Plate thickness change measurement method and plate thickness change measurement system

Abstract

To provide a plate thickness change measurement method for measuring thickness changes such as thinning and material changes in a measurement object over a wide range in a short period of time.SOLUTION: A plate thickness change measurement method includes: a moving step of moving a temperature control device that changes a surface temperature of a measurement object relative to the measurement object; an imaging step of photographing the changes in the surface temperature of the measurement object caused by changing the surface temperature of the measurement object as a thermal image using a thermal image photographing device that photographs the surface temperature of the measurement object; and a detection step of measuring a difference in temperature distribution or temperature gradient of the measurement object in the thermal image and detecting a position showing the difference as a plate thickness change estimated position.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] An embodiment of the present invention relates to a plate thickness change measuring method and a plate thickness change measuring system. [Background technology]

[0002] Non-combustible miscellaneous solid waste, which is a type of solid waste, is required to be packed into, for example, 200-liter steel drums and stored in solid waste storage facilities. Since drums used to store non-combustible miscellaneous solid waste can corrode, inspectors visually inspect the thickness of each drum.

[0003] This visual inspection requires detailed knowledge to find material changes such as rust and thinning such as dirt and paint peeling that resemble corrosion on the surface of drums, but the number of inspectors with this knowledge is on the decline. Meanwhile, the amount of non-combustible miscellaneous waste is on the rise. Therefore, in order to reduce the burden of storage management work on inspectors, there is a demand for the establishment of technology to automatically measure changes in plate thickness such as thinning and material changes in drums. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2022-58782 A Summary of the Invention [Problem to be solved by the invention]

[0005] Apart from conventional visual inspection, ultrasonic testing (UT) is a method for measuring thinning and material changes on the surface of objects such as drums. This is a non-destructive technology that can check the soundness of the surface and inside of an object, and by measuring the propagation time of ultrasonic waves inside the object, it is possible to calculate the plate thickness of a known material. However, since the probe used in ultrasonic testing is very small compared to the object being measured, the measurement range for one inspection is narrow, and there was an issue that it took a long time to measure the entire area of ​​the object being measured.

[0006] In addition, there is a conventional method for inspecting the inside of a measured object by acquiring thermal images using an infrared camera to estimate abnormalities. This method mainly targets concrete and detects cavities that function as a heat insulating layer inside the measured object, and enables a wide range of evaluation of the inside of the measured object using the acquired thermal images. However, a technology for inspecting changes in plate thickness, such as thinning or material changes, that exist on the surface of the measured object has not yet been developed.

[0007] Therefore, the problem to be solved by the present invention is to propose a plate thickness change measurement method and a plate thickness change measurement system that measure plate thickness changes such as thinning and material changes in a measured object over a wide range and in a short period of time. [Means for solving the problem]

[0008] In order to achieve the above object, the plate thickness change measuring method of the embodiment is characterized by having a moving step of moving a temperature control device that changes the surface temperature of the object to be measured relative to the object to be measured, an imaging step of capturing the change in surface temperature of the object to be measured caused by changing the surface temperature of the object to be measured as a thermal image using a thermal image capturing device that captures the surface temperature of the object to be measured, and a detection step of measuring a difference in temperature distribution or temperature gradient of the object to be measured in the thermal image and detecting a position showing this difference as an estimated position of plate thickness change.

[0009] In order to achieve the above object, the plate thickness change measurement system of the embodiment is characterized by comprising a temperature control device that moves relative to the object to be measured to change the surface temperature of the object to be measured, and a thermal image capture device that captures the surface temperature change of the object to be measured that occurs by moving the temperature control device relative to the object to be measured as a thermal image, measures the difference in temperature distribution or temperature gradient of the object to be measured in the thermal image, and detects the position showing this difference as an estimated position of plate thickness change. Effect of the Invention

[0010] The embodiments of the present invention have been made to solve the above-mentioned problems, and are capable of measuring changes in plate thickness of an object to be measured over a wide range in a short period of time. [Brief description of the drawings]

