides) and an FPC (polyimide film, 200 μm pitch, line:space=1:1, terminal thickness 12 μm, Ni (base) / Au (surface) plating) were thermocompression bonded to prepare a connection structure via anisotropic conductive film. Thermocompression bonding was performed by pressing a tool from the FPC side through a 200 μm thick silicone rubber under the conditions of temperature: 120°C, pressure: 1 MPa, and time: 6 sec. In practical use, it is desirable to obtain a number of captures of 5 or more for each terminal. When the indentation of the connection structure produced this time was observed with a microscope from the FPC side, it was confirmed that the number of conductive particles captured by the terminal was 5 or more.

[0096] [Evaluation of conduction characteristics] Using a digital multimeter (manufactured by Yokogawa Electric Corporation), the initial conduction resistance value of the connection structure was measured when a current of 1 mA was applied using the four-terminal method. In addition, the conduction resistance value of the connection structure was measured after a reliability evaluation test (12 h, 24 h) under conditions of a temperature of 121°C, humidity of 100%, and atmospheric pressure of 2 atm. The conduction characteristics were evaluated as "A" when the conduction resistance value after the reliability evaluation test was equal to the initial conduction resistance value (variation of 5% or less), and as "B" when the conduction resistance value after the reliability evaluation test increased from the initial conduction resistance value (variation of more than 5%). The conduction resistance values ​​of 20 samples of the connection structure were measured (N=20), and the sample with the highest conduction resistance value was used for evaluation.

[0097] [Evaluation of adhesion properties] The connection structure was subjected to a 90-degree peel test at a peel speed of 50 mm / min against an FPC, and the force required to peel was measured. The adhesive properties were evaluated with the peel strength of Comparative Example 1 set as 1. The peel strength of 20 samples of the connection structure was measured (N=20), and the sample with the lowest peel strength was used for evaluation.

[0098] <Experimental Example 1> A connection structure was fabricated by attaching a 6.0 mm wide anisotropic conductive film to a camera module evaluation board. Table 1 shows the evaluation of the electrical conductivity and adhesive properties of the connection structure.

[0099] <Example 1> 3 and 4, an anisotropic conductive film was produced by half-cutting a 50 μm-thick PET film to a depth of 20 μm (40% of the thickness of the substrate) so that the width 22W of the connection film 22 was 0.8 mm, the width 23W of the connection film 23 was 0.8 mm, and the width 24W of the gap 24 was 4.4 mm. Table 1 shows the evaluation of the conductive properties and adhesive properties of the connection structure.

[0100] <Example 2> 3 and 4, an anisotropic conductive film was produced in the same manner as in Example 1, except that the width 22W of the connecting film 22 was 1.2 mm, the width 23W of the connecting film 23 was 1.2 mm, and the width 24W of the gap 24 was 3.6 mm. Table 1 shows the evaluation of the conductive properties and the adhesive properties of the connecting structure.

[0101] <Example 3> 3 and 4, an anisotropic conductive film was produced in the same manner as in Example 1, except that the width 22W of the connecting film 22 was 2.4 mm, the width 23W of the connecting film 23 was 2.4 mm, and the width 24W of the gap 24 was 1.2 mm. Table 1 shows the evaluation of the conductive properties and the adhesive properties of the connecting structure.

[0102] <Experimental Example 2> 3 and 4, an anisotropic conductive film was produced in the same manner as in Example 1, except that the width 22W of the connecting film 22 was 2.88 mm, the width 23W of the connecting film 23 was 2.6 mm, and the width 24W of the gap 24 was 0.24 mm. Table 1 shows the evaluation of the conductive properties and the adhesive properties of the connecting structure.

