Biochip and manufacturing method thereof

Abstract

To provide a biochip and a manufacturing method in which the problem of overflow of a liquid specimen is avoided, and which can deal with a large amount of the liquid specimen.SOLUTION: A biochip comprises a substrate 110, an insulator layer IL, a semiconductor layer 120, a dielectric layer 130, a metal layer 140, and a protective layer 150. The semiconductor layer is disposed on the insulator layer, and has a reaction zone 121. The dielectric layer is disposed on the semiconductor layer, and has a first aperture O1. The metal layer is disposed on the dielectric layer, and has a source, a drain and a wall structure. The wall structure 141 surrounds the first aperture, the source and the drain. The protective layer is disposed on the metal layer, and has a flat part 151, a protruding part 152, a second aperture O2, and a third aperture O3. The flat part surrounds and defines the second aperture. The protruding part is disposed to correspond with the wall structure. The protruding part surrounds and defines the third aperture. The second aperture connects the third aperture and the first aperture, and allows the reaction zone to be exposed.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to a semiconductor chip and a method for manufacturing the same, and more particularly to a biochip and a method for manufacturing the same. [Background technology]

[0002] In general biochips, the space in which the test liquid can be placed is usually limited by the size of the reaction area, so if the amount of test liquid is too large or if the test liquid is added incorrectly, problems such as the test liquid overflowing can easily occur. Summary of the Invention [Problem to be solved by the invention]

[0003] The present invention provides a biochip that can avoid the problem of overflow of a test liquid and can handle a large amount of test liquid, and a manufacturing method thereof, so that when multiple reaction regions are arranged in a biochip, the reaction regions can be used to detect different types of biological substances, and there is no need to worry about the problem of cross-contamination caused by overflow of the test liquid between different reaction regions, thereby achieving the effect of simultaneously detecting multiple biological substances. [Means for solving the problem]

[0004] The biochip of the present invention may be configured to detect a biological material in a test liquid. The biochip includes a substrate, an insulating layer, a semiconductor layer, a dielectric layer, a metal layer, and a protective layer. The insulating layer is disposed on the substrate. The semiconductor layer is disposed on the insulating layer and has a reaction region. The dielectric layer is disposed on the semiconductor layer and has a first opening. The metal layer is disposed on the dielectric layer and includes a source, a drain, and a wall structure. The source and the drain are electrically connected to the semiconductor layer, respectively. The wall structure surrounds the first opening, the source, and the drain. The protective layer is disposed on the metal layer and has a flat portion, a protruding portion, a second opening, and a third opening. The flat portion surrounds and defines the second opening. The protruding portion is disposed corresponding to the wall structure, and the protruding portion surrounds and defines the third opening. The second opening connects the third opening and the first opening to expose the reaction region.

[0005] In one embodiment of the present invention, the source, drain and wall structures are separated from each other and the source and drain are electrically insulated from the wall structures.

[0006] In one embodiment of the invention, in a three-dimensional view of the biochip, the wall structure does not completely surround the first opening.

[0007] In one embodiment of the invention, in a three-dimensional view of the biochip, the wall structure completely surrounds the first opening.

[0008] In one embodiment of the present invention, the minimum distance between the wall structure and the source is between 0.1 micrometers and 5 micrometers.

[0009] In one embodiment of the present invention, in a three-dimensional view of the biochip, the third opening is larger than the second opening.

[0010] In one embodiment of the invention, the protrusion completely surrounds the first opening and the second opening.

[0011] In one embodiment of the present invention, the test liquid is placed in the first opening, and the upper surface of the test liquid is located between the upper surface of the protruding portion and the upper surface of the flat portion.

[0012] In one embodiment of the present invention, the metal layer further comprises a source extension pad and a drain extension pad, and the biochip further comprises a first transfer pad and a second transfer pad, the first transfer pad and the second transfer pad are respectively disposed on the insulating layer, the source is electrically connected to the source extension pad through the first transfer pad, and the drain is electrically connected to the drain extension pad through the second transfer pad.