[0011] [Figure 1] 1 is a schematic diagram showing an example of a plate thickness change measurement system, (a) is a configuration diagram showing an example of the plate thickness change measurement system, (b) is an explanatory diagram showing an example of a thermal image that can be captured by the plate thickness change measurement system, and (c) is a process explanatory diagram showing an example of a plate thickness change measurement method based on the progression of a thermal image that can be captured by the plate thickness change measurement system. [Diagram 2] FIG. 1 is a schematic diagram showing an example of a plate thickness change measurement system; (a) is a configuration diagram showing an example of the plate thickness change measurement system; (b) is an explanatory diagram showing an example of a thermal image that can be captured by the plate thickness change measurement system; and (c) is a process explanatory diagram showing an example of a plate thickness change measurement method based on the progression of a thermal image that can be captured by the plate thickness change measurement system. [Diagram 3] FIG. 1 is a schematic diagram showing an example of a plate thickness change measurement system; (a) is a configuration diagram showing an example of the plate thickness change measurement system; (b) is an explanatory diagram showing an example of a thermal image that can be captured by the plate thickness change measurement system; and (c) is a process explanatory diagram showing an example of a plate thickness change measurement method based on the progression of a thermal image that can be captured by the plate thickness change measurement system. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, a plate thickness change measurement system and a plate thickness change measurement method according to an embodiment of the present invention will be described in detail with reference to the drawings. Note that the embodiments shown below are illustrative of the embodiments of the present invention and are not intended to limit the scope of the invention. In addition, in the drawings referred to in the embodiments, the same parts or parts having similar functions are given the same or similar symbols, and their descriptions may be omitted. In addition, the dimensional ratios of the drawings may differ from the actual ratios, or part of the configuration may be omitted from the drawings.

[0013] First Embodiment A plate thickness change measurement system 1 according to a first embodiment will be described with reference to Fig. 1. Fig. 1 is a schematic diagram showing an example of the plate thickness change measurement system 1, in which (a) is a configuration diagram showing an example of the plate thickness change measurement system 1, (b) is a diagram showing an example of a thermal image that can be captured by the plate thickness change measurement system 1, and (c) is a process explanatory diagram showing an example of a plate thickness change measurement method based on the transition of a thermal image that can be captured by the plate thickness change measurement system 1.

[0014] The plate thickness change measurement system 1 in FIG. 1( a ) is a system that detects a plate thickness change portion 3 by measuring the plate thickness of a measurement object 2 , and uses a temperature control device 4 and a thermal image shooting device 5 .

[0015] The object to be measured 2 is an object to be measured by the thickness change measurement system 1. The object to be measured 2 may be anything that at least exhibits a temperature change, and may be of any material or thickness. The object to be measured 2 may have a thickness change portion 3 on its inner or outer surface. The thickness change portion 3 here refers to a portion where the thickness of the object to be measured 2 has changed due to thinning or material change. Thinning here refers to a physical decrease in the thickness of the object to be measured 2, and examples of such changes include erosion by fluids, scraping due to collision with solids, corrosion and erosion, and mechanical wear during operation. Material change here refers to a chemical change or state change near the surface of the object to be measured 2, and examples of such changes include rust on metal structures and re-formation of a passive film after destruction.

[0016] For example, the object to be measured 2 may be a drum for storing non-combustible miscellaneous solid waste, or a structure or pipe within a power generation plant where at least the plate thickness condition needs to be inspected, but is not limited to these, as long as it does not deviate from the gist of the invention.

[0017] The temperature control device 4 is a device or substance that is placed around the object to be measured 2 and changes the temperature of the object to be measured 2. The temperature change here refers to a temperature increase due to heating or a temperature decrease due to cooling, and the temperature increase or decrease may be continuous or instantaneous. The temperature control device 4 moves relative to the object to be measured 2, changing the temperature at the point where the temperature control device 4 and the object to be measured 2 are in contact or close to each other, thereby controlling the temperature of the object to be measured 2 to a desired value.

[0018] Relative movement here refers to the movement of the relative position of the temperature control device 4 with respect to the object to be measured 2, for example, the movement of the relative position that accompanies the movement of the temperature control device 4 when the object to be measured 2 is fixed, the movement of the relative position that accompanies the movement of the object to be measured 2 when the temperature control device 4 is fixed, and the movement of the relative position that accompanies the movement of both the object to be measured 2 and the temperature control device 4.

