Electromagnetic relay

Abstract

To provide an electromagnetic relay that can stably transmit high-frequency and low-frequency signals without degrading the isolation characteristics of high-frequency signals.SOLUTION: In an electromagnetic relay 1, a printed circuit board 3 includes first and third transmission lines 24A, 24B, second and fourth transmission lines 25A, 25B, and a first ground plate 23. First and second movable contact pieces 6A, 6B are connected to the first transmission line 24A and the third transmission line 24B, respectively. The first and second movable contact pieces 6A, 6B move between a connected position and a disconnected position. The shield plate 7 extends from the first ground plate 23 above the second and fourth transmission lines 25A, 25B. An insulating layer 107 is provided between the first ground plate 23 and the first and second movable contact pieces 6A, 6B.SELECTED DRAWING: Figure 7B

Description

[Technical field]

[0001] The present invention relates to an electromagnetic relay. [Background technology]

[0002] There are electromagnetic relays for opening and closing the transmission of high-frequency signals. For example, the electromagnetic relay of Patent Document 1 includes a movable contact piece, a plurality of fixed terminals, and a shield plate. When the movable contact piece is pressed by an electromagnet block, both ends of the movable contact piece come into contact with the plurality of fixed terminals. This allows the transmission of high-frequency signals. On the other hand, when the movable contact piece is biased by a return spring, both ends of the movable contact piece leave the plurality of fixed terminals and come into contact with the shield plate. This blocks the transmission of high-frequency signals. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP2003-51234A Summary of the Invention [Problem to be solved by the invention]

[0004] In conventional electromagnetic relays, the transmission of high frequency signals is opened and closed by bringing both ends of a movable contact piece into contact with fixed terminals and by separating both ends of the movable contact piece from the fixed terminals.

[0005] In this case, it is necessary to move the entire movable contact piece toward the fixed terminal or to move the entire movable contact piece away from the fixed terminal. To achieve this configuration, the configuration of the electromagnetic relay becomes complicated. Also, there is a problem that the pressing force of the electromagnet block, i.e., the power of the electromagnet, is required to move the entire movable contact piece.

[0006] In order to solve this problem, attempts have been made to develop electromagnetic relays in which the movable contact piece is not entirely movable but is partially movable. This type of electromagnetic relay can be configured as follows: One end of the movable contact piece is connected to a fixed terminal of a first transmission line. In this state, the movable contact piece is pressed by a pressing member, and the other end of the movable contact piece comes into contact with a fixed terminal of a second transmission line. This allows the transmission of high-frequency signals.

[0007] In this state, when the pressing member is released from the movable contact piece, the other end of the movable contact piece separates from the fixed terminal of the second transmission line and comes into contact with the shield plate, thereby blocking the transmission of high-frequency signals.

[0008] At the same time, attempts are being made to develop electromagnetic relays that can transmit not only high-frequency signals but also low-frequency signals. In this case, if the transmission of high-frequency signals is interrupted and a low-frequency signal is transmitted with the other end of the movable contact piece in contact with the shield plate, there is a risk of the low-frequency signal being short-circuited. If the shield plate is removed from the electromagnetic relay to solve this problem, the short-circuiting of low-frequency signals can be prevented, but the isolation characteristics of high-frequency signals may be reduced.

[0009] An object of the present invention is to provide an electromagnetic relay that can stably transmit high-frequency signals and low-frequency signals without degrading the isolation characteristics of the high-frequency signals. [Means for solving the problem]

[0010] An electromagnetic relay according to one aspect of the present invention includes a base block, a movable contact piece, a shield plate, and an insulating layer. The base block includes a first transmission line, a second transmission line, and a ground plate. The movable contact piece is connected to the first transmission line. The movable contact piece extends from the first transmission line toward the second transmission line. The movable contact piece moves between a connected position where the movable contact piece is connected to the second transmission line and a separated position above the second transmission line. The shield plate is disposed on the ground plate. The shield plate extends from the ground plate above the second transmission line. The insulating layer is provided between the ground plate and the movable contact piece. When the movable contact piece is located in the separated position, the movable contact piece contacts the insulating layer or the shield plate.

[0011] In the electromagnetic relay according to this embodiment, an insulating layer is provided between the ground plate and the movable contact piece. The movable contact piece is connected to the second transmission line while being connected to the first transmission line. This allows the transmission of high-frequency signals. In this state, when the movable contact piece moves from the contact position to the disengaged position, the movable contact piece comes into contact with the insulating layer or the shield plate. This blocks the transmission of high-frequency signals. At this time, even if a low-frequency signal is transmitted, the insulating layer can prevent the low-frequency signal from being short-circuited. In this way, in this electromagnetic relay, high-frequency signals and low-frequency signals can be stably transmitted without degrading the isolation characteristics of the high-frequency signals.

