Information processing device, information processing system, and information processing method

Abstract

To provide an information processing device and the like that can determine whether the occurrence of an error has been suppressed by changing mounting conditions.SOLUTION: An information processing device includes a control unit that causes a component mounting device to randomly execute mounting under a first mounting condition and mounting under a second mounting condition that are different from each other for at least a predetermined set number of times, and a calculation unit that calculates statistics regarding the first mounting condition and the second mounting condition on the basis of the number of first errors that have occurred due to the first mounting condition and the number of second errors that have occurred due to the second mounting condition.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to an information processing device, an information processing system, and an information processing method. [Background technology]

[0002] Conventionally, there is known an information processing device that performs information processing for producing component mounting boards using a component mounting device. Patent Document 1 discloses a device that, when an error occurs in the component mounting device, determines the cause of the error by performing a statistical analysis. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2018 / 142604 Summary of the Invention [Problem to be solved by the invention]

[0004] For example, if an error occurs in a component mounting device, the occurrence of the error may be suppressed by changing the mounting conditions. However, in actual production, conditions other than the changed mounting conditions change from moment to moment, making it difficult to determine whether the occurrence of the error has been suppressed by changing the mounting conditions as described above.

[0005] The present disclosure provides an information processing device and the like that can determine whether the occurrence of an error has been suppressed by changing a mounting condition. [Means for solving the problem]

[0006] An information processing device according to one embodiment of the present disclosure includes a control unit that causes a component mounting device to randomly execute mounting under a first mounting condition and mounting under a second mounting condition that are different from each other for at least a predetermined set number of times, and a calculation unit that calculates statistics regarding the first mounting condition and the second mounting condition based on a first number of errors occurring due to mounting under the first mounting condition and a second number of errors occurring due to mounting under the second mounting condition.

[0007] An information processing system according to one embodiment of the present disclosure includes a control unit that causes a component mounting device to randomly execute mounting under a first mounting condition and mounting under a second mounting condition that are different from each other for at least a predetermined set number of times, a calculation unit that calculates statistics regarding the first mounting condition and the second mounting condition based on a first number of errors caused by the first mounting condition and a second number of errors caused by the second mounting condition, and a display unit that displays information based on the statistics.

[0008] An information processing method according to one embodiment of the present disclosure randomly performs mounting under a first mounting condition and mounting under a second mounting condition that are different from each other for at least a predetermined set number of times using a component mounting device, and calculates statistics regarding the first mounting condition and the second mounting condition based on a first number of errors that occur due to the first mounting condition and a second number of errors that occur due to the second mounting condition.

[0009] These comprehensive or specific aspects may be realized by a system, a method, an integrated circuit, a computer program, or a computer-readable recording medium such as a CD-ROM, or may be realized by any combination of the system, the method, the integrated circuit, the computer program, and the recording medium. The recording medium may be a non-transitory recording medium. Effect of the Invention

[0010] According to the information processing device and the like disclosed herein, it is possible to determine whether the occurrence of an error has been suppressed by changing the mounting conditions.

[0011] Further advantages and effects of one aspect of the present disclosure will become apparent from the specification and drawings. Such advantages and / or effects are provided by some of the embodiments and features described in the specification and drawings, respectively, but not necessarily all of them are provided to obtain one or more identical features. [Brief description of the drawings]

[0012] [Figure 1] 1 is a schematic diagram of an information processing system according to a first embodiment. [Diagram 2] 2 is a block diagram showing a configuration of a management device and a production line included in the information processing system. FIG. [Diagram 3] FIG. 2 is a plan view of a component mounting device included in the production line. [Figure 4] FIG. 2 is a diagram showing a feeder and a mounting head which are an example of a unit used in a component mounting apparatus. [Diagram 5] 4A to 4C are diagrams illustrating an example of mounting under first mounting conditions and mounting under second mounting conditions that are executed by the component mounting apparatus. [Figure 6] FIG. 13 is a diagram illustrating an example of a past error rate and a recommended sample number. [Figure 7] 11 is a diagram showing an example of information regarding the number of mounting times, mounting conditions, and whether or not an error has occurred; FIG. [Figure 8] FIG. 4 is a diagram illustrating an example of information displayed on a display unit. [Figure 9] FIG. 11 is a diagram showing another example of information displayed on the display unit. [Figure 10] 4 is a flowchart showing the operation of the management device according to the first embodiment. [Figure 11] FIG. 13 is a block diagram showing a configuration of an information processing system according to a modified example of the first embodiment. [Figure 12] 13 is a flowchart showing the operation of a management device according to a modification of the first embodiment. [Figure 13]FIG. 11 is a block diagram showing a configuration of an information processing system according to a second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] For example, if an error occurs in a component mounting device, the occurrence of the error may be suppressed by changing the mounting conditions. However, in actual production, conditions other than the changed mounting conditions change from moment to moment, making it difficult to determine whether the occurrence of the error has been suppressed by changing the mounting conditions.

[0014] For example, if it is determined that component recognition errors will be reduced by changing the lamp value of the imaging lighting when recognizing components for mounting with a camera, the changed lamp value will be used for subsequent production. However, when it is determined that recognition errors will be reduced, if production is carried out by supplying components of the same specifications but from a different manufacturer, subsequent production will be carried out without knowing whether the recognition errors were reduced by changing the lamp value or by using components from a different manufacturer. For example, if recognition errors were reduced by using components from a different manufacturer, there is a possibility that recognition errors will occur again when the components supplied are changed back to the original components.

[0015] The information processing device and the like disclosed herein has the configuration shown in the following example in order to determine whether the occurrence of an error has been suppressed by changing the mounting conditions.

[0016] The information processing device of Example 1 includes a control unit that causes a component mounting device to randomly execute mounting under a first mounting condition and mounting under a second mounting condition that are different from each other for at least a predetermined set number of times, and a calculation unit that calculates statistics regarding the first mounting condition and the second mounting condition based on a first number of errors that have occurred due to the first mounting condition and a second number of errors that have occurred due to the second mounting condition.

[0017] In this way, by randomly executing mounting under the first mounting condition and mounting under the second mounting condition by the component mounting device, even if conditions other than the changed mounting condition fluctuate, the effects of the fluctuations can be averaged and data can be acquired. This makes it possible to determine whether the occurrence of errors has been suppressed by changing the mounting conditions.

[0018] The information processing device shown here corresponds to the management device described in the first embodiment or the component mounting device described in the second embodiment.

[0019] The information processing device of Example 2 is the information processing device described in Example 1, wherein the first mounting condition is a mounting condition that has been previously executed by the component mounting device, and the second mounting condition is a mounting condition that will be tried by the component mounting device in the future.

[0020] According to this, the component mounting device can be made to randomly execute mounting under the first mounting conditions that have been executed in the past and mounting under the second mounting conditions to be tried in the future. Therefore, even if conditions other than the mounting conditions to be tried in the future fluctuate, the effects of the fluctuations can be averaged to obtain data. This makes it possible to determine whether the occurrence of errors has been suppressed by changing the mounting conditions.

