Processing liquid supplying apparatus, substrate processing apparatus, and processing liquid supplying method

By using main storage-tank and mixing section in the treatment liquid supply equipment, and stably supplying chemical solutions and diluents with the first and second circulation systems, the problem of degradation in the quality of the treatment liquid caused by inaccurate flow rate adjustment is solved, and the stable supply and cost reduction of high-quality treatment liquid is achieved.

JP2025072871APending Publication Date: 2025-05-12SCREEN HOLDINGS CO LTD
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Patent Information

Application Number
JP2023183296
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-10-25
Publication Date
2025-05-12

AI Technical Summary

Technical Problem

In the prior art, when mixing chemical solutions and diluents, inaccurate flow rate adjustment leads to a decrease in the quality of the treatment liquid, and the low-quality treatment liquid generated during the initial production period needs to be discarded, which increases consumption cost.

Method used

The treatment liquid supply equipment including main storage-tank and mixing section is adopted to stabilize the supply of chemical solutions and dilutions through the first and second circulation systems, and precise mixing and storage are carried out in the mixing section to avoid the generation of low-quality processing liquid.

Benefits of technology

The high-quality and stable supply of the treatment liquid is achieved, the disposal of the low-quality treatment liquid is avoided, and the consumption cost is reduced.

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Abstract

To make it possible to stably supply high-quality processing liquid generated according to a predetermined condition to one or more substrate processing section without discarding low-quality processing liquid.SOLUTION: A processing liquid supplying apparatus 2 includes a first circulation device 110, a second circulation device 120, a mixing outlet section 130, and a liquid supplying section 140. The first circulation device 110 has a first circulation system connected to a first liquid supply source 5 and supplies a first liquid flowing through at least a part of the first circulation system to the mixing outlet section 130. The second circulation device 120 has a second circulation system connected to a second liquid supply source 6, and supplies a second liquid flowing through at least a part of the second circulation system to the mixing outlet section 130. The mixing outlet section 130 mixes the first liquid and the second liquid and guides them to a main storage tank 30 provided in the liquid supplying section 140. The liquid supplying section 140 supplies the mixed liquid stored in the main storage tank 30 to a substrate processing section 3 as a processing liquid.SELECTED DRAWING: Figure 1
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Description

[Technical field]

[0001] The present invention relates to a processing liquid supplying apparatus, a substrate processing apparatus, and a processing liquid supplying method for supplying a processing liquid to one or more substrate processing sections. [Background technology]

[0002] Substrate processing apparatuses are used to perform various processes on substrates such as semiconductor substrates, substrates for FPDs (Flat Panel Displays) such as liquid crystal display devices or organic EL (Electro Luminescence) display devices, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, and substrates for solar cells.

[0003] As an example of a substrate processing apparatus, Patent Document 1 describes a substrate processing apparatus that processes a substrate using a processing liquid. The substrate processing apparatus includes a substrate processing unit and a chemical liquid generating unit. The chemical liquid generating unit generates the processing liquid by diluting the chemical liquid. In the substrate processing unit, a predetermined process is performed on the substrate using the processing liquid generated by the chemical liquid generating unit. In the following description, for convenience, the chemical liquid generating unit described in Patent Document 1 is referred to as a processing liquid supplying device.

[0004] When the processing liquid is generated in the processing liquid supplying device, the original chemical liquid supplied from the chemical liquid supply source is sent to the mixing pipe. Also, the diluent liquid supplied from the diluent liquid supply source is sent to the mixing pipe. The chemical liquid and the diluent liquid supplied to the mixing pipe are mixed with each other and stored in the mixing tank as the processing liquid. The processing liquid stored in the mixing tank is supplied to the substrate processing unit. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2020-198357 A Summary of the Invention [Problem to be solved by the invention]

[0006] When the chemical liquid and the diluent liquid are mixed in the mixing pipe, unless the flow rate of the chemical liquid supplied to the mixing pipe and the flow rate of the diluent liquid supplied to the mixing pipe are accurately adjusted, the chemical liquid and the diluent liquid cannot be mixed in a predetermined ratio. In this case, the quality of the processing liquid stored in the mixing tank decreases, and it becomes impossible to supply a high-quality processing liquid to the substrate processing unit.

[0007] The flow rate of the chemical liquid supplied to the mixing pipe is adjusted by a flow rate adjusting means such as a motor needle valve, and is unstable for a certain period of time from the start of supplying the chemical liquid to the mixing pipe. The flow rate of the diluent liquid supplied to the mixing pipe is also adjusted by a flow rate adjusting means, and is unstable for a certain period of time from the start of supplying the diluent liquid to the mixing pipe. Therefore, a high-quality treatment liquid cannot be produced immediately after production of the treatment liquid begins.

[0008] Therefore, in the processing liquid supply device of Patent Document 1, the mixed liquid mixed in the mixing pipe is discarded (pre-drain) for a certain period from the start of generation of the processing liquid. However, discarding the mixed liquid (low-quality processing liquid) that is not generated under the predetermined conditions as waste liquid (industrial waste) increases the cost of consumables for generating the processing liquid.

[0009] An object of the present invention is to provide a processing liquid supplying device, a substrate processing apparatus, and a processing liquid supplying method that enable a stable supply of high-quality processing liquid to a substrate processing unit without waste of low-quality processing liquid. [Means for solving the problem]

[0010] A processing liquid supplying apparatus according to one aspect of the present invention is a processing liquid supplying apparatus that supplies a mixed liquid containing a first liquid and a second liquid as a processing liquid to one or more substrate processing units, and is equipped with: a main storage tank for storing the mixed liquid, and a liquid supplying section that supplies the mixed liquid stored in the main storage tank as the processing liquid to the one or more substrate processing units; a mixing outlet section that guides the mixed liquid to the main storage tank; a first circulation device having a first circulation system connected to a first liquid supply source and supplying the first liquid flowing through at least a portion of the first circulation system to the mixing outlet section; and a second circulation device having a second circulation system connected to a second liquid supply source and supplying the second liquid flowing through at least a portion of the second circulation system to the mixing outlet section.

[0011] A processing liquid supplying apparatus according to another aspect of the present invention is a processing liquid supplying apparatus that supplies a mixed liquid containing a first liquid and a second liquid as a processing liquid to one or more substrate processing units, and includes a main storage tank for storing the mixed liquid, a liquid supplying unit that supplies the mixed liquid stored in the main storage tank as the processing liquid to the one or more substrate processing units, a mixing outlet unit that guides the mixed liquid to the main storage tank, a first sub-storage tank connected to a first liquid supply source and storing a predetermined amount of the first liquid supplied from the first liquid supply source, a first supply device that supplies the first liquid stored in the first sub-storage tank to the mixing outlet unit, a second sub-storage tank connected to a second liquid supply source and storing a predetermined amount of the second liquid supplied from the second liquid supply source, and a second supply device that supplies the second liquid stored in the second sub-storage tank to the mixing outlet unit.

[0012] A substrate processing apparatus according to still another aspect of the present invention includes the above-mentioned processing liquid supply apparatus and the one or more substrate processing sections.

[0013] A processing liquid supply method according to yet another aspect of the present invention is a processing liquid supply method for supplying a mixed liquid containing a first liquid and a second liquid as a processing liquid to one or more substrate processing units, the processing liquid supply method including the steps of: supplying the first liquid and the second liquid to a mixing outlet section using a first circulation device and a second circulation device; mixing the first liquid and the second liquid supplied using the first circulation device and the second circulation device in the mixing outlet section and guiding the mixed liquid to a main storage tank; and supplying the mixed liquid stored in the main storage tank as the processing liquid to the one or more substrate processing units, wherein the first circulation device has a first circulation system connected to a first liquid supply source, and the second circulation device has a second circulation system connected to a second liquid supply source.

[0014] A processing liquid supply method according to yet another aspect of the present invention is a processing liquid supply method for supplying a mixed liquid containing a first liquid and a second liquid as a processing liquid to one or more substrate processing units, the method including the steps of: supplying the first liquid and the second liquid to a mixing outlet from a first sub-storage tank connected to a first liquid supply source and storing a predetermined amount of the first liquid supplied from the first liquid supply source, and a second sub-storage tank connected to a second liquid supply source and storing a predetermined amount of the second liquid supplied from the second liquid supply source; mixing the first liquid and the second liquid in the mixing outlet and guiding the mixed liquid to a main storage tank; and supplying the mixed liquid stored in the main storage tank as the processing liquid to the one or more substrate processing units. Effect of the Invention

[0015] According to the present invention, it is possible to stably supply high-quality processing liquid generated according to predetermined conditions to one or more substrate processing sections, without discarding low-quality processing liquid. [Brief description of the drawings]

[0016] [Figure 1] 1 is a schematic configuration diagram of a substrate processing apparatus according to a first embodiment. [Diagram 2]2 is a time chart for explaining an example of an operation of the substrate processing apparatus of FIG. [Diagram 3] 2 is a block diagram showing a configuration of a control system of the substrate processing apparatus of FIG. 1. [Figure 4] 13 is a flowchart of a treatment liquid generating process performed by a control unit. [Diagram 5] FIG. 11 is a schematic configuration diagram of a substrate processing apparatus according to a second embodiment. [Figure 6] FIG. 13 is a schematic configuration diagram of a substrate processing apparatus according to a third embodiment. [Figure 7] FIG. 11 is a block diagram showing a configuration example of a substrate processing apparatus according to another embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Hereinafter, a processing liquid supplying device, a substrate processing device, and a substrate processing method according to an embodiment of the present invention will be described with reference to the drawings. In the following description, the substrate refers to a substrate for a flat panel display (FPD) used in a liquid crystal display device or an organic electroluminescence (EL) display device, a semiconductor substrate, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a ceramic substrate, a substrate for a solar cell, or the like.

[0018] 1. First embodiment <1> Schematic of the configuration of the substrate processing apparatus FIG. 1 is a schematic diagram of a substrate processing apparatus according to a first embodiment. The substrate processing apparatus 1 mainly includes a processing liquid supplying apparatus 2, a substrate processing section 3, and a control section 9, and is installed in, for example, a factory. In the factory, a first liquid supply source 5 and a second liquid supply source 6 are provided as utility facilities used in the substrate processing apparatus 1. The second liquid supply source 6 is a supply source of a chemical liquid, and the chemical liquid of the second liquid supply source 6 according to this embodiment is hydrofluoric acid. The first liquid supply source 5 is a supply source of a diluent liquid for diluting the chemical liquid, and the diluent liquid of the first liquid supply source 5 according to this embodiment is deionized water. In the following description, hydrofluoric acid is abbreviated as HF, and deionized water is abbreviated as DIW.

