Composition for forming optical component

Abstract

To provide a composition for forming optical components that achieves both high refractive index and high transparency.SOLUTION: A composition for forming optical components comprises a compound represented by formula (0) (wherein X is O, S, or a non-crosslinking group; R0 and R2 are organic groups; n1 is an integer from 1 to 2; n0 is an integer from 0 to (4+2n1), with at least one being from 1 to (4+2n1); n4 is an integer from 0 to 1; and n5 is an integer from 0 to (4+2n4)).SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to a composition for forming an optical component. [Background technology]

[0002] By appropriately selecting the skeletal structure or functional group of the compound or resin, materials exhibiting various properties can be formed. For example, in materials used for forming planarizing films and microlenses in image display devices or optical devices, i.e., optical components, good transparency and high refractive index may be required as optical properties, and materials have been developed to improve such performance.

[0003] Various compositions for forming optical components have been proposed. For example, Patent Document 1 discloses an energy ray curable resin composition for optical lens sheets, which contains an ionic liquid, a compound having a specific polyalkylene oxide structure and a (meth)acryloyl group, a specific (meth)acrylate monomer, and a photopolymerization initiator. Patent Document 2 describes that a resin composition containing a copolymer having a specific structural unit, a specific curing-accelerating catalyst, and a solvent is preferably used for microlenses or planarization films. Patent Document 3 describes that a copolymer having a specific structural unit is preferably used for microlenses. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2010-138393 A [Patent Document 2] JP 2015-174877 A [Patent Document 3] JP 2018-203913 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, the materials described in Patent Documents 1 to 3 still have room for improvement in terms of achieving both a high refractive index and high transparency at a higher level as materials for forming optical components.

[0006] The present invention has been made in consideration of the problems associated with the above-mentioned conventional techniques, and has an object to provide a composition for forming an optical component that is capable of achieving both a high refractive index and high transparency. [Means for solving the problem]

[0007] Means for Solving the Problems The present inventors have conducted extensive research to solve the above problems and have found that a compound having a specific structure is useful as a material for forming optical components, thereby completing the present invention.

[0008] That is, the present invention includes the following aspects. [1] A composition for forming an optical component, comprising a compound represented by the following formula (0): [ka] (In the formula (0), X represents an oxygen atom, a sulfur atom, or no crosslinking. R 0 are each independently an alkyl group having 1 to 30 carbon atoms which may have a substituent, an aryl group having 6 to 30 carbon atoms which may have a substituent, an alkenyl group having 2 to 30 carbon atoms which may have a substituent, an alkynyl group having 2 to 30 carbon atoms which may have a substituent, an alkoxy group having 1 to 30 carbon atoms which may have a substituent, a halogen atom, a nitro group, an amino group, a carboxyl group, a crosslinkable group, a dissociable group, a thiol group, or a hydroxyl group, wherein R 0 At least one of R 0 The alkyl group, the aryl group, the alkenyl group, the alkynyl group, and the alkoxy group in the formula (I) may contain an ether bond, a ketone bond, or an ester bond; R 2are each independently an alkyl group having 1 to 30 carbon atoms which may have a substituent, an aryl group having 6 to 30 carbon atoms which may have a substituent, an alkenyl group having 2 to 30 carbon atoms which may have a substituent, an alkynyl group having 2 to 30 carbon atoms which may have a substituent, an alkoxy group having 1 to 30 carbon atoms which may have a substituent, a halogen atom, a nitro group, an amino group, a carboxyl group, a crosslinkable group, a dissociable group, a thiol group or a hydroxyl group, wherein R 2 The alkyl group, the aryl group, the alkenyl group, the alkynyl group, and the alkoxy group in the formula (I) may contain an ether bond, a ketone bond, or an ester bond; n 1 are each independently an integer of 1 to 2, n 0 are each independently 0 to (4+2n 1 ), where n 0 At least one of the following is 1~(4+2n 1 ) and n 4 are each independently an integer of 0 to 1, n 5 are each independently 0 to (4+2n 4 ) is an integer. [2] The composition for forming an optical part according to [1], wherein the compound represented by formula (0) is represented by the following formula (1): [ka] (In the above formula (1), X, R 2 , n 1 , n 4 and n 5 is defined as the same as formula (0), R's each independently represent a hydrogen atom, a linear alkyl group having 1 to 30 carbon atoms which may have a substituent, a branched or cyclic alkyl group having 3 to 30 carbon atoms which may have a substituent, an aryl group having 6 to 30 carbon atoms which may have a substituent, an alkenyl group having 2 to 20 carbon atoms which may have a substituent, an alkynyl group having 2 to 20 carbon atoms which may have a substituent, a crosslinkable group or a dissociable group, wherein at least one of R's is a hydrogen atom, a crosslinkable group or a dissociable group, R 1 each independently represents an alkyl group having 1 to 30 carbon atoms which may have a substituent, an aryl group having 6 to 30 carbon atoms which may have a substituent, an alkenyl group having 2 to 30 carbon atoms which may have a substituent, an alkynyl group having 2 to 30 carbon atoms which may have a substituent, an alkoxy group having 1 to 30 carbon atoms which may have a substituent, a halogen atom, a nitro group, an amino group, a carboxyl group or a thiol group, wherein the alkyl group, the aryl group, the alkenyl group, the alkynyl group and the alkoxy group may contain an ether bond, a ketone bond or an ester bond, n 2 are each independently 1 to (4+2n 1 ), n 3 are each independently 0 to (4+2n 1 -n 2 ) is an integer. [3] The composition for forming an optical part according to [2], wherein the compound represented by formula (1) is represented by the following formula (2): [ka] (In the formula (2), X, R, R 1 , R 2 , n 4 and n 5 is defined as the same as formula (1), n 2 are each independently an integer from 1 to 6, n 3 are each independently 0 to (6-n 2 ) is an integer. [4] The composition for forming an optical part according to [2], wherein the compound represented by formula (1) is represented by the following formula (3): [ka] (In the formula (3), X and R 1 , R 2 , n 4 and n 5 is defined as the same as formula (1), n 3 are each independently an integer of 0 to 5. [5] The composition for forming an optical part according to [2], wherein the compound represented by formula (1) is represented by the following formula (4): [ka] (In the formula (4), X, R, R 1 , R 2 , n 1 , n 2 and n 3 is defined as the same as formula (1), n 5 are each independently an integer of 0 to 4. [6] The composition for forming an optical part according to [2], wherein the compound represented by formula (1) is represented by the following formula (5): [ka] (In the formula (5), X and R 1 and R 2 is defined as the same as formula (1), n 3 are each independently an integer of 0 to 5, n 5 are each independently an integer of 0 to 4. [7] A composition for forming an optical component, comprising a resin having a structural unit derived from a compound represented by the following formula (0): [ka] (In the formula (0), X represents an oxygen atom, a sulfur atom, or no crosslinking. R 0 are each independently an alkyl group having 1 to 30 carbon atoms which may have a substituent, an aryl group having 6 to 30 carbon atoms which may have a substituent, an alkenyl group having 2 to 30 carbon atoms which may have a substituent, an alkynyl group having 2 to 30 carbon atoms which may have a substituent, an alkoxy group having 1 to 30 carbon atoms which may have a substituent, a halogen atom, a nitro group, an amino group, a carboxyl group, a crosslinkable group, a dissociable group, a thiol group, or a hydroxyl group, wherein R 0 At least one of R 0 The alkyl group, the aryl group, the alkenyl group, the alkynyl group, and the alkoxy group in the formula (I) may contain an ether bond, a ketone bond, or an ester bond; R 2 are each independently an alkyl group having 1 to 30 carbon atoms which may have a substituent, an aryl group having 6 to 30 carbon atoms which may have a substituent, an alkenyl group having 2 to 30 carbon atoms which may have a substituent, an alkynyl group having 2 to 30 carbon atoms which may have a substituent, an alkoxy group having 1 to 30 carbon atoms which may have a substituent, a halogen atom, a nitro group, an amino group, a carboxyl group, a crosslinkable group, a dissociable group, a thiol group or a hydroxyl group, wherein R 2 The alkyl group, the aryl group, the alkenyl group, the alkynyl group, and the alkoxy group in the formula (I) may contain an ether bond, a ketone bond, or an ester bond; n 1 are each independently an integer of 1 to 2, n 0 are each independently 0 to (4+2n 1 ), where n 0 At least one of the following is 1~(4+2n 1 ) and n 4 are each independently an integer of 0 to 1, n 5 are each independently 0 to (4+2n 4 ) is an integer. [8] The composition for forming an optical part according to [7], wherein the resin has a structure represented by the following formula (6): [ka] (In the formula (6), L is a divalent group having 1 to 60 carbon atoms, and M is a unit structure derived from the compound.) [9] The composition for forming an optical part according to any one of [1] to [8], wherein X is an oxygen atom or a sulfur atom.

[10] The composition for forming an optical part according to any one of [1] to [9], further comprising a solvent.

[11] The composition for forming an optical part according to any one of [1] to

[10] , further comprising an acid generator.

[12] The composition for forming an optical part according to any one of [1] to

[11] , further comprising a crosslinking agent. Effect of the Invention

[0009] According to the present invention, it is possible to provide a composition for forming an optical component that can achieve both a high refractive index and high transparency. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present invention (also referred to as "the present embodiment") will be described. Note that the present embodiment is an example for explaining the present invention, and the present invention is not limited to only the present embodiment.

[0011] In this specification, unless otherwise specified, the term "alkyl group" may be a linear or branched alkyl group or a cyclic alkyl group, and is used in the sense that it encompasses these. Similarly, unless otherwise specified, the term "alkoxy group" may be a linear or branched alkoxy group or a cyclic alkoxy group, and is used in the sense that it encompasses these.

[0012] [Composition for forming optical components] The composition for forming an optical component of the present embodiment contains a compound represented by the following formula (0). [ka] (In the formula (0), X represents an oxygen atom, a sulfur atom, or no crosslinking. R 0 are each independently an alkyl group having 1 to 30 carbon atoms which may have a substituent, an aryl group having 6 to 30 carbon atoms which may have a substituent, an alkenyl group having 2 to 30 carbon atoms which may have a substituent, an alkynyl group having 2 to 30 carbon atoms which may have a substituent, an alkoxy group having 1 to 30 carbon atoms which may have a substituent, a halogen atom, a nitro group, an amino group, a carboxyl group, a crosslinkable group, a dissociable group, a thiol group, or a hydroxyl group, wherein R 0 At least one of R 0 The alkyl group, the aryl group, the alkenyl group, the alkynyl group, and the alkoxy group in the formula (I) may contain an ether bond, a ketone bond, or an ester bond; R 2 are each independently an alkyl group having 1 to 30 carbon atoms which may have a substituent, an aryl group having 6 to 30 carbon atoms which may have a substituent, an alkenyl group having 2 to 30 carbon atoms which may have a substituent, an alkynyl group having 2 to 30 carbon atoms which may have a substituent, an alkoxy group having 1 to 30 carbon atoms which may have a substituent, a halogen atom, a nitro group, an amino group, a carboxyl group, a crosslinkable group, a dissociable group, a thiol group or a hydroxyl group, wherein R 2 The alkyl group, the aryl group, the alkenyl group, the alkynyl group, and the alkoxy group in the formula (I) may contain an ether bond, a ketone bond, or an ester bond; n 1 are each independently an integer of 1 to 2, n 0 are each independently 0 to (4+2n 1 ), where n 0 At least one of the following is 1~(4+2n1 ) and n 4 are each independently an integer of 0 to 1, n 5 are each independently 0 to (4+2n 4 ) is an integer.

[0013] Compound (0) is preferably a compound represented by the following formula (0') (hereinafter, also simply referred to as "compound (0')"). [ka] (In the above formula (0'), R 0 , R 2 , n 1 , n 0 , n 4 and n 5 has the same meaning as in formula (0), p1, p2, p3, and p4 each represent a condensation position in each condensed ring, and n1' represents an integer of 0 to 1. In the formula (0'), the condensation positions in the condensed ring (anthracene ring) are more preferably p1, p2 and / or p3, p4 in the above formula (0'). The condensation positions referred to here are the positions of the anthracene ring (n 1' This refers to the position of the edge shared by each aromatic ring within the structure (i.e., the symmetry of the aromatic rings).

[0014] The composition for forming an optical part of this embodiment contains compound (0), and is therefore useful as an optical part forming material that can achieve both a high refractive index and high transparency. More specifically, the composition for forming an optical part of this embodiment typically has the following characteristics (I) to (IV) (hereinafter also simply referred to as "predetermined characteristics") due to the structure of compound (0).

[0015] (I) Compound (0) has excellent solubility in organic solvents (especially safe solvents). Therefore, when compound (0) is used as a material for forming optical components, optical components can be formed by a wet process such as spin coating or screen printing.

