Thermosetting maleimide resin composition

Abstract

To provide a thermosetting maleimide resin composition giving a cured product which has high adhesive force to a copper foil while having excellent dielectric characteristics and can maintain high adhesive force even after high-temperature storage or high-temperature and high-humidity storage.SOLUTION: The thermosetting maleimide resin composition contains: (A) a maleimide compound represented by the following formula (1); (B) a heterocyclic compound containing a nitrogen atom; (C) a thermosetting resin excluding maleimide; and (D) a curing accelerator. (In the formula (1), A is independently a tetravalent organic group having a cyclic structure; B is independently a C6-200 divalent hydrocarbon group, and at least one of which is a hydrocarbon group derived from a dimer acid skeleton; and n is 0-200.)SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to a thermosetting maleimide resin composition. [Background technology]

[0002] In recent years, the next generation mobile communication system known as 5G has been spreading, aiming to realize high speed, large capacity, and low latency communication. To realize this, materials for high frequency bands are required, and reduction of transmission loss is essential as a noise countermeasure. For this reason, there is a demand for the development of insulating materials with excellent dielectric properties such as low relative permittivity and low dielectric tangent. The main properties required for insulating materials with excellent dielectric properties for high frequency bands include, for example, high peel strength, low water absorption, low thermal expansion coefficient, and heat resistance.

[0003] As materials for high frequency bands, especially for circuit board applications, insulating materials with excellent dielectric properties are required. Circuit boards such as rigid printed circuit boards (RPC) and flexible printed circuit boards (FPC) require insulating materials with excellent dielectric properties. Materials used include reactive polyphenylene ether resin (PPE), liquid crystal polymer (LCP), and modified polyimide (MPI) with improved properties.

[0004] When manufacturing the above FPC, an adhesive is required to attach the base film and coverlay film to the surface having the wiring portion by using a heat press, etc. Traditionally, adhesives that mainly use epoxy resins have been used, but recently there has been a demand for adhesives with excellent dielectric properties.

[0005] In light of this background, adhesives with excellent dielectric properties have been reported (for example, Patent Documents 1 to 4). Many of these are compositions of epoxy resins and other thermosetting and thermoplastic resins, and have excellent dielectric properties in the frequency range of 10 GHz or less. However, 5G is also required to have dielectric properties in the frequency range of 28 GHz or more, known as millimeter waves. Therefore, none of the conventional adhesives that have been said to have excellent dielectric properties at present have sufficient dielectric properties.

[0006] In addition, a resin composition containing a special maleimide compound and a thermoplastic resin has been disclosed as a composition having excellent high-frequency characteristics and adhesion to conductors (Patent Document 5). However, this resin composition has low heat resistance because it contains a thermoplastic elastomer, and may not be able to withstand reliability tests such as high-temperature and high-humidity storage. With regard to adhesion, it is also important that the composition does not peel off from the copper foil for a long period of time.

[0007] In addition, compositions containing a maleimide compound and a heterocyclic compound have also been reported (for example, Patent Documents 6 to 8). Although these compositions have shown good results in temperature cycle tests and heat resistance tests, there is no description of their dielectric properties, and they cannot be said to have the dielectric properties (low relative dielectric constant and low dielectric loss tangent) required in the high frequency range.

[0008] Furthermore, compositions using specific maleimide compounds have also been reported (for example, Patent Documents 9 and 10). These compositions have dielectric properties (low relative dielectric constant, low dielectric tangent) and high adhesiveness, but there is no description regarding the adhesiveness after storage at high temperature and high humidity, leaving a need for improvement. [Prior art documents] [Patent documents]

[0009] [Patent Document 1] JP 2008-248141 A [Patent Document 2] JP 2011-68713 A [Patent Document 3] International Publication No. 2016-17473 [Patent Document 4] JP 2016-79354 A [Patent Document 5] International Publication No. 2018-16489 [Patent Document 6] JP 2018-115233 A [Patent Document 7] JP 2017-110051 A [Patent Document 8] JP 2005-89659 A [Patent Document 9] JP 2021-127438 A [Patent Document 10] JP 2022-149589 A Summary of the Invention [Problem to be solved by the invention]

[0010] The present invention aims to provide a thermosetting maleimide resin composition which gives a cured product having excellent dielectric properties (low dielectric constant and low dielectric tangent) and high adhesive strength to copper foil, and which is capable of retaining high adhesive strength even after storage at high temperature or high temperature and high humidity. [Means for solving the problem]

