Imaging apparatus

Abstract

To provide an imaging apparatus that has a cooling unit consisting of a fan and a duct mounted therein, and can prevent an increase in the size of a camera.SOLUTION: An imaging apparatus of the present invention has a cooling unit 303, and the cooling unit comprises: a duct 310 that is thermally connected with an imaging substrate 305 and a control board 302; and a fan 131 that is thermally connected with the duct 310 and generates an airflow for cooling the imaging substrate 305 and the control board 302. When seen from an optical axis direction of an image pickup device 306, the imaging substrate 305, control board 302, and cooling unit 303 are arranged not overlapping each other.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to an imaging device equipped with a heat dissipation structure. [Background technology]

[0002] In recent years, with the demand for smaller image pickup devices, there has been a remarkable trend toward smaller and denser electronic components inside the devices.

[0003] On the other hand, there is an ever-increasing demand for more sophisticated imaging devices, particularly for higher performance video functions, and the amount of heat generated by imaging devices is on the rise.

[0004] As a result, the temperature inside the device increases during video shooting, which can potentially cause electronic components to malfunction or degrade in performance, and ultimately lead to failure of the imaging device.

[0005] In recent years, a heat dissipation structure that dissipates heat naturally is insufficient to dissipate heat relative to the amount of heat generated by an imaging device, and a heat dissipation structure that dissipates heat by forced air cooling using a fan is sometimes used.

[0006] Patent Document 1 discloses an imaging device equipped with a heat dissipation structure using a fan and a duct.

[0007] The imaging device of Patent Document 1 includes ducts with vents formed on the upper and bottom sides of the rear surface of the exterior member.

[0008] The duct is formed to extend from the rear side to the front side of the imaging device in the optical axis direction of the imaging device, and further passes from the top side to the bottom side, passing through the area between the control circuit board and the exterior member, and is connected to the ventilation hole on the bottom side.

[0009] The fan is disposed inside the bottom side of the duct.

[0010] The heat generated in the control circuit board is transferred to the duct and exhausted using the airflow generated in the duct by a fan, so that the heat in the control circuit board can be dissipated to the outside of the imaging device. [Prior art documents] [Patent documents]

[0011] [Patent Document 1] Patent Publication No. 2022-139640 Summary of the Invention [Problem to be solved by the invention]

[0012] However, in the imaging device disclosed in Patent Document 1, a duct is disposed between the control circuit board and the exterior member, which increases the size of the imaging device by the size of the duct, which goes against the recent demand for miniaturization of imaging devices.

[0013] SUMMARY OF THE PRESENTLY PREFERRED EMBODIMENTS An object of the present invention is to provide an imaging device that is equipped with a cooling unit consisting of a fan and a duct while preventing the camera from becoming too large. [Means for solving the problem]

[0014] In order to achieve the above object, the present invention provides an image pickup device for capturing an image of a subject, an imaging substrate on which the imaging element is mounted; a control board on which an electronic element for performing image processing of the imaging element is mounted; An imaging device having a cooling unit, the cooling unit includes a duct thermally connected to the imaging board and the control board, and a fan thermally connected to the duct to generate an airflow for cooling the imaging board and the control board; The imaging board, the control board, and the cooling unit are arranged so as not to overlap each other when viewed from the optical axis direction of the imaging element. Effect of the Invention

[0015] According to the present invention, it is possible to provide an imaging device that is equipped with a cooling unit consisting of a fan and a duct, while preventing the camera from becoming too large. [Brief description of the drawings]

[0016] [Figure 1] 1 is a block diagram showing the configuration of a digital camera according to the present invention. [Diagram 2] 1 is an external perspective view of a digital camera according to the present invention. [Diagram 3] FIG. 1 is an exploded perspective view of a digital camera according to the present invention. [Figure 4] FIG. 2 is an exploded rear view of the digital camera according to the first embodiment of the present invention. [Diagram 5] FIG. 2 is a schematic rear view of the digital camera according to the present invention. [Figure 6] FIG. 2 is an external view showing the arrangement of heat pipes relative to an imaging board which is a component of the digital camera according to the present invention. [Figure 7] FIG. 11 is an exploded rear view of a digital camera according to a second embodiment of the present invention. [Figure 8] FIG. 2 is an external view of a main board which is a component of the digital camera according to the present invention. [Figure 9] FIG. 2 is an external view of an imaging board which is a component of the digital camera according to the present invention. [Figure 10] FIG. 1 is a schematic rear view of a conventional imaging device. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0018] Example 1 (Configuration of digital camera 100) FIG. 1 is a block diagram showing an example of the configuration of a digital camera 100 as an example of an imaging apparatus of the present invention.

[0019] In this embodiment, a digital camera is illustrated as an example of an imaging device, but the imaging device is not limited to this.

[0020] The optical system of the digital camera 100 is made up of a photographing lens 101 , a shutter 102 having an aperture function, and an image capturing unit 103 .

[0021] The imaging unit 103 is composed of an imaging element 306 , an imaging board 305 for transmitting the converted electrical signal, and an imaging flex 307 .

[0022] The image capturing unit 103 will be described in detail later.

[0023] The A / D conversion unit 104 is used when converting an analog signal output from the imaging unit 103 into a digital signal, and when converting an analog signal output from the audio control unit 105 into a digital signal.

[0024] The lens barrier 106 covers the photographing lens 101 of the digital camera 100 to reduce the risk of the lens becoming dirty or damaged.

[0025] The timing generating unit 107 is controlled by the memory control unit 108 and the system control unit 109 , and supplies clock signals and control signals to the imaging unit 103 , the audio control unit 105 , the A / D conversion unit 104 , and the D / A conversion unit 110 .

[0026] An image processing unit 111 performs predetermined pixel interpolation, resizing such as reduction, and color conversion processing on the output data from the A / D conversion unit 104 and the data stored in the memory 112 .

[0027] Furthermore, the image processing unit 111 performs a predetermined calculation on the captured image data, and the system control unit 109 performs exposure control and distance measurement control based on the obtained calculation results.

[0028] This allows TTL (through-the-lens) AF (autofocus) processing, AE (autoexposure) processing, and EF (pre-flash) processing to be performed.

[0029] The image processing unit 111 further performs a predetermined calculation process using the captured image data, and also performs TTL type AWB (auto white balance) processing based on the obtained calculation results.

[0030] The output data from the A / D conversion unit 104 is written into a memory 112 via an image processing unit 111 and a memory control unit 108, or directly via the memory control unit 108.

