Plating apparatus and plating method

Abstract

To improve uniformity of plating thickness in a plating apparatus.SOLUTION: A plating apparatus is provided for plating a substrate by passing an electric current from an anode to the substrate. The plating apparatus comprises a plurality of anode-side electrical wires electrically connected to the anode via a plurality of electrical contacts on the anode, a plurality of substrate-side electrical wires electrically connected to the substrate via a plurality of electrical contacts on the substrate, and on at least either one of the anode side or the substrate side, a plurality of variable resistors located in the middle of the plurality of anode-side electrical wires or the plurality of substrate-side electrical wires, and a controller configured to adjust the respective resistance values of the plurality of variable resistors.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a plating apparatus and a plating method. [Background technology]

[0002] In a plating apparatus that performs plating by passing an electric current through a substrate immersed in a plating solution, the electric current is supplied to the substrate via a plurality of electric contacts provided on the periphery of the substrate (see, for example, Patent Document 1, particularly FIG. 9). In a plating apparatus configured in this manner, in order to make the thickness of the plating film formed on the substrate uniform across the substrate surface, it is important to ensure that a substantially equal current flows through the plurality of electric contacts on the periphery of the substrate. For this purpose, it is known that a variable resistor is connected to each of the plurality of electric contacts on the periphery of the substrate, and the resistance value of the variable resistor is adjusted to allow a uniform current to flow through the plurality of electric contacts (see, for example, Patent Document 1, particularly paragraph 0059). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2015-200017 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, it is not easy to determine the resistance value to which each of the multiple variable resistors should be set. For example, the contact resistance of each electrical contact may vary, and the film thickness distribution on the substrate may be unique to the plating device. [Means for solving the problem]

[0005] [Form 1] According to Form 1, there is provided a plating apparatus for plating a substrate by passing a current from an anode to the substrate, the plating apparatus comprising: a plurality of anode-side electrical wirings electrically connected to the anode via a plurality of electrical contacts on the anode; a plurality of substrate-side electrical wirings electrically connected to the substrate via a plurality of electrical contacts on the substrate; a plurality of variable resistors disposed midway along the anode-side electrical wirings or the plurality of substrate-side electrical wirings on at least one of the anode side and the substrate side; and a control unit configured to adjust the resistance values ​​of the plurality of variable resistors.

[0006] [Form 2] According to form 2, in the plating apparatus of form 1, the control unit is configured to determine each resistance value of the plurality of variable resistors using a machine learning model that uses the plating film thickness at each point on the substrate as an input and the resistance value of each of the variable resistors as an output, set the determined resistance value to each of the plurality of variable resistors, and perform a plating process in the plating apparatus.

[0007] [Form 3] According to form 3, in the plating apparatus of form 2, the machine learning model further includes as the input any one or more of a current value supplied between the anode and the substrate, a voltage value applied between the anode and the substrate, a current flow time for passing a current between the anode and the substrate, information regarding the shape of the substrate, and information regarding the properties of a plating solution used to plate the substrate.

[0008] [Form 4] According to Form 4, in the plating apparatus of Form 3, the information regarding the shape of the substrate includes any one or more of the opening area of ​​the substrate, the opening ratio of the substrate, and the thickness of a seed layer formed on the surface of the substrate.

[0009] [Form 5] According to form 5, in the plating apparatus of any one of forms 2 to 4, the machine learning model further includes as the output a size value of a mask to be placed between the anode and the substrate to adjust the electric field between the anode and the substrate.

[0010] [Form 6] According to Form 6, in the plating apparatus of any one of Forms 2 to 4, the control unit is configured to use the machine learning model to calculate a resistance value of each of the variable resistors based at least on a target value of a plating film thickness at each point on the substrate, set the calculated resistance values ​​to each of the multiple variable resistors, perform a plating process in the plating apparatus in which the resistance values ​​are set to each of the multiple variable resistors, obtain measured values ​​of the plating film thickness at each point on the substrate after the plating process, calculate a resistance value of each of the variable resistors based at least on the obtained measured values ​​of the plating film thickness at each point on the substrate using the machine learning model, and update the machine learning model based on a difference between the resistance value of each of the variable resistors obtained in the former calculation process and the resistance value of each of the variable resistors obtained in the latter calculation process.

[0011] [Form 7] According to Form 7, in the plating apparatus of any one of Forms 1 to 6, the control unit adjusts the resistance values ​​of the multiple variable resistors so that the sums of the resistance values ​​on each path of the multiple anode side electrical wirings or the multiple substrate side electrical wirings are substantially equal, regardless of the contact resistance value of each of the multiple electrical contacts.

[0012] [Form 8] According to form 8, in the plating apparatus of form 7, the control unit adjusts the resistance values ​​of the multiple variable resistors so that substantially equal currents flow through each path of the multiple anode side electrical wirings or the multiple substrate side electrical wirings.

[0013] [Form 9] According to Form 9, in the plating apparatus of any one of Forms 1 to 8, the control unit adjusts the resistance values ​​of each of the multiple variable resistors so that the resistance value of the variable resistor connected to the electrical contact near the center of the anode is relatively small and the resistance value of the variable resistor connected to the electrical contact near the periphery of the anode is relatively large.

