Processing head and substrate processing device

Abstract

To provide a processing head which can press a processing tool against a processed surface of a substrate, such as a wafer, with uniform force.SOLUTION: A processing head 10A includes: a pressing structure 12 which presses a processing tool 2A against a processed surface 5a of a substrate W; a pressing actuator 15 which moves the pressing structure 12 in a predetermined pressing direction CL and applies pressing force to act on the processed surface 5a to the pressing structure 12; and an inclination adjustment mechanism 50 which adjusts an inclination of the pressing structure 12 relative to the pressing direction CL. The inclination adjustment mechanism 50 includes: a first tilting actuator 58 which inclines the pressing structure 12 in a first direction D1; a support shaft 51; and a first stopper actuator 68 which is located at the opposite side of the first tilting actuator 58 with respect to the support shaft 51 and adjusts an inclination angle of the pressing structure 12 in the first direction D1. The pressing structure 12 is rotatably connected to the support shaft 51 so as to be able to incline around the support shaft 51 in the first direction D1 and a second direction D2.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a processing head for pressing a processing tool against a substrate such as a wafer, and to a substrate processing apparatus including such a processing head. [Background technology]

[0002] In recent years, devices such as memory circuits, logic circuits, and image sensors (e.g., CMOS sensors) are becoming more highly integrated. In the processes for forming these devices, foreign matter such as fine particles and dust may adhere to the devices. Foreign matter that adheres to the devices may cause short circuits between wiring and circuit malfunctions. Therefore, in order to improve the reliability of the devices, it is necessary to clean the substrate on which the devices are formed and remove the foreign matter on the substrate.

[0003] Foreign matter such as the above-mentioned fine particles and dust may also adhere to the back surface (non-device surface) of the substrate. If such foreign matter adheres to the back surface of the substrate, the substrate moves away from the stage reference surface of the exposure tool, causing the substrate surface to tilt relative to the stage reference surface, resulting in deviations in patterning and focal length. To prevent such problems, it is necessary to remove the foreign matter adhered to the back surface of the substrate.

[0004] Therefore, as shown in Fig. 32 and Fig. 33, a substrate processing apparatus is used that processes the rear surface of the substrate with a processing tape. The process of removing foreign matter from the rear surface of the substrate includes polishing the rear surface of the substrate with a polishing tape and cleaning the rear surface of the substrate with a cleaning tape. Fig. 32 is a top view of a conventional substrate processing apparatus, and Fig. 33 is a side view of the conventional substrate processing apparatus shown in Fig. 32. The substrate processing apparatus shown in Fig. 32 and Fig. 33 is configured to process the substrate W while circularly moving a plurality of pressing members 505 and the substrate W relative to each other.

[0005] The substrate processing apparatus rotates the substrate W about its axis O1 by rotating the rollers 500 themselves while holding the peripheral portion of the substrate W with the rollers 500. The substrate processing apparatus has a plurality of eccentric shafts 507 fixed to the rollers 500, respectively. Each eccentric shaft 507 has a first shaft portion 507a and a second shaft portion 507b that are eccentric by a distance e. By driving a motor 509 connected to each first shaft portion 507a, the rollers 500 perform a circular motion of radius e about the axis of the first shaft portion 507a. In this way, the substrate processing apparatus rotates the substrate W about its axis O1 while performing a circular motion of radius e.

[0006] The processing tape 502 is disposed on the rear surface side of the substrate W. The processing tape 502 advances in the direction indicated by the arrow Z while being given a predetermined tension. A plurality of pressing members 505 are arranged in the diameter direction of the substrate W, and these pressing members 505 press the processing tape 502 against the rear surface of the substrate W to process the rear surface of the substrate W. The processing tape 502 pressed against the rear surface of the substrate W can remove foreign matter from the rear surface of the substrate W. Such a substrate processing apparatus processes the rear surface of the substrate while causing the processing head and the substrate to perform a relative circular motion, thereby ensuring the relative speed between the pressing members of the processing head and the substrate, and efficiently processing the entire substrate. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Patent Publication No. 2021-2639 Summary of the Invention [Problem to be solved by the invention]

[0008] However, when the substrate W is processed while the multiple pressing members 505 and the substrate W are subjected to relative circular motion, the number of revolutions of the pressing members 505 in the central region including the center (axis) O1 of the substrate W is relatively greater than in other regions. As a result, the substrate processing apparatus may not be able to uniformly process the rear surface of the substrate W.

[0009] 34, when the processing tape 502 is pressed against the substrate W by the pressing member 505, the substrate W bends upward at the edge of the substrate W. Since the substrate W bends in an arc shape, the processing tape 502 is not pressed evenly, and the processing rate of the substrate W becomes non-uniform. Therefore, as shown in FIG. 35, a substrate processing apparatus has been developed that includes a universal joint 509 that supports the pressing member 505 so that it can tilt. Since this universal joint 509 enables the pressing member 505 to follow the bending of the substrate W, it is expected that the pressing member 505 will be able to press the processing tape 502 against the substrate W evenly.

[0010] 36 , when the edge portion of the substrate W is warped, the pressing member 505 may not be able to follow the warping of the edge portion of the substrate W. As a result, the pressing member 505 may not be able to uniformly press the processing tape 502 against the substrate W.

[0011] SUMMARY OF THE PRESENT DISCLOSURE In view of the above, the present invention provides a processing head capable of pressing a processing tool against a surface to be processed of a substrate such as a wafer with a uniform force, and a substrate processing apparatus including such a processing head. [Means for solving the problem]

[0012] In one aspect, a processing head is provided, comprising: a pressing structure which presses a processing tool against a surface of a substrate to be processed; a pressing actuator which moves the pressing structure in a predetermined pressing direction and applies a pressing force to the pressing structure against the surface of the substrate to be processed; and a tilt adjustment mechanism which adjusts the tilt of the pressing structure with respect to the pressing direction, wherein the tilt adjustment mechanism comprises a first tilting actuator which tilts the pressing structure in a first direction with respect to the pressing direction, a support shaft, and a first stopper actuator which is located on the opposite side of the support shaft to the first tilting actuator and adjusts the tilt angle of the pressing structure in the first direction, wherein the pressing structure is rotatably connected to the support shaft so as to be tilted around the support shaft in the first direction and in a second direction opposite to the first direction. In one embodiment, the tilt adjustment mechanism further includes a base member supporting the support shaft and a tilt member connected to the support shaft and capable of tilting around the support shaft, the pressing structure is fixed to the tilt member, the first tilt actuator has a first rod that pushes up the tilt member, and the first stopper actuator protrudes from the base member toward the tilt member. In one embodiment, the first tilt actuator is an air cylinder, and the first rod is a piston rod of the air cylinder. In one embodiment, the first stopper actuator includes any one of a piezoelectric element, a combination of a servo motor and a ball screw mechanism, and a combination of a stepping motor and a ball screw mechanism.

[0013] In one embodiment, the tilt adjustment mechanism further includes a second stopper actuator adjacent to the first tilt actuator for adjusting the tilt angle of the pressing structure in the second direction. In one embodiment, the tilt adjustment mechanism further includes a base member supporting the support shaft and a tilt member connected to the support shaft and capable of tilting around the support shaft, the pressing structure is fixed to the tilt member, the first tilt actuator has a first rod that pushes up the tilt member, and the first stopper actuator and the second stopper actuator protrude from the base member toward the tilt member. In one embodiment, each of the first stopper actuator and the second stopper actuator includes any one of a piezoelectric element, a combination of a servo motor and a ball screw mechanism, and a combination of a stepping motor and a ball screw mechanism.

[0014] In one embodiment, the tilt adjustment mechanism further includes a second tilt actuator that tilts the pressing structure in the second direction with respect to the pressing direction. In one embodiment, the tilt adjustment mechanism further includes a base member supporting the support shaft and a tilt member connected to the support shaft and capable of tilting around the support shaft, the pressing structure is fixed to the tilt member, the first tilt actuator has a first rod that pushes up the tilt member, the second tilt actuator has a second rod that pushes up the tilt member, and the first stopper actuator and the second stopper actuator protrude from the base member toward the tilt member. In one embodiment, each of the first tilt actuator and the second tilt actuator is an air cylinder, and each of the first rod and the second rod is a piston rod of the air cylinder. In one embodiment, the processing head is a polishing head for polishing the processing surface of the substrate, and the processing tool is a polishing tape having abrasive grains on its surface, or a grindstone. In one embodiment, the processing head is a cleaning head for cleaning the processing surface of the substrate, and the processing tool is a cleaning tape.

[0015] In one aspect, a substrate processing apparatus is provided, comprising: a substrate holder configured to hold a substrate and rotate the substrate; and the processing head described above. In one aspect, the processing head is a processing head that processes a central portion including a center of the processing surface of the substrate. In one aspect, the processing head is a processing head that processes an edge portion of the processing surface of the substrate. In one aspect, the processing head is a processing head that processes a peripheral portion of the processing surface of the substrate. Effect of the Invention

[0016] The processing head can press the processing tool against the processing surface of the substrate with the pressing structure tilted in a first direction and in a second direction opposite to the first direction. By using such a processing head, the processing tool can be pressed against the processing surface with the pressing structure tilted in the first direction, and further pressed against the processing surface with the pressing structure tilted in the second direction, so that the processing tool can be uniformly pressed against the processing surface of the substrate. As a result, the entire processing surface of the substrate can be uniformly processed. [Brief description of the drawings]

[0017] [Figure 1] 1 is a side view illustrating an embodiment of a substrate processing apparatus. [Diagram 2] 2 is a top view of the substrate processing apparatus shown in FIG. [Diagram 3] FIG. 2 is a schematic diagram illustrating a polishing region of a polishing head. [Figure 4] 1 is a perspective view showing one embodiment of a polishing head for polishing a central portion of a substrate. [Diagram 5] 5 is a cross-sectional view of the polishing head shown in FIG. 4. [Figure 6] 6 is a cross-sectional view taken along line AA in FIG. 5. [Figure 7] 6 is an enlarged view illustrating a schematic view of the first stopper actuator illustrated in FIG. 5. [Figure 8] 4 is a cross-sectional view showing a state in which a pressing structure is tilted in a first direction by a tilt adjustment mechanism. FIG. [Figure 9] Figure 9(a) is a cross-sectional view showing the state in which the pressing structure is pressed against the central portion of the substrate with the pressing structure tilted in a first direction by the tilt adjustment mechanism, and Figure 9(b) is a graph showing the relationship between the position from the center of the substrate and the polishing rate when the pressing structure is tilted in the first direction as shown in Figure 9(a) and the polishing tape is pressed against the central portion of the substrate with the pressing structure tilted in the first direction. [Figure 10] Figure 10(a) is a cross-sectional view showing the state in which the pressing structure is pressed against the central portion of the substrate with the pressing structure tilted in a second direction by the tilt adjustment mechanism, and Figure 10(b) is a graph showing the relationship between the position from the center of the substrate and the polishing rate when the pressing structure is tilted in the second direction as shown in Figure 10(a) and the polishing tape is pressed against the central portion of the substrate with the pressing structure tilted in the second direction. [Figure 11] 10 is a flowchart illustrating an example of a method for processing a substrate using the polishing head according to the embodiment. [Figure 12] 12(a) to 12(c) are graphs showing an example of changing the height position of the tip of the first stopper actuator while the substrate is being polished with the pressing structure tilted in a first direction. [Figure 13] FIG. 4 is a cross-sectional view showing another embodiment of the polishing head. [Figure 14] 14 is a top view showing a base member of the polishing head shown in FIG. 13. [Figure 15] 14 is a cross-sectional view showing a state in which the pressing structure is tilted in a second direction by the tilt adjustment mechanism of the polishing head shown in FIG. 13. FIG. [Figure 16] FIG. 11 is a cross-sectional view showing yet another embodiment of the polishing head. [Figure 17] 17 is a top view showing a base member of the polishing head shown in FIG. 16. [Figure 18] 11 is a cross-sectional view showing a state in which the pressing structure is tilted in a second direction by a second tilting actuator. FIG. [Figure 19] 10 is a flowchart illustrating an example of a method for processing a substrate using the polishing head according to the embodiment. [Figure 20] FIG. 11 is a cross-sectional view showing yet another embodiment of the polishing head. [Figure 21] 1 is a perspective view showing one embodiment of a polishing head for polishing an edge portion of a substrate. [Figure 22] 22 is a cross-sectional view of the polishing head shown in FIG. 21. [Diagram 23] 23 is a cross-sectional view taken along line BB in FIG. 22. [Figure 24] Figure 24(a) is a cross-sectional view showing the state in which the pressing structure is pressing the polishing tape against the edge portion of the substrate with the pressing structure tilted in a first direction by the polishing head tilt adjustment mechanism shown in Figure 21, and Figure 24(b) is a graph showing the relationship between the position from the center of the substrate and the polishing rate when the polishing tape is pressed against the edge portion of the substrate with the pressing structure tilted in the first direction as shown in Figure 24(a). [Diagram 25] Figure 25(a) is a cross-sectional view showing the state in which the pressing structure is pressing the polishing tape against the edge portion of the substrate with the pressing structure tilted in a second direction by the polishing head tilt adjustment mechanism shown in Figure 21, and Figure 25(b) is a graph showing the relationship between the position from the center of the substrate and the polishing rate when the polishing tape is pressed against the edge portion of the substrate with the pressing structure tilted in the second direction as shown in Figure 25(a). [Figure 26] FIG. 13 is a perspective view showing yet another embodiment of the polishing head. [Figure 27] 27(a) and 27(b) are enlarged cross-sectional views showing the peripheral portion of the substrate. [Figure 28] 27 is a cross-sectional view showing a state in which the polishing tape is pressed against the peripheral edge of the substrate by the pressing structure with the pressing structure tilted at a fixed angle by the tilt adjustment mechanism of the polishing head shown in FIG. 26. [Figure 29] FIG. 1 is a schematic diagram showing an embodiment of a tilt measurement device. [Diagram 30] FIG. 1 is a schematic diagram illustrating an embodiment of a tilt adjustment mechanism with a monitoring distance measuring device. [Diagram 31] FIG. 11 is a side view showing another embodiment of the substrate processing apparatus. [Diagram 32] FIG. 1 is a top view of a conventional substrate processing apparatus. [Diagram 33] FIG. 33 is a side view of the conventional substrate processing apparatus shown in FIG. [Diagram 34] 11A and 11B are schematic diagrams illustrating how a substrate is bent upward by a pressing structure. [Diagram 35] FIG. 1 is a schematic diagram of a conventional substrate processing apparatus equipped with a universal joint. [Diagram 36] 1A and 1B are schematic diagrams illustrating a state in which warping occurs at an edge portion of a substrate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a side view showing one embodiment of the substrate processing apparatus, and FIG. 2 is a top view of the substrate processing apparatus shown in FIG. 1. The substrate processing apparatus of this embodiment is a polishing apparatus for performing substrate polishing, which is an example of substrate processing, by pressing a polishing tape, which is an example of a processing tool, against a substrate such as a wafer by a polishing head, which is an example of a processing head. The substrate processing apparatus shown in FIG. 1 and FIG. 2 includes a substrate holding unit 20 for holding and rotating a substrate W, a plurality of polishing heads 10A to 10D for processing the first surface 5a of the substrate W by bringing the polishing tapes 2A and 2B into contact with the first surface 5a of the substrate W held by the substrate holding unit 20, a polishing tape supply mechanism 30A for feeding the polishing tape 2A in its longitudinal direction, and a polishing tape supply mechanism 30B for feeding the polishing tape 2B in its longitudinal direction.

