Method for manufacturing discharge head

Abstract

To provide a method for manufacturing a liquid discharge head which prevents generation of a residue without gelatinizing an uncured part of a flow channel wall formation layer, at the time of exposure to a discharge port formation layer.SOLUTION: A method for manufacturing a discharge head includes a step of forming a flow channel wall formation layer having a thickness of 4 μm to 14 μm on a substrate, exposing a part of the flow channel wall formation layer, and curing a flow channel wall, a step of forming a discharge port formation layer on the flow channel wall formation layer, exposing a part of the discharge port formation layer, curing a discharge port, and forming a water-repellent layer on the discharge port formation layer, and a step of removing uncured parts of the flow channel wall formation layer and the discharge port formation layer, and forming a flow channel and a discharge port, wherein the discharge port formation layer and the flow channel wall formation layer include a negative type photosensitive resin, and an exposure amount to the discharge port formation layer is smaller than a gelatinization start exposure amount of the flow channel wall formation layer.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a method for manufacturing a discharge head. [Background technology]

[0002] Patent Document 1 describes a method for manufacturing a discharge head in which nozzles are formed on a substrate with a supply port using a dry film resist. In detail, after a flow path wall forming layer is formed on a substrate with a supply port, the portion that will become the flow path wall is exposed to light, and a heat treatment is performed after the exposure. After a discharge port forming layer is formed on the flow path wall forming layer, the portion other than the portion that will become the discharge port is exposed to light, and a heat treatment is performed after the exposure. The unexposed portions of the flow path wall forming layer and the discharge port forming layer are removed with a solvent, and the flow paths and discharge ports of the discharge head are developed to form them. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication 2019-142155 Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, when attempting to obtain an ejection head capable of ejecting smaller droplets and contributing to high-quality recording, it is desirable to make the thickness of the flow path wall forming layer (flow path height) smaller. Specifically, the thickness of the flow path wall forming layer is set to 4 μm-14 μm. In this case, if a negative photosensitive resin is used for the ejection port forming layer and the flow path wall forming layer and the manufacturing method described in Patent Document 1 is carried out, the unexposed portion of the flow path wall forming layer is easily affected by reflection from the substrate when the ejection port forming layer is exposed to light. As a result, the unexposed portion of the flow path wall forming layer is exposed to reflected light, which may cause the flow path wall forming layer to gel and generate residue.

[0005] An object of the present disclosure is to provide a method for manufacturing a discharge head in which, when the discharge port forming layer is exposed to light, the uncured portions of the flow path wall forming layer do not gel and no residue is generated.

[0006] The method disclosed herein is a method for manufacturing a discharge head comprising the steps of forming a flow path wall forming layer having a thickness of 4 μm to 14 μm on a substrate, exposing a portion of the flow path wall forming layer to light, and hardening the flow path walls; forming an ejection port forming layer on the flow path wall forming layer, exposing a portion of the ejection port forming layer to light, hardening the ejection port, and forming a water repellent layer in the ejection port forming layer; and removing unhardened portions of the flow path wall forming layer and the ejection port forming layer to form a flow path and an ejection port, wherein the ejection port forming layer and the flow path wall forming layer contain a negative photosensitive resin, and the amount of exposure to the ejection port forming layer is smaller than the amount of exposure at which the flow path wall forming layer begins to gel. Effect of the Invention

[0007] According to the present disclosure, it is possible to manufacture a discharge head in which the uncured portions of the flow path wall forming layer do not gel when the discharge port forming layer is exposed to light, and no residue is generated. [Brief description of the drawings]

[0008] [Figure 1] 2A and 2B are a perspective view and an AA' cross-sectional view of a discharge head according to an embodiment of the present disclosure. [Diagram 2] 1A to 1F are cross-sectional views illustrating a method for manufacturing a discharge head according to an embodiment of the present disclosure. [Diagram 3] 5(a) and 5(b) are cross-sectional views illustrating a method for manufacturing a discharge head according to an embodiment of the present disclosure. [Figure 4] FIG. 2 is a top view of a dispensing head according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an embodiment of the present disclosure will be described in detail with reference to the drawings. Figures 1(a) and 1(b) are a perspective view showing a part of a cross section of an ejection head according to an embodiment of the present disclosure, and a cross section taken along line AA' in Figure 1(a). As shown in Figures 1(a) and 1(b), the ejection head 1 is configured by laminating a substrate 5, a flow path wall forming layer 21, and an ejection port forming layer 31, and includes a supply flow path 11, a flow path 20, and a plurality of ejection port rows each including a plurality of ejection ports 30.