[0031] The memory 112 stores audio data recorded by a microphone 113, still and moving images that have been taken, and information associated with images, such as file headers when configuring image files.

[0032] This memory 112 has a storage capacity sufficient to store a predetermined number of still images and a predetermined period of moving images and audio.

[0033] The compression / expansion unit 114 compresses and expands image data using adaptive discrete cosine transform (ADCT) or the like. Triggered by the shutter 102, it reads the captured image stored in the memory 112, performs compression processing, and writes the processed data to the memory 112.

[0034] It also reads a compressed image that has been read into the memory 112 from the recording medium 115 or the like, performs decompression processing, and writes the processed data into the memory 112 .

[0035] The image data written to the memory 112 by the compression / decompression unit 114 is converted into a file by a file processing unit of the system control unit 109 , and is recorded on the recording medium 115 via the recording medium I / F 116 .

[0036] The memory 112 also serves as a memory for image display, and image data for display written in the memory 112 is displayed by the image display unit 117 via the D / A conversion unit 110 .

[0037] An audio signal output from a microphone 113 passes through an audio control unit 105 constituted by an amplifier and the like, is converted into a digital signal in an A / D conversion unit 104, and is then stored in a memory 112 by a memory control unit .

[0038] On the other hand, audio data recorded on recording medium 115 is read into memory 112 , and then passes through D / A conversion section 110 and audio control section 105 , where the processed signal is outputted from speaker 118 .

[0039] The system control unit 109 is a control unit capable of overall control of the digital camera 100 and each unit attached to the digital camera 100 .

[0040] The system control unit 109 is connected to a non-volatile memory 120 and a system memory 119 .

[0041] The non-volatile memory 120 is a non-volatile storage element, and stores programs for operating the system control unit 109, various adjustment parameters, and the like.

[0042] The program read from the non-volatile memory 120 is deployed in the system memory 119, which is a volatile storage element, and then executed.

[0043] The system memory 119 is a so-called frame memory, which is a storage unit that temporarily stores image signals and can read them out when necessary.

[0044] The system memory 119 can store constants, variables, programs, and the like for the operation of the system control unit 109 in addition to image signals.

[0045] The shutter switch (SW1), the shutter switch (SW2), and the operation unit 121 are operation means for the user to input various operation instructions to the system control unit 109.

[0046] An operation unit 121 is made up of various operation members such as a menu button, a jog dial, etc., and can display a captured image on the image display unit 117 and can perform various settings.

[0047] When the menu button is pressed, a menu screen on which various settings can be made is displayed on the image display unit 117.

[0048] A user can intuitively perform various settings using the menu screen displayed on the image display unit 117 and the operation unit 121.

[0049] Furthermore, the touch of the user's finger or pen on image display unit 117 may be detected, and the icon displayed on image display unit 117 may be determined in the same manner as the operation of a switch such as a button or dial.

[0050] Furthermore, by using an operating member capable of detecting the rotation of a jog dial or the like, it is possible to perform the same operation as a bidirectional key.

[0051] A mode dial 122 is used by the user to switch the operation mode of the system control unit 109 between a still image capture mode, a continuous capture (continuous shooting) mode, a movie mode, a playback mode, and the like.

[0052] The shutter switch (SW1) is turned on when the release button 123 provided on the digital camera 100 is pressed halfway (halfway).

[0053] Then, it issues instructions to start operations such as AF (autofocus) processing, AE (auto exposure) processing, AWB (auto white balance) processing, and EF (pre-flash) processing.

[0054] The shutter switch (SW2) is turned on when the release button 123 is fully pressed (fully depressed), and instructs the start of a series of imaging processing operations, from reading out a signal from the imaging unit 103 to writing image data to the recording medium 115.

[0055] The power button 124 is an operating member for switching the power on and off.

[0056] The power supply control unit 125 is configured with a battery detection circuit, a DC-DC converter, a switch circuit for switching between blocks to which electricity is applied, and the like, and detects whether a battery is attached, the type of battery, and the remaining battery level.

[0057] Also, it controls a DC-DC converter based on the detection result and instructions from system control unit 109, and supplies the necessary voltage to each electric element including system control unit 109 for the necessary period.

[0058] The power supply unit 126 is composed of a primary battery such as an alkaline battery or a lithium battery, a secondary battery such as a NiCd battery, a NiMH battery, or a Li-ion battery, an AC adapter, or the like.

[0059] The power supply unit 126 is connected to the power supply control unit 125 via a camera-side power connector.

[0060] The RTC 127 (Real Time Clock) has an internal power supply separate from the power supply control unit 125, and continues to measure time even if the power supply unit 126 is turned off.

[0061] The system control unit 109 performs timer control using the date and time acquired from the RTC 127 at the time of startup.

[0062] The recording medium attachment / detachment detection unit 128 detects whether or not the recording medium 115 is attached to the digital camera 100 .

[0063] A communication unit 129 performs various communication processes such as RS232C, USB, IEEE1394, P1284, SCSI, modem, LAN, and wireless communication.

[0064] A communication connector 130 (or an antenna in the case of wireless communication) connects the digital camera 100 to other devices via a communication unit 129.

[0065] The fan 131 is controlled by the system control unit 109 to drive (turn on / off and rotation speed).

[0066] The fan 131 will be described in detail later.

[0067] (External appearance of digital camera 100) FIG. 2(a) is a perspective view of the digital camera 100 as seen from the front side (subject side).

[0068] FIG. 2B is a perspective view of the digital camera 100 shown in FIG. 2A, seen from the rear side.

[0069] The axis parallel to the optical axis O of the digital camera 100 is the Z axis, the height direction is the Y axis, and the width direction (horizontal direction) is the X axis.

[0070] The XYZ axes will be explained assuming they are common to other figures as well.

[0071] As shown in Figures 2(a) and 2(b), the exterior of the digital camera 100 is formed by a front cover 201, a top cover 202, a rear cover 203, and a terminal cover 212 that covers the communication connector 130 in an openable and closable manner.

[0072] A lens unit 215 is provided on the front side of the digital camera 100.

[0073] The lens unit 215 is composed of the photographing lens 101, the shutter 102, and the image capturing section 103 described above.

[0074] It should be noted that the lens unit 215 may be either integrated with the digital camera 100 or replaceable with respect to the digital camera 100 .