[0016] (II) Compound (0) has a relatively high carbon concentration and a relatively low oxygen concentration. In addition, when compound (0) has a phenolic hydroxyl group in the molecule, it is particularly useful for forming a cured product by reaction with a curing agent, but compound (0) alone can also form a cured product by crosslinking the phenolic hydroxyl group during high-temperature baking. Due to these factors, compound (0) can exhibit particularly high heat resistance when it has a phenolic hydroxyl group, and when compound (0) is used as a material for forming optical components, film deterioration during high-temperature baking can be suppressed and coloring can be suppressed.

[0017] (III) As described above, compound (0) can exhibit high heat resistance and transparency, and has excellent adhesion to resist films and resist intermediate layer film materials. Therefore, when compound (0) is used as an optical component forming material, it has excellent optical component formability. Note that the "optical component formability" here refers to the property that the formed optical components are unlikely to have major defects and have excellent optical properties such as light transmittance over a wide temperature range.

[0018] (IV) Compound (0) has a high refractive index due to its high aromatic ring density, and is inhibited from becoming discolored even when subjected to heat treatment, and has excellent transparency.

[0019] The functional groups constituting the compound in this embodiment will be described below.

[0020] The alkyl group is not particularly limited, and examples thereof include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a tert-butyl group, an n-pentyl group, a neopentyl group, a tert-pentyl group, an n-hexyl group, an n-heptyl group, a 2,2,4-trimethylpentyl group, an n-octyl group, an isooctyl group, an n-nonyl group, an n-decyl group, an n-undecyl group, an n-dodecyl group, an n-tridecyl group, an n-tetradecyl group, an n-pentadecyl group, an n-hex ... Examples of the alkyl group include linear or branched alkyl groups having 1 to 30 carbon atoms, such as decyl group, n-heptadecyl group, n-octadecyl group, n-nonadecyl group, n-heneicosyl group, n-tricosyl group, n-pentacosyl group, n-heptacosyl group, and n-nonacosyl group. From the viewpoint of making the specific characteristics of the present embodiment more effective, linear or branched alkyl groups having 1 to 20 carbon atoms are preferred, and linear or branched alkyl groups having 1 to 10 carbon atoms are more preferred. Examples of the cyclic alkyl group include monocyclic groups (monocyclic cycloalkyl groups) and polycyclic groups (polycyclic cycloalkyl groups). Examples of the monocyclic group include, but are not limited to, monocyclic groups having 3 to 30 carbon atoms, such as cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cyclopentyl group, cycloheptyl group, cyclooctyl group, cyclodecyl group, and cycloicosyl group. The polycyclic group is not particularly limited, but examples thereof include polycyclic groups having 7 to 30 carbon atoms, such as a dicyclopentyl group, a dicyclohexyl group, a norbornyl group, an adamantyl group, a tricyclodecyl group, and a tetracyclododecyl group.

[0021] The alkyl group may have a substituent. The substituent is not particularly limited, but examples thereof include a halogen atom (e.g., a fluorine atom, a chlorine atom, and a bromine atom), a nitro group, an amino group that may have a substituent, a carboxyl group, a thiol group, and a hydroxyl group. The number of the substituent is not particularly limited, and may be one or more.

[0022] The aryl group is not particularly limited, and examples thereof include aryl groups having 6 to 30 carbon atoms, such as a phenyl group, a naphthyl group (e.g., a 1-naphthyl group and a 2-naphthyl group), an anthryl group (e.g., a 1-anthryl group), and a phenanthryl group (e.g., a 1-phenanthryl group). From the viewpoint of making the predetermined characteristics of the present embodiment more effective, an aryl group having 6 to 10 carbon atoms, such as a phenyl group or a naphthyl group, is preferable, and a phenyl group is more preferable.

[0023] The aryl group may have a substituent. The substituent is not particularly limited, but may be, for example, the substituent exemplified as the substituent of the alkyl group in formula (0) and the alkyl group exemplified as the alkyl group in formula (0). The number of the substituent is not particularly limited, and may be one or more.

[0024] The alkenyl group is not particularly limited, and examples thereof include alkenyl groups having 2 to 30 carbon atoms, such as ethenyl, propenyl, butenyl, pentenyl, and hexenyl. The alkenyl group may have a substituent. The substituent is not particularly limited, and examples thereof include the substituents exemplified as the substituents of the alkyl group in formula (0) and the alkyl groups exemplified as the alkyl group in formula (0). The number of the substituents is not particularly limited, and may be one or more.

[0025] The alkynyl group is not particularly limited, and examples thereof include alkynyl groups having 2 to 30 carbon atoms, such as ethynyl and propargyl groups. The alkynyl group may have a substituent. The substituent is not particularly limited, and examples thereof include the substituents exemplified as the substituents of the alkyl group in formula (0) and the alkyl groups exemplified as the alkyl group in formula (0). The number of the substituents is not particularly limited, and may be one or more.

[0026] The alkoxy group is not particularly limited, but examples thereof include -OR a (wherein Ra represents an alkyl group exemplified as the alkyl group in formula (0). ) and other alkoxy groups having 1 to 30 carbon atoms are included. Among these, from the viewpoint of making the predetermined characteristics of the present embodiment more effective, it is preferable to use a linear or branched alkoxy group having 1 to 6 carbon atoms, such as a methoxy group, an ethoxy group, an n-propoxy group, an isopropoxy group, an n-butoxy group, an isobutoxo group, or a tert-butoxy group, more preferably a linear or branched alkoxy group having 1 to 3 carbon atoms, and even more preferably a methoxy group or an ethoxy group. The alkoxy group may have a substituent. The substituent is not particularly limited, and examples thereof include the substituents exemplified as the substituents of the alkyl group in formula (0) and the alkyl group exemplified as the alkyl group in formula (0). The number of substituents is not particularly limited, and may be one or more.

[0027] The halogen atom is not particularly limited, but examples thereof include a chlorine atom, a bromine atom, and an iodine atom.

[0028] In formula (0), R 0 At least one of R 0 By having this, the material has a predetermined characteristic. In addition, when the compound (0) of the present embodiment is a compound represented by formula (0'), the density tends to be high, so the number of atoms contained per unit thickness increases, which tends to be particularly advantageous for thin film formation. From the same viewpoint, when the condensation positions in the condensed ring (anthracene ring) in formula (0') are p1, p2, p3, and p4 in formula (0'), it tends to be even more advantageous for thin film formation.

[0029] In the present embodiment, the term "crosslinkable group" refers to a group that crosslinks in the presence or absence of a catalyst. The crosslinkable group is not particularly limited, but examples thereof include alkoxy groups having 1 to 20 carbon atoms, groups having an allyl group, groups having a (meth)acryloyl group, groups having an epoxy (meth)acryloyl group, groups having a hydroxyl group, groups having a urethane (meth)acryloyl group, groups having a glycidyl group, groups having a vinyl-containing phenylmethyl group, groups having various alkynyl groups, groups having a carbon-carbon double bond, groups having a carbon-carbon triple bond, and groups containing these groups, and the like, and the like, and the like, can be mentioned as groups that crosslink in the presence or absence of a catalyst. The above-mentioned "groups containing these groups" are preferably alkoxy groups represented by -ORx (Rx is a group having an allyl group, a group having a (meth)acryloyl group, a group having an epoxy (meth)acryloyl group, a group having a hydroxyl group, a group having a urethane (meth)acryloyl group, a group having a glycidyl group, a group having a vinyl-containing phenylmethyl group, a group having various alkynyl groups, a group having a carbon-carbon double bond, a group having a carbon-carbon triple bond, and groups containing these groups.). In this specification, when the functional groups (excluding the crosslinkable group) described above as constituting the compound of this embodiment overlap with the crosslinkable group, those without crosslinkability are treated as corresponding to each functional group, and those with crosslinkability are treated as corresponding to the crosslinkable group, based on the presence or absence of crosslinkability.

[0030] The group having an allyl group is not particularly limited, but examples thereof include groups represented by the following formula (X-1).

[0031] [ka] (In formula (X-1), n X1 is an integer from 1 to 5.

[0032] The group having a (meth)acryloyl group is not particularly limited, but examples thereof include groups represented by the following formula (X-2).

[0033] [ka] (In formula (X-2), n X2 is an integer from 1 to 5, and R X is a hydrogen atom or a methyl group.

[0034] The group having an epoxy(meth)acryloyl group is not particularly limited, but examples thereof include a group represented by the following formula (X-3): Here, the epoxy(meth)acryloyl group refers to a group generated by reaction of an epoxy(meth)acrylate with a hydroxyl group.

[0035] [ka] (In formula (X-3), n x3 is an integer from 0 to 5, preferably 0; R X is a hydrogen atom or a methyl group, and a methyl group is preferable.

[0036] The group having a urethane (meth)acryloyl group is not particularly limited, but examples thereof include groups represented by the following formula (X-4).

[0037] [ka] (In the general formula (X-4), n x4 is an integer of 0 to 5, preferably 0; s is an integer of 0 to 3, preferably 0; R X is a hydrogen atom or a methyl group, and a methyl group is preferable.

[0038] The group having a hydroxyl group is not particularly limited, but examples thereof include groups represented by the following formula (X-5).

[0039] [ka] (In the general formula (X-5), n x5 is an integer of 1 to 5, preferably 1.

[0040] The group having a glycidyl group is not particularly limited, but examples thereof include groups represented by the following formula (X-6).

[0041] [ka] (In formula (X-6), n x6 is an integer from 1 to 5.

[0042] The group having a vinyl-containing phenylmethyl group is not particularly limited, but examples thereof include groups represented by the following formula (X-7).

[0043] [ka] (In formula (X-7), n x7 is an integer of 1 to 5, preferably 1.

[0044] The groups having various alkynyl groups are not particularly limited, but examples thereof include groups represented by the following formula (X-8).

[0045] [ka] (In formula (X-8), n x8 is an integer from 1 to 5.

[0046] Examples of the carbon-carbon double bond-containing group include a (meth)acryloyl group, a substituted or unsubstituted vinylphenyl group, a group represented by the following formula (X-9-1), etc. Examples of the carbon-carbon triple bond-containing group include a substituted or unsubstituted ethynyl group, a substituted or unsubstituted propargyl group, and groups represented by the following formulas (X-9-2) and (X-9-3), etc.

[0047] [ka]

[0048] [ka]

[0049] [ka]

[0050] In the above formula (X-9-1), R X9A , R X9B and R X9C are each independently a hydrogen atom or a monovalent hydrocarbon group having 1 to 20 carbon atoms. X9D , R X9E and R X9F are each independently a hydrogen atom or a monovalent hydrocarbon group having 1 to 20 carbon atoms.

[0051] In the present embodiment, the term "dissociable group" refers to a group that dissociates in the presence or absence of a catalyst. Among dissociable groups, an acid-dissociable group refers to a group that is cleaved in the presence of an acid and changes into an alkali-soluble group or the like. The alkali-soluble group is not particularly limited, but examples thereof include a phenolic hydroxyl group, a carboxyl group, a sulfonic acid group, a hexafluoroisopropanol group, and the like. Among these, from the viewpoint of easy availability of an introduction reagent, a phenolic hydroxyl group and a carboxyl group are preferred, and a phenolic hydroxyl group is more preferred. The acid-dissociable group preferably has the property of undergoing a chain cleavage reaction in the presence of an acid, in order to enable pattern formation with high sensitivity and high resolution. The acid-dissociable group is not particularly limited, but can be appropriately selected from those proposed for example in hydroxystyrene resins, (meth)acrylic acid resins, and the like used in chemically amplified resist compositions for KrF or ArF. Specific examples of the acid-dissociable group include those described in International Publication No. 2016 / 158168. Examples of the acid-dissociable group include 1-substituted ethyl groups, 1-substituted n-propyl groups, 1-branched alkyl groups, silyl groups, acyl groups, 1-substituted alkoxymethyl groups, cyclic ether groups, alkoxycarbonyl groups (e.g., -C(O)OC(CH3)3, etc.), and alkoxycarbonylalkyl groups (e.g., -(CH2) n C(O)OC(CH3)3, where n = 1 to 4. In this specification, when the functional groups (excluding dissociable groups) described above as constituting the compound of this embodiment overlap with dissociable groups, those that are not dissociable are treated as corresponding to the functional groups, and those that are dissociable are treated as corresponding to the dissociable groups, based on the presence or absence of dissociability.