[0010] The flow path wall forming layer 21 has flow path walls that define the flow paths 20 provided for each ejection port 30. The flow paths 20 contain liquid such as ink that is supplied and discharged via a supply flow path 11. Heat generated by electrothermal conversion elements 2 (ejection energy generating elements) provided on the substrate 5 generates bubbles in the liquid, and ink is ejected from the ejection port 30 by the pressure of the bubbles. A set of supply flow paths 11 is provided in the substrate 5 for the flow paths 20. The ejection port forming layer 31 has the ejection port 30 and constitutes a flow path ceiling of the flow path 20. An insulating protective film (not shown) is formed on the ejection energy generating elements 2. The insulating protective film is patterned by photolithography, dry etching, or the like.

[0011] Figures 2(a)-(f) are cross-sectional views showing a manufacturing method of the ejection head shown in Figure 1. First, as shown in Figure 2(a), a supply flow path 11 is formed so as to penetrate the substrate 5, which includes ejection energy generating elements and whose surfaces are covered with an insulating protective film. The supply flow path 11 is formed by subjecting the substrate to dry etching or the like.

[0012] The material of the substrate 5 is silicon or the like that can be used as a semiconductor element substrate. The material of the ejection energy generating element is a resistor such as TaSiN, which heats the liquid in response to an electric signal to provide ejection energy. The insulating protective film is an insulating film made of a material such as SiN, SiC, or SiO, which can protect the electrical wiring from the liquid.

[0013] 2(b), the flow path wall forming layer 21 held on its upper surface by a support member (not shown) is transferred to the substrate 5. Thereafter, the support member is peeled off from the flow path wall forming layer 21, and the flow path wall forming layer 21 is placed on the substrate 5. The thickness of the flow path wall forming layer 21 in this embodiment is preferably 4 μm-14 μm, which allows small droplets to be appropriately formed when droplets are discharged.

[0014] In this embodiment, the flow path wall forming layer 21 is made of a negative photosensitive resin in the form of a dry film. The negative photosensitive resin is, for example, cresol novolac resin or epoxy resin. The flow path wall forming layer 21 contains a photoacid generator that absorbs the exposure wavelength. The support member is a material that is stable against the thermal history of the flow path wall forming layer, such as polyethylene terephthalate or polyimide. The temperature and pressure during the transfer of the flow path wall forming layer 21 are, for example, 60°C to 140°C and 0.1 MPa to 1.5 MPa, which allows the flow path wall forming layer 21 to soften and cover the steps on the surface of the substrate 5.

[0015] 2(c), a portion of the flow path wall forming layer 21 corresponding to the flow path wall is selectively exposed through a photomask and subjected to post-exposure heat treatment (PEB) to form a hardened portion 21A and an unhardened portion 21B. The hardened portion 21A corresponds to the flow path wall, and the unhardened portion 21B corresponds to the flow path 20.

[0016] 2(d), the ejection port formation layer 31 held on its upper surface by a support member (not shown) is transferred onto the flow path wall formation layer 21. Thereafter, the support member is peeled off from the ejection port formation layer 31, and the ejection port formation layer 31 is disposed on the flow path wall formation layer 21. Thereafter, a water-repellent layer (not shown) is formed on the ejection port formation layer 31. The thickness of the water-repellent layer is set to 250-750 nm from the viewpoint of the expression of water repellency related to the exposure dose described later.

[0017] The outlet forming layer 31 is a negative photosensitive resin in the form of a dry film. The negative photosensitive resin is, for example, a cresol novolac resin or an epoxy resin. The outlet forming layer 31 may be made of a material that is more sensitive to exposure than the flow path wall forming layer 21. The outlet forming layer 31 may contain more photoacid generator than the flow path wall forming layer 21. The temperature and pressure during transfer of the outlet forming layer 31 are, for example, 30° C. to 50° C. and 0.1 MPa to 0.5 MPa.

