Display panel, display device, and method for manufacturing display panel

Abstract

To provide: a display panel for improving the use performance of an OLED display product; a display device; and a method for manufacturing the display panel.SOLUTION: A display panel 10 comprises: a display region 11; a hole region 13; and a transition region 12 located between the display region 11 and the hole region 13. The display panel 10 further comprises: a substrate 100; a pixel defining layer 300 located on a side of the substrate 100, the pixel defining layer 300 comprising a pixel regulation layer 310 in which a pixel opening is formed by being enclosed by the pixel regulation layer; a light-emitting unit 610 located within the pixel opening and including a light-emitting layer 600; and an inorganic encapsulation layer located on a side facing away from the substrate 100, of the light-emitting unit 610. The inorganic encapsulation layer comprises a hole configured to avoid cutting damage. An orthographic projection to the substrate 100, of the hole region 13 is located within the orthographic projection to the substrate 100 of the hole that avoids cutting damage.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] This application claims priority to Chinese Patent Application No. 202311017132.0, filed on August 10, 2023, entitled "Display Panel, Display Device, and Method for Manufacturing a Display Panel," and Chinese Patent Application No. 202410646170.0, filed on May 21, 2024, entitled "Display Panel, Display Device, and Method for Manufacturing a Display Panel," the entire contents of which are incorporated herein by reference.

[0002] The present application relates to the display field, and in particular to a display panel, a display device, and a manufacturing method for a display panel. [Background technology]

[0003] Flat display devices based on technologies such as organic light emitting diode (OLED) and light emitting diode (LED) have advantages such as high image quality, power saving, thin body and wide range of applications, and therefore have been widely applied to various consumer electronic products such as mobile phones, televisions, notebook computers and desktop computers, and have become the main display devices.

[0004] However, there is a need to improve the performance of current OLED display products. Summary of the Invention

[0005] The embodiments of the present application provide a display panel, a display device, and a manufacturing method of a display panel for improving the performance of an OLED display product.

[0006] An embodiment of a first aspect of the present application provides a display panel comprising a display region, a hole region, and a transition region located between the display region and the hole region, further comprising a substrate, a pixel definition layer located on the substrate side, the pixel definition layer including a pixel restriction layer surrounding the pixel aperture to form a pixel aperture, an emitting layer including an emitting unit located within the pixel aperture, and an inorganic packaging layer located on a side of the emitting unit away from the substrate, the inorganic packaging layer including a hole to avoid damage due to cutting, and an orthogonal projection of the hole region onto the substrate is located within the orthogonal projection of the hole onto the substrate to avoid damage due to cutting.

[0007] According to an embodiment of the first aspect of the present application, the inorganic packaging layer includes a first packaging layer and a third packaging layer, the third packaging layer being located on a side of the first packaging layer away from the substrate, and holes for avoiding damage due to cutting are opened in the first packaging layer and / or the third packaging layer.

[0008] According to an embodiment of the first aspect of the present application, the display panel further comprises a second package layer located between the first package layer and the third package layer, and the material of the second package layer includes an organic material.

[0009] According to any of the above embodiments of the first aspect of the present application, the inorganic packaging layer is provided with a blocking groove in the transition region.

[0010] According to any of the above embodiments of the first aspect of the present application, the blocking groove is annular surrounding the hole region.

[0011] According to any of the above embodiments of the first aspect of the present application, the blocking groove is opened in the first package layer, and the hole for avoiding damage caused by cutting is opened in the third package layer.

[0012] According to any of the above-described embodiments of the first aspect of the present application, the blocking groove is provided through the first package layer along a thickness direction of the display panel.

[0013] According to any of the above-described embodiments of the first aspect of the present application, the hole for avoiding damage caused by cutting is provided through the third package layer along the thickness direction of the display panel.

[0014] According to any of the above-described embodiments of the first aspect of the present application, the display panel further comprises an isolation structure located on the substrate, the isolation structure including a first isolation portion located in the display region and a second isolation portion located in the transition region, the second isolation portion being spaced apart from the hole region, and the blocking groove being located on a side of the second isolation portion away from the substrate.

[0015] According to any of the above-described embodiments of the first aspect of the present application, the display panel further comprises a first insulating layer located on the substrate and having a first cutout portion formed therein, the first cutout portion being located in the transition region and spaced apart from the display region, the first cutout portion extending from the transition region to a boundary between the hole region and the transition region.

[0016] According to any of the above-described embodiments of the first aspect of the present application, the first recessed portion is provided penetrating the first insulating layer along the thickness direction of the display panel.

[0017] According to any of the above-described embodiments of the first aspect of the present application, the first recessed portion is annular and surrounds the hole region.

[0018] According to any of the above embodiments of the first aspect of the present application, the holes avoiding damage from cuts are located in the transition region.

[0019] According to any of the above-described embodiments of the first aspect of the present application, the orthogonal projection of the first recessed portion onto the substrate and the orthogonal projection of the hole for avoiding damage due to cutting onto the substrate at least partially overlap.

[0020] According to any of the above embodiments of the first aspect of the present application, an orthogonal projection of the first recess onto the substrate is located within an orthogonal projection of the hole onto the substrate avoiding damage due to the cut.

[0021] According to any of the above-described embodiments of the first aspect of the present application, a third cutout portion is provided in the first insulating layer, the third cutout portion being located in the transition region, the third cutout portion being arranged surrounding the first cutout portion and spaced apart from the first cutout portion.

[0022] According to any of the above-described embodiments of the first aspect of the present application, the third recessed portions are provided at intervals.

[0023] According to any of the above-described embodiments of the first aspect of the present application, the third recessed portion is annular and surrounds the hole region.

[0024] An embodiment of a second aspect of the present application provides a display panel having a display area, a hole area, and a transition area located between the display area and the hole area, further comprising a substrate, a pixel definition layer located on the substrate side and including a pixel regulating layer surrounding the pixel opening, an emission layer including an emission unit located in the pixel opening, and an inorganic packaging layer located on the side of the emission unit away from the substrate, the inorganic packaging layer having a blocking groove opened in the transition area.

[0025] According to an embodiment of the second aspect of the present application, the inorganic packaging layer includes a first packaging layer and a third packaging layer, the third packaging layer being located on a side of the first packaging layer away from the substrate, and the blocking groove is opened in the first packaging layer and / or the third packaging layer.

[0026] According to an embodiment of the second aspect of the present application, the blocking groove is annular surrounding the hole area.

[0027] According to an embodiment of the second aspect of the present application, the blocking grooves are multiple.

[0028] According to any of the above embodiments of the second aspect of the present application, the inorganic packaging layer includes a hole that avoids cut damage located in a hole region, and an orthogonal projection of the hole region onto the substrate is located within an orthogonal projection of the hole that avoids cut damage onto the substrate.

[0029] According to an embodiment of the second aspect of the present application, the blocking groove is opened in the first package layer and the hole for avoiding damage by cutting is opened in the third package layer.

[0030] According to an embodiment of the second aspect of the present application, the blocking groove is provided through the first package layer.

[0031] According to any of the above-described embodiments of the second aspect of the present application, the display panel further comprises an isolation structure located on the substrate, the isolation structure including a first isolation portion located in the display region and a second isolation portion located in the transition region, the second isolation portion being spaced apart from the hole region, and the blocking groove being located on a side of the second isolation portion away from the substrate.

[0032] According to any of the above-described embodiments of the second aspect of the present application, the display panel further comprises a first insulating layer located on the substrate and having a first cutout portion formed therein, the first cutout portion being located in the transition region and spaced apart from the display region, and the first cutout portion extending from the transition region to a boundary between the hole region and the transition region.

[0033] According to any of the above-described embodiments of the second aspect of the present application, the first recessed portion is provided penetrating the first insulating layer along the thickness direction of the display panel.

[0034] According to any of the above-described embodiments of the second aspect of the present application, the first recessed portion is annular and surrounds the hole region.

[0035] According to any of the above embodiments of the second aspect of the present application, the holes avoiding damage from cuts are located in the transition region.

[0036] According to any of the above-described embodiments of the second aspect of the present application, the orthogonal projection of the first recessed portion onto the substrate and the orthogonal projection of the hole for avoiding damage due to cutting onto the substrate at least partially overlap.

[0037] According to any of the above embodiments of the second aspect of the present application, an orthogonal projection of the first recess onto the substrate is located within an orthogonal projection of the hole onto the substrate avoiding damage due to the cut.

[0038] An embodiment of a third aspect of the present application provides a display panel having a display area, a hole area, and a transition area located between the display area and the hole area, the display panel comprising: a substrate; a first insulating layer located on the substrate, the first hole being located in the transition area and spaced apart from the display area, the first hole extending from the transition area to a boundary between the hole area and the transition area; a pixel definition layer located on a side of the first insulating layer away from the substrate, the pixel definition layer including a pixel opening pixel regulating layer surrounding the pixel opening to form a pixel opening; and an emission layer including an emission unit located within the pixel opening.

[0039] According to an embodiment of the third aspect of the present application, the display panel further comprises a first package layer located on a side of the light-emitting unit away from the substrate and including a first portion located in a display area, a second package layer located on a side of the first package layer away from the substrate, and a third package layer located on a side of the second package layer away from the substrate, and at least one of the first package layer and the third package layer is provided with a blocking groove or a hole for avoiding damage due to cutting.

[0040] According to any of the above embodiments of the third aspect of the present application, the second package layer is located in the display area.

[0041] According to any of the above-described embodiments of the third aspect of the present application, the display panel further comprises an isolation structure located on the substrate side, the isolation structure including a first isolation portion located in the display area and a second isolation portion located in the transition area, the second isolation portion being spaced apart from the hole area, the first package layer further including a second portion located in the transition area, at least a portion of the second portion being located within the first recessed portion, the second portion being blocked by the second isolation portion to form a plurality of subsections, and the blocking groove located in the isolation structure is formed between adjacent subsections.

[0042] According to any of the above embodiments of the third aspect of the present application, the subsection includes a first thinned portion located on at least one side of the second isolation portion.

[0043] According to any of the above-described embodiments of the third aspect of the present application, the pixel definition layer includes a second pixel regulation layer located within the first recessed portion, and the second isolation portion is located on a side of the second pixel regulation layer away from the substrate.

[0044] According to any of the above-described embodiments of the third aspect of the present application, the isolation structure includes a first isolation portion located in the display area, and a first isolation opening is formed by being surrounded by the first isolation portion.

[0045] According to any of the above-described embodiments of the third aspect of the present application, the pixel definition layer includes a first pixel regulation layer located in the display region, and the pixel opening includes a first pixel opening formed by being surrounded by the first pixel regulation layer, and the first pixel opening is in communication with the first isolation opening.

[0046] According to any of the above-described embodiments of the third aspect of the present application, the display panel further includes a barrier located on a side of the first insulating layer facing away from the substrate, the barrier being provided between the first pixel regulation layer and the first hollowed-out portion and forming an annular shape surrounding the transition region.

[0047] According to any of the above embodiments of the third aspect of the present application, the barrier is two or more.

[0048] According to any of the above embodiments of the third aspect of the present application, the light-emitting unit includes a first light-emitting unit located in the first isolation opening.

[0049] According to any of the above embodiments of the third aspect of the present application, the display panel further includes a first electrode layer located on a side of the light-emitting layer facing away from the substrate, the first electrode layer including a first electrode located in the first isolation opening.

[0050] According to any of the above-described embodiments of the third aspect of the present application, the light-emitting layer includes a second light-emitting unit located on a side of the second isolation portion facing the hole region.

[0051] According to any of the above-described embodiments of the third aspect of the present application, the pixel regulation layer further includes an extension portion connected to the first pixel regulation layer, and at least a portion of the extension portion is located on a surface of the barrier away from the substrate.

[0052] According to any of the above embodiments of the third aspect of the present application, the extension extends to the transition region.

[0053] According to any of the above-described embodiments of the third aspect of the present application, the extension portion is provided at a distance from the second pixel regulation layer.

[0054] According to any of the above embodiments of the third aspect of the present application, the third packaging layer includes a hole that avoids damage from cuts located in the hole area.

[0055] According to any of the above-described embodiments of the third aspect of the present application, the orthogonal projection of the first recessed portion onto the substrate and the orthogonal projection of the hole for avoiding damage due to cutting onto the substrate at least partially overlap.

[0056] According to any of the above embodiments of the third aspect of the present application, an orthogonal projection of the first recess onto the substrate is located within an orthogonal projection of the hole onto the substrate avoiding damage due to the cut.

[0057] According to any of the above-described embodiments of the third aspect of the present application, the first recessed portion is provided penetrating the first insulating layer along the thickness direction of the display panel.

