Imaging apparatus and heat radiation unit

Abstract

To provide a heat radiation unit for an imaging apparatus which is provided on the outside surface of the housing of the imaging apparatus and cools the imaging apparatus if necessary, without sacrificing other functions.SOLUTION: An imaging apparatus 10 includes a housing 12, a heat source which is provided in the housing 12, a monitor 16, a hinge which is provided in the housing 12 and rotatably supports the monitor 16, and a heat radiation unit 30 which includes a plurality of fins 32a provided on the outside surface of the housing 12 and is thermally connected to the heat source. The monitor 16 is rotatable by the hinge between a first position for covering the plurality of fins 32a of the heat radiation unit 30 and a second position away from the plurality of fins 32a.SELECTED DRAWING: Figure 16

Description

[Technical field]

[0001] The present disclosure relates to an imaging device and a heat dissipation unit for the imaging device. [Background technology]

[0002] For example, Patent Document 1 discloses an imaging device that is provided with a cooling means that is detachably attached to the bottom surface of the housing and forcibly cools the housing. By selectively attaching and detaching this cooling means to and from the housing, the imaging device can be cooled as needed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2009-017050 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the case of the imaging device described in Patent Document 1, if the cooling means is attached to the bottom surface of the housing, it becomes impossible to attach a tripod or the like to the bottom surface of the housing. In addition, the imaging device cannot be placed on a desk or the like via the bottom surface. In other words, the cooling means is attached to the housing at the expense of some functions.

[0005] Therefore, an object of the present disclosure is to realize a heat dissipation unit for an imaging device that is provided on the outer surface of a housing of the imaging device and cools the imaging device as needed without sacrificing other functions. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems, according to one aspect of the present disclosure, A housing; A heat source provided within the housing; A monitor and a hinge provided on the housing for rotatably supporting the monitor; a heat dissipation unit including a plurality of fins provided on an outer surface of the housing and thermally connected to the heat source; An imaging device is provided, wherein the monitor is rotatable by the hinge between a first position covering the fins of the heat dissipation unit and a second position spaced apart from the fins.

[0007] According to another aspect of the present disclosure, A heat dissipation unit that is detachably attached to an imaging device, The imaging device, A housing; A heat source provided within the housing; A monitor and a hinge provided on the housing for rotatably supporting the monitor; the housing includes a monitor seating surface on which the monitor can be seated; A heat dissipation unit is provided, the heat dissipation unit being removably attached to the monitor seating surface and thermally connected to the heat source. Effect of the Invention

[0008] According to the present disclosure, it is possible to realize a heat dissipation unit for an imaging device that is provided on the outer surface of a housing of the imaging device and cools the imaging device as needed without sacrificing other functions. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a front perspective view of an imaging device according to an embodiment of the present disclosure. [Diagram 2] A rear perspective view of the imaging device. [Diagram 3] FIG. 1 is a rear perspective view of an imaging device with a heat dissipation unit attached thereto; [Figure 4] FIG. 1 is a rear view of an imaging device with a heat dissipation unit attached. [Diagram 5] A bottom view of the imaging device with the heat dissipation unit attached. [Figure 6] FIG. 1 is a perspective view of an imaging device with a monitor mounted on a housing; [Figure 7] FIG. 2 is a bottom view of the imaging device with the monitor seated in the housing. [Figure 8] Rear perspective view of the heat dissipation unit [Figure 9] Front perspective view of the heat dissipation unit [Figure 10] Exploded perspective view of the heat dissipation unit [Figure 11] Cross-sectional view of the heat dissipation unit taken along line AA in Figure 8. [Figure 12] Cross-sectional view of the heat dissipation unit taken along line BB in Figure 8. [Figure 13] FIG. 2 is an exploded perspective view of a portion of an imaging device showing the thermal connection between a heat source within the housing and a heat dissipation unit; [Figure 14] FIG. 1 is a rear view of the imaging device showing the monitor seating surface with the heat dissipation unit removed; [Figure 15] FIG. 1 is a rear perspective view of an imaging device showing attachment and detachment of a heat dissipation unit and a cover member; [Figure 16] FIG. 1 is a partial cross-sectional view of an imaging device showing a state in which a monitor is seated on a heat dissipation unit; [Figure 17] FIG. 1 is a rear perspective view of the imaging device showing a state in which a monitor is seated on a heat dissipation unit. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, the embodiments will be described in detail with reference to the drawings as appropriate. However, more detailed explanation than necessary may be omitted. For example, detailed explanation of already well-known matters or duplicate explanation of substantially the same configuration may be omitted. This is to avoid the following explanation becoming unnecessarily redundant and to facilitate understanding by those skilled in the art.