[0018] 2(e), to form the discharge ports 30 of the discharge port formation layer 31, selective exposure is performed through a photomask, and post-exposure heat treatment (PEB) is performed to form hardened portions 31A and unhardened portions 31B. The hardened portions 31A correspond to the nozzles and flow channel ceilings that form the discharge ports, and the unhardened portions 31B correspond to the discharge ports 30.

[0019] 2(e) is controlled as described below. The exposure dose for the discharge port forming layer 31 is set to be smaller than the gelation start exposure dose for the flow path wall forming layer 21. In this case, taking into consideration the substrate reflection, material sensitivity, process variations, etc., it is preferably set to be 30% or less of the gelation start exposure dose for the flow path wall forming layer 21. In addition, it is preferable that the exposure dose for the discharge port forming layer 31 is larger than the water repellency development exposure dose for the water repellent layer. From the above, in this embodiment, the exposure dose for the discharge port forming layer 31 is set to be a value in the range of 400-600 J / m2.

[0020] It is also possible to compensate for the curing reaction of the water-repellent layer by reducing the amount of exposure to the discharge port formation layer 31 and increasing the heat treatment temperature after exposure. If the heat treatment temperature after exposure is too high, the developability of the uncured portion 21B of the flow path wall formation layer 21 decreases, so a temperature of, for example, 80° C. to 110° C. is preferable.

[0021] The gelation start exposure dose of the flow path wall forming layer 21 is the exposure dose at which the epoxy reaction rate of the flow path wall forming layer 21 becomes 10%. The epoxy reaction rate is a ratio of the total number of epoxy rings contained in the material as the denominator and the number of epoxy rings opened in the exposure step and PEB step as the numerator. For example, if all epoxy rings are opened by heat, the epoxy reaction rate is 100%.

[0022] Next, as shown in FIG. 2(f), the uncured portions of the flow path wall forming layer 21 and the discharge port forming layer 31 are removed with a soluble liquid to form the flow path 20 and the discharge port 30. The water repellency can be enhanced by reducing the amount of exposure to the discharge port forming layer 31 and removing the uncured portions 21B and 31B, and then exposing the water repellent layer. In this way, it is possible to fully express the water repellency of the water repellent layer while setting the amount of exposure to a level that does not cause gelling residues in the uncured portions 21B of the flow path wall forming layer. Through the above steps, a discharge head substrate is completed, in which a nozzle portion is formed to discharge the liquid flowing in from the supply flow path 11 through the discharge port 30.

[0023] 3(a) and (b) are diagrams for explaining the energy due to exposure in the manufacturing of the ejection head of the present embodiment described above. Fig. 3(a) shows incident light during exposure to the ejection port formation layer 31, and Fig. 3(b) shows reflection of the incident light.

[0024] 3(a) and (b), the discharge port formation layer 31 is irradiated with light exposure 100 through a photomask. When the uncured portion 21B of the flow path wall formation layer 21 is irradiated with light exposure 100, the incident light is reflected by the surface of the substrate 5, generating reflected light 200. As a result, the uncured portion 21B of the flow path wall formation layer 21 receives the total energy of the direct incident light 100 and the reflected light 200 (hereinafter also referred to as "total energy").

[0025] <Total energy> This total energy can be expressed as total energy = incident exposure amount to the uncured layer + reflected exposure amount, and the reflected exposure amount can be expressed as incident exposure amount to the uncured layer × transmittance of the uncured layer × thickness of the uncured layer × reflectance.

[0026] As can be seen from the above relationship, as the thickness of the flow path wall forming layer 21 decreases, the absorption of the light exposure 100 in the uncured portion 21B of the flow path wall forming layer 21 decreases, the amount of exposure light by the reflected light 200 from the substrate increases, and the energy received by the flow path wall forming layer 21 increases. Therefore, when the thickness of the flow path wall forming layer 21 is 4 μm-14 μm as in this embodiment, the uncured portion of the flow path wall forming layer 21 is more likely to gel if the same amount of exposure light as in the conventional method is applied.

