Electromagnetic relay

Abstract

To provide an electromagnetic relay that can improve the stability of the impedance of a high frequency signal in a through hole.SOLUTION: An electromagnetic relay 1 comprises a first conductor layer 11, second to fourth conductor layers 12 to 14, and through holes 26A, 27A, 26B, 27B. The first conductor layer 11 is connected with a transmission line for transmitting a high frequency signal. The second to fourth conductor layers 12 to 14 are arranged at intervals from the first conductor layer 11 in an orthogonal direction orthogonal to a plane including the first conductor layer 11. The through holes 26A, 27A, 26B, 27B are connected to the transmission line at an end face of the first conductor layer 11, and extend toward the orthogonal direction. The second to fourth conductor layers 12 to 14 have window parts 12a, 13a, 14a arranged at intervals from the through holes 26A, 27A, 26B, 27B on a plane including the second to fourth conductor layers 12 to 14.SELECTED DRAWING: Figure 7

Description

[Technical field]

[0001] The present invention relates to an electromagnetic relay. [Background technology]

[0002] There are electromagnetic relays for opening and closing the transmission of high-frequency signals. For example, the electromagnetic relay of Patent Document 1 includes a movable contact piece, multiple fixed terminals, and a shield plate. When the electromagnet block is turned on and the movable contact piece is pressed by the electromagnet block, both ends of the movable contact piece come into contact with the multiple fixed terminals. This allows the transmission of high-frequency signals. On the other hand, when the electromagnet block is turned off and the movable contact piece is biased by the return spring, both ends of the movable contact piece leave the multiple fixed terminals and come into contact with the shield plate. This blocks the transmission of high-frequency signals. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP2003-51234A Summary of the Invention [Problem to be solved by the invention]

[0004] In conventional electromagnetic relays, the transmission of high frequency signals is opened and closed by bringing both ends of the movable contact piece into contact with the fixed terminal or by removing both ends of the movable contact piece from the fixed terminal. In this case, it is necessary to bring the entire movable contact piece close to the fixed terminal or remove the entire movable contact piece from the fixed terminal. In order to realize this configuration, there is a problem that the configuration of the electromagnetic relay becomes complicated. In addition, there is also a problem that the pressing force of the electromagnet block, i.e., the power of the electromagnet, is required to move the entire movable contact piece.

[0005] In order to solve this problem, attempts have been made to develop electromagnetic relays in which the movable contact piece is not entirely movable but is partially movable. This type of electromagnetic relay can be configured as follows: One end of the movable contact piece is connected to a fixed terminal of a first transmission line. In this state, the movable contact piece is pressed by a pressing member, and the other end of the movable contact piece comes into contact with a fixed terminal of a second transmission line. This allows the transmission of high-frequency signals.

[0006] In this state, when the pressing member is released from the movable contact piece, the other end of the movable contact piece separates from the fixed terminal of the second transmission line and comes into contact with the shield plate, thereby blocking the transmission of high-frequency signals.

[0007] In this type of electromagnetic relay, attempts have been made to form a through hole on the end surface of the printed circuit board. In this case, the through hole extends in the up-down direction (vertical direction) on the end surface of the printed circuit board. Here, if a high-frequency signal is passed through the through hole while the through hole is in contact with the ground layer, there is a risk that the impedance of the high-frequency signal will not be locally stable in the up-down direction (vertical direction). An object of the present invention is to provide an electromagnetic relay that can improve the stability of the impedance of the high-frequency signal in the through hole. [Means for solving the problem]

[0008] An electromagnetic relay according to one aspect of the present invention includes a surface layer, at least one ground layer, and a through hole. A transmission line for transmitting a high-frequency signal is connected to the surface layer. The at least one ground layer is disposed at a distance from the surface layer in an orthogonal direction perpendicular to a plane including the surface layer. The through hole is connected to the transmission line at an end face of the surface layer and extends in the orthogonal direction. The ground layer has a window portion disposed at a distance from the through hole on the plane including the ground layer.

[0009] In the electromagnetic relay according to this embodiment, a window is provided in the ground layer. The window of the ground layer is disposed at a distance from the through hole on a plane including the ground layer. With this configuration, even if a high-frequency signal is passed through the through hole, the impedance of the high-frequency signal can be stabilized. That is, in this electromagnetic relay, the stability of the impedance of the high-frequency signal in the through hole can be improved compared to the conventional technology.

[0010] The through hole may be formed in an arc shape. In this case, the window portion is formed in an arc shape. With this configuration, it is possible to suitably improve the stability of the impedance of a high frequency signal in the through hole.