[0058] According to any of the above-described embodiments of the third aspect of the present application, the first cutout portion includes an upper surface and a lower surface arranged opposite each other along the thickness direction of the display panel, the upper surface is located on the side away from the lower surface substrate, the cutout portion has a first opening located on the upper surface and a second opening located on the lower surface, and the orthogonal projection of the second opening onto the substrate is located within the orthogonal projection of the first opening onto the substrate.

[0059] According to any of the above-described embodiments of the third aspect of the present application, a third cutout portion is provided in the first insulating layer, the third cutout portion being located in the transition region, the third cutout portion being arranged surrounding the first cutout portion and spaced apart from the first cutout portion.

[0060] According to any of the above-described embodiments of the third aspect of the present application, the third recesses are provided at intervals.

[0061] An embodiment of a fourth aspect of the present application provides a display device comprising the display panel according to any one of the above embodiments.

[0062] An embodiment of a fifth aspect of the present application is a method for manufacturing a display panel including a display area, a hole area, and a transition area located between the display area and the hole area, comprising: manufacturing a first insulating layer on a substrate; opening a first lightening portion in the first insulating layer, the first lightening portion being located in the transition area and spaced apart from the display area, the first lightening portion extending from the transition area to a boundary between the hole area and the transition area; manufacturing a pixel definition layer on the substrate, the pixel definition layer including a pixel regulation layer, and a pixel opening being formed by being surrounded by the pixel regulation layer; manufacturing an emission layer on a side of the pixel definition layer away from the substrate; The present invention provides a method for manufacturing a pixel defining layer including: an emitting layer including an emitting unit located in a pixel opening; and fabricating an inorganic packaging layer on a side of the pixel defining layer away from the substrate, the inorganic packaging layer including a hole located in a hole region to avoid damage caused by cutting, the hole region being located within the orthogonal projection of the hole onto the substrate of the hole to avoid damage caused by cutting, or the inorganic packaging layer including a blocking groove located in a transition region; and removing a film layer structure in the hole region by cutting along a cut line located inside the hole to avoid damage caused by cutting, to form an opening corresponding to the hole region.

[0063] According to the display panel of the embodiment of the present application, the display panel comprises a display region, a hole region, and a transition region between the display region and the hole region, the display panel further comprises a substrate, a pixel definition layer located on the substrate side, the pixel definition layer including a pixel regulation layer surrounding the pixel opening, a light emitting layer including a light emitting unit located in the pixel opening, and an inorganic package layer located on the side of the light emitting unit away from the substrate, the inorganic package layer includes a hole for avoiding damage caused by cutting, and the orthogonal projection of the hole region onto the substrate is formed in the inorganic package layer located within the orthogonal projection of the hole for avoiding damage caused by cutting onto the substrate, thereby reducing the thickness of the film layer at the cut line position of the display panel and reducing the difficulty of cutting the hole region. In addition, the orthogonal projection of the hole region onto the substrate is located within the orthogonal projection of the hole for avoiding damage caused by cutting onto the substrate, thereby reducing the impact of the hole region on the inorganic package layer when the hole region is cut, and the problem of the inorganic package layer being cracked and extending to the display region when the inorganic package layer is cut can be avoided. [Brief description of the drawings]

[0064] [Figure 1] FIG. 2 is a schematic top view of a display panel according to an embodiment of the present application. [Diagram 2] FIG. 2 is a cross-sectional view taken along the line AA in FIG. [Diagram 3] 2 is a cross-sectional view taken along line AA in FIG. 1 according to another embodiment of the present invention. [Figure 4] 2 is a cross-sectional view of still another embodiment taken along the line AA in FIG. 1. [Diagram 5] FIG. 5 is a partially enlarged view of FIG. [Figure 6] 2 is a cross-sectional view of still another embodiment taken along the line AA in FIG. 1. [Figure 7] 2 is a cross-sectional view taken along line AA in FIG. 1, showing yet another embodiment of the present invention before cutting. [Figure 8] 2 is a cross-sectional view taken along line AA in FIG. 1, showing yet another embodiment of the present invention before cutting. [Figure 9]2 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application. [Figure 10] FIG. 2 is a partial plan view of a display panel according to an embodiment of the present application. [Figure 11] 2 is a cross-sectional view of still another embodiment taken along the line AA in FIG. 1. [Figure 12] 2 is a cross-sectional view of still another embodiment taken along the line AA in FIG. 1. [Figure 13] 2 is a cross-sectional view of still another embodiment taken along the line AA in FIG. 1. [Figure 14] 2 is a cross-sectional view of still another embodiment taken along the line AA in FIG. 1. [Figure 15] 2 is a partial cross-sectional view of a display area of ​​a display panel according to an embodiment of the present application. [Figure 16] 2 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0065] An embodiment of the present application provides a display panel, which may be an Organic Light Emitting Diode (OLED) display panel.

[0066] 1 and 2, FIG. 1 is a schematic top view of a display panel according to an embodiment of the present application, and FIG. 2 is a cross-sectional view taken along line AA in FIG.

[0067] As shown in FIG. 1 and FIG. 2 , an embodiment of the first aspect of the present application provides a display panel 10, which includes a display area 11, a transition area 12, and a hole area 13, where the display area 11 is disposed around the transition area 12, and the transition area 12 is disposed around the hole area 13, and the display panel 10 further includes a substrate 100, a first insulating layer 200, and a pixel definition layer 300, where the first insulating layer 200 is located on the substrate 100, and the first insulating layer 200 is located on the substrate 100. 00 has a first cutout 210, which is located in the transition region 12 and spaced apart from the display region 11, the first cutout 210 extending from the transition region 12 to the boundary between the hole region 13 and the transition region 12, and a pixel definition layer 300 located on the side of the first insulating layer 200 away from the substrate 100, and the pixel definition layer 300 includes a pixel regulating layer 310 and a pixel opening 320 formed by being surrounded by the pixel regulating layer 310.

[0068] Optionally, the boundary is a cut edge of the hole area 13 of the display panel 10 , where the display panel 10 is cut to form the hole area 13 .

[0069] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a display area 11, a transition area 12 and a hole area 13, the display area 11 is arranged around the transition area 12, and the transition area 12 is arranged around the hole area 13. The display area 11 is used to realize the light-emitting display of the display panel 10, and the hole area 13 below the display panel is used to provide a light-sensitive assembly. The display panel 10 further includes a substrate 100, a first insulating layer 200 and a pixel definition layer 300. The pixel definition layer 300 includes a pixel regulating layer 310 and a pixel opening 320 formed by being surrounded by the pixel regulating layer 310, and the pixel opening 320 is used to provide a light-emitting unit. A first cutout 210 is formed in the first insulating layer 200 located between the pixel definition layer 300 and the substrate 100, and the first cutout 210 is located in the transition region 12 and spaced apart from the display region 11, thereby reducing the thickness of the brittle film layer located in the first cutout 210 of the display panel 10 or eliminating the brittle film layer. When the substrate 100 is cut at the first cutout 210, cracks are unlikely to form in the first insulating layer 200 and the cracks are unlikely to extend toward the display region 11, thereby improving the performance of the OLED display panel 10.

[0070] Optionally, the display panel 10 includes an array layer, and the first insulating layer 200 includes an interlayer insulating layer located within the array layer. For example, the array layer includes a metal layer, and the metal layer includes a first metal layer, a second metal layer, and a third metal layer arranged in a stacked manner, and the first insulating layer 200 includes an interlayer insulating layer located between adjacent metal layers.

[0071] For example, the array layer includes an active layer and a gate layer, and the first insulating layer 200 includes an inter-gate insulating layer between the active layer and the gate layer.

[0072] Optionally, the first insulating layer 200 includes a planarizing layer located towards the substrate 100 side of the pixel defining layer 300 .

[0073] In some optional embodiments, the pixel regulation layer 310 includes a first pixel regulation layer 311 located in the display area 11, the pixel opening 320 includes a first pixel opening 321 formed by being surrounded by the first pixel regulation layer 311, and the display panel 10 further includes a barrier 400 located on the side of the first insulating layer 200 away from the substrate 100, the barrier 400 being provided between the first pixel regulation layer 311 and the first hollowed-out portion 210 and forming an annular shape surrounding the transition region 12.

[0074] In these optional embodiments, the first pixel regulating layer 311 is located in the display area 11 to regulate the light emitting area of ​​the display area 11, i.e., the first pixel opening 321 is surrounded by the first pixel regulating layer 311, and the display panel 10 emits light through the first pixel opening 321. The barrier 400 is provided between the first pixel regulating layer 311 and the first hollowed-out portion 210, and the barrier 400 allows a part of the film layer to be provided in the display area 11 and blocked at the barrier 400, thereby improving the defect of water or oxygen intrusion caused by water vapor entering the display area 11 from the transition area 12.

[0075] Optionally, multiple barriers 400 can be spaced apart to further extend the water and oxygen ingress path and improve poor water and oxygen ingress caused by water vapor entering the display area 11 from the transition area 12.

[0076] In some optional embodiments, the display panel 10 further includes an isolation structure 500 and an emitting layer 600, where the isolation structure 500 is located on a side of the pixel regulating layer 310 away from the substrate 100, the isolation structure 500 includes a first isolation portion 510 located on a side of the barrier 400 away from the transition region 12 and is surrounded by the first isolation portion 510 to form a first isolation opening 511, each first pixel opening 321 is located within each first isolation opening 511, the emitting layer 600 is located on a side of the pixel regulating layer 310 away from the substrate 100, and the emitting layer 600 includes a first light-emitting unit 610 located in the first isolation opening 511.

[0077] In these optional embodiments, the first isolation portion 510 is provided in the display area 11, and is surrounded by the first isolation portion 510 to form a plurality of first isolation openings 511, thereby blocking the light-emitting layer 600 to form first light-emitting units 610 that are broken from each other, thereby reducing the carrier crosstalk in the light-emitting layer 600, improving the display effect of the display panel 10, and eliminating the need to use precision masks to manufacture the first light-emitting units 610, thereby reducing the development and use of precision masks and reducing manufacturing costs.

[0078] Optionally, a portion of the light-emitting layer 600 in the transition region 12 may be etched to form a cutout, which can further reduce the thickness of the film layer in the transition region 12 of the display panel 10 and make it less difficult to cut.

[0079] As shown in FIG. 2, in some optional embodiments, the display panel 10 further includes a first electrode layer 700 located on a side of the light-emitting layer 600 away from the substrate 100, and the first electrode layer 700 includes a first electrode 710 located in the first isolation opening 511.

[0080] In these optional embodiments, the first electrode layer 700 is interrupted by first isolation portions 510 to form spaced apart first electrodes 710, each first electrode 710 being located in a first isolation opening 511, and the spaced apart first electrodes 710 being electrically connected by the first isolation portions 510 to form a full surface electrode.

[0081] Optionally, a portion of the first electrode layer 700 in the transition area 12 can be etched to further reduce the thickness of the film layer in the transition area 12 of the display panel 10 and make it less difficult to cut.

[0082] In some optional embodiments, the display panel 10 further includes a first packaging layer 810 located on a side of the first electrode layer 700 away from the substrate 100, and the first packaging layer 810 includes a first portion 811 located in the display area 11.

[0083] In these optional embodiments, the first packaging layer 810 can package the first electrode layer 700 and the light-emitting layer 600 to reduce corrosion of the first electrode layer 700 and the light-emitting layer 600 by water or oxygen. The first portion 811 of the first packaging layer 810 can be located in the display area 11 to improve packaging performance in the display area 11 of the display panel 10.

[0084] Optionally, a portion of the first package layer 810 in the transition area 12 can be etched to further reduce the thickness of the film layer in the transition area 12 of the display panel 10 and make it less difficult to cut.

[0085] In some optional embodiments, the display panel 10 further includes a second package layer 820, which is located on the side of the first package layer 810 away from the substrate 100 and is located on the side of the barrier 400 away from the transition region 12.

[0086] In these optional embodiments, the display panel 10 can be multi-layer packaged using a first package layer 810 and a second package layer 820 to further improve the packaging performance of the display panel 10. The second package layer 820 is blocked at a location where the barrier 400 is located, so that the entire second package layer 820 is located in the display area 11, thereby improving the problem of water and oxygen intrusion caused by water vapor entering the display area 11 from the transition area 12.

[0087] In some optional embodiments, the display panel 10 further includes a third package layer 830, which is located on the side of the second package layer 820 away from the substrate 100, and the third package layer 830 includes a second recessed portion 833 located in the transition region 12, or the third package layer 830 is located in the display region 11 and the transition region 12.

[0088] In these optional embodiments, the display panel 10 is triple-packaged using a first packaging layer 810, a second packaging layer 820, and a third packaging layer 830, which can further improve the packaging performance of the display panel 10. The third packaging layer 830 has a second lightening portion 833 formed in the transition region 12, which reduces the thickness of the brittle film layer of the display panel 10 at the second lightening portion 833 in the transition region 12. When the substrate 100 is cut at the second lightening portion 833, cracks are less likely to form in the third packaging layer 830 and to extend toward the display region 11.