[0014] [Mode 10] According to Mode 10, in the plating apparatus of any one of Modes 1 to 9, the resistance value of each of the variable resistors is greater than the contact resistance value of the electrical contacts.

[0015] [Mode 11] According to mode 11, in the plating apparatus of mode 10, the resistance value of each of the variable resistors is 10 times or more larger than the contact resistance value of the electrical contacts.

[0016] [Form 12] According to Form 12, there is provided a method for plating a substrate by passing a current from an anode to the substrate in a plating apparatus, the plating apparatus comprising: a plurality of anode-side electrical wirings electrically connected to the anode via a plurality of electrical contacts on the anode; a plurality of substrate-side electrical wirings electrically connected to the substrate via a plurality of electrical contacts on the substrate; and a plurality of variable resistors arranged in the middle of the plurality of anode-side electrical wirings or the plurality of substrate-side electrical wirings on at least one of the anode side and the substrate side, the method including the steps of: determining each resistance value of the plurality of variable resistors using a machine learning model that uses a plating film thickness at each point on the substrate as an input and outputs a resistance value of each of the variable resistors; and setting each of the determined resistance values ​​to each of the plurality of variable resistors to perform a plating process in the plating apparatus. [Brief description of the drawings]

[0017] [Figure 1] 1 is an overall layout diagram of a plating apparatus according to an embodiment of the present invention; [Diagram 2] 2 is a schematic cross-sectional side view of a plating module provided in the plating apparatus. FIG. [Diagram 3] FIG. 2 is a circuit diagram showing in more detail how the anodes and substrates are electrically connected to the rectifier in the plating module. [Figure 4] FIG. 2 illustrates a control unit for controlling the resistance values ​​of a plurality of variable resistors. [Diagram 5] FIG. 1 is a diagram illustrating an example of an implementation of a machine learning model provided in a control unit. [Figure 6] 1 is a flowchart showing the training and operational phases of a machine learning model. [Figure 7] 1 is a flowchart illustrating a method for enabling more efficient training of machine learning models. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings described below, the same or corresponding components are designated by the same reference numerals and redundant description will be omitted.

[0019] FIG. 1 is an overall layout diagram of a plating apparatus 10 according to an embodiment of the present invention. The plating apparatus 10 has two cassette tables 102, an aligner 104 that aligns the position of the orientation flat (orientation flat) and notch of the substrate in a predetermined direction, and a spin rinse dryer 106 that rotates the substrate at high speed after plating to dry it. The cassette table 102 is loaded with a cassette 100 that stores substrates such as semiconductor wafers. A load / unload station 120 is provided near the spin rinse dryer 106, on which the substrate holder 30 is placed to load and unload the substrate. A transfer robot 122 that transfers substrates between these units is provided in the center of these units 100, 104, 106, and 120.

[0020] The load / unload station 120 is equipped with a flat mounting plate 152 that is slidable laterally along rails 150. The two substrate holders 30 are mounted horizontally in parallel on the mounting plate 152, and after a substrate is transferred between one substrate holder 30 and the transport robot 122, the mounting plate 152 is slid laterally, and a substrate is transferred between the other substrate holder 30 and the transport robot 122.

[0021] The plating apparatus 10 further includes a stocker 124, a pre-wet module 126, a pre-soak module 128, a first rinse module 130a, a blow module 132, a second rinse module 130b, and a plating module 110. The stocker 124 stores and temporarily stores the substrate holder 30. The pre-wet module 126 immerses the substrate in pure water. The pre-soak module 128 etches away an oxide film on the surface of a conductive layer such as a seed layer formed on the surface of the substrate. The first rinse module 130a cleans the substrate after pre-soaking together with the substrate holder 30 with a cleaning liquid (such as pure water). The blow module 132 drains the substrate after cleaning. The second rinse module 130b cleans the substrate after plating together with the substrate holder 30 with a cleaning liquid. The load / unload station 120, the stocker 124, the pre-wet module 126, the pre-soak module 128, the first rinse module 130a, the blow module 132, the second rinse module 130b, and the plating module 110 are arranged in this order.

[0022] The plating module 110 is configured, for example, by housing a plurality of plating tanks 114 inside an overflow tank 136. In the example of Fig. 1, the plating module 110 has eight plating tanks 114. Each plating tank 114 is configured to house one substrate therein and to immerse the substrate in a plating solution held therein to perform plating such as copper plating on the substrate surface.

[0023] The plating apparatus 10 is located beside each of these devices, and a substrate holder is provided between each of these devices. The plating apparatus 10 has a conveying device 140, which employs, for example, a linear motor system, for conveying the wafer carrier 30 together with the substrate. The conveying device 140 has a first conveying device 142 and a second conveying device 144. The first conveying device 142 is configured to convey the substrate between the load / unload station 120, the stocker 124, the pre-wet module 126, the pre-soak module 128, the first rinse module 130a, and the blow module 132. The second conveying device 144 is configured to convey the substrate between the first rinse module 130a, the second rinse module 130b, the blow module 132, and the plating module 110. The plating apparatus 10 may have only the first conveying device 142 without the second conveying device 144.