[0011] The at least one ground layer may include a plurality of ground layers. In this case, each of the plurality of ground layers has a window portion disposed at a distance from the through hole. With this configuration, since each of the plurality of ground layers has a window portion, it is possible to stabilize the impedance of a high frequency signal at the through hole even if the ground layer is a plurality of ground layers.

[0012] The multiple ground layers may include first to third ground layers. In this case, a dielectric layer is disposed between the surface layer and the first ground layer. A dielectric layer is disposed between the first ground layer and the second ground layer. A dielectric layer is disposed between the second ground layer and the third ground layer. Even with this configuration, it is possible to stabilize the impedance of high frequency signals in the through hole.

[0013] The radius of the window of each of the plurality of ground layers may be the same. With this configuration, it is possible to suitably improve the stability of the impedance of high frequency signals in the through hole.

[0014] The radius of the window of at least one of the plurality of ground layers may be different from that of the other. This configuration can favorably improve the stability of the impedance of high frequency signals in the through hole. Effect of the Invention

[0015] In the electromagnetic relay of the present invention, the stability of the impedance of high frequency signals in the through-hole can be improved. [Brief description of the drawings]

[0016] [Figure 1] FIG. [Diagram 2] FIG. [Diagram 3] FIG. [Figure 4] FIG. [Diagram 5] FIG. 2 is a perspective view of first to fourth conductor layers of the printed circuit board. [Figure 6A] FIG. 4 is a top view of a first conductor layer. [Figure 6B] FIG. 4 is a top view of a second conductor layer. [Figure 6C] FIG. 4 is a top view of a third conductor layer. [Figure 7] FIG. 4 is a partially enlarged top view of the first to third window portions. [Figure 8A] 4 is a partially enlarged cross-sectional view (closed state) of the first and second movable contact pieces taken in the longitudinal direction. FIG. [Figure 8B] 4 is a partially enlarged cross-sectional view (open state) of first and second movable contact pieces taken in the longitudinal direction. FIG. [Figure 9] 2 is a perspective view of the base assembly and the stand as viewed from below. FIG. [Figure 10] FIG. 4 is a perspective view of the base assembly as viewed from below. [Figure 11] FIG. [Figure 12A] FIG. 2 is a cross-sectional view of an electromagnetic relay in an open state. [Figure 12B] FIG. 2 is a cross-sectional view of an electromagnetic relay in a closed state. [Figure 13] FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An electromagnetic relay according to an embodiment will now be described with reference to the drawings. The electromagnetic relay according to the present embodiment is used to switch between a high-frequency RF signal (an example of a high-frequency signal) and a low-frequency DC signal.

[0018] Figures 1 and 2 are perspective views of an electromagnetic relay 1 according to an embodiment. As shown in Figures 1 and 2, the electromagnetic relay 1 includes a case 2, a base block 3, a base assembly 4, and a stand 5. Note that the case 2 is omitted in Figure 2. In the following description, the direction in which the base assembly 4 and the stand 5 are arranged with respect to the printed circuit board 3 is defined as the upper side, and the opposite direction is defined as the lower side.

[0019] As shown in Fig. 1, the case 2 is attached to the base block 3. The case 2 covers the upper surface of the base block 3, the base assembly 4, and the stand 5. The base block 3 includes a printed circuit board, a ceramic board, a resin molded product, a metal molded product, a flexible board, and an MID (Molded Interconnect Device). In this embodiment, an example is shown in which the base block 3 is a printed circuit board. In the following description, the term "printed circuit board 3" is used.

[0020] Fig. 3 is an exploded perspective view of the electromagnetic relay 1. As shown in Fig. 3, the electromagnetic relay 1 includes a first movable contact piece 6A, a second movable contact piece 6B, and a shield plate 7. The first movable contact piece 6A, the second movable contact piece 6B, and the shield plate 7 are disposed on a printed circuit board 3.

[0021] Fig. 4 is a perspective view of the printed circuit board 3. Note that the shield plate 7 is omitted in Fig. 4. As shown in Fig. 4, the printed circuit board 3 includes first to fourth conductor layers 11-14 and first to third dielectric layers 15-17.

[0022] The first to fourth conductor layers 11-14 shown in Figures 4 to 6C are made of an electrically conductive material such as copper. As shown in Figure 4, the first to third dielectric layers 15-17 are made of a dielectric material. The first to fourth conductor layers 11-14 and the first to third dielectric layers 15-17 are alternately stacked with each other.

[0023] 4, a first conductor layer 11 (an example of a surface layer) is provided on the upper surface of the printed circuit board 3. The first conductor layer 11 is provided with a first RF line 21A, a second RF line 21B, a first DC line 22A, a second DC line 22B, a first ground plate 23, and a pair of second ground plates 123A1 and 123A2.