[0075] On the top surface of the digital camera 100, there are provided a release button 123, a power button 124, a mode dial 122, a video recording button 209, a microphone 113 for picking up external sounds, an accessory shoe 204, and the like.

[0076] As shown in FIG. 2(b), an image display unit 117 made up of an LCD or the like is provided on the rear side of the digital camera 100.

[0077] A plurality of operation buttons 214a to 214e constituting an operation unit 121 are provided on the right side of the image display unit 117 when the digital camera 100 is viewed from the rear side.

[0078] The front cover 201 is provided with an intake port 201 a for the fan 131 .

[0079] Furthermore, the top cover 202 is provided with two exhaust ports 202 a and 202 b which are exhaust ports for the fan 131 .

[0080] The first exhaust port 202a is located on the side of the digital camera 100, on the side opposite the operation system such as the release button 123, with the accessory shoe 204 in between.

[0081] The second exhaust port 202b is opened so as to exhaust air toward the rear of the digital camera 100.

[0082] As the fan 131 rotates, air flows into the interior of the digital camera 100 through the air intake 201a, and the air that has flowed in is exhausted through the air exhaust ports 202a and 202b.

[0083] The exhaust direction of the first exhaust port 202a is the side direction (+X direction) opposite the microphone 113 so that the exhaust wind does not hit the microphone 113.

[0084] The second exhaust direction is toward the rear of the digital camera 100 (-Z direction).

[0085] (Heat dissipation structure of the entire digital camera 100) The heat dissipation structure of the entire digital camera 100 of this embodiment will be described with reference to FIGS.

[0086] FIG. 3 is an exploded perspective view of the digital camera 100. As shown in FIG.

[0087] As shown in FIG. 3, the exterior of the digital camera 100 is formed by the front cover 201, top cover 202, rear cover 203, and terminal cover 212 described above.

[0088] Inside the digital camera 100, an imaging unit 301, a main board 302, a cooling unit 303, a battery chamber unit 304, and the like are arranged.

[0089] The main board 302 has a system control unit 109 and a plurality of electronic elements mounted thereon.

[0090] The imaging unit 301 is composed of the above-mentioned photographing lens 101, shutter 102, imaging section 103, and lens barrier 106.

[0091] The imaging board 305 is exposed on the rear surface (−Z direction) of the imaging unit 301 .

[0092] The image sensor 306 is an image capturing means that employs a charge storage type solid-state image sensor such as a CMOS that can receive the light beam of the subject guided by the photographing lens 101 and convert it into an electrical image signal.

[0093] The imaging element 306 is mounted on the surface of the imaging board 305 on the front side of the digital camera 100 , and is disposed inside the imaging unit 301 .

[0094] The image sensor 306 is not shown in FIG. 2 but is shown in FIG.

[0095] The imaging board 305 controls the voltage for driving the imaging element 306 , and further transmits the imaging signal output from the imaging element 306 to the main board 302 via the imaging flex 307 .

[0096] The battery chamber unit 304 holds the power supply unit 126 described above, and supplies power to the main board 302 via a power flex 309 .

[0097] The cooling unit 303 is composed of a fan 131 and a duct 310 .

[0098] The duct 310 has two openings, one of which is connected to the intake port 201a, and the other of which is connected via the fan 131 to the exhaust ports 202a and 202b.

[0099] The main chassis 311 is a sheet metal member extending in the X direction of the digital camera 100, and ensures the rigidity of the digital camera 100, and also holds the cooling unit 303 and the heat pipes 312 by fastening with screws.

[0100] The heat pipe 312 is a heat transfer member for transferring heat from the system control unit 109 to the cooling unit 303 .

[0101] Three pieces of heat-conducting rubber 313 are disposed between the heat pipe 312 and the system control unit 109 , and heat from the system control unit 109 is transferred to the cooling unit 303 via the heat-conducting rubber 313 and the heat pipe 312 .

[0102] Furthermore, imaging section 103 is thermally connected to cooling unit 303 via duct side graphite sheet 314 , and heat from imaging section 103 is transferred to cooling unit 303 via duct side graphite sheet 314 .

[0103] The imaging unit 301 and the electronic chamber unit 304 are fixed to the front cover 201 with screws.

[0104] Furthermore, the main board 302 and the main chassis 311 are fixed to the battery chamber unit 304 with screws.

[0105] The heat pipe 312 is fixed to the main chassis 311 with screws as described above, and is fixed to the battery chamber unit 304 together with the main chassis 311 .

[0106] With the above configuration, a heat dissipation path is formed via the heat pipe 312 to the system control unit 109 and the cooling unit 303 of the imaging unit 103 .

[0107] The heat transferred to the cooling unit 303 is discharged to the outside of the digital camera 100 by the fan 131 .

[0108] Digital camera 100 of this embodiment uses a heat pipe, heat conductive rubber, and graphite sheet as heat transfer members, but is not limited to these.

[0109] For example, it may be a metal plate made of a metal material having a relatively high thermal conductivity, such as aluminum, copper, or magnesium.

[0110] Among the components of the digital camera 100, the system control unit 109 and the image capture unit 103 consume a large amount of power and generate a large amount of heat, and therefore are prone to temperature rise.

[0111] Therefore, the imaging time of the digital camera 100 is limited by the guaranteed operating temperature of the system control unit 109 and the imaging unit 103, except for the remaining battery power.

[0112] In order to maximize the imaging time, it is necessary to cool the system control unit 109 and the imaging unit 103 so that their temperatures do not exceed the guaranteed operating temperatures.

[0113] For this reason, the digital camera 100 of the present invention is provided with the above-mentioned heat dissipation structure.

[0114] By exhausting the heat of the system control unit 109 and the imaging unit 103 transferred to the duct 310 by the fan 131, the system control unit 109 and the imaging unit 103 can be forcibly air-cooled, thereby suppressing a rise in temperature.

[0115] (Exploded rear view of digital camera 100) FIG. 4 is an exploded rear view of the digital camera 100. As shown in FIG.

[0116] In FIG. 4, the front cover 201, the top cover 202, and the rear cover 203 are omitted.

[0117] The fan 131 is electrically connected to the main board 302 via a lead wire 401 , a flex connector 402 , and a control flex 403 .

[0118] A control signal from the system control unit 109 is transmitted to the fan 131 via the lead wire 401, the flexible connector 402, the control flexible cable 403, and the main board 302, thereby controlling the driving of the fan 131.