[0052] The substituent on the dissociative group is not particularly limited, but examples thereof include a halogen atom, an alkyl group, an aryl group, an aralkyl group, an alkenyl group, an acyl group, an alkoxycarbonyl group, an alkyloyloxy group, an aryloyloxy group, a cyano group, a nitro group, and a heteroatom. The halogen atom is not particularly limited, but examples thereof include a chlorine atom, a bromine atom, and an iodine atom. The alkyl group may be linear, branched or cyclic. The alkyl group is not particularly limited, but examples thereof include alkyl groups having 1 to 10 carbon atoms, such as a methyl group, a tert-butyl group, a cyclohexyl group, and an adamantyl group. The aryl group is not particularly limited, but examples thereof include aryl groups having 6 to 20 carbon atoms, such as a phenyl group, a tolyl group, and a naphthyl group. The aryl group may further have a substituent such as a halogen atom or an alkyl group having 1 to 5 carbon atoms. The aralkyl group is not particularly limited, but examples thereof include a benzyl group, a phenethyl group, etc. The aralkyl group may further have a substituent such as a halogen atom or an alkyl group having 1 to 5 carbon atoms. The alkynyl group is not particularly limited, but examples thereof include an ethynyl group and a propargyl group. The acyl group is not particularly limited, but examples thereof include aliphatic acyl groups having 1 to 6 carbon atoms, such as a formyl group or an acetyl group, and aromatic acyl groups, such as a benzoyl group. The alkoxycarbonyl group is not particularly limited, but examples thereof include alkoxycarbonyl groups having 2 to 5 carbon atoms, such as a methoxycarbonyl group. The alkyloyloxy group is not particularly limited, but may be, for example, an acetoxy group. The aryloyloxy group is not particularly limited, but examples thereof include a benzoyloxy group.

[0053] The heteroatom is not particularly limited, but examples thereof include an oxygen atom, a sulfur atom, a selenium atom, a nitrogen atom, and a phosphorus atom. Heteroatoms may replace carbon atoms in each group. In addition, the number of carbon atoms of each group described in this specification, when the group contains the above-mentioned substituents, is the total number of carbon atoms including the substituents.

[0054] X in the compound (0) represents an oxygen atom, a sulfur atom, or no crosslinking. In the present embodiment, from the viewpoint of increasing the refractive index, X is preferably an oxygen atom or a sulfur atom, and more preferably an oxygen atom.

[0055] n in compound (0) 1 are each independently an integer of 1 to 2, preferably 1. 0 are each independently an integer from 0 to (4+2n1), where n 0 At least one of the following is 1~(4+2n 1 ), preferably 1 to 2. 4 is an integer of 0 to 1, preferably 0. 5 is 0~(4+2n 4 ) and is preferably an integer of 0 to 2. In this embodiment, from the viewpoint of making a predetermined characteristic more effective, n 1 = 1 and n 4It is preferred that =0.

[0056] In this embodiment, from the viewpoint of making the predetermined properties more effective, compound (0) in this embodiment preferably has a cardo structure.

[0057] Although the compound (0) has a relatively low molecular weight, it has high heat resistance due to the rigidity of its structure, and can therefore be used even under high temperature baking conditions.

[0058] Since compound (0) has high solubility in organic solvents (especially safe solvents), a relatively low molecular weight, and a low viscosity, the composition for forming an optical component of the present embodiment containing compound (0) has excellent flatness and formability for forming an optical component. Examples of the organic solvent include the organic solvents described below under [Solvent].

[0059] Compound (0) has a high refractive index due to its high aromatic ring density, and coloration is suppressed even by heat treatment over a wide range from low to high temperatures, making it useful for forming various optical components described below.

[0060] The optical component forming composition of the present embodiment is preferably used for forming optical components. The optical components are not particularly limited, but include, for example, film-like or sheet-like parts, plastic lenses such as prism lenses, lenticular lenses, microlenses, Fresnel lenses, viewing angle control lenses, and contrast-enhancing lenses, retardation films, films for electromagnetic shielding, prisms, optical fibers, solder resists for flexible printed wiring, plating resists, interlayer insulating films for multilayer printed wiring boards, photosensitive optical waveguides, liquid crystal displays, organic electroluminescence (EL) displays, light-emitting diode (LED) elements, solid-state imaging elements, organic thin-film solar cells, dye-sensitized solar cells, and organic thin-film transistors (TFTs). Compound (0) is particularly preferably used as a material for forming embedded films and planarizing films on photodiodes, which are components of solid-state imaging elements that require a high refractive index, planarizing films before and after color filters, microlenses, planarizing films on microlenses, and conformal films.

[0061] From the viewpoints of ease of crosslinking and solubility in organic solvents, compound (0) is preferably a compound represented by the following formula (1) (hereinafter also simply referred to as "compound (1)").

[0062] [ka] (In the above formula (1), X, R 2 , n 1 , n 4 and n 5 is defined as the same as formula (0), R's each independently represent a hydrogen atom, a linear alkyl group having 1 to 30 carbon atoms which may have a substituent, a branched or cyclic alkyl group having 3 to 30 carbon atoms which may have a substituent, an aryl group having 6 to 30 carbon atoms which may have a substituent, an alkenyl group having 2 to 20 carbon atoms which may have a substituent, an alkynyl group having 2 to 20 carbon atoms which may have a substituent, a crosslinkable group or a dissociable group, wherein at least one of R's is a hydrogen atom, a crosslinkable group or a dissociable group, R 1 each independently represents an alkyl group having 1 to 30 carbon atoms which may have a substituent, an aryl group having 6 to 30 carbon atoms which may have a substituent, an alkenyl group having 2 to 30 carbon atoms which may have a substituent, an alkynyl group having 2 to 30 carbon atoms which may have a substituent, an alkoxy group having 1 to 30 carbon atoms which may have a substituent, a halogen atom, a nitro group, an amino group, a carboxyl group or a thiol group, wherein the alkyl group, the aryl group, the alkenyl group, the alkynyl group and the alkoxy group may contain an ether bond, a ketone bond or an ester bond, n 2 are each independently 1 to (4+2n 1 ), n 3 are each independently 0 to (4+2n 1 -n 2 ) is an integer.

[0063] In formula (1), the alkyl group, the aryl group, the alkenyl group, the alkoxy group, the halogen atom, the crosslinkable group, the dissociable group, and the substituent substituting each group are not particularly limited, and examples thereof include each group exemplified in the explanation of formula (0).

[0064] n 2 are each independently 1 to (4+2n 1 ), preferably 1 to 2. 3 are each independently 0 to (4+2n 1 -n 2 ) and is preferably an integer of 0 to 2.

[0065] From the viewpoint of supplyability of the raw material, compound (1) is preferably a compound represented by the following formula (2) (hereinafter, also simply referred to as "compound (2)").

[0066] [ka] (In the formula (2), R, R 1 , R 2 , n 4 and n 5 is defined as the same as formula (1), n 2 are each independently an integer from 1 to 6, n 3 are each independently 0 to (6-n 2 ) is an integer.

[0067] From the viewpoint of a high refractive index, compound (2) is preferably a compound represented by the following formula (3) (hereinafter, also simply referred to as "compound (3)").

[0068] [ka] (In the above formula (3), R 1 , R 2 , n 4 and n 5 is defined as the same as formula (1), n 3 are each independently an integer of 0 to 5.

[0069] From the viewpoint of raw material supply, compound (1) is preferably a compound represented by the following formula (4) (hereinafter, also simply referred to as "compound (4)").

[0070] [ka] (In the formula (4), R, R 1 , R 2 , n 1 , n 2 and n 3 is defined as the same as formula (1), n 5 are each independently an integer of 0 to 4.

[0071] From the viewpoint of raw material supply, compound (1) is preferably a compound represented by the following formula (5) (hereinafter, also simply referred to as "compound (5)").

[0072] [ka] (In the above formula (5), R 1 and R 2 is defined as the same as formula (1), n 3 are each independently an integer of 0 to 5, n 5 are each independently an integer of 0 to 4.

[0073] Specific examples of the compound represented by the above formula (0) include compounds represented by the following formulas: However, the compound represented by the above formula (0) is not limited to the compounds represented by the following formulas.

[0074] [ka] [ka] [ka] [ka] [ka]

[0075] [Method for producing compound (0)] The method for producing the compound (0) is not particularly limited, but may be, for example, the following method. That is, under normal pressure, a compound represented by the following formula (0-x) (hereinafter, compound (0-x)), a compound represented by the following formula (0-y) (hereinafter, compound (0-y)), and a compound represented by the following formula (0-z) (hereinafter, compound (0-z)) are subjected to a polycondensation reaction under an acid catalyst or a base catalyst to obtain the compound (0). In the above polycondensation reaction, precursors of the compound (0-x), the compound (0-y), and the compound (0-y) may also be used. The above reaction may be carried out under pressure as necessary.

[0076] [ka]

[0077] In formula (0-x), R 0 , n 0 , n 1 and n 5 are as defined in formula (0). In formula (0-x), R 0 , n 0 , n 1 and n 5 are as defined in formula (0). In formula (0-z), R 2 , n 4 and n 5 are as defined in formula (0). The compound (0-x) and the compound (0-y) may be the same.

[0078] A specific example of the polycondensation reaction is not particularly limited, but for example, compound (0) can be obtained by polycondensation reaction of compound (0-x) and compound (0-y) with compound (0-z) or a precursor thereof in the presence of an acid catalyst or a base catalyst.

[0079] Compound (0-x) and compound (0-y) are not particularly limited, but examples thereof include 2,7-dihydroxynaphthalene, 2,7-dihydroxy-3-bromonaphthalene, 2-naphthol, and 2,6-dihydroxyanthracene. These compounds are used alone or in combination of two or more. Among these compounds, 2,7-dihydroxynaphthalene is preferred.

[0080] Compound (0-z) is not particularly limited, but for example, 9-fluorenone, 11H-benzo[b]fluoren-11-one, 11H-benzo[a]fluoren-11-one, 3,6-dibromo-9H-fluoren-9-one, 2-bromo-9-fluorenone, 2,7-dihydroxy-9H-fluoren-9-one, 2-hydroxy-9-fluorenone, etc. are mentioned. These compounds are used alone or in combination of two or more. Among these compounds, 9-fluorenone is preferred.

[0081] The acid catalyst used in the above reaction is not particularly limited, but examples thereof include inorganic acids such as hydrochloric acid, sulfuric acid, phosphoric acid, hydrobromic acid, and hydrofluoric acid, organic acids such as oxalic acid, malonic acid, succinic acid, adipic acid, sebacic acid, citric acid, fumaric acid, maleic acid, formic acid, p-toluenesulfonic acid, methanesulfonic acid, trifluoroacetic acid, dichloroacetic acid, trichloroacetic acid, trifluoromethanesulfonic acid, benzenesulfonic acid, naphthalenesulfonic acid, and naphthalenedisulfonic acid, Lewis acids such as zinc chloride, aluminum chloride, iron chloride, and boron trifluoride, and solid acids such as silicotungstic acid, phosphotungstic acid, silicomolybdic acid, and phosphomolybdic acid. These acid catalysts are used alone or in combination of two or more. Among these, from the viewpoint of production, organic acids and solid acids are preferred, and from the viewpoint of production, such as ease of availability and ease of handling, it is preferred to use hydrochloric acid or sulfuric acid. The amount of the acid catalyst used can be appropriately set depending on the raw materials and catalyst used, as well as the reaction conditions, and is not particularly limited, but is preferably 0.01 to 100 parts by mass per 100 parts by mass of the reaction raw materials.

[0082] The base catalyst used in the above reaction is not particularly limited, and examples thereof include metal alkoxides (alkali metal or alkaline earth metal alkoxides such as sodium methoxide, sodium ethoxide, potassium methoxide, potassium ethoxide, etc.), metal hydroxides (alkali metal or alkaline earth metal hydroxides such as sodium hydroxide, potassium hydroxide, etc.), alkali metal or alkaline earth hydrogen carbonates such as sodium hydrogen carbonate, potassium hydrogen carbonate, etc., amines (for example, tertiary amines (trialkylamines such as triethylamine, aromatic tertiary amines such as N,N-dimethylaniline, heterocyclic tertiary amines such as 1-methylimidazole, etc.), and the like. Examples of the base catalyst include organic bases such as carboxylic acid metal salts (alkali metal acetate or alkaline earth metal salts such as sodium acetate and calcium acetate). These base catalysts are used alone or in combination of two or more. Among these, metal alkoxides, metal hydroxides and amines are preferred from the viewpoint of production, and sodium hydroxide is preferred from the viewpoint of production such as ease of availability and ease of handling. The amount of the base catalyst used can be appropriately set depending on the raw materials and catalysts used, as well as the reaction conditions, and is not particularly limited, but is preferably 0.01 to 100 parts by mass with respect to 100 parts by mass of the reaction raw materials.

[0083] In the above reaction, a reaction solvent may be used. The reaction solvent is not particularly limited, but examples thereof include water, methanol, ethanol, propanol, butanol, tetrahydrofuran, dioxane, 1-methoxy-2-propanol, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, etc. These solvents may be used alone or in combination of two or more.

[0084] The amount of the solvent used can be appropriately set depending on the raw materials and catalyst used, as well as the reaction conditions, and is not particularly limited, but is preferably in the range of 0 to 2000 parts by mass per 100 parts by mass of the reaction raw materials. Furthermore, the reaction temperature in the above reaction can be appropriately selected depending on the reactivity of the reaction raw materials, and is not particularly limited, but is usually in the range of 10 to 200°C.