[0011] The inventor(s) provide the accompanying drawings and the following description so that those skilled in the art can fully understand the present disclosure, and do not intend for them to limit the subject matter described in the claims.

[0012] Hereinafter, an imaging device according to an embodiment of the present disclosure will be described with reference to the drawings.

[0013] FIG. 1 is a front perspective view of an imaging device according to an embodiment of the present disclosure. FIG. 2 is a rear perspective view of the imaging device. Note that the XYZ Cartesian coordinate system shown in the figure is for facilitating understanding of the embodiment of the present disclosure, and does not limit the embodiment of the present disclosure. The X-axis direction is the front-rear direction of the imaging device, the Y-axis direction is the left-right direction, and the Z-axis direction is the height direction. In this specification, the side of the imaging device where a subject exists is referred to as the "front side", and the side where the imaging device exists is referred to as the "rear side".

[0014] 1 and 2, an imaging device 10 according to this embodiment has a housing 12, a lens mount 14 provided on the front surface of the housing 12 and to which a lens (not shown) is detachably attached, and a monitor 16 provided on the rear surface of the housing 12. Note that Fig. 1 shows a state in which a lens cover 18 is attached to the lens mount 14.

[0015] As shown in FIG. 1, the monitor 16 is, for example, a liquid crystal display, and includes a display unit 16a that displays images and the like. The monitor 16 is attached to the housing 12 via a hinge 20 provided on the housing 12. In the present embodiment, the hinge 20 supports the monitor 16 so as to be rotatable about a first rotation center line C1 extending in the height direction (Z-axis direction) and a second rotation center line C2 extending in a direction perpendicular to the first rotation center line C1. In other words, the monitor 16 is a vari-angle monitor. Such a hinge 20 allows the display unit 16a of the monitor 16 to be oriented in various directions.

[0016] The monitor 16 is configured to be able to display an image of a subject transmitted through a lens attached to the lens mount 14 of the imaging device 10. Specifically, an imaging element (not shown) is disposed in a position within the imaging device 10 behind the lens attached to the lens mount 14. The imaging element receives an image of the subject through the lens attached to the lens mount 14 and converts the received image into image data. The image data is displayed on the monitor 16. The image data is also displayed on the electronic viewfinder 22.

[0017] 1 and 2 show the state of the imaging device 10 in a so-called self-portrait mode. The self-portrait mode is a mode in which a user is positioned in front of the imaging device 10 and photographs himself / herself while checking an image of the user himself / herself reflected on the monitor 16. In the self-portrait mode, the monitor 16 is disposed to the right of the imaging device 10, with its display unit 16a facing forward. Note that in the self-portrait mode, the imaging device 10 may be installed in a predetermined position on a tripod or the like, and the user may remotely operate the imaging device 10 from a distant position.

[0018] When shooting is performed for a long period of time, the temperature inside the housing 12 of the imaging device 10 rises. For example, when shooting high-resolution moving images for a long period of time, heat is generated from heat sources such as the memory, image sensor, and processor inside the housing 12. In particular, high-temperature heat is generated from processors such as MPUs that process moving images. The imaging device 10 according to this embodiment has high cooling performance so that it can shoot such high-resolution moving images for a long period of time.