[0024] The first RF line 21A and the second RF line 21B are transmission lines for transmitting an RF signal. The first RF line 21A includes a first transmission line 24A and a second transmission line 25A. The first transmission line 24A and the second transmission line 25A are arranged apart from each other. The first transmission line 24A and the second transmission line 25A are electrically isolated from each other. The first transmission line 24A is connected to a first input terminal 26A. The second transmission line 25A is connected to a first RF terminal 27A.

[0025] The second RF line 21B includes a third transmission line 24B and a fourth transmission line 25B. The third transmission line 24B and the fourth transmission line 25B are arranged apart from each other. The third transmission line 24B and the fourth transmission line 25B are electrically isolated from each other. The third transmission line 24B is connected to a second input terminal 26B. The fourth transmission line 25B is connected to a second RF terminal 27B.

[0026] As shown in Fig. 4, the first DC line 22A and the second DC line 22B are transmission lines for passing a DC signal. The first DC line 22A is connected to the first transmission line 24A and the first ground plate 23. A first inductor 28A and a first capacitor 29A are disposed on the first DC line 22A. Note that in the drawing, only a part of the first inductor 28A is labeled with the reference symbol 28A, and the reference symbols of the other first inductors 28A are omitted.

[0027] The first DC line 22A is connected to the first DC terminal 30A between the first inductor 28A and the first capacitor 29A. The first DC line 22A, the first inductor 28A, and the first capacitor 29A function as a low-pass filter that passes DC signals but cuts RF signals. The first inductor 28A and the first capacitor 29A are set to cut high-frequency signals of, for example, 1 kHz or higher.

[0028] The second DC line 22B is connected to the third transmission line 24B and the first ground plate 23. A second inductor 28B and a second capacitor 29B are disposed on the second DC line 22B. Note that in the drawing, only a portion of the second inductor 28B is labeled with the reference symbol 28B, and the reference symbols of the remaining second inductors 28B are omitted.

[0029] The second DC line 22B is connected to the second DC terminal 30B between the second inductor 28B and the second capacitor 29B. The second DC line 22B, the second inductor 28B, and the second capacitor 29B function as a low-pass filter that passes DC signals but cuts RF signals. The second inductor 28B and the second capacitor 29B are set to cut high-frequency signals of, for example, 1 kHz or higher.

[0030] 4 to 6C, the first input terminal 26A and the first RF terminal 27A are through-hole terminals provided on an end surface of the printed circuit board 3. The first input terminal 26A is provided on an end surface of the first conductor layer 11, and is connected to the first transmission line 24A. The first input terminal 26A is formed in an arc shape. The first input terminal 26A extends in an orthogonal direction that is orthogonal to a plane including the first conductor layer 11.

[0031] The first RF terminal 27A is provided on an end surface of the first conductor layer 11 and is connected to the second transmission line 25A. The first RF terminal 27A is formed in an arc shape. The first RF terminal 27A extends in a direction perpendicular to a plane including the first conductor layer 11.

[0032] The second input terminal 26B and the second RF terminal 27B are each a through-hole terminal provided on an end surface of the printed circuit board 3. The second input terminal 26B is provided on an end surface of the first conductor layer 11, and is connected to the third transmission line 24B. The second input terminal 26B is formed in an arc shape. The second input terminal 26B extends in an orthogonal direction that is orthogonal to a plane including the first conductor layer 11.

[0033] The second RF terminal 27B is provided on an end surface of the first conductor layer 11 and is connected to the fourth transmission line 25B. The second RF terminal 27B is formed in an arc shape. The second RF terminal 27B extends in a direction perpendicular to a plane including the first conductor layer 11.

[0034] The first DC terminal 30A is a through-hole terminal provided on an end surface of the printed circuit board 3. The first DC terminal 30A is provided on an end surface of the first conductor layer 11, and is connected to the first DC line 22A. The first DC terminal 30A is formed in an arc shape. The first DC terminal 30A extends in a direction perpendicular to a plane including the first conductor layer 11.

[0035] The second DC terminal 30B is a through-hole terminal provided on an end surface of the printed circuit board 3. The second DC terminal 30B is provided on an end surface of the first conductor layer 11 and is connected to the second DC line 22B. The second DC terminal 30B is formed in an arc shape. The second DC terminal 30B extends in a direction perpendicular to a plane including the first conductor layer 11.

[0036] 4, the first ground plate 23 has a ground line 23A. The ground line 23A extends between the first transmission line 24A and the third transmission line 24B and along the first transmission line 24A and the third transmission line 24B. The ground line 23A extends between the second transmission line 25A and the fourth transmission line 25B and along the second transmission line 25A and the fourth transmission line 25B.

[0037] The ground line 23A is disposed along the first movable contact piece 6A in the longitudinal direction from the first transmission line 24A to the second transmission line 25A. The ground line 23A is disposed along the second movable contact piece 6B in the longitudinal direction from the third transmission line 24B to the fourth transmission line 25B.