[0085] In order to obtain compound (0), the reaction temperature is preferably high, specifically, in the range of 60 to 200°C. The reaction method is not particularly limited, but for example, the raw materials (reactants) and the catalyst are charged all at once, or the raw materials (reactants) are successively dropped in the presence of a catalyst. After the polycondensation reaction is completed, the isolation of the obtained compound can be carried out according to a conventional method, and is not particularly limited. For example, in order to remove unreacted raw materials and catalysts present in the system, the temperature of the reaction vessel is increased to 130 to 230°C, and the volatile matter is removed at about 1 to 50 mmHg, and the target compound can be obtained by adopting a general method.

[0086] Preferable reaction conditions include using 1.0 mole to excess of the compound represented by the above formula (0-x) and the compound represented by the above formula (0-y) per mole of the ketone represented by the above formula (0-z), and further using 0.001 to 1 mole of an acid catalyst, and reacting at normal pressure at 50 to 150° C. for about 20 minutes to 100 hours.

[0087] After the reaction is completed, the target product can be isolated by a known method. For example, the reaction solution is concentrated, pure water is added to precipitate the reaction product, and the reaction product is cooled to room temperature, filtered to separate the product, and the solid obtained is filtered and dried, and then separated and purified from the by-products by column chromatography, and the target compound (0) can be obtained by distilling off the solvent, filtering, and drying the product.

[0088] [resin] The resin in this embodiment contains a structural unit derived from the compound represented by the above formula (0). That is, the resin in this embodiment contains the compound represented by the above formula (0) as a monomer component. As the resin in this embodiment, a resin having a structure represented by the following formula (6) (hereinafter, also simply referred to as "resin (6)") is preferable.

[0089] [ka] (In formula (6), L is a divalent group having 1 to 60 carbon atoms, and M is a unit structure derived from a compound represented by any one of formulas (0) to (5).)

[0090] Examples of the linking group include residues derived from crosslinkable compounds described below. L is preferably a divalent hydrocarbon group having 1 to 30 carbon atoms. The divalent hydrocarbon group is not particularly limited, but examples thereof include linear or branched hydrocarbon groups such as alkylene groups, and cyclic hydrocarbon groups.

[0091] The resin (6) can be obtained by reacting the compound (0) with a compound having crosslinking reactivity.

[0092] The crosslinkable compound may be any compound capable of oligomerizing or polymerizing compound (0), and examples thereof include aldehydes, ketones, carboxylic acids, carboxylic acid halides, halogen-containing compounds, amino compounds, imino compounds, isocyanate compounds, and unsaturated hydrocarbon group-containing compounds.

[0093] The resin (6) is not particularly limited, but examples thereof include novolak resins obtained by a condensation reaction between the compound (0) and an aldehyde or ketone, which is a crosslinkable compound.

[0094] Here, the aldehydes used in converting the compound (0) into a novolak are not particularly limited, but examples thereof include formaldehyde, trioxane, paraformaldehyde, benzaldehyde, acetaldehyde, propylaldehyde, phenylacetaldehyde, phenylpropionaldehyde, hydroxybenzaldehyde, chlorobenzaldehyde, nitrobenzaldehyde, methylbenzaldehyde, dimethylbenzaldehyde, trimethylbenzaldehyde, pentamethylbenzaldehyde, ethylbenzaldehyde, propylbenzaldehyde, butylbenzaldehyde, pentylbenzaldehyde, butylmethylbenzaldehyde, and the like. Examples of the aldehydes include aldehyde, hydroxybenzaldehyde, dihydroxybenzaldehyde, fluoromethylbenzaldehyde, cyclopropanecarbaldehyde, cyclobutancarbaldehyde, cyclohexanecarbaldehyde, cyclodecanecarbaldehyde, cycloundecanecarbaldehyde, cyclopropylbenzaldehyde, cyclobutylbenzaldehyde, cyclohexylbenzaldehyde, cyclodecylbenzaldehyde, cycloundecylbenzaldehyde, biphenylaldehyde, naphthaldehyde, anthracenecarbaldehyde, phenanthrenecarbaldehyde, pyrenecarbaldehyde, and furfural. These aldehydes may be used alone or in combination of two or more. In addition to these aldehydes, one or more ketones may also be used in combination.Among these, from the viewpoint of exhibiting high heat resistance, at least one selected from the group consisting of benzaldehyde, phenylacetaldehyde, phenylpropylaldehyde, hydroxybenzaldehyde, chlorobenzaldehyde, nitrobenzaldehyde, methylbenzaldehyde, ethylbenzaldehyde, butylbenzaldehyde, cyclohexylbenzaldehyde, biphenylaldehyde, naphthaldehyde, anthracenecarbaldehyde, phenanthrenecarbaldehyde, pyrenecarbaldehyde, and furfural is preferably used. is preferred, and from the viewpoint of improving the etching resistance, it is preferred to use one or more selected from the group consisting of benzaldehyde, hydroxybenzaldehyde, chlorobenzaldehyde, nitrobenzaldehyde, methylbenzaldehyde, ethylbenzaldehyde, butylbenzaldehyde, cyclohexylbenzaldehyde, biphenylaldehyde, naphthaldehyde, anthracenecarbaldehyde, phenanthrenecarbaldehyde, pyrenecarbaldehyde, and furfural, and it is more preferred to use formaldehyde. The amount of aldehyde used is not particularly limited, but is preferably 0.2 to 5 mol, more preferably 0.5 to 2 mol, per 1 mol of compound (0).

[0095] The ketones used in converting the compound (0) into a novolak are not particularly limited, and examples thereof include acetone, methyl ethyl ketone, cyclobutanone, cyclopentanone, cyclohexanone, norbornanone, cyclohexanedione, cyclohexanetrione, cyclodecane trione, adamantanone, fluorenone, benzofluorenone, dibenzofluorenone, acenaphthenequinone, acenaphthenone, anthraquinone, acetophenone, diacetylbenzene, triacetylbenzene, acetonaphthone, acetylmethylbenzene, acetyldimethylbenzene, acetyltrimethylbenzene, acetylethylbenzene, acetylpropylbenzene, acetylbutylbenzene, acetylpentabenzene, acetylbutylmethylbenzene, acetylhydroxybenzene, acetyldihydroxybenzene, acetylfluoromethylbenzene, diphenylcarbonylnaphthalene, phenylcarbonylbiphenyl, diphenylcarbonylbiphenyl, benzophenone, diphenylcarbonylbenzene, triphenylcarbonylbenzene, benzonaphthone, diphenylcarbonylnaphthalene, phenylcarbonylbiphenyl, and diphenylcarbonylbiphenyl. These ketones may be used alone or in combination of two or more.Among these, from the viewpoint of exhibiting high heat resistance, cyclopentanone, cyclohexanone, norbornanone, tricyclohexanone, tricyclodecanone, adamantanone, fluorenone, benzofluorenone, acenaphthenequinone, acenaphthenone, anthraquinone, acetophenone, diacetylbenzene, triacetylbenzene, acetonaphthone, diphenylcarbonylnaphthalene, phenylcarbonylbiphenyl, diphenylcarbonylbiphenyl, benzophenone, diphenylcarbonylbenzene, triphenylcarbonylbenzene, benzonaphthone, diphenylcarbonylnaphthalene, phenylcarbonyl It is preferable to use one or more selected from the group consisting of acetophenone, diacetylbenzene, triacetylbenzene, acetonaphthone, diphenylcarbonylnaphthalene, phenylcarbonylbiphenyl, diphenylcarbonylbiphenyl, benzophenone, diphenylcarbonylbenzene, triphenylcarbonylbenzene, benzonaphthone, diphenylcarbonylnaphthalene, phenylcarbonylbiphenyl, and diphenylcarbonylbiphenyl. The amount of ketones used is not particularly limited, but is preferably 0.2 to 5 moles, more preferably 0.5 to 2 moles, per mole of compound (0).

[0096] A catalyst can also be used in the condensation reaction of compound (0) with aldehydes or ketones. The acid catalyst or base catalyst used here can be appropriately selected from known ones and is not particularly limited. Such acid catalysts and base catalysts are the same as the examples given in the production method of compound (0). These catalysts are used alone or in combination of two or more. Among them, from the viewpoint of production, organic acids and solid acids are preferred, and from the viewpoint of production, such as ease of availability and ease of handling, hydrochloric acid or sulfuric acid is preferred. The amount of the acid catalyst used can be appropriately set depending on the raw materials used and the types of catalysts used, and further reaction conditions, and is not particularly limited, but is preferably 0.01 to 100 parts by mass with respect to 100 parts by mass of the reaction raw materials.

[0097] However, in the case of a copolymerization reaction with a compound having a non-conjugated double bond, such as indene, hydroxyindene, benzofuran, hydroxyanthracene, acenaphthylene, biphenyl, bisphenol, trisphenol, dicyclopentadiene, tetrahydroindene, 4-vinylcyclohexene, norbornadiene, 5-vinylnorborn-2-ene, α-pinene, β-pinene, or limonene, aldehydes or ketones are not necessarily required.

[0098] In the condensation reaction of the compound (0) with aldehydes or ketones, a reaction solvent can also be used. The reaction solvent in this polycondensation can be appropriately selected from known solvents and is not particularly limited, but examples thereof include water, methanol, ethanol, propanol, butanol, 1-methoxy-2-propanol, tetrahydrofuran, dioxane, or a mixture thereof. These solvents can be used alone or in combination of two or more.

[0099] The amount of the solvent used can be appropriately set depending on the raw materials used, the type of catalyst used, and further the reaction conditions, and is not particularly limited, but is preferably in the range of 0 to 2000 parts by mass per 100 parts by mass of the reaction raw materials. Furthermore, the reaction temperature can be appropriately selected depending on the reactivity of the reaction raw materials, and is not particularly limited, but is usually in the range of 10 to 200°C. The reaction method may include a method in which the compound (0), aldehydes and / or ketones, and catalyst are charged all at once, or a method in which the compound (0), aldehydes and / or ketones are successively added dropwise in the presence of a catalyst.

[0100] After the polycondensation reaction is completed, the obtained resin can be isolated by a conventional method, and is not particularly limited. For example, in order to remove unreacted raw materials and catalysts present in the system, the temperature of the reaction vessel is raised to 130 to 230°C, and volatile matters are removed at about 1 to 50 mmHg, and a general method is adopted to obtain the target product (for example, a novolak resin).

[0101] The resin (6) may be one obtained during the synthesis reaction of the compound (0), i.e., the resin (6) may be a polymer of the compound (0) and an aldehyde or ketone derived from the raw material used in the synthesis of the compound (0).

[0102] Here, the resin (6) may be a homopolymer of the compound (0), or may be a copolymer with other phenols, etc. The copolymerizable phenols are not particularly limited, but examples thereof include phenol, cresol, dimethylphenol, trimethylphenol, butylphenol, phenylphenol, diphenylphenol, naphthylphenol, resorcinol, methylresorcinol, catechol, butylcatechol, methoxyphenol, methoxyphenol, propylphenol, pyrogallol, and thymol.

[0103] Resin (6) may be copolymerized with a polymerizable monomer other than the above-mentioned other phenols. The copolymerization monomer is not particularly limited, but may be, for example, naphthol, methylnaphthol, methoxynaphthol, dihydroxynaphthalene, indene, hydroxyindene, benzofuran, hydroxyanthracene, acenaphthylene, biphenyl, bisphenol, trisphenol, dicyclopentadiene, tetrahydroindene, 4-vinylcyclohexene, norbornadiene, vinylnorbornaene, pinene, limonene, etc. Resin (6) may be a two-component or more (e.g., two- to four-component) copolymer of compound (0) and the above-mentioned phenols, a two-component or more (e.g., two- to four-component) copolymer of compound (0) and the above-mentioned copolymerization monomers, or a three-component or more (e.g., three- to four-component) copolymer of compound (1), the above-mentioned phenols, and the above-mentioned copolymerization monomers.

[0104] The weight average molecular weight (Mw) of the resin (6) is not particularly limited, but is preferably 300 to 100,000, more preferably 500 to 30,000, and even more preferably 750 to 20,000, calculated as polystyrene by GPC measurement. From the viewpoints of increasing crosslinking efficiency and suppressing volatile components during baking, the resin (6) preferably has a dispersity (weight average molecular weight Mw / number average molecular weight Mn) in the range of 1 to 7.

[0105] The above-mentioned compound (0) and / or resin (6) are preferably highly soluble in a solvent, from the viewpoint of making it easier to apply a wet process. More specifically, when propylene glycol monomethyl ether (hereinafter also referred to as "PGME") and / or propylene glycol monomethyl ether acetate (hereinafter also referred to as "PGMEA") is used as a solvent, the solubility of the compound (0) and / or resin (6) in the solvent is preferably 10% by mass or more. Here, the solubility in PGME and / or PGMEA is defined as "mass of compound (0) and / or resin (6) ÷ (mass of compound (0) and / or resin (6) + mass of solvent) × 100 (mass%)". For example, 10 g of the above compound (0) and / or resin (6) is evaluated as having high solubility in 90 g of PGMEA when the solubility of the compound (0) and / or resin (6) in PGMEA is "10% by mass or more," and is evaluated as not having high solubility when the solubility is "less than 10% by mass."

