Micro LED pixel and micro LED array panel

Abstract

To reduce one or more cross-sectional dimensions of a micro LED pixel to enhance light emission quality.SOLUTION: A micro LED pixel 100 includes a first light-emitting mesa 110, a second light-emitting mesa 120 provided above the first light-emitting mesa, and a third light-emitting mesa 130 provided above the second light-emitting mesa, where at least a portion of the third light-emitting mesa fully covers the second light-emitting mesa. The first light-emitting mesa, the second light-emitting mesa, and the third light-emitting mesa do not contact each other.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This disclosure claims priority to PCT Application No. PCT / CN2023 / 112262, filed August 10, 2023, which is incorporated by reference in its entirety.

[0002] The present disclosure relates generally to microdisplay technology, and more particularly to micro light emitting diodes (LEDs) and micro LED array panels. [Background technology]

[0003] background Typically, a conventional micro LED pixel includes three or more micro LED mesas arranged side-by-side to form a micro LED panel, which may emit light of different colors.

[0004] To reduce the volume of the micro-LED pixel, the micro-LED pixel may include multiple micro-LED mesas formed vertically with a common central axis. The micro-LED mesas define a light-emitting area, and electrodes for the micro-LED mesas are formed on an external panel outside the light-emitting area of ​​the micro-LED pixel. However, the external panel may increase the dimensions of the micro-LED pixel.

[0005] Therefore, the microLED pixel structure needs to be further improved to reduce the dimensions and enlarge the light-emitting area. Summary of the Invention

[0006] An embodiment of the present disclosure provides a micro-LED pixel, which includes a first light emitting mesa, a second light emitting mesa disposed above the first light emitting mesa, and a third light emitting mesa disposed above the second light emitting mesa, where at least a portion of the third light emitting mesa completely covers the second light emitting mesa, and the first light emitting mesa, the second light emitting mesa, and the third light emitting mesa are not in contact with each other.

[0007] An embodiment of the present disclosure provides a micro LED array panel, which includes a plurality of the micro LED pixels as described above, the plurality of micro LED pixels being arranged in an array.

[0008] An embodiment of the present disclosure provides a micro LED array panel, which includes a plurality of micro LED pixels as described above, the micro LED pixels further including an upper conductive layer continuously formed on an upper surface of the first light emitting mesa, an upper surface of the second light emitting mesa, and an upper surface of the third light emitting mesa, and the upper conductive layer of each of the plurality of micro LED pixels is interconnected.

[0009] An embodiment of the present disclosure provides a micro LED array panel, which includes a plurality of the aforementioned micro LED pixels, the micro LED pixels further including an integrated circuit (IC) backplane disposed at a bottom of the micro LED pixels, and the IC backplanes of each of the plurality of micro LED pixels are interconnected.

[0010] Embodiments and various aspects of the present disclosure are described in the following detailed description and in the accompanying drawings, in which various features are not drawn to scale. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 illustrates a structural diagram of an example of a micro LED pixel according to some embodiments of the present disclosure. [Diagram 2]FIG. 2 is a structural diagram illustrating a top view of the micro LED pixel shown in FIG. 1 according to some embodiments of the present disclosure. [Diagram 3] FIG. 3 is a structural diagram showing a cross-sectional view of a micro LED pixel along the AA' direction shown in FIG. 2 according to some embodiments of the present disclosure. [Figure 4] FIG. 3 is a structural diagram showing a cross-sectional view of a micro LED pixel along the BB' direction shown in FIG. 2 according to some embodiments of the present disclosure. [Diagram 5] FIG. 3 is a structural diagram showing a cross-sectional view of a micro LED pixel along the CC' direction shown in FIG. 2 according to some embodiments of the present disclosure. [Figure 6] FIG. 3 is a structural diagram showing a cross-sectional view of a micro LED pixel structure along the DD' direction shown in FIG. 2 according to some embodiments of the present disclosure. [Figure 7] FIG. 7 is a structural diagram illustrating a top view of an exemplary micro LED array panel 700, according to some embodiments of the present disclosure. [Figure 8] FIG. 8 illustrates another top view of the example micro LED array panel shown in FIG. 7, with the top conductive layer and top contact structure removed from the view, according to some embodiments of the present disclosure. [Figure 9] FIG. 8 is a structural diagram illustrating a cross-sectional view of a micro LED array panel along the E-E' direction shown in FIG. 7 according to some embodiments of the present disclosure. [Figure 10] FIG. 8 is a structural diagram illustrating a cross-sectional view of a micro LED array panel along the F-F' direction shown in FIG. 7 according to some embodiments of the present disclosure. [Figure 11] 1A-1D are structural diagrams illustrating top views of different exemplary micro-LED pixels according to some embodiments of the present disclosure. [Figure 12-13] 1A-1C are structural diagrams illustrating top views of different exemplary micro-LED pixels, according to some embodiments of the present disclosure. [Figure 14-15] 1A-1C are structural diagrams illustrating top views of different exemplary micro-LED pixels, according to some embodiments of the present disclosure. [Figure 16-17] 1A-1C are structural diagrams illustrating top views of different exemplary micro-LED pixels, according to some embodiments of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Reference will now be made in detail to the exemplary embodiments illustrated in the accompanying drawings. The following description refers to the accompanying drawings, in which like numbers in different drawings represent the same or similar elements unless otherwise specified. The implementations set forth in the following description of the exemplary embodiments do not represent all implementations consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with aspects related to the present invention as set forth in the appended claims. Certain aspects of the present disclosure are described in further detail below. In the event of a conflict with terms and / or definitions incorporated by reference, the terms and definitions provided herein shall control.