[0019] Fig. 3 is a rear perspective view of the imaging device with the heat dissipation unit attached. Fig. 4 is a rear view of the imaging device with the heat dissipation unit attached. Fig. 5 is a bottom view of the imaging device with the heat dissipation unit attached. Fig. 6 is a rear perspective view of the imaging device with a monitor seated in the housing. And Fig. 7 is a bottom view of the imaging device with a monitor seated in the housing.

[0020] 3 to 5, in order to achieve high cooling performance, the imaging device 10 according to this embodiment has a heat dissipation unit 30. The heat dissipation unit 30 is a unit for cooling the inside of the housing 12 of the imaging device 10 by dissipating heat within the housing 12 to the outside of the housing 12.

[0021] As shown in Figs. 3 to 5, the heat dissipation unit 30 is provided on the outer surface of the housing 12 for use. In this embodiment, the heat dissipation unit 30 is detachably attached to the monitor seating surface 12a of the housing 12 on which the monitor 16 sits. As shown in Figs. 6 and 7, this monitor seating surface 12a is a part of the rear surface of the housing 12 that faces the monitor 16 when the monitor 16 is closest to the rear surface of the housing 12 in a state in which the heat dissipation unit 30 is not attached. Strictly speaking, in this embodiment, the monitor 16 does not directly contact the monitor seating surface 12a. As shown in Fig. 4, a cushion sheet 24 is provided on the monitor seating surface 12a, and the monitor 16 comes into contact with the cushion sheet 24. Also, Fig. 6 shows a state in which the monitor 16 is seated on the monitor seating surface 12a of the housing 12 with the display unit 16a of the monitor 16 facing forward, i.e., toward the housing 12. However, it is also possible for the monitor 16 to be seated on the monitor seating surface 12a with the display portion 16a facing backward.

[0022] 3 to 5, the heat dissipation unit 30 is provided on the monitor seating surface 12a when the monitor 16 is not seated on the monitor seating surface 12a of the housing 12. That is, as shown in Fig. 2, when the monitor 16 is away from the monitor seating surface 12a, the heat dissipation unit 30 can be attached to the monitor seating surface 12a.

[0023] Fig. 8 is a rear perspective view of the heat dissipation unit. Fig. 9 is a front perspective view of the heat dissipation unit. Fig. 10 is an exploded perspective view of the heat dissipation unit. Fig. 11 is a cross-sectional view of the heat dissipation unit taken along line AA in Fig. 8. And Fig. 12 is a cross-sectional view of the heat dissipation unit taken along line BB in Fig. 8.

[0024] As shown in FIGS. 8 to 12, in this embodiment, the heat dissipation unit 30 includes a heat sink 32 and a heat sink cover 34 that partially covers the heat sink 32.

[0025] The heat sink 32 is a member made of a material having high thermal conductivity, for example, an aluminum alloy. The heat sink 32 also includes a plurality of fins 32a arranged at intervals. As shown in FIG. 3 and FIG. 4, when the heat dissipation unit 30 is attached to the housing 12 of the imaging device 10, the plurality of fins 32a of the heat sink 32 protrude in the front-rear direction (X-axis direction) of the imaging device 10 and are arranged at intervals in the left-right direction (Y-axis direction). That is, the plurality of fins 32a protrude in a direction intersecting the monitor seating surface 12a and are arranged at intervals in a direction (Y-axis direction) perpendicular to the extension direction (Z-axis direction) of the first rotation center line C1 of the monitor 16.

[0026] As shown in FIG. 9, the heat sink 32 includes a connection portion 32b for thermally connecting to a heat source in the housing 12, which will be described later.

[0027] As shown in FIG. 10, the heat sink cover 34 is made of, for example, a resin material, and is a member that partially covers the heat sink 32. In the present embodiment, the heat sink cover 34 is a box that houses the heat sink 32. Specifically, the heat sink cover 34 includes a wall portion 34a that is erected in the protruding direction (X-axis direction) of the multiple fins 32a and at least partially surrounds the multiple fins 32a when viewed in the protruding direction, and a bottom portion 34b that supports the heat sink cover 34. In the present embodiment, the heat sink 32 is fixed to the bottom portion 34b of the heat sink cover 34 via multiple fixing screws 36. In the present embodiment, the wall portion 34a is rectangular and annular when viewed in the protruding direction of the fins 32a. However, the wall portion 34a is not limited to annular, and may be other shapes such as a U-shape.