[0106] [Components in the composition for forming optical components] The optical component forming composition of this embodiment contains compound (0) and / or resin (6). Therefore, wet process is applicable, and the composition has excellent heat resistance and flattening properties. Furthermore, since the optical component forming composition of this embodiment contains compound (0) and / or resin (6), the aromatic ring density is high, so the refractive index is high, and coloring is suppressed even by a wide range of heat treatment from low temperature to high temperature. Therefore, the optical component forming composition of this embodiment is suitable for forming optical components. In addition to compound (0) and / or resin (6), the composition may contain a solvent, a crosslinking agent, a crosslinking promoter, an acid generator, a basic compound, and other components as necessary. These optional components will be described below.

[0107] [solvent] The composition for forming an optical component of the present embodiment may contain a solvent. The solvent is not particularly limited as long as it can dissolve the compound (0) and / or the resin (6). As described above, the compound (0) and / or the resin (6) have excellent solubility in organic solvents, and therefore various organic solvents are preferably used.

[0108] The solvent is not particularly limited, but examples thereof include ketone-based solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, etc., cellosolve-based solvents such as PGME, PGMEA, etc., ester-based solvents such as ethyl lactate, methyl acetate, ethyl acetate, butyl acetate, isoamyl acetate, ethyl lactate, methyl methoxypropionate, methyl hydroxyisobutyrate, etc., alcohol-based solvents such as methanol, ethanol, isopropanol, 1-ethoxy-2-propanol, etc., aromatic hydrocarbons such as toluene, xylene, anisole, etc. These solvents may be used alone or in combination of two or more.

[0109] Among the above-mentioned solvents, from the viewpoint of safety, it is preferable to use one or more selected from the group consisting of cyclohexanone, PGME, PGMEA, ethyl lactate, methyl hydroxyisobutyrate, and anisole. In the composition for forming an optical component of the present embodiment, the amount of solid components is not particularly limited, but is preferably 1 to 80 mass %, more preferably 1 to 50 mass %, even more preferably 2 to 40 mass %, and even more preferably 2 to 10 mass % and 90 to 98 mass % of the solvent, relative to the total mass of the solid components and the solvent being 100 mass %. In the composition for forming an optical part of this embodiment, the amount of the solvent is not particularly limited, but is preferably 20 to 99 mass%, more preferably 50 to 99 mass%, even more preferably 60 to 98 mass%, and even more preferably 90 to 98 mass%, relative to 100 mass% of the total mass of the solid components and the solvent. In this specification, the term "solid components" refers to components other than the solvent.

[0110] The content of the solvent is not particularly limited, but from the viewpoints of solubility and film formation, it is preferably 100 to 10,000 parts by mass, more preferably 200 to 5,000 parts by mass, and even more preferably 200 to 1,000 parts by mass, relative to 100 parts by mass of the compound (0) and / or the resin (6).

[0111] [Crosslinking agent] The composition for forming an optical component of the present embodiment may contain a crosslinking agent from the viewpoint of improving the solvent resistance after forming the optical component, etc. The crosslinking agent is not particularly limited, but for example, those described in International Publication No. 2013 / 024779 and International Publication No. 2018 / 016614 can be used.

[0112] The crosslinking agent is not particularly limited, but examples thereof include phenol compounds, epoxy compounds, cyanate compounds, amino compounds, benzoxazine compounds, acrylate compounds, melamine compounds, guanamine compounds, glycoluril compounds, urea compounds, isocyanate compounds, and azide compounds. These crosslinking agents are used alone or in combination of two or more. Among these, it is preferable to use one or more selected from the group consisting of benzoxazine compounds, epoxy compounds, and cyanate compounds, and from the viewpoint of improving etching resistance, benzoxazine compounds are more preferable.

[0113] In the present embodiment, the content of the crosslinking agent is not particularly limited, but is preferably 0.1 to 100 parts by mass, more preferably 5 to 50 parts by mass, and even more preferably 10 to 40 parts by mass, relative to 100 parts by mass of the compound (0) and / or the resin (6). By having the content of the crosslinking agent within the above range, the solvent resistance after formation of the optical component tends to be improved, and the film formability after crosslinking tends to be improved.

[0114] [Crosslinking accelerator] The composition for forming an optical component of the present embodiment may contain a crosslinking accelerator to accelerate the crosslinking reaction (curing reaction) as necessary. Examples of the crosslinking accelerator include a radical polymerization initiator.

[0115] The radical polymerization initiator may be a photopolymerization initiator that initiates radical polymerization by light, or a thermal polymerization initiator that initiates radical polymerization by heat. The radical polymerization initiator is not particularly limited, but examples thereof include ketone-based photopolymerization initiators, organic peroxide-based polymerization initiators, and azo-based polymerization initiators.

[0116] Such a radical polymerization initiator is not particularly limited, but for example, those described in WO 2018 / 016614 can be used.

[0117] These radical polymerization initiators may be used alone or in combination of two or more.

[0118] The content of the radical polymerization initiator in this embodiment is not particularly limited, but is preferably 0.05 to 25 parts by mass, and more preferably 0.1 to 10 parts by mass, based on 100 parts by mass of the compound (0) or the resin (6). When the content of the radical polymerization initiator is 0.05 parts by mass or more, it tends to be possible to prevent insufficient curing, while when the content of the radical polymerization initiator is 25 parts by mass or less, it tends to be possible to prevent the long-term storage stability at room temperature from being impaired.

[0119] [Acid generator] The optical component forming composition of the present embodiment may contain an acid generator from the viewpoint of further promoting the crosslinking reaction by heat. As the acid generator, there are known ones that generate acid by thermal decomposition and ones that generate acid by light irradiation, and any of them can be used. As the acid generator, there is no particular limitation, but for example, those described in International Publication No. 2013 / 024779 can be used.

[0120] The content of the acid generator in the composition for forming an optical component is not particularly limited, but is preferably 0.1 to 50 parts by mass, more preferably 0.5 to 40 parts by mass, relative to 100 parts by mass of the compound (0) and / or the resin (6). When the content of the acid generator is within the above range, the crosslinking reaction tends to be enhanced, and the solvent resistance after the formation of the optical component tends to be improved.

[0121] [Basic compounds] The composition for forming an optical part of the present embodiment may contain a basic compound from the viewpoint of improving storage stability, etc. The basic compound plays a role of preventing a small amount of acid generated from the acid generator from proceeding with the crosslinking reaction, that is, plays a role of a quencher for the acid. Examples of such basic compounds include, but are not limited to, those described in WO 2013 / 024779.

[0122] The content of the basic compound in the composition for forming an optical part of the present embodiment is not particularly limited, but is preferably 0.001 to 2 parts by mass, more preferably 0.01 to 1 part by mass, relative to 100 parts by mass of the compound (0) and / or the resin (6). By having the content of the basic compound within the above range, the storage stability tends to be improved without excessively impairing the crosslinking reaction.

[0123] [Other additives] The optical part forming composition of this embodiment may contain other resins and / or compounds for the purpose of imparting curability by heat or light or controlling absorbance. Examples of such other resins and / or compounds are not particularly limited, but include naphthol resins, xylene resins, naphthol-modified resins, and phenol-modified resins of naphthalene resins; polyhydroxystyrene, dicyclopentadiene resins, (meth)acrylates, dimethacrylates, trimethacrylates, tetramethacrylates, vinylnaphthalene, polyacenaphthylene, and other naphthalene rings, phenanthrenequinone, fluorene, and other biphenyl rings, thiophene, indene, and other heterocyclic rings having heteroatoms or resins not containing aromatic rings; rosin-based resins, cyclodextrins, adamantane (poly)ols, tricyclodecane (poly)ols, and derivatives thereof, and other resins or compounds containing alicyclic structures. The lithography film forming composition of this embodiment may contain known additives other than those described above. Examples of known additives include, but are not limited to, heat and / or light curing catalysts, polymerization inhibitors, flame retardants, fillers, coupling agents, thermosetting resins, light curing resins, dyes, pigments, thickeners, lubricants, defoamers, leveling agents, ultraviolet absorbers, surfactants, colorants, and nonionic surfactants.

[0124] [Optical components] The composition for forming an optical component of this embodiment is used to form an optical component. That is, the optical component of this embodiment contains the composition for forming an optical component of this embodiment. The optical parts are not particularly limited, but examples thereof include film-like or sheet-like parts, plastic lenses such as prism lenses, lenticular lenses, microlenses, Fresnel lenses, viewing angle control lenses, and contrast-enhancing lenses, retardation films, films for electromagnetic shielding, prisms, optical fibers, solder resists for flexible printed wiring, plating resists, interlayer insulating films for multilayer printed wiring boards, photosensitive optical waveguides, liquid crystal displays, organic electroluminescence (EL) displays, light-emitting diode (LED) elements, solid-state imaging elements, organic thin-film solar cells, dye-sensitized solar cells, and organic thin-film transistors (TFTs). Compound (0) is preferably used as a material for forming embedded films and planarizing films on photodiodes, which are components of solid-state imaging elements that require a particularly high refractive index, planarizing films before and after color filters, microlenses, planarizing films on microlenses, and conformal films.

[0125] The optical component may be used as a film-like or sheet-like component, or may be an optical component formed by forming a desired pattern of the optical component on a layer formed from a composition for forming an optical component on a film, and then reflowing the pattern by heating as necessary.

[0126] Specific examples of the optical component of this embodiment when applied to devices include microlens materials, sealing materials for LEDs and PDs, and in the case of thin displays, thin film transistor protective films, liquid crystal color filter protective films, black matrices, spacers, etc. In particular, optical components containing the optical component-forming composition of this embodiment tend to have the excellent advantages of being excellent in heat resistance and moisture resistance, as well as being less susceptible to contamination by sublimation components, and tend to be materials that combine high sensitivity, high heat resistance, and moisture absorption reliability with less degradation of image quality due to important contamination, particularly in display materials.

[0127] When used for the applications described above, the composition for forming an optical component of this embodiment may be prepared by adding a curing agent and, if necessary, various additives such as other resins, surfactants, dyes, fillers, crosslinking agents, and dissolution promoters, and dissolving the mixture in an organic solvent.

[0128] The composition for forming an optical component of this embodiment can be prepared by blending the above-mentioned components and mixing them using a stirrer, etc. Furthermore, when the composition for forming an optical component of this embodiment contains a filler or a pigment, it can be prepared by dispersing or mixing using a dispersing device such as a dissolver, a homogenizer, or a three-roll mill.

[0129] [Method for purifying compound (0) and / or resin (6)] Before using the compound (0) and / or the resin (6) as the optical component forming composition of this embodiment, impurities can be sufficiently reduced by purification. Here, the purification method of the compound (0) and / or the resin (6) preferably includes an extraction step of contacting an organic solvent that is arbitrarily immiscible with water and a solution containing the compound (0) and / or the resin (6) (hereinafter, simply referred to as "solution (A)") with an acidic aqueous solution to perform extraction. More specifically, the purification method of this embodiment preferably includes dissolving the compound (0) and / or the resin (6) in an organic solvent that is arbitrarily immiscible with water, contacting the solution with an acidic aqueous solution to perform extraction treatment, thereby transferring metals contained in the solution (A) to the aqueous phase, and then separating the organic phase and the aqueous phase for purification. The purification method of this embodiment can significantly reduce the content of various metals in the compound or resin of this embodiment.

[0130] In this embodiment, the term "organic solvent that is not arbitrarily miscible with water" refers to a solvent that has a solubility in water of less than 50% by mass at 20°C, and preferably less than 25% by mass from the viewpoint of productivity. The organic solvent that is not arbitrarily miscible with water is not particularly limited, but is preferably an organic solvent that can be safely applied to the semiconductor manufacturing process. The amount of the organic solvent used is usually about 1 to 100 times by mass relative to the compound (0) and / or resin (6).

[0131] Specific examples of the organic solvent include, but are not limited to, those described in International Publication WO2015 / 080240. These solvents are used alone or in combination of two or more. Among these, toluene, 2-heptanone, cyclohexanone, cyclopentanone, methyl isobutyl ketone, PGMEA, ethyl acetate, etc. are preferred, and cyclohexanone and PGMEA are more preferred.

