Optical vibration-proof device, optical device, and magnetic sensor fixing method

Abstract

To provide an optical vibration-proof device in which magnetic sensor for detecting a position of a lens for vibration compensation can be easily and accurately attached to a base member, and provide an optical device, and a magnetic sensor fixing method.SOLUTION: An optical vibration-proof device includes: a base member; a lens holding frame configured to be movable, relative to the base member, along a plane orthogonal to an optical axis; a magnetic material which integrally moves with the lens holding frame, and generates a magnetic field; a position detection Hall element 224 for detecting a change of the magnetic field according to the movement of the lens holding frame; and a sensor attachment member 240 which is fixed to the base member. The base member includes a positioning part 134, and positions the position detection Hall element 224 by a sensor attachment member 140 with the positioning part 134. The base member is constituted with a different member from the sensor attachment member 240.SELECTED DRAWING: Figure 11

Description

[Technical field]

[0001] The present invention relates to an optical vibration isolation device, an optical device, and a magnetic sensor fixing method, and more particularly to a technique for attaching a magnetic sensor that detects the position of a lens for vibration correction to a base member. [Background technology]

[0002] In general, in an optical vibration isolation device, a lens for vibration correction is moved in a plane perpendicular to the optical axis to suppress image blur caused by vibration of the optical device, such as camera shake during handheld photography.

[0003] Patent Document 1 describes a technique for positioning a magnetic sensor (Hall element) that detects the position of a lens for image stabilization.

[0004] The optical vibration isolation device described in Patent Document 1 comprises a lens holding frame that holds a lens for vibration correction, a base member that supports the lens holding frame so that it can be displaced along a plane perpendicular to the optical axis, and a flexible board on which a Hall element is mounted that detects changes in the magnetic field of a magnet provided in the lens holding frame, and the flexible board is positioned and fixed to one side of the base member (the side opposite to the lens holding frame).

[0005] In addition, the Hall element mounted on the flexible substrate protrudes from the other surface (the surface on the lens holding frame side) of the lens holding frame through an opening formed in the base member, and the protruding portion of the Hall element is sandwiched between a pair of Hall element actuation portions and Hall element fixing portions formed integrally with the base member, at the periphery of the opening formed in the base member. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2016-157040 A Summary of the Invention [Problem to be solved by the invention]

[0007] One embodiment of the technology disclosed herein provides an optical vibration isolation device, an optical device, and a magnetic sensor fixing method that enable a magnetic sensor that detects the position of a shake correction lens to be attached to a base member simply, accurately, and reliably so that it does not shift in position due to impact or the passage of time. [Means for solving the problem]

[0008] The optical vibration isolation device according to the first aspect of the present invention comprises a base member, a lens holding frame configured to be movable relative to the base member along a plane perpendicular to the optical axis, a magnetic body that moves integrally with the lens holding frame and generates a magnetic field, a magnetic sensor that detects changes in the magnetic field in response to movement of the lens holding frame, and a sensor mounting member fixed to the base member, wherein the base member has a positioning portion and the sensor mounting member positions the magnetic sensor relative to the positioning portion, and the base member is composed of a separate member from the sensor mounting member.

[0009] In the optical vibration isolation device according to the second aspect of the present invention, it is preferable that the magnetic sensor is mounted on a printed circuit board, and the printed circuit board is fixed to the base member at a position between the lens holding frame and the base member.

[0010] In the optical vibration isolation device according to the third aspect of the present invention, it is preferable that the positioning portion has a recess for avoiding interference with the printed circuit board when the magnetic sensor comes into contact with the positioning portion.

[0011] In the optical vibration isolation device according to the fourth aspect of the present invention, the printed circuit board is preferably a flexible printed circuit board.

[0012] In the optical vibration isolation device according to the fifth aspect of the present invention, it is preferable that the sensor mounting member and the base member each have a position restriction portion capable of directly restricting their positions.

[0013] In the optical vibration isolation device according to the sixth aspect of the present invention, it is preferable that the base member has a first pin and a second pin, the sensor mounting member has a first hole and a second hole formed therein, and the sensor mounting member is positioned on the base member by inserting the first pin and the second pin through the first hole and the second hole, respectively.

[0014] In the optical vibration isolation device according to the seventh aspect of the present invention, it is preferable that the sensor mounting member is formed with a fastening hole through which a fastener is inserted, and the sensor mounting member is fixed to the base member via a fastener that is inserted into the fastening hole and fixed to the base member.

[0015] In the optical vibration isolation device according to the eighth aspect of the present invention, it is preferable that the sensor mounting member also serves as a position restricting member that restricts the position of the magnetic sensor in the optical axis direction.

[0016] In the optical vibration isolation device according to the ninth aspect of the present invention, it is preferable that the sensor mounting member also serves as a fixing member for fixing the printed circuit board to the base member.

[0017] In the optical vibration isolation device according to the tenth aspect of the present invention, it is preferable that the sensor mounting member has an elastic portion, and the magnetic sensor is urged by an elastic force generated in the elastic portion to abut against the positioning portion.

[0018] In the optical vibration isolation device according to the eleventh aspect of the present invention, it is preferable that the base member and the sensor mounting member are each molded from resin.

[0019] In the optical vibration isolation device according to the twelfth aspect of the present invention, the sensor mounting member is preferably a molded product made of a resin having higher molding flowability than the base member.

[0020] In the optical vibration isolation device according to the thirteenth aspect of the present invention, it is preferable that the base member and the sensor mounting member are made of different materials.

[0021] In the optical vibration isolation device according to the fourteenth aspect of the present invention, the sensor mounting member is preferably made of a material having a lower elastic modulus than the base member.

[0022] In the optical vibration isolation device according to the fifteenth aspect of the present invention, the base member and the sensor mounting member are preferably manufactured from materials having the same linear expansion coefficient.

[0023] In the optical vibration isolation device according to the sixteenth aspect of the present invention, the base member is preferably made of a material having higher rigidity than the sensor mounting member.

[0024] In the optical vibration isolation device according to the seventeenth aspect of the present invention, it is preferable that the sensor mounting member has a shape with a larger ratio of overall length to cross-sectional area than the shape of any part of the base member.

[0025] In the optical vibration isolation device according to the eighteenth aspect of the present invention, it is preferable that the magnetic body is a magnet provided in the lens holding frame.

[0026] An optical device according to a nineteenth aspect of the present invention includes the optical vibration isolation device according to any one of the first to eighteenth aspects.