[0028] When the heat dissipation unit 30 is attached to the housing 12 of the imaging device 10, the bottom portion 34b of the heat sink cover 34 is seated on (contacts) the monitor seating surface 12a. At this time, the annular wall portion 34a stands in a direction (X-axis direction) intersecting the monitor seating surface 12a.

[0029] 9 and 10, a through hole 34c through which the connection portion 32b of the heat sink 32 passes is formed in the bottom portion 34b of the heat sink cover 34. Furthermore, in the present embodiment, a plurality of through hole-like ventilation openings 34d for generating air flow in the space between the plurality of fins 32a of the heat sink 32 is formed in the annular wall portion 34a of the heat sink cover 34 as shown in FIGS.

[0030] Fig. 13 is an exploded perspective view of a part of the imaging device showing the thermal connection between the heat source in the housing and the heat dissipation unit. Fig. 14 is a rear view of the imaging device showing the monitor seating surface with the heat dissipation unit removed. Note that Fig. 13 omits the illustration of a part of the housing of the imaging device.

[0031] 13, in the present embodiment, a processor 40 that executes video processing is present in the housing 12 as a heat source thermally connected to the heat dissipation unit 30 (connection portion 32b of the heat sink 32). The processor 40 is mounted on a circuit board 42 provided in the housing 12.

[0032] In this embodiment, the heat dissipation unit 30 is thermally connected to the processor 40 via a metal heat transfer member 44 having high thermal conductivity provided between the circuit board 42 and the housing 12. The processor 40 is in contact with the heat transfer member 44 via a heat transfer cushion 46 having high thermal conductivity.

[0033] Furthermore, in the present embodiment, the heat dissipation unit 30 is fixed to the heat transfer member 44 via a plurality of mounting screws 48 in a state where the connection portion 32b of the heat sink 32 is in direct contact with the heat transfer member 44. In order for the connection portion 32b of the heat sink 32 to be in direct contact with the heat transfer member 44 in the housing 12, a through hole 12b through which the connection portion 32b passes is formed in the monitor seating surface 12a of the housing 12. Through this through hole 12b, a part of the heat transfer member 44 in the housing 12 is exposed to the outside, as shown in FIG. 14. As a result, when the bottom portion 34b of the heat sink cover 34 of the heat dissipation unit 30 is seated on the monitor seating surface 12a, the connection portion 32b of the heat sink 32 passes through the through hole 12b and comes into contact with the heat transfer member 44 in the housing 12.

[0034] When the processor 40 generates high heat due to long-term shooting of high-resolution video, the heat of the processor 40 is transferred to the heat transfer member 44 via the heat-conducting cushion 46. The heat of the heat transfer member 44 is transferred to the multiple fins 32a via the connection portion 32b of the heat sink 32 of the heat dissipation unit 30. The heat is then released to the outside air from the surfaces of the multiple fins 32a. As a result, the processor 40 is cooled.

[0035] It should be noted that the heat source cooled by the heat dissipation unit 30 is not limited to the processor 40. If other heat sources are thermally connected to the heat transfer member 44, the heat dissipation unit 30 can also cool these other heat sources.

[0036] FIG. 15 is a rear perspective view of the imaging device showing attachment and detachment of the heat dissipation unit and the cover member.