[0013] The method for manufacturing a biochip of the present invention includes the following: A substrate is provided. An insulating layer is formed on the substrate. A semiconductor layer is formed on the insulating layer. The semiconductor layer has a reaction region. A dielectric layer is formed on the semiconductor layer. The dielectric layer has a first opening. A metal layer is formed on the dielectric layer. The metal layer includes a source, a drain, and a wall structure. The source and drain are electrically connected to the semiconductor layer, respectively, and the wall structure surrounds the first opening, the source, and the drain. A protective layer is formed on the metal layer. The protective layer has a flat portion, a protruding portion, a second opening, and a third opening. The flat portion surrounds and defines the second opening. The protruding portion is disposed corresponding to the wall structure, and the protruding portion surrounds and defines the third opening. The second opening connects the third opening and the first opening to expose the reaction region. Effect of the Invention

[0014] Based on the above, in the biochip and its manufacturing method according to the present invention, by setting the wall structure, the protrusion can be formed simultaneously with the formation of the protective layer, which has the effect of simplifying the process. Since the protrusion may be a closed pattern surrounding the first opening, the test liquid is limited within the third opening, and the test liquid can be prevented from overflowing outside the third opening. Compared with a general biochip, the biochip of the present invention can increase the volume of the biochip that can hold the test liquid by setting the third opening, thereby avoiding overflow of the test liquid, and can handle a large amount of test liquid, thereby improving the operating margin and convenience of the biochip. In this way, when a plurality of reaction regions are arranged in the biochip of the present invention, the reaction regions can be used to detect different types of biological substances, and there is no need to worry about the problem of cross-contamination due to the overflow of the test liquid between different reaction regions, and therefore the effect of simultaneously detecting a plurality of biological substances can be achieved.

[0015] In order to make the foregoing more easily understandable, several embodiments are described in detail below with reference to the drawings. [Brief description of the drawings]

[0016] The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification. The drawings illustrate exemplary embodiments of the invention and, together with the description, serve to explain the principles of the invention. [Figure 1] 1 is a schematic three-dimensional view of a method for producing a biochip according to an embodiment of the present invention. [Diagram 2] 1 is a schematic three-dimensional view of a method for producing a biochip according to an embodiment of the present invention. [Diagram 3] 1 is a schematic three-dimensional view of a method for producing a biochip according to an embodiment of the present invention. [Figure 4] 1 is a schematic three-dimensional view of a method for producing a biochip according to an embodiment of the present invention. [Diagram 5] FIG. 5 is a schematic cross-sectional view of the biochip of FIG. 4 taken along line II'. [Figure 6] 5 is a schematic cross-sectional view of the biochip of FIG. 4 taken along line II-II'. [Figure 7] 4 is a schematic three-dimensional view of a method for producing a biochip according to another embodiment of the present invention. FIG. [Figure 8] 4 is a schematic three-dimensional view of a method for producing a biochip according to another embodiment of the present invention. FIG. [Figure 9] 4 is a schematic three-dimensional view of a method for producing a biochip according to another embodiment of the present invention. FIG. [Figure 10] 4 is a schematic three-dimensional view of a method for producing a biochip according to another embodiment of the present invention. FIG. [Figure 11] 11 is a schematic cross-sectional view of the biochip of FIG. 10 taken along line III-III'. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Figures 1 to 4 are schematic three-dimensional diagrams of a method for producing a biochip according to an embodiment of the present invention. Figure 5 is a schematic cross-sectional view taken along the cutting line II-II' of the biochip in Figure 4. Figure 6 is a schematic cross-sectional view taken along the cutting line II-II' of the biochip in Figure 4. For clarity and ease of illustration, the semiconductor layer 120, metal layer 140, and test liquid 200 in the biochip 100 are omitted in Figure 4.