[0027] A twentieth aspect of the invention is a method for fixing a magnetic sensor in an optical vibration isolation device comprising a base member, a lens retaining frame configured to be movable relative to the base member along a plane perpendicular to the optical axis, a magnetic body that moves integrally with the lens retaining frame and generates a magnetic field, a magnetic sensor that detects changes in the magnetic field in response to movement of the lens retaining frame, a printed circuit board on which the magnetic sensor is mounted, and a sensor mounting member fixed to the base member, and which moves the lens retaining frame in a plane perpendicular to the optical axis, the method comprising: placing the printed circuit board on the surface of the base member facing the lens retaining frame, placing the sensor mounting member on the base member with the printed circuit board sandwiched between them, and when fixing the sensor mounting member, positioning the magnetic sensor by the sensor mounting member using a positioning portion provided on the base member, and fixing the sensor mounting member to the base member with the magnetic sensor positioned by the positioning portion. [Brief description of the drawings]

[0028] [Figure 1]FIG. 1 is a block diagram showing an embodiment of a digital camera equipped with an optical vibration isolation device. [Diagram 2] FIG. 2 is a conceptual diagram of the movement of the shake correction lens. [Diagram 3] FIG. 3 is a block diagram of the main functions realized by the camera microcontroller. [Figure 4] FIG. 4 is a front view of the optical vibration isolation device according to the present invention. [Diagram 5] FIG. 5 is a rear view of the optical vibration isolation device shown in FIG. [Figure 6] FIG. 6 is a front view of the optical vibration isolation device with the lens holding frame exposed. [Figure 7] FIG. 7 is a front view of the base member. [Figure 8] FIG. 8 is a perspective view showing a first embodiment of the sensor mounting member. [Figure 9] FIG. 9 is a plan view of the sensor mounting member shown in FIG. [Figure 10] FIG. 10 is a plan view of a tip portion of a flexible printed circuit board. [Figure 11] FIG. 11 is a plan view showing a state in which a sensor attachment member is disposed on the tip portion of a flexible printed circuit board. [Figure 12] FIG. 12 is a diagram showing how the flexible printed circuit board is arranged on the base member. [Figure 13] FIG. 13 is a cross-sectional view taken along line 13-13 in FIG. [Figure 14] FIG. 14 is a plan view of the base member showing a state in which a flexible printed circuit board is disposed on the base member and two Hall elements for position detection are positioned by two sensor mounting members. [Figure 15] FIG. 15 is a perspective view showing how the sensor mounting member is fixed to the base member by a fastener. [Figure 16] 16(A) and (B) are a plan view and a side view, respectively, of the sensor mounting member. [Figure 17] FIG. 17 is a perspective view showing a second embodiment of the sensor mounting member. [Figure 18] FIG. 18 is a plan view of the sensor mounting member shown in FIG. [Figure 19] FIG. 19 is a plan view showing a sensor mounting member according to a third embodiment. [Figure 20] FIG. 20 is a plan view showing a fourth embodiment of the sensor mounting member. [Figure 21] FIG. 21 is a diagram showing another embodiment of the position detector for detecting the position of the lens holding frame. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0029] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of an optical vibration isolation device, an optical device, and a magnetic sensor fixing method according to the present invention will be described with reference to the accompanying drawings.

[0030] [Optical device] FIG. 1 is a block diagram showing an embodiment of a digital camera that is an optical device equipped with an optical image stabilization device according to the present invention.

[0031] The digital camera 1 shown in FIG. 1 is a digital camera with an integrated lens, and includes an optical vibration isolation device 100 of a lens shift type.

[0032] As shown in FIG. 1, the digital camera 1 includes an imaging optical system 10, an image sensor 20, an image sensor driving unit 20A, an analog signal processing unit 22, a digital signal processing unit 24, a display unit 30, a memory unit 32, an operation unit 34, an angular velocity detection unit 40, a camera microcomputer 50, etc.

[0033] The imaging optical system 10 is made up of a plurality of lens groups including a focus lens 12 and a vibration correction lens 14. For convenience, only the focus lens 12 and the vibration correction lens 14 are shown in Fig. 1. The imaging optical system 10 has a diaphragm 16 on its optical path.

[0034] The focus lens 12 is a lens for adjusting focus, and adjusts the focus of the imaging optical system 10 by moving back and forth along the optical axis z. The focus lens 12 is driven by a focus lens driving unit 12A. The focus lens driving unit 12A includes a voice coil motor as an actuator and a driving circuit for the voice coil motor. The focus lens driving unit 12A drives the voice coil motor in response to an instruction from the camera microcomputer 50 to move the focus lens 12.

[0035] The image stabilizer lens 14 is a lens for image stabilizer that corrects image shake caused by camera shake or the like during handheld photography with the digital camera 1, and moves within a plane perpendicular to the optical axis z to correct image shake.

[0036] FIG. 2 is a conceptual diagram of the movement of the shake correction lens 14. As shown in FIG.

[0037] As shown in FIG. 2, the shake correction lens 14 moves freely within an xy plane perpendicular to the optical axis z.

[0038] The x-axis is set as an axis that passes through the center of the image sensor 20 and is parallel to the top and bottom sides of the image sensor 20. The y-axis is set as an axis that passes through the center of the image sensor 20 and is parallel to the left and right sides of the image sensor 20. The direction of the x-axis is the horizontal direction of the digital camera 1, and the direction of the y-axis is the vertical direction of the digital camera 1. The x-axis and y-axis are perpendicular to each other.

[0039] When correcting image shake, the shake correction lens 14 is moved in a direction that cancels the shake. The shake correction lens 14 is driven by an optical vibration isolator 100. The optical vibration isolator 100 will be described in detail later.

[0040] The diaphragm 16 is, for example, an iris diaphragm. The diaphragm 16 is driven by a diaphragm driver 16A, and the opening amount thereof is variable. The diaphragm driver 16A includes a motor as an actuator and a drive circuit for the motor. The diaphragm driver 16A drives the motor in response to an instruction from the camera microcomputer 50, and varies the opening amount of the diaphragm 16.

[0041] The image sensor 20 is a part that receives a light image representing a subject image that passes through the imaging optical system 10 and converts it into an electrical signal (image signal). The image sensor 20 is configured as a known image sensor such as a CMOS (Complementary Metal-Oxide Semiconductor) type or a CCD (Charge Coupled Device) type.

[0042] The image sensor driving unit 20A drives the image sensor 20 in response to instructions from the camera microcomputer 50. By driving the image sensor 20 by the image sensor driving unit 20A, charges corresponding to the amount of received light accumulated in each pixel are read out as an image signal.

[0043] The analog signal processing unit 22 takes in analog image signals for each pixel output from the image sensor 20 and performs predetermined signal processing (e.g., correlated double sampling processing, amplification processing, etc.). The analog signal processing unit 22 includes an ADC (Analog to Digital Converter / AD converter), converts the analog image signals after the predetermined signal processing into digital image signals, and outputs them.

[0044] The digital signal processor 24 takes in the digital image signal output from the analog signal processor 22, and performs predetermined signal processing (e.g., gradation conversion processing, white balance correction processing, gamma correction processing, demosaic processing (also called "synchronization processing"), luminance / color difference conversion processing, etc.) to generate image data. The generated image data is output to the camera microcomputer 50.

[0045] The digital signal processor 24 also detects information on the brightness of the subject, which is necessary for exposure control, based on the captured image signal. The detected information on the brightness of the subject is output to the camera microcomputer 50.

[0046] Furthermore, the digital signal processor 24 detects subject contrast information required for autofocus control based on the captured image signal. The detected contrast information is output to the camera microcomputer 50.

[0047] The display unit 30 displays various information including images. The display unit 30 includes a display device such as a liquid crystal display or an organic EL display (EL: Electro Luminescent), and a drive circuit for the display device.

[0048] The display unit 30 displays a live view in addition to captured images. The live view is a function that displays images captured by the image sensor in real time. By displaying the live view, an image can be captured while checking the image on the display unit 30. The display unit 30 is also used as a display screen for the user interface when performing various settings. The display on the display unit 30 is controlled by the camera microcomputer 50.