[0038] Through-hole terminals 31A, 31B are provided on an end surface of the printed circuit board 3, and are connected to ends of the ground line 23A of the first ground plate 23. The through-hole terminals 31A, 31B connect the first ground plate 23 to the second to fourth conductor layers 12-14. In the drawings, reference numerals are attached to the above-mentioned through-hole terminals 26A, 27A, 26B, 27B and the through-hole terminal 31. Reference numerals for the other through-hole terminals 31 are omitted.

[0039] Each of the pair of second ground plates 123A1, 123A2 is formed separately from the first ground plate 23. The pair of second ground plates 123A1, 123A2 are disposed on both sides of the second transmission line 25A and the fourth transmission line 25B. In other words, the second transmission line 25A is disposed between the ground line 23A and the second ground plate 123A1. The fourth transmission line 25B is disposed between the ground line 23A and the second ground plate 123A2. The pair of second ground plates 123A1, 123A2 are disposed on both sides of the first movable contact piece 6A and the second movable contact piece 6B when viewed from above the printed circuit board 3.

[0040] The second to fourth conductor layers 12-14 shown in Fig. 4 to Fig. 6C are ground layers. Each of the second to fourth conductor layers 12-14 is disposed at an interval from the first conductor layer 11 in an orthogonal direction perpendicular to a plane including the first conductor layer 11. In detail, the second conductor layer 12 is disposed at an interval from the first conductor layer 11 in the orthogonal direction. The third conductor layer 13 is disposed at an interval from the second conductor layer 12 in the orthogonal direction. The fourth conductor layer 14 is disposed at an interval equal to the third conductor layer 123 in the orthogonal direction.

[0041] 6B and 6C, the second to fourth conductor layers 12-14 have first to third window portions 12a-14a, respectively. In detail, the second conductor layer 12 has a first window portion 12a. The first window portion 12a is formed around each of the first input terminal 26A, the first RF terminal 27A, the second input terminal 26B, and the second RF terminal 27B.

[0042] 6B, the first window 12a is formed in an arc shape. In this embodiment, the first window 12a is formed in a semicircular shape. The first window 12a is disposed at intervals from the first input terminal 26A, the first RF terminal 27A, the second input terminal 26B, and the second RF terminal 27B on a plane including the second conductor layer 12.

[0043] 6B, the third conductor layer 13 has second windows 13a. The second windows 13a are formed around the first input terminal 26A, the first RF terminal 27A, the second input terminal 26B, and the second RF terminal 27B.

[0044] The second window portion 13a is formed in an arc shape. In this embodiment, the second window portion 13a is formed in a semicircular shape. The second window portion 13a is disposed at intervals from each of the first input terminal 26A, the first RF terminal 27A, the second input terminal 26B, and the second RF terminal 27B on a plane including the third conductor layer 13.

[0045] 6C, the fourth conductor layer 14 has third windows 14a. The third windows 14a are formed around the first input terminal 26A, the first RF terminal 27A, the second input terminal 26B, and the second RF terminal 27B.

[0046] The third window portion 14a is formed in an arc shape. In this embodiment, the third window portion 14a is formed in a semicircular shape. The third window portion 14a is disposed at intervals from each of the first input terminal 26A, the first RF terminal 27A, the second input terminal 26B, and the second RF terminal 27B on a plane including the fourth conductor layer 14.

[0047] The third window portion 14a is disposed at intervals from each of the flange portion 26A1 of the first input terminal 26A, the flange portion 27A1 of the first RF terminal 27A, the flange portion 26B1 of the second input terminal 26B, and the flange portion 27B1 of the second RF terminal 27B on a plane including the fourth conductor layer 14. The outer surfaces of the flange portions 26A1, 27A1, 26B1, and 27B1 are formed in an arc shape. In this embodiment, the outer surfaces of the flange portions 26A1, 27A1, 26B1, and 27B1 are formed in a semicircular shape.

[0048] 7, the first to third windows 12a-14a have the same inner surface radius r1. The first input terminal 26A, the first RF terminal 27A, the second input terminal 26B, and the second RF terminal 27B have the same outer surface radius r2.

[0049] The radius r1 of the first to third window portions 12a-14a is larger than the radius r2 of the first input terminal 26A, the radius r2 of the first RF terminal 27A, the radius r2 of the second input terminal 26B, and the radius r2 of the second RF terminal 27B.

[0050] The radius r3 of the outer surfaces of flange portions 26A1, 27A1, 26B1, and 27B1 is smaller than the radius r1 of first to third window portions 12a-14a. The radius r3 of the outer surfaces of flange portions 26A1, 27A1, 26B1, and 27B1 is larger than the radius r2 of first input terminal 26A, the radius r2 of first RF terminal 27A, the radius r2 of second input terminal 26B, and the radius r2 of second RF terminal 27B.