[0019] The chemical liquid of the second liquid supply source 6 may be, instead of HF, an aqueous solution of buffered hydrofluoric acid (BHF), dilute hydrofluoric acid (DHF), hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, acetic acid, oxalic acid, or ammonia water, or a mixed solution thereof, etc. The diluent liquid of the first liquid supply source 5 may be, instead of DIW, carbonated water, ozone water, magnetic water, functional water, ionized water, or an organic solvent, etc.

[0020] The processing liquid supplying device 2 is connected to a first liquid supplying source 5 and a second liquid supplying source 6. The processing liquid supplying device 2 mixes the DIW supplied from the first liquid supplying source 5 and the HF supplied from the second liquid supplying source 6 at a predetermined ratio. In the present embodiment, the predetermined mixing ratio between the DIW and the HF is 100:1. As a result, a mixed liquid (diluted liquid) in which the HF is diluted with a large amount of DIW is generated. The generated mixed liquid is stored as a processing liquid in a main storage tank 30 described later. The processing liquid stored in the main storage tank 30 is supplied to the substrate processing unit 3.

[0021] The processing liquid supplying apparatus 2 according to the present embodiment has a plurality of components for producing a high-quality processing liquid without discarding a low-quality processing liquid. The configuration and operation of the processing liquid supplying apparatus 2 will be described in detail later.

[0022] The substrate processing section 3 includes a plurality of processing units 4. Each processing unit 4 is provided with a spin chuck 4a, a nozzle 4b, and a cup 4c. The spin chuck 4a is configured to be capable of holding a substrate W to be processed. The spin chuck 4a is rotated by a driving device (e.g., an electric motor) (not shown) while holding the substrate W. This causes the substrate W held by the spin chuck 4a to rotate.

[0023] The nozzle 4b ejects the processing liquid supplied from the processing liquid supplying apparatus 2 to the substrate processing apparatus 1 onto the substrate W held and rotating by the spin chuck 4a. This processes the surface (the upper surface in this example) of the substrate W. The cup 4c is provided to surround the substrate W held by the spin chuck 4a, and receives the processing liquid shaken off from the substrate W during processing of the substrate W. A portion of the processing liquid received by the cup 4c is returned to the processing liquid supplying apparatus 2 through a recovery pipe p33, which will be described later.

[0024] The control unit 9 controls the operations of the processing liquid supplying device 2 and each unit of the substrate processing unit 3. The control unit 9 will be described in detail later.

[0025] <2> Configuration of processing liquid supply device 2 1, the treatment liquid supplying apparatus 2 is mainly composed of a first circulation device 110, a second circulation device 120, a mixing and outlet section 130, and a liquid supplying section 140. The first circulation device 110 includes a first sub-storage tank 10, a plurality of valves 11, 15, 16 (three in this example), a pump 12, a flow meter 13, an adjustment section 14, a supply source pipe p11, a pressure delivery pipe p12, and a circulation pipe p13.

[0026] An upstream end of the supply source pipe p11 is connected to the first liquid supply source 5. A downstream end of the supply source pipe p11 is disposed in the first sub-reservoir 10. A valve 11 is provided on the supply source pipe p11.

[0027] As described above, the first liquid supply source 5 is a utility facility and holds DIW to which a predetermined pressure has been applied. The valve 11 opens and closes under the control of the control unit 9. When the valve 11 is closed, the flow of DIW through the supply source pipe p11 is blocked. On the other hand, when the valve 11 is open, DIW is supplied from the first liquid supply source 5 to the first sub-storage tank 10 through the supply source pipe p11. The supplied DIW is stored in the first sub-storage tank 10.

[0028] The capacity of the first sub-tank 10 is smaller than that of the main tank 30 described below, and is, for example, about 20 L to 50 L. A liquid level sensor LS1 is attached to the first sub-tank 10. The liquid level sensor LS1 detects the liquid level (liquid level height) of the DIW stored in the first sub-tank 10.

[0029] The upstream end of the pressure-feed pipe p12 is connected to the bottom of the first sub-storage tank 10. A pump 12, a flow meter 13, and an adjustment unit 14 are arranged in this order in the pressure-feed pipe p12 from its upstream end to its downstream end.

[0030] The pump 12 sucks the DIW stored in the first sub-storage tank 10 and pumps the sucked DIW toward the downstream end of the pressure-feeding pipe p12. The flow meter 13 detects the amount of DIW flowing through the pressure-feeding pipe p12 per unit time as a flow rate. The adjustment unit 14 includes a flow rate adjuster such as a regulator or a motor needle valve, and adjusts the flow rate of the DIW flowing through the pressure-feeding pipe p12 based on the detection result of the flow meter 13.

[0031] The flow rate regulator provided in the adjustment unit 14 is selected according to the flow rate level of the DIW to be supplied to the mixing and outlet unit 130 when the treatment liquid is generated and the required flow rate accuracy. In this example, when the treatment liquid is generated, the DIW needs to be supplied to the mixing and outlet unit 130 at a relatively large flow rate, and therefore a regulator is used.

[0032] A circulation pipe p13 is provided to connect the first sub-storage tank 10 and the downstream end of the pressure-feed pipe p12. A valve 15 is provided in the circulation pipe p13. The upstream end of a supply pipe p14 is further connected to the downstream end of the pressure-feed pipe p12. The supply pipe p14 extends from the downstream end of the pressure-feed pipe p12 to the mixing outlet section 130. A valve 16 is provided in the supply pipe p14.

[0033] Valve 15 allows the flow of DIW through the circulation pipe p13 when open and blocks the flow of DIW through the circulation pipe p13 when closed. Valve 16 allows the flow of DIW through the supply pipe p14 when open and blocks the flow of DIW through the supply pipe p14 when closed.

[0034] In the first circulation device 110, for example, when a predetermined amount of DIW is stored in the first sub-storage tank 10, the valve 15 is opened and the valve 16 is closed. Furthermore, the pump 12 operates and the adjustment unit 14 adjusts the flow rate of the DIW flowing through the pressure-feed pipe p12. As a result, the DIW stored in the first sub-storage tank 10 circulates through the pressure-feed pipe p12 and the circulation pipe p13 (see the thick dashed arrow A11 in FIG. 1).

[0035] In this manner, in the first circulation device 110, the first sub-storage tank 10, the pressure-feeding pipe p12, the pump 12, the flowmeter 13, the adjustment unit 14, the circulation pipe p13, and the valve 15 form a first circulation system for circulating the DIW. The operation mode of the first circulation device 110 at this time is called a first liquid circulation mode.

[0036] In the first circulation device 110, for example, when a predetermined amount of DIW is stored in the first sub-storage tank 10, the valve 15 is closed and the valve 16 is opened. Furthermore, the pump 12 operates and the adjustment unit 14 adjusts the flow rate of the DIW flowing through the pressure-feeding pipe p12. As a result, the DIW stored in the first sub-storage tank 10 is sent to the mixing and outlet unit 130 through the supply pipe p14 at the flow rate adjusted by the adjustment unit 14 (see the thick dotted arrow A12 in FIG. 1). The operation mode of the first circulation device 110 at this time is called a first liquid supply mode.

[0037] The second circulation device 120 includes a second sub-storage tank 20, a plurality of (three in this example) valves 21, 25, 26, a pump 22, a flow meter 23, an adjustment unit 24, a supply source pipe p21, a pressure delivery pipe p22, and a circulation pipe p23.

[0038] An upstream end of the supply source pipe p21 is connected to the second liquid supply source 6. A downstream end of the supply source pipe p21 is disposed in the second sub-reservoir 20. A valve 21 is provided in the supply source pipe p21.

[0039] As described above, the second liquid supply source 6 is a utility facility and holds HF to which a predetermined pressure has been applied. The valve 21 opens and closes under the control of the control unit 9. When the valve 21 is closed, the flow of HF through the supply source piping p21 is blocked. On the other hand, when the valve 21 is open, HF is supplied from the second liquid supply source 6 to the second sub-reservoir 20 through the supply source piping p21. The supplied HF is stored in the second sub-reservoir 20.

[0040] The capacity of the second sub-tank 20 is smaller than that of the main tank 30 (described later), for example, about 5 L to 20 L, similar to the capacity of the first sub-tank 10. A liquid level sensor LS2 is attached to the second sub-tank 20. The liquid level sensor LS2 detects the liquid level (liquid level height) of the HF stored in the second sub-tank 20.

[0041] The upstream end of the pressure-feed pipe p22 is connected to the bottom of the second sub-storage tank 20. The pressure-feed pipe p22 is provided with a pump 22, a flow meter 23, and an adjustment unit 24 arranged in this order from the upstream end to the downstream end thereof.

[0042] The pump 22 draws in the HF stored in the second sub-storage tank 20 and pumps the drawn-in HF toward the downstream end of the pressure-feeding pipe p22. The flow meter 23 detects the amount of HF flowing through the pressure-feeding pipe p22 per unit time as a flow rate. The adjustment unit 24 includes a flow rate regulator such as a motor needle valve or a regulator, and adjusts the flow rate of the HF flowing through the pressure-feeding pipe p22 based on the detection result of the flow meter 23.

[0043] The flow rate regulator provided in the adjustment unit 24 is selected according to the flow rate level of the HF to be supplied to the mixing and outlet unit 130 when the treatment liquid is generated and the required flow rate accuracy. In this example, when the treatment liquid is generated, the HF needs to be supplied to the mixing and outlet unit 130 at a relatively small flow rate and with high accuracy, and therefore a motor needle valve is used.

[0044] A circulation pipe p23 is provided to connect the second sub-storage tank 20 and the downstream end of the pressure-feed pipe p22. A valve 25 is provided in the circulation pipe p23. The upstream end of a supply pipe p24 is further connected to the downstream end of the pressure-feed pipe p22. The supply pipe p24 extends from the downstream end of the pressure-feed pipe p22 to the mixing outlet section 130. A valve 26 is provided in the supply pipe p24.

[0045] Valve 25 allows the flow of HF in the circulation pipe p23 when open and blocks the flow of HF in the circulation pipe p23 when closed. Valve 26 allows the flow of HF in the supply pipe p24 when open and blocks the flow of HF in the supply pipe p24 when closed.

[0046] In the second circulation device 120, for example, with a predetermined amount of HF stored in the second sub-storage tank 20, the valve 25 is opened and the valve 26 is closed. Furthermore, the pump 22 operates and the adjustment unit 24 adjusts the flow rate of HF flowing through the pressure-feed pipe p22. As a result, the HF stored in the second sub-storage tank 20 circulates through the pressure-feed pipe p22 and the circulation pipe p23 (see the thick dashed arrow A21 in FIG. 1).

