Resin molding device and resin molding manufacturing method

Abstract

To provide a resin molding device and a resin molding manufacturing method that can improve the molding quality of resin.SOLUTION: A resin molding device according to the present invention includes a first mold in which a substrate on which an electronic element is mounted can be placed, a second mold that forms a cavity between the first mold and the second mold, a transfer mechanism that supplies a resin material to the cavity by a plunger, and a control unit that controls the moving speed of the plunger on the basis of the volume value of the space in the cavity that can be filled with a resin material when the substrate is placed in the cavity.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product. [Background technology]

[0002] Patent Document 1 discloses a method for manufacturing a resin molded product by placing a substrate on which a chip is mounted in a cavity and filling the cavity with resin by moving a plunger of a transfer mechanism. Specifically, the resin filling rate in the cavity is indirectly controlled by adjusting the plunger rising speed according to the resin filling rate in the cavity based on the relationship between the resin filling rate in the cavity and the rising position of the plunger. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2022-148957 A Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, even if the moving speed of the plunger is the same, if the number of chips mounted on the substrate changes, the resin filling speed (filling time) in the cavity may substantially change as follows. (1) The amount of resin required to be filled varies depending on the number of chips on the board. Therefore, if the plunger moving speed is kept the same regardless of the number of chips, the resin filling speed will vary. (2) If the plunger moving speed is kept the same regardless of the number of chips, the resin filling time for a board with a large number of chips will be shorter, i.e., the resin filling speed in the cavity will be faster.

[0005] In this way, if the resin filling speed in the cavity is different, the molding quality will not be consistent. For example, if the resin filling speed is too fast, the wire may flow or the chip may shift. On the other hand, if the resin filling speed is too slow, some of the resin may harden and cause unfilled parts.

[0006] The present invention has been made to solve the above problems, and has an object to provide a resin molding apparatus and a method for manufacturing a resin molded product that can improve the molding quality of resin. [Means for solving the problem]

[0007] The resin molding apparatus of the present invention includes a first mold in which a substrate having a semiconductor chip mounted thereon can be placed, a second mold that forms a cavity between the first mold and the second mold, a transfer mechanism that supplies resin material to the cavity by a plunger, and a control unit that controls the moving speed of the plunger based on the volume value of the space in the cavity that can be filled with resin material when the substrate is placed in the cavity.

[0008] The manufacturing method of the present invention is a manufacturing method of a resin molded product in a resin molding apparatus including a first mold on which a substrate on which a semiconductor chip is mounted can be placed, a second mold that forms a cavity between the first mold and a transfer mechanism that supplies resin material to the cavity by a plunger, and includes the steps of placing the substrate on the first mold, clamping the second mold and the first mold, and supplying the resin material to the cavity by moving the plunger, and in the step of supplying the resin material to the cavity, the moving speed of the plunger is controlled based on the volume value of the space in the cavity that can be filled with resin material. Effect of the Invention

[0009] According to the present invention, the molding quality of the resin can be improved. [Brief description of the drawings]

[0010] [Figure 1] 1 is a plan view showing a schematic configuration of a resin molding apparatus according to an embodiment of the present invention; [Diagram 2] 2 is a cross-sectional view of a resin molding module provided in the resin molding apparatus of FIG. 1. [Diagram 3] 3 is a plan view of the lower mold of the resin molding module of FIG. 2, viewed from the mold surface side (above). [Figure 4] 3 is a plan view of the upper mold of the resin molding module of FIG. 2, viewed from the mold surface side (below). [Diagram 5] This is a plan view showing a connecting groove that connects the culls to each other. [Figure 6] This is a plan view showing an example in which culls are connected to each other via a cavity. [Figure 7] 3 is a partial cross-sectional view of the resin molded module of FIG. 2. [Figure 8] This is a model of the cavity used to calculate the moving speed of the plunger. [Figure 9] 4 is an example of a resin filling speed. [Figure 10] 4 is a flowchart showing a flow of resin molding. [Figure 11] 3 is a partial cross-sectional view of the resin molded module of FIG. 2. [Figure 12] 13 is another example of a model of a cavity used to calculate the moving speed of a plunger. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, a resin molding apparatus and a method for manufacturing a resin molded product according to one embodiment of the present invention will be described with reference to the drawings. For convenience of explanation, the following description will be given according to the directions shown in the drawings, but the present invention is not limited to these directions, and the direction can be changed depending on the state of the product to be implemented, for example. In addition, the following description will be given on the assumption that a lower mold is used as the first mold of the present invention, and an upper mold is used as the second mold of the present invention.

[0012] 1 is a plan view showing a schematic configuration of a resin molding apparatus according to this embodiment. This resin molding apparatus 1 is an apparatus for resin-sealing an electronic element such as a semiconductor chip (hereinafter simply referred to as a "chip 2a") on a substrate to manufacture a resin molded product. In particular, this embodiment illustrates a resin molding apparatus 1 that performs resin molding using a transfer molding method.

[0013] <1. Overview of resin molding equipment> 1, the resin molding apparatus 1 includes, as its components, a supply module 10, two resin molding modules 20, and an unloading module 30, which are arranged in this order from left to right. Each component is detachable and replaceable with respect to the other components.

[0014] <1-1. Supply module> The supply module 10 supplies a lead frame (hereinafter simply referred to as "substrate 2"), which is a type of substrate on which a chip 2a is mounted, and a resin tablet T to the resin molding module 20. In this embodiment, a lead frame is exemplified as the substrate 2, but various other substrates (glass epoxy substrate, ceramic substrate, resin substrate, metal substrate, etc.) can be used in addition to the lead frame. The supply module 10 mainly includes a frame sending section 11, a frame measuring section 12, a frame supply section 13, a resin sending section 14, a resin measuring section 15, a resin supply section 16, a loader 17, and a control section 18.

[0015] The frame sending section 11 sends out the substrate 2 that is not resin-sealed and is housed in an in-magazine unit (not shown) to the frame measuring section 12. The frame measuring section 12 measures the volume of the chip 2a attached to the substrate 2. Details of the frame measuring section 12 will be described later. After the measurement of the volume of the chip 2a has been completed in the frame measuring section 12, the substrate 2 is sent out to the frame supplying section 13. The frame supplying section 13 receives the substrate 2 from the frame measuring section 12, aligns the received substrate 2 appropriately, and passes it to the loader 17.