[0019] For example, the temperature control device 4 is a dielectric heating coil. When a current is passed through the dielectric heating coil, an eddy current is generated in the conductive object 2 to be measured. When an eddy current is generated in the object 2 to be measured, Joule heat is generated due to the electrical resistance between the eddy current and the object 2 to be measured, and the object 2 to be measured is heated. By moving this dielectric heating coil relative to the object 2 to be measured, the portion of the object 2 to which the dielectric heating coil is close is heated.

[0020] In the plate thickness change measurement system 1 of this embodiment, the temperature control device 4 is exemplified as a dielectric heating coil, but the temperature control device 4 need only be capable of changing the temperature of the object to be measured 2, and may also be a gas, liquid, solid, plasma, etc. that can change the temperature within the scope of the gist of the invention.

[0021] For example, a light source such as a laser or a flash lamp may be used in the temperature control device 4, and the object 2 may be heated by the radiant energy generated when the light source irradiates the object 2 with light.

[0022] In addition, for example, a temperature control element such as a Peltier element may be used in the temperature control device 4, and the cooling surface or heating surface of the electronically temperature-controlled element may be brought into contact with or close to the object to be measured 2, thereby cooling or heating the object to be measured 2.

[0023] Furthermore, for example, a reactive material such as a cooling spray may be used in the temperature control device 4 to heat or cool the object 2 to be measured by an exothermic or endothermic reaction caused by a chemical reaction, a state change, or the like.

[0024] Furthermore, for example, a different temperature body such as water vapor, water, ice, or a high-temperature metal solid may be used in the temperature control device 4 to heat or cool the object to be measured 2 by heat transfer caused by bringing a substance having a different temperature from the object to be measured 2 into contact with or close to the object to be measured 2.

[0025] The temperature control device 4 may be controlled by a control device (not shown) to move relative to the object to be measured 2, thereby changing the temperature of the object to be measured 2.

[0026] The thermal imager 5 is disposed at a distance from the object 2. The thermal imager 5 forms an image of the infrared energy radiated from the object 2 on an infrared detection element, and converts the electrically converted value into temperature through arithmetic processing, thereby capturing a thermal image 6 (see FIG. 1(b)).

[0027] The thermal image photographing device 5 measures the difference in temperature distribution or temperature gradient of the object 2 based on the captured thermal image 6. The thermal image photographing device 5 is only required to be able to capture at least the thermal image 6, and the quality performance and main body performance of the thermal image photographing device 5 are not important within the scope of the gist of the invention.

[0028] In addition, the thermal image photographing device 5 may be controlled by a control device (not shown) to photograph the object to be measured 2 heated by the temperature control device 4, and may also move relative to the object to be measured 2 together with the temperature control device 4 when photographing, and photograph the object to be measured 2 heated by the temperature control device 4.

[0029] 1(c), an example of a plate thickness change measuring method based on the transition of a thermal image 6 that can be captured by the plate thickness change measuring system 1 will be described. In the plate thickness change measuring method of this embodiment, a moving step of moving a temperature control device 4 that changes the surface temperature of the object 2 to be measured relative to the object 2, a photographing step of photographing the surface temperature of the object 2 to be measured, which is caused by changing the surface temperature of the object 2, as a thermal image 6 by a thermal image photographing device 5 that photographs the surface temperature of the object 2, and a detecting step of measuring the difference in temperature distribution or temperature gradient of the object 2 to be measured in the thermal image 6 and detecting the position showing this difference as an estimated plate thickness change position 7 are sequentially performed.

[0030] 1(c)(1), a temperature control device 4 moves relative to an object 2 to be measured (from top to bottom in the figure) to heat the object 2. A thermal image capturing device 5 captures the heated object 2 as a thermal image 6. If a thickness-changing portion 3 does not exist in the area through which the temperature control device 4 has passed, no difference in temperature in the object 2 to be measured will be detected in the thermal image 6.