[0047] In this manner, in the second circulation device 120, the second sub-storage tank 20, the pressure-feeding pipe p22, the pump 22, the flowmeter 23, the adjustment unit 24, the circulation pipe p23, and the valve 25 form a second circulation system for circulating HF. The operation mode of the second circulation device 120 at this time is called a second liquid circulation mode.

[0048] In the second circulation device 120, for example, when a predetermined amount of HF is stored in the second sub-storage tank 20, the valve 25 is closed and the valve 26 is opened. Furthermore, the pump 22 operates and the adjustment unit 24 adjusts the flow rate of HF flowing through the pressure-feeding pipe p22. As a result, the HF stored in the second sub-storage tank 20 is sent to the mixing and outlet unit 130 through the supply pipe p24 at the flow rate adjusted by the adjustment unit 24 (see the thick dotted arrow A22 in FIG. 1). The operation mode of the second circulation device 120 at this time is called a second liquid supply mode.

[0049] The mixing and outlet section 130 includes a mixing pipe p31. In this example, the mixing pipe p31 is a single pipe. The downstream end of the supply pipe p14 of the first circulation device 110 and the downstream end of the supply pipe p24 of the second circulation device 120 are connected to the upstream end of the mixing pipe p31. The downstream end of the mixing pipe p31 is disposed in a main storage tank 30 (described later) of the liquid supply section 140. As a result, when the first circulation device 110 is in the first liquid supply mode and the second circulation device 120 is in the second liquid supply mode, the DIW and the HF are mixed in the mixing pipe p31 and are led to the main storage tank 30 of the liquid supply section 140.

[0050] At this time, in the mixing pipe p31, the DIW and the HF are mixed at a ratio of the flow rate of the DIW supplied to the mixing pipe p31 to the flow rate of the HF supplied to the mixing pipe p31. In order to mix the DIW and the HF supplied from the first circulation device 110 and the second circulation device 120 more uniformly, a member for stirring the liquid flowing through the mixing pipe p31 may be provided inside the mixing pipe p31.

[0051] The liquid supply unit 140 includes a main storage tank 30, a pump 31, a heater 32, a filter 33, a supply pipe p32, and a recovery pipe p33. As described above, the downstream end of the mixing pipe p31 of the first sub-storage tank 10 is disposed in the main storage tank 30. As a result, the mixture of DIW and HF flowing through the mixing pipe p31 is guided into the main storage tank 30 and stored as a processing liquid used for processing the substrates W in the substrate processing unit 3. The capacity of the main storage tank 30 is, for example, about 20 liters to 100 liters. A liquid level sensor LS3 is attached to the main storage tank 30. The liquid level sensor LS3 detects the liquid level (liquid level height) of the processing liquid stored in the main storage tank 30.

[0052] The upstream end of the supply pipe p32 is connected to the bottom of the main reservoir 30. The supply pipe p32 is provided with a pump 31, a heater 32, and a filter 33 arranged in this order from the upstream end to the downstream end. The downstream end of the supply pipe p32 is connected to the substrate processing unit 3.

[0053] The pump 31 sucks the processing liquid stored in the main storage tank 30 and pressure-feeds the sucked processing liquid toward the downstream end of the supply pipe p32. The heater 32 heats the processing liquid flowing through the supply pipe p32 to a predetermined temperature. The filter 33 filters the processing liquid to remove impurities, precipitates, and the like from the processing liquid. Thus, the processing liquid stored in the main storage tank 30 is heated and filtered before being supplied to the substrate processing unit 3. In the substrate processing unit 3, the processing liquid supplied from the processing liquid supply device 2 is sent to the nozzles 4b of the multiple processing units 4, respectively.

[0054] The upstream end of the recovery pipe p33 is connected to the substrate processing section 3. The downstream end of the recovery pipe p33 is disposed in the main reservoir 30. In the substrate processing section 3, a portion of the processing liquid received in each cup 4c of the plurality of processing units 4 is guided to the upstream end of the recovery pipe p33. Thereby, as described above, a portion of the processing liquid used in the plurality of processing units 4 is recovered into the main reservoir 30 through the recovery pipe p33.

[0055] Of the processing liquid supplied from the main storage tank 30 to the substrate processing unit 3, the remaining processing liquid that is not collected in the main storage tank 30 is sent to a drainage facility (not shown). Therefore, if a state in which new processing liquid is not supplied to the main storage tank 30 continues, the liquid level of the processing liquid stored in the main storage tank 30 will drop every time a substrate is processed in each section of the substrate processing unit 3.

[0056] Therefore, in this embodiment, whether or not to replenish the main storage tank 30 with new processing liquid is determined based on the liquid level of the processing liquid detected by the liquid level sensor LS3 and two liquid level levels that are preset in the main storage tank 30.

[0057] The two liquid level levels preset in the main storage tank 30 are a lower limit level L1 and a specified level L2. The lower limit level L1 is a liquid level corresponding to the amount of processing liquid considered to be the minimum amount necessary to supply the processing liquid to the substrate processing unit 3. On the other hand, the specified level L2 is a liquid level higher than the lower limit level L1. More specifically, the specified level L2 is a liquid level corresponding to the amount of processing liquid considered to be sufficient to supply the processing liquid to the substrate processing unit 3 and that is considered not to overflow from the main storage tank 30.

[0058] <3> Operation of the substrate processing apparatus 1 Fig. 2 is a time chart for explaining an example of the operation of the substrate processing apparatus 1 of Fig. 1. Here, the operation of replenishing the main storage tank 30 with the processing liquid while generating the processing liquid in the processing liquid supplying apparatus 2 will be mainly explained.

[0059] 2 shows 11 items related to the status of each part of the substrate processing apparatus 1. The 11 items are "substrate processing," "main storage tank liquid level," "main storage tank liquid level," "DIW pump 12," "HF pump 22," "DIW flow rate," "HF flow rate," "DIW circulation side valve 15," "DIW supply side valve 16," "HF circulation side valve 25," and "HF supply side valve 26," and are arranged vertically in this order from the top row (first row) to the bottom row (eleventh row).

[0060] To the right of the above 11 items, changes in the states corresponding to those items are shown in chronological order using a common time axis. To the right of the item "Substrate Processing" in the first row, it is shown whether the substrate processing section 3 is in an operating state, i.e., whether substrate processing is being performed in the substrate processing section 3. To the right of the item "Main Storage Tank Liquid Level" in the second row, it is shown whether the liquid level detected by the liquid level sensor LS3 in Fig. 1 is higher than or equal to the lower limit level L1. To the right of the item "Main Storage Tank Liquid Level" in the third row, it is shown whether the liquid level detected by the liquid level sensor LS3 in Fig. 1 is higher than or equal to the specified level L2, or lower than the specified level L2.

[0061] To the right of the fourth row item "DIW pump 12" is shown whether the pump 12 in Fig. 1 is in operation or stopped. To the right of the fifth row item "HF pump 22" is shown whether the pump 22 in Fig. 1 is in operation or stopped.

[0062] In the processing liquid supplying apparatus 2 according to the present embodiment, in order to mix DIW and HF at a predetermined ratio, an ideal flow rate range of DIW to flow through the first circulation system of the first circulation device 110 is determined as a first flow rate range. Also, an ideal flow rate range of HF to flow through the second circulation system of the second circulation device 120 is determined as a second flow rate range.

[0063] To the right of the sixth item "DIW flow rate" is shown whether the DIW flow rate (the flow rate of DIW flowing through the first circulation system) detected by flowmeter 13 is within a first flow rate range. To the right of the seventh item "HF flow rate" is shown whether the HF flow rate (the flow rate of HF flowing through the second circulation system) detected by flowmeter 23 is within a second flow rate range.

[0064] To the right of "DIW circulation side valve 15" in the eighth row, it is indicated whether valve 15 in FIG. 1 is in an open or closed state. To the right of "DIW supply side valve 16" in the ninth row, it is indicated whether valve 16 in FIG. 1 is in an open or closed state. To the right of "HF circulation side valve 25" in the tenth row, it is indicated whether valve 25 in FIG. 1 is in an open or closed state. To the right of "HF supply side valve 26" in the eleventh row, it is indicated whether valve 26 in FIG. 1 is in an open or closed state.

[0065] In this example, the valve 11 of the first circulation device 110 is switched between an open state and a closed state based on the detection result of the liquid level sensor LS1 so that a predetermined amount of DIW is always stored in the first sub-storage tank 10. The valve 21 of the second circulation device 120 is switched between an open state and a closed state based on the detection result of the liquid level sensor LS2 so that a predetermined amount of HF is always stored in the second sub-storage tank 20.

[0066] First, in the initial state (time t0), the substrate processing unit 3 is in a stopped state. The liquid level of the processing liquid stored in the main storage tank 30 is higher than the lower limit level L1 and lower than the specified level L2. The pumps 12 and 22 in FIG. 1 are in a stopped state, the flow rate of DIW flowing through the first circulation system is outside the first flow rate range (specifically, 0), and the flow rate of HF flowing through the second circulation system is outside the second flow rate range (specifically, 0). Furthermore, the valves 15 and 25 in FIG. 1 are in an open state, and the valves 16 and 26 in FIG. 1 are in a closed state.

[0067] At time t1, the substrate processing section 3 switches from a stopped state to an operating state, and substrate processing is started in the multiple processing units 4 of the substrate processing section 3. As a result, the processing liquid stored in the main storage tank 30 of the processing liquid supplying device 2 is supplied to the substrate processing section 3. As the processing of the substrate W continues in the substrate processing section 3, the liquid level of the processing liquid in the main storage tank 30 drops.

[0068] At time t2, the liquid level of the treatment liquid in the main storage tank 30 becomes equal to or lower than the lower limit level L1. As a result, at time t3, the pumps 12 and 22 in FIG. 1 are switched from a stopped state to an operating state. At this time, in the first circulation device 110, the valve 15 is in an open state and the valve 16 is in a closed state. As a result, the DIW pumped by the pump 12 through the pressure delivery pipe p12 is returned to the first sub-storage tank 10 through the circulation pipe p13. That is, the DIW circulates through the first circulation system in the first circulation device 110.

[0069] In the second circulation device 120, the valve 25 is open and the valve 26 is closed. As a result, the HF pumped by the pump 22 through the pressure delivery pipe p22 is returned to the second sub-storage tank 20 through the circulation pipe p23. That is, in the second circulation device 120, the HF circulates through the second circulation system.

[0070] Immediately after time t3, the operating states of the pumps 12 and 22 are unstable. In addition, the flow rate of DIW passing through the regulator 14 in the first circulation system is also unstable. Furthermore, the flow rate of HF passing through the regulator 24 in the second circulation system is also unstable.