[0089] Optionally, the first packaging layer 810 includes an inorganic material, the first packaging layer 810 is packaged using an inorganic material, and the first packaging layer 810 using an inorganic material has good compactness and good packaging performance.

[0090] Optionally, the second packaging layer 820 includes an organic material, and the second packaging layer 820 can be packaged with the organic material to further improve the packaging performance of the packaging layer.

[0091] Optionally, the third package layer 830 includes an inorganic material, and the first package layer 810, the second package layer 820 and the third package layer 830 are packaged using inorganic materials, organic materials and inorganic materials respectively to form a TFE (Thin Film Encapsulation) thin film package structure, which can further improve the package performance of the package layers.

[0092] In some optional embodiments, the first portion 811 is located on a side of the first isolation portion 510 that is closer to an edge of the transition region 12 and away from the transition region 12 .

[0093] In these optional embodiments, since the first package layer 810 is blocked by the first isolation portion 510, the first package layer 810 cannot extend continuously to the transition region 12, which further reduces the thickness of the film layer in the transition region 12 of the display panel 10 and reduces the difficulty of cutting. When cutting into the transition region 12 to the substrate 100, cracks are less likely to form in the first package layer 810 and the cracks are less likely to extend toward the display region 11.

[0094] In some optional embodiments, the third package layer 830 includes a second cutout portion 833 located in the transition region 12, and the orthogonal projection of the first cutout portion 210 onto the substrate 100 and the orthogonal projection of the second cutout portion 833 onto the substrate 100 at least partially overlap.

[0095] In these optional embodiments, the orthogonal projections of the first cutout portion 210 and the second cutout portion 833 onto the substrate 100 at least partially overlap, so that the first cutout portion 210 and the second cutout portion 833 are at least partially connected, and the display panel 10 has a small thickness at the overlap position, so that the display panel 10 is more easily cut at the overlap position, and cracks are less likely to form in the third package layer 830 and the first insulating layer 200 and extend toward the display area 11.

[0096] In some optional embodiments, the orthogonal projection of the first lightening cutout 210 onto the substrate 100 lies within the orthogonal projection of the second lightening cutout 833 onto the substrate 100 .

[0097] In these optional embodiments, the orthogonal projection area of ​​the second cutout portion 833 is larger than the orthogonal projection area of ​​the first cutout portion 210, so that when cutting the substrate 100 within the first cutout portion 210, the thickness is smaller and the cutting is less difficult, and because the area of ​​the second cutout portion 833 is larger, cracks are less likely to form in the third package layer 830 and extend toward the display area 11.

[0098] In some optional embodiments, the first recess 210 is provided through the first insulating layer 200 along the thickness direction of the display panel 10 .

[0099] In these optional embodiments, the first cutout portion 210 is provided through the first insulating layer 200 to further reduce the thickness of the first insulating layer 200 at the first cutout portion 210, thereby reducing the difficulty of cutting the substrate 100 at the first cutout portion 210, and by cutting the portion of the substrate 100 at the first cutout portion 210, cracks are less likely to occur in the first insulating layer 200 and extend toward the display area 11, thereby improving the luminescence reliability of the display panel 10.

[0100] Referring to FIG. 3, FIG. 3 is a cross-sectional view of another embodiment taken along line AA in FIG.

[0101] As shown in FIG. 3, in some optional embodiments, the first insulating layer 200 is provided with a third cutout 220 located in the transition region 12, the third cutout 220 surrounding the first cutout 210 and spaced apart from the first cutout 210.

[0102] In these optional embodiments, the third cutout portion 220 is arranged to surround the first cutout portion 210, and when other film layers are provided on the first insulating layer 200, the provision of the third cutout portion 220 increases the intrusion path for water and oxygen, making it more difficult for water and oxygen to invade the display area 11 through the transition area 12, thereby ensuring the reliability of the display panel 10.

[0103] Optionally, the plurality of third recessed portions 220 are provided at intervals. By providing the plurality of third recessed portions 220, it is possible to further increase the number of paths through which water and oxygen can enter.

[0104] 4 and 5, FIG. 4 is a cross-sectional view of another embodiment taken along the line AA in FIG. 1, and FIG. 5 is a partially enlarged view of FIG.

[0105] As shown in Figures 4 and 5, in some optional embodiments, the pixel regulation layer 310 includes a second pixel regulation layer 312 located in the first hollowed-out portion 210, the isolation structure 500 includes a second isolation portion 520 located in the second pixel regulation layer 312, the second isolation portion 520 is spaced apart from the hole region 13, and the light-emitting layer 600 includes a second light-emitting unit 620 located on the side of the second isolation portion 520 facing the hole region 13.

[0106] In these optional embodiments, the second pixel regulating layer 312 and the second isolation portion 520 are provided in the first cutout portion 210, and the second light-emitting unit 620 is provided on the side of the second isolation portion 520 facing the hole region 13, so that the film layer structure in the first cutout portion 210 can be made closer to the film layer structure used for cutting in the related art, and the substrate 100 can be cut using conventional cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0107] Optionally, the first electrode layer 700 includes a second electrode 720 on the side facing the hole region 13 of the second isolation portion 520, and by providing the second electrode 720 on the side facing the hole region 13 of the second isolation portion 520, the film layer structure within the first hollowed-out portion 210 can be made closer to the film layer structure used for cutting in related art, and the substrate 100 can be cut using conventional cutting equipment and known equipment parameters, reducing the difficulty of cutting.

[0108] In some optional embodiments, the first package layer 810 includes a second portion 812 located in the transition region 12 , with at least a portion of the second portion 812 located within the first lightening cutout 210 .

[0109] In these optional embodiments, the second portion 812 of the first package layer 810 is provided within the first cutout 210, thereby allowing the film layer structure within the first cutout 210 to be closer to the film layer structure used for cutting in related art, and allowing the substrate 100 to be cut using conventional cutting equipment and known equipment parameters, reducing the difficulty of cutting.

[0110] In some optional embodiments, the second portion 812 includes first thinned portions 813 located on either side of the second standoff portion 520 .

[0111] In these optional embodiments, the second portion 812 has a first thin portion 813 formed on both sides of the second isolation portion 520, i.e., the second portion 812 has a smaller thickness on both sides of the second isolation portion 520, and when the substrate 100 is cut on the side of the second isolation portion 520 toward the hole region 13, any cracks that occur will easily break at the first thin portion 813 and will not likely continue toward the display area 11.

[0112] As an option, the second portion 812 and the first portion 811 are spaced apart, and when the substrate 100 is cut at the second portion 812 in the first hollowed-out portion 210, a crack that occurs in the second portion 812 cannot extend to the first portion 811, thereby ensuring the display reliability of the display panel 10.

[0113] Optionally, the third package layer 830 includes a third portion 831 located in the display area 11 and a fourth portion 832 located in the transition area 12, and at least a part of the fourth portion 832 is located in the first hollowed-out portion 210. By providing the fourth portion 832 of the third package layer 830 in the first hollowed-out portion 210, the film layer structure in the first manufacturing groove can be made closer to the film layer structure for cutting in the related art, and the substrate 100 can be cut using a conventional cutting device and known device parameters, reducing the difficulty of cutting.

[0114] Optionally, the fourth portion 832 includes a second thin portion 834 located on both sides of the second isolation portion 520, i.e., the thickness of both sides of the fourth portion 832 located on the second isolation portion 520 is thin, and when the substrate 100 is cut on the side toward the hole region 13 of the second isolation portion 520, any cracks that occur are more likely to break at the second thin portion 834 and less likely to continue toward the display area 11.

[0115] 4, optionally, the isolation structure 500 includes a first layer 501, and each first electrode 710 is electrically connected to the first layer 501. The first electrodes 710 spaced apart from each other are electrically connected to each other through the first layer 501 to form a full-surface electrode, which makes it easier for the first electrodes 710 and the first layer 501 to overlap with each other, and can improve the overlap efficiency of the first electrodes 710.

[0116] In some optional embodiments, the isolation structure 500 further includes a second layer 502 located on the side of the first layer 501 away from the substrate 100, and the orthogonal projection of the first layer 501 onto the substrate 100 is located within the orthogonal projection of the second layer 502 onto the substrate 100.

[0117] In these optional embodiments, the first layer 501 and the second layer 502 are arranged to form an isolation structure 500, where the orthogonal projection of the first layer 501 arranged adjacent to the substrate 100 is located within the orthogonal projection of the second layer 502 onto the substrate 100, the area of ​​the second layer 502 is larger than the area of ​​the first layer 501, and the second layer 502 covers the surface of the first layer 501 adjacent to the second layer 502, where the first layer 501 is recessed relative to the second layer 502 in a direction away from the pixel opening 320. When the light-emitting layer 600 is manufactured, the light-emitting layer 600 has a large step at the edge of the isolation structure 500, and the first layer 501 is recessed inward relative to the second layer 502, so that the light-emitting layer 600 is difficult to connect at the edge of the isolation structure 500, which causes breakage, and the light-emitting layer 600 breaks to form the first light-emitting unit 610 and the second light-emitting unit 620 that are broken from each other. In addition, the second layer 502 is recessed inward relative to the first layer 501, and when the first package layer 810 and the third package layer 830 are manufactured, the second portion 812 has a first thin portion 813 with a small thickness formed on both sides of the second layer 502, and the fourth portion 832 has a second thin portion 834 with a small thickness formed on both sides of the second layer 502.

[0118] Optionally, when the fourth portion 832 is broken at the barrier 400 and the substrate 100 is cut at the fourth portion 832 in the first cutout portion 210, a crack that occurs in the fourth portion 832 cannot extend to the third portion 831, thereby ensuring the display reliability of the display panel 10.

[0119] Referring to FIG. 2, in some optional embodiments, the first recessed portion 210 includes a first opening 211 and a second opening 212 arranged opposite each other along the thickness direction of the display panel 10, the first opening 211 being located on the side of the second opening 212 away from the substrate 100, and the orthogonal projection of the second opening 212 onto the substrate 100 being located within the orthogonal projection of the first opening 211 onto the substrate 100.

[0120] In these optional embodiments, the area of ​​the first opening 211 of the first cutout portion 210 is larger than the area of ​​the second opening 212, so that the first cutout portion 210 is completely exposed toward the side away from the substrate 100, making it easier to cut the substrate 100 with the first cutout portion 210 and reducing the possibility of cutting the first insulating layer 200, making cracks less likely to occur in the first insulating layer 200 and extend toward the display area 11.

[0121] Referring to FIG. 6, FIG. 6 is a cross-sectional view of still another embodiment taken along the line AA in FIG.

[0122] 6, optionally, the substrate 100 includes a base 110 and a protective film 120, the protective film 120 is located on the base 110, and a fourth groove 121 is formed in the protective film 120, the fourth groove 121 is connected to the first hollowed-out portion 210. By forming the fourth groove 121 in the protective film 120, the thickness of the display panel 10 in the transition region 12 can be further reduced, the difficulty of cutting the transition region 12 can be reduced, and the thickness of the display panel 10 at the location of the fourth groove 121 can be reduced, thereby reducing the possibility of cracks occurring.

[0123] Optionally, the display panel 10 further includes a pixel electrode exposed from the first pixel opening 321, where one of the pixel electrode and the first electrode 710 is used as the anode of the first light-emitting unit 610, and the other is used as the cathode of the first light-emitting unit 610. In the embodiments of the present application, the pixel electrode is used as the anode of the first light-emitting unit 610, and the first electrode 710 is used as the cathode of the first light-emitting unit 610 as an example.

[0124] 7 and 8, FIG. 7 is a cross-sectional view of still another embodiment taken along line AA in FIG. 1 before cutting, and FIG. 8 is a cross-sectional view of still another embodiment taken along line AA in FIG. 1 before cutting.

[0125] As shown in Figures 7 and 8, Figures 7 and 8 are masters before the display panel 10 is cut to form the hole area 13. Taking the masters of Figures 7 and 8 as an example, a circular cut is made at the boundary between the transition area 12 and the hole area 13 of the display panel 10 to form the display panel 10 of the embodiment of the present application.

[0126] The structural design in this embodiment can be applied to other display panels 10, and specifically can be selected according to the actual situation, but the present application does not specifically limit it.

[0127] An embodiment of the second aspect of the present application further provides a display device including the display panel 10 according to any of the embodiments of the first aspect. Since the display device according to the embodiment of the second aspect of the present application includes the display panel 10 according to any of the embodiments of the first aspect, the display device according to the embodiment of the second aspect of the present application has beneficial effects possessed by the display panel 10 according to any of the embodiments of the first aspect, and description thereof will be omitted here.

[0128] The display device in the embodiments of the present application includes, but is not limited to, devices with display functions such as mobile phones, personal digital assistants (abbreviated as PDAs), tablet computers, e-books, televisions, gate controls, smart landlines, and consoles.