[0018] First, referring to FIG. 4 to FIG. 6, the biochip 100 of this embodiment may include a substrate 110, an insulating layer IL, a semiconductor layer 120, a dielectric layer 130, a metal layer 140, and a protective layer 150. The semiconductor layer 120 is disposed on the insulating layer IL and has a reaction region 121. The dielectric layer 130 is disposed on the semiconductor layer 120 and has a first opening O1. The metal layer 140 is disposed on the dielectric layer 130 and includes a source SD1, a drain SD2, and a wall structure 141. The source SD1 and the drain SD2 are electrically connected to the semiconductor layer 120, respectively. The wall structure 141 surrounds the first opening O1, the source SD1, and the drain SD2. The protective layer 150 is disposed on the metal layer 140 and has a flat portion 151, a protruding portion 152, a second opening O2, and a third opening O3. The flat portion 151 surrounds and defines the second opening O2. The protrusion 152 is disposed corresponding to the wall structure 141, and the protrusion 152 surrounds and defines the third opening O3. The second opening O2 connects the third opening O3 and the first opening O1, and exposes the reaction region 121. The biochip 100 of this embodiment may be configured to detect a biological material 210 in the test liquid 200.

[0019] Next, a method for manufacturing the biochip 100 of this embodiment will be described. The method for manufacturing the biochip 100 of this embodiment may include the following steps.

[0020] 1, a substrate 110 is provided. In this embodiment, the substrate 110 may be a silicon substrate or a silicon wafer. For example, the substrate 110 may be, but is not limited to, a P-type silicon substrate.

[0021] 1, an insulating layer IL is formed on the substrate 110. In this embodiment, the insulating layer IL is, for example, but not limited to, a gate oxide layer.

[0022] 1, a semiconductor layer 120 is formed on the insulating layer IL. In this embodiment, the semiconductor layer 120 has a reaction region 121, a source region 122, and a drain region 123. The reaction region 121 is located between the source region 122 and the drain region 123. In this embodiment, the material of the semiconductor layer 120 may include, but is not limited to, polysilicon or other suitable semiconductor material. In some embodiments, the semiconductor layer 120 may be considered as a channel in a transistor structure. Thus, when a threshold voltage of the semiconductor layer 120 is exceeded, the channel opens and current can flow.

[0023] In some embodiments, an identification portion (not shown) may be provided on the reaction region 121 of the semiconductor layer 120 to specifically identify and bind the biological material 210 in the test liquid 200. Specifically, one end of the identification portion may be connected to and fixed to the reaction region 121, and the other end of the identification portion may be used to recognize and bind the biological material 210. The identification portion may be a chemical molecule or a biological molecule. For example, the identification portion may be an antibody, an antigen, a nucleic acid, a carbohydrate, or a combination thereof, but is not limited thereto, as long as the identification portion can specifically recognize and bind the biological material 210.

[0024] 2, a dielectric layer 130 is formed on the semiconductor layer 120. The dielectric layer 130 has a first opening O1, an opening 131, and an opening 132. The first opening O1 can expose a portion of the reaction region 121 and the insulating layer IL, and the first opening O1 has a sidewall O11. The opening 131 can expose a portion of the source region 122, and the opening 132 can expose a portion of the drain region 123.

[0025] 3, a metal layer 140 is formed on the dielectric layer 130. In this embodiment, the metal layer 140 may cover a portion of the dielectric layer 130 and expose another portion of the dielectric layer 130. The metal layer 140 may include a source SD1, a drain SD2, and a wall structure 141. The source SD1 may be disposed on the dielectric layer 130 and in the opening 131, and the drain SD2 may be disposed on the dielectric layer 130 and in the opening 131. In this way, the source SD1 and the drain SD2 may be electrically connected to the source region 122 and the drain region 123 of the semiconductor layer 120, respectively. The source SD1, the drain SD2, and the wall structure 141 are disposed on the same layer, and the source SD1, the drain SD2, and the wall structure 141 are physically separated from each other. The source SD1 and the drain SD2 are electrically isolated from the wall structure 141.