[0071] At time t4, a certain time after time t3, the operating states of the pumps 12 and 22 stabilize, and the flow rates of the DIW passing through the regulator 14 and the HF passing through the regulator 24 stabilize. As a result, the flow rate of the DIW flowing through the first circulation system falls within a first flow rate range, and the flow rate of the HF flowing through the second circulation system falls within a second flow rate range.

[0072] Thereafter, at time t5, valve 15 of the first circulation device 110 is closed, and valve 16 is opened. As a result, the DIW in the first sub-storage tank 10 is sent to the mixing and outlet portion 130 at a predetermined flow rate (a flow rate within the first flow rate range). Also, valve 25 of the second circulation device 120 is closed, and valve 26 is opened. As a result, the HF in the second sub-storage tank 20 is sent to the mixing and outlet portion 130 at a predetermined flow rate (a flow rate within the second flow rate range).

[0073] In the mixing and outlet section 130, the DIW and HF supplied from the first circulation device 110 and the second circulation device 120 are mixed, and the resulting mixture is introduced as the processing liquid to the main storage tank 30 of the liquid supply section 140. In this manner, new processing liquid is successively added to the main storage tank 30. As a result, the liquid level of the processing liquid in the main storage tank 30 rises and exceeds the lower limit level at time t6.

[0074] At time t7, the substrate processing unit 3 is switched from an operating state to a stopped state while new processing liquid is being added to the main storage tank 30. This causes the supply of processing liquid from the main storage tank 30 of the processing liquid supplying device 2 to the substrate processing unit 3 to be stopped.

[0075] Thereafter, new processing liquid is further added to the main storage tank 30, so that the liquid level of the processing liquid in the main storage tank 30 reaches a specified level at time t8. Then, in order to prevent the processing liquid from leaking from the main storage tank 30, the pumps 12 and 22 are switched from the operating state to the stopped state at time t9. This stops the supply of DIW and HF from the first circulation device 110 and the second circulation device 120 to the mixing and outlet part 130. Also, at time t10, the flow rate of DIW flowing through the first circulation system falls outside the first flow rate range (specifically, 0), and the flow rate of HF flowing through the second circulation system falls outside the second flow rate range (specifically, 0). In this way, the replenishment of new processing liquid to the main storage tank 30 is stopped.

[0076] Thereafter, in preparation for refilling the main reservoir 30 with new processing liquid, at time t11, the valve 15 of the first circulation device 110 is opened and the valve 16 is closed. Also, the valve 25 of the second circulation device 120 is opened and the valve 26 is closed.

[0077] <4> Substrate processing equipment control system The control system of the substrate processing apparatus 1 will be described together with the configuration of the control unit 9 in Fig. 1. Fig. 3 is a block diagram showing the configuration of the control system of the substrate processing apparatus 1 in Fig. 1. As shown in Fig. 3, the control unit 9 includes a CPU (Central Processing Unit) 91, a RAM (Random Access Memory) 92, a ROM (Read Only Memory) 93, and a storage device 94.

[0078] The RAM 92 is used as a working area for the CPU 91. The ROM 93 stores a system program. The storage device 94 includes a storage medium such as a hard disk or a semiconductor memory, and stores a substrate processing program for performing substrate processing and a processing liquid generation program for generating a processing liquid. Furthermore, the storage device 94 stores processing liquid conditions that are set in relation to the generation of the processing liquid and the replenishment of the processing liquid to the main storage tank 30. The processing liquid conditions include the lower limit level L1, the specified level L2, the first flow rate range, and the second flow rate range described above, as well as liquid generation conditions described below.

[0079] The substrate processing program and the processing liquid generating program may be provided in a state stored in a recording medium such as a CD-ROM 95, and may be installed in the ROM 93 or the storage device 94. Alternatively, the substrate processing program and the processing liquid generating program may be distributed from a server external to the substrate processing apparatus 1 via a communication network, and may be installed in the ROM 93 or the storage device 94.

[0080] The CPU 91 executes the substrate processing program, whereby a necessary amount of processing liquid is supplied from the processing liquid supplying device 2 to the substrate processing section 3. In addition, the operation of each section of the substrate processing section 3 is controlled, and substrate processing is performed in the multiple processing units 4.

[0081] Meanwhile, the CPU 91 executes a processing liquid generating program to mainly control the operation of each part of the processing liquid supplying device 2 in the substrate processing apparatus 1. Specifically, the control unit 9 controls the open / close state of the valve 11 so that a certain amount of DIW is stored in the first sub-storage tank 10 based on the detection result of the liquid level sensor LS1. The control unit 9 also determines the flow state of the DIW in the first circulation system based on the detection result of the flow meter 13. In this embodiment, the flow state includes the magnitude of the flow rate of the DIW flowing through the first circulation system. At this time, the control unit 9 may control the adjustment unit 14 based on the detection result of the flow meter 13.

[0082] Furthermore, when circulating DIW in the first circulation device 110, the control unit 9 operates the pump 12 while opening the valve 15 and closing the valve 16 (first liquid circulation mode). Furthermore, when supplying DIW from the first circulation device 110 to the mixing and outlet part 130, the control unit 9 operates the pump 12 while closing the valve 15 and opening the valve 16 (first liquid supply mode).

[0083] Furthermore, the control unit 9 controls the open / close state of the valve 21 based on the detection result of the liquid level sensor LS2 so that a certain amount of HF is stored in the second sub-storage tank 20. Furthermore, the control unit 9 determines the flow state of HF in the second circulation system based on the detection result of the flow meter 23. In this embodiment, the flow state includes the magnitude of the flow rate of HF flowing through the second circulation system. At this time, the control unit 9 may control the adjustment unit 24 based on the detection result of the flow meter 23.

[0084] Furthermore, when circulating HF in the second circulation device 120, the control unit 9 operates the pump 22 while opening the valve 25 and closing the valve 26 (second liquid circulation mode). Furthermore, when supplying HF from the second circulation device 120 to the mixing and outlet unit 130, the control unit 9 operates the pump 22 while closing the valve 25 and opening the valve 26 (second liquid supply mode).

[0085] The control unit 9 also determines the amount of the processing liquid stored in the main storage tank 30 based on the detection result of the liquid level sensor LS3. The control unit 9 also controls the pump 31 to supply a required amount of the processing liquid from the processing liquid supplying device 2 to the substrate processing unit 3. Furthermore, the control unit 9 controls the heater 32 so that the processing liquid supplied to the substrate processing unit 3 approaches a temperature suitable for substrate processing.

[0086] <5> Processing solution generation process 4 is a flowchart of the treatment liquid generating process by the control unit 9. The treatment liquid generating process described below is performed by the CPU 91 of the control unit 9 executing on the RAM 92 a treatment liquid generating program stored in the storage device 94.

[0087] The processing liquid generating process is started by turning on the power supply of the substrate processing apparatus 1, and is repeatedly performed at predetermined time intervals. When the processing liquid generating process is started, the CPU 91 determines whether or not the main storage tank 30 needs to be replenished with the processing liquid based on the detection result of the liquid level sensor LS3 (step S11).

[0088] Specifically, when the liquid level detected by the liquid level sensor LS3 is equal to or lower than the lower limit level L1, the CPU 91 determines that it is necessary to replenish the main storage tank 30 with the processing liquid. On the other hand, when the liquid level detected by the liquid level sensor LS3 is higher than the lower limit level L1, the CPU 91 determines that it is not necessary to replenish the main storage tank 30 with the processing liquid. In the example of Fig. 2, the CPU 91 determines that it is necessary to replenish the main storage tank 30 with the processing liquid at time t2.

[0089] When the CPU 91 determines that the main storage tank 30 does not need to be replenished with the treatment liquid, the CPU 91 repeats the process of step S11. On the other hand, when the CPU 91 determines that the main storage tank 30 needs to be replenished with the treatment liquid, the CPU 91 starts the operation of the first circulation device 110 and the second circulation device 120 in the first liquid circulation mode and the second liquid circulation mode, respectively (step S12). In the example of FIG. 2, the CPU 91 starts the operation of the first circulation device 110 in the first liquid circulation mode and starts the operation of the second circulation device 120 in the second liquid circulation mode at time t3.

[0090] Next, the CPU 91 judges whether or not a predetermined liquid production condition is satisfied (step S13). Here, the liquid production condition is a condition for judging whether or not the flow state of the DIW circulating through the first circulation system in the first circulation device 110 and the flow state of the HF circulating through the second circulation system in the second circulation device 120 are both stable.

[0091] In this embodiment, the liquid generation condition includes that the flow rate of DIW flowing through the first circulation system is within a first flow rate range, and that the flow rate of HF flowing through the second circulation system is within a second flow rate range. In this case, the CPU 91 can determine whether or not the liquid generation condition is satisfied based on the detection results of the flow meters 13 and 23. In the example of FIG. 2, the CPU 91 determines that the liquid generation condition is satisfied at time t4.

[0092] The liquid production condition is not limited to the above example, and may include the lapse of a predetermined fixed time (e.g., about 5 to 10 seconds) from the start of operation of the first circulation device 110 and the second circulation device 120 in the process of step S12. In this case, in the example of Fig. 2, the CPU 91 determines that the liquid production condition is satisfied when a fixed time has elapsed from the start of operation of the pumps 12, 22 at time t3.

[0093] When the CPU 91 determines that the liquid generation condition is not satisfied, it repeats the process of step S13. On the other hand, when the CPU 91 determines that the liquid generation condition is satisfied, it switches the operation modes of the first circulation device 110 and the second circulation device 120 to the first liquid supply mode and the second liquid supply mode (step S14). In the example of Fig. 2, the CPU 91 switches the operation mode of the first circulation device 110 to the first liquid supply mode and switches the operation mode of the second circulation device 120 to the second liquid supply mode at time t5.

[0094] Next, the CPU 91 determines whether the liquid level of the treatment liquid in the main storage tank 30 is equal to or higher than the specified level L2 based on the detection result of the liquid level sensor LS3 (step S15). If the CPU 91 determines that the liquid level is not equal to or higher than the specified level L2, it repeats the process of step S15. On the other hand, if the CPU 91 determines that the liquid level is equal to or higher than the specified level L2, it stops the operation of the first circulation device 110 and the second circulation device 120 (step S16).

[0095] 2, the CPU 91 determines at time t8 that the liquid level of the treatment liquid in the main storage tank 30 is equal to or higher than the specified level L2. In addition, at time t9, the CPU 91 stops the operation of the first circulation device 110 and stops the operation of the second circulation device 120 by stopping the pumps 12 and 22.