[0129] The embodiment of the third aspect of the present application further provides a method for manufacturing a display panel 10, which may be any of the display panels 10 according to the embodiments of the first aspect described above, and referring to Figures 1 to 8 together and Figure 9, Figure 9 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present application. The manufacturing method includes the following steps:

[0130] Step S01: fabricate a first insulating layer on a substrate, and open a first fabrication groove in the first insulating layer, the first fabrication groove being located in a transition region and a hole region and spaced apart from a display region.

[0131] Step S02: Fabricating a pixel definition layer on a side of the first insulating layer remote from the substrate, the pixel definition layer including a pixel regulation layer and a pixel opening surrounded by the pixel regulation layer.

[0132] Step S03: Make an annular cut in the substrate in the first manufacturing groove to form a first recess and an aperture located in the hole region, the first recess extending from the transition region to a boundary between the hole region and the transition region.

[0133] According to the manufacturing method of the embodiment of the third aspect of the present application, a first insulating layer 200 is manufactured on a substrate 100 in step S01, and a first manufacturing groove is opened in the first insulating layer 200 in the transition region 12, and the first manufacturing groove and the display region 11 are spaced apart from each other. Next, a pixel opening 320 is manufactured in the pixel definition layer 300 and surrounded by the pixel regulating layer 310, so that a light-emitting unit is installed to realize the light-emitting display of the display panel 10. Finally, in step S03, an annular cut is made on the substrate 100 in the first manufacturing groove, so that an opening is formed in the hole region 13 of the display panel 10, and a photosensitive assembly is installed in the hole region 13, and the photosensitive effect of the photosensitive assembly is ensured. Since the thickness of the film layer of the display panel 10 located in the first manufacturing groove is small, when the substrate 100 is cut in the first manufacturing groove, cracks are less likely to form in the first insulating layer 200 and the cracks are less likely to extend toward the display area 11, thereby improving the usage performance of the OLED display panel 10.

[0134] In some optional embodiments, the pixel regulation layer 310 includes a first pixel regulation layer 311 located in the display area 11 and a second pixel regulation layer 312 located in the transition area 12, the second pixel regulation layer 312 is annular and spaced apart from the first pixel regulation layer 311, and at least a portion of the second pixel regulation layer 312 is disposed in the first fabrication groove, and before step S03, the method further includes the steps of: fabricating an isolation structure 500 on a side of the pixel definition layer 300 away from the substrate 100, the isolation structure 500 including a first isolation portion 510 located in the first pixel regulation layer 311 and two spaced apart second isolation portions 520 located in the second pixel regulation layer 312.

[0135] In step S03, the method further includes the steps of: making a circular cut in the substrate 100 between the two second isolation portions 520;

[0136] In these optional embodiments, the first isolation portion 510 is disposed in the display area 11, and the first isolation portion 510 is surrounded to form a plurality of first isolation openings 511, thereby blocking the light-emitting layer 600 to form the first light-emitting units 610 that are broken from each other, thereby reducing the crosstalk of carriers in the light-emitting layer 600, improving the display effect of the display panel 10, and eliminating the need for precision masks to manufacture the first light-emitting units 610, reducing the development and use of precision masks, and reducing manufacturing costs. The two second isolation portions 520 are disposed on the second pixel regulating layer 312 with a gap therebetween, so that when cutting the substrate 100, a circular cut is made on the substrate 100 between the two second isolation portions 520, reducing the possibility of cutting the first insulating layer 200, and the first insulating layer 200 is less likely to crack, and the cracks are less likely to extend toward the display area 11.

[0137] In some optional embodiments, the display panel 10 further includes a second light-emitting unit 620 located on a side of the second isolation portion 520 facing the hole region 13, and in the step of making an annular cut in the substrate 100 in the first manufacturing groove, the method further includes the steps of: making an annular cut in the substrate 100 at the second light-emitting portion 620;

[0138] In these optional embodiments, the light-emitting layer 600 is broken at the second isolation structure 500 to form a second light-emitting unit 620, making the film layer structure between the two second isolation sections 520 closer to the film layer structure for cutting in the related art, and when cutting the substrate 100 at the second light-emitting unit 620, the substrate 100 can be cut using conventional cutting equipment and known equipment parameters, reducing the difficulty of cutting.

[0139] In some optional embodiments, the display panel 10 further includes a second electrode 720 located on a side of the second isolation portion 520 facing the hole region 13, and in step S03, the method further includes: making a circular cut in the substrate 100 at the second electrode 720.

[0140] In these optional embodiments, the first electrode layer 700 is broken at the position of the second isolation structure 500 to form a second electrode 720, making the film layer structure between the two second isolation structures 520 closer to the film layer structure used for cutting in the related art, and when cutting the substrate 100 at the second electrode 720, the substrate 100 can be cut using conventional cutting equipment and known equipment parameters, reducing the difficulty of cutting.

[0141] In some optional embodiments, before step S03, the method further includes: manufacturing a first package material layer on a side of the pixel definition layer 300 away from the substrate 100, and performing a patterning process on the first package material layer to obtain a first portion 811 located in the display area 11 and a second portion 812 located in the transition area 12 and the hole area 13, where at least a part of the second portion 812 is located in the first lightening portion 210.

[0142] In step S03, the method further includes: making a circular cut in the substrate 100 at the second portion 812;

[0143] In these optional embodiments, by providing the second portion 812 of the first package layer 810 in the first manufacturing groove, the film layer structure in the first manufacturing groove can be made closer to the film layer structure that is cut in the related art, and the substrate 100 can be cut using conventional cutting equipment and known equipment parameters, reducing the difficulty of cutting.

[0144] In some optional embodiments, before step S03, the method further includes: manufacturing a third package material layer on a side of the second portion 812 away from the substrate 100, and performing a patterning process on the third package material layer to obtain a third portion 831 located in the display area 11 and a fourth portion 832 located in the transition area 12 and the hole area 13, and at least a part of the fourth portion 832 located in the first lightening portion 210.

[0145] In step S03, the method further includes: making a circular cut in the substrate 100 in the fourth portion 832;

[0146] In these optional embodiments, by providing a fourth portion 832 of the third package layer 830 in the first manufacturing groove, the film layer structure in the first manufacturing groove can be made closer to the film layer structure that is cut in the related art, and the substrate 100 can be cut using conventional cutting equipment and known equipment parameters, reducing the difficulty of cutting.

[0147] Optionally, after the step of manufacturing a first package material layer on a side of the pixel definition layer 300 facing away from the substrate 100, the method further comprises: manufacturing a second package material layer on a side of the first package material layer facing away from the substrate 100.

[0148] A third packaging material layer is manufactured on the side of the second packaging material layer away from the substrate 100, and a patterning process is performed on the third packaging material layer to cut out at least a part of the third packaging material layer in the transition region 12 and the hole region 13 to obtain a third packaging layer 830, the third packaging layer 830 including a second lightening portion 833 located in the transition region 12. In these optional embodiments, after the third packaging material layer is manufactured, the third packaging material layer is cut in the transition region 12 and the hole region 13 to remove the third packaging material in the transition region 12 and the hole region 13 to form the second lightening portion 833, so that the thickness of the brittle film layer of the display panel 10 at the second lightening portion 833 in the transition region 12 and the hole region 13 is reduced, and when the substrate 100 is cut at the second lightening portion 833, a crack is not easily formed in the third packaging layer 830, and the crack is not easily extended toward the display region 11.

[0149] The hole 833 that avoids damage caused by the cutting described below is the second hollowed-out portion 833 described above.

[0150] Referring to FIG. 1, FIG. 2 and FIG. 15, FIG. 15 is a partial cross-sectional view of a display area of ​​a display panel according to an embodiment of the present application.

[0151] As shown in FIG. 1, FIG. 2 and FIG. 15, an embodiment of the present application provides a display panel 10, which includes a display area 11, a transition area 12 and a hole area 13, the display area 11 is arranged to surround the transition area 12, and the transition area 12 is arranged to surround the hole area 13, and the display panel 10 further includes a substrate 100, a first insulating layer 200 and a pixel definition layer 300, the first insulating layer 200 is disposed on the substrate 100, and a first lightening portion 210 is formed in the first insulating layer 200. the first hollowed-out portion 210 is located in the transition region 12 and is spaced apart from the display region 11, the first hollowed-out portion 210 extends from the transition region 12 to the boundary between the hole region 13 and the transition region 12, the pixel definition layer 300 is located on the side of the first insulating layer 200 away from the substrate 100, the pixel definition layer 300 includes a pixel regulating layer 310 and a pixel opening 320 formed by being surrounded by the pixel regulating layer 310, and the light-emitting layer 600 includes a light-emitting unit located in the pixel opening 320.

[0152] Optionally, the boundary is a cut edge of the hole area 13 of the display panel 10 , where the display panel 10 is cut to form the hole area 13 .

[0153] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a display area 11, a transition area 12 and a hole area 13, the display area 11 is arranged around the transition area 12, and the transition area 12 is arranged around the hole area 13. The display area 11 is used to realize the light-emitting display of the display panel 10, and the hole area 13 below the display panel is used to provide a light-sensitive assembly. The display panel 10 further includes a substrate 100, a first insulating layer 200 and a pixel definition layer 300. The pixel definition layer 300 includes a pixel regulating layer 310 and a pixel opening 320 formed by being surrounded by the pixel regulating layer 310, and the pixel opening 320 is used to provide a light-emitting unit. A first cutout 210 is formed in the first insulating layer 200 located between the pixel definition layer 300 and the substrate 100, and the first cutout 210 is located in the transition region 12 and spaced apart from the display region 11, thereby reducing the thickness of the brittle film layer located in the first cutout 210 of the display panel 10 or eliminating the brittle film layer. When the substrate 100 is cut at the first cutout 210, cracks are unlikely to form in the first insulating layer 200 and the cracks are unlikely to extend toward the display region 11, thereby improving the performance of the OLED display panel 10.

[0154] As shown in FIG. 15, optionally, the display panel 10 includes an array layer disposed on the substrate 100, and the first insulating layer 200 includes an interlayer insulating layer located in the array layer. For example, the array layer includes a metal layer, and the metal layer includes a first metal layer, a second metal layer, and a third metal layer that are stacked, and the first insulating layer 200 includes an interlayer insulating layer located between adjacent metal layers. The display panel 10 includes a pixel driving circuit, and the pixel driving circuit includes a transistor and a storage capacitor. The transistor includes a semiconductor, a gate, a source, and a drain. The storage capacitor includes a first electrode plate and a second electrode plate. As an example, the gate and the first electrode plate may be located in the first metal layer, the second electrode plate may be located in the second metal layer, and the source and drain may be located in the third metal layer.

[0155] For example, the array layer includes an active layer and a gate layer, and the gate layer is the first metal layer. Optionally, the first insulating layer 200 includes an inter-gate insulating layer between the active layer and the gate layer.

[0156] Optionally, the first insulating layer 200 comprises a planarizing layer located on the side of the pixel definition layer 300 facing the substrate 100 .

[0157] In some optional embodiments, the display panel 10 further includes a first package layer 810 located on a side of the pixel definition layer 300 away from the substrate 100, and the first package layer 810 includes a first portion 811 located in the display area 11.

[0158] In these optional embodiments, the first packaging layer 810 can package the first electrode layer 700 and the light-emitting layer 600 to reduce corrosion of the first electrode layer 700 and the light-emitting layer 600 by water or oxygen. The first portion 811 of the first packaging layer 810 is located in the display area 11 to improve packaging performance in the display area 11 of the display panel 10.

[0159] Optionally, a portion of the first package layer 810 in the transition region 12 can be etched to further reduce the thickness of the film layer in the transition region 12 of the display panel 10 and reduce the difficulty of cutting. In some optional embodiments, the display panel 10 further includes a second package layer 820, which is located on a side of the first package layer 810 away from the substrate 100 and on a side of the barrier 400 away from the transition region 12.

[0160] In these optional embodiments, the display panel 10 can be multi-layer packaged using a first package layer 810 and a second package layer 820 to further improve the packaging performance of the display panel 10. The second package layer 820 is blocked at the barrier 400, so that the entire second package layer 820 is located in the display area 11, and the failure of water or oxygen intrusion caused by water vapor entering the display area 11 from the transition area 12 can be improved.

[0161] In some optional embodiments, the display panel 10 further includes a third package layer 830, which is located on the side of the second package layer 820 away from the substrate 100, and at least one of the first package layer 810 and the third package layer 830 is provided with a blocking groove 840 or a hole 833 to avoid damage due to cutting.

