Washing and drying machine

Abstract

To provide a washing and drying machine with high reliability.SOLUTION: A washing and drying machine 100 comprises: an enclosure 1; an inner tank 4 that is installed in the enclosure 1 and allows laundry R1 to be put in; an outer tank 8 including the inner tank 4; a substrate 30 on which a plurality of electronic components E1 including a power semiconductor element and a heat sink are mounted; a case C1 to store the substrate 30; and a cooling fan installed in the case C1. The case C1 is disposed above the outer tank 8. The plurality of electronic components E1 and the heat sink are mounted on the undersurface of the substrate 30.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a washing and drying machine. [Background technology]

[0002] As a structure of an electronic unit of a washer / dryer, for example, the technology described in Patent Document 1 is known. That is, Patent Document 1 describes that "the housing of the electronic unit is provided with a rib located above the intake port of the fan device to prevent water droplets from entering." [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2017-80009 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the technology described in Patent Document 1, a rib is provided on the housing of the electronic unit to prevent water droplets from entering, but there is room for improvement in terms of increasing the reliability of the washer-dryer.

[0005] In view of the above, an object of the present disclosure is to provide a highly reliable washer / dryer. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems, the washer-dryer of the present disclosure comprises a housing, an inner tub installed inside the housing and into which laundry is placed, an outer tub containing the inner tub, a board on which a plurality of electronic components including power semiconductor elements and a heat sink are mounted, a case for accommodating the board, and a cooling fan installed in the case, wherein the case is positioned above the outer tub, and the plurality of electronic components and the heat sink are mounted on the underside of the board. Effect of the Invention

[0007] According to the present disclosure, a highly reliable washer / dryer can be provided. [Brief description of the drawings]

[0008] [Figure 1] 1 is a perspective view of a washing / drying machine according to an embodiment; [Diagram 2] 1 is a schematic cross-sectional view showing an internal structure of a washing / drying machine according to an embodiment. [Diagram 3] 2 is a perspective view of the washer / dryer according to the embodiment with the top cover removed, viewed from the right rear downward. FIG. [Figure 4] 4 is a partially enlarged view of the vicinity of a case of an electronic unit in FIG. 3 in the washer / dryer according to the embodiment. [Diagram 5] 2 is a perspective view of a resin case of the washer / dryer according to the embodiment, viewed from the right rear downward. FIG. [Figure 6] 2 is a perspective view of a resin case and a cooling fan of the washer / dryer according to the embodiment, viewed from the left rear downward. FIG. [Figure 7] 4 is a rear view of the resin case in which a substrate is installed in the washer / dryer according to the embodiment, as viewed from the rear side. FIG. [Figure 8] 4 is a bottom view of the case of the washer / dryer according to the embodiment, in which a substrate is installed, as viewed from below. FIG. [Figure 9] 6 is a cross-sectional view taken along line VI-VI of FIG. 8 in the washer / dryer according to the embodiment. [Figure 10] 9 is a rear perspective view of the washer / dryer according to the embodiment taken along line VI-VI in FIG. 8. [Figure 11] 2 is a perspective view of a metal case in which a substrate and a resin case are housed in the washer / dryer according to the embodiment; FIG. [Figure 12] 4 is a bottom view of the metal case accommodating the substrate and the resin case of the washer / dryer according to the embodiment. FIG. [Figure 13] 1 is a perspective view of a washer / dryer according to an embodiment of the present invention as viewed from the right rear downward. [Figure 14]14 is a partial enlarged view of an area Z1 in FIG. 13 in the washer / dryer according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] <Embodiment> <Washer / dryer configuration> FIG. 1 is a perspective view of a washing / drying machine 100 according to an embodiment. The washer / dryer 100 shown in FIG. 1 is a drum-type washer / dryer that washes, rinses, spins, dries, etc. clothes. The washer / dryer 100 includes a housing 1, an operation unit 2, and a door 3. The housing 1 is a box-shaped body in which an inner tub 4 (see FIG. 2), an outer tub 8 (see FIG. 2), an electronic unit U1 (see FIG. 2), etc. are installed. An input opening H1 for inserting and removing laundry is provided on the front side of the housing 1. An openable and closable door 3 is also installed at the input opening H1.

[0010] The operation unit 2 receives user operations. For example, a mechanical switch or a capacitive touch panel is used as the operation unit 2. The operation unit 2 may also have a function of displaying the operation state and setting screen of the washer / dryer 100 in addition to the function of receiving user operations. In the example of FIG. 1, the operation unit 2 is provided on a cover panel 1c that is inclined downwardly toward the front between a top cover 1a and a front cover 1b of the housing 1.

[0011] FIG. 2 is a schematic cross-sectional view showing the internal structure of the washer / dryer 100. As shown in FIG. As shown in FIG. 2, the washer / dryer 100 includes an inner tub 4, a fluid balancer 5, a lifter 6, a motor 7, an outer tub 8, a bellows 9, a circulation pump 10, a heat pump unit 20, and an electronic unit U1.

