Phase-shifting device

Abstract

To provide a phase-shifting device that is more compact than conventional devices and can achieve desired phase-shifting characteristics.SOLUTION: A phase-shifting device includes a first row in which a plurality of digital phase-shifting circuits each including a loop line are connected in cascade in a longitudinal direction, a second row in which the plurality of digital phase-shifting circuits are connected in cascade in the longitudinal direction and which extends in parallel to the first row so as to overlap the first row when viewed in an intersection direction, a connection portion that electrically connects one end portion of the first row to one end portion of the second row, and a first ground plane having a recess portion formed therein, the recess portion surrounding the first row, the second row, and the connection portion in a plan view. The first ground plane and the loop line are not in contact with each other.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a phase shifting device. [Background technology]

[0002] The following Non-Patent Document 1 discloses a digitally controlled phase shift circuit (digital phase shift circuit) for microwaves, quasi-millimeter waves, or millimeter waves. As shown in FIG. 2 of Non-Patent Document 1, this digital phase shift circuit includes a signal line, a pair of inner lines, a pair of outer lines, a first ground bar, a second ground bar, and a pair of NMOS switches. The pair of inner lines are provided on both sides of the signal line. The pair of outer lines are provided outside the pair of inner lines. The first ground bar is connected to one end of each of the inner lines and each of the outer lines. The second ground bar is connected to the other end of each of the outer lines. Each NMOS switch is provided between the other end of each of the inner lines and the second ground bar.

[0003] Such a digital phase shift circuit switches between a low delay mode and a high delay mode by switching a return current flowing in a pair of inner lines or a pair of outer lines due to the transmission of a signal wave in the signal line depending on whether a pair of NMOS switches are open or closed. That is, when a return current flows in the pair of inner lines, the digital phase shift circuit operates in the low delay mode, and when a return current flows in the pair of outer lines, the digital phase shift circuit operates in the high delay mode. [Prior art documents] [Non-patent literature]

[0004] [Non-Patent Document 1] A Ka-band Digitally-Controlled Phase Shifter with sub-degree Phase Precision (2016,IEEE,RFIC) Summary of the Invention [Problem to be solved by the invention]

[0005] The digital phase shift circuit is applied to, for example, a base station using a phased array antenna. In this case, the digital phase shift circuit is mounted on a semiconductor substrate with a plurality of digital phase shift circuits connected in series. That is, the digital phase shift circuit is a unit in the configuration of an actual phase shift device, and a plurality of digital phase shift circuits are connected in series to configure the phase shift device. This phase shift device realizes a plurality of phase shift amounts as a whole by each of the plurality of digital phase shift circuits independently switching between a high delay mode and a low delay mode.

[0006] When such a phase shift device is mounted on a semiconductor substrate, a plurality of digital phase shift circuits may be arranged in multiple rows. That is, a plurality of rows (unit rows) each having a plurality of cascaded digital phase shift circuits may be arranged parallel to each other on the semiconductor substrate. A ground conductor such as a ground plane may be arranged around each unit row. Depending on the arrangement of the ground conductor, it may adversely affect the phase shift characteristics of each unit row (phase shift device).

[0007] In addition, in the above-mentioned digital phase shift circuit, in order to secure the amount of phase shift in a limited area, it is desirable to make the inductance, which is one of the circuit constants, sufficiently larger in inductance value in the high delay mode than in the low delay mode. However, in the above-mentioned conventional digital phase shift circuit, in order to increase the inductance value in the high delay mode, it is necessary to separate the outer line from the signal line (or increase the length of the outer line). This increases the size of the digital phase shift circuit. Since the above-mentioned phase shift device is configured by cascading a plurality of digital phase shift circuits, there is a problem that the phase shift device also increases in size when the size of the digital phase shift circuit increases.

[0008] The present invention has been made in consideration of the above circumstances, and an object of the present invention is to provide a phase shifting device that is smaller than conventional devices and can achieve desired phase shifting characteristics. [Means for solving the problem]

[0009] In order to solve the above problems, a phase shift device according to a first aspect of the present invention includes a signal line, a first line including a first parallel line extending parallel to the signal line, a second parallel line extending parallel to the signal line, and a second line including a loop-shaped loop line extending from one end of the second parallel line to near the other end of the second parallel line and having a convex shape in a direction away from the signal line in a cross direction intersecting a longitudinal direction of the signal line, a first ground conductor electrically connected to one end of the first parallel line and one end of the second parallel line, a second ground conductor connected to one end of the second line, a first electronic switch provided between the other end of the first parallel line and the second ground conductor, and a first electronic switch provided between the other end of the second parallel line and the front end of the second parallel line. the first parallel line and the second parallel line, a first row in which a plurality of digital phase shift circuits are cascaded in the longitudinal direction, a second row in which a plurality of digital phase shift circuits are cascaded in the longitudinal direction and extends parallel to the first row so as to overlap with the first row when viewed from the intersecting direction, a connection portion electrically connecting one end of the first row and one end of the second row, and a first ground plane in which a recess is formed and which surrounds the first row, the second row, and the connection portion in a plan view, and the first ground plane and the loop line are not in contact with each other.

[0010] According to the first aspect of the present invention, since the second line of each digital phase shift circuit includes a loop line, the required phase shift amount can be ensured even if each digital phase shift circuit is miniaturized. Furthermore, by miniaturizing each digital phase shift circuit, the required phase shift amount can be ensured with only two columns, and the phase shift device can be miniaturized. Furthermore, since the first ground plane and the loop line are not in contact with each other, the effect of the first ground plane on the phase shift characteristics of each digital phase shift circuit can be suppressed, and desired phase shift characteristics can be achieved.

[0011] Furthermore, a second aspect of the present invention relates to a phase shift device of the first aspect, further comprising: a power supply wiring that is U-shaped in a planar view, at least a portion of which extends along an inner edge of the recess and supplies power to the control circuit; and a decoupling capacitor that is arranged between the first ground plane and the power supply wiring.

[0012] Further, a third aspect of the present invention relates to a phase shift device according to the first or second aspect, wherein in each of the plurality of digital phase shift circuits, the loop line includes a first intersecting line extending from one end of the second parallel line in the intersecting direction away from the signal line, a third parallel line extending from one end of the first intersecting line in parallel to the signal line and having a length shorter than that of the second parallel line, and a bent line connected to one end of the third parallel line, having a bent portion formed such that the bent line extends shorter than the length of the first intersecting line in the intersecting direction so as to approach the signal line and then extends parallel to the signal line, and in each of the plurality of digital phase shift circuits, the control circuit is located in a gap formed between the bent line and the first intersecting line of an adjacent digital phase shift circuit in a planar view.

[0013] A fourth aspect of the present invention is the phase shift device according to any one of the first to third aspects, wherein the connection portion has a second ground plane, and the first ground plane and the second ground plane are not in contact with each other.

[0014] A fifth aspect of the present invention is the phase shift device according to any one of the first to fourth aspects, in which no ground plane is disposed between the first and second rows.

[0015] Furthermore, a sixth aspect of the present invention is a phase shift device according to any one of the first to fifth aspects, further comprising an input transmission line having a GND electrically connected to the other end of the first row, and an output transmission line having a GND electrically connected to the other end of the second row, wherein the GND of the input transmission line and the GND of the output transmission line are electrically connected to the first ground plane.

[0016] Furthermore, a seventh aspect of the present invention relates to a phase shift device according to the sixth aspect, wherein each of the input transmission line and the output transmission line has a signal line electrically connected to the signal line, and a pair of ground lines arranged on either side of the signal line with a space therebetween.

[0017] Furthermore, in an eighth aspect of the present invention, in the phase shift device of the seventh aspect, each of the input transmission line and the output transmission line further has a ground layer arranged at least either above or below the signal line and the pair of ground lines, and a connecting conductor connecting the pair of ground lines and the ground layer.

[0018] In addition, in a ninth aspect of the present invention, in the phase shift device of the eighth aspect, when the distance between the signal line and the ground line is S1 and the distance between the signal line and the ground layer is H1, H1≧3×S1 holds.

[0019] Furthermore, a tenth aspect of the present invention is a phase shift device according to any one of the sixth to ninth aspects, further comprising a first bend connection portion electrically connecting the other end of the first row and the input transmission line and having a bent shape in a planar view, and a second bend connection portion electrically connecting the other end of the second row and the output transmission line and having a bent shape in a planar view, wherein each of the input transmission line and the output transmission line extends in the intersecting direction.

[0020] Furthermore, an eleventh aspect of the present invention relates to a phase shift device according to any one of the seventh to ninth aspects, further comprising: a first bend connection portion electrically connecting the other end of the first row and the input transmission line and having a bent shape in a planar view; and a second bend connection portion electrically connecting the other end of the second row and the output transmission line and having a bent shape in a planar view, wherein each of the first bend connection portion and the second bend connection portion has a signal line connection path electrically connected to the signal line and a pair of ground line connection paths electrically connected to the pair of ground lines.

[0021] Furthermore, in a twelfth aspect of the present invention, in the phase shift device of aspect 11, each of the first bend connection portion and the second bend connection portion further has a connection ground layer arranged at least either above or below the signal line connection path and the pair of ground line connection paths, and a connection conductor connecting the pair of ground line connection paths and the connection ground layer.

[0022] In addition, in a thirteenth aspect of the present invention, in the phase shift device of the twelfth aspect, when the distance between the signal line connection path and the ground line connection path is S2 and the distance between the signal line connection path and the connection ground layer is H2, H2≧3×S2 holds. Effect of the Invention

[0023] According to the above aspects of the present invention, it is possible to provide a phase shifting device that is smaller than conventional devices and can achieve desired phase shifting characteristics. [Brief description of the drawings]

[0024] [Figure 1] 1 is a plan view showing a phase shifting device according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a plan view showing a unit row according to an embodiment of the present invention. [Diagram 3] FIG. 1 is a plan view showing a digital phase shift circuit according to an embodiment of the present invention. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV shown in FIG. [Diagram 5] 4 is a cross-sectional view taken along line VV shown in FIG. [Figure 6] FIG. 4 is a plan view showing the periphery of a connection portion according to an embodiment of the present invention. [Figure 7] 2 is a plan view showing the periphery of an inlet transmission line, a first bend connection portion, and an input circuit according to an embodiment of the present invention. FIG. [Figure 8] 4 is a plan view showing the periphery of an exit transmission line, a second bend connection portion, and an output matching circuit according to an embodiment of the present invention. FIG. [Figure 9] 9 is a cross-sectional view taken along line IX-IX shown in FIG. 7. [Figure 10] 8 is a cross-sectional view taken along line XX shown in FIG. 7. [Figure 11] 4 is a diagram showing a connection relationship between power supply wiring and a switch control unit according to the embodiment of the present invention; FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A phase shifting device according to an embodiment of the present invention will now be described with reference to the drawings.

[0026] <Outline of Phase Shifter> The phase shift device A according to this embodiment is a high-frequency circuit that receives a high-frequency signal such as a microwave, quasi-millimeter wave, or millimeter wave as input, and outputs to the outside a high-frequency signal that has been phase-shifted by a predetermined phase amount.

[0027] Fig. 1 is a plan view showing a phase shift device A according to the present embodiment. As shown in Fig. 1, the phase shift device A according to the present embodiment includes a first row R1, a second row R2, a connection portion 90, an input transmission line 100A, an output transmission line 100B, a first bend connection portion 110A, a second bend connection portion 110B, a power supply wiring 120, a plurality of decoupling capacitors 130, an input circuit 140, an output matching circuit 150, and a first ground plane G1.

[0028] In the phase shift device A according to the present embodiment, a high-frequency signal is transmitted through an input transmission line 100A, a first bend connection portion 110A, an input circuit 140, a first row R1 (digital phase shift circuits B1 to B n), a connection portion 90, a second row R2 (digital phase shift circuits B1 to B n ), the output matching circuit 150, the second bend connection portion 110B, and the output matching circuit 150. That is, in the phase shift device A according to this embodiment, a high-frequency signal is input from an input transmission line 100A, and a high-frequency signal that has been phase-shifted by a predetermined phase amount is output from an output transmission line 100B.

[0029] The first column R1 and the second column R2 extend parallel to each other. In this embodiment, the first column R1 has a shape obtained by rotating the second column R2 by 180° in a plan view. In this specification, when the first column R1 and the second column R2 are not particularly distinguished from each other, each column R1 and R2 may be referred to as a "unit column R." The unit column R (each column R1 and R2) has a plurality of digital phase shift circuits B for shifting the phase of a high-frequency signal by a predetermined phase shift amount. FIG. 2 is a plan view showing the second column R2 according to this embodiment.

[0030] <Digital phase shift circuit> Fig. 3 is a plan view showing a digital phase shift circuit B according to this embodiment. Fig. 4 is a cross-sectional view taken along line IV-IV shown in Fig. 3. Fig. 5 is a cross-sectional view taken along line VV shown in Fig. 3. In the following description, unless otherwise specified, the digital phase shift circuit B belonging to the second column R2 will be described. The digital phase shift circuit B belonging to the first column R1 has a shape obtained by rotating the digital phase shift circuit B belonging to the second column R2 by 180° in a plan view.