[0024] On either side of the overflow tank 136, there are disposed a paddle driver 160 and a paddle follower 162 which drive paddles located inside each plating tank 114 and function as stirring rods for stirring the plating solution in the plating tank 114.

[0025] An example of a series of plating processes using this plating apparatus 10 will be described below. First, a substrate is taken out of the cassette 100 mounted on the cassette table 102 by the transfer robot 122, and transferred to the aligner 104. The aligner 104 aligns the positions of the orientation flat, notch, etc. to a predetermined direction. The substrate whose direction has been aligned by the aligner 104 is then transferred to the load / unload station 120 by the transfer robot 122.

[0026] In the load / unload station 120, two substrate holders 30 housed in the stocker 124 are simultaneously gripped by a first transfer device 142 of the transfer device 140 and transferred to the load / unload station 120. Then, the two substrate holders 30 are simultaneously placed horizontally on a mounting plate 152 of the load / unload station 120. In this state, the transfer robot 122 transfers substrates to each substrate holder 30, and the transferred substrates are held by the substrate holders 30.

[0027] Next, two substrate holders 30 holding substrates are simultaneously gripped by first transfer device 142 of transfer device 140 and stored in pre-wet module 126. Next, substrate holders 30 holding the substrates processed in pre-wet module 126 are transferred by first transfer device 142 to pre-soak module 128, where an oxide film on the substrate is etched. Next, substrate holders 30 holding the substrates are transferred to first rinse module 130a, where the surfaces of the substrates are rinsed with pure water stored in first rinse module 130a.

[0028] The substrate holder 30 holding the substrate after the water rinsing is transported by the second transport device 144 from the first rinsing module 130a to the plating module 110 and stored in the plating tank 114 filled with plating solution. The second transport device 144 sequentially repeats the above procedure to sequentially store the substrate holders 30 holding the substrate in each plating tank 114 of the plating module 110.

[0029] In each plating tank 114, a plating voltage is applied between the anode (not shown) in the plating tank 114 and the substrate, and at the same time, the paddle is moved back and forth parallel to the surface of the substrate by the paddle drive unit 160 and the paddle follower unit 162, thereby plating the surface of the substrate.

[0030] After plating is completed, the two substrate holders 30 holding the plated substrates are simultaneously gripped by the second transport device 144 and transported to the second rinse module 130b, where the substrates are immersed in the pure water contained in the second rinse module 130b to clean the surfaces of the substrates with the pure water. Next, the substrate holders 30 are transported by the second transport device 144 to the blow module 132, where water droplets adhering to the substrate holders 30 are removed by blowing air or the like. Thereafter, the substrate holders 30 are transported by the first transport device 142 to the load / unload station 120.

[0031] In the load / unload station 120, the processed substrate is removed from the substrate holder 30 by the transfer robot 122 and transferred to the spin rinse dryer 106. The spin rinse dryer 106 rotates the plated substrate at high speed to dry it. The dried substrate is returned to the cassette 100 by the transfer robot 122.

[0032] FIG. 2 is a schematic cross-sectional side view of the plating module 110 described above. As shown in the figure, the plating module 110 has an anode holder 220 configured to hold an anode 221, a substrate holder 30 configured to hold a substrate W, a plating tank 114 containing a plating solution Q containing an additive, and an overflow tank 136 that receives and discharges the plating solution Q overflowing from the plating tank 114. The plating tank 114 and the overflow tank 136 are separated by a partition wall 255. The anode holder 220 and the substrate holder 30 are accommodated inside the plating tank 114. As described above, the substrate holder 30 holding the substrate W is transported by the second transport device 144 (see FIG. 1) and accommodated in the plating tank 114.

[0033] Although only one plating tank 114 is illustrated in FIG. 2, as described above, the plating module 110 may include multiple plating tanks 114 having the same configuration as that shown in FIG.

[0034] The anode 221 is electrically connected to a positive terminal 271 of the rectifier 270 via an electrical contact (not shown) on the anode 221 and an electrical terminal 223 provided on the anode holder 220. The substrate W is electrically connected to a negative terminal 272 of the rectifier 270 via an electrical contact 242 on the substrate W and an electrical terminal 243 provided on the substrate holder 30. The rectifier 270 is configured to supply a plating current between the anode 221 connected to the positive terminal 271 and the substrate W connected to the negative terminal 272, and to measure an applied voltage between the positive terminal 271 and the negative terminal 272.

[0035] The anode holder 220 holding the anode 221 and the substrate holder 30 holding the substrate W are immersed in the plating solution Q in the plating tank 114, and are arranged facing each other so that the anode 221 and the plating surface W1 of the substrate W are approximately parallel to each other. A plating current is supplied to the anode 221 and the substrate W from the rectifier 270 while they are immersed in the plating solution Q in the plating tank 114. As a result, metal ions in the plating solution Q are reduced on the plating surface W1 of the substrate W, and a film is formed on the plating surface W1.