[0011] Means for Solving the Problems The present inventors have conducted intensive research to solve the above problems and have found that the following thermosetting maleimide resin composition can achieve the above object, thereby completing the present invention. Specifically, the present invention provides the following thermosetting maleimide resin composition. [1] (A) a maleimide compound represented by the following formula (1): 100 parts by mass, (B) a heterocyclic compound containing a nitrogen atom: 0.1 to 20 parts by mass, (C) a thermosetting resin other than maleimide: 0.5 to 50 parts by mass, and (D) Curing accelerator: 0.1 to 10 parts by mass 1. A thermosetting maleimide resin composition comprising: [ka] (In formula (1), A is independently a tetravalent organic group having a cyclic structure, B is independently a divalent hydrocarbon group having 6 to 200 carbon atoms, at least one of which is a hydrocarbon group derived from a dimer acid skeleton, n is 0 to 200, the repeating units bracketed by n may be the same or different, the order thereof is not limited, and the bonding mode may be alternate, block, or random.) [2] The thermosetting maleimide resin composition according to [1], wherein A in formula (1) is any of the tetravalent organic groups represented by the following structural formulas: [ka] (The bond not bonded to a substituent in the above structural formula is bonded to the carbonyl carbon that forms a cyclic imide structure in formula (1).) [3] The thermosetting maleimide resin composition according to [1] or [2], wherein component (C) is a thermosetting resin having one or more functional groups selected from an amino group, a carboxyl group, an epoxy group, a methacryl group, an acrylic group, a styryl group, and an alkenyl group. [4] The component (B) is represented by the following formula (3): [ka] (In formula (3), R 2 is a hydrogen atom or a group represented by the following formula (4): [ka] (In formula (4), R 3 are independently an alkyl group having 1 to 6 carbon atoms, o is an integer of 2 to 10, p is an integer of 1 to 3, and * represents a bond. The thermosetting maleimide resin composition according to any one of [1] to [3], wherein the heterocyclic compound has a 1,2,3-benzotriazole ring and is represented by the following formula: The present invention also provides an uncured resin film, a cured resin film, a bonding sheet, a build-up film, an adhesive, a solder resist, a resist, an encapsulant, a prepreg, and a substrate, each of which contains the thermosetting maleimide resin composition according to any one of the above [1] to [4]. Effect of the Invention

[0012] The thermosetting maleimide resin composition of the present invention is excellent in dielectric properties (low dielectric constant and low dielectric tangent) and gives a cured product with excellent adhesive strength to copper foil, and in particular maintains high adhesive strength after curing even after storage at high temperature or high temperature and high humidity. Therefore, the thermosetting maleimide resin composition of the present invention is useful as an adhesive, particularly for copper foil. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] The present invention will now be described in more detail.

[0014] [(A) Maleimide compound] The component (A) used in the present invention is a maleimide compound having a specific structure represented by the following formula (1).

[0015] [ka] (In formula (1), A is independently a tetravalent organic group having a cyclic structure, B is independently a divalent hydrocarbon group having 6 to 200 carbon atoms, at least one of which is a hydrocarbon group derived from a dimer acid skeleton, n is 0 to 200, the repeating units bracketed by n may be the same or different, the order thereof is not limited, and the bonding mode may be alternate, block, or random.)

[0016] The component (A) is a thermosetting resin, and the composition of the present invention containing the component (A) forms a cured product with good heat resistance, mechanical properties, and adhesive properties, and is highly reliable. In addition, the component (A) has good dielectric properties because it has a dimer acid skeleton. Therefore, the composition shows excellent dielectric properties.

[0017] The organic group represented by A in formula (1) is independently a tetravalent organic group having a cyclic structure, and is particularly preferably any of the tetravalent organic groups represented by the following structural formulas. [ka] The bond not bonded to a substituent in the above structural formula is bonded to the carbonyl carbon that forms a cyclic imide structure in formula (1).

[0018] In formula (1), B is independently a divalent hydrocarbon group having 6 to 200 carbon atoms. Examples of B include a hydrocarbon group derived from a dimer acid skeleton, an alkylene group, an alicyclic hydrocarbon group, and an aromatic group, each having 6 to 200 carbon atoms, and is preferably a hydrocarbon group derived from a dimer acid skeleton.