[0119] The control flex 403 transmits control signals for not only the fan 131 but also the photographing lens 101 and the shutter 102 from the system control unit 109 to the lens unit 215 .

[0120] The control signal transmitted through the lead wire 401 and the control flex 403 is a high-frequency signal similar to the imaging signal output from the imaging element 306, and is prone to crosstalk with the imaging signal.

[0121] As a result, the output of the imaging signal may change, and the image processor 111 may not be able to generate the desired still image or video.

[0122] Therefore, it is desirable that the control signal and the imaging signal are arranged so as not to overlap each other.

[0123] Therefore, in the digital camera 100 of this embodiment, as shown in FIG. 4, the fan 131, the lead wire 401, and the control flex 403 are arranged with respect to the imaging board 305 and the imaging flex 307 without overlapping with each other along the optical axis O (Z direction).

[0124] This allows the cooling unit 303 to forcibly air-cool the system control unit 109 and the imaging unit 103, without impeding the generation of still images and moving images by the image processing unit 111, thereby making it possible to suppress temperature increases.

[0125] (Mechanisms for making the digital camera 100 smaller) The arrangement of the main board 302 and the imaging board 305 relative to the cooling unit 303 will be described with reference to FIGS. 5, 6, and 10. FIG.

[0126] FIG. 5(a) is a schematic rear view of the digital camera 100, and FIG. 5(b) is a schematic side view of the digital camera 100.

[0127] The cooling unit 303, the main board 302, and the imaging board 305 are illustrated generally to clearly show their relative positions, and other components are not illustrated.

[0128] 5A represents the outermost shape of the digital camera 100 formed by the front cover 201, the top cover 202, the rear cover 203, and the terminal cover 212. As shown in FIG.

[0129] As shown in FIG. 5(a), the cooling unit 303, the main board 302, and the imaging board 305 are arranged so as not to protrude from the solid-line frame P.

[0130] This prevents the digital camera 100 from being partially enlarged in the X or Y direction.

[0131] With respect to the cooling unit 303, the main board 302 and the imaging board 305 are arranged side by side without overlapping with each other in the optical axis O direction (Z direction).

[0132] Furthermore, referring to FIG. 5(b), the main board 302 and the imaging board 305 are disposed so as to overlap each other in the X direction with respect to the cooling unit 303.

[0133] Here, for comparison with the digital camera 100 of this embodiment, the configuration of a conventional imaging device in FIG. 10 will be referred to.

[0134] FIG. 10 is a schematic rear view showing the arrangement of a main board 302 and an imaging board 305 relative to a cooling unit 303 of a conventional imaging device.

[0135] As in FIG. 5, the solid line frame P' shown in FIG. 10 represents the outermost shape of the conventional imaging device.

[0136] As shown in FIG. 10(a), a main board 1004 and an imaging board 1005 are disposed with respect to a cooling unit 1003 so as to overlap each other in the optical axis direction (Z direction) of an imaging element (not shown).

[0137] Furthermore, referring to FIG. 10(b), the main board 1004 and the imaging board 1005 are disposed relative to the cooling unit 1003 without overlapping with each other in the X direction.

[0138] 5(b) and 10(b), the arrangement space of the cooling unit 303, the main board 302, and the imaging board 305 is smaller than the arrangement space of the cooling unit 1003, the main board 1004, and the imaging board 1005.

[0139] As a result, the solid-line frame P is smaller in the Z direction than the solid-line frame P'.

[0140] That is, the digital camera 100 of this embodiment is smaller than the conventional imaging device.

[0141] With the above configuration, in the digital camera 100 of the present invention, the main board 302 and the imaging board 305 are arranged side by side with respect to the cooling unit 303 without overlapping each other in the optical axis O direction (Z direction), making it possible to reduce the size in the Z direction compared to conventional imaging devices.

[0142] The arrangement of the cooling unit 303, the main board 302, and the imaging board 305 is not limited to that shown in FIG. 5(a), and similar size reduction is possible even if the arrangement of these three components is relatively interchanged.

[0143] For example, in FIG. 5C, the main board 302, the imaging board 305, and the cooling unit 303 are arranged in this order in the +X direction so as to fit within the solid-line frame P.

[0144] In addition, in FIG. 5(d), the main board 302 and the imaging board 305 are arranged in this order in the +X direction so as to fit within the solid-line frame P.

[0145] Furthermore, a cooling unit 303 is disposed in the +Z direction with respect to the imaging substrate 305 .

[0146] That is, the main board 302, the imaging board 305, and the cooling unit 303 are arranged within a solid-line frame P in a substantially L-shape.

[0147] In either case of Figures 5(c) or (d), the heat dissipation path from the main board 302 or the imaging board 305 to the cooling unit 303 can be formed similarly by using a heat transfer member such as a heat pipe, thermally conductive rubber, or a graphite sheet.

[0148] Next, a configuration that allows the digital camera 100 to be made smaller while ensuring heat dissipation from the system control unit 109 will be described with reference to FIG.

[0149] FIG. 6(a) is an exploded rear view illustrating the arrangement of the heat pipe 312 relative to the imaging substrate 305, and FIG. 6(b) is a cross-sectional view taken along line AA in FIG. 6(a).

[0150] As shown in FIG. 6(a), in the vicinity of the cutting line of the cross-sectional view AA, the heat pipe 312 is disposed so as to overlap with the imaging substrate 305 in the optical axis O direction (Z direction).

[0151] In order for the heat pipe 312 to efficiently transfer the heat of the system control unit 109 to the cooling unit 303, it is desirable that the heat resistance of the heat pipe 312 be small.

[0152] That is, it is desirable that the heat pipe 312 connects the system control unit 109 and the cooling unit 303 via the shortest distance, that is, the path indicated by the dashed arrow B.

[0153] However, in order to arrange the heat pipe 312 as indicated by the dashed arrow B, it is necessary to arrange the heat pipe 312 away from the electronic element group 601 on the imaging board 305 and the imaging flex 307 in the -Z direction so as not to interfere with them.

[0154] Since the heat pipe 312 is arranged away from the -Z direction, the size of the digital camera 100 increases in the Z direction by the amount corresponding to the distance.

[0155] Therefore, in the digital camera 100 of this embodiment, the heat pipe 312 is provided with two bent portions 312a and 312b.

[0156] As shown in FIG. 6(a), the heat pipe 312 is disposed so as to overlap the imaging substrate 305 in the optical axis O direction (Z direction) in a section L from the bent portion 312a to the bent portion 312b.