[0036] The anode holder 220 has an anode mask 225 for adjusting the electric field between the anode 221 and the substrate W. The anode mask 225 is, for example, a substantially plate-shaped member made of a dielectric material, and is provided on the front surface (the surface facing the substrate holder 30) of the anode holder 220. That is, the anode mask 225 is disposed between the anode 221 and the substrate holder 30. The anode mask 225 has a first opening 225a at the substantially central portion through which a current flows between the anode 221 and the substrate W. The diameter of the opening 225a is preferably smaller than the diameter of the anode 221. The anode mask 225 may be configured so that the diameter of the opening 225a can be adjusted.

[0037] The plating module 110 further includes a regulation plate 230 for regulating the electric field between the anode 221 and the substrate W. The regulation plate 230 is a substantially plate-shaped member made of, for example, a dielectric material, and is disposed between the anode mask 225 and the substrate holder 30 (substrate W). The regulation plate 230 has a second opening 230a through which a current flows between the anode 221 and the substrate W. The diameter of the opening 230a is preferably smaller than the diameter of the substrate W. The regulation plate 230 includes the opening 230a. The diameter of the groove 0a may be adjustable. Furthermore, a paddle (not shown) serving as a stirring rod for stirring the plating solution Q in the plating tank 114 is disposed between the regulation plate 230 and the substrate holder 30 (substrate W).

[0038] The plating tank 114 has a plating solution supply port 256 for supplying plating solution Q into the tank. The overflow tank 136 has a plating solution discharge port 257 for discharging plating solution Q that has overflowed from the plating tank 114. The plating solution supply port 256 is disposed at the bottom of the plating tank 114, and the plating solution discharge port 257 is disposed at the bottom of the overflow tank 136.

[0039] When the plating solution Q is supplied to the plating tank 114 from the plating solution supply port 256, the plating solution Q overflows from the plating tank 114, passes over the partition wall 255, and flows into the overflow tank 136. The plating solution Q that flows into the overflow tank 136 is discharged from a plating solution discharge port 257, and impurities are removed by a filter or the like of a plating solution circulation device 258. The plating solution Q from which the impurities have been removed is supplied to the plating tank 114 via the plating solution supply port 256 by the plating solution circulation device 258.

[0040] FIG. 3 is a circuit diagram showing in more detail how the anode 221 and the substrate W are electrically connected to the rectifier 270 in the plating module 110. The anode 221 has a plurality of electrical contacts 222 on its back surface (the surface opposite to the surface facing the substrate W). The plurality of electrical contacts 222 may be arranged over the entire back surface of the anode 221 from the center to the periphery. Alternatively, the plurality of electrical contacts 222 may be arranged only on a portion (e.g., the periphery) of the back surface of the anode 221. In addition to or instead of the back surface of the anode 221, the electrical contacts 222 may be arranged on the periphery of the front surface (the surface facing the substrate W) of the anode 221. Similarly, the substrate W has a plurality of electrical contacts 242 on its back surface (the surface opposite to the surface facing the anode 221). The plurality of electrical contacts 242 may be arranged over the entire back surface of the substrate W from the center to the periphery. The rear surface of the substrate W may be covered with an insulating material such as an oxide film, except for the peripheral portion. In such a case, the electrical contacts 242 may be disposed only on the peripheral portion of the rear surface of the substrate W, or, if possible, the electrical contacts 242 may be disposed on the peripheral portion of the front surface of the substrate W (the surface facing the anode 221).

[0041] Each of the electrical contacts 222 of the anode 221 is connected to a positive terminal 271 of the rectifier 270 by an electrical wiring (hereinafter referred to as an anode-side electrical wiring) 226. Similarly, each of the electrical contacts 242 of the substrate W is connected to a negative terminal 272 of the rectifier 270 by an electrical wiring (hereinafter referred to as a substrate-side electrical wiring) 246. In this manner, the anode 221 is electrically connected to the rectifier 270 via the electrical contacts 222 and the electrical wiring 226 of the anode, and the substrate W is electrically connected to the rectifier 270 via the electrical contacts 242 and the electrical wiring 246 of the substrate. As a result, a supply current from the rectifier 270 flows through the electrical contacts 222 and 242 to the anode 221 and the substrate W. Note that a configuration may be adopted in which a plurality of rectifiers 270 are installed and a plating current is supplied from each rectifier 270 to each of the electrical contacts 222 and 242, or to each set of several electrical contacts 222 and 242 located nearby.

[0042] A variable resistor 228 is inserted in the middle of each anode-side electrical wiring 226 that connects one electrical contact 222 of the anode 221 and a positive terminal 271 of the rectifier 270. Each variable resistor 228 makes it possible to individually adjust the electrical resistance value between the rectifier 270 and each electrical contact 222 on the anode 221. Similarly, a variable resistor 248 is inserted in the middle of each board-side electrical wiring 246 that connects one electrical contact 242 of the board W and a negative terminal 272 of the rectifier 270. Each variable resistor 248 makes it possible to individually adjust the electrical resistance value between the rectifier 270 and each electrical contact 242 on the board W. Note that in FIG. 3, for the sake of simplicity, a plurality of anode-side electrical wirings 226 are shown. Only some of the node-side electrical wiring 226 and the variable resistor 228 and the plurality of substrate-side electrical wirings 246 and the variable resistors 248 are shown, with the rest not being shown.