[0031] 3, the digital phase shift circuit B includes a signal line 10, a first line 21, a second line 22, an upper pad 24, an upper pad 25, a first ground conductor 31, a second ground conductor 32, and a switch control unit 80 (a control circuit). The first line 21 according to the present embodiment includes a first parallel line 21p1 and a pair of upper pads 21d1 and 21d2. The second line 22 according to the present embodiment includes a second parallel line 22p2, a first cross line 22c1, a third parallel line 22p3, a bent line 22b, a second cross line 22c2, and a pair of upper pads 22d1 and 22d2. Moreover, the digital phase shift circuit B according to this embodiment includes four electronic switches 41 to 44, a plurality of connection conductors 50, a capacitor 60, and a plurality of connection pads P1 to P4 (see also FIGS. 4 and 5).

[0032] As shown in Fig. 3, the signal line 10 is a linear strip-shaped conductor extending in one direction. That is, the signal line 10 is a long, plate-shaped conductor having a constant width, a constant thickness, and a specified length. A signal current flows through the signal line 10 from the right side of the paper in Fig. 3 to the left side of the paper, that is, from the end (input end) on the right side of the paper to the end (output end) on the left side of the paper. This signal current is a high-frequency signal having a wavelength range of the microwave, quasi-millimeter wave, or millimeter wave described above.

[0033] (direction definition) Here, in this embodiment, the longitudinal direction of the signal line 10 (the direction in which the signal line 10 extends) is simply referred to as the longitudinal direction X. In the digital phase shift circuit B belonging to the second column R2, the direction from the input end to the output end of the signal line 10 along the longitudinal direction X is referred to as the +X direction or left. The direction opposite to the left is referred to as the right or -X direction. The direction intersecting (for example, perpendicular to) the signal line 10 is referred to as the cross direction Y. One direction along the cross direction Y is referred to as the back side or +Y direction. The direction opposite to the back side is referred to as the front side or -Y direction. The direction intersecting (for example, perpendicular to) both the longitudinal direction X and the cross direction Y is referred to as the up-down direction Z. One direction along the up-down direction Z is referred to as the up or +Z direction. The direction opposite to the up is referred to as the down or -Z direction. Viewing from the up-down direction Z is referred to as a planar view.

[0034] The signal line 10 has an inductance L1 as a lumped constant circuit element electrically. This inductance L1 is a parasitic inductance having a size according to the shape of the signal line 10, such as the length of the signal line 10. The signal line 10 also has a capacitance C1 as a lumped constant circuit element electrically. This capacitance C1 is a parasitic capacitance between the signal line 10 and a first parallel line 21p1 (described in detail below), between the signal line 10 and a second parallel line 22p2 (described in detail below), between the signal line 10 and a third parallel line 22p3 (described in detail below), between the signal line 10 and a silicon substrate (not shown), or the like.

[0035] The first parallel line 21p1 is a linear strip-shaped conductor provided on the other side (-Y side) of the signal line 10. The first parallel line 21p1 is a long plate-shaped conductor having a constant width, a constant thickness, and a predetermined length. The first parallel line 21p1 extends parallel to the signal line 10 (longitudinal direction X). The first parallel line 21p1 and the signal line 10 are arranged at an interval in the intersecting direction Y.

[0036] The upper pad 21d1 is a rectangular flat plate conductor connected to one end (-X side) of the first parallel line 21p1. The long side of the upper pad 21d1 extends in the cross direction Y, and the short side of the upper pad 21d1 extends in the longitudinal direction X. One short side (+Y side) of the upper pad 21d1 is located at approximately the same position in the cross direction Y as one side edge (+Y side) of the first parallel line 21p1. The other short side (-Y side) of the upper pad 21d1 is located closer to the front (-Y side) than the other side edge (-Y side) of the first parallel line 21p1. That is, the dimension of the upper pad 21d1 in the cross direction Y is larger than the width (dimension in the cross direction Y) of the first parallel line 21p1.

[0037] The upper pad 21d2 is a rectangular flat plate conductor connected to the other end (+X side) of the first parallel line 21p1. The long side of the upper pad 21d2 extends in the cross direction Y, and the short side of the upper pad 21d2 extends in the longitudinal direction X. One short side (+Y side) of the upper pad 21d2 is located at approximately the same position in the cross direction Y as one side edge (+Y side) of the first parallel line 21p1. The other short side (-Y side) of the upper pad 21d2 is located closer to the front (-Y side) than the other side edge (-Y side) of the first parallel line 21p1. That is, the dimension of the upper pad 21d2 in the cross direction Y is larger than the width (dimension in the cross direction Y) of the first parallel line 21p1.

[0038] The second parallel line 22p2 is a linear strip-shaped conductor provided on one side (+Y side) of the signal line 10. The second parallel line 22p2 is a long plate-shaped conductor having a constant width, a constant thickness, and a predetermined length. The second parallel line 22p2 extends parallel to the signal line 10 (longitudinal direction X). The second parallel line 22p2 and the signal line 10 are arranged at an interval in the intersecting direction Y.

[0039] The second parallel line 22p2 is provided on the opposite side of the signal line 10 from the first parallel line 21p1. In other words, the second parallel line 22p2 is disposed such that the signal line 10 is located between the first parallel line 21p1 and the second parallel line 22p2 in the cross direction Y.

[0040] The upper pad 22d1 is a rectangular flat conductor connected to one end (-X side) of the second parallel line 22p2. The long side of the upper pad 22d1 extends in the cross direction Y, and the short side of the upper pad 22d1 extends in the longitudinal direction X. The other short side (-Y side) of the upper pad 22d1 is located at approximately the same position in the cross direction Y as the other side edge (-Y side) of the second parallel line 22p2. In addition, one short side (+Y side) of the upper pad 22d1 is located on the back side (+Y side) of one side edge (+Y side) of the second parallel line 22p2. In other words, the dimension of the upper pad 22d1 in the cross direction Y is larger than the width (dimension in the cross direction Y) of the second parallel line 22p2.

[0041] The upper pad 22d2 is a rectangular flat plate conductor connected to the other end (+X side) of the second parallel line 22p2. The long side of the upper pad 22d2 extends in the cross direction Y, and the short side of the upper pad 22d2 extends in the longitudinal direction X. The other short side (-Y side) of the upper pad 22d2 is located at approximately the same position in the cross direction Y as the other side edge (-Y side) of the second parallel line 22p2. In addition, one short side (+Y side) of the upper pad 22d2 is located on the back side (+Y side) of one side edge (+Y side) of the second parallel line 22p2. In other words, the dimension of the upper pad 22d2 in the cross direction Y is larger than the width (dimension in the cross direction Y) of the second parallel line 22p2.

[0042] The first cross line 22c1 is a strip-shaped conductor electrically connected to one end (-X side) of the second parallel line 22p2. A bend CR1 is formed in the first cross line 22c1, and the side closer to the second parallel line 22p2 (for example, the second parallel line 22p2 side of the midpoint of the first cross line 22c1 in the Y direction) is crank-shaped. In a plan view, the first cross line 22c1 extends from one end (-X side) of the second parallel line 22p2 so as to move away from the signal line 10 in the cross direction Y, bends to the left (+X side) at the bend CR1, and then extends again so as to move away from the signal line 10 in the cross direction Y.

[0043] The third parallel line 22p3 is a linear strip-shaped conductor connected to one end (+Y end) of the first cross line 22c1. The third parallel line 22p3 is a long plate-shaped conductor having a constant width, a constant thickness, and a predetermined length. The third parallel line 22p3 extends from one end (+Y side) of the first cross line 22c1 in parallel (longitudinal direction X) with the signal line 10. That is, the third parallel line 22p3 in this embodiment extends from one end (+Y side) of the first cross line 22c1 toward the left side (+X side). The length of the third parallel line 22p3 is shorter than the length of the second parallel line 22p2.

[0044] The third parallel line 22p3 is provided on one side (+Y side) of the signal line 10, at a position farther from the signal line 10 than the second parallel line 22p2. In other words, the third parallel line 22p3 is disposed such that the second parallel line 22p2 is located between the signal line 10 and the third parallel line 22p3 in the cross direction Y.

[0045] As shown in FIG. 3, in the intersecting direction Y, the distance D1 between the center line of the second parallel line 22p2 and the center line of the third parallel line 22p3 is greater than the distance D2 between the center line of the second parallel line 22p2 and the far outer edge (the outer edge on the third parallel line 22p3 side) of the first ground conductor 31 (described later).

[0046] The bent line 22b is a strip-shaped conductor connected to one end (+X side) of the third parallel line 22p3 and having a bent portion CR. The bent line 22b includes a partial line 22b1 extending from one end (+X side) of the third parallel line 22p3 in the crossing direction Y toward the signal line 10, and a partial line 22b2 extending from one end (-Y side) of the partial line 22b1 in the longitudinal direction X (left side (+X side)) in parallel with the signal line 10. The partial lines 22b1 and 22b2 constituting the bent line 22b are long plate-shaped conductors having a constant width, a constant thickness, and a predetermined length. The length of the partial line 22b1 is shorter than the length of the first cross line 22c1. The bent line 22b may have a plurality of bent portions CR.

[0047] The second crossing line 22c2 is a strip-shaped conductor connected to one end (+X side) of the partial line 22b2 constituting the bent line 22b. The second crossing line 22c2 has a bent portion CR2, and the side closer to the second parallel line 22p2 (for example, the second parallel line 22p2 side of the midpoint of the second crossing line 22c2 in the Y direction) is crank-shaped. In a plan view, the second crossing line 22c2 extends from one end (+X side) of the partial line 22b2 constituting the bent line 22b so as to approach the signal line 10 in the crossing direction Y, bends to the left (+X side) at the bent portion CR2, and then extends again so as to approach the signal line 10 in the crossing direction Y.

[0048] In this embodiment, one end edge (-Y side) of the second intersecting line 22c2 is located at approximately the same position in the intersecting direction Y as the other short sides (-Y side) of the upper pads 22d1 and 22d2 and the other side edge (-Y side) of the second parallel line 22p2. The upper pad 22d2 and the second intersecting line 22c2 are arranged with an interval in the longitudinal direction X.

[0049] In addition, one end (-Y side) of the second cross line 22c2 in this embodiment is constantly electrically connected to a second ground conductor 32 (described later) by a conductor (not shown). In other words, one end of the loop line RP (described later) is constantly electrically connected to the second ground conductor 32 by a conductor (not shown).

[0050] The first intersecting line 22c1, the third parallel line 22p3, the bent line 22b, and the second intersecting line 22c2 described above form a loop line RP that is convex toward the back side (+Y side).

[0051] The loop line RP is formed in a layer different from the layer in which the signal line 10, the first line 21, the second parallel line 22p2, and the upper pads 22d1, 22d2, 24, and 25 are formed, and the layer in which the first ground conductor 31 and the second ground conductor 32 are formed. For example, the loop line RP is formed in the layer in which the second intermediate pads 71b, 72b, 73b, and 74b (details will be described later) shown in Figures 4 and 5 are formed. The loop line RP may also be formed in the layer in which the third intermediate pads 71c, 72c, 73c, and 74c (details will be described later) shown in Figures 4 and 5 are formed.

[0052] The loop line RP is formed in such a layer in order to make the thickness (cross-sectional area) of the loop line RP smaller than the thickness (cross-sectional area) of the signal line 10, the first line 21, the second parallel line 22p2, and the upper pads 22d1 and 22d2. In general, in a semiconductor having a multi-layer structure, the thickness of the wiring is formed to be smaller as it goes from the surface to the inner layer. For this reason, in this embodiment, the loop line RP is formed in a layer (inner layer) lower than the layer in which the signal line 10, the first line 21, the second parallel line 22p2, and the upper pads 22d1, 22d2, 24, and 25 are formed, so that the thickness (cross-sectional area) of the loop line RP is made smaller than the thickness (cross-sectional area) of the signal line 10, the first line 21, the second parallel line 22p2, and the upper pads 22d1 and 22d2.

[0053] Although details will be described later, the thickness of the loop line RP is made smaller than the thicknesses of the signal line 10, the first line 21, the second parallel line 22p2, and the upper pads 22d1 and 22d2 in order to increase the strength of the magnetic field generated by the current (third return current) flowing through the loop line RP and to increase the resistance of the loop line RP. It is preferable to set the thickness of the loop line RP so that the cross-sectional area of ​​the loop line RP is less than 1 / 5 of the cross-sectional areas of the signal line 10, the first line 21, the second parallel line 22p2, and the upper pads 22d1 and 22d2.

[0054] The upper pad 24 is a rectangular flat plate conductor similar to the upper pads 21d1 and 21d2 that form a part of the first line 21. The long side of the upper pad 24 extends in the cross direction Y, and the short side of the upper pad 24 extends in the longitudinal direction X. One short side (+Y side) of the upper pad 24 is located at approximately the same position in the cross direction Y as one side edge (+Y side) of the first parallel line 21p1. The other short side (-Y side) of the upper pad 24 is located closer to the front (-Y side) than the other side edge (-Y side) of the first parallel line 21p1. That is, the dimension of the upper pad 24 in the cross direction Y is larger than the width (dimension in the cross direction Y) of the first parallel line 21p1, similar to the upper pads 21d1 and 21d2 that form a part of the first line 21. Similarly to one end (-Y side) of the second cross line 22c2, the upper pad 24 is constantly electrically connected to the second ground conductor 32 by a conductor (not shown).

[0055] The upper pad 25 is a rectangular flat plate conductor similar to the upper pads 22d1 and 22d2 that form a part of the second line 22. The long side of the upper pad 25 extends in the cross direction Y, and the short side of the upper pad 25 extends in the longitudinal direction X. The other short side (-Y side) of the upper pad 25 is located at approximately the same position in the cross direction Y as the other side edge (-Y side) of the second parallel line 22p2. In addition, one short side (+Y side) of the upper pad 25 is located on the inner side (+Y side) of one side edge (+Y side) of the second parallel line 22p2. In other words, the dimension of the upper pad 25 in the cross direction Y is larger than the width (dimension in the cross direction Y) of the second parallel line 22p2, similar to the upper pads 22d1 and 22d2 that form a part of the second line 22. Similarly to one end (-Y side) of the second cross line 22c2, the upper pad 25 is constantly electrically connected to the second ground conductor 32 via a conductor (not shown).