[0157] On the other hand, in the sections other than section L, the heat pipe 312 is disposed on approximately the same plane as the imaging substrate 305 .

[0158] Furthermore, as shown in FIG. 6(b), in section L, the heat pipe 312 passes through a portion on the imaging board 305 where neither the electronic element group 601 nor the imaging flex 307 is arranged.

[0159] With the above configuration, the heat pipe 312 connects the system control unit 109 to the cooling unit 303 in the shortest possible direction while minimizing deflection in the -Z direction relative to the imaging unit 103.

[0160] As a result, the digital camera 100 can be made smaller while ensuring heat dissipation from the system control unit 109.

[0161] The features of the invention of this embodiment 1 are listed below.

[0162] The first feature will be described with reference to FIGS. 5a and 7. FIG.

[0163] The imaging device includes an imaging element 306 that captures a subject image, an imaging board 305 on which the imaging element 306 is mounted, a control board 302 on which an electronic element 109 that performs imaging processing for the imaging element 306 is mounted, and a cooling unit 303.

[0164] The cooling unit 303 includes a duct 310 thermally connected to the imaging board 305 and the control board 302, and a fan 131 thermally connected to the duct 310 to generate an airflow for cooling the imaging board 305 and the control board 302.

[0165] When viewed from the optical axis direction of the imaging element 306, the imaging board 305, the control board 302, and the cooling unit 303 are arranged so as not to overlap each other.

[0166] The second feature will be described with reference to FIGS.

[0167] The imaging board 305, the control board 302, and the cooling unit 303 are housed within an exterior cover of the imaging device.

[0168] The imaging board 305, the control board 302, and the cooling unit 303 are characterized by being housed inside the exterior cover of the imaging device without protruding from the outermost shape.

[0169] The third feature will be described with reference to FIGS. 5a and 7. FIG.

[0170] When viewed from the optical axis direction of the imaging element 306, the imaging board 305, the control board 302, and the cooling unit 303 are arranged in this order along the long side of the outermost shape of the exterior cover of the imaging device.

[0171] The fourth feature will be described with reference to FIGS. 5a and 7. FIG.

[0172] When viewed from the optical axis direction of the imaging element 306 , the upper end of the cooling unit 303 is characterized by being disposed above the upper ends of the imaging board 305 and the control board 302 .

[0173] The fifth feature will be explained with reference to FIG. 6a.

[0174] The imaging board 305 and the control board 302 are characterized in that they are thermally connected to the duct 310 by being in contact with thermally conductive members 312 and 314, respectively.

[0175] The sixth feature will be explained with reference to FIG. 6a.

[0176] The thermal conductive member 312 that thermally connects the control board 302 and the cooling unit 303 has a first portion that is arranged overlapping with the imaging board 305 in the optical axis direction of the imaging element 306, and a second portion that is arranged without overlapping with the imaging board 305.

[0177] The electronic element 601 mounted on the imaging board 305 and the flexible board 307 incorporating a signal line electrically connected to the electronic element are characterized in that they are arranged in the second portion and not arranged in the first portion.

[0178] The seventh feature will be described with reference to FIG.

[0179] The fan 131 is thermally connected to signal transmission means 401 , 402 , 403 for transmitting a control signal from the electronic element 109 mounted on the control board 302 .

[0180] When viewed from the optical axis direction of the imaging element 306 , the signal transmission means 401 , 402 , 403 are characterized in that they are arranged so as not to overlap with the imaging substrate 305 .

[0181] The eighth feature will be described with reference to FIG.

[0182] The imaging device includes a first thermally conductive sheet 314 that does not include a signal line and that thermally connects the imaging board 305 and the cooling unit 303 .

[0183] The imaging device also includes a second thermally conductive sheet 701 that does not include a signal line and that thermally connects the imaging board 305 and a metal member 311 that is disposed inside the imaging device and is capable of diffusing heat.

[0184] The second thermally conductive sheet 701 has a lower thermal resistance than the first thermally conductive sheet 314 .

[0185] When viewed from the optical axis direction of the imaging element 306 , the second thermally conductive sheet 701 is characterized in that it is disposed so as not to overlap the control board 302 and the cooling unit 303 .

[0186] The ninth feature will be described with reference to FIG. 4 and FIG. 6a.

[0187] Regarding the optical axis direction Z of the imaging device, the top surface of the flexible substrate 307 is characterized by being farther away from the top surface of the heat conductive member 312 and from the rear surface of the imaging substrate 305.

[0188] The tenth feature will be described with reference to FIGS.

[0189] The first thermally conductive sheet 314 and the second thermally conductive sheet 701 are graphite sheets.

[0190] Example 2 (Heat dissipation structure of imaging board 305) The heat dissipation structure of the imaging substrate 305 will be described with reference to FIG.

[0191] FIG. 7 is an exploded rear view of the digital camera 100. As shown in FIG.

[0192] In Figure 7, compared to the exploded rear view of Figure 4, duct side graphite sheet 314 which does not include signal lines, main side graphite sheet 701 which does not include signal lines, and main chassis 311 are additionally shown as parts related to the heat dissipation structure of imaging board 305.

[0193] The signal lines are wiring that include control signals such as imaging signals.

[0194] As shown in FIG. 7, imaging board 305 is provided with duct-side graphite sheet 314 and main-side graphite sheet 701 as two heat dissipation paths.

[0195] Duct side graphite sheet 314 does not include a signal line and thermally connects imaging board 305 and duct 310 , and heat from imaging element 306 is transmitted to duct 310 via imaging board 305 and duct side graphite sheet 314 .

[0196] Furthermore, the fan 131 rotates to generate an airflow within the duct 310 and exhaust the air, thereby discharging the heat transferred to the duct 310 to the outside of the digital camera 100 .

[0197] Due to the heat dissipation path provided by this duct side graphite sheet 314, heat from the imaging element 306 is forcibly air-cooled by the cooling unit 303, and the temperature rise of the imaging element 306 can be suppressed.

[0198] (Heat source of the main board 302 and the imaging board 305) Here, the heat sources of the main board 302 and the imaging board 305 will be described with reference to FIGS.

[0199] FIG. 8 is an external rear view of main board 302.

[0200] FIG. 9 is a front view of the appearance of the imaging board 305. As shown in FIG.

[0201] As shown in FIG. 8, on the main board 302, the system control unit 109 which is a heat source, the system memory 119, a DC-DC converter 801, and a drive control IC 802 are arranged.

