Cutting device

Abstract

To provide a cutting device which allows checking of a machining state through a transparent opening / closing door and prevents the inside of a machining chamber and a suction duct and a duct fan from being stained.SOLUTION: A cutting device includes: a chuck table 6 for holding a plate-shaped object 4; cutting means 8 having a spindle 34 rotatably equipped with a cutting blade 36 for cutting the plate-shaped object 4 held by the chuck table 6; cutting water supply means 10 for supplying cutting water to the cutting blade 36; an X-axis feed means which cuts and feeds the chuck table 6 in the X-axis direction; and a Y-axis feed means which indexes and feeds the cutting means 8 in a Y-axis direction orthogonal to the X-axis direction. The cutting device further includes a top plate 52 which is disposed to extend in the X-axis direction with an angle of depression θ viewed from the cutting blade 36 side to a side where cutting water is scattered due to rotation of the cutting blade 36, receives the scattered cutting water, and separates gas and liquid. A Y-axis direction length of the top plate 52 is set to a size that satisfies a length for which the cutting blade 36 is indexed and fed in the Y-axis direction.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a cutting device for cutting a plate-shaped object. [Background technology]

[0002] Plate-like objects such as wafers and CSP (Chip Size Package) substrates, on whose surfaces multiple devices such as ICs and LSIs are formed along planned dividing lines, are divided into individual device chips by a cutting machine, and each of the divided device chips is used in electrical equipment such as mobile phones and personal computers.

[0003] The cutting apparatus includes a chuck table for holding a plate-like object, cutting means equipped with a spindle to which a cutting blade for cutting the plate-like object held on the chuck table is rotatably mounted, cutting water supplying means for supplying cutting water to the cutting blade, X-axis feeding means for feeding the chuck table in the X-axis direction for cutting, and Y-axis feeding means for indexing and feeding the cutting means in the Y-axis direction perpendicular to the X-axis direction, and can divide the plate-like object into individual device chips with high precision.

[0004] Furthermore, the cutting means and the chuck table are housed in a machining chamber that is provided with a suction port for sucking in mist so that the mist generated by scattering cutting water is not exposed to the outside (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 7139051 Summary of the Invention [Problem to be solved by the invention]

[0006] However, there are cases where the mist containing cutting chips cannot be sufficiently discharged, and in such cases, there are problems in that the machining state cannot be confirmed through the transparent door that separates the machining chamber, and the inside of the machining chamber becomes dirty. Furthermore, there is a problem in that the inside of the suction duct and the duct fan become dirty due to the mist sucked in from the suction port.

[0007] An object of the present invention is to provide a cutting device that allows the machining state to be checked through a transparent opening and closing door, and prevents the machining chamber, the inside of the suction duct, and the duct fan from becoming dirty. [Means for solving the problem]

[0008] According to the present invention, there is provided the following cutting device that solves the above problems. "A cutting device for cutting a plate-shaped object, the cutting means including a chuck table for holding a plate-like object, a cutting means having a spindle to which a cutting blade for cutting the plate-like object held on the chuck table is rotatably mounted, a cutting water supplying means for supplying cutting water to the cutting blade, an X-axis feeding means for feeding the chuck table in the X-axis direction for cutting, and a Y-axis feeding means for indexing and feeding the cutting means in the Y-axis direction perpendicular to the X-axis direction, a top plate extending in the X-axis direction at a depression angle as viewed from the cutting blade on the side where cutting water is scattered due to the rotation of the cutting blade, for receiving the scattered cutting water and separating gas and liquid; A cutting device is provided in which the length of the top plate in the Y-axis direction is set to a size that satisfies the length over which the cutting blade is indexed in the Y-axis direction.