[0013] Embodiments of the present disclosure provide a micro-LED pixel with staggered light-emitting mesas to reduce one or more cross-sectional dimensions of the micro-LED pixel.

[0014] FIG. 1 is a structural diagram illustrating an example of a micro LED pixel 100 according to some embodiments of the present disclosure. As shown in FIG. 1, the micro LED pixel 100 includes three light emitting mesas that are vertically staggered and spaced apart. For example, a first light emitting mesa 110 is provided at the bottom, a second light emitting mesa 120 is provided on the first light emitting mesa 110, and a third light emitting mesa 130 is provided on the second light emitting mesa 120. The top surface of the first light emitting mesa 110 is lower than the bottom surface of the second light emitting mesa 120, and the top surface of the second light emitting mesa 120 is lower than the bottom surface of the third light emitting mesa 130. That is, the first light emitting mesa 110, the second light emitting mesa 120, and the third light emitting mesa 130 are spaced apart from each other, i.e., do not contact each other.

[0015] When viewed from above the micro LED pixel 100, at least a portion of the three light emitting mesas may overlap. For example, at least a portion of the second light emitting mesa 120 covers at least a portion of the first light emitting mesa 110, i.e., overlaps without touching, or at least a portion of the third light emitting mesa 130 covers at least a portion of the first light emitting mesa 110 or the second light emitting mesa, i.e., overlaps without touching. At the same time, another portion of the second light emitting mesa 120 does not cover the first light emitting mesa 110, or another portion of the third light emitting mesa 130 does not cover the second light emitting mesa 120 or the first light emitting mesa 110. Referring to FIG. 1, in this example, a portion of the third light emitting mesa 130 covers a portion of the second light emitting mesa 120, and a portion of the second light emitting mesa 120 covers a portion of the first light emitting mesa 110. Other portions of first light emitting mesa 110 are not covered by second light emitting mesa 120 or third light emitting mesa 130 , and other portions of second light emitting mesa 120 are not covered by third light emitting mesa 130 .

[0016] Each light emitting mesa (i.e., 110, 120, and 130) includes a top electrode and a bottom electrode. For example, the top electrode is disposed on a top surface of the light emitting mesa, and the bottom electrode is disposed on a bottom surface of the light emitting mesa. In some embodiments, the micro LED pixel 100 further includes a group of conductive bottom pads. As shown in FIG. 1 , the group of conductive bottom pads includes a first bottom pad 111 of the first light emitting mesa 110 disposed under the first light emitting mesa 110, a second bottom pad 121 of the second light emitting mesa 120 disposed under a portion of the second light emitting mesa 120 where the second light emitting mesa 120 does not cover the first light emitting mesa 110, and a third bottom pad 131 of the third light emitting mesa 130 disposed under a portion of the third light emitting mesa 130 where the third light emitting mesa 130 does not cover the second light emitting mesa 120 or the first light emitting mesa 110. That is, the second lower pad 121 is disposed under a portion of the second light emitting mesa 120 and is not covered by the first light emitting mesa 110. The third lower pad 131 is disposed under a portion of the third light emitting mesa 130 and is not covered by the first light emitting mesa 110 or the second light emitting mesa 120. The first lower pad 111, the second lower pad 121, and the third lower pad 131 do not contact each other. In some embodiments, the micro LED pixel 100 further includes an integrated circuit (IC) backplane (not shown in FIG. 1 ), and the first lower pad 111, the second lower pad 121, and the third lower pad 131 are disposed separately on the IC backplane.

[0017] Thus, each light emitting mesa can be connected to a bottom pad beneath its respective bottom surface. In the case of the micro-LED pixel 100, all bottom pads can be provided beneath the light emitting area formed by the first light emitting mesa 110, the second light emitting mesa 120, and the third light emitting mesa 130. Thus, no external area is required for the bottom pads, and the cross-sectional dimensions of the micro-LED pixel 100 are reduced because the three light emitting mesas overlap at least in part.