[0202] The system control unit 109 is a control IC that controls the entire digital camera 100 described above.

[0203] The system memory 119 is the volatile recording element described above, and two of them are mounted on the main board 302 .

[0204] The DC-DC converter 801 is a voltage conversion element that converts the voltage from the power supply unit 126 and supplies power to the system control unit 109 and each electric element mounted on the main board 302 .

[0205] Two DC-DC converters 801 are mounted on the main board 302 .

[0206] The drive control IC 802 is a control IC that controls the driving of the fan 131 and the lens unit 215 .

[0207] A total of six heat sources as described above are mounted on the main board 302.

[0208] Next, as shown in FIG. 9, an imaging element 306 is mounted on the surface of the imaging board 305 on the front side of the digital camera 100 .

[0209] The image sensor 306 is the image capturing means of the digital camera 100 of this embodiment described above.

[0210] The only heat source on the imaging substrate 305 is the imaging element 306 .

[0211] As described above, the number of heat sources arranged on the main substrate 302 is greater than the number of heat sources arranged on the imaging element 306 .

[0212] Therefore, the main board 302 consumes more power in total and generates more heat than the imaging board 305 .

[0213] As a result, the amount of heat transferred to the cooling unit 303 is also greater in the main board 302 .

[0214] Therefore, the proportion of the heat capacity of the duct 310 accounted for by the main board 302 is greater, and the amount of heat transferred from the imaging element 305 to the duct 310 is inevitably smaller.

[0215] As described above, when the fan 131 is rotating, the heat of the system control unit 109 and the image sensor 306 that is transferred to the duct 310 is discharged to the outside of the digital camera 100 by forced air cooling.

[0216] Therefore, the heat capacity of the duct 310 is not limited, and the temperature rise of the system control unit 109 and the image pickup element 306 can be suppressed at all times.

[0217] However, when the fan 131 is off, there is no forced air cooling by the cooling unit 303 and the duct 310 acts as a heat sink.

[0218] As a result, the image pickup element 306 is unable to obtain a heat dissipation effect greater than the heat capacity of the duct 310, and there is a problem in that the temperature rises.

[0219] One possible solution to this problem would be to increase the heat capacity of duct 310. However, in that case, duct 310 would need to be large, which could lead to an increase in the size of digital camera 100.

[0220] Therefore, digital camera 100 of the present invention includes main board graphite sheet 701 as a heat dissipation path that does not depend on cooling unit 303 for imaging board 305 .

[0221] Main-side graphite sheet 701 thermally connects imaging board 305 and main chassis 311 , and heat from imaging element 306 is transmitted to main chassis 311 via imaging board 305 and main-side graphite sheet 701 .

[0222] Due to the heat dissipation path provided by main-side graphite sheet 701, heat from imaging element 306 is naturally dissipated to main chassis 311 via imaging board 305 and main-side graphite sheet 701, thereby preventing the temperature of imaging element 306 from increasing.

[0223] The amount of heat dissipated from the imaging element 306 to the main chassis 311 via this heat dissipation path does not depend on the thermal capacity of the duct 310 .

[0224] With the above configuration, even when the fan is stopped, heat from the imaging element 306 is naturally dissipated via the main substrate graphite sheet 701, so that a rise in temperature can be suppressed.

[0225] Next, a configuration for effectively suppressing a rise in temperature of the image sensor 306 will be described.

[0226] First, duct side graphite sheet 314 is configured to have a higher thermal resistance than main side graphite sheet 701 .

[0227] In order to prevent heat transferred from main substrate 302 from flowing into imaging substrate 305 via duct 310, it is desirable for duct side graphite sheet 314 to have a high thermal resistance.

[0228] On the other hand, it is desirable that the thermal resistance of main-side graphite sheet 701 is low in order to facilitate heat transfer from imaging board 305 to main chassis 311 .

[0229] Therefore, in digital camera 100 of this embodiment, duct-side graphite sheet 314 is configured to have a higher thermal resistance than main-side graphite sheet 701 .

[0230] This makes it possible to effectively prevent the temperature of the image sensor 306 from increasing.

[0231] The means for increasing the thermal resistance include selecting a material with low thermal conductivity, reducing the cross-sectional area of ​​the heat dissipation path, and increasing the length of the heat dissipation path.

[0232] Further, the connection point between main-side graphite sheet 701 and main chassis 311 is set in area Q, which is a portion of main chassis 701 that does not face main board 302 or duct 310 .

[0233] The portion of the main chassis 701 facing the main board 302 is taken as region R, and the portion of the main chassis 701 facing the duct 310 is taken as region S.

[0234] The temperatures of the regions R and S become high because they are thermally connected to the main board 302, which is the heat source, or to the duct 310, which is the destination of heat transfer from the main board 302, by fastening with screws.

[0235] On the other hand, compared to regions R and S, region Q has a relatively low temperature since there is no heat source in the vicinity thereof.

[0236] Therefore, by thermally connecting main-side graphite sheet 701 to region Q, heat from imaging element 306 is more easily transferred to main chassis 701 .

[0237] Furthermore, as shown in FIG. 7, a connection portion 311a between the region Q and the region R, and a connection portion 311b between the region Q and the region S are formed so as to have a smaller cross-sectional area than other portions of the main chassis 701.

[0238] By reducing the cross-sectional area, main chassis 701 has locally increased thermal resistance at connection portion 311a and connection portion 311b.

[0239] Therefore, the heat transfer from the region R and the region S to the region Q can be suppressed, and the temperature rise in the region Q can be suppressed.

[0240] As a result, heat from the imaging element 306 is more easily transferred to the main chassis 701 via the main-side graphite sheet 701 .

[0241] With the above configuration, the temperature rise of the image sensor 306 can be effectively suppressed.

[0242] The above-described embodiments are merely examples for explaining the technology of the present disclosure, and the technology of the present disclosure can be modified or combined as appropriate without departing from the spirit of the invention.

[0243] Specifically, the present invention is not limited to digital cameras, but can be widely applied to electronic devices and imaging devices with a video shooting function, such as video cameras and network cameras.

[0244] The eleventh feature will be described with reference to FIG.

[0245] The imaging device includes an imaging element 306 that captures a subject image, an imaging board 305 on which the imaging element 306 is mounted, a control board 302 on which an electronic element 109 that performs imaging processing for the imaging element 306 is mounted, and a cooling unit 303.