[0031] On the other hand, when a thickness-changing portion 3 is present in the area passed by the temperature control device 4 as shown in FIG. 1(c)(2), a change in the temperature characteristics of the object 2 to be measured occurs due to the thickness-changing portion 3, and an estimated thickness-changing position 7 showing a different temperature from the surrounding area is detected in the thermal image 6.

[0032] Furthermore, as shown in FIG. 1(c)(3), the temperature change in the object 2 continues even after the temperature control device 4 has passed, so that a temperature transition different from the surrounding area can be seen at the plate thickness change estimation position 7 in the thermal image 6.

[0033] According to the plate thickness change measurement system 1 of this embodiment, a temperature control device 4 that changes the surface temperature of the object to be measured 2 and a thermal image capture device 5 that captures the surface temperature of the object to be measured 2 are used, and the change in the surface temperature of the object to be measured 2 that occurs when the temperature control device 4 is moved relative to the object to be measured 2 is captured as a thermal image 6 using the thermal image capture device 5.Based on the thermal image 6, a position that shows a temperature distribution or temperature gradient different from the surrounding area can be defined as an estimated plate thickness change position 7, and a plate thickness change portion 3 such as thinning or a material change can be detected.

[0034] As a result, in conventional inspections of plate-like structures, inspectors visually inspected the plate-like structures to determine whether there was any thinning or change in material, but in the inspection of plate-like structures of this embodiment, plate thickness measurements can be performed automatically over a wide area or in large quantities, so that the presence or absence of thinning or change in material can be detected in a short time. In addition, since the inspection is performed automatically and not by the ability of an inspector, the inspection standards can be unified.

[0035] Second Embodiment The plate thickness change measurement system 10 according to the second embodiment will be described below with reference to Fig. 2. Fig. 2 is a schematic diagram showing an example of the plate thickness change measurement system 10, (a) is a configuration diagram showing an example of the plate thickness change measurement system 10, (b) is an explanatory diagram showing an example of a thermal image that can be captured by the plate thickness change measurement system 10, and (c) is a process explanatory diagram showing an example of a plate thickness change measurement method based on the transition of a thermal image that can be captured by the plate thickness change measurement system 10. Note that, hereinafter, only the points different from the first embodiment will be described, and the other points will be assigned the same reference numerals as those in the first embodiment, and the description thereof may be omitted.

[0036] 2(a) uses a temperature control device 4, a thermal image capturing device 5, and a wide-range temperature control device 11. That is, the second embodiment differs from the first embodiment in that the wide-range temperature control device 11 is further used.

[0037] The wide-range temperature control device 11 is disposed at a position facing the temperature control device 4 with respect to the object to be measured 2. The position facing the temperature control device 4 with respect to the object to be measured 2 here refers to a position where the temperature change of the entire object to be measured 2, including the places where the temperature control device 4 comes into contact or approaches, can be controlled from the inner or outer surface of the object to be measured 2. The wide-range temperature control device 11 is a device or substance that changes the temperature of the entire object to be measured 2, and is used together with the temperature control device 4. The use together with the temperature control device 4 here refers to the relationship that when a device or substance that heats the object to be measured 2 from the surroundings is used for the temperature control device 4, a device or substance that cools the object to be measured 2 as a whole is used for the wide-range temperature control device 11, and when a device or substance that cools the object to be measured 2 from the surroundings is used for the temperature control device 4, a device or substance that heats the object to be measured 2 as a whole is used for the wide-range temperature control device 11.

[0038] For example, the wide-area temperature control device 11 may be a wide-area temperature control body such as a thermal tape attached to the inner surface of the object to be measured 2, a high-temperature fluid such as steam flowing inside the object to be measured 2, or a low-temperature fluid such as ice or low-temperature gas, and these will all be referred to as wide-area temperature control devices 11.