[0056] The first ground conductor 31 is a plate-shaped conductor provided on the input end side (-X side) of the signal line 10. The first ground conductor 31 is electrically grounded. The first ground conductor 31 has a rectangular shape with long sides extending in the cross direction Y and short sides extending in the longitudinal direction X. The first ground conductor 31 overlaps with the front side (-Y side) ends of the upper pads 21d1 and 22d1 and the first cross line 22c1 in the up-down direction Z. As shown in FIG. 4, the first ground conductor 31 is located below (-Z side) the signal line 10, the first line 21 (upper pad 21d1), and the second line 22 (upper pad 22d1).

[0057] The second ground conductor 32 is a plate-shaped conductor provided on the output end side (+X side) of the signal line 10. The second ground conductor 32 is electrically grounded. Although detailed illustration is omitted, the second ground conductor 32 is located below (on the -Z side) the signal line 10, the first line 21, the second line 22, and the upper pads 24 and 25.

[0058] 4, the first connection pad P1 includes the above-mentioned upper pad 21d1, the first intermediate pad 71a, the second intermediate pad 71b, the third intermediate pad 71c, and the first ground conductor 31. The upper pad 21d1, the first intermediate pad 71a, the second intermediate pad 71b, the third intermediate pad 71c, and the first ground conductor 31 overlap one another in a plan view. The upper pad 21d1, the first intermediate pad 71a, the second intermediate pad 71b, the third intermediate pad 71c, and the first ground conductor 31 are arranged in this order from the upper side (+Z side) to the lower side (-Z side) and are spaced apart in the up-down direction Z.

[0059] As shown in FIG. 4, the upper pad 21d1 and the first intermediate pad 71a are electrically and mechanically connected by a plurality of connection conductors 50. The first intermediate pad 71a and the second intermediate pad 71b are electrically and mechanically connected by a plurality of connection conductors 50. The second intermediate pad 71b and the third intermediate pad 71c are electrically and mechanically connected by a plurality of connection conductors 50. The third intermediate pad 71c and the first ground conductor 31 are electrically and mechanically connected by a plurality of connection conductors 50. As a result, the first connection pad P1 constantly electrically connects one end (-X side) of the first parallel line 21p1 and the first ground conductor 31.

[0060] In this specification, the "connection conductor 50" is a conductor extending in the vertical direction Z, and is a member that electrically and mechanically connects a member connected to the upper end of the connection conductor 50 and a member connected to the lower end of the connection conductor 50. The connection conductor 50 is, for example, a via that penetrates an insulating layer (not shown) in the vertical direction Z.

[0061] 4, the second connection pad P2 includes an upper pad 22d1, a first intermediate pad 72a, a second intermediate pad 72b, a third intermediate pad 72c, and a first ground conductor 31. The upper pad 22d1, the first intermediate pad 72a, the second intermediate pad 72b, the third intermediate pad 72c, and the first ground conductor 31 overlap one another in a plan view. The upper pad 22d1, the first intermediate pad 72a, the second intermediate pad 72b, the third intermediate pad 72c, and the first ground conductor 31 are arranged in this order from the upper side (+Z side) to the lower side (-Z side) and are spaced apart in the up-down direction Z.

[0062] As shown in FIG. 4, the upper pad 22d1 and the first intermediate pad 72a are electrically and mechanically connected by a plurality of connection conductors 50. The first intermediate pad 72a and the second intermediate pad 72b are electrically and mechanically connected by a plurality of connection conductors 50. The second intermediate pad 72b and the third intermediate pad 72c are electrically and mechanically connected by a plurality of connection conductors 50. The third intermediate pad 72c and the first ground conductor 31 are electrically and mechanically connected by a plurality of connection conductors 50. As a result, the second connection pad P2 constantly electrically connects one end (-X side) of the second parallel line 22p2 and the first ground conductor 31.

[0063] 4, a front side (-Y side) end of the first intersecting line 22c1 is connected to a second intermediate pad 72b included in the second connection pad P2. As a result, the second connection pad P2 constantly electrically connects the loop line RP and the first ground conductor 31. The front side (-Y side) end of the first intersecting line 22c1 may be connected to a third intermediate pad 72c included in the second connection pad P2.

[0064] 5, the third connection pad P3 includes the above-mentioned upper pad 21d2, the first intermediate pad 73a, the second intermediate pad 73b, the third intermediate pad 73c, and the lower pad 33a. The upper pad 21d2, the first intermediate pad 73a, the second intermediate pad 73b, the third intermediate pad 73c, and the lower pad 33a overlap each other in a plan view. The upper pad 21d2, the first intermediate pad 73a, the second intermediate pad 73b, the third intermediate pad 73c, and the lower pad 33a are arranged in this order from the upper side (+Z side) to the lower side (-Z side), and are arranged at intervals in the vertical direction Z.

[0065] 3, the lower pad 33a is a rectangular flat conductor whose long sides extend in the intersecting direction Y and whose short sides extend in the longitudinal direction X. The lower pad 33a is provided separately from the second ground conductor 32. The lower pad 33a and the second ground conductor 32 are electrically connected or not connected depending on the state of a first electronic switch 41 (described later). Therefore, the lower pad 33a is electrically grounded or not connected depending on the state of the first electronic switch 41.

[0066] 5, the upper pad 21d2 and the first intermediate pad 73a are electrically and mechanically connected by a plurality of connection conductors 50. The first intermediate pad 73a and the second intermediate pad 73b are electrically and mechanically connected by a plurality of connection conductors 50. The second intermediate pad 73b and the third intermediate pad 73c are electrically and mechanically connected by a plurality of connection conductors 50. The third intermediate pad 73c and the lower pad 33a are electrically and mechanically connected by a plurality of connection conductors 50. As a result, the third connection pad P3 electrically connects the other end (+X side) of the first parallel line 21p1 and the first electronic switch 41 at all times.

[0067] 5, the fourth connection pad P4 includes the above-mentioned upper pad 22d2, the first intermediate pad 74a, the second intermediate pad 74b, the third intermediate pad 74c, and the lower pad 33b. The upper pad 22d2, the first intermediate pad 74a, the second intermediate pad 74b, the third intermediate pad 74c, and the lower pad 33b overlap each other in a plan view. The upper pad 22d2, the first intermediate pad 74a, the second intermediate pad 74b, the third intermediate pad 74c, and the lower pad 33b are arranged in this order from the upper side (+Z side) to the lower side (-Z side) and are arranged at intervals in the vertical direction Z.

[0068] 3, the lower pad 33b is a rectangular flat conductor whose long sides extend in the intersecting direction Y and whose short sides extend in the longitudinal direction X. The lower pad 33b is provided separately from the second ground conductor 32 and the lower pad 33a. The lower pad 33b and the second ground conductor 32 are electrically connected or not connected depending on the state of a second electronic switch 42 (described later). Therefore, the lower pad 33b is electrically grounded or not connected depending on the state of the second electronic switch 42.

[0069] 5, the upper pad 22d2 and the first intermediate pad 74a are electrically and mechanically connected by a plurality of connection conductors 50. The first intermediate pad 74a and the second intermediate pad 74b are electrically and mechanically connected by a plurality of connection conductors 50. The second intermediate pad 74b and the third intermediate pad 74c are electrically and mechanically connected by a plurality of connection conductors 50. The third intermediate pad 74c and the lower pad 33b are electrically and mechanically connected by a plurality of connection conductors 50. As a result, the fourth connection pad P4 constantly electrically connects the other end (+X side) of the second parallel line 22p2 and the second electronic switch 42.

[0070] 4, the capacitor 60 is a parallel plate having an upper electrode connected to the signal line 10 and a lower electrode connected to the first ground conductor 31 via the third electronic switch 43. The capacitor 60 has a capacitance Ca according to the opposing area of ​​the parallel plates. In other words, the capacitance Ca is a circuit constant provided between the signal line 10 and the first ground conductor 31. However, the capacitor 60 may be a comb-type capacitor.

[0071] 3, the first electronic switch 41 is a transistor that freely opens and closes between the lower pad 33a of the third connection pad P3 and the second ground conductor 32. The first electronic switch 41 in this embodiment is, for example, a MOS type FET, as shown in FIG. 1, with a drain terminal connected to the lower pad 33a of the third connection pad P3, a source terminal connected to the second ground conductor 32, and a gate terminal connected to the switch control unit 80.

[0072] The first electronic switch 41 switches the conductive state between the drain terminal and the source terminal to an open state or a closed state based on a gate signal input to the gate terminal from the switch control unit 80. That is, the first electronic switch 41, by the switch control unit 80, brings the other end (+X side) of the first parallel line 21p1 and the second ground conductor 32 into a conductive state or a cut-off state.

[0073] 3, the second electronic switch 42 is a transistor that freely opens and closes between the lower pad 33b of the fourth connection pad P4 and the second ground conductor 32. The second electronic switch 42 in this embodiment is, for example, a MOS type FET, as shown in FIG 1, with a drain terminal connected to the lower pad 33b of the fourth connection pad P4, a source terminal connected to the second ground conductor 32, and a gate terminal connected to the switch control unit 80.

[0074] The second electronic switch 42 switches the conductive state between the drain terminal and the source terminal to an open state or a closed state based on a gate signal input to the gate terminal from the switch control unit 80. That is, the second electronic switch 42 switches the conductive state or the cut-off state between the other end (+X side) of the second parallel line 22p2 and the second ground conductor 32 by the switch control unit 80.

[0075] 4, the third electronic switch 43 is a transistor that freely opens and closes the lower electrode of the capacitor 60 and the first ground conductor 31. The third electronic switch 43 is, for example, a MOS type FET, and has a drain terminal connected to the lower electrode of the capacitor 60, a source terminal connected to the first ground conductor 31, and a gate terminal connected to the switch control unit 80.

[0076] 4, the third electronic switch 43 is disposed at a position away from the signal line 10 toward the rear (+Y side). One end (+Y side) of the first ground conductor 31 extends away from the signal line 10 in the cross direction Y and is connected to the third electronic switch 43. The reason for this arrangement is that there are design rule restrictions on the connection of the lower electrode of the capacitor 60 in a particular semiconductor manufacturing process.

[0077] Specifically, the lower electrode of the capacitor 60 must first be connected to an upper wiring layer (for example, a layer in which the signal line 10 is formed) through a connection wiring and a via, and then connected from that wiring layer to a lower wiring layer through a via. In FIG. 4, the connection path between the lower electrode of the capacitor 60 and the third electronic switch 43 is illustrated in a simplified manner. Due to this constraint, the third electronic switch 43 cannot be disposed near the position where the capacitor 60 is formed (for example, the input end side (-X side) of the signal line 10 shown in FIG. 3), and must be disposed at a position away from the signal line 10 toward the rear side (+Y side). The first ground conductor 31 extends away from the signal line 10 in the cross direction Y in order to be connected to the source terminal of the third electronic switch 43 disposed at such a position.

[0078] The third electronic switch 43 switches the conductive state between the drain terminal and the source terminal to an open state or a closed state based on a gate signal input to the gate terminal from the switch control unit 80. That is, the third electronic switch 43 brings the lower electrode of the capacitor 60 and the first ground conductor 31 into a conductive state or a cut-off state by the switch control unit 80.

[0079] 4, the fourth electronic switch 44 is a transistor that freely connects the input end side (-X side) of the signal line 10 and the first ground conductor 31. Like the above-mentioned first electronic switch 41, second electronic switch 42, and third electronic switch 43, this fourth electronic switch 44 is a MOS type FET, with a drain terminal connected to the input end side (-X side) of the signal line 10, a source terminal connected to the first ground conductor 31, and a gate terminal connected to the switch control unit 80. Note that the fourth electronic switch 44 may be provided between the output end side (+X side) of the signal line 10 and the second ground conductor 32, instead of between the input end side (-X side) of the signal line 10 and the first ground conductor 31.

[0080] The fourth electronic switch 44 switches the conduction state between the drain terminal and the source terminal to an open state or a closed state based on a gate signal input to the gate terminal from the switch control unit 80. That is, the fourth electronic switch 44, by the switch control unit 80, brings the connection between the input end side (-X side) of the signal line 10 and the first ground conductor 31 into a conductive state or a cut-off state.

[0081] The switch control unit 80 is a control circuit that controls the above-mentioned first electronic switch 41, second electronic switch 42, third electronic switch 43, and fourth electronic switch 44. The switch control unit 80 has four output ports, and outputs gate signals from each output port individually to the gate terminals of the first electronic switch 41, second electronic switch 42, third electronic switch 43, and fourth electronic switch 44. That is, the switch control unit 80 opens or closes the first electronic switch 41, second electronic switch 42, third electronic switch 43, and fourth electronic switch 44 by the gate signals.

[0082] Next, the operation of the digital phase shift circuit B configured as above will be described.

[0083] In the digital phase shift circuit B of this embodiment, the operation mode is switched according to the conductive states of the first to third electronic switches 41 to 43. That is, the operation modes of the digital phase shift circuit B include a low delay mode in which the first electronic switch 41 and the second electronic switch 42 are set to a closed state and the third electronic switch 43 is set to an open state by the switch control unit 80, and a high delay mode in which the first electronic switch 41 and the second electronic switch 42 are set to an open state and the third electronic switch 43 is set to a closed state by the switch control unit 80.