[0009] Preferably, the chuck table and the cutting means are disposed in a machining chamber, and a suction port for sucking in the gas from which the gas and liquid are separated in the machining chamber is disposed above the top plate in a side wall of the machining chamber. It is preferable that a bottom plate is provided directly below the top plate, and the bottom plate is disposed adjacent to the chuck table and moves in the X-axis direction together with the chuck table. A scrap material collecting means for collecting scrap material generated when cutting a plate-shaped object may be disposed. Effect of the Invention

[0010] The cutting device of the present invention comprises: the cutting means including a chuck table for holding a plate-like object, a cutting means having a spindle to which a cutting blade for cutting the plate-like object held on the chuck table is rotatably mounted, a cutting water supplying means for supplying cutting water to the cutting blade, an X-axis feeding means for feeding the chuck table in the X-axis direction for cutting, and a Y-axis feeding means for indexing and feeding the cutting means in the Y-axis direction perpendicular to the X-axis direction, a top plate extending in the X-axis direction at a depression angle as viewed from the cutting blade on the side where cutting water is scattered due to the rotation of the cutting blade, for receiving the scattered cutting water and separating gas and liquid; The length of the top plate in the Y-axis direction is set to a size that satisfies the length by which the cutting blade is indexed in the Y-axis direction, so that the mist containing cutting chips collides with the top plate, causing the gas to float, and the water droplets containing cutting chips fall, separating the gas and liquid, and the floating gas is discharged from the machining chamber, so that the machining state can be confirmed through the transparent opening and closing door, and the problem of the inside of the machining chamber becoming dirty is eliminated. In addition, the mist containing cutting chips is prevented from being sucked in through the suction port, and the problem of the inside of the suction duct and the duct fan becoming dirty is also eliminated. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a perspective view of a cutting device according to the present invention. [Diagram 2] 2 is a schematic diagram showing a state in which a CSP substrate is placed on the chuck table shown in FIG. 1; [Diagram 3] FIG. 2 is a schematic diagram showing a top plate and the like in the cutting device shown in FIG. 1 . [Figure 4] 2 is a schematic diagram showing a bottom plate and the like in the cutting device shown in FIG. 1; [Diagram 5] FIG. 2 is a schematic diagram showing a cutting process being performed by the cutting device shown in FIG. 1 . [Figure 6] FIG. 2 is a perspective view of the cutting means shown in FIG. [Figure 7] FIG. 4 is a schematic diagram of the brushing means shown in FIG. 3 . DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, preferred embodiments of the cutting device according to the present invention will be described with reference to the drawings.

[0013] (Cutting device 2) Explaining with reference to Figures 1 and 2, the cutting device 2 includes a chuck table 6 that holds a plate-like object 4 (see Figure 2), cutting means 8 equipped with a spindle to which a cutting blade that cuts the plate-like object 4 held on the chuck table 6 is rotatably mounted, cutting water supplying means 10 that supplies cutting water to the cutting blade, X-axis feeding means (not shown) that feeds the chuck table 6 for cutting in the X-axis direction, and Y-axis feeding means (not shown) that indexes and feeds the cutting means 8 in the Y-axis direction perpendicular to the X-axis direction.

[0014] The X-axis direction is the direction indicated by the arrow X in Fig. 1, and the Y-axis direction is the direction indicated by the arrow Y in Fig. 1. The XY plane defined by the X-axis direction and the Y-axis direction is substantially horizontal. The Z-axis direction indicated by the arrow Z in Fig. 1 is the up-down direction perpendicular to the X-axis direction and the Y-axis direction.

[0015] (Plate 4) 2, the plate-like object 4 may be composed of, for example, a CSP substrate. The plate-like object 4 (CSP substrate) is partitioned into a plurality of rectangular regions by lattice-shaped planned division lines 12. Devices 14 are provided in the rectangular regions, and each device 14 is sealed with a sealing material that may be made of a synthetic resin such as epoxy resin. Furthermore, no devices 14 are provided in an outer peripheral region 16 of the plate-like object 4, and when the plate-like object 4 is cut into individual device chips 14, the outer peripheral region 16 of the plate-like object 4 becomes waste material.

[0016] (Chuck table 6) 2, the chuck table 6 is formed in a rectangular shape larger than the plate-like object 4. On the upper surface of the chuck table 6, relief grooves 18 for allowing the cutting blade of the cutting means 8 to escape are formed in a lattice pattern, and a plurality of rectangular areas 20 are partitioned by the relief grooves 18. The arrangement and number of the relief grooves 18 correspond to the arrangement and number of the planned division lines 12 of the plate-like object 4. In other words, the arrangement and number of the rectangular areas 20 of the chuck table 6 correspond to the arrangement and number of the devices 14 of the plate-like object 4.