[0021] An information processing device of Example 3 is the information processing device according to Example 1 or 2, in which the calculation unit may calculate, as the statistic, a test statistic of the second mounting condition with respect to the first mounting condition.

[0022] In this way, by calculating the test statistic of the second mounting condition with respect to the first mounting condition, it is possible to determine whether there is a significant difference between the second mounting condition and the first mounting condition, thereby increasing the accuracy of determining whether the occurrence of errors has been suppressed by changing the mounting conditions.

[0023] An information processing device of Example 4 is the information processing device according to Example 3, wherein the control unit outputs a signal for causing a display unit to display information based on the test statistic.

[0024] This makes it possible to notify information based on the test statistics to the outside.

[0025] An information processing device of Example 5 is the information processing device according to Example 4, wherein the control unit may cause the display unit to display a probability based on the test statistic as the information based on the test statistic.

[0026] This makes it possible to notify the probability based on the test statistic to the outside.

[0027] An information processing device of Example 6 is the information processing device described in Example 4, and the control unit may cause the display unit to display, as the information based on the test statistic, information indicating whether or not a probability based on the test statistic falls below a predetermined significance level.

[0028] This makes it possible to externally notify information indicating whether or not the probability based on the test statistic falls below a predetermined significance level.

[0029] An information processing device of Example 7 is the information processing device described in Example 4, wherein, when a probability based on the test statistic falls below a predetermined significance level, the control unit may cause the display unit to display information based on the test statistic indicating that the mounting conditions will be changed from the first mounting conditions to the second mounting conditions.

[0030] According to this, it is possible to externally notify information indicating that the mounting condition is to be changed from the first mounting condition to the second mounting condition.

[0031] An information processing device of Example 8 is the information processing device according to any one of Examples 1 to 7, and the set number of times may be determined based on a past error rate in the component mounting device.

[0032] According to this, the component mounting device can randomly execute mounting under the first mounting condition and mounting under the second mounting condition based on a set number of times determined based on the past error rate. Therefore, even if conditions other than the changed mounting condition fluctuate, the effects of the fluctuations can be averaged to obtain data. This makes it possible to determine whether the occurrence of errors has been suppressed by changing the mounting condition.

[0033] An information processing device of Example 9 is the information processing device according to Example 4, wherein the control unit may cause the display unit to display the set number of times.

[0034] This makes it possible to notify the outside of the number of mounting operations performed by the component mounting device.

[0035] An information processing device of Example 10 is the information processing device described in Example 8, and the past error rate may be a component pickup error rate by a suction nozzle of the component mounting device, a recognition error rate of the component by a camera of the component mounting device, or a mounting error rate of the component in a production line including the component mounting device.

[0036] According to this, the component mounting device can randomly execute mounting under the first mounting condition and mounting under the second mounting condition based on the set number of times determined based on the pickup error rate, the recognition error rate, and the mounting error rate. Therefore, even if conditions other than the changed mounting condition fluctuate, the influence of the fluctuation can be averaged to obtain data. This makes it possible to determine whether the occurrence of errors has been suppressed by changing the mounting condition.

[0037] An information processing device of Example 11 is the information processing device according to any one of Examples 1 to 10, and further includes an information acquisition unit that acquires a production plan for the component mounting device, and the control unit determines whether or not the component mounting device is capable of performing the predetermined set number of mountings based on the production plan, and (1) if it is determined that the component mounting device is capable of performing the mounting under the first mounting condition and the mounting under the second mounting condition, and (2) if it is determined that the component mounting device is not capable of performing the mounting, it may output information indicating that the set number of mountings cannot be performed.

[0038] This makes it possible to carry out a randomized controlled trial based on the production plan acquired by the information acquisition unit.

[0039] The information processing device of Example 12 is the information processing device according to any one of Examples 1 to 11, and further includes an information acquisition unit that acquires a production plan for the component mounting device, and the control unit may derive a scheduled end time for mounting to end based on the production plan and the set number of times, and output a signal to display the scheduled end time on a display unit.

[0040] This makes it possible to notify the planned end time of the randomized controlled trial to the outside.

[0041] The information processing system of Example 13 includes a control unit that causes a component mounting device to randomly execute mounting under a first mounting condition and mounting under a second mounting condition that are different from each other for at least a predetermined set number of times, a calculation unit that calculates statistics regarding the first mounting condition and the second mounting condition based on a first number of errors that have occurred due to the first mounting condition and a second number of errors that have occurred due to the second mounting condition, and a display unit that displays information based on the statistics.

[0042] In this way, by randomly executing mounting under the first mounting condition and mounting under the second mounting condition by the component mounting device, even if conditions other than the changed mounting condition fluctuate, the effects of the fluctuations can be averaged and data can be acquired. This makes it possible to determine whether the occurrence of errors has been suppressed by changing the mounting conditions.

[0043] The information processing system includes the management device and the component mounting device described in the first and second embodiments.

[0044] An information processing method of Example 14 randomly performs mounting under a first mounting condition and mounting under a second mounting condition, which are different from each other, by a component mounting device for at least a predetermined set number of times, and calculates statistics regarding the first mounting condition and the second mounting condition based on a first number of errors occurring due to the first mounting condition and a second number of errors occurring due to the second mounting condition.

[0045] In this way, by randomly executing mounting under the first mounting condition and mounting under the second mounting condition by the component mounting device, even if conditions other than the changed mounting condition fluctuate, the effects of the fluctuations can be averaged and data can be acquired. This makes it possible to determine whether the occurrence of errors has been suppressed by changing the mounting conditions.

[0046] Hereinafter, the embodiment will be specifically described with reference to the drawings.

[0047] The embodiments described below are all comprehensive or specific examples. The numerical values, shapes, materials, components, the arrangement and connection of the components, steps, and the order of steps shown in the following embodiments are merely examples and are not intended to limit the present disclosure. Furthermore, among the components in the following embodiments, components that are not described in the independent claims showing the highest concept are described as optional components.

[0048] In addition, each drawing is a schematic diagram and is not necessarily a precise illustration. In addition, in each drawing, the same components are denoted by the same reference numerals.

[0049] (Embodiment 1) [Outline of information processing system configuration] The schematic configuration of an information processing system according to the first embodiment will be described with reference to FIGS. 1 and 2. FIG.

[0050] Fig. 1 is a schematic diagram of an information processing system 1 according to embodiment 1. Fig. 2 is a block diagram showing configurations of a management device 50 and a production line 10 included in the information processing system 1. Note that the management device 50 is an example of an information processing device in the present disclosure.

[0051] 1 and 2, the information processing system 1 includes a production line 10 and a management device 50. The production line 10 and the management device 50 are connected via a communication network. The communication network may be realized by a wide area communication network such as the Internet, or may be realized by a short-distance wireless network such as a wireless LAN (Local Area Network).