[0019] In this specification, unless otherwise specified, the longitudinal direction of the polishing tapes 2A, 2B and the traveling direction of the polishing tapes 2A, 2B refer to the longitudinal direction of the polishing tapes 2A, 2B on the pressing structures of the polishing heads 10A to 10D that press the polishing tapes 2A, 2B against the first surface 5a of the substrate W, respectively, and the traveling direction of the polishing tapes 2A, 2B.

[0020] In this embodiment, the first surface 5a of the substrate W is the back surface of the substrate W on which no devices are formed or on which no devices are to be formed, i.e., the non-device surface. The second surface 5b of the substrate W opposite to the first surface 5a is the surface on which devices are formed or on which devices are to be formed, i.e., the device surface. The first surface 5a and the second surface 5b of the substrate W are flat surfaces of the substrate W. In this embodiment, the substrate W is supported horizontally by the substrate holder 20 with the first surface 5a, which is the surface to be processed, facing downward.

[0021] The substrate holding part 20 includes a plurality of rollers 25 capable of contacting the peripheral portion of the substrate W, a plurality of motors 29 for rotating the plurality of rollers 25 at the same speed, and a plurality of eccentric shafts 27 for connecting the plurality of rollers 25 to the plurality of motors 29. In this embodiment, four rollers 25 are provided, but three or five or more rollers may be provided.

[0022] Each of the eccentric shafts 27 has a first shaft portion 27a and a second shaft portion 27b extending parallel to each other. The second shaft portion 27b is eccentric from the first shaft portion 27a by a distance e1. The rollers 25 are fixed to one end of the second shaft portions 27b, respectively. The axis of the rollers 25 coincides with the axis of the second shaft portions 27b, respectively. The motors 29 are connected to one end of the first shaft portion 27a, respectively.

[0023] When the motors 29 are driven, the eccentric shafts 27 rotate around the first shaft portion 27a. When the eccentric shafts 27 rotate, the rollers 25 perform a circular motion of radius e1 around the axis of the first shaft portion 27a. When the rollers 25 rotate once around the axis of the first shaft portion 27a, the rollers 25 rotate once around the axis of the rollers 25. By such motion of the rollers 25, the substrate holding unit 20 rotates the substrate W held by the rollers 25 around its axis (center) O1 while causing the substrate W to perform a circular motion of radius e1. Therefore, the substrate W and the polishing heads 10A to 10D perform a circular motion relative to each other. In this specification, a circular motion is defined as a motion in which an object moves on a circular orbit.

[0024] A plurality of polishing heads 10A to 10D are disposed below the substrate W held by the substrate holding part 20. The polishing heads 10A and 10C are supported by a support member 11A, and the polishing heads 10B and 10D are supported by a support member 11B. These polishing heads 10A to 10D are arranged in the diameter direction of the substrate W. In this embodiment, four polishing heads 10A to 10D are provided, but the number of polishing heads is not limited to this embodiment. In one embodiment, three or less, or five or more polishing heads may be provided.

[0025] The polishing tape supply mechanisms 30A and 30B have basically the same configuration, so the polishing tape supply mechanism 30A will be described below. The polishing tape supply mechanism 30A is equipped with a tape supply reel 31 to which one end of the polishing tape 2A is connected, a tape take-up reel 32 to which the other end of the polishing tape 2A is connected, and a number of guide rollers 33 that guide the polishing tape 2A in the traveling direction. The tape supply reel 31 and the tape take-up reel 32 are connected to reel motors 36 and 37, respectively.

[0026] By rotating the tape take-up reel 32 in the direction indicated by the arrow, the polishing tape 2A is fed from the tape supply reel 31 to the tape take-up reel 32 via the polishing heads 10A, 10C. The polishing tape 2A is supplied above the polishing heads 10A, 10C so that the processing surface (polishing surface) of the polishing tape 2A faces the first surface 5a of the substrate W. The reel motor 36 applies a predetermined torque to the tape supply reel 31 to apply tension to the polishing tape 2A. The reel motor 37 is controlled to feed the polishing tape 2A at a constant speed. The speed at which the polishing tape 2A is fed can be changed by changing the rotational speed of the tape take-up reel 32.

[0027] In one embodiment, the substrate processing apparatus may include a tape feed device that feeds the polishing tape 2A in its longitudinal direction, in addition to the tape supply reel 31, the tape take-up reel 32, and the reel motors 36, 37. In another embodiment, the positions of the tape supply reel 31 and the tape take-up reel 32 may be reversed.

[0028] The substrate processing apparatus is electrically connected to an operation control unit 100 that controls the operations of each component of the substrate processing apparatus. The operations of the substrate holding unit 20, the polishing heads 10A to 10D, and the polishing tape supply mechanisms 30A and 30B are controlled by the operation control unit 100.

[0029] The operation control unit 100 includes at least one computer. The operation control unit 100 includes a storage device 100a in which a program is stored, and an arithmetic unit 100b that executes calculations according to the program. The storage device 100a includes a main storage device (e.g., random access memory) accessible by the arithmetic unit 100b, and an auxiliary storage device (e.g., a hard disk drive or a solid state drive) that stores the program. The arithmetic unit 100b includes a CPU (Central Processing Unit) or a GPU (Graphics Processing Module) that executes calculations according to instructions included in the program stored in the storage device 100a. However, the specific configuration of the operation control unit 100 is not limited to these examples.

[0030] FIG. 3 is a schematic diagram illustrating the polishing regions of the polishing heads 10A to 10D. As shown in FIG. 3, the polishing heads 10A to 10D are arranged along the diameter direction of the substrate W. The distance from the center O1 of the substrate W to each polishing head is greater in the order of the polishing head 10A, the polishing head 10B, the polishing head 10C, and the polishing head 10D. The polishing heads 10A and 10C are disposed below the substrate W and the polishing tape 2A, and are configured to press the polishing tape 2A from its back side against the processing surface (first surface 5a) of the substrate W. The polishing heads 10B and 10D are disposed below the substrate W and the polishing tape 2B, and are configured to press the polishing tape 2B from its back side against the processing surface (first surface 5a) of the substrate W.

[0031] Each of the polishing heads 10A to 10D has a pressing structure 12 that presses the polishing tape 2A or the polishing tape 2B against the surface (first surface 5a) to be processed of the substrate W. The pressing structure 12 of this embodiment has a tape pressing member 13 having a contact surface with the polishing tape 2A or the polishing tape 2B. Each of the pressing structures 12 of the polishing heads 10A and 10B has one tape pressing member 13, and each of the pressing structures 12 of the polishing heads 10C and 10D has two tape pressing members 13. The polishing head 10A is configured to polish a central portion P1 of the substrate W including a center O1 of the substrate W. The polishing head 10B is configured to polish an inner intermediate portion P2 located radially outward of the central portion P1 of the substrate W. The polishing head 10C is configured to polish an outer intermediate portion P3 located radially outward of the inner intermediate portion P2 of the substrate W. The polishing head 10D is located radially outward of the outer intermediate portion P3 of the substrate W and is configured to polish the outermost edge portion P4 of the substrate W. The center portion P1, the inner intermediate portion P2, the outer intermediate portion P3, and the edge portion P4 are all located within the first surface 5a of the substrate W.

[0032] As described above, the substrate processing apparatus of this embodiment polishes the substrate W while relatively circularly moving the substrate W and the polishing heads 10A-10D. In the central region located radially inward within the central portion P1 of the substrate W and including the center O1 of the substrate W, the number of revolutions of the pressing structure 12 by the radially inner part of the polishing head 10A is relatively greater than in other regions. As a result, the substrate processing apparatus may not be able to uniformly process the processing surface of the substrate W. Therefore, the polishing head 10A of this embodiment is configured to be able to change the inclination of the pressing structure 12 while the substrate W is being polished.

[0033] FIG. 4 is a perspective view showing an embodiment of a polishing head 10A for polishing a central portion P1 of a substrate W, FIG. 5 is a cross-sectional view of the polishing head 10A shown in FIG. 4, and FIG. 6 is a cross-sectional view taken along line AA in FIG. 5. The polishing head 10A is disposed below the substrate W and the polishing tape 2A. The polishing head 10A includes a pressing structure 12 for pressing the polishing tape 2A against the processing surface (first surface 5a) of the substrate W, a pressing actuator 15 for moving the pressing structure 12 in a predetermined pressing direction indicated by an arrow CL and applying a pressing force against the processing surface (first surface 5a) of the substrate W to the pressing structure 12, a housing 18 in which the pressing actuator 15 is disposed, and an inclination adjustment mechanism 50 for adjusting the inclination of the pressing structure 12. The pressing actuator 15 includes a movable shaft 16 connected to the pressing structure 12, and a partition film (diaphragm) 42 for forming a pressure chamber 40 between an end (lower end) of the movable shaft 16 and the housing 18. The movable shaft 16 and the diaphragm membrane 42 are disposed within the housing 18 .

[0034] The pressing structure 12 of this embodiment has a tape pressing member 13 having a contact surface with the polishing tape 2A, and a pressing member holder 14 that holds the tape pressing member 13. The pressing structure 12 is connected to a movable shaft 16 via an inclination adjustment mechanism 50, and can move integrally with the movable shaft 16. The tape pressing member 13 is a blade having a shape extending in a straight line, and has a pressing surface for pressing the polishing tape 2A against the substrate W. The tape pressing member 13 is fixed in a state of being fitted into a fitting groove of the pressing member holder 14. As shown in FIG. 4, the tape pressing member 13 is inclined obliquely with respect to the traveling direction of the polishing tape 2A indicated by the arrow Z1. The tape pressing member 13 is formed of an elastic material. Examples of materials constituting the tape pressing member 13 include rubbers such as fluororubber, silicone rubber, and ethylene propylene diene rubber. The cross section of the tape pressing member 13 has a circular shape.

[0035] The tape pressing member 13 is not limited to this embodiment, and may have other shapes or be made of other materials. In one embodiment, the tape pressing member 13 is made of an annular member (e.g., an O-ring), and may be hung on a protrusion provided on the side of the pressing member holder 14 and supported by the pressing member holder 14 in an elastically deformed state. In other embodiments, the tape pressing member 13 may be in the shape of a curved blade. Furthermore, in other embodiments, the cross section of the tape pressing member 13 may have a rectangular shape, a trapezoidal shape, or a triangular shape.