[0027] In contrast, in this embodiment, the combined exposure energy of the incident light 100 and the reflected light 200 is made smaller than the gelation start exposure amount of the flow path wall forming layer 21. Preferably, it is made 45% or less of the gelation start exposure amount of the flow path wall forming layer 21. Furthermore, it is preferable that the exposure amount of the discharge port forming layer 31 corresponding to the incident light is larger than the exposure amount for developing water repellency of the water repellent layer of the discharge port forming layer 31. From the above, in this embodiment, the combined energy of the incident light and reflected light received by the flow path wall forming layer 21 is controlled to a value in the range of 450-750 J / m2.

[0028] <First embodiment> Fig. 4 is a top view of the discharge head 1 in the first embodiment. As shown in Fig. 4, the discharge head 1 has a hardened portion 21A of the flow path wall forming layer 21 and a supply flow path 11 of a substrate 5, and a cavitation-resistant film 13 is disposed on the substrate 5. In the first embodiment, the cavitation-resistant film 13 is made of iridium and overlaps with an area of ​​the unhardened portion 21B of the flow path wall forming layer 21.

[0029] 2(a)-(f) will be used again to explain the detailed manufacturing method of the ejection head in the first embodiment. As shown in FIG. 2(a), ejection energy generating elements (not shown) are formed on the substrate 5, and the ejection energy generating elements are covered with an insulating protective film (not shown). A mask resist is formed on the insulating protective film, and after patterning, the substrate 5 is processed by dry etching to form the supply flow path 11. Iridium is disposed on the surface of the substrate 5 as a cavitation-resistant film 13 (not shown), and the i-line reflectance of iridium is 0.67. The i-line reflectance of such a cavitation-resistant film 13 is 0.4 or more.

[0030] As shown in FIG. 2(b), the flow path wall forming layer 21 held on the upper surface side by the support member is transferred onto the insulating protective film (not shown) of the substrate 5. The flow path wall forming layer 21 is a negative photosensitive resin, and is formed in the form of a dry film. In the first embodiment, the transfer temperature is 70° C., the pressure is 0.5 MPa, and the peeling speed of the support member is 5 mm / s. The thickness of the flow path wall forming layer 21 is 10 μm, the gelation start exposure amount of the flow path wall forming layer 21 is 2000 J / m2, and the water repellency development exposure amount of the water repellent layer is 400 J / m2. The support member of the flow path wall forming layer 21 is a PET film that has been subjected to a release treatment.

[0031] 2(c), the portions of the flow path wall forming layer 21 corresponding to the flow path walls are exposed to i-line (wavelength 365 nm) using a Canon FPA-3000i5+ through a photomask to form the cured portions 21A that will become the flow path walls and the uncured portions 21B that will become the flow paths 20. In the first embodiment, the exposure dose is 10000 J / m2. Thereafter, heating is performed on a hot plate at 50°C for 4 minutes as PEB to promote the curing reaction.

[0032] 2(d), a discharge port forming layer 31 made of a negative photosensitive resin in a dry film form is formed to a thickness of 6 μm on the flow path wall forming layer 21. The temperature for transferring the discharge port forming layer 31 is 40° C., the pressure is 0.3 MPa, and the peeling speed of the support member is 5 mm / s.

[0033] As shown in FIG. 2(e), the portion of the discharge port forming layer 31 that will become the flow path ceiling is exposed to i-line (wavelength 365 nm) using a Canon FPA-3000i5+ through a photomask to form a hardened portion 31A that will become the flow path ceiling and an unhardened portion 31B that will become the discharge port.

[0034] In the first embodiment, the exposure dose is 500 J / m2. At this time, the uncured portion 21B of the flow path wall forming layer 21 is also exposed, and the total energy received by the flow path wall forming layer 21 on the iridium is 600 J / m2. The gelation start exposure dose of the flow path wall forming layer 21 is 2000 J / m2, which is 45% or less of the gelation start exposure dose of the flow path wall forming layer 21, so that the curing reaction of the uncured portion 21B does not occur. After that, heating is performed on a hot plate at 90°C for 5 minutes as PEB to promote the curing reaction.

[0035] Thereafter, a water-repellent layer is formed on the discharge port formation layer 31. The thickness of the water-repellent layer is 500 nm. By adjusting the amount of exposure to the discharge port formation layer 31, it is possible to achieve the desired water repellency, and there is an advantage that residues due to gelation of the flow path wall formation layer 21 are unlikely to be generated.