[0026] In this embodiment, in the three-dimensional view of the biochip 100, the wall structure 141 may surround the first opening O1, the source SD1, and the drain SD2, and the wall structure 141 may not completely surround the first opening O1. Specifically, in this embodiment, the wall structure 141 may include a first portion 1411 and a second portion 1412. The first portion 1411 has end points P1 and P2, and the second portion 1412 has end points P3 and P4. There is a minimum distance G1 between the end point P1 and the source SD1, between the end point P3 and the source SD1, between the end point P2 and the drain SD2, and between the end point P4 and the drain SD2. The minimum distance G1 may be, for example, 0.1 micrometers (μm) to 5 micrometers, and the minimum distance G1 may be filled and laminated as a part of the protrusion 152 by the subsequently formed protection layer 150, but is not limited thereto. If the minimum distance G1 is less than 0.1 micrometers, there is a risk of a short circuit or bridge connection between the wall structure 141 and the source SD1 (or drain SD2). If the minimum distance G1 exceeds 5 μm, the protective layer formed later cannot fill the gap, and a notch may occur in the annular protrusion 152. For example, when the thickness T1 of the protective layer 150 is 1 micrometer, the minimum distance G1 is 1.2 micrometers, and the protective layer 150 formed later can fill the minimum distance G1. In addition, in this embodiment, the outer shape of the first portion 1411 and the second portion 1412 is U-shaped, but is not limited thereto.

[0027] Next, referring to FIG. 4 to FIG. 6, a protective layer 150 is formed on the metal layer 140. In this embodiment, the protective layer 150 has a flat portion 151, a protruding portion 152, a second opening O2, and a third opening O3. The flat portion 151 may cover other parts of the dielectric layer 130 exposed by the metal layer 140, and the flat portion 151 may be disposed adjacent to the metal layer 140. The flat portion 151 surrounds and defines the second opening O2. The flat portion 151 has an upper surface 1511 facing away from the dielectric layer 130. In this embodiment, a thickness T1 of the protective layer 150 may be, for example, 1 micrometer to 3 micrometers, but is not limited thereto.

[0028] The second opening O2 may connect the third opening O3 and the first opening O1 to expose the reaction region 121. The second opening O2 may correspond to and overlap the first opening O1 in the normal direction Z of the substrate 110. The second opening O2 has a sidewall O21. The sidewall O21 of the second opening O2 may be substantially flush with the sidewall O11 of the first opening O1, but is not limited thereto.

[0029] The protrusion 152 may be disposed on the metal layer 140 and the flat portion 151, and the protrusion 152 may be disposed to correspond to and overlap the wall structure 141, the source SD1, and the drain SD2 in the normal direction Z of the substrate 110. The protrusion 152 may surround and define the third opening O3, and the protrusion 152 may be disposed to form the third opening O3. The protrusion 152 may completely surround the first opening O1 and the second opening O2. The protrusion 152 has an upper surface 1521 facing away from the metal layer 140. In the normal direction Z of the substrate 110, the upper surface 1521 of the protrusion 152 may be higher than the upper surface 1511 of the flat portion 151.

[0030] In some embodiments, the protrusion 152 can be considered as a continuous three-dimensional structure in which the protective layer 150 protrudes from the metal top surface 142 (i.e., the surface of the metal layer 140 opposite the dielectric layer 130) in a direction away from the metal layer 140. The layer 140 is continuous and continuous in a direction away from the metal layer 140. In some embodiments, in a top view of the biochip 100, the shape of the protrusion 152 can be considered as a closed, unnotched ring to prevent the test liquid 200 from leaking out.

[0031] The third opening O3 may be connected to the second opening O2, and the third opening O3 may correspond to and overlap the second opening O2 in the normal direction Z of the substrate 110. The third opening O3 has a sidewall O31. The sidewall O31 of the third opening O3 is not flush with the sidewall O21 of the second opening O2. Furthermore, in the three-dimensional view of the biochip 100, the third opening O3 may be larger than the first opening O1, the second opening O2, and the reaction region 121.

[0032] 5 and 6, the test liquid 200 may include a biological material 210 and a liquid 220. The test liquid 200 may include a body fluid such as serum, and the biological material 210 may include, but is not limited to, a microorganism or a biomolecule. Examples of the microorganism include bacteria, viruses, or a combination thereof, and examples of the biomolecule include, but are not limited to, nucleic acids (including deoxyribonucleic acid, ribonucleic acid, or a combination thereof), nucleotides, proteins, carbohydrates, lipids, or a combination thereof.