[0016] The resin sending section 14 receives the resin tablets T from a stocker (not shown), and sends out the resin tablets T to the resin measuring section 15. The resin measuring section 15 measures the weight (volume) of the resin tablets T. Details of the resin measuring section 15 will be described later. The resin tablets T whose weight has been measured in the resin measuring section 15 are sent out to the resin supplying section 16. The resin supplying section 16 receives the resin tablets T from the resin measuring section 15, aligns the received resin tablets T appropriately, and passes them to the loader 17.

[0017] The loader 17 transports the substrate 2 and the resin tablet T received from the frame supply unit 13 and the resin supply unit 16 to the resin molding module 20.

[0018] The control unit 18 controls the operation of each of the modules 10, 20, and 30 of the resin molding apparatus 1. In this embodiment, an example is shown in which the control unit 18 is provided in the supply module 10, but the control unit 18 can also be provided in other modules. It is also possible to provide a plurality of control units 18. For example, it is also possible to provide a control unit 18 for each module or device, and to individually control the operation of each module while linking them together.

[0019] <1-2. Resin molding module> Each of the two resin molding modules 20 resin-seals the chip 2a mounted on the substrate 2. By using the two resin molding modules 20 to resin-seal the substrate 2 in parallel, the manufacturing efficiency of resin molded products can be improved. As described below, the resin molding module 20 has a lower die 110 and an upper die 140, and uses molten resin material to resin-seal the chip 2a mounted on the substrate 2. The detailed configuration of the resin molding module 20 will be described later.

[0020] <1-3.Exit module> The unloading module 30 receives and unloads the resin-sealed substrate 2 from the resin molding module 20. The unloading module 30 mainly includes an unloader 31 and a substrate receiving section 32.

[0021] The unloader 31 holds the resin-sealed substrate 2 and carries it out to the substrate accommodation section 32. The substrate accommodation section 32 accommodates the resin-sealed substrate 2.

[0022] <2. Detailed configuration of resin molding module> Next, the configuration of resin molding module 20 will be described in detail with reference to Fig. 2 to Fig. 4. Fig. 2 is a cross-sectional view of the resin molding module, Fig. 3 is a schematic plan view showing the configuration of the lower mold as viewed from the mold surface side (above), and Fig. 4 is a schematic bottom view showing the configuration of the upper mold as viewed from the mold surface side (below).

[0023] 2, the resin molding module 20 mainly includes a lower mold installation section 100, a lower mold 110, a lower mold cavity adjustment mechanism 120, an upper mold installation section 130, an upper mold 140, a disc spring 150, an upper mold cavity adjustment mechanism 160, an air vent opening and closing mechanism 170, a transfer mechanism 180, and a mold clamping mechanism 190. Each part will be described below.

[0024] <2-1. Lower mold installation section> The lower mold installation part 100 is a part where the lower mold 110 is provided. The lower mold installation part 100 mainly comprises a lower mold movable base part 101 and a lower mold attachment part 102. The lower mold movable base part 101 constitutes the lower part of the lower mold installation part 100. The lower mold attachment part 102 is a part where the lower mold 110 is attached, and is provided on the upper part of the lower mold movable base part 101.

[0025] <2-2. Lower mold> The lower mold 110 constitutes the lower part of the molding die. The lower mold 110 mainly comprises a lower mold side block 111, a pot block 112, a lower mold cavity block 113, a lower mold pillar 114, and a lower mold elastic member 115. In this embodiment, as shown in Fig. 3, the pot block 112 is disposed in the center of the lower mold 110, and the lower mold cavity blocks 113 are disposed on the left and right thereof so as to sandwich the pot block 112. Furthermore, the lower mold side blocks 111 are disposed on the left and right outer sides of each lower mold cavity block 113, respectively.

[0026] Each lower die side block 111 constitutes an outer periphery of the lower die 110, and is provided on the upper surface of the lower die mounting portion 102. The pot block 112 is a portion in which the resin tablets T supplied from the supply module 10 are accommodated. The pot block 112 has a plurality of through holes (pots) for accommodating the resin tablets T. The pot block 112 is also provided on the upper surface of the lower die mounting portion 102.

[0027] Lower die cavity block 113 is a portion on which substrate 2 is placed. Lower die cavity block 113 is disposed between lower die side block 111 and pot block 112. Lower die cavity block 113 is movable relative to lower die side block 111 and pot block 112 in the vertical direction.

[0028] The lower die pillars 114 are members extending downward from the lower die cavity block 113. The upper ends of the lower die pillars 114 are fixed to the lower part of the lower die cavity block 113. In this embodiment, a plurality of lower die pillars 114 are provided.

[0029] The lower mold elastic member 115 is a member that applies an upward elastic force to each lower mold cavity block 113. Each lower mold elastic member 115 can be formed of, for example, a compression coil spring. Each lower mold elastic member 115 is disposed between the lower mold cavity block 113 and the lower mold attachment portion 102. Due to the biasing force of the lower mold elastic member 115, an upward force is always applied to the lower mold cavity block 113.

[0030] <2-3. Lower die cavity adjustment mechanism> The lower die cavity adjustment mechanism 120 has a function of adjusting the position of the lower die cavity block 113. The lower die cavity adjustment mechanism 120 mainly includes a lower die first wedge member 121, a lower die second wedge member 122, and a lower die wedge member drive unit 123.

[0031] The lower die first wedge member 121 and the lower die second wedge member 122 are a pair of members having tapered portions formed on the surfaces facing each other. The lower die second wedge member 122 is disposed above the lower die first wedge member 121. The lower die second wedge member 122 is disposed below the lower die pillar 114. The lower end of the lower die pillar 114 comes into contact with the lower die second wedge member 122, thereby restricting the downward movement of the lower die cavity block 113. This sets the position of the lower die cavity block 113.