[0036] 2(f), the uncured portions of the flow path wall forming layer 21 and the discharge port forming layer 31 are collectively removed by a development process to form the flow paths 20 and the discharge ports 30. Propylene glycol monomethyl acetate is used as a solvent for the development process, and the development process is carried out for 15 minutes.

[0037] Furthermore, the exposure of the discharge port forming layer 31 may cross regions having a plurality of reflectances of the exposure wavelength (the surface of the cavitation-resistant film 13 and the surface of the substrate). In this case, the reflected light may cause diffracted light to scatter in the region of the uncured portion 31B, which may cause gelation of the uncured portion 31B. By controlling the amount of exposure of the discharge port forming layer 31 as described above, not only is it possible to prevent the generation of residues due to gelation of the flow path wall forming layer 21, but also to form the discharge port 30 normally.

[0038] Through the above steps, a discharge head substrate is manufactured having a nozzle portion that discharges liquid flowing from the supply flow path 11 through the flow path 20 from the discharge port 30. The discharge head substrate is cut and separated into chips using a dicing saw or the like. Electrical wiring that drives the discharge energy generating elements is bonded to each chip, and a chip tank member for supplying liquid is bonded to complete the discharge head. Printing was performed with this discharge head, and high-quality discharge characteristics were confirmed, including water repellency and the ability to discharge small droplets.

[0039] <Second embodiment> 4 is made of tantalum and overlaps with the region of the unhardened portion 21B of the flow path wall forming layer 21. As shown in FIG. 2(e), the portion of the discharge port forming layer 31 corresponding to the flow path ceiling is exposed to i-line (wavelength 365 nm) using a Canon FPA-3000i5+ to form the hardened portion 31A that becomes the flow path ceiling and the unhardened portion 31B that becomes the discharge port 30.

[0040] In the second embodiment, the exposure dose to the discharge port formation layer 31 is 600 J / m2. At this time, the uncured portion 21B of the flow path wall formation layer 21 is also exposed, but the gelation start exposure dose of the flow path wall formation layer 21 is 2000 J / m2, which is 30% or less of the gelation start exposure dose of the flow path wall formation layer 21, and therefore no curing reaction occurs.

[0041] The combined energy in the second embodiment will be described again with reference to Fig. 3. Tantalum is disposed on the surface of the substrate 5 as the cavitation-resistant film 13, and since the i-line reflectance of tantalum is 0.44, the combined energy received by the flow path wall forming layer 21 on the tantalum is 670 J / m2. Since the gelation start exposure dose of the flow path wall forming layer 21 is 2000 J / m2, which is 45% or less of the gelation start exposure dose of the flow path wall forming layer 21, the uncured portion 21B of the flow path wall forming layer 21 does not gel, and the flow path 20 and the discharge port 30 can be formed.

[0042] <Third embodiment> In the third embodiment, the heat treatment temperature after exposure of the discharge port formation layer 31 is 100° C. As shown in FIG. 2(e), a portion of the discharge port formation layer 31 corresponding to the flow channel ceiling is exposed to i-line (wavelength 365 nm) using a Canon FPA-3000i5+ to form a hardened portion 31A that becomes the flow channel ceiling and an unhardened portion 31B that becomes the discharge port.

[0043] In the third embodiment, the exposure dose to the discharge port formation layer 31 is 400 J / m2. At this time, the uncured portion 21B of the flow path wall formation layer 21 is also irradiated with light, but the gelation start exposure dose of the flow path wall formation layer 21 is 2000 J / m2, which is 30% or less of the gelation start exposure dose of the flow path wall formation layer 21, and therefore no curing reaction occurs.

[0044] At this time, since the i-line reflectance of iridium is 0.67, the total energy received by the flow path wall forming layer 21 is 470 J / m2, which is less than 45% of the gelation start exposure of the flow path wall forming layer 21, so no hardening reaction occurs. Even if the exposure dose of the discharge port forming layer 31 is reduced, the water repellency of the discharge port forming layer 31 is promoted by setting the heat treatment temperature after exposure to the discharge port forming layer 31 to 100°C. As a result, a discharge head having a flow path and a discharge port is completed as in Example 1. As a result of printing with this discharge head, high quality discharge characteristics were confirmed without any problems with water repellency.