[0084] In the low delay mode, the switch control unit 80 sets the first electronic switch 41 and the second electronic switch 42 to a closed state, and sets the third electronic switch 43 to an open state. That is, in the low delay mode, the first propagation delay time T L The phase at the output end (left end) is the second phase θ H A first phase θ smaller than L The low latency mode will be explained in more detail below.

[0085] By setting the first electronic switch 41 to a closed state, the other end (+X side) of the first parallel line 21p1 is connected to the second ground conductor 32 via the third connection pad P3 (see FIG. 3). On the other hand, one end (-X side) of the first parallel line 21p1 is constantly connected to the first ground conductor 31 via the first connection pad P1 (see FIGS. 3 and 4). Therefore, by connecting the other end (+X side) of the first parallel line 21p1 to the second ground conductor 32 via the first electronic switch 41, a first current path is formed through which a current can flow between the one end (-X side) and the other end (+X side).

[0086] Moreover, by setting the second electronic switch 42 to a closed state, the other end (+X side) of the second parallel line 22p2 is connected to the second ground conductor 32 via the fourth connection pad P4 (see FIG. 3). On the other hand, one end (-X side) of the second parallel line 22p2 is constantly connected to the first ground conductor 31 via the second connection pad P2 (see FIGS. 3 and 4). Therefore, by connecting the other end (+X side) of the second parallel line 22p2 to the second ground conductor 32 via the second electronic switch 42, a second current path is formed through which a current can flow between the one end (-X side) and the other end (+X side).

[0087] When a signal current flows from the input end to the output end of the signal line 10 in a state in which both ends of the first parallel line 21p1 and the second parallel line 22p2 are connected, a return current is generated in the first parallel line 21p1 and the second parallel line 22p2 due to the propagation of the signal current. The return current flows through the first parallel line 21p1 and the second parallel line 22p2 from the other end (+X side) to one end (-X side).

[0088] That is, a first return current flows in the first parallel line 21p1 forming the first current path in a direction opposite to the direction of the signal current due to the passage of the signal current in the signal line 10. Also, a second return current flows in the second parallel line 22p2 forming the second current path in a direction opposite to the direction of the signal current, i.e., in the same direction as the first return current, due to the passage of the signal current in the signal line 10.

[0089] Here, the first return current flowing through the first parallel line 21p1 and the second return current flowing through the second parallel line 22p2 are both opposite to the direction of the signal current. Therefore, the first return current and the second return current act to reduce the overall inductance of the digital phase shift circuit B due to the electromagnetic coupling (mutual induction) between the signal line 10 and the first parallel line 21p1 and the electromagnetic coupling (mutual induction) between the signal line 10 and the second parallel line 22p2. When the inductance of the signal line 10 is reduced to Ls low , the inductance of the return path (the first parallel line 21p1 and the second parallel line 22p2) is Lglow , the mutual inductance between the signal line 10 and the return path is M low The total inductance L of the digital phase shift circuit B in the low delay mode is low , Ls low +Lg low -M low It becomes.

[0090] As described above, the signal line 10 has the capacitance C1 as a parasitic capacitance. In the low delay mode, the third electronic switch 43 is set to an open state, and therefore the capacitor 60 is not connected between the signal line 10 and the first ground conductor 31. That is, the capacitance Ca of the capacitor 60 does not affect the high-frequency signal propagating through the signal line 10. Therefore, the high-frequency signal propagating through the signal line 10 has a capacitance C2 of (L low ×C1) 1 / 2 The first propagation delay time T is proportional to L comes into effect.

[0091] The high-frequency signal at the output end of the signal line 10 has a first propagation delay time T L As a result, the phase of the high-frequency signal at the input end of the signal line 10 becomes a first phase θ L That is, in the low delay mode, the total inductance of the digital phase shift circuit B is delayed by the inductance L low This reduces the propagation delay time.

[0092] On the other hand, in the high delay mode, the switch control unit 80 sets the first electronic switch 41 and the second electronic switch 42 to an open state, and sets the third electronic switch 43 to a closed state. The fourth electronic switch 44 is set to a closed state. That is, in the high delay mode, the second propagation delay time T H Thus, the phase at the output end (left end) is the first phase θ L A second phase θ larger than H The high latency mode will be explained in more detail below.

[0093] As described above, in the high delay mode, the first electronic switch 41 and the second electronic switch 42 are set to the open state. Therefore, the first conductive path described above is not formed in the first parallel line 21p1, and the second conductive path described above is not formed in the second parallel line 22p2. Therefore, the first return current flowing in the first parallel line 21p1 becomes extremely small, and the second return current flowing in the second parallel line 22p2 becomes extremely small.

[0094] On the other hand, the near side (-Y side) end of the first crossing line 22c1 forming a part of the loop line RP is always connected to the first ground conductor 31 via the second connection pad P2 (see FIG. 4). Also, one end (-Y side) of the second crossing line 22c2 forming a part of the loop line RP is always connected to the second ground conductor 32 as described above. Therefore, in the loop line RP, a third current path through which a current can flow between one end (-Y side) of the second crossing line 22c2 and the near side (-Y side) end of the first crossing line 22c1 is formed in advance. Therefore, in the high delay mode, due to the signal current in the signal line 10, a third return current flows from one end (-Y side) of the second crossing line 22c2 to the near side (-Y side) end of the first crossing line 22c1 via the bent line 22b and the third parallel line 22p3.

[0095] Here, the third return current flows in the third parallel line 22p3 parallel to the signal line 10 and in the partial line 22b2 of the bent line 22b in a direction opposite to the direction of current flow of the signal current in the signal line 10. The partial line 22b1 of the bent line 22b, the third parallel line 22p3, and the first cross line 22c1 form a loop line RP that is convex on the opposite side (+Y side) from the signal line 10. Therefore, the inductance of the return path (path through which the third return current flows) can be increased compared to a conventional configuration in which the loop line RP is not formed. Moreover, in this embodiment, the thickness of the loop line RP (the thickness of the first crossing line 22c1, the third parallel line 22p3, the bent line 22b, and the second crossing line 22c2) is smaller than the thicknesses of the signal line 10, the first line 21, the second parallel line 22p2, and the upper pads 22d1 and 22d2.

[0096] This allows the overall inductance of the digital phase shift circuit B to be significantly increased, and a desired phase shift amount can be ensured even at low frequencies where the phase shift amount is small. high The inductance of the return path (the second intersecting line 22c2, the bent line 22b, the third parallel line 22p3, and the first intersecting line 22c1) is Lg high , the mutual inductance between the signal line 10 and the return path is M high In addition, Ls high =Ls low The total inductance L of the digital phase shift circuit B in the high delay mode high , Ls high +Lg high -M high Here, obviously, Lg low <Lg high and M. low >M high Since this holds, L high >L low holds true.

[0097] The principle by which the third return current acts to increase the inductance of the return path can be explained as follows. That is, the magnetic field generated when the third return current flows through the partial line 22b1 of the bent line 22b, the magnetic field generated when the third return current flows through the third parallel line 22p3, and the magnetic field generated when the third return current flows through the first intersecting line 22c1 all have the same direction (-Z direction) in the above-mentioned loop line. Therefore, these magnetic fields reinforce each other. Therefore, compared with the conventional configuration in which the line through which the third return current flows does not form a loop line, it is possible to increase the magnetic field generated by the third return current and increase the inductance of the return path. In addition, the value of the inductance of the return path can be changed significantly by adjusting the height of the loop (i.e., the position of the third parallel line 22p3 in the intersecting direction Y, and the first intersecting line 22c1 and the partial line 22b1 of the bent line 22b).

[0098] On the other hand, the signal line 10 has a capacitance C1 as a parasitic capacitance. In the high delay mode, the third electronic switch 43 is set to a closed state, and therefore the capacitor 60 is connected between the signal line 10 and the first ground conductor 31. That is, the signal line 10 has a capacitance Cb which is a sum of the capacitance Ca of the capacitor 60 and the capacitance C1 (parasitic capacitance). Therefore, the high-frequency signal propagating through the signal line 10 has a second propagation delay time T H comes into effect.

[0099] The high-frequency signal at the output end of the signal line 10 has a second propagation delay time T H As a result, the phase of the high-frequency signal at the input end of the signal line 10 becomes a second phase θ H That is, in the high delay mode, the inductance of the transmission system is increased due to the third return current, and thus the propagation delay time increases.

[0100] Here, in the high delay mode, the loss in the signal line 10 may be intentionally increased by setting the fourth electronic switch 44 to a closed state. This loss is intended to make the loss of the high frequency signal in the high delay mode approximately the same as the loss of the high frequency signal in the low delay mode.

[0101] <Columns 1 and 2> As shown in FIGS. 1 and 2, the unit row R (each row R1, R2) according to this embodiment includes a plurality of digital phase shift circuits B (B1, B2, B3, . . . , B n-1 , B n ) are cascade-connected in the longitudinal direction X. As shown in FIG. 1, the first row R1 and the second row R2 extend in parallel so as to overlap each other when viewed from the cross direction Y.

[0102] The unit string R is a digital phase shift circuit B1 that receives a high-frequency signal from the digital phase shift circuit B n 1 and 2, the first electronic switch 41, the second electronic switch 42, and the switch control unit 80 are omitted for ease of viewing. As described above, the first column R1 has a shape obtained by rotating the second column R2 by 180° in a plan view. Therefore, in the following description, unless otherwise specified, only the second column R2 will be described, and the description of the second column R2 will be substituted for the description of the first column R1.

[0103] 2, the second row R2 is cascaded in the longitudinal direction X such that the first line 21 is located only on the other side (-Y side) of the signal line 10 and the second line 22 is located only on one side (+Y side) of the signal line 10. That is, the second row R2 is configured such that the loop line RP is disposed only on one side (+Y side) of the signal line 10. The reason for this configuration is to reduce the size of the unit row R and the phase shift device A.

[0104] In the second column R2 according to this embodiment, the digital phase shift circuit B k (k is any natural number satisfying 1≦k≦n-1. The same applies below.) is the digital phase shift circuit B adjacent to the left (+X side). k+1In the second column R2 according to the present embodiment, the digital phase shift circuit B k+1 is the adjacent digital phase shift circuit B on the right side (-X side). k It can also be said that a part of the wire is connected to the other wire.

[0105] More specifically, in a portion where the digital phase shift circuits are adjacent to each other, the first ground conductor 31 and the second ground conductor 32 are common to each other, a portion of the first cross line 22c1 and a portion of the second cross line 22c2 are common to each other, the upper pad 21d1 and the upper pad 24 are common to each other, and the upper pad 22d1 and the upper pad 25 are common to each other. In the example shown in FIG. 2, for example, the digital phase shift circuit B k The second ground conductor 32 and the digital phase shift circuit B k+1 The first ground conductor 31 of the digital phase shift circuit B k A part of the second cross line 22c2 of the digital phase shift circuit B k+1 A part of the first cross line 22c1 of the digital phase shift circuit B k and the upper pad 24 of the digital phase shift circuit B k+1 The upper pad 21d1 of the digital phase shift circuit B k and the upper pad 25 of the digital phase shift circuit B k+1 The upper pad 22d1 is shared with the upper pad 22d2.

[0106] For this reason, the digital phase shift circuit B k+1 The first ground conductor 31 is connected to the digital phase shift circuit B k It also functions as the second ground conductor 32 of the digital phase shift circuit B k+1 A part of the first cross line 22c1 is connected to the digital phase shift circuit B k Also functions as a part of the second cross line 22c2 of the digital phase shift circuit B k+1 The upper pad 21d1 of the digital phase shift circuit B k It also functions as the upper pad 24 of the digital phase shift circuit B k+1 The upper pad 22d1 of the digital phase shift circuit B k It also functions as the upper pad 25 of the

[0107] Here, the first crossing line 22c1 forming the loop line RP has a bent portion CR1, and the side closer to the second parallel line 22p2 has a crank shape. The second crossing line 22c2 forming the loop line RP has a bent portion CR2, and the side closer to the second parallel line 22p2 has a crank shape. Therefore, in a portion where the digital phase shift circuits B are adjacent to each other, the shared first crossing line 22c1 and second crossing line 22c2 extend from one end (-X side) of the second parallel line 22p2 in the crossing direction Y in a plan view so as to move away from the signal line 10, bend to the left (+X side) at the bent portion CR1, and bend to the right (-X side) at the bent portion CR2 to form a T-shape.

[0108] Such a connection can reduce the decrease in the magnetic field caused by interference between adjacent digital phase shift circuits B. As a result, the mutual inductance between adjacent digital phase shift circuits B can be reduced.

[0109] In this manner, in the unit string R of this embodiment, as described above, the digital phase shift circuits B1 to B n In each of the above, the line through which the third return current flows forms a loop line RP that is convex on the opposite side to the signal line 10 (the +Y side in the second row R2, and the -Y side in the first row R1), and the thickness (cross-sectional area) is smaller than the thickness (cross-sectional area) of the signal line 10, the first line 21, the second parallel line 22p2, and the upper pads 22d1 and 22d2. This makes it possible to significantly improve the efficiency of generating a magnetic field compared to the conventional technique. In addition, as described above, in the unit row R of this embodiment, the mutual inductance between adjacent digital phase shift circuits B can be reduced. As a result, the unit row R of this embodiment can ensure a required amount of phase shift even if the loop line RP is arranged only on one side of the signal line 10 (the +Y side in the second row R2, and the -Y side in the first row R1).