[0032] The lower die wedge member driving unit 123 has a function of moving the lower die first wedge member 121 in the horizontal direction (left-right direction). The lower die wedge member driving unit 123 is formed by, for example, a servo motor or an air cylinder. The lower die wedge member driving unit 123 is connected to the lower die first wedge member 121 via a known power transmission member. When the lower die wedge member driving unit 123 is driven, the lower die first wedge member 121 can be moved arbitrarily in the left-right direction.

[0033] With the above configuration, the lower die cavity adjustment mechanism 120 can adjust the position of the lower die cavity block 113. That is, when the lower die wedge member drive unit 123 is driven to move the lower die first wedge member 121 in the left-right direction, the lower die second wedge member 122 in contact with the lower die first wedge member 121 is displaced up and down along the tapered portion. This displaces the position of the set lower die pillar 114, making it possible to adjust the position of the lower die cavity block 113.

[0034] <2-4. Upper mold installation section> The upper mold installation section 130 is a portion where the upper mold 140 is provided. The upper mold installation section 130 mainly includes an upper mold fixing base section 131, an upper mold attachment section 132, and a heater plate 133.

[0035] The upper mold fixing base part 131 constitutes the upper part of the upper mold installation part 130. The upper mold attachment part 132 is a part where the upper mold 140 is attached, and is provided on the lower part of the upper mold fixing base part 131. The upper mold attachment part 132 can be formed by combining a plurality of members. For example, a support part 132a that supports the upper mold 140 (upper mold base part 141) described later from below is attached to the upper mold attachment part 132. The heater plate 133 has a function of heating the upper mold 140, and is provided on the bottom surface of the upper mold attachment part 132.

[0036] <2-5. Upper mold> The upper die 140 constitutes the upper part of the molding die. The upper die 140 mainly comprises an upper die base portion 141, an upper die side block 142, an upper die cavity block 143, an upper die support 145, and an upper die pillar 146. In this embodiment, as shown in Fig. 4, a cull block 144 is disposed in the center of the upper die 140, and upper die cavity blocks 143 are disposed on the left and right thereof. Then, upper die side blocks 142 are disposed so as to surround the upper die cavity block 143 and the cull block 144.

[0037] The upper die base part 141 is a plate-shaped member that supports the upper die side block 142. The outer peripheral part of the upper die base part 141 is supported from below by the above-mentioned support part 132a. This allows the upper die base part 141 to move in the vertical direction relative to the upper die installation part 130.

[0038] The upper die side block 142 is provided on the lower surface of the upper die base portion 141, and constitutes the side surface of the cavity C formed by the upper die 140. The upper die side block 142 is formed in a frame shape, which forms an opening at a position corresponding to the resin molded product (cavity C). Furthermore, the upper die side block 142 is formed with an air vent groove 142a.

[0039] The air vent groove 142a is provided to exhaust air inside the cavity C to the outside. The air vent groove 142a is formed in an appropriate position on the lower surface of the upper die side block 142.

[0040] The upper die cavity block 143 constitutes the upper surface of the cavity C formed by the upper die 140. The upper die cavity block 143 is disposed inside the upper die side block 142 (more specifically, inside the opening of the upper die side block 142) and is movable relative to the upper die side block 142 in the vertical direction.

[0041] Cull block 144 is disposed at a position facing pot block 112 of lower mold 110, and constitutes the side surface of cavity C formed by upper mold 140. As shown in Fig. 4, a groove-shaped cull portion 144a and a runner portion 144b are formed on the lower surface of cull block 144 to guide the resin material to cavity C. In Figs. 2 and 4, in order to easily understand the flow of resin, a through hole (pot) of pot block 112 is shown diagrammatically to be connected to cavity C, which will be described later, via cull portion 144a and runner portion 144b.

[0042] The upper die supports 145 contact the upper die installation portion 130 to restrict the upward movement of the upper die 140 and define the position of the upper die 140. The upper die supports 145 are fixed to the upper surface of the upper die base portion 141 at a plurality of positions.

[0043] Upper die pillar 146 is a member extending upward from upper die cavity block 143. The lower end of upper die pillar 146 is fixed to the upper part of upper die cavity block 143, and extends upward through upper die base portion 141. Note that Fig. 2 shows a state in which release film F is adsorbed to the lower surface of upper die 140 (the surface forming cavity C).

[0044] <2-6. Disc spring> The disc spring 150 is a member that applies a downward force to the upper die 140. The disc spring 150 is disposed between the lower surface of the upper die installation portion 130 (heater plate 133) and the upper surface of the upper die 140 (upper die base portion 141). The biasing force of the disc spring 150 constantly applies a force to the upper die 140 in a direction away from the upper die installation portion 130 (downward).

[0045] <2-7.Upper die cavity adjustment mechanism> The upper die cavity adjustment mechanism 160 has a function of adjusting the position of the upper die cavity block 143. The upper die cavity adjustment mechanism 160 includes an upper die cavity block holding member 161, an upper die cavity block driving unit 162, a restricting member 163, an upper die elastic member 164, an upper die first wedge member 165, an upper die second wedge member 166, and an upper die wedge member driving unit 167.

[0046] The upper die cavity block holding member 161 is a member that holds the upper die cavity block 143 via the upper die pillar 146. The upper die cavity block holding member 161 is formed in a hollow frame shape when viewed from the front. The upper die cavity block holding member 161 can be formed by combining a plurality of members (upper and lower plate-like members and a plurality of cylindrical members connecting the upper and lower plate-like members, etc.). The upper die cavity block holding member 161 is disposed so as to penetrate the upper die fixing base part 131 from top to bottom. The upper die cavity block holding member 161 is also provided so as to be movable up and down relative to the upper die fixing base part 131. The upper end of the upper die pillar 146 is fixed to the lower surface of the upper die cavity block holding member 161. This allows the upper die cavity block holding member 161 to hold the upper die cavity block 143 via the upper die pillar 146.

[0047] The upper die cavity block driving unit 162 moves the upper die cavity block holding member 161 in the vertical direction (up and down direction). The upper die cavity block driving unit 162 is formed by, for example, a servo motor, an air cylinder, or the like. The upper die cavity block driving unit 162 is provided on the upper part of the upper die cavity block holding member 161. By driving the upper die cavity block driving unit 162, the upper die cavity block holding member 161 (and thus the upper die cavity block 143) can be moved arbitrarily in the vertical direction relative to the upper die installation unit 130.