[0033] In this embodiment, the test liquid 200 may be disposed in the first opening O1, the second opening O2, and the third opening O3, and the upper surface 200a of the test liquid 200 may cover the upper surface 1511 of the flat portion 151 in the third opening O3. In the normal direction Z of the substrate 110, the upper surface 200a of the test liquid 200 may be higher than the upper surface 1511 of the flat portion 151, and the upper surface 200a of the test liquid 200 may be between the upper surface 1521 of the protruding portion 152 and the upper surface 1511 of the flat portion 151.

[0034] In this embodiment, by setting the wall structure 141, the protrusion 152 can be formed simultaneously with the formation of the protective layer 150, so that no additional process is required to manufacture the protrusion 152 used to form the third opening O3, which has the effect of simplifying the process.

[0035] In this embodiment, since the wall structure 141 can surround the first opening O1, the source SD1, and the drain SD2, the protrusion 152 installed on the upper part of the wall structure 141 may be a closed pattern (e.g., a closed rectangle) surrounding the first opening O1, thereby confining the test liquid 200 within the third opening O3 and preventing the test liquid 200 from overflowing outside the third opening O3, as shown in Figures 5 and 6. For example, when the test liquid 200 added to the first opening O1 exceeds the second opening O2 (or when the upper surface 200a of the test liquid 200 added to the first opening O1 is higher than the upper surface 1511 of the flat part 151), the setting of the protrusion 152 can confine the test liquid 200 within the third opening O3 and prevent the test liquid 200 from overflowing, thereby preventing the test liquid 200 from overflowing into another adjacent reaction area and interfering with the results of another biological material. Therefore, in the biochip 100 of this embodiment, the volume of the biochip 100 that can hold the test liquid 200 can be increased by setting the third opening O3, compared to a general biochip, and this allows it to handle a larger amount of the test liquid 200, improving the operating margin and convenience of the biochip 100. In this way, in the biochip 100 of this embodiment, multiple reaction regions can be arranged to simultaneously detect different biological substances, and there is no need to worry about the problem of cross-contamination due to the overflow of the test liquid between different reaction regions, and therefore the effect of simultaneously detecting multiple biological substances can be achieved.

[0036] Other embodiments are listed below for explanation. Please note that in the following embodiments, the symbols and some contents of the above-mentioned embodiments are continued to be used, the same symbols are used to indicate the same or similar components, and the description of the same technical contents is omitted. For the description of the omitted parts, please refer to the above-mentioned embodiments, and they will not be repeated in the following embodiments.

[0037] 7 to 10 are schematic three-dimensional views of a method for manufacturing a biochip according to another embodiment of the present invention. Fig. 11 is a schematic cross-sectional view taken along the line III-III' of the biochip in Fig. 10. For clarity and ease of illustration, Fig. 10 omits the semiconductor layer 120, the first transfer pad 120a, the second transfer pad 120b, the metal layer 140a, and the test liquid 200 in the biochip 100a.

[0038] 1 to 6 and 7 to 11 together, the biochip 100a of this embodiment is similar to the biochip 100 of Figures 1 to 6, so that the components of this embodiment that are the same or similar to those of the embodiment of Figures 1 to 6 can be implemented using the same materials or methods. Therefore, the same and similar descriptions in the two embodiments will not be repeated below, and the focus will be mainly on the differences between the two embodiments.

[0039] Specifically, the method for producing the biochip 100a of this embodiment may include the following steps.

[0040] First, referring to Fig. 7, a substrate 110 is provided, and a semiconductor layer 120, a first transfer pad 120a, and a second transfer pad 120b are formed on an insulating layer IL. The semiconductor layer 120, the first transfer pad 120a, and the second transfer pad 120b are disposed in the same layer, and the semiconductor layer 120, the first transfer pad 120a, and the second transfer pad 120b are physically separated from each other. In this embodiment, the material of the first transfer pad 120a and the second transfer pad 120b may include, but is not limited to, polysilicon or other suitable semiconductor materials.