[0036] As shown in FIG. 5, the movable shaft 16 is configured to be movable in the housing 18 in its axial direction, and the movable shaft 16 can raise the pressing structure 12 in the pressing direction indicated by the arrow CL. The pressing structure 12 faces the back side of the polishing tape 2A. When the movable shaft 16 raises the pressing structure 12 in the pressing direction indicated by the arrow CL, the tape pressing member 13 of the pressing structure 12 comes into contact with the back side of the polishing tape 2A. The back side of the polishing tape 2A is the surface opposite to the polishing surface having the abrasive grains. The pressing structure 12 presses the polishing surface of the polishing tape 2A against the first surface 5a of the substrate W, and polishes the first surface 5a of the substrate W with the polishing tape 2A. During polishing of the substrate W, the back side of the polishing tape 2A is supported by the pressing structure 12. During polishing of the substrate W, the polishing tape 2A is fed in its longitudinal direction at a predetermined speed. The arrow Z1 in FIG. 4 and FIG. 5 indicates the traveling direction of the polishing tape 2A.

[0037] In this embodiment, the movable shaft 16 is configured as a ball spline shaft. A ball spline nut 45 is disposed inside the housing 18, and the movable shaft 16 is supported by the ball spline nut 45 so as to be movable in the axial direction of the movable shaft 16. In one embodiment, the movable shaft 16 may be supported on the inner surface of the housing 18 so as to be movable.

[0038] The housing 18 includes a housing body 18A having a space formed therein for accommodating the movable shaft 16, and a lid 18B for closing the space. The lid 18B is detachably fixed to the housing body 18A by screws (not shown). The pressing actuator 15, which generates a pressing force for pressing the polishing tape 2A against the substrate W, includes the movable shaft 16 and a partition film 42. The partition film 42 is in contact with an end (lower end) of the movable shaft 16, and an edge of the partition film 42 is sandwiched between the housing body 18A and the lid 18B. The partition film 42 is only in contact with the movable shaft 16 and is not fixed to the movable shaft 16.

[0039] The partition membrane 42 is formed of a flexible material. Examples of materials that form the partition membrane 42 include chloroprene rubber, fluororubber, and silicone rubber. The pressure chamber 40 is connected to a compressed gas supply line (not shown), and is configured so that compressed gas (e.g., compressed air) is supplied into the pressure chamber 40 from the compressed gas supply line.

[0040] The inclination adjustment mechanism 50 is configured to adjust the inclination of the pressing structure 12 with respect to the moving direction (pressing direction) CL of the pressing structure 12 moved by the pressing actuator 15. The pressing structure 12 is connected to the inclination adjustment mechanism 50, and the pressing structure 12 is connected to the movable shaft 16 via the inclination adjustment mechanism 50. The inclination adjustment mechanism 50 is disposed between the movable shaft 16 and the pressing structure 12, and an upper portion of the inclination adjustment mechanism 50 is housed inside the pressing member holder 14 of the pressing structure 12. The inclination adjustment mechanism 50 and the pressing structure 12 (in this embodiment, the tape pressing member 13 and the pressing member holder 14) are moved together by the pressing actuator 15.

[0041] When polishing the substrate W, compressed gas such as compressed air is supplied into the pressure chamber 40. The pressure of the compressed gas in the pressure chamber 40 acts on the end (lower end) of the movable shaft 16 through the partition membrane 42, lifting the movable shaft 16, the inclination adjustment mechanism 50, and the pressing structure 12. The polishing head 10A may further include a distance sensor that measures the relative movement distance of the movable shaft 16 with respect to the housing 18. When polishing of the substrate W is to be completed, the pressure chamber 40 is opened to the atmosphere, and as a result, the movable shaft 16, the inclination adjustment mechanism 50, and the pressing structure 12 are lowered by the weight of the movable shaft 16 and the tension of the polishing tape 2A.

[0042] The pressing member holder 14 has a skirt 14a extending downward. This skirt 14a surrounds the upper part of the housing 18 and the inclination adjustment mechanism 50. In this embodiment, the skirt 14a is in a rectangular tube shape, but may have other shapes as long as it can surround the upper part of the housing 18 and the inclination adjustment mechanism 50. The skirt 14a can prevent liquids such as pure water used in polishing the substrate W from entering the housing 18 and the inclination adjustment mechanism 50.

[0043] As shown in FIG. 5 and FIG. 6, the tilt adjustment mechanism 50 includes a support shaft 51, a base member 55 supporting the support shaft 51, a tilt member 56 connected to the support shaft 51 and capable of tilting about the support shaft 51, a first tilt actuator 58 tilting the tilt member 56, and a first stopper actuator 68 located on the opposite side of the first tilt actuator 58 with respect to the support shaft 51. The base member 55 is fixed to the upper end of the movable shaft 16. The base member 55 has a central portion 70, and a first protruding portion 72 and a second protruding portion 73 protruding from both sides of the central portion 70. The first protruding portion 72 is located downstream of the central portion 70 in the advancing direction Z1 of the polishing tape 2A. The second protruding portion 73 is located upstream of the central portion 70 in the advancing direction Z1 of the polishing tape 2A. The upper portion of the central portion 70 is located in a hollow space 75 formed in the center of the tilt member 56.

[0044] The support shaft 51 is inserted into a through hole 55a formed in a central portion 70 of the base member 55. Both ends of the support shaft 51 are inserted into two support holes 56a formed in the tilt member 56. The extending direction of the support shaft 51 is perpendicular to the moving direction (pressing direction) CL of the pressing structure 12 and perpendicular to the radial direction of the substrate W. In this embodiment, the direction perpendicular to the radial direction of the substrate W is perpendicular to the longitudinal direction of the polishing tape 2A (the advancing direction Z1 of the polishing tape 2A). The pressing structure 12 is fixed to the tilt member 56 and rotatably connected to the support shaft 51 so as to be able to tilt around the support shaft 51 together with the tilt member 56. In one embodiment, the tilt member 56 may be configured integrally with the pressing member holder 14.

[0045] The first tilt actuator 58 is disposed downstream of the support shaft 51 in the advancing direction Z1 of the polishing tape 2A. The first tilt actuator 58 includes a first rod 59 for pushing up the tilt member 56. In this embodiment, the first tilt actuator 58 is an air cylinder, and the first rod 59 is a piston rod. As shown in FIG. 5, the first tilt actuator 58 includes the piston rod 59, a cylinder 60, a cover 62 for closing the space in the cylinder 60, and a compressed gas supply line 65 for supplying compressed gas (e.g., compressed air) into the cylinder 60. The piston rod 59 is disposed in the cylinder 60. The first tilt actuator 58 in this embodiment is configured integrally with the first protrusion 72 of the base member 55. The first tilt actuator 58 is not fixed to the housing 18, and is movable up and down relative to the housing 18. That is, the first tilt actuator 58 is moved up and down integrally with the base member 55, the tilt member 56, and the pressing structure 12 by the pressing actuator 15.

[0046] The configuration of the first tilt actuator 58 is not limited to this embodiment and may be any configuration as long as the first rod 59 can push up the tilt member 56. In one embodiment, the first tilt actuator 58 may be an electric actuator operated by an electric motor or an electromagnetic actuator operated by electromagnetic force.

[0047] The inside of the cylinder 60 is connected to the compressed gas supply line 65 through a through hole 62a formed in the lid 62. When compressed gas is supplied from the compressed gas supply line 65 into the cylinder 60, the first tilt actuator 58 is driven, and the piston rod 59 moves (rises) in its axial direction. The movement direction of the piston rod 59 is parallel to the pressing direction CL of the pressing structure 12. The piston rod 59 is configured to be able to penetrate a rod hole 63 provided in the first protruding portion 72 of the base member 55 and protrude upward from the base member 55. The rod hole 63 extends through the first protruding portion 72 of the base member 55. The tip 59a of the piston rod 59 is configured to be able to contact the lower surface of the tilt member 56. The first tilt actuator 58 raises the piston rod 59 and can tilt the pressing structure 12 together with the tilt member 56 with the support shaft 51 as a fulcrum.

[0048] 5, the first stopper actuator 68 and the piston rod 59 of the first tilting actuator 58 are disposed on both sides of the support shaft 51 (symmetrically with respect to the support shaft 51) when viewed in the axial direction of the support shaft 51. That is, the first stopper actuator 68 is disposed on the opposite side of the support shaft 51 to the piston rod 59. The first stopper actuator 68 and the piston rod 59 are aligned along a direction perpendicular to the support shaft 51. That is, the first stopper actuator 68 and the piston rod 59 are aligned along the longitudinal direction of the polishing tape 2A (the advancing direction Z1 of the polishing tape 2A). The first stopper actuator 68 is disposed upstream of the support shaft 51 in the advancing direction Z1 of the polishing tape 2A.

[0049] FIG. 7 is an enlarged view showing the first stopper actuator 68 shown in FIG. 5. The first stopper actuator 68 is attached to the base member 55. In this embodiment, the first stopper actuator 68 is attached to the second protruding portion 73 of the base member 55. The first stopper actuator 68 protrudes upward from the base member 55 toward the tilt member 56. The first stopper actuator 68 is disposed at a position where its tip 68a can contact the lower surface of the tilt member 56. The first stopper actuator 68 is configured so that the height position of the tip 68a can be adjusted. More specifically, the first stopper actuator 68 is electrically connected to the operation control unit 100, and is configured so that the height position of the tip 68a of the first stopper actuator 68 is adjusted based on a command signal from the operation control unit 100. The height position of the tip 68a of the first stopper actuator 68 can be adjusted in units of 10 μm to 100 μm.

[0050] The first stopper actuator 68 includes any one of a piezoelectric element, a combination of a servo motor and a ball screw mechanism, and a combination of a stepping motor and a ball screw mechanism. The first stopper actuator 68 of this embodiment is a piezo actuator including a piezoelectric element, and the height position of the tip 68a is adjusted by the first stopper actuator 68 extending by utilizing the piezoelectric effect of the piezoelectric element. However, the configuration of the first stopper actuator 68 is arbitrary as long as it can adjust the height position of the tip 68a, and is not limited to this embodiment.

[0051] The first tilting actuator 58 can tilt the pressing structure 12 about the support shaft 51 until the lower surface of the tilting member 56 comes into contact with the tip 68a of the first stopper actuator 68. The angle of tilt of the tilting member 56 and the pressing structure 12 when tilted by the first tilting actuator 58 can be changed by the height position of the tip 68a of the first stopper actuator 68 (i.e., the relative position of the tip 68a of the first stopper actuator 68 with respect to the tilting member 56). The arrangement of the first stopper actuator 68 in the base member 55 is arbitrary as long as the lower surface of the tilting member 56 can come into contact with the tip 68a of the first stopper actuator 68 when the pressing structure 12 is tilted by the first tilting actuator 58, and is not limited to this embodiment.

[0052] FIG. 8 is a cross-sectional view showing a state in which the pressing structure 12 is tilted in the first direction D1 by the tilt adjustment mechanism 50. As shown in FIG. 8, when the first tilt actuator 58 is driven to raise the piston rod 59, the tip 59a of the piston rod 59 comes into contact with the lower surface of the tilt member 56. As a result, the pressing structure 12 is tilted in the first direction D1 with respect to the pressing direction CL of the pressing structure 12, centered on the support shaft 51 together with the tilt member 56. The first direction D1 is substantially the same as the radial direction of the substrate W. In this embodiment, the first direction D1 is substantially the same as the longitudinal direction of the polishing tape 2A, and is a direction inclined downward toward the upstream side in the advancing direction Z1 of the polishing tape 2A (i.e., downward toward the opposite direction to the advancing direction Z1). In this specification, "substantially the same" includes being completely the same, and being substantially the same to the extent that the purpose of uniformly polishing the entire surface to be processed of the substrate W can be achieved, as described later.

[0053] When the tilt member 56 and the pressing structure 12 are tilted in the first direction D1 with respect to the pressing direction CL of the pressing structure 12, the tilt member 56 comes into contact with a tip 68a of a first stopper actuator 68 protruding upward from the base member 55. The first stopper actuator 68 has a function of a stopper that limits the angle of the tilt member 56 and the pressing structure 12 tilted in the first direction D1. The pressure of the compressed gas supplied from the compressed gas supply line 65 of the first tilting actuator 58 is maintained at or above a pressure value required to raise the tip 59a of the piston rod 59 and tilt the tilt member 56 until it comes into contact with the tip 68a of the first stopper actuator 68.