[0110] Furthermore, in the unit string R of this embodiment, for example, when the adjacent digital phase shift circuits, excluding the digital phase shift circuit B1, are set to the high delay mode, the third return current flows through a path (path PT in the figure) that does not pass through the second connection pad P2. That is, except for the digital phase shift circuit B1, the third return current flows through the path PT that does not pass through obstacles with large losses, such as the second connection pad P2 and the first ground conductor 31 (second ground conductor 32). Therefore, the unit string R of this embodiment can significantly reduce the loss of high-frequency signals in the high delay mode.

[0111] <Connection> FIG. 6 is a plan view showing the periphery of a connection portion 90 according to this embodiment.

[0112] As shown in FIG. 6, the connection portion 90 is connected to one end of the first row R1 (the digital phase shift circuit B n The connection portion 90 electrically connects one end of the first column R1 (the end where the digital phase shift circuit B1 is located) to one end of the second column R2 (the end where the digital phase shift circuit B n ) to one end (digital phase shift circuit B1) of the second row R2. The connection portion 90 according to this embodiment has a U-shape that is convex in the longitudinal direction X in the direction away from the rows R1 and R2.

[0113] Specifically, the connection part 90 according to this embodiment constitutes a so-called grounded coplanar line, and includes a signal line connection line 91, a pair of ground line connection lines 92a, 92b, a lower ground layer (second ground plane G2), and a plurality of connection conductors 50. The pair of ground line connection lines 92a, 92b are disposed on both sides of the signal line connection line 91 with a gap therebetween. However, the connection part 90 may constitute a so-called coplanar line or a microstrip line.

[0114] The signal line connection path 91 is a long plate-like conductor having a constant width, a constant thickness, and a predetermined length. The signal line connection path 91 connects the signal line 10 in the first row R1 and the signal line 10 in the second row R2. In the example shown in FIG. 6, the signal line connection path 91 has a shape consisting of five straight line portions, but the shape of the signal line connection path 91 is not limited to this. For example, the signal line connection path 91 may include four or less or six or more straight line portions, or may include a curved portion.

[0115] Of the pair of ground line connections 92a, 92b, the first ground line connection 92a is a long plate-like conductor having a constant width, a constant thickness, and a predetermined length. The first ground line connection 92a extends parallel to the signal line connection 91 and is located on the inner side of the signal line connection 91. The first ground line connection 92a is connected to the digital phase shift circuit B of the first row R1. n and the upper pad 21d1 of the digital phase shift circuit B1 in the second row R2.

[0116] Of the pair of ground line connections 92a, 92b, the second ground line connection 92b is a long plate-like conductor having a constant width, a constant thickness, and a predetermined length. The second ground line connection 92b extends parallel to the signal line connection 91 and is located outside the signal line connection 91. The second ground line connection 92b is connected to the digital phase shift circuit B of the first row R1. n and the digital phase shift circuit B n and an upper pad 22d1 of the same.

[0117] The second ground plane G2 is a rectangular plate-like conductor extending in the longitudinal direction X and the transverse direction Y. The second ground plane G2 is disposed below and spaced a predetermined distance from the signal line connection path 91 and the pair of ground line connection paths 92a, 92b. The second ground plane G2 is connected to the pair of ground line connection paths 92a, 92b via a plurality of connection conductors 50. The plurality of connection conductors 50 are arranged along the first ground line connection path 92a and along the second ground line connection path 92b.

[0118] In addition to the above-mentioned lower ground layer (second ground plane G2), the connection part 90 may have an upper ground layer arranged above the signal line connection path 91 and the pair of ground line connection paths 92a, 92b at a predetermined distance. That is, the connection part 90 may form a triplate line structure in which the signal line connection path 91 is sandwiched between two ground layers. Alternatively, the connection part 90 may have only one of the upper ground layer and the lower ground layer. That is, it is sufficient that a ground layer is arranged at least above or below the signal line connection path 91 and the pair of ground line connection paths 92a, 92b.

[0119] <Input circuit> FIG. 7 is an enlarged view showing the input transmission line 100A, the first bend connection portion 110A, the input circuit 140, and the surrounding area according to this embodiment.

[0120] 7, the input circuit 140 is electrically connected to the other end of the first row R1 (the end where the digital phase shift circuit B1 is located). The input circuit 140 has a role of transmitting the high-frequency signal input from the input transmission line 100A via the first bend connection portion 110A to the other end of the first row R1 (the digital phase shift circuit B1).

[0121] Specifically, the input circuit 140 according to this embodiment configures a so-called grounded coplanar line, and includes a signal line 141, a pair of parallel lines 142a and 142b, a ground layer 143 (lower ground layer), and a plurality of connecting conductors 50. The pair of parallel lines 142a and 142b are disposed on both sides of the signal line 141 with a gap therebetween. However, the input circuit 140 may also configure a so-called coplanar line or a microstrip line.

[0122] The signal line 141 is a linear strip-shaped conductor extending in the longitudinal direction X. That is, the signal line 141 is a strip-shaped conductor having a constant width, a constant thickness, and a predetermined length. The signal line 141 is connected to the signal line 10 in the first row R1.

[0123] Of the pair of parallel lines 142a and 142b, the parallel line 142a is a strip-shaped conductor having a constant width, a constant thickness, and a predetermined length. The parallel line 142a extends in parallel with the signal line 141. The parallel line 142a is connected to the upper pad 21d1 of the digital phase shift circuit B1 in the first column R1.

[0124] Of the pair of parallel lines 142a, 142b, the other parallel line 142b is a strip-shaped conductor having a constant width, a constant thickness, and a predetermined length. The parallel line 142b extends in parallel with the signal line 141. The parallel line 142b is connected to the upper pad 22d1 of the digital phase shift circuit B1 in the first column R1.

[0125] The ground layer 143 is a plate-like conductor extending in the longitudinal direction X and the transverse direction Y. The ground layer 143 is disposed below the signal line 141 and the pair of parallel lines 142a, 142b at a predetermined distance. The ground layer 143 is connected to the pair of parallel lines 142a, 142b via a plurality of connecting conductors 50. The plurality of connecting conductors 50 are arranged along the parallel line 142a, and are also arranged along the parallel line 142b.

[0126] In addition to the above-mentioned ground layer 143 (lower ground layer), the input circuit 140 may have an upper ground layer arranged above the signal line 141 and the pair of parallel lines 142a, 142b at a predetermined distance. That is, the input circuit 140 may form a triplate line structure in which the signal line 141 is sandwiched between two ground layers. Alternatively, the input circuit 140 may have only one of the upper ground layer and the lower ground layer. That is, it is sufficient that a ground layer is arranged at least above or below the signal line 141 and the pair of parallel lines 142a, 142b.

[0127] <Output matching circuit> FIG. 8 is an enlarged view showing the output transmission line 100B, the second bend connection portion 110B, the output matching circuit 150, and the surrounding area according to this embodiment.

[0128] As shown in FIG. 8, the output matching circuit 150 is connected to the other end of the second column R2 (the digital phase shift circuit B n The output matching circuit 150 is electrically connected to the other end of the second column R2 (the end where the digital phase shift circuit B n ) to the output transmission line 100B via the second bend connection portion 110B.

[0129] The output matching circuit 150 according to this embodiment also plays a role in matching the input / output impedance to a real load. In general, a method of matching the input / output impedance to a real load is known in which an inductive component (inductor) is connected in series to the output unit. However, in this embodiment, the output unit (digital phase shift circuit B in the second row R2) n ), and the output transmission line 100B and the first bend connection portion 110A, which are the output destinations of the phase shift device A, are each composed of a plurality of conductors. Therefore, it is difficult to connect an inductor, which is a lumped element, in series between them. According to the output matching circuit 150 of this embodiment, even in the phase shift device A, where it is difficult to connect an inductor, which is a lumped element, in series between them, it is possible to match the input / output impedance to a real load.

[0130] Specifically, the output matching circuit 150 according to this embodiment includes a signal line 151 and a return line 152. The return line 152 according to this embodiment includes a cross line 152c1, a parallel line 152p1, a bent line 152b, and a cross line 152c2.

[0131] The signal line 151 is formed, for example, in the same layer as the signal line 10. The return line 152 is formed in a layer different from the layer in which the signal line 151 is formed. For example, the return line 152 is formed in a layer below the layer in which the signal line 151 is formed. However, the signal line 151 and the return line 152 may be formed in the same layer.

[0132] The signal line 151 is a linear strip-shaped conductor extending in the longitudinal direction X. That is, the signal line 151 is a long plate-shaped conductor having a constant width, a constant thickness, and a predetermined length. The signal line 151 is connected to the digital phase shift circuit B n The signal line 151 is electrically connected to the signal line 10. The width (cross-sectional area) of the signal line 151 is smaller than the width (cross-sectional area) of the signal line 10.

[0133] The cross line 152c1 is connected to the digital phase shift circuit B n The cross line 152c1 is a strip-shaped conductor electrically connected to the upper pad 25 of the digital phase shift circuit B in the second row R2. The cross line 152c1 has a bent portion CR, and the side closer to the signal line 151 (for example, the side closer to the signal line 151 than the midpoint of the cross line 152c1 in the Y direction) has a crank shape. The cross line 152c1 is connected to the digital phase shift circuit B in the second row R2 in a plan view. n The signal line 151 extends from the upper pad 25 in the transverse direction Y away from the signal line 151, bends at a bend CR in the longitudinal direction X away from the second row R2, and then extends again in the transverse direction Y away from the signal line 151.

[0134] The parallel line 152p1 is a linear strip-shaped conductor connected to one end of the intersecting line 152c1 (the end opposite the upper pad 25 in the intersecting direction Y). The parallel line 152p1 is a long plate-shaped conductor having a constant width, a constant thickness, and a predetermined length. The parallel line 152p1 extends from one end of the intersecting line 152c1 in parallel to the signal line 151 (in the longitudinal direction X). That is, the parallel line 152p1 in this embodiment extends from one end of the intersecting line 152c1 in the longitudinal direction X so as to move away from the second row R2. The length of the parallel line 152p1 is shorter than the length of the signal line 151.

[0135] The bent line 152b is a strip-shaped conductor connected to one end of the parallel line 152p1 (the end opposite the cross line 152c1 in the longitudinal direction X) and having a bent portion CR. The bent line 152b is composed of a partial line 152b1 extending from one end of the parallel line 152p1 to approach the signal line 151 in the cross direction Y, and a partial line 152b2 extending from one end of the partial line 152b1 (the end opposite the parallel line 152p1 in the cross direction Y) in parallel with the signal line 151 and away from the second row R2 in the longitudinal direction X. The partial lines 152b1 and 152b2 constituting the bent line 152b are long plate-shaped conductors having a constant width, a constant thickness, and a predetermined length. The length of the partial line 152b1 is shorter than the length of the cross line 152c1. The bent line 152b may have a plurality of bends CR.

[0136] The cross line 152c2 is a strip-shaped conductor connected to one end (the end opposite to the partial line 152b1 in the longitudinal direction X) of the partial line 152b2 constituting the bent line 152b. A bend CR is formed in the cross line 152c2, and the side closer to the signal line 151 (for example, closer to the signal line 151 than the midpoint of the cross line 152c2 in the Y direction) is crank-shaped. In a plan view, the cross line 152c2 extends from one end of the partial line 152b2 constituting the bent line 152b so as to approach the signal line 151 in the cross direction Y, bends at the bend CR so as to move away from the second row R2 in the longitudinal direction X, and then extends again so as to approach the signal line 151 in the cross direction Y.

[0137] The return line 152 described above forms a loop line that is convex in the crossing direction Y away from the signal line 151. The shape of the return line 152 corresponds to the shape of the loop line RP of the digital phase shift circuit B. Specifically, the crossing line 152c1 has a shape that is smaller than the width (cross-sectional area) of the loop line RP.

[0138] The shape of the return line 152 can be changed as appropriate. For example, the shape of the return line 152 does not have to correspond to the shape of the loop line RP. Alternatively, the return line 152 does not have to form a loop line. In this case, the return line 152 may extend linearly in parallel with the signal line 151.

[0139] <Input transmission line and output transmission line> As shown in FIG. 1 and FIG. 7, the input transmission line 100A according to this embodiment is electrically connected to the other end of the first row R1 (the end where the digital phase shift circuit B1 is located) via the first bend connection portion 110A and the input circuit 140. The input transmission line 100A extends in the cross direction Y. The input transmission line 100A has a role of transmitting a high-frequency signal input from the outside of the phase shift device A to the inside of the phase shift device A (for example, rows R1 and R2). However, the phase shift device A may not include the first bend connection portion 110A and the input circuit 140, and the input transmission line 100A may be directly connected to the first row R1. In this case, the input transmission line 100A may extend in the longitudinal direction X.

[0140] As shown in FIG. 1 and FIG. 8, the output transmission line 100B according to the present embodiment is connected to the other end of the second column R2 (the digital phase shift circuit B n The output transmission line 100B extends in the intersecting direction Y. The output transmission line 100B has a role of transmitting a high-frequency signal phase-shifted inside the phase-shifting device A (for example, rows R1 and R2) to the outside of the phase-shifting device A. However, the phase-shifting device A may not include the second bend connection portion 110B and the output matching circuit 150, and the output transmission line 100B may be directly connected to the second row R2. In this case, the output transmission line 100B may extend in the longitudinal direction X.