[0162] In these optional embodiments, the display panel 10 can be triple-packaged using the first package layer 810, the second package layer 820, and the third package layer 830 to further improve the packaging performance of the display panel 10. When the hole region 13 is cut, the impact of the cutting of the hole region 13 on the first package layer 810 and / or the third package layer 830 can be reduced, and the first package layer 810 and / or the third package layer 830 can be cut to avoid the problem of cracks occurring in the first package layer 810 and / or the third package layer 830 and the cracks extending to the display region 11. The first package layer 810 and / or the third package layer 830 are cut into multiple parts by the blocking groove 840, and when a crack occurs due to the cutting of a part close to the hole region 13, the crack extension path is blocked by the blocking groove 840, so that the cracks can be prevented from extending to the display region 11.

[0163] Optionally, the first packaging layer 810 includes an inorganic material, the first packaging layer 810 uses an inorganic material for packaging, and the first packaging layer 810 using the inorganic material has good compactness and good packaging performance.

[0164] Optionally, the second packaging layer 820 includes an organic material, and the second packaging layer 820 can be packaged with the organic material to further improve the packaging performance of the packaging layer.

[0165] Optionally, the third package layer 830 includes an inorganic material, and the first package layer 810, the second package layer 820 and the third package layer 830 are packaged using inorganic materials, organic materials and inorganic materials respectively to form a TFE (Thin Film Encapsulation) thin film package structure, which can further improve the package performance of the package layers.

[0166] 4, the isolation structure 500 optionally includes a second isolation portion 520 located in the transition region, and the second isolation portion 520 and the hole region 13 are spaced apart. The second isolation portion 520 and the hole region 13 being spaced apart means that the second isolation portion 520 and the hole region 13 are spaced apart by a certain distance.

[0167] Optionally, the second isolation portion 520 is located in the first cutout portion 210, and the second isolation portion 520 is located within the first cutout portion 210 of the transition region 12 to block the membrane layer of the transition region 12 and reduce the extension of cracks caused by cuts in the membrane layer of the transition region 12 into the display region 11.

[0168] For reference, related technical proposals for isolation structures (also known as blocking structures, etc.) are described in patent / patent application PCT / CN2023 / 134518, Chinese patent application 202310759370.2, Chinese patent application 202311117143.6, Chinese patent application 202310771071.0, Chinese patent application 202310740412.8, Chinese patent application 202310707209.0, Chinese patent application 202310771124.9, Chinese patent application 202310855866.X, Chinese patent application 202311017132.0, Chinese patent application 202311124847.6, and Chinese patent application 202311091555.7.

[0169] In some optional embodiments, the first packaging layer 810 includes a second portion 812 located in the transition region 12 , with at least a portion of the second portion 812 located within the first recess 210 .

[0170] In these optional embodiments, the second portion 812 of the first package layer 810 is provided within the first cutout 210, thereby allowing the film layer structure within the first cutout 210 to be closer to the film layer structure used for cutting in related art, and allowing the substrate 100 to be cut using conventional cutting equipment and known equipment parameters, reducing the difficulty of cutting.

[0171] Optionally, the second portion 812 may be interrupted by the second isolation portion 520 to form two or more subsections broken from one another, with an interruption groove 840 located in the isolation structure 500 formed between adjacent subsections, so that when cutting the transition region 12, a crack may occur in the second portion 812 and the adjacent subsections may be interrupted by the interruption groove 840 to prevent the crack from extending and expanding between the multiple subsections, thereby reducing the likelihood of the crack in the second portion 812 extending into the display region 11.

[0172] In some optional embodiments, a subsection of the second portion 812 includes a first thinned portion 813 located on at least one side of the second standoff portion 520 .

[0173] In these optional embodiments, a subsection of the second portion 812 has a first thin portion 813 formed on at least one side of the second isolation portion 520, i.e., the thickness of the second portion 812 on at least one side of the second isolation portion 520 is thin, so that when the substrate 100 is cut on the side of the second isolation portion 520 toward the hole region 13, any cracks that occur are easily broken at the first thin portion 813 and are less likely to continue extending toward the display area 11.

[0174] Optionally, the second portion 812 and the first portion 811 are spaced apart from each other, so that when the substrate 100 is cut to the second portion 812 in the first lightening portion 210, a crack occurring in the second portion 812 cannot extend to the first portion 811, thereby ensuring the display reliability of the display panel 10. In some optional embodiments, the third package layer 830 includes a hole 833 for avoiding damage caused by cutting located in the transition region 12, and an orthogonal projection of the first lightening portion 210 onto the substrate 100 and an orthogonal projection of the hole 833 for avoiding damage caused by cutting onto the substrate 100 at least partially overlap each other.

[0175] In these optional embodiments, the orthogonal projections of the first cutout portion 210 and the hole 833 for avoiding damage due to cutting onto the substrate 100 at least partially overlap, so that the first cutout portion 210 and the hole 833 for avoiding damage due to cutting are at least partially connected, and at the overlap position, the display panel 10 has a smaller thickness, the display panel 10 is more easily cut at the overlap position, and cracks are less likely to form in the third package layer 830 and the first insulating layer 200 and less likely to extend towards the display area 11.

[0176] In some optional embodiments, the orthogonal projection of the first lightening cutout 210 onto the substrate 100 is located within the orthogonal projection of the hole 833 onto the substrate 100 to avoid damage from the cut.

[0177] In these optional embodiments, the orthogonal projection area of ​​the hole 833 that avoids damage due to cutting is larger than the orthogonal projection area of ​​the first cutout portion 210, so that when cutting the substrate 100 within the first cutout portion 210, the thickness is smaller, the cutting difficulty is lower, and the area of ​​the hole 833 that avoids damage due to cutting is larger, so that cracks are less likely to form in the third package layer 830 and are less likely to extend toward the display area 11.

[0178] In some optional embodiments, the first recess 210 is provided through the first insulating layer 200 along the thickness direction of the display panel 10 .

[0179] In these optional embodiments, the first cutout portion 210 is provided through the first insulating layer 200, so as to further reduce the thickness of the first insulating layer 200 located at the first cutout portion 210, reduce the difficulty of cutting the substrate 100 located at the first cutout portion 210, and cut the substrate 100 at the first cutout portion 210, making it less likely that cracks will occur in the first insulating layer 200 and that the cracks will not extend toward the display area 11, thereby improving the luminescence reliability of the display panel 10.

[0180] As shown in FIG. 3, in some optional embodiments, the first insulating layer 200 is provided with a third cutout 220 located in the transition region 12, the third cutout 220 surrounding the first cutout 210 and spaced apart from the first cutout 210.

[0181] In these optional embodiments, the third cutout portion 220 is arranged to surround the first cutout portion 210, and when other film layers are provided on the first insulating layer 200, the provision of the third cutout portion 220 increases the intrusion path for water and oxygen, making it more difficult for water and oxygen to invade the display area 11 through the transition area 12, thereby ensuring the reliability of the display panel 10.

[0182] Optionally, the plurality of third recessed portions 220 are provided at intervals. By providing the plurality of third recessed portions 220, it is possible to further increase the number of paths through which water and oxygen can enter.

[0183] Optionally, the third packaging layer 830 and / or the first packaging layer 810 are arranged to cover the side walls and bottom wall of the third recessed portion 220, thereby increasing the side length of the extension path of the third packaging layer 830 and / or the first packaging layer 810, and further increasing the intrusion path for moisture and oxygen.

[0184] As shown in Figures 4 and 5, optionally, the pixel definition layer 300 includes a second pixel regulation layer 312 located in the first cutout portion 210, and a second isolation portion 520 is located in the second pixel regulation layer 312, and the second pixel regulation layer 312 in the first cutout portion 210 is reserved, so that the film layer structure in the first cutout portion 210 is closer to the film layer structure for cutting in the related art, and the substrate 100 can be cut using conventional cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0185] In some optional embodiments, the pixel definition layer 300 further includes a first pixel regulation layer 311 located in the display area 11, and the pixel opening 320 includes a first pixel opening 321 formed by being surrounded by the first pixel regulation layer 311.

[0186] Optionally, the display panel 10 further includes a barrier 400 located on a side of the first insulating layer 200 facing away from the substrate 100, the barrier 400 being disposed between the first pixel regulation layer 311 and the first recessed portion 210 and forming an annular shape surrounding the transition region 12.

[0187] In these optional embodiments, the first pixel regulating layer 311 is located in the display area 11 to regulate the light emitting area of ​​the display area 11, i.e., the first pixel opening 321 is surrounded by the first pixel regulating layer 311, so that the display panel 10 emits light at the first pixel opening 321. The barrier 400 is provided between the first pixel regulating layer 311 and the first hollowed-out portion 210, and the barrier 400 allows a part of the film layer to be provided in the display area 11 and blocked at the position of the barrier 400, thereby improving the defect of water or oxygen intrusion caused by water vapor entering the display area 11 from the transition area 12.

[0188] As shown in FIG. 3, optionally, there are two or more barriers 400, and multiple barriers 400 are spaced apart, and the provision of multiple barriers 400 can further extend the water and oxygen ingress path and improve poor water and oxygen ingress caused by water vapor entering the display area 11 from the transition area 12.

[0189] In some optional embodiments, the isolation structure 500 is located on the side of the pixel regulation layer 310 away from the substrate 100, and the isolation structure 500 includes a first isolation portion 510 located on the side of the barrier 400 away from the transition region 12, and is surrounded by the first isolation portion 510 to form a first isolation opening 511, and the first pixel opening 321 is connected to the first isolation opening 511.

[0190] As shown in FIGS. 4 and 5, the light-emitting units optionally include a first light-emitting unit 610 located in the first isolation opening 511 .

[0191] In these optional embodiments, the first isolation portion 510 is provided in the display area 11, and is surrounded by the first isolation portion 510 to form a plurality of first isolation openings 511, thereby blocking the light-emitting layer 600 to form first light-emitting units 610 that are broken from each other, thereby reducing carrier crosstalk in the light-emitting layer 600 and improving the display effect of the display panel 10; and there is no need to use precision masks to manufacture the first light-emitting units 610, which reduces the development and use of precision masks and reduces manufacturing costs.

[0192] Optionally, a portion of the light-emitting layer 600 in the transition region 12 may be etched to form a cutout, which can further reduce the thickness of the film layer in the transition region 12 of the display panel 10 and make it less difficult to cut.

[0193] In some optional embodiments, the display panel 10 further includes a first electrode layer 700 located on the side of the light-emitting layer 600 facing away from the substrate 100, the first electrode layer 700 including a first electrode 710 located in the first isolation opening 511.

[0194] In these optional embodiments, the first electrode layer 700 is interrupted by first isolation portions 510 to form spaced apart first electrodes 710, each first electrode 710 being located in a first isolation opening 511, and the spaced apart first electrodes 710 being electrically connected by the first isolation portions 510 to form a full surface electrode.

[0195] Optionally, a portion of the first electrode layer 700 in the transition area 12 can be etched to further reduce the thickness of the film layer in the transition area 12 of the display panel 10 and make it less difficult to cut.

[0196] Optionally, the light-emitting layer 600 includes a second light-emitting unit 620 located on the side of the second isolation portion 520 facing the hole region 13 .

[0197] In these optional embodiments, the second pixel regulating layer 312 and the second isolation portion 520 are provided in the first cutout portion 210, and the second light-emitting unit 620 is provided on the side of the second isolation portion 520 facing the hole region 13, so that the film layer structure in the first cutout portion 210 can be made closer to the film layer structure used for cutting in related technologies, and the substrate 100 can be cut using conventional cutting equipment and known equipment parameters, thereby reducing the difficulty of cutting.

[0198] Optionally, the first electrode layer 700 includes a second electrode 720 on the side facing the hole region 13 of the second isolation portion 520, and by providing the second electrode 720 on the side facing the hole region 13 of the second isolation portion 520, the film layer structure within the first hollowed-out portion 210 can be made closer to the film layer structure used for cutting in related art, and the substrate 100 can be cut using conventional cutting equipment and known equipment parameters, reducing the difficulty of cutting.

[0199] Optionally, the third package layer 830 includes a third portion 831 located in the display area 11 and a fourth portion 832 located in the transition area 12, and at least a part of the fourth portion 832 is located in the first hollowed-out portion 210. By providing the fourth portion 832 of the third package layer 830 in the first hollowed-out portion 210, the film layer structure in the first manufacturing groove can be made closer to the film layer structure for cutting in the related art, and the substrate 100 can be cut using a conventional cutting device and known device parameters, reducing the difficulty of cutting.

[0200] Optionally, the fourth portion 832 includes second thin portions 834 located on both sides of the second isolation portion 520, i.e., the fourth portion 832 has a smaller thickness at the portions located on both sides of the second isolation portion 520, so that when the substrate 100 is cut on the side of the second isolation portion 520 toward the hole region 13, any cracks that occur are more likely to break at the second thin portions 834 and less likely to continue toward the display region 11.