[0052] The management device 50 is a device that manages production in the production line 10. The management device 50 performs various information processing based on a production plan acquired in advance. The production plan includes information on production quantity, production time, and mounting conditions. The management device 50 is provided, for example, in a factory (an example of a facility) where the production line 10 is installed. The management device 50 may be provided in a remote location different from the factory.

[0053] The production line 10 is an apparatus for producing component-mounted boards. The production line 10 includes a printing apparatus, a component mounting apparatus 20, a reflow apparatus, an inspection apparatus, and the like. The production line 10 produces component-mounted boards by performing processes such as solder printing, component mounting, reflow, and inspection on boards carried in from the upstream side, and carries out the produced component-mounted boards downstream. In the following, of the various apparatuses included in the production line 10, the component mounting apparatus 20 will be described as an example.

[0054] [Configuration of component mounting equipment included in production line] The configuration of the component mounting apparatus 20 included in the production line 10 will be described with reference to FIGS.

[0055] Fig. 3 is a plan view of the component mounting apparatus 20 included in the production line 10. Fig. 4 is a diagram showing a feeder 31 and a mounting head 36 which are an example of a unit 30 used in the component mounting apparatus 20. Fig. 4 shows a schematic diagram of a part of the component mounting apparatus 20 seen from the side.

[0056] The component mounting apparatus 20 is an apparatus that mounts components onto the substrate 5. The components mounted on the substrate 5 are, for example, surface-mount electronic components.

[0057] The unit 30 is one of a plurality of constituent blocks that make up the component mounting apparatus 20, and is detachable from the main body of the component mounting apparatus 20. A plurality of units 30 selected according to the type, size, material, etc. of electronic components are assembled to the component mounting apparatus 20. The units 30 used in the component mounting apparatus 20 are, for example, a feeder 31 and a mounting head 36.

[0058] The component mounting apparatus 20 includes a transport unit 24, a drive unit 41, a plurality of feeders 31, and a plurality of mounting heads 36. The component mounting apparatus 20 also includes a detection unit 43, a counting unit 42, a control unit 45, a storage unit 46, an input unit 47, and a display unit 48.

[0059] The input unit 47 is a user interface such as a touch panel, and is used to input operation commands and various data.

[0060] The display unit 48 is a display such as a liquid crystal panel, etc. The display unit 48 displays various information output from the management device 50.

[0061] The storage unit 46 stores an operation program for mounting components on the board 5. The operation program is a program created in accordance with the component-mounted boards to be produced, and is transmitted from the management device 50 to the component mounting device 20.

[0062] The control unit 45 operates the component mounting apparatus 20 based on the operation program transmitted from the management apparatus 50. The control unit 45 randomly executes mounting under a plurality of mounting conditions. The configuration of the control unit 45 will be described later.

[0063] The transport unit 24 is provided on the base 22, and transports the substrate 5 in the X-axis direction while positioning the substrate 5 in the Y-axis direction.

[0064] The multiple feeders 31 are provided on both sides of the base 22. Each of the multiple feeders 31 supplies components to be mounted on the board 5. For example, if the feeder 31 is a tape feeder, the feeder 31 supplies the components by transporting (pitch feeding) the multiple components stored on a component supply tape (carrier tape) 32 together with the component supply tape 32. If the feeder 31 is a bulk feeder, the feeder 31 supplies the components by aligning and transporting the multiple components stored in a case.

[0065] The driving unit 41 has a pair of Y-axis linear motion robots 26 and a pair of X-axis linear motion robots 28. The pair of Y-axis linear motion robots 26 are attached to the base 22, and the pair of X-axis linear motion robots 28 are attached corresponding to the pair of Y-axis linear motion robots 26. The driving unit 41 drives the Y-axis linear motion robot 26 and the X-axis linear motion robot 28 to move the mounting head 36 attached to the X-axis linear motion robot 28 to a predetermined position.

[0066] Each of the multiple mounting heads 36 is equipped with multiple suction nozzles 37. The suction nozzles 37 are capable of moving in the vertical and rotational directions. The mounting heads 36 hold components by the suction force of the suction nozzles 37. The mounting heads 36 pick up components supplied from the feeders 31 with the suction nozzles 37, and mount the picked-up components on the board 5.

[0067] The detection unit 43 is a sensor for detecting the presence or absence of an error in the component mounting apparatus 20. The detection unit 43 is provided in the main body of the component mounting apparatus 20 or in the unit 30 itself. The detection unit 43 includes, for example, a camera, an imaging light, a vacuum pressure gauge, and a load cell.

[0068] For example, the detection unit 43 captures an image of the component using a camera 44 and an imaging illumination fixed to the base 22. Specifically, the detection unit 43 captures an image of the suction nozzle 37 and the component picked up by the suction nozzle 37 from below while the suction nozzle 37 is moving, thereby detecting the holding position and attitude of the component with respect to the suction nozzle 37.

[0069] The detection unit 43 also uses a camera 44a attached to the mounting head 36 to capture an image of the board 5 from above, and detects the mounting position of the component on the board 5. The detection unit 43 also uses the camera 44a to detect the feeding accuracy of the feeder 31, i.e., the accuracy of component positioning by the feeder 31. The detection unit 43 also uses a vacuum pressure gauge to detect the suction force of the mounting head 36. The detection unit 43 also uses a load cell to detect the drive load (or drive resistance force) of the mounting head 36. The detection unit 43 may have a sensor other than the above-mentioned sensor in order to detect an error in the component mounting device 20. The detection result obtained by the detection unit 43 and information regarding the occurrence or absence of an error are output to the management device 50.

[0070] The counting unit 42 is a counter that counts the number of times components are mounted by the component mounting device 20. For example, the counting unit 42 counts the number of times the unit 30 operates, thereby counting the number of times the components are mounted. If the unit 30 is a feeder 31, the number of times the feeder 31 operates to feed corresponds to the number of times the components are mounted. If the unit 30 is a mounting head 36, the number of times the mounting head 36 operates to and fro, or the number of times the mounting head 36 switches suction on and off or the number of times it blows corresponds to the number of times the components are mounted. Information relating to the number of times the components are mounted obtained by the counting unit 42 is output to the management device 50.

[0071] [Management device configuration] The management device 50 is a calculation device (computer) equipped with a CPU, and manages the operation and non-operation of the component mounting device 20. The management device 50 is an example of an information processing device of the present disclosure.

[0072] The management device 50 performs a randomized controlled trial using the component mounting device 20. By performing a randomized controlled trial, even if conditions other than the changed mounting conditions vary, the effects of the variations can be averaged and data can be acquired. This makes it possible to accurately determine whether the occurrence of errors has been suppressed by changing the mounting conditions.

[0073] The management device 50 has the following configuration in order to perform a randomized controlled trial.