[0132] The acidic aqueous solution used is appropriately selected from among aqueous solutions in which a generally known organic compound or an inorganic compound is dissolved in water. For example, those described in International Publication WO2015 / 080240 can be mentioned. These acidic aqueous solutions are used alone or in combination of two or more. Among these, aqueous solutions of sulfuric acid, nitric acid, and carboxylic acids such as acetic acid, oxalic acid, tartaric acid, and citric acid are preferred, aqueous solutions of sulfuric acid, oxalic acid, tartaric acid, and citric acid are more preferred, and aqueous solutions of oxalic acid are even more preferred. Polycarboxylic acids such as oxalic acid, tartaric acid, and citric acid are coordinated to metal ions, and a chelating effect is generated, so that it is considered that metals can be removed more easily. In addition, the water used here is preferably one with a low metal content, such as ion-exchanged water, in line with the purpose of this embodiment.

[0133] The pH of the acidic aqueous solution used in this embodiment is not particularly limited, but in general, the pH range is preferably about 0 to 5, and more preferably about 0 to 3.

[0134] The amount of the acidic aqueous solution used in this embodiment is not particularly limited, but if the amount is too small, extraction must be performed many times to remove the metal, and conversely, if the amount of the aqueous solution is too large, the total amount of liquid becomes large, which may cause operational problems. The amount of the acidic aqueous solution used is usually preferably 10 to 200% by mass, and more preferably 20 to 100% by mass, relative to the solution (A).

[0135] In the purification method of the present embodiment, for example, the above-mentioned acidic aqueous solution is brought into contact with solution (A) to extract metal components.

[0136] The temperature during the extraction treatment is usually preferably 20 to 90°C, more preferably 30 to 80°C. The extraction operation is carried out, for example, by thoroughly mixing the solution by stirring or the like, and then allowing it to stand. This allows the metals contained in solution (A) to migrate to the aqueous phase. This operation also reduces the acidity of the solution, making it possible to suppress the deterioration of compound (0) and / or resin (6).

[0137] The resulting mixture is separated into an organic phase containing compound (0) and / or resin (6) and an organic solvent, and an aqueous phase, and the organic phase containing compound (0) and / or resin (6) and an organic solvent is recovered by decantation or the like. The time for leaving the mixture to stand is not particularly limited, but is preferably, for example, 1 minute or more, more preferably 10 minutes or more, and even more preferably 30 minutes or more. The extraction process may be performed only once, but it is also effective to repeat the operations of mixing, leaving the mixture to stand, and separating the mixture several times.

[0138] When such an extraction treatment is carried out using an acidic aqueous solution, it is preferable that the organic phase containing the compound (0) and / or resin (6) and the organic solvent, which is extracted and recovered from the acidic aqueous solution after the treatment, is further subjected to an extraction treatment with water. The extraction treatment is carried out by thoroughly mixing the organic phase with water by stirring or the like, and then leaving it to stand. The resulting solution is separated into a solution phase containing the compound (0) and / or resin (6) and the organic solvent and an aqueous phase, and the solution phase containing the compound (0) and / or resin (6) and the organic solvent is recovered by decantation or the like. In addition, the water used here is preferably one with a low metal content, such as ion-exchanged water, in line with the object of this embodiment. The extraction treatment may be carried out only once, but it is also effective to repeat the operations of mixing, leaving to stand, and separating several times. In addition, the ratio of both used in the extraction treatment, and the conditions such as temperature and time are not particularly limited, but may be the same as in the case of the contact treatment with the acidic aqueous solution described above.

[0139] Water contained in the solution containing compound (0) and / or resin (6) and an organic solvent thus obtained can be easily removed by performing an operation such as vacuum distillation, etc. Furthermore, the concentration of compound (0) and / or resin (6) can be adjusted to any desired concentration by adding an organic solvent, if necessary.

[0140] The method for obtaining only the compound (0) and / or the resin (6) from the obtained solution containing the compound (0) and / or the resin (6) and an organic solvent can be performed by a known method such as removal under reduced pressure, separation by reprecipitation, a combination thereof, etc. If necessary, known treatments such as a concentration operation, a filtration operation, a centrifugation operation, a drying operation, etc. can be performed.

[0141] The method for evaluating the amount of impurities in compound (0) and / or resin (6) after the purification method of the present embodiment, i.e., after purification, is not particularly limited, and can be evaluated based on the amount of various metals measured by ICP-MS as described in the Examples below. EXAMPLES

[0142] The present embodiment will be described in more detail below with reference to examples, but the present embodiment is not limited to these examples in any way.

[0143] (LC-MS analysis: molecular weight measurement) The molecular weight of the compound or resin was measured by liquid chromatography mass spectrometry (hereinafter, simply referred to as "LC-MS analysis") using an analytical device "Acquity UPLC / MALDI-Synapt HDMS" (product name, product of Waters Corporation).

[0144] (Mn, Mw and Mw / Mn) Mn, Mw and Mw / Mn were determined in terms of polystyrene by gel permeation chromatography (GPC) analysis under the following measurement conditions. Equipment: "Shodex GPC-101" (product name, manufactured by Showa Denko K.K.) Column: "KF-80M" x 3 (product name, manufactured by Showa Denko K.K.) Eluent: Tetrahydrofuran (hereinafter referred to as "THF") Flow rate: 1mL / min Temperature: 40℃

[0145] (ICP-MS) The measurements were carried out using an inductively coupled plasma mass spectrometer (hereinafter also referred to as "ICP-MS") "ELAN DRCII" (product name, manufactured by PerkinElmer).

[0146] [Synthesis of compound (0) and resin (6)] (Synthesis Example 1) Synthesis of compound (XBisN-F1) In a 1000 mL container equipped with a stirrer, a cooling tube, and a buret, 89.2 g (0.56 mol) of 2,7-dihydroxynaphthalene, 44.6 g (0.25 mol) of fluorenone, 4.86 g (0.05 mol) of sulfuric acid, and 500 mL of γ-butyrolactone were added, and the contents were stirred at 150 ° C. for 7 hours to carry out the reaction, thereby obtaining a reaction solution. The reaction solution was cooled, extracted twice with 1 L of ethyl acetate, concentrated, separated by column chromatography, and then recrystallized three times with isopropyl alcohol to obtain 1.3 g of the target compound (XBisN-F1) represented by the following formula (XBisN-F1). The molecular weight of the resulting compound (XBisN-F1) was measured by the above-mentioned "LC-MS analysis" method, and was found to be 464. Regarding the obtained compound (XBisN-F1), 1 When H-NMR (500 MHz, DMSO-d6) measurement was performed, the following peaks were found, and it was confirmed that compound (XBisN-F1) has the chemical structure of the following formula (XBisN-F1). δ (ppm) 6.7-8.1 (18H, Ph-H, naphthyl-H), 9.76 (2H, -OH). [ka]

[0147] (Synthesis Example 2) Synthesis of compound (XBisN-F1-MeBOC) In a 200mL container equipped with a stirrer, a cooling tube, and a buret, 5.5g (11.8mmol) of the compound (XBisN-F1) obtained above, 5.4g (27mmol) of t-butyl bromoacetate (manufactured by Aldrich Co.), and 100mL of acetone were charged, 3.8g (27mmol) of potassium carbonate (manufactured by Aldrich Co.) and 0.8g of 18-crown-6 were added, and the contents were stirred under reflux for 3 hours to carry out the reaction. Next, the reaction solution after the reaction was concentrated, 100g of pure water was added to the concentrated solution to precipitate the reaction product, and the solution was cooled to room temperature, and then filtered to separate the solid matter. The obtained solid was dried and then separated and purified by column chromatography to obtain 1.0 g of the compound represented by the following formula (XBisN-F1-MeBOC). When the obtained compound (XBisN-F1-MeBOC) was subjected to NMR measurement under the above-mentioned measurement conditions, the following peaks were found, and it was confirmed that the compound had the chemical structure of the following formula, XBisN-F1-MeBOC). 1H-NMR (d6-DMSO): δ (ppm) 1.4 (18H, OC-CH3), 4.9 (4H, O-CH2-C), 6.7~8.1 (18H, Ph-H, naphthyl-H). [ka]

[0148] (Synthesis Example 3) Synthesis of resin (R1-XBisN-F1) A four-neck flask with a capacity of 1 L and equipped with a Dimroth condenser, a thermometer and a stirring blade, which can be opened from the bottom, was prepared. In this four-neck flask, 28 g (60 mmol) of the compound (XBisN-F1) obtained in Synthesis Example 1, 21.0 g of a 40 mass% formalin aqueous solution (280 mmol as formaldehyde, manufactured by Mitsubishi Gas Chemical Co., Ltd.) and 0.97 mL of 98 mass% sulfuric acid (manufactured by Kanto Chemical Co., Ltd.) were charged in a nitrogen gas flow, and the mixture was reacted for 7 hours under reflux at 100 ° C. under normal pressure. Then, 180.0 g of ortho-xylene (special grade reagent manufactured by Wako Pure Chemical Industries, Ltd.) was added as a dilution solvent to the reaction solution, and after standing, the aqueous phase of the lower phase was removed. Furthermore, neutralization and washing with water were performed, and ortho-xylene was distilled off under reduced pressure to obtain 23 g of a brown solid resin (R1-XBisN-F1).

[0149] The resulting resin (R1-XBisN-1) had Mn: 3650, Mw: 6950, and Mw / Mn: 1.90.

[0150] (Synthesis Example 4) Synthesis of compound (XBisN-F1-BOC) In a 200 mL container equipped with a stirrer, a cooling tube, and a buret, 5.5 g (11.8 mmol) of the compound (XBisN-F1) obtained in Synthesis Example 1 and 5.2 g (23.8 mmol) of di-t-butyl dicarbonate (manufactured by Aldrich) were charged in 100 mL of acetone, 3.29 g (23.8 mmol) of potassium carbonate (manufactured by Aldrich) were added, and the contents were stirred at 20 ° C. for 6 hours to carry out the reaction to obtain a reaction solution. Next, the reaction solution was concentrated, and 100 g of pure water was added to the concentrated solution to precipitate the reaction product, and the solution was cooled to room temperature, and then filtered to separate the solid matter. The obtained solid matter was filtered, dried, and then separated and purified by column chromatography to obtain 0.9 g of the target compound (XBisN-F1-BOC) represented by the following formula. When the obtained compound was subjected to NMR measurement under the above-mentioned measurement conditions, the following peaks were found, and it was confirmed that the compound had a chemical structure represented by the following formula (XBisN-F1-BOC). 1H-NMR (d6-DMSO): δ (ppm) 1.4 (27H, OC-CH3), 5.3 (1H, CH), 6.9~7.9 (12H, Ph-H)

[0151] 1H-NMR (d6-DMSO): δ (ppm) 1.4 (18H, OC-CH3), 6.7-8.1 (18H, Ph-H, naphthyl-H). [ka]

[0152] (Synthesis Example 5) Synthesis of compound (XBisN-F1-AL) In a 500mL container equipped with a stirrer, a cooling tube and a buret, 5.5g (11.8mmol) of the compound (XBisN-F1) obtained by the method of Synthesis Example 1, 54g (39mmol) of potassium carbonate and 200mL of dimethylformamide were charged, 77.6g (0.64mol) of allyl bromide was added, and the reaction solution was stirred at 110°C for 24 hours to carry out the reaction. Next, the reaction solution was concentrated, 500g of pure water was added to precipitate the reaction product, and after cooling to room temperature, it was separated by filtration. The obtained solid was filtered and dried, and then separated and purified by column chromatography to obtain 2.7g of the target compound (XBisN-F1AL) represented by the following formula. When the obtained compound was subjected to NMR measurement under the above-mentioned measurement conditions, the following peaks were found, and it was confirmed that the compound had the chemical structure represented by the following formula (XBisN-F1-AL). 1H-NMR (d6-DMSO): δ(ppm) 4.8 (4H, O-CH2-C), 5.3~5.4 (4H,-C=CH2), 6.1 (2H,-CH=C), 6.7~8.1 (18H, Ph-H, naphthyl-H). [ka]

[0153] (Synthesis Example 6) Synthesis of compound (XBisN-F1-Ac) The procedure was the same as in Synthesis Example 5, except that 46.1 g (0.64 mol) of acrylic acid was used instead of 77.6 g (0.64 mol) of the above-mentioned allyl bromide, and 3.5 g of the target compound (XBisN-F1-Ac) represented by the following formula was obtained. When the obtained compound was subjected to NMR measurement under the above-mentioned measurement conditions, the following peaks were found, and it was confirmed that the compound had a chemical structure represented by the following formula (XBisN-F1-Ac). 1H-NMR (d6-DMSO): δ (ppm) 5.8~6.4 (4H,-C=CH2), 6.1 (2H,-CH=C), 6.7~8.1 (18H, Ph-H, naphthyl-H). [ka]