[0019] Dimer acid is a liquid fatty acid mainly composed of a dicarboxylic acid with 36 carbon atoms, produced by dimerization of unsaturated fatty acids with 18 carbon atoms, which are derived from natural products such as vegetable oils. Dimer acids do not have a single skeleton, but rather have multiple structures, and there are several types of isomers. Representative dimer acids are classified into linear (a), monocyclic (b), aromatic (c), and polycyclic (d) types, as shown in the formula below. Generally, dimer acids may contain trimers (trimer acids). However, it is preferable that the proportion of the hydrocarbon groups derived from dimer acids among the hydrocarbon groups derived from dimer acids and trimer acids is high, for example, 95 mass% or more, because this tends to result in excellent dielectric properties, excellent moldability due to a tendency for the viscosity to decrease when heated, and reduced effects of moisture absorption. [ka]

[0020] In this specification, the dimer acid skeleton refers to a group derived from a dimer diamine having a structure in which the carboxy groups of such a dimer acid are substituted with primary aminomethyl groups. Examples of the hydrocarbon group derived from the dimer acid skeleton include, but are not limited to, groups in which the two carboxy groups in each of the formulas (a) to (d) above are substituted with aminomethyl groups. As described above, the dimer acid skeleton has a plurality of structures, and therefore, in this specification, the hydrocarbon group derived from the dimer acid skeleton is referred to as the average structure, i.e., -C 36 H 70 It may be written as -. Furthermore, from the viewpoint of the heat resistance and reliability of the cured product, it is more preferable that the hydrocarbon group derived from the dimer acid skeleton of the component (A) has a structure in which the carbon-carbon double bonds in the hydrocarbon group derived from the dimer acid skeleton are reduced by a hydrogenation reaction.

[0021] In the formula (1), n ​​is an integer of 0 to 200, and preferably 0 to 100.

[0022] If component (A) is not included, the adhesiveness and dielectric properties of the composition will deteriorate. In addition, the solubility in solvents will decrease, causing turbidity and separation when made into a varnish. This may result in unevenness in the composition, which may cause variations in the properties of the composition. The component (A) is contained in the composition of the present invention in an amount of preferably 1 to 99 mass %, and more preferably 5 to 95 mass %. The component (A) may use either a single type alone, or a combination of two or more types.

[0023] [(B) Heterocyclic compounds containing nitrogen atoms] The component (B) used in the present invention is a heterocyclic compound containing a nitrogen atom, and preferably a heterocyclic compound in which at least one of the atoms constituting the heterocycle is a nitrogen atom, but excludes the maleimide compound of the component (A). By incorporating component (B), the composition of the present invention can improve adhesion to copper foil and can retain adhesion after storage at high temperature and high humidity, as well as after storage at high temperature.

[0024] The nitrogen atom-containing heterocycle may be a single ring or a multiple ring. Examples of the single ring include five-membered rings such as pyrrole ring, imidazole ring, pyrazole ring, and triazole ring, and six-membered rings such as pyridine ring, pyrimidine ring, and triazine ring. Examples of the multiple ring include indole ring, benzimidazole ring, benzotriazole ring, quinoline ring, bipyridyl ring, and phenanthroline ring.

[0025] The component (B) is preferably a heterocyclic compound having a 1,2,3-benzotriazole ring, as represented by the following formula (3). [ka] (In formula (3), R 2 is a hydrogen atom or a group represented by the following formula (4): [ka] (In formula (4), R 3 are independently an alkyl group having 1 to 6 carbon atoms, o is an integer of 2 to 10, p is an integer of 1 to 3, and * represents a bond.

[0026] In formula (4), R 3 Examples of the alkyl group having 1 to 6 carbon atoms include a methyl group, an ethyl group, a propyl group, an isopropyl group, a butyl group, an isobutyl group, a tert-butyl group, a pentyl group, a neopentyl group, and a hexyl group. 3 is preferably a methyl group or an ethyl group.

[0027] The blending amount of component (B) is 0.1 to 20 parts by mass, and preferably 0.2 to 10 parts by mass, per 100 parts by mass of component (A). Within this range, the adhesive strength can be improved without deteriorating the dielectric properties.

[0028] [(C) Thermosetting resin] The component (C) used in the present invention is a thermosetting resin other than maleimide. By blending the component (C), the composition of the present invention can have improved curability and heat resistance.