[0049] The storage unit 32 stores various data including image data. The storage unit 32 includes a built-in memory and a control circuit that reads and writes data from and to the built-in memory. The built-in memory is, for example, a non-volatile memory such as an EEPROM (Electrically Erasable Programmable Read Only Memory). The reading and writing of data from and to the storage unit 32 is controlled by the camera microcomputer 50.

[0050] Alternatively, the storage unit 32 may be configured with an external memory such as a so-called memory card, etc. In this case, the digital camera 1 is provided with a card slot or the like for inserting the memory card.

[0051] The operation unit 34 includes typical operating means of a digital camera, such as a release button, a power switch, an imaging mode dial, a shutter speed dial, an exposure compensation dial, a command dial, a menu button, a cross key, a decision button, a cancel button, an erase button, and a shake compensation switch, and outputs signals in response to the operations to the camera microcomputer 50.

[0052] Here, the shake correction switch is a switch that turns the shake correction function on and off. When the shake correction switch is turned on, the shake correction function is turned on, and when the shake correction switch is turned off, the shake correction function is turned off.

[0053] The angular velocity detection unit 40 detects the angular velocities of the yaw direction Yaw and pitch direction Pit of the digital camera 1. The yaw direction Yaw is the rotation direction around the y-axis as shown in Fig. 2, and is the horizontal rotation direction of the digital camera 1. The pitch direction Pit is the rotation direction around the x-axis as shown in Fig. 2, and is the vertical rotation direction of the digital camera 1.

[0054] The angular velocity detection unit 40 includes a yaw direction angular velocity detection unit 40A and a pitch direction angular velocity detection unit 40B. An angular velocity signal indicating the angular velocity in the yaw direction Yaw detected by the yaw direction angular velocity detection unit 40A, and an angular velocity signal indicating the angular velocity in the pitch direction Pit detected by the pitch direction angular velocity detection unit 40B are output to the camera microcomputer 50.

[0055] The camera microcomputer 50 functions as a control unit that comprehensively controls the overall operation of the digital camera 1. The camera microcomputer 50 also functions as a calculation processing unit that calculates physical quantities necessary for controlling the digital camera 1.

[0056] The camera microcomputer 50 is composed of a computer (microcomputer) equipped with a CPU (Central Processing Unit), RAM (Random Access Memory), and ROM (Read Only Memory). The camera microcomputer 50 executes a predetermined program to realize various functions. The programs executed by the camera microcomputer 50, various data necessary for control, etc. are stored in the ROM.

[0057] FIG. 3 is a block diagram showing the main functions realized by the camera microcomputer.

[0058] As shown in FIG. 3, the camera microcontroller 50 functions as a focus control unit 52, an exposure setting unit 54, an image sensor drive control unit 56, an aperture control unit 58, a shake correction control unit 60, a display control unit 62, a memory control unit 64, a shake detection unit 70, a shake correction amount calculation unit 90, etc.

[0059] The focus control unit 52 performs autofocus control, that is, detects the in-focus state and moves the focus lens 12 to adjust the focus.

[0060] The exposure setting unit 54 sets a shutter speed (exposure time) and an aperture value that provide appropriate exposure based on the detection result of the brightness of the subject.

[0061] The image sensor drive control unit 56 controls the driving of the image sensor 20 via the image sensor drive unit 20A so that exposure is performed at the shutter speed set by the exposure setting unit .

[0062] The aperture control unit 58 controls the opening amount of the aperture 16 via the aperture drive unit 16A so that the aperture value set by the exposure setting unit 54 is achieved.

[0063] The display control unit 62 controls the display of the display unit 30. For example, when image data obtained by imaging is to be displayed on the display unit 30, the display control unit 62 converts the image data into a data format that can be displayed on the display unit 30 and outputs the image data to the display unit 30.

[0064] The storage control unit 64 controls reading and writing of data from and to the storage unit 32. Image data obtained by imaging is stored in the storage unit 32 via the storage control unit 64. When the image data stored in the storage unit 32 is to be reproduced, the image data is read from the storage unit 32 via the storage control unit 64.

[0065] The shake detection unit 70 calculates the amount of shake of the digital camera 1 based on the detection results of the angular velocities in the yaw direction Yaw and the pitch direction Pit detected by the angular velocity detection unit 40. Specifically, the shake detection unit 70 integrates the angular velocity signal in the yaw direction Yaw output from the yaw direction angular velocity detection unit 40A to calculate the amount of shake in the yaw direction Yaw. The shake detection unit 70 also integrates the angular velocity signal in the pitch direction Pit output from the pitch direction angular velocity detection unit 40B to calculate the amount of shake in the pitch direction Pit.

[0066] The shake correction amount calculation unit 90 calculates the shake correction amount based on the shake amount in the yaw direction Yaw and the shake amount in the pitch direction Pit detected by the shake detection unit 70. The shake correction amount is calculated as the movement amount of the shake correction lens 14 required to cancel the detected shake. Specifically, the shake correction amount is calculated as the movement amount in the x-axis direction and the y-axis direction of the shake correction lens 14 required to cancel the shake.

[0067] The shake correction control unit 60 controls the movement of the shake correction lens 14 based on the shake correction amount calculated by the shake correction amount calculation unit 90, and corrects the image shake.

[0068] <Optical vibration isolation device> Fig. 4 is a front view of the optical vibration isolation device according to the present invention, and Fig. 5 is a rear view of the optical vibration isolation device shown in Fig. 4.

[0069] The optical vibration isolation device 100 comprises a lens retaining frame 110 that holds the shake correction lens 14, a base member 120 that supports the lens retaining frame 110 so that it can move freely in a plane perpendicular to the optical axis, a rotation regulating unit 140 that regulates the rotation of the lens retaining frame 110, a movable range regulating unit 160 that regulates the movable range of the lens retaining frame 110, an x-axis direction driving unit 180 that drives the lens retaining frame 110 in the x-axis direction, a y-axis direction driving unit 190 that drives the lens retaining frame 110 in the y-axis direction, an x-axis direction position detection unit 210 that detects the position of the lens retaining frame 110 in the x-axis direction, and a y-axis direction position detection unit 220 that detects the position of the lens retaining frame 110 in the y-axis direction.

[0070] FIG. 6 is a front view of the optical vibration isolation device with the lens holding frame exposed.

[0071] The lens holding frame 110 has a cylindrical lens holding portion 110A and a flange portion 110B that protrudes outward from the lens holding portion 110A. The shake correction lens 14 is held on the inner periphery of the lens holding portion 110A.

[0072] FIG. 7 is a front view of the base member.

[0073] The base member 120 in this example is a molded product made of resin. The material of the base member 120 may be, for example, a glass fiber reinforced PC (Polycarbonate) resin containing glass fibers, but is not limited thereto and various resins may be used.

[0074] The base member 120 has a cylindrical lens barrel portion 120A, a fixed side ball accommodating portion 128 that accommodates the ball 124, a fixed side spring hook portion 130 to which one end of the spring 126 is hooked, and positioning portions 132, 134 used to position a position detection hall element 214 in the x-axis direction and a position detection hall element 224 in the y-axis direction, which will be described later.