[0051] The ratio (r1 / r2) of the radius r1 of the first to third window portions 12a-14a to the radius r2 of the first input terminal 26A, the first RF terminal 27A, the second input terminal 26B, and the second RF terminal 27B is preferably 1.5 or more and 3.5 or less. This ratio (r1 / r2) is set according to the thickness of the printed circuit board 3, the dielectric constant of the printed circuit board 3, and the like. The ratio (r1 / r3) of the radius r1 of the first to third window portions 12a-14a to the radius r3 of the flange portions 26A1, 27A1, 26B1, 27B1 is preferably 1.2 or more and 2.5 or less. This ratio (r1 / r3) is set according to the thickness of the printed circuit board 3, the dielectric constant of the printed circuit board 3, and the like.

[0052] As shown in Fig. 4, the first movable contact piece 6A and the second movable contact piece 6B are disposed on the printed circuit board 3. The first movable contact piece 6A is disposed above the first RF line 21A. The first movable contact piece 6A extends from the first transmission line 24A toward the second transmission line 25A. The first movable contact piece 6A is formed in a rectangular shape that is long in one direction.

[0053] The first movable contact piece 6A includes a first connecting portion 32A, a first contact portion 33A, and a first intermediate portion 34A. The first connecting portion 32A is connected to the first transmission line 24A. The first contact portion 33A is disposed above the second transmission line 25A. The first intermediate portion 34A is located between the first connecting portion 32A and the first contact portion 33A.

[0054] 8A and 8B, the first movable contact piece 6A is movable between a connected position and a disconnected position (an example of a disconnected position). As shown in Fig. 8A, when the first movable contact piece 6A is located at the connected position, the first contact portion 33A contacts the second transmission line 25A. As a result, the first movable contact piece 6A connects the first transmission line 24A and the second transmission line 25A.

[0055] As shown in Fig. 8B, when the first movable contact piece 6A is in the interrupting position, the first contact portion 33A is separated from the second transmission line 25A. As a result, the first movable contact piece 6A interrupts the first transmission line 24A and the second transmission line 25A. In this state, the first movable contact piece 6A contacts the shield plate 7 in the interrupting position. It is preferable that the first movable contact piece 6A contacts the shield plate 7 via an insulating layer 107 in the interrupting position. The insulating layer 107 is attached to the back surface of the shield plate 7.

[0056] As shown in FIG. 8A, when viewed from the side of the first movable contact piece 6A, in the connection position of the first movable contact piece 6A, the first connection portion 32A of the first movable contact piece 6A is connected to the first transmission line 24A, and the first contact portion 33A of the first movable contact piece 6A is in contact with the second transmission line 25A.

[0057] 4, the second movable contact piece 6B is disposed above the second RF line 21B. The second movable contact piece 6B extends from the third transmission line 24B toward the fourth transmission line 25B. The second movable contact piece 6B is formed in a rectangular shape that is long in one direction.

[0058] The second movable contact piece 6B includes a second connection portion 32B, a second contact portion 33B, and a second intermediate portion 34B. The second connection portion 32B is connected to the third transmission line 24B. The second contact portion 33B is disposed above the fourth transmission line 25B. The second intermediate portion 34B is located between the second connection portion 32B and the second contact portion 33B.

[0059] As shown in Figures 8A and 8B, like the first movable contact piece 6A, the second movable contact piece 6B can move between a connection position and a disconnection position. As shown in Figure 7A, when the second movable contact piece 6B is located at the connection position, the second contact portion 33B contacts the fourth transmission line 25B. As a result, the second movable contact piece 6B connects the third transmission line 24B and the fourth transmission line 25B.

[0060] 8B, when the second movable contact piece 6B is in the interrupting position, the second contact portion 33B is separated from the fourth transmission line 25B. As a result, the second movable contact piece 6B interrupts the third transmission line 24B and the fourth transmission line 25B. In this state, the second movable contact piece 6B contacts the shield plate 7 in the interrupting position. It is preferable that the second movable contact piece 6B contacts the shield plate 7 via the insulating layer 107 in the interrupting position.

[0061] As shown in FIG. 8A, when viewed from the side of the second movable contact piece 6B, in the connection position of the second movable contact piece 6B, the second connection portion 32B of the second movable contact piece 6B is connected to the third transmission line 24B, and the second contact portion 33B of the second movable contact piece 6B is in contact with the fourth transmission line 25B.