[0246] The cooling unit 303 includes a duct 310 thermally connected to the imaging board 305 and the control board 302, and a fan 131 thermally connected to the duct 310 to generate an airflow for cooling the imaging board 305 and the control board 302.

[0247] The imaging device includes a first thermally conductive sheet 314 that does not include a signal line and that thermally connects the imaging board 305 and the cooling unit 303 .

[0248] The imaging device includes a second thermally conductive sheet 701 that does not include a signal line and that thermally connects the imaging board 305 and a metal member 311 that is disposed inside the imaging device and is capable of diffusing heat.

[0249] The second thermally conductive sheet 701 has a lower thermal resistance than the first thermally conductive sheet 314 .

[0250] When viewed from the optical axis direction of the imaging element 306 , the second thermally conductive sheet 701 is characterized in that it is disposed so as not to overlap the control board 302 and the cooling unit 303 .

[0251] The twelfth feature will be described with reference to FIG.

[0252] The imaging board 305 and the control board 302 are each thermally connected to the duct 310 .

[0253] The control board 302 is characterized by generating more heat than the imaging board 305 .

[0254] The thirteenth feature will be described with reference to Figs.

[0255] The metal member 311 has a first region S that is thermally connected to the duct 310 and a second region R that is thermally connected to the control board 302 .

[0256] The second thermally conductive sheet 701 is thermally connected to the metal member 311 in a third region Q different from the first region S and the second region R.

[0257] The third region Q is thermally connected to the first region S at the first connection portion 311b, and the third region Q is thermally connected to the second region R at the second connection portion 311a.

[0258] The first connection portion 311b has a smaller cross-sectional area than the first region S.

[0259] The second connection portion 311a is characterized in that it has a smaller cross-sectional area than the second region R.

[0260] The fourteenth feature will be described with reference to FIGS.

[0261] The first thermally conductive sheet 314 and the second thermally conductive sheet 701 are graphite sheets.

[0262] The above-described embodiments are merely examples for explaining the technology of the present disclosure, and the technology of the present disclosure can be modified or combined as appropriate without departing from the spirit of the invention.

[0263] Further, preferred embodiments are shown below.

[0264] (Configuration 1) an image sensor 306 for capturing an image of a subject; an imaging substrate 305 on which the imaging element 306 is mounted; A control board 302 on which an electronic device 109 for performing image processing of the image sensor 306 is mounted; An imaging device having a cooling unit 303, The cooling unit 303 includes a duct 310 thermally connected to the imaging board 305 and the control board 302, and a fan 131 thermally connected to the duct 310 to generate an air flow for cooling the imaging board 305 and the control board 302, An imaging device characterized in that, when viewed from the optical axis direction of the imaging element 306, the imaging board 305, the control board 302, and the cooling unit 303 are arranged without overlapping with each other (Figures 4, 5a, and 7).

[0265] (Configuration 2) The imaging board 305, the control board 302, and the cooling unit 303 are housed in an exterior cover of the imaging device, The imaging device according to configuration 1 (FIG. 5a), characterized in that the imaging board 305, the control board 302, and the cooling unit 303 are housed inside without protruding from the outermost shape of the exterior cover of the imaging device.

[0266] (Configuration 3) The imaging device described in configuration 1 or 2, characterized in that, when viewed from the optical axis direction of the imaging element 306, the imaging board 305, the control board 302, and the cooling unit 303 are arranged in that order in the direction of the outermost long side of the exterior cover of the imaging device.

[0267] (Configuration 4) The imaging device described in any one of configurations 1 or 3, characterized in that, when viewed from the optical axis direction of the imaging element 306, the upper end of the cooling unit 303 is located above the upper ends of the imaging board 305 and the control board 302.

[0268] (Configuration 5) An imaging device described in any one of configurations 1 or 4, characterized in that the imaging board 305 and the control board 302 are thermally connected to the duct 310 by contacting thermally conductive members 312, 314, respectively (Figure 6a).

[0269] (Configuration 6) When viewed from the optical axis direction of the imaging element 306, the thermal conductive member 312 that thermally connects the control board 302 and the cooling unit 303 has a first portion that is arranged so as to overlap with the imaging board 305 in the optical axis direction of the imaging element 306, and a second portion that is arranged so as not to overlap with the imaging board 305, An imaging device described in any one of configurations 1 or 5, characterized in that an electronic element 601 mounted on the imaging board 305 and a flexible board 307 incorporating a signal line electrically connected to the electronic element are arranged in the second portion and not arranged in the first portion.

[0270] (Configuration 7) The fan 131 is thermally connected to signal transmission means 401, 402, 403 for transmitting a control signal from an electronic element 109 mounted on the control board 302, An imaging device described in any one of configurations 1 or 6 (Figure 4), characterized in that when viewed from the optical axis direction of the imaging element 306, the signal transmission means 401, 402, 403 are arranged without overlapping with the imaging board 305.

[0271] (Configuration 8) the imaging device includes a first thermally conductive sheet 314 that does not include a signal line and that thermally connects the imaging board 305 and the cooling unit 303, and a second thermally conductive sheet 701 that does not include a signal line and that thermally connects the imaging board 305 and a thermally diffusible metal member 311 that is disposed inside the imaging device, The second thermally conductive sheet 701 has a smaller thermal resistance than the first thermally conductive sheet 314, An imaging device described in any one of configurations 1 or 7 (Figure 7), characterized in that when viewed from the optical axis direction of the imaging element 306, the second thermal conductive sheet 701 is arranged without overlapping the control board 302 and the cooling unit 303.

[0272] (Configuration 9) Regarding the optical axis direction Z of the imaging device, the imaging device according to any one of configurations 1 or 8, characterized in that the top surface of the flexible substrate 307 is farther away from the back surface of the imaging substrate 305 than the top surface of the thermally conductive member 312 (FIGS. 4 and 6a).

[0273] (Configuration 10) The imaging device according to any one of configurations 1 and 9 (FIGS. 7 and 8), wherein the first thermally conductive sheet 314 and the second thermally conductive sheet 701 are graphite sheets.