[0074] 2, the management device 50 includes an information acquisition unit 51, a calculation unit 52, a control unit 55, a storage unit 56, an input unit 57, and a display unit 58. The information acquisition unit 51, the calculation unit 52, and the control unit 55 are processing units realized by a program stored in the storage unit 56 and a processor that executes the program.

[0075] The input unit 57 is a user interface such as a keyboard, a touch panel, a mouse, etc., and is used when inputting operation commands and various data.

[0076] The display unit 58 is a display such as a liquid crystal panel, etc. The display unit 58 displays various information output from the management device 50.

[0077] In order to perform a randomized comparative test, the control unit 55 of this embodiment causes the component mounting apparatus 20 to randomly perform mounting under a first mounting condition m1 and mounting under a second mounting condition m2 that are different from each other.

[0078] FIG. 5 is a diagram showing an example of mounting under the first mounting condition m1 and mounting under the second mounting condition m2 that are executed by the component mounting apparatus 20. In FIG.

[0079] The first mounting condition m1 is a mounting condition previously executed by the component mounting apparatus 20. The first mounting condition m1 is a condition that is recognized by, for example, an operator or the management apparatus 50 as a condition in which an error occurs relatively frequently.

[0080] The second mounting condition m2 is a mounting condition to be tried by the component mounting device 20. The second mounting condition m2 is a condition to be newly executed by the component mounting device 20, but is not limited thereto, and may be selected from among conditions executed in the past as long as it is a condition different from the first mounting condition m1. The management device 50 checks whether the occurrence of an error is suppressed by changing the first mounting condition m1 to the second mounting condition m2.

[0081] In the figure, the lamp value of the imaging illumination when capturing an image of a component for mounting is shown as a mounting condition to be changed. The lamp value of the imaging illumination is a parameter that changes the brightness of the illumination, and is changed and adjusted when the component recognition error rate is high.

[0082] The mounting conditions to be changed to suppress the occurrence of errors are not limited to the lamp value of the imaging illumination. For example, when the component recognition error rate is high, mounting conditions such as an algorithm for processing the recognition of the component from the imaging data of the camera 44, the height of the suction nozzle 37 at the time of imaging, or the passing speed at which the component held by the suction nozzle 37 passes over the camera 44 are changed. Also, when the component suction error rate is high, mounting conditions such as the nozzle descent speed at which the suction nozzle 37 is lowered relative to the component, the suction height at which the suction nozzle 37 is suctioned onto the component, the suction waiting time from when the component is supplied to the feeder 31 until it is suctioned, or the nozzle ascent speed at which the suction nozzle 37 is raised after suction are changed. Also, when the component mounting error rate is high, mounting conditions such as the amount of pressure applied by the suction nozzle 37 during mounting are changed.

[0083] In addition, in the figure, an example in which the number of parameters of the mounting condition to be changed is one is shown, but the present invention is not limited thereto. For example, the mounting condition to be changed may include multiple parameters, and the mounting condition may be changed with the multiple parameters as one set. The mounting condition to be changed may also be the unit 30. For example, when the target to be changed is the unit 30, the mounting condition is changed by using a feeder 31 having the same specifications but different manufacturing dates. Specifically, when the component mounting device 20 has multiple feeders 31 that supply the same type of components, components are picked up randomly from each of the multiple feeders 31 and mounted on the same mounting point. The multiple feeders 31 are, for example, the same type of feeders. For example, the result of mounting components on one feeder 31 may be a sample of the first mounting condition m1, and the result of mounting components on the other feeder 31 may be a sample of the second mounting condition m2.

[0084] The control unit 55 acquires information on the first mounting condition m1 and the second mounting condition m2 via the input unit 57, and stores the acquired first mounting condition m1 and second mounting condition m2 in the storage unit 56. The first mounting condition m1 is selected from among conditions already executed by the component mounting device 20. The second mounting condition m2 is set to an arbitrary condition by an operator's input using the input unit 57. Note that the first mounting condition m1 and the second mounting condition m2 may be mounting conditions provided by the management device 50. The management device 50 may provide past mounting conditions and mounting conditions to be changed based on the recent occurrence of errors.

[0085] Furthermore, the control unit 55 of this embodiment performs the randomized comparative test for at least a predetermined set number of times st. The set number of times st is determined as follows.

[0086] FIG. 6 is a diagram showing an example of the past error rate and the recommended sample number.

[0087] The figure shows the past error rate of the component mounting device 20 and the recommended number of samples corresponding to the error rate. The reason why the recommended number of samples differs for each error rate is that, for example, if the number of samples is small even though the error rate is low, the frequency of error occurrence cannot be accurately grasped.

[0088] The past error rate is a specific error rate that occurred in the past due to mounting under the first mounting condition m1. For example, the past error rate is a component pickup error rate by the suction nozzle 37 of the component mounting device 20, a component recognition error rate by the camera 44 of the component mounting device 20, or a component mounting error rate in the production line 10 including the component mounting device 20. Note that the past error rate is not limited to the component mounting device 20, and may be derived from the inspection results of an inspection device included in the production line 10.

[0089] The recommended sample number is the set number of times st set in the component mounting apparatus 20 when performing the randomized comparative test. In other words, the set number of times st set in the component mounting apparatus 20 is determined based on the past error rate of the component mounting apparatus 20. For example, when the past error rate is 0.05%, the set number of times st is set to 100,000 times based on FIG. 6.

[0090] 6 also shows an estimated error rate for the second mounting condition m2. As shown in the figure, if the error rate of errors occurring due to mounting under the second mounting condition m2 can be estimated, the set number of times st may be determined taking into consideration the estimated error rate under the second mounting condition m2 in addition to the past error rate. For example, the set number of times st is determined to be larger as the difference between the past error rate and the estimated error rate under the second mounting condition m2 becomes smaller.

[0091] The set number of times st is set by an operator using the input unit 57. Specifically, the operator inputs the set number of times st based on the past error rate and the recommended sample number shown in FIG. 6. Information related to the input set number of times st is output to the control unit 55.

[0092] The control unit 55 sets the set number of times st inputted by the input unit 57 in the component mounting apparatus 20 as the number of mounting times when performing the randomized comparative test. In addition, the control unit 55 causes the storage unit 56 to store the set number of times st, and also causes the display unit 58 to display it.

[0093] Although the above describes an example in which the operator inputs the set number of times st, the present invention is not limited to this, and the control unit 55 may derive the set number of times st. In this case, the control unit 55 may derive a past error rate based on information related to the first mounting condition m1 and the second mounting condition m2 inputted through the input unit 57, and may automatically determine the set number of times st based on the past error rate and the information shown in FIG.

[0094] The control unit 55 outputs a control command to the component mounting device 20 to randomly execute mounting under the first mounting condition m1 and mounting under the second mounting condition m2, which are different from each other, for the above-mentioned set number of times st. For example, the control command includes a command to select the first mounting condition m1 if the number is odd, and to select the second mounting condition m2 if the number is even. The component mounting device 20 randomly determines whether to mount under the first mounting condition m1 or the second mounting condition m2 for each mounting point where a component is to be mounted, using, for example, a random number generator, and then performs mounting. In this way, the component mounting device 20 randomly executes mounting under the first mounting condition m1 and mounting under the second mounting condition m2 for at least the predetermined set number of times st.