[0012] The inner tub 4 is a cylindrical rotating drum with a bottom into which laundry R1 is put, and is installed inside the housing 1. The inner tub 4 is provided with a number of small holes (not shown) used for spin-drying and ventilation. A metal flange 4a for connecting the drive shaft 7a of the motor 7 is installed at the bottom of the inner tub 4. As shown in FIG. 2, a water supply hose connection port 19 is provided at the back side of the top cover 1a. A hose for introducing tap water from a water faucet is inserted into the water supply hose connection port 19.

[0013] The fluid balancer 5 is an annular member for suppressing vibrations caused by imbalance of the laundry R1, and is installed on the opening edge of the inner tub 4. The lifter 6 is a member for lifting up the laundry R1, and protrudes radially inward from the inner circumferential surface of the inner tub 4. The motor 7 is a drive source for rotating the inner tub 4, and is connected to a metal flange 4a at the bottom of the inner tub 4 via a drive shaft 7a.

[0014] The outer tub 8 is a cylindrical member with a bottom that contains the inner tub 4. The inner tub 4 and the outer tub 8 have substantially the same central axis (not shown). In the drum-type washer / dryer 100, the central axes of the inner tub 4 and the outer tub 8 are inclined at a predetermined angle so that the front of the tub is raised. As shown in FIG. 2, the outer tub 8 is supported from below by a suspension 11 and is suspended by a spring 12. The bellows 9 is a rubber ring-shaped member for ensuring watertightness between the outer tub 8 and the door 3, and is installed around the edge of the opening of the outer tub 8.

[0015] The lower part of the outer tub 8 is provided with a water receiving section 8a having a downwardly recessed shape. The water receiving section 8a is provided with a drain outlet H2 for draining the wash water. A lint filter 13 for collecting lint mixed in the wash water is provided downstream of the drain outlet H2. When the drain valve 14 is opened, the wash water is drained through the drain outlet H2, the lint filter 13, the drain valve 14, and the drain hose 15 in this order.

[0016] The circulation pump 10 is a pump for pumping the wash water up to the top of the outer tub 8 and spraying it onto the laundry R1 in the inner tub 4, and is installed below the outer tub 8. Although not shown, the heat pump unit 20 is configured with a compressor, a condenser, an expansion valve, and an evaporator, which are connected in sequence via refrigerant piping. During drying operation, moist air is dehumidified by the evaporator, and the dehumidified air is heated by the condenser. The heat pump unit 20 includes a housing 20a for accommodating devices such as the compressor. The housing 20a is installed at the lower part of the rear side of the housing 1.

[0017] 2 includes a substrate 30 and a case C1. The electronic unit U1 (i.e., the substrate 30 and the case C1) is disposed above the outer tank 8 inside the housing 1. This allows the electronic unit U1 to be appropriately disposed even when there is not enough space below the housing 1 due to the placement of the heat pump unit 20, etc. An upper cover 1a is disposed above the electronic unit U1 with a predetermined gap therebetween.

[0018] The substrate 30 is a printed circuit board on which a plurality of electronic components E1 including power semiconductor elements and a heat sink (not shown in FIG. 2) are mounted. As shown in FIG. 2, the surface of the substrate 30 is substantially parallel to the surface of the top cover 1a. In addition, a plurality of electronic components E1 and a heat sink are mounted on the lower surface of the substrate 30. As a result, even if condensation occurs on the heat sink, for example, the condensed water drips down under its own weight, so that adhesion of the condensed water to the electronic components E1 can be suppressed. Incidentally, the heat sink is made of aluminum or an aluminum alloy with high thermal conductivity to dissipate heat well, and is prone to condensation.

[0019] The case C1 is for housing the substrate. As shown in FIG. 2, the case C1 is configured to include a box-shaped resin case 40 with an opening at the bottom, and a metal case 50 that contains the resin case 40. The substrate 30 is placed in the upper space inside the resin case 40. By housing the substrate 30 in the resin case 40 in this way, it becomes possible to fill the potting material, as will be described below. Furthermore, by housing the resin case 40 in the metal case 50, it is possible to prevent the spread of fire in the event of a malfunction.

[0020] The resin case 40 is filled with a predetermined potting material. For example, in the manufacturing process of the electronic unit U1, the liquid potting material is poured into the resin case 40 while it is turned upside down (with the top open), and the potting material is then cured. As a result, the electronic component E1 near the bottom of the case C1 is covered with the potting material, improving waterproofing and dustproofing. For example, silicone resin, epoxy resin, or urethane resin is used as such a potting material. Note that the heat dissipation fins of the heat sink (not shown in FIG. 2) in the substrate 30 are present outside the potting material. The return duct 17 and the blowing nozzle 18 shown in FIG. 2 will be described later.

[0021] FIG. 3 is a perspective view of the washer / dryer 100 with the top cover removed, viewed from the right rear. In addition to the above-mentioned components, the washer / dryer 100 also includes boxes 61, 62 and a hot air duct 16 shown in FIG. 3. The boxes 61, 62 are lidded boxes into which detergent or fabric softener is poured. That is, detergent is poured into one of the boxes 61, 62, and fabric softener is poured into the other. These boxes 61, 62 are arranged side by side above the outer tub 8 (see FIG. 2). The boxes 61, 62 are also arranged adjacent to the case C1 in the horizontal direction (width direction). In the example of FIG. 3, the boxes 61, 62 are arranged side by side on the left side of the case C1.