[0054] The tilt angle of the tilt member 56 and the pressing structure 12 in the first direction D1 is determined by the height position of the tip 68a of the first stopper actuator 68 that protrudes from the base member 55 (more specifically, the second protrusion 73) toward the tilt member 56. The height position of the tip 68a of the first stopper actuator 68 is adjusted in advance before driving the first tilt actuator 58. In this way, the first stopper actuator 68 adjusts the tilt angle of the tilt member 56 and the pressing structure 12 in the first direction D1. The higher the height position of the adjusted tip 68a of the first stopper actuator 68, the smaller the tilt angle of the tilt member 56 and the pressing structure 12 becomes.

[0055] Fig. 9(a) is a cross-sectional view showing a state in which the pressing structure 12 is pressed against the central portion P1 of the substrate W with the pressing structure 12 tilted in the first direction D1 by the tilt adjustment mechanism 50. Fig. 9(b) is a graph showing the relationship between the position from the center O1 of the substrate W and the polishing rate when the polishing tape 2A is pressed against the central portion P1 of the substrate W by the pressing structure 12 tilted in the first direction D1 as shown in Fig. 9(a).

[0056] As shown in Fig. 9(a), when the pressing structure 12 is moved (raised) in the pressing direction CL by the pressing actuator 15 (see Fig. 5) while the tilt adjustment mechanism 50 tilts the pressing structure 12 in the first direction D1, the downstream portion of the pressing structure 12 in the advancing direction Z1 of the polishing tape 2A presses the polishing tape 2A against the processing surface (first surface 5a) of the substrate W. As a result, as shown in Fig. 9(b), the radially outer region of the central portion P1 (see Fig. 3) of the substrate W is polished. This radially outer region is a region that does not include the center O1 of the substrate W1.

[0057] Fig. 10(a) is a cross-sectional view showing a state in which the pressing structure 12 is pressed against the substrate W with the pressing structure 12 tilted in the second direction D2 by the tilt adjustment mechanism 50. Fig. 10(b) is a graph showing the relationship between the position from the center O1 of the substrate W and the polishing rate when the polishing tape 2A is pressed against the substrate W by the pressing structure 12 tilted in the second direction D2 as shown in Fig. 10(a).

[0058] When the first tilt actuator 58 is stopped, the piston rod 59 descends, and contact between the tilt member 56 and the piston rod 59 and between the tilt member 56 and the first stopper actuator 68 are released. More specifically, when the supply of compressed gas from the compressed gas supply line 65 is stopped and the inside of the cylinder 60 is opened to the atmosphere, the driving of the first tilt actuator 58 stops, the piston rod 59 descends, the piston rod 59 moves away from the tilt member 56, and the tilt member 56 moves away from the first stopper actuator 68. The driving of the first tilt actuator 58 is stopped while the pressing structure 12 is moved (raised) in the pressing direction CL by the pressing actuator 15 (see FIG. 5).

[0059] During polishing of the substrate W, the polishing tape 2A is fed in the direction indicated by the arrow Z1 while being tensioned. As the polishing tape 2A advances, friction occurs between the polishing tape 2A and the substrate W and between the polishing tape 2A and the tape pressing member 13 of the pressing structure 12. The friction between the polishing tape 2A and the tape pressing member 13 generates a torque that tilts the tilt member 56 and the pressing structure 12 in a second direction D2 with respect to the pressing direction CL of the pressing structure 12. As shown in FIG. 10(a), the tilt adjustment mechanism 50 allows the tilt member 56 and the pressing structure 12 to tilt in the second direction D2 with respect to the pressing direction CL of the pressing structure 12. The second direction D2 is substantially the same as the radial direction of the substrate W. In this embodiment, the second direction D2 is substantially the same as the traveling direction Z1 of the polishing tape 2A (the longitudinal direction of the polishing tape 2A) and is a direction that is inclined downward toward the downstream side in the traveling direction Z1 of the polishing tape 2A (i.e., downward toward the traveling direction Z1). The second direction D2 is the opposite direction to the first direction D1.

[0060] In one embodiment, the pressure of the compressed gas supplied from the compressed gas supply line 65 may be reduced to such an extent that, without stopping the drive of the first tilting actuator 58, the pressing structure 12 can be tilted in a second direction D2, which is substantially the same direction as the traveling direction Z1 of the polishing tape 2A, due to friction generated between the pressing structure 12 and the polishing tape 2A.

[0061] As shown in Fig. 10(a), when the pressing structure 12 is tilted in the second direction D2 by the tilt adjustment mechanism 50 while being moved (raised) in the pressing direction CL by the pressing actuator 15 (see Fig. 5), the upstream portion of the pressing structure 12 in the advancing direction Z1 of the polishing tape 2A presses the polishing tape 2A against the processing surface (first surface 5a) of the substrate W. As a result, as shown in Fig. 10(b), a radially inner region of the central portion P1 (see Fig. 3) of the substrate W is polished. This radially inner region is a region that includes the center O1 of the substrate W.

[0062] The timing for changing the tilt of the pressing structure 12 of the polishing head 10A while polishing the substrate W, i.e., the timing for stopping the first tilting actuator 58, is determined in advance based on the polishing result of the previously polished substrate, etc. Specifically, the timing for stopping the first tilting actuator 58 is the timing when the overall polishing amount of the central portion P1 of the substrate W becomes uniform.

[0063] Polishing head 10B for polishing the inner middle portion P2 (see FIG. 3) of substrate W, polishing head 10C for polishing the outer middle portion P3 (see FIG. 3) of substrate W, and polishing head 10D for polishing the edge portion P4 (see FIG. 3) of substrate W are provided with a universal joint (not shown) that allows the pressing structure 12 to tilt in all directions relative to the movable shaft 16, instead of the tilt adjustment mechanism 50. A known universal joint can be used as the universal joint.

[0064] FIG. 11 is a flow chart showing an example of a method for processing a substrate W using the polishing head 10A according to this embodiment. In step S101, the operation control unit 100 issues a command to the first stopper actuator 68 of the polishing head 10A to adjust the height position of the tip 68a of the first stopper actuator 68. In step S102, the operation control unit 100 issues a command to the substrate holding unit 20 to rotate the substrate W about its axis O1 while causing the substrate W and the polishing heads 10A to 10D to perform relative circular motion. In step S103, the operation control unit 100 issues a command to the polishing tape supply mechanisms 30A and 30B to feed the polishing tapes 2A and 2B in their longitudinal directions, respectively. In step S104, the operation control unit 100 issues a command to the first tilt actuator 58 of the polishing head 10A to tilt the pressing structure 12 of the polishing head 10A in a first direction D1 with respect to the predetermined pressing direction CL by the first tilt actuator 58. More specifically, the operation control unit 100 issues a command to the first tilt actuator 58 of the polishing head 10A to drive the first tilt actuator 58 to raise the piston rod 59 and tilt the pressing structure 12 together with the tilt member 56 in the first direction D1 with respect to the predetermined pressing direction CL. The first tilt actuator 58 tilts the pressing structure 12 about the support shaft 51 until the lower surface of the tilt member 56 comes into contact with the tip 68a of the first stopper actuator 68.

[0065] In step S105, the operation control unit 100 issues a command to the pressing actuators 15 of the polishing heads 10A to 10D to raise the pressing structures 12 of the polishing heads 10A to 10D by the pressing actuators 15. The polishing heads 10A to 10D press the polishing tapes 2A and 2B against the processing surface (first surface 5a) of the substrate W by the pressing structures 12, respectively.

[0066] The polishing head 10A presses the polishing tape 2A against the processing surface (first surface 5a) of the substrate W with the pressing structure 12 tilted in the first direction D1. As a result, as described with reference to Figures 9(a) and 9(b), the radially outer region of the central portion P1 (see Figure 3) of the substrate W is polished. The polishing heads 10B to 10D can press the polishing tapes 2A and 2B against the processing surface (first surface 5a) of the substrate W by the pressing structure 12 via a universal joint (not shown) so that the polishing tapes 2A and 2B are parallel to the processing surface (first surface 5a) of the substrate W.

[0067] In step S106, the operation control unit 100 issues a command to the first tilting actuator 58 of the polishing head 10A to stop driving the first tilting actuator 58, and the pressing structure 12 of the polishing head 10A is tilted in a second direction D2 with respect to the predetermined pressing direction CL by friction generated between the tape pressing member 13 of the pressing structure 12 and the polishing tape 2A. With the pressing structure 12 tilted in the second direction D2, the polishing head 10A further presses the polishing tape 2A against the processing surface (first surface 5a) of the substrate W. As a result, as described with reference to FIG. 10(a) and FIG. 10(b), the radially inner region (including the center O1 of the substrate W) in the central portion P1 of the substrate W is polished.

[0068] In one embodiment, the pressing structure 12 may be tilted in the first direction D1 to polish the substrate W, and then the polishing head 10A may be temporarily separated from the polishing tape 2A and the substrate W, and the pressing structure 12 may be tilted in the second direction D2 to polish the substrate W. More specifically, after the pressing structure 12 is tilted in the first direction D1 to polish the substrate W, the operation control unit 100 stops driving the pressing actuator 15 of the polishing head 10A to lower the pressing structure 12 of the polishing head 10A. Furthermore, the operation control unit 100 stops driving the first tilt actuator 58. The operation control unit 100 drives the pressing actuator 15 of the polishing head 10A again to raise the pressing structure 12 of the polishing head 10A, so that the pressing structure 12 is tilted in the second direction D2 and the pressing structure 12 presses the polishing tape 2A against the processing surface (first surface 5a) of the substrate W.

[0069] In step S107, the operation control unit 100 issues a command to the pressing actuators 15 of the polishing heads 10A to 10D to stop driving the pressing actuators 15 and lower the pressing structures 12 of the polishing heads 10A to 10D. The pressing structures 12 of the polishing heads 10A to 10D are separated from the polishing tapes 2A and 2B and the substrate W, respectively. In step S108, polishing of the substrate W by the polishing heads 10A to 10D is completed.

[0070] According to this embodiment, the polishing tape 2A is pressed against the surface to be processed of the substrate W in a state in which the pressing structure 12 of the polishing head 10A is inclined in a first direction D1 with respect to the pressing direction CL of the pressing structure 12, and then the polishing tape 2A is pressed against the surface to be processed in a state in which the pressing structure 12 is inclined in a second direction D2 opposite to the first direction D1 with respect to the pressing direction CL of the pressing structure 12. That is, during polishing of the substrate W, the inclination of the pressing structure 12 of the polishing head 10A is changed from the first direction D1 to the second direction D2 opposite to the first direction D1. This makes it possible to prevent the number of contact revolutions by the pressing structure 12 of the polishing head 10A from being relatively greater in the central region located radially inside the central portion P1 of the substrate W and including the center O1 of the substrate W than in other regions when the substrate W is polished while the substrate W and the polishing heads 10A to 10D are caused to make circular motion relative to each other. As a result, the entire processing surface of the substrate W can be polished uniformly.

[0071] In one embodiment, the polishing head 10A may first polish an area including the center O1 of the substrate W located radially inward of the substrate W in the central portion P1 of the substrate W with the pressing structure 12 tilted in the second direction D2, and then polish an area radially outward of the substrate W in the central portion P1 of the substrate W with the pressing structure 12 tilted in the first direction D1. In this case, the polishing head 10A may drive the pressing actuator 15 to raise the pressing structure 12 of the polishing head 10A with the driving of the first tilting actuator 58 stopped. This allows the polishing head 10A to press the polishing tape 2A against the processing surface (first surface 5a) of the substrate W by the pressing structure 12 with the pressing structure 12 tilted in the second direction D2. Thereafter, the first tilt actuator 58 is driven to tilt the pressing structure 12 in the first direction D1 until the lower surface of the tilt member 56 contacts the tip 68a of the first stopper actuator 68, and the pressing structure 12 further presses the polishing tape 2A against the processing surface (first surface 5a) of the substrate W.

[0072] In one embodiment, the height position of the tip 68a of the first stopper actuator 68 may be changed while the substrate W is polished with the pressing structure 12 tilted in the first direction D1. FIGS. 12(a) to 12(c) are graphs showing an example of changing the height position of the tip 68a of the first stopper actuator 68 while the substrate W is polished with the pressing structure 12 tilted in the first direction D1. In FIGS. 12(a) to 12(c), the vertical axis represents the height position of the tip 68a of the first stopper actuator 68, and the horizontal axis represents time. Time Ts is the time when the pressing actuator 15 of the polishing head 10A raises the pressing structure 12 of the polishing head 10A to start polishing the substrate W. Time Te is the time when the driving of the first tilting actuator 58 of the polishing head 10A is stopped to end polishing the substrate W with the pressing structure 12 tilted in the first direction D1.