[0029] The thermosetting resin preferably has one or more thermosetting functional groups selected from an amino group, a carboxyl group, an epoxy group, a methacryl group, an acrylic group, a styryl group, and an alkenyl group (excluding the maleimide compound corresponding to component (A)). Examples of the thermosetting resin include amine resin, styrene resin, methacrylic resin, acrylic resin, allyl resin, benzoxazine resin, phenol resin, cyanate resin, epoxy resin, polyphenylene ether resin, melamine resin, and silicone resin. Among them, epoxy resin, polyphenylene ether resin, and allyl resin are preferable. These thermosetting resins may have the thermosetting functional group in the resin skeleton, or may be modified by the thermosetting functional group. In addition, the (C) component may be used alone or in combination of two or more. The blend amount of component (C) is 0.5 to 50 parts by mass, and preferably 1 to 30 parts by mass, per 100 parts by mass of component (A). If it is within this range, curability and heat resistance are improved.

[0030] [(D) Curing accelerator] The component (D) used in the present invention is a curing accelerator. The curing accelerator, component (D), is added mainly to accelerate the curing reaction caused by crosslinking between the maleimide compound, component (A), and the thermosetting resin, component (C). The curing accelerator is not particularly limited, but is preferably one or more compounds selected from organic peroxides, imidazole compounds, phosphorus compounds, and amine compounds.

[0031] Specific examples of organic peroxides include dicumyl peroxide, di-tert-butyl peroxide, 2,5-dimethyl-2,5-di-(tert-butylperoxy)hexane, 2,5-dimethyl-2,5-di(tert-butylperoxy)hexyne-3, 1,3-bis(tert-butylperoxyisopropyl)benzene, 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane, n-butyl-4,4-bis(tert-butylperoxy)valerate, benzoyl peroxide, p-chlorobenzoyl peroxide, 2,4-dichlorobenzoyl peroxide, tert-butyl peroxybenzoate, tert-butylperoxyisopropyl carbonate, diacetyl peroxide, lauroyl peroxide, and tert-butylcumyl peroxide.

[0032] Specific examples of the imidazole compound include imidazole, 2-methylimidazole, 2-ethylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, and imidazoles having a diaminotriazine ring such as 2,4-diamino-6-[2'-methylimidazolyl-(1')]-ethyl-s-triazine.

[0033] Specific examples of phosphorus compounds include tributylphosphine, tri(p-methylphenyl)phosphine, tri(nonylphenyl)phosphine, triphenylphosphine, triphenylphosphine·triphenylborane, and tetraphenylphosphine·tetraphenylborate.

[0034] Specific examples of the amine compound include triethylamine, benzyldimethylamine, α-methylbenzyldimethylamine, 1,8-diazabicyclo[5.4.0]undecene, and tris(dimethylaminomethyl)phenol.

[0035] The blend amount of component (D) is 0.1 to 10 parts by mass, and preferably 0.2 to 5 parts by mass, per 100 parts by mass of component (A). Within this range, both curability and storage stability can be achieved, and low dielectric properties can be maintained.

[0036] [Other additives] The thermosetting maleimide resin composition of the present invention may further contain various additives as necessary within a range that does not impair the effects of the present invention. Examples of such additives include inorganic fillers such as silica, alumina, and boron nitride, resin powders such as PTFE powder, metal particles such as silver, organopolysiloxanes having reactive functional groups, non-functional silicone oils, thermoplastic resins, thermoplastic elastomers other than styrene-based, organic synthetic rubbers, photosensitizers, light stabilizers, polymerization inhibitors, flame retardants, pigments, dyes, and the like. In order to improve the electrical properties of the cured product of the thermosetting maleimide resin composition, an ion trapping agent or the like may be added as other additives. Furthermore, as other additives, maleimide resins, polyimide resins, and polyamideimide resins other than the (A) component may be added to the thermosetting maleimide resin composition of the present invention within a range that does not impair the effects of the present invention. The amount of other additives to be added is determined appropriately depending on the type of additive. For example, when an inorganic filler is added, the amount is preferably 1 to 1,000 parts by mass, more preferably 10 to 500 parts by mass, and even more preferably 20 to 300 parts by mass, per 100 parts by mass of component (A).

[0037] The thermosetting maleimide resin composition of the present invention can be produced by mixing the components (A), (B), (C), and (D), and, if necessary, other additives. The thermosetting maleimide resin composition of the present invention can be dissolved in an organic solvent and treated as a varnish. The thermosetting maleimide resin composition can be easily molded into a sheet or film by forming it into a varnish. The organic solvent can be used without any restrictions as long as it dissolves the components (A) and (C). As the organic solvent, for example, toluene, xylene, anisole, cyclohexanone, cyclopentanone, etc. can be suitably used. The above organic solvents may be used alone or in combination of two or more kinds. The concentration of the thermosetting maleimide resin composition of the present invention in the varnish is preferably 5 to 80% by mass, more preferably 10 to 75% by mass.