[0039] In the plate thickness change measurement system 10 of this embodiment, the wide-range temperature control device 11 is illustrated as being arranged on the inner surface side of the object to be measured 2, but it is sufficient that the wide-range temperature control device 11 is capable of at least changing the temperature of the entire object to be measured 2, and within the scope of the gist of the invention, for example, the wide-range temperature control device 11 may heat the entire object to be measured 2 from the outer surface side using a hot plate, light such as sunlight or irradiation, microwaves, etc., and the wide-range temperature control device 11 may cool the entire object to be measured 2 from the outer surface side using a refrigerator, freezer, fan, etc.

[0040] The wide-range temperature control device 11 may be controlled by a control device (not shown) to change the temperature of the entire object to be measured 2.

[0041] Here, an example of a plate thickness change measuring method based on the transition of a thermal image 12 that can be captured by the plate thickness change measuring system 10 will be described with reference to the process diagram of Fig. 2(c). In the plate thickness change measuring method of this embodiment, an entire temperature control step in which the wide-area temperature control device 11 changes the temperature of the entire object 2 from a position facing the temperature control device 4 with respect to the object 2, a movement step in which the temperature control device 4 that changes the surface temperature of the object 2 is moved relative to the object 2, a photographing step in which the surface temperature change of the object 2 caused by changing the surface temperature of the object 2 is photographed as a thermal image 12 by the thermal image photographing device 5 that photographs the surface temperature of the object 2, and a detection step in which the difference in temperature distribution or temperature gradient of the object 2 is measured in the thermal image 12 and the position showing this difference is detected as the plate thickness change estimated position 13 are sequentially performed.

[0042] 2(c)(1), a wide-area temperature control device 11 cools the entire object 2 from a position facing the temperature control device 4 relative to the object 2. The temperature control device 4 moves relatively around the object 2 (from top to bottom in the figure) to heat the object 2. A thermal image capture device 5 captures the heated object 2 as a thermal image 12. If there is no thickness change portion 3 in the area passed by the temperature control device 4, no difference in temperature distribution will be detected in the thermal image 12.

[0043] On the other hand, when a thickness change portion 3 exists in the area through which the temperature control device 4 has passed as shown in Fig. 2(c)(2), a change occurs in the temperature characteristics of the object 2 due to the thickness change portion 3, and therefore a thickness change estimation position 13 showing a different temperature from the surroundings is detected at the position of the thickness change portion 3 in the thermal image 12. At this time, since the wide-area temperature control device 11 cools the entire object 2 from the inner side of the object 2, the temperature change of the object 2 when the temperature control device 4 heats the object 2 from the surroundings becomes larger compared to the case of the thickness change measurement system 1 in Fig. 1. In other words, the temperature difference between the surroundings and the thickness change estimation position 13 becomes larger compared to the case of the thickness change measurement system 1 in Fig. 1.

[0044] 2(c)(3), the temperature change of the object 2 continues even after the temperature control device 4 has passed, so a temperature transition different from the surroundings is observed at the thickness change estimation position 13 in the thermal image 12. At this time, for the same reason as described above, it becomes even clearer that the temperature transition at the thickness change estimation position 13 is different from the surroundings, compared to the case of the thickness change measurement system 1 in FIG.

[0045] According to the plate thickness change measurement system 10 of this embodiment, in addition to the temperature control device 4 that changes the surface temperature of the object 2 to be measured and the thermal image photographing device 5 that photographs the surface temperature of the object 2 to be measured, a wide-area temperature control device 11 that changes the temperature of the entire object 2 to be measured is further used. As a result, since the wide-area temperature control device 11 cools the entire object 2 to be measured, when the temperature control device 4 heats the object 2 to be measured and causes a change in the surface temperature, the temperature difference between the surroundings and the plate thickness change estimated position 13 in the thermal image 12 photographed by the thermal image photographing device 5 becomes larger than that in the plate thickness change measurement system 1.

[0046] As a result, it is possible to achieve the same effect as the first embodiment, and since it is possible to impart an amount of temperature change to the entire object to be measured 2 that could not be achieved by the temperature control device 4 alone, it is possible to detect changes in thickness, such as thinning or material changes, that occur in plate-like structures whose materials or thicknesses are poorly resistant to temperature change.