[0095] FIG. 7 is a diagram showing an example of information regarding the number of mounting times, mounting conditions, and whether or not an error has occurred.

[0096] The figure shows the number of mounting attempts performed by the component mounting device 20, the mounting conditions, and whether or not an error occurred due to the mounting conditions. As shown in the figure, the mounting conditions are expressed as a first mounting condition m1 or a second mounting condition m2, which are randomly displayed for each mounting attempt number. The presence or absence of an error is recorded as the presence or absence of an error when focusing on one error or the same type of error. The component mounting device 20 outputs information related to the number of mounting attempts, the mounting conditions, and whether or not an error occurred to the management device 50.

[0097] The information acquiring unit 51 acquires information related to the number of mounting operations, the mounting conditions, and whether or not an error has occurred, which are output from the component mounting apparatus 20. Furthermore, the information acquiring unit 51 acquires the total number of mounting operations, the number of first errors that occurred under the first mounting conditions m1, and the number of second errors that occurred under the second mounting conditions m2, based on the information shown in FIG.

[0098] The calculation unit 52 calculates statistics for the first mounting condition m1 and the second mounting condition m2 based on the total number of times mounting was performed, the first number of errors, and the second number of errors. Specifically, the calculation unit 52 calculates a test statistic for the second mounting condition m2 with respect to the first mounting condition m1 as the above-mentioned statistic. The test statistic is a univariate statistic (a function of sample data) used in statistical hypothesis testing. Note that the test in this example is a one-sided test. Examples of the test include a Z-test, a t-test, a chi-square test, and an F-test.

[0099] The control unit 55 of this embodiment determines whether or not the occurrence of an error can be suppressed by changing the first mounting condition m1 to the second mounting condition m2, based on the statistics calculated by the calculation unit 52. In order to determine whether or not the occurrence of an error can be suppressed, the control unit 55 uses the test statistics calculated by the calculation unit 52 to determine whether or not there is a significant difference in changing the mounting condition.

[0100] If the test statistic falls below a predetermined significance level, the control unit 55 determines that there is an effect of setting the implementation condition to the second implementation condition m2, and determines to perform subsequent implementation under the second implementation condition m2. If the test statistic does not fall below the predetermined significance level, the control unit 55 determines that there is no effect of setting the implementation condition to the second implementation condition m2, and determines to perform subsequent implementation under the first implementation condition m1. The predetermined significance level is a value set to determine whether or not there is a significant difference, and is set to, for example, 0.05. The predetermined significance level is stored in advance in the storage unit 56.

[0101] Furthermore, the control unit 55 outputs a signal for displaying information based on the test statistic to the display unit 58. The display unit 58 displays the information based on the test statistic based on the signal.

[0102] 8 is a diagram showing an example of information displayed on the display unit. The display unit may be the display unit 58 of the management device 50, or the display unit 48 of the component mounting device 20. An example of information displayed on the display unit 58 of the management device 50 will be described below.

[0103] The control unit 55 causes the display unit 58 to display information based on the test statistic, as shown in (a) of Fig. 8. In the figure, the P value derived from the test statistic is shown.

[0104] The control unit 55 may cause the display unit 58 to display information indicating whether or not the probability based on the test statistic falls below a predetermined significance level, as shown in (b) of Fig. 8. The figure shows that the P value falls below the significance level. For example, if the probability based on the test statistic is less than 1%, a double circle (◎) is displayed, if it is between 1% and 5%, a circle (○) is displayed, and if it is 5% or more, an NG mark (×) is displayed.

[0105] As shown in (c) of FIG. 8, when the probability based on the test statistic falls below a predetermined significance level, the control unit 55 may cause the display unit 58 to display information indicating that the mounting conditions have been changed from the first mounting condition m1 to the second mounting condition m2. In the figure, a P value, which is an example of the probability based on the test statistic, is shown, and information indicating that the mounting conditions have been changed because the P value falls below a predetermined significance level is displayed. Note that the control unit 55 may display inquiry information such as "A significant difference was found, so would you like to change the mounting conditions?" before changing the mounting conditions, and change the mounting conditions when an input to change the mounting conditions is received.

[0106] Furthermore, when the probability based on the test statistic is not below a predetermined significance level, the control unit 55 may cause the display unit 58 to display information indicating that the implementation conditions have been returned to the first implementation conditions m1. Note that, before returning the implementation conditions to the first implementation conditions m1, the control unit 55 may display inquiry information such as "Since no significant difference was found, do you want to return the implementation conditions to the first implementation conditions m1?", and may return the implementation conditions to their original state when an input to return the implementation conditions to their original state is received.

[0107] 9 is a diagram showing another example of information displayed on the display unit 58 of the management device 50. Here, an example of information displayed on the display unit 58 of the management device 50 will be described.

[0108] 9A, the control unit 55 may cause the display unit 58 to display information based on the test statistics. The figure shows the error rates of the first mounting condition m1 and the second mounting condition m2, and that the P value of the second mounting condition m2 relative to the first mounting condition m1 is smaller than a predetermined significance level (p<0.05).

[0109] The control unit 55 may cause the display unit 58 to display information based on the test statistic using a confidence interval, as shown in (b) of Fig. 9. In the figure, the presence or absence of a significant difference between the second mounting condition m2 and the first mounting condition m1 is shown with a 95% confidence interval.

[0110] The management device 50 of this embodiment includes a control unit 55 that causes the component mounting device 20 to randomly execute mounting under a first mounting condition m1 and mounting under a second mounting condition m2 that are different from each other for at least a predetermined set number of times, and a calculation unit 52 that calculates statistics regarding the first mounting condition m1 and the second mounting condition m2 based on the number of first errors that have occurred due to the first mounting condition m1 and the number of second errors that have occurred due to the second mounting condition m2.

[0111] In this way, by randomly executing mounting under the first mounting condition m1 and mounting under the second mounting condition m2 by the component mounting device 20, even if conditions other than the changed mounting condition fluctuate, the influence of the fluctuation can be averaged and data can be acquired. This makes it possible to determine whether the occurrence of errors has been suppressed by changing the mounting condition.

[0112] Although the above describes an example in which the statistic is a test statistic, the statistic is not limited to this and may be an average value. For example, the control unit 55 may determine whether the second mounting condition m2 is acceptable relative to the first mounting condition m1 based on the average value of the number of first errors caused by the first mounting condition m1 and the average value of the number of second errors caused by the second mounting condition m2.

[0113] In the above, an example was given in which the error is information that is explicitly notified on the display unit 58 or the like, but the present invention is not limited to this. For example, the error may be information such as an event and a warning that is left as a log indicating a malfunction of the device. For example, the information such as an event and a warning may be information indicating that the production performance of the mounting device is deteriorating even though no error has occurred. For example, the number of errors may be at least one of information indicating the number of boards involved in mounting errors and information indicating an increasing trend thereof.