[0045] (Comparative Example) In the comparative example, the exposure dose to the discharge port forming layer 31 is 700 J / m2. As shown in FIG. 2(e), the portion of the discharge port forming layer 31 corresponding to the flow channel ceiling is exposed to i-line (wavelength 365 nm) using Canon's FPA-3000i5+ to form a hardened portion 31A that becomes the flow channel ceiling and an unhardened portion 31B that becomes the discharge port. In the comparative example, the exposure dose to the discharge port forming layer 31 is 700 J / m2, which is 30% or more of the gelation start exposure dose of the flow channel wall forming layer 21. Although the unhardened portion was removed by development processing, a residue due to the gelation of the flow channel wall forming layer 21 remained in the flow channel, and when a discharge head was created from this substrate, the desired discharge characteristics were not obtained.

[0046] <<Other embodiments>> The present disclosure includes configurations typified by the following recording apparatus example and recording apparatus control method example.

[0047] <Configuration 1> forming a flow path wall forming layer having a thickness of 4 μm to 14 μm on a substrate, exposing a part of the flow path wall forming layer to light, and hardening the flow path wall; forming a discharge port forming layer on the flow path wall forming layer, exposing a part of the discharge port forming layer to light, hardening the discharge port, and forming a water-repellent layer on the discharge port forming layer; removing uncured portions of the flow path wall forming layer and the discharge port forming layer to form a flow path and a discharge port; Including, A method for manufacturing an ejection head, wherein the ejection port forming layer and the flow path wall forming layer contain a negative photosensitive resin, and an amount of exposure to the ejection port forming layer is smaller than an amount of exposure to which the flow path wall forming layer starts to gel. <Configuration 2> The method for producing a discharge head according to Configuration 1, wherein the amount of exposure to the discharge port forming layer is 30% or less of the amount of exposure to the flow path wall forming layer that starts gelling. <Configuration 3> 3. The method for manufacturing a discharge head according to any one of configurations 1 and 2, wherein an amount of exposure to the discharge port formation layer is greater than an amount of exposure to induce water repellency in the discharge port formation layer. <Configuration 4> The method for manufacturing a discharge head according to any one of configurations 1 to 3, wherein the amount of exposure to the discharge port formation layer is 400 to 600 J / m2. <Component 5> 5. The method for manufacturing an ejection head according to any one of configurations 1 to 4, wherein the water-repellent layer contains a photoacid generator and a negative photosensitive resin. <Component 6> The method for manufacturing an ejection head according to any one of configurations 1 to 5, wherein the water-repellent layer has a film thickness of 250 to 750 nm. <Component 7> The method for manufacturing a discharge head according to any one of configurations 1 to 6, wherein the flow path wall forming layer absorbs light having a wavelength that is exposed to the discharge port forming layer. <Component 8> The method for manufacturing a discharge head according to any one of configurations 1 to 7, wherein the discharge port is formed across a region having a plurality of reflectivities at an exposure wavelength of the discharge port formation layer. <Component 9> The method for manufacturing a discharge head according to any one of configurations 1 to 8, wherein the discharge port formation layer is exposed to an i-line at a wavelength. <Component 10> The method for manufacturing an ejection head according to configuration 9, wherein the region having a plurality of reflectivities includes a region having an i-line reflectivity of 0.4 or more. <Component 11> 11. The method for manufacturing an ejection head according to any one of configurations 8 to 10, wherein the regions having a plurality of reflectivities include iridium. <Component 12> 12. The method for manufacturing an ejection head according to any one of configurations 8 to 11, wherein the regions having a plurality of reflectivities include tantalum. <Component 13> 13. The method for manufacturing a discharge head according to any one of configurations 1 to 12, wherein a heat treatment is carried out after the exposure of the discharge port formation layer, and the heat treatment temperature is 80 to 110°C. <Component 14> 14. The method for manufacturing the ejection head according to any one of configurations 1 to 13, further comprising the step of exposing the water-repellent layer to light after the step of forming the flow path and the ejection port. <Component 15> forming a flow path wall forming layer having a thickness of 4 μm to 14 μm on a substrate, exposing a part of the flow path wall forming layer to light, and hardening the flow path wall; forming a discharge port forming layer on the flow path wall forming layer, exposing a part of the discharge port forming layer to light, hardening the discharge port, and forming a water-repellent layer on the discharge port forming layer; removing uncured portions of the flow path wall forming layer and the discharge port forming layer to form a flow path and a discharge port; Including, A method for manufacturing a discharge head, wherein the discharge port forming layer and the flow path wall forming layer contain a negative type photosensitive resin, the energy received by the uncured portion of the flow path wall forming layer is a sum of the amount of exposure light to the ejection port forming layer and the amount of exposure light reflected by the substrate, The method for manufacturing a discharge head, wherein the combined energy is smaller than an exposure amount at which the uncured portion of the flow path wall forming layer starts to gel. <Component 16> 16. The method for producing a discharge head according to claim 15, wherein the combined energy is 45% or less of the gelation start exposure amount of the flow path wall forming layer. <Component 17> 17. The method for manufacturing a discharge head according to any one of Configurations 15 to 16, wherein an exposure amount of the discharge port formation layer is greater than an exposure amount of the discharge port formation layer that develops water repellency. <Component 18> 18. The method for manufacturing an ejection head according to any one of configurations 15 to 17, wherein the total energy is 450-750 J / m2. <Component 19> 19. The method for producing an ejection head according to any one of configurations 15 to 18, wherein the water-repellent layer contains a photoacid generator and a negative photosensitive resin. <Component 20> 20. The method for manufacturing an ejection head according to any one of configurations 15 to 19, wherein the water-repellent layer has a film thickness of 250 to 750 nm. <Component 21> 21. The method for manufacturing a discharge head according to any one of configurations 15 to 20, wherein the flow path wall forming layer absorbs light having a wavelength at which the discharge port forming layer is exposed. <Component 22> 22. The method for manufacturing a discharge head according to any one of configurations 15 to 21, wherein the discharge port is formed across an area having different reflectance at an exposure wavelength in the discharge port formation layer. <Component 23> 23. The method for manufacturing a discharge head according to any one of configurations 15 to 22, wherein the discharge port formation layer is exposed to an i-line at a wavelength. <Component 24> 24. The method of claim 23, wherein the region with different reflectance includes a region with an i-line reflectance of 0.4 or more. <Component 25> 25. The method for manufacturing an ejection head according to any one of configurations 22 to 24, wherein the region with different reflectance contains iridium. <Component 26> 26. The method of manufacturing an ejection head according to any one of configurations 22 to 25, wherein the region with different reflectance contains tantalum. <Component 27> 27. The method for manufacturing a discharge head according to any one of configurations 15 to 26, wherein a heat treatment is performed after the exposure of the discharge port formation layer, and the heat treatment temperature of the discharge port formation layer is 80 to 110°C. <Component 28> 27. The method for manufacturing a discharge head according to any one of Configurations 15 to 26, wherein the water-repellent layer is exposed to light after the flow path and the discharge port are formed. [Explanation of symbols]