[0022] The hot air duct 16 is a duct through which hot air flows during drying operation. The hot air duct 16 is disposed adjacent to the case C1 in the lateral direction (width direction). In the example of Fig. 3, the hot air duct 16 is disposed on the right side of the case C1.

[0023] The washer / dryer 100 includes, as components related to the drying operation, a return duct 17 (see FIG. 2), a blower fan (not shown), a blowing nozzle 18 (see FIG. 2), and a heat pump unit 20 (see FIG. 2) in addition to the hot air duct 16. The hot air duct 16 shown in FIG. 3 is a duct for guiding hot air (high-temperature, dry air) from the heat pump unit 20 to the blowing nozzle 18. The blowing nozzle 18 blows the hot air flowing through the hot air duct 16 into the inside of the inner tub 4 (see FIG. 2).

[0024] The return duct 17 (see FIG. 2) is a duct for guiding the moist air flowing out from the inner tub 4 to the heat pump unit 20. The blower fan (not shown) is a fan for circulating air through the hot air duct 16, the blowing nozzle 18, the inner tub 4 (see FIG. 2), the return duct 17 (see FIG. 2), and the heat pump unit 20 in that order. As described above, in the heat pump unit 20, the air is dehumidified in the evaporator (not shown), and is further heated in the condenser (not shown). Then, the hot, dry air is blown out into the inner tub 4 (see FIG. 2) through the hot air duct 16 and the blowing nozzle 18 (see FIG. 2) in that order.

[0025] FIG. 4 is a partially enlarged view of the vicinity of the case C1 of the electronic unit in FIG. In addition, cooling fan 80 (see FIG. 6) is not shown in FIG. 4. In addition to the components described above, washer / dryer 100 (see FIG. 3) is equipped with a front stay 71 and a rear stay 72. The front stay 71 and the rear stay 72 are metal members for reinforcement, and each extends in an elongated manner in the horizontal direction. The front stay 71 is disposed at the front of the housing 1. The rear stay 72 is disposed at the rear of the housing 1. These front stay 71 and rear stay 72 are disposed between top cover 1a (see FIG. 2) and outer tub 8 (see FIG. 2) in the up-down direction.

[0026] 4, the case C1 is disposed between the front stay 71 and the rear stay 72 in the front-rear direction. The case C1 is fixed to the front stay 71 and the rear stay 72 with screws or the like, and is also fixed to the hot air duct 16.

[0027] As described above, since hot air flows through the hot air duct 16 during the drying operation, the surroundings of the hot air duct 16 often become hot. Therefore, in this embodiment, the case C1 is arranged between the boxes 61, 62 and the hot air duct 16 in the horizontal direction. This makes it possible to prevent the detergent and fabric softener in the boxes 61, 62 from being altered by the heat of the hot air duct 16, compared to a configuration in which the boxes 61, 62 are adjacent to the hot air duct 16. It is also desirable to prevent heat transfer from the hot air duct 16 to the electronic component E1 (see FIG. 2) mounted on the board 30 (see FIG. 2), and a configuration for this purpose will be described later.

[0028] FIG. 5 is a perspective view of the resin case 40 as viewed from the rear right. In addition, cooling fan 80 (see FIG. 6) is not shown in FIG. 5. As described above, resin case 40 is box-shaped with an open bottom (see FIG. 2). Resin case 40 has rectangular top surface portion 41 and side surface portions 42 extending downward from edges of top surface portion 41. Side surface portions 42 form the front, rear, left, and right side surfaces of resin case 40, and are formed integrally with top surface portion 41. A circular opening H3 is provided in the rear surface of resin case 40 in a portion corresponding to the rotation area of ​​the propeller of cooling fan 80 (see FIG. 6).

[0029] As shown in FIG. 5, the resin case 40 includes a fan installation section 43, a side fixing section 44, a front fixing section 45, and rear fixing sections 46 and 47, as well as a flange 48 and a plurality of locking sections 49. The fan installation section 43 is a section into which a cooling fan 80 (see FIG. 6) is fitted. In the example of FIG. 5, the fan installation section 43 is provided on the rear surface of the resin case 40, on the right side of the center in the lateral direction. The fan installation section 43 includes a plurality of locking pieces 43a to 43d for locking a housing 80a (see FIG. 6) of the cooling fan 80 (see FIG. 6). These locking pieces 43a to 43d protrude forward from the front surface of the resin case 40, and are arranged to surround a circular opening H3.

[0030] The side fixing part 44 is for fixing the resin case 40 to the hot air duct 16 (see FIG. 4) and protrudes to the right from the right side surface of the resin case 40. The side fixing part 44 is provided with a hole H4 used for fixing to the hot air duct 16 (see FIG. 4). The front fixing portion 45 is for fixing the resin case 40 to the front stay 71 (see FIG. 4), and protrudes forward from the front surface of the resin case 40. The front fixing portion 45 is provided with a hole H5 used for fixing to the front stay 71 (see FIG. 4).