[0062] 3, the shield plate 7 is disposed on the printed circuit board 3. The shield plate 7 is connected to the first ground plate 23. In detail, the shield plate 7 is connected to the first ground plate 23 and the pair of second ground plates 123A1, 123A2. The shield plate 7 is made of a conductive material.

[0063] 8A and 8B, the shield plate 7 is disposed above the first contact portion 33A and the second contact portion 33B. That is, the first contact portion 33A is disposed between the shield plate 7 and the second transmission line 25A. The second contact portion 33B is disposed between the shield plate 7 and the fourth transmission line 25B. The shield plate 7 improves the isolation characteristics between the first RF line 21A and the second RF line 21B.

[0064] Fig. 9 is a perspective view of the base assembly 4 and the stand 5 as viewed from below. Fig. 10 is a perspective view of the base assembly 4 as viewed from below. Fig. 11 is an exploded perspective view of the base assembly 4. Fig. 12 is a cross-sectional view of the electromagnetic relay 1. As shown in Figs. 9 to 11, the base assembly 4 includes a base 40, a coil block 41, and a movable block 42.

[0065] The coil block 41 includes a coil 43, a spool 44, and an iron core 45. The coil 43 is wound around the spool 44. The iron core 45 is disposed within the coil 43. The iron core 45 includes an intermediate portion 46, a first attraction portion 47, and a second attraction portion 48. The intermediate portion 46 is disposed within the coil 43 and extends in the axial direction of the coil 43. The first attraction portion 47 protrudes from the coil 43 in the axial direction of the coil 43. The first attraction portion 47 is disposed facing downward. The second attraction portion 48 protrudes from the coil 43 in the opposite direction to the first attraction portion 47 in the axial direction of the coil 43. The second attraction portion 48 is disposed facing downward.

[0066] The movable block 42 is operated by the electromagnetic force of the coil 43 to move the first movable contact piece 6A and the second movable contact piece 6B between the connection position and the disconnection position. Fig. 13 is a perspective view of the movable block 42. As shown in Fig. 13, the movable block 42 includes an iron piece 50, a first hinge spring 51, a second hinge spring 52, a permanent magnet 53, a card 54, and a movable insulating base 55.

[0067] The iron piece 50 is supported by a movable insulating stand 55. The iron piece 50 includes a first end 56 and a second end 57. The first end 56 protrudes from the movable insulating stand 55 in the axial direction of the coil 43. The first end 56 is disposed below the first attraction portion 47 of the iron core 45 and faces the first attraction portion 47. The second end 57 protrudes from the movable insulating stand 55 in the opposite direction to the first end 56 in the axial direction of the coil 43. The second end 57 is disposed below the second attraction portion 48 of the iron core 45 and faces the second attraction portion 48.

[0068] The first hinge spring 51 is supported by the movable insulating base 55. The first hinge spring 51 protrudes from the movable insulating base 55 toward one side of the movable insulating base 55. The second hinge spring 52 is supported by the movable insulating base 55. The second hinge spring 52 protrudes from the movable insulating base 55 toward the other side of the movable insulating base 55. The permanent magnet 53 is attached to the upper surface of the movable insulating base 55.

[0069] The card 54 is supported by the movable insulating base 55. The card 54 protrudes downward from the movable insulating base 55. The card 54 is disposed above the first movable contact piece 6A and the second movable contact piece 6B. In detail, the card 54 is disposed above the first intermediate portion 34A of the first movable contact piece 6A and the second intermediate portion 34B of the second movable contact piece 6B. The card 54 is connected to the lower surface of the first end portion 56 of the iron piece 50. The card 54 protrudes downward from the lower surface of the first end portion 56.

[0070] The movable insulating stand 55 is supported to be swingable relative to the base 40. As shown in FIG. 11, the base 40 includes support protrusions 58 and 59. As shown in FIG. 13, the movable insulating stand 55 includes support holes 60 and 61. The support protrusions 58 and 59 are disposed in the support holes 60 and 61, and support the movable insulating stand 55 to be swingable. Also, as shown in FIG. 11, the base 40 includes a first support recess 62 and a second support recess 63. The first hinge spring 51 is disposed in the first support recess 62. The first hinge spring 51 is connected to the base 40 at the first support recess 62. The second hinge spring 52 is disposed in the second support recess 63. The second hinge spring 52 is connected to the base 40 at the second support recess 63. The movable insulating stand 55 is supported to be swingable relative to the base 40 around the first hinge spring 51 and the second hinge spring 52.

[0071] The stand 5 is disposed above the printed circuit board 3 and supports the base assembly 4. In detail, the stand 5 supports the base 40. The coil block 41 is supported by the stand 5 via the base 40. The movable block 42 is supported by the stand 5 via the base 40. The stand 5 includes a frame 70 and a plurality of legs 71-74. As shown in FIG. 11 , the frame 70 has an opening 75 in the center. The movable block 42 is disposed in the opening 75 of the frame 70. The card 54 extends downward through the opening 75.