[0096] Thereafter, the CPU 91 prepares for operation in the first liquid circulation mode and the second liquid circulation mode, assuming a case where the main storage tank 30 is refilled with new processing liquid (step S17). Specifically, the CPU 91 opens the valve 15 in FIG. 1 and closes the valve 16 in FIG. 1 so that the DIW circulates through the first circulation system of the first circulation device 110 when the pump 12 starts to operate. The CPU 91 also opens the valve 25 in FIG. 1 and closes the valve 26 in FIG. 1 so that the HF circulates through the second circulation system of the second circulation device 120 when the pump 22 operates. In the example of FIG. 2, the CPU 91 switches the open / closed states of the valves 15, 16, 25, and 26 at time t11. This ends the processing liquid generation process.

[0097] <6> Chassis In the above-described substrate processing apparatus 1, the first circulation device 110, the second circulation device 120, and the liquid supply unit 140 may be housed in separate housings as shown by dashed lines in Fig. 1. In this case, the mixing and outlet unit 130 may be housed in one housing together with the liquid supply unit 140. In this manner, the multiple members constituting the processing liquid supply apparatus 2 are housed in multiple housings, respectively, thereby improving the degree of freedom in layout when the processing liquid supply apparatus 2 is installed in a factory.

[0098] The processing liquid supplying device 2 may have a configuration in which all components including the first circulation device 110, the second circulation device 120, the mixing and outlet section 130 and the liquid supplying section 140 are housed within a single common housing.

[0099] <7> effect (a) In the above-described processing liquid supplying apparatus 2, when the liquid level of the processing liquid stored in the main storage tank 30 becomes equal to or lower than the lower limit level L1, replenishment of the processing liquid to the main storage tank 30 is started. When replenishment of the processing liquid is started, the first circulation device 110 operates in the first liquid circulation mode, and the second circulation device 120 operates in the second liquid circulation mode. As a result, the DIW supplied from the first liquid supply source 5 and stored in the first sub-storage tank 10 flows through the first circulation system. In addition, the HF supplied from the second liquid supply source 6 and stored in the second sub-storage tank 20 flows through the second circulation system.

[0100] The first circulation system of the first circulation device 110 receives the DIW supplied from the first liquid supply source 5 and functions as a buffer flow path that buffers fluctuations in the flow rate, pressure, etc. of the DIW. This prevents large disturbances from occurring in the flow state of the DIW in the first circulation system.

[0101] The second circulation system of the second circulation device 120 receives the HF supplied from the second liquid supply source 6 and functions as a buffer flow path that buffers fluctuations in the flow rate, pressure, etc. of the HF, thereby preventing large disturbances from occurring in the flow state of the HF in the second circulation system.

[0102] Thereafter, as the liquid production condition is satisfied, the operation mode of the first circulation device 110 is switched to the first liquid supply mode, and the operation mode of the second circulation device 120 is switched to the second liquid supply mode. As a result, in the mixing and outlet portion 130, the DIW and the HF are appropriately mixed in a relatively stable state, and a high-quality processing liquid is produced.

[0103] In this case, the generation of the processing liquid under unstable conditions is suppressed, and therefore the processing for removing the low-quality processing liquid such as pre-draining is not required. As a result, it becomes possible to stably supply the high-quality processing liquid generated according to the predetermined conditions to the substrate processing unit 3 without discarding the low-quality processing liquid.

[0104] (b) As described above, the liquid generating conditions include that the flow rate of the DIW flowing through the first circulation system is within a first flow rate range, and the flow rate of the HF flowing through the second circulation system is within a second flow rate range. In this case, the flow rates of the DIW and HF supplied to the mixed outlet portion 130 are adjusted with high precision. Therefore, the DIW and HF constituting the processing liquid can be mixed with high precision according to a predetermined mixing ratio.

[0105] (c) In the processing liquid supplying apparatus 2 according to the present embodiment, the first circulation device 110 and the second circulation device 120 are provided with adjustment units 14 and 24 for adjusting the flow rate of the processing liquid flowing through each circulation system, respectively. Therefore, the DIW and HF constituting the processing liquid can be mixed with high accuracy according to a predetermined mixing ratio.

[0106] (d) In the processing liquid supplying apparatus 2 according to the present embodiment, the first circulation device 110 and the second circulation device 120 are provided with flow meters 13, 23, respectively, for detecting the flow rate of the processing liquid flowing through each circulation system.

[0107] This allows the flow rate of DIW flowing through the first circulation system to be adjusted based on the detection result of the flowmeter 13. Also, the flow rate of HF flowing through the second circulation system to be adjusted based on the detection result of the flowmeter 23. Also, the timing for supplying DIW and HF from the first circulation device 110 and the second circulation device 120 to the mixing and outlet portion 130 can be appropriately determined based on the flow states of the liquids flowing through the first circulation system and the second circulation system, respectively.

[0108] (e) The above-mentioned first circulation device 110 and second circulation device 120 each include a first sub-reservoir 10 and a second sub-reservoir 20. In this case, the first sub-reservoir 10 functions as a buffer tank that buffers fluctuations in the flow rate and pressure of the DIW supplied from the first liquid supply source 5 to the first circulation system. This prevents significant disturbances in the state of the DIW flowing through the first circulation system caused by the supply of DIW from the first liquid supply source 5 to the first circulation system.

[0109] In addition, the second sub-storage tank 20 functions as a buffer tank that buffers fluctuations in the flow rate, pressure, etc. of HF supplied from the second liquid supply source 6 to the second circulation system. This prevents the state of HF flowing through the second circulation system from being significantly disturbed due to the supply of HF from the second liquid supply source 6 to the second circulation system.

[0110] 2. Second embodiment The substrate processing apparatus according to the second embodiment will be described with respect to the differences from the substrate processing apparatus 1 according to the first embodiment. Fig. 5 is a schematic configuration diagram of the substrate processing apparatus according to the second embodiment.

[0111] 5, in the first circulation device 110 according to this embodiment, in addition to the pump 12, the flow meter 13, and the adjustment unit 14, a heater 17 and a filter 18 are provided in the pressure-feeding pipe p12. Furthermore, the first sub-storage tank 10 is provided with a temperature sensor TS1 that detects the temperature of the DIW stored in the first sub-storage tank 10.

[0112] With this configuration, when the first circulation device 110 operates in the first liquid circulation mode, the heater 17 can be controlled based on the detection result of the temperature sensor TS1, thereby adjusting the temperature of the DIW flowing through the first circulation system to a desired temperature.

[0113] In the second circulation device 120 according to this embodiment, the pressure-feeding pipe p22 is provided with a heater 27 and a filter 28 in addition to the pump 22, the flowmeter 23, and the adjustment unit 24. Furthermore, the second sub-storage tank 20 is provided with a temperature sensor TS2 that detects the temperature of the HF stored in the second sub-storage tank 20.

[0114] With this configuration, when the second circulation device 120 operates in the second liquid circulation mode, the heater 27 is controlled based on the detection result of the temperature sensor TS2, thereby adjusting the temperature of the HF flowing through the second circulation system to a desired temperature.

[0115] In this embodiment, the flow state includes the flow rate and temperature of the DIW flowing through the first circulation system, and the flow rate and temperature of the HF flowing through the second circulation system. Also, in this embodiment, the liquid generation condition includes that the flow rate of the DIW flowing through the first circulation system is within a first flow rate range, the temperature of the DIW flowing through the first circulation system is within a first temperature range, the flow rate of the HF flowing through the second circulation system is within a second flow rate range, and the temperature of the HF flowing through the second circulation system is within a second temperature range.

[0116] In this case, the CPU 91 can determine whether the liquid production condition is satisfied based on the detection results of the flow meters 13 and 23 and the detection results of the temperature sensors TS1 and TS2. Specifically, the CPU 91 can determine whether the flow rate of the DIW flowing through the first circulation system is within a first flow rate range and the flow rate of the HF flowing through the second circulation system is within a second flow rate range based on the detection results of the flow meters 13 and 23. The CPU 91 can also determine whether the temperature of the DIW flowing through the first circulation system is within a first temperature range and the temperature of the HF flowing through the second circulation system is within a second temperature range based on the detection results of the temperature sensors TS1 and TS2. This allows the mixing and leading-out section 130 to generate a processing liquid having a desired temperature under stable temperature conditions.

[0117] 3. Third embodiment The substrate processing apparatus according to the third embodiment will be described with respect to the differences from the substrate processing apparatus 1 according to the first embodiment. Fig. 6 is a schematic configuration diagram of the substrate processing apparatus according to the third embodiment.

[0118] As shown in FIG. 6, the substrate processing apparatus 1 according to this embodiment includes a first supply device 150 and a second supply device 160 instead of the first circulation device 110 and the second circulation device 120 of FIG.

[0119] The first supply device 150 has a configuration in which the circulation pipe p13 and the valve 15 are removed from the first circulation device 110 in Fig. 1. Therefore, the first supply device 150 in Fig. 6 does not have a first circulation system that circulates DIW.

[0120] The second supply device 160 has a configuration in which the circulation pipe p23 and the valve 25 in the second circulation device 120 in Fig. 1 are removed. Therefore, the second supply device 160 in Fig. 6 does not have a second circulation system for circulating HF.

[0121] Even in such a case, in the substrate processing apparatus 1 according to this embodiment, the first supply device 150 includes the first sub-storage tank 10. In this case, the first sub-storage tank 10 functions as a buffer tank (buffer tank) that buffers fluctuations in the flow rate and pressure of the DIW supplied from the first liquid supply source 5. This suppresses the occurrence of significant disturbances in the state of the DIW sent to the mixing and outlet portion 130, compared to when the DIW is directly supplied from the first liquid supply source 5 to the mixing and outlet portion 130.

[0122] Furthermore, in the substrate processing apparatus 1 according to this embodiment, the second supply device 160 includes the second sub-storage tank 20. In this case, the second sub-storage tank 20 functions as a buffer tank (buffer tank) that buffers fluctuations in the flow rate, pressure, and the like of the HF supplied from the second liquid supply source 6. This suppresses the occurrence of significant disturbances in the state of the HF sent to the mixing and outlet portion 130, as compared to the case in which HF is directly supplied from the second liquid supply source 6 to the mixing and outlet portion 130.

[0123] Thus, in this embodiment, the first sub-storage tank 10 is included in the DIW flow path connecting the first liquid supply source 5 and the mixing outlet 130. Also, the second sub-storage tank 20 is included in the HF flow path connecting the second liquid supply source 6 and the mixing outlet 130. This suppresses the generation of processing liquid under unstable conditions, making it unnecessary to perform a process such as pre-draining to remove low-quality processing liquid. As a result, it becomes possible to stably supply high-quality processing liquid generated according to predetermined conditions to one or more substrate processing units 3 without discarding low-quality processing liquid.