[0048] The restricting member 163 restricts the movement of the upper cavity block holding member 161 by contacting with the upper cavity block holding member 161. The restricting member 163 can be formed by combining a plurality of members (plate-shaped members, etc.). The restricting member 163 includes an upper portion that straddles the upper cavity block holding member 161 from the left to right, and a central portion that is disposed inside the upper cavity block holding member 161. The central portion of the restricting member 163 is disposed so as to be able to contact the lower portion (bottom portion) of the upper cavity block holding member 161 from above. The restricting member 163 restricts the upward movement of the upper cavity block holding member 161 by contacting with the lower portion of the upper cavity block holding member 161 from above. This allows the depth of the cavity C to be determined.

[0049] The upper mold elastic member 164 applies an upward force to the regulating member 163. The upper mold elastic member 164 can be formed of, for example, a compression coil spring. The upper mold elastic member 164 is disposed between the regulating member 163 and the upper mold attachment portion 132, and an upward force is always applied to the regulating member 163 by the biasing force of the upper mold elastic member 164.

[0050] The upper die first wedge member 165 and the upper die second wedge member 166 are a pair of members having tapered portions formed on the surfaces facing each other. The upper die second wedge member 166 is disposed below the upper die first wedge member 165. The upper die first wedge member 165 and the upper die second wedge member 166 are disposed inside the upper die cavity block holding member 161. More specifically, the upper die first wedge member 165 and the upper die second wedge member 166 are disposed between the upper die fixed base portion 131 and the regulating member 163. The upper die second wedge member 166 is fixed to the upper surface of the regulating member 163.

[0051] The upper die wedge member drive unit 167 has a function of moving the upper die first wedge member 165 in the horizontal direction (left-right direction). The upper die wedge member drive unit 167 can be formed by, for example, a servo motor or an air cylinder. The upper die wedge member drive unit 167 is connected to the upper die first wedge member 165 via an appropriate power transmission member. By driving the upper die wedge member drive unit 167, the upper die wedge member drive unit 167 can be moved arbitrarily in the left-right direction.

[0052] With the above configuration, the upper mold cavity adjustment mechanism 160 can adjust the position of the upper mold cavity block 143. Specifically, when the upper mold cavity block drive unit 162 is driven to move the upper mold cavity block holding member 161 downward, a gap is formed between the regulating member 163 and the lower part of the upper mold cavity block holding member 161. That is, the regulating member 163 can move up and down by utilizing this gap. In this state, when the upper mold wedge member drive unit 167 is driven to move the upper mold first wedge member 165 in the left-right direction, the upper mold second wedge member 166 in contact with the upper mold first wedge member 165 is displaced up and down along the tapered portion. In addition, the regulating member 163 is also displaced up and down together with the upper mold second wedge member 166. After adjusting the restricting member 163 to a predetermined position, the upper die cavity block driving unit 162 is driven again to move the upper die cavity block holding member 161 upward until it comes into contact with the restricting member 163. By displacing the restricting member 163 up and down in this manner, the position at which the upward movement of the upper die cavity block holding member 161 is restricted is displaced, and therefore the position of the upper die cavity block 143 can be adjusted.

[0053] <2-8. Air vent opening and closing mechanism> The air vent opening and closing mechanism 170 has a function of opening and closing the air vent groove 142a that communicates between the cavity C and the outside. The air vent opening and closing mechanism 170 mainly includes an air vent pin 171 and an air vent driver 172.

[0054] The air vent pin 171 closes the air vent groove 142a. More specifically, the air vent pin 171 is provided in a through hole in the upper side block 142 that communicates with the air vent groove 142a so as to be movable up and down.

[0055] The air vent driving unit 172 moves the air vent pin 171 in the up-down direction. The air vent driving unit 172 can be formed of, for example, a servo motor or an air cylinder. The air vent driving unit 172 is connected to the air vent pin 171 via an appropriate power transmission member. By driving the air vent driving unit 172, the air vent pin 171 can be moved arbitrarily in the up-down direction. For example, the air vent groove 142a can be closed by moving the air vent pin 171 downward.

[0056] <2-9.Transfer mechanism> The transfer mechanism 180 has a function of supplying a resin material to the cavity C. The transfer mechanism 180 mainly includes a transfer drive unit 181, a plunger 182, and a plunger load measurement unit 183.

[0057] The transfer drive unit 181 is a drive source that moves a plunger 182 (described later) in a vertical direction (up and down direction). The transfer drive unit 181 can be formed by, for example, a servo motor or an air cylinder. The transfer drive unit 181 is provided on the lower die movable base part 101 below the pot block 112.

[0058] The plunger 182 is a member for supplying the molten resin material to the cavity C. Therefore, the plunger 182 is capable of moving up and down (raising and lowering) within the pot block 112. The resin material is formed by melting the resin tablet T accommodated in the pot block 112.

[0059] The plunger load measuring unit 183 measures the force (plunger load) applied to the plunger 182. Specifically, the force applied to the plunger 182 is the force with which the transfer driving unit 181 presses the plunger 182. The plunger load measuring unit 183 can be formed by, for example, a load cell. The plunger load measuring unit 183 is provided between the transfer driving unit 181 and the plunger 182.

[0060] <2-10. Clamping mechanism> The mold clamping mechanism 190 has a function of lifting the lower mold 110 and clamping (clamping) the lower mold 110 and the upper mold 140. The mold clamping mechanism 190 mainly includes a fixed platen 191, a support 192, a drive mechanism 193, and a clamp load measuring unit 194.

[0061] The fixed platen 191 is a portion that is placed on the ground (installation surface) and supports other members. A lower die 110 (lower die installation portion 100) is disposed above the fixed platen 191 via a drive mechanism 193, which will be described later.

[0062] The support pillars 192 are members that support the upper mold 140 (upper mold installation part 130). The support pillars 192 extend upward from the fixed platen 191, and the upper mold fixing base part 131 of the upper mold installation part 130 is fixed to the upper part of the support pillars 192. As a result, the upper mold 140 (upper mold installation part 130) is disposed above the lower mold 110 (lower mold installation part 100).