[0073] In the example shown in FIG. 12(a), the height position of the tip 68a of the first stopper actuator 68 is adjusted to h1, the pressing structure 12 is tilted in the first direction D1, and polishing of the substrate W is started. During polishing of the substrate W with the pressing structure 12 tilted in the first direction D1, at time T1, the height position of the tip 68a of the first stopper actuator 68 is changed to h2, which is higher than h1. This reduces the tilt angle of the pressing structure 12 in the first direction D1. Thereafter, with the height position of the tip 68a of the first stopper actuator 68 adjusted to h2, the pressing structure 12 is tilted in the first direction D1 to polish the substrate W, and at time Te, polishing of the substrate W with the pressing structure 12 tilted in the first direction D1 is completed.

[0074] In the example shown in FIG. 12(b), the height position of the tip 68a of the first stopper actuator 68 is adjusted to h1, the pressing structure 12 is tilted in the first direction D1, and polishing of the substrate W is started. During polishing of the substrate W with the pressing structure 12 tilted in the first direction D1, the height position of the tip 68a of the first stopper actuator 68 is gradually changed from time T2 to time T3 until it becomes h2, which is higher than h1. As a result, the tilt angle of the pressing structure 12 in the first direction D1 gradually decreases from time T2 to time T3. Thereafter, with the height position of the tip 68a of the first stopper actuator 68 adjusted to h2, the pressing structure 12 is tilted in the first direction D1 to polish the substrate W, and polishing of the substrate W with the pressing structure 12 tilted in the first direction D1 is completed at time Te.

[0075] 12(c), with the height position of the tip 68a of the first stopper actuator 68 adjusted to h1, the pressing structure 12 is tilted in the first direction D1 to start polishing the substrate W. From time Ts to time Te, the height position of the tip 68a of the first stopper actuator 68 is gradually changed until it becomes h2, which is higher than h1. As a result, while the substrate W is polished with the pressing structure 12 tilted in the first direction D1, the tilt angle of the pressing structure 12 in the first direction D1 gradually decreases, and at time Te, polishing of the substrate W with the pressing structure 12 tilted in the first direction D1 is completed.

[0076] Fig. 13 is a cross-sectional view showing another embodiment of the polishing head 10A, and Fig. 14 is a top view showing the base member 55 of the polishing head 10A shown in Fig. 13. The configuration and operation of the polishing head 10A of this embodiment that are not particularly described are the same as those of the above-mentioned embodiment, so that the overlapping description will be omitted. In this embodiment, the tilt adjustment mechanism 50 further includes a second stopper actuator 80 that adjusts the tilt angle of the pressing structure 12 in the second direction D2.

[0077] The second stopper actuator 80 is attached to the base member 55 and is adjacent to the first tilt actuator 58. In this embodiment, the second stopper actuator 80 is attached to the first protruding portion 72 of the base member 55. The second stopper actuator 80 protrudes upward from the base member 55 toward the tilt member 56. The second stopper actuator 80 is disposed at a position where its tip 80a can contact the lower surface of the tilt member 56. The second stopper actuator 80 is configured so that the height position of its tip 80a can be adjusted. More specifically, the second stopper actuator 80 is electrically connected to the operation control unit 100 and is configured so that the height position of the tip 80a of the second stopper actuator 80 is adjusted based on a command signal from the operation control unit 100. The height position of the tip 80a of the second stopper actuator 80 can be adjusted in units of 10 μm to 100 μm.

[0078] The second stopper actuator 80 includes any one of a piezoelectric element, a combination of a servo motor and a ball screw mechanism, and a combination of a stepping motor and a ball screw mechanism. The second stopper actuator 80 of this embodiment is a piezo actuator including a piezoelectric element, and the height position of the tip 80a is adjusted by the second stopper actuator 80 expanding by utilizing the piezoelectric effect of the piezoelectric element. However, the configuration of the second stopper actuator 80 is arbitrary as long as it can adjust the height position of the tip 80a, and is not limited to this embodiment.

[0079] The positions of the first tilt actuator 58 and the first stopper actuator 68 in the base member 55 are arbitrary as long as the lower surface of the tilt member 56 tilted in the first direction D1 by the first tilt actuator 58 contacts the first stopper actuator 68, and are not limited to this embodiment. Similarly, the position of the second stopper actuator 80 in the base member 55 is arbitrary as long as the lower surface of the tilt member 56 tilted in the second direction D2 contacts the second stopper actuator 80, and is not limited to this embodiment. For example, the piston rod 59 of the first tilt actuator 58 may be disposed outside the second stopper actuator 80, or the positions of the piston rod 59 of the first tilt actuator 58 and the second stopper actuator 80 may be interchanged.

[0080] FIG. 15 is a cross-sectional view showing a state in which the pressing structure 12 is tilted in the second direction D2 by the tilt adjustment mechanism 50 of the polishing head 10A shown in FIG. 13. As described with reference to FIG. 10(a), when the first tilting actuator 58 is stopped, the tilt member 56 and the pressing structure 12 are tilted in the second direction D2 with respect to the pressing direction CL of the pressing structure 12 due to friction generated between the polishing tape 2A and the tape pressing member 13. As shown in FIG. 15, when the tilt member 56 and the pressing structure 12 are tilted in the second direction D2 with respect to the pressing direction CL of the pressing structure 12, the tilt member 56 comes into contact with the tip 80a of the second stopper actuator 80 protruding upward from the base member 55. The second stopper actuator 80 has a function of a stopper that limits the angle of the tilt member 56 and the pressing structure 12 tilted in the second direction D2.

[0081] The tilt angle of the tilt member 56 and the pressing structure 12 in the second direction D2 is determined by the height position of the tip 80a of the second stopper actuator 80 that protrudes from the base member 55 (more specifically, the first protrusion 72) toward the tilt member 56. The height position of the tip 80a of the second stopper actuator 80 is adjusted in advance before stopping the first tilt actuator 58. In this manner, the second stopper actuator 80 adjusts the tilt angle of the tilt member 56 and the pressing structure 12 in the second direction D2. The higher the height position of the adjusted tip 80a of the second stopper actuator 80, the smaller the tilt angle of the tilt member 56 and the pressing structure 12 becomes.

[0082] In one embodiment, similar to the change in the height position of the tip 68a of the first stopper actuator 68 described with reference to Figures 12(a) to 12(c), the height position of the tip 80a of the second stopper actuator 80 may be changed while the substrate W is being polished with the pressing structure 12 tilted in the second direction D2.

[0083] FIG. 16 is a cross-sectional view showing yet another embodiment of the polishing head 10A, and FIG. 17 is a top view showing the base member 55 of the polishing head 10A shown in FIG. 16. The configuration and operation of the polishing head 10A of this embodiment not specifically described are the same as those of the embodiment described with reference to FIG. 13 to FIG. 15, and therefore the overlapping description will be omitted. The tilt adjustment mechanism 50 of this embodiment further includes a second tilt actuator 82 that tilts the tilt member 56 in the second direction D2. The second tilt actuator 82 is located on the opposite side of the support shaft 51 to the first tilt actuator 58.

[0084] The second tilt actuator 82 is disposed upstream of the support shaft 51 in the advancing direction Z1 of the polishing tape 2A. The second tilt actuator 82 includes a second rod 83 that pushes up the tilt member 56. In this embodiment, the second tilt actuator 82 is an air cylinder, and the second rod 83 is a piston rod. As shown in FIG. 16, the second tilt actuator 82 includes a piston rod 83, a cylinder 84, a lid 86 that closes the space in the cylinder 84, and a compressed gas supply line 89 that supplies compressed gas (e.g., compressed air) into the cylinder 84. The piston rod 83 is disposed in the cylinder 84. The second tilt actuator 82 in this embodiment is configured integrally with the second protrusion 73 of the base member 55. The second tilt actuator 82 is not fixed to the housing 18, and is movable up and down relative to the housing 18. That is, the second tilt actuator 82 is moved up and down integrally with the base member 55, the tilt member 56, and the pressing structure 12 by the pressing actuator 15.

[0085] The configuration of the second tilt actuator 82 is not limited to this embodiment and may be any configuration as long as the second rod 83 can push up the tilt member 56. In one embodiment, the second tilt actuator 82 may be an electric actuator operated by an electric motor or an electromagnetic actuator operated by electromagnetic force.

[0086] The inside of the cylinder 84 is connected to the compressed gas supply line 89 through a through hole 86a formed in the lid 86. When compressed gas is supplied from the compressed gas supply line 89 into the cylinder 84, the second tilt actuator 82 is driven, and the piston rod 83 moves (rises) in its axial direction. The movement direction of the piston rod 83 is a direction parallel to the pressing direction CL of the pressing structure 12. The piston rod 83 is configured to be able to penetrate a rod hole 87 provided in the second protruding portion 73 of the base member 55 and protrude upward from the base member 55. The rod hole 87 extends through the second protruding portion 73 of the base member 55. The tip 83a of the piston rod 83 is configured to be able to contact the lower surface of the tilt member 56. The second tilt actuator 82 raises the piston rod 83 and can tilt the pressing structure 12 together with the tilt member 56 with the support shaft 51 as a fulcrum.

[0087] The compressed gas supply line 65 of the first tilt actuator 58 and the compressed gas supply line 89 of the second tilt actuator 82 are connected to a switching valve (not shown). The switching valve is connected to a compressed gas supply source (not shown) and can guide compressed gas from the compressed gas supply source to either the compressed gas supply line 65 or the compressed gas supply line 89. An example of the switching valve is a four-port solenoid valve.

[0088] 16 and 17, the second stopper actuator 80 and the piston rod 83 of the second tilting actuator 82 are disposed on both sides of the support shaft 51 (symmetrically with respect to the support shaft 51) when viewed in the axial direction of the support shaft 51. In other words, the second stopper actuator 80 is disposed on the opposite side of the support shaft 51 to the piston rod 83. The second stopper actuator 80 is disposed downstream of the support shaft 51 in the advancing direction Z1 of the polishing tape 2A.

[0089] In this embodiment, the piston rod 59 of the first tilt actuator 58 and the piston rod 83 of the second tilt actuator 82 are aligned along a direction perpendicular to the support shaft 51. That is, the piston rod 59 of the first tilt actuator 58 and the piston rod 83 of the second tilt actuator 82 are aligned along the longitudinal direction of the polishing tape 2A (the advancing direction Z1 of the polishing tape 2A). The first stopper actuator 68 and the second stopper actuator 80 are aligned along a direction perpendicular to the support shaft 51. That is, the first stopper actuator 68 and the second stopper actuator 80 are aligned along the longitudinal direction of the polishing tape 2A (the advancing direction Z1 of the polishing tape 2A).

[0090] The positions of the first tilt actuator 58 and the first stopper actuator 68 in the base member 55 are arbitrary as long as the lower surface of the tilt member 56 tilted in the first direction D1 by the first tilt actuator 58 contacts the first stopper actuator 68, and are not limited to this embodiment. Similarly, the positions of the second tilt actuator 82 and the second stopper actuator 80 in the base member 55 are arbitrary as long as the lower surface of the tilt member 56 tilted in the second direction D2 contacts the second stopper actuator 80, and are not limited to this embodiment. For example, the piston rod 59 of the first tilt actuator 58 may be disposed outside the second stopper actuator 80, and the piston rod 83 of the second tilt actuator 82 may be disposed outside the first stopper actuator 68. Alternatively, the positions of the piston rod 59 of the first tilt actuator 58 and the second stopper actuator 80 may be interchanged, or the positions of the piston rod 83 of the second tilt actuator 82 and the first stopper actuator 68 may be interchanged.

[0091] The operation of tilting the pressing structure 12 in the first direction D1 by the first tilting actuator 58 is the same as that in the embodiment described with reference to FIG. 8, and therefore a duplicated description thereof will be omitted.

[0092] Fig. 18 is a cross-sectional view showing a state in which the pressing structure 12 is tilted in the second direction D2 by the second tilting actuator 82. As shown in Fig. 18, the tilt adjustment mechanism 50 of this embodiment is configured to tilt the pressing structure 12 in the second direction D2 by the second tilting actuator 82. When the second tilting actuator 82 is driven to raise the piston rod 83, the tip 83a of the piston rod 83 comes into contact with the lower surface of the tilt member 56. As a result, the pressing structure 12 is tilted in the second direction D2 with respect to the pressing direction CL of the pressing structure 12, centered on the support shaft 51, together with the tilt member 56.

[0093] When the tilt member 56 and the pressing structure 12 are tilted in the second direction D2 with respect to the pressing direction CL of the pressing structure 12, the tilt member 56 comes into contact with a tip 80a of a second stopper actuator 80 protruding upward from the base member 55. The second stopper actuator 80 functions as a stopper that limits the angle of the tilt member 56 and the pressing structure 12 tilted in the second direction D2 by the second tilting actuator 82.

[0094] The pressure of the compressed gas supplied from the compressed gas supply line 89 of the second tilt actuator 82 is maintained at or above the pressure value required to raise the tip 83a of the piston rod 83 and tilt the tilt member 56 until it comes into contact with the tip 80a of the second stopper actuator 80. Therefore, the tilt angle of the tilt member 56 and the pressing structure 12 in the second direction D2 is determined by the height position of the tip 80a of the second stopper actuator 80 that protrudes from the base member 55 (more specifically, the first protruding portion 72) toward the tilt member 56. The height position of the tip 80a of the second stopper actuator 80 is adjusted in advance before the second tilt actuator 82 is driven.