[0037] As shown in FIG. 15, when the mounting screws 48 are removed from the heat transfer member 44, the heat dissipation unit 30 is separated from the housing 12. When the heat dissipation unit 30 is separated, the through hole 12b continues to communicate the inside and outside of the housing 12, and foreign matter may enter the inside of the housing 12. To deal with this, a cover member 50 that closes the through hole 12b is attached to the through hole 12b as shown in FIG. 2. When the cover member 50 is attached to the through hole 12b, the monitor 16 can be seated on the monitor seating surface 12a. That is, the heat dissipation unit 30 and the cover member 50 can be selectively attached to the housing 12. As a result, when cooling by the heat dissipation unit 30 is not required for a long period of time, for example, when the monitor 16 is stored for a long period of time or when only still images are continuously taken without video recording, the monitor 16 can be seated on the monitor seating surface 12a to make the imaging device 10 compact.

[0038] Since the heat dissipation unit 30 is detachable from the housing 12, the user may perform an operation that requires cooling by the heat dissipation unit 30, such as long-term shooting of a high-resolution video, while the heat dissipation unit 30 is separated from the housing 12. To deal with this, in the present embodiment, as shown in Figs. 13 to 15, the imaging device 10 has a heat dissipation unit detection sensor 52 that detects the state in which the heat dissipation unit 30 is attached to the housing 12. In the present embodiment, the heat dissipation unit detection sensor 52 is a mechanical switch. As shown in Fig. 9, the heat dissipation unit detection sensor 52 detects that the bottom 34b of the heat sink cover 34 of the heat dissipation unit 30 is seated on the monitor seating surface 12a by contacting with a protrusion 34e provided on the heat sink cover 34 of the heat dissipation unit 30. This allows a warning to be given to the user when the user performs an operation related to the execution of an operation that requires the heat dissipation unit 30 while the heat dissipation unit 30 is separated from the housing 12. For example, the user may be instructed via the monitor 16 to attach the heat dissipation unit 30 to the housing 12 .

[0039] 3 to 5, when the heat dissipation unit 30 is attached to the monitor seating surface 12a of the housing 12, the monitor 16 cannot be seated on the monitor seating surface 12a. Therefore, the monitor 16 is in a freely rotatable state and may come into forceful contact with the heat dissipation unit 30. For example, when the user suddenly moves the imaging device 10, the monitor 16 may suddenly rotate and hit the heat dissipation unit 30 with a large impact force.

[0040] Fig. 16 is a partial cross-sectional view of the imaging device showing a state in which a monitor is seated on a heat dissipation unit, and Fig. 17 is a rear perspective view of the imaging device showing a state in which a monitor is seated on a heat dissipation unit.

[0041] 16, in the case of this embodiment, the imaging device 10 is configured such that, when the monitor 16 comes into contact with the heat dissipation unit 30 attached to the monitor seating surface 12a, the monitor 16 comes into contact with the heat sink cover 34 while avoiding contact with the heat sink 32. In other words, the monitor 16 comes into contact with the resin heat sink cover 34 without coming into contact with the multiple fins 32a of the metal heat sink 32.

[0042] Specifically, first, as shown in Fig. 16, the monitor 16 is seated on the top surface 34f of the annular wall portion 34a of the heat sink cover 34 of the heat dissipation unit 30. Also, when viewed in the extension direction (Z-axis direction) of the first rotation center line C1 of the monitor 16, the multiple fins 32a of the heat sink 32 protrude so as not to exceed the top surface 34f of the annular wall portion 34a. This prevents the monitor 16 from coming into contact with the multiple fins 32a of the metal heat sink 32. As a result, the monitor 16 and the multiple fins 32a are prevented from coming into contact with each other and damaging at least one of them.

[0043] In the present embodiment, as shown in FIG. 16, the top surface 34f of the annular wall portion 34a of the heat sink cover 34 of the heat dissipation unit 30 is inclined toward the first rotation center line C1 side when viewed in the extension direction (Z-axis direction) of the first rotation center line C1 of the monitor 16. Specifically, the top surface 34f is inclined at an angle that allows the monitor 16 to be seated over the entire top surface 34f. As a result, as shown in FIG. 16 and FIG. 17, the monitor 16 can be seated on the monitor seating surface 12a via the heat dissipation unit 30, and free rotation of the monitor 16 can be suppressed. Even in a state where the heat dissipation unit 30 is attached, the imaging device 10 can be made compact, for example, during transportation or storage. Furthermore, the monitor 16 is seated on the top surface 34f of the annular wall portion 34a of the heat sink cover 34, so that the multiple fins 32a are covered by the monitor 16. As a result, when it is not necessary to use the heat dissipation unit 30, the multiple fins 32a can be covered and hidden by the monitor 16, and deterioration in the design of the imaging device 10 can be suppressed.