[0154] (Synthesis Example 7) Synthesis of compound (XBisN-F1-Ea) In a 100 ml vessel equipped with a stirrer, a condenser, and a buret, 7.0 g (15.1 mmol) of the compound (XBisN-F1) obtained in Synthesis Example 1, 5.5 g of glycidyl methacrylate, 0.45 g of triethylamine, and 0.08 g of p-methoxyphenol were placed in 70 ml of methyl isobutyl ketone, and the mixture was heated to 80° C. and stirred for 24 hours to carry out the reaction. The reaction solution was cooled to 50°C, dropped into pure water, and the precipitated solid was filtered and dried. The solid was then separated and purified by column chromatography to obtain 1.4 g of the target compound (XBisN-F1-Ea) represented by the following formula. When the obtained compound was subjected to NMR measurement under the above-mentioned measurement conditions, the following peaks were found, and it was confirmed that the compound had the chemical structure represented by the following formula (XBisN-F1-Ea). 1H-NMR (d6-DMSO): δ(ppm) 2.0 (6H, -CH3), 3.4~4.4 (9H, -CH2-, -CH-), 5.8 (2H, -OH), 6.4~6.5 (4H, -C=CH2), 6.1 (2H, -CH=C), 6.7~8.1 (18H, Ph-H, naphthyl-H). [ka]

[0155] (Synthesis Example 8) Synthesis of compound (XBisN-F1-Ua) In a 100 mL container equipped with a stirrer, a cooling tube and a buret, 7.0 g (15.1 mmol) of the compound (XBisN-F1) obtained in Synthesis Example 1, 5.5 g of 2-isocyanatoethyl methacrylate, 0.45 g of triethylamine, and 0.08 g of p-methoxyphenol were charged in 70 mL of methyl isobutyl ketone, and the mixture was heated to 80 ° C. and stirred for 24 hours to carry out the reaction. The mixture was cooled to 50 ° C., the reaction liquid was dropped into pure water, and the precipitated solid was filtered and dried, and then separation and purification were carried out by column chromatography to obtain 1.5 g of the target compound (XBisN-F1-Ua) represented by the following formula. When the obtained compound was subjected to NMR measurement under the above-mentioned measurement conditions, the following peaks were found, and it was confirmed that the compound had a chemical structure represented by the following formula (XBisN-F1-Ua). 1H-NMR (d6-DMSO): δ(ppm) 2.0 (6H, -CH3), 3.1 (4H, -CH2-), 4.6 (4H, -CH2-), 6.4~6.5 (4H, -C=CH2), 6.7~8.1 (20H, Ph-H, naphthyl-H, -NH-). [ka]

[0156] (Synthesis Example 9) Synthesis of compound (XBisN-F1-E) In a 200mL vessel equipped with a stirrer, a cooling tube and a buret, 7.0g (15.1mmol) of the compound (XBisN-F1) obtained in Synthesis Example 1 and 10g (72mmol) of potassium carbonate were charged in 60mL of dimethylformamide, 5.0g (40.6mmol) of 2-chloroethyl acetate was added, and the reaction solution was stirred at 90°C for 12 hours to carry out the reaction. Next, the reaction solution was cooled in an ice bath to precipitate crystals, which were then separated by filtration. Next, 30g of the above-mentioned crystals, 30g of methanol, 100g of THF and a 24% aqueous sodium hydroxide solution were charged in a 500mL vessel equipped with a stirrer, a cooling tube and a buret, and the reaction solution was stirred under reflux for 4 hours to carry out the reaction. After that, the reaction solution was cooled in an ice bath, the reaction solution was concentrated, and the precipitated solid was filtered and dried, and then separation and purification was carried out by column chromatography to obtain 3.0g of the target compound (XBisN-F1-E) represented by the following formula. When the obtained compound was subjected to NMR measurement under the above-mentioned measurement conditions, the following peaks were found, and it was confirmed that the compound had a chemical structure represented by the following formula (XBisN-F1-Ua). 1H-NMR (d6-DMSO): δ (ppm) 3.7 (4H,-CH2-), 4.3 (4H,-CH2-), 5.4 (2H,-OH), 6.7~8.1 (18H, Ph-H, naphthyl-H). [ka]

[0157] (Synthesis Example 10) Synthesis of compound (XBisN-F1-PX) In a 1000mL container equipped with a stirrer, a cooling tube and a buret, 30g (65mmol) of the compound (XBisN-F1) obtained in Synthesis Example 1-1, 47.2g of iodoanisole, 87.5g of cesium carbonate, 1.4g of dimethylglycim hydrochloride, and 0.5g of copper iodide were charged in 400mL of 1,4-dioxane, heated to 95°C and stirred for 22 hours to carry out the reaction. Next, the insoluble matter was filtered off, the filtrate was concentrated and dropped into pure water, the precipitated solid was filtered, dried, and then separated and purified by column chromatography to obtain 16g of the intermediate compound (XBisN-F1-M) represented by the following formula. [ka]

[0158] Next, 15 g of the compound represented by the above formula (XBisN-F1-M) and 80 g of pyridine hydrochloride were charged into a 1000 mL container equipped with a stirrer, a cooling tube, and a burette, and the reaction was carried out by stirring at 190 ° C for 2 hours. Next, 160 mL of hot water was added and stirred to precipitate a solid. Then, 250 mL of ethyl acetate and 100 mL of water were added, stirred, and allowed to stand. The organic layer separated was concentrated and dried, and then separated and purified by column chromatography to obtain 7 g of the target compound represented by the following formula (XBisN-F1-PX). When the obtained compound was subjected to NMR measurement under the above-mentioned measurement conditions, the following peaks were found, and it was confirmed that the compound had the chemical structure represented by the following formula (XBisN-F1-PX). 1H-NMR (d6-DMSO): δ (ppm) 6.7-8.1 (26H, Ph-H, naphthyl-H) 9.1 (2H, OH). [ka]

[0159] (Synthesis Example 11) Synthesis of compound (XBisN-F1-PE) The reaction was carried out in the same manner as in Synthesis Example 1-10, except that the compound represented by the above formula (XBisN-F1-E) was used instead of the compound represented by the above formula (XBisN-F), to obtain 5 g of the target compound represented by the following formula (XBisN-F1-PE). When the obtained compound was subjected to NMR measurement under the above-mentioned measurement conditions, the following peaks were found, and it was confirmed that the compound had the chemical structure represented by the following formula (XBisN-F1-PE). 1H-NMR(d6-DMSO): δ(ppm) 3.1(4H,-CH2-), 4.3(4H,-CH2-), 6.7~8.1(26H, Ph-H, naphthyl-H), 9.1(2H,OH). [ka]

[0160] (Synthesis Example 12) Synthesis of compound (XBisN-F1-G) A 100 ml container equipped with a stirrer, a cooling tube and a buret was charged with 5.5 g (11.8 mmol) of the compound (XBisN-F1) obtained in Synthesis Example 1 and 3.7 g (27 mmol) of potassium carbonate in 100 ml of dimethylformamide, and 2.5 g (27 mmol) of epichlorohydrin was added, and the resulting reaction solution was stirred at 90 ° C. for 6.5 hours to carry out the reaction. Next, the solid content was removed from the reaction solution by filtration, cooled in an ice bath, crystals were precipitated, filtered, dried, and then separated and purified by column chromatography to obtain 1.5 g of the target compound represented by the following formula (XBisN-F1-G). When the obtained compound was subjected to NMR measurement under the above-mentioned measurement conditions, the following peaks were found, and it was confirmed that the compound had the chemical structure represented by the following formula (XBisN-F1-G). 1H-NMR (d6-DMSO): δ (ppm) 2.3~2.7 (6H, -CH(CH2)O), 3.9~4.1 (4H, -CH2-), 6.7~8.1 (18H, Ph-H, naphthyl-H). [ka]

[0161] (Synthesis Example 13) Synthesis of compound (XBisN-F1-GE) The reaction was carried out in the same manner as in Synthesis Example 12, except that the compound represented by the formula (XBisN-F1-E) was used instead of the compound represented by the formula (XBisN-F1), to obtain 1.6 g of the target compound represented by the following formula (XBisN-F1-GE). When the obtained compound was subjected to NMR measurement under the above-mentioned measurement conditions, the following peaks were found, and it was confirmed that the compound had the chemical structure represented by the following formula (XBisN-F1-GE). 1H-NMR(d6-DMSO): δ(ppm) 2.3~2.7(6H,-CH(CH2)O), 3.9~4.3(12H,-CH2-), 6.7~8.1(18H, Ph-H, naphthyl-H). [ka]

[0162] (Synthesis Example 14) Synthesis of compound (XBisN-F1-SX) In a 100 ml container equipped with a stirrer, a cooling tube and a buret, 5.5 g (11.8 mmol) of the compound (XBisN-F1) obtained in Synthesis Example 1 and 3.8 g of vinylbenzyl chloride (trade name CMS-P; manufactured by Seimi Chemical Co., Ltd.) were charged in 50 ml of dimethylformamide, and in a state of being heated to 50 ° C and stirred, 5.0 g of 28 mass% sodium methoxide (methanol solution) was added from a dropping funnel over 20 minutes, and the reaction solution was stirred at 50 ° C for 1 hour to carry out the reaction. Next, 1.0 g of 28 mass% sodium methoxide (methanol solution) was added, the reaction solution was heated to 60 ° C and stirred for 3 hours, and 1.0 g of 85 mass% phosphoric acid was added, stirred for 10 minutes, cooled to 40 ° C, the reaction solution was dropped into pure water, and the precipitated solid was filtered and dried, and then separation and purification was performed by column chromatography, and 1.5 g of the target compound (XBisN-F1-SX) represented by the following formula was obtained. When the obtained compound was subjected to NMR measurement under the above-mentioned measurement conditions, the following peaks were found, and it was confirmed that the compound had a chemical structure represented by the following formula (XBisN-F1-SX). 1H-NMR (d6-DMSO): δ (ppm) 5.1~5.3 (6H, -CH2-, -C=CH, CH), 5.8 (2H, -C=CH), 6.7~8.1 (28H, -CH=C, Ph-H, naphthyl-H). [ka]

[0163] (Synthesis Example 15) Synthesis of compound (XBisN-F1-SE) The reaction was carried out in the same manner as in Synthesis Example 14, except that the compound represented by the formula (XBisN-F1-E) was used instead of the compound represented by the formula (XBisN-F1), to obtain 1.6 g of the target compound represented by the following formula (XBisN-F1-SE). When the obtained compound was subjected to NMR measurement under the above-mentioned measurement conditions, the following peaks were found, and it was confirmed that the compound had the chemical structure represented by the following formula (XBisN-F1-SE). 1H-NMR (d6-DMSO): δ(ppm) 3.8 (4H, -CH2-), 4.3 (4H, -CH2-), 4.8 (4H, -CH2-), 5.3 (2H, -C=CH), 5.8 (2H, -C=CH), 6.7~8.1 (28H, -CH=C, Ph-H, naphthyl-H). [ka]

[0164] (Synthesis Example 16) Synthesis of compound (XBisN-F1-Pr) In a 300 mL container equipped with a stirrer, a cooling tube, and a buret, 5.5 g (11.8 mmol) of the compound (XBisN-F1) obtained in Synthesis Example 1-1 and 4.8 g (40 mmol) of propargyl bromide were charged into 100 mL of dimethylformamide, and the reaction was carried out by stirring at room temperature for 3 hours to obtain a reaction solution. The reaction solution was then concentrated, and 300 g of pure water was added to the concentrated solution to precipitate the reaction product, which was then cooled to room temperature and filtered to separate the solid matter. The obtained solid matter was filtered, dried, and then separated and purified by column chromatography to obtain 2.7 g of the target compound (XBisN-F1-Pr) represented by the following formula. When the obtained compound was subjected to NMR measurement under the above-mentioned measurement conditions, the following peaks were found, and it was confirmed that the compound had a chemical structure represented by the following formula (XBisN-F1-Pr). 1H-NMR (d6-DMSO): δ (ppm) 3.5 (2H,≡CH), 4.7 (4H, -CH2-), 6.7~8.1 (18H, Ph-H, naphthyl-H). [ka]

[0165] (Comparative Synthesis Example 1) Synthesis of C-1 A four-neck flask with a capacity of 10 L was prepared, which was equipped with a Dimroth condenser, a thermometer, and an agitator and could be bottomed out. In this four-neck flask, 1.09 kg (7 mol, manufactured by Mitsubishi Gas Chemical Co., Ltd.), 2.1 kg of 40 mass% formalin aqueous solution (28 mol as formaldehyde, manufactured by Mitsubishi Gas Chemical Co., Ltd.), and 0.97 mL of 98 mass% sulfuric acid (manufactured by Kanto Chemical Co., Ltd.) were charged in a nitrogen stream, and the mixture was reacted for 7 hours while refluxing at 100°C under normal pressure. Then, 1.8 kg of ethylbenzene (manufactured by Wako Pure Chemical Industries, Ltd., special grade reagent) was added as a dilution solvent to the reaction solution, and after standing, the aqueous phase of the lower phase was removed. Furthermore, neutralization and washing with water were performed, and ethylbenzene and unreacted 1,5-dimethylnaphthalene were distilled off under reduced pressure to obtain 1.25 kg of dimethylnaphthalene formaldehyde resin as a light brown solid. The molecular weight of the obtained dimethylnaphthalene formaldehyde resin was as follows: number average molecular weight (Mn): 562, weight average molecular weight (Mw): 1168, and dispersity (Mw / Mn): 2.08.