[0017] Suction holes 22 are formed in the rectangular region 20 of the chuck table 6, penetrating in the vertical direction. The suction holes 22 are connected to a suction means (not shown) via a flow path. In the chuck table 6, the suction means generates a suction force in the suction holes 22, thereby suction-holding the plate-like object 4 before cutting and the plate-like object 4 after cutting (i.e., each divided device chip 14).

[0018] As shown in Fig. 3, the chuck table 6 is supported by a support table 24. An upwardly protruding rectangular support portion 26 is provided on the upper surface of the support table 24 (see Fig. 4), and the chuck table 6 is supported on the upper surface of the support portion 26. The support portion 26 is configured to be rotatable about the Z-axis direction. As shown in Fig. 4, a rectangular recess 28 is formed in the center of the support portion 26. A communication passage 30 is provided in the center of the recess 28, which communicates with the suction hole 22 of the chuck table 6 and is connected to the suction means.

[0019] (Cutting means 8) Explaining with reference to FIG. 5 and FIG. 6, the cutting means 8 includes a spindle housing 32 (see FIG. 6) extending in the Y-axis direction, a spindle 34 supported by the spindle housing 32 so as to be rotatable about the Y-axis direction, an annular cutting blade 36 fixed to one end of the spindle 34 in the Y-axis direction, and a blade cover 38 covering the cutting blade 36. A motor (not shown) for rotating the spindle 34 is connected to the other end of the spindle 34 in the Y-axis direction. The cutting blade 36 has an annular base 40 and an annular cutting blade 42 attached to the outer periphery of the base 40. The cutting blade 42 is formed to a predetermined thickness (for example, about 10 to 30 μm) from diamond abrasive grains and a binder such as metal or resin. The cutting means 8 cuts the plate-like object 4 held on the chuck table 6 by rotating the cutting blade 36 together with the spindle 34 at high speed (for example, 20,000 rpm) in the direction indicated by the arrow R1 by the motor.

[0020] (Cutting water supply means 10) As shown in FIG. 6, the cutting water supplying means 10 includes a pair of supply ports 44 provided at the top of the blade cover 38 and a pair of jet nozzles 46 (only one side is shown) provided at the bottom of the blade cover 38. Although not shown, the pair of supply ports 44 are connected to a water source via a pipe such as a tube. The pair of supply ports 44 are also connected to a pair of jet nozzles 46 via a flow path (not shown) in the blade cover 38. The pair of jet nozzles 46 are arranged at intervals in the Y-axis direction across the cutting blade 36. The jet nozzle 46 has a plurality of jet holes (not shown) formed at intervals in the X-axis direction. The cutting water supplying means 10 jets cutting water (e.g., pure water) supplied from a water source from the jet holes of the pair of jet nozzles 46 onto the cutting blade 36 and the plate-like object 4.

[0021] (X-axis feed means) The X-axis feed means has a ball screw that is connected to the support table 24 that supports the chuck table 6 and extends in the X-axis direction, and a motor that rotates the ball screw. The X-axis feed means converts the rotational motion of the motor into linear motion using the ball screw and transmits it to the support table 24 and the chuck table 6, thereby feeding the chuck table 6 for cutting in the X-axis direction.

[0022] Since the ball screw and the motor of the X-axis feed means are precision machine elements, it is necessary to protect the ball screw and the motor from cutting water sprayed during cutting and cutting chips generated during cutting. For this reason, as shown in Figs. 3 and 4, a first bellows cover 48 that can be freely extended and retracted in the X-axis direction is attached to one end of the support table 24 in the X-axis direction. Also, a second bellows cover 50 that can be freely extended and retracted in the X-axis direction is attached to the other end of the support table 24 in the X-axis direction. The first and second bellows covers 48, 50 extend and retract in accordance with the movement of the chuck table 6 in the X-axis direction. Also, the first and second bellows covers 48, 50 can be made of an appropriate foldable material such as a waterproof cloth.