[0201] 4, optionally, the isolation structure 500 includes a first layer 501, and each first electrode 710 is electrically connected to the first layer 501. The first electrodes 710 spaced apart from each other are electrically connected to each other through the first layer 501 to form a full-surface electrode, which makes it easier for the first electrodes 710 and the first layer 501 to overlap with each other, and can improve the overlap efficiency of the first electrodes 710.

[0202] In some optional embodiments, the isolation structure 500 further includes a second layer 502 located on the side of the first layer 501 away from the substrate 100, and the orthogonal projection of the first layer 501 onto the substrate 100 is located within the orthogonal projection of the second layer 502 onto the substrate 100.

[0203] In these optional embodiments, the first layer 501 and the second layer 502 are arranged to form an isolation structure 500, where the orthogonal projection of the first layer 501 arranged adjacent to the substrate 100 is located within the orthogonal projection of the second layer 502 onto the substrate 100, the area of ​​the second layer 502 is larger than the area of ​​the first layer 501, and the second layer 502 covers the surface of the first layer 501 adjacent to the second layer 502, where the first layer 501 is recessed relative to the second layer 502 in a direction away from the pixel opening 320. When the light-emitting layer 600 is manufactured, the light-emitting layer 600 generates a large step at the edge of the isolation structure 500, and the first layer 501 is recessed inward relative to the second layer 502, so that the light-emitting layer 600 is difficult to connect at the edge of the isolation structure 500, which causes breakage, and the light-emitting layer 600 breaks to form the first light-emitting unit 610 and the second light-emitting unit 620 that are broken from each other. In addition, the second layer 502 is recessed inward relative to the first layer 501, and when the first package layer 810 and the third package layer 830 are manufactured, the second portion 812 has a first thin portion 813 with a small thickness formed on both sides of the second layer 502, and the fourth portion 832 has a second thin portion 834 with a small thickness formed on both sides of the second layer 502.

[0204] Optionally, when the fourth portion 832 is broken at the barrier 400 and the substrate 100 is cut at the fourth portion 832 in the first hollowed-out portion 210, a crack that occurs in the fourth portion 832 cannot extend to the third portion 831, thereby ensuring the display reliability of the display panel 10.

[0205] Referring to FIG. 2, in some optional embodiments, the first recessed portion 210 includes a first opening 211 and a second opening 212 arranged opposite each other along the thickness direction of the display panel 10, the first opening 211 being located on the side of the second opening 212 away from the substrate 100, and the orthogonal projection of the second opening 212 onto the substrate 100 being located within the orthogonal projection of the first opening 211 onto the substrate 100.

[0206] In these optional embodiments, the area of ​​the first opening 211 of the first cutout portion 210 is larger than the area of ​​the second opening 212, so that the first cutout portion 210 is completely exposed toward the side away from the substrate 100, making it easier to cut the substrate 100 with the first cutout portion 210 and reducing the possibility of cutting the first insulating layer 200, making it less likely that cracks will occur in the first insulating layer 200 and extend toward the display area 11.

[0207] 6, optionally, the substrate 100 includes a base 110 and a protective film 120, the protective film 120 is located on the base 110, and a fourth groove 121 is formed in the protective film 120, the fourth groove 121 is provided to communicate with the first hollowed-out portion 210. By forming the fourth groove 121 in the protective film 120, the thickness of the display panel 10 in the transition region 12 can be further reduced, the difficulty of cutting the transition region 12 can be reduced, and the thickness of the display panel 10 can be reduced at the location of the fourth groove 121, thereby reducing the possibility of cracks occurring.

[0208] Optionally, the display panel 10 further includes a pixel electrode exposed from the first pixel opening 321, where one of the pixel electrode and the first electrode 710 is used as the anode of the first light-emitting unit 610, and the other is used as the cathode of the first light-emitting unit 610. In the embodiments of the present application, the pixel electrode is used as the anode of the first light-emitting unit 610, and the first electrode 710 is used as the cathode of the first light-emitting unit 610 as an example.

[0209] As shown in Figures 7 and 8, Figures 7 and 8 are masters before the display panel 10 is cut to form the hole region 13, and taking the masters in Figures 7 and 8 as examples, a circular cut is made at the boundary between the transition region 12 and the hole region 13 of the display panel 10 to form the display panel 10 of the embodiment of the present application. The cut line is not shown in the drawings, and the boundary between the transition region 12 and the hole region 13 is the boundary of the cut line, and other boundaries are spaced a certain width from the boundary.

[0210] 12 and 4, FIG. 12 is a cross-sectional view of still another embodiment taken along line AA in FIG. 1, and FIG. 4 is a cross-sectional view of still another embodiment taken along line AA in FIG.

[0211] As shown in FIG. 12, optionally, the pixel regulation layer 310 further includes an extension portion 313 connected to the first pixel regulation layer 311, and at least a portion of the extension portion 313 is located on a surface of the barrier 400 away from the substrate 100, which can raise the portion of the barrier 400 of the subsequent third package layer 830, reduce the gradient of the third package layer 830, and improve the package performance of the third package layer 830.

[0212] As shown in FIG. 4, the extension 313 can optionally extend to the transition region 12 to further increase the ingress path of water and oxygen in the extension 313 and reduce the ingress of water and oxygen into the display region 11.

[0213] As an option, extending portion 313 and second pixel regulation layer 312 are provided with a gap therebetween, so that cracks that occur when second pixel regulation layer 312 is cut are less likely to extend toward extending portion 313.

[0214] 2 and 10, FIG. 10 is a partial top view of a display panel according to an embodiment of the present application.

[0215] As shown in Figures 2 and 10, an embodiment of the present application provides a display panel 10, which includes a display area 11, a hole area 13, and a transition area 12 located between the display area 11 and the hole area 13; the display panel 10 further includes a substrate 100, a pixel definition layer 300, an emission layer 600, and an inorganic packaging layer, the pixel definition layer 300 is located on the substrate 100 side and includes a pixel regulating layer 310 and a pixel opening 320 formed by being surrounded by the pixel regulating layer 310; the emission layer 600 includes an emission unit located in the pixel opening 320; the inorganic packaging layer is located on the side of the emission unit away from the substrate 100; the inorganic packaging layer includes a hole 833 at least a part of which is located in the hole area 13 to avoid damage caused by cutting; and the orthogonal projection of the hole area 13 onto the substrate 100 is located within the orthogonal projection of the hole 833 to avoid damage caused by cutting onto the substrate 100.

[0216] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a display area 11, a transition area 12, and a hole area 13, the display area 11 is arranged around the transition area 12, and the transition area 12 is arranged around the hole area 13. The display area 11 is used to realize the light-emitting display of the display panel 10, and the hole area 13 below the display panel is used to provide a light-sensitive assembly. The display panel 10 further includes a substrate 100, a pixel definition layer 300, and a first package layer 810. The pixel definition layer 300 includes a pixel regulation layer 310 and a pixel opening 320 formed by being surrounded by the pixel regulation layer 310, and the pixel opening 320 is used to provide a light-emitting unit. The first package layer 810 packages the first electrode layer 700 and the light-emitting layer 600, and reduces the erosion of the first electrode layer 700 and the light-emitting layer 600 caused by water or oxygen. The first portion 811 of the first packaging layer 810 is located in the display area 11, and improves the packaging performance in the display area 11 of the display panel 10. The inorganic packaging layer is provided with a hole 833 for avoiding damage caused by cutting, and the thickness of the film layer at the cut line position of the display panel 10 is reduced, thereby reducing the difficulty of cutting the hole area 13. In addition, the orthogonal projection of the hole area 13 onto the substrate 100 is located within the orthogonal projection of the hole 833 for avoiding damage caused by cutting onto the substrate 100, and when cutting the hole area 13, the impact of cutting the hole area 13 on the inorganic packaging layer is reduced, and the problem of cracks occurring in the inorganic packaging layer and extending to the display area 11 due to the inorganic packaging layer being cut can be avoided.

[0217] Optionally, the inorganic package layer includes a first package layer 810 and a third package layer 830, the third package layer 830 being located on the side of the first package layer 810 away from the substrate 100, and holes 833 for avoiding damage due to cutting are opened in the first package layer 810 and / or the third package layer 830, so that when the hole region 13 is cut, the impact of cutting the hole region 13 on the first package layer 810 and / or the third package layer 830 can be reduced, and the problem of cracks occurring in the first package layer 810 and / or the third package layer 830 and extending to the display region 11 due to the first package layer 810 and / or the third package layer 830 being cut can be avoided.

[0218] Referring to FIG. 14, FIG. 14 is a cross-sectional view of still another embodiment taken along the line AA in FIG.

[0219] As shown in FIG. 14 , optionally, the inorganic packaging layer includes a blocking groove 840 located in the transition region 12, which blocks the inorganic packaging layer into multiple parts. When a part close to the hole region 13 is cut and a crack occurs, the blocking groove 840 can block the extension path of the crack, thereby preventing the crack from extending to the display region 11.

[0220] Optionally, the blocking groove 840 is annular and surrounds the hole region 13, and the blocking groove 840 can block the inorganic packaging layer on both sides of the hole region 13, further preventing cracks from extending to the display region 11.

[0221] Optionally, a blocking groove 840 is opened in the first packaging layer 810, and a hole 833 is opened in the third packaging layer 830 to prevent damage caused by cutting. When cutting the hole region 13, the impact on the third packaging layer 830 caused by cutting the hole region 13 can be reduced, and the third packaging layer 830 can be cut to avoid the problem of cracks occurring in the third packaging layer 830 and extending to the display region 11. The blocking groove 840 blocks the first packaging layer 810 into multiple parts, and when a part close to the hole region 13 is cut and a crack occurs, the extension path of the crack is blocked by the blocking groove 840, so that the crack can be prevented from extending to the display region 11.

[0222] Optionally, a blocking groove 840 can be provided penetrating the first packaging layer 810 along the thickness direction of the display panel 10, so that the first packaging layer 810 is completely blocked by the blocking groove 840, further preventing cracks from extending in the first packaging layer 810 to the display area 11.

[0223] Optionally, a hole 833 for avoiding damage due to cutting may be provided penetrating the third package layer 830 along the thickness direction of the display panel 10, so that the portion of the third package layer 830 at the hole 833 for avoiding damage due to cutting is completely hollowed out, thereby further avoiding the problem of cracks occurring in the third package layer 830 due to the third package layer 830 being cut when cutting.

[0224] 13 and 14 , optionally, the display panel 10 further includes an isolation structure 500 located on the substrate 100, the isolation structure 500 including a second isolation portion 520 located in the transition region 12, the second isolation portion 520 being spaced apart from the hole region 13, and a blocking groove 840 located on a side of the second isolation portion 520 away from the substrate 100. The inorganic package layer is blocked by the second isolation portion 520 to form the blocking groove 840, and the blocking groove 840 blocks the inorganic package layer into a plurality of portions, so that when a portion close to the hole region 13 is cut and a crack occurs, the extension path of the crack is blocked by the blocking groove 840, and the crack can be prevented from extending to the display region 11.

[0225] In some optional embodiments, the display panel 10 further includes a first insulating layer 200 located on the substrate 100, the first insulating layer 200 having a first cutout 210 formed therein, the first cutout 210 being located in the transition region 12 and spaced apart from the display region 11, and the first cutout 210 extending from the transition region 12 to the boundary between the hole region 13 and the transition region 12.

[0226] In these optional embodiments, a first cutout 210 is formed in the first insulating layer 200 located between the pixel definition layer 300 and the substrate 100, and the first cutout 210 is located in the transition region 12 and spaced apart from the display region 11, thereby reducing the thickness of the brittle film layer located in the first cutout 210 of the display panel 10 or removing the brittle film layer. When the substrate 100 is cut at the first cutout 210, cracks are less likely to form in the first insulating layer 200 and the cracks are less likely to extend toward the display region 11, thereby improving the performance of the OLED display panel 10.

[0227] Optionally, a first cutout 210 is provided penetrating the first insulating layer 200 along the thickness direction of the display panel 10, so that the first insulating layer 200 is completely blocked by the first cutout 210, further preventing cracks from extending in the first insulating layer 200 to the display area 11.

[0228] Optionally, the first cutout portion 210 is annular and surrounds the hole region 13, and the first cutout portion 210 blocks the first insulating layer 200 on all sides of the hole region 13, thereby further preventing cracks in the first insulating layer 200 from extending to the display region 11.

[0229] Optionally, the cut damage avoidance hole 833 is located in the transition region 12, so that when cutting the transition region 12, the inorganic packaging layer in which the cut damage avoidance hole 833 is located is cut during cutting, thereby avoiding the problem of cracking the inorganic packaging layer.

[0230] Optionally, the third cutout 220 is annular and surrounds the hole region 13, and the third cutout 220 blocks the first insulating layer 200 again around the hole region 13, further preventing cracks in the first insulating layer 200 from extending to the display region 11.