[0044] 16, in this embodiment, in order to achieve high heat dissipation efficiency, each of the fins 32a protrudes to the maximum extent without exceeding the top surface 34f of the annular wall portion 34a of the heat sink cover 34. That is, the fins 32a protrude higher as they move away from the first rotation center line C1 of the monitor 16. Specifically, when viewed in the extension direction of the first rotation center line C1 (Z-axis direction), each of the fins 32a protrudes so that the distance to the inclined top surface 34f is constant.

[0045] In the present embodiment, as shown in FIG. 16, even when the monitor 16 is seated on the top surface 34f of the annular wall portion 34a of the heat sink cover 34 and covers the fins 32a, the fins 32a of the heat dissipation unit 30 can dissipate heat with high heat dissipation efficiency. Specifically, as shown in FIG. 8 to FIG. 11, the fins 32a can dissipate heat to the outside of the heat sink cover 34 through the vent holes 34d formed in the annular wall portion 34a of the heat sink cover 34. Therefore, when there is no need for heat dissipation or the need for heat dissipation is relatively low, the imaging device 10 can be used in a compact state with the monitor 16 disposed in a position covering the fins 32a as shown in FIG. 16 and FIG. 17. When there is a relatively high need for heat dissipation, the imaging device 10 can be used in a state where the monitor 16 is disposed at a position away from the fins 32a as shown in FIG. 3 to FIG. 5. This use of the heat dissipation unit 30 according to the degree of need for heat dissipation is possible because the monitor 16 is rotatable via the hinge 20.

[0046] According to the present embodiment as described above, it is possible to realize a heat dissipation unit for an imaging device that is provided on the outer surface of the housing of the imaging device and cools the imaging device as needed without sacrificing other functions such as not being able to attach it to the housing on a tripod, etc. Specifically, in the case of the present embodiment, at least a part of the space between the monitor and the housing that is generated by the rotation of the monitor is effectively used as installation space for the heat dissipation unit.

[0047] Although the embodiments of the present disclosure have been described above, the embodiments of the present disclosure are not limited to these.

[0048] For example, in the above-described embodiment, the heat dissipation unit 30 is thermally connected to the processor 40, which is a heat source, via the heat transfer member 44. However, the embodiment of the present disclosure is not limited to this. The heat dissipation unit may be in direct contact with the heat source in the imaging device.

[0049] In the above embodiment, the heat dissipation unit 30 is detachably provided on the outer surface of the housing 12, i.e., the monitor seating surface 12a. However, the embodiment of the present disclosure is not limited to this. For example, a recess may be formed on the monitor seating surface of the housing, and multiple fins of the heat dissipation unit may be permanently installed in the recess. When heat dissipation by the heat dissipation unit is required, the monitor that sits on the monitor seating surface and covers the multiple fins rotates via the hinge to a position away from the multiple fins. On the other hand, when heat dissipation by the heat dissipation unit is not substantially required, the monitor sits on the monitor seating surface and covers the multiple fins.

[0050] Furthermore, in the case of the above-mentioned embodiment, the imaging device 10 dissipates heat generated from a heat source (processor 40) in the housing 12 to the outside of the housing 12 via the heat dissipation unit 30. However, the imaging device may have another heat dissipation means in addition to the heat dissipation unit. For example, the imaging device may have a fan that forcibly exhausts high-temperature air inside the housing to the outside as another heat dissipation means. By providing a fan in an imaging device having a heat dissipation unit, the heat dissipation efficiency is improved. In addition, the heat dissipation unit can keep the rotation speed of the fan low, and the noise level generated by the fan can be kept low (compared to a case without a heat dissipation unit).