[0023] (Y-axis feed means) The Y-axis feed means has a ball screw that is connected to the spindle housing 32 of the cutting means 8 and extends in the Y-axis direction, and a motor that rotates the ball screw. The Y-axis feed means converts the rotational motion of the motor into linear motion using the ball screw and transmits it to the cutting means 8, thereby indexing and feeding the cutting means 8 in the Y-axis direction.

[0024] (Z-axis feed means) Although not shown, the cutting device 2 includes a Z-axis feed means for feeding the cutting means 8 in the Z-axis direction. The Z-axis feed means has a ball screw connected to the spindle housing 32 of the cutting means 8 and extending in the Z-axis direction, and a motor for rotating the ball screw. The Z-axis feed means converts the rotational motion of the motor into linear motion by the ball screw and transmits it to the cutting means 8, thereby feeding the cutting means 8 in the Z-axis direction.

[0025] (Tabletop 52) As shown in FIG. 3 and FIG. 5, the cutting device 2 of the illustrated embodiment is provided with a top plate 52 that is disposed extending in the X-axis direction with a depression angle θ as seen from the cutting blade 36 side on the side where cutting water is scattered due to the rotation of the cutting blade 36, and that receives the scattered cutting water and separates gas and liquid. As described above, the cutting blade 36 rotates at high speed in the direction indicated by the arrow R1. Therefore, the cutting water that comes into contact with the cutting blade 36 during cutting is scattered to the left or upward in FIG. 5 (for example, in the direction indicated by the arrows A1-A4) and becomes mist-like. That is, during cutting, a large amount of mist of cutting water is generated. This makes it difficult to check the processing state from outside the cutting device 2 through the transparent opening and closing door. Therefore, in this embodiment, a top plate 52 is provided that receives the scattered cutting water and separates gas and liquid.

[0026] 5, the top plate 52 extends in the X-axis direction at an incline downward in a direction away from the cutting means 8. The length of the top plate 52 in the Y-axis direction is set to a size that satisfies the length by which the cutting blade 36 is indexed in the Y-axis direction. In other words, the length of the top plate 52 in the Y-axis direction is set to a length that is equal to or greater than the movable range of the cutting blade 36 in the Y-axis direction. The top plate 52 is also supported by an appropriate bracket (not shown).

[0027] During cutting, the mist of cutting water containing cutting chips collides with the top plate 52, causing the gas to float, and the water droplets containing the cutting chips fall from the top plate 52 after colliding with the top plate 52. In this way, the gas and liquid are separated.

[0028] As shown in FIG. 3, the top plate 52 of this embodiment has side walls 54 extending downward at both ends in the Y-axis direction. The side walls 54 prevent the mist of cutting water from rising from both ends in the Y-axis direction of the top plate 52. However, the side walls 54 do not necessarily have to be provided. The cutting means 8 and the chuck table 6 are surrounded by walls and a ceiling to prevent the cutting water from scattering outside the cutting device 2. In other words, the cutting means 8 and the chuck table 6 are disposed in a processing chamber 56 (see FIG. 1). For this reason, the walls of the processing chamber 56 can be used as the side walls 54 of the top plate 52. For convenience, FIG. 1 does not show all of the members (such as a transparent opening and closing door) that divide the processing chamber 56, and a part of the side wall of the processing chamber 56 is indicated by the reference symbol 56a.

[0029] As shown in FIG. 1 and FIG. 5, a suction port 58 for sucking in gas from which gas and liquid are separated in the processing chamber 56 is disposed above the top plate 52 in the side wall 56a of the processing chamber 56. The suction port 58 is connected to a suction means (not shown). During cutting, a suction force is generated at the suction port 58 by the suction means, and the gas from which gas and liquid are separated in the processing chamber 56 is sucked into the suction port 58 (see arrow B in FIG. 5), and the gas is discharged from the processing chamber 56. Note that the suction port 58 does not have to be within the range of the top plate 52 in the X-axis direction (the range indicated by arrow C) as long as it is above the top plate 52. For example, a suction port 58' may be provided at the position indicated by the imaginary line in FIG. 5.