[0095] In this embodiment, the pressing structure 12 is moved (raised) in the pressing direction CL by the pressing actuator 15 (see FIG. 16), and the pressing structure 12 is tilted in the second direction D2 by the second tilting actuator 82. When the pressing structure 12 is tilted in the second direction D2 by the second tilting actuator 82, the upstream part of the pressing structure 12 in the advancing direction Z1 of the polishing tape 2A presses the polishing tape 2A against the processing surface (first surface 5a) of the substrate W, as in the embodiment described with reference to FIGS. 10(a) and 10(b). As a result, the radially inner region of the central portion P1 (see FIG. 3) of the substrate W is polished. This radially inner region is a region including the center O1 of the substrate W.

[0096] The timing for changing the tilt of the pressing structure 12 of the polishing head 10A while polishing the substrate W, i.e., the timing for stopping the first tilt actuator 58 and driving the second tilt actuator 82, is determined in advance based on the polishing result of the previously polished substrate, etc. Specifically, the timing for stopping the first tilt actuator 58 and driving the second tilt actuator 82 is the timing at which the overall polishing amount of the central portion P1 of the substrate W becomes uniform.

[0097] FIG. 19 is a flow chart showing an example of a method for processing a substrate W using the polishing head 10A according to this embodiment. In step S201, the operation control unit 100 issues a command to the first stopper actuator 68 of the polishing head 10A to adjust the height position of the tip 68a of the first stopper actuator 68. Furthermore, the operation control unit 100 issues a command to the second stopper actuator 80 of the polishing head 10A to adjust the height position of the tip 80a of the second stopper actuator 80. Steps S202 to S205 are the same as steps S102 to S105 shown in FIG. 11, so a duplicated description will be omitted.

[0098] In step S206, the operation control unit 100 issues a command to the first tilt actuator 58 of the polishing head 10A to stop driving the first tilt actuator 58. Furthermore, the operation control unit 100 issues a command to the second tilt actuator 82 to tilt the pressing structure 12 of the polishing head 10A in the second direction D2 with respect to the predetermined pressing direction CL by the second tilt actuator 82. More specifically, the operation control unit 100 issues a command to the second tilt actuator 82 of the polishing head 10A to drive the second tilt actuator 82 to raise the piston rod 83 and tilt the pressing structure 12 together with the tilt member 56 in the second direction D2 with respect to the predetermined pressing direction CL. The second tilt actuator 82 tilts the pressing structure 12 about the support shaft 51 until the lower surface of the tilt member 56 comes into contact with the tip 80a of the second stopper actuator 80. With the pressing structure 12 tilted in the second direction D2, the polishing head 10A further presses the polishing tape 2A against the processing surface (first surface 5a) of the substrate W. As a result, the radially inner region (including the center O1 of the substrate W) in the central portion P1 of the substrate W is polished, similar to the embodiment described with reference to Figures 10(a) and 10(b).

[0099] In one embodiment, the pressing structure 12 may be tilted in the first direction D1 to polish the substrate W, and then the polishing head 10A may be temporarily separated from the polishing tape 2A and the substrate W, and the pressing structure 12 may be tilted in the second direction D2 to polish the substrate W. More specifically, after the pressing structure 12 is tilted in the first direction D1 to polish the substrate W, the operation control unit 100 stops driving the pressing actuator 15 of the polishing head 10A to lower the pressing structure 12 of the polishing head 10A. The operation control unit 100 stops driving the first tilting actuator 58. Furthermore, the operation control unit 100 drives the second tilting actuator 82 to tilt the pressing structure 12 of the polishing head 10A in the second direction D2. The operation control unit 100 again drives the pressing actuator 15 of the polishing head 10A to raise the pressing structure 12 of the polishing head 10A, thereby tilting the pressing structure 12 in the second direction D2 and pressing the polishing tape 2A against the processed surface (first surface 5a) of the substrate W with the pressing structure 12.

[0100] In step S207, the operation control unit 100 issues a command to the pressing actuators 15 of the polishing heads 10A to 10D to stop driving the pressing actuators 15 and lower the pressing structures 12 of the polishing heads 10A to 10D. The pressing structures 12 of the polishing heads 10A to 10D are separated from the polishing tapes 2A and 2B and the substrate W, respectively. In step S208, polishing of the substrate W by the polishing heads 10A to 10D is completed.

[0101] In one embodiment, the polishing head 10A may first polish an area including the center O1 of the substrate W located radially inward of the substrate W in the central portion P1 of the substrate W with the pressing structure 12 tilted in the second direction D2, and then polish an area radially outward of the substrate W in the central portion P1 of the substrate W with the pressing structure 12 tilted in the first direction D1. In this case, the polishing head 10A may drive the pressing actuator 15 while driving the second tilt actuator 82 to raise the pressing structure 12 of the polishing head 10A. This allows the polishing head 10A to press the polishing tape 2A against the processing surface (first surface 5a) of the substrate W with the pressing structure 12 tilted in the second direction D2 until the lower surface of the tilt member 56 contacts the tip 80a of the second stopper actuator 80. Thereafter, the second tilting actuator 82 is stopped and the first tilting actuator 58 is driven to tilt the pressing structure 12 in the first direction D1 until the lower surface of the tilt member 56 contacts the tip 68a of the first stopper actuator 68, and the pressing structure 12 further presses the polishing tape 2A against the processed surface (first surface 5a) of the substrate W.

[0102] FIG. 20 is a cross-sectional view showing yet another embodiment of the polishing head 10A. The configuration and operation of the polishing head 10A of this embodiment that are not particularly described are the same as those of the embodiment described with reference to FIG. 16 to FIG. 19, so that the overlapping description will be omitted. In this embodiment, the processing tool is a grindstone 3 instead of the polishing tape 2A, and the polishing head 10A has a pressing structure 12 that presses the grindstone 3 against the processing surface (first surface 5a) of the substrate W. The grindstone 3 is fixed to the upper part of the pressing structure 12. The pressing structure 12 presses the grindstone 3 fixed to the pressing structure 12 against the first surface 5a of the substrate W, and polishes the first surface 5a of the substrate W with the grindstone 3.

[0103] When the pressing structure 12 is tilted in the first direction D1 or the second direction D2 by the tilt adjustment mechanism 50, the grindstone 3 is tilted together with the pressing structure 12. In this embodiment, the grindstone 3 is pressed against the processing surface of the substrate W in a state in which the pressing structure 12 is tilted in the first direction D1 by the first tilt actuator 58, and then the grindstone 3 is pressed against the processing surface in a state in which the pressing structure 12 is tilted in the second direction D2 by the second tilt actuator 82. This prevents the number of contact revolutions by the pressing structure 12 of the polishing head 10A from being relatively greater in the central region located radially inside the central portion P1 of the substrate W and including the center O1 of the substrate W than in other regions when the substrate W is polished while the substrate W and the polishing heads 10A to 10D are caused to perform circular motions relative to each other. As a result, the entire processing surface of the substrate W can be polished uniformly.

[0104] Fig. 21 is a perspective view showing one embodiment of a polishing head 10D for polishing an edge portion P4 (see Fig. 3) of a substrate W, Fig. 22 is a cross-sectional view of the polishing head 10D shown in Fig. 21, and Fig. 23 is a cross-sectional view taken along line BB in Fig. 22. The configuration and operation of this embodiment not specifically described are the same as those of the embodiment described with reference to Figs. 4 to 10, and therefore redundant description will be omitted. Arrow Z2 in Figs. 21 and 22 indicates the traveling direction of the polishing tape 2B.

[0105] In this embodiment, the pressing structure 12 of the polishing head 10D has two tape pressing members 13. The two tape pressing members 13 are blades having a shape extending in a straight line, and each has a pressing surface for pressing the polishing tape 2B against the substrate W. As shown in FIG. 21, the two tape pressing members 13 are inclined obliquely with respect to the traveling direction of the polishing tape 2B indicated by the arrow Z2. When the polishing head 10D is viewed from above, the two tape pressing members 13 are disposed symmetrically with respect to a center line L along the traveling direction Z2 of the polishing tape 2B.

[0106] The two tape pressing members 13 are not limited to this embodiment, and may have other shapes or be made of other materials. In one embodiment, the two tape pressing members 13 are made of a single annular member (e.g., an O-ring), and may be hung on a protrusion provided on the side of the pressing member holder 14 and supported by the pressing member holder 14 in an elastically deformed state. In another embodiment, each of the two tape pressing members 13 may be in the shape of a curved blade. Furthermore, in another embodiment, the cross section of each of the two tape pressing members 13 may have a rectangular shape, a trapezoidal shape, or a triangular shape.

[0107] The first tilt actuator 58 is disposed downstream of the support shaft 51 in the advancing direction Z2 of the polishing tape 2B. The first stopper actuator 68 and the piston rod 59 of the first tilt actuator 58 are disposed on both sides of the support shaft 51 (symmetrically with respect to the support shaft 51) when viewed from the axial direction of the support shaft 51. The first stopper actuator 68 and the piston rod 59 are aligned along a direction perpendicular to the support shaft 51. That is, the first stopper actuator 68 and the piston rod 59 are aligned along the longitudinal direction of the polishing tape 2B (the advancing direction Z2 of the polishing tape 2B). The first stopper actuator 68 is disposed upstream of the support shaft 51 in the advancing direction Z2 of the polishing tape 2B.

[0108] The inclination adjustment mechanism 50 of this embodiment further includes two pins 92 perpendicular to the support shaft 51. The two pins 92 pass through through holes 90 provided in the skirt 14a of the pressing member holder 14 and are inserted into pin holes 91 provided in the tilt member 56. The two pins 92 are fixed to the pressing member holder 14 and are not fixed to the tilt member 56. The two pins 92 are arranged on both sides of the support shaft 51 (symmetrically with respect to the support shaft 51) when viewed from the axial direction of the support shaft 51. In this embodiment, the central axis of the support shaft 51 and the central axes of the two pins 92 are located on the same plane. The two pins 92 extend in the longitudinal direction of the polishing tape 2B (the advancing direction Z2 of the polishing tape 2B).

[0109] The pressing member holder 14 is capable of tilting (rotating) relatively to the tilt member 56 around the two pins 92. The pressing member holder 14 of this embodiment is connected to the tilt member 56 by the two pins 92. The upper surface of the tilt member 56 and the inner surface of the pressing member holder 14 are not in contact. The two pins 92 are provided to equalize the pressing force applied from the pressing structure 12 (in this embodiment, the two tape pressing members 13 on the pressing member holder 14) to the substrate W via the polishing tape 2B. In one embodiment, the two pins 92 may be omitted.

[0110] Fig. 24(a) is a cross-sectional view showing a state in which the pressing structure 12 is pressed against the edge portion P4 of the substrate W in a state in which the pressing structure 12 is tilted in a first direction D1 by the tilt adjustment mechanism 50 of the polishing head 10A shown in Fig. 21. Fig. 24(b) is a graph showing the relationship between the position from the center O1 of the substrate W and the polishing rate when the polishing tape 2B is pressed against the edge portion P4 of the substrate W by the pressing structure 12 tilted in the first direction D1 as shown in Fig. 24(a).

[0111] As shown in FIG. 24(a), warping may occur in the outermost periphery, which is a part of the edge of the substrate W. When polishing such a substrate W, the tilt adjustment mechanism 50 tilts the tilt member 56 and the pressing structure 12 in a first direction D1 with respect to the pressing direction CL of the pressing structure 12, and the pressing actuator 15 (see FIG. 22) moves (raises) the pressing structure 12 in the pressing direction CL. The downstream part of the pressing structure 12 in the advancing direction Z2 of the polishing tape 2B presses the polishing tape 2B against the outermost periphery of the surface to be processed (first surface 5a) of the substrate W. The first direction D1 is substantially the same as the radial direction of the substrate W. In this embodiment, the first direction D1 is substantially the same as the longitudinal direction of the polishing tape 2B, and is a direction that is inclined downward toward the upstream side in the advancing direction Z2 of the polishing tape 2B (i.e., downward toward the opposite direction to the advancing direction Z2).

[0112] The tilt adjustment mechanism 50 tilts the tilt member 56 and the pressing structure 12 in a first direction D1 so that the pressing structure 12 follows the warp generated in the outermost periphery of the substrate W, and brings it into contact with the substrate W via the polishing tape 2B. As a result, as shown in FIG. 24(b), the radially outer region (i.e., the outermost periphery of the substrate W) within the edge portion P4 (see FIG. 3) of the substrate W is polished. The tilt angle of the tilt member 56 and the pressing structure 12 in the first direction D1 is determined by the height position of the tip 68a of the first stopper actuator 68. The height position of the tip 68a of the first stopper actuator 68 is adjusted in advance before the first tilt actuator 58 is driven.