[0012] The insulating layer may be attached to either the movable contact piece or the shield plate as a separate member from the movable contact piece and the shield plate. In this case, the insulating layer can be easily attached to either the movable contact piece or the shield plate. Also, an appropriate material can be selected from various materials that can be used as the insulating layer.

[0013] The insulating layer may be formed on either the movable contact piece or the shield plate by coating either one of the movable contact piece or the shield plate. In this case, the insulating layer can be stably formed on either the movable contact piece or the shield plate. Also, the number of assembly steps can be reduced.

[0014] The insulating layer may be disposed between the ground plate and the shield plate. Even in this configuration, the insulating layer can prevent a short circuit of a low-frequency signal when the movable contact piece comes into contact with the shield plate.

[0015] The electromagnetic relay may further include a conductor. In this case, the conductor is connected to the shield plate. The conductor is disposed between the shield plate and the ground plate. The insulating layer is disposed between the conductor and the ground plate. Even with this configuration, when the movable contact piece comes into contact with the shield plate, the insulating layer can prevent a short circuit of the low-frequency signal. Also,

[0016] The base block may include a ground plate and a plurality of conductor layers disposed between the shield plate and the ground plate. In this case, the insulating layer is provided on any one of the plurality of conductor layers. Even with this configuration, when the movable contact piece comes into contact with the shield plate, the insulating layer can prevent a short circuit of the low-frequency signal. In addition, the conductor layer can ensure a large conductor area, thereby improving the isolation characteristics of the high-frequency signal.

[0017] The insulating layer may have a thickness of 3 μm or more and 80 μm or less. The insulating layer may be made of at least one of a high dielectric material and a high dielectric loss tangent material. This configuration can improve the isolation characteristics of high frequency signals. Effect of the Invention

[0018] The electromagnetic relay of the present invention can stably transmit high-frequency signals and low-frequency signals without degrading the isolation characteristics of the high-frequency signals. [Brief description of the drawings]

[0019] [Figure 1] FIG. [Diagram 2] FIG. [Diagram 3] FIG. [Figure 4] FIG. [Diagram 5] FIG. [Figure 6] 2 is a top view of a printed circuit board, a first movable contact piece, a second movable contact piece, and a shield plate. FIG. [Figure 7A] 7 is a partially enlarged cross-sectional view taken along line VII in FIG. 6 (contacts are in a closed state). [Figure 7B] FIG. 7 is a partially enlarged cross-sectional view taken along line VII in FIG. 6 (contacts are in an open state). [Figure 8A] FIG. 2 is an external perspective view of the shield plate as viewed from above. [Figure 8B] FIG. 4 is an external perspective view of the shield plate as viewed from below. [Figure 9] 2 is a perspective view of the base assembly and the stand as viewed from below. FIG. [Figure 10] FIG. 4 is a perspective view of the base assembly as viewed from below. [Figure 11] FIG. [Figure 12A] FIG. 2 is a cross-sectional view of an electromagnetic relay in an open state. [Figure 12B] FIG. 2 is a cross-sectional view of an electromagnetic relay in a closed state. [Figure 13] FIG. [Figure 14] FIG. 11 is a partially enlarged cross-sectional view of a printed circuit board and a shield plate according to another embodiment. [Figure 15] FIG. 11 is a partially enlarged cross-sectional view of a printed circuit board and a shield plate according to another embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Hereinafter, an electromagnetic relay according to an embodiment will be described with reference to the drawings. The electromagnetic relay according to the present embodiment is used to switch between a high-frequency RF signal (an example of a high-frequency signal) and a low-frequency DC signal (an example of a low-frequency signal).

[0021] Figures 1 and 2 are perspective views of an electromagnetic relay 1 according to an embodiment. As shown in Figures 1 and 2, the electromagnetic relay 1 includes a case 2, a base block 3, a base assembly 4, and a stand 5. Note that the case 2 is omitted in Figure 2. In the following description, the direction in which the base assembly 4 and the stand 5 are arranged with respect to the printed circuit board 3 is defined as the upper side, and the opposite direction is defined as the lower side.

[0022] As shown in FIG. 1, the case 2 is attached to the base block 3. The case 2 covers the upper surface of the base block 3, the base assembly 4, and the stand 5. The base block 3 includes a printed circuit board, a ceramic board, a resin molded product, a metal molded product, a flexible board, and an MID (Molded Interconnect Device). In this embodiment, an example in which the base block 3 is a printed circuit board is shown. In the following, the base block is described using the term "printed circuit board 3". FIG. 3 is an exploded perspective view of the electromagnetic relay 1. As shown in FIG. 3, the electromagnetic relay 1 includes a first movable contact piece 6A (an example of a movable contact piece), a second movable contact piece 6B (an example of a movable contact piece), and a shield plate 7. The first movable contact piece 6A, the second movable contact piece 6B, and the shield plate 7 are arranged on the printed circuit board 3.