[0030] (bottom plate 60) Explaining with reference to FIG. 3 and FIG. 4, the cutting device 2 of this embodiment is provided with a bottom plate 60 directly below the top plate 52, and the bottom plate 60 is disposed adjacent to the chuck table 6 and moves in the X-axis direction together with the chuck table 6. As described above, when the plate-like object 4 is cut into individual device chips 14, the outer peripheral region 16 of the plate-like object 4 becomes scrap material. In FIG. 5, the scrap material is indicated by the reference symbol 16. If the scrap material 16 scatters to the left side of FIG. 5 together with the cutting water and adheres to the second bellows cover 50, the scrap material 16 may bite into the second bellows cover 50 as the second bellows cover 50 expands and contracts, causing a hole in the second bellows cover 50. Therefore, in this embodiment, the bottom plate 60 is provided to protect the second bellows cover 50 from the scrap material 16 scattered together with the cutting water.

[0031] The bottom plate 60 may be formed of an appropriate synthetic resin sheet such as a polyethylene terephthalate (PET) sheet. As shown in Fig. 4, a connecting portion 60a is provided at one end of the bottom plate 60 in the X-axis direction. The connecting portion 60a is connected to the support table 24 by a screw 62. In other words, the bottom plate 60 is disposed adjacent to the chuck table 6.

[0032] (winding roller 64) The other end of the bottom plate 60 in the X-axis direction is wound around a winding roller 64. A motor (not shown) is attached to the winding roller 64. As the chuck table 6 moves in the X-axis direction and the second bellows cover 50 expands and contracts, the motor of the winding roller 64 rotates and the bottom plate 60 is wound around the winding roller 64 or pulled out from the winding roller 64. That is, the bottom plate 60 moves in the X-axis direction together with the chuck table 6. Note that a spring may be provided to bias the bottom plate 60 in the winding direction. In this case, the motor for rotating the winding roller 64 is not necessary.

[0033] (Roller bracket 66) The take-up roller 64 is rotatably supported by a roller bracket 66. The position of the roller bracket 66 is fixed, and the roller bracket 66 does not move even if the chuck table 6 moves. As shown in Fig. 4, the roller bracket 66 has a cross section (a surface transverse to the Z-axis direction) formed in a U-shape. The roller bracket 66 includes a main portion 68 extending in the Y-axis direction, and support portions 70 protruding in the X-axis direction from both end portions of the main portion 68 in the Y-axis direction.

[0034] The main portion 68 of the roller bracket 66 is connected to one end of the second bellows cover 50 in the X-axis direction by a screw 72. A guide means for guiding the bottom plate 60 to the take-up roller 64 is provided at the upper end of the main portion 68. The guide means in the illustrated embodiment are a plurality of protrusions 74 that protrude upward from the upper end of the main portion 68 at intervals in the Y-axis direction. However, the guide means may also be a roller provided to be rotatable about the Y-axis direction.

[0035] The winding roller 64 is rotatably supported on the support portion 70 of the roller bracket 66. As shown in Figs. 4 and 7, the support portion 70 of this embodiment is provided with a brushing means 76 for removing the scraps 16 from the bottom plate 60. The brushing means 76 has a wiper plate 78 that contacts the surface of the bottom plate 60 just before the bottom plate 60 is taken up by the take-up roller 64. The wiper plate 78 can be made of an appropriate synthetic resin sheet such as a polyethylene terephthalate sheet (PET). In the brushing means 76, the wiper plate 78 removes the scraps 16 and cutting chips adhering to the bottom plate 60 from the bottom plate 60 just before the bottom plate 60 is taken up by the take-up roller 64.

[0036] (Means for recovering scraps 80) In the cutting device 2 of this embodiment, as shown in FIG. 3, a scrap material collecting means 80 is provided for collecting scrap material 16 generated when cutting the plate-like object 4. The scrap material collecting means 80 includes a hollow rectangular parallelepiped main body 82 and a trash can 84 installed inside the main body 82 so as to be freely inserted and removed. A discharge port 86a is formed in a lower plate 86 of the main body 82, and a drain hose 88 is attached to the discharge port 86a. A lower plate 90 of the trash can 84 is in a net shape having a number of openings. In addition, a side wall 92 of the trash can 84 is provided with a handle 94 for inserting and removing the trash can 84 inside the main body 82. In the scrap material collecting means 80, the scrap material 16 and cutting chips brushed off from the bottom plate 60 by the brushing means 76 are collected by the trash can 84, and cutting water is discharged to the outside from the drain hose 88.