[0113] Fig. 25(a) is a cross-sectional view showing a state in which the pressing structure 12 is pressing the polishing tape 2B against the edge portion P4 of the substrate W in a state in which the pressing structure 12 is tilted in the second direction D2 by the tilt adjustment mechanism 50 of the polishing head 10A shown in Fig. 21. Fig. 25(b) is a graph showing the relationship between the position from the center O1 of the substrate W and the polishing rate when the polishing tape 2B is pressed against the edge portion P4 of the substrate W by the pressing structure 12 tilted in the second direction D2 as shown in Fig. 25(a).

[0114] When the driving of the first tilt actuator 58 is stopped, the tilt adjustment mechanism 50 allows the tilt member 56 and the pressing structure 12 to tilt in a second direction D2 opposite to the first direction D1 with respect to the pressing direction CL of the pressing structure 12 due to friction generated between the polishing tape 2B and the tape pressing member 13. The second direction D2 is substantially the same as the radial direction of the substrate W. In this embodiment, the second direction D2 is substantially the same as the traveling direction Z2 of the polishing tape 2B (the longitudinal direction of the polishing tape 2B), and is a direction tilted downward toward the downstream side in the traveling direction Z2 of the polishing tape 2B (i.e., downward toward the traveling direction Z2).

[0115] 25(a), when the pressing structure 12 is tilted in the second direction D2 by the tilt adjustment mechanism 50 while being moved (raised) in the pressing direction CL by the pressing actuator 15 (see FIG. 22), the upstream portion of the pressing structure 12 in the advancing direction Z2 of the polishing tape 2B presses the polishing tape 2B against the processing surface (first surface 5a) of the substrate W. As a result, as shown in FIG 25(b), the radially inner region of the edge portion P4 (see FIG. 3) of the substrate W is polished.

[0116] The timing for changing the tilt of the pressing structure 12 of the polishing head 10D while polishing the substrate W, i.e., the timing for stopping the first tilting actuator 58, is determined in advance based on the polishing result of the previously polished substrate, etc. Specifically, the timing for stopping the first tilting actuator 58 is the timing when the overall polishing amount of the edge portion P4 of the substrate W becomes uniform.

[0117] According to this embodiment, the polishing tape 2B is pressed against the processing surface of the substrate W with the pressing structure 12 of the polishing head 10D tilted in the first direction D1, and then the polishing tape 2B is pressed against the processing surface with the pressing structure 12 tilted in the second direction D2 opposite to the first direction D1. That is, during polishing of the substrate W, the inclination of the pressing structure 12 of the polishing head 10D is changed from the first direction D1 to the second direction D2 opposite to the first direction D1. As a result, even if a part of the edge portion P4 of the substrate W is warped, the pressing structure 12 can uniformly press the polishing tape 2B against the entire edge portion P4 of the substrate W. As a result, the entire processing surface of the substrate W can be uniformly polished.

[0118] In one embodiment, the polishing head 10D for polishing the edge portion P4 of the substrate W may be a polishing head having a configuration similar to that of the polishing head 10A described with reference to Figures 4 to 10, Figures 13 to 15, Figures 16 to 18, and Figure 20.

[0119] Although the embodiment of the tilt adjustment mechanism 50 described above is applied to a polishing head that polishes the back surface of the substrate W, the tilt adjustment mechanism 50 can also be applied to polishing heads having other configurations. For example, as shown in FIG. 26, the tilt adjustment mechanism 50 can be applied to a polishing head 10 for polishing the peripheral portion of the substrate W. FIGS. 27(a) and 27(b) are enlarged cross-sectional views showing the peripheral portion of the substrate W. More specifically, FIG. 27(a) is a cross-sectional view of a so-called straight type substrate, and FIG. 27(b) is a cross-sectional view of a so-called round type substrate. The bevel portion B has a chamfered or rounded shape.

[0120] In the substrate W of FIG. 27(a), the bevel portion B is the outermost peripheral surface of the substrate W composed of an upper inclined surface (upper bevel portion) B1, a lower inclined surface (lower bevel portion) B2, and a side portion (apex) B3. In the substrate W of FIG. 27(b), the bevel portion B is a portion having a curved cross section that constitutes the outermost peripheral surface of the substrate W. The top edge portion E1 is an annular flat portion located radially inside the bevel portion B. The bottom edge portion E2 is located on the opposite side to the top edge portion E1 and is an annular flat portion located radially inside the bevel portion B. The top edge portion E1 may include a region in which a device is formed. In this specification, the peripheral portion of the substrate W refers to a region including any one of the top edge portion E1, the bevel portion B, and the bottom edge portion E2.

[0121] The polishing head 10 shown in Fig. 26 is configured to polish in particular the top edge portion E1 and the bottom edge portion E2. The pressing structure 12 has a tape pressing member 13 that curves along the peripheral edge portion of the substrate W. While the pressing structure 12 presses the polishing tape 2B against the peripheral edge portion of the substrate W, the polishing head 10 moves toward the radial outside of the substrate W, as indicated by arrow X. The movement of the polishing head 10 in the direction X is performed by a polishing head moving mechanism (not shown).

[0122] Fig. 28 is a cross-sectional view showing a state in which the pressing structure 12 is pressed against the peripheral edge of the substrate W with the pressing structure 12 tilted at a fixed angle by the tilt adjustment mechanism 50 of the polishing head 10 shown in Fig. 26. The configuration of the tilt adjustment mechanism 50 is the same as that of the embodiment described with reference to Figs. 21 to 25, and therefore a duplicated description will be omitted.

[0123] 28, when the polishing tape 2B is pressed against the peripheral edge of the substrate W by the pressing structure 12, the substrate W is bent by the pressing force of the pressing structure 12. Since the pressing structure 12 is inclined in advance at an angle fixed by the tilt adjustment mechanism 50, the pressing structure 12 can uniformly press the polishing tape 2B against the peripheral edge of the bent substrate W. Furthermore, the tilt adjustment mechanism 50 allows the pressing structure 12 to freely tilt around the axis R shown in FIG. 26 as indicated by the arrow. As a result, the polishing tape 2B can uniformly polish the peripheral edge of the substrate W.

[0124] The polishing head 10 described with reference to Figures 26 to 28 can also be applied to the embodiment using the grindstone 3 as the processing tool described with reference to Figure 20. In this case, the grindstone 3 has a shape that curves along the peripheral edge of the substrate W, and the pressing structure 12 presses the grindstone 3 fixed to the pressing structure 12 against the first surface 5a of the substrate W, polishing the first surface 5a of the substrate W with the grindstone 3.

[0125] In one embodiment, as shown in Fig. 29, the substrate processing apparatus further includes a tilt measuring device 110 that measures the tilt angle of the pressing structure 12. Fig. 29 is a schematic diagram showing one embodiment of the tilt measuring device 110. The tilt measuring device 110 of this embodiment measures the tilt angle of the pressing structure 12 of the polishing head 10A. The tilt measuring device 110 includes two distance measuring devices 112A and 112B arranged above the pressing structure 12 of the polishing head 10A, and a tilt calculation unit 113 that calculates the tilt of the pressing structure 12. The distance measuring devices 112A and 112B are non-contact distance sensors or non-contact displacement sensors.

[0126] The inclination measuring device 110 is configured to measure the relative inclination angle of the pressing structure 12 with respect to a reference plane. In this embodiment, the reference plane is the upper surface of the support member 11A that supports the polishing head 10A. FIG. 29 shows a state in which the inclination adjustment mechanism 50 inclines the pressing structure 12 of the polishing head 10A in the first direction D1. In this embodiment, the inclination measuring device 110 measures the relative inclination angle of the pressing structure 12 with respect to the reference plane when the first tilting actuator 58 inclines the pressing structure 12 in the first direction D1 until the lower surface of the tilt member 56 contacts the tip 68a of the first stopper actuator 68.

[0127] The distance measuring device 112A is configured to measure a distance M1 to a first measurement point Q1 located on the upper surface of the pressing structure 12, and a distance M2 to a second measurement point Q2 located on a reference plane (i.e., the upper surface of the support member 11A). The distance measuring device 112B is configured to measure a distance M3 to a third measurement point Q3 located on the upper surface of the pressing structure 12, and a distance M4 to a fourth measurement point Q4 located on a reference plane (i.e., the upper surface of the support member 11A). In this embodiment, the first measurement point Q1 and the third measurement point Q3 are located on the upper surface of the pressing member holder 14, but in one embodiment, the first measurement point Q1 and the third measurement point Q3 may be located on the upper surface of the tape pressing member 13.

[0128] Distance measuring devices 112A, 112B are electrically connected to tilt calculation unit 113, and the measured values ​​of distances M1 to M4 measured by distance measuring devices 112A, 112B are sent to tilt calculation unit 113. Tilt calculation unit 113 is configured to calculate the relative tilt angle of pressing structure 12 with respect to the reference plane based on the measured values ​​of distances M1 to M4 sent from distance measuring devices 112A, 112B. In this manner, tilt measurement device 110 measures the relative tilt angle of pressing structure 12 with respect to the reference plane.

[0129] In one embodiment, the inclination measurement device 110 may include a level measuring instrument (a spirit level) for measuring the levelness of the upper surface of the pressing structure 12 and the levelness of the reference surface, instead of the distance measuring instruments 112A and 112B. In this case, the inclination calculation unit 113 is configured to calculate the relative inclination angle of the pressing structure 12 with respect to the reference surface, based on the measured values ​​of the levelness of the upper surface of the pressing structure 12 and the levelness of the reference surface measured by the level measuring instrument.

[0130] The inclination calculation unit 113 includes at least one computer. The inclination calculation unit 113 includes a storage device 113a in which a program is stored, and a calculation device 113b that executes calculations according to the program. The storage device 113a includes a main storage device (e.g., a random access memory) accessible by the calculation device 113b, and an auxiliary storage device (e.g., a hard disk drive or a solid state drive) that stores the program. The calculation device 113b includes a CPU (Central Processing Unit) or a GPU (Graphics Processing Module) that executes calculations according to instructions included in the program stored in the storage device 113a. However, the specific configuration of the inclination calculation unit 113 is not limited to these examples. In one embodiment, the inclination calculation unit 113 may be configured integrally with the operation control unit 100.

[0131] In one embodiment, the tilt measurement device 110 (more specifically, the tilt calculation unit 113) is electrically connected to the operation control unit 100, and the relative tilt angle of the pressing structure 12 with respect to the reference plane measured by the tilt measurement device 110 is sent to the operation control unit 100. The operation control unit 100 may store correlation data in the storage device 100a indicating a correlation between the measured value of the relative tilt angle of the pressing structure 12 with respect to the reference plane and a command signal for the height position of the tip 68a of the first stopper actuator 68 at the time of measuring the tilt angle. The operation control unit 100 may provide a command signal to the tilt adjustment mechanism 50 to adjust the height position of the tip 68a of the first stopper actuator 68 by the tilt adjustment mechanism 50, and may display the tilt angle of the pressing structure 12 corresponding to the command signal on a display device (not shown) based on the correlation data stored in the storage device 100a.

[0132] In one embodiment, the operation control unit 100 may adjust the height position of the tip 68a of the first stopper actuator 68 based on the set value of the relative inclination angle of the pressing structure 12 with respect to a reference plane inputted to an input device not shown and the above correlation stored in the memory device 100a.

[0133] The inclination measurement device 110 can be applied to any of the polishing heads described with reference to Fig. 13 to Fig. 28. When the inclination measurement device 110 is applied to a polishing head having a second stopper actuator 80, the operation control unit 100 may store correlation data indicating the correlation between the relative inclination angle of the pressing structure 12 with respect to the reference plane and a command signal for the height position of the tip 80a of the second stopper actuator 80 in the storage device 100a of the operation control unit 100.

[0134] In one embodiment, as shown in FIG. 30, the tilt adjustment mechanism 50 further includes a monitoring distance measuring device 115 that measures the distance N between the upper surface of the base member 55 and the lower surface of the tilt member 56. FIG. 30 is a schematic diagram showing one embodiment of the tilt adjustment mechanism 50 including the monitoring distance measuring device 115. FIG. 30 shows a state in which the tilt adjustment mechanism 50 tilts the pressing structure 12 of the polishing head 10A in the first direction D1. The monitoring distance measuring device 115 is a non-contact type distance sensor or a non-contact type displacement sensor. In one embodiment, the monitoring distance measuring device 115 may be a contact type distance sensor or a contact type displacement sensor.

[0135] In this embodiment, the monitoring distance measuring device 115 is attached to the base member 55 and is adjacent to the first stopper actuator 68. In this embodiment, the monitoring distance measuring device 115 is attached to the second protrusion 73 of the base member 55. However, the arrangement of the monitoring distance measuring device 115 is arbitrary as long as it can measure the distance between the upper surface of the base member 55 and the lower surface of the tilt member 56, and is not limited to this embodiment.