[0023] FIG. 4 is a perspective view of the printed circuit board 3. Note that the shield plate 7 is omitted in FIG. 4. As shown in FIG. 4, the printed circuit board 3 includes first to fourth conductor layers 11-14 and first to third dielectric layers 15-17. The first to fourth conductor layers 11-14 are made of an electrically conductive material such as copper. The first to third dielectric layers 15-17 are made of a dielectric material. The first to fourth conductor layers 11-14 and the first to third dielectric layers 15-17 are alternately stacked with each other.

[0024] The first conductor layer 11 is provided on the upper surface of the printed circuit board 3. Fig. 5 is a top view of the printed circuit board 3. Note that the shield plate 7 and the first and second movable contact pieces 6A, 6B are omitted in Fig. 5. As shown in Figs. 4 and 5, the first conductor layer 11 is provided with a first RF line 21A, a second RF line 21B, a first DC line 22A, a second DC line 22B, a first ground plate 23 (an example of a ground plate), and a pair of second ground plates 123A1, 123A2 (an example of a ground plate).

[0025] The first RF line 21A and the second RF line 21B are transmission lines for transmitting an RF signal. The first RF line 21A includes a first transmission line 24A (an example of a first transmission line) and a second transmission line 25A (an example of a second transmission line). The first transmission line 24A and the second transmission line 25A are disposed apart from each other. The first transmission line 24A and the second transmission line 25A are electrically isolated from each other. The first transmission line 24A is connected to a first input terminal 26A. The second transmission line 25A is connected to a first RF terminal 27A. The first input terminal 26A and the first RF terminal 27A are through-hole terminals provided on the end surface of the printed circuit board 3, respectively.

[0026] The second RF line 21B includes a third transmission line 24B (an example of a first transmission line) and a fourth transmission line 25B (an example of a second transmission line). The third transmission line 24B and the fourth transmission line 25B are arranged apart from each other. The third transmission line 24B and the fourth transmission line 25B are electrically isolated from each other. The third transmission line 24B is connected to a second input terminal 26B. The fourth transmission line 25B is connected to a second RF terminal 27B. The second input terminal 26B and the second RF terminal 27B are through-hole terminals provided on the end surface of the printed circuit board 3, respectively.

[0027] The first DC line 22A and the second DC line 22B are transmission lines for passing a DC signal. The first DC line 22A is connected to the first transmission line 24A and the first ground plate 23. A first inductor 28A and a first capacitor 29A are disposed on the first DC line 22A. In the drawings, only a part of the first inductor 28A is labeled with the reference symbol 28A, and the reference symbols of the other first inductors 28A are omitted.

[0028] The first DC line 22A is connected to the first DC terminal 30A between the first inductor 28A and the first capacitor 29A. The first DC terminal 30A is a through-hole terminal provided on an end surface of the printed circuit board 3. The first DC line 22A, the first inductor 28A, and the first capacitor 29A function as a low-pass filter that passes DC signals but cuts RF signals. The first inductor 28A and the first capacitor 29A are set to cut high-frequency signals of, for example, 1 kHz or higher.

[0029] The second DC line 22B is connected to the third transmission line 24B and the first ground plate 23. A second inductor 28B and a second capacitor 29B are disposed on the second DC line 22B. Note that in the drawing, only a portion of the second inductor 28B is labeled with the reference symbol 28B, and the reference symbols of the remaining second inductors 28B are omitted.

[0030] The second DC line 22B is connected to the second DC terminal 30B between the second inductor 28B and the second capacitor 29B. The second DC terminal 30B is a through-hole terminal provided on an end surface of the printed circuit board 3. The second DC line 22B, the second inductor 28B, and the second capacitor 29B function as a low-pass filter that passes DC signals but cuts RF signals. The second inductor 28B and the second capacitor 29B are set to cut high-frequency signals of, for example, 1 kHz or higher.

[0031] 4, 5, and 6, the first ground plate 23 has a ground line 23A and a pair of ground portions 23B1, 23B2. The ground line 23A extends between the first transmission line 24A and the third transmission line 24B and along the first transmission line 24A and the third transmission line 24B. The ground line 23A extends between the second transmission line 25A and the fourth transmission line 25B and along the second transmission line 25A and the fourth transmission line 25B.

[0032] The pair of ground parts 23B1, 23B2 are formed integrally with the ground line 23A. The pair of ground parts 23B1, 23B2 are arranged on both sides of the ground line 23A. The pair of ground parts 23B1, 23B2 are arranged on both sides of the first movable contact piece 6A and the second movable contact piece 6B when viewed from above the printed circuit board 3.

[0033] Each of the pair of second ground plates 123A1 and 123A2 is formed separately from the first ground plate 23. The pair of second ground plates 123A1 and 123A2 may be formed integrally with the first ground plate 23. The pair of second ground plates 123A1 and 123A2 are disposed on both sides of the second transmission line 25A and the fourth transmission line 25B. In other words, the second transmission line 25A is disposed between the ground line 23A and the second ground plate 123A1. The fourth transmission line 25B is disposed between the ground line 23A and the second ground plate 123A2. The pair of second ground plates 123A1 and 123A2 are disposed on both sides of the first movable contact piece 6A and the second movable contact piece 6B when viewed from above the printed circuit board 3.