[0018] In some embodiments, the micro-LED pixel 100 includes one or more lower electrical connection structures for conductively connecting the lower electrodes on the bottom surfaces of the light-emitting mesas to the conductive lower pads. For example, a first lower electrical connection structure may be provided for connecting the bottom surface of the first light-emitting mesa 110 to the first lower pad 111. In this example, since the first light-emitting mesa 110 is provided at the lowest position, the first lower electrical connection structure may be a lower bonding layer or a lower via provided between the bottom surface of the first light-emitting mesa 110 and the first lower pad 111, connecting the first light-emitting mesa 110 and the first lower pad 111. A second lower electrical connection structure 122 is provided for connecting the bottom surface of the second light-emitting mesa 120 to the second lower pad 121. A third lower electrical connection structure 132 is provided for connecting the bottom surface of the third light-emitting mesa 130 to the third lower pad 131. In some embodiments, the second lower electrical connection structure 122 and the third lower electrical connection structure 132 are through vias. The through vias are made of metal and may have a hollow structure. The second lower electrical connection structure 122 and the third lower electrical connection structure 132 are not in electrical conductive contact.

[0019] In some embodiments, each of the light emitting mesas (i.e., 110, 120, and 130) has a tapered structure, i.e., the area of ​​the top surface of the light emitting mesa is smaller than the area of ​​the bottom surface of the light emitting mesa, and each light emitting mesa has a symmetric structure. In some embodiments, the top surface is a rectangle having a width (short side) and a length (long side). The symmetric structure is characterized by a length vertical symmetry plane along the length direction and a width vertical symmetry plane along the width direction. The length vertical symmetry plane is perpendicular to the width vertical symmetry plane, and the intersection line between the length vertical symmetry plane and the width vertical symmetry plane points to the vertical centerline of the light emitting mesa and is perpendicular to the light emitting mesa. In some embodiments, the top surface is a square, i.e., the width and the length are equal. In this case, it is understood that the width direction and the length direction can be interchanged and can also be referred to as the first direction and the second direction. Thus, the length vertical symmetry plane and the width vertical symmetry plane can be interchanged and referred to as the first vertical symmetry plane and the second vertical symmetry plane.

[0020] 2 is a structural diagram showing a top view of the micro-LED pixel shown in FIG 1 according to some embodiments of the present disclosure. As shown in FIG 2, in accordance with FIG 1, in this example, the length vertical symmetry planes of the first light emitting mesa 110 and the third light emitting mesa 130 are parallel and perpendicular to the length vertical symmetry plane of the second light emitting mesa 120.

[0021] 3-6 illustrate an example structure of a micro-LED pixel 100 according to some embodiments of the present disclosure.

[0022] FIG 3 is a structural diagram showing a cross-sectional view of the micro LED pixel 100 along the A-A' direction shown in FIG 2 according to some embodiments of the present disclosure. FIG 4 is a structural diagram showing a cross-sectional view of the micro LED pixel 100 along the B-B' direction shown in FIG 2 according to some embodiments of the present disclosure. FIG 5 is a structural diagram showing a cross-sectional view of the micro LED pixel 100 along the C-C' direction shown in FIG 2 according to some embodiments of the present disclosure. FIG 6 is a structural diagram showing a cross-sectional view of the micro LED pixel 100 along the D-D' direction shown in FIG 2 according to some embodiments of the present disclosure.

[0023] 3-6, the micro LED pixel 100 further includes an upper conductive layer 160 formed on the top surface of the micro LED pixel 100. As shown in FIG. 3, the upper conductive layer 160 is continuously formed on the first light emitting mesa 110, the second light emitting mesa 120, and the third light emitting mesa 130, and configured to connect to the upper electrodes of the first light emitting mesa 110, the second light emitting mesa 120, and the third light emitting mesa 130. The upper conductive layer 160 has a wave-like structure and includes one or more recessed portions. In some embodiments, the upper conductive layer 160 includes recessed portions (e.g., 161, 162, and 163) corresponding to each light emitting mesa for connecting to each light emitting mesa, respectively. Since the three light emitting mesas (110, 120, 130) have different vertical positions, the depths of the three recessed portions (161, 162, 163) are different from each other. In some embodiments, the micro LED pixel 100 further includes upper electrical connection structures (e.g., 113, 123, and 133) for connecting the upper electrodes of the light emitting mesas to the upper conductive layer 160. For example, the upper surface of the first light emitting mesa 110 is provided with a first upper electrical connection structure 113 for connecting to the upper conductive layer 160. The second upper electrical connection structure 123 is provided on the upper surface of the second light emitting mesa 120 and connected to the upper conductive layer 160. The upper electrical connection structures (e.g., 113, 123, and 133) may function as ohmic contact layers. In some embodiments, the material of the upper electrical connection structures (e.g., 113, 123, and 133) is a metal. In some embodiments, the upper conductive layer 160 can be directly contacted to the upper surfaces of the three light emitting mesas (i.e., 110, 120, and 130), so that the upper electrical connection structures (e.g., 113, 123, and 133) are not required. In some embodiments, the top conductive layer 160 is transparent, with a light transmittance of 70% or less. In some embodiments, the top conductive layer 160 is a TCO (transparent conductive oxide) layer, such as an ITO (indium tin oxide) layer, an AZO (antimony doped zinc oxide) layer, an ATO (antimony doped tin oxide) layer, an FTO (fluorine doped tin oxide) layer, etc.