[0274] (Configuration 11) an image sensor 306 for capturing an image of a subject; an imaging substrate 305 on which the imaging element 306 is mounted; A control board 302 on which an electronic device 109 for performing image processing of the image sensor 306 is mounted; An imaging device having a cooling unit 303, The cooling unit 303 includes a duct 310 thermally connected to the imaging board 305 and the control board 302, and a fan 131 thermally connected to the duct 310 to generate an air flow for cooling the imaging board 305 and the control board 302, the imaging device includes a first thermally conductive sheet 314 that does not include a signal line and that thermally connects the imaging board 305 and the cooling unit 303, and a second thermally conductive sheet 701 that does not include a signal line and that thermally connects the imaging board 305 and a thermally diffusible metal member 311 that is disposed inside the imaging device, The second thermally conductive sheet 701 has a smaller thermal resistance than the first thermally conductive sheet 314, An imaging device (FIG. 7) characterized in that, when viewed from the optical axis direction of the imaging element 306, the second thermally conductive sheet 701 is arranged so as not to overlap the control board 302 and the cooling unit 303.

[0275] (Configuration 12) The imaging board 305 and the control board 302 are thermally connected to the duct 310, 12. The imaging device according to configuration 11, wherein the control board 302 generates more heat than the imaging board 305.

[0276] (Configuration 13) The metal member 311 has a first region S thermally connected to the duct 310 and a second region R thermally connected to the control board 302, the second thermally conductive sheet 701 is thermally connected to the metal member 311 in a third region Q different from the first region S and the second region R; The third region Q is thermally connected to the first region S at a first connection portion 311b, and the third region Q is thermally connected to the second region R at a second connection portion 311a, The first connection portion 311b has a cross-sectional area smaller than that of the first region S, The imaging device according to configuration 11 or 12, wherein the second connection portion 311a has a smaller cross-sectional area than the second region R (FIGS. 7 and 8).

[0277] (Configuration 14) 14. The imaging device according to any one of configurations 11 to 13, wherein the first thermally conductive sheet 314 and the second thermally conductive sheet 701 are graphite sheets. [Explanation of symbols]

[0278] 109 Electronic Elements 131 Fans 302 Control Board 303 Cooling Unit 305 Imaging Board 306 Image sensor 310 Duct

Claims

1. an imaging element for capturing an image of a subject; an imaging substrate on which the imaging element is mounted; a control board on which an electronic element for performing image processing of the imaging element is mounted; An imaging device having a cooling unit, the cooling unit includes a duct thermally connected to the imaging board and the control board, and a fan thermally connected to the duct to generate an airflow for cooling the imaging board and the control board; An imaging device, characterized in that, when viewed from the optical axis direction of the imaging element, the imaging board, the control board, and the cooling unit are arranged so as not to overlap one another.

2. the imaging board, the control board, and the cooling unit are housed in an exterior cover of the imaging device; 2. The image pickup device according to claim 1, wherein the image pickup board, the control board, and the cooling unit are housed inside an exterior cover of the image pickup device without protruding from the outermost surface of the exterior cover.

3. 3. The imaging device according to claim 2, wherein, when viewed from the optical axis direction of the imaging element, the imaging board, the control board, and the cooling unit are arranged in order in the direction of the long side of the outermost shape of an exterior cover of the imaging device.

4. 3. The imaging device according to claim 2, wherein, when viewed from the optical axis direction of the imaging element, an upper end of the cooling unit is disposed above upper ends of the imaging board and the control board.

5. 2. The imaging device according to claim 1, wherein the imaging board and the control board are thermally connected to the duct by being in contact with a thermally conductive member.

6. when viewed from the optical axis direction of the imaging element, the thermal conductive member that thermally connects the control board and the cooling unit has a first portion that is arranged to overlap with the imaging board in the optical axis direction of the imaging element, and a second portion that is arranged without overlapping with the imaging board, The imaging device according to claim 5, characterized in that an electronic element mounted on the imaging board and a flexible board incorporating a signal line electrically connected to the electronic element are arranged in the second portion and not arranged in the first portion.

7. the fan is thermally connected to a signal transmission means for transmitting a control signal from an electronic element mounted on the control board; 7. The imaging device according to claim 6, wherein the signal transmission means is disposed so as not to overlap the imaging board when viewed from the optical axis direction of the imaging element.

8. the imaging device includes a first thermally conductive sheet that does not include a signal line and that thermally connects the imaging board and the cooling unit, and a second thermally conductive sheet that does not include a signal line and that thermally connects a metal member capable of diffusing heat that is disposed inside the imaging board and the imaging device, the second thermally conductive sheet has a lower thermal resistance than the first thermally conductive sheet; 7. The imaging device according to claim 6, wherein the second thermally conductive sheet is disposed so as not to overlap the control board and the cooling unit when viewed from the optical axis direction of the imaging element.

9. Regarding the optical axis direction of the imaging device.

7. The imaging device according to claim 6, wherein the uppermost surface of the flexible substrate is farther away from the rear surface of the imaging substrate than the uppermost surface of the thermally conductive member.

10. The imaging device according to claim 8 , wherein the first thermally conductive sheet and the second thermally conductive sheet are graphite sheets.

11. an imaging element for capturing an image of a subject; an imaging substrate on which the imaging element is mounted; a control board on which an electronic element for performing image processing of the imaging element is mounted; An imaging device having a cooling unit, the cooling unit includes a duct thermally connected to the imaging board and the control board, and a fan thermally connected to the duct to generate an airflow for cooling the imaging board and the control board; the imaging device includes a first thermally conductive sheet that does not include a signal line and that thermally connects the imaging board and the cooling unit, and a second thermally conductive sheet that does not include a signal line and that thermally connects a metal member capable of diffusing heat that is disposed inside the imaging board and the imaging device, the second thermally conductive sheet has a lower thermal resistance than the first thermally conductive sheet; An imaging device, characterized in that, when viewed from the optical axis direction of the imaging element, the second thermally conductive sheet is positioned so as not to overlap the control board and the cooling unit.

12. the imaging board and the control board are each thermally connected to the duct; The imaging device according to claim 11 , wherein the control board generates a larger amount of heat than the imaging board.

13. the metal member has a first region thermally connected to the duct and a second region thermally connected to the control board, the second thermally conductive sheet is thermally connected to the metal member in a third region different from the first region and the second region; the third region is thermally connected to the first region at a first connection portion, and the third region is thermally connected to the second region at a second connection portion; The first connection portion has a smaller cross-sectional area than the first region, The imaging device according to claim 11 , wherein the second connection portion has a smaller cross-sectional area than the second region.

14. The imaging device according to claim 11 , wherein the first thermally conductive sheet and the second thermally conductive sheet are graphite sheets.

Images