[0072] Next, the operation of the electromagnetic relay 1 will be described. FIG. 12A shows the electromagnetic relay 1 in an open state. When no current flows through the coil 43, the coil 43 is not excited, and the iron piece 50 is not attracted to the iron core 45. Due to the magnetic force of the permanent magnet 53, the first end 56 of the iron piece 50 is attracted to the first attraction portion 47 of the iron core 45 and is in contact with the first attraction portion 47. Therefore, the card 54 is separated from the first movable contact piece 6A and the second movable contact piece 6B, and the first movable contact piece 6A and the second movable contact piece 6B are each located at the disconnection position. Therefore, in the first RF line 21A, the first transmission line 24A and the second transmission line 25A are disconnected from each other. Also, in the second RF line 21B, the third transmission line 24B and the fourth transmission line 25B are disconnected from each other.

[0073] When a current flows through the coil 43, the electromagnetic relay 1 is in a closed state as shown in FIG. 12B. When the electromagnetic relay 1 is in a closed state, the second end 57 of the iron piece 50 is attracted to the second attraction portion 48 of the iron core 45 by the electromagnetic force of the coil 43 and rises. This causes the iron piece 50 to swing and the first end 56 to descend. The card 54 descends together with the first end 56 and presses the first movable contact piece 6A and the second movable contact piece 6B, thereby moving the first movable contact piece 6A and the second movable contact piece 6B to their respective connection positions. This causes the first transmission line 24A and the second transmission line 25A to be connected to each other in the first RF line 21A. Also, the third transmission line 24B and the fourth transmission line 25B to be connected to each other in the second RF line 21B.

[0074] When the current to the coil 43 is interrupted, the iron piece 50 rotates in the opposite direction due to the magnetic force of the permanent magnet 53, the second end 57 descends and separates from the second attraction portion 48, and the first end 56 rises. The card 54 rises together with the first end 56 and separates from the first movable contact piece 6A and the second movable contact piece 6B. As a result, the first movable contact piece 6A and the second movable contact piece 6B return to their respective disconnected positions due to the elastic forces of the first movable contact piece 6A and the second movable contact piece 6B. As a result, in the first RF line 21A, the first transmission line 24A and the second transmission line 25A are disconnected from each other. Also, in the second RF line 21B, the third transmission line 24B and the fourth transmission line 25B are disconnected from each other.

[0075] For example, when an RF signal is input to the first input terminal 26A and the second input terminal 26B of the electromagnetic relay 1, the electromagnetic relay 1 is closed. In this case, the first transmission line 24A and the second transmission line 25A are connected to each other, and the third transmission line 24B and the fourth transmission line 25B are connected to each other. Therefore, the RF signal is output from the first input terminal 26A through the first RF line 21A to the first RF terminal 27A. Also, the RF signal is output from the second input terminal 26B through the second RF line 21B to the second RF terminal 27B. On the other hand, the RF signal is cut at the first DC line 22A and the second DC line 22B, respectively, and therefore the RF signal is prevented from being output from the first and second DC terminals 30B.

[0076] When a DC signal is input to the first input terminal 26A and the second input terminal 26B of the electromagnetic relay 1, the electromagnetic relay 1 is opened. In this case, the first transmission line 24A and the second transmission line 25A are disconnected from each other, and the third transmission line 24B and the fourth transmission line 25B are disconnected from each other. Therefore, the DC signal is output from the first input terminal 26A through the first DC line 22A without passing through the first RF line 21A, and from the first DC terminal 30A. The DC signal is output from the second input terminal 26B through the second DC line 22B without passing through the second RF line 21B, and from the second DC terminal 30B. This prevents the DC signal from flowing to the first movable contact piece 6A and the second movable contact piece 6B.

[0077] In the electromagnetic relay 1 according to the present embodiment described above, the second to fourth conductor layers 12-14 are each provided with a window portion. The first to third window portions 12a-14a of the second to fourth conductor layers 12-14 are disposed at intervals from the first input terminal 26A, the first RF terminal 27A, the second input terminal 26B, and the second RF terminal 27B on a plane including each conductor layer 12-14.

[0078] With this configuration, it is possible to stabilize the impedance of the high frequency signal even if the high frequency signal is passed through first input terminal 26A, first RF terminal 27A, second input terminal 26B, and second RF terminal 27B. That is, in the electromagnetic relay 1, it is possible to improve the stability of the impedance of the high frequency signal at first input terminal 26A, first RF terminal 27A, second input terminal 26B, and second RF terminal 27B, compared to the conventional technology.