[0031] The rear fixing parts 46, 47 are for fixing the resin case 40 to the rear stay 72 (see FIG. 4), and protrude rearward from the rear surface of the resin case 40. The resin case 40 is fixed to the rear stay 72 (see FIG. 4) via a holding member 63 (see FIG. 4). That is, each of the rear fixing parts 46, 47 is fixed to the holding member 63, and the holding member 63 is further fixed to the rear stay 72. Such a configuration is also included in the matter of the resin case 40 being fixed to the rear stay 72. The rear fixing parts 46, 47 are provided with holes H6, H7 used for fixing to the rear stay 72 (see FIG. 4) via the holding member 63 (see FIG. 4).

[0032] The resin case 40 thus configured is fixed to the hot air duct 16 (see FIG. 4), the front stay 71 (see FIG. 4), and the rear stay 72 (see FIG. 4). Because the resin case 40 is firmly fixed by these three members, there is no particular need to fix the resin case 40 to the detergent and fabric softener boxes 61, 62 (see FIG. 4).

[0033] 5 extends horizontally outward from the edge of the opening of resin case 40, which has an open bottom. A plurality of locking portions 49 are provided on flange 48. These locking portions 49 are used when fixing main body 51 (see FIG. 11) and lid 52 (see FIG. 11) of metal case 50 (see FIG. 11) to resin case 40.

[0034] As shown in Fig. 5, a first insertion hole H8, a second insertion hole H9, and a third insertion hole H10 are provided on the rear surface of the resin case 40. The first insertion hole H8 is a hole through which a harness (not shown) for the compressor is inserted. In the example of Fig. 5, the first insertion hole H8 is provided on the left side of the rear fixing part 46.

[0035] The second insertion hole H9 is a hole through which a power cord (not shown) or a ground wire (not shown) is inserted. In the example of Fig. 5, the second insertion hole H9 is provided between the rear fixing parts 46 and 47 in the left-right direction. The third insertion hole H10 is a hole through which a harness (not shown) for low-current systems such as sensors is inserted. In the example of Fig. 5, the third insertion hole H10 is provided on the right side of the fan installation part 43.

[0036] It is preferable that no opening is provided on the side surface of the case C1 (resin case 40 and metal case 50: see FIG. 2) on the hot air duct 16 side (see FIG. 4). This makes it possible to prevent high-temperature air around the hot air duct 16 from flowing into the resin case 40 during drying operation. This makes it possible to prevent a temperature rise in the electronic component E1 (see FIG. 2) mounted on the board 30 (see FIG. 2).

[0037] FIG. 6 is a perspective view of the resin case 40 and the cooling fan 80 as viewed from the rear left. 6 illustrates the cooling fan 80, but the propeller of the cooling fan 80 is not shown. The cooling fan 80 is an axial fan for blowing cooling air to a plurality of electronic components E1 (see FIG. 2) and a heat sink on the board 30 (see FIG. 2), and is installed in the resin case 40 (case). The cooling fan 80 includes a housing 80a, a propeller (not shown), and a motor (not shown). When the motor is driven, the propeller rotates, and air is sucked into the resin case 40.

[0038] It is preferable that no openings are provided on the side surface of the case C1 (resin case 40 and metal case 50: see FIG. 2) on the side of the boxes 61 and 62 (see FIG. 4). This makes it possible to prevent air (air whose temperature has increased due to the heat of the electronic component E1) flowing out of the case C1 (see FIG. 2) from heading toward the boxes 61 and 62. This makes it possible to prevent deterioration of the detergent and fabric softener in the boxes 61 and 62 (see FIG. 4).

[0039] FIG. 7 is a rear view of resin case 40 with the substrate placed therein, as viewed from the rear side. 7 shows a state in which the cooling fan 80 (see FIG. 6) has been removed from the resin case 40. Therefore, the first heat sink 32 (see also FIG. 8) of the board 30 (see FIG. 8) is exposed, and the airflow direction vane 90 is also exposed. The first heat sink 32 and the airflow direction vane 90 will be described later. The fan installation portion 43, the side fixing portion 44, the rear fixing portions 46 and 47, as well as the first insertion hole H8, the second insertion hole H9, and the third insertion hole H10 shown in FIG. 7 are as described above (see also FIG. 5).

[0040] FIG. 8 is a bottom view of the case C1 with the board 30 installed therein, as viewed from below. 8 shows a state in which the lid 52 (see FIG. 12) of the metal case 50 is removed. The area surrounded by a dashed line in FIG. 8 shows the first exhaust port H12 and the second exhaust port H13 of the lid 52 (see FIG. 12) of the metal case 50. The outline arrows in FIG. 8 indicate the direction in which the cooling air flows inside the case C1. A large number of electronic components (corresponding to the electronic component E1 in FIG. 2) are mounted on the board 30. These electronic components include a plurality of power semiconductor elements and other electronic components.

[0041] Further, a plurality of power semiconductor elements having different drive targets are mounted on the board along the flow direction (white arrow in FIG. 8) of the cooling air blown from the cooling fan 80 (see FIG. 6) into the inside of the case C1. The plurality of power semiconductor elements include a first power semiconductor element 31 (see FIG. 9) for the compressor, a second power semiconductor element (not shown) for the blower fan, and a third power semiconductor element (not shown) for tank rotation. In FIG. 8, the first power semiconductor element 31 (power semiconductor element: see FIG. 9) is hidden by the first heat sink 32 and cannot be seen (the same applies to the other power semiconductor elements).