[0075] The lens barrel portion 120A, the fixed side ball receiving portion 128, the fixed side spring hook portion 130, and the positioning portions 132, 134, etc. are integrally molded from the same resin material to form the base member 120. The base member 120 has an opening 120B in the center.

[0076] The base member 120 includes a plurality of balls 124 that movably support the lens holding frame 110 , and a plurality of springs 126 that urge the lens holding frame 110 toward the base member 120 .

[0077] The fixed-side ball receiving portions 128 are provided on a surface facing the flange portion 110B of the lens holding frame 110. The fixed-side ball receiving portions 128 are configured as rectangular recesses, and are provided on the base member 120 at three positions.

[0078] The fixed-side spring hook portions 130 are formed of hook-shaped protrusions extending radially outward, and are provided at four locations on the base member 120.

[0079] As shown in FIG. 6, the lens holding frame 110 is provided with a movable ball receiving portion 116 and a movable spring hook portion 112 corresponding to the fixed ball receiving portion 128 and the fixed spring hook portion 130 provided in the base member 120 .

[0080] The movable ball receiving portion 116 is configured as a circular recess, and is provided on the surface facing the base member 120.

[0081] The movable-side spring hooks 112 are formed of hook-shaped protrusions extending radially outward, and are provided at four locations on the flange portion 110B.

[0082] The spring 126 is formed of a coil spring and is disposed parallel to the optical axis z. One end of the spring 126 is hooked on a fixed-side spring hook portion 130 of the base member 120, and the other end is hooked on a movable-side spring hook portion 112 of the lens holding frame 110. This biases the lens holding frame 110 towards the base member 120.

[0083] The lens holding frame 110 is biased toward the base member 120, whereby the balls 124 are sandwiched between the lens holding frame 110 and the base member 120. In this way, the lens holding frame 110 is supported relative to the base member 120 so as to be freely movable.

[0084] The rotation regulating portion 140 includes a guide shaft 142 arranged perpendicular to the optical axis z, a oscillating base member 144 that supports the guide shaft 142 so that it can oscillate freely, and a guide portion 114 that is integral with the lens holding frame 110 and guides the lens holding frame 110 along the guide shaft 142.

[0085] The guide shaft 142 is made of a metal round bar, and is disposed perpendicular to the optical axis z.

[0086] The oscillating base member 144 has a bracket 146 that holds the guide shaft 142, an oscillating shaft 148 provided on the bracket 146, and an axis base member 150 that supports the oscillating shaft 148. The bracket 146 has a base 146A and a pair of arm portions 146B extending in parallel from the base 146A, and has a U-shape as a whole. The guide shaft 142 is supported at both ends by the pair of arm portions 146B. The oscillating shaft 148 is provided on the base 146A and disposed in parallel with the guide shaft 142. The axis base member 150 is provided integrally with the base member 120, and supports both ends of the oscillating shaft 148 so as to be freely rotatable. The oscillating shaft 148 supported by the axis base member 150 is disposed perpendicular to the optical axis z. As a result, the guide shaft 142 is supported so as to be freely oscillated about an axis perpendicular to the optical axis z.

[0087] The guide portion 114 is provided integrally with the flange portion 110B of the lens holding frame 110. The guide portion 114 has a guide groove 114A into which the guide shaft 142 fits, on the surface facing the base member 120. The guide groove 114A is configured as a U-shaped groove, and is disposed perpendicular to the optical axis of the shake correction lens 14.

[0088] The lens holding frame 110 is restricted from rotating around the optical axis by fitting the guide shaft 142 into the guide groove 114A of the guide portion 114. The lens holding frame 110 is supported so as to be slidable along the guide shaft 142 by fitting the guide shaft 142 into the guide groove 114A of the guide portion 114. This allows the lens holding frame 110 to be supported so as to be movable within a plane perpendicular to the optical axis z. That is, since the guide shaft 142 is supported so as to be swingable about an axis perpendicular to the optical axis z, the movement of the lens holding frame 110 is not hindered even if the lens holding frame 110 moves within a plane perpendicular to the optical axis. This allows the lens holding frame 110 to be supported so as to be movable within a plane perpendicular to the optical axis z.

[0089] In this way, the lens holding frame 110 is supported so as to be freely movable within a plane perpendicular to the optical axis z, but may also be supported so as to be freely movable within a plane approximately perpendicular to the optical axis z as long as performance is not impaired.

[0090] 6, the movable range restricting portion 160 includes a movable range restricting hole 162 provided in the lens holding frame 110, and a stopper 164 that is inserted into the movable range restricting hole 162 to restrict the movable range of the lens holding frame 110. The stopper 164 is attached to the base member 120.

[0091] The movable range restriction holes 162 are an example of an opening. The movable range restriction holes 162 are provided in two places on the flange portion 110B of the lens holding frame 110. The movable range restriction holes 162 are disposed at symmetrical positions with respect to the optical axis of the shake correction lens 14.

[0092] The x-axis direction driver 180 is composed of a voice coil motor, and drives the lens holding frame 110 in the x-axis direction.

[0093] As shown in FIGS. 4 and 5, the voice coil motor constituting the x-axis direction driving section 180 includes a pair of yokes 200A, 200B, a pair of x-axis direction driving magnets 182A, 182B, and an x-axis direction driving coil 184.

[0094] The pair of yokes 200A, 200B are made of magnetic metal plates such as steel plates. The pair of yokes 200A, 200B are attached to the front and back surfaces of the base member 120 by screws 202A, 202B. The yokes 200A, 200B attached to the base member 120 are disposed at a fixed interval in the direction of the optical axis z and are disposed perpendicular to the optical axis z.

[0095] The pair of x-axis direction drive magnets 182A, 182B are attached integrally to the corresponding yokes 200A, 200B. The pair of x-axis direction drive magnets 182A, 182B are arranged at predetermined positions on the base member 120 by attaching the yokes 200A, 200B to the base member 120. Specifically, they are arranged on the x-axis (the centers of the x-axis direction drive magnets 182A, 182B are located on the x-axis) and are arranged facing each other with a certain interval in the direction of the optical axis z. The pair of x-axis direction drive magnets 182A, 182B are arranged at intermediate positions between the two stoppers 164 in the direction perpendicular to the x-axis direction (the y-axis direction).

[0096] The x-axis direction drive coil 184 is provided on the flange portion 110B of the lens holding frame 110. The x-axis direction drive coil 184 is disposed between a pair of x-axis direction drive magnets 182A, 182B. The x-axis direction drive coil 184 is also disposed on a straight line that passes through the center of the shake correction lens 14 and is parallel to the x-axis.

[0097] The x-axis direction driving section 180 configured as above moves the lens holding frame 110 in the x-axis direction by energizing the x-axis direction driving coil 184.

[0098] The y-axis direction driver 190 is composed of a voice coil motor, and drives the lens holding frame 110 in the y-axis direction.

[0099] The voice coil motor constituting the y-axis direction drive section 190 includes a pair of yokes 200A, 200B, a pair of y-axis direction drive magnets 192A, 192B, and a y-axis direction drive coil 194.

[0100] The pair of yokes 200A, 200B are made of magnetic metal plates such as steel plates. The pair of yokes 200A, 200B are attached to the front and back surfaces of the base member 120 by screws 202A, 202B. The yokes 200A, 200B attached to the base member 120 are disposed at a fixed interval in the direction of the optical axis z and are disposed perpendicular to the optical axis z.