[0136] The monitoring distance measuring device 115 is electrically connected to the operation control unit 100, and the distance N between the upper surface of the base member 55 and the lower surface of the tilt member 56 measured by the monitoring distance measuring device 115 is sent to the operation control unit 100. The operation control unit 100 stores in the storage device 100a correlation data indicating the correlation between the measured value of the distance N between the upper surface of the base member 55 and the lower surface of the tilt member 56 and the command signal for the height position of the tip 68a of the first stopper actuator 68 when the distance N was measured.

[0137] During polishing of the substrate W, the monitoring distance measuring device 115 measures the distance N between the upper surface of the base member 55 and the lower surface of the tilt member 56, and sends the distance N to the operation control unit 100. The distance N varies depending on the tilt angle of the pressing structure 12. Therefore, the operation control unit 100 can monitor the tilt angle of the pressing structure 12 during polishing of the substrate W, based on the measurement value of the distance N. Furthermore, the operation control unit 100 can monitor the operation of the tilt adjustment mechanism 50 during polishing of the substrate W, based on the measurement value of the distance N, a command signal regarding the height position of the tip 68a of the first stopper actuator 68, and the above correlation data.

[0138] Fig. 31 is a side view showing another embodiment of the substrate processing apparatus. The configuration of the substrate processing apparatus of this embodiment that is not particularly described is the same as that of the substrate processing apparatus described with reference to Figs. 1 and 2, so duplicated description will be omitted. The substrate processing apparatus of this embodiment has a substrate holding unit 120 with a different configuration from that of the substrate holding unit 20 of the substrate processing apparatus described with reference to Figs. 1 and 2, and further includes a table circular motion mechanism 130 that causes the polishing heads 10A-10D and the polishing tape supply mechanisms 30A, 30B to perform circular motion.

[0139] The substrate holding part 120 includes a plurality of rollers 125 capable of contacting the peripheral edge of the substrate W, and a roller rotation device (not shown) for rotating the plurality of rollers 125 at the same speed. The substrate W is held horizontally by the substrate holding part 120 with its first surface 5a facing downward. In this embodiment, four rollers 125 are provided, but three or five or more rollers may be provided.

[0140] The multiple polishing heads 10A-10D are disposed below the substrate W held by the substrate holding part 120. The table circular motion mechanism 130 is disposed below the polishing heads 10A-10D and the polishing tape supply mechanisms 30A, 30B. The support member 11A supporting the polishing heads 10A, 10C, the support member 11B supporting the polishing heads 10B, 10D, and the polishing tape supply mechanisms 30A, 30B are connected to the table circular motion mechanism 130.

[0141] The table circular motion mechanism 130 includes a table motor 132, a crankshaft 134 fixed to the table motor 132, a table 141, a base 142, and a plurality of eccentric joints 135. The table motor 132 is disposed below the base 142 and fixed to the lower surface of the base 142. The crankshaft 134 passes through the base 142 and extends upward. The table 141 is connected to the plurality of eccentric joints 135 and the crankshaft 134. The base 142 is connected to the plurality of eccentric joints 135. The table 141 is connected to the base 142 via the plurality of eccentric joints 135 and the crankshaft 134. Although only two eccentric joints 135 are illustrated in FIG. 31, the table circular motion mechanism 130 includes at least two eccentric joints 135.

[0142] The tip of the crankshaft 134 is eccentric by a distance e2 from the axis of the table motor 132. Therefore, when the table motor 132 is driven, the table 141 performs a circular motion with a radius e2. Since the table 141 is supported by a plurality of eccentric joints 135, the table 141 itself does not rotate while the table 141 performs a circular motion. The amount of eccentricity of the plurality of eccentric joints 135 is the same as the amount of eccentricity of the table 141. The polishing heads 10A to 10D and the polishing tape supply mechanisms 30A and 30B are fixed to the table 141.

[0143] When the table circular motion mechanism 130 is operated, the polishing heads 10A to 10D and the polishing tape supply mechanisms 30A, 30B are caused to perform circular motion together. Therefore, the substrate W held by the substrate holding portion 120 and the polishing heads 10A to 10D perform circular motion relative to each other.

[0144] The roller rotation device of the substrate holding part 120 and the table motor 132 of the table circular motion mechanism 130 are electrically connected to the operation control part 100. The operations of the substrate holding part 120 and the table circular motion mechanism 130 are controlled by the operation control part 100.

[0145] In this embodiment, the polishing head 10A for polishing the central portion P1 (see FIG. 3) of the substrate W has a configuration similar to that of the polishing head 10A equipped with the tilt adjustment mechanism 50 described with reference to FIGS. 4 to 10. The polishing head 10B, polishing head 10C, and polishing head 10D are polishing heads equipped with a universal joint (not shown) that allows the pressing structure 12 to tilt in all directions relative to the movable shaft 16.

[0146] In one embodiment, the polishing head 10D that polishes the edge portion P4 (see FIG. 3) of the substrate W may have a configuration similar to that of the polishing head 10D equipped with the tilt adjustment mechanism 50 described with reference to FIGS. 21 to 25, or may have a configuration similar to that of the polishing head 10A equipped with the tilt adjustment mechanism 50 described with reference to FIGS. 4 to 10. In other embodiments, the polishing head 10A and the polishing head 10D may have a configuration similar to that of the polishing heads of the embodiments described with reference to FIGS. 13 to 28.

[0147] A polishing head equipped with the above-mentioned tilt adjustment mechanism 50 is not limited to substrate processing apparatuses that polish a substrate while performing relative circular motion between the substrate and the polishing head, but can also be applied to substrate processing apparatuses that polish a substrate while rotating the substrate around its axis without performing relative circular motion between the substrate and the polishing head.

[0148] The polishing head equipped with the tilt adjustment mechanism 50 described above is applied to a polishing apparatus that polishes the processed surface of a substrate as an example of a processing head, but can also be applied to a cleaning head of a cleaning apparatus that cleans the processed surface of a substrate. The configuration and operation of the substrate processing apparatus equipped with the cleaning head are similar to those of the substrate processing apparatus of the above-mentioned embodiment, so that the overlapping description will be omitted. A cleaning tape, which is an example of a processing tape, is used to clean the substrate instead of the polishing tape. The cleaning tape is, for example, a cloth cleaning tape. The substrate processing apparatus for cleaning the substrate presses the cleaning tape against the processed surface of the substrate with the pressing structure of the cleaning head equipped with the tilt adjustment mechanism 50 inclined in a first direction with respect to the pressing direction of the pressing structure, and then presses the cleaning tape against the processed surface of the substrate with the pressing structure inclined in a second direction opposite to the first direction with respect to the pressing direction of the pressing structure. This allows the entire processed surface of the substrate to be uniformly cleaned.

[0149] The above-described embodiments have been described for the purpose of enabling a person having ordinary skill in the art to practice the present invention. Various modifications of the above-described embodiments are naturally possible for a person skilled in the art, and the technical idea of ​​the present invention can be applied to other embodiments. Therefore, the present invention is not limited to the described embodiments, but is to be interpreted in the broadest scope according to the technical idea defined by the claims. [Explanation of symbols]

[0150] 2A, 2B Polishing Tape 3. Grindstone 5a First Side 5b Second Side 10A, 10B, 10C, 10D Polishing head 11A, 11B Support member 12 Pressing structure 13 Tape pressing member 14 Pressing member holder 14a Skirt 15 Pressurized Actuator 16 Movable axis 18 Housing 18A Housing body 18B Lid 20 Board holding part 25 Roller 27 Eccentric shaft 27a 1st shaft part 27b 2nd shaft part 29 Motor 30A, 30B Polishing tape supply mechanism 31 Tape winding reel 32 Tape take-up reel 33 Guide roller 36,37 Reel motor 40 Pressure Chamber 42 Diaphragm 45 Ball spline nut 50 Tilt adjustment mechanism 51 Spindle 55 Base material 55a through hole 56 Tilt member 56a Support hole 58 First tilt actuator (air cylinder) 59 First rod (piston rod) 60 cylinders 62 Lid 62a through hole 63 Rod Hole 65 Compressed gas supply line 68 First stopper actuator 70 Central part 72 1st protrusion 73 Second protrusion 75 Hollow space 80 Second stopper actuator 82 Second tilt actuator (air cylinder) 83 Second rod (piston rod) 84 Cylinders 86 Lid 86a through hole 87 Rod Hole 89 Compressed gas supply line 90 through hole 91 Pin Hole 92 pin 100 Motion control section 100a Storage device 100b arithmetic unit 110 Tilt measuring device 112A,112B distance measuring device 113 Tilt Calculation Unit 113a Storage device 113b Arithmetic unit 115 Monitoring distance measuring device 120 Board holding part 125 Roller 130 Table Circular Motion Mechanism 132 Table motor 134 Crankshaft 135 Eccentric joint 141 Table 142 Foundation P1 central part P2 Inner middle part P3 outer middle part P4 Edge part

Claims

1. a pressing structure for pressing the processing tool against the processing surface of the substrate; a pressing actuator that moves the pressing structure in a predetermined pressing direction to apply a pressing force to the pressing structure against the processing surface of the substrate; a tilt adjustment mechanism for adjusting a tilt of the pressing structure relative to the pressing direction, The tilt adjustment mechanism includes: a first tilt actuator that tilts the pressing structure in a first direction with respect to the pressing direction; A support shaft and a first stopper actuator that is located on the opposite side of the support shaft from the first tilt actuator and adjusts the tilt angle of the pressing structure in the first direction; The pressing structure is rotatably connected to the support shaft so as to be tiltable about the support shaft in the first direction and in a second direction opposite to the first direction.

2. The tilt adjustment mechanism includes: A base member supporting the support shaft; A tilt member is further provided which is connected to the support shaft and can tilt around the support shaft, The pressing structure is fixed to the tilt member, The first tilt actuator has a first rod that pushes up the tilt member, The process head of claim 1 , wherein the first stop actuator protrudes from the base member toward the tilt member.

3. the first tilt actuator is an air cylinder; The process head of claim 2 , wherein the first rod is a piston rod of the air cylinder.

4. The processing head of claim 2 , wherein the first stopper actuator includes any one of a piezoelectric element, a combination of a servo motor and a ball screw mechanism, and a combination of a stepping motor and a ball screw mechanism.

5. The processing head according to claim 1 , wherein the tilt adjustment mechanism further comprises a second stopper actuator adjacent to the first tilt actuator for adjusting a tilt angle of the pressing structure in the second direction.

6. The tilt adjustment mechanism includes: A base member supporting the support shaft; A tilt member is further provided which is connected to the support shaft and can tilt around the support shaft, The pressing structure is fixed to the tilt member, The first tilt actuator has a first rod that pushes up the tilt member, The process head of claim 5 , wherein the first stopper actuator and the second stopper actuator protrude from the base member toward the tilt member.

7. The processing head of claim 5 , wherein each of the first stopper actuator and the second stopper actuator includes any one of a piezoelectric element, a combination of a servo motor and a ball screw mechanism, and a combination of a stepping motor and a ball screw mechanism.

8. The processing head according to claim 5 , wherein the tilt adjustment mechanism further comprises a second tilt actuator that tilts the pressing structure in the second direction with respect to the pressing direction.

9. The tilt adjustment mechanism includes: A base member supporting the support shaft; A tilt member is further provided which is connected to the support shaft and can tilt around the support shaft, The pressing structure is fixed to the tilt member, The first tilt actuator has a first rod that pushes up the tilt member, The second tilt actuator has a second rod that pushes up the tilt member, The process head of claim 8 , wherein the first stop actuator and the second stop actuator protrude from the base member toward the tilt member.

10. each of the first tilt actuator and the second tilt actuator is an air cylinder; The process head of claim 9 , wherein each of the first rod and the second rod is a piston rod of the air cylinder.

11. the processing head is a polishing head for polishing the processing surface of the substrate, The processing head according to claim 1 , wherein the processing tool is an abrasive tape having abrasive grains on its surface, or a grindstone.

12. the processing head is a cleaning head for cleaning the processing surface of the substrate, The treatment head of claim 1 , wherein the treatment tool is a cleaning tape.

13. a substrate holder that holds a substrate and rotates the substrate; A substrate processing apparatus comprising a processing head according to any one of claims 1 to 12.

14. The substrate processing apparatus according to claim 13 , wherein the processing head is a processing head that processes a central portion including a center of the processing surface of the substrate.

15. The substrate processing apparatus according to claim 13 , wherein the processing head is a processing head that processes an edge portion of the processing surface of the substrate.

16. The substrate processing apparatus according to claim 13 , wherein the processing head is a processing head that processes a peripheral portion of the processing surface of the substrate.

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