[0024] In some embodiments, the top contact structure 180 is provided on the top conductive layer 160 and configured to provide contact to the top conductive layer 160. In some embodiments, the top contact structure 180 is connected to the top and further connected to an external circuit. In some embodiments, the top pad is provided on an IC backplane. In some embodiments, the top contact structure 180 is provided on the edges of the micro-LED pixel 100 and around the periphery of the micro-LED pixel 100.

[0025] In some embodiments, the micro-LED pixel 100 further includes an optical isolation structure 140 disposed around the micro-LED pixel 100 and configured to prevent light crossover between adjacent micro-LED pixels. In some embodiments, an upper portion of the optical isolation structure 140 is equal to or higher than an upper surface of the third light-emitting mesa 130, and a lower portion of the optical isolation structure 140 is equal to or lower than a lower surface of the first light-emitting layer 110. Thus, the optical isolation structure 140 can prevent light crossover between the light-emitting mesas of adjacent micro-LED pixels. It can be seen that the optical isolation structure 140 is not connected to the light-emitting mesas (i.e., 110, 120, 130), the upper conductive layer 160, and the IC backplane 190.

[0026] In some embodiments, the light isolating structure 140 is reflective. In some embodiments, the material of the light isolating structure 140 is metallic.

[0027] In some embodiments, the micro-LED pixel 100 further includes a dielectric material 150 filled within the micro-LED pixel 100, i.e., the dielectric material 150 fills a space at least partially defined by the IC backplane 190, the top conductive layer 160, and the optical isolation structure 140. More specifically, the dielectric material 150 fills a space between the first light emitting mesa 110, the second light emitting mesa 120, the third light emitting mesa 130, the second lower electrical connection structure 122, the third lower electrical connection structure 132, the first lower pad 111, the second lower pad 121, the third lower pad 131, the IC backplane 190, the top conductive layer 160, and the optical isolation structure 140. In some embodiments, the space defined by the IC backplane 190, the top conductive layer 160, and the optical isolation structure 140 can have a box structure. In some embodiments, the dielectric material 150 is selected from the group consisting of silicon oxide, silicon nitride, SiCN, SiNO, or Al. 2 O 3 In some embodiments, the dielectric material 150 is transparent.

[0028] With the above-mentioned structure, the micro LED pixel provided by the embodiment of the present invention can have a good balance between high transmittance and size. By staggering the light emitting mesas, a bottom connection structure can be provided under each light emitting mesa with at least a portion of the light emitting mesas overlapping each other. This eliminates the need for an external panel to connect with the electrodes, reduces the cross-sectional area of ​​the micro LED pixel, and improves the transmittance.

[0029] FIG. 7 is a structural diagram showing a top view of an exemplary micro LED array panel according to some embodiments of the present disclosure. FIG. 8 is a structural diagram showing another top view of a micro LED array panel 700 with the top conductive layer 160 and the top contact structure 180 removed according to some embodiments of the present disclosure. With reference to FIG. 7 and FIG. 8, the micro LED array panel 700 includes two or more micro LED pixels 100 arranged in an array. In this example, a 3×2 array is shown. As shown in FIG. 7, the top view of each micro LED pixel 100 has a rectangular shape, so that two or more micro LED pixels 100 can be arranged closely together.

[0030] Figure 9 is a structural diagram showing a cross-sectional view of a micro LED array panel 700 along the E-E' direction shown in Figure 7 according to some embodiments of the present disclosure. Figure 10 is a structural diagram showing a cross-sectional view of a micro LED array panel 700 along the F-F' direction shown in Figure 7 according to some embodiments of the present disclosure. As shown in Figures 9 and 10, light crossover between adjacent micro LED pixels can be prevented by a light isolation structure 140.

[0031] 9 and 10, in some embodiments, the top conductive layer 160 of each of the multiple micro LED pixels 100 is interconnected. For example, the top conductive layer 160 is continuously formed on top of the micro LED array panel 700.