[0101] The pair of y-axis direction drive magnets 192A, 192B are attached integrally to the corresponding yokes 200A, 200B. The pair of y-axis direction drive magnets 192A, 192B are arranged at predetermined positions on the base member 120 by attaching the yokes 200A, 200B to the base member 120. Specifically, they are arranged on the y-axis (the centers of the y-axis direction drive magnets 192A, 192B are positioned on the y-axis) and are arranged facing each other with a certain interval in the direction of the optical axis z. The pair of y-axis direction drive magnets 192A, 192B are arranged at intermediate positions between the two stoppers 164 in the direction perpendicular to the y-axis direction (x-axis direction).

[0102] The y-axis direction drive coil 194 is provided on the flange portion 110B of the lens holding frame 110. The y-axis direction drive coil 194 is disposed between a pair of y-axis direction drive magnets 192A, 192B. In addition, the y-axis direction drive coil 194 is disposed on a straight line that passes through the center of the shake correction lens 14 and is parallel to the y-axis.

[0103] The y-axis direction driving section 190 configured as above moves the lens holding frame 110 in the y-axis direction by energizing the y-axis direction driving coil 194.

[0104] <<Position detection unit in the x-axis direction and position detection unit in the y-axis direction>> <X-axis direction position detection section> 4 and 7, the x-axis direction position detection unit 210 detects the position of the lens holding frame 110 in the x-axis direction. The position detection unit 210 includes a magnet (magnetic body) 212 for detecting the position in the x-axis direction, and a Hall element 214 for detecting the position in the x-axis direction.

[0105] The position detection hall element 214 is a magnetic sensor that detects the magnetic field generated by the position detection magnet 212 in the x-axis direction.

[0106] The position detection hall element 214 in this example is configured as a linear hall IC (IC: Integrated Circuit) with two hall elements built into a package, and has detection sensitivity to the movement of the position detection magnet 212 in the x-axis direction.

[0107] The magnet 212 for detecting position in the x-axis direction is provided on the flange portion 110B of the lens holding frame 110 (see FIG. 4), and the Hall element 214 for detecting position is fixed to the base member 120 (see FIG. 7).

[0108] The structure and method for fixing the position detection hall element 214 to the base member 120 will be described in detail later.

[0109] The x-axis position detection unit 210 detects the position of the position detection magnet 212 in the x-axis direction using a position detection Hall element 214, and detects the position of the lens holding frame 110 in the x-axis direction (i.e., the position of the shake correction lens 14 in the x-axis direction).

[0110] <Y-axis direction position detection unit> The y-axis direction position detection section 220 detects the position of the lens holding frame 110 in the y-axis direction, and is configured similarly to the x-axis direction position detection section 210.

[0111] That is, the y-axis direction position detection unit 220 includes a magnet (magnetic body) 222 for detecting the position in the y-axis direction, and a Hall element 224 for detecting the position in the y-axis direction.

[0112] The position detection hall element 224 is a magnetic sensor that detects the magnetic field generated by the position detection magnet 222 in the y-axis direction, and has detection sensitivity to the movement of the position detection magnet 222 in the y-axis direction.

[0113] The magnet 222 for detecting position in the y-axis direction is provided on the flange portion 110 B of the lens holding frame 110 , and the Hall element 224 for detecting position is fixed to the base member 120 .

[0114] The y-axis position detection unit 210 detects the position of the position detection magnet 222 in the y-axis direction using a position detection hall element 224, and detects the position of the lens holding frame 110 in the y-axis direction (i.e., the position of the shake correction lens 14 in the y-axis direction).

[0115] <Shake correction> A shake correction method using the optical image stabilization device 100 (a drive control method for the optical image stabilization device) will be described below.

[0116] When the shake correction function is turned on, shake correction is performed in digital camera 1. When the shake correction function is turned on, the shake amount of digital camera 1 is detected by shake detection unit 70 shown in Fig. 3, and the shake correction amount is calculated by shake correction amount calculation unit 90 based on the detection result. Then, based on the calculation result by shake correction amount calculation unit 90, the movement of shake correction lens 14 is controlled by shake correction control unit 60, and image shake is corrected. At this time, the movement of shake correction lens 14 is controlled based on a predetermined origin position, and the movement of shake correction lens 14 is controlled within a predetermined shake correction control range.

[0117] When the power supply of the digital camera 1 is turned off, the vibration correction lens 14 loses its holding force and falls freely. In this case, the vibration correction lens 14 is held by the stopper 164.

[0118] <Fixing structure of Hall element for position detection> As shown in FIG. 7, the Hall element 214 for detecting a position in the x-axis direction and the Hall element 224 for detecting a position in the y-axis direction are each packaged and mounted on a flexible printed circuit board 230.

[0119] This flexible printed circuit board 230 is fixed to the base member 120 by two sensor attachment members 240 , and as a result, the position detection hall elements 214 , 224 are fixed to the base member 120 .

[0120] First embodiment of sensor mounting member FIG. 8 is a perspective view showing a first embodiment of the sensor mounting member, and FIG. 9 is a plan view of the sensor mounting member shown in FIG.

[0121] The sensor mounting member 240 of this example is a molded product made of resin, and is configured as a separate member from the base member 120. The material of the sensor mounting member 240 may be, for example, ABS resin, but is not limited to this, and various resins may be used.

[0122] However, it is preferable that the resin applied to the sensor mounting member 240 is a resin with higher molding fluidity than the resin applied to the base member 120. This is because the sensor mounting member 240 has a shape with a larger ratio of total length to cross-sectional area than any part of the shape of the base member 120, as described below.

[0123] In addition, the base member 120 and the sensor mounting member 240 are manufactured from different materials, and it is preferable that the sensor mounting member 240 is made of a material having a lower elastic modulus than the base member 120, and further it is preferable that the base member 120 is made of a material having a higher rigidity than the sensor mounting member 240.

[0124] In this embodiment, the base member 120 is made of a glass fiber reinforced PC resin that contains glass fibers, and the sensor mounting member 240 is made of a PC resin that does not contain glass fibers, so that the above material characteristics are satisfied.

[0125] In addition, the base member 120 and the sensor mounting member 240 are preferably manufactured from materials with the same linear expansion coefficient. The sensor mounting member 240 is fixed to the base member 120, and by manufacturing the two from materials with the same linear expansion coefficient, it is possible to suppress the occurrence of dimensional changes (thermal stress) between the two. The linear expansion coefficients of the two are not necessarily perfectly the same, and if the dimensional change caused by the difference in the linear expansion coefficients of the two is sufficiently small compared to the detection error of the position detection hall elements 214, 224, or is small enough not to affect the position detection accuracy of the position detection hall elements 214, 224, the difference in the linear expansion coefficients is acceptable.

[0126] 8 and 9, the sensor mounting member 240 has a U-shaped external shape and a cantilever-shaped elastic portion 242 extending toward the space in the center thereof. A protrusion 242A is formed at the tip of the elastic portion 242, which biases the position detection hall element by the elastic force generated in the elastic portion 242.