[0063] The driving mechanism 193 has a function of moving the lower mold 110 (lower mold installation section 100) in the vertical direction (up and down direction). The driving mechanism 193 can be formed by, for example, a driving source such as a servo motor and an appropriate power transmission mechanism. The driving mechanism 193 is disposed between the fixed platen 191 and the lower mold installation section 100. By driving the driving mechanism 193, the lower mold installation section 100 can be moved (raised and lowered) arbitrarily in the vertical direction. For example, the lower mold 110 can be clamped by raising it toward the upper mold 140 using the driving mechanism 193. Also, the lower mold 110 can be opened by lowering it in a direction away from the upper mold 140 using the driving mechanism 193.

[0064] The clamp load measuring unit 194 has a function of measuring the force (clamp load) when the lower die 110 and the upper die 140 are clamped by the clamping mechanism 190, and is provided on the support 192. The clamp load measuring unit 194 can be formed by, for example, a load cell or a strain gauge, and can measure the clamp load based on the load applied to the support 192.

[0065] FIG. 2 shows a state in which the lower die 110 and the upper die 140 are clamped together after the substrate 2 and the resin tablet T have been transported to the forming die.

[0066] <3. Overview of the resin molding device operation> Next, an outline of the operation of the resin molding apparatus configured as above (a method for manufacturing a resin molded product) will be described with reference to FIGS.

[0067] In the supply module 10, the frame sending section 11 sends out the substrate 2 accommodated in an in-magazine unit (not shown) to the frame measuring section 12. The frame measuring section 12 measures the volume of the chips 2a in the received substrate 2, and then sends the substrate 2 to the frame supply section 13. The frame supply section 13 appropriately aligns the received substrate 2 and passes it to the loader 17.

[0068] Furthermore, the resin sending unit 14 sends out the resin tablets T received from a stocker (not shown) to the resin measuring unit 15. The resin measuring unit 15 measures the weight of the received resin tablets T, and then sends the resin tablets T to the resin supplying unit 16. The resin supplying unit 16 transfers the required number of the received resin tablets T to the loader 17. The loader 17 transports the received substrate 2 and resin tablets T to the molding die of the resin molding module 20.

[0069] In the resin molding module 20, the mold clamping mechanism 190 clamps the molding die. Then, the resin tablet T is heated and melted by a heating section (not shown) of the molding die, and the substrate 2 is resin-sealed using the molten resin that is produced. After the resin sealing is completed, the mold clamping mechanism 190 opens the molding die. Then, the resin-sealed substrate 2 is released from the die. The operation of the resin molding module 20 will be described in detail later.

[0070] Thereafter, the unloader 31 unloads the substrate 2 from the mold and stores it in the substrate storage section 32 of the unloading module 30. At this time, unnecessary parts (unnecessary resin such as culls and runners) of the resin-molded substrate 2 are appropriately removed. In this manner, a resin-sealed substrate 2 (resin molded product) is manufactured.

[0071] <4. Operation of resin molding module> The operation of the resin molding module 20 will be described in detail below. In this embodiment, when resin molding is performed in the resin molding module 20, control is performed to improve the dimensional accuracy of the product (specifically, the dimensional accuracy of the thickness of the molded resin). This will be described with reference to Figs. 7 and 8. Fig. 7 is a partial cross-sectional view of the resin molding module, and Fig. 8 is a diagram for explaining modeling of the cavity.

[0072] Prior to the resin moldability, the control unit 18 calculates and sets the following items. (1) Volume of resin tablet T The specific gravity of the resin tablet T to be used is input to the control unit 18, and the volume of the resin tablet T is calculated from the weight of the resin tablet T measured based on the specific gravity. Specifically, the following examples can be given.

[0073] The volume of the resin tablet T is measured in the resin measuring section 15 of the supply module 10 as described above. In the resin measuring section 15, the volume of the resin tablet T can be measured using any measuring device. An example of the resin measuring section 15 is a weighing scale that measures the weight of the resin tablet T. The volume of the resin tablet T is calculated from the weight of the resin tablet T measured by the weighing scale and the specific gravity of the resin tablet T. The method of measuring the volume of the resin tablet T is not particularly limited, and it is possible to measure using various other devices. For example, various types of three-dimensional scanners, laser volume meters using laser light, etc. can be used.

[0074] (2) Volume of chip 2a The volume of the chip 2a on the substrate 2 is measured in the frame measuring unit 12 of the supply module 10 as described above. In the frame measuring unit 12, the volume of the chip 2a on the substrate 2 can be measured using any measuring device. One example of the frame measuring unit 12 is a volume meter that measures the volume of the chip 2a on the substrate 2. The volume meter is a laser volume meter that measures the shape (and therefore the volume) of the chip 2a by detecting the distance to the chip 2a on the substrate 2 using a laser beam. The method of measuring the volume of the chip 2a is not particularly limited, and it is possible to measure using various other devices. For example, various types of three-dimensional scanners, etc. can be used.

[0075] (3) Capacity (volume value) of cavity C, resin filling rate, and plunger position The volume of cavity C is calculated based on the pre-stored dimensions of each part (upper side block 142, upper cavity block 143, pot block 112, cull block 144, etc.) and the vertical position of upper cavity block 143. The vertical position of upper cavity block 143 can be grasped based on the drive amount of upper wedge member drive unit 167, etc. The control unit 18 can calculate what percentage of the volume of cavity C is filled with molten resin material (resin filling rate) at what position the plunger 182 has risen to, based on the calculated volume of cavity C and the measured volumes of resin tablet T and tip 2a.

[0076] 7, the control unit 18 calculates positions of the plunger 182 where the resin filling rate of the cavity C is 0%, 25%, 50%, 75% and 100% (hereinafter referred to as positions T0, T25, T50, T75 and T100, respectively). The distance represented by T100-T0 corresponds to L of the present invention.

[0077] The position T0 of the plunger 182 is determined based on the volume calculated from the weight of the resin tablet T as described above. That is, if the volume of the resin tablet T is large, the position T0 is set downward, and if the volume is small, the position T0 is set upward. In addition, the position T100 of the plunger 182 is the position where the filling of the resin is completed, and is therefore set based on the capacity (volume value) of the cavity C calculated as described above.