[0141] As shown in Fig. 7 and Fig. 8, each of the input transmission line 100A and the output transmission line 100B according to this embodiment constitutes a so-called grounded coplanar line, and includes a signal line 101, a pair of ground lines 102a and 102b, a ground layer 103 (lower ground layer), and a plurality of connection conductors 50. The pair of ground lines 102a and 102b are arranged on both sides of the signal line 101 with a gap therebetween. However, the transmission lines 100A and 100B may constitute a so-called coplanar line. In this case, the transmission lines 100A and 100B may not have the ground layer 103 and the connection conductors 50. Alternatively, the transmission lines 100A and 100B may constitute a so-called microstrip line.

[0142] Fig. 9 is a cross-sectional view taken along line IX-IX in Fig. 7. As shown in Fig. 9, the input transmission line 100A according to this embodiment further includes a pair of intermediate conductor layers 104a and 104b. Although not shown in detail, the output transmission line 100B also includes a pair of intermediate conductor layers 104a and 104b, similar to the input transmission line 100A.

[0143] The signal line 101 is a long plate-like conductor having a constant width, a constant thickness, and a predetermined length, as shown in Fig. 7 and Fig. 8. The signal line 101 of the input transmission line 100A is electrically connected to the signal line 10 of the first row R1 via the signal line connecting path 111 (details will be described later) of the first bend connection portion 110A and the signal line 141 of the input circuit 140, as shown in Fig. 7. The signal line 101 of the output transmission line 100B is electrically connected to the signal line 10 of the second row R2 via the signal line connecting path 111 (details will be described later) of the second bend connection portion 110B and the signal line 151 of the output matching circuit 150, as shown in Fig. 8.

[0144] Of the pair of ground wires 102a, 102b, the first ground wire 102a is a long, plate-like conductor having a constant width, a constant thickness, and a predetermined length, as shown in Figures 7 and 8. The first ground wire 102a extends parallel to the signal wire 101 and is located outside (farther from rows R1 and R2) than the signal wire 101 in the longitudinal direction X.

[0145] Of the pair of ground wires 102a, 102b, the second ground wire 102b is a long, plate-like conductor having a constant width, a constant thickness, and a predetermined length, as shown in Figures 7 and 8. The second ground wire 102b extends parallel to the signal wire 101 and is located inside (closer to rows R1 and R2) than the signal wire 101 in the longitudinal direction X.

[0146] 9, the ground layer 103 is disposed below and spaced a predetermined distance from the signal line 101 and the pair of ground lines 102a, 102b. The ground layer 103 functions as a GND for the transmission lines 100A, 100B.

[0147] 9, the first intermediate conductor layer 104a of the pair of intermediate conductor layers 104a, 104b is located between the first ground wire 102a and the ground layer 103 in the vertical direction Z. The first intermediate conductor layer 104a is also located at a position spaced a predetermined distance from both the first ground wire 102a and the ground layer 103.

[0148] The first ground wire 102a and the first intermediate conductor layer 104a are connected by a connection conductor 50. The first intermediate conductor layer 104a and the ground layer 103 are also connected by the connection conductor 50. As a result, the ground layer 103 is connected to the first ground wire 102a via the connection conductor 50 and the first intermediate conductor layer 104a. As shown in Figs. 7 and 8, the multiple connection conductors 50 are arranged along the first ground wire 102a. Although detailed illustration is omitted, the first intermediate conductor layer 104a extends along the first ground wire 102a.

[0149] 9, the second intermediate conductor layer 104b is located between the second ground wire 102b and the ground layer 103 in the vertical direction Z. The second intermediate conductor layer 104b is disposed at a position spaced a predetermined distance from both the second ground wire 102b and the ground layer 103.

[0150] The second ground wire 102b and the second intermediate conductor layer 104b are connected by a connection conductor 50. The second intermediate conductor layer 104b and the ground layer 103 are also connected by the connection conductor 50. As a result, the ground layer 103 is connected to the second ground wire 102b via the connection conductor 50 and the second intermediate conductor layer 104b. As shown in Figs. 7 and 8, the multiple connection conductors 50 are arranged along the second ground wire 102b. Although detailed illustration is omitted, the second intermediate conductor layer 104b extends along the second ground wire 102b.

[0151] Here, in order to perform good transmission of high-frequency signals in the transmission lines 100A and 100B, it is desirable that high-frequency current flows between the signal line 101 and the ground wires 102a and 102b, and that high-frequency current does not flow between the signal line 101 and the ground layer 103. In other words, it is desirable that the distance S1 between the signal line 101 and the ground wires 102a and 102b is sufficiently larger than the distance H1 between the signal line 101 and the ground layer 103. For example, it is desirable that the distances S1 and H1 satisfy H1≧3×S1.

[0152] In addition to the above-mentioned lower ground layer (ground layer 103), the transmission lines 100A and 100B may have an upper ground layer arranged above the signal line 101 and the pair of ground wires 102a and 102b at a predetermined distance. That is, the transmission lines 100A and 100B may form a triplate line structure in which the signal line 101 is sandwiched between two ground layers. Alternatively, the signal line 101 may have only one of the upper ground layer and the lower ground layer. That is, it is sufficient that a ground layer is arranged at least above or below the signal line 101 and the pair of ground wires 102a and 102b.

[0153] <First bend connection part and second bend connection part> 1 and 7, the first bend connection portion 110A according to this embodiment electrically connects the other end of the first row R1 (the end where the digital phase shift circuit B1 is located) and the input transmission line 100A via the input circuit 140. The first bend connection portion 110A has a role of transmitting the high-frequency signal input from the input transmission line 100A to the other end of the first row R1 (the digital phase shift circuit B1) via the input circuit 140. However, the phase shift device A may not include the input circuit 140, and the first bend connection portion 110A may be directly connected to both the first row R1 and the input transmission line 100A.

[0154] The first bend connection portion 110A according to this embodiment has a bent shape in a plan view. More specifically, the first bend connection portion 110A according to this embodiment has a bent shape that extends in a direction away from the first row R1 and the input circuit 140 in the longitudinal direction X, and then bends in a direction away from the center line M (see FIG. 1) of the phase shift device A in the cross direction Y. The "center line M of (the phase shift device A)" is a virtual line that extends in the longitudinal direction X and is equidistant from the center line of the signal line 10 in the first row R1 and the center line of the signal line 10 in the second row R2.

[0155] As shown in FIGS. 1 and 8, the second bend connection portion 110B according to this embodiment is connected to the other end of the second column R2 (the digital phase shift circuit B n The second bend connection portion 110B electrically connects the other end of the second row R2 (the end where the digital phase shift circuit B n ) to the output transmission line 100B. However, the phase shift device A may not include the output matching circuit 150, and the second bend connection portion 110B may be directly connected to both the second row R2 and the output transmission line 100B.

[0156] The second bend connection portion 110B according to this embodiment has a bent shape in a plan view. More specifically, the second bend connection portion 110B according to this embodiment extends in a direction away from the second row R2 and the output matching circuit 150 in the longitudinal direction X, and then has a bent shape in the transverse direction Y so as to move away from the center line M (see FIG. 1) of the phase shifting device A.

[0157] As shown in Fig. 7 and Fig. 8, each of the first bend connection part 110A and the second bend connection part 110B according to the present embodiment constitutes a so-called grounded coplanar line, and includes a signal line connection line 111, a pair of ground line connection lines 112a and 112b, a connection ground layer 113 (lower ground layer), and a plurality of connection conductors 50. The pair of ground line connection lines 112a and 112b are arranged on both sides of the signal line connection line 111 with a gap therebetween. However, the bend connection parts 110A and 110B may constitute a so-called coplanar line. In this case, the bend connection parts 110A and 110B may not have the connection ground layer 113 and the connection conductors 50. Alternatively, the bend connection parts 110A and 110B may constitute a so-called microstrip line.

[0158] Fig. 10 is a cross-sectional view taken along line XX in Fig. 7. As shown in Fig. 10, the first bend connection portion 110A according to this embodiment further includes a pair of intermediate conductor layers 114a, 114b. Although not shown in detail, the second bend connection portion 110B also includes a pair of intermediate conductor layers 114a, 114b, similar to the first bend connection portion 110A.

[0159] As shown in Figs. 7 and 8, the signal line connection path 111 is a long plate-like conductor having a certain width, a certain thickness, and a predetermined length. As shown in Fig. 7, the signal line connection path 111 of the first bend connection portion 110A electrically connects the signal line 10 of the first row R1 and the signal line 101 of the input transmission line 100A through the signal line 141 of the input circuit 140. As shown in Fig. 8, the signal line connection path 111 of the second bend connection portion 110B electrically connects the signal line 10 of the second row R2 and the signal line 101 of the output transmission line 100B through the signal line 151 of the output matching circuit 150. In the example shown in Figs. 7 and 8, the signal line connection path 111 has a shape consisting of three straight line portions, but the shape of the signal line connection path 111 is not limited to this. For example, the signal line connection path 111 may include two or less or four or more straight line portions, or may include a curved portion.

[0160] Of the pair of ground line connecting paths 112a, 112b, the first ground line connecting path 112a is a plate-shaped conductor that extends parallel to the signal line connecting path 111 and is located outside the signal line connecting path 111, as shown in Fig. 7 and Fig. 8. The first ground line connecting path 112a of the first bend connecting portion 110A connects the parallel line 142a of the input circuit 140 and the first ground line 102a of the input transmission line 100A, as shown in Fig. 7. The first ground line connecting path 112a of the second bend connecting portion 110B is electrically connected to the first ground line 102a of the output transmission line 100B.

[0161] Of the pair of ground line connecting paths 112a, 112b, the second ground line connecting path 112b is a plate-shaped conductor that extends parallel to the signal line connecting path 111 and is located inside the signal line connecting path 111, as shown in Figures 7 and 8. The second ground line connecting path 112b of the first bend connecting portion 110A connects the parallel line 142b of the input circuit 140 and the second ground line 102b of the input transmission line 100A, as shown in Figure 7. The second ground line connecting path 112b of the second bend connecting portion 110B is electrically connected to the second ground line 102b of the output transmission line 100B.

[0162] A pad 115 is provided at one end (the end opposite to the first ground line 102a) of the first ground line connection path 112a of the second bend connection portion 110B. A pad 116 is provided at one end (the end opposite to the second ground line 102b) of the second ground line connection path 112b of the second bend connection portion 110B. The pad 116 electrically connects the return line 152 of the output matching circuit 150 and the second ground line connection path 112b of the second bend connection portion 110B.

[0163] 10, the connection ground layer 113 is disposed below and spaced a predetermined distance from the signal line connection path 111 and the pair of ground line connection paths 112a, 112b. The connection ground layer 113 functions as a GND for the bend connection parts 110A, 110B.

[0164] 10, of the pair of intermediate conductor layers 114a, 114b, the first intermediate conductor layer 114a is located between the first ground line connecting path 112a and the connection ground layer 113 in the vertical direction Z. In addition, the first intermediate conductor layer 114a is disposed at a position spaced a predetermined distance from both the first ground line connecting path 112a and the connection ground layer 113.

[0165] The first ground line connecting path 112a and the first intermediate conductor layer 114a are connected by a connecting conductor 50. The first intermediate conductor layer 114a and the connection ground layer 113 are connected by a connecting conductor 50. As a result, the connection ground layer 113 is connected to the first ground line connecting path 112a via the connecting conductor 50 and the first intermediate conductor layer 114a. As shown in Figs. 7 and 8, the multiple connecting conductors 50 are arranged along the first ground line connecting path 112a. Although detailed illustration is omitted, the first intermediate conductor layer 114a extends along the first ground line connecting path 112a.

[0166] 10, the second intermediate conductor layer 114b is located between the second ground line connecting path 112b and the connection ground layer 113 in the vertical direction Z. The second intermediate conductor layer 114b is also located at a position spaced a predetermined distance from both the second ground line connecting path 112b and the connection ground layer 113.

[0167] The second ground line connecting path 112b and the second intermediate conductor layer 114b are connected by a connecting conductor 50. The second intermediate conductor layer 114b and the connection ground layer 113 are connected by a connecting conductor 50. As a result, the connection ground layer 113 is connected to the second ground line connecting path 112b via the connecting conductor 50 and the second intermediate conductor layer 114b. As shown in Figs. 7 and 8, the multiple connecting conductors 50 are arranged along the second ground line connecting path 112b. Although detailed illustration is omitted, the second intermediate conductor layer 114b extends along the second ground line connecting path 112b.

[0168] Here, in order to achieve good transmission of high frequency signals at the bend connection parts 110A and 110B, it is desirable that high frequency current flows between the signal line connection path 111 and the ground line connection paths 112a and 112b, but that high frequency current does not flow between the signal line connection path 111 and the connection ground layer 113. In other words, it is desirable that the distance S2 between the signal line connection path 111 and the ground line connection paths 112a and 112b is sufficiently larger than the distance H2 between the signal line connection path 111 and the connection ground layer 113. For example, it is desirable that the distances S2 and H2 satisfy H2≧3×S2.

[0169] In addition to the above-mentioned lower ground layer (connection ground layer 113), the bend connection parts 110A and 110B may have an upper ground layer arranged above the signal line connection path 111 and the pair of ground line connection paths 112a and 112b at a predetermined distance. That is, the bend connection parts 110A and 110B may form a triplate line structure in which the signal line connection path 111 is sandwiched between two ground layers. Alternatively, the signal line connection path 111 may have only one of the upper ground layer and the lower ground layer. That is, it is sufficient that a ground layer is arranged at least above or below the signal line connection path 111 and the pair of ground line connection paths 112a and 112b.