[0127] The sensor attachment member 240 is formed with a first positioning hole 245 and a second positioning hole 246, and further formed with fastening holes 247 and 248 through which fasteners (male screws) are inserted.

[0128] FIG. 10 is a plan view of the tip portion of the flexible printed circuit board, and FIG. 11 is a plan view showing a state in which a sensor attachment member is disposed on the tip portion of the flexible printed circuit board.

[0129] A Hall element 224 for detecting a position in the y-axis direction is mounted on the tip portion of a flexible printed circuit board 230 shown in FIG.

[0130] At the tip portion of the flexible printed circuit board 230, a third hole 235 and a fourth hole 236 corresponding respectively to a first hole 245 and a second hole 246 for positioning the sensor mounting member 240, as well as fastening holes 237 and 238 corresponding respectively to fastening holes 247 and 248 of the sensor mounting member 240 are formed.

[0131] The third hole 235, the fourth hole 236, and the fastening holes 237, 238 formed in the flexible printed circuit board 230 are formed larger than the first hole 245, the second hole 246, and the fastening holes 247, 248 formed in the sensor attachment member 240. This is to allow the flexible printed circuit board 230 to move slightly with respect to the base member 120.

[0132] Needless to say, the third hole 235, the fourth hole 236, and the fastening holes 237, 238 similar to those described above are formed in the portion of the flexible printed circuit board 230 where the hall element 214 for detecting the position in the x-axis direction is mounted.

[0133] <Magnetic sensor fixing method> Next, a magnetic sensor fixing method will be described in which a flexible printed circuit board 230 having mounted thereon a Hall element 214 for position detection in the x-axis direction and a Hall element 224 for position detection in the y-axis direction, etc., is fixed to the base member 120 using two sensor mounting members 240, and the position detection Hall elements 214, 224 (magnetic sensors) are positioned and fixed.

[0134] FIG. 12 is a diagram showing how the flexible printed circuit board is arranged on the base member.

[0135] 11 and 12, a first pin 135 and a second pin 136 are integrally molded with the base member 120. The first hole 245 and the second hole 246 for positioning formed in the sensor mounting member 240, and the first pin 135 and the second pin 136 formed in the base member 120 are position restricting parts that can directly restrict the positions of the sensor mounting member 240 and the base member 120.

[0136] The flexible printed circuit board 230 is movably arranged on one surface of the base member 120 (the surface facing the lens holding frame 110) with a third hole 235 and a fourth hole 236 formed in the flexible printed circuit board 230 loosely inserted into the first pin 135 and the second pin 136 of the base member 120, respectively.

[0137] Next, the first pin 135 and the second pin 136 of the base member 120 are inserted into the first hole 245 and the second hole 246 of the sensor mounting member 240, respectively, to position the sensor mounting member 240 on the base member 120.

[0138] Thereafter, the sensor attachment member 240 is pressed toward the flexible printed circuit board 230 .

[0139] FIG. 13 is a cross-sectional view taken along line 13-13 in FIG.

[0140] As shown in FIG. 13, the elastic portion 242 of the sensor mounting member 240 has a tapered underside at its tip protrusion 242A, and by pressing the sensor mounting member 240 towards the flexible printed circuit board 230, the position detection hall element 224 is pressed to the right in FIG. 13 and moved together with the flexible printed circuit board 230.

[0141] At this time, one side of the package of the position detection Hall element 224 abuts against the two protrusions 134A, 134B of the positioning portion 134 of the base member 120, and the other side of the package abuts against the protrusion 242A at the tip of the elastic portion 242 of the sensor mounting member 240 and is pressed by the elastic force generated in the elastic portion 242.

[0142] As shown in Figures 12 and 13, the positioning portion 134 is formed with an escape portion 134C that avoids interference between the flexible printed circuit board 230 and the positioning portion 134 when the package of the position detection Hall element 224 abuts against the positioning portion 134 (two protrusions 134A, 134B).

[0143] The elastic portion 242 formed on the sensor mounting member 240 has a shape in which the ratio of its overall length to its cross-sectional area is large.

[0144] When the elastic portion 242 is used as a spring as described above, a shape with a large ratio of the total length to the cross-sectional area is advantageous in terms of spring characteristics. More specifically, the advantageous spring characteristics are, for example, advantageous in that the amount of spring displacement can be made large and changes in load due to displacement errors are small.

[0145] In addition, the elastic portion 242 formed in the sensor mounting member 240 has a shape whose ratio of total length to cross-sectional area is greater than the shape of any part of the base member 120 (e.g., the fixed side spring hook portion 130, the first pin 135, the second pin 136, etc.).

[0146] One side of the package of the position-detection Hall element 224 (the side that abuts against the two protrusions 134A, 134B of the positioning portion 134) serves as a reference surface perpendicular to the y-axis direction, which is the detection direction of the position-detection Hall element 224, and this reference surface abuts against the two protrusions 134A, 134B of the positioning portion 134 that are integrally molded with the base member 120, thereby precisely positioning the position-detection Hall element 224 on the base member 120.

[0147] As a result, when the lens holding frame 110 (position detection magnet 222) moves in the left-right direction in FIG. 13 relative to the base member 120, the left-right position of the position detection magnet 222 can be detected with high accuracy.

[0148] Similarly, the Hall element 214 for detecting position in the x-axis direction can also be positioned with high precision on the base member 120 by using the sensor attachment member 240 and the positioning portion 132 formed on the base member 120 .

[0149] Furthermore, by providing the positioning portions 132, 134 integrally with the base member 120, the position detection hall elements 214, 224 can be positioned with high precision with respect to the base member 120, which serves as a reference for displacing the shake correction lens 14.

[0150] Meanwhile, since the two sensor mounting members 240, which are separate parts from the base member 120, are used to bring the position detection hall elements 214, 224 into contact with the positioning portions 132, 134, when biasing the position detection hall elements 214, 224 using the spring force of the elastic portion 242 of the sensor mounting member 240, the sensor mounting member 240 having a shape with a large ratio of total length to cross-sectional area can be configured as a separate part without being bound by processing restrictions such as molding conditions of the base member 120. This makes it possible to form the elastic portion 242 which has a long effective spring length and exhibits excellent spring characteristics, enabling stable positioning of the position detection hall elements 214, 224.

[0151] Figure 14 is a plan view of the base member showing the state in which a flexible printed circuit board is placed on the base member and two position detection Hall elements are positioned by two sensor mounting members. In the state shown in Figure 14, the sensor mounting member 240 has not yet been fixed to the base member 120.

[0152] FIG. 15 is a perspective view showing how the sensor mounting member is fixed to the base member by a fastener, and FIGS. 16(A) and 16(B) are a plan view and a side view, respectively, of the sensor mounting member.

[0153] As shown in Figures 15 and 16, two male screws 249A, 249B, which serve as fasteners, are screwed into screw holes 129A, 129B of the base member 120 via fastening holes 247, 248 of the sensor mounting member 240, and the sensor mounting member 240 is fixed to the base member 120 by sandwiching the flexible printed circuit board 230 therebetween.

[0154] As a result, the flexible printed circuit board 230 (the hall element for position detection mounted on the flexible printed circuit board 230) is also fixed to the base member 120. Note that the fastener for fixing the sensor attachment member 240 to the base member 120 is not limited to a combination of a male screw and a screw hole. Also, the flexible printed circuit board 230 is omitted from illustration in FIG.