[0042] The first power semiconductor element 31 (see FIG. 9), the second power semiconductor element (not shown), and the third power semiconductor element (not shown) are elements that generate a large amount of heat compared to other electronic components, and are mounted in the right area A1 of the substrate 30. As such power semiconductor elements, for example, an IGBT (Insulated Gate Bipolar Transistor) is used.

[0043] A first heat sink 32 (heat sink) for promoting heat dissipation is provided on the first power semiconductor element 31 (see FIG. 9). That is, the first power semiconductor element 31 and the first heat sink 32 are in thermal contact with each other. Similarly, a second heat sink 33 (heat sink) is provided on the second power semiconductor element (not shown), and a third heat sink 34 (heat sink) is provided on the third power semiconductor element (not shown). Among the multiple power semiconductor elements that are different targets for driving, the first power semiconductor element 31 (see FIG. 9) for the compressor has the largest amount of heat generated per unit time, the second power semiconductor element (not shown) has the next largest amount of heat generated, and the third power semiconductor element (not shown) has the smallest amount of heat generated.

[0044] Moreover, among the multiple power semiconductor elements, those closer to the cooling fan 80 (see FIG. 6) are arranged so that the amount of heat generated (loss) per unit time is greater. That is, the cooling air blown into the inside of the case C1 first hits the first power semiconductor element 31 (see FIG. 9) and the first heat sink 32. As a result, heat dissipation from the first power semiconductor element 31 (see FIG. 9), which generates the largest amount of heat, is promoted. Moreover, the cooling air after absorbing heat from the first power semiconductor element 31 (see FIG. 9) is guided to the second power semiconductor element (not shown) and the second heat sink 33, and further to the third power semiconductor element (not shown) and the third heat sink 34. This allows the heat of each power semiconductor element to be appropriately dissipated.

[0045] As shown in Fig. 8, a fan installation section 43 is provided on the rear surface of the resin case 40 at a position corresponding to the right area A1 of the substrate 30 in the horizontal direction. That is, a cooling fan 80 (see Fig. 6) is disposed on the right side (one side in the horizontal direction) of the case C1. Also, each power semiconductor element is mounted in the right area A1 (one side area) of the substrate 30, and other electronic components are mounted in the left area A2 (the other side area). As a result, the cooling air blown out from the cooling fan 80 (see Fig. 6) is led directly to each power semiconductor element in sequence, promoting heat dissipation from each power semiconductor element.

[0046] Meanwhile, in the left region A2 of the substrate 30, other electronic components different from the above-mentioned multiple power semiconductor elements are mounted. Examples of such other electronic components include a rectifying diode bridge, a power factor correcting diode bridge and switching elements, a drive circuit for the cooling fan 80 (see FIG. 6), a noise filter, and a capacitor. These other electronic components also generate heat during operation of the washer / dryer 100 (see FIG. 1). The heat sink 35 shown in FIG. 8 is for facilitating heat dissipation from the rectifying diode bridge, the power factor correcting diode bridge, and the switching elements, and is installed on the substrate 30.

[0047] In this way, on the board 30, the power semiconductor elements are mounted on the side closer to the hot air duct 16 (see FIG. 4), and other electronic components are mounted on the side closer to the boxes 61, 62 (see FIG. 4). This makes it possible to prevent the temperature of the other electronic components, which generate less heat than the power semiconductor elements, from increasing due to the heat of the hot air duct 16 (see FIG. 4). In addition, it is possible to prevent the temperature of the detergent and fabric softener in the boxes 61, 62 (see FIG. 4) from increasing due to the heat of the power semiconductor elements, and thus to prevent deterioration of the detergent and fabric softener.

[0048] FIG. 9 is a cross-sectional view taken along line VI-VI in FIG. In addition, in Fig. 9, the case C1 is shown upside down to make it easier to understand the corresponding relationship with the following Fig. 10. In addition, in Fig. 9, a main body 51 of a metal case 50 is shown in addition to the resin case 40, but a lid 52 of the metal case 50 (see Fig. 11) is not shown. As described above, the first power semiconductor element 31 shown in Fig. 9 is the power semiconductor element that generates the largest amount of heat, and is in thermal contact with the first heat sink 32.

[0049] The substrate 30 is engaged with the bottom surface (the surface behind the top surface) of the resin case 40 by claws 30a. A large number of electronic components mounted on the substrate 30 are filled with potting material. The main body 51 of the metal case 50 has a box shape with an open bottom, and is engaged with the outside of the resin case 40 by engaging parts 49. When a lid 52 (see FIG. 11) is placed on the opening of the main body 51 of the metal case 50, the resin case 40 is enclosed within the metal case 50 (see FIG. 2).

[0050] FIG. 10 is a rear perspective view taken along line VI-VI in FIG. Capacitor 36 shown in Fig. 10 (also see Fig. 8) is an element used for power conversion such as an inverter. Coil 37 is used as a noise filter. Heat sink 35 is used for dissipating heat from a diode bridge for rectification, a diode bridge for power factor improvement, and an IGBT. Capacitor 38 is an element for removing noise.