[0034] The second to fourth conductor layers 12-14 shown in Fig. 4 are ground layers. As shown in Fig. 4 and Fig. 5, a plurality of through-hole terminals 31 are provided on an end face of the printed circuit board 3. Note that in the drawings, only some of the through-hole terminals 31 are labeled with the reference numeral 31, and the reference numerals of the other through-hole terminals 31 are omitted. The through-hole terminals 31 connect the above-mentioned first ground plate 23 and the second to fourth conductor layers 12-14.

[0035] As shown in FIG. 4, the first movable contact piece 6A and the second movable contact piece 6B are arranged on the printed circuit board 3. The first movable contact piece 6A is arranged above the first RF line 21A. The first movable contact piece 6A extends from the first transmission line 24A toward the second transmission line 25A. The first movable contact piece 6A includes a first connection portion 32A, a first contact portion 33A, and a first intermediate portion 34A. The first connection portion 32A is connected to the first transmission line 24A. The first contact portion 33A is arranged above the second transmission line 25A. The first intermediate portion 34A is located between the first connection portion 32A and the first contact portion 33A.

[0036] As described later, the first movable contact piece 6A is movable between a connected position and a disconnected position (an example of a disconnected position). When the first movable contact piece 6A is in the connected position, the first contact portion 33A contacts the second transmission line 25A. This causes the first movable contact piece 6A to connect the first transmission line 24A and the second transmission line 25A.

[0037] When the first movable contact piece 6A is in the disconnecting position, the first contact portion 33A is separated from the second transmission line 25A. As a result, the first movable contact piece 6A disconnects the first transmission line 24A from the second transmission line 25A. In this state, the first movable contact piece 6A, in the disconnecting position, contacts the shield plate 7 via an insulating layer 107, which will be described later.

[0038] The second movable contact piece 6B is disposed above the second RF line 21B. The second movable contact piece 6B extends from the third transmission line 24B toward the fourth transmission line 25B. The second movable contact piece 6B includes a second connection portion 32B, a second contact portion 33B, and a second intermediate portion 34B. The second connection portion 32B is connected to the third transmission line 24B. The second contact portion 33B is disposed above the fourth transmission line 25B. The second intermediate portion 34B is located between the second connection portion 32B and the second contact portion 33B.

[0039] Like the first movable contact piece 6A, the second movable contact piece 6B can move between a connection position and a disconnection position. When the second movable contact piece 6B is in the connection position, the second contact portion 33B contacts the fourth transmission line 25B. As a result, the second movable contact piece 6B connects the third transmission line 24B and the fourth transmission line 25B. When the second movable contact piece 6B is in the disconnection position, the second contact portion 33B is separated from the fourth transmission line 25B. As a result, the second movable contact piece 6B disconnects the third transmission line 24B and the fourth transmission line 25B. In this state, the second movable contact piece 6B contacts the shield plate 7 via an insulating layer 107 described later at the disconnection position.

[0040] As shown in Fig. 3, the shield plate 7 is disposed on the printed circuit board 3. As shown in Fig. 3 and Fig. 6, the shield plate 7 is connected to the first ground plate 23. In detail, the shield plate 7 is connected to the first ground plate 23 and the pair of second ground plates 123A1, 123A2. The shield plate 7 is made of a conductive material.

[0041] As shown in Fig. 6, the shield plate 7 extends from the first ground plate 23 above the second transmission line 25A and above the fourth transmission line 25B. As shown in Figs. 7A and 7B, the shield plate 7 is disposed above the first contact portion 33A and the second contact portion 33B. That is, the first contact portion 33A is disposed between the shield plate 7 and the second transmission line 25A. The second contact portion 33B is disposed between the shield plate 7 and the fourth transmission line 25B. The shield plate 7 improves the isolation characteristics between the first RF line 21A and the second RF line 21B.

[0042] 8A, the shield plate 7 has a shield portion 7A, a first leg portion 7B, a pair of second leg portions 7C1, 7C2, and a pair of third leg portions 7D1, 7D2. The shield portion 7A has a shield body 7A1 and a pair of connecting portions 7A21, 7A22. The shield body 7A1 is formed in a rectangular plate shape.

[0043] As shown in FIGS. 6, 7A, and 7B, the shield body 7A1 is disposed above the second transmission line 25A and the fourth transmission line 25B with a gap therebetween.

[0044] As shown in Fig. 8A, the pair of connecting portions 7A21, 7A22 protrude from the shield body 7A1 separately. The pair of connecting portions 7A21, 7A22 are disposed at a distance from each other. As shown in Fig. 6, the pair of connecting portions 7A21, 7A22 are disposed on both sides of the first movable contact piece 6A and the second movable contact piece 6B when viewed from above the printed circuit board 3.