[0114] [Operation of management device] The operation of the management device 50 according to the first embodiment will be described.

[0115] FIG. 10 is a flowchart showing the operation of the management device 50.

[0116] The management device 50 acquires information on the first mounting condition m1 and the second mounting condition m2 (step S10). For example, the management device 50 receives information on the mounting conditions from the operator via the input unit 57.

[0117] Furthermore, the management device 50 acquires information regarding the set number of times st (step S20). For example, the management device 50 receives information regarding the set number of times st from an operator via the input unit 57. Note that step S20 may be executed before step S10.

[0118] Next, the management device 50 causes the component mounting device 20 to randomly perform mounting under the first mounting conditions m1 and mounting under the second mounting conditions m2 for a predetermined set number of times st (step S30).

[0119] The component mounting device 20 randomly performs mounting under the first mounting condition m1 and mounting under the second mounting condition m2 for a predetermined set number of times st based on a control command output from the management device 50. The component mounting device 20 also detects whether an error has occurred for each number of mounting times. The component mounting device 20 outputs information related to the number of mounting times, the mounting conditions, and whether an error has occurred to the management device 50.

[0120] The management device 50 acquires information regarding the number of mounting times, the mounting conditions, and the occurrence or non-occurrence of an error output from the component mounting device 20 (step S40).

[0121] The management device 50 calculates statistics regarding the first mounting condition m1 and the second mounting condition m2 based on the number of first errors that occurred under the first mounting condition m1 and the number of second errors that occurred under the second mounting condition m2 (step S50). For example, the management device 50 performs a binomial test on the first mounting condition m1 and the second mounting condition m2 to calculate the test statistics.

[0122] The management device 50 determines whether or not the P value based on the test statistic falls below the significance level (step S60).

[0123] When the P value falls below the significance level (Yes in S60), the management device 50 outputs a control command to the component mounting device 20 to perform mounting under the second mounting condition m2 (Step S71). The management device 50 also causes the display unit 58 to display that subsequent production will be performed under the second mounting condition m2 (Step S72).

[0124] On the other hand, if the P value is equal to or greater than the significance level (No in S60), the management device 50 outputs a control command to the component mounting device 20 to return to the first mounting condition m1 and perform mounting (step S75). In addition, the management device 50 causes the display unit 58 to display that subsequent production will be performed under the first mounting condition m1 (step S76).

[0125] By executing the above steps S10 to S76, it is possible to determine whether the occurrence of errors has been suppressed by changing the mounting conditions.

[0126] [Modification of the first embodiment] An information processing system 1A according to a modification of the first embodiment will be described.

[0127] For example, if the set number of times st is large, it takes a long time to execute the randomized controlled test, and a problem may occur in that the randomized controlled test is interrupted midway due to a change in the type of component mounting board during mass production, etc. Therefore, in the modified example, an example will be described in which it is determined whether or not the randomized controlled test can be executed within the production plan based on a production plan created in advance.

[0128] FIG. 11 is a block diagram showing a configuration of an information processing system 1A according to a modification of the first embodiment.

[0129] The information processing system 1A includes a production line 10, a management device 50A, and further includes a production plan creation device 70. The production line 10, the management device 50A, and the production plan creation device 70 are connected via a communication network.

[0130] The production plan creation device 70 creates parts data for multiple parts that make up the product based on the input overall plan information, and creates a production program based on the parts data. The parts data includes shape information of the parts and operation parameters for mounting the parts. The production program is a program for operating the production line 10, and includes information on the mounting order of parts and the supply positions of the parts, as well as information on the use order and arrangement of the units 30.

[0131] The production plan created by the production plan creation device 70 is output to the management device 50A. The management device 50A performs production management of the production line 10 including the component mounting device 20 based on the production plan output from the production plan creation device 70.

[0132] FIG. 12 is a flowchart showing the operation of the management device 50A according to the modification of the first embodiment.

[0133] The information acquiring unit 51 of the management device 50A acquires the production plan output from the production plan creation device 70 (step S110).

[0134] The control unit 55 determines whether or not the component mounting device 20 is capable of performing mounting the predetermined set number of times st based on the production plan (step S120).

[0135] When the control unit 55 determines that the component mounting device 20 is capable of performing the predetermined set number of times st of mounting (Yes in S120), it outputs a signal to the component mounting device 20 to perform mounting under the first mounting condition m1 and mounting under the second mounting condition m2 (step S130). The component mounting device 20 randomly performs mounting under the first mounting condition m1 and mounting under the second mounting condition m2 based on the control command output from the control unit 55.

[0136] Furthermore, the control unit 55 derives the scheduled end time of the randomized controlled test based on the production plan acquired in step S110 and the predetermined set number of times st, and outputs a signal for displaying the scheduled end time to the display units 48 and 58 (step S140). The display units 48 and 58 display the scheduled end time of the randomized controlled test based on the information output from the control unit 55. Note that step S140 may be executed between steps S120 and S130, or may be executed simultaneously with step S130. Step S140 may be executed during the randomized controlled test, as long as it is executed before the randomized controlled test of the component mounting apparatus 20 is finished.

[0137] On the other hand, when the control unit 55 determines that the component mounting device 20 cannot execute the predetermined set number of times st of mounting (No in S120), it outputs information indicating that the set number of times st of mounting cannot be executed to the display units 48 and 58 (step S150). Based on the information output from the control unit 55, the display units 48 and 58 display information indicating that the set number of times st of mounting cannot be executed, that is, that the randomized controlled test cannot be executed.

[0138] According to this modification, a randomized controlled trial can be carried out in a well-planned manner.

[0139] (Embodiment 2) [Outline of information processing system configuration] A schematic configuration of an information processing system 1B according to a second embodiment will be described with reference to Fig. 13. In the second embodiment, an example will be described in which a component mounting apparatus 20B randomly executes mounting under a first mounting condition m1 and mounting under a second mounting condition m2, and calculates statistics based on the number of errors for each. In the second embodiment, the component mounting apparatus 20B corresponds to the information processing apparatus in the present disclosure.

[0140] FIG. 13 is a block diagram showing the configuration of a management device 50 and a production line 10 included in an information processing system 1B.

[0141] 13, the information processing system 1B includes a production line 10 and a management device 50. The production line 10 and the management device 50 are connected to each other via a communication network. The communication network may be realized by a wide area communication network such as the Internet, or may be realized by a short-distance wireless network such as a wireless LAN.

[0142] The management device 50 is a device that manages production in the production line 10. The management device 50 performs various information processing based on a production plan acquired in advance. The production plan includes information on the production quantity, production time, and mounting conditions.