[0043] Here, the contact resistance at each electrical contact 242 on the substrate W (contact resistance between the electrode provided at the tip of the substrate-side electrical wiring 246 and the substrate surface) may differ for each electrical contact 242. Similarly, the contact resistance at each electrical contact 222 on the anode 221 may not be uniform between the contacts. In such cases, the current flowing through each substrate-side electrical wiring 246 varies among a plurality of current paths, which may cause the current distribution within the surface of the substrate W to be non-uniform, thereby reducing the uniformity of the thickness of the plating film formed on the substrate W. In addition, if the current flowing through each anode-side electrical wiring 226 varies among the current paths, the electric field distribution in the plating solution Q between the anode 221 and the substrate W becomes non-uniform, which also affects the potential on the plating surface of the substrate W and, ultimately, the uniformity of the plating film thickness.

[0044] By individually setting the resistance values ​​of the variable resistors 228 and 248, it is possible to control the thickness distribution of the plating film formed on the substrate W. For example, by setting the resistance value of the variable resistor 248 so as to compensate for the difference in contact resistance at each electrical contact 242 on the substrate W, the electrical resistance values ​​from the rectifier 270 to each electrical contact 242 can be made equal in all current paths on the substrate W side. In addition, by setting the resistance value of the variable resistor 228 so as to compensate for the difference in contact resistance at each electrical contact 222 on the anode 221, the electrical resistance values ​​from the rectifier 270 to each electrical contact 222 can be made equal in all current paths on the anode 221 side. As a result, the current flowing through each substrate-side electrical wiring 246 and / or the current flowing through each anode-side electrical wiring 226 becomes uniform between the wirings, and as a result, the uniformity of the thickness of the plating film formed on the substrate W can be improved.

[0045] The setting of the resistance value of the variable resistors 228, 248 is not limited to making the current flowing through each of the substrate-side electric wirings 246 and / or each of the anode-side electric wirings 226 uniform. For example, in a configuration in which the electrical contacts 242 are disposed only on the periphery of the substrate W, the current does not flow easily near the center of the substrate W due to the resistance value of the substrate W itself between the center and periphery of the substrate W or the resistance value of the seed layer on the substrate W. Therefore, in such a configuration, the plating film thickness at the center of the substrate W tends to be thinner than that at the periphery. Therefore, by setting the variable resistors 228 on the anode 221 side so that the resistance value of the variable resistors 228 closer to the center of the anode 221 is smaller, the reduction in the current flowing into the center of the substrate W can be suppressed and the current distribution in the substrate surface can be made uniform, thereby improving the uniformity of the thickness of the plating film formed on the substrate W.

[0046] The resistance value of the variable resistors 228, 248 is preferably larger than the contact resistance at the electrical contacts 222, 242. For example, the resistance value of each of the variable resistors 228, 248 may be about 10 times or more larger than the contact resistance at the electrical contacts 222, 242 (for example, the average value of all contact resistances). This makes the influence of the variation in the contact resistance of the electrical contacts 222, 242 relatively small, making it easier to control the balance of the current values ​​flowing through each of the electrical contacts 222, 242. However, the resistance values ​​of the variable resistors 228, 248 must be smaller than a predetermined upper limit value so that the output voltage of the rectifier 270 does not exceed a rated value with respect to the set output current of the rectifier 270.

[0047] Furthermore, since the multiple variable resistors 228, 248 are connected in parallel to the rectifier 270, under the condition of a constant plating current (i.e., assuming that the combined resistance between the rectifier 270 and the anode 221 and between the rectifier 270 and the substrate W is constant), the greater the number of variable resistors 228, 248, the greater the resistance value of each variable resistor 228, 248. Therefore, the greater the number of variable resistors 228, 248, the smaller the effect of variations in the contact resistance of the electrical contacts 222, 242 on the magnitude of the resistance value of the variable resistors 228, 248, and as a result This makes it easier to control the balance of the current values ​​flowing through the electrical contacts 222 and 242.

[0048] FIG. 4 is a diagram illustrating a control unit for controlling the resistance values ​​of the multiple variable resistors 228, 248. The control unit 400 may be a computer including a processor and a memory (not shown). In one embodiment, the control unit 400 is configured to control the resistance values ​​of the multiple variable resistors 228, 248 using a machine learning model 420. For example, the machine learning model 420 may be implemented in the control unit 400 by the processor reading and executing a program (computer executable instructions) stored in the memory of the control unit (computer) 400. The machine learning model 420 is trained using a large amount of learning data and is configured to determine the resistance value of each of the variable resistors 228, 248 required to achieve an optimal or desired film thickness distribution of the plating film formed on the substrate W. The control unit 400 is configured to set the respective resistance values ​​determined by the machine learning model 420 to each of the variable resistors 228, 248.