[0078] Moreover, the information regarding the above-mentioned positions is input in advance to the control unit 18. In this embodiment, five positions (T0, T25, T50, T75, and T100) are set, but the coordinates of these positions and the number of positions can be appropriately set according to the molded product to be manufactured. This also applies to Fn and Vn, which will be described later.

[0079] (4) Determination of resin filling speed In this embodiment, the moving speed of the plunger 182 is adjusted according to the resin filling rate, thereby making it possible to prevent occurrence of insufficient filling of the resin material.

[0080] In this embodiment, as shown in FIG. 7, there are four sections A1 to A4 between T0 and T100, and the resin filling speed (F1 to F4: collectively referred to as Fn) in the cavity C is determined in these four sections A1 to A4. Such a resin filling speed Fn can be determined in advance by experiments, numerical analysis, etc. For example, such a resin filling speed Fn can be determined by judging the presence or absence of wire flow and chip shift due to the resin flow speed based on experiments or numerical analysis using a test chip mounting substrate, or can be determined empirically. Also, the resin filling speed can be determined from the viewpoint of the hardening characteristics of the resin used.

[0081] (5) Calculating the plunger movement speed In this embodiment, the moving speed of the plunger 182 is calculated as follows. This point will be described with reference to FIG.

[0082] In this embodiment, the cavity is expressed by a simple rectangular parallelepiped model as shown in FIG. 8. That is, this model assumes that the resin is uniformly filled into the cavity C as shown in FIG. 8(b) from the initial state of FIG. 8(a). In this cavity C, the length from the end on the pod side (the side closer to the plunger 182) to the end on the air vent side (the side farther from the plunger 182) is W (the length in the direction in which the resin material flows in the cavity C). Then, it can be assumed that the time when the plunger 182 moves is the same as the time when the resin flows in the cavity C. Therefore, if the resin filling speed F is determined, the moving speed V of the plunger 182 can be calculated by the following formula (1). V = F × (T100 - T0) / W (1)

[0083] In this embodiment, since the resin filling speed is set in the four sections A1 to A4 as described above, the moving speed Vn (n=4) in each of the sections A1 to A4 can be calculated using the following formulas (2) to (5). V1 = F1 × (T100 - T0) / W (2) V2 = F2 × (T100 - T0) / W (3) V3 = F3 × (T100 - T0) / W (4) V4 = F4 × (T100 - T0) / W (5) That is, in this embodiment, the moving speed of the plunger 182 is different in the four sections A1 to A4. Furthermore, formulas (1) to (5) may be collectively expressed as formula (6) below. Vn = Fn × (T100 - T0) / W (6) Equations (2) to (5) can also be rewritten as the following equations (7) to (10), respectively. V1 = F1 × (T25 - T0) / (W25 - W0) (7) V2=F2×(T50-T25) / (W50-W25) (8) V3=F3×(T75-T50) / (W75-W50) (9) V4=F4×(T100-T75) / (W100-W75) (10) Here, W0 is the position of the end of cavity C on the pod side, W100 is the position of the end of cavity C on the air vent side, and W25, W50, and W75 are the positions where the resin filling speed in the cavity switches to F2, F3, and F4, respectively.

[0084] FIG. 9 shows an example of the moving speed Vn of the plunger. In the example of FIG. 9, as the plunger 182 rises, the moving speed Vn decreases. Also, the rate of change of the moving speed Vn is decreased as the plunger 182 rises. That is, in this example, as the filling of the resin into the cavity C progresses, the moving speeds V1 to V4 of the plunger are decreased. Since the viscosity of the resin decreases with time, it is considered that if the filling speed of the resin is increased under such circumstances, the resin may be divided and gaps, that is, unfilled portions or voids may occur. Therefore, in the example of FIG. 9, the moving speed of the plunger 182 is decreased with time. However, this is only an example and can be changed as appropriate. Also, the values ​​shown on the vertical axis of FIG. 9 are added to show an example of the rate of change of the moving speed, and do not indicate a specific speed.

[0085] (6) Resin molding flow Next, the flow of resin molding will be described with reference to the flowchart shown in Fig. 10. First, as described above, a resin filling speed Fn corresponding to a predetermined resin filling rate of the cavity C is determined (step S1). Following this, as described above, a moving speed Vn of the plunger is calculated (step S2).

[0086] Next, the volumes of the resin tablet T and the chip 2a are obtained (step S3).

[0087] Next, the substrate 2 and the resin tablet T are each transported to the molding die of the resin molding module 20. Specifically, the substrate 2 is placed on the lower die 110, and the resin tablet T is accommodated in the pot of the pot block 112. Following this, the lower die 110 and the upper die 140 are clamped by the clamping mechanism 190 (step S4). Specifically, the lower die 110 is raised by the clamping mechanism 190, and the lower die 110 comes into contact with the upper die 140 from below. This closes the cavity C. At this time, as shown in FIG. 11, the upper die 140 is raised to a position where the upper die support 145 comes into contact with the upper die installation section 130 (heater plate 133).

[0088] Next, the plunger 182 is raised (step S5). First, the plunger 182 is raised from position T0 to position T25 at the above-mentioned speed V1. Then, when the position of the plunger 182 reaches position T25 (position where the resin filling rate is 25%) (YES in step S6), the movement speed of the plunger 182 is adjusted (step S7). That is, the movement speed of the plunger 182 is changed to the movement speed V2 in the next movement section (positions T25 to T50). In this way, the movement speed of the plunger 182 is changed every time the movement section is changed (step S7), and when the position of the plunger 182 reaches position T100 (position where the resin filling rate is 100%) (YES in step S8), the plunger 182 is stopped.

[0089] Following this, the plunger 182 is lowered (step S10). Then, the lower mold 110 and the upper mold 140 are opened by the mold clamping mechanism 190 (step S11). Thereafter, the substrate 2 for which resin molding (resin sealing) has been completed is unloaded from the molding die. The unloaded substrate 2 is transported to the unloading module 30.