[0143] The production line 10 is an apparatus for producing component-mounted boards. The production line 10 includes a printing apparatus, a component mounting apparatus 20B, a reflow apparatus, an inspection apparatus, and the like. The production line 10 produces component-mounted boards by performing processes such as solder printing, component mounting, reflow, and inspection on boards carried in from the upstream side, and carries out the produced component-mounted boards downstream. In the following, of the various apparatuses included in the production line 10, the component mounting apparatus 20B will be described as an example.

[0144] [Configuration of component mounting equipment included in production line] The configuration of component mounting apparatus 20B included in production line 10 will be described.

[0145] The component mounting apparatus 20B of the second embodiment includes a transport unit 24, a drive unit 41, a plurality of feeders 31, and a plurality of mounting heads 36. The component mounting apparatus 20B also includes a detection unit 43, a counting unit 42, a control unit 45, a storage unit 46, an input unit 47, and a display unit 48.

[0146] The configurations of the transport unit 24, the drive unit 41, the multiple feeders 31, and the multiple mounting heads 36 in the second embodiment are the same as those in the first embodiment. The following description will focus on the points that are different from the first embodiment.

[0147] Storage unit 46 stores an operation program for mounting components on board 5. The operation program is a program created in accordance with the component-mounted boards to be produced, and is transmitted from management device 50 to component mounting device 20B.

[0148] The control unit 45 operates the component mounting apparatus 20B based on the operation program transmitted from the management apparatus 50. The control unit 45 randomly executes mounting under a plurality of mounting conditions.

[0149] The detection unit 43 is a sensor for detecting whether an error has occurred in the component mounting apparatus 20B. The detection unit 43 is provided in the main body of the component mounting apparatus 20B or in the unit 30 itself. The detection unit 43 includes, for example, a camera, an imaging light, a vacuum pressure gauge, and a load cell. The detection result obtained by the detection unit 43 and information regarding the occurrence of an error are output to the control unit 45 of the component mounting apparatus 20B.

[0150] The counting unit 42 is a counter that counts the number of times components are mounted by the component mounting apparatus 20B. Information relating to the number of times mounting is obtained by the counting unit 42 is output to the control unit 45 of the component mounting apparatus 20B.

[0151] The input unit 47 is a user interface such as a touch panel, and is used to input operation commands and various data.

[0152] The display unit 48 is a display such as a liquid crystal panel, etc. The display unit 48 displays various information output from the management device 50 and the control unit 45.

[0153] The component mounting apparatus 20B has the following configuration in order to perform a randomized comparative test.

[0154] The component mounting apparatus 20B of the second embodiment includes a calculation unit 52B in addition to the control unit 45. The calculation unit 52B and the control unit 45 are processing units realized by a program stored in a storage unit 56 and a processor that executes the program.

[0155] To perform a randomized comparative test, the control unit 45 causes the component mounting apparatus 20B to randomly execute mounting under a first mounting condition m1 and mounting under a second mounting condition m2 that are different from each other.

[0156] The first mounting condition m1 is a mounting condition previously executed by the component mounting apparatus 20B. The first mounting condition m1 is a condition that is recognized by, for example, an operator or the component mounting apparatus 20B as a condition in which an error occurs relatively frequently.

[0157] The second mounting condition m2 is a mounting condition to be tried by the component mounting apparatus 20B. The second mounting condition m2 is a condition to be newly executed by the component mounting apparatus 20B, but is not limited thereto, and may be selected from conditions executed in the past as long as it is a condition different from the first mounting condition m1. The component mounting apparatus 20B checks whether the occurrence of an error is suppressed by changing the first mounting condition m1 to the second mounting condition m2.

[0158] The control unit 45 acquires information on the first mounting condition m1 and the second mounting condition m2 via the input unit 47, and stores the acquired first mounting condition m1 and second mounting condition m2 in the storage unit 46. The first mounting condition m1 is selected from among conditions already executed by the component mounting device 20B. The second mounting condition m2 is set to an arbitrary condition by an operator's input using the input unit 47. Note that the first mounting condition m1 and the second mounting condition m2 may be mounting conditions provided by the component mounting device 20B. The component mounting device 20B may provide past mounting conditions and mounting conditions to be changed based on the recent occurrence of errors.

[0159] Moreover, the control unit 45 of this embodiment performs the randomized comparative test for at least a predetermined set number of times st.

[0160] The set number of times st set in the component mounting apparatus 20B is set based on the past error rate that occurred in the component mounting apparatus 20B. The lower the past error rate, the larger the recommended sample number.

[0161] The set number of times st is set by an operator using the input unit 47. Specifically, the operator inputs the set number of times st based on the past error rate and the recommended number of samples. Information about the input set number of times st is output to the control unit 45.

[0162] The control unit 45 sets the set number of times st inputted by the input unit 47 in the component mounting apparatus 20B as the number of mounting times when performing the randomized comparative test. In addition, the control unit 45 causes the storage unit 46 to store the set number of times st, and also causes the display unit 48 to display it.

[0163] Although the above describes an example in which the operator inputs the set number of times st, the present invention is not limited to this, and the control unit 45 may derive the set number of times st. In this case, the control unit 45 may derive a past error rate based on information related to the first mounting condition m1 and the second mounting condition m2 inputted through the input unit 47, and may automatically determine the set number of times st based on the past error rate and the information shown in FIG.

[0164] The control unit 45 randomly executes mounting under the first mounting condition m1 and mounting under the second mounting condition m2, which are different from each other, for the set number of times st. The control unit 45 randomly determines whether to mount under the first mounting condition m1 or the second mounting condition m2 for each mounting point where a component is to be mounted, using, for example, a random number generator, and then performs mounting. In this way, the component mounting device 20B randomly executes mounting under the first mounting condition m1 and mounting under the second mounting condition m2 for at least the predetermined set number of times st.

[0165] The control unit 45 acquires information regarding the number of mounting operations, the mounting conditions, and whether or not an error has occurred. The control unit 45 also acquires the total number of mounting operations, the number of first errors that occurred under the first mounting conditions m1, and the number of second errors that occurred under the second mounting conditions m2, and outputs these to the calculation unit 52B.

[0166] The calculation unit 52B calculates statistics regarding the first mounting condition m1 and the second mounting condition m2 based on the total number of mountings performed, the first number of errors, and the second number of errors. Specifically, the calculation unit 52B calculates a test statistic of the second mounting condition m2 against the first mounting condition m1 as the above-mentioned statistics. Note that the test in this example is a one-sided test.

[0167] The control unit 45 determines whether or not the occurrence of an error can be suppressed by changing the first mounting condition m1 to the second mounting condition m2 based on the statistics calculated by the calculation unit 52B. In order to determine whether or not the occurrence of an error can be suppressed, the control unit 45 uses the test statistics calculated by the calculation unit 52B to determine whether or not there is a significant difference in changing the mounting condition.