[0124] The first supply device 150 and the second supply device 160 are not configured to be operable in a plurality of operation modes, unlike the first circulation device 110 and the second circulation device 120 in Fig. 1. Therefore, in this embodiment, unlike the first and second embodiments, the generation of the treatment liquid based on the liquid generation conditions is not performed.

[0125] 4. Other embodiments 7(a) is a block diagram showing a configuration example of a substrate processing apparatus 1 according to another embodiment. As shown in FIG. 7, the substrate processing apparatus 1 may have a plurality of substrate processing sections 3. In this case, the processing liquid supplying apparatus 2 may supply a processing liquid to the plurality of substrate processing sections 3.

[0126] In addition, the processing liquid supplying apparatus 2 may be configured to supply processing liquid to the substrate processing section 3 within the substrate processing apparatus 1 including the processing liquid supplying apparatus 2, as well as to be capable of supplying processing liquid to the substrate processing section 3 of another substrate processing apparatus 1.

[0127] (b) In the substrate processing apparatus 1 according to the first and second embodiments, the first circulation device 110 does not need to be provided with the first sub-storage tank 10. Even in this case, the first circulation system is formed in the first circulation device 110, and the first circulation system functions as a buffer flow path that buffers fluctuations in flow rate and pressure from the first liquid supply source 5. This prevents large disturbances from occurring in the flow state of the DIW in the first circulation system.

[0128] (c) In the substrate processing apparatus 1 according to the first and second embodiments, the second circulation device 120 does not need to be provided with the second sub-storage tank 20. Even in this case, the second circulation device 120 forms a second circulation system, and the second circulation system functions as a buffer flow path that buffers fluctuations in flow rate and pressure from the second liquid supply source 6. This prevents significant disturbances in the flow state of HF in the second circulation system.

[0129] (d) In the substrate processing apparatus 1 according to the first and second embodiments, the liquid generating condition may include only that the flow rate of DIW flowing through the first circulation system is within a first flow rate range and the flow rate of HF flowing through the second circulation system is within a second flow rate range. Alternatively, the liquid generating condition may include only that a predetermined period of time (e.g., about 5 to 10 seconds) has elapsed since the operation of the first circulation device 110 and the second circulation device 120 was started in the process of step S12 in FIG. 4.

[0130] (e) In the substrate processing apparatus 1 according to the first and second embodiments, the pumps 12, 22 may be configured to be able to adjust the flow rates of the liquids flowing therethrough to some extent. In this case, the control unit 9 may adjust the pumps 12, 22 to adjust the flow rates of the liquids flowing through the first and second circulation systems.

[0131] (f) In the substrate processing apparatus 1 according to the first and second embodiments, the pumps 12 and 22 are maintained in a stopped state when no processing liquid is produced, but the present invention is not limited to this. The pumps 12 and 22 may be maintained in an operating state at all times while the power supply of the substrate processing apparatus 1 is turned on.

[0132] In this case, when the power supply of the substrate processing apparatus 1 is turned on, DIW flows through the first circulation system, and HF flows through the second circulation system. Therefore, when each circulation system has a heating unit such as a heater as in the second embodiment, it becomes possible to always store a constant amount of temperature-adjusted DIW and HF in the sub-storage tank.

[0133] (g) In the substrate processing apparatus 1 according to the first to third embodiments, the substrate processing section 3 includes a plurality of processing units 4, but the substrate processing section 3 may include only one processing unit 4.

[0134] (h) In the substrate processing apparatus 1 according to the above embodiment, the DIW stored in the first sub-storage tank 10 is sucked by the pump 12 and pumped through the pressure-feeding pipe p12, but the present invention is not limited to this. The first sub-storage tank 10 may be provided with a pressurizing device that supplies an inert gas into the first sub-storage tank 10. In this case, the pressurizing device increases the pressure in the first sub-storage tank 10, so that the DIW in the first sub-storage tank 10 can be circulated through the pressure-feeding pipe p12.

[0135] (i) In the substrate processing apparatus 1 according to the above embodiment, the HF stored in the second sub-storage tank 20 is sucked by the pump 22 and pumped through the pumping pipe p22, but the present invention is not limited to this. The second sub-storage tank 20 may be provided with a pressurizing device that supplies an inert gas into the second sub-storage tank 20. In this case, the pressurizing device increases the pressure in the second sub-storage tank 20, so that the HF in the second sub-storage tank 20 can be circulated through the pumping pipe p22.

[0136] (j) In the substrate processing apparatus 1 according to the above embodiment, the processing liquid is generated by mixing two types of liquid (DIW and HF), but the present invention is not limited to this. The substrate processing apparatus 1 may be configured to be capable of mixing three or more types of liquid. For example, the substrate processing apparatus 1 may include three circulation devices or supply devices having basically the same configuration as the first circulation device 110, and may include a mixing outlet section that mixes the three types of liquid flowing through the three circulation devices.

[0137] 5. Correspondence between each component of the claims and each part of the embodiment Below, examples of the correspondence between each component of the claims and each element of the embodiment will be described, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each component of the claims.

[0138] In the above embodiment, a dilution liquid such as DIW is an example of a first liquid, a chemical liquid such as HF is an example of a second liquid, the substrate processing unit 3 is an example of one or more substrate processing units, the processing liquid supply device 2 is an example of a processing liquid supply device, the main storage tank 30 is an example of a main storage tank, the liquid supply unit 140 is an example of a liquid supply unit, and the mixing outlet unit 130 is an example of a mixing outlet unit.

[0139] In addition, the first liquid supply source 5 is an example of a first liquid supply source, the first circulation device 110 is an example of a first circulation device, the second liquid supply source 6 is an example of a second liquid supply source, the second circulation device 120 is an example of a second circulation device, the pump 12, the adjustment unit 14, the heater 17 and the filter 18 are examples of a first condition adjustment unit, the pump 22, the adjustment unit 24, the heater 27 and the filter 28 are examples of a second condition adjustment unit, and the control unit 9 is an example of a control unit.

[0140] Further, examples of the first condition are that the flow rate of DIW flowing through the first circulation system is within a first flow rate range, that a predetermined fixed time has elapsed since the operation of the first circulation device 110 was started, and that the temperature of the DIW flowing through the first circulation system is within a first temperature range, and examples of the second condition are that the flow rate of HF flowing through the second circulation system is within a second flow rate range, that a predetermined fixed time has elapsed since the operation of the second circulation device 120 was started, and that the temperature of the HF flowing through the second circulation system is within a second temperature range.

[0141] Furthermore, pump 12 is an example of a first pump, pump 22 is an example of a second pump, the regulator of adjustment unit 14 is an example of a first adjustment valve, the motor needle valve of adjustment unit 24 is an example of a second adjustment valve, flow meter 13 is an example of a first flow meter, flow meter 23 is an example of a second flow meter, heater 17 is an example of a first heating unit, and heater 27 is an example of a second heating unit.

[0142] In addition, the first sub-storage tank 10 is an example of a first sub-storage section, the second sub-storage tank 20 is an example of a second sub-storage section, the first supply device 150 is an example of a first supply device, the second supply device 160 is an example of a second supply device, and the substrate processing apparatus 1 is an example of a substrate processing apparatus.

[0143] 6. Summary of the embodiment (Item 1) The processing liquid supplying device according to item 1 comprises: A processing liquid supplying apparatus that supplies a mixed liquid containing a first liquid and a second liquid as a processing liquid to one or more substrate processing sections, a liquid supply unit including a main reservoir tank for storing the mixed liquid, the liquid supply unit supplying the mixed liquid stored in the main reservoir tank as the processing liquid to the one or more substrate processing units; A mixed liquid outlet portion that introduces the mixed liquid into the main storage tank; a first circulation device having a first circulation system connected to a first liquid supply source and supplying the first liquid flowing through at least a part of the first circulation system to the mixing outlet; The second circulation device has a second circulation system connected to a second liquid supply source and supplies the second liquid flowing through at least a part of the second circulation system to the mixing outlet portion.

[0144] In the processing liquid supplying device, a first liquid supplied from a first liquid supply source circulates through a first circulation system. A second liquid supplied from a second liquid supply source circulates through a second circulation system. The first liquid circulating through the first circulation system and the second liquid circulating through the second circulation system are supplied to a mixing and outlet section. Thus, the first liquid and the second liquid are mixed in the mixing and outlet section.

[0145] A mixture containing the first liquid and the second liquid is generated and stored in a main reservoir tank, and the mixture stored in the main reservoir tank is supplied to one or more substrate processing units as a processing liquid.

[0146] In the above configuration, the first circulation system receives the first liquid supplied from the first liquid supply source and functions as a buffer flow path that buffers fluctuations in the flow rate, pressure, etc. of the first liquid. This prevents the first liquid flowing from the first circulation system to the mixing outlet section from being significantly disturbed. The second circulation system receives the second liquid supplied from the second liquid supply source and functions as a buffer flow path that buffers fluctuations in the flow rate, pressure, etc. of the second liquid. This prevents the second liquid flowing from the second circulation system to the mixing outlet section from being significantly disturbed.

[0147] In this case, the first liquid and the second liquid can be mixed in a relatively stable state in the mixing and outlet section. Therefore, the processing liquid is generated with relatively high accuracy. Furthermore, since the generation of the processing liquid under unstable conditions is suppressed, a process for removing the low-quality processing liquid, such as pre-draining, is not required. As a result, it is possible to stably supply a high-quality processing liquid generated according to predetermined conditions to one or more substrate processing sections without discarding the low-quality processing liquid.

[0148] (2) In the processing liquid supplying apparatus according to the first aspect, the first circulation system includes a first condition adjusting unit that adjusts a condition of the first liquid flowing through the first circulation system; The second circulation system may include a second condition adjusting unit that adjusts a condition of the second liquid flowing through the second circulation system.

[0149] In this case, the state of the first liquid flowing from the first circulation system to the mixing outlet portion can be adjusted to an appropriate state. Also, the state of the second liquid flowing from the second circulation system to the mixing outlet portion can be adjusted to an appropriate state. As a result, the first liquid and the second liquid can be mixed with high accuracy according to predetermined conditions.