[0037] As shown in FIG. 1, the cutting apparatus 2 further includes an imaging means 96 for imaging the plate-like object 4 held on the chuck table 6, a cassette stage 100 which can be raised and lowered and on which a cassette 98 containing a plurality of the plate-like objects 4 before cutting is placed, a conveying means 104 for pulling out the plate-like object 4 before cutting from the cassette 98 and conveying it to the temporary placement table 102, a first conveying means 106 for conveying the plate-like object 4 before cutting conveyed to the temporary placement table 102 to the chuck table 6, a cleaning means 108 for cleaning the cut device chip 14, and a second conveying means 110 for conveying the cut device chip 14 from the chuck table 6 to the cleaning means 108.

[0038] A plurality of suction holes (not shown) for suctioning all of the cut device chips 14 are provided on the underside of the suction piece 112 of the second transport means 110. Although not shown, the cleaning means 108 is also provided with a spinner table having a plurality of suction holes for suctioning all of the cut device chips 14.

[0039] Next, a cutting method for cutting the plate-like object 4 using the above-mentioned cutting device 2 will be described.

[0040] (holding process) In this embodiment, first, a holding step is performed in which the plate-like object 4 is transported from the cassette 98 to the chuck table 6 and the plate-like object 4 is held on the chuck table 6. In the holding step, the uncut plate-like object 4 is first transported from the cassette 98 to the temporary placement table 102 by the transport means 104. Next, the plate-like object 4 is transported from the temporary placement table 102 to the chuck table 6 positioned at the transfer position (the position shown in FIG. 1) by the first transport means 106, and the plate-like object 4 is placed on the upper surface of the chuck table 6. At this time, the plate-like object 4 is placed on the chuck table 6 with the planned division line 12 of the plate-like object 4 aligned with the relief groove 18 of the chuck table 6. Next, a suction force is generated in the suction holes 22 of the chuck table 6, and the plate-like object 4 is suction-held on the chuck table 6.

[0041] (splitting process) After the holding step is performed, a dividing step is performed in which the plate-like object 4 is cut by the cutting blade 36 of the cutting means 8 and divided into individual device chips 14. In the dividing step, first, the plate-like object 4 is positioned directly under the imaging means 96 by the X-axis feed means, and the image of the plate-like object 4 is taken by the imaging means 96. Next, the chuck table 6 is rotated based on the image of the plate-like object 4 taken by the imaging means 96, thereby adjusting the orientation of the plate-like object 4 and aligning the planned division line 12 with the X-axis direction.

[0042] After adjusting the orientation of the plate-like object 4, the chuck table 6 is moved below the cutting means 8 by the X-axis feed means. Next, the cutting blade 36 is rotated in the direction shown by the arrow R1 in Fig. 5. Next, the cutting means 8 is lowered by the Z-axis feed means to cause the cutting edge 42 of the cutting blade 36 to cut from the upper surface to the lower surface of the plate-like object 4, and the chuck table 6 is fed for cutting in the X-axis direction by the X-axis feed means while cutting water is supplied from the injection nozzle 46 of the cutting water supply means 10 to the cutting blade 36 and the plate-like object 4. In this way, cutting is performed along the intended division lines 12.

[0043] Then, the cutting blade 36 is indexed and fed by the Y-axis feed means in the Y-axis direction by the interval of the division lines 12, and the cutting process is repeated to cut the plate-like object 4 along all of the division lines 12 aligned in the X-axis direction. Furthermore, the chuck table 6 is rotated 90 degrees, and the cutting process and indexing are repeated to cut the plate-like object 4 along all of the division lines 12 perpendicular to the division lines 12 previously cut. This allows the plate-like object 4 to be divided into individual device chips 14. As described above, the arrangement and number of the rectangular areas 20 of the chuck table 6 in which the suction holes 22 are formed correspond to the arrangement and number of the devices 14 of the plate-like object 4, so that even after the cutting process, all of the device chips 14 are maintained in a state of being sucked and held by the chuck table 6.