[0166] Next, a four-neck flask with an internal volume of 0.5 L equipped with a Dimroth condenser, a thermometer, and a stirring blade was prepared. In this four-neck flask, 100 g (0.51 mol) of the dimethylnaphthalene formaldehyde resin obtained as described above and 0.05 g of p-toluenesulfonic acid were charged under a nitrogen gas flow, and the temperature was raised to 190 ° C. and heated for 2 hours, and then stirred. Then, 52.0 g (0.36 mol) of 1-naphthol was added, and the temperature was raised to 220 ° C. and reacted for 2 hours. After dilution with a solvent, neutralization and washing with water were performed, and the solvent was removed under reduced pressure to obtain 126.1 g of a black-brown solid resin (C-1). The obtained resin (C-1) had Mn: 885, Mw: 2220, and Mw / Mn: 2.51.

[0167] [Examples 1 to 21, Comparative Example 1] Using the compounds or resins of Synthesis Examples 1 to 16 and Synthesis Comparative Example 1, compositions for forming optical components were prepared having the formulations shown in Table 1 below. The acid generators, crosslinking agents, and organic solvents used were as follows. Acid generator: di-tert-butyldiphenyliodonium nonafluoromethanesulfonate (hereinafter also referred to as "DTDPI") (manufactured by Midori Chemical Co., Ltd.) Crosslinking agent: "Nicalac MX270" (hereinafter also referred to as "MX270") (product name, manufactured by Sanwa Chemical Co., Ltd.) Organic solvent: Propylene glycol monomethyl ether (PGME)

[0168] [Table 1]

[0169] [Evaluation method] (1) Safe solvent solubility test for compounds or resins The solubility of the compound or resin in PGME, PGMEA, and CHN was evaluated according to the following criteria using the amount dissolved in each solvent. The amount dissolved was measured at 23°C by precisely weighing the compound or resin alone in a test tube, adding the target solvent to a specified concentration, applying ultrasonic waves in an ultrasonic cleaner for 30 minutes, and visually observing the state of the liquid thereafter. A:5.0% by mass ≦ ​​Dissolved amount B:2.0 mass% ≦ Dissolved amount <5.0 mass% C: Dissolved amount <2.0% by mass

[0170] (2) Storage stability and thin film formation of compositions for forming optical components The storage stability of the optical component forming composition containing the compound was evaluated by preparing the optical component forming composition, leaving it at rest for 3 days at 23°C, and visually observing whether precipitation occurred. In addition, the optical component forming composition was spin-coated on a clean silicon wafer, and then baked before exposure (PB) on a hot plate at 110°C to form a resist film with a thickness of 50 nm. The prepared optical component forming composition was evaluated as ○ if it was a homogeneous solution and thin film formation was good, △ if it was a homogeneous solution but the thin film had defects, and × if precipitation occurred.

[0171] (3) Refractive index and transparency test [Refractive index and transparency test] The composition for forming an optical component was applied onto a SiO2 substrate with a thickness of 300 nm, and baked at 260°C for 300 seconds to form a film for optical components with a thickness of 100 nm. The refractive index and transparency of the film for optical components were evaluated by the following method. That is, a refractive index and transparency test was performed at a wavelength of 633 nm using a vacuum ultraviolet multi-angle incident spectroscopic ellipsometer (product name "M-2000DI-YK", manufactured by J.A. Woollam Japan Co., Ltd.), and the refractive index and transparency were evaluated according to the following criteria. (Evaluation standard for refractive index) S: Refractive index is 1.70 or more A: Refractive index is 1.60 or more and less than 1.70 C: Refractive index less than 1.60 (Transparency Evaluation Criteria) A: Extinction coefficient less than 0.03 C: Extinction coefficient is 0.03 or more

[0172] The above evaluation results are shown in Table 2.

[0173] [Table 2]

[0174] As is clear from the above, compound (0) and resin (6) have no problems in solubility in organic solvents, storage stability, and film formation as optical component forming materials, and can be said to have a high degree of compatibility between refractive index and transparency. In other words, the optical component forming composition of this embodiment is useful as an optical component film forming material.

[0175] This application is based on a Japanese patent application (Patent Application No. 2019-085938) filed with the Japan Patent Office on April 26, 2019, the contents of which are incorporated herein by reference. [Industrial Applicability]

[0176] The optical component forming composition containing the compound and / or resin of the present invention can be widely and effectively used in the formation of optical components. Therefore, the present invention can be widely and effectively used in the formation of optical components, for example, film-like or sheet-like parts, plastic lenses such as prism lenses, lenticular lenses, microlenses, Fresnel lenses, viewing angle control lenses, and contrast-enhancing lenses, retardation films, films for electromagnetic shielding, prisms, optical fibers, solder resists for flexible printed wiring, plating resists, interlayer insulating films for multilayer printed wiring boards, photosensitive optical waveguides, liquid crystal displays, organic electroluminescence (EL) displays, light-emitting diode (LED) elements, solid-state imaging elements, organic thin-film solar cells, dye-sensitized solar cells, and organic thin-film transistors (TFTs). Compound (1) can be widely and effectively used in the formation of embedded films and planarizing films on photodiodes, which are components of solid-state imaging elements that require a high refractive index, planarizing films before and after color filters, microlenses, planarizing films on microlenses, and conformal films.

Claims

1. A composition for forming an optical component, comprising a compound represented by the following formula (0): 【Chemistry 1】 (In the formula (0), X represents an oxygen atom, a sulfur atom, or no crosslinking. R 0 are each independently an alkyl group having 1 to 30 carbon atoms which may have a substituent, an aryl group having 6 to 30 carbon atoms which may have a substituent, an alkenyl group having 2 to 30 carbon atoms which may have a substituent, an alkynyl group having 2 to 30 carbon atoms which may have a substituent, an alkoxy group having 1 to 30 carbon atoms which may have a substituent, a halogen atom, a nitro group, an amino group, a carboxyl group, a crosslinkable group, a dissociable group, a thiol group, or a hydroxyl group, wherein R 0 At least one of R is a hydroxyl group, a crosslinkable group, or a dissociable group, 0 The alkyl group, the aryl group, the alkenyl group, the alkynyl group, and the alkoxy group in the formula (I) may contain an ether bond, a ketone bond, or an ester bond; R 2 are each independently an alkyl group having 1 to 30 carbon atoms which may have a substituent, an aryl group having 6 to 30 carbon atoms which may have a substituent, an alkenyl group having 2 to 30 carbon atoms which may have a substituent, an alkynyl group having 2 to 30 carbon atoms which may have a substituent, an alkoxy group having 1 to 30 carbon atoms which may have a substituent, a halogen atom, a nitro group, an amino group, a carboxyl group, a crosslinkable group, a dissociable group, a thiol group or a hydroxyl group, wherein R 2 The alkyl group, the aryl group, the alkenyl group, the alkynyl group, and the alkoxy group in the formula (I) may contain an ether bond, a ketone bond, or an ester bond; n 1 are each independently an integer from 1 to 2, n 0 Each independently represents 0 to (4+2n 1 ), where n 0 At least one of the following is 1 to (4+2n 1 ) and n 4 are each independently an integer from 0 to 1, n 5 Each independently represents 0 to (4+2n 4 ) is an integer.

2. The composition for forming an optical part according to claim 1 , wherein the compound represented by formula (0) is represented by the following formula (1): 【Chemistry 2】 (In the above formula (1), X, R 2 , n 1 , n 4 and n 5 is defined as the same as formula (0), R's each independently represent a hydrogen atom, a linear alkyl group having 1 to 30 carbon atoms which may have a substituent, a branched or cyclic alkyl group having 3 to 30 carbon atoms which may have a substituent, an aryl group having 6 to 30 carbon atoms which may have a substituent, an alkenyl group having 2 to 20 carbon atoms which may have a substituent, an alkynyl group having 2 to 20 carbon atoms which may have a substituent, a crosslinkable group or a dissociable group, wherein at least one of R's is a hydrogen atom, a crosslinkable group or a dissociable group, R 1 each independently represents an alkyl group having 1 to 30 carbon atoms which may have a substituent, an aryl group having 6 to 30 carbon atoms which may have a substituent, an alkenyl group having 2 to 30 carbon atoms which may have a substituent, an alkynyl group having 2 to 30 carbon atoms which may have a substituent, an alkoxy group having 1 to 30 carbon atoms which may have a substituent, a halogen atom, a nitro group, an amino group, a carboxyl group or a thiol group, wherein the alkyl group, the aryl group, the alkenyl group, the alkynyl group and the alkoxy group may contain an ether bond, a ketone bond or an ester bond, n 2 are each independently 1 to (4+2n 1 ), n 3 Each independently represents 0 to (4+2n 1 -n 2 ) is an integer.

3. The composition for forming an optical part according to claim 2 , wherein the compound represented by formula (1) is represented by the following formula (2): 【Chemistry 3】 (In the formula (2), X, R, R 1 , R 2 , n 4 and n 5 is defined as the same as formula (1), n 2 are each independently an integer from 1 to 6, n 3 Each independently represents 0 to (6-n 2 ) is an integer.

4. The composition for forming an optical part according to claim 2 , wherein the compound represented by formula (1) is represented by the following formula (3): 【Chemistry 4】 (In the formula (3), X, R 1 , R 2 , n 4 and n 5 is defined as the same as formula (1), n 3 are each independently an integer from 0 to 5.

5. The composition for forming an optical part according to claim 2 , wherein the compound represented by formula (1) is represented by the following formula (4): 【Chemistry 5】 (In the formula (4), X, R, R 1 , R 2 , n 1 , n 2 and n 3 is defined as the same as formula (1), n 5 are each independently an integer from 0 to 4.

6. The composition for forming an optical part according to claim 2 , wherein the compound represented by formula (1) is represented by the following formula (5): 【Chemistry 6】 (In the formula (5), X, R 1 and R 2 is defined as the same as formula (1), n 3 are each independently an integer from 0 to 5, n 5 are each independently an integer from 0 to 4.

7. A composition for forming an optical component, comprising a resin having a structural unit derived from a compound represented by the following formula (0): 【Chemistry 7】 (In the formula (0), X represents an oxygen atom, a sulfur atom, or no crosslinking. R 0 are each independently an alkyl group having 1 to 30 carbon atoms which may have a substituent, an aryl group having 6 to 30 carbon atoms which may have a substituent, an alkenyl group having 2 to 30 carbon atoms which may have a substituent, an alkynyl group having 2 to 30 carbon atoms which may have a substituent, an alkoxy group having 1 to 30 carbon atoms which may have a substituent, a halogen atom, a nitro group, an amino group, a carboxyl group, a crosslinkable group, a dissociable group, a thiol group, or a hydroxyl group, wherein R 0 At least one of R is a hydroxyl group, a crosslinkable group, or a dissociable group, 0 The alkyl group, the aryl group, the alkenyl group, the alkynyl group, and the alkoxy group in the formula (I) may contain an ether bond, a ketone bond, or an ester bond; R 2 are each independently an alkyl group having 1 to 30 carbon atoms which may have a substituent, an aryl group having 6 to 30 carbon atoms which may have a substituent, an alkenyl group having 2 to 30 carbon atoms which may have a substituent, an alkynyl group having 2 to 30 carbon atoms which may have a substituent, an alkoxy group having 1 to 30 carbon atoms which may have a substituent, a halogen atom, a nitro group, an amino group, a carboxyl group, a crosslinkable group, a dissociable group, a thiol group or a hydroxyl group, wherein R 2 The alkyl group, the aryl group, the alkenyl group, the alkynyl group, and the alkoxy group in the formula (I) may contain an ether bond, a ketone bond, or an ester bond; n 1 are each independently an integer from 1 to 2, n 0 Each independently represents 0 to (4+2n 1 ), where n 0 At least one of the following is 1 to (4+2n 1 ) and n 4 are each independently an integer from 0 to 1, n 5 Each independently represents 0 to (4+2n 4 ) is an integer.

8. The composition for forming an optical part according to claim 7 , wherein the resin has a structure represented by the following formula (6): 【Chemistry 8】 (In the formula (6), L is a divalent group having 1 to 60 carbon atoms, and M is a unit structure derived from the compound.)

9. The composition for forming an optical part according to any one of claims 1 to 8, wherein X is an oxygen atom or a sulfur atom.

10. The composition for forming an optical part according to any one of claims 1 to 9, further comprising a solvent.

11. The composition for forming an optical part according to any one of claims 1 to 10, further comprising an acid generator.

12. The composition for forming an optical part according to any one of claims 1 to 11, further comprising a crosslinking agent.

Images