[0090] <5.Features> According to this embodiment, the following effects can be obtained. (1) If the moving speed of the plunger 182 is the same regardless of the number of chips 2a on the substrate 2, the filling speed of the resin material in the cavity C changes. For example, in a substrate 2 with a large number of chips 2a, the filling time of the resin material is shorter. In other words, the filling speed of the resin in the cavity C becomes faster. In this way, if the filling speed of the resin in the cavity C differs, there is a problem that the quality of the molded product is not consistent. For example, if the filling speed of the resin is too fast, the wire may flow or the chip may shift. On the other hand, if the filling speed of the resin is too slow, part of the resin may harden, resulting in non-filling.

[0091] Therefore, in this embodiment, the volume of the space in the cavity C that can be filled with the resin material is calculated based on the volume of the chip 2a, and an appropriate filling speed of the resin material flowing in the cavity C is set in advance based on this volume value. That is, a filling speed of the resin suitable for the calculated volume of the cavity C is set in advance. Then, the moving speed of the plunger 182 is set so that the resin material flows in the cavity C at the set filling speed. Therefore, the quality of the resin molding can be improved. In particular, the quality can be maintained or improved when there is a constraint on the resin filling time from the viewpoint of the hardening characteristics of the resin.

[0092] (2) In this embodiment, the resin filling rate (the position of the plunger 182 corresponding to the resin filling rate) is calculated based on the actual measured volume of the resin tablet T and the chip 2a of the substrate 2. Therefore, the resin filling rate of the cavity C can be accurately grasped regardless of variations in volume of each resin tablet T.

[0093] (3) By adjusting the moving speed of the plunger 182 to V1 to V4 according to the resin filling rate, it is possible to prevent the occurrence of non-filling of the resin material. Specifically, the resin material flowing in the cavity C flows through relatively easy-to-flow parts (e.g., parts of the substrate 2 where the chip 2a is not provided) and relatively difficult-to-flow parts (e.g., parts of the substrate 2 where the chip 2a is provided), so it may be desirable to adjust the flow speed to improve circulation of the resin. Therefore, by adjusting the moving speed of the plunger 182 according to the resin filling rate as described above, it is possible to improve circulation of the resin.

[0094] <6. Variations> Although one embodiment of the present invention has been described above, the present invention is not limited to the above-mentioned embodiments, and various modifications are possible without departing from the spirit of the present invention. For example, the following modifications are possible. In addition, the gist of the following modifications can be combined as appropriate.

[0095] <6-1> In the above embodiment, the model shown in FIG. 8 is used to calculate the moving speed of the plunger using equations (1) to (5) (or equations (7) to (10)), but the present invention is not limited to this. For example, assume that the cavity has a shape as shown in FIG. 12. This cavity C has three regions. That is, it has a region (chip region B) where the chip 2a is arranged, a region on the pod side where the resin is injected and reaches the chip region B (resin injection region A), and a region on the air vent side where excess resin is flowed to prevent the chip region B from being left unfilled with resin (flow cavity region C).

[0096] In the cavity model shown in FIG. 12, the chip region B is formed in a rectangular parallelepiped shape, and the resin injection region A and the flow cavity region C are formed in a triangular prism shape (the longitudinal section is a right-angled triangle). The lengths of the resin injection region A, the chip region B, and the flow cavity region C in the direction in which the resin is filled are respectively defined as X A ,X B ,X C(These are sometimes written as WA, WB, and WC.)

[0097] In this model, the position and velocity of the plunger in each region can be set as follows: (1) Position of the plunger corresponding to resin injection area A T0~T0+(T100-T0)*X A / (2X B +X A +X C ) Since the tip 2a is not disposed in this region, the moving speed of the plunger 182 may be arbitrary.

[0098] (2) Plunger position corresponding to tip area B T0+(T100-T0)*X A / (2X B +X A +X C )~T0+(T100-T0)*(X A +2X B ) / (2X B +X A +X C ) The plunger movement speed (constant speed) VB in this region is given by: VB = 2FB * (T100 - T0) / (2X B +X A +X C ) where FB is the resin filling speed in chip area B.

[0099] (3) Position of the plunger corresponding to flow cavity region C T0+(T100-T0)*(X A +2X B ) / (2X B +X A +X C )~T100 The movement speed of the plunger may be any speed such that the movement speed becomes 0 when the plunger reaches position T100.

[0100] Incidentally, immediately after the plunger 182 starts to rise, it is necessary to push out the resin filling the runner portion first, so the initial position of the plunger 182 is lower than position T0 (the position where the resin filling rate in the cavity is 0%). Also, the moving speed of the plunger 182 from the initial position to position T0 can be any value because the resin does not flow through the tip region B.

[0101] The above model can be used when the resin injection area A and the flow cavity area C where no chips are arranged cannot be ignored in filling the resin.

[0102] The above-mentioned setting of the moving speed of the plunger is one example, and various modifications are possible. That is, the optimal filling speed of the resin in the cavity is set based on the volume value of the space in the cavity that can be filled with the resin material, and the moving speed of the plunger 182 is set based on this.

[0103] <6-2> 1, when there is one plunger 182 and multiple cavities C (two in FIG. 1), the volume value of the space that can be filled with the resin material in each cavity C is calculated, and these are averaged to set the average volume value. Then, the resin filling speed and the plunger moving speed can be set based on this average volume value.

[0104] <6-3> In the above embodiment, the moving speed of the plunger 182 is adjusted according to the resin filling rate, but it is not necessary to set multiple moving speeds of the plunger, and the speed can be constant between positions T0 and T100. In other words, the filling speed of the resin can also be constant.

[0105] <6-4> In the above embodiment, the resin filling rate (the position of the plunger 182 corresponding to the resin filling rate) is calculated based on the actual measured values ​​of the volume of the resin tablet T and the chip 2a of the substrate 2, but a calculated value can also be used instead of the actual measured value.

[0106] <6-5> The resin molding device shown in the above embodiment is one example, and various modifications are possible as long as the resin is filled into the cavity by the plunger 182 and the moving speed of the plunger 182 can be appropriately changed. Also, in the above embodiment, the substrate 2 on which the chip 2a is mounted is placed on the lower mold 110 as the first mold, but the substrate 2 may be placed on the upper mold 140 and resin molding may be performed. That is, the first mold of the present invention may be the upper mold 140, and the second mold may be the lower mold 110.