[0045] As shown in Fig. 8A, the first leg 7B is integrally formed with the shield body 7A1 of the shield part 7A. As shown in Fig. 6, the first leg 7B extends from the shield body 7A1 toward the ground line 23A. The first leg 7B is disposed on the ground line 23A.

[0046] As shown in Fig. 8A, the pair of second leg portions 7C1, 7C2 are formed integrally with the pair of connecting portions 7A21, 7A22 of the shield portion 7A, respectively. As shown in Fig. 6, the pair of second leg portions 7C1, 7C2 extend separately from the pair of connecting portions 7A21, 7A22 toward the pair of ground portions 23B1, 23B2.

[0047] As shown in Fig. 8A, the pair of third legs 7D1, 7D2 are integrally formed with the shield body 7A1 of the shield part 7A. As shown in Fig. 6, the pair of third legs 7D1, 7D2 extend from the shield body 7A1 toward the pair of second ground plates 123A1, 123A2. The pair of third legs 7D1, 7D2 are disposed on the pair of second ground plates 123A1, 123A2, respectively.

[0048] In this manner, in the shield plate 7, the first leg 7B is connected to the ground line 23A of the first ground plate 23. The pair of second leg portions 7C1, 7C2 are connected to the pair of ground portions 23B1, 23B2 of the first ground plate 23, respectively. The pair of third leg portions 7D1, 7D2 are connected to the pair of second ground plates 123A1, 123A2, respectively. In this state, the first movable contact piece 6A and the second movable contact piece 6B are in contact with the shield body 7A1 via the insulating layer 107 shown in FIG. 8B.

[0049] As shown in Fig. 8B, the insulating layer 107 is provided on the shield plate 7. As shown in Fig. 7B, when the first movable contact piece 6A and the second movable contact piece 6B are located in the interrupting position, the first contact portion 33A of the first movable contact piece 6A and the second contact portion 33B of the second movable contact piece 6B come into contact with the insulating layer 107. The insulating layer 107 may be provided on each of the first contact portion 33A of the first movable contact piece 6A and the second contact portion 33B of the second movable contact piece 6B. In this case, when the first movable contact piece 6A and the second movable contact piece 6B are located in the interrupting position, the insulating layer 107 comes into contact with the shield plate 7.

[0050] The insulating layer 107 is a separate member from the first movable contact piece 6A, the second movable contact piece 6B, and the shield plate 7. The insulating layer 107 is attached to the shield plate 7 with an adhesive. The insulating layer 107 has a thickness of 3 μm or more and 80 μm or less. The insulating layer 107 is preferably formed of at least one of a high dielectric material and a high dielectric loss tangent material. For example, the insulating layer 107 is preferably formed of a high dielectric loss tangent material having a high dielectric constant. Specifically, the insulating layer 107 is preferably formed of a material such as ceramic, a resin material containing ceramic particles, ferrite, a resin material containing ferrite particles, and a radio wave absorber.

[0051] The insulating layer 107 may be formed on the shield plate 7 by coating the shield plate 7. For example, a fluorine coating and a polyamideimide coating are applied to the portions of the shield plate 7 facing the first movable contact piece 6A and the second movable contact piece 6B. As a result, a resin layer that functions as the insulating layer 107 is formed on the shield plate 7. The resin layer is preferably formed to a thickness of 3 μm or more and 80 μm or less.

[0052] Fig. 9 is a perspective view of the base assembly 4 and the stand 5 as viewed from below. Fig. 10 is a perspective view of the base assembly 4 as viewed from below. Fig. 11 is an exploded perspective view of the base assembly 4. Figs. 12A and 12B are cross-sectional views of the electromagnetic relay 1. As shown in Figs. 9 to 12B, the base assembly 4 includes a base 40, a coil block 41, and a movable block 42.

[0053] The coil block 41 includes a coil 43, a spool 44, and an iron core 45. The coil 43 is wound around the spool 44. The iron core 45 is disposed within the coil 43. The iron core 45 includes an intermediate portion 46, a first attraction portion 47, and a second attraction portion 48. The intermediate portion 46 is disposed within the coil 43 and extends in the axial direction of the coil 43. The first attraction portion 47 protrudes from the coil 43 in the axial direction of the coil 43. The first attraction portion 47 is disposed facing downward. The second attraction portion 48 protrudes from the coil 43 in the opposite direction to the first attraction portion 47 in the axial direction of the coil 43. The second attraction portion 48 is disposed facing downward.

[0054] The movable block 42 is operated by the electromagnetic force of the coil 43 to move the first movable contact piece 6A and the second movable contact piece 6B between the connection position and the disconnection position. Fig. 13 is a perspective view of the movable block 42. As shown in Fig. 13, the movable block 42 includes an iron piece 50, a first hinge spring 51, a second hinge spring 52, a permanent magnet 53, a card 54, and a movable insulating base 55.