[0103] [Table 1]

[0104] As shown in Table 1, in Experimental Example 1, in which an anisotropic conductive film was applied to the entire camera module evaluation board, the conductive resistance value increased after the reliability evaluation test. In Experimental Example 2, in which the gap width was set to 4% (0.24 mm) of the width of the camera module evaluation board, the conductive resistance value also increased after the reliability evaluation test. In Experimental Example 2, because the gap width was narrow, the gap was blocked by the resin flow during connection, and it is believed that the FPC swelled due to the expansion of gas during the reliability evaluation test, causing the resistance value to increase. Note that the performance of Experimental Examples 1 and 2 does not pose any particular problems in practical use.

[0105] On the other hand, in Examples 1 to 3 in which the gap width was 5% to 75% of the width of the camera module evaluation substrate, the conduction resistance value after the reliability evaluation test was equivalent to the initial conduction resistance value. Also, in Examples 2 and 3 in which the width of the anisotropic conductive film was 100% to 250% of the width of the mounting surface of the terminal row, the peel strength was 1, similar to Experimental Example 1.

[0106] In addition, a camera module evaluation board (ceramic board, width 6.0 mm, width of mounting surface of first to third terminal rows 1.0 mm, 200 μm pitch, line:space=1:1, terminal thickness 10 μm, Ni (base) / Au (surface) plating, cavity structure, terminal rows on each side of the U-shape) and an FPC (polyimide film, 200 μm pitch, line:space=1:1, terminal thickness 12 μm, Ni (base) / Au (surface) plating) were thermocompression-bonded to prepare a connection structure using an anisotropic conductive film having an attachment part shaped as shown in Fig. 18. The anisotropic conductive film had the same composition as above, and the ratio of the maximum film width to the width (1.0 mm) of the terminal rows on the mounting surface of the first to third terminal rows was set to 100% (1.0 mm). Here, the film width is the width from the gap side to the outside at the attachment part having the shape shown in Fig. 18. Then, when the electrical conductivity and adhesive properties of the connection structure were evaluated in the same manner as above, the electrical conductivity was A and the adhesive properties were 1, similar to Example 2.

[0107] Furthermore, using an anisotropic conductive film having an attachment portion shaped as shown in Figure 17, a camera module evaluation substrate having a U-shaped terminal row as shown in Figure 16 (ceramic substrate, width 6.0 mm, width of mounting surface for first to third terminal rows 1.0 mm, 200 μm pitch, line:space=1:1, terminal thickness 10 μm, Ni (base) / Au (surface) plating, with cavity structure, terminal row on each side of the U-shape) was thermocompression bonded to an FPC (polyimide film, 200 μm pitch, line:space=1:1, terminal thickness 12 μm, Ni (base) / Au (surface) plating) to produce a connection structure.

[0108] The corners of the anisotropic conductive film are chamfered in the unit regions 21L and 21W, and the peripheral shape of the attachment portion is octagonal, and the length 21L and width 21W of the attachment portion are the same as the length and width of the camera module evaluation substrate, respectively. That is, the anisotropic conductive film is chamfered at the portions corresponding to the corners of the evaluation substrate. Then, similarly to the above, the conductive characteristics and adhesive characteristics of the connection structure were evaluated, and the results were similar to those of Experimental Example 1. There were no practical problems with the performance, and excessive resin overflow after connection was suppressed, making it easy to handle.

[0109] The substrate and the anisotropic conductive film were punched out to have a square shape (connection film and substrate hollowed out) similar to that in FIG. 21, with each of the four sides having a width of 0.8 mm, 1.2 mm, and 2.4 mm (similar to Examples 1 to 3). A film structure having a width of 6.0 mm and a PET film having a thickness of 12 μm was prepared as a cover film. Using this film structure, a camera module evaluation substrate (ceramic substrate, width 6.0 mm, width of mounting surface of first to third terminal rows 1.0 mm, 200 μm pitch, line:space=1:1, terminal thickness 10 μm, Ni (base) / Au (surface) plating, no cavity structure, terminal rows on each side of the U-shape) and an FPC (polyimide film, 200 μm pitch, line:space=1:1, terminal thickness 12 μm, Ni (base) / Au (surface) plating) were thermocompressed to prepare a connection structure. The conductive properties and adhesive properties of the connection structure were evaluated in the same manner as above. When the anisotropic conductive film with a width of 0.8 mm, 1.2 mm, or 2.4 mm was used for all four sides, the conductive properties were A, which was the same as in Examples 1 to 3. The adhesive properties were also the same as in Examples 1 to 3. As above, the evaluation results were satisfactory for practical use. Since the base material and the anisotropic conductive film were hollowed out to match the outer shape of the substrate, manual alignment was easy when bonding to the ceramic substrate. It is expected that it will be more efficient if done mechanically.