[0049] FIG. 5 shows an example of an implementation of the machine learning model 420. The machine learning model 420 is configured by a neural network 421 including an input layer 422 having a plurality of input nodes 423, an intermediate layer 424 consisting of one or more layers each having a plurality of nodes 425, and an output layer 426 having a plurality of output nodes 427. Each node is connected to a plurality of nodes in a layer adjacent to the layer to which the node belongs, with a strength characterized by a weighting parameter. In the learning (training) phase, the weighting parameters between the nodes are updated using a large amount of learning data, thereby creating a learned machine learning model 420. In the operation (inference and prediction) phase, the resistance values ​​of the variable resistors 228 and 248 are determined using the learned machine learning model 420.

[0050] As shown in FIG. 5, the input node 423 of the machine learning model 420 is associated with the plating film thickness values ​​at a plurality of coordinates 1 to M on the substrate W, and the output node 427 of the machine learning model 420 is associated with the resistance value of the variable resistor 248 connected to each of the electrical contacts 1 to N1 (electrical contact 242) on the substrate W and the resistance value of the variable resistor 228 connected to each of the electrical contacts 1 to N2 (electrical contact 222) on the anode 221. Note that the positions of the plurality of coordinates 1 to M are independent of the positions of the electrical contacts 222, 242, and the number M may be different from the number N1, N2 of the electrical contacts. As described above, the resistance value of each of the variable resistors 228, 248 affects the film thickness distribution of the plating film formed on the substrate W. Therefore, by configuring the machine learning model 420 to have the film thickness distribution (i.e., the film thickness value of each coordinate) as an input and the resistance value of each of the variable resistors 228, 248 as an output, it is possible to infer and determine the resistance value of each of the variable resistors 228, 248 required to realize a desired film thickness distribution. Then, by setting each of the variable resistors 228, 248 to the resistance value determined in this manner and carrying out plating processing, a plating film with a uniform film thickness distribution can be formed on the substrate W.

[0051] Data other than the plating film thickness value may be associated with the input node 423 of the machine learning model 420. For example, when a constant current is output from the rectifier 270, when the resistance values ​​of the variable resistors 228 and 248 change, the output voltage of the rectifier 270 also changes, and the output voltage of the rectifier 270 also changes depending on the magnitude of the constant current output from the rectifier 270. In addition, the output current value and output voltage value from the rectifier 270 as a design value are related to the combined resistance value between the positive terminal 271 and the negative terminal 272 of the rectifier 270 (including the resistance values ​​of the variable resistors 228 and 248, the contact resistance at the electrical contacts 222 and 242, the wiring resistance of the anode side electrical wiring 226 and the substrate side electrical wiring 246, the chemical resistance of the plating solution Q, and the polarization resistance on the surfaces of the substrate W and the anode 221). Furthermore, the thickness value of the plating film formed on the substrate W at each point on the substrate surface and the average thickness value on the substrate surface are determined by the magnitude of the constant current supplied from the rectifier 270, the distribution of the current flowing through each of the electrical contacts 222 and 242, the current application time for outputting the constant current from the rectifier 270, the thickness of the plating film on the substrate W, and the average thickness of the plating film on the substrate W. It varies depending on the shape of the plating solution Q (opening area of ​​the substrate W, opening ratio of the substrate W, thickness of the seed layer formed on the surface of the substrate W, etc.), and the characteristics of the plating solution Q (concentration, temperature, chemical composition, etc.). The opening area of ​​the substrate W refers to the area of ​​the front surface of the substrate W that is not covered with an insulating film such as an oxide film or resist (i.e., the area where the plating film is actually formed), and the opening ratio of the substrate W is defined as the ratio of the opening area to the area of ​​the front surface of the substrate W.

[0052] 5, it is advantageous to further associate one or more of the following with the input node 423: (1) a current value supplied between the anode 221 and the substrate W, (2) a voltage value applied between the anode 221 and the substrate W, (3) a current flow time for passing a current between the anode 221 and the substrate W, (4) information on the shape of the substrate W (the opening area of ​​the substrate W, the opening ratio of the substrate W, the thickness of the seed layer formed on the surface of the substrate W, etc.), and (5) information on the characteristics of the plating solution Q (the concentration, temperature, chemical components, etc. of the plating solution Q). This allows the resistance values ​​of the variable resistors 228, 248 to be inferred and determined more accurately.

[0053] The resistance values ​​of the variable resistors 228, 248 associated with the output node 427 of the machine learning model 420 are objects to be controlled by the control unit 400. That is, the control unit 400 operates to determine the optimum resistance values ​​of the variable resistors 228, 248 according to the given conditions (i.e., the input value to the input node 423). The control unit 400 may control other elements in addition to the resistance values ​​of the variable resistors 228, 248. For example, the anode mask 225 and the regulation plate 230 (see FIG. 2) arranged between the anode 221 and the substrate W affect the electric field distribution in the plating solution Q between the anode 221 and the substrate W, and thus the uniformity of the plating film thickness formed on the substrate W. Therefore, as in the machine learning model 420 of FIG. 5, it is possible to further associate one or both of the size (opening diameter) of the opening 225a of the anode mask 225 and the size of the opening 230a of the regulation plate 230 with the output node 427. By applying the opening diameter determined using such a machine learning model 420 to the anode mask 225 and / or the regulation plate 230, the uniformity of the thickness of the plating film formed on the substrate W can be further improved.