[0055] The iron piece 50 is supported by a movable insulating stand 55. The iron piece 50 includes a first end 56 and a second end 57. The first end 56 protrudes from the movable insulating stand 55 in the axial direction of the coil 43. The first end 56 is disposed below the first attraction portion 47 of the iron core 45 and faces the first attraction portion 47. The second end 57 protrudes from the movable insulating stand 55 in the opposite direction to the first end 56 in the axial direction of the coil 43. The second end 57 is disposed below the second attraction portion 48 of the iron core 45 and faces the second attraction portion 48.

[0056] The first hinge spring 51 is supported by the movable insulating base 55. The first hinge spring 51 protrudes from the movable insulating base 55 toward one side of the movable insulating base 55. The second hinge spring 52 is supported by the movable insulating base 55. The second hinge spring 52 protrudes from the movable insulating base 55 toward the other side of the movable insulating base 55. The permanent magnet 53 is attached to the upper surface of the movable insulating base 55.

[0057] The card 54 is supported by the movable insulating base 55. The card 54 protrudes downward from the movable insulating base 55. The card 54 is disposed above the first movable contact piece 6A and the second movable contact piece 6B. In detail, the card 54 is disposed above the first intermediate portion 34A of the first movable contact piece 6A and the second intermediate portion 34B of the second movable contact piece 6B. The card 54 is connected to the lower surface of the first end portion 56 of the iron piece 50. The card 54 protrudes downward from the lower surface of the first end portion 56.

[0058] The movable insulating stand 55 is supported to be swingable relative to the base 40. As shown in FIG. 11, the base 40 includes support protrusions 58 and 59. As shown in FIG. 13, the movable insulating stand 55 includes support holes 60 and 61. The support protrusions 58 and 59 are disposed in the support holes 60 and 61, and support the movable insulating stand 55 to be swingable. Also, as shown in FIG. 11, the base 40 includes a first support recess 62 and a second support recess 63. The first hinge spring 51 is disposed in the first support recess 62. The first hinge spring 51 is connected to the base 40 at the first support recess 62. The second hinge spring 52 is disposed in the second support recess 63. The second hinge spring 52 is connected to the base 40 at the second support recess 63. The movable insulating stand 55 is supported to be swingable relative to the base 40 around the first hinge spring 51 and the second hinge spring 52.

[0059] The stand 5 is disposed above the printed circuit board 3 and supports the base assembly 4. In detail, the stand 5 supports the base 40. The coil block 41 is supported by the stand 5 via the base 40. The movable block 42 is supported by the stand 5 via the base 40. The stand 5 includes a frame 70 and a plurality of legs 71-74. As shown in FIG. 9, the frame 70 has an opening 75 in the center. The movable block 42 is disposed in the opening 75 of the frame 70. The card 54 extends downward through the opening 75.

[0060] Next, the operation of the electromagnetic relay 1 will be described. FIG. 12A shows the electromagnetic relay 1 in an open state. When no current flows through the coil 43, the coil 43 is not excited, and the iron piece 50 is not attracted to the iron core 45. Due to the magnetic force of the permanent magnet 53, the first end 56 of the iron piece 50 is attracted to the first attraction portion 47 of the iron core 45 and is in contact with the first attraction portion 47. Therefore, the card 54 is separated from the first movable contact piece 6A and the second movable contact piece 6B, and the first movable contact piece 6A and the second movable contact piece 6B are each located at the disconnection position. Therefore, in the first RF line 21A, the first transmission line 24A and the second transmission line 25A are disconnected from each other. Also, in the second RF line 21B, the third transmission line 24B and the fourth transmission line 25B are disconnected from each other.

[0061] When a current flows through the coil 43, the electromagnetic relay 1 is in a closed state as shown in FIG. 12B. When the electromagnetic relay 1 is in a closed state, the second end 57 of the iron piece 50 is attracted to the second attraction portion 48 of the iron core 45 by the electromagnetic force of the coil 43 and rises. This causes the iron piece 50 to swing and the first end 56 to descend. The card 54 descends together with the first end 56 and presses the first movable contact piece 6A and the second movable contact piece 6B, thereby moving the first movable contact piece 6A and the second movable contact piece 6B to their respective contact positions. This causes the first transmission line 24A and the second transmission line 25A to be connected to each other in the first RF line 21A. Also, the third transmission line 24B and the fourth transmission line 25B to be connected to each other in the second RF line 21B.

[0062] When the current to the coil 43 is interrupted, the iron piece 50 rotates in the opposite direction due to the magnetic force of the permanent magnet 53, the second end 57 descends and separates from the second attraction portion 48, and the first end 56 rises. The card 54 rises together with the first end 56 and separates from the first movable contact piece 6A and the second movable contact piece 6B. As a result, the first movable contact piece 6A and the second movable contact piece 6B return to their respective disconnected positions due to the elastic forces of the first movable contact piece 6A and the second movable contact piece 6B. As a result, in the first RF line 21A, the first transmission line 24A and the second transmission line 25A are disconnected from each other. Also, in the second RF line 21B, the third transmission line 24B and the fourth transmission line 25B are disconnected from each other.