[0107] Some embodiments of the present invention have been described above by way of example. That is, the detailed description and the accompanying drawings have been disclosed for the purpose of illustrative description. Therefore, some components described in the detailed description and the accompanying drawings may be non-essential components for solving the problem. Therefore, just because these non-essential components are described in the detailed description and the accompanying drawings, it should not be immediately determined that these non-essential components are essential.

[0108] (Additional Note) The following supplementary notes are further disclosed regarding the above-described embodiment. Appendix 1. A first type in which a substrate on which an electronic element is mounted can be placed; A second mold that forms a cavity between the first mold and a second mold; a transfer mechanism for supplying a resin material to the cavity by a plunger; a control unit that controls a moving speed of the plunger based on a volume value of a space in the cavity that can be filled with a resin material while the substrate is placed in the cavity; and A resin molding device comprising:

[0109] Addendum 2. The resin material is formed by melting a solid resin material placed in the resin molding device; The control unit is An initial position T0 of the plunger is set based on a weight value of the solid resin material; Based on the volume value, a terminal position T100 of the plunger is set; setting a filling speed of the resin material flowing through the cavity based on a volume value of the cavity; controlling a moving speed of the plunger based on the filling speed; 2. The resin molding apparatus according to claim 1.

[0110] Note 3: The length of the cavity in the direction in which the resin material is injected is W, F is a filling speed of the resin material in the cavity calculated based on the volume value; The moving distance of the plunger from the initial position T0 to the terminal position T100 is L, 3. The resin molding apparatus according to claim 2, wherein a moving speed V of the plunger is calculated by the following formula (1). V = F × L / W (1)

[0111] Addendum 4. The resin material is formed by melting a solid resin material placed in the resin molding device; The control unit is An initial position T0 of the plunger is set based on a weight value of the solid resin material; Based on the volume value, a terminal position T100 of the plunger is set; a movement section of the plunger corresponding to filling the resin material into an element region in the cavity in which the electronic element is arranged is set between the position T0 and the position T100; setting a filling speed of the resin material flowing through the element region of the cavity based on a volume value of the element region of the cavity; controlling a moving speed of the plunger based on the filling speed in the element region; 2. The resin molding apparatus according to claim 1.

[0112] Note 5: The length of the cavity in the element region in the direction in which the resin material is injected is WB, In the direction in which the resin is injected, the lengths of the cavity on the upstream side and downstream side of the element region are denoted by WA and WC, respectively. FB is a filling speed of the resin material in the element region of the cavity calculated based on the moving time; The movement distance of the plunger in the movement section is LB, 5. The resin molding apparatus according to claim 4, wherein, when VB=V, a moving speed VB of the plunger in the moving section is calculated by the following formula (2). VB = 2FB × LB / (2WB + WA + WC) (2)

[0113] Addendum 6. The control unit adjusts the moving speed of the plunger when the plunger reaches a position corresponding to a predetermined resin filling rate for the cavity. 6. A resin molding apparatus according to any one of claims 1 to 5.

[0114] Appendix 7. A first type capable of arranging a substrate on which a semiconductor chip is mounted; A second mold that forms a cavity between the first mold and a second mold; a transfer mechanism for supplying a resin material to the cavity by a plunger; A method for producing a resin molded product in a resin molding apparatus comprising: placing the substrate on the first mold; clamping the second mold and the first mold; supplying the resin material to the cavity by moving the plunger; Equipped with In the step of supplying the resin material to the cavity, a moving speed of the plunger is controlled based on a volume value of a space in the cavity that can be filled with the resin material. A method for manufacturing a resin molded product. [Explanation of symbols]

[0115] C Cavity 182 Plunger 2 Package substrate 2a Chip

Claims

1. a first mold on which a substrate having an electronic device mounted thereon can be placed; A second mold that forms a cavity between the first mold and a second mold; a transfer mechanism for supplying a resin material to the cavity by a plunger; a control unit that controls a moving speed of the plunger based on a volume value of a space in the cavity that can be filled with a resin material while the substrate is placed in the cavity; and A resin molding device comprising:

2. the resin material is formed by melting a solid resin material placed in the resin molding device, The control unit is An initial position T0 of the plunger is set based on a weight value of the solid resin material; Based on the volume value, a terminal position T100 of the plunger is set; setting a filling speed of the resin material flowing through the cavity based on a volume value of the cavity; controlling a moving speed of the plunger based on the filling speed; The resin molding apparatus according to claim 1 .

3. The length of the cavity in the direction in which the resin material is injected is W, F is a filling speed of the resin material in the cavity calculated based on the volume value; The moving distance of the plunger from the initial position T0 to the terminal position T100 is L, 3. The resin molding apparatus according to claim 2, wherein a moving speed V of the plunger is calculated by the following formula (1): V=F×L / W (1)

4. the resin material is formed by melting a solid resin material placed in the resin molding device, The control unit is An initial position T0 of the plunger is set based on a weight value of the solid resin material; Based on the volume value, a terminal position T100 of the plunger is set; a movement section of the plunger corresponding to filling the resin material into an element region in the cavity in which the electronic element is arranged is set between the position T0 and the position T100; setting a filling speed of the resin material flowing through the element region of the cavity based on a volume value of the element region of the cavity; controlling a moving speed of the plunger based on the filling speed in the element region; The resin molding apparatus according to claim 1 .

5. the control unit adjusts a moving speed of the plunger when the plunger reaches a position corresponding to a predetermined resin filling rate for the cavity. The resin molding apparatus according to claim 1 .

6. a first mold capable of arranging a substrate having a semiconductor chip mounted thereon; A second mold that forms a cavity between the first mold and a second mold; a transfer mechanism for supplying a resin material to the cavity by a plunger; A method for producing a resin molded product in a resin molding apparatus comprising: placing the substrate on the first mold; clamping the second mold and the first mold; supplying the resin material to the cavity by moving the plunger; Equipped with In the step of supplying the resin material to the cavity, a moving speed of the plunger is controlled based on a volume value of a space in the cavity that can be filled with the resin material. A method for manufacturing a resin molded product.

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