[0032] In some embodiments, the IC backplane 190 of each of the multiple micro LED pixels 100 are interconnected. For example, the IC backplane 190 may be provided continuously as an entire bottom plate of the micro LED array panel 700. In some embodiments, the entire IC backplane 190 further includes a top pad (not shown), and the top conductive layer 160 is connected to the top pad. In some embodiments, an external wire is further provided for connecting the top contact structure 180 to the top pad.

[0033] 1 , in some embodiments, first light emitting mesa 110 is oriented along a first length direction D1, second light emitting mesa 120 is oriented along a second length direction D2, and third light emitting mesa 130 is oriented along a third length direction D3. In some embodiments, the vertical centerline of third light emitting mesa 130 and the vertical centerline of second light emitting mesa 120 are not collinear. The length vertical symmetry planes of first light emitting mesa 110 and third light emitting mesa 130 are parallel and both are perpendicular to the length vertical symmetry plane of second light emitting mesa 120.

[0034] 11-17 are structural diagrams illustrating top views of different exemplary micro-LED pixels according to some embodiments of the present disclosure. In various such embodiments, the first light emitting mesa 110, the second light emitting mesa 120, and the third light emitting mesa 130 can be arranged in different orientations and with different dimensions.

[0035] 11, in the example micro-LED pixel 100A, the first vertical plane of symmetry 110A of the first light-emitting mesa 110 and the first vertical plane of symmetry 130A of the third light-emitting mesa 130 are parallel and perpendicular to the first vertical plane of symmetry 120A of the second light-emitting mesa 120. The second vertical plane of symmetry 110B of the first light-emitting mesa 110 is aligned with the second vertical plane of symmetry 130B of the third light-emitting mesa 130, i.e., the second vertical plane of symmetry 110B of the first light-emitting mesa 110 and the second vertical plane of symmetry 130B of the third light-emitting mesa 130 are coplanar. A portion of the third light-emitting mesa 130 covers a portion of the second light-emitting mesa 120, and a portion of the second light-emitting mesa 120 covers a portion of the first light-emitting mesa 110. Other portions of the first light emitting mesa are not covered by the second light emitting mesa 120 or the third light emitting mesa 130, and other portions of the second light emitting mesa 120 are not covered by the third light emitting mesa 130. In this example, each light emitting mesa has an upward-facing light emitting area and may not be covered by other light emitting mesas. Thus, the light emitting quality is high and the transmittance of the light emitting mesas can be balanced.

[0036] 12, in the exemplary micro LED pixel 100B, a portion of the second light emitting mesa 120 covers a portion of the first light emitting mesa 110, another portion of the second light emitting mesa 120 does not cover the first light emitting mesa 110, and another portion of the first light emitting mesa 110 is not covered by the second light emitting mesa 120. The third light emitting mesa 130 does not cover the second light emitting mesa 120 or the first light emitting mesa 110. In this example, both the second light emitting mesa 120 and the third light emitting mesa 130 can emit light without being covered by the other light emitting mesa. More specifically, in FIG. 12, the first vertical plane of symmetry 110A of the first light emitting mesa 110 and the first vertical plane of symmetry 130A of the third light emitting mesa 130 are parallel and both are perpendicular to the first vertical plane of symmetry 120A of the second light emitting mesa 120. The second vertical symmetry plane 110B of the first light emitting mesa 110 is aligned with the second vertical symmetry plane 130B of the third light emitting mesa 130, i.e., the second vertical symmetry plane 110B of the first light emitting mesa 110 and the second vertical symmetry plane 130B of the third light emitting mesa 130 are on the same plane. Since the third light emitting mesa 130 does not cover the second light emitting mesa 120 or the first light emitting mesa 110, the third light emitting mesa 130 can be provided at any position in the vertical direction as long as the third light emitting mesa 130 does not contact the first light emitting mesa 110 or the second light emitting mesa 120. For example, the third light emitting mesa 130 and the second light emitting mesa 120 can be provided in the same plane. Therefore, the height of the micro LED pixel 100B can be reduced.

[0037] 13, in one example of a micro LED pixel 100C, the first light emitting mesa 110 is completely covered by a portion of the second light emitting mesa 120. Other portions of the second light emitting mesa 120 do not cover the first light emitting mesa 110. The third light emitting mesa 130 does not cover the second light emitting mesa 120 or the first light emitting mesa 110. More specifically, the first vertical plane of symmetry 120A of the second light emitting mesa 120 and the second vertical plane of symmetry 110B of the first light emitting mesa 110 are coplanar and parallel to the first vertical plane of symmetry 130A of the third light emitting mesa 130. The second vertical plane of symmetry 120B of the second light emitting mesa 120 and the second vertical plane of symmetry 130B of the third light emitting mesa 130 are coplanar and parallel to the first vertical plane of symmetry 110A of the first light emitting mesa 110. Since the third light emitting mesa 130 does not cover the second light emitting mesa 120 or the first light emitting mesa 110, the third light emitting mesa 130 can be provided at any position in the vertical direction as long as the third light emitting mesa 130 does not contact the first light emitting mesa 110 or the second light emitting mesa 120. For example, the third light emitting mesa 130 and the second light emitting mesa 120 can be provided in the same plane. Therefore, the height of the micro LED pixel 100C can be reduced.