[0047] Third embodiment Hereinafter, the plate thickness change measurement system 20 according to the third embodiment will be described with reference to Fig. 3. Fig. 3 is a schematic diagram showing an example of the plate thickness change measurement system 20, (a) is a configuration diagram showing an example of the plate thickness change measurement method 20, (b) is an explanatory diagram showing an example of a thermal image that can be captured by the plate thickness change measurement method 20, and (c) is a process explanatory diagram showing an example of a plate thickness change measurement method based on the transition of a thermal image that can be captured by the plate thickness change measurement method 20. Below, the parts different from the first embodiment will be described, and the other parts will be assigned the same reference numerals as those in the first embodiment, and the description thereof may be omitted.

[0048] The plate thickness change measurement system 20 in Fig. 3(a) uses a temperature control device 4, a thermal image capturing device 5, a plate thickness measurement device 21, and a learning device 22. That is, the third embodiment differs from the first embodiment in that the plate thickness measurement device 21 and the learning device 22 are further used. Note that the plate thickness change measurement system 20 according to the third embodiment is exemplified as a modified example of the first embodiment without the wide-area temperature control device 11, but may be a modified example of the second embodiment using the wide-area temperature control device 11.

[0049] The plate thickness measuring device 21 measures the plate thickness of the object 2 to be measured and outputs the measured thickness as a numerical value. For example, the plate thickness measuring device 21 may be an ultrasonic flaw detector. The ultrasonic flaw detector can use ultrasonic waves to inspect for cracks and scratches inside the object 2 to be measured, inspect for peeling, measure thickness, etc. Note that the plate thickness measuring device 21 is only required to be able to measure at least the plate thickness of the object 2 to be measured, and may measure the plate thickness by actually measuring the cross section or by performing a hammering test, etc., within the scope of the gist of the invention.

[0050] The thickness measuring device 21 may measure the thickness of the object 2 at the position of the thickness changing portion 3 under the control of a control device (not shown).

[0051] The learning device 22 displays a thickness change estimate 25 at a thickness change estimate position 24 of a thermal image 23 captured by the thermal image photographing device 5 by associating the thickness measurement value measured by the thickness measuring device 21 with the thickness design value. The thickness change estimate here refers to a value where the thickness measurement value has decreased relative to the thickness design value. The learning device 22 also accumulates integrated data in which the thermal image captured by the thermal image photographing device 5 and the thickness measurement value measured by the thickness measuring device 21 are associated with each other.

[0052] As a result, the learning device 22 performs a plate thickness analysis using the training data by simply capturing a thermal image with the thermal image capturing device 5, using the accumulated integrated data as training data. After that, the learning device 22 estimates the plate thickness value of the object 2 to be measured without measuring the plate thickness with the plate thickness measuring device 21, and displays a plate thickness change estimated value 25 at a plate thickness change estimated position 24 of the thermal image 23. Note that, although an example showing a plate thickness reduction value has been described in this embodiment, it is of course possible to display a plate thickness measurement value and a plate thickness design value as well.

[0053] In addition, the learning device 22 is required to be able to at least correspond the measurement values ​​measured by the plate thickness measuring device 21 to the design values, and may, within the scope of the gist of the invention, for example, treat the thermal image as image data and construct a learning model using a Convolutional Neural Network (CNN) or the like, and may process the temperature at each position in the thermal image by outputting the temperature at each position as a separate numerical value, thereby correlating the temperature at each position with the plate thickness, and calculate a predicted value according to the temperature by regression analysis or the like.

[0054] The learning device 22 may be controlled by a control device (not shown) to associate the measured thickness value received from the thickness measuring device 21 with the designed thickness value, thereby displaying the estimated thickness change value 25 at the estimated thickness change position 24 of the thermal image 23 received from the thermal image photographing device 5. The learning device 22 may also be controlled by a control device (not shown) to accumulate integrated data in which the thermal image received from the thermal image photographing device 5 is associated with the measured thickness value received from the thickness measuring device 21, perform a thickness analysis using this integrated data as teacher data, estimate the thickness value of the object 2 to be measured without measuring the thickness with the thickness measuring device 21, and display the estimated thickness change value 25 at the estimated thickness change position 24 of the thermal image 23.

