Ultra-low temperature vitrified bond, preparation method therefor, ceramic diamond wheel including ultra-low temperature vitrified bond and preparation method therefor

The development of ultra-low temperature vitrified bonds with a sintering temperature of 400°C addresses the challenges of diamond oxidation and heavy metal contamination in existing technologies, enabling the production of ultra-fine abrasive ceramic diamond wheels with improved mechanical properties and grinding performance.

JP2025040919AActive Publication Date: 2025-03-25ZHENGZHOU RES INST FOR ABRASIVES & GRINDING CO LTD
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Patent Information

Application Number
JP2023214545
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-09-12
Filing Date
2023-12-20
Publication Date
2025-03-25
Estimated Expiration
2043-12-20

AI Technical Summary

Technical Problem

Current vitrified bonds for ultra-fine abrasive diamond wheels require high sintering temperatures, leading to oxidation of diamonds and inability to meet the sintering requirements for ultra-fine abrasive ceramic diamond wheels, while also containing harmful heavy metals.

Method used

Development of ultra-low temperature vitrified bonds with a sintering temperature as low as 400°C, composed of Bi2O3, B2O3, ZnO, SiO2, Li2O, TiO2, CaF2, and Y2O3, which maintains mechanical strength and allows for effective bonding and fixation before polymer pore forming agents and binders decompose.

Benefits of technology

The ultra-low temperature vitrified bonds prevent high-temperature oxidation of ultra-fine abrasive diamonds, enable the preparation of wheels with high porosity and controlled pore size, and provide good wettability and bond strength with diamonds, resulting in improved grinding performance and extended wheel life.

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Abstract

To provide an ultra-low temperature vitrified bond capable of having relatively high porosity and maintaining completeness of a tissue structure of pores by keeping a satisfactory mechanical strength, decreasing a sinter temperature to 400°C at a minimum, decreasing a softening point temperature of a bond to 320°C at a minimum and keeping actions of binding and fixing of a vitrified bond before burning down a polymer pore-forming agent and a polymer temporary binding agent.SOLUTION: An ultra-low temperature vitrified bond contains as components in mass percentage: Bi2O3 in 40 to 80%; B2O3 in 5 to 15%; ZnO in 10 to 35%; SiO2 in 0 to 5%; Li2O in 0.5 to 3%; TiO2 in 0 to 5%; CaF2 in 2 to 10%; and Y2O3 in 0 to 5%.SELECTED DRAWING: None
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