[0110] In addition, for the above three types of samples, the hollowed-out anisotropic conductive film was not provided with a cover film, and 10 or more layers were manually wound around a φ150 mm core, which was then pulled out and visually inspected at any 10 or more points. For all three types of samples, punching marks remained on the surface of the connection film. When a cover film was provided and the sample was evaluated in the same manner, no punching marks remained on the surface of the connection film. If the appearance is impaired, the cause of the defect becomes unclear when anisotropic connections are made continuously, so it is clear that providing a cover film is preferable to avoid this. [Explanation of symbols]

[0111] 10 camera module, 11 ceramic substrate, 12 first terminal row, 13 second terminal row, 14 image sensor, 15 protective glass, 16 lens, 17 camera module driving IC, 20 film structure, 21 substrate, 22 connecting film, 23 connecting film, 24 gap, 30 flexible substrate, 31 substrate, 32 first terminal row, 33 second terminal row, 41 cushioning material. 42 crimping tool, 43 crimping tool, 50 camera module, 51 ceramic substrate, 52 first terminal row, 53 second terminal row, 54 third terminal row, 55 image sensor, 60 camera module, 61 ceramic substrate, 62A to 62C first electrodes, 63A to 63C second electrodes, 64 third electrodes, 65 image sensor, 70 connection film, 71 attachment portion, 72 non-attachment portion, 80 film structure, 81 substrate, 82 connection film, 83 cover film, 84 non-attachment portion

Claims

1. A tape-shaped base material, The system comprises a connecting film that is peelably formed on the substrate, In a plan view, the substrate has a unit region of a predetermined length in the longitudinal direction and a unit region of a predetermined width in the width direction of the substrate. The unit region has a void in the center where the connecting film is not present, The connecting film in the aforementioned unit region is separated by the gap portion, A film structure in which the substrate is half-cut to the shape of the void portion.

2. The film structure according to claim 1, wherein the void portion is formed in the longitudinal direction of the substrate.

3. The film structure according to claim 1, wherein the void portion is formed in the width direction of the substrate.

4. The film structure according to claim 2 or 3, wherein the length of the void in the short direction is 5% or more and 80% or less of the width of the substrate.

5. The film structure according to any one of claims 1 to 4, wherein the connecting film in the unit region has a shape in which the corners are missing.

6. The film structure according to any one of claims 1 to 5, wherein the connecting film comprises conductive particles.

7. The process includes slitting, half-cutting, punching, or punch-pressing a film roll comprising a tape-shaped base material and a connecting film peelably formed on the base material, to form a film structure having a unit area of ​​a predetermined length in the longitudinal direction of the base material and a predetermined width in the width direction of the base material in a plan view. A method for manufacturing a film structure, wherein the film structure has a void in the center of the unit region where the connecting film is not present, the connecting film in the unit region is separated by the void, and the substrate is half-cut to the shape of the void.

8. A first electronic component having multiple terminal rows, The second electronic component, A connecting film of the film structure according to any one of claims 1 to 6 is formed by curing between the first electronic component and the second electronic component, and the terminals of the first electronic component and the terminals of the second electronic component are connected by a cured film. A connecting structure comprising:

9. A bonding step of peeling a connecting film from the film structure according to any one of claims 1 to 6 and attaching it to a first electronic component or a second electronic component having a plurality of terminal rows, A connection step of connecting the terminals of the first electronic component and the terminals of the second electronic component via the connecting film. A method for manufacturing a connecting structure having the following characteristics.

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