[0048] 1 Discharge head 5 Substrate 11 Supply Channel 20 Flow Path 21 Channel wall forming layer 21A Flow path wall forming layer hardened part 21B Unhardened part of flow channel wall forming layer 30 outlet 31 Discharge port forming layer 31A Discharge port forming layer hardened part 31B Uncured portion of discharge port forming layer

Claims

1. forming a flow path wall forming layer having a thickness of 4 μm to 14 μm on a substrate, exposing a part of the flow path wall forming layer to light, and hardening the flow path wall; forming a discharge port forming layer on the flow path wall forming layer, exposing a part of the discharge port forming layer to light, hardening the discharge port, and forming a water-repellent layer on the discharge port forming layer; removing uncured portions of the flow path wall forming layer and the discharge port forming layer to form a flow path and a discharge port; Including, A method for manufacturing an ejection head, wherein the ejection port forming layer and the flow path wall forming layer contain a negative photosensitive resin, and an amount of exposure to the ejection port forming layer is smaller than an amount of exposure to which the flow path wall forming layer starts to gel.

2. The method for manufacturing a discharge head according to claim 1 , wherein the amount of exposure to the discharge port forming layer is 30% or less of the amount of exposure to the flow path wall forming layer at which gelation begins.

3. The method for manufacturing a discharge head according to claim 2 , wherein an exposure amount of the discharge port formation layer is greater than an exposure amount at which the discharge port formation layer develops water repellency.