[0055] Here, an example of a method for measuring a change in plate thickness based on the transition of the thermal image 23 that can be captured by the plate thickness change measuring system 20 will be described with reference to the process explanatory diagram of FIG. In the plate thickness change measurement method of this embodiment, the following steps are sequentially performed: a moving step in which a temperature control device 4, which changes the surface temperature of the object to be measured 2, is moved relative to the object to be measured 2; an imaging step in which the change in the surface temperature of the object to be measured 2 caused by the change in the surface temperature of the object to be measured 2 is captured as a thermal image 23 by a thermal image imaging device 5 that images the surface temperature of the object to be measured 2; a detection step in which a difference in temperature distribution or temperature gradient of the object to be measured 2 in the thermal image 23 is measured and a position showing this difference is detected as a plate thickness change estimated position 24; a measurement step in which the plate thickness of the object to be measured 2 at the plate thickness change estimated position 24 is measured by a plate thickness measuring device 21; and a learning step in which the plate thickness measurement value at the plate thickness change estimated position 24 measured by the plate thickness measuring device 21 is associated with the plate thickness design value, and the plate thickness change estimated value 25 is displayed at the plate thickness change estimated position 24 of the thermal image 23 by a learning device 22.

[0056] Specifically, as shown in Fig. 3(c)(1), the temperature control device 4 moves relative to the object 2 to heat it. The thermal image capturing device 5 captures the heated object 2 as a thermal image 23. If there is no thickness change portion 3 in the area through which the temperature control device 4 has passed, no temperature difference is detected in the thermal image 23.

[0057] On the other hand, when a thickness-changing portion 3 is present in the area passed by the temperature control device 4, as shown in FIG. 3(c)(2), a change occurs in the temperature characteristics of the object 2 to be measured due to the thickness-changing portion 3, and an estimated thickness-changing position 24 showing a different temperature from the surrounding area is detected in the thermal image 23 at the position of the thickness-changing portion 3.

[0058] 3(c)(3), when the thickness change estimated position 24 is detected, the thickness measuring device 21 measures the thickness at the thickness change estimated position 24, and the learning device 22 associates the measured thickness value with the designed thickness value, thereby displaying a thickness change estimated value 25 at the thickness change estimated position 24 in the thermal image 23. Alternatively, when the thickness change estimated position 24 is detected, a thickness analysis is performed using teacher data accumulated in the learning device 22 to estimate the thickness value of the object 2 to be measured from the thermal image 23, and the thickness change estimated value 25 is displayed at the thickness change estimated position 24 in the thermal image 23.

[0059] According to the plate thickness change measurement system 20 of this embodiment, in addition to the temperature control device 4 that changes the surface temperature of the object to be measured 2 and the thermal image photographing device 5 that photographs the surface temperature of the object to be measured 2, a plate thickness measuring device 21 that measures the plate thickness of the object to be measured 2 and a learning device 22 that matches the plate thickness measurement value measured by the plate thickness measuring device 21 with the plate thickness design value are further used.

[0060] As a result, the object 2 is heated by the temperature control device 4 to change the surface temperature, and a thickness change portion 3 such as a thinning or material change is detected based on a thermal image 23 captured by the thermal image capture device 5, with a position showing a temperature distribution or temperature gradient different from the surroundings as a thickness change estimated position 24. Thereafter, the thickness measurement device 21 measures the thickness at the thickness change estimated position 24, and the learning device 22 associates the measured thickness value with the designed thickness value, thereby displaying a thickness change estimated value 25 on the thermal image 23. Alternatively, the learning device 22 performs a thickness analysis using the accumulated teacher data to accumulate integrated data in which the thermal image and the measured thickness value are associated, estimates the thickness value of the object 2 from the captured thermal image, and displays the thickness change estimated value 25 on the thermal image 23.

[0061] As a result, the same effect as the first embodiment can be obtained, and it is possible to perform efficient plate thickness measurement by extracting only the portions that require plate thickness measurement for a wide area or a large number of plate-like structures. Also, it is possible to estimate the plate thickness value by simply taking a thermal image using a thermal imager on-site, and it is possible to immediately determine whether plate thickness measurement is necessary.