[0051] The airflow direction plate 90 divides the cooling air blown from the cooling fan 80 into the inside of the case C1 into one directed toward the power semiconductor elements (such as the first power semiconductor element 31 in FIG. 9) and the other directed toward other electronic components. The airflow direction plate 90 has a cross section with a predetermined curved shape, and is formed integrally with the resin case 40. As shown in FIG. 10, the airflow direction plate 90 is disposed near the cooling fan 80 so as to partition the opening H3 on the blowing side of the cooling fan 80 in the case C1. Specifically, the airflow direction plate 90 is disposed to the left of the center of the opening H3 (the other side in the horizontal direction).

[0052] The airflow direction plate 90 includes a base end portion 91, an intermediate portion 92, and a downstream portion 93. The base end portion 91, the intermediate portion 92, and the downstream portion 93 are all elongated rectangular shapes in the vertical direction, and the height positions of the upper and lower ends are equal. The base end portion 91 extends forward from the rear plate of the resin case 40. The intermediate portion 92 extends leftward from the front end of the base end portion 91. The downstream portion 93 extends leftward from the front end of the intermediate portion 92. A part of the cooling air blown out through the circular opening H3 flows along the airflow direction plate 90 and is directed toward other electronic components that generate a relatively small amount of heat. This allows the cooling air to be appropriately sent to other electronic components in the left area A2 (see FIG. 8) of the board 30. Meanwhile, since the cooling fan 80 is installed to the right, the cooling air can be intensively sent to each power semiconductor element in the right area A1 (see FIG. 8) of the board 30.

[0053] In addition, the airflow direction plate 90 is provided with an air hole H11. In the example of FIG. 10, the air hole H11 is provided at a position higher than the coil 37 at the connection point between the base end portion 91 and the intermediate portion 92. This air hole H11 is a hole for sending cooling air to the coil 37 mounted in the vicinity of the front side of the airflow direction plate 90. The cooling air passing through the air hole H11 of the airflow direction plate 90 is guided to the coil 37 (a predetermined electronic component) of the multiple electronic components E1 (see FIG. 2). This allows the electronic component (the coil 39 in the example of FIG. 10) to be mounted in the vicinity of the front side of the airflow direction plate 90, so that the space of the board 30 can be used without waste.

[0054] FIG. 11 is a perspective view of metal case 50 housing the substrate and resin case. In addition, in order to illustrate the lid 52 of the metal case 50, the metal case 50 is shown upside down. As described above, the metal case 50 has a box-shaped main body 51 that is open at the bottom, and has a lid 52 that covers the opening of the main body 51. As shown in FIG. 11, the flange 48 of the resin case 40 (see FIG. 6) is exposed. In this manner, the configuration in which the flange 48 of the resin case 40 (see FIG. 6) is exposed is also included in the fact that the metal case 50 contains the resin case 40.

[0055] As shown in FIG. 11, a plurality of locking portions 49 provided on the flange 48 lock the main body 51 of the metal case 50 and also lock the lid 52. The lid 52 of the metal case 50 is configured such that a rear horizontal portion 52a, an inclined portion 52b, and a front horizontal portion 52c are integrally formed. The rear horizontal portion 52a has a rectangular plate shape. The plate surfaces of the rear horizontal portion 52a and the front horizontal portion 52c are approximately parallel to the upper surface of the main body 51. The inclined portion 52b has a rectangular plate shape and is connected to the front side of the rear horizontal portion 52a. The inclined portion 52b is inclined upward toward the front.

[0056] The front horizontal portion 52c has a rectangular plate shape and is connected to the front side of the inclined portion 52b. As described above, since the inclined portion 52b is raised toward the front, the height position of the front horizontal portion 52c is higher than the height position of the rear horizontal portion 52a. This makes it possible to prevent the metal case 50 from interfering with the outer tub 8 (see FIG. 2), which is inclined toward the front.

[0057] A plurality of exhaust ports are provided on the underside of the metal case 50. Specifically, a plurality of first exhaust ports H12 (exhaust ports) are provided on the front horizontal portion 52c of the lid 52. That is, a plurality of first exhaust ports H12 are provided near the downstream end of the metal case 50 in the flow direction of the cooling air. Also, a plurality of second exhaust ports H13 (exhaust ports) are provided on the inclined portion 52b. That is, the second exhaust ports H13 are provided upstream of the first exhaust ports H12. In the example of FIG. 11, each of the first exhaust ports H12 and the second exhaust ports H13 has a slit shape that is elongated in the front-rear direction.

[0058] As the cooling fan 80 (see FIG. 6) is driven, the air taken into the case C1 (see FIG. 2) absorbs heat from the electronic components E1 (see FIG. 2), and the air whose temperature has increased due to this heat absorption is exhausted to the outside of the case C1 through the first exhaust port H12 and the second exhaust port H13. The air exhausted to the outside of the case C1 (the internal space of the housing 1: see FIG. 2) is exhausted through an opening (not shown) near the bottom of the housing 1.