[0170] In this embodiment, the ground layer 103 of the transmission lines 100A and 100B, the connection ground layer 113 of the bend connection portions 110A and 110B, and the ground layer 143 of the input circuit 140 are electrically connected to each other. For example, the ground layer 103, the connection ground layer 113, and the ground layer 143 may be a common layer. In other words, the ground layer 103, the connection ground layer 113, and the ground layer 143 may be the same conductor. Alternatively, the ground layer 103, the connection ground layer 113, and the ground layer 143, which are provided separately from each other, may be electrically connected to each other through conductors such as vias and pads.

[0171] <First ground plane> 1, the first ground plane G1 is a plate-like conductor having a recess RC formed therein, extending in the longitudinal direction X and the transverse direction Y. The first ground plane G1 having the recess RC according to this embodiment surrounds the first row R1, the second row R2, the connection portion 90, the input circuit 140, and the output matching circuit 150 in a plan view. That is, in this embodiment, the first row R1, the second row R2, the connection portion 90, the input circuit 140, and the output matching circuit 150 are disposed in (the region of) the recess RC in a plan view.

[0172] Hereinafter, among the edges of the first ground plane G1, a portion corresponding to the inner edge of the recess RC will be referred to as the "inner edge EA (of the first ground plane G1)," and a portion other than the inner edge EA will be referred to as the "outer edge EB (of the first ground plane G1)." In this embodiment, the inner edge EA includes a pair of first edges E1a, E1b, a pair of second edges E2a, E2b, a pair of third edges E3a, E3b, and a fourth edge E4. In this embodiment, the outer edge EB includes a pair of fifth edges E5a, E5b.

[0173] Each of the pair of first edges E1a, E1b extends in the longitudinal direction X. The pair of first edges E1a, E1b are located outside the first row R1, the second row R2, the input circuit 140, and the output matching circuit 150 in the cross direction Y. Of the pair of first edges E1a, E1b, one edge E1a faces the input circuit 140 and the first row R1 in the cross direction Y. Of the pair of first edges E1a, E1b, the other edge E1b faces the output matching circuit 150 and the second row R2 in the cross direction Y.

[0174] Each of the pair of second edges E2a, E2b extends in the transverse direction Y. Of the pair of second edges E2a, E2b, one edge E2a extends from one end of edge E1a (the end on the side farther from the input transmission line 100A in the longitudinal direction X) toward the center line M in the transverse direction Y. Of the pair of second edges E2a, E2b, the other edge E2b extends from one end of edge E1b (the end on the side farther from the output transmission line 100B in the longitudinal direction X) toward the center line M in the transverse direction Y.

[0175] Each of the pair of third edges E3a, E3b extends in the longitudinal direction X. The pair of third edges E3a, E3b are located outside the connection portion 90 in the transverse direction Y. Of the pair of third edges E3a, E3b, one edge E3a extends from one end of the edge E2a (the end closer to the center line M in the transverse direction Y) so as to move away from the input transmission line 100A in the longitudinal direction X. Of the pair of third edges E3a, E3b, the other edge E3b extends from one end of the edge E2b (the end closer to the center line M in the transverse direction Y) so as to move away from the output transmission line 100B in the longitudinal direction X.

[0176] The fourth edge E4 extends in the intersecting direction Y. The fourth edge E4 connects one ends of the pair of third edges E3a, E3b (ends farther from the transmission lines 100A, 100B in the longitudinal direction X). The fourth edge E4 and the pair of third edges E3a, E3b extend along the outer edge of the second ground plane G2 (see also FIG. 6).

[0177] Each of the pair of fifth edges E5a, E5b extends in the transverse direction Y. Of the pair of fifth edges E5a, E5b, one edge E5a extends from the other end of edge E1a (the end on the side closer to the input transmission line 100A in the longitudinal direction X) so as to move away from the center line M in the transverse direction Y. Of the pair of fifth edges E5a, E5b, the other edge E5b extends from the other end of edge E1b (the end on the side closer to the output transmission line 100B in the longitudinal direction X) so as to move away from the center line M in the transverse direction Y.

[0178] Here, as shown in FIG. 1, the pair of first edges E1a, E1b are arranged at a predetermined distance from the first row R1, the second row R2, the input circuit 140, and the output matching circuit 150 in the cross direction Y. As a result, the first ground plane G1 and the loop line RP of the digital phase shift circuit B in the rows R1 and R2 are not in contact with each other. Therefore, it is possible to ensure a wide and stable GND while suppressing the influence of the first ground plane G1 on the phase shift characteristics of each digital phase shift circuit B, and to achieve the desired phase shift characteristics. In addition, since the first ground plane G1 and the return line 152 of the output matching circuit 150 are not in contact with each other, it is possible to suppress the influence of the first ground plane G1 on the characteristics of the output matching circuit 150.

[0179] Furthermore, no ground plane (plate-shaped ground conductor) is placed between the first row R1 and the second row R2 in the intersecting direction Y. If a ground plane were placed between the rows R1 and R2, this ground plane could affect the phase shift characteristics of each digital phase shift circuit B. By not placing a ground plane between the rows R1 and R2, such an effect on the phase shift characteristics can be eliminated, and desired phase shift characteristics can be achieved.

[0180] 1 and 6, the pair of third edges E3a, E3b are disposed at a predetermined distance from the second ground plane G2 in the transverse direction Y. The fourth edge E4 is disposed at a predetermined distance from the second ground plane G2 in the longitudinal direction X. As a result, the first ground plane G1 and the second ground plane G2 are not in contact with each other.

[0181] In other words, a slit SL is formed between the first ground plane G1 and the second ground plane G2 (see FIG. 6). The slit SL has a U-shape that is convex in the longitudinal direction X in the direction away from the rows R1 and R2. By providing such a slit SL, high-frequency signals can be transmitted well in the connection portion 90.

[0182] 1 and 7, the edge E5a is in contact with the ground layer 103 of the input transmission line 100A. Similarly, as shown in Figures 1 and 8, the edge E5b is in contact with the ground layer 103 of the output transmission line 100B. Note that, for ease of viewing, the power supply wiring 120 and the decoupling capacitor 130 are omitted in Figures 7 and 8.

[0183] That is, at least a part of the outer edge EB of the first ground plane G1 is in contact with the ground layer 103 of the transmission lines 100A and 100B. As a result, the GND of the input transmission line 100A and the GND of the output transmission line 100B are electrically connected to the first ground plane G1. By electrically connecting the GND of the transmission lines 100A and 100B to the first ground plane G1, the GND of the transmission lines 100A and 100B can be stabilized.

[0184] The GND of the transmission lines 100A and 100B and the first ground plane G1 do not have to be in direct contact with each other. In other words, the GND of the transmission lines 100A and 100B and the first ground plane G1 may be connected to each other through conductors such as vias or pads.

[0185] <Power supply wiring and decoupling capacitors> As shown in Fig. 1, the power supply wiring 120 has a U-shape that is convex in the longitudinal direction X in a direction away from the transmission lines 100A and 100B. The power supply wiring 120 is for supplying power to the switch control units 80 (see Fig. 3 and the like) of each digital phase shift circuit B. The power supply wiring 120 may be formed in any layer, for example, in the layer in which the signal line 10 is formed, or in a layer other than the layer in which the signal line 10 is formed. The power supply wiring 120 according to this embodiment has a pair of parallel portions 121a and 121b and a detour portion 122.

[0186] Of the pair of parallel parts 121a, 121b, the first parallel part 121a is a long plate-like conductor having a constant width, a constant thickness, and a predetermined length. The first parallel part 121a extends in the longitudinal direction X along the edge E1a (inner edge EA) of the first ground plane G1. In the illustrated example, the first parallel part 121a overlaps with the first ground plane G1 (edge ​​E1a) in a plan view. More specifically, the side edge of the first parallel part 121a on the inner side in the cross direction Y (the side of the center line M) coincides with the edge E1a in a plan view. In the illustrated example, the length (dimension in the longitudinal direction X) of the first parallel part 121a is equal to the length (dimension in the longitudinal direction X) of the edge E1a.

[0187] Of the pair of parallel parts 121a, 121b, the second parallel part 121b is a long plate-like conductor having a constant width, a constant thickness, and a predetermined length. The second parallel part 121b extends in the longitudinal direction X along the edge E1b (inner edge EA) of the first ground plane G1. In the illustrated example, the second parallel part 121b overlaps with the first ground plane G1 (edge ​​E1b) in a plan view. More specifically, the side edge of the second parallel part 121b on the inner side in the cross direction Y (the side of the center line M) coincides with the edge E1b in a plan view. In the illustrated example, the length (dimension in the longitudinal direction X) of the second parallel part 121b is equal to the length (dimension in the longitudinal direction X) of the edge E1b.

[0188] The detour portion 122 is a long plate-like conductor having a constant width, a constant thickness, and a predetermined length. The detour portion 122 connects one end (the end farther from the transmission lines 100A and 100B in the longitudinal direction X) of the pair of parallel portions 121a and 121b to each other. The detour portion 122 has a U-shape that is convex in the longitudinal direction X in a direction away from the transmission lines 100A and 100B. The detour portion 122 does not overlap the connection portion 90 in a plan view, and is located outside the connection portion 90. In other words, the detour portion 122 extends so as to detour around the connection portion 90 in a plan view.

[0189] A plurality of decoupling capacitors 130 are provided along each of the parallel portions 121a and 121b. Each decoupling capacitor 130 is disposed between the power supply wiring 120 and the first ground plane G1. That is, when the power supply wiring 120 is in a layer above the first ground plane G1, an upper electrode of the decoupling capacitor 130 is connected to the power supply wiring 120, and a lower electrode of the decoupling capacitor 130 is connected to the first ground plane G1.

[0190] In the phase shifting device A according to this embodiment, the multiple decoupling capacitors 130 correspond one-to-one to the multiple digital phase shifting circuits B. Each decoupling capacitor 130 is provided at a position aligned with the corresponding digital phase shifting circuit B in the intersecting direction Y. However, the number and arrangement of the decoupling capacitors 130 can be changed as appropriate.

[0191] In this way, at least a part (parallel parts 121a, 121b) of the power supply wiring 120 extends along the inner edge EA (first edges E1a, E1b) of the first ground plane G1, which makes it easy to provide a large number of decoupling capacitors 130 between the power supply wiring 120 and the first ground plane G1. This allows the power supply wiring 120 to be stable.

[0192] Furthermore, at least a portion (parallel portions 121a, 121b) of the power supply wiring 120 extends along the inner edge EA (first edges E1a, E1b) of the first ground plane G1, so that the power supply wiring 120 and the first ground plane G1 are close to each other. This makes it possible to shorten the connection path of the decoupling capacitor 130. This makes it possible to realize a stable power supply wiring 120.

[0193] If it is possible to place the decoupling capacitor 130 between the power supply wiring 120 and the first ground plane G1, the parallel portions 121a, 121b and the first edges E1a, E1b may be misaligned in the cross direction Y. That is, it is only necessary that the parallel portions 121a, 121b extend parallel to the first edges E1a, E1b in the vicinity of the first edges E1a, E1b.

[0194] Fig. 11 is a diagram showing the connection relationship between the power supply wiring 120 and the switch control unit 80 according to this embodiment. As shown in Fig. 11, the power supply wiring 120 supplies power to the switch control unit 80 via a power supply path 123. Note that as long as the power supply wiring 120 can supply power to the switch control unit 80, the specific form of the power supply path 123 is not particularly limited and can be designed as appropriate.

[0195] Here, as shown in FIG. 11, a gap GP is formed between two adjacent digital phase shift circuits B in a plan view. This is because the digital phase shift circuit B has the above-mentioned bent line 22b. Specifically, the gap GP k is the digital phase shift circuit B k and the adjacent digital phase shift circuit B k+1 In other words, the gap GP k is the digital phase shift circuit B k The bent line 22b and the digital phase shift circuit B k+1 The first intersecting line 22c1 is a region surrounded by the first intersecting line 22c2.

[0196] And digital phase shift circuit B k The switch control unit 80 of this gap GP k By disposing the switch control section 80 in the gap GP, the space on the semiconductor substrate can be effectively utilized, and the phase shifting device A can be further miniaturized.

[0197] <Summary> As described above, the phase-shifting device A according to the present embodiment includes the signal line 10, the first line 21 including the first parallel line 21p1 extending parallel to the signal line 10, the second parallel line 22p2 extending parallel to the signal line 10, and the second parallel line 22p2 extending from one end of the second parallel line 22p2 to near the other end of the second parallel line 22p2 and away from the signal line 10 in the intersecting direction Y intersecting the longitudinal direction X of the signal line 10. a first ground conductor 31 electrically connected to one end of the first parallel line 21p1 and one end of the second parallel line 22p2; a second ground conductor 32 connected to one end of the second line 22; a first electronic switch 41 provided between the other end of the first parallel line 21p1 and the second ground conductor 32; the first ground conductor 32 and the second ground conductor 32; a second electronic switch 42 provided between the end and the second ground conductor 32; and a control circuit (switch control unit 80) that controls the first electronic switch 41 and the second electronic switch 42. The first ground conductor 32 and the second ground conductor 32 include a first row R1 in which a plurality of digital phase-shifting circuits B are cascaded in a longitudinal direction X, and a second row R2 in which a plurality of digital phase-shifting circuits B are cascaded in a longitudinal direction X and extend parallel to the first row R1 so as to overlap with the first row R1 as viewed from the intersecting direction Y. A connection portion 90 electrically connects one end of the first row R1 and one end of the second row R2. A first ground plane G1 in which a recess RC is formed and which surrounds the first row R1, the second row R2, and the connection portion 90 in a plan view, and the first ground plane G1 and the loop line RP are not in contact with each other.