[0041] 8, a dielectric layer 130a is formed on the semiconductor layer 120, the first transfer pad 120a, and the second transfer pad 120b. The dielectric layer 130a has a first opening O1, an opening 131, an opening 132, an opening 133, an opening 134, an opening 135, and an opening 136. The openings 133 and 134 can expose different portions of the first transfer pad 120a, respectively, and the openings 135 and 136 can expose different portions of the second transfer pad 120b, respectively.

[0042] Next, referring to FIG. 9, a metal layer 140a is formed on the dielectric layer 130a. In this embodiment, the metal layer 140a may include a source SD1, a drain SD2, a wall structure 141a, a source extension pad SD1a, and a drain extension pad SD1a. The source SD1 may be disposed on the dielectric layer 130a and in the openings 134 and 131, so that the source SD1 can be electrically connected to the first transfer pad 120a and the source region 122 of the semiconductor layer 120, respectively. The source extension pad SD1a may be disposed on the dielectric layer 130a and in the openings 133, so that the source extension pad SD1a can be electrically connected to the first transfer pad 120a. The drain SD2 may be disposed on the dielectric layer 130a and in the openings 132 and 135, so that the drain SD2 can be electrically connected to the drain region 123 and the second transfer pad 120b of the semiconductor layer 120, respectively. The drain extension pad SD2a may be disposed on the dielectric layer 130a and in the opening 136, such that the drain extension pad SD2a can be electrically connected to the second transfer pad 120b. That is, the source SD1 can be electrically connected to the source extension pad SD1a through the first transfer pad 120a, and the drain SD2 can be electrically connected to the drain extension pad SD2a through the second transfer pad 120b.

[0043] In this embodiment, in the three-dimensional view of the biochip 100, the wall structure 141a may completely surround the first opening O1. There is a minimum distance G2 between the wall structure 141a and the source SD1, between the wall structure 141a and the source extension pad SD1a, between the wall structure 141a and the drain SD2, and between the wall structure 141a and the drain extension pad SD2a. The minimum distance G2 may be, for example, greater than 0 micrometers, but is not limited thereto. Furthermore, in this embodiment, the outer shape of the wall structure 141a is rectangular, but is not limited thereto.

[0044] 10 and 11, a protective layer 150 is formed on the metal layer 140a. In this embodiment, the protective layer 150 has a flat portion 151, a protruding portion 152a, a second opening O2, and a third opening O3. The protruding portion 152a may be disposed in correspondence with the wall structure 141a, the source SD1, the drain SD2, the source extension pad SD1a, and the drain extension pad SD2a in the normal direction Z of the substrate 110. The protruding portion 152a may surround and define the third opening O3, and the protruding portion 152a may be disposed to form the third opening O3. The protruding portion 152a may completely surround the first opening O1 and the second opening O2.

[0045] In the biochip 100a of this embodiment, the wall structure 141a is a closed ring-shaped structure without a notch, so that the protrusion 152a of the protective layer 150 formed on the wall structure 141a is also guaranteed to be a closed ring-shaped structure without a notch.

[0046] In the biochip 100a of this embodiment, the source SD1 and the drain SD2 need to transmit and receive signals through the first transfer pad 120a and the second transfer pad 120b, respectively, which attenuates the signal strength. In contrast, the source SD1 and the drain SD2 of the biochip 100 shown in Figures 1 to 6 do not need to transmit and receive signals through the transfer pad settings, which avoids the risk of signal attenuation.

[0047] In summary, in the biochip and its manufacturing method according to the present invention, by setting the wall structure, the protrusion can be formed simultaneously with the formation of the protective layer, which has the effect of simplifying the process. Since the protrusion may be a closed pattern surrounding the first opening, the test liquid is limited within the third opening, and the test liquid can be prevented from overflowing outside the third opening. Compared with a general biochip, the biochip of the present invention can increase the volume of the biochip that can hold the test liquid by setting the third opening, so that the overflow of the test liquid can be avoided, a large amount of the test liquid can be handled, and the operating margin and convenience of the biochip can be improved. In this way, when a plurality of reaction regions are arranged in the biochip of the present invention, the reaction regions can be used to detect different types of biological substances, and there is no need to worry about the problem of cross-contamination due to the overflow of the test liquid between different reaction regions, and therefore the effect of simultaneously detecting a plurality of biological substances can be achieved.