[0062] Although several embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, modifications, and combinations can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, and are included in the scope of the invention and its equivalents described in the claims. [Explanation of symbols]

[0063] 1...plate thickness change measurement system, 2...object to be measured, 3...plate thickness change part, 4...temperature control device, 5...thermal image shooting device 5, 6...thermal image, 7...estimated position of plate thickness change, 10...plate thickness change measurement system, 11...wide-area temperature control device, 12...thermal image, 13...estimated position of plate thickness change, 20...plate thickness change measurement system, 21...plate thickness measurement device, 22...learning device, 23...thermal image, 24...estimated position of plate thickness change, 25...estimated value of plate thickness change.

Claims

1. a moving step of moving a temperature control device that changes a surface temperature of an object to be measured relative to the object to be measured; a photographing step of photographing a change in the surface temperature of the object to be measured, which occurs by changing the surface temperature of the object to be measured, as a thermal image by a thermal image photographing device for photographing the surface temperature of the object to be measured; A detection step of measuring a difference in temperature distribution or temperature gradient of the object in the thermal image and detecting a position showing this difference as a plate thickness change estimated position; A plate thickness change measuring method comprising:

2. The plate thickness change measuring method according to claim 1, further comprising a measuring step of measuring the plate thickness at the plate thickness change estimation position of the object to be measured using a plate thickness measuring device that measures the plate thickness.

3. The plate thickness change estimation position of the thermal image is further characterized in that a learning device is further used to correspond the plate thickness measurement value at the plate thickness change estimation position measured by the plate thickness measurement device to the plate thickness design value at the plate thickness change estimation position, and a learning step is further included in which a plate thickness change estimation value is displayed at the plate thickness change estimation position of the thermal image. The plate thickness change measurement method according to claim 2, further comprising:

4. The plate thickness change measurement method according to claim 3, characterized in that the learning device accumulates integrated data in which the thermal image and the plate thickness measurement value correspond to each other, performs plate thickness analysis using the integrated data as teacher data, and estimates the plate thickness value of the measured object in the thermal image.

5. The plate thickness change measurement method according to any one of claims 1 to 4, further comprising an overall temperature control step of changing the temperature of the entire object to be measured using a wide-area temperature control device from a position facing the temperature control device with respect to the object to be measured.

6. 5. The plate thickness change measurement method according to claim 1, further comprising an overall temperature control step of changing the temperature of the entire object to be measured by a wide-area temperature control body from a position facing the temperature control device with respect to the object to be measured.

7. a temperature control device that moves relative to an object to be measured to change a surface temperature of the object; A thermal image capturing device that captures the surface temperature change of the object to be measured that occurs by moving the temperature control device relative to the object to be measured as a thermal image, measures the difference in the temperature distribution or temperature gradient of the object to be measured in the thermal image, and detects the position showing this difference as an estimated position of the plate thickness change; A plate thickness change measurement system comprising:

8. The plate thickness change measurement system according to claim 7, further comprising a plate thickness measurement device that measures the plate thickness at the plate thickness change estimation position of the object to be measured.

9. The plate thickness change measurement system according to claim 8, further comprising a learning device that associates the plate thickness measurement value at the plate thickness change estimation position measured by the plate thickness measurement device with the plate thickness design value at the plate thickness change estimation position and displays the plate thickness change estimation value at the plate thickness change estimation position of the thermal image received from the thermal image photographing device.

10. The learning device accumulates integrated data in which the thermal image and the plate thickness measurement value correspond to each other, performs plate thickness analysis using the integrated data as teacher data, and estimates the plate thickness value of the object to be measured in the thermal image. The plate thickness change measurement system described in claim 9.

11. 11. The plate thickness change measurement system according to claim 7, further comprising a wide-area temperature control device arranged at a position opposite to the temperature control device with respect to the object to be measured, and changing the temperature of the entire object to be measured.

12. 11. The plate thickness change measurement system according to claim 7, further comprising a wide-area temperature control body arranged at a position opposite the temperature control device with respect to the object to be measured, and changing the temperature of the entire object to be measured.

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