[0150] (Item 3) In the processing liquid supplying apparatus according to item 2, the first circulation device is configured to be operable in a first liquid circulation mode in which the first liquid is circulated through the first circulation system, and a first liquid supply mode in which the first liquid flowing through at least a portion of the first circulation system is supplied to the mixing outlet portion, the second circulation device is configured to be operable in a second liquid circulation mode in which the second liquid is circulated through the second circulation system, and a second liquid supply mode in which the second liquid flowing through at least a portion of the second circulation system is supplied to the mixing outlet portion, The processing liquid supply device includes: The system may further include a control unit that switches the operation mode of the first circulation device from the first liquid circulation mode to the first liquid supply mode and switches the operation mode of the second circulation device from the second liquid circulation mode to the second liquid supply mode when the first circulation device operates in the first liquid circulation mode and the second circulation device operates in the second liquid circulation mode, when a state of the first liquid flowing through the first circulation system satisfies a predetermined first condition and a state of the second liquid flowing through the second circulation system satisfies a predetermined second condition.

[0151] In this case, in the first circulation device in the first liquid circulation mode, the first condition adjusting unit can adjust the state of the first liquid flowing through the first circulation system so as to satisfy the first condition. In the second circulation device in the second liquid circulation mode, the second condition adjusting unit can adjust the state of the second liquid flowing through the second circulation system so as to satisfy the second condition.

[0152] When a first condition is satisfied in the first circulation device in the first liquid circulation mode and a second condition is satisfied in the second circulation device in the second liquid circulation mode, the operation modes of the circulation devices are switched. As a result, the first liquid is supplied to the mixing outlet in a state where the first condition is satisfied, and the second liquid is supplied to the mixing outlet in a state where the second condition is satisfied. Therefore, the first liquid and the second liquid are appropriately mixed in the mixing outlet.

[0153] According to the above configuration, it is possible to prevent the first liquid and the second liquid from being mixed in an unintended state to generate a treatment liquid. Also, it is possible to mix the first liquid and the second liquid with high accuracy according to a predetermined condition.

[0154] (4) In the processing liquid supplying apparatus according to the third aspect, the first condition adjustment unit includes a first pump that pumps the first liquid in the first circulation system when in the first liquid circulation mode, and pumps the first liquid flowing through the first circulation system to the mixing outlet when in the first liquid supply mode, the second condition adjustment unit includes a second pump that pumps the second liquid in the second circulation system when in the second liquid circulation mode, and pumps the second liquid flowing through the second circulation system to the mixing outlet when in the second liquid supply mode, the first condition includes that an amount of the first liquid flowing through the first circulation system per unit time is within a predetermined first flow rate range; The second condition may include that an amount per unit time of the second liquid flowing through the second circulatory system is within a predetermined second flow rate range.

[0155] In this case, the flow rate of the first liquid flowing through the first circulation system can be adjusted with high precision. Also, the flow rate of the second liquid flowing through the second circulation system can be adjusted with high precision. This allows the flow rates of the first liquid and the second liquid supplied to the mixing outlet to be adjusted with high precision. As a result, the first liquid and the second liquid can be mixed with high precision according to a predetermined ratio.

[0156] (Item 5) In the processing liquid supplying apparatus according to item 4, the first condition adjusting unit further includes a first adjusting valve that adjusts a flow rate of the first liquid flowing through the first circulation system; The second condition adjusting unit may further include a second adjusting valve that adjusts a flow rate of the second liquid flowing through the second circulation system.

[0157] In this case, the flow rate of the first liquid flowing through the first circulation system can be adjusted with higher accuracy. Also, the flow rate of the second liquid flowing through the second circulation system can be adjusted with higher accuracy. This allows the flow rates of the first liquid and the second liquid supplied to the mixing outlet to be adjusted with higher accuracy. As a result, the first liquid and the second liquid can be mixed with higher accuracy according to a predetermined ratio.

[0158] (Item 6) In the processing liquid supplying device according to any one of items 1 to 5, the first circulatory system includes a first flow meter that detects a flow rate of the first liquid flowing through the first circulatory system; The second circulation system may include a second flow meter that detects a flow rate of the second liquid flowing through the second circulation system.

[0159] In this case, the state of the first liquid can be adjusted by controlling each part of the first circulation system based on the detection result of the first flow meter, and the state of the second liquid can be adjusted by controlling each part of the second circulation system based on the detection result of the second flow meter.

[0160] Furthermore, based on the detection results of the first flow meter and the detection results of the second flow meter, it becomes possible to determine whether the state of the first liquid satisfies the first condition and whether the state of the second liquid satisfies the second condition.

[0161] (Item 7) In the processing liquid supplying apparatus according to any one of items 3 to 5, the first condition adjusting unit includes a first heating unit that heats the first liquid flowing through the first circulation system; the second condition adjusting unit includes a second heating unit that heats the second liquid flowing through the second circulation system, the first condition includes that a temperature of the first liquid flowing through the first circulation system is within a predetermined first temperature range; The second condition may include that a temperature of the second liquid flowing through the second circulation system is within a predetermined second temperature range.

[0162] In this case, the processing liquid is generated by mixing a first liquid within a first temperature range and a second liquid within a second temperature range, whereby the mixed liquid can be generated under stable temperature conditions.

[0163] (Item 8) In the processing liquid supplying device according to any one of items 1 to 7, the first circulatory system includes a first sub-reservoir configured to retain a predetermined amount of the first liquid supplied from the first liquid supply source; The second circulatory system may include a second sub-reservoir that stores a predetermined amount of the second liquid supplied from the second liquid supply source.

[0164] In this case, the first sub-storage tank functions as a buffer tank that buffers fluctuations in the flow rate, pressure, etc. of the first liquid supplied from the first liquid supply source to the first circulatory system, thereby suppressing the occurrence of significant disturbances in the state of the first liquid flowing through the first circulatory system, which is caused by the supply of the first liquid from the first liquid supply source to the first circulatory system.

[0165] The second sub-storage tank also functions as a buffer tank that buffers fluctuations in the flow rate, pressure, etc. of the second liquid supplied from the second liquid supply source to the second circulatory system, thereby suppressing the occurrence of significant disturbances in the state of the second liquid flowing through the second circulatory system, which is caused by the supply of the second liquid from the second liquid supply source to the second circulatory system.

[0166] (Item 9) The processing liquid supplying device according to item 9 comprises: A processing liquid supplying apparatus that supplies a mixed liquid containing a first liquid and a second liquid as a processing liquid to one or more substrate processing sections, a liquid supply unit including a main reservoir tank for storing the mixed liquid, the liquid supply unit supplying the mixed liquid stored in the main reservoir tank as the processing liquid to the one or more substrate processing units; A mixed liquid outlet portion that introduces the mixed liquid into the main storage tank; a first sub-reservoir connected to a first liquid supply source and configured to store a predetermined amount of the first liquid supplied from the first liquid supply source; a first supply device that supplies the first liquid stored in the first sub-storage tank to the mixing outlet; a second sub-reservoir connected to a second liquid supply source and configured to store a predetermined amount of the second liquid supplied from the second liquid supply source; and a second supply device that supplies the second liquid stored in the second sub-storage tank to the mixing outlet portion.

[0167] In the processing liquid supply device, a first liquid supplied from a first liquid supply source is stored in a first sub-storage tank. A second liquid supplied from a second liquid supply source is stored in a second sub-storage tank. The first liquid stored in the first sub-storage tank is supplied to a mixing and outlet portion, and the second liquid stored in the second sub-storage tank is supplied to the mixing and outlet portion. Thus, the first liquid and the second liquid are mixed in the mixing and outlet portion.

[0168] A mixture of the first liquid and the second liquid is generated and stored in a main reservoir, and the mixture stored in the main reservoir is supplied to one or more substrate processing units as a processing liquid.

[0169] In the above configuration, the first sub-storage tank receives the first liquid supplied from the first liquid supply source and functions as a buffer tank that buffers fluctuations in the flow rate, pressure, etc. of the first liquid. This prevents large disturbances from occurring in the flow state of the first liquid flowing from the first sub-storage tank to the mixing and outlet portion. The second sub-storage tank receives the second liquid supplied from the second liquid supply source and functions as a buffer tank that buffers fluctuations in the flow rate, pressure, etc. of the second liquid. This prevents large disturbances from occurring in the flow state of the second liquid flowing from the second sub-storage tank to the mixing and outlet portion.

[0170] In this case, the first liquid and the second liquid can be mixed in a relatively stable state in the mixing and outlet section. Therefore, the processing liquid is generated with relatively high accuracy. Furthermore, since the generation of the processing liquid under unstable conditions is suppressed, a process for removing the low-quality processing liquid, such as pre-draining, is not required. As a result, it is possible to stably supply a high-quality processing liquid generated according to predetermined conditions to one or more substrate processing sections without discarding the low-quality processing liquid.

[0171] (Item 10) The substrate processing apparatus according to item 10 includes: A processing liquid supplying device according to any one of items 1 to 9, and the one or more substrate processing sections.

[0172] The substrate processing apparatus includes the above-mentioned processing liquid supply device, and therefore, it is possible to perform substrate processing using high-quality processing liquid while reducing the consumption of each liquid used in generating the processing liquid.

[0173] (Item 11) The processing liquid supply method according to item 11 includes: 1. A processing liquid supplying method for supplying a mixed liquid containing a first liquid and a second liquid as a processing liquid to one or more substrate processing sections, comprising: Supplying the first liquid and the second liquid to a mixed outlet portion using a first circulation device and a second circulation device; a step of mixing the first liquid and the second liquid supplied by using the first circulation device and the second circulation device in the mixing and outlet portion, and guiding the mixed liquid to a main storage tank; supplying the mixed liquid stored in the main storage tank as the processing liquid to the one or more substrate processing units; the first circulation device has a first circulation system connected to a first liquid supply source; The second circulation device has a second circulation system connected to a second liquid source.

[0174] In the processing liquid supply method, a first liquid supplied from a first liquid supply source circulates through a first circulation system. A second liquid supplied from a second liquid supply source circulates through a second circulation system. The first liquid circulating through the first circulation system and the second liquid circulating through the second circulation system are supplied to a mixing and outlet section. Thus, the first liquid and the second liquid are mixed in the mixing and outlet section.

[0175] A mixture containing the first liquid and the second liquid is generated and stored in a main reservoir tank, and the mixture stored in the main reservoir tank is supplied to one or more substrate processing units as a processing liquid.

[0176] In the above configuration, the first circulation system receives the first liquid supplied from the first liquid supply source and functions as a buffer flow path that buffers fluctuations in the flow rate, pressure, etc. of the first liquid. This prevents the first liquid flowing from the first circulation system to the mixing outlet section from being significantly disturbed. The second circulation system receives the second liquid supplied from the second liquid supply source and functions as a buffer flow path that buffers fluctuations in the flow rate, pressure, etc. of the second liquid. This prevents the second liquid flowing from the second circulation system to the mixing outlet section from being significantly disturbed.