[0231] As shown in Figures 13 and 14, an embodiment of the present application provides a display panel 10, which includes a display area 11, a hole area 13, and a transition area 12 located between the display area 11 and the hole area 13, and the display panel 10 further includes a substrate 100, a first insulating layer 200, a pixel definition layer 300, an emission layer 600, and an inorganic packaging layer, wherein the first insulating layer 200 is located on the substrate 100, and a first cutout portion 210 is opened in the first insulating layer 200, the first cutout portion 210 is located in the transition area 12 and spaced apart from the display area 11, and the first cutout portion 210 extends from the transition area 12 to the boundary between the hole area 13 and the transition area 12. The pixel definition layer 300 is located on one side of the substrate 100 and includes a pixel regulating layer 310 and a pixel opening 320 surrounded by the pixel regulating layer 310, the light emitting layer 600 includes a light emitting unit located within the pixel opening 320, and the inorganic packaging layer is located on a side of the pixel definition layer 300 away from the substrate 100, and the inorganic packaging layer includes a blocking groove 840 located in the transition region 12.

[0232] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a display area 11, a transition area 12 and a hole area 13, the display area 11 is arranged around the transition area 12, and the transition area 12 is arranged around the hole area 13. The display area 11 is used to realize the light-emitting display of the display panel 10, and the hole area 13 below the display panel is used to provide a light-sensitive assembly. The display panel 10 further includes a substrate 100, a first insulating layer 200, a pixel definition layer 300 and a first package layer 810. The pixel definition layer 300 includes a pixel regulating layer 310 and a pixel opening 320 formed by being surrounded by the pixel regulating layer 310, and the pixel opening 320 is used to provide a light-emitting unit. The first insulating layer 200 between the pixel definition layer 300 and the substrate 100 has a first hollowed portion 210, which is located in the transition region 12 and spaced apart from the display region 11, thereby reducing the thickness of the brittle film layer located in the first hollowed portion 210 of the display panel 10 or eliminating the brittle film layer. When the substrate 100 is cut at the first hollowed portion 210, cracks are unlikely to form in the first insulating layer 200 and the cracks are unlikely to extend toward the display region 11, thereby improving the performance of the OLED display panel 10. The first packaging layer 810 packages the first electrode layer 700 and the light-emitting layer 600, and reduces the erosion of the first electrode layer 700 and the light-emitting layer 600 by water or oxygen. The first portion 811 of the first packaging layer 810 is located in the display region 11, improving the packaging performance of the display region 11 of the display panel 10. The blocking groove 840 blocks the inorganic package layer into multiple parts, and when a crack occurs due to a cut in a part close to the hole region 13, the blocking groove 840 blocks the extension path of the crack, thereby preventing the crack from extending to the display region 11.

[0233] Optionally, the inorganic package layer includes a first package layer 810 and a third package layer 830, and the blocking groove 840 is opened in the first package layer 810 and / or the third package layer 830, and the first package layer 810 and / or the third package layer 830 are blocked into a plurality of parts by the blocking groove 840, and when a crack occurs due to the cut of the part close to the hole region 13, the extension path of the crack is blocked by the blocking groove 840, and the crack can be prevented from extending to the display region 11. Optionally, the blocking groove 840 is provided around the hole region 13, so that any crack occurring on the inorganic package layer on the peripheral side of the hole region 13 is unlikely to extend to the display region 11.

[0234] Optionally, the blocking grooves 840 are multiple, which can further prevent cracks from extending to the display area 11 .

[0235] Optionally, a blocking groove 840 is opened in the first packaging layer 810, and a hole 833 for avoiding damage caused by cutting is opened in the third packaging layer 830. When cutting the hole region 13, the impact on the third packaging layer 830 caused by the cutting of the hole region 13 can be reduced, and the problem of cracks occurring in the third packaging layer 830 and extending to the display region 11 due to the cutting of the third packaging layer 830 can be avoided. The blocking groove 840 blocks the first packaging layer 810 into multiple parts, and when a crack occurs due to the cutting of the part close to the hole region 13, the extension path of the crack is blocked by the blocking groove 840, and the crack can be prevented from extending to the display region 11.

[0236] The structural design in this embodiment can be applied to other display panels 10, and specifically can be selected according to the actual situation, but this application does not specifically restrict it.

[0237] The embodiments of the present application further provide a display device including the display panel 10 of any of the above embodiments. Since the display device according to the embodiments of the present application includes the display panel 10 according to any of the above embodiments, the display device according to the embodiments of the present application has the beneficial effects of the display panel 10 according to any of the above embodiments, and the description thereof will be omitted here.

[0238] The display device in the embodiments of the present application includes devices with display functions such as mobile phones, personal digital assistants (abbreviated as PDA), tablet computers, e-books, televisions, gate controls, smart landlines, and consoles, but is not limited to these.

[0239] An embodiment of the present application further provides a manufacturing method for a display panel 10, and the display panel 10 may be the display panel 10 according to any of the above embodiments. With reference to Figs. 1 to 15 together, and also to Fig. 16, Fig. 16 is a flowchart of a manufacturing method for a display panel according to an embodiment of the present application. The display panel 10 includes a display area 11, a hole area 13, and a transition area 12 located between the display area 11 and the hole area 13. The manufacturing method includes:

[0240] Step S1: Fabricate a first insulating layer on a substrate, and open a first cutout portion in the first insulating layer, the first cutout portion being located in a transition region and spaced apart from a display region, and the first cutout portion extending from the transition region to a boundary between the hole region and the transition region.

[0241] Step S2: fabricating a pixel definition layer on the substrate, the pixel definition layer including a pixel regulation layer and a pixel opening surrounded by the pixel regulation layer.

[0242] Step S3: On the side of the pixel definition layer away from the substrate, a light-emitting layer is fabricated, the light-emitting layer including light-emitting units located within the pixel openings.

[0243] Step S4: fabricating an inorganic packaging layer on a side of the pixel definition layer away from the substrate, the inorganic packaging layer including a hole at least partially located in the hole region to avoid damage caused by the cut, and the orthogonal projection of the hole region onto the substrate is located within the orthogonal projection of the hole onto the substrate to avoid damage caused by the cut, or the inorganic packaging layer including a blocking groove located in the transition region.

[0244] Step S5: Cut along the cut line located inside the hole to avoid damage caused by cutting, and remove the membrane layer structure in the hole area to form an opening corresponding to the hole area.

[0245] According to the manufacturing method of the embodiment of the present application, the first insulating layer 200 is manufactured in step S1. The pixel defining layer 300 is manufactured in step S2. The light emitting layer 600 is manufactured in step S3. The inorganic package layer is manufactured in step S4. The hole region 13 is cut in step S5. The pixel defining layer 300 includes a pixel restricting layer 310, and is surrounded by the pixel restricting layer 310 to form a pixel opening 320, which is used to provide a light emitting unit. The first insulating layer 200 located between the pixel defining layer 300 and the substrate 100 is provided with a first lightening portion 210, which is located in the transition region 12 and spaced apart from the display region 11, thereby reducing the thickness of the brittle film layer located in the first lightening portion 210 of the display panel 10 or eliminating the brittle film layer. When the substrate 100 is cut at the first hollowed portion 210, cracks are unlikely to form in the first insulating layer 200 and the cracks are unlikely to extend toward the display area 11, improving the performance of the OLED display panel 10. The first packaging layer 810 packages the first electrode layer 700 and the light-emitting layer 600, and reduces the erosion of the first electrode layer 700 and the light-emitting layer 600 by water or oxygen. The first portion 811 of the first packaging layer 810 is located in the display area 11, improving the packaging performance of the display panel 10 in the display area 11. The inorganic packaging layer is provided with a hole 833 for avoiding damage caused by cutting, and the thickness of the film layer at the cut line position of the display panel 10 is reduced, reducing the difficulty of cutting the hole area 13. In addition, the orthogonal projection of the hole region 13 onto the substrate 100 is located within the orthogonal projection of the hole 833 onto the substrate 100, which avoids damage caused by cutting, and when cutting the hole region 13, the impact on the inorganic package layer caused by cutting the hole region 13 is reduced, and the problem of cracks occurring in the inorganic package layer and extending to the display region 11 due to the inorganic package layer being cut can be avoided. The blocking groove 840 blocks the inorganic package layer into multiple parts, and when a part close to the hole region 13 is cut and a crack occurs, the extension path of the crack is blocked by the blocking groove 840, and the crack can be prevented from extending to the display region 11.

[0246] The embodiment of the present application further provides a method for manufacturing a display panel 10, and the display panel 10 may be the display panel 10 according to any of the above embodiments. Please also refer to Figures 1 to 15 and Figure 9, which is a flowchart of another method for manufacturing a display panel according to an embodiment of the present application. The manufacturing method includes:

[0247] Step S01: fabricating a first insulating layer on a substrate, and opening a first fabrication groove in the first insulating layer, the first fabrication groove being located in a transition region and a hole region and spaced apart from a display region.

[0248] Step S02: Fabricating a pixel definition layer on a side of the first insulating layer remote from the substrate, the pixel definition layer including a pixel regulation layer and a pixel opening surrounded by the pixel regulation layer.

[0249] Step S03: Make an annular cut in the substrate within the first manufacturing groove to form a first recess and an aperture located in the hole region, the first recess extending from the transition region to a boundary between the hole region and the transition region.

[0250] According to the manufacturing method of the embodiment of the present application, a first insulating layer 200 is manufactured on the substrate 100 in step S01, and a first manufacturing groove is opened in the transition region 12 of the first insulating layer 200, and the first manufacturing groove and the display region 11 are spaced apart from each other. Next, in step S02, a pixel opening 320 is manufactured, which is surrounded by the pixel regulating layer 310 of the pixel defining layer 300, and a light-emitting unit is installed to realize the light-emitting display of the display panel 10. Finally, in step S03, the substrate 100 is cut into an annular shape in the first manufacturing groove, so that an opening is formed in the hole region 13 of the display panel 10, and a photosensitive assembly is installed in the hole region 13, and the photosensitive effect of the photosensitive assembly is ensured. Because the thickness of the film layer of the display panel 10 is small in the first manufacturing groove, when the substrate 100 is cut in the first manufacturing groove, cracks are not easily formed in the first insulating layer 200, and the cracks are not easily extended toward the display region 11, so that the use performance of the OLED display panel 10 can be improved.

[0251] In some optional embodiments, the pixel regulation layer 310 includes a first pixel regulation layer 311 located in the display area 11 and a second pixel regulation layer 312 located in the transition area 12, the second pixel regulation layer 312 is annular and spaced apart from the first pixel regulation layer 311, and at least a portion of the second pixel regulation layer 312 is provided in the first fabrication groove, and before step S03, the method further includes: fabricating an isolation structure 500 on a side of the pixel definition layer 300 away from the substrate 100, the isolation structure 500 including a first isolation portion 510 located in the first pixel regulation layer 311 and two spaced apart second isolation portions 520 located in the second pixel regulation layer 312.

[0252] In step S03, the method further includes: making an annular cut on the substrate 100 between the two second isolation portions 520;

[0253] In these optional embodiments, the first isolation portion 510 is provided in the display area 11, and is formed around a plurality of first isolation openings 511 to interrupt the light-emitting layer 600 to form the first light-emitting units 610 that are broken from each other, thereby reducing the crosstalk of carriers in the light-emitting layer 600, improving the display effect of the display panel 10, and eliminating the need for precision masks to manufacture the first light-emitting units 610, reducing the development and use of precision masks, and reducing manufacturing costs. The two second isolation portions 520 are provided on the second pixel regulating layer 312 with a gap therebetween, so that when cutting the substrate 100, a circular cut is made on the substrate 100 between the two second isolation portions 520, reducing the possibility of cutting the first insulating layer 200, and the first insulating layer 200 is less likely to crack and extend toward the display area 11.

[0254] In some optional embodiments, the display panel 10 further includes a second light-emitting unit 620 located on a side of the second isolation portion 520 toward the hole region 13, and in the step of making an annular cut in the substrate 100 in the first manufacturing groove, the method further includes: making an annular cut in the substrate 100 at the second light-emitting portion 620.

[0255] In these optional embodiments, the light-emitting layer 600 is broken at the second isolation structure 500 to form a second light-emitting unit 620, making the film layer structure between the two second isolation sections 520 closer to the film layer structure for cutting in the related art, and when cutting the substrate 100 at the second light-emitting unit 620, the substrate 100 can be cut using conventional cutting equipment and known equipment parameters, reducing the difficulty of cutting.

[0256] In some optional embodiments, the display panel 10 further includes a second electrode 720 located on a side of the second isolation portion 520 facing the hole region 13, and in step S03, the method further includes: making a circular cut in the substrate 100 at the second electrode 720.