[0038] 14, in one example of a micro LED pixel 100D, the second light emitting mesa 120 is completely covered by a portion of the third light emitting mesa 130. The other portion of the third light emitting mesa 130 does not cover the second light emitting mesa 120. The first light emitting mesa 110 is not covered by the second light emitting mesa 120 or the third light emitting mesa 130. The first light emitting mesa 110 can emit light without being covered by other light emitting mesas. More specifically, the first vertical plane of symmetry 130A of the third light emitting mesa 130 and the second vertical plane of symmetry 120B of the second light emitting mesa 120 are coplanar and parallel to the first vertical plane of symmetry 110A of the first light emitting mesa 110. The second vertical symmetry plane 110B of the first light emitting mesa 110 and the second vertical symmetry plane 130B of the third light emitting mesa 130 are on the same plane and are parallel to the first vertical symmetry plane 120A of the second light emitting mesa 120. Since the first light emitting mesa 110 is not covered by the second light emitting mesa 120 or the third light emitting mesa 130, the first light emitting mesa 110 can be located at any position in the vertical direction as long as the first light emitting mesa 110 does not contact the second light emitting mesa 120 or the third light emitting mesa 130. For example, the first light emitting mesa 110 and the second light emitting mesa 120 can be located in the same plane. Therefore, the height of the micro LED pixel 100D can be reduced.

[0039] 15, in one example of a micro LED pixel 100E, the second light emitting mesa 120 is completely covered by a portion of the third light emitting mesa 130, which in turn covers a portion of the first light emitting mesa 110. The third light emitting mesa 130 also covers a portion of the first light emitting mesa 110. More specifically, the first vertical plane of symmetry 130A of the third light emitting mesa 130 and the second vertical plane of symmetry 120B of the second light emitting mesa 120 are coplanar and parallel to the first vertical plane of symmetry 110A of the first light emitting mesa 110. The second vertical plane of symmetry 110B of the first light emitting mesa 110 and the second vertical plane of symmetry 130B of the third light emitting mesa 130 are coplanar and parallel to the first vertical plane of symmetry 120A of the second light emitting mesa 120.

[0040] 16, in one example of a micro LED pixel 100F, the third light emitting mesa 130 does not cover any portion of the second light emitting mesa 120 or the first light emitting mesa 110. A portion of the second light emitting mesa 120 covers a portion of the first light emitting mesa 110. More specifically, the first vertical plane of symmetry 110A of the first light emitting mesa 110 and the first vertical plane of symmetry 130A of the third light emitting mesa 130 are parallel and perpendicular to the first vertical plane of symmetry 120A of the second light emitting mesa 120. The second vertical plane of symmetry 110B of the first light emitting mesa 110 and the second vertical plane of symmetry 130B of the third light emitting mesa 130 are parallel and perpendicular to the second vertical plane of symmetry 120B of the second light emitting mesa 120. Compared with the micro LED pixel 100B shown in FIG. 12, in this example, the light emitting area of ​​the third light emitting mesa 130 is reduced, and the light emitting area of ​​the first light emitting mesa 110 is enlarged. Since the third light emitting mesa 130 does not cover the second light emitting mesa 120 or the first light emitting mesa 110, the third light emitting mesa 130 can be provided at any position in the vertical direction as long as the third light emitting mesa 130 does not contact the first light emitting mesa 110 or the second light emitting mesa 120. For example, the third light emitting mesa 130 and the second light emitting mesa 120 can be provided in the same plane. Therefore, the height of the micro LED pixel 100F can be reduced.