[0063] For example, when an RF signal is input to the first input terminal 26A and the second input terminal 26B of the electromagnetic relay 1, the electromagnetic relay 1 is closed. In this case, the first transmission line 24A and the second transmission line 25A are connected to each other, and the third transmission line 24B and the fourth transmission line 25B are connected to each other. Therefore, the RF signal is output from the first input terminal 26A through the first RF line 21A to the first RF terminal 27A. Also, the RF signal is output from the second input terminal 26B through the second RF line 21B to the second RF terminal 27B. On the other hand, the RF signal is cut at the first DC line 22A and the second DC line 22B, respectively, and therefore the RF signal is prevented from being output from the first and second DC terminals 30B.

[0064] When a DC signal is input to the first input terminal 26A and the second input terminal 26B of the electromagnetic relay 1, the electromagnetic relay 1 is opened. In this case, the first transmission line 24A and the second transmission line 25A are disconnected from each other, and the third transmission line 24B and the fourth transmission line 25B are disconnected from each other. Therefore, the DC signal is output from the first input terminal 26A through the first DC line 22A without passing through the first RF line 21A, and from the first DC terminal 30A. The DC signal is output from the second input terminal 26B through the second DC line 22B without passing through the second RF line 21B, and from the second DC terminal 30B. This prevents the DC signal from flowing to the first movable contact piece 6A and the second movable contact piece 6B.

[0065] In the electromagnetic relay 1 according to the present embodiment described above, the insulating layer 107 is provided between the first ground plate 23 and the first and second movable contact pieces 6A and 6B. In detail, the insulating layer 107 is provided on the shield plate 7. The first and second movable contact pieces 6A and 6B are connected to the second and fourth transmission lines 25A and 25B, respectively, in a state where they are connected to the first and third transmission lines 24A and 24B, respectively. This allows the transmission of high-frequency signals. In this state, when the first and second movable contact pieces 6A and 6B move from the contact position to the cut-off position, the first and second movable contact pieces 6A and 6B come into contact with the insulating layer 107 attached to the shield plate 7. This cuts off the transmission of high-frequency signals. At this time, even if a DC signal is transmitted, the insulating layer 107 can prevent the DC signal from being short-circuited. In this way, in the electromagnetic relay 1, the RF signal and the DC signal can be stably transmitted without degrading the isolation characteristics of the RF signal.

[0066] The insulating layer 107 is attached to the shield plate 7 as a separate member from the first and second movable contact pieces 6A, 6B and the shield plate 7. This allows the insulating layer 107 to be easily attached to the shield plate 7. Also, an appropriate material can be selected from various materials that can be used as the insulating layer 107.

[0067] The insulating layer 107 may be formed on either one of the shield plates 7 by coating the shield plate 7. In this case, the insulating layer 107 can be stably formed on the shield plate 7. In addition, the number of assembly steps can be reduced.

[0068] The insulating layer 107 has a thickness of 3 μm or more and 80 μm or less. The insulating layer 107 is made of at least one of a high dielectric material and a high dielectric loss tangent material. This configuration can improve the isolation characteristics of high frequency signals.

[0069] Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications are possible without departing from the gist of the invention.

[0070] As shown in Fig. 14, the insulating layer 207 may be disposed between the first ground plate 23 and the shield plate 7, and between the second ground plates 123A1, 123A2 and the shield plate 7. Fig. 14 is a cross-sectional view of the printed circuit board 3 cut in a direction perpendicular to the longitudinal direction of the first movable contact piece 6A. The reference numerals for the cross section on the second movable contact piece 6B side are shown in parentheses. Even with this configuration, when the first movable contact piece 6A and the second movable contact piece 6B come into contact with the shield plate 7, the insulating layer 207 can prevent a short circuit of a low-frequency signal.

[0071] As shown in Fig. 15, the electromagnetic relay 1 may have a first insulating layer 307, a second insulating layer 308, a third insulating layer 309, and a fourth insulating layer 310. Fig. 15 is a cross-sectional view of the printed circuit board 3 cut in a direction perpendicular to the longitudinal direction of the first movable contact piece 6A. The reference numerals for the cross section on the second movable contact piece 6B side are shown in parentheses. In Fig. 15, vias 401, 402, and 403, which will be described later, are shown in a simplified manner.

[0072] In this case, the first dielectric layer 15 is used as the first insulating layer 307. The second dielectric layer 16 is used as the second insulating layer 308. The third dielectric layer 17 is used as the third insulating layer 309.