[0048] It will be apparent to one skilled in the art that various modifications and variations can be made to the disclosed embodiments without departing from the scope or spirit of the invention. In view of the above, it is intended that the present invention cover modifications and variations provided they come within the scope of the following claims and their equivalents. [Industrial Applicability]

[0049] The biochip and method for producing the same of the present invention can avoid the problem of overflow of test liquid, and can simultaneously detect a plurality of biological substances while accommodating a large amount of test liquid. [Explanation of symbols]

[0050] 100: Biochips 110: Circuit board 120: Semiconductor layer 121: Reaction region 130: Dielectric layer 140: Metal layer 141: Wall structure 142, 1511, 1521, 200a: Top surface 150: Protective layer 151: Flat area 152: Protrusion 200: Test liquid 210: Biological materials 220: Liquid IL: Insulating layer O1: First opening O11, O21, O31: Side wall O2: Second opening O3: Third opening T1: Thickness Z: Normal direction

Claims

1. A biochip configured to detect a biological substance in a test liquid, comprising: A substrate; an insulating layer disposed on the substrate; a semiconductor layer disposed on the insulating layer and having a reaction region; a dielectric layer disposed on the semiconductor layer and having a first opening; disposed on the dielectric layer; a source and a drain, each electrically connected to the semiconductor layer; a wall structure surrounding the first opening, the source, and the drain; a protective layer disposed on the metal layer, the protective layer having a flat portion, a protruding portion, a second opening, and a third opening; A metal layer comprising: Equipped with the flat portion defines the second opening, the protrusion is disposed in correspondence with the wall structure, and the protrusion defines the third opening, the second opening connects the third opening and the first opening to expose the reaction region; Biochip.

2. the source, the drain, and the wall structure are isolated from each other, and the source and the drain are electrically insulated from the wall structure; The biochip of claim 1 .

3. In a three-dimensional view of the biochip, the wall structure does not completely surround the first opening. The biochip of claim 1 .

4. In a three-dimensional view of the biochip, the wall structure completely surrounds the first opening. The biochip of claim 1 .

5. the minimum distance between the wall structure and the source is between 0.1 micrometers and 5 micrometers; The biochip of claim 1 .

6. In a three-dimensional view of the biochip, the third opening is larger than the second opening. The biochip of claim 1 .

7. The protrusion completely surrounds the first opening and the second opening. The biochip of claim 1 .

8. The test liquid is placed in the first opening, and an upper surface of the test liquid is located between an upper surface of the protruding portion and an upper surface of the flat portion. The biochip of claim 1 .

9. the metal layer further comprises a source extension pad and a drain extension pad; The biochip comprises: a first transfer pad and a second transfer pad respectively disposed on the insulating layer; the source is electrically connected to the source extension pad via the first transfer pad, and the drain is electrically connected to the drain extension pad via the second transfer pad; The biochip of claim 1 .

10. 1. A method for manufacturing a biochip configured to detect a biological substance in a test liquid, comprising the steps of: Providing a substrate; forming an insulating layer on the substrate; forming a semiconductor layer having a reaction region on the insulating layer; forming a dielectric layer having a first opening over a semiconductor layer; a source and a drain, each electrically connected to the semiconductor layer; a wall structure surrounding the first opening, the source, and the drain; forming a metal layer on the dielectric layer comprising: forming a protective layer on the metal layer, the protective layer having a flat portion, a protruding portion, a second opening, and a third opening; Equipped with the flat portion defines the second opening, the protrusion is disposed in correspondence with the wall structure, and the protrusion defines the third opening, the second opening connects the third opening and the first opening to expose the reaction region; A method for producing a biochip.

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