[0054] The sizes of the opening 225a in the anode mask 225 and the opening 230a in the regulation plate 230 may be associated with the input node 423 instead of the output node 427. When the machine learning model 420 is configured in this way, the machine learning model can determine optimal resistance values ​​of each of the variable resistors 228, 248 according to not only the input parameters (1) to (5) above but also the sizes of the opening 225a in the anode mask 225 and the opening 230a in the regulation plate 230.

[0055] FIG. 6 is a flowchart showing the learning phase and the operation phase of the machine learning model 420. A large number of learning data are required to train the machine learning model 420 in the learning phase. These learning data can be prepared by performing plating processes under various conditions in the plating module 110 (step 602). For example, the resistance values ​​of the variable resistors 228 and 248, the opening sizes of the electric field adjustment masks (anode mask 225 and regulation plate 230), the output current value from the rectifier 270 and the current flow time for passing the current, the shape of the substrate W, and the characteristics of the plating solution Q are set to certain conditions, and plating processes are performed. Next, the output voltage value of the rectifier 270 is measured during the plating process, and each plating film thickness value at coordinates 1 to M on the substrate W is measured after the plating process. Each of these set values ​​and measured values ​​constitutes one set of learning data. A large number of sets of learning data are created by setting a plurality of different conditions in the plating module 110 and performing plating processes and measurements in the same manner.

[0056] Next, one set of the created learning data is provided to each of the input node 423 and the output node 427 of the machine learning model 420 (step 604), and weighting parameters between each node are updated (step 606). Steps 604 and 606 are repeated for multiple sets of learning data, thereby progressing the training of the machine learning model 420. When the training has progressed to a predetermined stage, the machine learning model 420 can be used in the operation phase.

[0057] In the operation phase, the target thickness distribution of the plating film (i.e., the plating film thickness at coordinates 1 to M on the substrate W) and each setting value of the plating module 110 (such as the output current value of the rectifier 270) are input to the input node 423 of the machine learning model 420 (step 608). For example, these inputs may be made by an operator of the plating apparatus 10 via a user interface of the control unit (computer) 400. Next, the machine learning model 420 can output the resistance values ​​of each of the variable resistors 228, 248 and the aperture sizes of the anode mask 225 and the regulation plate 230 required to realize the target plating film thickness distribution from the output node 427 according to the data input to the input node 423 (step 610). The resistance values ​​thus determined by the machine learning model 420 are set to each of the variable resistors 228, 248 by the control unit 400 (and the determined aperture sizes are set to the anode mask 225 and the regulation plate 230 as necessary) (step 612).

[0058] Next, plating is performed on the substrate W in the plating module 110 in which the variable resistors 228, 248 (and the opening sizes of the anode mask 225 and regulation plate 230) are set to optimal values. This makes it possible to form a plating film having a targeted film thickness distribution on the substrate W. If it is possible to measure the plating film thickness at each of the coordinates 1 to M on the substrate W in real time during plating, the above learning phase and operation phase can be repeated using the film thickness data measured in this way at each time, thereby making it possible to more precisely control the film thickness distribution of the plating film formed on the substrate W.

[0059] FIG. 7 is a flowchart showing a method for enabling the machine learning model 420 to be trained more efficiently by performing learning and operation of the machine learning model 420 in parallel. First, in step 702, a machine learning model 420 in which weighting parameters between nodes are set to initial values ​​is prepared. The machine learning model 420 in which weighting parameters are set to initial values ​​may be, for example, a machine learning model 420 in which learning has progressed to a certain degree according to the learning phase of the flowchart in FIG. 6 described above. Alternatively, the resistance values ​​of the variable resistors 228 and 248 may be calculated from the target film thickness distribution, current value, voltage value, current application time, etc. by a predetermined theoretical calculation or simulation, and the machine learning model 420 may be trained in advance using these data to obtain the machine learning model 420 in which the weighting parameters are set to initial values.

[0060] Next, in step 704, the target thickness distribution of the plating film (i.e., the plating film thickness at coordinates 1 to M on the substrate W) and each set value of the plating module 110 (output current value, output voltage value, energization time of the rectifier 270, shape of the substrate W, and characteristics of the plating solution Q) are input to the input node 423 of the machine learning model 420. In step 706, the machine learning model 420 outputs the resistance values ​​of the variable resistors 228 and 248 and the aperture sizes of the anode mask 225 and the regulation plate 230 required to realize the target plating film thickness distribution from the output node 427 according to the data input to the input node 423. In step 708, the control unit 400 sets the resistance values ​​determined in step 706 to the variable resistors 228 and 248, and sets the aperture sizes to the anode mask 225 and the regulation plate 230. Note that these steps 704 to 708 correspond to steps 608 to 612 in the flowchart of FIG. 6 described above.

[0061] Next, in step 710, plating is performed in the plating module 110 to which the settings have been applied as described above, and in step 712, the output current value, output voltage value, and current flow time of the rectifier 270 during the plating process, and the film thickness value of the plating film formed on the substrate W by this plating process at each coordinate 1 to M of the substrate W are measured. Next, in step 714, the measured values ​​measured in step 712 are input to the input node 423 of the machine learning model 420, and in step 716, the machine learning model 420 outputs the resistance values ​​of each of the variable resistors 228, 248 from the output node 427 in accordance with the data input to the input node 423.