[0059] FIG. 12 is a bottom view of metal case 50 housing the substrate and resin case. In the example of Fig. 12, a plurality of second exhaust ports H13 are provided in the right region of the inclined portion 52b, while no second exhaust ports H13 are provided in the left region of the inclined portion 52b. The plurality of second exhaust ports H13 are provided downstream of the power semiconductor elements in the flow direction of the cooling air (see also Fig. 8). That is, in the lateral direction of the metal case 50, the region in which the plurality of second exhaust ports H13 exist corresponds to the right region A1 (see Fig. 8) in which the power semiconductor elements exist. On the other hand, the plurality of first exhaust ports H12 are provided in both the right and left regions of the front horizontal portion 52c.

[0060] According to this configuration, the flow resistance of air passing through the right area A1 (see FIG. 8) where multiple power semiconductor elements are mounted is reduced. This promotes heat dissipation from each power semiconductor element. In addition, since the first exhaust port H12 and the second exhaust port H13 are provided downstream of the power semiconductor elements, a sufficient flow rate can be ensured when the cooling air hits the power semiconductor elements. In addition, since the second exhaust port H13 is provided downstream of other electronic components present in the left area A2 (see FIG. 8), the other electronic components are also appropriately cooled by the cooling air.

[0061] FIG. 13 is a perspective view of the washer / dryer 100 as viewed from the rear right side. It should be noted that lids for covering the detergent and fabric softener boxes 61, 62 are not shown in Fig. 13. As shown in Fig. 13, a slit H14 is provided near the rear end of the top cover 1a of the washer / dryer 100.

[0062] FIG. 14 is a partial enlarged view of region Z1 in FIG. In the example of FIG. 14, a plurality of slits H14 elongated in the horizontal direction are provided on the rear surface of the housing 1. Specifically, the slits H14 are provided in the housing 1 near a location corresponding to the suction side of the cooling fan 80 (see FIG. 6). As a result, low-temperature air around the washer-dryer 100 enters the internal space of the housing 1 through the slits H14, and is further sucked into the inside of the case C1 (see FIG. 2) by the cooling fan 80 (see FIG. 6). Therefore, low-temperature air can be supplied to the inside of the case C1 when dissipating heat from the electronic component E1 (see FIG. 2) mounted on the board 30 (see FIG. 2). Since the temperature of the internal space of the housing 1 is likely to be high especially during the drying operation, dissipation of heat from the electronic component E1 (see FIG. 2) can be promoted by providing the slits H14 for taking in low-temperature air from the outside.

[0063] <Effects> According to this embodiment, an electronic unit U1 (see FIG. 2) is provided above the outer tub 8 (see FIG. 2), and a plurality of electronic components E1 (see FIG. 2) including power semiconductor elements are mounted on the underside of the substrate 30. As a result, even if condensation occurs on a heat sink or the like, the condensed water drips down by its own weight, preventing the condensed water from adhering to the electronic components E1. As a result, the reliability of the washer / dryer 100 is improved compared to before.

[0064] Moreover, according to this embodiment, unlike the above-mentioned Patent Document 1, there is no particular need to narrow the air passage by providing ribs to prevent the intrusion of water droplets. Therefore, it is possible to reduce pressure loss when the cooling air flows inside the case C1 (see FIG. 2), and thus to promote heat dissipation from the electronic component E1 (see FIG. 2). In other words, since the temperature rise of the electronic component E1 is suppressed, it is possible to suppress the occurrence of malfunctions in the electronic component E1. Furthermore, since the configuration of the electronic unit U1 (see FIG. 2) is relatively simple, it is possible to reduce the cost of the washer / dryer 100.

[0065] In addition, the power semiconductor elements that generate a large amount of heat are arranged upstream in the direction of the cooling airflow. This allows the power semiconductor elements to be appropriately cooled even when multiple power semiconductor elements with different amounts of heat are mounted on one board 30. Furthermore, by providing an airflow direction plate 90 (see FIG. 10), the cooling air is diverted toward other electronic components, allowing the other electronic components to also appropriately dissipate heat.

[0066] <<Variations>> Although the washer / dryer 100 according to the present disclosure has been described in the embodiment above, the washer / dryer 100 is not limited to the embodiment described above and may be modified in various ways. For example, in the embodiment, a power semiconductor element for a compressor, a power semiconductor element for a blower fan, and a power semiconductor element for tank rotation are mounted on the board 30 along the flow direction of the cooling air, but the number and types of the power semiconductor elements to be driven are not limited to this. That is, a configuration may be used in which a plurality of power semiconductor elements are mounted on the board 30 along the flow direction of the cooling air when it flows inside the case C1 (see FIG. 2).

[0067] In the embodiment, the case where an IGBT is used as the power semiconductor element is described, but the type of the power semiconductor element is not limited to this. For example, a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), a bipolar transistor, or a thyristor may be used as the power semiconductor element. In addition, different types of power semiconductor elements may be mixed among the multiple power semiconductor elements mounted on the substrate 30.

[0068] In the embodiment, the case C1 of the electronic unit U1 (see FIG. 4) is fixed to the front stay 71, the rear stay 72, and the hot air duct 16, but the present invention is not limited to this. For example, the case C1 may be fixed to the front stay 71 and the rear stay 72, but may not be fixed to the hot air duct 16. The case C1 may be fixed to the front stay 71, the rear stay 72, and other specified members. That is, it is sufficient that the case C1 is fixed to at least the front stay 71 and the rear stay 72.