[0051] That is, an imaging device according to an embodiment of the present disclosure broadly comprises a housing, a heat source provided within the housing, a monitor, a hinge provided in the housing for rotatably supporting the monitor, and a heat dissipation unit having a plurality of fins provided on the outer surface of the housing and thermally connected to the heat source, and the monitor is rotatable by the hinge between a first position covering the plurality of fins of the heat dissipation unit and a second position away from the plurality of fins.

[0052] As described above, the above-mentioned embodiment has been described as an example of the technology in the present disclosure. For this purpose, drawings and detailed description are provided. Therefore, among the components described in the drawings and detailed description, not only components essential for solving the problem but also components that are not essential for solving the problem in order to illustrate the above-mentioned technology may be included. Therefore, the fact that these non-essential components are described in the drawings or detailed description should not be used to immediately determine that these non-essential components are essential.

[0053] Furthermore, since the above-described embodiments are intended to illustrate the technology in the present disclosure, various modifications, substitutions, additions, omissions, and the like can be made within the scope of the claims or their equivalents. [Industrial Applicability]

[0054] The present disclosure is applicable to imaging devices with a rotatable monitor. [Explanation of symbols]

[0055] 10. Imaging device 12. Cabinet 16 monitors 30 Heat dissipation unit 32a Fins

Claims

1. A housing; A heat source provided within the housing; A monitor and a hinge provided on the housing for rotatably supporting the monitor; a heat dissipation unit including a plurality of fins provided on an outer surface of the housing and thermally connected to the heat source; An imaging device, wherein the monitor is rotatable by the hinge between a first position covering the fins of the heat dissipation unit and a second position away from the fins.

2. The heat dissipation unit is detachable from the housing, a rear surface of the housing includes a monitor seating surface on which the monitor can be seated when the heat dissipation unit is detached; The imaging device according to claim 1 , wherein the heat dissipation unit is detachable from at least a portion of the monitor seating surface when the monitor is separated from the seating surface.

3. a heat transfer member provided within the housing and in contact with the heat source, the monitor seating surface includes a through hole for exposing the heat transfer member to the outside, The imaging device according to claim 2 , wherein the heat dissipation unit is in contact with the heat transfer member through the through hole.

4. The imaging device according to claim 2 , further comprising a heat dissipation unit detection sensor that detects a state in which the heat dissipation unit is attached to the housing.

5. the heat dissipation unit includes a heat sink having the plurality of fins and a heat sink cover partially covering the heat sink, The imaging device of claim 2 , wherein the monitor is seated on the heat sink cover while avoiding contact with the heat sink.

6. Each of the plurality of fins protrudes in a first direction intersecting with the monitor seating surface, the heat sink cover includes a wall portion that at least partially surrounds the plurality of fins when viewed in the first direction; The imaging device according to claim 5 , wherein the plurality of fins protrude in the first direction so as not to extend beyond a top surface of the wall portion of the heat sink cover.

7. 7. The imaging device according to claim 6, wherein a top surface of the wall portion of the heat sink cover is inclined toward a rotation center line of the monitor so that the monitor can be seated over the entire top surface.

8. the fins are arranged at intervals in a third direction perpendicular to the first direction and the second direction in which the rotation center line extends; The imaging device according to claim 7 , wherein the plurality of fins protrude in the first direction so as to become higher as they move away from the rotation center line.

9. The imaging device according to claim 1 , wherein the second position is a position in which a display unit of the monitor faces a front side of the housing.

10. A heat dissipation unit that is detachably attached to an imaging device, The imaging device, A housing; A heat source provided within the housing; A monitor and a hinge provided on the housing for rotatably supporting the monitor; the housing includes a monitor seating surface on which the monitor can be seated; The heat dissipation unit is detachably attached to the monitor seating surface and thermally connected to the heat source.

Images