[0062] The resistance values ​​of the variable resistors 228, 248 calculated by the machine learning model 420 in step 706 correspond to the plating film thickness distribution targeted in the plating process, and the resistance values ​​of the variable resistors 228, 248 calculated in step 716 correspond to the plating film thickness distribution actually obtained by performing the plating process. In step 718, the control unit 400 calculates the difference between the resistance values ​​of the variable resistors 228, 248 calculated in step 706 and the resistance values ​​of the variable resistors 228, 248 calculated in step 716, and updates the weighting parameters between the nodes of the machine learning model 420 based on this difference. For example, the backpropagation method can be used to update the weighting parameters. This improves the weighting parameters between the nodes of the machine learning model 420 to match the plating film thickness distribution actually obtained, and as a result, the machine learning model 420 can calculate the resistance values ​​of the variable resistors 228, 248 more accurately.

[0063] The cycle of steps 704-718 may be repeated any number of times, allowing further optimization of the machine learning model 420 to occur accordingly.

[0064] Although the embodiments of the present invention have been described above based on several examples, the above-mentioned embodiments of the present invention are intended to facilitate understanding of the present invention and do not limit the present invention. For example, the plating apparatus 10 described with reference to Figs. 1 and 2 is a so-called dip-type plating apparatus, but the present invention can also be applied to a so-called cup-type plating apparatus in which the surface to be plated of a substrate such as a semiconductor wafer is placed horizontally with the surface facing downward (face down), and plating liquid is sprayed up from below to plate the substrate. The present invention may be modified or improved without departing from the spirit of the present invention, and of course, the present invention includes equivalents thereof. In addition, any combination or omission of each component described in the claims and specification is possible within the scope of solving at least a part of the above-mentioned problems or achieving at least a part of the effects. [Explanation of symbols]

[0065] 10 Plating Equipment 30 Substrate holder 100 cassettes 102 Cassette Table 104 Alaina 106 Spin rinse dryer 110 Plating Module 114 Plating tank 120 Load / Unload Station 122 Transport Robot 124 Stocker 126 Pre-wet module 128 Presoak Module 130a First Rinse Module 130b Second rinse module 132 Blow Module 136 Overflow tank 140 Transport Equipment 142 First conveying device 144 Second conveyor 150 Rail 152 Mounting plate 160 Paddle drive unit 162 Paddle follower 220 Anode holder 221 Anode 222 Electrical contacts 223 Electrical terminals 225 Anode Mask 225a First opening 226 Anode side electrical wiring 228 Variable Resistor 230 Regulation Plate 230a Second opening 242 Electrical Contacts 243 Electrical terminals 246 Electrical wiring on the board 248 Variable Resistor 255 Partition Wall 256 Plating solution supply port 257 Plating solution outlet 258 Plating solution circulation device 270 Rectifier 271 Positive terminal 272 negative terminal 400 Control Unit 420 Machine Learning Models 421 Neural Networks 422 Input Layer 423 Input Node 424 Middle Class 425 nodes 426 Output Layer 427 Output Node Q Plating solution W substrate W1 Plated surface

Claims

1. 1. A plating apparatus for plating a substrate by passing an electric current from an anode to the substrate, comprising: a plurality of anode-side electrical wirings electrically connected to the anode via a plurality of electrical contacts on the anode; a plurality of board-side electrical wirings electrically connected to the board via a plurality of electrical contacts on the board; a rectifier connected to the plurality of anode-side electrical wirings and the plurality of substrate-side electrical wirings to supply a plating current between the anode and the substrate; A plurality of variable resistors arranged in the middle of the plurality of anode-side electrical wirings; A control unit configured to adjust the resistance values ​​of the plurality of variable resistors; A plating apparatus comprising:

2. 2. The plating apparatus of claim 1, wherein the control unit adjusts the resistance values ​​of the plurality of variable resistors so that sums of resistance values ​​on each path of the plurality of anode side electrical wirings or the plurality of substrate side electrical wirings are substantially equal, regardless of contact resistance values ​​at each of the plurality of electrical contacts.

3. 3. The plating apparatus according to claim 2, wherein the control unit adjusts the resistance values ​​of the plurality of variable resistors so that substantially equal currents flow through the paths of the plurality of anode-side electrical wirings or the plurality of substrate-side electrical wirings.

4. 4. The plating apparatus according to claim 1, wherein the control unit adjusts the resistance values ​​of the plurality of variable resistors so that the resistance value of the variable resistor connected to the electrical contact near the center of the anode is relatively small and the resistance value of the variable resistor connected to the electrical contact near the periphery of the anode is relatively large.

5. The plating apparatus according to claim 1 , wherein a resistance value of each of the variable resistors is greater than a contact resistance value of the electrical contacts.

6. 6. The plating apparatus according to claim 5, wherein the resistance value of each of the variable resistors is at least 10 times greater than the contact resistance value of the electrical contacts.

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