[0257] In these optional embodiments, the first electrode layer 700 is broken at the second isolation structure 500 to form a second electrode 720, making the film layer structure between the two second isolation structures 520 closer to the film layer structure used for cutting in the related art, and when cutting the substrate 100 at the second electrode 720, the substrate 100 can be cut using conventional cutting equipment and known equipment parameters, reducing the difficulty of cutting.

[0258] In some optional embodiments, before step S03, the method further includes: manufacturing a first package material layer on a side of the pixel definition layer 300 away from the substrate 100, and performing a patterning process on the first package material layer to obtain a first portion 811 located in the display area 11 and a second portion 812 located in the transition area 12 and the hole area 13, at least a part of which is located in the first lightening portion 210.

[0259] In step S03, the method further includes: making a circular cut in the substrate 100 at the second portion 812;

[0260] In these optional embodiments, by providing the second portion 812 of the first package layer 810 in the first manufacturing groove, the film layer structure in the first manufacturing groove can be made closer to the film layer structure that is cut in the related art, and the substrate 100 can be cut using conventional cutting equipment and known equipment parameters, reducing the difficulty of cutting.

[0261] In some optional embodiments, before step S03, the method further includes: manufacturing a third package material layer on a side of the second portion 812 away from the substrate 100, and performing a patterning process on the third package material layer to obtain a third portion 831 located in the display area 11 and a fourth portion 832 located in the transition area 12 and the hole area 13, and at least a part of the fourth portion 832 located in the first lightening portion 210.

[0262] In step S03, the method further includes: making a circular cut in the substrate 100 in the fourth portion 832;

[0263] In these optional embodiments, by providing a fourth portion 832 of the third package layer 830 in the first manufacturing groove, the film layer structure in the first manufacturing groove can be made closer to the film layer structure that is cut in the related art, and the substrate 100 can be cut using conventional cutting equipment and known equipment parameters, reducing the difficulty of cutting.

[0264] Optionally, before step S03, the method further includes: removing the second portion.

[0265] In these optional embodiments, removing second portion 812 reduces the thickness of the film layer in transition region 12, making it easier to cut, and removing second portion 812 avoids the problem of cutting causing cracks in second portion 812 that may extend toward display region 11.

[0266] Optionally, after the step of manufacturing a first package material layer on a side of the pixel definition layer 300 away from the substrate 100, the method further includes: manufacturing a second package material layer on a side of the first package material layer away from the substrate 100; manufacturing a third package material layer on a side of the second package material layer away from the substrate 100, and performing a patterning process on the third package material layer to cut out at least a part of the third package material layer in the transition region 12 and the hole region 13, to obtain a third package layer 830, where the third package layer 830 includes holes 833 located in the transition region 12 to avoid damage caused by the cut. In these optional embodiments, after manufacturing the third packaging material layer, the third packaging material layer is cut in the transition region 12 and the hole region 13 to remove the third packaging material in the transition region 12 and the hole region 13 and form holes 833 that avoid damage caused by cutting, and the thickness of the brittle film layer of the display panel 10 at the locations of the holes 833 that avoid damage caused by cutting in the transition region 12 and the hole region 13 is reduced; and when the substrate 100 is cut at the holes 833 that avoid damage caused by cutting, cracks are less likely to form in the third packaging layer 830 and the cracks are less likely to extend toward the display region 11. [Explanation of symbols]

[0267] 10 display panel, 11 display region, 12 transition region, 13 hole region, 100 substrate, 110 undercoat, 120 protective film, 121 fourth groove, 200 first insulating layer, 210 first lightening portion, 211 first opening, 212 second opening, 220 third lightening portion, 300 pixel definition layer, 310 pixel regulation layer, 311 first pixel regulation layer, 312 second pixel regulation layer, 313 extension portion, 320 pixel opening, 321 first pixel opening, 400 barrier, 500 isolation structure, 501 first layer, 502 second layer, 510 first isolation portion, 511 first isolation opening, 520 second isolation portion, 600 light emitting layer, 610 first light emitting unit, 620 second light emitting unit, 700 First electrode layer, 710; first electrode, 720; second electrode, 810; first package layer, 811; first portion, 812; second portion, 813; first thin portion, 820; second package layer, 830; third package layer, 831; third portion, 832; fourth portion, 833; cut avoidance portion, 834; second thin portion, 840; blocking groove.

Claims

1. A display panel comprising a display area, a hole area, and a transition area located between the display area and the hole area, A substrate; a pixel definition layer located on one side of the substrate, the pixel definition layer including a pixel confinement layer surrounding the pixel aperture; a light-emitting layer including a light-emitting unit located within the pixel opening; an inorganic packaging layer located on a side of the light emitting unit away from the substrate; the inorganic packaging layer includes a hole that avoids damage caused by a cut, and an orthogonal projection of the hole area onto the substrate is located within an orthogonal projection of the hole that avoids damage caused by the cut onto the substrate; A display panel characterized by:

2. the inorganic package layer includes a first package layer and a third package layer, the third package layer is located on a side of the first package layer away from the substrate, and a hole for avoiding damage caused by the cut is opened in the first package layer or the third package layer; the display panel further comprises a second package layer located between the first package layer and the third package layer, the second package layer comprising an organic material; The inorganic package layer has a blocking groove in the transition region, The blocking groove is annular and surrounds the hole region; the blocking groove is provided through the first package layer along a thickness direction of the display panel, the hole for avoiding damage due to the cut is provided through the third package layer along a thickness direction of the display panel, The display panel further comprises an isolation structure located on the substrate, the isolation structure including a first isolation portion located in the display region and a second isolation portion located in the transition region; the second isolation portion is provided at a distance from the hole region, and the blocking groove is opened on a side of the second isolation portion away from the substrate.

2. The display panel according to claim 1 .

3. The substrate further includes a first insulating layer located on the substrate and having a first recessed portion formed therein; the first hollow portion is located in the transition area and is spaced apart from the display area; the first recessed portion extends from the transition region to a boundary between the hole region and the transition region, the first hollow portion is provided penetrating the first insulating layer along a thickness direction of the display panel, The first hollow portion is annular and surrounds the hole region, the hole for avoiding damage due to the cut is located in the transition region, and the orthogonal projection of the first hollow portion onto the substrate and the orthogonal projection of the hole for avoiding damage due to the cut onto the substrate at least partially overlap, or the first insulating layer is provided with a third hollow portion located in the transition region, the third hollow portion is provided surrounding the first hollow portion and spaced apart from the first hollow portion, and a plurality of the third hollow portions are provided at intervals, and the third hollow portion forms a ring shape surrounding the hole region; 2. The display panel according to claim 1 .

4. A display panel comprising a display area, a hole area, and a transition area located between the display area and the hole area, A substrate; a pixel definition layer located on one side of the substrate, the pixel definition layer including a pixel confinement layer surrounding the pixel aperture; a light-emitting layer including a light-emitting unit located within the pixel opening; an inorganic packaging layer located on a side of the light emitting unit away from the substrate, the inorganic packaging layer having a blocking groove in the transition region; A display panel characterized by:

5. the inorganic package layer includes a first package layer and a third package layer, the third package layer is located on a side of the first package layer away from the substrate, and the blocking groove is opened in the first package layer or the third package layer; The blocking groove is annular and surrounds the hole region; The blocking groove is a plurality of grooves, the inorganic packaging layer includes a hole that avoids damage caused by the cut located in the hole area, and an orthogonal projection of the hole area onto the substrate is located within an orthogonal projection of the hole that avoids damage caused by the cut onto the substrate; The display panel further includes an isolation structure located on the substrate, the isolation structure including a first isolation portion located in the display region and a second isolation portion located in the transition region, the second isolation portion being spaced apart from the hole region, and the blocking groove being located on a side of the second isolation portion away from the substrate; The display panel further includes a first insulating layer located on the substrate and having a first hollow portion formed therein, the first hollow portion being located in the transition region and spaced apart from the display region, the first hollow portion extending from the transition region to a boundary between the hole region and the transition region, the first hollow portion is provided penetrating the first insulating layer along a thickness direction of the display panel, The first hollow portion is annular and surrounds the hole region, The cut avoidance hole is located in the transition area, and an orthogonal projection of the first hollowed-out portion onto the substrate and an orthogonal projection of the hole for avoiding damage caused by the cut onto the substrate at least partially overlap with each other.

5. The display panel according to claim 4.

6. A display panel comprising a display area, a hole area, and a transition area located between the display area and the hole area, A substrate; a first insulating layer located on the substrate, the first insulating layer having a first recess located in the transition region and spaced apart from the display region, the first recess extending from the transition region to a boundary between the hole region and the transition region; a pixel definition layer located on a side of the first insulating layer remote from the substrate, the pixel definition layer including a pixel restriction layer surrounding the pixel opening; a light-emitting layer including a light-emitting unit located within the pixel opening; A display panel characterized by:

7. a first package layer located on a side of the light emitting unit away from the substrate and located in a first portion of the display area; a second package layer located on a side of the first package layer away from the substrate; a third package layer located on a side of the second package layer away from the substrate, At least one of the first package layer and the third package layer is provided with a blocking groove or a hole for avoiding damage due to a cut; the second package layer is located in the display area; 7. The display panel according to claim 6.

8. an isolation structure located on one side of the substrate, the isolation structure including a first isolation portion located in the display region and a second isolation portion located in the transition region; the second isolation portion is spaced apart from the hole region, the first package layer further includes a second portion located in the transition region, at least a portion of the second portion is located within the first lightening portion, the second portion is interrupted by the second isolation portion to form a plurality of subsections, and the interruption groove located in the isolation structure is formed between adjacent subsections; the subsection includes a first thinned portion located on at least one side of the second isolation portion; the pixel definition layer includes a second pixel regulation layer located in the first hollowed-out portion, and the second isolation portion is located on a side of the second pixel regulation layer away from the substrate; The first isolation opening is formed by being surrounded by the first isolation portion, the pixel definition layer includes a first pixel regulation layer located in the display area, the pixel opening includes a first pixel opening formed by being surrounded by the first pixel regulation layer, the first pixel opening communicates with the first isolation opening, the light emitting unit includes a first light emitting unit located in the first isolation opening, the display panel further includes a first electrode layer located on a side of the light emitting layer away from the substrate, the first electrode layer includes a first electrode located in the first isolation opening, and the light emitting unit includes a second isolation opening. the display panel further includes a barrier located on a side of the first insulating layer facing the hole region of the first insulating layer, the barrier being provided between the first pixel regulation layer and the first hollowed-out portion and forming an annular shape surrounding the transition region, there are two or more barriers, the pixel regulation layer further includes an extension portion connected to the first pixel regulation layer, at least a portion of the extension portion is located on a surface of the barrier away from the substrate, the extension portion extends to the transition region, and the extension portion is provided at a distance from the first pixel regulation layer.

8. The display panel according to claim 7.

9. the third package layer includes a hole located in the hole region for avoiding damage caused by the cut, an orthogonal projection of the first hollow portion onto the substrate and an orthogonal projection of the hole for avoiding damage caused by the cut onto the substrate at least partially overlap each other, and the first hollow portion is provided penetrating the first insulating layer along a thickness direction of the display panel, the first hollowed-out portion includes an upper surface and a lower surface provided opposite to each other along a thickness direction of the display panel, the upper surface being located on a side of the lower surface that is away from the substrate, the first hollowed-out portion having a first opening located on the upper surface and a second opening located on the lower surface, and an orthogonal projection of the second opening onto the substrate is located within an orthogonal projection of the first opening onto the substrate, The first insulating layer has a third recessed portion in the transition region, and the third recessed portion is provided surrounding the first recessed portion and spaced apart from the first recessed portion. The third recessed portions are provided at intervals.

8. The display panel according to claim 7.

10. A display panel according to any one of claims 1 to 9, A display device comprising:

11. 1. A method for manufacturing a display panel including a display area, a hole area, and a transition area located between the display area and the hole area, comprising: A first insulating layer is formed on a substrate, and a first recess is formed in the first insulating layer, the first recess is located in the transition region and spaced apart from the display region, and the first recess extends from the transition region to a boundary between the hole region and the transition region; fabricating a pixel definition layer on the substrate, the pixel definition layer including a pixel restriction layer and a pixel opening surrounded by the pixel restriction layer; fabricating a light-emitting layer on a side of the pixel defining layer away from the substrate, the light-emitting layer including a light-emitting unit located within the pixel opening; fabricating an inorganic packaging layer on a side of the pixel definition layer away from the substrate, the inorganic packaging layer including a cut avoidance hole located in the hole region, and an orthogonal projection of the hole region onto the substrate is located within an orthogonal projection of the cut damage avoidance hole onto the substrate, or the inorganic packaging layer including a blocking groove located in the transition region; and removing a membrane layer structure in the hole region by cutting along a cut line located inside the hole to avoid damage caused by the cut, thereby forming an opening corresponding to the hole region. Manufacturing method.

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