[0069] Furthermore, a plurality of electronic components E1 (see FIG. 2) including power semiconductor elements may be mounted on the lower surface of the substrate 30, while a predetermined circuit pattern may be provided on the upper surface of the substrate 30. Even with this configuration, when condensation occurs on the heat sink on the lower surface of the substrate 30, the condensed water can be prevented from adhering to the electronic components E1.

[0070] In the embodiment, the configuration in which the substrate 30 is provided on the upper side of the outer tank 8 (see FIG. 2) has been described, but in addition to this, other substrates may be provided at other locations inside the housing 1. For example, a substrate for displaying a liquid crystal panel or a substrate for network connection may be provided inside the housing 1.

[0071] In the embodiment, the cross section of the airflow direction plate 90 (see FIG. 10) is bent in a predetermined manner, but the present invention is not limited to this. For example, the cross section of the airflow direction plate 90 may be curved in a predetermined manner. In the embodiment, the airflow direction plate 90 (see FIG. 10) is provided with an air hole H11, but the air hole H11 may be omitted as appropriate. In the embodiment, the case where the case C1 of the electronic unit U1 (see FIG. 2) includes the resin case 40 and the metal case 50 has been described, but one of the resin case 40 and the metal case 50 may be omitted as appropriate. In addition, in the embodiment, the case where the washer / dryer 100 is a drum type has been described, but the present invention is also applicable to other types of washing / dryer.

[0072] In addition, the embodiments are described in detail to explain the present disclosure in an easily understandable manner, and are not necessarily limited to those having all the configurations described. In addition, it is possible to add, delete, or replace some of the configurations of the embodiments with other configurations. In addition, the above-mentioned mechanisms and configurations are those considered necessary for explanation, and do not necessarily show all mechanisms and configurations in the product. [Explanation of symbols]

[0073] 1 Case 4 Inner tank 8 Outer tank 16 Hot air duct 30 Substrate 31 First power semiconductor element (power semiconductor element, electronic component) 32 1st heat sink (heat sink) 33 Second heat sink (heat sink) 34 3rd heat sink (heat sink) 36 Capacitors (other electronic components) 37 Coil (specified electronic component) 40 Resin case 50 Metal Case 61,62 Box 71 Front stay 72 Rear stay 80 Cooling Fan 90 Wind direction board 100 Washer / dryer A1 Right area (area on one side) A2 Left area (area on the other side) C1 Case E1 Electronic Components H3 opening H11 wind hole H12 No. 1 exhaust port (exhaust port) H13 Second exhaust port (exhaust port) H14 Slit R1 Laundry U1 Electronic unit

Claims

1. A housing and an inner tub disposed inside the housing and into which laundry is put; An outer tank containing the inner tank; a substrate on which a plurality of electronic components including power semiconductor elements and a heat sink are mounted; A case for accommodating the substrate; a cooling fan installed in the case; The case is disposed above the outer tank, A washing / drying machine, wherein a plurality of the electronic components and the heat sink are mounted on the underside of the substrate.

2. A plurality of the power semiconductor elements, each of which is a different drive target, are mounted on the board along a flow direction of cooling air blown from the cooling fan into the inside of the case, Among the plurality of power semiconductor elements, the closer to the cooling fan the greater the amount of heat generated per unit time. The washing and drying machine according to claim 1 .

3. The cooling fan is provided with a wind direction plate that divides the cooling air blown into the inside of the case into one directed toward the power semiconductor element and the other directed toward the electronic components. The washing and drying machine according to claim 1 .

4. The cooling fan is disposed on one lateral side of the case, The airflow direction plate is disposed on the other lateral side of the opening so as to partition the opening on the blowing side of the cooling fan in the case, The power semiconductor element is mounted in the region on one side of the substrate, and other electronic components are mounted in the region on the other side of the substrate. The washing and drying machine according to claim 3 .

5. The wind direction plate is provided with a wind hole, The cooling air that has passed through the air holes is guided to a predetermined electronic component among the plurality of electronic components. The washing and drying machine according to claim 3 .

6. A slit is provided in the housing near a portion corresponding to the intake side of the cooling fan. The washing and drying machine according to claim 1 .

7. A box is provided for inserting detergent or fabric softener, The box is disposed adjacent to the case, The case has no opening on the side surface facing the box. The washing and drying machine according to claim 1 .

8. Equipped with a hot air duct through which hot air flows during drying operation, The hot air duct is disposed adjacent to the case, The case has no opening on the side surface on the hot air duct side. The washing and drying machine according to claim 1 .

9. A box into which detergent or fabric softener is dispensed; A hot air duct through which hot air flows during drying operation; a front stay disposed at a front portion of the housing and extending laterally; a rear stay disposed at a rear portion of the housing and extending laterally; The case is disposed between the box and the hot air duct in the lateral direction, and between the front stay and the rear stay in the front-rear direction, and is fixed to at least the front stay and the rear stay. The washing and drying machine according to claim 1 .

10. The case includes a box-shaped resin case having an opening at the bottom and a metal case that contains the resin case, The substrate is placed inside the resin case, An exhaust port is provided on the bottom surface of the metal case. The washing and drying machine according to claim 1 .

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