[0155] As fasteners that are highly accurate, strong, and easy to assemble, metal screws such as iron and stainless steel are usually used, but non-magnetic brass screws are used for the male screws 249A and 249B.

[0156] If a magnetic material is used as a fastener, there is a concern that it may disrupt the magnetic field of the magnet, causing position detection errors, or that the magnetic force of the magnet may hinder movement of the lens holding frame. Therefore, it is desirable to use a non-magnetic material such as a non-magnetic metal or ceramic as the fastener, and when consideration is given to ease of assembly, it is most preferable to use screws made of a non-magnetic metal such as brass.

[0157] The two sensor mounting members 240 shown in FIG. 7 above differ from those in FIG. 14 in that each is fixed to the base member 120 by two male screws 249A, 249B.

[0158] As shown in FIG. 7 and other figures, the sensor attachment member 240 also serves as a fixing member for fixing the flexible printed circuit board 230 to the base member 120.

[0159] Furthermore, since the position detection hall elements 214, 224 are also fixed in close contact with the surface of the base member 120, the sensor attachment member 240 also serves as a position restricting member that restricts the positions of the position detection hall elements 214, 224 (magnetic sensors) in the optical axis direction.

[0160] Second embodiment of sensor mounting member Fig. 17 is a perspective view showing a second embodiment of the sensor mounting member, and Fig. 18 is a plan view of the sensor mounting member shown in Fig. 17. In Fig. 17 and Fig. 18, parts common to the sensor mounting member 240 of the first embodiment shown in Fig. 8, Fig. 9, etc. are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0161] A sensor mounting member 250 of the second embodiment differs from the sensor mounting member 240 of the first embodiment in that an arch-shaped connecting portion 252 is integrally formed.

[0162] The connecting portion 252 connects the tips of a pair of mounting portions of the sensor mounting member 240 of the first embodiment, which has a U-shaped external shape, and the sensor mounting member 250 as a whole has a frame-like shape with an elastic portion 242 and an opening in the center.

[0163] Sensor mounting member 250 of the second embodiment has increased rigidity compared to sensor mounting member 240 of the first embodiment due to connecting portion 252. As a result, for example, when sensor mounting member 250 is pressed toward flexible printed circuit board 230 during positioning of the position detection Hall element, only elastic portion 242 deforms in this case, and other portions do not deform.

[0164] Furthermore, the connecting portion 252 is formed in an arch shape, thereby preventing interference with the positioning portion 134 formed on the base member 120 .

[0165] Third embodiment of sensor mounting member Fig. 19 is a plan view showing a sensor mounting member according to a third embodiment. In Fig. 19, parts common to the sensor mounting member 240 according to the first embodiment shown in Figs. 8 and 9 are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0166] In a sensor mounting member 260 of the third embodiment, the shape of an elastic portion 262 formed on the sensor mounting member 260 differs from the shape of the elastic portion 242 formed on the sensor mounting member 240 of the first embodiment.

[0167] The elastic portion 262 of the sensor mounting member 260 is bent into a hairpin shape, and its overall length is longer than the overall length of the elastic portion 242 formed in the sensor mounting member 240 .

[0168] As a result, the elastic portion 262, which functions as a spring that presses the position detection Hall element 224, can have a long effective length, so that the load changes little in response to errors in the amount of displacement. In addition, since the internal stress is small, the elastic portion 262 exhibits excellent spring characteristics with little reduction in load due to "sagging" or the like, and can more stably position the position detection Hall element 224.

[0169] Fourth embodiment of sensor mounting member Fig. 20 is a plan view showing a fourth embodiment of the sensor mounting member. In Fig. 20, parts common to the sensor mounting member 240 of the first embodiment shown in Figs. 8 and 9 are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0170] The sensor mounting member 270 of the fourth embodiment, like the sensor mounting member 260 of the third embodiment shown in FIG. 19, has an elastic portion 272 formed on the sensor mounting member 270 that has a different shape from the elastic portion 242 formed on the sensor mounting member 240 of the first embodiment.

[0171] The elastic portion 272 of the sensor mounting member 270 extends from a central member that connects the pair of mounting portions of the sensor mounting member 270, and is bent in a hairpin shape. The overall length of the elastic portion 272 is formed to be longer than the overall length of the elastic portion 262 formed in the sensor mounting member 260 of the third embodiment.

[0172] As a result, the elastic portion 272 functioning as a spring for pressing the position detection hall element 224 exhibits excellent spring characteristics with a long effective length of the spring, and the position detection hall element 224 can be positioned more stably.

[0173] Other embodiments of the position detection unit FIG. 21 is a diagram showing another embodiment of the position detector for detecting the position of the lens holding frame.

[0174] The position detection unit shown in FIG. 21 includes a position detection magnet 211 and a position detection hall element 226.

[0175] The position detection magnet 211 is a two-pole magnet having a magnetized portion magnetized with two poles. The position detection magnet 211 is disposed in the lens holding frame 110.

[0176] The position detection Hall element 226 differs from the position detection Hall elements 214 and 224, which are configured as linear Hall ICs with two Hall elements built into a package, in that the position detection Hall element 226 is configured as a linear Hall IC with one Hall element built into a package.

[0177] When the position detection magnet 211 moves from the reference position shown in FIG. 21 in the left-right direction in FIG. 21 and the N pole of the position detection magnet 211 approaches, the output voltage of the position detection hall element 226 increases according to the strength of the N pole, and when the S pole approaches, the output voltage of the position detection hall element 226 decreases according to the strength of the S pole. To fall.

[0178] 21 has sensitivity to the left-right movement of the position detection magnet 211 in FIG. 21, and can detect the movement position of the lens holding frame 110.

[0179] [others] In the present embodiment, a Hall element is used as a magnetic sensor for detecting a change in the magnetic field of a magnetic body. However, the present invention is not limited to this, and for example, an MR (Magneto Resistive) sensor can also be used.

[0180] The sensor mounting member in this example is a molded product made of resin, but is not limited to this and may be made of processed non-magnetic metals, ceramics, or the like.

[0181] In this embodiment, the case where the base member and the sensor mounting member are made of different materials has been described, but this is not limiting, and even if the materials are the same, the sensor mounting member may be made of a different material. As an example, in the case of an injection molded product of PC (polycarbonate) containing the same 30% glass fiber as the base member and the sensor mounting member, if the mold for molding the base member and the mold for molding the sensor mounting member are different, the mold for the sensor mounting member is smaller, so the injection pressure from the gate can reach the sensor mounting member more easily, and molding conditions such as temperature control can be easily controlled, so that a relatively fine and complex structure can be created with high precision compared to a large mold such as the base member. For example, in the case of a spring, a thin and long spring can be constructed on a small part, and a spring that is stress stable and resistant to "sagging" can be created.

[0182] Even in the case of a structure other than a spring, a structure that applies a stable contact force can be realized because the shape of the structural part that applies the contact force is not subject to the processing constraints of the base member, which is a large component.