[0041] 17, in one example of a micro LED pixel 100G, a portion of the third light emitting mesa 130 covers a portion of the second light emitting mesa 120. The first light emitting mesa 110 is not covered by the second light emitting mesa 120 or the third light emitting mesa 130. More specifically, the first vertical plane of symmetry 110A of the first light emitting mesa 110 and the first vertical plane of symmetry 130A of the third light emitting mesa 130 are parallel and perpendicular to the first vertical plane of symmetry 120A of the second light emitting mesa 120. The second vertical plane of symmetry 110B of the first light emitting mesa 110 and the second vertical plane of symmetry 130B of the third light emitting mesa 130 are parallel and perpendicular to the second vertical plane of symmetry 120B of the second light emitting mesa 120. Compared with the micro LED pixel 100D shown in FIG. 14, the light emitting area of ​​the first light emitting mesa 110 is reduced, and the light emitting area of ​​the second light emitting mesa 120 is increased. Compared with the micro LED pixel 100F shown in FIG. 16, the light emitting area of ​​the second light emitting mesa 120 is reduced, and the light emitting area of ​​the third light emitting mesa 130 is increased. Since the first light emitting mesa 110 is not covered by the second light emitting mesa 120 or the third light emitting mesa 130, the first light emitting mesa 110 can be provided at any position in the vertical direction as long as the first light emitting mesa 110 does not contact the second light emitting mesa 120 or the third light emitting mesa 130. For example, the first light emitting mesa 110 and the second light emitting mesa 120 can be provided in the same plane. Therefore, the height of the micro LED pixel 100G can be reduced.

[0042] In some embodiments, the area of ​​the top surface of the bottom light emitting mesa is the largest among the areas of the three or more light emitting mesas. In this example, the area of ​​the top surface of first light emitting mesa 110 is greater than the area of ​​the top surface of second light emitting mesa 120 and the area of ​​the top surface of third light emitting mesa 130.

[0043] In some embodiments, the three or more light emitting mesas include at least a red light emitting mesa configured to emit red light, a green light emitting mesa configured to emit green light, and a blue light emitting mesa configured to emit blue light. For example, the first light emitting mesa 110 is a red light emitting mesa, the second light emitting mesa 120 is a green light emitting mesa, and the third light emitting mesa 130 is a blue light emitting mesa. In some embodiments, the first light emitting mesa 110 is a red light emitting mesa, the second light emitting mesa 120 is a blue light emitting mesa, and the third light emitting mesa 130 is a green light emitting mesa.

[0044] Those skilled in the art will appreciate that there are many other arrangements of these three or more light emitting mesas. The purpose of this arrangement is to allow each light emitting mesa to be connected to an electrode underneath itself without the need for an external panel. This allows the cross-sectional dimensions of the micro-LED pixel to be reduced. In some embodiments, the arrangement of three or more light emitting mesas forms a rectangular top surface. Thus, the micro-LED pixel provided by the embodiments of the present invention is convenient for assembling a micro-LED array panel with a large light emitting area.

[0045] It should be noted herein that relational terms such as "first" and "second" are used only to distinguish one entity or operation from another and do not require or imply an actual relationship or order between those entities or operations. Moreover, the terms "comprising," "having," "containing," "including," and the like are intended to be equivalent in meaning and open-ended in that the items following any one of these terms are not intended to be an exhaustive list of such items, nor are they intended to be limited to only the listed items.

[0046] As used herein, unless otherwise stated, the term "or" includes all possible combinations unless impracticable. For example, if it is stated that a database may include A or B, then the database may include A, or B, or A and B, unless otherwise stated or impracticable. As a second example, if it is stated that a database may include A, B, or C, then the database may include A, or B, or C, or A and B, or A and C, or B and C, or A and B and C, unless otherwise stated or impracticable.

[0047] In the foregoing specification, the embodiments have been described with reference to numerous specific details that may vary from implementation to implementation. Certain adaptations and modifications may be made to the described embodiments. Other embodiments will be apparent to those skilled in the art from consideration of the detailed description and practice of the invention disclosed herein. It is intended that the specification and examples be considered as exemplary only, with the true scope and spirit of the invention being indicated by the following claims. Additionally, the order of steps depicted in the figures is for illustrative purposes only and is not intended to be limiting to the particular order of steps. Thus, one skilled in the art will recognize that steps can be performed in different orders while performing the same method.

[0048] The drawings and specification disclose illustrative embodiments. However, these embodiments are susceptible to many variations and modifications. Thus, although specific terms are used, they are used in a generic and descriptive sense only and not for purposes of limitation.

Claims

1. a first light emitting mesa; a second light emitting mesa disposed on the first light emitting mesa; a third light emitting mesa provided on the second light emitting mesa; Including, At least a portion of the third light emitting mesa completely covers the second light emitting mesa, and the first light emitting mesa, the second light emitting mesa, and the third light emitting mesa are not in contact with each other.

2. 10. The micro LED pixel of claim 1 , wherein the first light emitting mesa is not covered by any portion of the second light emitting mesa.

3. 3. The micro LED pixel of claim 2, wherein the first light emitting mesa is not covered by any portion of the third light emitting mesa.

4. each of the first light emitting mesa, the second light emitting mesa, and the third light emitting mesa has a symmetric structure; a first vertical plane of symmetry along the length; A second vertical plane of symmetry along the width direction; and A vertical centerline which is an intersection line between the first vertical plane of symmetry and the second vertical plane of symmetry.