[0177] In this case, the first liquid and the second liquid can be mixed in a relatively stable state in the mixing and outlet section. Therefore, the processing liquid is generated with relatively high accuracy. Furthermore, since the generation of the processing liquid under unstable conditions is suppressed, a process for removing the low-quality processing liquid, such as pre-draining, is not required. As a result, it is possible to stably supply a high-quality processing liquid generated according to predetermined conditions to one or more substrate processing sections without discarding the low-quality processing liquid.

[0178] (Item 12) The processing liquid supply method according to item 12 includes: 1. A processing liquid supplying method for supplying a mixed liquid containing a first liquid and a second liquid as a processing liquid to one or more substrate processing sections, comprising: supplying the first liquid and the second liquid to a mixing outlet from a first sub-storage tank connected to a first liquid supply source and storing a predetermined amount of the first liquid supplied from the first liquid supply source, and a second sub-storage tank connected to a second liquid supply source and storing a predetermined amount of the second liquid supplied from the second liquid supply source; mixing the first liquid and the second liquid in the mixing outlet portion and guiding the mixed liquid to a main storage tank; and supplying the mixed liquid stored in the main reservoir as the processing liquid to the one or more substrate processing units.

[0179] In the processing liquid supply method, a first liquid supplied from a first liquid supply source is stored in a first sub-storage tank. A second liquid supplied from a second liquid supply source is stored in a second sub-storage tank. The first liquid stored in the first sub-storage tank is supplied to a mixing and outlet portion, and the second liquid stored in the second sub-storage tank is supplied to the mixing and outlet portion. Thus, the first liquid and the second liquid are mixed in the mixing and outlet portion.

[0180] A mixture of the first liquid and the second liquid is generated and stored in a main reservoir, and the mixture stored in the main reservoir is supplied to one or more substrate processing units as a processing liquid.

[0181] In the above configuration, the first sub-storage tank receives the first liquid supplied from the first liquid supply source and functions as a buffer tank that buffers fluctuations in the flow rate, pressure, etc. of the first liquid. This prevents large disturbances from occurring in the flow state of the first liquid flowing from the first sub-storage tank to the mixing and outlet portion. The second sub-storage tank receives the second liquid supplied from the second liquid supply source and functions as a buffer tank that buffers fluctuations in the flow rate, pressure, etc. of the second liquid. This prevents large disturbances from occurring in the flow state of the second liquid flowing from the second sub-storage tank to the mixing and outlet portion.

[0182] In this case, the first liquid and the second liquid can be mixed in a relatively stable state in the mixing and outlet section. Therefore, the processing liquid is generated with relatively high accuracy. Furthermore, since the generation of the processing liquid under unstable conditions is suppressed, a process for removing the low-quality processing liquid, such as pre-draining, is not required. As a result, it is possible to stably supply a high-quality processing liquid generated according to predetermined conditions to one or more substrate processing sections without discarding the low-quality processing liquid.

[0183] The processing liquid supplying apparatus, the substrate processing apparatus, and the substrate processing method according to the above-mentioned embodiments can suppress the wasteful consumption of the raw liquid for generating the processing liquid, thereby contributing to the reduction of global environmental pollution caused by the processing liquid. [Explanation of symbols]

[0184] 1...substrate processing apparatus, 2...processing liquid supply apparatus, 3...substrate processing section, 4...processing unit, 4a...spin chuck, 4b...nozzle, 4c...cup, 5...first liquid supply source, 6...second liquid supply source, 9...control section, 10...first sub-storage tank, 11, 15, 16, 21, 25, 26...valve, 12...pump, 13...flow meter, 14...adjustment section, 17...heater, 18...filter, 20...second sub-storage tank, 22...pump, 23...flow meter, 24...adjustment section, 27...heater, 28...filter, 30...main storage tank, 31...pump, 32...heater, 33...filter, 9 1...CPU, 92...RAM, 93...ROM, 94...storage device, 95...CD-ROM, 110...first circulation device, 120...second circulation device, 130...mixing and outlet section, 140...liquid supply section, 150...first supply device, 160...second supply device, L1...lower limit level, L2...prescribed level, LS1, LS2, LS3...liquid level sensor, TS1, TS2...temperature sensor, W...substrate, p11, p21...supply source piping, p12, p22...pressure transfer piping, p13, p23...circulation piping, p14, p24, p32...supply piping, p31...mixing piping, p33...recovery piping

Claims

1. A processing liquid supplying apparatus that supplies a mixed liquid containing a first liquid and a second liquid as a processing liquid to one or more substrate processing units, comprising: a liquid supply unit including a main reservoir tank for storing the mixed liquid, the liquid supply unit supplying the mixed liquid stored in the main reservoir tank as the processing liquid to the one or more substrate processing units; A mixed liquid outlet portion that introduces the mixed liquid into the main storage tank; a first circulation device having a first circulation system connected to a first liquid supply source and supplying the first liquid flowing through at least a part of the first circulation system to the mixing outlet; a second circulation device having a second circulation system connected to a second liquid supply source and supplying the second liquid flowing through at least a part of the second circulation system to the mixing outlet section.

2. the first circulation system includes a first condition adjusting unit that adjusts a condition of the first liquid flowing through the first circulation system, 2. The processing liquid supply apparatus according to claim 1, wherein the second circulation system includes a second condition adjusting unit that adjusts a condition of the second liquid flowing through the second circulation system.

3. the first circulation device is configured to be operable in a first liquid circulation mode in which the first liquid is circulated through the first circulation system, and a first liquid supply mode in which the first liquid flowing through at least a portion of the first circulation system is supplied to the mixing outlet portion, the second circulation device is configured to be operable in a second liquid circulation mode in which the second liquid is circulated through the second circulation system, and a second liquid supply mode in which the second liquid flowing through at least a portion of the second circulation system is supplied to the mixing outlet portion, The processing liquid supply device includes:

3. The processing liquid supply apparatus according to claim 2, further comprising a control unit that switches an operation mode of the first circulation device from the first liquid circulation mode to the first liquid supply mode and switches an operation mode of the second circulation device from the second liquid circulation mode to the second liquid supply mode when the first circulation device operates in the first liquid circulation mode and the second circulation device operates in the second liquid circulation mode, when a state of the first liquid flowing through the first circulation system satisfies a predetermined first condition and a state of the second liquid flowing through the second circulation system satisfies a predetermined second condition.

4. the first condition adjustment unit includes a first pump that pumps the first liquid in the first circulation system when in the first liquid circulation mode, and pumps the first liquid flowing through the first circulation system to the mixing outlet when in the first liquid supply mode, the second condition adjustment unit includes a second pump that pumps the second liquid in the second circulation system when in the second liquid circulation mode, and pumps the second liquid flowing through the second circulation system to the mixing outlet when in the second liquid supply mode, the first condition includes that an amount of the first liquid flowing through the first circulation system per unit time is within a predetermined first flow rate range; 4. The processing liquid supplying apparatus according to claim 3, wherein the second condition includes a condition that an amount of the second liquid flowing through the second circulation system per unit time is within a second predetermined flow rate range.

5. the first condition adjusting unit further includes a first adjusting valve that adjusts a flow rate of the first liquid flowing through the first circulation system; 5. The processing liquid supplying apparatus according to claim 4, wherein the second condition adjusting unit further includes a second adjusting valve that adjusts a flow rate of the second liquid flowing through the second circulation system.

6. the first circulatory system includes a first flow meter that detects a flow rate of the first liquid flowing through the first circulatory system; 6. The processing liquid supplying apparatus according to claim 1, wherein the second circulation system includes a second flowmeter that detects a flow rate of the second liquid flowing through the second circulation system.

7. the first condition adjusting unit includes a first heating unit that heats the first liquid flowing through the first circulation system, the second condition adjusting unit includes a second heating unit that heats the second liquid flowing through the second circulation system, the first condition includes that a temperature of the first liquid flowing through the first circulation system is within a predetermined first temperature range; The processing liquid supplying apparatus according to any one of claims 3 to 5, wherein the second condition includes that a temperature of the second liquid flowing through the second circulation system is within a predetermined second temperature range.

8. the first circulatory system includes a first sub-reservoir configured to retain a predetermined amount of the first liquid supplied from the first liquid supply source; The processing liquid supply apparatus according to any one of claims 1 to 5, wherein the second circulation system includes a second sub-storage tank that stores a predetermined amount of the second liquid supplied from the second liquid supply source.

9. A processing liquid supplying apparatus that supplies a mixed liquid containing a first liquid and a second liquid as a processing liquid to one or more substrate processing units, comprising: a liquid supply unit including a main reservoir tank for storing the mixed liquid, the liquid supply unit supplying the mixed liquid stored in the main reservoir tank as the processing liquid to the one or more substrate processing units; A mixed liquid outlet portion that introduces the mixed liquid into the main storage tank; a first sub-reservoir connected to a first liquid supply source and configured to store a predetermined amount of the first liquid supplied from the first liquid supply source; a first supply device that supplies the first liquid stored in the first sub-storage tank to the mixing outlet; a second sub-reservoir connected to a second liquid supply source and configured to store a predetermined amount of the second liquid supplied from the second liquid supply source; a second supply device that supplies the second liquid stored in the second sub-storage tank to the mixing outlet portion.

10. A processing liquid supplying device according to any one of claims 1 to 5, The one or more substrate processing units are provided. Substrate processing equipment.

11. 1. A processing liquid supplying method for supplying a mixed liquid containing a first liquid and a second liquid as a processing liquid to one or more substrate processing sections, comprising: Supplying the first liquid and the second liquid to a mixed outlet portion using a first circulation device and a second circulation device; a step of mixing the first liquid and the second liquid supplied by using the first circulation device and the second circulation device in the mixing and outlet portion, and guiding the mixed liquid to a main storage tank; supplying the mixed liquid stored in the main storage tank as the processing liquid to the one or more substrate processing units; the first circulation device has a first circulation system connected to a first liquid supply source; The second circulation device has a second circulation system connected to a second liquid supply source.

12. 1. A processing liquid supplying method for supplying a mixed liquid containing a first liquid and a second liquid as a processing liquid to one or more substrate processing sections, comprising: supplying the first liquid and the second liquid to a mixing outlet from a first sub-storage tank connected to a first liquid supply source and storing a predetermined amount of the first liquid supplied from the first liquid supply source, and a second sub-storage tank connected to a second liquid supply source and storing a predetermined amount of the second liquid supplied from the second liquid supply source; mixing the first liquid and the second liquid in the mixing outlet portion and guiding the mixed liquid to a main storage tank; supplying the mixed liquid stored in the main storage tank as the processing liquid to the one or more substrate processing units.

Citation Information

Patent Citations

  • Substrate processing apparatus and substrate processing method

    JP2020198357A