[0079] First input terminal 26A, first RF terminal 27A, second input terminal 26B, and second RF terminal 27B are formed in an arc shape. First to third window portions 12a-14a are formed in an arc shape. This configuration can suitably improve the stability of impedance of high frequency signals at first input terminal 26A, first RF terminal 27A, second input terminal 26B, and second RF terminal 27B.

[0080] The first to fourth conductor layers 11-14 and the first to third dielectric layers 15-17 are alternately stacked one on top of the other. Even with this configuration, by forming the first to third windows 12a-14a as described above, it is possible to stabilize the impedance of high frequency signals at the first input terminal 26A, the first RF terminal 27A, the second input terminal 26B, and the second RF terminal 27B.

[0081] The first to third windows 12a-14a have the same radius r1. This configuration makes it possible to suitably improve the stability of the impedance of the high frequency signal at the first input terminal 26A, the first RF terminal 27A, the second input terminal 26B, and the second RF terminal 27B.

[0082] Although one embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various modifications are possible without departing from the gist of the invention.

[0083] In the above embodiment, the second to fourth conductor layers 12-14 are used as ground layers. As long as there is at least one ground layer, the number of conductor layers may be less than three or more than three.

[0084] In the above embodiment, an example in which the first to third window portions 12a-14a are formed in an arc shape has been shown. The first to third window portions 12a-14a may have other shapes. For example, the first to third window portions 12a-14a may have a polygonal shape. In this case, the shortest distance from the center of each of the first input terminal 26A, the first RF terminal 27A, the second input terminal 26B, and the second RF terminal 27B to the first to third window portions 12a-14a is used as the value of "r1" in the above embodiment.

[0085] In the above embodiment, an example in which the radius r1 of the inner surface of the first to third window portions 12a-14a is the same has been shown. At least one of the radius r1 of the inner surface of the first to third window portions 12a-14a may be different. In this case, it is preferable to change the radius r1 of the inner surface of the first to third window portions 12a-14a so as to ensure an impedance equivalent to that in the case where the first to third window portions 12a-14a are not used around the first input terminal 26A, the first RF terminal 27A, the second input terminal 26B, and the second RF terminal 27B.

[0086] The configuration of the printed circuit board 3 is not limited to that of the above embodiment, and may be modified. The configuration of the transmission lines of the printed circuit board 3 is not limited to that of the above embodiment, and may be modified. For example, the second RF line 21B and the second DC line 22B may be omitted. The configuration of the terminals of the printed circuit board 3 is not limited to that of the above embodiment, and may be modified. For example, the second input terminal 26B, the second RF terminal 27B, and the second DC terminal 30B may be omitted. The RF signal and the DC signal may be passed in the opposite direction to that of the above embodiment. The configuration of the base assembly 4 is not limited to that of the above embodiment, and may be modified. For example, the stand 5 is not limited to being separate from the base 40, and may be integrated with the base 40. [Industrial Applicability]

[0087] In the electromagnetic relay of the present invention, the stability of the impedance of high frequency signals in the through-hole can be improved. [Explanation of symbols]

[0088] 2: case, 3: printed circuit board, 6A: first movable contact piece, 6B: second movable contact piece, 12a: first window portion, 13a: second window portion, 14a: third window portion, 23: first ground plate, 24A: first transmission line, 24B: third transmission line, 25A: second transmission line, 25B: fourth transmission line, 26A: first input terminal, 26B: second input terminal, 27A: first RF terminal, 27B: second RF terminal

Claims

1. a surface layer to which a transmission path for transmitting a high frequency signal is connected; at least one ground layer disposed at a distance from the surface layer in a direction perpendicular to a plane including the surface layer; a through hole connected to the transmission line at an end face of the surface layer and extending in the perpendicular direction; Equipped with the ground layer has a window portion disposed at a distance from the through hole on a plane including the ground layer; Electromagnetic relay.

2. The through hole is formed in an arc shape, The window portion is formed in an arc shape.

2. An electromagnetic relay as claimed in claim 1.

3. the at least one ground plane includes a plurality of ground planes; Each of the plurality of ground layers has the window portion disposed at a distance from the through hole.

2. An electromagnetic relay as claimed in claim 1.

4. the plurality of ground layers include first to third ground layers, a dielectric layer is disposed between the surface layer and the first ground layer, between the first ground layer and the second ground layer, and between the second ground layer and the third ground layer; 4. An electromagnetic relay according to claim 3.

5. The through hole is formed in an arc shape, The window portion is formed in an arc shape.

5. An electromagnetic relay according to claim 3 or 4.

6. The radius of the window portion of each of the plurality of ground layers is the same.

6. An electromagnetic relay according to claim 5.

7. the radius of the window of at least one of the plurality of ground layers is different; 6. An electromagnetic relay according to claim 5.

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