[0044] In the dividing process, the cutting water is scattered and a large amount of mist is generated, but the mist containing the cutting chips is separated into gas and liquid by the top plate 52. That is, the mist containing the cutting chips collides with the top plate 52, and the gas floats, and is sucked into the suction port 58 as shown by the arrow B in FIG. 3, and is discharged from the processing chamber 56. On the other hand, the water droplets containing the cutting chips fall from the top plate 52 onto the upper surface of the bottom plate 60 after colliding with the top plate 52. The scraps 16 generated in the dividing process also fall onto the upper surface of the bottom plate 60. As described above, the bottom plate 60 moves in the X-axis direction together with the chuck table 6, so that the cutting water and the scraps 16 are carried by the bottom plate 60 toward the scrap collection means 80. Then, when they are carried to the vicinity of the winding roller 64, the cutting water and the scraps 16 are brushed off from the bottom plate 60 by the action of the brushing means 76, and are stored in the trash can 84 of the scrap collection means 80. The cutting water also passes through the mesh bottom plate 90 of the trash can 84 and is discharged through the drain hose 88.

[0045] (Cleaning process) After the dividing step is performed, the divided device chips 14 are transferred to the cleaning means 108 by the second transfer means 110, and a cleaning step is performed in which the divided device chips 14 are cleaned in the cleaning means 108. Then, after the cleaning step is performed, although not shown, all of the divided device chips 14 are transferred outside the cutting device 2 by a transfer means having an adsorbing piece capable of adsorbing, and a pick-up step is performed in which each device chip 14 is picked up.

[0046] As described above, in this embodiment, the mist containing cutting chips collides with the top plate 52, the gas floats, and the water droplets containing the cutting chips fall, separating the gas and liquid, and the floating gas is discharged from the machining chamber 56, so that the machining state can be confirmed through the transparent opening and closing door, and the problem of the inside of the machining chamber 56 becoming dirty is eliminated. In addition, the mist containing cutting chips is prevented from being sucked in through the suction port 58, and the problem of the inside of the suction duct and the duct fan becoming dirty is also eliminated. [Explanation of symbols]

[0047] 2:Cutting device 4: Plate-shaped object 6: Chuck table 8: Cutting means 10: Cutting water supply means 16: Outer periphery, scrap material 34: Spindle 36: Cutting blade 52: Tabletop 56: Processing room 56a: Part of the side wall of the processing chamber 58: Suction port 60: Bottom plate 80: Scrap material recovery method

Claims

1. A cutting device for cutting a plate-shaped object, the cutting means including a chuck table for holding a plate-like object, a cutting means having a spindle to which a cutting blade for cutting the plate-like object held on the chuck table is rotatably mounted, a cutting water supplying means for supplying cutting water to the cutting blade, an X-axis feeding means for feeding the chuck table in the X-axis direction for cutting, and a Y-axis feeding means for indexing and feeding the cutting means in the Y-axis direction perpendicular to the X-axis direction, a top plate extending in the X-axis direction at a depression angle as viewed from the cutting blade on the side where cutting water is scattered due to the rotation of the cutting blade, for receiving the scattered cutting water and separating gas and liquid; A cutting device in which the length of the top plate in the Y-axis direction is set to a size that satisfies the length by which the cutting blade is indexed and fed in the Y-axis direction.

2. 2. The cutting device according to claim 1, wherein said chuck table and said cutting means are disposed in a machining chamber, and a suction port for sucking gas from which gas and liquid have been separated in said machining chamber is disposed in a side wall of said machining chamber above said top plate.

3. 2. The cutting device according to claim 1, further comprising a bottom plate disposed immediately below said top plate, said bottom plate being disposed adjacent to said chuck table and movable together with said chuck table in the X-axis direction.

4. 2. The cutting device according to claim 1, further comprising scrap recovery means for recovering scraps generated when cutting a plate-like workpiece.

Images