[0168] If the test statistic falls below a predetermined significance level, the control unit 45 determines that there is an effect of setting the implementation condition to the second implementation condition m2, and determines to perform subsequent implementation under the second implementation condition m2. If the test statistic does not fall below the predetermined significance level, the control unit 45 determines that there is no effect of setting the implementation condition to the second implementation condition m2, and determines to perform subsequent implementation under the first implementation condition m1. The predetermined significance level is a value set to determine whether or not there is a significant difference, and is set to, for example, 0.05. The predetermined significance level is stored in advance in the storage unit 46.

[0169] The control unit 45 outputs a signal for displaying the information based on the test statistic to the display unit 48. The display unit 48 displays the information based on the test statistic based on the signal.

[0170] The component mounting apparatus 20B of this embodiment includes a control unit 45 that causes the component mounting apparatus 20B to randomly execute mounting under a first mounting condition m1 and mounting under a second mounting condition m2 that are different from each other for at least a predetermined set number of times st, and a calculation unit 52B that calculates statistics regarding the first mounting condition m1 and the second mounting condition m2 based on the number of first errors that have occurred due to the first mounting condition m1 and the number of second errors that have occurred due to the second mounting condition m2.

[0171] In this way, by randomly executing mounting under the first mounting condition m1 and mounting under the second mounting condition m2 by the component mounting apparatus 20B, even if conditions other than the changed mounting condition fluctuate, the influence of the fluctuation can be averaged and data can be acquired. This makes it possible to determine whether the occurrence of errors has been suppressed by changing the mounting condition.

[0172] (Other embodiments, etc.) Although the information processing system according to one or more aspects has been described based on each embodiment, the present disclosure is not limited to each of the embodiments. As long as it does not deviate from the gist of the present disclosure, various modifications conceived by a person skilled in the art may also be included in the scope of the present disclosure.

[0173] Although the above describes an example of performing a randomized comparative test during the production of component-mounted boards, the present invention is not limited to this. For example, a randomized comparative test may be performed for the sole purpose of experimentation, not during the production of component-mounted boards, and a test statistic of the second mounting condition m2 relative to the first mounting condition m1 may be calculated.

[0174] In the above, an example has been shown in which the first mounting condition m1 and the second mounting condition m2 are randomly executed in the component mounting apparatus 20, and which mounting condition is to be used is randomly determined each time, but this is not limiting. For example, it may be determined randomly in advance whether to use the first mounting condition m1 or the second mounting condition m2 for all set number of times, and then mounting may be performed according to that determination.

[0175] In each of the above-mentioned embodiments, each component may be configured with dedicated hardware, or may be realized by executing a software program suitable for each component. Each component may be realized by a program execution unit such as a CPU (Central Processing Unit) or a processor reading and executing a software program recorded on a recording medium such as a hard disk or a semiconductor memory. Here, the software for realizing the device or the like of each of the above-mentioned embodiments is a program that causes a computer to execute each step included in each flowchart. [Industrial Applicability]

[0176] The present disclosure is applicable to component mounting devices that produce component mounted boards, management devices that manage the production of component mounted boards by the component mounting devices, and information processing systems that include the component mounting devices and the management devices. [Explanation of symbols]

[0177] 1, 1A, 1B Information Processing System 5 Substrate 10 Production Lines 20, 20B Component mounting device (information processing device) 22 Foundation 24 Conveyor 26 Y-axis linear motion robot 28 X-axis linear motion robot 30 units 31 Feeder 32 Parts supply tape 36 Mounting Head 37 Suction nozzle 41 Drive unit 42 Counting section 43 Detection unit 44, 44a Camera 45 Control section 46 Memory section 47 Input section 48 Display section 50, 50A Management device (information processing device) 51 Information Acquisition Department 52, 52B calculation section 55 Control section 56 Memory section 57 Input section 58 Display section 70 Production planning device m1 First mounting condition m2 Second mounting condition st setting number of times

Claims

1. a control unit that causes the component mounting apparatus to randomly execute mounting under a first mounting condition and mounting under a second mounting condition that are different from each other for at least a predetermined set number of times; a calculation unit that calculates statistics regarding the first mounting condition and the second mounting condition based on a first number of errors that occurred due to mounting under the first mounting condition and a second number of errors that occurred due to mounting under the second mounting condition; and An information processing device comprising:

2. the first mounting condition is a mounting condition previously executed by the component mounting device, The second mounting condition is a mounting condition to be tried by the component mounting device. The information processing device according to claim 1 .

3. the calculation unit calculates, as the statistical quantity, a test statistical quantity of the second mounting condition with respect to the first mounting condition; The information processing device according to claim 1 .

4. The control unit outputs a signal to cause a display unit to display information based on the test statistic. The information processing device according to claim 3 .

5. the control unit causes the display unit to display a probability based on the test statistic as the information based on the test statistic. The information processing device according to claim 4.

6. the control unit causes the display unit to display, as the information based on the test statistic, information indicating whether or not a probability based on the test statistic falls below a predetermined significance level. The information processing device according to claim 4.

7. when the probability based on the test statistic falls below a predetermined significance level, the control unit causes the display unit to display, as information based on the test statistic, information indicating that the mounting condition is to be changed from the first mounting condition to the second mounting condition. The information processing device according to claim 4.

8. The set number of times is determined based on a past error rate of the component mounting device. The information processing device according to claim 1 .

9. The control unit causes the display unit to display the set number of times. The information processing device according to claim 4.

10. the past error rate is a component pickup error rate by a suction nozzle of the component mounting device, a component recognition error rate by a camera of the component mounting device, or a component mounting error rate in a production line including the component mounting device; The information processing device according to claim 8.

11. Further, an information acquisition unit that acquires a production plan for the component mounting device is provided, The control unit determines whether or not the component mounting device is capable of performing the predetermined set number of mounting operations based on the production plan, (1) when it is determined that the component mounting can be performed, outputting a signal for causing the component mounting device to perform mounting under the first mounting condition and mounting under the second mounting condition; (2) if it is determined that the program is not executable, outputting information indicating that the program cannot be implemented the set number of times; The information processing device according to claim 1 .

12. Further, an information acquisition unit that acquires a production plan for the component mounting device is provided, the control unit derives a scheduled end time for mounting to be completed based on the production plan and the set number of times, and outputs a signal to cause a display unit to display the scheduled end time. The information processing device according to claim 1 .

13. a control unit that causes the component mounting apparatus to randomly execute mounting under a first mounting condition and mounting under a second mounting condition that are different from each other for at least a predetermined set number of times; a calculation unit that calculates statistics regarding the first mounting condition and the second mounting condition based on a first number of errors occurring under the first mounting condition and a second number of errors occurring under the second mounting condition; and a display unit that displays information based on the statistics; An information processing system comprising:

14. randomly executing, by the component mounting device, mounting under a first mounting condition and mounting under a second mounting condition which are different from each other, at least for a predetermined set number of times; calculating statistics regarding the first mounting condition and the second mounting condition based on a first number of errors occurring under the first mounting condition and a second number of errors occurring under the second mounting condition; Information processing methods.

Images