[0038] This thermosetting maleimide resin composition can be suitably used mainly as an adhesive, a primer, a bonding film or sheet material for a substrate, a sealing material, an adhesive layer of a coverlay film for an FPC, or a flexible flat cable. There are no limitations on the method or form of use. For example, it can be used as an uncured resin film or a cured resin film, or as an adhesive. Examples of use are shown below, but are not limited thereto.

[0039] For example, a thermosetting maleimide resin composition (varnish) dissolved in an organic solvent is applied to a support sheet, and then the organic solvent is removed by heating for 0.5 to 5 hours at a temperature of usually 80°C or higher, preferably 100°C or higher, to obtain an uncured film- or sheet-shaped composition. As the support sheet, a commonly used one can be used. For example, polyolefin resins such as polyethylene (PE) resin, polypropylene (PP) resin, and polystyrene (PS) resin, and polyester resins such as polyethylene terephthalate (PET) resin, polybutylene terephthalate (PBT) resin, and polycarbonate (PC) resin can be used. The surface of these support sheets may be subjected to a release treatment. The method of applying the varnish is not particularly limited, and examples of the method include a gap coater, a curtain coater, a roll coater, and a laminator. The thickness of the coating layer is not particularly limited, but the thickness after distilling off the solvent is in the range of 1 to 100 μm, preferably 3 to 80 μm. Furthermore, a cover film may be used on the coating layer. The uncured resin film or uncured resin sheet thus produced can be suitably used for prepregs and the like.

[0040] Moreover, a copper foil can be attached onto the coating layer to use it as a substrate material.

[0041] Furthermore, the varnish can be used as an adhesive by applying the varnish to a substrate, heating it for 0.5 to 5 hours at a temperature of usually 80° C. or higher, preferably 100° C. or higher, to remove the organic solvent, pressing the material to be bonded to the substrate while heating, and heating it for 0.5 to 10 hours at a temperature of 130° C. or higher, preferably 150° C. or higher. Examples of application methods include, but are not limited to, a spin coater, a slit coater, a spray, a dip coater, a bar coater, and the like. EXAMPLES

[0042] The present invention will be specifically described below with reference to examples and comparative examples, but the present invention is not limited to the following examples.

[0043] (A) Maleimide compound (A-1): A bismaleimide compound represented by the following formula (SLK-3000, manufactured by Shin-Etsu Chemical Co., Ltd.) [ka] -C 36 H 70 - represents a hydrocarbon group derived from a dimer acid skeleton. (A-2): Bismaleimide compound represented by the following formula (SLK-1500, manufactured by Shin-Etsu Chemical Co., Ltd.) [ka] -C 36 H 70 - represents a hydrocarbon group derived from a dimer acid skeleton. (A-3): Bismaleimide compound represented by the following formula (SLK-6895, manufactured by Shin-Etsu Chemical Co., Ltd.) [ka] -C 36 H 70 - represents a hydrocarbon group derived from a dimer acid skeleton. (A-4): 4,4'-diphenylmethane bismaleimide (BMI-1000, manufactured by Daiwa Chemical Industry Co., Ltd., for comparison)

[0044] (B) Heterocyclic compounds containing nitrogen (B-1) 1,2,3-benzotriazole (Tokyo Chemical Industry Co., Ltd.) (B-2) A silane coupling agent having a 1,2,3-benzotriazole ring represented by the following formula (manufactured by Shin-Etsu Chemical Co., Ltd.) [ka]

[0045] (C) Thermosetting resin (C-1) Triallyl isocyanurate (TAIC, manufactured by Mitsubishi Chemical Corporation) (C-2) Styrene-terminated polyphenylene ether resin (OPE-2St-1200, manufactured by Mitsubishi Gas Chemical Co., Inc.) (C-3) Polyphenylene ether modified with methacrylic end groups (SA9000, manufactured by SABIC Corporation) (C-4) Biphenyl aralkyl type epoxy resin (NC-3000, manufactured by Nippon Kayaku Co., Ltd.)

[0046] (D) Curing accelerator (D-1) Dicumyl peroxide (Percumyl D, NOF Corp.) (D-2) 2-Ethyl-4-methylimidazole (2E4MZ, manufactured by Shikoku Kasei Holdings Co., Ltd.)