[0183] As another example, even in the case of cutting, the smaller the processing size, the smaller the range of movement of the blade, so a processing machine more suitable for fine processing (a processing machine with a small blade movement distance) can be selected. In this way, by configuring the sensor mounting member as a separate member even if the material is the same, it is possible to create relatively fine part shapes with high precision without being restricted by the processing and molding conditions of the base member, and the contact force that contacts the positioning part can be applied stably both initially and over time.

[0184] Furthermore, the sensor mounting member only needs to have at least a pressing portion for abutting the magnetic sensor against the positioning portion of the base member.

[0185] The substrate on which the magnetic sensor is mounted is not limited to a flexible printed circuit board, and may be a non-flexible printed circuit board.

[0186] Furthermore, in the above embodiment, a digital camera equipped with an optical vibration isolator has been described, but the application of the optical vibration isolator to optical devices is not limited to digital cameras, and can be applied to other optical devices, including, for example, various imaging devices such as so-called silver halide cameras, television cameras, and video cameras, and lens devices used in imaging devices.

[0187] Furthermore, the present invention is not limited to the above-described embodiment, and it goes without saying that various modifications are possible without departing from the spirit of the present invention. [Explanation of symbols]

[0188] 1. Digital camera 10. Imaging optical system 12 Focus Lens 12A Focus lens drive unit 14 Image stabilizer lens 16 Aperture 16A Aperture drive unit 20 Image Sensor 20A Image sensor driver 21 Position detection magnet 22 Analog signal processing section 24 Digital signal processing section 30 Display section 32 Storage section 34 Control section 40 Angular velocity detector 40A Yaw direction angular velocity detector 40B Pitch direction angular velocity detector 50 Camera microcomputer 52 Focus control section 54 Exposure setting section 56 Image sensor drive control unit 58 Aperture control section 60 Image stabilizer control unit 62 Display control unit 64 Memory control unit 70 Shake detection unit 90 Shake correction amount calculation unit 100 Optical vibration isolation device 110 Lens holder 110A Lens holder 110B Flange part 112 Movable side spring hook 114 Guide part 114A Guide groove 116 Movable ball receiving section 120 Base material 120A Tube 120B opening 124 Ball 126 Spring 128 Fixed side ball receiving section 129A, 129B screw holes 130 Fixed side spring hook 132, 134 Positioning part 134A, 134B protrusion 134C Relief 135 1st pin 136 2nd pin 140 Rotation control part 142 Guide shaft 144 Swing base member 146 Bracket 146A base 146B Arm section 148 Swing Axis 150 Shaft base member 160 Movable range control part 162 Movable range restriction hole 164 Stopper 180 x-axis direction drive 182A, 182B x-axis direction drive magnet 184 x-axis direction drive coil 190 y-axis drive unit 192A, 192B y-axis direction drive magnet 194 y-axis drive coil 200A, 200B Yoke 202A, 202B screws 210, 220 Position detection unit 211, 212, 222 Position detection magnet 214 Hall element for position detection 224, 226 Hall element for position detection 230 Flexible Printed Circuit Board 235 Hole 3 236 Hole 4 237, 238 Fastening holes 240, 250, 260, 270 Sensor mounting parts 242, 262, 272 Elastic part 242A Protrusion 245 Hole 1 246 Hole 2 247, 248 Fastening holes 249A, 249B Male thread 252 Connecting part

Claims

1. A base member; a lens holding frame configured to be movable along a plane perpendicular to an optical axis with respect to the base member; a magnetic body that moves together with the lens holding frame and generates a magnetic field; a magnetic sensor that detects a change in a magnetic field in response to the movement of the lens holding frame; a sensor mounting member configured so that only the elastic portion is deformed and other portions are not deformed; The base member has a positioning portion, the sensor mounting member positions the magnetic sensor by bringing the magnetic sensor into contact with the positioning portion through deformation of the elastic portion; Optical vibration isolation device.

2. The magnetic sensor is mounted on a printed circuit board. the printed circuit board is fixed to the base member at a position between the lens holding frame and the base member; 2. The optical vibration isolation device according to claim 1.

3. the positioning portion has a recess for avoiding interference with the printed circuit board when the magnetic sensor contacts the positioning portion.

3. The optical vibration isolation device according to claim 2.

4. The printed circuit board is a flexible printed circuit board.

4. An optical vibration isolation device according to claim 2.

5. the base member has a first position restriction portion that restricts a position of the sensor mounting member relative to the base member, the sensor mounting member has a second position restricting portion that restricts the position of the sensor mounting member relative to the base member by the first position restricting portion; 5. An optical vibration isolation device according to claim 1.

6. the base member has a first pin and a second pin as the first position restriction portion, The sensor mounting member has a first hole and a second hole formed as the second position restriction portion, the sensor mounting member is positioned on the base member by inserting the first pin and the second pin into the first hole and the second hole, respectively; 6. An optical vibration isolation device according to claim 5.

7. The sensor mounting member is provided with a fastening hole through which a fastener is inserted, The sensor mounting member is fixed to the base member via a fastener that is inserted into the fastening hole and fixed to the base member.

7. An optical vibration isolation device according to claim 1.

8. the sensor mounting member also serves as a position restricting member that restricts the position of the magnetic sensor in the optical axis direction; 8. An optical vibration isolation device according to claim 1.

9. The sensor mounting member also serves as a fixing member for fixing the printed circuit board to the base member.

5. The optical vibration isolation device according to claim 2.

10. The sensor mounting member has an elastic portion, and an elastic force generated in the elastic portion biases the magnetic sensor to contact the positioning portion.

10. An optical vibration isolation device according to claim 1.

11. The base member and the sensor mounting member are each a molded product made of resin.

11. An optical vibration isolation device according to claim 1.

12. The sensor mounting member is a molded product made of a resin having a higher molding fluidity than the base member.

12. The optical vibration isolation device according to claim 11.

13. The base member and the sensor mounting member are made of different materials.

13. An optical vibration isolation device according to claim 1.

14. The sensor mounting member is made of a material having a lower elastic modulus than the base member.

14. An optical vibration isolation device according to claim 1.

15. The base member and the sensor mounting member are made of materials having the same linear expansion coefficient.

15. An optical vibration isolation device according to claim 1.

16. The base member is made of a material having a higher rigidity than the sensor mounting member.

16. An optical vibration isolation device according to claim 1.

17. The magnetic body is a magnet provided in the lens holding frame.

17. An optical vibration isolation device according to claim 1.

18. An optical device comprising the optical vibration isolation device according to claim 1 .

19. a lens holding frame configured to be movable relative to the base member along a plane perpendicular to an optical axis; a magnetic body that moves integrally with the lens holding frame and generates a magnetic field; a magnetic sensor that detects a change in the magnetic field in response to the movement of the lens holding frame; a printed circuit board on which the magnetic sensor is mounted; and a sensor mounting member configured so that only an elastic portion is deformed and other portions are not deformed, the method comprising the steps of: moving the lens holding frame within a plane perpendicular to the optical axis; The printed circuit board is disposed on a surface of the base member facing the lens holding frame; The elastic portion of the sensor mounting member is deformed, and an elastic force generated in the elastic portion biases the magnetic sensor mounted on the printed circuit board; The magnetic sensor is pressed toward the positioning portion by the elastic force and moved together with the printed circuit board, and the magnetic sensor is positioned by contacting the positioning portion with the sensor mounting member. Magnetic sensor fixing method.

Images