[0073] Here, the second conductor layer 12 has a fifth conductor layer 12A connected to the shield plate 7 and a sixth conductor layer 12B connected to the fourth conductor layer 14. The fifth conductor layer 12A is connected to the first ground plate 23 and the pair of second ground plates 123A, 123A2 of the first conductor layer 11 through a via 401. The shield plate 7 is connected to the first ground plate 23 and the pair of second ground plates 123A, 123A2.

[0074] The sixth conductor layer 12B is a conductor layer separate from the fifth conductor layer 12A. The sixth conductor layer 12B is disposed around the fifth conductor layer 12A at a distance. The sixth conductor layer 12B is connected to the third conductor layer 13 through a via 402. The third conductor layer 13 is connected to the fourth conductor layer 14 through a via 403.

[0075] The fourth insulating layer 310 is disposed between the fifth conductor layer 12A and the sixth conductor layer 12B, between the first insulating layer 307 and the second insulating layer 308. For example, the fourth insulating layer 310 is disposed between the fifth conductor layer 12A and the sixth conductor layer 12B so as to surround the fifth conductor layer 12A. As a result, the fifth conductor layer 12A and the sixth conductor layer 12B are insulated by the fourth insulating layer 310. In this case, at least one of the sixth conductor layer 12B, the third conductor layer 13, and the fourth conductor layer 14 is interpreted as an example of a ground plate.

[0076] Even with this configuration, when the first movable contact piece 6A and the second movable contact piece 6B come into contact with the shield plate 7, the first to fourth insulating layers 307, 308, 309, 310 can prevent a short circuit of low-frequency signals. Furthermore, with this configuration, the fifth conductor layer 12A can ensure a large conductor area, thereby improving the isolation characteristics of high-frequency signals.

[0077] The configuration of the printed circuit board 3 is not limited to that of the above embodiment, and may be modified. The configuration of the transmission lines of the printed circuit board 3 is not limited to that of the above embodiment, and may be modified. For example, the second RF line 21B and the second DC line 22B may be omitted. The configuration of the terminals of the printed circuit board 3 is not limited to that of the above embodiment, and may be modified. For example, the second input terminal 26B, the second RF terminal 27B, and the second DC terminal 30B may be omitted. The RF signal and the DC signal may be passed in the opposite direction to that of the above embodiment. The configuration of the base assembly 4 is not limited to that of the above embodiment, and may be modified. For example, the stand 5 is not limited to being separate from the base 40, and may be integrated with the base 40. [Industrial Applicability]

[0078] The electromagnetic relay of the present invention can stably transmit high-frequency signals and low-frequency signals without degrading the isolation characteristics. [Explanation of symbols]

[0079] 2: case, 3: printed circuit board, 6A: first movable contact piece, 6B: second movable contact piece, 7: shield plate, 7A: shield portion, 7B: first leg portion, 7C1, 7C2: second leg portion, 7D1, 7D2: third leg portion, 11: first conductor layer, 12: second conductor layer, 12A: fifth conductor layer, 12B: sixth conductor layer, 13: third conductor layer, 14: fourth conductor layer, 23: first ground plate, 23A: ground line, 23B1, 23B2: ground portion, 24A: first transmission line, 25A: second transmission line, 107, 207, 307, 308, 309, 310: insulating layer, 123A1, 123A2: second ground plate, 301: conductor

Claims

1. a base block including a first transmission line, a second transmission line, and a ground plate; a movable contact piece connected to the first transmission line, extending from the first transmission line toward the second transmission line, and movable between a connection position connected to the second transmission line and a release position spaced upward from the second transmission line; a shield plate disposed on the ground plate and extending from the ground plate to above the second transmission line; an insulating layer provided between the ground plate and the movable contact piece; Equipped with When the movable contact piece is in the released position, the movable contact piece comes into contact with the insulating layer or the shield plate. Electromagnetic relay.

2. the insulating layer is a separate member from the movable contact piece and the shield plate and is attached to either one of the movable contact piece and the shield plate; 2. An electromagnetic relay as claimed in claim 1.

3. the insulating layer is formed on either one of the movable contact piece or the shield plate by coating the either one of the movable contact piece or the shield plate; 2. An electromagnetic relay as claimed in claim 1.

4. The insulating layer is disposed between the ground plate and the shield plate.

2. An electromagnetic relay as claimed in claim 1.

5. a conductor connected to the shield plate and disposed between the ground plate and the shield plate; Further equipped with the insulating layer is disposed between the conductor and the ground plate; 5. An electromagnetic relay according to claim 4.

6. the base block includes the ground plate and a plurality of conductor layers disposed between the shield plate and the ground plate; The insulating layer is provided on any one of the plurality of conductor layers.

5. An electromagnetic relay according to claim 4.

7. The insulating layer has a thickness of 3 μm or more and 80 μm or less.

5. An electromagnetic relay according to claim 1.

8. The insulating layer is formed of at least one of a high dielectric material and a high dielectric tangent material.

2. An electromagnetic relay as claimed in claim 1.

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