[0047] (E) Inorganic filler (E-1) Fused spherical silica (SO-25R, manufactured by Admatechs Co., Ltd., average particle size 0.5 μm) treated with a methacrylic group-modified silane coupling agent (KBM-503, manufactured by Shin-Etsu Chemical Co., Ltd.)

[0048] [Examples 1 to 8, Comparative Examples 1 to 3] The components were dissolved and dispersed in toluene in the proportions (parts by mass) shown in Table 1, and the non-volatile content was adjusted to 60% by mass to obtain a varnish of a resin composition. [Table 1] (Note 1) A silane coupling agent containing a 1,2,3-benzotriazole ring as shown above.

[0049] <Preparation of uncured resin film> The varnish of the thermosetting maleimide resin composition prepared above was applied to a 38 μm thick PET film using a roller coater so that the thickness after drying would be 50 μm, and then dried at 120° C. for 10 minutes to obtain an uncured resin film.

[0050] <Dielectric constant, dielectric loss tangent> The uncured resin film was cured at 180° C. for 2 hours, and the resulting resin film was cut to prepare a 60 mm×60 mm test piece. The dielectric constant and dielectric loss tangent of the obtained test piece at 25° C. and 28 GHz were measured using an SPDR dielectric resonator (MS46122B, manufactured by Anritsu Corporation).

[0051] <Adhesiveness> The thermosetting resin composition of the present application was applied to a copper foil of 10 mm x 10 mm, and after drying, a silicon chip of 2 mm x 2 mm was placed on the copper foil. The resin composition was then cured under the above-mentioned curing conditions to prepare an adhesive test piece. The shear adhesive strength of this test piece was measured at room temperature (25°C) using a bond tester DAGE-SERIES-4000PXY (manufactured by DAGE).

[0052] <Adhesion strength after storage at high temperature and high humidity> The prepared adhesive test pieces were stored at 85°C and 85% RH for 100 hours, and then the shear adhesive strength was measured at room temperature (25°C) using a bond tester DAGE-SERIES-4000PXY (manufactured by DAGE). The adhesive strength retention rate after moisture absorption was calculated from the shear adhesive strength before and after storage at high temperature and high humidity.

[0053] The evaluation results are shown in Table 2.

[0054] [Table 2]

[0055] From the above results, the thermosetting maleimide resin composition of the present invention has excellent dielectric properties after curing and exhibits high adhesive strength to metals and organic resins even after storage at high temperature and high humidity, and therefore, its usefulness as a thermosetting resin composition has been confirmed.

Claims

1. (A) a maleimide compound represented by the following formula (1): 100 parts by mass, (B) a heterocyclic compound containing a nitrogen atom: 0.1 to 20 parts by mass, (C) a thermosetting resin other than maleimide: 0.5 to 50 parts by mass, and (D) Curing accelerator: 0.1 to 10 parts by mass 1. A thermosetting maleimide resin composition comprising: 【Chemistry 1】 (In formula (1), A is independently a tetravalent organic group having a cyclic structure, B is independently a divalent hydrocarbon group having 6 to 200 carbon atoms, at least one of which is a hydrocarbon group derived from a dimer acid skeleton, n is 0 to 200, the repeating units bracketed by n may be the same or different, the order thereof is not limited, and the bonding mode may be alternate, block, or random.)

2. 2. The thermosetting maleimide resin composition according to claim 1, wherein A in formula (1) is any one of tetravalent organic groups represented by the following structural formulas: 【Chemistry 2】 (The bond not bonded to a substituent in the above structural formula is bonded to the carbonyl carbon that forms a cyclic imide structure in formula (1).)

3. 2. The thermosetting maleimide resin composition according to claim 1, wherein the component (C) is a thermosetting resin having one or more functional groups selected from an amino group, a carboxyl group, an epoxy group, a methacryl group, an acrylic group, a styryl group, and an alkenyl group.

4. The component (B) is represented by the following formula (3): 【Chemistry 3】 (In formula (3), R 2 is a hydrogen atom or a group represented by the following formula (4): 【Chemistry 4】 (In formula (4), R 3 are independently an alkyl group having 1 to 6 carbon atoms, o is an integer of 2 to 10, p is an integer of 1 to 3, and * indicates a bond.

2. The thermosetting maleimide resin composition according to claim 1, wherein the maleimide resin is a heterocyclic compound having a 1,2,3-benzotriazole ring represented by the following formula:

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