4. The method for manufacturing a discharge head according to claim 2, wherein the amount of exposure to the discharge port formation layer is 400 to 600 J / m2.

5. The method for manufacturing a discharge head according to claim 1 , wherein the water-repellent layer contains a photoacid generator and a negative photosensitive resin.

6. The method for manufacturing a discharge head according to claim 5, wherein the water-repellent layer has a film thickness of 250 to 750 nm.

7. The method for manufacturing a discharge head according to claim 1 , wherein the flow path wall forming layer absorbs light having a wavelength that is exposed to the discharge port forming layer.

8. The method for manufacturing a discharge head according to claim 1 , wherein the discharge port is formed across a plurality of regions having a reflectance at a wavelength of exposure light to the discharge port formation layer.

9. The method for manufacturing a discharge head according to claim 8 , wherein the discharge port formation layer is exposed to i-line light.

10. The method for manufacturing an ejection head according to claim 9 , wherein the regions having a plurality of reflectivities include a region having an i-line reflectivity of 0.4 or more.

11. The method for manufacturing a discharge head according to claim 8 , wherein the regions having a plurality of reflectivities include iridium.

12. The method of claim 8 , wherein the regions having a plurality of reflectivities include tantalum.

13. 2. The method for manufacturing a discharge head according to claim 1, wherein a heat treatment is carried out after the exposure of the discharge port formation layer, and the heat treatment temperature is 80 to 110.degree.

14. The method for manufacturing a discharge head according to claim 1 , further comprising the step of exposing the water-repellent layer to light after the step of forming the flow paths and the discharge ports.

15. forming a flow path wall forming layer having a thickness of 4 μm to 14 μm on a substrate, exposing a part of the flow path wall forming layer to light, and hardening the flow path wall; forming a discharge port forming layer on the flow path wall forming layer, exposing a part of the discharge port forming layer to light, hardening the discharge port, and forming a water-repellent layer on the discharge port forming layer; removing uncured portions of the flow path wall forming layer and the discharge port forming layer to form a flow path and a discharge port; Including, A method for manufacturing a discharge head, wherein the discharge port forming layer and the flow path wall forming layer contain a negative type photosensitive resin, the energy received by the uncured portion of the flow path wall forming layer is a sum of the amount of exposure light to the ejection port forming layer and the amount of exposure light reflected by the substrate, The method for manufacturing a discharge head, wherein the combined energy is smaller than an exposure amount at which the uncured portion of the flow path wall forming layer starts to gel.

16. The method for manufacturing a discharge head according to claim 15 , wherein the combined energy is 45% or less of the gelation start exposure amount of the flow path wall forming layer.

17. The method for manufacturing a discharge head according to claim 16 , wherein an exposure amount of the discharge port formation layer is greater than an exposure amount of the discharge port formation layer that develops water repellency.

18. The method for manufacturing an ejection head according to claim 17, wherein the total energy is 450-750 J / m2.

19. The method for manufacturing a discharge head according to claim 15, wherein the water-repellent layer contains a photoacid generator and a negative photosensitive resin.

20. The method for manufacturing a discharge head according to claim 19, wherein the water-repellent layer has a film thickness of 250 to 750 nm.

21. The method for manufacturing a discharge head according to claim 15 , wherein the flow path wall forming layer absorbs light having a wavelength at which the discharge port forming layer is exposed.

22. The method for manufacturing a discharge head according to claim 15, wherein the discharge port is formed across an area having different reflectance at an exposure wavelength in the discharge port formation layer.

23. The method for manufacturing a discharge head according to claim 22, wherein the discharge port formation layer is exposed to i-line light.

24. The method for manufacturing a discharge head according to claim 23 , wherein the region with different reflectance includes a region with an i-line reflectance of 0.4 or more.

25. The method for manufacturing a discharge head according to claim 22 , wherein the region with different reflectance contains iridium.

26. The method for manufacturing a discharge head according to claim 22 , wherein the region with different reflectance contains tantalum.

27. The method for manufacturing a discharge head according to claim 15, wherein a heat treatment is performed after the exposure of the discharge port formation layer, and the heat treatment temperature of the discharge port formation layer is 80 to 110°C.

28. The method for manufacturing a discharge head according to claim 15, wherein the water-repellent layer is exposed to light after the flow path and the discharge port are formed.

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