[0198] According to this configuration, since the second line 22 of each digital phase shift circuit B includes the loop line RP, the required phase shift amount can be ensured even if each digital phase shift circuit B is made compact. Furthermore, by making each digital phase shift circuit B compact, the required phase shift amount can be ensured with only two rows R1 and R2 (i.e., without providing three or more unit rows R), and the phase shift device A can be made compact. Furthermore, since the first ground plane G1 and the loop line RP are not in contact with each other, the effect of the first ground plane G1 on the phase shift characteristics of each digital phase shift circuit B can be suppressed, and desired phase shift characteristics can be realized.

[0199] Moreover, the phase shift device A according to this embodiment further includes a power supply wiring 120 having a U-shape in a plan view, at least a part of which (parallel parts 121a, 121b) extends along the inner edge EA (first edges E1a, E1b) of the recess RC and supplies power to the switch control part 80, and a decoupling capacitor 130 disposed between the first ground plane G1 and the power supply wiring 120. With this configuration, a stable power supply wiring 120 can be realized.

[0200] In each of the multiple digital phase shift circuits B, the loop line RP includes a first cross line 22c1 extending from one end of the second parallel line 22p2 in the crossing direction Y away from the signal line 10, a third parallel line 22p3 extending from one end of the first cross line 22c1 parallel to the signal line 10 and having a length shorter than the second parallel line 22p2, and a bent line 22b connected to one end of the third parallel line 22p3 and having a bent portion CR extending shorter than the length of the first cross line 22c1 so as to approach the signal line 10 in the crossing direction Y and then extending parallel to the signal line 10, and in each of the multiple digital phase shift circuits B, the switch control unit 80 is located in a gap GP formed between the bent line 22b and the first cross line 22c1 of the adjacent digital phase shift circuit B in a planar view. This configuration allows the space on the semiconductor substrate to be effectively utilized, and the phase shifting device A to be further miniaturized.

[0201] Furthermore, the connection portion 90 has a second ground plane G2, and the first ground plane G1 and the second ground plane G2 are not in contact with each other. With this configuration, the connection portion 90 can transmit high-frequency signals well.

[0202] Furthermore, no ground plane is placed between the first row R1 and the second row R2. This configuration eliminates the adverse effect that the ground plane placed between the rows R1 and R2 has on the phase shift characteristics of each digital phase shift circuit B, thereby achieving the desired phase shift characteristics.

[0203] The phase shift device A according to the present embodiment further includes an input transmission line 100A having a GND, electrically connected to the other end of the first row R1, and an output transmission line 100B having a GND, electrically connected to the other end of the second row R2, and the GND of the input transmission line 100A and the GND of the output transmission line 100B are electrically connected to the first ground plane G1. This configuration can stabilize the GND of the transmission lines 100A and 100B.

[0204] Each of the input transmission line 100A and the output transmission line 100B has a signal line 101 electrically connected to the signal line 10, a pair of ground wires 102a, 102b arranged on both sides of the signal line 101 with a gap therebetween, a ground layer 103 arranged above and / or below the signal line 101 and the pair of ground wires 102a, 102b, and a connection conductor 50 connecting the pair of ground wires 102a, 102b and the ground layer 103, where S1 is the distance between the signal line 101 and the ground wires 102a, 102b, and H1 is the distance between the signal line 101 and the ground layer 103, and H1≧3×S1 is satisfied. With this configuration, it is possible to facilitate the flow of high-frequency current between the signal line 101 and the ground wires 102a, 102b, and to make it difficult for high-frequency current to flow between the signal line 101 and the ground layer 103. This allows good transmission of high frequency signals through the transmission lines 100A and 100B. In addition, by suppressing the outflow of high frequency current from the signal line 101 to the ground layer 103, it is possible to suppress the outflow of high frequency current to the first ground plane G1 connected to the ground layer 103. This makes it possible to suppress adverse effects on the phase shift characteristics caused by the outflow of high frequency current to the first ground plane G1.

[0205] The phase shift device A according to the present embodiment further includes a first bend connection portion 110A electrically connecting the other end of the first row R1 and the input transmission line 100A and having a bent shape in a plan view, and a second bend connection portion 110B electrically connecting the other end of the second row R2 and the output transmission line 100B and having a bent shape in a plan view, and each of the input transmission line 100A and the output transmission line 100B extends in the intersecting direction Y. By introducing such bend connection portions 110A and 110B, the transmission lines 100A and 100B can be extended from the other ends of the rows R1 and R2 toward the outside in the intersecting direction Y. This makes it possible to suitably apply the phase shift device A according to the present embodiment to a semiconductor package in which other circuits connected to the transmission lines 100A and 100B are located on both sides of the rows R1 and R2 in the intersecting direction Y.

[0206] In addition, each of the first bend connection portion 110A and the second bend connection portion 110B has a signal line connection path 111 electrically connected to the signal line 10, a pair of ground line connection paths 112a, 112b electrically connected to the pair of ground lines 102a, 102b, a connection ground layer 113 arranged at least one above and below the signal line connection path 111 and the pair of ground line connection paths 112a, 112b, and a plurality of connection conductors 50 connecting the pair of ground line connection paths 112a, 112b and the connection ground layer 113, and when the distance between the signal line connection path 111 and the ground line connection paths 112a, 112b is S2 and the distance between the signal line connection path 111 and the connection ground layer 113 is H2, H2≧3×S2 holds. This configuration allows high-frequency current to flow easily between the signal line connecting path 111 and the ground line connecting paths 112a, 112b, and makes it difficult for high-frequency current to flow between the signal line connecting path 111 and the connection ground layer 113. This allows good transmission of high-frequency signals at the bend connecting parts 110A, 110B. In addition, by suppressing the outflow of high-frequency current from the signal line connecting path 111 to the connection ground layer 113, it is also possible to suppress the outflow of high-frequency current to the first ground plane G1 connected to the connection ground layer 113 via the ground layer 103. This makes it possible to suppress adverse effects on phase shift characteristics caused by the outflow of high-frequency current to the first ground plane G1.

[0207] <Modification> The technical scope of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

[0208] For example, the configuration of the loop line RP in each digital phase shift circuit B can be changed as appropriate. As an example, the loop line RP may be formed in the layer in which the signal line 10 is formed. In addition, the crossover lines 22c1 and 22c2 may not have the bent portions CR1 and CR2. In this case, the digital phase shift circuit B k The bent line 22b (partial line 22b2) of the digital phase shift circuit B k+1In other words, the digital phase shift circuit B k and the digital phase shift circuit B k+1 The first intersecting line 22c1 may be connected in a T-shape. Also, the loop line RP may not have the bent line 22b, and the second cross line 22c2 and the third parallel line 22p3 may be directly connected to each other. The loop line RP may be formed across multiple layers. More specifically, the loop line RP may include a first loop line portion formed in a first layer (e.g., a layer in which the signal line 10 and the like are formed) and a second loop line portion formed in a second layer different from the first layer. The first loop line portion and the second loop line portion may be electrically connected to each other through a via or the like. The configuration of the loop line RP is not limited to the above example, and can be modified as appropriate as long as it has a loop shape that is convex in the direction away from the signal line 10 in the cross direction Y. Similarly, the configuration of the return line 152 of the output matching circuit 150 can also be modified as appropriate.

[0209] In the above embodiment, the multiple digital phase shift circuits B are cascade-connected in each of the columns R1 and R2 such that the first line 21 is located only on the other side of the signal line 10 (-Y side in the second column R2, +Y side in the first column R1) and the second line 22 is located only on one side of the signal line 10 (+Y side in the second column R2, -Y side in the first column R1), but the manner of cascade connection is not limited to this. For example, the multiple digital phase shift circuits B may be cascade-connected such that the second line 22 is alternately arranged on one side (+Y side) and the other side (-Y side) of the signal line 10 as viewed in the longitudinal direction X. More specifically, the digital phase shift circuit B and an inverted digital phase shift circuit rB (not shown) obtained by inverting the digital phase shift circuit B with respect to the center line of the signal line 10 may be alternately cascade-connected.

[0210] In addition, within the scope of the spirit of the present invention, it is possible to replace the components in the above-described embodiments with well-known components as appropriate, and the above-described embodiments and variations may be combined as appropriate. [Explanation of symbols]

[0211] A...Phase shift device R1...First row R2...Second row B...Digital phase shift circuit 10...Signal line 21...First line 21p1...First parallel line 22...Second line RP...Loop line 22p2...Second parallel line 22c1...First cross line 22p3...Third parallel line 22b...Bent line 31...First ground conductor 32...Second ground conductor 41...First electronic switch 42...Second electronic switch 50...Connecting conductor 80...Switch control section (control circuit) 90...Connecting section 100A...Input transmission line 100B...Output transmission line 101...Signal line 102a, 102b...Ground line 103...Ground layer 110A...First bend connection section 110B...Second bend connection section 111...Signal line connecting path 112a, 112b... Ground line connection path 113... Connection ground layer 120... Power supply wiring 130... Decoupling capacitor G1... First ground plane RC... Recess EA... Inner edge G2... Second ground plane

Claims

1. a first line including a signal line, a first parallel line extending parallel to the signal line, a second parallel line extending parallel to the signal line, and a second line including a loop-shaped loop line extending from one end of the second parallel line to near the other end of the second parallel line and having a convex shape in a direction away from the signal line in a direction intersecting a longitudinal direction of the signal line; a first ground conductor electrically connected to one end of the first parallel line and one end of the second parallel line; a first electronic switch provided between the other end of the first parallel line and the second ground conductor; a second electronic switch provided between the other end of the second parallel line and the second ground conductor; and a control circuit for controlling the first electronic switch and the second electronic switch, the first row including a plurality of digital phase shift circuits cascaded in the longitudinal direction, the first row including a plurality of digital phase shift circuits, the signal line of which is located between the first parallel line and the second parallel line; a second row in which a plurality of the digital phase shift circuits are connected in cascade in the longitudinal direction and which extends parallel to the first row and overlaps with the first row when viewed from the cross direction; a connection portion electrically connecting one end of the first row and one end of the second row; a first ground plane having a recess formed therein and surrounding the first row, the second row, and the connection portion in a plan view; the first ground plane and the loop line are not in contact with each other; Phase shifting device.

2. a power supply wiring having a U-shape in a plan view, at least a portion of which extends along an inner edge of the recess and supplies power to the control circuit; a decoupling capacitor disposed between the first ground plane and the power supply wiring, 2. A phase shifting device according to claim 1.

3. In each of the plurality of digital phase shift circuits, the loop line includes a first cross line extending from one end of the second parallel line in the crossing direction away from the signal line, a third parallel line extending from one end of the first cross line in parallel to the signal line and having a length shorter than that of the second parallel line, and a bent line connected to one end of the third parallel line, extending closer to the signal line in the crossing direction to a length shorter than that of the first cross line, and then extending parallel to the signal line, In each of the plurality of digital phase shift circuits, the control circuit is located in a gap formed between the bent line and the first intersecting line of the adjacent digital phase shift circuit in a plan view.

3. A phase shifting device according to claim 1 or 2.

4. the connection portion includes a second ground plane; the first ground plane and the second ground plane are not in contact with each other; 3. A phase shifting device according to claim 1 or 2.

5. No ground plane is disposed between the first row and the second row.

3. A phase shifting device according to claim 1 or 2.

6. an input transmission line having a GND, electrically connected to the other end of the first row; an output transmission line having a GND, electrically connected to the other end of the second row; the GND of the input transmission line and the GND of the output transmission line are electrically connected to the first ground plane; 3. A phase shifting device according to claim 1 or 2.

7. Each of the input transmission line and the output transmission line has a signal line electrically connected to the signal line, and a pair of ground lines arranged on both sides of the signal line with a space therebetween.

7. A phase shifting device according to claim 6.

8. Each of the input transmission line and the output transmission line further includes a ground layer disposed above and / or below the signal line and the pair of ground lines, and a connection conductor connecting the pair of ground lines and the ground layer.

8. A phase shifting device according to claim 7.

9. When the distance between the signal line and the ground line is S1 and the distance between the signal line and the ground layer is H1, H1≧3×S1 is satisfied.

9. A phase shifting device according to claim 8.

10. a first bend connection portion that electrically connects the other end of the first row and the input transmission line and has a bent shape in a plan view; a second bend connection portion that electrically connects the other end of the second row and the output transmission line and has a bent shape in a plan view, each of the input transmission line and the output transmission line extends in the intersecting direction; 7. A phase shifting device according to claim 6.

11. a first bend connection portion that electrically connects the other end of the first row and the input transmission line and has a bent shape in a plan view; a second bend connection portion that electrically connects the other end of the second row and the output transmission line and has a bent shape in a plan view, each of the first bend connection portion and the second bend connection portion has a signal line connection path electrically connected to the signal line and a pair of ground line connection paths electrically connected to the pair of ground lines; 8. A phase shifting device according to claim 7.

12. Each of the first bend connection portion and the second bend connection portion further includes a connection ground layer disposed above and / or below the signal line connection path and the pair of ground line connection paths, and a connection conductor connecting the pair of ground line connection paths and the connection ground layer.

12. A phase shifting device according to claim 11.

13. When a distance between the signal line connection path and the ground line connection path is S2 and a distance between the signal line connection path and the connection ground layer is H2, H2≧3×S2 is satisfied.

13. A phase shifting device according to claim 12.

Images