10. The micro LED pixel of claim 1 , characterized by:

5. 5. The micro LED pixel of claim 4, wherein a vertical centerline of the third light emitting mesa and a vertical centerline of the second light emitting mesa are misaligned.

6. 5. The micro LED pixel of claim 4, wherein neither the first nor the second vertical plane of symmetry of the third light emitting mesa is coplanar with the first and second vertical planes of symmetry of the second light emitting mesa.

7. 7. The micro LED pixel of claim 6, wherein the first vertical plane of symmetry of the third light emitting mesa is parallel to the first vertical plane of symmetry of the second light emitting mesa.

8. 5. The micro LED pixel of claim 4, wherein the first vertical plane of symmetry of the third light emitting mesa is coplanar with the first vertical plane of symmetry of the second light emitting mesa.

9. 10. The micro LED pixel of claim 1, further comprising an integrated circuit (IC) backplane, wherein a first bottom pad, a second bottom pad, and a third bottom pad are separately provided on the IC backplane and configured to connect with bottom electrodes of the first light emitting mesa, the second light emitting mesa, and the third light emitting mesa, respectively.

10. 10. The micro LED pixel of claim 9, further comprising a top conductive layer formed continuously on top surfaces of the first light emitting mesa, the second light emitting mesa, and the third light emitting mesa, the top conductive layer being configured to connect to top electrodes of the first light emitting mesa, the second light emitting mesa, and the third light emitting mesa.

11. 11. The micro LED pixel of claim 10, wherein the top conductive layer includes one or more recessed portions for connecting to the first light emitting mesa, the second light emitting mesa, and the third light emitting mesa, respectively.

12. 11. The micro LED pixel of claim 10, wherein the top conductive layer is transparent having a light transmittance of 70% or greater.

13. 11. The micro LED pixel of claim 10, further comprising a top contact structure disposed on said top conductive layer and configured to provide contact to said top conductive layer.

14. 14. The micro LED pixel of claim 13, wherein the top contact structure is provided around the periphery of the micro LED pixel.

15. 11. The micro LED pixel of claim 10, further comprising a light isolation structure formed around the periphery of the micro LED pixel.

16. 16. The micro LED pixel of claim 15, wherein the light isolation structure is reflective.

17. 17. The micro LED pixel of claim 16, wherein the material of the light isolation structure is a metal.

18. 20. The micro LED pixel of claim 17, wherein the optical isolation structure does not contact the top conductive layer, the first light emitting mesa, the second light emitting mesa, the third light emitting mesa, the bottom pad, or the IC backplane.

19. 16. The micro LED pixel of claim 15, further comprising a dielectric material filling a space within the micro LED pixel.

20. The dielectric material is silicon oxide, silicon nitride, SiCN, SiNO, or Al. ２ O ３ 20. The micro LED pixel of claim 19, wherein the pixel is selected from one of:

21. 20. The micro LED pixel of claim 19, wherein the dielectric material is transparent.

22. 10. The micro LED pixel of claim 1 , wherein an area of ​​a top surface of the first light emitting mesa is greater than an area of ​​a top surface of the second light emitting mesa and greater than an area of ​​a top surface of the third light emitting mesa.

23. 10. The micro LED pixel of claim 1 , wherein the first light emitting mesa is configured to emit red light, the second light emitting mesa is configured to emit green light, and the third light emitting mesa is configured to emit blue light.

24. 10. The micro LED pixel of claim 1 , wherein the first light emitting mesa is configured to emit red light, the second light emitting mesa is configured to emit blue light, and the third light emitting mesa is configured to emit green light.

25. 5. The micro LED pixel of claim 4, wherein a top surface of the first light emitting mesa, a top surface of the second light emitting mesa, and a top surface of the third light emitting mesa are rectangular.

26. 26. A micro LED array panel comprising a plurality of the micro LED pixels according to any one of claims 1 to 25, the plurality of micro LED pixels being arranged in an array.

27. 26. A method for manufacturing a micro LED display comprising the steps of: providing a micro LED pixel having a first surface and a second surface; the micro LED pixel further includes a top conductive layer continuously formed on a top surface of the first light emitting mesa, on a top surface of the second light emitting mesa, and on a top surface of the third light emitting mesa, and the top conductive layers of each of the plurality of micro LED pixels are interconnected.

28. 26. A method for manufacturing a micro LED display comprising the steps of: providing a micro LED pixel having a first surface and a second surface; 2. The micro LED array panel, wherein the micro LED pixels further include an integrated circuit (IC) backplane disposed at a bottom of the micro LED pixels, and the IC backplanes of each of the plurality of micro LED pixels are interconnected.

Images